TWI423755B - Laminating apparatus for laminating multi-layers plate and method thereof - Google Patents

Description

Multilayer board bonding device and method thereof

The present invention relates to a multi-layer board bonding apparatus and method thereof, and more particularly to a multi-layer board bonding apparatus using a liquid glue for sheet bonding, and a method thereof.

The design of multi-layer board architecture has been widely used in various fields. For the colloid used in the lamination of multi-layer boards, if the manufacturer wants to make the cured multi-layer board have higher transparency, the more common technology is Use liquid glue as a medium for bonding. However, in the laminating process, the technical problem faced with the use of liquid glue is that it is easy to generate bubbles. In addition, the bonding quality of the liquid glue on the process is also a focus of electronic products (such as touch panels, liquid crystal display panels, etc.). Therefore, a variety of techniques have been used to reduce bubble generation to meet the quality requirements of electronic products.

As shown in the first figure, a schematic diagram of bonding by a point contact method using a liquid glue is disclosed in the prior art, in which a liquid paste 83 is attached to an upper substrate 81 and a lower substrate 82. The bonding process is to apply a liquid glue 83 to the bonding surface 811 of the upper substrate 81. Next, the upper substrate 81 is turned over so that the liquid glue 83 on the upper substrate 81 can be aggregated by gravity to form one or several peaks. Finally, the upper substrate 81 is further brought closer to the lower substrate 82 so that the peak top formed by the liquid glue 83 can be brought into point contact with the bonding surface 821 of the lower substrate 82, and the air bubbles can be reduced.

However, such a bonding technique for discharging air bubbles by the point contact method may cause a plurality of peaks to be formed during the aggregation. Therefore, it is necessary to pay attention to whether or not the contact between the upper substrate 81 and the lower substrate 82 is actually performed. There are bubbles. In addition, those skilled in the art can understand that the liquidity of the liquid glue 83 is required to be higher when the substrate of a larger size is attached, and the requirement of the bonding technique of the contact mode requires the use of lower fluidity. The liquid glue 83, otherwise the liquid glue 83 will not be able to continuously contact the inverted substrate 81, so the point contact bonding technique is only suitable for the bonding of small-sized substrates.

Referring to the second figure, a schematic view of the conventional technique for bonding by using the difference in the pressing angle is used to attach an upper substrate 91 and a lower substrate 92. The bonding surface 921 of the lower substrate 92 is further configured with a limiting frame 94 (in a hollow state) to glue the liquid glue 93 within the range framed by the limiting frame 94. Then, the upper substrate 91 is pressed against the lower substrate 92 by adjusting the pressing angle D between the upper substrate 91 and the lower substrate 92, so that the bonding surface 911 of the upper substrate 91 is adjusted by the upper substrate 91 and the lower substrate 92. Below the press angle D, it is possible to produce fewer conforming bubbles with the liquid glue 93.

However, this technique must additionally design the limit frame 94 on the abutment surface 921 of the lower substrate 92, and also because of the design of the limit frame 94, the coating range of the liquid glue 93 is limited.

In addition to the above two bonding processes, another common process is to achieve the bonding of the substrate directly under a vacuum environment to reduce the bubbles generated when the bonding is performed. However, to construct a vacuum environment, the requirements of the overall equipment organization are higher, and the production cost is relatively higher. In addition, the characteristics of the liquid glue are also high, and it is necessary to have no small molecules in a low vacuum environment, and it is necessary to consider the phenomenon that the liquid is boiled under a low vacuum state.

From the current liquid glue bonding technology, in the case of multi-layer boards with different properties and sizes, it is often necessary to match specific bonding equipment and processes, which not only can not effectively reduce production costs, but also affect the development of production processes. Therefore, there is still room for further improvement in the bonding equipment of the multilayer board and its process.

