201236066 六、發明說明： 【發明所屬之技術句織】 發明領域 本發明係關於一種例如在半導體晶圓等 光束施予燒蝕加工之燒蝕加工方法、ιν …雷射 u及在施予燒蝕加工 時覆盍保棱工件的被加工面之保護材。 發明背景 在半導體元件之製造步驟中，在由略呈圓薄片狀的半 導體晶圓構成駐件表面’根據格子狀的分割駭線區書 出多數個矩形狀的元件區域’在轉元件區域形成^Lsi 等電子電路’其次在切削内面後施予研磨等必要的處理之 後，進行順著分義定線靖的切割，而料元件區域個 片化，由1張工件得到多數個元件（半導體晶片）。 半導體晶圓等的工件切割係將使其高速旋轉的切削刀 片切入工件的方法為-般悉知的，但是近年來，也進行一 邊進行照射雷射光輯融轉則纽加卫_邊辑 切害U參照專利文獻1)。然而，在進行根據雷射光束的昭 射之燒勤叫，會使被稱騎狀—成份的飛珠附著 在工件的被加卫面，造成品質降低的問題。因此本案申請 人係提出若是在工件的被加卫面塗布樹脂形成保護膜的二 態下將雷射光束照射到被加卫面，碎屑則會附著在保護膜 而不會直接附著在被加工面’可以確保品f之技術(專利文 獻2)。 201236066 【先前技術文獻】 【專利文獻】 【專利文獻1】曰本特開平10-305420號公報 【專利文獻2】日本特開2〇〇4-188475號公報 【發明内容】 發明概要 發明欲解決之課題 就在工件的被加工面塗布樹脂形成保護膜的方法而 言，如上述專利文獻2記載所示，在使其旋轉的工件中心滴 下樹脂，利用離心力使樹脂流動到整個被加工面之旋塗法 為適合的。然而在該方法中，由於飛散而在實質上沒被塗 布在工件的樹脂量為多，造成極不經濟實惠的問題。 本發明係有鑑於上述情況而開發出來者，其主要的技 術課題係為提供可以效率佳地保護工件的被加工面之保護 材及燒触加工方法。 用以欲解決課題之手段 申請專利範圍第1項記載之本發明的保護材，其係在使 用雷射光束燒蝕加工工件時，覆蓋工件的被加工面以從燒 蝕加工時所產生的碎屑保護工件的被加工面者，其特徵在 於：呈薄片狀，厚度為0· 1 μηι以上1 Ομηι以下，且為水溶性， 355nm波長的光可穿透，並且具有可完全覆蓋工件之加工預 定線的面積。 又申請專利範圍第2項記載之本發明的燒蝕加工方 法，其係使用如申請專利範圍第1項之保護材者，其特徵在 201236066 於匕3以下步驟·在薄片狀的基材上形成如中請專利範圍 第I—員之保4材，至少在工件的被加卫面或是前述保護材的 貼著面供給水；_水層將形成麵絲材上的狀態下之 料保護材的貼著面與讀的前述被加玉面予㈣合；將 可述基材剝離前述保護材；及由已貼著前述保護材之工件 的前述被加^側照射純光束，•加X就線施予燒 钱力σ工。 根據本發明’由於在工件的被加工面貼合薄片狀的保 護材以保護該被力d因此賴材係為能夠覆蓋被加工 必要最低限的大小者即可。為此使保護材的浪費變 V可以放率佳地保護工件的被加工面。又因為貼著薄片 狀的保護材覆紅件的被加4，因此即使在被加工面有 凹凸的情況也可以確實健整個被加工面。 又本I明所提及之工件係沒有特別限定，可以舉例如 t二錄(GaAS)、％化邦ic)等構成之半導體晶圓、成為 °安4用-X置在晶IU内面之DAF(晶粒附接膜）等黏著構 件、半導體製品之封裝、喊或玻璃、藍寶石⑽⑹系或 时系之…、機材料基板、控制驅動液晶顯示裝置之匕⑶驅 動咨等各種電子零件、再者要求微子序列的加玉位置精確 度之各種加工材料等。 發明效果 康本發明’達到提供可以效率佳地保護1件的被加 面之保遵材及燒姓加工方法的效果。 圖式簡單說明 201236066 第1圖係為顯示關於本發明之一實施形態的雷射加工 裝置之工件（半導體晶圓）的立體圖，顯示將該工件透過黏著 帶支撐在環狀框體的狀態。 第2圖係為顯示關於本發明之一實施形態的雷射加工 裝置之整體立體圖。 第3圖係為顯示一實施形態之雷射加工裝置所具備的 洗淨手段之立體圖。 第4圖係為顯示一實施形態之雷射加工裝置所具備的 貼著手段之立體圖。 第5圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示將水供給至工件表 面的步驟、（b)顯示將保護材位於工件上方的步驟。 第6圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示在工件表面貼著保 護材薄片之保護材的步驟、（b)顯示從已貼著保護材的工件 表面剝離保護材薄片之基材的步驟。 第7圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示在工件表面貼著保 護材後將貼著手段退避到上方的步驟、（b)顯示拉出下個貼 著之保護材的步驟。 實施方式;1 用以實施發明之形態 以下，說明本發明之一實施形態。 [1]工件 201236066 首先，根據第1圖說明一實施形態中的工件。該工件l 係為厚度例如是100〜700μηι程度之呈圓薄片狀的矽晶圓 等半導體晶圓。在工件1表面係根據格子狀的分割預定線 (加工預定線)2區畫出多個矩形狀的元件區域3。在此等元件 區域3係形成未圖示之1C或LSI等電子電路。在工件1外周部 的特定處係形成顯示半導體的結晶方位之被稱為晶向切平 面的直線狀切口 4。 工件1係藉由利用第2圖所示之雷射加工裝置1〇，雷射 加工全部的分割預定線2，使各元件區域3被切割為多個元 件（半導體晶片）。在該情況的雷射加工係為照射雷射光束熔 1¾¾ [Ιφ». 4^ μ 工件1的成份之燒蝕加工。就燒蝕加工而言，除了完 王貫穿工件1的厚度方向之全切割之外，也包含直至厚度中 途形成特定深度的溝之溝加卫。已進行溝加工情況的工件1 =由利用後程進―步全切割該溝的殘留厚度之部份， 或疋施加應力割斷，而被切割為元件。 工件1係如第1圖所示，透過黏著帶6以同心狀配置在環 欠框體5的圓形狀開口部5a，而且形成―體切的工件單元 ，供給至雷射加工裝置10。黏著帶6係為使單面成為黏著 由金屬 金屬德㈣叙具有祕者，藉由切域5，工件^ 係連同工件單元7—起被搬送。 [2]雷射加工裝置 ⑴進行燒餘加工之雷射加工裝置的構成及動作 接者，連同動作說明第2圖所示之雷射加工裝置10的構 201236066 成。第2圖的符號11係為基台。基台11係具有雷射加工工件 1之加工平台11A、設置在加工平台11A的單側（Y1側），對於 加工平台11A搬入/搬出工件單元7之搬入/搬出平台11B。在 加工平台11A的内側(X 2側）係直立設置壁部12。 搬入/搬出平台11B係利用在X方向延伸之長方形狀的 水平上面構成。在搬入/搬出平台11B的中央係配置對於加 工平台11A搬入/搬出工件單元7的搬送手段20。又在加工平 台11A之搬送手段20的XI側係設置卡匣台30，在X2側係設 置旋轉洗淨式的洗淨手段40。再者在洗淨手段40的上方係 配置貼著手段50。 在卡匣台3 0係以可以裝拆地載置收納複數個工件單元 7之卡匣31。卡匣31係在側方具有工件單元7的出入口之開 口’使該開口朝向X2側載置在卡匣台30上。雖然未圖示， 但是在卡匣31之挾持該開口的兩側側壁内面，將在γ方向分 開的左右一對架板以涵蓋上下設置複數組。工件單元7係將 框體5载置在左右一對的架板上，藉此使複數個工件單元7 以在上下空出空隙的狀態水平收納在卡匣31内。卡匣台3〇 係為利用設置在基台11内之未圖示的昇降機構於上下方向 驅動之升降式，藉由昇降將卡匣31内的丨塊工件單元7位於 一定高度之拉出高度位置。 位於該拉出高度位置的工件單元7係利用配置在搬入/ 搬出平台11B之搬送手段2〇與卡匣台3〇之間的拉出手段以 朝X2方向被拉出，將框體5載置在朝χ方向延伸之一對弓丨導 框架36上。拉出手段32係為具備：在搬入/搬出平台UB上 8 201236066 突出之設置成可朝χ方向移動之在z方向（錯直方向）延伸的 可動桿33、固定在可動桿33上端的挾接板34、及設置在挾 接板34之卡匣台30側（XI側）的失具35者，藉由夾具35抓緊 工件單元7的框體5，將可動桿33朝X2方向移動，工件單元7 係從卡匣31内被拉出。工件單元7係在利用夾具35被拉出並 載置在引導框架36的時點完成X方向的定位。 一對引導框架36係以平行的狀態在γ方向分開，並使卡 匣台30側的一端部被支撐為可在γ方向移動。使框體5載置 在引導框架36上的工件單元7係藉由使引導框架36朝相互 靠近的方向同步移動完成γ方向的定位。藉此決定工件單元 7的搬送開始位置。 其次，工件單元7係利用搬送手段2〇搬送到洗淨手段 40。搬送手段20係具備：透過在z方向延伸之旋轉軸21可旋 轉地支撐在搬入/搬出平台11B上之伸縮式水平旋轉臂22、 固定在旋轉臂22前端之Η狀托架23、及安裝在托架23的4個 端部下面之保持墊片24。旋轉軸21係被支撐為對於基台u 可以上下移動，.而使搬送手段2〇整體成為可以上下移動。 保持墊片24係為具有利用根據氣體吸引的負壓作用在 下面的吸附面吸附、保持工件單元7的框體5，利用喷出氣 體的正壓作㈣框體5朝下方分離的機能者，配置在可以與 框體5的上面吸附之位置。利用搬送手段2()，旋轉旋轉臂22 使保持塾片24位於載置在引導框架36上的工件單元7的框 體上’接著藉由下降將框體5吸附在保持塾片24後再上昇拿 起工件單元7。再者從該狀態«轉臂22旋轉約18G。，將工 201236066 件單元7搬移到洗淨手段40的旋轉台42。 洗淨手段40係如第3圖所示，其係為在形成於基台11内 部之在上方開口的圓筒狀凹槽41内收納旋轉台42與2個水 平的喷嘴45、46之構成。旋轉台42係為利用根據氣體吸引 的負壓作用在上面的保持面42a吸附、保持工件單元7的工 件1之真空卡盤式平台，透過旋轉軸43被支樓為可自由旋 轉，利用未圖示之旋轉驅動機構而被旋轉驅動。在旋轉台 42的外周部係配置可自由裝拆地保持工件單元7的框體5之 複數個夾具44。此等夾具44係在旋轉旋轉台42產生離心力 時以從上方按壓框體5的方式動作。利用未圖示之汽缸等昇 降機構，使旋轉台42在凹槽41開口 41a的高度附近之交接位 置、與凹槽41内之下部洗淨位置之間昇降。在第3圖中，旋 轉台42係位於洗淨位置。 上述2個喷嘴4 5、4 6係使一方成為喷出洗淨水之洗淨水 喷嘴，另一方成為噴出乾燥氣體之氣體喷嘴。此等喷嘴45、 46為並列水平設置，並使基端部可水平旋轉地支撐在直立 設置在凹槽41底部之供給管部47的上端，使前端部向下彎 曲。就從洗淨水喷嘴45喷出的洗淨水而言，使用純水、或 是由於靜電防止而混入C02的純水為佳。 各噴嘴45、46係在旋轉台42位於洗淨位置時於旋轉台 42的上方水平旋轉，並朝與旋轉台42一起旋轉而自轉的整 個工件1表面噴出洗淨水或乾燥氣體。又在昇降旋轉台42時 係旋轉到比旋轉台42更外周側，位於不會干擾旋轉台42的 昇降之退避位置。 10 201236066 工件單元7_賴送手段2峨置在㈣上述交接位 置的旋轉台4 2 ’藉由洗淨手段4 Q與貼著手段5 ^在卫件i的表 面貼著保護材。 «手段_如第2及4圖所示’其係為在配置於上述 壁部12和側端面之題51内配置保護材供給手砂之構 成。供護材供給手段52係、為從將保護材薄片53捲成滚筒狀 的保護材薄片滾筒53錄出捲繞保護材薄片53，在拉出的中 途水平保持保護材薄片53，將形成在該水平部份的下面之 保遵材P貼著在被保持在旋轉台伽：件丨表面者。貼著手 段5〇係連同殼體51使整體可以上下移動地㈣在壁部12。 保遵材溥片53係為將保護材p在長度方向隔著等間隔 形成在長條帶狀的基材53a的單面上者，以保護材p成為外 周面側的狀態下捲為滾筒狀而構成保護材薄片滾筒53A。在 本發明中係包含在基材53a上以薄片狀形成保護材？的步驟 作為燒蝕加工方法步驟中之一部份。基材53a係使用例如厚 度為70〜200μιη程度之聚烯烴等柔軟的樹脂製薄片等。 保護材Ρ係形成為具有與工件丨同等面積的圓形狀。該 保5蔓材Ρ的厚度為〇·_以上1〇μιη以下，利用具有355nm波 長的光可穿透之特性的材料形成。又保護材p係被要求在工 件1的雷射加工後可以利用洗淨手段4 〇藉由水洗加以除去 之水浴性，就滿足此等條件之材料而言，使用聚乙烯醇或 疋聚乙二醇等水溶性樹脂為佳。又在保護材P中含有水溶性 的紫外線吸收劑係從確保雷射光束吸收能的觀點看來被期 。+的’就那樣的紫外線吸收劑而言係適合使用例如阿魏酸 201236066 等。 保護材薄片滾筒53A係在殼體51内的X2側以從下方朝 向XI方向捲出保護材薄片53的方式，可旋轉地支撐在供給 側滚筒軸54。如第5圖所示，保護材薄片53係從保護材薄片 滾筒53Α被捲出，通過供給側引導滾筒對55導向固定張力滾 清56，伙固疋張力浪请56朝XI方向水平延伸被捲入可動張 力滾筒57，之後，經過捲繞側引導滾筒對58被捲進捲繞軸 5 9。在從固定張力滾筒5 6到可動張力滾筒5 7之水平部份中 使保護材Ρ的露出面，也就是貼著面貼著在工件丨的表面， 因此捲繞軸59中係只有捲繞基材53a，成為基材滚筒53Β加 以回收。又在該水平部份係如第5圖所示，使2個保護材ρ 被並列位於X方向。 可動張力滾筒57係設置為可在X方向移動，在如第5圖 所示之凹槽41的XI側’也就是保護材薄片53被拉出延伸水 平部份，使該水平部份的XI側的保護材ρ位於與工件丨對應 的位置之拉出位置、與從拉出位置朝凹槽41的Χ2側移動之 基材剝離位置（第6(b)圖）之2個位置往返移動。 其次’參照第5〜7圖’說明在保持於旋轉台42的工件1 表面貼著保護材Ρ的步驟。又在此等圖式中描繪在保護材薄 片滚筒53Α或是基材滾筒53Β周圍的圓弧狀箭頭標記、描繪 在各滾筒55 ' 56、57、58内的圓弧狀箭頭標記係表示該等 滚筒在該步驟中旋轉的方向。 首先’如第5(a)圖所示，將旋轉台42從上方的交接位置 下降到下方的洗淨位置，從洗淨喷嘴45朝向工件1喷出洗淨 12 201236066 水w供給至整個表面。藉此在工件㈣表面形成水層。其 次’如第5(b)圖所示，在將旋轉台42上昇到交接位置之後， 如第6(a)圖所示，使貼著手段連同殼體51下降到貼著位置， 使保s蔓材P與工件1表面的水層接觸。