TW201231690A - Copper alloy, and wrought copper, electric parts, and connector using thereof, and manufacturing method of copper alloy - Google Patents

Copper alloy, and wrought copper, electric parts, and connector using thereof, and manufacturing method of copper alloy Download PDF

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TW201231690A
TW201231690A TW100136251A TW100136251A TW201231690A TW 201231690 A TW201231690 A TW 201231690A TW 100136251 A TW100136251 A TW 100136251A TW 100136251 A TW100136251 A TW 100136251A TW 201231690 A TW201231690 A TW 201231690A
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copper
ray diffraction
plane
mass
copper alloy
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TW100136251A
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Chinese (zh)
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TWI429766B (en
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Hiroyasu Horie
Naohiko Era
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Jx Nippon Mining & Metals Corp
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026Alloys based on copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22CALLOYS
    • C22C9/00Alloys based on copper
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/002Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
    • CCHEMISTRY; METALLURGY
    • C22METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22FCHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21BROLLING OF METAL
    • B21B3/00Rolling materials of special alloys so far as the composition of the alloy requires or permits special rolling methods or sequences ; Rolling of aluminium, copper, zinc or other non-ferrous metals
    • B21B2003/005Copper or its alloys

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

The present invention provides a titanium-copper, a wrought copper, electronic parts, and a connector having an excellent strength and bending processing property, and their manufacturing method. The copper alloy of the present invention contains 2.0 to 4.0 mass% of Ti, and contains 0 to 0.2 mass% of one or two or more elements selected from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B, and P as a third element, with the remainder portion being the copper alloy constituted by copper and inevitable impurity. Upon measuring the X-ray diffraction strength of the flattening plane, the ratio (I/I0) of the X-ray diffraction strength I of the flattening plane relative to the X-ray diffraction strength I0 of the pure copper powder in the plane (311) and plane (200) satisfies the following correlation: { I/I0 (311)}/ { I/I0 (200)} ≤ 2.54, and the ratio (I/I0) of the X-ray diffraction strength I of the flattening plane relative to the X-ray diffraction strength I0 of the pure copper powder in the plane (220) and plane (200) satisfies the following correlation: 15 ≤ { I/I0 (220)}/ { I/I0 (200)} ≤ 95.

