201233259 i w〇jH〇r/\ 六、發明說明： 【發明所屬之技術領域】 本發明是關於一種印刷電路板及其製造方法，且特別是 關於一種即使在高電壓下也能測量崩潰電壓的印刷電路板 及其製造方法。 【先前技術】 隨著高科技電子裝置及產品的發展，電子裝置及產品的 微型化以及技術整合正不斷地進行中，因而應用於電子裝置 及電子產品等等上的印刷電路板(PCB)亦必須隨之改變，以 配。電子裝·置及產品的微型化及技術整合。 特別是隨著對於側光式液晶顯示裝置的需求增加，對於 邊緣型印刷電路板(edge type printed circuit board)亦隨著增 加’並且要求能夠以高電壓驅動印刷電路板。 由於絕緣層原材料中存在雜質，在以高電壓驅動印刷電 路板的過程中’會產生焚毀(burnt)等缺陷，因此需要檢測絕 緣層在原材料狀態下的崩潰電壓。為此，係藉由施加電壓至 原材料狀態下的一上金屬層與一下金屬層，檢測夾在該上下 金屬層間之絕緣層的崩潰電壓。 然而根據上述方法會導致閃燃（flash over)現象發生，亦 即由於電流透過空氣而在原材料侧邊產生電弧放電。 因此’向來難以在高電壓的狀態下檢測崩潰電壓。 【發明内容】 201233259201233259 iw〇jH〇r/\ VI. Description of the Invention: [Technical Field] The present invention relates to a printed circuit board and a method of manufacturing the same, and more particularly to a printing capable of measuring a breakdown voltage even at a high voltage Circuit board and its manufacturing method. [Prior Art] With the development of high-tech electronic devices and products, the miniaturization and technology integration of electronic devices and products are constantly being carried out, so printed circuit boards (PCBs) used in electronic devices and electronic products, etc. Must be changed to match. Miniaturization and technical integration of electronic equipment and products. In particular, as the demand for the edge type liquid crystal display device increases, the edge type printed circuit board also increases, and it is required to be able to drive the printed circuit board at a high voltage. Since impurities are present in the raw material of the insulating layer, defects such as burnt are generated in the process of driving the printed circuit board at a high voltage, and therefore it is necessary to detect the breakdown voltage of the insulating layer in the raw material state. To this end, the breakdown voltage of the insulating layer sandwiched between the upper and lower metal layers is detected by applying a voltage to an upper metal layer and a lower metal layer in the state of the raw material. However, according to the above method, a flash over phenomenon occurs, that is, an arc discharge is generated on the side of the raw material due to the passage of current through the air. Therefore, it has been difficult to detect a breakdown voltage in a state of high voltage. [Abstract content] 201233259
TW8348PA 本七月提供-種即使在南電壓下也能測量崩潰電壓的 〔刷電路板及其製造方法，係藉由在電流可能流經空氣的部 刀m緣體’以避免在以高電壓檢測絕緣體之崩潰電壓時 透過空氣而產生電弧放電。 根據本發明一示範實施例提供一種印刷電路板，包含： 第至屬層，塗佈於第一金屬層之上的一絕緣體；塗佈於 絕緣體之上的-第二金屬層；以及形成於第__及第二金屬層 中至少一者之一側邊上的一保護性絕緣體。 保護性絕緣體可形成於第一及第二金屬層中至少一者 的一側邊上，以避免在檢測絕緣體之崩潰電壓時，透過空氣 而在絕緣體表面上產生電弧放電。 保護性絕緣體可形成於第一金屬層、絕緣體以及第二金 屬層的側邊上。 保護性絕緣體可藉由印刷絕緣墨水而形成。 第一金屬層可由鋁製成，而保護性絕緣體可藉由將鋁陽 極處理而形成。 保護性絕緣體可藉由塗佈一絕緣膜而形成。 保遵性絕緣體可由第一及第二金屬層中至少一者的側 邊延伸至第一及第二金屬層中至少一者的表面。 保護性絕緣體可由第一金屬層、絕緣體以及第二金屬層 的側邊延伸至第一及第二金屬層的表面。 