TW201232186A - Light irradiation device for exposure device, control method of light irradiation device, exposure device, and exposure method - Google Patents

Light irradiation device for exposure device, control method of light irradiation device, exposure device, and exposure method Download PDF

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Publication number
TW201232186A
TW201232186A TW100126077A TW100126077A TW201232186A TW 201232186 A TW201232186 A TW 201232186A TW 100126077 A TW100126077 A TW 100126077A TW 100126077 A TW100126077 A TW 100126077A TW 201232186 A TW201232186 A TW 201232186A
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TW
Taiwan
Prior art keywords
light
light source
mask
exposure
portions
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TW100126077A
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Chinese (zh)
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TWI443479B (en
Inventor
Tomonori Harada
Shinichiro Nagai
Hironori Kawashima
Yutaka Yamada
Shusaku Karuishi
Shinichiro Hayashi
Original Assignee
Nsk Ltd
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Priority claimed from JP2011154669A external-priority patent/JP5799306B2/en
Application filed by Nsk Ltd filed Critical Nsk Ltd
Publication of TW201232186A publication Critical patent/TW201232186A/en
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Publication of TWI443479B publication Critical patent/TWI443479B/en

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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008Production of exposure light, i.e. light sources
    • G03F7/7005Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K2/00Non-electric light sources using luminescence; Light sources using electrochemiluminescence
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V13/00Producing particular characteristics or distribution of the light emitted by means of a combination of elements specified in two or more of main groups F21V1/00 - F21V11/00
    • F21V13/02Combinations of only two kinds of elements
    • F21V13/08Combinations of only two kinds of elements the elements being filters or photoluminescent elements and reflectors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2041Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274Photolithographic processes

Abstract

The present invention provides a light irradiation apparatus for an exposure apparatus, the exposure apparatus and an exposure method. The light irradiation apparatus for exposure apparatus can shorten the time for replacing a light source part and the time for stopping the device. The light irradiation apparatus (80) comprises the following components: a plurality of light source parts (73) which respectively comprise a lamp (71) and a reflector (72) that cause the light emitted from the lamp (71) to be transmitted out directionally; a plurality of lamp boxes (81) which can respectively be equipped with a preset number of light source parts (73); and a frame (82) which can be equipped with a plurality of lamp boxes (81).

Description

201232186 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種曝光裝置用光照射裝置、光照射裝置 之控制方法、曝光裝置及曝光方法,更詳細而言,本發明 係關於一種可應用於將遮罩之遮罩圖案曝光轉印至液晶顯 示器或電漿顯示器等大型平板顯示器之基板上之曝光裝置 之曝光裝置用光照射裝置、光照射裝置之控制方法、曝光 裝置及曝光方法。 【先前技:術】 先前,作為製造平板顯示器裝置之彩色濾波器等面板之 裝置,考慮有接近曝光裝置、掃描曝光裝置、投影曝光裝 置、鏡像投影、密接式曝光裝置等各種曝光裝置。例如, 於分割逐次接近曝光裝置中,以遮罩台保持較基板小之遮 罩’並且以工件台保持基板而使兩者接近地對向配置之 後’使工件台相對於遮罩進行步進移動,並於每次步進中 自遮罩侧向基板照射圖案曝光用之光,藉此將描畫於遮罩 上之複數個圖案曝光轉印至基板上而於一個基板製作複數 個面板。又,於掃描曝光裝置中,對以固定速度搬送之基 板經由遮罩而照射曝光用之光而於基板上曝光轉印遮罩之 圖案。 近年來’顯示器裝置越來越大型化,例如於分割逐次曝 光中’於以4次曝光照射而製造第8代(2200 mmx2500 mm) 面板之情形時,一次曝光區域成為13〇0 mrnxmo mm,於 以6次曝光照射而製造之情形時,一次曝光區域成為11〇〇201232186 VI. Description of the Invention: [Technical Field] The present invention relates to a light irradiation device for an exposure device, a control method of the light irradiation device, an exposure device, and an exposure method, and more particularly, the present invention relates to an applicable The light irradiation device, the light irradiation device control method, the exposure device, and the exposure method of the exposure device for exposing the mask pattern of the mask to a substrate of a large flat panel display such as a liquid crystal display or a plasma display. [Prior Art: Technique] Conventionally, as an apparatus for manufacturing a panel such as a color filter of a flat panel display device, various exposure apparatuses such as a proximity exposure apparatus, a scanning exposure apparatus, a projection exposure apparatus, a mirror projection, and a close exposure apparatus have been considered. For example, in the split-sequential proximity exposure device, the mask table is moved stepwise relative to the mask after the mask is held smaller than the substrate and the substrate is held by the workpiece table to align the two adjacently. And irradiating the substrate for the pattern exposure from the mask side substrate in each step, thereby exposing and transferring the plurality of patterns drawn on the mask onto the substrate to form a plurality of panels on one substrate. Further, in the scanning exposure apparatus, the substrate for transport at a constant speed is irradiated with light for exposure through a mask to expose the pattern of the transfer mask on the substrate. In recent years, the display device has become larger and larger, for example, in the case of dividing the successive exposures, in the case of manufacturing the 8th generation (2200 mmx2500 mm) panel with 4 exposures, the exposure area becomes 13〇0 mrnxmo mm, In the case of manufacturing with 6 exposures, the exposure area becomes 11〇〇.

S 157707.doc 201232186 mmx75 0 mm。因此,對於曝光裝置亦要求擴大曝光區域, 亦必需提高所使用之光源之輸出。因此,已知使用複數個 光源作為照明光學系統來提高光源全體之輸出者(例如, 參照專利文獻1、2及3)。 專利文獻1中記載之曝光用照明裝置中,使自光源部出 射之發散光入射至入射面之區域的大小小於入射面以使發 散光全部入射至入射面,從而謀求自光源部發出之光之有 效活用又,專利文獻2中記載之光照射裝置於鄰接配置 之各光源間設置有阻斷光之隔離壁,防止來自鄰接之光源 之光照射以解決因加熱等所導致之光源部之問題。進而, 專利文獻3中記載之光照射裝置係將交錯狀地配置有複數 個光源單元之2組光源部於前後方向上分開配置而使光源 單元之間具有空隙,從而效率良好地冷卻光源單元。又, 專利文獻4中記載之光照射裝置中,設置有對來自光源之 光進行遮光並使入射至積分透鏡之光之聚光角變窄之遮光 機構,於使用照射區域狹小之積分透鏡之情形時,將遮光 機構插入至光路内。 先前技術文獻 專利文獻 專利文獻1:曰本專利第4391 136號公報 專利文獻2 :日本專利特開2〇〇6_324435號公報 專利文獻3 :日本專利特開20074 15817號公報 專利文獻4 :日本專利特開2〇〇5_292316號公報 【發明内容】 157707.doc 201232186 發明所欲解決之問題 一般而言,作為曝光裝置用之光源部,使用以鎢製作電 極而成之超咼壓水銀燈。如圖28(a)所示,曝光裝置用光照 射裝置I中,為使來自複數個超高壓水銀燈2之所有光乙入 射至積分器3,將複數個超高壓水銀燈2沿曲面配置成大致 圓弧狀。即便超高壓水銀燈2從未使用,自該超高壓水銀 燈2照射之光-般亦具有大致2。左右之光擴散角,若為獲 /寻咼輸出而對电極供給大電流,則伴隨使用時間之經過, 於光源之球官内鎢電極會逐漸蒸發而使電極彼此之間隔變 寬,光源之基點變大,其結果如圖28(b)所示,光之照射角 度變寬為例如2.2。。 5亥情形時,若使自超高壓水銀燈2至積分器3為止之距離 為例如4 m,則就照射角度變化0.2。而言,於照射位置(積 射面)上’通常相對於1 〇〇〜200 mm左右之照射範 積刀器3之尺寸,相當於照射範圍擴大約14爪爪。因 此:來自超高壓水銀燈2之光之一部分並未入射至積分器3 而成為損耗’因必匕存在照度降低之問題。專敎獻1〜4中 揭:之技術係藉由設定對積分器之光入射區域、或應對光 '、卩之‘、,、之對策而謀求光之有效利用,均未考慮因上述電 之消耗所弓|起之光擴散,從而具有改善之餘地。 。本發明係鑒於上述課題而完成者,纟目的在於提供一種 〇制光源。卩之照度伴隨照射時間之經過而降低之曝光裝 用光奴射裝置、光照射裝置之控制方法、曝光裝置及曝 光方法。S 157707.doc 201232186 mmx75 0 mm. Therefore, it is also required to enlarge the exposure area for the exposure apparatus, and it is also necessary to increase the output of the light source used. Therefore, it is known to use a plurality of light sources as illumination optical systems to increase the output of the entire light source (for example, refer to Patent Documents 1, 2 and 3). In the illumination device for exposure according to Patent Document 1, the size of the region where the divergent light emitted from the light source portion is incident on the incident surface is smaller than the incident surface so that all the divergent light is incident on the incident surface, thereby achieving the light emitted from the light source portion. Further, the light irradiation device described in Patent Document 2 is provided with a partition wall for blocking light between adjacent light sources, and prevents light from the adjacent light source from being irradiated to solve the problem of the light source portion due to heating or the like. Further, in the light-emitting device described in Patent Document 3, the two light source units in which a plurality of light source units are arranged in a staggered manner are arranged apart in the front-rear direction to have a gap between the light source units, thereby efficiently cooling the light source unit. Further, in the light irradiation device described in Patent Document 4, a light shielding mechanism that shields light from the light source and narrows the light collecting angle of the light incident on the integrator lens is provided, and the integrator lens having a narrow irradiation area is used. When the light shielding mechanism is inserted into the optical path. CITATION LIST Patent Literature Patent Literature 1: Japanese Patent Laid-Open No. Hei. No. 4,391,136 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. As shown in Fig. 28 (a), in the light irradiation device 1 for exposure apparatus, in order to cause all the light B from the plurality of ultrahigh pressure mercury lamps 2 to enter the integrator 3, a plurality of ultrahigh pressure mercury lamps 2 are arranged along the curved surface to be substantially circular. Arc shape. Even if the ultrahigh pressure mercury lamp 2 is never used, the light irradiated from the ultrahigh pressure mercury lamp 2 generally has approximately two. The left and right light diffusion angles, if a large current is supplied to the electrodes for obtaining/seeking the output, the tungsten electrode in the spherical body of the light source gradually evaporates and the electrodes are spaced apart from each other with the passage of time, and the light source is The base point becomes large, and as a result, as shown in FIG. 28(b), the irradiation angle of light is increased to, for example, 2.2. . In the case of 5 hr, if the distance from the ultrahigh pressure mercury lamp 2 to the integrator 3 is, for example, 4 m, the irradiation angle changes by 0.2. In the case of the irradiation position (the accumulation surface), the size of the illuminating blade 3 is usually about 1 〇〇 to 200 mm, which corresponds to an increase in the irradiation range of about 14 claws. Therefore, a part of the light from the ultrahigh pressure mercury lamp 2 is not incident on the integrator 3 and becomes a loss. Therefore, there is a problem that the illuminance is lowered. Dedicated to 1~4: The technology is based on setting the light incident area of the integrator, or responding to the countermeasures of light ', ', ', and, and is not considered for the above-mentioned electricity. The light is diffused, so there is room for improvement. . The present invention has been made in view of the above problems, and it is an object of the invention to provide a light source. The exposure light illuminating device, the light irradiation device control method, the exposure device, and the exposure method are reduced in accordance with the illuminating time.