藉此使保護材p的至少 /谷解於水中，透過水使保護材p與整個工件表面貼 合。 其次，如第6(b)圖所示，一邊捲繞基材滾筒53β一邊使 可動張力滾筒朝箭頭標記Ε方向（Χ2方向）轉動，使其移動到 基材剝離位置，接著如第7(a)圖所示，將貼著手段上昇到退 避位置。藉由將可動張力滾筒57移動到基材剝離位置，使 基材53a從已貼著在工件丨表面的保護材ρ被剝離，形成在工 件1的表面只貼著保護材P的狀態。因為保護材p係為覆蓋貼 著整個工件1的表面，因此全部的分割預定線2係利用保護 材P加以被覆。之後，將可動張力滾筒57如第7(b)圖所示， 朝箭頭標記F方向（XI方向）轉動回到拉出位置，使該移動距 離份的保護材薄片53從保護材薄片滾筒53A被拉出。 如以上所示工件1的表面係利用保護材p覆蓋，接著工 件單π7係利用搬送手段2〇被搬入到加工平台丨丨八的保持台 68。根據第2圖針對加工平台11A上的構成與對工件丨的雷射 加工加以說明。 加工平台11A係利用水平的上面加以構成，保持台邰 係設置在設於加工平台11A上之可以在水平的χγ*向移動 之ΧΥ移動台6〇上。在㈣台68的上方係將朝向保持在保持 台68的工件1照射雷射光束(脈衝雷射光線)施予雷射加 13 201236066 雷射加工手段70以與保持台68對向的狀態加以配置。雷射 加工手段70係被固定在壁部12。 ΧΥ移動台60係利用透過導軌61可朝X方向移動地設置 在加工平台11Α上之X軸基座62、與透過導軌63可朝γ方向 移動地設置在該X軸基座62上之γ軸基座64的組合構成。X 軸基座62係藉由利用馬達65a使滾珠螺桿65b動作之X軸驅 動機構65使其朝X方向移動。一方面，γ軸基座料係藉由利 用馬達66a使滾珠螺桿66b動作之Y軸驅動機構66使其朝γ 方向移動。 在Y軸基座64的上面係固定圓筒狀的桌台67，使保持台 68成為旋轉軸係可在Z方向自由旋轉地支撐在該桌台”之 上。保持台68係為利用根據氣體吸引的負壓作用在上面的 保持面68a吸附、保持工件單元7的工件丨之真空卡盤式平 台，藉由收納在桌台67内之未圖示的旋轉驅動手段而朝一 方向或是兩方向旋轉驅動。在保持台68的外周部係配置可 自由裝拆地保持工件單元7的框體5之複數個失具的。 雷射加工手段7〇係具有使一端固定在壁部12的幻側 面，並從該一端朝向保持台68上方在χι方向延伸之直方體 狀的框體71。在框體7丨的前端係設置約略朝向鉛直下方^ 射雷射光束之照射部72。在框體71内係收納由發出雷射光 束之發振H、減雷射光束之集光鏡、將從發振器所發出 的雷射光束導向集光鏡的同時調整雷射光束的光軸之光軸 調整手段等構成之雷射光束照射手段(未圖示）。 又在框體71的前端下部，也就是照射勒的附近係配 201236066 置用以拍攝工件丨的分割預定線2辨識雷射光束的照射位置 之枚準手段(未圖示）。該校準手段係具備照日紅件1的表面 之照明手段或光學系、由拍攝該光學系所捕捉到的\ 像之CCD等構成的攝影元件等。 〜 藉由上述洗淨手段4〇與貝占著手段％在工件W表面貼 著保護材P之工件單元7係利用搬送手段2〇被載置搬入到將 XYf動台60㈣方向移純於特定的搬人/搬出位置之保 持台68上。卫件單元7之轉1鱗賴材p之被貼著的表面 (被加工面）側朝向上方利用負壓作用吸附、保持在保持台 68又利用夹具69保持框體5。再者，將移動台朝η 方向移動’紅和位於照射部72下方之加卫位置，在該加 工位置於工件1的分割預定線2施予雷射加工而切割工件卜 對於分割預定線2的雷射加工係在利用上述的校準手 段拍=分割財線2，辨識雷射光束的照射位置之後再進 行。雷射加卫作藉由—邊使ΧΥ移動台6G的X軸基座62在乂 方向移動邊彳< 雷射加卫手段7()的照射部π順著與X方向 平订之刀割預定線2由表面側照射雷射光束到卫件丄上進 行/在刀相定線2成為與χ方向，也就是與加卫輸送方向 平仃時’藉由將保持台68旋轉而使工件i自轉加以完成。又 在照射雷射光束之分割預L的選擇係使XY移動台_ 軸土座4朝γ方向移動，肖由將從照射部72所照射之雷射 光束的照射位置之Y方向位置與加卫對象之分割預定線2吻 合之分㈣送加錢成。又加讀財向與分缝送方向 係”此相反’也就疋使γ方向為加卫輪送方向，X方向為分 15 201236066 割輸出方向加以設定亦可，沒有限定。 上=雷射加工係利用例如以下的加卫條件加以完成 •雷春+ 止；ΑΑ、Ν、Γτ·. 雷射光束的光源 波長 反覆頻率 輸出 集光光點徑 加工輪送速度 YV04雷射或是yag雷射 355nm 5〇〜]00kHz 〇·3 〜4.0W Φ9.2μηι 1 〜80〇nm/秒 為線Γ之在本實施形態_加工係 散―、70 D 纽加叫所產^之稱為碎屑的蒗201236066 VI. Description of the Invention: [Technical Sentences of the Invention] Field of the Invention The present invention relates to an ablation processing method such as a semiconductor wafer or the like for ablation processing of a beam, a laser, and ablation The protective material of the processed surface of the ribbed workpiece is covered during processing. BACKGROUND OF THE INVENTION In the manufacturing process of a semiconductor device, a plurality of rectangular element regions are formed in a rotating element region by forming a surface of a semiconductor wafer having a substantially circular flaky shape. The electronic circuit such as Lsi is followed by the necessary processing such as grinding after cutting the inner surface, and then cutting along the sizing line, and the material element regions are diced, and a plurality of components (semiconductor wafers) are obtained from one workpiece. A workpiece cutting system such as a semiconductor wafer is generally known for cutting a cutting blade that rotates at a high speed, but in recent years, it has also been carried out while irradiating a laser beam. U refers to Patent Document 1). However, the burning of the laser beam according to the illumination of the laser beam causes the flying-bead-like component to adhere to the surface of the workpiece to be cured, resulting in a problem of quality degradation. Therefore, the applicant of the present invention proposed that if the laser beam is irradiated onto the surface to be reinforced in a two-state state in which the resin is coated on the surface of the workpiece to form a protective film, the debris adheres to the protective film without being directly attached to the processed surface. The surface 'can guarantee the technology of the product f (Patent Document 2). [Patent Document 1] [Patent Document 1] Japanese Unexamined Patent Publication No. Hei No. Hei No. Hei. In the method of applying a resin to form a protective film on the surface to be processed of the workpiece, as described in the above Patent Document 2, the resin is dropped at the center of the workpiece to be rotated, and the resin is caused to flow through the entire surface to be processed by centrifugal force. The law is suitable. However, in this method, the amount of resin which is not substantially coated on the workpiece due to scattering is extremely uneconomical. The present invention has been developed in view of the above circumstances, and its main technical problem is to provide a protective material and a burn-in processing method for a processed surface which can efficiently protect a workpiece. Means for Solving the Problem The protective material of the present invention described in the first aspect of the patent application is a method of covering a machined surface of a workpiece from ablation processing when a workpiece is ablated using a laser beam ablation. The chip-protecting surface of the workpiece is characterized by being in the form of a sheet having a thickness of 0·1 μηι or more and 1 Ομηι or less, and being water-soluble, light having a wavelength of 355 nm is permeable, and has a processing schedule capable of completely covering the workpiece. The area of the line. Further, the ablation processing method of the present invention described in the second aspect of the patent application is the use of the protective material according to the first aspect of the patent application, which is characterized in that the following steps are carried out in the following steps: on the sheet-like substrate. For example, the material of the first part of the patent scope is to provide water at least on the surface of the workpiece or the surface of the protective material; _ the water layer will form the material protection material on the surface of the wire. The affixed surface and the read jasper surface are read (4); the substrate can be peeled off from the protective material; and the pure light beam is irradiated from the side of the workpiece to which the protective material has been attached, and X is added The line is given to the burning power. According to the present invention, since the sheet-like protective material is bonded to the surface to be processed of the workpiece to protect the force d, the material can be covered to the minimum necessary for processing. For this reason, the waste of the protective material is changed to V to protect the processed surface of the workpiece. Further, since the sheet-shaped protective material-coated red material is added by 4, even if the surface to be processed has irregularities, the entire surface to be processed can be surely cured. Further, the workpiece according to the present invention is not particularly limited, and examples thereof include a semiconductor wafer formed of a t-record (GaAS) or a chemical-based ic), and a DAF which is placed on the inner surface of the crystal IU. Adhesive members such as (die attach film), package of semiconductor products, shouting or glass, sapphire (10) (6) or time series, machine material substrate, control drive liquid crystal display device, (3) drive, etc. Various processing materials such as the accuracy of the jade position of the micro-sequence are required. EFFECT OF THE INVENTION The present invention achieves the effect of providing a coated and conformed processing method that can efficiently protect one piece. Brief Description of the Drawings 201236066 Fig. 1 is a perspective view showing a workpiece (semiconductor wafer) of a laser processing apparatus according to an embodiment of the present invention, showing a state in which the workpiece is supported by an annular frame by an adhesive tape. Fig. 2 is an overall perspective view showing a laser processing apparatus according to an embodiment of the present invention. Fig. 3 is a perspective view showing a cleaning means provided in the laser processing apparatus of the embodiment. Fig. 4 is a perspective view showing a bonding means provided in the laser processing apparatus of the embodiment. Figure 5 is a side view showing a step of attaching a protective material to the surface of the workpiece by means of an adhering means according to an embodiment, (a) showing the step of supplying water to the surface of the workpiece, and (b) showing that the protective material is placed above the workpiece A step of. Fig. 6 is a side view showing a step of attaching a protective material to a surface of a workpiece by means of an adhering means according to an embodiment, (a) showing a step of adhering a protective material of a protective material sheet to a surface of the workpiece, and (b) displaying from The step of peeling off the substrate of the protective material sheet on the surface of the workpiece to which the protective material has been attached. Fig. 7 is a side view showing a step of attaching a protective material to a surface of a workpiece by means of an adhering means according to an embodiment, and (a) showing a step of retracting the adhering means to the upper surface after attaching a protective material to the surface of the workpiece, ( b) shows the step of pulling out the next protective material. Embodiments 1 Embodiments for Carrying Out the Invention Hereinafter, an embodiment of the present invention will be described. [1] Workpiece 201236066 First, the workpiece in one embodiment will be described based on Fig. 1 . The workpiece 1 is a semiconductor wafer such as a tantalum wafer having a thickness of, for example, 100 to 700 μm. On the surface of the workpiece 1, a plurality of rectangular element regions 3 are drawn in accordance with two regions of a grid-shaped dividing line (processed line). In these element regions 3, an electronic circuit such as 1C or LSI (not shown) is formed. A linear slit 4 called a crystal tangential plane is formed at a specific portion of the outer peripheral portion of the workpiece 1 to show the crystal orientation of the semiconductor. The workpiece 1 is laser-processed by dividing all the predetermined dividing lines 2 by the laser processing apparatus 1 shown in Fig. 2, so that each element region 3 is cut into a plurality of elements (semiconductor wafer). In this case, the laser processing is ablation processing of the composition of the workpiece 1 by irradiating the laser beam with a laser beam of 13 43 43⁄4 [Ιφ». 4^ μ. In the ablation process, in addition to the full cut of the king through the thickness direction of the workpiece 1, it also includes a groove which is formed to a certain depth until the thickness is formed. The workpiece 1 which has been subjected to the groove processing is cut into the components by cutting the residual thickness of the groove by using the trailing path, or by applying a stress cut. As shown in Fig. 1, the workpiece 1 is disposed concentrically in the circular opening portion 5a of the ring-shaped frame 5 through the adhesive tape 6, and is formed into a body-cut workpiece unit and supplied to the laser processing apparatus 10. The adhesive tape 6 is made to adhere to one side. The metal metal (4) has a secret. By cutting the field 5, the workpiece is transported together with the workpiece unit 7. [2] Laser processing apparatus (1) The configuration and operation of the laser processing apparatus for performing the burn-in processing, together with the structure of the laser processing apparatus 10 shown in Fig. 2 of the operation description 201236066. The symbol 11 in Fig. 2 is a base. The base 11 has a processing stage 11A for laser-processing the workpiece 1 and a single side (Y1 side) provided on the processing stage 11A, and carries in/out the loading/unloading stage 11B of the workpiece unit 7 to the processing stage 11A. The wall portion 