根據本發明另一示範實施例提供一種印刷電路板的製 造方法，包含：將一絕緣體塗佈至一第一金屬層上；將一第 二金屬層塗佈至絕緣體上；於第一及第二金屬層中至少一者 201233259TW8348PA This July provides a kind of brush circuit board and its manufacturing method that can measure the breakdown voltage even under the south voltage. It is avoided by high voltage detection by the knife edge of the air flowing through the air. When the breakdown voltage of the insulator is passed through the air, an arc discharge occurs. According to an exemplary embodiment of the present invention, a printed circuit board includes: a first sub-layer, an insulator coated on the first metal layer; a second metal layer coated on the insulator; and formed on the first a protective insulator on the side of at least one of the second metal layer. A protective insulator may be formed on one side of at least one of the first and second metal layers to avoid arcing on the surface of the insulator through the air when detecting a breakdown voltage of the insulator. A protective insulator can be formed on the sides of the first metal layer, the insulator, and the second metal layer. The protective insulator can be formed by printing an insulating ink. The first metal layer can be made of aluminum, and the protective insulator can be formed by treating the aluminum anode. The protective insulator can be formed by coating an insulating film. The compliant insulator may extend from a side of at least one of the first and second metal layers to a surface of at least one of the first and second metal layers. The protective insulator may extend from the sides of the first metal layer, the insulator, and the second metal layer to the surfaces of the first and second metal layers. According to another exemplary embodiment of the present invention, a method of manufacturing a printed circuit board includes: coating an insulator onto a first metal layer; applying a second metal layer to the insulator; and first and second At least one of the metal layers 201233259
I W5J^5KA 的一側邊上形成一保護性絕緣體，以避免在檢測絕緣體之崩 潰電壓時，透過空氣而在絕緣體表面上產生電弧放電。 保護性絕緣體的形成可包含於第一金屬層、絕緣體以及 第二金屬層的側邊上形成保護性絕緣體。 保護性絕緣體的形成可包含於第一金屬層、絕緣體以及 第二金屬層之側邊上形成延伸至第一及第二金屬層表面的 保護性絕緣體。 保護性絕緣體的形成可包含藉由印刷絕緣墨水而形成 保護性絕緣體。 當第一金屬層係以鋁製成時，保護性絕緣體的形成可包 含藉由將鋁陽極處理而形成保護性絕緣體。 保護性絕緣體的形成可包含藉由塗佈一絕緣膜而形成 保護性絕緣體。 【實施方式】 在本發明說明書以及申請專利範圍中所用的字詞，不應 以限定於其通常意義或字典中之定義的方式進行解釋，而應 基於發明者可適當定義術語之概念來以最佳方式描述其發 明的法則，解釋為具有關於本發明技術領域之意義及概念。 因此，本發明之實施例及圖式所顯示的態樣僅為最佳實 施例，而不代表本發明技術精神之全部。而在提交本發明申 請案時，本發明應被視為包含所有在不影響本發明精神和範 圍的情況下所作的更動、以等價物取代以及替換。 以下將配合所附圖式，對於本發明之示範實施例進行詳 201233259 1 W8348HA 細說明。 第1至7圖顯示根據本發明第一至笫七示範實施例之印 刷電路板的剖面。 如第1至7圖所示，印刷電路板1包含一基材（base substrate)100 以及一保護性絕緣體（protective insuiator)2〇〇。 基材100意指印刷電路板1的原材料，包含一第一金屬 層120、一絕緣體140以及一第二金屬層160。第一金屬層 120、絕緣體140以及第二金屬層160係依序堆疊以形成基 材 100。 當基材 100 為銅箔基板(copper clad laminate，CCL)時， 第一及第二金屬層120、160可皆為銅，而當基材100為金 屬銅箔基板(metal copper clad laminate，MCCL)時，第一及 第二金屬層120、160可分別為鋁與銅。 此外，第一及第二金屬層120、160可為選自銅、紹、 鐵、鎳等金屬所組成之群組的任一者。 保護性絕緣體200形成於第一及第二金屬層120、160 中至少一者的一側邊上。 保護性絕緣體200可如第1圖所示，形成於第一金屬層 120之側邊上，或者可如第2圖所示，形成於第二金屬層160 之側邊上。 此外，保護性絕緣體200可如第3圖所示，形成於第一 金屬層120、絕緣體140以及第二金屬層160之側邊上。 於基材100之側邊上形成如上所述之保護性絕緣體200 的理由，為確保第一與第二金屬層120、160間的絕緣距離 201233259 W8J45PA (insulating distance)，以避免在以高電壓（例如8〇〇v^\ 緣體之崩潰電壓時，透過空氣而在絕緣體14〇之表面2'則絕 電弧放電，亦即閃燃現象。 I生 保護性絕緣體200可藉由在基材1〇〇之側邊上印刷会 墨水而形成。