In view of the above technical problems, the present invention is for effectively reducing air bubbles generated during the manufacture of a multi-layer board. Wherein, the present invention controls a suitable small gap between the upper and lower substrates for injecting liquid glue in a small gap between the upper and lower substrates. In other words, the present invention utilizes the principle that the liquid does not generate bubbles upon contact with a small area to apply the liquid glue, thereby completing the bonding of the multilayer board.

According to an aspect of the present invention, a multi-layer board bonding apparatus is provided, comprising: a first carrier, a second carrier, and at least one glue injection device. Wherein, the first carrier carries the substrate, and the second carrier carries an upper substrate such that the bonding surface of the upper substrate faces the bonding surface of the lower substrate, and has a gap between the lower substrate and the upper substrate. space. The glue injection device protrudes into the gap space and injects the liquid glue relatively close to the side of the upper substrate, so that the liquid glue first contacts the upper substrate and then drops, and the liquid glue after the drop can maintain contact with the upper substrate and the lower substrate.

According to another aspect of the present invention, a multi-layer board bonding method is provided, the method comprising: first, controlling a bonding surface of an upper substrate facing a bonding surface of a lower substrate so that between the upper substrate and the lower substrate is Has a gap space. Then, at least one glue injection device is controlled to extend into the interstitial space, and a liquid glue is injected relatively close to the side of the upper substrate, so that the liquid glue contacts the upper substrate and then drops, and the liquid glue after the drop is maintained in contact. Substrate and lower substrate.

Therefore, the effect achieved by the present invention is that the bonding of the multi-layer board can be performed under normal temperature and normal pressure without easily forming the bonding bubbles, and the production can be effectively improved without greatly increasing the production cost. rate. In addition, it can be easily applied to the bonding process of different size substrates, increasing the versatility and practicability of the bonding device.

The above summary, the following detailed description and the annexed drawings are intended to further illustrate the manner, the Other objects and advantages of the present invention will be described in the following description and drawings.

The present invention is a multilayer board bonding apparatus and a method thereof which are designed by utilizing a characteristic principle that a liquid does not generate bubbles when contacted in a small area, so that the bonding surfaces of the upper substrate and the lower substrate of the multilayer board are facing each other. In the case, a dispensing of the liquid glue is carried out. When the liquid glue is just out of the glue, it directly contacts the upper substrate, and when it is contacted with the lower substrate by gravity, the liquid glue can always maintain contact with the upper substrate. In this way, the subsequent press-fitting and curing processes are further carried out.

The so-called multi-layer board refers to a composite board structure of at least two layers, such as a touch panel ^{, a} liquid crystal display panel, a plastic composite substrate, a glass composite substrate, and the like. The plates of different layers are not limited to the same material, and may be laminated with different materials or plates after different processing processes, and the invention is not limited thereto. For convenience of explanation, the multilayer board in the following embodiments will be described, for example, by a touch panel.

Please refer to the third figure, which is a side view of an architectural embodiment of the multi-layer board bonding apparatus of the present invention. As shown in the figure, the present embodiment provides a multi-layer board bonding apparatus 1 including at least one glue injection device 10, a first carrier 11, and a second carrier 12. In addition, since the multi-layer board bonding apparatus 1 of the present embodiment can be, for example, a process device designed to be automated, the multi-layer board bonding apparatus 1 further includes a controller (not shown) for controlling the glue injection apparatus by the controller. 10. Operation of the first carrier 11 and the second carrier 12. The first carrier 11 and the second carrier 12 are respectively designed to be movable in the front, rear, left, and right directions to facilitate position adjustment. In addition, the actual design of the controller is not limited to the manner of being mounted on the local end or the distal end of the multi-layer board bonding apparatus 1 to achieve the same control. Moreover, the controller performs corresponding control according to a built-in operating program table, and the operating program table can be set by the user according to actual process requirements.