S 157707.doc 201232186 解決問題之技術手段 本發明之上述目的係藉由下述構成而達成。 ⑴-種曝光裝置用光照射裝置,其特徵在於包括·· 稷數個光源部,其分別包含發光部與反射光學系统…亥 反射光學系統使自該發光部產生之光具有指向性地射出厂 複數個s盒,其包含光源支樓部,該光源支樓部以使上 述特疋數1之光源部之光入射至積分透鏡之入 分別支樓上述光源部; 的方式 支樓體,其包含複數㈣盒安裝部,該E盒安裝部以使 上述所有光源部之光入射至積分透鏡之入射面的方式分別 安裝上述複數個匣盒;及 光軸角度調整機構,其可調整上述各光源部之相對於上 述積分透鏡之光軸角度,以修正上述各光源部之伴隨照射 時間之經過而產生之上述光擴散。 (2) 如(1)之曝光裝置用光照射裝置,其中上述特定數量之 光源部包含分光特性不同之複數種光源部。 (3) 如(2)之曝光裝置用光照射裝置,其中上述特定數量之 光源部之各發光部的分光特性相同,且 上述特定數量之光源部藉由於其一部分配置有波長截止 慮波器而構成分光特性不同之複數種光源部。 (4) 一種曝光裝置’其特徵在於,包括: 基板保持部’其保持作為被曝光材之基板; 遮罩保持部,其以與上述基板對向之方式保持遮罩;及 照明光學系統,其包含⑴至(3)中任一項之上述光照射 157707.doc rs • 6 · 201232186 裝置、及自該光照射裝置之複數個光源部出射之光所入射 之積分透鏡;且 對上述基板經由上述遮罩而照射來自上述照明光學系統 之光。 (5)—種曝光裝置用光照射裝置之控制方法,其特徵在於, 該曝光裝置用光照射裝置包括: 複數個光源部,其分別包含發光部與反射光學系統,該 反射光學系統使自該發光部產生之光具有指向性地射出; 複數個®盒,其包含光源支揮部,該光源支撐部以使上 述特定數量之光源部之光入射至積分透鏡之入射面的方式 分別支撐上述光源部; 支揮體’其包含複數個£盒安裝部,該£盒安裝部以使 上述所有光源部之光入射至積分透鏡之入射面的方式分別 安裝有上述複數個匣盒;及 光軸角度調整機構,其可調整上述各㈣部之相對於上 述積分透鏡之光軸角度,以修正上述各光源部之伴隨照射 時間之、,二過而產生之上述光擴散;該曝光裝置用光照射裝 置之控制方法包括如下步驟: 檢測上述各光源部之伴隨照射時間之經過而產生之上述 光擴散;及 藉由上述光轴角度調整機構而修正上述光擴散。 ⑹如⑺之曝光裝置用光照射裝置之控制方法,其中該曝 光裝置用光照射裝置進而包括: ’’、、度。十其配置於上述積分透鏡之下游側,測量與各波 157707.doc 5 201232186 長對應之照度;及 控制部,其控制上述各發光部之點亮、熄滅及照度;且 上述特定數量之光源部包含分光特性不同之複數種光源 部, 上述控制部根據以上述照度計所測量之與各波長對應之 妝度,以於特定波長獲得所需之照度之方式而控制上述匣 盒内之各光源部。 (7) 如(6)之曝光裝置用光照射裝置之控制方法,其中上述 特定數量之光源部之各發光部的分光特性相同,且 上述特疋數S之光源部藉由於其一部分配置有波長截止 濾波器而構成分光特性不同之複數種光源部。 (8) 種曝光方法,其特徵在於,曝光裝置包括: 基板保持部,其保持作為被曝光材之基板; 遮罩保持部’其以與上述基板對向之方式保持遮罩;及 照明光學系統,其包含(5)至⑺中任一項之上述光照射 裝置、及自該光照射裝置之複數個光源部出射之光所入射 之積分透鏡;且 該曝光方法係-面執行(5)至⑺中任一項之上述光照射 裝置之控制方法,-面經由上述料而對上述基板照射來 自上述照明光學系統之光,而將形成於上述遮罩上之圖案 曝光轉印至上述基板。 發明之效果 根據本發明之曝光裝置用光照射裝置,其包括:複數個 光源部,其包含發光部及反射光學系統·複數個度盒,其 157707.doc rs • 8 · 201232186 人―#特疋數里之光源部之光源支撐部;支撐體,其包 :女裳有複數個g盒之複數㈣含安裝部;及光軸角度調 〃可凋整各光源部之相對於積分透鏡之光軸角 ^以修正各光源部之伴隨照射時間之經過而產生之光擴 政口此,即便伴隨光源部之照射時間之經過而產生光擴 散’亦可藉由光軸角度調整機構而修正擴散以使來自各光 原P之70 loo/。之照射量的光入射至積分透鏡,藉此,可 抑制照度伴隨照射時間之經過而降低,從而可長期地獲得 穩定之照度。 又,根據本發明之曝光裝置用光照射裝置之控制方法, 檢測各光源部之伴隨照射時間 之經過而產生之光擴散,且 藉由光轴角度調整機構而修正所檢測出之錢散,因此可 使來自各光源部之7G〜1G()%之照射量的光確實人射至積分 透鏡’可抑制照度伴隨照射時間之經過而降低,從而可長 期地獲得穩定之照度。 進而,根據本發明之曝光裝置及曝光方法,使用上述之 曝光裝置用光照射裝置及其控制方法將形成於遮罩上之圖 案曝光轉印至基板,因此可以長期穩定之照度之曝光光進 行曝光,從而可進行高精度之曝光而使製品之品質提高。 【實施方式】 以下,根據圖式詳細地說明本發明之曝光裝置用光照射 裝置、及使用有該光照射裝置之曝光裝置及曝光方法的實 施形態。 (第1實施形態)S 157707.doc 201232186 Technical Solution to Problem The above object of the present invention is achieved by the following constitution. (1) A light-emitting device for an exposure apparatus, comprising: a plurality of light source units each including a light-emitting portion and a reflection optical system; the light-reflecting optical system causes the light generated from the light-emitting portion to be directed to the factory a plurality of s boxes including a light source branch portion, wherein the light source branch portion is configured such that the light of the light source portion of the special number 1 is incident on the light source portion of the integrator lens; a plurality of (four) cartridge mounting portions that respectively mount the plurality of cassettes such that light of all of the light source units is incident on an incident surface of the integrator lens; and an optical axis angle adjustment mechanism that adjusts each of the light source units The light diffusion caused by the elapse of the irradiation time of each of the light source sections is corrected with respect to the optical axis angle of the integrator lens. (2) The light-emitting device for an exposure apparatus according to (1), wherein the specific number of the light source sections includes a plurality of light source sections having different spectral characteristics. (3) The light-emitting device for an exposure apparatus according to (2), wherein the light-emitting characteristics of the respective light-emitting portions of the specific number of light source sections are the same, and the specific number of the light source sections are configured by a part of the light-emitting sections A plurality of light source sections having different spectral characteristics are formed. (4) An exposure apparatus characterized by comprising: a substrate holding portion that holds a substrate as an exposure material; a mask holding portion that holds a mask opposite to the substrate; and an illumination optical system The light-emitting 157707.doc rs • 6 · 201232186 device according to any one of (1) to (3), and an integrator lens into which light emitted from a plurality of light source units of the light irradiation device is incident; and the substrate is passed through The light from the illumination optical system is illuminated by a mask. (5) A method of controlling a light-emitting device for an exposure apparatus, characterized in that the light-emitting device for the exposure device comprises: a plurality of light source portions each including a light-emitting portion and a reflection optical system, the reflection optical system The light generated by the light-emitting portion is directed to emit light; the plurality of ® boxes include a light source support portion that supports the light source in such a manner that light of the specific number of light source portions is incident on an incident surface of the integrator lens a plurality of cartridge mounting portions that are respectively mounted with the plurality of cassettes in such a manner that light of all of the light source portions is incident on an incident surface of the integrator lens; and an optical axis angle An adjustment mechanism for adjusting an optical axis angle of each of the (4) portions with respect to the integrator lens to correct a light diffusion caused by the illumination time of each of the light source portions; and the light irradiation device for the exposure device The control method includes the following steps: detecting the light diffusion generated by the elapse of the irradiation time of each of the light source sections; and by the above The optical axis angle adjustment mechanism corrects the light diffusion described above. (6) The method of controlling a light-emitting device for an exposure apparatus according to (7), wherein the light-emitting device of the exposure device further comprises: ’’. The illuminance corresponding to the length of each wave 157707.doc 5 201232186 is measured on the downstream side of the integrator lens, and the control unit controls the lighting, extinction, and illumination of each of the light emitting units; and the specific number of the light source units a plurality of light source units having different spectral characteristics, wherein the control unit controls the light source units in the cassette so as to obtain a desired illuminance at a specific wavelength based on the brightness corresponding to each wavelength measured by the illuminometer . (7) The method of controlling a light-emitting device for an exposure apparatus according to (6), wherein the light-emitting characteristics of the light-emitting portions of the specific number of light source sections are the same, and the light source section of the characteristic number S is configured to have a wavelength by a part thereof The cutoff filter constitutes a plurality of light source sections having different spectral characteristics. (8) an exposure method, comprising: a substrate holding portion that holds a substrate as an exposed material; a mask holding portion that holds a mask in a manner opposed to the substrate; and an illumination optical system The light irradiation device according to any one of (5) to (7), wherein the light emitted from a plurality of light source portions of the light irradiation device is incident on the integrator lens; and the exposure method is performed by (5) to (7) The method of controlling the light irradiation device according to any one of the preceding claims, wherein the substrate is irradiated with light from the illumination optical system via the material, and the pattern formed on the mask is exposed and transferred to the substrate. Advantageous Effects of Invention A light irradiation device for an exposure apparatus according to the present invention includes: a plurality of light source sections including a light-emitting section and a reflection optical system and a plurality of degrees, 157707.doc rs • 8 · 201232186 人―#特疋a light source support portion of the light source portion of the number; a support body, the package: the female skirt has a plurality of g boxes (four) including the mounting portion; and the optical axis angle adjustment can neat the optical axis of each light source portion relative to the integrator lens The angle ^ is corrected by the optical expansion of the light source portion with the passage of the irradiation time, and the light diffusion is generated by the irradiation of the light source portion. 70 loo/ from each light source P. The light of the irradiation amount is incident on the integrator lens, whereby the illuminance can be suppressed from decreasing with the passage of the irradiation time, and stable illuminance can be obtained for a long period of time. Further, according to the control method of the light irradiation device for an exposure apparatus of the present invention, light diffusion generated by the elapse of the irradiation time of each light source unit is detected, and the detected money is corrected by the optical axis angle adjustment mechanism. It is possible to suppress the illuminance of 7 G to 1 G (%) of the light source from each light source portion to be incident on the integrator lens, and it is possible to suppress the illuminance from decreasing with the lapse of the irradiation time, and it is possible to obtain stable illuminance for a long period of time. Further, according to the exposure apparatus and the exposure method of the present invention, the pattern formed on the mask is exposed and transferred to the substrate by using the above-described exposure apparatus light irradiation apparatus and the control method thereof, so that exposure light with long-term stable illumination can be exposed. Therefore, high-precision exposure can be performed to improve the quality of the product. [Embodiment] Hereinafter, an embodiment of a light irradiation device for an exposure apparatus of the present invention, an exposure apparatus using the light irradiation device, and an exposure method will be described in detail based on the drawings. (First embodiment)

S 157707.doc 201232186 如圖1及圖2所示,本實施形態之分割逐次接近曝光裝置 PE包括··保持有遮罩^^之遮罩台1〇 ;保持有玻璃基板(被 曝光材)W之基板台20;及照射圖案曝光用之光之照明光學 系統70。 再者,玻璃基板W(以下,僅稱為「基板w」)係與遮罩 Μ對向配置,且於應曝光轉印有描畫於該遮罩“上之圖案 的表面(遮罩Μ之對向面側)塗佈有感光劑。 遮罩台10包括:遮罩台底座Π,其於中央部形成有矩形S 157707.doc 201232186 As shown in FIG. 1 and FIG. 2, the split-sequential proximity exposure apparatus PE of the present embodiment includes a mask stage 1 in which a mask is held, and a glass substrate (exposed material) is held. The substrate stage 20; and the illumination optical system 70 for illuminating the light for pattern exposure. Further, the glass substrate W (hereinafter simply referred to as "substrate w") is disposed opposite to the mask ,, and the surface on which the pattern drawn on the mask is to be exposed is exposed (the pair of masks) The sensitizer is coated on the surface side. The mask stage 10 includes a mask base Π which is formed with a rectangle at the center.

形狀之開口 11a,·遮罩保持框12,其作為遮罩保持部,於X 軸' Y軸、θ方向上可移動地安裝於遮罩台底座u之開口 11a,及遮罩驅動機構16,其設置於遮罩台底座η之上表 面,使遮罩保持框12於X轴、γ軸、θ方向移動以調整遮罩 Μ之位置。 遮罩台底座11藉由豎立設置於裝置底座5〇上之支柱51、 及設置於支柱51上端部之ζ轴移動裝置52而可於ζ軸方向 (參照圖2)移動地被支撐,且配置於基板台2〇之上方。 如圖3所示,於遮罩台底座灯之開口 Ua之周緣部的上表 面,於複數個部位配置有平承面13,遮罩保持框12將設置 於其上端外周緣部之凸緣l2a載置於平承面13上。藉此, 遮罩保持框12隔有特定縫隙而插入至遮罩台底座u之開口 lla中,因此可於X軸、Y軸、θ方向僅移動該縫隙量。幵 又,於遮罩保持框12之下表面,經由間隔件15而固定有 保持有遮罩Μ之夾盤部14。於該夾盤部14卜m 丄·间s又有用以吸 附遮罩Μ之未描晝有遮罩圖案之周緣部的複數個吸引喷嘴 157707.doc •10- 201232186 14a遮罩]Vi經由吸5/喷嘴14a並藉由未圖示之真空式吸附 褒置而袭卸自如地保持於夾盤部14上。又,央盤部14與遮 罩保持框12 -同相對於遮罩台底座u而可於χ抽、γ抽、θ 方向移動。 遮罩驅動機構16包括··安裝於遮罩保持框12之沿Χ軸方 向之一邊的2台Υ軸方向驅動裝置16y ;及安裝於遮罩保持 框12之沿γ轴方向之一邊的j台χ抽方向驅動裝置⑹。 丫轴方向雜動裝置l6y包括:驅動用致動器(例如電動致 動器等)16a,其設置於遮罩台底座丨1上,包括沿Y軸方向 伸縮之棒16b;滑件16d,其經由銷支撐機構—而連結於 棒16b之前端;及導轨16e ’其安裝於遮罩保持框η之沿χ 軸方向之邊部,且可移動地安裝有滑件16^再者,X軸方 向驅動裝置16x亦具有與γ軸方向驅動裝置16y相同之構 成。 而且,於遮罩驅動機構16中,藉由使丨台又軸方向驅動裝 置16x驅動而使遮罩保持框12於又軸方向移動,藉由使2台 γ軸方向驅動裝置16y同等地驅動而使遮軍保持框12於¥= 方向移動。又,藉由使2台Y軸方向驅動裝置16y之任一方 驅動而使遮罩保持框12於Θ方向移動(繞2軸之旋轉)。 面設置有: 向面間之間 14上之遮罩 18經由移動 且配置於遮 進而,如圖1所示,於遮罩台底座丨丨之上表 間隙感測器17,其測定遮罩Μ與基板W之對 隙,及對準相機18,其用以確認保持於夾盤部 Μ之安裝位置。該些間隙感測器17及對準相機 機構19而可於X軸、γ轴方向移動地被保持,The shape opening 11a, the mask holding frame 12, which is movably attached to the opening 11a of the mask base u and the mask driving mechanism 16 as a mask holding portion in the X-axis 'Y-axis and the θ direction, It is disposed on the upper surface of the mask base η, and moves the mask holding frame 12 in the X-axis, the γ-axis, and the θ direction to adjust the position of the mask Μ. The mask base 11 is movably supported in the y-axis direction (see FIG. 2) by the struts 51 that are erected on the apparatus base 5 、 and the yaw moving device 52 that is provided at the upper end of the struts 51, and is disposed. Above the substrate table 2〇. As shown in FIG. 3, a flat bearing surface 13 is disposed on a plurality of portions on the upper surface of the peripheral edge portion of the opening Ua of the mask base lamp, and the mask holding frame 12 is provided at the flange l2a of the outer peripheral edge portion of the upper end thereof. It is placed on the flat bearing surface 13. Thereby, the mask holding frame 12 is inserted into the opening 11a of the mask base u with a specific slit therebetween, so that the gap amount can be moved only in the X-axis, Y-axis, and θ directions. Further, on the lower surface of the mask holding frame 12, the chuck portion 14 holding the mask 固定 is fixed via the spacer 15. The chuck portion 14 is further provided with a plurality of suction nozzles 157707.doc •10-201232186 14a mask]Vi via the suction 5 for adsorbing the mask Μ without describing the peripheral portion of the mask pattern The nozzle 14a is detachably held by the chuck portion 14 by a vacuum suction device (not shown). Further, the center disk portion 14 and the mask holding frame 12 are movable in the χ, γ, and θ directions with respect to the mask base u. The mask driving mechanism 16 includes two x-axis driving devices 16y attached to one side of the mask holding frame 12 in the x-axis direction, and j stages mounted on one side of the mask holding frame 12 along the γ-axis direction. The pumping direction drive unit (6). The cymbal-direction pulsation device 16E includes a driving actuator (for example, an electric actuator or the like) 16a provided on the mask base 丨1, including a rod 16b that expands and contracts in the Y-axis direction, and a slider 16d. Connected to the front end of the rod 16b via the pin supporting mechanism; and the guide rail 16e' is attached to the side of the mask holding frame η in the y-axis direction, and is movably mounted with the slider 16^, X-axis The direction driving device 16x also has the same configuration as the γ-axis direction driving device 16y. Further, in the mask driving mechanism 16, the mask holding frame 12 is driven in the axial direction by driving the stage and the axial direction driving device 16x, and the two γ-axis direction driving devices 16y are driven in the same manner. The occlusion holding frame 12 is moved in the direction of ¥=. Further, by driving either of the two Y-axis direction driving devices 16y, the mask holding frame 12 is moved in the x-direction (rotation around two axes). The surface is provided with: a mask 18 between the faces 14 is moved and disposed on the cover, and as shown in FIG. 1, a gap sensor 17 is formed on the base of the mask base, and the mask is measured. The gap with the substrate W and the alignment camera 18 are used to confirm the mounting position of the chuck portion. The gap sensors 17 and the alignment camera mechanism 19 are held movably in the X-axis and γ-axis directions.