12 is erected on the inner side (X 2 side) of the processing table 11A. The loading/unloading platform 11B is configured by a rectangular horizontal surface extending in the X direction. In the center of the loading/unloading platform 11B, the conveying means 20 for loading/unloading the workpiece unit 7 to the processing platform 11A is disposed. Further, the cassette unit 30 is provided on the XI side of the transport unit 20 of the processing stage 11A, and the spin cleaning type cleaning means 40 is provided on the X2 side. Further, the attaching means 50 is disposed above the washing means 40. The cassette 31 for accommodating a plurality of workpiece units 7 is detachably mounted on the cassette 30. The cassette 31 has an opening of the entrance and exit of the workpiece unit 7 on the side, and the opening is placed on the cassette 30 toward the X2 side. Although not shown, a pair of left and right side plates which are separated in the γ direction are disposed on the inner surface of both side walls of the cassette 31 which hold the opening to cover the upper and lower arrays. In the workpiece unit 7, the frame body 5 is placed on a pair of left and right frame plates, and the plurality of workpiece units 7 are horizontally housed in the cassette 31 in a state where the space is left and left. The cassette 3 is a lifting type that is driven in the vertical direction by a lifting mechanism (not shown) provided in the base 11, and the height of the workpiece unit 7 in the cassette 31 is raised and lowered at a certain height by lifting. position. The workpiece unit 7 located at the pull-out height position is pulled out in the X2 direction by the pulling means disposed between the transport means 2 and the cassette table 3B of the loading/unloading platform 11B, and the frame 5 is placed. One of the pair of bow guide frames 36 extends in the direction of the yaw. The pull-out means 32 is provided with a movable lever 33 which is provided in the loading/unloading platform UB 8 201236066 and which is provided so as to be movable in the z-direction (straight direction), and is attached to the upper end of the movable lever 33. The plate 34 and the case 35 provided on the side of the cassette 30 (X1 side) of the splicing plate 34 are gripped by the frame 35 of the workpiece unit 7 by the jig 35, and the movable lever 33 is moved in the X2 direction. The 7 series is pulled out from the cassette 31. The workpiece unit 7 is positioned in the X direction at the time when the jig 35 is pulled out and placed on the guide frame 36. The pair of guide frames 36 are separated in the γ direction in a parallel state, and one end portion on the side of the cassette 30 is supported to be movable in the γ direction. The workpiece unit 7 on which the frame 5 is placed on the guide frame 36 is positioned to move in the γ direction by moving the guide frames 36 in the direction in which they are close to each other. Thereby, the conveyance start position of the workpiece unit 7 is determined. Next, the workpiece unit 7 is transported to the cleaning means 40 by the transport means 2. The transporting means 20 includes a telescopic horizontal rotating arm 22 rotatably supported by the loading/unloading platform 11B through a rotating shaft 21 extending in the z direction, a bracket 23 fixed to the front end of the rotating arm 22, and a bracket The spacers 24 are held under the four ends of the bracket 23. The rotating shaft 21 is supported so as to be movable up and down with respect to the base u, and the entire conveying means 2 can be moved up and down. The holding spacer 24 is a member that has the frame body 5 that adsorbs and holds the workpiece unit 7 by the suction surface that is suctioned by the negative pressure of the gas, and that is separated by the positive pressure of the gas to be discharged downward (4). It is disposed at a position that can be adsorbed on the upper side of the casing 5. By the conveyance means 2 (), the rotary arm 22 is rotated to position the holding blade 24 on the frame of the workpiece unit 7 placed on the guide frame 36, and then the frame 5 is sucked on the holding blade 24 by lowering and then raised. Pick up the workpiece unit 7. Furthermore, from this state «the arm 22 rotates by about 18G. Then, the 201236066 unit 7 is moved to the rotary table 42 of the cleaning means 40. As shown in Fig. 3, the cleaning means 40 is configured such that the rotary table 42 and the two horizontal nozzles 45, 46 are housed in the cylindrical recess 41 formed in the upper portion of the base portion 11 and open. The rotary table 42 is a vacuum chuck type platform that sucks and holds the workpiece 1 of the workpiece unit 7 by the holding surface 42a that acts on the upper surface by the suction of the gas, and is rotatably rotated by the rotating shaft 43. The rotary drive mechanism is shown and is rotationally driven. A plurality of jigs 44 for detachably holding the frame 5 of the workpiece unit 7 are disposed on the outer peripheral portion of the turntable 42. These jigs 44 are operated to press the frame 5 from above when the rotary table 42 generates centrifugal force. The raising/lowering mechanism such as a cylinder (not shown) raises and lowers the position of the turntable 42 at the vicinity of the height of the opening 41a of the recess 41 and the lower cleaning position of the recess 41. In Fig. 3, the rotary table 42 is in the washing position. One of the two nozzles 4 5 and 46 is a washing nozzle for discharging the washing water, and the other is a gas nozzle for discharging the drying gas. These nozzles 45, 46 are horizontally arranged in parallel, and the base end portion is horizontally rotatably supported at the upper end of the supply pipe portion 47 which is erected at the bottom of the groove 41, and the front end portion is bent downward. The washing water sprayed from the washing water nozzle 45 is preferably pure water or pure water mixed with CO 2 due to static electricity prevention. Each of the nozzles 45, 46 is horizontally rotated above the turntable 42 when the turntable 42 is at the washing position, and sprays washing water or drying gas toward the surface of the entire workpiece 1 that rotates together with the turntable 42. Further, when the rotary table 42 is lifted and lowered, it is rotated to the outer peripheral side of the rotary table 42, and is located at a retracted position that does not interfere with the elevation of the rotary table 42. 