The glue injection device 10 is used for filling a liquid glue G, and the type of the liquid glue G can be a light curing liquid glue, a heat curing liquid glue, a moisture curing liquid glue or a composite curing liquid according to design requirements. Glue is not limited here. Among them, the so-called composite curing liquid glue refers to a liquid glue that can be cured by different curing methods, for example, liquid glue which can be cured by light or heat, or liquid glue which can be cured by heat or moisture. .

The first carrier 11 is used to carry the substrate 2 below. In view of the architecture of the capacitive touch panel, the lower substrate 2 can be, for example, a substrate after being coated with at least one conductive transparent layer, an electrode layer, or the like. The first carrier 11 further includes a first jig 111. The first jig 111 is disposed on an upper surface of the first carrier 11 for fixing the position of the lower substrate 2. Further, the first jig 111 of the present embodiment is designed, for example, by using a clip member to clip the lower substrate 2.

The second carrier 12 is for carrying an upper substrate 3. When viewed from a capacitive touch panel, the upper substrate 3 is used as a protective layer, and thus can be, for example, a substrate after being subjected to processing such as abrasion resistance, anti-glare, and antibacterial treatment. The second carrier 12 further includes a second jig 121 for fixing the lower substrate 2. Since the second carrier 12 is for carrying the upper substrate 3 and the bonding surface of the upper substrate 3 is a bonding surface facing the lower substrate 2, the second jig 121 can be disposed, for example, under the second carrier 12. The surface is coated with a suction device to carry and fix the upper substrate 3 by means of suction attachment. Of course, the means for the second carrier 12 to carry the upper substrate 3 is not limited thereto, and any manner of supporting the bonding surface of the upper substrate 3 to face the bonding surface of the lower substrate 2 is the scope of protection of the present invention. .

More specifically, the controller of the present embodiment controls the first carrier 11 and the second carrier 12 to adjust the gap space I between the upper substrate 3 and the lower substrate 2. The controller sets the size of the gap space I according to the characteristics of the liquid glue G and the size of the glue injection device 10. Incidentally, in the case of the touch panel exemplified in the embodiment, the gap space I is usually a distance of millimeters (mm).

Further, the controller further controls the glue injection device 10 to be located in the interstitial space I between the upper substrate 3 and the lower substrate 2, and movably injects the liquid glue G in a position relatively close to the side of the upper substrate 3. In order to enable the glue injection device 10 to easily enter and move in the interstitial space I, the glue injection device 10 further includes a needle-shaped injection tube 101 for moving from the needle-shaped injection tube 101 to the interstitial space I, and injecting Apply liquid glue G.

Please refer to the third A picture together, which is a partial enlarged view of the A part of the third figure, which is used to show the condition of the liquid glue G at the instant of dispensing. Wherein, when the controller controls the glue injection device 10 to perform the glue application of the liquid glue G, the liquid glue G injected by the needle injection tube 101 first contacts the upper substrate 3 and then drops, and passes through the embodiment. The gap space I between the upper substrate 3 and the lower substrate 2 is adjusted to maintain the contact of the liquid glue G after the dropping The substrate 3 and the lower substrate 2. Thereby, the present invention can utilize the small gap to inject the liquid glue G, and effectively reduce the probability of generating bubbles at the time of bonding by the principle that the liquid does not generate bubbles when contacted in a small area.

In summary, under the condition that at least the glue injection device 10 can enter the gap space I, the controller of the embodiment sets the gap space I according to the characteristics of the fluidity of the liquid glue G, and the gap space I is a The injected liquid glue G is continuously maintained in contact with the upper substrate 3 even after it is contacted with the lower substrate 2 at the instant of dispensing or by gravity. For example, if the fluidity of the liquid glue G used is high, the gap space I is set to a small distance to prevent the liquid glue G after the drop from forming a detachment from the upper substrate 3; If the fluidity of the liquid glue G is low, the gap space I does not need to be set to an excessively small distance, so that it is easier to control the fineness correction.