S 157707.doc -11 - 201232186 罩保持框12内。 又,於遮罩保持框12上,如圖1所示,於遮罩台底座11 之開口 11 a之X軸方向的兩端部,設置有視需要而遮掩遮罩 Μ之兩端部之光闌葉片(aperture blade)38。該光闌葉片38 藉由包含馬達、滾珠螺桿、及線性導軌等之光闌葉片驅動 機構39而可於X軸方向移動,以調整遮罩μ之兩端部之遮 掩面積。再者’光闌葉片38不僅設置於開口 11a之X軸方向 之兩端部’而且同樣地設置於開口 1 1 a之Y軸方向之兩端 部。 如圖1及圖2所示,基板台20包括:保持有基板w之基板 保持部21 ;及使基板保持部21相對於裝置底座5〇而於X 軸、γ軸、z軸方向移動之基板驅動機構22。基板保持部 21藉由未圖示之真空吸附機構而裝卸自如地保持基板w。 基板驅動機構22於基板保持部21之下方包括γ軸平台幻、 Υ軸進給機構24、X軸平台25、χ軸進給機構%、及ζ_傾斜 調整機構27。 '、 如圖2所示,Υ軸進給機構24包括線性導軌28與進給驅動 機構29而構成’安裝於丫軸平台23之背面之滑件3〇 動體(未圖示)而跨設於在裝置底座5〇上延伸之2條導轨U 上’並且藉由馬達32與滾珠螺桿以加沿導仙驅動γ 再者,X轴進給機構26亦具有與¥轴進給機構24 構成,相對於Y軸平台23而沿χ方向驅動叫平二u Ζ-傾斜調整機構27係藉由將楔狀之移動㈣、 仏 157707.doc -12- 201232186 動機構36組合而成之可動楔機槿 機稱於X方向之一端側配置有1 台、且於另一端側配置有2台而構成。再者,進給驅動機 構29、36可為組合有馬達與滚珠螺桿裝置之構成亦可為 含有定子與轉子之線性馬達。又 ^ ^又Z_傾斜調整機構27之設 置數量為任意。 藉此,基板驅動機構22以於χ方向及丫方向進給驅動基 板保持部2!、並且微調整遮罩以與基板…之對向面間之間 隙的方式,使基板保持部2mz軸方向㈣且對其進行傾 斜調整。 於基板保持部21之X方向側部與γ方向側部上分別安裝 有棒㈣' 62’又’於裝置底座5()之丫方向端部與 端部上,設置有共計3台雷射干涉儀63、64、65。藉此, 自^射干涉儀63、64、65對棒鏡61、62照射f射光7並接 收藉由棒鏡6卜62而反射之雷射光,測定雷射光與藉由棒 鏡61、62而反射之雷射光之干涉而檢測基板台⑼之位置。 如圖2及圖4所示,照明光學系統7〇包括:光照射裝置 其包含複數個光源部73;自複數個光源部73射出之光 束所入射之積分透鏡74;光學控制部76,其將電壓得以調 整後之直流電流供給至各光源部73之燈71 ;凹面鏡77,其 改變自積分透鏡74之出射面出射之光路的方向;及曝光控 制用快H78,其配置於複數個光源㈣與積分透鏡74: 間,且以使所照射之光穿透·阻斷之方式進行開閉控制。 再者,於積分透鏡74與曝光面之間,亦可配置有Duv截止 遽波器、偏光遽波器、帶通濾、波器,又,於凹面鏡77上亦 157707.doc •13· 201232186 可設置有可手動或自動地變更鏡片之曲率之偏角修正機 構。 如圖4至圖8所示’光照射裝置80包括:複數個光源部 73 ”別包含作為發光部之超高壓水銀燈71、及使自該 燈71產生之光具有指向性地射出之作為反射光學系統的反 射鏡72 ’複數個g盒81,其可分別安裝有複數個光源部乃 中之特定數量之光源部73;及支撑㈣,其可安裝有複數 個匣盒81。 再者’於照明光學系統70中,於使用160 W之超高麼水 銀燈之If形時,對於製造第6代平板之曝光裝置需要3 μ 個光源。卩對於製造第7代平板之曝光裝置需要572個光源 4,對於製造第8代平板之曝光裝置需要774個光源部。然 而,本實施形態中,為簡化說明,如圖4所示,說明包含 54個光源部73者,該54個光源部”係將安裝有於以方向呈3 •k且於β方向主2行之共計6個光源部73的匣盒81配置3段 行之共计9個而成。再者,關於匣盒81或支撐體82,亦考 慮使光源部73之配置於α、β方向為相同數量之正方形形 狀,但使用於α' β方向上為不同數量之長方形形狀。又, 本實鈿形恶之光源部73中,將反射鏡72之開口部72b形成 為大致矩形形狀,且配置成使四邊沿α、p方向。再者,所 明大致矩形形狀之開α部72b ,並不限於圖7(約所示之將角 隅部72c交叉成直角之正方形形狀或大致長方形形狀者, 亦可為圖7(b)所示之將角隅部72e倒角成曲面狀者,或圖 7(c)所示之將角隅部72c倒角成直線狀者。又,如圖7(d)所 •14- 157707.doc rs 201232186 示,開口部72b亦可為將對向之2邊之兩端部以圓弧連接而 成之形狀。 如圖5所示,於超高壓水銀燈71之發光管(石英玻璃 球)94之内部設置有2個電極等,並填充有特定水銀蒸氣壓 之例如105〜數1〇7帕斯卡的水銀。於供給有直流電流之超高 壓水銀燈71之情形時,電極包括對放電電漿釋放電子之陰 極95、及自放電電漿流入電子之陽極96,且藉由陰極%與 陽極96間之電弧放電而發光。發光管94以使陰極%與陽極 96之中點大致位於反射鏡72之焦點的方式被固定。 反射鏡72可為具有使反射光集中於焦點之拋物面或橢圓 面之形狀,亦可為使反射光成為平行光之拋物面鏡。反射 鏡72例如包括硼矽酸玻璃或結晶化玻璃之成形體,且於其 内表面形成有反射塗膜。反射塗膜使可見光區域之光自 300〜590 nm之紫外區域反射、且使無需之可見光區域或紅 外區域之光穿透反射鏡72之背後的例如包括以〇2與?^)2〇5 之介電體多層膜。 如圖5至圖8所示,各匣盒81形成為包括以下構件之大致 長方體形狀,且具有分別相同之構成,上述構件為:支撐 特疋數里之光源部7 3之光源支撐部8 3、及凹狀之燈扣麼罩 (罩構件)84,該燈扣壓罩84扣壓支撐於該光源支撐部以上 之光源73而安裝於該光源支撐部83上。再者,所謂大致長 方體形狀’亦可為包括倒角部之形狀。 於光源支撐部83上形成有:複數個窗部83a,其對應於 光源部73之數量而設置,使來自光源部乃之光發光;及燈 157707.doc 201232186 用凹部83b’其设置於该窗部83a之罩側,包圍反射鏡72之 開口部72a(或安裝有反射鏡72之反射鏡安裝部之開口部)。 又,於該窗部83 a之罩侧相反側’分別安裝有複數個罩玻 璃85。再者’罩玻璃85之安裝為任意,亦可不設置。 各燈用凹部83b之底面形成為平面或曲面(本實施形態中 為平面),即於下述之光軸角度調整機構99未作動之狀態 下’照射光源部73之光之照射面(此處為反射鏡72之開口 部72b)與光源部73之光軸LA的交點p於各α、β方向上位於 單一曲面、例如球面r上。 於燈扣壓罩84之底面設置有與光源部73之後部抵接之抵 接部86,於各抵接部86設置有包含如馬達或氣缸般之致動 器、彈簧限位器、螺釘止動器等之燈扣壓機構87。藉此, 各光源部7 3以如下方式定位於匡盒8 1上,即,使反射鏡7 2 之開口部72a嵌合於光源支樓部83之燈用凹部83b中,將燈 扣麗罩84安裝於光源支撐部83上,且藉由燈扣壓機構87而 扣壓光源部73之後部。 因此,如圖8所示,使定位於匣盒81上之特定數量之光 源部73之光入射至積分透鏡74之入射面,且自特定數量之 光源部73之各照射面所照射的光到達積分透鏡74之入射面 之照射量成為70%~ 1 〇〇〇/〇。 又’支撐體82包括:支撐體本體91,其包含安裝有複數 個£盒8 1之複數個匣盒安裝部9〇 ;及支撐體罩92,其安裝 於該支撐體本體91上,覆蓋各匣盒81之後部。 如圖9所示’在將支撐體82安裝於光照射裝置8〇上時, 157707.doc •16· 201232186 考慮到t裝有匿盒81之支撐體82之重心,較佳為使位於最 下方之E盒81之前表面與支撐體82之設置面之間的角度ψ 為90。而安裝。藉此,可防止光照射裝置8〇傾倒。再 者’圖9表示ψ=9〇。之情形。 如圖6所示’於各匣盒安裝部90形成有面向光源支撐部 83之開口部90a,於該開口部9〇a之周圍形成有將光源支撐 部83周圍之矩形平面所對向之平面9〇b作為底面之匣盒用 凹4 90c。又’於支撐體本體91之匣盒用凹部9〇c周圍設置 有用以固定匣盒81之匣盒固定機構93,本實施形態中,其 與形成於匣盒81上之凹部81a卡合而固定匣盒81。 再者,如圖10所示,當匣盒81藉由匣盒固定機構93而固 疋時,將匣盒81以其一部分傾斜之狀態組裝於匣盒安裝部 〇則可使光照射裝置8〇難以向後方傾倒地組裝。 排列於α方向或β方向上之匣盒用凹部9〇c之各平面9〇b形 成為以特定角度γ交又(參照圖8),以使各匣盒81之照射有 有光源邛73之光之照射面與光源部73之光軸LA的交點ρ 於各α、β方向上位於單一曲面、例如球面r上。 因此,各匣盒81係於將該些光源支撐部83嵌合於各匣盒 女哀邛90之匣盒用凹部9〇c中而定位之狀態下,藉由使匣 :固定機構93卡合於匣盒81之凹部81a中而分別固定於支 撐體82上。而且,在將該些各匣盒81安裝於支撐體本體91 上之狀態下,於該支撐體本體91上安裝有支撐體罩92。因 此’如®8所示,使定位於各g盒81上之所有光源部乃之 “射至積分透鏡74之入射面,且自所有光源部73之各照 157707.doc 5 •17· 201232186 射面所照射之光到達積分透鏡74之入射面的照射量成為 70%〜100% 〇 再者’亦可替代圖6所示之匣盒固定機構93,如圖丨i所 示,於匣盒81之對向之兩邊設置貫通孔83c,將作為匿盒 固疋機構之圓柱狀之轴構件93a經由貫通孔83c而插入至支 撐體本體91之凹部91b中,藉此固定匣盒81。再者,貫通 孔或匣盒固定機構係設置於對向之兩邊之中間部,但例如 亦可設置於匣盒81之四角處。又,於匣盒81上,如圖12所 示,亦可替代貫通孔83c而設置與匣盒81之側面相對之槽 部83d,將圓柱狀之軸構件93以呈由槽部83d而插入至支撐 體本體91之凹部91b中,藉此固定匣盒81。又’匣盒固定 機構亦可替代圓柱狀之軸構件93a而為如圖13所示之多邊 形狀之軸構件93e,亦可與其相應地變更貫通孔83c或凹部 91b之形狀。特別藉由將匣盒固定機構形成為圓柱狀之軸 構件93a與多邊形狀之軸構件93e之組合而可將匣盒81無誤 地安裴於支撐體82之標準的位置處。又,如圖u及圖以所 不之匣盒固定機構可與圖6所示之匣盒固定機構%同時使 用。 或者亦可如圖14(a)所示於匣盒81之四角設置作為匣盒固 定機構之圓柱突起93b或多邊形突起,且如圖14〇3)所示與 形成於支撐體本體91側之孔部或槽部91c嵌合而對準。或 者亦可如圖15(a)所示於匿盒81之對向之兩邊形成棒頭 93c ’且 > 圖i5(b)所示與形成於支撐體本體側之孔部或 槽部贈合而對準。再者’自組裝性考慮,榫頭93c較佳 157707.doc 201232186 為=置於兩邊’但如圖15⑷之—點鏈線所示,榫頭w亦 可又置於剩餘之對向之兩邊上。又,亦可為如下構成:將 ^ ()所示之圓柱突起93b或圖15(a)所示之榫頭93c設置 於支標體本體91側、且將孔部或槽部設置於匡盒81側。進 圖(a)及圖15(a)所示之匣盒固定機構亦可與圖8所示 之匣盒固定機構93同時使用。 圖所示,於框狀之光源支撐部83之背面固定有自鄰 接之光源部73之間向後方延伸之長條的外螺紋97a,該外 螺紋97a之前端螺合於藉由固定於燈扣壓罩底部之馬達 98而鉍轉驅動的螺帽m。若馬達%作動而使螺帽9職 轉’則光源支撐部83經由螺合之外螺紋97a而被拉伸或擠 壓而發生彈性變形,藉此,固定於光源支揮部83上之光源 473之光軸角度得以調整。換言之,外螺紋^、螺帽9外 及馬達98構成調整相對於積分透鏡74之各光源部73之光轴 角度的光軸角度調整機構99。S 157707.doc -11 - 201232186 The cover is held inside the frame 12. Further, on the mask holding frame 12, as shown in Fig. 1, at both end portions of the opening 11a of the mask base 11 in the X-axis direction, light which shields both ends of the mask as needed is provided. An aperture blade 38. The diaphragm blade 38 is movable in the X-axis direction by a diaphragm driving mechanism 39 including a motor, a ball screw, and a linear guide to adjust the shielding area of both ends of the mask μ. Further, the diaphragm blades 38 are provided not only at both end portions of the opening 11a in the X-axis direction but also at both end portions of the opening 1 1 a in the Y-axis direction. As shown in FIGS. 1 and 2, the substrate stage 20 includes: a substrate holding portion 21 holding the substrate w; and a substrate for moving the substrate holding portion 21 in the X-axis, the γ-axis, and the z-axis direction with respect to the device chassis 5 Drive mechanism 22. The substrate holding portion 21 detachably holds the substrate w by a vacuum suction mechanism (not shown). The substrate driving mechanism 22 includes a γ-axis platform phantom, a cymbal feeding mechanism 24, an X-axis stage 25, a cymbal feeding mechanism %, and a ζ_ tilt adjusting mechanism 27 below the substrate holding portion 21. As shown in FIG. 2, the cymbal feeding mechanism 24 includes a linear guide 28 and a feed drive mechanism 29 to constitute a slidable body (not shown) attached to the back surface of the cymbal platform 23 and straddles The two guide rails U are extended on the base 5 of the device and are driven by the motor 32 and the ball screw to drive the γ. The X-axis feed mechanism 26 also has a structure with the spindle feed mechanism 24. The movable wedge machine is driven in the χ direction relative to the Y-axis platform 23 by a combination of a wedge-shaped movement (4) and a 仏157707.doc -12-201232186 moving mechanism 36. The downtime machine is configured to have one unit disposed on one end side in the X direction and two units disposed on the other end side. Further, the feed drive mechanisms 29, 36 may be a combination of a motor and a ball screw device or a linear motor including a stator and a rotor. Further, ^ ^ and the number of Z_tilt adjustment mechanisms 27 are arbitrary. Thereby, the substrate driving mechanism 22 feeds the substrate holding portion 2 in the meandering direction and the weir direction, and finely adjusts the gap between the mask and the opposing surface of the substrate, so that the substrate holding portion 2mz is in the axial direction (four) And tilt it. A rod (four) '62' is mounted on the X-direction side portion and the γ-direction side portion of the substrate holding portion 21, respectively, and a total of three laser interferences are provided on the end portion and the end portion of the device base 5 () in the meandering direction. Instruments 63, 64, 65. Thereby, the laser beams 7 are irradiated to the rod mirrors 61, 62 by the radiation interferometers 63, 64, 65, and the laser light reflected by the rod mirrors 62 is received, and the laser light is measured by the rod mirrors 61, 62. The position of the substrate stage (9) is detected by the interference of the reflected laser light. As shown in FIGS. 2 and 4, the illumination optical system 7A includes a light irradiation device including a plurality of light source portions 73, an integrator lens 74 from which a light beam emitted from a plurality of light source portions 73 is incident, and an optical control portion 76. The DC current whose voltage is adjusted is supplied to the lamp 71 of each light source unit 73; the concave mirror 77 changes the direction of the optical path emitted from the exit surface of the integrator lens 74; and the exposure control fast H78 is disposed in the plurality of light sources (4) and The integrator lens 74 is opened and closed so as to penetrate and block the irradiated light. Furthermore, between the integrator lens 74 and the exposure surface, a Duv cut-off chopper, a polarization chopper, a band pass filter, and a wave filter may be disposed, and the concave mirror 77 may also be 157707.doc •13· 201232186 An angling correction mechanism that can manually or automatically change the curvature of the lens is provided. As shown in FIGS. 4 to 8, the 'light-emitting device 80 includes a plurality of light source units 73' that include an ultra-high pressure mercury lamp 71 as a light-emitting portion and a light-reflecting light that is emitted from the lamp 71 in a directivity manner. The mirror 72 of the system has a plurality of g boxes 81 which are respectively mounted with a specific number of light source portions 73 of a plurality of light source portions, and a support (four) which can be mounted with a plurality of cassettes 81. In the optical system 70, when an If shape of a 160 W ultra-high mercury lamp is used, 3 μ light sources are required for the exposure apparatus for manufacturing the 6th generation flat plate. 572 572 light sources 4 are required for the exposure apparatus for manufacturing the 7th generation flat plate, 774 light source units are required for the exposure apparatus for manufacturing the 8th generation flat plate. However, in the present embodiment, for simplification of description, as shown in FIG. 4, 54 light source units 73 will be described, and the 54 light source units will be mounted. The cassette 81 having a total of six light source units 73 in the direction of 3 • k and two lines in the β direction is arranged in a total of nine rows. Further, regarding the cassette 81 or the support 82, it is also considered that the light source unit 73 is arranged in the same number of square shapes in the α and β directions, but is used in a different number of rectangular shapes in the α' β direction. Further, in the light source portion 73 of the present embodiment, the opening portion 72b of the mirror 72 is formed into a substantially rectangular shape, and is arranged so that the four sides are in the directions α and p. Further, the opening α portion 72b having a substantially rectangular shape is not limited to the one shown in Fig. 7 (the square shape or the substantially rectangular shape in which the corner portion 72c is crossed at right angles as shown in Fig. 7(b). It is shown that the corner portion 72e is chamfered into a curved shape, or the corner portion 72c is chamfered into a straight line as shown in Fig. 7(c). Further, as shown in Fig. 7(d), 14-157707.doc Rs 201232186, the opening 72b may have a shape in which both ends of the opposite sides are connected by a circular arc. As shown in Fig. 5, the arc tube (quartz glass ball) 94 of the ultrahigh pressure mercury lamp 71 is used. Two electrodes or the like are disposed inside and filled with mercury having a specific mercury vapor pressure of, for example, 105 to 1 〇7 Pascal. In the case of supplying an ultrahigh pressure mercury lamp 71 having a direct current, the electrode includes electrons released to the discharge plasma. The cathode 95 and the self-discharge plasma flow into the anode 96 of the electron and emit light by arc discharge between the cathode % and the anode 96. The arc tube 94 is such that the cathode % and the anode 96 are substantially at the focus of the mirror 72. The mode is fixed. The mirror 72 can be a paraboloid or an ellipse having the reflected light concentrated at the focus. The shape of the circular surface may be a parabolic mirror that causes the reflected light to be parallel light. The mirror 72 includes, for example, a formed body of borosilicate glass or crystallized glass, and a reflective coating film is formed on the inner surface thereof. The light in the visible light region is reflected from the ultraviolet region of 300 to 590 nm, and the light of the unnecessary visible light region or the infrared region is penetrated behind the mirror 72, for example, including a plurality of dielectric layers of 〇2 and ^2) membrane. As shown in FIGS. 5 to 8, each of the cassettes 81 is formed in a substantially rectangular parallelepiped shape including the following members, and the above-described members are: a light source supporting portion 8 that supports the light source portion 73 in a specific number of points. And a concave lamp cover (cover member) 84 that is attached to the light source support portion 83 by pressing the light source 73 supported by the light source support portion. Further, the substantially rectangular parallelepiped shape ' may also be a shape including a chamfered portion. A plurality of window portions 83a are formed on the light source supporting portion 83, which are provided corresponding to the number of the light source portions 73 to emit light from the light source portion, and a lamp 157707.doc 201232186 is provided in the window by a recess 83b' The cover side of the portion 83a surrounds the opening portion 72a of the mirror 72 (or the opening portion of the mirror mounting portion to which the mirror 72 is attached). Further, a plurality of cover glasses 85 are attached to the side opposite to the cover side of the window portion 83a. Further, the mounting of the cover glass 85 is arbitrary or may not be provided. The bottom surface of each of the lamp recesses 83b is formed into a flat surface or a curved surface (in the present embodiment, a plane), that is, the irradiation surface of the light that illuminates the light source unit 73 in a state where the optical axis angle adjusting mechanism 99 described below is not activated (here) The intersection p of the opening 72b) of the mirror 72 and the optical axis LA of the light source unit 73 is located on a single curved surface, for example, a spherical surface r, in the respective α and β directions. An abutting portion 86 abutting against a rear portion of the light source portion 73 is disposed on a bottom surface of the light button cover 84. Each of the abutting portions 86 is provided with an actuator such as a motor or a cylinder, a spring stopper, and a screw stop. A lamp pressing mechanism 87 such as a device. Thereby, each of the light source units 733 is positioned on the cassette 8 1 in such a manner that the opening 72a of the mirror 7 2 is fitted into the lamp recess 83b of the light source branch portion 83, and the light cover is covered. 84 is attached to the light source supporting portion 83, and the rear portion of the light source portion 73 is pressed by the lamp pressing mechanism 87. Therefore, as shown in Fig. 8, light of a specific number of light source portions 73 positioned on the cassette 81 is incident on the incident surface of the integrator lens 74, and light irradiated from each of the illumination surfaces of the specific number of light source portions 73 is reached. The irradiation amount of the incident surface of the integrator lens 74 is 70% to 1 〇〇〇/〇. Further, the support body 82 includes a support body 91 including a plurality of cassette mounting portions 9A on which a plurality of cassettes 8 1 are mounted, and a support body cover 92 mounted on the support body 91 to cover each The back of the box 81. As shown in Fig. 9, when the support body 82 is attached to the light irradiation device 8 157707.doc •16· 201232186, considering the center of gravity of the support body 82 in which the cassette 81 is mounted, it is preferably at the bottom. The angle ψ between the front surface of the E case 81 and the set face of the support body 82 is 90. And install. Thereby, it is possible to prevent the light irradiation device 8 from falling over. Further, Fig. 9 shows ψ = 9 〇. The situation. As shown in FIG. 6, the opening portion 90a facing the light source supporting portion 83 is formed in each of the cassette mounting portions 90, and a plane facing the rectangular plane around the light source supporting portion 83 is formed around the opening portion 9A. 9〇b is used as the bottom of the box for the recess 4 90c. Further, a cassette fixing mechanism 93 for fixing the cassette 81 is provided around the recessed portion 9C of the support body 91. In the present embodiment, the recessed portion 81a formed on the cassette 81 is engaged and fixed. 81 box 81. Further, as shown in FIG. 10, when the cassette 81 is fixed by the cassette fixing mechanism 93, the cassette 81 is assembled to the cassette mounting portion with a portion thereof tilted, and the light irradiation unit 8 can be made. It is difficult to assemble backwards. The planes 9〇b of the recesses 9〇c arranged in the α direction or the β direction are formed to intersect at a specific angle γ (refer to FIG. 8) so that the illumination of each of the cassettes 81 is performed by the light source 邛73. The intersection ρ of the light irradiation surface and the optical axis LA of the light source unit 73 is located on a single curved surface, for example, the spherical surface r in the respective α and β directions. Therefore, each of the cassettes 81 is engaged with the fixing mechanism 93 by fitting the light source supporting portions 83 to the cassette recesses 9〇c of the cassette boxes 90. The recesses 81a of the cassette 81 are respectively fixed to the support body 82. Further, in a state in which the respective cassettes 81 are attached to the support body 91, a support body cover 92 is attached to the support body 91. Therefore, as shown in Fig. 8, all the light source portions positioned on the respective g-boxes 81 are "shot" to the incident surface of the integrator lens 74, and each of the light source portions 73 is illuminated by 157707.doc 5 •17·201232186 The irradiation amount of the light irradiated by the surface to the incident surface of the integrator lens 74 becomes 70% to 100%. Further, instead of the cassette fixing mechanism 93 shown in FIG. 6, as shown in FIG. The through hole 83c is provided on both sides of the opposite side, and the cylindrical shaft member 93a as the concealing means is inserted into the recess 91b of the support main body 91 via the through hole 83c, thereby fixing the cassette 81. The through hole or the cassette fixing mechanism is disposed at an intermediate portion of the opposite sides, but may be disposed, for example, at the four corners of the cassette 81. Further, on the cassette 81, as shown in FIG. 12, the through hole may be replaced. The groove portion 83d opposed to the side surface of the cassette 81 is provided at 83c, and the cylindrical shaft member 93 is inserted into the concave portion 91b of the support body 91 by the groove portion 83d, thereby fixing the cassette 81. The cartridge fixing mechanism can also replace the cylindrical shaft member 93a as a polygonal shaft as shown in FIG. The shape of the through hole 83c or the recessed portion 91b can be changed correspondingly to the piece 93e. In particular, the cassette 81 can be made correct by the combination of the cylindrical member 93a and the polygonal shaft member 93e. The ground is mounted at the standard position of the support body 82. Further, as shown in Fig. 5 and the figure, the cassette fixing mechanism can be used simultaneously with the cassette fixing mechanism % shown in Fig. 6. Alternatively, as shown in Fig. 14 ( a) A cylindrical projection 93b or a polygonal projection as a cassette fixing mechanism is provided at the four corners of the cassette 81, and is fitted to the hole portion or the groove portion 91c formed on the side of the support body 91 as shown in Fig. 14A). Alternatively, or as shown in FIG. 15(a), the rod head 93c' may be formed on both sides of the concealed box 81 and <Fig. i5(b) and the hole formed on the side of the support body or The groove part is given and aligned. In addition, 'self-assembly consideration, Shantou 93c is better 157707.doc 201232186 = placed on both sides' but as shown in Figure 15 (4) - point chain line, the head w can also be placed in the remaining On either side of the opposite side, it may be configured as follows: a cylindrical protrusion 93b as shown by ^() or as shown in Fig. 15(a) The head 93c is disposed on the side of the support body 91, and the hole portion or the groove portion is disposed on the side of the cassette 81. The cassette fixing mechanism shown in Figs. (a) and 15(a) may also be as shown in Fig. 8. The cassette fixing mechanism 93 is used at the same time. As shown in the figure, a long external thread 97a extending rearward from the adjacent light source unit 73 is fixed to the rear surface of the frame-shaped light source supporting portion 83, and the external thread 97a is at the front end. The nut is screwed to the nut m that is driven by the motor 98 fixed to the bottom of the lamp cover. If the motor is actuated to rotate the nut 9, the light source support portion 83 is pulled by screwing the external thread 97a. The elastic deformation is performed by stretching or pressing, whereby the optical axis angle of the light source 473 fixed to the light source branching portion 83 is adjusted. In other words, the external thread ^, the nut 9 and the motor 98 constitute an optical axis angle adjusting mechanism 99 for adjusting the optical axis angle with respect to each of the light source portions 73 of the integrator lens 74.