此外，保護性絕緣體200可藉由塗你—^^ ，一絕緣腺A protective insulator is formed on one side of I W5J^5KA to avoid arcing on the surface of the insulator through the air when detecting the breakdown voltage of the insulator. The formation of the protective insulator may include forming a protective insulator on the sides of the first metal layer, the insulator, and the second metal layer. The formation of the protective insulator may include forming a protective insulator extending to the surfaces of the first and second metal layers on the sides of the first metal layer, the insulator, and the second metal layer. The formation of the protective insulator can include forming a protective insulator by printing an insulating ink. When the first metal layer is made of aluminum, the formation of the protective insulator may comprise forming a protective insulator by anodizing the aluminum. The formation of the protective insulator may include forming a protective insulator by coating an insulating film. [Embodiment] The words used in the specification of the present invention and the scope of the patent application should not be construed as being limited to the meaning of the ordinary meaning or the definition in the dictionary, but should be based on the concept that the inventor can appropriately define the term. A preferred way of describing the principles of the invention is to have the meaning and concept of the technical field of the invention. Therefore, the embodiments of the present invention and the drawings are only the preferred embodiments and are not intended to represent all of the technical spirit of the present invention. The present invention, when submitted to the present invention, is to be construed as being inclusive of all modifications, substitutions, and substitutions thereof, without departing from the spirit and scope of the invention. The detailed description of the exemplary embodiment of the present invention will be described in detail below with reference to the accompanying drawings. Figs. 1 through 7 show cross sections of a printed circuit board according to an exemplary embodiment of the first to seventh inventions of the present invention. As shown in FIGS. 1 to 7, the printed circuit board 1 includes a base substrate 100 and a protective insuiator. The substrate 100 means a raw material of the printed circuit board 1, and includes a first metal layer 120, an insulator 140, and a second metal layer 160. The first metal layer 120, the insulator 140, and the second metal layer 160 are sequentially stacked to form the substrate 100. When the substrate 100 is a copper clad laminate (CCL), the first and second metal layers 120 and 160 may both be copper, and when the substrate 100 is a metal copper clad laminate (MCCL). The first and second metal layers 120, 160 may be aluminum and copper, respectively. In addition, the first and second metal layers 120, 160 may be any one selected from the group consisting of metals such as copper, lanthanum, iron, and nickel. The protective insulator 200 is formed on one side of at least one of the first and second metal layers 120, 160. The protective insulator 200 may be formed on the side of the first metal layer 120 as shown in Fig. 1, or may be formed on the side of the second metal layer 160 as shown in Fig. 2. Further, the protective insulator 200 may be formed on the side of the first metal layer 120, the insulator 140, and the second metal layer 160 as shown in Fig. 3. The reason for forming the protective insulator 200 as described above on the side of the substrate 100 is to ensure the insulation distance between