In addition, in general, the injection molding device 10 has a relatively small amount of injection at the initial stage of injection molding, which is less than the amount of injection during the normal injection molding period. Therefore, if the control of the bonding process is to be performed more precisely, the gap space I designed in this embodiment can be further divided into two stages to be suitable for the initial injection and the normal injection time. stage. The controller can adjust the distance between the upper substrate 3 and the lower substrate 2 in a time-sharing manner, so that the adjusted distance in the initial stage of the injection is smaller than the adjusted distance in the normal injection period, so that the liquid glue G can be injected. The requirement to maintain contact with the upper substrate 3 is maintained. Among them, there is a definition of the time point between the initial glue and the normal glue injection period, and the setting is adjusted according to the size of the injection molding diameter of the actual glue injection device 10, the characteristics of the liquid glue G, and the like, and is not limited herein.

Next, please refer to the fourth figure again, which is a schematic perspective view of an embodiment of the multi-layer board bonding apparatus of the present invention. This embodiment is further described with respect to the overall structure of the multilayer board bonding apparatus 1. As shown in the figure, the multi-layer board bonding apparatus 1 further includes: a lifting and lowering mechanism, in addition to the above-mentioned injection molding apparatus 10, the first carrier 11, the second carrier 12, and the controller 13. 14. A derivation mechanism 15, a feeding mechanism 16, a cleaning roller 17, an optical positioning device 18, and a positioning curing device 19. The controller 13 of the present embodiment is designed, for example, using local end control to control the action flow according to the operation program table, and display corresponding information.

The lifting and lowering mechanism 14 is electrically connected to the controller 13 and is fixed to the second carrier 12 for controlling the vertical displacement of the second carrier 12 to adjust the gap space I and control the upper substrate 3 to be pressed under The function of the substrate 2. The lead-out mechanism 15 is electrically connected to the controller 13, and is disposed downstream of the first carrier 11 for guiding the multilayer board formed by pressing the upper substrate 3 and the lower substrate 2.

The feeding mechanism 16 is disposed upstream of the second carrier 12 and electrically connected to the controller 13 for conveying the upper substrate 3 to the second carrier 12. Moreover, the upper substrate 3 conveyed by the feeding mechanism 16 can be conveyed, for example, in a manner that the bonding surface faces downward to facilitate subsequent bonding. The cleaning roller 17 is mounted on the feeding mechanism 16 for cleaning the bonding surface of the upper substrate 3 conveyed on the feeding mechanism 16, so that the bonding surface of the upper substrate 3 can be further cleaned before being bonded. Of course, those skilled in the art can understand the manner in which the upper substrate 3 is fed, the cleaning method, and the manner in which the bonding surface of the upper substrate 3 faces the lower substrate 2 in the design of the multi-layer board bonding apparatus 1. It is not limited to this embodiment.

In addition, the first carrier 11 and the second carrier 12 are in addition to the positions of the first fixture 111 and the second fixture 121 that are initially fixed to the lower substrate 2 and the upper substrate 3, respectively. For example, the optical positioning device 18 is further designed, such as a charge coupled device (CCD), which is an electrical connection controller 13 for matching the first carrier 11 and the second carrier 12. The adjusted design is performed to perform an optical positioning procedure to further accurately position the relative fit between the upper substrate 3 and the lower substrate 2. Of course, the first fixture 11 and the second carrier 12 can eliminate the use of the first fixture 111 and the second fixture, respectively, after the optical positioning device 18 is added to the multi-layer board bonding apparatus 1 in consideration of the cost factor. The design of 121 is to directly position the relative bonding position between the upper substrate 3 and the lower substrate 2 by the optical positioning device 18.