10 201236066 The workpiece unit 7_receiving means 2 is placed at the (four) transfer position of the rotary table 4 2 ' by the cleaning means 4 Q and the adhering means 5 ^ on the surface of the guard i. The term "means" as shown in Figs. 2 and 4 is a configuration in which a protective material is supplied to hand sand in a question 51 disposed on the wall portion 12 and the side end surface. In the protective material supply means 52, the protective material sheet 53 is recorded from the protective material sheet roll 53 in which the protective material sheet 53 is wound into a roll shape, and the protective material sheet 53 is horizontally held in the middle of the drawing, and is formed therein. The horizontal part of the underlying compliant material P is attached to the surface that is held on the rotating table. The door 5 is attached to the door 51 together with the casing 51 so that the whole portion can be moved up and down (4) in the wall portion 12. In the case where the protective material p is formed on the single surface of the long strip-shaped base material 53a at equal intervals in the longitudinal direction, the protective material p is wound into a roll shape in a state where the protective material p is on the outer peripheral surface side. The protective material sheet roll 53A is formed. In the present invention, the protective material is formed in a sheet form on the substrate 53a. The steps are part of the ablation process steps. For the base material 53a, for example, a flexible resin sheet such as polyolefin having a thickness of 70 to 200 μm is used. The protective material is formed into a circular shape having the same area as the workpiece. The thickness of the 5 vine material is 〇·_ or more and 1 〇μηη or less, and is formed using a material having a light-transmissive property of a wavelength of 355 nm. Further, the protective material p is required to be removed by the washing means 4 after the laser processing of the workpiece 1, and the water bath property is removed by washing with water. For the material satisfying these conditions, polyvinyl alcohol or polyethylene polyethylene is used. A water-soluble resin such as an alcohol is preferred. Further, the protective material P contains a water-soluble ultraviolet absorber which is expected from the viewpoint of ensuring the absorption energy of the laser beam. For such a UV absorber, it is suitable to use, for example, ferulic acid 201236066. The protective material sheet roll 53A is rotatably supported by the supply side drum shaft 54 so as to wind up the protective material sheet 53 from the lower side in the XI direction on the X2 side in the casing 51. As shown in Fig. 5, the protective material sheet 53 is taken up from the protective material sheet roll 53, and guided by the supply side guide roller pair 55 to the fixed tension rolling 56, and the tension wave 56 is horizontally extended in the XI direction. The movable tension roller 57 is inserted, and then, the winding side guide roller pair 58 is wound into the winding shaft 59 through the winding side. In the horizontal portion from the fixed tension roller 56 to the movable tension roller 57, the exposed surface of the protective material ,, that is, the abutting surface is attached to the surface of the workpiece ,, so that only the winding base is included in the winding shaft 59. The material 53a is collected as a substrate roll 53. Further, in the horizontal portion, as shown in Fig. 5, the two protective members ρ are arranged side by side in the X direction. The movable tension roller 57 is arranged to be movable in the X direction, in the XI side of the groove 41 as shown in Fig. 5, that is, the protective material sheet 53 is pulled out to extend the horizontal portion so that the XI side of the horizontal portion The protective material ρ is reciprocated at two positions of the pull-out position at the position corresponding to the workpiece 、 and the substrate peeling position (Fig. 6(b)) moving from the pull-out position toward the Χ2 side of the groove 41. Next, the step of attaching the protective material 在 to the surface of the workpiece 1 held on the turntable 42 will be described with reference to FIGS. 5 to 7. In the drawings, an arc-shaped arrow mark around the protective material sheet roll 53 or the substrate roll 53A, and an arc-shaped arrow mark drawn in each of the rolls 55' 56, 57, 58 indicate these. The direction in which the drum rotates in this step. First, as shown in Fig. 5(a), the turntable 42 is lowered from the upper transfer position to the lower cleaning position, and the cleaning nozzle 12 is sprayed toward the workpiece 1 to wash the water 12 201236066 water w to the entire surface. Thereby, a water layer is formed on the surface of the workpiece (four). Next, as shown in Fig. 5(b), after the rotary table 42 is raised to the transfer position, as shown in Fig. 6(a), the attaching means is lowered to the abutting position together with the housing 51, so that The vine material P is in contact with the water layer on the surface of the workpiece 1. Thereby, at least / gluten of the protective material p is dissolved in water, and the protective material p is bonded to the entire surface of the workpiece through the