the first and second metal layers 120, 160 by 201233259 W8J45PA (insulating distance) to avoid high voltage ( For example, when the breakdown voltage of the 8〇〇v^\ edge is transmitted through the air, the surface 2' of the insulator 14 is arc-discharged, that is, a flashing phenomenon. The I-protective insulator 200 can be used in the substrate 1 The ink is formed by printing ink on the side of the crucible. In addition, the protective insulator 200 can be coated by you-^^, an insulating gland
而形成。 R 護性絕緣 而形成 另如第4圖所示’當第一金屬層120為鋁，保 體200可藉由陽極處理鋁所製成之第一金屬層ι2〇 保護性絕緣體200可使用各種方式來形成，如浸塗 (dip scheme)等等。 式 絕緣 同時，保護性絕緣體200可由第一金屬層12〇、 屬層 140以及第二金屬層160之側邊，延伸至第一及第二 120、160的表面。 第 具體而言，如第5圖所示，在保護性絕緣體2〇〇 一延伸長度L1延伸的例子中，當施加一負（-)電壓於第 屬層120、一正(+)電壓於第二金屬層160以測量綽絡μ金 G緣體14〇 之崩潰電壓時，可進一步地阻隔基材100側邊的空氣，， 在高電壓之下也能夠輕易地檢測崩潰電壓，而不會私& 現象。 此外如第6圖所示，當保護性絕緣體200具有 較第5 圖中保護性絕緣體之第一延伸長度L1更長的第二& L2，第一與第二金屬層120、160間的絕緣距離能被進〜& 地延長，從而在高電壓之下也能夠更有效地檢測崩潰電壓步 另如第4圖及第7圖所示’藉由陽極處理鋁所製成之第 201233259And formed. R protective insulation is formed as shown in Fig. 4 'When the first metal layer 120 is aluminum, the first metal layer ι2 〇 protective insulator 200 made of the anode 200 can be used in various ways. To form, such as dip scheme and so on. Insulation At the same time, the protective insulator 200 may extend from the sides of the first metal layer 12, the genus layer 140, and the second metal layer 160 to the surfaces of the first and second 120, 160. Specifically, as shown in FIG. 5, in the example in which the protective insulator 2 extends an extension length L1, when a negative (-) voltage is applied to the first layer 120, a positive (+) voltage is applied. When the two metal layers 160 measure the breakdown voltage of the 缘 μ 金 G G G G , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , & phenomenon. Further, as shown in FIG. 6, when the protective insulator 200 has a second & L2 longer than the first extension length L1 of the protective insulator in FIG. 5, the insulation between the first and second metal layers 120, 160 The distance can be extended by ~& to be able to detect the breakdown voltage more effectively under high voltage. As shown in Figures 4 and 7, '201233259 made of anodized aluminum
TW8348PA 一金屬層120形成保護性絕緣體200，當保護性絕緣體200 之陽極處理長度自第一陽極處理長度dl延長至第二陽極處 理長度d2時，可進一步地阻隔基材100側邊的空氣，從而 能夠進一步地減少閃燃現象，如前文所述。 總而言之，當以高電壓檢測絕緣體之崩潰電壓時，會通 過空氣而在基材100(原材料）側邊產生閃燃現象。然而在本 發明之示範實施例中，為解決此一問題，係於基材100的側 邊形成保護性絕緣體200，以屏蔽基材100側邊的空氣並確 保第一與第二金屬層120、160間的絕緣距離（阻隔空氣），從 而在高電壓之下也能夠輕易地檢測崩潰電壓。 以下將對於製造根據本發明一示範實施例之印刷電路 板的步驟進行說明。 第8圖為顯示製造根據本發明一示範實施例之印刷電路 板的步驟的流程圖；而第9至12圖為顯示製造根據本發明 一示範實施例之印刷電路板的步驟的剖面圖。 請參照第8至12圖，絕緣體140係塗佈於第一金屬層 120 之上（S800；)。 接著，第二金屬層160係塗佈於絕緣體140之上以形成 基材 100(S820)。 在此，第一及第二金屬層120、160可為選自銅、鋁、 鐵、鎳等金屬所組成之群組的任一者。 再接下來，保護性絕緣體200形成於第一金屬層120、 絕緣體140以及第二金屬層160的側邊，以避免在檢測絕緣 體140之崩潰電壓時，透過空氣而在絕緣體140表面上產生 201233259 I WOJHOf/Λ 電弧放電（S840)。 在此，保護性絕緣體200可由第一金屬層12〇、絕緣體 140以及第一金屬層160之侧邊，延伸至第一及第二金屬層 120、160的表面。 曰 同時，雖然本發明之示範實施例係描述保護性絕緣體 200形成於第一金屬層120、絕緣體14〇以及第二金屬層16〇 側邊的例子，保護性絕緣體200亦可僅形成於第一及第二金 屬層120、160中至少一者的侧邊上。 此外，保護性絕緣體200可藉由在基材丨〇〇之侧邊上印 刷絕緣墨水而形成。並且，保護性絕緣體2〇〇可藉由塗佈絕 緣膜而形成。 保護性絕緣體200可使用各種方式來形成，如浸塗方式 等等。 而後，於第一金屬層120施加負㈠電壓並於第二金屬層 160施加正(+)電壓，以漸進式地將施加於絕緣體14〇的電壓 增加至一特定電壓，在該特定電壓之下會量測到一急速增加 之電流，從而在高電壓之下也能夠輕易地檢測崩潰電壓，而 不會發生閃燃現象。 