The positioning curing device 19 is an electrical connection controller 13 for performing a fixing process to cure the upper substrate 3 by using a fixed point or a full curing method after the upper substrate 3 is pressed against the lower substrate 2 and the liquid glue G is overflowed. And a liquid glue G between the lower substrate 2. When the second carrier 12 is detached from the upper substrate 3, the liquid substrate G is not cured, and the upper substrate 3 and the lower substrate 2 are displaced. The positioning curing device 19 adopts different designs according to the type of the actual liquid glue G, and may be, for example, an illumination device or a heating device.

Incidentally, the multi-layer board bonding apparatus 1 can be mounted, for example, in a dust-free environment to avoid dust generation and improve production yield. Of course, if the multi-layer board bonding apparatus 1 is installed in a accommodating space of a general environment, an air purifying device may be further added to the accommodating space to purify the air in the accommodating space to avoid as much as possible. Dust is produced.

Further, in the process of pressing the upper substrate 3 and the lower substrate 2 to diffuse the liquid glue G in the process of pressing the upper and lower substrates 3 and the lower substrate 2 to form a surrounding bubble, the present embodiment can further respond to different substrates. Shape to coat different graphics. In other words, the controller 13 can control the glue injection device 10 to inject the liquid glue G according to a graphic coordinate value to apply a pattern on the upper substrate 3.

Please refer to the fifth figure together for a schematic diagram of an embodiment of the pattern coated by the glue injection device of the present invention. This embodiment is described by, for example, coating a liquid glue G on a square substrate. As shown in the figure, the glue injection device 10 preferably applies a liquid glue G by a rice-shaped coating method to serve as the upper substrate 3 . When the liquid glue G is allowed to overflow in the lower substrate 2, the chance of enclosing the bubbles is reduced.

In addition to the above-described rice-shaped coating, in practical applications, if it is designed by using an elliptical substrate, the pattern coated by the injection molding device 10 can be, for example, directly coated on the central portion of the substrate. . However, it should be noted here that since the present invention is directed to reducing the probability of occurrence of the bonding bubble when the dispensing is applied, the present invention is not limited in terms of the coating pattern of the actual liquid glue G.

Finally, in order to more specifically describe the operation flow when the present invention is actually pasted, please refer to the sixth figure for a flow chart of an embodiment of the multi-layer board bonding method of the present invention. As shown in the figure, the embodiment provides a method for laminating a multi-layer board, the steps of which include: firstly, providing an upper substrate and a lower substrate (S601), and controlling a bonding surface of the upper substrate to be a bonding surface facing the lower substrate ( S603).

Next, the gap between the upper substrate and the lower substrate is adjusted to have a gap space (S605), and at least one glue injection device is controlled to be movably stretched to the gap space and relatively close to the side of the upper substrate (S607). In the condition after the completion of the step (S607), the injection molding device can be controlled to inject a liquid glue according to a graphic coordinate value to apply a pattern on the upper substrate (S609). Through the design of the embodiment, the injected liquid glue first contacts the upper substrate and then drops, and the liquid glue after the drop is maintained to contact the upper substrate and the lower substrate.

Next, it is judged whether or not the pattern is coated (S611). If the result of the determination in the step (S611) is NO, it indicates that the glue injection device has not finished coating the pattern, and then the steps (S609) and (S611) are repeated until the determination result of the step (S611) is YES, which represents the glue injection device. The graphic has been coated. At this time, the glue injection device can be controlled to leave the clearance space (S613).

After the glue injection device is separated from the gap space, the upper substrate and the lower substrate are vertically pressed (S615), so that the liquid glue injected between the upper substrate and the lower substrate begins to overflow. It is to be noted that, in the step (S601), during the process of feeding the upper substrate and the lower substrate to the step (S615), the upper substrate and the lower substrate are pressed together, and after any step is performed, in order to ensure the between the upper substrate and the lower substrate. The relative bonding position can be maintained, and an optical positioning procedure can be selectively performed to correct the relative bonding position between the upper substrate and the lower substrate. Thereby, it is ensured that the relative bonding position between the upper substrate and the lower substrate is constant.