再者,由光軸角度調整機構99所調整之各光源部乃之光 軸角度係可修正伴隨光源部73之照射時間之經過而產生之 光擴散之角度,例如為1〇以下之微小角度便足夠,因此可 於光源支撐部83之彈性變形之範圍内調整。又,光軸角度 調整機構"並不限定於上述之包括外螺紋97a、螺帽97J 及馬達98之機構,可採用任意機構,亦可配設於扣壓光源 部73之後部之燈扣壓機構87上。 又,如圖8所示,與積分透鏡74鄰接地配設有例如照度 計等之光檢測裝置1G1。光檢測裝置⑻檢測藉由伴隨照二 157707.doc 5 • J9· 201232186 時間之經過所產生之光源部73之光的擴散而照射至積分透 鏡74外而並未入射至積分透鏡74中的洩漏光量。又,光檢 測裝置HH及光軸角度調整機構99之馬達98分別藉由電線 103而連接於控制裝置1〇2。 、 而且,若光檢測襄置101檢測出茂漏光量,則使馬達% 作動,以使70~100%之照射量之光入射至積分透鏡74中的 方式而調整光源部73之光軸角度,修正光之擴散量。更具 體而言,若光檢測裝置101檢測出超過所設定之特定臨限 值的光量,則控制裝置102對馬達98傳達作動指令而使其< 作動,使螺帽97b旋轉。藉此,將螺合於螺帽97b之外螺紋 97a朝馬達98方向引入,使光源支撐部以朝曲率半徑變小 之方向發生彈性變形,以此使各光源部73之光轴角度朝向 内側:修正光之擴散量。藉此’若光檢測裝置ι〇ι檢測出 之光量降低至初始值以下,即,若使7〇〜1〇〇%之照射量之 光以與初始狀態相同之方式人射至積分透鏡74,則馬物 之作動停止。 再者,若光檢測裝置1〇1係可檢測出藉由照射時間而產 生之光源部73之光擴散者,則並不限定於光檢測裝置 ’亦可為配置於積分透鏡74之人射面上之光量檢測裝 置、或計數照射時間之計時器等。在將光量檢測裝置配置 於,刀透鏡74上之情形時’當藉由光量檢測裝置所檢測之 光量少於特定臨限料,使藉由絲角度調整機構99調整 各光源部73之光軸角度後之光入射至積分透鏡74之中心 〇 而且田檢測光量還原為初始值時,停止作動。另一 157707.doc -20- 201232186 方面,當即便藉由光軸角度調整機構99而調整各光源部乃 之光軸角度後仍少於特定臨限值之情形時,判斷燈71自身 之照度降低’故而進行燈7丨之更換。 又,於計時器控制之情形時,預先檢查光源部73之照射 日守間與光之擴散角度的關係,當經過特定照射時間時,調 整各光源部73之光軸角度。 又,進行燈71之更換後亦檢查照度,但有時照度無法還 原。例如’於罩玻璃85被污染之情形時,更換罩玻璃8卜 罩玻璃85之污垢可藉由目視而確認,亦可藉由感測器而碟 認。作為感測器,可使用穿透型之光檢測感測器、反射型 之光檢測感測器、渦電流式之感測器。 如此構成之曝光裝置pE中,於照明光學系統7〇中若於 曝光時曝光控制用快門78受到開控制,則自超高壓水銀燈 71照射之光會入射至積分透鏡74之入射面。然後,自積分 透鏡74之出射面發出之光藉由凹面鏡77而改變其行進方向 並且變換為平行光。然後,該平行光對保持於遮罩台1〇上 之遮罩Μ、進而對保持於基板台2〇上之基板w之表面作為 圖案曝光用之光而大致垂直地照射,將遮罩1^之圖案1>曝 光轉印至基板W上。 此處,即便超高壓水銀燈71為未使用之燈,自超高壓水 銀燈71照射之光例如亦具有2。左右之光之擴散角,但若為 獲得高輸出而對電極95、96間供給大電流,則伴隨使用時 間之經過,於發光管94内鎢之電極95、96會逐漸蒸發而使 兩電極95、96之間隔變寬,*源之基點變大,光擴散且昭 〇八 1 - <、、、Further, the optical axis angle of each of the light source sections adjusted by the optical axis angle adjusting means 99 can correct the angle of light diffusion caused by the irradiation time of the light source section 73, for example, a slight angle of 1 〇 or less. It is sufficient that it can be adjusted within the range of elastic deformation of the light source supporting portion 83. Further, the optical axis angle adjusting mechanism is not limited to the above-described mechanism including the male screw 97a, the nut 97J, and the motor 98, and any mechanism may be employed, or the lamp pressing mechanism 87 may be disposed at the rear of the crimping light source portion 73. on. Further, as shown in Fig. 8, a photodetecting device 1G1 such as an illuminometer is disposed adjacent to the integrator lens 74. The light detecting device (8) detects the amount of leaked light that is incident on the outside of the integrator lens 74 without being incident on the integrator lens 74 by the diffusion of the light from the light source portion 73 generated by the passage of time 157707.doc 5 • J9·201232186 . Further, the optical detecting device HH and the motor 98 of the optical axis angle adjusting mechanism 99 are connected to the control device 1A by the electric wires 103, respectively. When the light detecting means 101 detects the amount of light leakage, the motor % is actuated to adjust the optical axis angle of the light source unit 73 so that 70 to 100% of the amount of light is incident on the integrator lens 74. Correct the amount of light spread. More specifically, if the light detecting device 101 detects the amount of light exceeding the set specific threshold value, the control device 102 transmits an actuation command to the motor 98 to actuate the nut 97b to rotate. Thereby, the thread 97a screwed to the nut 97b is introduced in the direction of the motor 98, and the light source supporting portion is elastically deformed in a direction in which the radius of curvature becomes smaller, whereby the optical axis angle of each light source portion 73 is directed toward the inner side: Correct the amount of light spread. Therefore, if the amount of light detected by the light detecting means ι〇ι is lowered below the initial value, that is, if the light of the irradiation amount of 7 〇 to 1 〇〇% is irradiated to the integrating lens 74 in the same manner as the initial state, Then the action of the horse stopped. Further, if the light detecting device 1〇1 can detect the light diffuser of the light source unit 73 caused by the irradiation time, the light detecting device ′′ is not limited to the human emitting surface disposed on the integrating lens 74. The upper light amount detecting device or the timer for counting the irradiation time. When the light amount detecting device is disposed on the blade lens 74, 'when the amount of light detected by the light amount detecting device is less than a specific threshold material, the optical axis of each light source portion 73 is adjusted by the wire angle adjusting mechanism 99. When the light after the angle is incident on the center of the integrator lens 74 and the field detection light amount is restored to the initial value, the operation is stopped. In another aspect, 157707.doc -20-201232186, when the optical axis angle of each light source portion is adjusted to be less than a certain threshold value even by the optical axis angle adjusting mechanism 99, the illumination of the lamp 71 itself is lowered. 'Therefore, the lamp 7 is replaced. Further, in the case of the timer control, the relationship between the irradiation day of the light source unit 73 and the light diffusion angle is checked in advance, and when the specific irradiation time elapses, the optical axis angle of each light source unit 73 is adjusted. Further, the illuminance is also checked after the replacement of the lamp 71, but the illuminance may not be restored. For example, when the cover glass 85 is contaminated, the dirt of the cover glass 8 can be confirmed by visual inspection or by means of a sensor. As the sensor, a penetrating type light detecting sensor, a reflective type photo detecting sensor, and an eddy current type sensor can be used. In the exposure apparatus pE configured as described above, when the exposure control shutter 78 is subjected to the opening control in the illumination optical system 7A, the light irradiated from the ultrahigh pressure mercury lamp 71 is incident on the incident surface of the integrator lens 74. Then, the light emitted from the exit surface of the integrator lens 74 is changed by the concave mirror 77 to change its traveling direction and converted into parallel light. Then, the parallel light is irradiated to the mask Μ on the mask stage 1 and the surface of the substrate w held on the substrate stage 2 as a pattern exposure light, and is irradiated substantially vertically, and the mask 1^ The pattern 1> is transferred onto the substrate W by exposure. Here, even if the ultrahigh pressure mercury lamp 71 is an unused lamp, the light irradiated from the ultrahigh pressure mercury lamp 71 has, for example, two. The diffusion angle of the left and right light, but if a large current is supplied between the electrodes 95 and 96 in order to obtain a high output, the tungsten electrodes 95 and 96 gradually evaporate in the arc tube 94 to cause the two electrodes 95 to elapse with the passage of the use time. , 96 intervals become wider, the base point of the * source becomes larger, the light spreads and the 〇 〇 1 -1, &,