如上所述’根據本發明示範實施例之印刷電路板及其製 造方法，係於基材1〇〇的側邊形成保護性絕緣體2〇〇，以確 保金屬層間的絕緣距離，從而能夠避免閃燃現象。 據此，即使在高電壓之下也能夠輕易地檢測崩潰電壓。 此外尚能調整保護性絕緣體之延伸長度（或陽極處理長 度），從而在高電壓之下也能夠檢測崩潰電壓。 201233259TW8348PA a metal layer 120 forms a protective insulator 200, and when the anode treatment length of the protective insulator 200 is extended from the first anode treatment length dl to the second anode treatment length d2, the air on the side of the substrate 100 can be further blocked, thereby The flashing phenomenon can be further reduced as described above. In summary, when the breakdown voltage of the insulator is detected at a high voltage, a flashing phenomenon occurs on the side of the substrate 100 (raw material) by the air. However, in an exemplary embodiment of the present invention, in order to solve this problem, a protective insulator 200 is formed on the side of the substrate 100 to shield the air on the side of the substrate 100 and ensure the first and second metal layers 120, The insulation distance of 160 (blocking air) makes it easy to detect the breakdown voltage even under high voltage. The steps of manufacturing a printed circuit board according to an exemplary embodiment of the present invention will be described below. Fig. 8 is a flow chart showing the steps of manufacturing a printed circuit board according to an exemplary embodiment of the present invention; and Figs. 9 to 12 are cross-sectional views showing the steps of manufacturing a printed circuit board according to an exemplary embodiment of the present invention. Referring to Figures 8 to 12, the insulator 140 is applied over the first metal layer 120 (S800;). Next, the second metal layer 160 is applied over the insulator 140 to form the substrate 100 (S820). Here, the first and second metal layers 120, 160 may be any one selected from the group consisting of metals such as copper, aluminum, iron, and nickel. Next, a protective insulator 200 is formed on the side of the first metal layer 120, the insulator 140, and the second metal layer 160 to avoid generation of 201233259 I on the surface of the insulator 140 by detecting air when the breakdown voltage of the insulator 140 is detected. WOJHOf / 电弧 arc discharge (S840). Here, the protective insulator 200 may extend from the sides of the first metal layer 12, the insulator 140, and the first metal layer 160 to the surfaces of the first and second metal layers 120, 160. Meanwhile, although the exemplary embodiment of the present invention describes an example in which the protective insulator 200 is formed on the side of the first metal layer 120, the insulator 14A, and the second metal layer 16, the protective insulator 200 may be formed only in the first And a side of at least one of the second metal layers 120, 160. Further, the protective insulator 200 can be formed by printing an insulating ink on the side of the substrate. Further, the protective insulator 2 can be formed by coating an insulating film. The protective insulator 200 can be formed in a variety of ways, such as dip coating or the like. Then, a negative (one) voltage is applied to the first metal layer 120 and a positive (+) voltage is applied to the second metal layer 160 