In addition, after the completion of the step (S615), a fixing process (S616) may be further performed to allow the liquid glue applied between the upper substrate and the lower substrate to be fixedly or completely cured to avoid direct or indirect subsequent processes. A situation in which the upper substrate and the lower substrate are displaced.

After the step (S616), a derivation process is performed to derive the multilayer board formed by pressing the upper substrate and the lower substrate (S617). Finally, a curing process (S619) is performed to cure the liquid glue between the upper substrate and the lower substrate. Thereby, the manufacturing process of bonding and curing of the multilayer board is realized.

In summary, the present invention utilizes the principle of the principle that the liquid does not generate bubbles when contacted in a small area, and the multi-layer board bonding apparatus and the method thereof can effectively reduce the sticker without greatly modifying the production process. The generation of bubbles will increase the production yield of the multi-layer board. Moreover, the present invention can directly laminate the multi-layer boards under normal temperature and normal pressure, thereby avoiding an increase in production cost due to the construction of a complicated production environment. In addition, the invention can be easily applied to the bonding process of different size substrates, and the versatility and practicability of the multi-layer board bonding device are increased.

However, the above description is only for the purpose of illustration and illustration of the embodiments of the present invention, and is not intended to limit the scope of the invention. Variations or modifications that may be readily conceived within the scope of the invention may be covered by the scope of the invention as defined in the following.

[Practical Technology]

81,91. . . Upper substrate

811,911. . . Bonding surface of the upper substrate

82,92. . . Lower substrate

821,921. . . Bonding surface of the lower substrate

83,93. . . Liquid glue

94. . . Limit box

[this invention]

1. . . Multilayer board bonding device

10. . . Injection molding device

101. . . Needle injection tube

11. . . First vehicle

111. . . First fixture

12. . . Second vehicle

121. . . Second fixture

13. . . Controller

14. . . Lifting and pressing mechanism

15. . . Export mechanism

16. . . Feeding mechanism

17. . . Cleaning roller

18. . . Optical positioning device

19. . . Positioning curing device

2. . . Lower substrate

3. . . Upper substrate

G. . . Liquid glue

I. . . Clearance space

S601 to S619. . . Flow chart step description

The first figure is a schematic diagram of a conventional technique for bonding by means of point contact of a liquid glue;

The second figure is a schematic diagram of a conventional technique for bonding using a difference in press angle;

3 is a side view showing an embodiment of an embodiment of a multilayer board bonding apparatus of the present invention;

The third A is a partially enlarged schematic view of the A portion of the third figure;

The fourth drawing is a schematic perspective view of an embodiment of the multilayer board bonding apparatus of the present invention;

Figure 5 is a schematic view showing an embodiment of a pattern coated by the glue injection device of the present invention;

Figure 6 is a flow chart showing an embodiment of the method for laminating a multilayer board of the present invention.

1. . . Multilayer board bonding device

10. . . Injection molding device

101. . . Needle injection tube

11. . . First vehicle

111. . . First fixture

12. . . Second vehicle

121. . . Second fixture

2. . . Lower substrate

3. . . Upper substrate

G. . . Liquid glue

I. . . Clearance space

Claims (21)