water. Next, as shown in Fig. 6(b), while the substrate roller 53β is wound, the movable tension roller is rotated in the direction of the arrow mark Χ (direction 2), and moved to the substrate peeling position, followed by the seventh (a) As shown in the figure, the sticking means is raised to the retracted position. By moving the movable tension roller 57 to the substrate peeling position, the base material 53a is peeled off from the protective material ρ that has adhered to the surface of the workpiece, and the protective material P is placed on the surface of the workpiece 1. Since the protective material p is applied to cover the surface of the entire workpiece 1, all the planned dividing lines 2 are covered with the protective material P. Thereafter, the movable tension roller 57 is rotated back to the pull-out position in the direction of the arrow mark F (XI direction) as shown in Fig. 7(b), so that the protective material sheet 53 of the moving distance portion is removed from the protective material sheet roll 53A. Pull out. As described above, the surface of the workpiece 1 is covered with the protective material p, and then the workpiece π7 is carried into the holding table 68 of the processing table by the transport means 2〇. The configuration on the processing stage 11A and the laser processing on the workpiece 加以 will be described based on Fig. 2 . The processing platform 11A is constituted by a horizontal upper surface, and the holding stage is disposed on the movable table 6A which is disposed on the processing platform 11A and can be moved to the horizontal χγ*. On the upper side of the (four) stage 68, the workpiece 1 held in the holding stage 68 is irradiated with a laser beam (pulsed laser beam), and a laser beam is applied. 13 201236066 The laser processing means 70 is arranged to be in a state of being opposed to the holding stage 68. . The laser processing means 70 is fixed to the wall portion 12. The ΧΥ mobile station 60 is an XY axis provided on the processing platform 11 by the X-axis base 62 that is movable in the X direction by the transmission guide 61, and a γ-axis that is disposed on the X-axis base 62 so as to be movable in the γ direction by the transmission guide 63. The combination of the bases 64 is constructed. The X-axis base 62 is moved in the X direction by the X-axis driving mechanism 65 that operates the ball screw 65b by the motor 65a. On the other hand, the γ-axis susceptor is moved in the γ direction by the Y-axis drive mechanism 66 that operates the ball screw 66b by the motor 66a. A cylindrical table 67 is fixed to the upper surface of the Y-axis base 64 so that the holding table 68 can be rotatably supported in the Z direction on the table in the Z-direction. The holding table 68 is used according to the gas. The vacuum chucking platform that sucks and holds the workpiece 工件 of the workpiece unit 7 on the upper holding surface 68a by the suction force is attracted to one direction or both directions by a rotational driving means (not shown) housed in the table 67. Rotary drive. A plurality of disengagements for detachably holding the frame 5 of the workpiece unit 7 are disposed on the outer peripheral portion of the holding table 68. The laser processing means 7 has a phantom side in which one end is fixed to the wall portion 12. And a rectangular parallelepiped frame 71 extending from the one end toward the upper side of the holding table 68 in the χι direction. The illuminating portion 72 that is directed toward the vertical direction of the laser beam is provided at the front end of the frame body 丨. The internal system accommodates the optical axis adjustment of the optical axis of the laser beam by emitting the laser beam H of the laser beam, reducing the laser beam, and directing the laser beam emitted from the vibrator to the collecting mirror. Laser beam irradiation means Further, in the lower portion of the front end of the casing 71, that is, in the vicinity of the illuminator, a registration means (not shown) for identifying the irradiation position of the laser beam by the planned dividing line 2 for taking the workpiece 2012 201236066 is attached. The calibration means includes an illumination means or an optical system that illuminates the surface of the red component 1, an imaging element such as a CCD that captures an image captured by the optical system, etc. - by the above-described cleaning means 4 The workpiece unit 7 that is placed on the surface of the workpiece W with the protective material P is placed on the holding table 68 that is moved in the direction of the XYf moving table 60 (four) to the specific moving/unloading position by the transporting means 2. The side of the surface (the surface to be processed) on which the spheroidal material of the spheroidal material is placed is attached to the upper surface by the negative pressure, and is held by the holding table 68, and the frame 5 is held by the jig 69. Further, it will move. The table moves 'red' in the η direction and a garnish position below the illuminating portion 72, and at this processing position, laser processing is performed on the dividing line 2 of the workpiece 1 to cut the workpiece, and the laser processing for the dividing line 2 is performed. Use the above calibration method to shoot = split Line 2, after identifying the irradiation position of the laser beam, the laser is used to move the X-axis base 62 of the ΧΥ mobile station 6G in the 乂 direction by the laser 彳 雷 雷 雷 雷 雷 雷 雷 雷 雷The illuminating portion π illuminates the laser beam from the surface side to the guard 丄 along the cutting line 2 which is aligned with the X direction, and is in the χ direction, that is, the aligning direction with the aligning direction. At the time of ', the workpiece i is rotated by the rotation of the holding table 68. The selection of the pre-L of the laser beam is also moved to move the XY moving table _ the shaft holder 4 in the γ direction. The position of the Y-direction of the irradiation position of the laser beam irradiated by the portion 72 coincides with the division target line 2 of the defending object (4), and the money is added. The reading direction is also added to the direction of the financial direction and the slit.