S 157707.doc -21 · 201232186 射:度擴大為例如2.2。。由於電流係朝一方向流動,故而 流之超高壓水銀燈71之該磨損現象存在有較之供 給有父流之超高壓水銀燈更顯著的傾向。 自光之利用效率之翻點 親點而§ ’於照明光學系統70之組裝 時間點,以使來自所有光源部73之7〇〜1〇〇%之照射量的光 广射至積分透鏡74之人射面之方式而調整。然而,若光檢 測裝置1 〇 1檢測出藉由伴隨上述超高壓水銀燈71之使用時 間而產生之光之擴散所導致的茂漏光量(光之擴散),則控 制裝置H)2使馬達98作動,並經由外螺紋w而引入光源支 撐部83從而引起彈性變形。藉此,使固定於光源支撐部83 上之各光源部73朝向内側而調整光轴角度,以修正光之擴 散。 如上所述,根據第!實施形態之曝光裝置用光照射裝置 8〇 ,、包括.複數個光源部73,其包含發光部71與反射光 學系統t複數個厘盒81,其以使特定數量之光源部乃之 光入射至積分透鏡74之入射面的方式,由光源支撺部83支 撐光源。p 73,支撐體82,其包含安裝複數個匡盒^之複數 個E盒安裝部90,以使所有光源部73之光入射至積分透鏡 74之^射面,及光軸角度調整機構99,其可調整各光源部 73之光軸角度,因此可修正伴隨光源部之照射時間之經 過而產生之光擴散,使來自各光源部73之7〇〜1〇〇%之照射 量之光入射至積分透鏡74,藉此可提高光利用效率,抑制 照度降低。 又,檢測伴隨各光源部73之照射時間之經過所產生之光 J57707.docS 157707.doc -21 · 201232186 Shot: The degree is expanded to, for example, 2.2. . Since the current flows in one direction, the wear phenomenon of the ultrahigh pressure mercury lamp 71 flowing has a tendency to be more remarkable than that of the ultrahigh pressure mercury lamp having a parent flow. From the point of assembly of the illumination optical system 70, the light from the illumination light system 70 is irradiated to the integrator lens 74 so that the light from 7 〇 to 1% of the light source portion 73 is irradiated. People adjust the way they face. However, if the photodetecting device 1 〇 1 detects the amount of light leakage (diffusion of light) caused by the diffusion of light accompanying the use time of the ultrahigh pressure mercury lamp 71, the control device H) 2 activates the motor 98. And the light source support portion 83 is introduced via the external thread w to cause elastic deformation. Thereby, the respective light source portions 73 fixed to the light source supporting portion 83 are directed inward to adjust the optical axis angle to correct the light diffusion. As mentioned above, according to the first! The light-emitting device for exposure apparatus according to the embodiment includes a plurality of light source units 73 including a light-emitting portion 71 and a reflection optical system t, and a plurality of slits 81 for causing a specific number of light sources to be incident on the light source portion. The light source support portion 83 supports the light source in such a manner as to form the incident surface of the integrator lens 74. p 73, a support body 82 comprising a plurality of E-box mounting portions 90 for mounting a plurality of cassettes, such that light from all of the light source units 73 is incident on the emitting surface of the integrator lens 74, and the optical axis angle adjusting mechanism 99, Since the optical axis angle of each of the light source units 73 can be adjusted, the light diffusion caused by the irradiation time of the light source unit can be corrected, and the light of the irradiation amount of 7 〇 to 1% by the light source unit 73 can be incident on the light source. The integrator lens 74 can thereby improve the light use efficiency and suppress the decrease in illuminance. Further, the light generated by the irradiation time of each light source unit 73 is detected. J57707.doc

S -22· 201232186 擴散,且以藉由光軸角度調整機構99而修正所檢測出之光 之擴散的方式來控制光照射裝置80,因此可使來自各光源 部73之70〜1〇〇%之照射量之光確實入射至積分透鏡74,從 而防止照度降低。再者,於上述實施形態中,檢測.光之擴 散且自動地調整光源部73之光軸角度,但預測壽命照射時 間與光之擴散間的關係,且預先使各光源部73以該角度之 量朝向内側而進行調整,藉此亦可於某種程度上改善光之 利用效率。 (第2實施形態) 其-人,參照圖16〜19對本發明之第2實施形態之分割逐次 接近曝光裝置進行說明。再者,本實施形態之分割逐次曝 光裝置形成為與第1實施形態之分割逐次接近曝光裝置基 本相同之構成,因此對於相同部分標註相同符號而省略其 說明,對於不同部分進行詳細描述。 八 如圖17、18所示,於本實施形態之分割逐次曝光裝置pE 中,於匣盒81上之與所需之燈71對應的前表面上,配置有 波長截止濾波器186。作為波長截止濾波器186,可為低通 遽波器、高通遽波器、帶通遽波器之任一者,亦可為降低 所需之波長之強度的ND(Neutral Denshy,中性密度賊 光)渡波器。再者,波長截止濾波器186較佳為點對稱地設 置,本實施形態中,安裝於上段之6個燈與下段之6個燈: (圖17、18之斜線部分)。藉此,於^以上構成有分光特 性不同之2種光源部73。以下,將安裝有波長截止濾波器 6之光源73稱$具遽波器光源部73八,將不含有波長截 157707.doc 5 •23- 201232186 止濾波器186之光源部73稱為無濾波器光源部73B。 又,如圖16所示’於凹面鏡77之—部分上形成有開口 77a,於開口 77a之後方設置有測定g射線、h射線、i射線、 j射線、k射線等之各波長之照度的各照度計79。S-22 - 201232186 is diffused, and the light irradiation device 80 is controlled so as to correct the diffusion of the detected light by the optical axis angle adjustment mechanism 99, so that 70 to 1% of the light source portion 73 can be obtained. The amount of illumination light is incident on the integrator lens 74, thereby preventing illuminance from decreasing. Further, in the above embodiment, the light is diffused and the optical axis angle of the light source unit 73 is automatically adjusted. However, the relationship between the life irradiation time and the light diffusion is predicted, and the light source unit 73 is previously set at the angle. The amount is adjusted toward the inner side, whereby the light utilization efficiency can be improved to some extent. (Second Embodiment) A person-by-person, a divided sequential approaching exposure apparatus according to a second embodiment of the present invention will be described with reference to Figs. In addition, the divisional sequential exposure apparatus of the present embodiment is basically the same as the divisional sequential proximity exposure apparatus of the first embodiment. Therefore, the same portions are denoted by the same reference numerals and the description thereof will not be repeated, and the different portions will be described in detail. As shown in Figs. 17 and 18, in the divided sequential exposure apparatus pE of the present embodiment, a wavelength cut filter 186 is disposed on the front surface of the cassette 81 corresponding to the desired lamp 71. As the wavelength cut filter 186, it may be any one of a low pass chopper, a high pass chopper, and a band pass chopper, or may be an ND (Neutral Denshy, neutral density thief) that reduces the intensity of a desired wavelength. Light) waver. Further, the wavelength cut filter 186 is preferably arranged in point symmetry. In the present embodiment, six lamps are mounted in the upper stage and six lamps in the lower stage: (hatched portions in Figs. 17 and 18). Thereby, two types of light source sections 73 having different spectral characteristics are formed. Hereinafter, the light source 73 to which the wavelength cut filter 6 is mounted is referred to as a chopper light source unit 73, and the light source unit 73 not including the wavelength cutoff 157707.doc 5 •23-201232186 stop filter 186 is referred to as a no filter. Light source unit 73B. Further, as shown in Fig. 16, an opening 77a is formed in a portion of the concave mirror 77, and each of the illuminances of the respective wavelengths of g-rays, h-rays, i-rays, j-rays, and k-rays is measured behind the opening 77a. Illuminance meter 79.

又,於光學控制部76中,預先測定具濾波器光源部73A 與無濾波器光源部73B之各分光特性,特別是各波長之峰 值高度,並將其作為資料庫而保存。再者,光源部73 A、 73B若持續使用燈7丨則分光特性會產生變化,因此於未進 订曝光之狀態下,預先測定各光源部73A、73B之各波長 之照度。 如此構成之光照射裝置80根據由照度計79測定之結果, 參照資料庫,決定各光源部73A、73B點亮之燈”之功 率、,個數。此處,當點亮之燈71之個數較多之情形時,即 便亚非點對稱,燈71之熄滅方法對曝光面照度分佈之影響 亦較小,但當點亮之燈71之個數較少之情形時,例如,於 媳滅心盈燈W%左右的情形時,^並非點對稱,則 燈71之媳滅方法有可能導致曝光面照度分佈變差。因此, 具遽波器光源部73A、减波器光源部咖較佳為以分別 成為點對稱之方式而點亮燈71。 自水銀燈71出射之光—般為非相干光,當其通過包含積 ^透鏡74、凹面鏡77等之照明光學系統而到達曝光面時, :、強度係作為對應每一波長之和而被賦予。藉由設置有具 濾波器光源部73A盥益廣波器光 八 Μ…、属“尤源。”沾而可某種程度地 控制各波長之分光強度比。 157707.doc 201232186 此處,在使用有分光特性不同之2種燈之情形、及於分 光特性相同之燈上設置有波長截止濾波器之情形時,進行 照度之測定試驗。具體而言,在使用有分光特性不同之2 種燈的試驗中,於使用有4盞第1燈之情形時、於使用有短 波長側之強度較之該第1燈更強的4盞第2燈之情形時、及 於使用有2盈第1燈及2盞第2燈之情形時測定照度。又,在 設置有波長截止濾波器之試驗中,於使用有4盞第2燈且未 女裝波長截止據波益之情形時、於將波長截止渡波器安裝 於2盞燈上之情形時、及於將波長截止濾波器安裝於4盞燈 上之情形時測定照度。將使用有2種燈之情形時的結果示 於表1 ,將設置有波長截止濾波器之情形時的結果示於表 2 ° 再者,作為本試驗中所使用之照度計,使用Ushi〇 Inc 股份公司製造之紫外線累計光量計UIT_25〇,且受光部使 用65 nm測疋用受光态UVD-S365、313 nm測定用受光器 UVD-S313 ’於該些受光部中測定2〇〇 minx200 mm之曝光 面之中心部之1射線(365 nm)與j射線(313 nm)的強度。 及結果如表丨及表2所示’可知藉由變更DUV濾波器之個 數而可與變更燈之種類之情形同樣地變更各波長之強度。 [表1] 第1燈4個~ 照度(mW/cm2) 365(nm) 313(nm) 40.5 15.9 第2燈4個1 34.9 23.0 第Ϊ燈2個 第2燈2個 37.8 19.4Further, in the optical control unit 76, the spectral characteristics of the filter light source unit 73A and the filterless light source unit 73B, in particular, the peak heights of the respective wavelengths, are measured in advance, and are stored as a database. Further, when the light source units 73 A and 73B continue to use the lamp 7 丨, the spectral characteristics change. Therefore, the illuminance of each wavelength of each of the light source units 73A and 73B is measured in advance without exposure. The light irradiation device 80 configured as described above determines the power of the lamp "lights that are lit by the light source units 73A, 73B" based on the result of the measurement by the illuminometer 79. Here, the number of the lamps 71 that are lit When there are a large number of cases, even if the sub-asymmetry is used, the method of extinguishing the lamp 71 has a small influence on the illuminance distribution of the exposure surface, but when the number of the lamps 71 is small, for example, annihilation When the heart-light is about W%, ^ is not point-symmetric, and the annihilation method of the lamp 71 may cause the exposure surface illuminance distribution to be deteriorated. Therefore, the chopper light source portion 73A and the wave-reducing light source portion are preferably The lamp 71 is lit in such a manner as to be point-symmetric, respectively. The light emitted from the mercury lamp 71 is generally incoherent light, and when it reaches the exposure surface by the illumination optical system including the lens 74, the concave mirror 77, and the like, it is: The intensity is given as the sum of each wavelength. By providing the filter light source unit 73A, it is a "light source". The dioptric intensity ratio of each wavelength can be controlled to some extent. 157707.doc 201232186 Here, a wavelength cut filter is provided on a lamp having two types of lamps having different spectral characteristics and a lamp having the same spectral characteristics. In the case of the measurement of the illuminance, in particular, in the case of using two types of lamps having different spectral characteristics, the intensity of the short-wavelength side is used when the fourth lamp is used. The illuminance is measured when the first lamp is stronger than the fourth lamp, and when the second lamp and the second lamp are used. In the test in which the wavelength cut filter is provided, When using a 4th second lamp and no women's wavelength is determined according to the wave, when the wavelength cutoff wave is mounted on the 2 lamps, and the wavelength cut filter is mounted on the 4 lamps In the case of the case, the illuminance is measured. The results when two types of lamps are used are shown in Table 1, and the results when the wavelength cut filter is provided are shown in Table 2 °, and the illuminance used in this test. , using the purple made by Ushi〇Inc AG The external line integrated light meter UIT_25〇, and the light receiving unit uses the light receiving state UVD-S365 for 65 nm and the 313 nm measuring light receiver UVD-S313' to measure the center of the exposure surface of 2〇〇minx200 mm in the light receiving portions. The intensity of the 1 ray (365 nm) and the j ray (313 nm), and the results are shown in Table 丨 and Table 2, and it can be seen that the number of DUV filters can be changed in the same manner as in the case of changing the type of the lamp. The intensity of each wavelength [Table 1] 4th lamp 1 illuminance (mW/cm2) 365 (nm) 313 (nm) 40.5 15.9 2nd lamp 4 1 34.9 23.0 2nd lamp 2 2nd lamp 2 37.8 19.4

S 157707.doc -25· 201232186 [表2] 照度(mW/cm2) 365(nm) 313(nm) 無DUV濾波器 34.9 23.0 DUV濾波器4個 32.1 1.02 DUV濾波器2個 33.5 11.7 如上所述’根據第2實施形態之曝光裝置用光照射震置 80及曝光裝置PE,包括:特定數量之光源部73,其包含發 光部71與反射光學系統72;及匣盒81,其以使特定數量之 光源部73之光入射至積分透鏡74之入射面的方式支撐光源 部73 ;特定數量之光源部73係由分光特性不同之2種光源 部73構成。藉此,可不更換光源部73而自如地設定每一波 長之強度。特別是特定數量之光源部73之各燈7丨之分光特 性相同,特定數量之光源部73藉由於其一部分配置有波長 截止濾波器186而構成分光特性不同之2種光源部乃。藉 此,可不更換光源部73、且不使用分光特性不同之光源部 而自如地設定每一波長之強度。 又,由於包括複數個艮盒81,並且進而包括以使所有光 源部73之光入射至積分透鏡74之入射面之方式安裝有 個匣盒81的支撐體82,因此可將燈71單元化而進行管理, 從而可縮短燈71之更換時間及裝置之停卫時間,且對燈71 之安裝零件不進行較大之曲面加工便可將所有光源部73配 置於單一曲面上。 進而,根據本實施形態之曝光裝置用光照射裝置之控制 方法及曝光方法’除上述之複數個光源部乃、複數㈣盒 157707.doc -26- 201232186 8卜及支標體82外’光照射裝置8〇包括:照度計79_,其配 置於積分透鏡74之下游側,測量與各波長對應之照度·及 光學控制部76,其控制各燈71之點亮、媳滅、及照度。而 且,光學控制部76係根據照度計79所測量之與各波長對應 之照度,以於特定波長内獲得所需之照度之方式而控制匿 盒8!内的各光源部73。藉此,可使必要之㈣點亮,自如 地設定曝光中所必要之波長成分之強度,從而可延長㈣ 之壽命。 。。再者,於上述實施形態中,使用丨種類之波長截止濾波 器186而構成分光特性不同之2種光源部73八、乃b,但如 圖19⑷及(b)所示,亦可使用2種波長截止濾波器職、 18仏而構成分光特性不同之3種光源部73A1、73A2、 73B。例如,可將3種光源部73A1、73八2、π如圖 所示以8:8:8而構成’亦可如圖19(b)所示以ι〇:ι〇:4而構 成。該些情形時’較佳為將3種光源部73幻' 73八2、MB 點對稱地構成,又’於藉由光學㈣部76而使圖i9⑷之燈 71熄滅之情形時’亦可如圖19⑷之網格部分所示使其點對 稱地媳滅。 (第3實施形態) 其次,一面參照圖20〜圖25—面對本發明之第3實施形態 之接近掃描曝光裝置進行說明。 如圖23所示,接近掃描曝光裝置200對一面接近於遮罩 Μ-面朝特定方向搬送之大致矩形狀的基板w,經由形成 S案P之複數個遮罩Μ而照射曝光用光l,將圖案p曝光S 157707.doc -25· 201232186 [Table 2] Illuminance (mW/cm2) 365 (nm) 313 (nm) No DUV filter 34.9 23.0 DUV filter 4 32.1 1.02 DUV filter 2 33.5 11.7 As mentioned above' According to the exposure apparatus of the second embodiment, the light irradiation unit 80 and the exposure apparatus PE include a specific number of light source units 73 including the light-emitting unit 71 and the reflection optical system 72, and a cassette 81 for a specific number. The light source unit 73 supports the light source unit 73 so that the light of the light source unit 73 enters the incident surface of the integrator lens 74. The specific number of light source units 73 are composed of two types of light source units 73 having different spectral characteristics. Thereby, the intensity of each wavelength can be set freely without replacing the light source unit 73. In particular, the light-emitting characteristics of the lamps 7 of the specific number of light source units 73 are the same, and a specific number of the light source units 73 are formed by the wavelength cut-off filter 186, and the two light source units having different spectral characteristics are formed. As a result, the intensity of each wavelength can be set freely without replacing the light source unit 73 and using a light source unit having different spectral characteristics. Further, since a plurality of cassettes 81 are included, and further includes a support body 82 in which the cassettes 81 are attached so that the light of all the light source units 73 is incident on the incident surface of the integrator lens 74, the lamps 71 can be unitized. By managing, the replacement time of the lamp 71 and the time of stopping the device can be shortened, and all the light source portions 73 can be disposed on a single curved surface without performing large surface processing on the mounting parts of the lamp 71. Further, according to the control method and the exposure method of the light irradiation device for an exposure apparatus according to the present embodiment, in addition to the plurality of light source units, the plural (four) box 157707.doc -26-201232186 8 and the label body 82, the light irradiation is performed. The device 8A includes an illuminance meter 79_ disposed on the downstream side of the integrator lens 74, and measures an illuminance and optical control unit 76 corresponding to each wavelength, which controls lighting, annihilation, and illuminance of each of the lamps 71. Further, the optical control unit 76 controls the respective light source units 73 in the cassette 8 to control the illuminance corresponding to each wavelength measured by the illuminometer 79 to obtain the desired illuminance within a specific wavelength. Thereby, it is possible to illuminate necessary (4), and to freely set the intensity of the wavelength component necessary for exposure, thereby prolonging the life of (4). . . Further, in the above-described embodiment, the two kinds of light source units 73 and b having different spectral characteristics are formed by using the wavelength cut filter 186 of the 丨 type. However, as shown in Figs. 19 (4) and (b), two types of light source units can be used. The wavelength cutoff filter unit is configured to form three light source units 73A1, 73A2, and 73B having different spectral characteristics. For example, the three types of light source units 73A1, 73, VIII, and π may be formed by 8:8:8 as shown in Fig. 19(b), and may be formed by ι 〇: ι 〇: 4. In these cases, it is preferable that the three types of light source units 73 are illusory 73 8 and 2, and the points of the i9 (4) are turned off by the optical (four) portion 76. The grid portion of Fig. 19(4) shows its point symmetry annihilation. (Third Embodiment) Next, a proximity scanning exposure apparatus according to a third embodiment of the present invention will be described with reference to Figs. 20 to 25 . As shown in FIG. 23, the scanning exposure apparatus 200 approaches the substantially rectangular substrate w which is conveyed in a specific direction close to the mask Μ-surface, and irradiates the exposure light l through a plurality of mask 形成 which forms the S case P, Expose pattern p