A multi-layer board bonding apparatus comprising: a first carrier for carrying a substrate; a second carrier for carrying an upper substrate, wherein a bonding surface of the upper substrate faces a bonding surface of the lower substrate, And a gap space between the upper substrate and the lower substrate; and at least one glue injection device extends into the gap space and injects a liquid glue relatively close to the upper substrate, so that the liquid glue first contacts the liquid glue The upper substrate is further dropped, and the liquid gel after the dropping is maintained in contact with the upper substrate and the lower substrate. The multi-layer board bonding apparatus according to claim 1, wherein the liquid glue is a light curing liquid glue, a heat curing liquid glue, a moisture curing liquid glue or a composite curing liquid glue. The multi-layer board bonding apparatus according to claim 1, wherein the glue injection apparatus comprises a needle-shaped injection tube to move in the interstitial space. The multi-layer board bonding apparatus of claim 1, wherein the first carrier further comprises: a first jig disposed on an upper surface of the first carrier for fixing the lower substrate . The multi-layer board bonding apparatus of claim 4, wherein the first fixture is a clipper member. The multi-layer board bonding apparatus of claim 1, wherein the second carrier further comprises: a second jig disposed on a lower surface of the second carrier for fixing the upper substrate. The multi-layer board bonding apparatus according to claim 6, wherein the second fixture is an adsorption device. The multi-layer board bonding apparatus of claim 1, further comprising: a controller for adjusting the gap space between the lower substrate and the upper substrate. The multi-layer board bonding apparatus according to claim 8, wherein the controller sets the gap space according to the characteristics of the liquid glue and the size of the glue injection device. The multi-layer board bonding apparatus of claim 8, wherein the gap space is divided into a plurality of stage distances, and the controller adjusts the distance between the lower substrate and the upper substrate by the time division. The multi-layer board bonding apparatus according to claim 8, wherein the controller controls the glue injection device to inject the liquid glue according to a graphic coordinate value to apply a pattern on the upper substrate. The multi-layer panel bonding apparatus of claim 11, wherein the controller further controls the glue injection device to actively inject the liquid glue, and the controller controls the glue injection device after the pattern is applied The glue injection device leaves the interstitial space. The multi-layer board bonding apparatus of claim 12, further comprising: a lifting and lowering pressing mechanism electrically connecting the controller, and fixing the second carrier for controlling the second carrier a vertical displacement to adjust the gap space, and after the glue injection device leaves the gap space, the upper substrate is pressed against the lower substrate; and a lead-out mechanism is electrically connected to the controller, and The utility model is disposed downstream of the first carrier for guiding the multilayer substrate and the multilayer board formed by pressing the lower substrate. The multi-layer board bonding apparatus of claim 8, further comprising: a feeding mechanism disposed upstream of the second carrier and electrically connected to the controller for conveying the upper substrate to the Second vehicle. The multi-layer board bonding apparatus of claim 14, further comprising: a cleaning roller mounted on the feeding mechanism for cleaning the bonding surface of the upper substrate. The multi-layer board bonding apparatus of claim 8, further comprising: an optical positioning device electrically connected to the controller for positioning a relative bonding position between the upper substrate and the lower substrate; And a positioning curing device electrically connected to the controller for fixing or fully curing the liquid glue between the upper substrate and the lower substrate. A multi-layer board bonding method, the method comprising: controlling a bonding surface of an upper substrate facing a bonding surface of a lower substrate, and adjusting a gap space between the upper substrate and the lower substrate; and controlling at least one glue injection device Extending into the interstitial space, and injecting a liquid glue relatively close to the upper substrate, so that the liquid glue first contacts the upper substrate and then drops, and the liquid gel after the drop is maintained in contact with the upper substrate and the lower Substrate. The multi-layer board bonding method according to claim 17, wherein the glue injection device injects the liquid glue according to a graphic coordinate value to apply a pattern on the upper substrate. The multi-layer board bonding method of claim 18, further comprising: after coating the pattern, controlling the glue injection device to completely leave the gap space; vertically pressing the upper substrate and the lower substrate to make Dissolving the liquid glue; performing a derivation process to derive the multilayer substrate formed by pressing the upper substrate and the lower substrate; and performing a curing process to cure the liquid state between the upper substrate and the lower substrate gum. The multi-layer board bonding method according to claim 19, wherein after the pressing step, further comprising: performing a fixing process to fix the liquid glue between the upper substrate and the lower substrate in a fixed or full manner, And the export procedure is executed after the fixed program. The multi-layer board bonding method according to claim 17, wherein the gap space is determined according to the characteristics of the liquid glue and the size of the glue injection device.