疋The γ direction is the direction of the welcoming wheel, and the X direction is the minute 15 201236066. The cutting output direction can be set, and there is no limit. The upper = laser processing system is completed by using the following conditions: • Lei Chun + stop; ΑΑ, Ν, Γτ·. The source wavelength of the laser beam is reversed. The frequency output is collected by the light spot diameter processing wheel speed YV04 laser or It is yag laser 355nm 5〇~]00kHz 〇·3 ～4.0W Φ9.2μηι 1 ~80〇nm/sec is the line Γ in this embodiment _ processing system scatter -, 70 D Newcom called the production of ^ Crumbs
3 =飛珠係掉落附著在已貼著於工件二材P :。為此，碎屑不會直接附著在 '以 工件1的品質。 TU確保 照射在工件W雷射光束係因 波長的光可穿透之特性，因此 WP為具有35恤 夯。y & 會穿透保護材P而在工件1集 在此，保護材P中係因為如上述 八 線吸收劑，因此伴騎!>#可心 3有水溶性的紫外 ;利用雷射光束的照射而炼融。為 b 加工同時保護材p係順著分割預定線2而破广加細雷射 成為沒有利用保護材P填塞而開放 因工。15伤係 ^ 、 炚態。因此，碎屑係平 右校散並在保護材P之上落下。若是當保護狀沒 ㈣融時’恐怕會使保護材p由於内壤而從工件^表面制 離’使碎眉掉進保護材P與工件丨表雨之間而附著在工件i 的表面’但是在本實施形態中係難以發生那樣的不人宜情 16 201236066 況。 在全部的分割預定線2照射雷射光束施予燒蝕加工之 後’將工件單元7位於搬入/搬出位置的同時，並且解除根 據保持台68之工件的保持與根據夾具69之框體5的保持。再 者’利用搬送手段20從保持台68搬出工件單元7，工件單元 7係再次置於在洗淨手段40。 將工件1被燒蝕加工而切割之工件單元7係吸附、保持 在於上述交接位置待機之旋轉台42上。接著，將旋轉台42 下降旋轉到上述洗淨位置。再者各噴嘴45、46係—邊往返 方疋轉—邊從洗淨水喷嘴45的前端喷出洗淨水，使洗淨水到 处函蓋整個保護材p。藉此由水溶性樹脂構成的保護材p係 4解，使附著在保護材P的碎屑連同保護材p被水洗流動而 除去。又雖然未圖示，但是在凹槽41的底部係連接用以將 洗淨時的排出液排出到處理設備之排水管。 ^在從工件1的表面完全除去保護材P之後，停止來自洗 二水嘴嘴45的洗淨水噴出，接著在持續進行旋轉台42的旋 4二及各喷嘴45、46的往返旋轉之狀態下，從氣體噴嘴 的月而嘴出乾燥氣體。乾燥氣體係在露出的整個工件1表 :到處吹拂，再者也與利用離心力揮散水分的作用相輔相 位’而使工件成乾燥處理。之後，將旋轉台42上昇到交接 ::手用搬送手段2°力，持。再者，利用 手元7載置在引導_36上，接著使拉出 Μ闕，轉仙^具35按壓框體5 而破收納到卡匡31内。 17 201236066 以上為對於丨張工件丨施予雷射加工（燒蝕加工）而切割 的步驟之1循環，該循環係對於卡S31内的全部工件單元7 而完成。再者，被切割的工件1之工件單元7係連同卡匣31 被搬移到下個步驟，又將收納新的工件單元7之卡匣31載置 在卡匣台30，進行相同處理。 [3 ] —實施形態之作用效果 在上述—實施形態中防止碎屑不會直接附著在工件i 表面的保護材P係從薄片狀，也就是保護材薄片53貼著在工 件1的表面者。為此，保護材P係為能夠覆蓋工件丨表面的必 要最低限之大小，換言之具有與工件1相同形狀及直徑者即 可。其結果為使保護材P的浪費為少，並且可以效率佳地保 護工件1的表面。又因為貼著保護材P覆蓋工件1的表面，因 此即使在其表面有凹凸的情況也可以確實保護整個表面。 又在上述實施形態中，雖然用以將保護材P貼著在工件 1表面的水是供給到工件1的表面，但是本發明係不限於 此，可以的話將水供給到保護材P之對於工件1的貼著面而 在該貼著面形成水層，從該狀態將保護材p貼著在工件1的 表面亦可。 【圖式簡單説明】 第1圖係為顯示關於本發明之一實施形態的雷射加工 裝置之工件（半導體晶圓）的立體圖’顯示將該工件透過黏著 帶支撐在環狀框體的狀態。 第2圖係為顯示關於本發明之一實施形態的雷射加工 裝置之整體立體圖。 18 201236066 第3圖係為顯示一實施形態之雷射加工裝置所具備的 洗淨手段之立體圖。 第4圖係為顯示一實施形態之雷射加工裝置所具備的 貼著手段之立體圖。 第5圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示將水供給至工件表 面的步驟、（b)顯示將保護材位於工件上方的步驟。 第6圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示在工件表面貼著保 護材薄片之保護材的步驟、（b)顯示從已貼著保護材的工件 表面剝離保護材薄片之基材的步驟。 第7圖係為顯示利用一實施形態的貼著手段在工件表 面貼著保護材的步驟之側面圖，（a)顯示在工件表面貼著保 護材後將貼著手段退避到上方的步驟、（b)顯示拉出下個貼 著之保護材的步驟。 【主要元件符號說明】 1.. .工件 10…雷射加工裝置 2…分割預定線(加工預定線） 11...基台 3.. .元件區域 11A...加工平台 4·.·直線狀切口 11B...搬入/搬出平台 5.. .環狀框體 12...直立設置壁部 5a...圓形狀開口部 20...搬送手段 6.. .黏著帶 21、43...旋轉軸 7.. .工件單元 22...伸縮式水平旋轉臂 19 201236066 23.. .Η狀托架 24.. .保持墊片 30.. .卡密台 31.. .卡匣 32.. .拉出手段 33.. .可動桿 34.. .挾接板 35、44、69...炎具 36.. .引導框架 40.. .洗淨手段 41.. .圓筒狀凹槽 41a…開口 42.. .旋轉台 42a...保持面 45、46...喷嘴 47.. .供給管部 50.. .貼著手段 51.. .殼體 52.. .供護材供給手段 53.. .保護材薄片 53A...保護材薄片滾筒 53B...基材滾筒 53a...基材 55.. .供給側引導滾筒對 56.. .固定張力滾筒 57.. .可動張力滚筒 58.. .捲繞側引導滚筒對 59.. .撓繞轴 60.. .XY移動台 61.. .導軌 62.. .X軸基座 63.. .導執 64.. . Y軸基座 65.. .X軸驅動機構 65a、66a...馬達 65b...滾珠螺桿 66.. .Y軸驅動機構 66b...滾珠螺桿 67.. .桌台 68.. .保持台 68a...保持面 70.. .雷射加工手段 71.. .框體 72.. .照射部 P...保護材 203 = The flying beads are dropped and attached to the two materials P: which have been attached to the workpiece. For this reason, the debris does not adhere directly to the quality of the workpiece 1. The TU ensures that the laser beam incident on the workpiece W is permeable to light due to the wavelength, so the WP has 35 夯. y & will penetrate the protective material P and be in the workpiece 1 here, the protective material P is because of the above-mentioned eight-line absorbent, so accompanying riding! >#可心3 has water-soluble ultraviolet; using laser beam The radiance of the illumination. In order to process b, the protective material p is broken along the dividing line 2, and the laser beam is broken and opened without being filled with the protective material P. 15 injuries ^, embarrassing. Therefore, the chips are scattered right and fall over the protective material P. If the protective shape is not (four) melted, 'I am afraid that the protective material p will be separated from the surface of the workpiece due to the inner soil', so that the broken eyebrow falls into the surface between the protective material P and the workpiece and the surface is attached to the surface of the workpiece i. In the present embodiment, it is difficult to cause such unpleasant feelings in the case of 201236066. After all the divided planned lines 2 are irradiated with the laser beam to be ablated, the workpiece unit 7 is placed at the loading/unloading position, and the holding of the workpiece according to the holding table 68 and the holding of the frame 5 according to the jig 69 are released. . Further, the workpiece unit 7 is carried out from the holding table 68 by the transport means 20, and the workpiece unit 7 is placed in the cleaning means 40 again. The workpiece unit 7 which is ablated by the ablation of the workpiece 1 is adsorbed and held on the rotary table 42 which is placed at the transfer position. Next, the turntable 42 is lowered and rotated to the above-described washing position. Further, each of the nozzles 45, 46 is rotated side by side, and the washing water is sprayed from the front end of the washing water nozzle 45, so that the washing water covers the entire protective material p. Thereby, the protective material p composed of the water-soluble resin is removed, and the debris adhering to the protective material P and the protective