to progressively increase the voltage applied to the insulator 14 至 to a specific voltage below the specific voltage. A rapidly increasing current is measured, so that the breakdown voltage can be easily detected under high voltage without flashing. As described above, the printed circuit board and the method of manufacturing the same according to the exemplary embodiment of the present invention form a protective insulator 2 on the side of the substrate 1 to ensure the insulation distance between the metal layers, thereby avoiding flashing. phenomenon. According to this, the breakdown voltage can be easily detected even under a high voltage. In addition, the extension length (or anode treatment length) of the protective insulator can be adjusted to detect the breakdown voltage even under high voltage. 201233259
TW8348PA 雖然本發明已以示範實施例揭露如上，然其並非用以限 定本發明。本發明所屬技術領域中具有通常知識者，在不脫 離本發明之精神和範圍内，當可作各種之更動與潤飾。因 此，本發明之保護範圍當視後附之申請專利範圍所界定者為 準。 【圖式簡單說明】 第1圖為根據本發明第一示範實施例之印刷電路板的剖 面圖。 第2圖為根據本發明第二示範實施例之印刷電路板的剖 面圖。 第3圖為根據本發明第三示範實施例之印刷電路板的剖 面圖。 第4圖為根據本發明第四示範實施例之印刷電路板的剖 面圖。 第5圖為根據本發明第五示範實施例之印刷電路板的剖 面圖。 第6圖為根據本發明第六示範實施例之印刷電路板的剖 面圖。 第7圖為根據本發明第七示範實施例之印刷電路板的剖 面圖。 第8圖為顯示製造根據本發明一示範實施例之印刷電路 板的步驟的流程圖。 第9-12圖為顯示製造根據本發明一示範實施例之印刷 201233259 I w〇j^or/\ 電路板的步驟的剖面圖。 【主要元件符號說明】 1 :印刷電路板 100 :基材 120 :第一金屬層 140 :絕緣體 160 :第二金屬層 200 :保護性絕緣體 dl :第一陽極處理長度 d2 :第二陽極處理長度 L1 :第一延伸長度 L2 :第二延伸長度 S800、S820、S840 :流程方塊 πTW8348PA Although the present invention has been disclosed above by way of exemplary embodiments, it is not intended to limit the invention. A person skilled in the art can make various changes and modifications without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing a printed circuit board according to a first exemplary embodiment of the present invention. Fig. 2 is a cross-sectional view showing a printed circuit board according to a second exemplary embodiment of the present invention. Fig. 3 is a cross-sectional view showing a printed circuit board according to a third exemplary embodiment of the present invention. Fig. 4 is a cross-sectional view showing a printed circuit board according to a fourth exemplary embodiment of the present invention. Fig. 5 is a cross-sectional view showing a printed circuit board according to a fifth exemplary embodiment of the present invention. Fig. 6 is a cross-sectional view showing a printed circuit board according to a sixth exemplary embodiment of the present invention. Fig. 7 is a cross-sectional view showing a printed circuit board according to a seventh exemplary embodiment of the present invention. Figure 8 is a flow chart showing the steps of fabricating a printed circuit board in accordance with an exemplary embodiment of the present invention. 9-12 are cross-sectional views showing the steps of fabricating a 201233259 I w〇j^or/\ circuit board in accordance with an exemplary embodiment of the present invention. [Main component symbol description] 1 : Printed circuit board 100 : Substrate 120 : First metal layer 140 : Insulator 160 : Second metal layer 200 : Protective insulator dl : First anode treatment length d2 : Second anode treatment length L1 : first extension length L2 : second extension length S800, S820, S840: flow block π