S 157707.doc -27- 201232186 印至基板w上。即,該曝光裝置2〇〇採用—面使基板帅 對於複數個遮罩河進行相對移動一面進行曝光轉印之掃描 曝光方式。再者’本實施形態中所使用之遮罩之尺寸設定 為 350 mmx250 ,園安 + 圖木P之X方向長度對應於有效曝光 區域之X方向長度。 如圖20及圖21所示,接近掃描曝光裝置2⑼包括:基板 搬送機構…,其使基❹上浮而對其支稽,並且將基板% 朝特定方向(圖中為X方向)搬送;遮罩保持機構i7〇,其包 含複數個遮罩保持部171,該複數個遮罩保持部ΐ7ι分別保 持有複數個遮罩Μ,且沿著與特定方向交叉之方向(圖中為 Υ方向)而父錯狀地配置有兩行;複數個照射部丨8〇,其分 別配置於複數個遮罩保持部171之上部,且作為照射曝光 用光L之照明光學系統;及複數個遮光裝置丨9〇,其分別配 置於複數個照射部1 8 0與複數個遮罩保持部丄7丨之間,對自 照射部180出射之曝光用光l進行遮光。 該些基板搬送機構120、遮罩保持機構17〇、複數個照射 部180、及遮光裝置190係經由平台(未圖示)而配置於設置 在地面上之裝置底座201上。此處’如圖21所示,於基板 搬送機構120搬送基板W之區域中,將於上方配置有遮罩 保持機構17 0之區域稱為遮罩配置區域e A,將相對於遮罩 配置區域EA之上游側之區域稱為基板搬入側區域IA,將 相對於曝光區域EA之下游側之區域稱為基板搬出側區域 OA。 基板搬送機構1 2 0包括:上浮單元12 1,其作為基板保持 157707.doc •28· 201232186 部’配置於經由其他平台(未圖示)而設置於裝置底座201上 之搬入框架105、精密框架106、及搬出框架1〇7上,且藉 由空氣而使基板W上浮並對其支撐;及基板驅動單元 140,其於上浮單元121之Y方向側方,配置於進而經由其 他平台108而設置於裝置底座201上之框架1〇9上,把持基 板W,並且將基板w朝X方向搬送。 如圖22所示’上浮單元121包括··長條狀之複數個排氣 墊123(參照圖21)、124及長條狀之複數個吸排氣墊125a、 125b’其於下表面分別安裝有自搬入框架1〇5、搬出框架 106及精达、框架1 〇7之上表面朝上方延伸之複數個連結桿 122 ’空氣排出系統13 0及空氣排出用泵13 1,其自形成於 各氣墊123、124、125a、125b上之複數個排氣孔126排出 空氣;及空氣吸引系統132及空氣吸引用泵133,其用以自 形成於吸排氣墊125a、125b上之吸氣孔127吸引空氣。 又’吸排氣墊125a、125b包含複數個排氣孔126及複數 個吸氣孔127’對氣塾125a、1256之支撐面134與基板W之 間之氣壓進行平衡調整,可高精度地設定特定上浮量,從 而可以穩定之高度進行水平支撐。 如圖21所示,基板驅動單元14〇包括:藉由真空吸附而 把持基板W之把持構件141 ;沿X方向導引把持構件ι41之 線性導執142 ;沿X方向驅動把持構件141之驅動馬達143及 滾珠螺桿機構144 ;以及支撐朝遮罩保持機構17〇之搬送等 待之基板w之下表面的複數個工件防衝突輥丨45,其以自 框架1〇9之上表面突出之方式,於Z方向可移動且旋轉自如S 157707.doc -27- 201232186 Printed on the substrate w. That is, the exposure apparatus 2 employs a scanning exposure method in which the substrate is subjected to exposure transfer while relatively moving the plurality of mask rivers. Further, the size of the mask used in the present embodiment is set to 350 mm x 250, and the length of the X direction of the garden + picture P corresponds to the length of the effective exposure area in the X direction. As shown in FIGS. 20 and 21, the proximity scanning exposure device 2 (9) includes a substrate transfer mechanism that lifts the substrate to support the substrate and transports the substrate % in a specific direction (X direction in the drawing); The holding mechanism i7〇 includes a plurality of mask holding portions 171, and the plurality of mask holding portions ΐ71 respectively hold a plurality of mask ridges, and are in a direction crossing the specific direction (the direction in the figure is the Υ direction) and the parent Two rows are arranged in a staggered manner; a plurality of illuminating portions 丨8 〇 are disposed on the upper portions of the plurality of mask holding portions 171, and serve as an illumination optical system for illuminating the exposure light L; and a plurality of light shielding devices 丨9〇 Each of the plurality of illuminating units 180 is disposed between the plurality of illuminating units 180 and the plurality of mask holding units 丄7丨, and the exposure light 1 emitted from the illuminating unit 180 is shielded from light. The substrate transport mechanism 120, the mask holding mechanism 17A, the plurality of illuminating units 180, and the light blocking device 190 are disposed on the apparatus base 201 provided on the ground via a platform (not shown). Here, as shown in FIG. 21, in a region where the substrate transport mechanism 120 transports the substrate W, a region in which the mask holding mechanism 170 is disposed above is referred to as a mask arrangement region e A, and a region to be placed with respect to the mask is disposed. A region on the upstream side of the EA is referred to as a substrate carry-in side region IA, and a region on the downstream side of the exposure region EA is referred to as a substrate carry-out side region OA. The substrate transfer mechanism 1 200 includes a floating unit 12 1 as a substrate holding 157707.doc • 28· 201232186 'moving frame 105 disposed on the device base 201 via another platform (not shown), and a precision frame 106 and moving out of the frame 1〇7, and the substrate W is floated and supported by air; and the substrate driving unit 140 is disposed on the Y-direction side of the floating unit 121, and is further disposed via the other platform 108. The substrate W is held on the frame 1〇9 on the apparatus base 201, and the substrate w is conveyed in the X direction. As shown in FIG. 22, the 'floating unit 121 includes a plurality of exhaust vents 123 (see FIG. 21) and 124 and a plurality of long and short venting pads 125a and 125b' which are respectively mounted on the lower surface. The frame 1〇5, the carrying-out frame 106, and the plurality of connecting rods 122 that extend upward from the upper surface of the frame 1〇7, the air discharging system 130 and the air discharging pump 131 are formed on the air cushion 123, 124, 125a, 125b, a plurality of exhaust holes 126 discharge air; and an air suction system 132 and an air suction pump 133 for sucking air from the intake holes 127 formed in the intake and exhaust pads 125a, 125b. Further, the intake and exhaust pads 125a and 125b include a plurality of exhaust holes 126 and a plurality of intake holes 127' for balancing the air pressure between the support surfaces 134 of the air cells 125a and 1256 and the substrate W, so that the specific floating amount can be set with high precision. Therefore, horizontal support can be performed at a stable height. As shown in FIG. 21, the substrate driving unit 14A includes: a holding member 141 that holds the substrate W by vacuum suction; a linear guide 142 that guides the holding member ι41 in the X direction; and a driving motor that drives the holding member 141 in the X direction. 143 and a ball screw mechanism 144; and a plurality of workpiece anti-collision rollers 45 supporting the lower surface of the substrate w waiting for the conveyance of the mask holding mechanism 17, which protrude from the upper surface of the frame 1〇9 Z direction can be moved and rotated freely