material p are removed by washing with water. Further, although not shown, a drain for discharging the discharged liquid at the time of washing to the processing equipment is connected to the bottom of the recess 41. After the protective material P is completely removed from the surface of the workpiece 1, the washing water from the washing nozzle 45 is stopped, and then the rotation of the rotating table 42 and the reciprocating rotation of the respective nozzles 45, 46 are continued. Next, the dry gas is discharged from the mouth of the gas nozzle. The dry gas system is dried in the entire exposed workpiece 1 table: bobbing everywhere, and in addition to the effect of volatilizing the water by centrifugal force. After that, the turntable 42 is raised to the handover: hand transfer means 2° force, and held. Further, the hand 7 is placed on the guide _36, and then the Μ阙 拉 is pulled out, and the fascia 35 is pressed against the frame 5 to be stored in the cassette 31. 17 201236066 The above is a cycle of the step of cutting the workpiece by laser processing (ablative processing), which is completed for all the workpiece units 7 in the card S31. Further, the workpiece unit 7 of the workpiece 1 to be cut is moved to the next step together with the cassette 31, and the cassette 31 accommodating the new workpiece unit 7 is placed on the cassette table 30, and the same processing is performed. [3] - Operation and effect of the embodiment In the above-described embodiment, the protective material P which prevents the debris from adhering directly to the surface of the workpiece i is formed in a sheet shape, that is, the protective material sheet 53 is attached to the surface of the workpiece 1. For this reason, the protective material P is of a minimum necessary size to cover the surface of the workpiece, in other words, it has the same shape and diameter as the workpiece 1. As a result, the waste of the protective material P is made small, and the surface of the workpiece 1 can be efficiently protected. Further, since the surface of the workpiece 1 is covered by the protective material P, the entire surface can be surely protected even if the surface thereof has irregularities. Further, in the above embodiment, although the water for adhering the protective material P to the surface of the workpiece 1 is supplied to the surface of the workpiece 1, the present invention is not limited thereto, and water may be supplied to the protective material P for the workpiece. A water layer is formed on the adhering surface of the surface of the first surface, and the protective material p may be attached to the surface of the workpiece 1 from this state. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a workpiece (semiconductor wafer) of a laser processing apparatus according to an embodiment of the present invention, showing a state in which the workpiece is supported by an adhesive tape in a ring-shaped frame. Fig. 2 is an overall perspective view showing a laser processing apparatus according to an embodiment of the present invention. 18 201236066 Fig. 3 is a perspective view showing a cleaning means provided in the laser processing apparatus of the embodiment. Fig. 4 is a perspective view showing a bonding means provided in the laser processing apparatus of the embodiment. Figure 5 is a side view showing a step of attaching a protective material to the surface of the workpiece by means of an adhering means according to an embodiment, (a) showing the step of supplying water to the surface of the workpiece, and (b) showing that the protective material is placed above the workpiece A step of. Fig. 6 is a side view showing a step of attaching a protective material to a surface of a workpiece by means of an adhering means according to an embodiment, (a) showing a step of adhering a protective material of a protective material sheet to a surface of the workpiece, and (b) displaying from The step of peeling off the substrate of the protective material sheet on the surface of the workpiece to which the protective material has been attached. Fig. 7 is a side view showing a step of attaching a protective material to a surface of a workpiece by means of an adhering means according to an embodiment, and (a) showing a step of retracting the adhering means to the upper surface after attaching a protective material to the surface of the workpiece, ( b) shows the step of pulling out the next protective material. [Description of main component symbols] 1.. Workpiece 10... Laser processing apparatus 2... Division of a predetermined line (predetermined line of processing) 11...Abutment 3.. Component area 11A...Machining platform 4···Line The incision 11B is carried in and out of the platform 5. The annular frame 12 is provided with the wall portion 5a erected... the circular opening portion 20... the conveying means 6: the adhesive tape 21, 43. .. Rotary Axis 7.. Workpiece Unit 22... Telescopic Horizontal Rotating Arm 19 201236066 23.. . Bracket 24: Holder 30.. . Carmel 31.. Card 32 .. . Pull out means 33.. Moveable rod 34.. 挟 板 35, 44, 69... 烟 36.. Guide frame 40.. Washing means 41.. Cylindrical concave Slot 41a... Opening 42.. Rotating table 42a... Holding surface 45, 46... Nozzle 47.. Supply tube 50... Adhesive means 51.. Housing 52.. Supply means 53.. Protective material sheet 53A... Protective material sheet roll 53B... Substrate roll 53a... Substrate 55.. Supply side guide roll pair 56.. Fixed tension roll 57.. Movable tension roller 58.. Winding side guide roller pair 59.. Swing around the shaft 60.. XY moving table 61.. Guide rail 62.. X-axis base 63.. Guide 64.. Y-axis base 65.. X-axis drive mechanism 65a, 66a... Motor 65b... Ball screw 66.. Y-axis drive mechanism 66b... Ball screw 67.. . Table 68.. Table 68a... holding surface 70.. laser processing means 71.. frame 72.. illuminating part P... protective material 20