S 157707.doc -29- 201232186 地安裝於基板搬入區域IA之框架i 〇 9之側方。 又’基板搬送機構120包括:基板預對準機構15〇,其設 置於基板搬入側區域IA上,進行於該基板搬入側區域〗A等 待之基板W之預對準;及基板對準機構1 60,其進行基板w 之對準。 如圖21及圖22所示,遮罩保持機構170包括:上述複數 個遮罩保持部17 1 ;及複數個遮罩驅動部丨72,其對應每一 遮罩保持部1 71而設置,使遮罩保持部! 7丨於X、γ、ζ、θ 方向驅動,即,於特定方向、交叉方向、相對於特定方向 與交又方向之水平面之鉛垂方向、以及環繞該水平面之法 線而驅動。 沿γ方向交錯狀地配置有兩行之複數個遮罩保持部l7i包 括:配置於上游側之複數個上游侧遮罩保持部nia(本實 施形態中為6個);及配置於下游侧之複數個下游側遮罩保 持部171b(本實施形態中為6個);且經由遮罩驅動部而 分別支撐於在豎立設置於裝置底座2〇1之γ方向兩側之柱部 112(參照圖20)間於上游侧及下游側各架設有2根的主框架 113上。各遮罩保持部171包含貫通於ζ方向之開口 η?,並 且於其周緣部下表面真空吸附有遮罩Μ。 遮罩驅動部172包括:χ方向驅動部173 ’其安裝於主框 本113上,且沿χ方向移動;ζ方向驅動部174,其安裝於X 方向驅動部173之前端,且朝ζ方向驅動;γ方向驅動部 175,其安裝於ζ方向驅動部174上,且朝¥方向驅動;及㊀ 方向驅動部176,其安裝於Υ方向驅動部175上’且朝0方向 157707.doc rs •30· 201232186 驅動;於θ方向驅動部176之前端安裝有遮罩保持部i7i。 如圖24及圖25所示,複數個照射部18〇包括:框體181内 之與第1實施形態同樣地構成之光照射裝置80Α、積分透鏡 74、光學控制部76、凹面鏡77、及曝光控制用快門78,並 且包括配置於光源部73Α與曝光控制用快門78之間、及積 分透鏡74與凹面鏡77之間的平面鏡280、281、282。再 者,於凹面鏡77或作為折返鏡之平面鏡282上,亦可設置 有可手動或自動地變更鏡之曲率之偏角修正機構。 光照射裝置80Α含有直線狀地排列有3個匣盒81八之支撐 體82Α,δ亥匣盒81Α包括分別包含超高壓水銀燈71與反射 鏡72之例如4段2行之8個光源部73。與第丨實施形態同樣 地,於匣盒81Α中,藉由於支撐8個光源部73之光源支撐部 83上文裝有匣盒扣壓罩84而定位各光源部73,以便可使來 自各光源部73之70%〜100%之照射量的光入射至積分透鏡 74。又,藉由於支撐體82Α之複數個匣盒安裝部上安裝 有各匣盒81Α而定位各匣盒81Α,以便可使來自各光源部 73之70%〜1 〇〇%之照射量的入射至積分透鏡74。 於框狀之光源支撐部83與燈扣壓罩84之底部之間,配設 有包括外螺紋97a、螺帽97b及馬達98之光軸角度調整機構 99。又,與積分透鏡74鄰接地配設之光檢測裝置丨〇 1及光 轴角度調整機構99藉由電線1〇3而連接有控制裝置1〇2,此 與第1實施形態為相同。 如圖22所示,複數個遮光裝置19〇含有變更傾斜角度之 一對板狀之擋板構件208、209,且藉由擋板驅動單元192 157707.doc •31· 201232186 而變更一對擋板構件2〇8、209之傾斜角度。藉此,可阻斷 在保持於遮罩保持部171上之遮罩Μ之附近自照射部18〇出 射之曝光用光L,並且使遮光曝光用光l之特定方向之遮光 幅度、即自Ζ方向觀察之投影面積可變。 再者’於接近掃描曝光裝置200設置有遮罩更換器22〇, 其藉由將保持有遮罩Μ之一對遮罩托架部221朝γ方向驅動 而更換保持於上游侧及下游側遮罩保持部171a、171b上之 遮罩Μ,並且設置有遮罩預對準機構24〇,其於遮罩更換 之前,一面按壓相對於遮罩托架部22丨而受到上浮支撐之 遮罩Μ,一面使遮罩Μ抵接於定位銷(未圖示),藉此進行 預對準。 進而,如圖22所示,於接近掃描曝光裝置2〇〇配置有雷 射變位計260、遮罩對準用相機(未圖示)、追隨用相機(未 圖示)、及追隨用照明273等之各種檢測機構。 其次,使用以上述方式構成之接近掃描曝光裝置2〇〇, 對基板W之曝光轉印進行說明◎再者,於本實施形態中, 對以下情形進行說明1,相對於描畫有基底圖案(例如 黑矩陣)之彩色濾波器基板w而描晝有R(紅)、g(綠)、 B(藍)之任一圖案。 接近掃描曝光裝置200藉由未圖示之搭載器等,使被搬 达至基板搬入區域IA之基板|藉由來自排氣墊123之空氣 而上浮並叉到支撐,進行基板w之預對準作業、對準作業 之後’將由基板驅動單元14〇之把持構件141夾緊之基板w 搬送至遮罩配置區域EA。 157707.doc *32- 201232186 其後,基板w藉由使基板驅動單元ι40之驅動馬達143驅 動而沿線性導軌142朝X方向移動。然後,使基板w在設置 於遮罩配置區域EA上之排氣墊124及吸排氣墊i25a、125b 上移動,並於極力排除振動之狀態下使其上浮而受到支 撐。然後,若自照射部180内之光源出射曝光用光[,則該 曝光用光L會通過保持於遮罩保持部171上之遮而將圖 案曝光轉印至基板W上《 又,該曝光裝置200含有追隨用相機(未圖示)、雷射變 位計260,因此於曝光動作中,檢測遮罩M與基板w之相對 位置偏移,並根據所檢測之相對位置偏移而使遮罩驅動部 172驅動,使遮罩μ之位置實時追隨於基板w。同時,檢測 遮罩Μ與基板W之間隙,並根據所檢測之間隙而使遮罩驅 動部172驅動’實時修正遮罩μ與基板w之間隙。 按與以上相同之方式連續曝光,藉此可於整個基板w上 進行圖案之曝光。由於保持於遮罩保持部171上之遮罩Μ 配置成交錯狀,因此即便將保持於上游側或下游側之遮罩 保持部171a、171b上之遮罩河分開排列,亦可於基板w上 無間隙地形成圖案。 又,於自基板W切下複數個面板之情形時,在與鄰接之 面板彼此間對應之區域上形成有未照射曝光用光L之非曝 光區域。因此,於曝光動作中,開閉一對擋板構件2〇8、 2〇9,以使擋板構件208、2〇9位於非曝光區域上之方式, 按照基板w之進給速度而使擋板構件2〇8、2〇9朝與基板w 之進給方向相同之方向移動。S 157707.doc -29- 201232186 is mounted on the side of the frame i 〇 9 of the substrate loading area IA. Further, the substrate transfer mechanism 120 includes a substrate pre-alignment mechanism 15 that is disposed on the substrate carry-in side region IA, performs pre-alignment of the substrate W waiting for the substrate carry-in side region, and a substrate alignment mechanism 1 60, which performs alignment of the substrate w. As shown in FIGS. 21 and 22, the mask holding mechanism 170 includes: the plurality of mask holding portions 17 1; and a plurality of mask driving portions 72 that are provided corresponding to each of the mask holding portions 71 Mask holder! 7丨 is driven in the X, γ, ζ, θ directions, that is, in a specific direction, a crossing direction, a vertical direction with respect to a specific direction and a horizontal plane, and a normal around the horizontal plane. The plurality of mask holding portions 17i that are arranged in two rows in a staggered manner in the γ direction include a plurality of upstream mask holding portions nia disposed on the upstream side (six in the present embodiment); and are disposed on the downstream side a plurality of downstream side mask holding portions 171b (six in the present embodiment); and each of the column portions 112 erected on both sides in the γ direction of the apparatus base 2〇1 via the mask driving unit (refer to the figure) 20) Two main frames 113 are provided on each of the upstream side and the downstream side. Each of the mask holding portions 171 includes an opening η? penetrating in the ζ direction, and a mask 真空 is vacuum-adsorbed on the lower surface of the peripheral portion. The mask driving unit 172 includes a χ direction driving unit 173 ′′ mounted on the main frame 113 and moving in the χ direction, and a ζ direction driving unit 174 attached to the front end of the X direction driving unit 173 and driving in the ζ direction The γ-direction driving unit 175 is mounted on the ζ direction driving unit 174 and driven in the ¥ direction; and the one-direction driving unit 176 is mounted on the Υ direction driving unit 175' and faces the 0 direction 157707.doc rs • 30 · 201232186 drive; the mask holding portion i7i is attached to the front end of the θ direction drive unit 176. As shown in FIG. 24 and FIG. 25, the plurality of irradiation units 18A include a light irradiation device 80A configured in the same manner as the first embodiment in the housing 181, an integrator lens 74, an optical control unit 76, a concave mirror 77, and an exposure. The control shutter 78 includes plane mirrors 280, 281, and 282 disposed between the light source portion 73A and the exposure control shutter 78 and between the integrator lens 74 and the concave mirror 77. Further, an off-angle mirror 77 or a plane mirror 282 as a folding mirror may be provided with an off-angle correcting mechanism that can manually or automatically change the curvature of the mirror. The light irradiation device 80 includes a support body 82 直线 in which three cassettes 81 are linearly arranged, and the δ 匣 box 81 Α includes eight light source units 73 each including, for example, four stages and two lines of the ultrahigh pressure mercury lamp 71 and the mirror 72, respectively. Similarly to the third embodiment, in the cassette 81, the light source supporting portions 83 supporting the eight light source units 73 are provided with the cassette pressing cover 84, and the respective light source units 73 are positioned so as to be possible from the respective light source units. Light of 70% to 100% of the amount of light of 73 is incident on the integrator lens 74. Further, each of the cassettes 81 is positioned by attaching each of the cassettes 81 to the plurality of cassette mounting portions of the support 82, so that the irradiation amount of 70% to 1% of the light from each of the light source units 73 can be incident. Integral lens 74. An optical axis angle adjusting mechanism 99 including an external thread 97a, a nut 97b, and a motor 98 is disposed between the frame-shaped light source supporting portion 83 and the bottom of the lamp pressing cover 84. Further, the photodetecting device 丨〇 1 and the optical axis angle adjusting mechanism 99 disposed adjacent to the integrator lens 74 are connected to the control device 1 2 by the electric wires 1 to 3, which is the same as in the first embodiment. As shown in FIG. 22, a plurality of light-shielding devices 19A include a plate-shaped baffle member 208, 209 which changes one of the inclination angles, and the pair of baffles are changed by the baffle drive unit 192 157707.doc • 31· 201232186 The inclination angle of the members 2〇8, 209. Thereby, the exposure light L emitted from the irradiation portion 18 in the vicinity of the mask 保持 held by the mask holding portion 171 can be blocked, and the light-shielding width in the specific direction of the light-shielding exposure light 1 can be blocked. The projected area of the direction observation is variable. Further, a proximity changer 22 is provided in the proximity scanning exposure apparatus 200, and is replaced by the upstream side and the downstream side by driving one of the masks 对 to the mask bracket portion 221 in the γ direction. The mask holding portions 171a, 171b are covered with a mask, and a mask pre-alignment mechanism 24 is provided, which is pressed against the mask bracket portion 22 to receive a floating support before the mask is replaced. The mask Μ is abutted against a positioning pin (not shown) to perform pre-alignment. Further, as shown in FIG. 22, a laser displacement meter 260, a mask alignment camera (not shown), a follow-up camera (not shown), and a follow-up illumination 273 are disposed in proximity to the scanning exposure apparatus 2A. Various testing institutions. Next, the exposure transfer of the substrate W will be described using the scanning exposure apparatus 2A configured as described above. Further, in the present embodiment, the following will be described. 1 The base pattern is drawn with respect to the drawing (for example, The color filter substrate w of the black matrix) has any one of R (red), g (green), and B (blue). The substrate adjacent to the scanning exposure apparatus 200 is transported to the substrate loading area IA by a carrier or the like (not shown). The substrate is lifted by the air from the exhaust pad 123 and supported by the fork to perform pre-alignment of the substrate w. After the alignment operation, the substrate w clamped by the holding member 141 of the substrate driving unit 14 is transported to the mask arrangement area EA. 157707.doc *32- 201232186 Thereafter, the substrate w is moved in the X direction along the linear guide 142 by driving the drive motor 143 of the substrate driving unit 134. Then, the substrate w is moved over the exhaust pad 124 and the suction/discharge pads i25a, 125b provided on the mask arrangement area EA, and is supported by being lifted up while the vibration is removed as much as possible. Then, when the light source for exposure is emitted from the light source in the illuminating unit 180, the exposure light L is exposed to the substrate W by the occlusion held by the mask holding portion 171. 200 includes a follow-up camera (not shown) and a laser displacement gauge 260. Therefore, during the exposure operation, the relative positional shift between the mask M and the substrate w is detected, and the mask is masked according to the detected relative positional shift. The driving unit 172 is driven to cause the position of the mask μ to follow the substrate w in real time. At the same time, the gap between the mask Μ and the substrate W is detected, and the mask driving portion 172 is driven to correct the gap between the mask μ and the substrate w in real time in accordance with the detected gap. The exposure is continuously performed in the same manner as above, whereby the pattern exposure can be performed on the entire substrate w. Since the masks 保持 held by the mask holding portion 171 are arranged in a staggered manner, even if the mask rivers held on the upstream or downstream side of the mask holding portions 171a and 171b are arranged separately, the substrate w can be arranged on the substrate w. The pattern is formed without a gap. Further, when a plurality of panels are cut out from the substrate W, a non-exposed region where the exposure light L is not irradiated is formed in a region corresponding to the adjacent panels. Therefore, in the exposure operation, the pair of shutter members 2〇8, 2〇9 are opened and closed so that the shutter members 208, 2〇9 are placed on the non-exposed area, and the shutter is made according to the feed speed of the substrate w. The members 2〇8, 2〇9 are moved in the same direction as the feeding direction of the substrate w.

S 157707.doc •33· 201232186 本實施形態中,亦於曝光動作中,於超高壓水銀燈71之 兩電極95、96間供給有大電流,因此伴隨使用時間之經 過,電極95、96會蒸發而產生光之擴散,但與第i實施形 態同樣地,由光檢測裝置101檢測光之擴散,並藉由光軸 角度調整機構99而使各光源部73之光軸LA朝向内侧以調 整光軸角度。 因此’於本實施形態之接近掃描曝光裝置中,亦由光檢 測裝置101檢測伴隨各光源部73之照射時間之經過而產生 之光擴散,且以藉由光軸角度調整機構99而修正所檢測之 光之擴散的方式來控制光照射裝置80,因此可使來自各光 源部73之70〜100%之照射量的光確實入射至積分透鏡74, 從而可抑制照度降低。 (第4實施形態) 其次’參照圖26~27對本發明之第4實施形態之接近掃描 曝光裝置進行說明。再者,本實施形態之接近掃描曝光裝 置形成為與第3實施形態之接近掃描曝光裝畳基本相同之 構成’因此對於相同部分標註相同符號而省略其說明,對 於不同部分進行詳細描述。 如圖26所示,本實施形態之接近掃描曝光裝置200於複 數個照射部1 80之框體1 8 1内’於凹面鏡77之一部分上形成 有開口 77a,於開口 77a之後方,設置有測定g射線、h射 線、i射線、j射線' k射線等之各波長之照度的各照度計 79°再者,於圖26中,符號195為點燈電源,符號196為控 制電路。 157707.doc rs -34· 201232186 光照射裝置80A包括直線狀地排列有3個匡盒以之支樓體 82A該匣|81包括分別包含超高壓水銀燈η與反射鏡 之例如6段4行之24個光源部73。與第i實施形態同樣地, 於E盒81中,藉由於支撐24個光源部乃之光源支樓部以上 安袭有医盒扣壓罩84而定位各光源部73,以可使來自各光 源部73之观〜職之照射量的光人射至積分透鏡74。 又,藉由於支撐體82A上安裝有各匿盒81而定位各匿盒 81 ’以可使來自各光源部73之7()%〜⑽%之照射量的光入 射至積分透鏡74。 又,於本實施形態之光照射裝置嶋中,特定數量之光 源部73之各發光部71之分光特性亦為相同,且特定數量之 光源部73亦藉由於其一部分配置有波長截止濾波器186而 構成分光特性不同之2種光源部73。 因此’於如本實施形態般之接近掃描曝光裝置中, 立包括:含有發光部71與反射光學系㈣之特定數量之光源 心、及以使特定數量之光源部73之光人射至積分透鏡μ ,入射面之方式支撐光源部73較盒8ι,特定數量之光源 二3之各燈71之分光特性相同’特定數量之光源部乃藉由 门/分配置有波長截止濾波器i 8 6而構S 157707.doc •33· 201232186 In the present embodiment, a large current is supplied between the electrodes 95 and 96 of the ultrahigh pressure mercury lamp 71 during the exposure operation, so that the electrodes 95 and 96 evaporate with the passage of the use time. In the same manner as in the first embodiment, the light detecting device 101 detects the diffusion of light, and the optical axis LA of each light source unit 73 is directed inward by the optical axis angle adjusting mechanism 99 to adjust the optical axis angle. . Therefore, in the proximity scanning exposure apparatus of the present embodiment, the light detecting device 101 detects the light diffusion caused by the elapse of the irradiation time of each light source unit 73, and corrects the detection by the optical axis angle adjusting mechanism 99. Since the light irradiation device 80 is controlled in such a manner that the light is diffused, the light from the respective light source units 73 can be surely incident on the integrator lens 74, and the illuminance can be suppressed from being lowered. (Fourth Embodiment) Next, a proximity scanning exposure apparatus according to a fourth embodiment of the present invention will be described with reference to Figs. 26 to 27 . Incidentally, the proximity scanning exposure apparatus of the present embodiment is formed in substantially the same configuration as the scanning exposure apparatus of the third embodiment. Therefore, the same portions are denoted by the same reference numerals, and the description thereof will not be repeated, and the different portions will be described in detail. As shown in Fig. 26, in the proximity scanning exposure apparatus 200 of the present embodiment, an opening 77a is formed in a portion of the concave mirror 77 in the housing 181 of the plurality of illuminating units 180, and measurement is provided after the opening 77a. Each illuminance meter of the illuminance of each wavelength of g-ray, h-ray, i-ray, j-ray 'k-ray, etc. is 79. Further, in Fig. 26, reference numeral 195 is a lighting power source, and reference numeral 196 is a control circuit. 157707.doc rs -34· 201232186 The light irradiation device 80A includes three cassettes arranged in a straight line to support the body 82A. The 匣|81 includes, for example, 6 segments and 4 rows of ultrahigh pressure mercury lamps η and mirrors, respectively. Light source unit 73. Similarly to the first embodiment, in the E-box 81, each of the light source units 73 is positioned by supporting the medical cell buckle cover 84 by supporting the light source branch portions of the 24 light source units, so that the light source units can be positioned from the respective light source units. The light person of the observation amount of the position of 73 is incident on the integrator lens 74. Further, by attaching the respective cartridges 81 to the support 82A, the respective cartridges 81' are positioned so that 7 (%) to (10)% of the light from the respective light source portions 73 can be incident on the integrator lens 74. Further, in the light irradiation device 本 of the present embodiment, the light-splitting characteristics of the light-emitting portions 71 of the specific number of light source units 73 are also the same, and a specific number of the light source units 73 are also provided with the wavelength cut filter 186 by a part thereof. Two types of light source units 73 having different spectral characteristics are formed. Therefore, in the proximity of the scanning exposure apparatus as in the present embodiment, the light source includes a specific number of light source cores including the light-emitting portion 71 and the reflective optical system (4), and a light person of the light source portion 73 of a specific number is incident on the integrator lens. μ, the incident surface supports the light source portion 73 to be the same as the cartridge 8i, and the light splitting characteristics of the lamps 71 of the specific number of the light sources 2 are the same. A specific number of light source portions are configured by the gate/minutes with the wavelength cut filter i 8 6 Structure

=種光源部73。因此,可不更換燈71 '且不使用J •同之光源部而自如地設定每-波長之強度。 〜r本發月並非限定於上述實施形態者,其可進行適 备’交形、改良耸。仓丨Λ 、、1 °,於上述實施形態中,說明了作為 之分割逐次接近曝光裝置與掃描式接近曝光裝= light source unit 73. Therefore, it is possible to freely set the intensity per wavelength without replacing the lamp 71' and using the same light source portion. The present month is not limited to the above-described embodiment, and it is possible to perform an appropriate 'cross-shape and improvement. Cangjie, 1 °, in the above embodiment, the stepwise sequential exposure device and the scanning proximity exposure device are described as the division

S 157707.doc -35- 201232186 置,並不限定於此,本發明亦可適用於鏡像投影式曝光裝 置、透鏡投影式曝光裝置、密接式曝光裝置。又,本發明 亦可適用於總括式、逐次式'掃描式等任一種曝光方法。 本申請案係基於2010年7月22日提出申請之日本專利申 請2010-165 163、2010年8月27日提出申請之日本專利申請 2〇1〇-191288、及2011年7月13日提出申請之日本專利申請 2011-154669者,其内容作為參照而引入至此。 【圖式簡單說明】 圖1係用以說明本發明之第丨實施形態之分割逐次接近曝 光裝置的一部分分解立體圖。 圖2係圖i所示之分割逐次接近曝光裝置之前視圖。 圖3係遮罩台之剖面圖。 圖4⑷係表示光照射裝置之前視圖,圖4(b)係沿⑷t㈣ 線之剖面圖,圖4(c)係沿⑷之卩^沪線之剖面圖。 圖5係安裝於匡盒中之光源部附近之擴大剖面圖。 圖6係表示龍盒安裝於支樓體上之狀態之要部擴大 圖7⑷〜⑷係分別表示反射鏡之開口部形狀之前視圖。 圖8係表示自各光源部之出射面至積分透鏡之入射面為 止之距離的概略圖。 ' 圖 圖9係表示將支撐體安裝於光照明裝置上之例之剖面S 157707.doc -35- 201232186 is not limited thereto, and the present invention is also applicable to a mirror projection exposure apparatus, a lens projection exposure apparatus, and a close exposure apparatus. Further, the present invention is also applicable to any one of an exposure method such as a general type or a sequential type 'scanning type. The present application is filed on the basis of Japanese Patent Application No. 2010-165 163 filed on Jul. 22, 2010, and Japanese Patent Application No. 2 〇 191 191 288, filed on August 27, 2010, and filed on July 13, 2011 Japanese Patent Application No. 2011-154669, the disclosure of which is incorporated herein by reference. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partially exploded perspective view showing a split sequential approaching exposure apparatus according to a third embodiment of the present invention. Figure 2 is a front elevational view of the segmented successive exposure apparatus shown in Figure i. Figure 3 is a cross-sectional view of the mask table. Fig. 4 (4) shows a front view of the light irradiation device, Fig. 4 (b) is a cross-sectional view taken along line (4) t (four), and Fig. 4 (c) is a cross-sectional view taken along line (4) of the line. Fig. 5 is an enlarged cross-sectional view showing the vicinity of a light source unit mounted in a cassette. Fig. 6 is an enlarged view showing a state in which the dragon box is attached to the branch body. Fig. 7 (4) to (4) are front views showing the shape of the opening of the mirror, respectively. Fig. 8 is a schematic view showing the distance from the exit surface of each light source unit to the incident surface of the integrator lens. Figure 9 is a section showing an example of mounting a support on a light illuminating device.

圖 1 〇係表示將匣盒安裝於匣 11係表示用以將匣盒安裝 最文裝部時之例的剖面圖。 於支撐體上之匣盒固定機構 157707.doc -36- 201232186 之變形例的圖,圖11(甸係立體圖,圖11(6)係平面圖,圖 11(c)係沿圖li(b)2XI_XI線之剖面圖。 圖12係表示用以將g盒安裝於支撐體上之厘盒固定機構 之另一變形例的圖。 圖13係表示用以將匣盒安裝於支撐體上之匣盒固定機構 之又一變形例的圖。 圖14(a)係表示用以將匣盒安裝於支撐體上之匣盒固定機 構之另一變形例的立體圖,圖14〇?)係表示將匣盒安裝於支 撐體上之狀態的剖面圖。 圖15(a)係表示用以將匣盒安裝於支撐體上之匣盒固定機 構之又一變形例的立體圖,圖15(b)係表示將匣盒安裝於支 撐體上之狀態的剖面圖。 圖16係第2實施形態之分割逐次接近曝光裝置之前視 圖。 圖17(a)係表示光照射裝置之前視圖,圖17(b)係沿圖 17(a)之XVII-XVII線之剖面圖。 圖18(a)係表示匣盒之前視圖’圖i8(b)係圖i8(a)之側視 圖,圖18(c)係圖i8(a)之底視圖。 圖19(a)係表示第2實施形態之變形例之光照射裴置之匣 盒的前視圖,圖19(b)係表示另一變形例之光照射裝置之匣 盒的前視圖,圖19(c)係表示使圖19(a)之光照射裝置之光 源部局部熄滅之情形的圖。 圖20係本發明之第3實施形態之接近掃描曝光裝置之全 體立體圖。 157707.doc 5 -37- 201232186 圖21係表示將接近掃描曝光裝置之照射部等之上部構成 拆除後之狀態的頂視圖。 圖22係表示接近掃描曝光裝置之遮罩配置區域之曝光狀 態的側視圖。 圖23(a)係用以說明遮罩與氣墊之位置關係的要部頂視 圖,圖23(b)係其剖面圖。 圖24係用以說明接近掃描曝光裝置之照射部之圖。 圖25(a)係表示圖24之光照射裝置之前視圖,圖係 沿圖25(a)之χχν-χχν線之剖面圖。 圖26係用以說明本發明之第4實施形態之接近掃描曝光 裝置之照射部的圖。 圖27(a)係表示圖26之光照射裝置之前視圓,圖27(b)係 沿圖27(a)之XXVII-XXVII線之剖面圖。 圖28(a)及圖28(b)係表示已擴散之光自積分透鏡偏離之 狀態的先前之光照射裝置之概略圖Q 【主要元件符號說明】 12 遮罩保持框(遮罩保持部) 21 基板保持部 70 照明光學系統 71 超高壓水銀燈(發光部) 72 反射鏡(反射光學系統) 73 ' 73A ' 73B 光源部 74 積分透鏡 80 ' 80A 曝光裝置用光照射裳置 157707.doc •38· 201232186 81 ' 81A 匣盒 82 ' 82A 支撐體 83 光源支撐部 84 燈扣壓罩(罩構件) 86 抵接部 87 燈扣壓機構 90 匣盒安裝部 91 支樓體本體 99 光軸角度調整機構 101 光檢測裝置 102 控制裝置 103 電線 171 遮罩保持部 171a 上游侧遮罩保持部 171b 下游側遮罩保持部 180 照射部(照明光學系統) 186 波長截止遽波器 200 接近掃描曝光裝置(曝光裝置) LA 光軸 M 遮罩 P 圖案 PE 分割逐次接近曝光裝置(曝光裝置) W 基板、玻璃基板、彩色濾波器基板(被曝光材) 157707.doc •39-Fig. 1 is a cross-sectional view showing an example in which the cassette is attached to the cassette 11 to show the case where the cassette is attached to the most image mounting unit. Fig. 11 (denier stereogram, Fig. 11 (6) is a plan view, Fig. 11 (c) is along the diagram li(b) 2XI_XI, on the support body, a diagram of a modification of the cassette fixing mechanism 157707.doc-36-201232186 Fig. 12 is a view showing another modification of the stencil fixing mechanism for attaching the g cartridge to the support. Fig. 13 is a view showing the cymbal fixing for attaching the cassette to the support. Fig. 14 (a) is a perspective view showing another modification of the cassette fixing mechanism for attaching the cassette to the support, and Fig. 14 is a view showing the cassette mounting. A cross-sectional view of the state on the support. Fig. 15 (a) is a perspective view showing still another modification of the cassette fixing mechanism for attaching the cassette to the support, and Fig. 15 (b) is a sectional view showing a state in which the cassette is attached to the support. . Fig. 16 is a front view of the divided successive approaching exposure apparatus of the second embodiment. Fig. 17 (a) is a front view showing the light irradiation device, and Fig. 17 (b) is a sectional view taken along line XVII-XVII of Fig. 17 (a). Fig. 18(a) is a front view of the cassette, Fig. i8(b) is a side view of Fig. i8(a), and Fig. 18(c) is a bottom view of Fig. i8(a). Fig. 19 (a) is a front view showing a cassette of a light irradiation device according to a modification of the second embodiment, and Fig. 19 (b) is a front view showing a cassette of the light irradiation device according to another modification, Fig. 19 (c) is a view showing a state in which the light source unit of the light irradiation device of Fig. 19 (a) is partially extinguished. Fig. 20 is a perspective view showing the entire vicinity of a scanning exposure apparatus according to a third embodiment of the present invention. 157707.doc 5 -37-201232186 Fig. 21 is a top view showing a state in which the upper portion of the illuminating portion or the like close to the scanning exposure device is removed. Fig. 22 is a side view showing the exposure state of the mask arrangement area close to the scanning exposure apparatus. Fig. 23 (a) is a top plan view showing the positional relationship between the mask and the air cushion, and Fig. 23 (b) is a sectional view thereof. Fig. 24 is a view for explaining the irradiation portion of the scanning exposure apparatus. Fig. 25 (a) is a front view showing the light irradiation device of Fig. 24, and is a cross-sectional view taken along line χχν-χχν of Fig. 25(a). Fig. 26 is a view for explaining an illuminating unit of the scanning exposure apparatus according to the fourth embodiment of the present invention. Fig. 27 (a) is a front view circle of the light irradiation device of Fig. 26, and Fig. 27 (b) is a cross-sectional view taken along line XXVII-XXVII of Fig. 27 (a). 28(a) and 28(b) are schematic diagrams showing a prior art light irradiation device in which the diffused light is deviated from the integrator lens. [Description of main component symbols] 12 Mask holding frame (mask holding portion) 21 Substrate holding unit 70 Illumination optical system 71 Ultra high pressure mercury lamp (light emitting unit) 72 Mirror (reflecting optical system) 73 '73A ' 73B Light source unit 74 Integral lens 80 ' 80A Exposure device is illuminated with light 157707.doc •38· 201232186 81 ' 81A 82 box 82 ' 82A Support body 83 Light source support part 84 Light-retaining cover (cover member) 86 Abutment part 87 Light-pressing mechanism 90 安装 Box mounting part 91 Branch body 99 Optical axis angle adjustment mechanism 101 Light detection Device 102 Control device 103 Wire 171 Mask holding portion 171a Upstream side mask holding portion 171b Downstream side mask holding portion 180 Irradiation portion (illumination optical system) 186 Wavelength cutoff chopper 200 Proximity to scanning exposure device (exposure device) LA light Axis M Mask P pattern PE division successive approaching exposure device (exposure device) W substrate, glass substrate, color filter substrate (exposed material) ) 157707.doc •39-

Claims (1)

201232186 七、申請專利範圍: ί. 一種曝光裝置用光照射裝置,其特徵在於包括: 複數個光源部,其分別包含發光部與反射光學系統, 該反射光學系統使自該發光部產生之光具有指向性地射 出; 複數個e盒,其包含分別支揮上述光源部之光源支撐 部,以使上述特定數量之光源部之光入射至積分透鏡之 入射面; 支撐體,其包含分別安裝上述複數個匣盒之複數個匣 盒安裝部,以使上述所有光源部之光入射至積分透鏡之 入射面;及 光軸角度調整機構’丨可調整上述各光源部之相對於 上述積>透鏡之光軸角《,以修正上述各光源部之伴隨 照射時間之經過而產生之上述光擴散。 2. 如請求項1之曝光裝置用光照射裝置,其中上述特定數 f之光源部包含分光特性不同之複數種光源部。 3. =請求項2之曝光裝置用光照射裝置,其中上述特定數 I之光源部之各發光部的分光特性相同,且 上述特疋數直之光源部藉由於其一部分配置波長截止 濾波器而構成分光特性不同之複數種光源部。 4. 一種曝光裝置,其特徵在於包括: 基板保持部,其保持作為被曝光材之基板; 遮罩保持部’其以與上述基㈣向之方式保持遮罩;及 照明光學系統,其包含如請求項丨至3中任— 貝 < 上述 157707.doc , ^ 201232186 光照射裝置、及自該光照射裝置之複數個光源部出射之 光所入射之積分透鏡;且 對上述基板經由上述遮罩而照射來自上述照明光學系 統之光》 5,一種曝光裝置用光照射裝置之控制方法,其特徵在於: 該曝光裝置用光照射裝置包括: 複數個光源部,其分別包含發光部與反射光學系統, 該反射光學系統使自該發光部產生之光具有指向性地射 出; 複數個匣盒,其包含分別支撐上述光源部之光源支撐 部,以使上述特定數量之光源部之光入射至積分透鏡之 入射面; 支撐體,其包含分別安裝上述複數個匣盒之複數個匣 盒安裝部,以使上述所有光源部之光入射至積分透鏡之 入射面;及 光軸角度調整機構,其可調整上述各光源部之相對於 上述積分透鏡之光輛角度,以修正上述各光源部之伴隨 照射時間之經過而產生之上述光擴散; 該曝光裝置用光照射裝置之控制方法包括如下步驟: 檢測上述各光源部之伴隨照射時間之經過而產生之上 述光擴散;及 藉由上述光軸角度調整機構而修正上述光擴散。 6·如請求項5之曝光裝置用光照射裝置之控制方法,其中 該曝光裝置用光照射裝置進而包括: 157707.doc 201232186 照度計’其配置於上述積分透 i預刀远鏡之下游側,測量與各 渡長對應之照度;及 控制部,其㈣上述各發光部之點亮、熄滅及照度;且 上㈣定數量之光源部包含分光特性不同之複數種光 t述控制部根據以上述照度計所測量之與各波長對應 之知、度’以於特定波長獲得所需之照度之方式而控制上 述s盒内之各光源部。 7.如請求項6之曝光裝置^照射裝置之控制方法,其中 上述特定數量之光源部之各發光部的分光特性相同,且 8. 上料定數量之光源部藉由於其—部分配置波長截止 滤波益而構成分光特性不同之複數種光源部。 一種曝光方法’其特徵在於: 曝光裝置包括: 基板保持部,其保持作為被曝光材之基板; 遮罩保持σρ ’其以與上述基板對向之方式保持遮罩;及 照明光學系統’其包含如請求項5至7中任一項之上述 光照射裝置、及自該光照射裝置之複數個光源部出射之 光所入射之積分透鏡;且 該曝光方法係一面執行如請求項5至7中任一項之上述 光照射裝置之控制方法,—面經由上述遮罩而對上述基 板照射來自上述照明光學系統之光,而將形成於上述遮 罩上之圖案曝光轉印至上述基板。 5 157707.doc201232186 VII. Patent application scope: ί. A light irradiation device for an exposure device, comprising: a plurality of light source portions each including a light emitting portion and a reflection optical system, wherein the reflection optical system causes light generated from the light emitting portion to have Directly ejecting; a plurality of e-boxes respectively including a light source supporting portion for supporting the light source portion, such that light of the specific number of light source portions is incident on an incident surface of the integrator lens; and a support body including the plurality of the above-mentioned plurality a plurality of cassette mounting portions for causing light of all of the light source portions to be incident on an incident surface of the integrator lens; and an optical axis angle adjusting mechanism '丨 adjusting the light source portion with respect to the product> The optical axis angle "corrects" the light diffusion caused by the elapse of the irradiation time of each of the light source sections. 2. The light-emitting device for an exposure apparatus according to claim 1, wherein the light source portion of the specific number f includes a plurality of light source portions having different spectral characteristics. 3. The light-emitting device for an exposure apparatus according to claim 2, wherein the light-emitting portions of the light-emitting portions of the specific number I have the same spectral characteristics, and the light source portion of the plurality of direct-numbered light sources is configured by arranging a wavelength cut filter A plurality of light source sections having different spectral characteristics. 4. An exposure apparatus, comprising: a substrate holding portion that holds a substrate as an exposed material; a mask holding portion that holds a mask in a manner to be opposite to the base (four); and an illumination optical system including The request item 丨 to 3—Beilt; the above 157707.doc, ^ 201232186 light irradiation device, and an integrating lens from which light emitted from a plurality of light source units of the light irradiation device is incident; and the substrate is passed through the mask And the light from the illumination optical system, wherein the light irradiation device of the exposure device comprises: a plurality of light source portions each including a light emitting portion and a reflective optical system The reflective optical system emits light from the light-emitting portion in a directivity manner; and a plurality of cassettes respectively include a light source supporting portion respectively supporting the light source portion such that light of the specific number of the light source portions is incident on the integrator lens The incident surface; the support body includes a plurality of cassette mounting portions respectively mounting the plurality of cassettes, so that An incident surface of the light source portion is incident on the incident surface of the integrator lens; and an optical axis angle adjusting mechanism that adjusts a light angle of each of the light source portions with respect to the integrator lens to correct an incident time of each of the light source portions The light diffusion device generated by the exposure device includes: a step of: detecting the light diffusion caused by the elapse of the irradiation time of each of the light source portions; and the optical axis angle adjustment mechanism by the optical axis angle adjustment mechanism Correct the above light diffusion. 6. The method of controlling a light-emitting device for an exposure apparatus according to claim 5, wherein the light-emitting device of the exposure device further comprises: 157707.doc 201232186 illuminance meter, which is disposed on a downstream side of the above-mentioned integral transparent mirror Measuring the illuminance corresponding to each ferry length; and a control unit, wherein: (4) the lighting, extinction, and illuminance of each of the light-emitting portions; and the plurality (four) of the plurality of light source units including the plurality of types of light having different spectral characteristics, the control unit The light source portion corresponding to each wavelength measured by the illuminometer controls the respective light source portions in the s box in such a manner that the desired illuminance is obtained at a specific wavelength. 7. The method of controlling an exposure apparatus according to claim 6, wherein the light-emitting characteristics of the respective light-emitting portions of the specific number of light source sections are the same, and 8. the predetermined number of light source sections are due to the partial-configuration wavelength cut-off filtering thereof. It constitutes a plurality of light source sections having different spectral characteristics. An exposure method characterized by: an exposure apparatus comprising: a substrate holding portion that holds a substrate as an exposed material; a mask holding σρ 'which holds a mask opposite to the substrate; and an illumination optical system' The light irradiation device according to any one of claims 5 to 7, wherein the light emitted from the plurality of light source portions of the light irradiation device is incident on the integrator lens; and the exposure method is performed as claimed in claims 5 to 7 In the method of controlling the light irradiation device of any one of the above, the substrate is irradiated with light from the illumination optical system via the mask, and the pattern formed on the mask is exposed and transferred to the substrate. 5 157707.doc
TW100126077A 2010-07-22 2011-07-22 Exposure apparatus light irradiation device, light irradiation device control method, exposure apparatus, and exposure method TWI443479B (en)

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