Description

201231690 六、發明說明: 【發明所屬之技術領域】 本發明係關於一種含有例如適合用作連接器等電子零 件用構件之鈦的銅合金及使用其之伸銅品、電子零件及連 結器,以及銅合金之製造方法。 【先前技術】 近年來u行動終知等為代表之電子機器之小型化不 斷發展’因此其中所使用之連接器之窄間距化及低背化 (.L〇WPr〇file)之傾向顯著。連接器越小型,接腳寬度(pin W1dth)越窄,為了成為摺疊得較小之加工形狀,要求所使 用之構件具有較高的強度以獲得必需之彈性以及具有可 承受嚴酷彎曲加工之優異脊曲加工性。於該方面,由於含 有鈦之銅合金(以下,稱為「鈦銅」)之強度比較高,且 應力緩和特性在銅合金中最為優異,因此自先前以來即被 用作特別要求強度之訊號系端子用構件。 鈦銅係時效硬化型之銅合金。具體而言,若藉由固溶 處理形成作為溶質原子之Ti之過飽和固溶體,並自該狀態 於低溫下實施較長時間之熱處理,則會因為離相分解 (spinodal decomposition ),而使得母相中之们濃度之週 期變動即s周變結構(modulated structure )擴展,且強产提 高。正研發有以該強化結構為基本,謀求使鈦鋼之特性更 進一步提升之各種手段。 此時,問題在於強度與彎曲加工性相反之特性這一方 面。即’若使強度提高,則會損及彎曲加工性,相反地, 3 201231690 若重視彎曲加工性,則無法獲得期望之強度 因此, 已研究開發有從如下觀點來謀求兼 具鈦銅之強 添加 Fe、Co、Ni、Si 度與彎曲加工性之先前未有的技術 等第三疋素(專利文獻1 );限制於母相中固溶之雜質元素 群濃度,並使該等作為第二相粒子(Cu—Ti—x系粒子)以 (專利文獻 特定之分佈形態析出來提高調變結構之規則性 2);規定有效使晶粒微細化之微量添加元素與第二相粒子 之密度(專利文獻3 );使晶粒微細化(專利文獻4)等。 又,於專利文獻5中,提出有如下技術:著眼於結晶 方位’並為了防止彎曲加工中之破裂,控制結晶配向以滿 足調整熱壓延條件成1{42〇}/1〇{42〇}>1 〇,進一步調整冷 壓延率成1{22〇}/1〇{22〇}$3 〇,藉此改善強度、變曲加工 性及耐應力緩和性。 [專利文獻1]曰本特開2004— 23 1985號公報 [專利文獻2]日本特開2004 — 1 761 63號公報 [專利文獻3]日本特開2〇〇5_ 97638號公報 [專利文獻4]日本特開2〇〇6 — 283142號公報 [專利文獻5]日本特開2〇〇8 — 3〇8734號公報 【發明内容】 上述之鈦銅基本係以鑄錠之熔解鑄造—均質化退火 熱壓延反覆進行退火及冷壓延)—最終固溶處理— 壓延—時效處理之順序來加以製造,且以該步驟為基本 謀求了改善特性。然而’為了得到具有更佳優異之特性 鈦銅,仍有進一步改善之餘地。 八 4 201231690 因此,本發明係基於與習 之特性’藉此提供一種具有優 合金及使用其之伸銅品'電子 之製造方法。 知相異的觀點s式圖改善欽銅 異之強度及彎曲加工性之銅 零件及連結器,以及銅合金 本發明人於為解決上述課題而進行研究之過程中,發 現若於固溶處理後,進行不生成或生成-部分鈦的準穩定 相或穩定相程度的適當之熱處理(次時效處理(artifrcial agi:g treatment))’而預先引起一定程度的離相分解則 之後進行冷壓延及時效處理而最後獲#的鈥銅的強度將會 有效地得到提高。g卩,先前的鈦銅的製造方法是在時效處 理的1個階段進行引起離相分解的熱處理步驟,相對於此, :發明的鈦銅的製造方法’較大不同之處在於,在冷壓延 釗後於2個階段引起離相分解。 進而亦得知,藉由進一步將第3元素的添加量調節在 最適範圍,可將於以往利用以固溶為目的之帛2固溶處理 =以再結晶為目的之第2固溶處理此2階段來進行處理而 知者於1次的固溶處理中同時進行固溶及再結晶,可得 到生產效率優異、且強度及-曲加卫性之平衡優異的鈦銅。 八基於上述見解之本發明於_形態中係一種銅 :金’其含有2.G〜4.G質量%之Ti,並含有合計G〜〇 2質 量 %之選自由 Mn、Fe、Mg、Co、Ni、Cr、v、灿、M〇、201231690 VI. [Technical Field] The present invention relates to a copper alloy containing titanium, which is suitable for use as a member for electronic parts such as connectors, and copper products, electronic parts and connectors using the same, and A method of manufacturing a copper alloy. [Prior Art] In recent years, the miniaturization of electronic devices represented by the end of the u-action has been progressing steadily. Therefore, the narrow pitch and low-profile (.L〇WPr〇file) of the connectors used therein are remarkable. The smaller the connector, the narrower the pin width (pin W1dth), and in order to be a folded shape, the member to be used is required to have high strength to obtain the necessary elasticity and to have an excellent ridge capable of withstanding severe bending. Flexibility. In this respect, since the copper alloy containing titanium (hereinafter referred to as "titanium copper") has a relatively high strength and the stress relaxation property is the most excellent in the copper alloy, it has been used as a signal line of particularly required strength since the prior art. Terminal member. Titanium copper type age hardening type copper alloy. Specifically, if a supersaturated solid solution of Ti as a solute atom is formed by solution treatment, and heat treatment is performed for a long period of time at a low temperature from this state, the mother may be decomposed by spinodal decomposition. The cyclical variation of the concentration of the phases is the expansion of the s-modulated structure and the increase in yield. We are developing various means to further improve the characteristics of titanium steel based on this reinforced structure. At this time, the problem lies in the fact that the strength is opposite to the bending workability. In other words, if the strength is increased, the bending workability is impaired. On the contrary, 3 201231690 If the bending workability is emphasized, the desired strength cannot be obtained. Therefore, research and development have been made to achieve a strong addition of titanium and copper from the following viewpoints. A third element such as Fe, Co, Ni, Si, and a previously unseen technique of bending workability (Patent Document 1); concentration of an impurity element group which is limited to solid solution in the matrix phase, and these are used as the second phase Particles (Cu—Ti—x-based particles are precipitated according to the distribution pattern specified in the patent document to improve the regularity of the modulation structure 2); the density of the trace additive element and the second phase particle which are effective to refine the crystal grains are specified (patent Document 3); refining crystal grains (Patent Document 4) and the like. Further, in Patent Document 5, there is proposed a technique of focusing on the crystal orientation 'and in order to prevent cracking in the bending process, and controlling the crystal orientation to satisfy the adjustment heat rolling condition to 1{42〇}/1〇{42〇} >1 〇, further adjust the cold rolling ratio to 1{22〇}/1〇{22〇}$3 〇, thereby improving strength, bending processability and stress relaxation resistance. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. The rolling is performed by annealing and cold rolling, the final solution treatment, the calendering-aging treatment, and the improvement of the characteristics is basically achieved by this step. However, there is still room for further improvement in order to obtain titanium copper with better properties. VIII 4 201231690 Accordingly, the present invention is based on the characteristics of the present invention, thereby providing a manufacturing method having an excellent alloy and a copper-exposed product of the same. In view of the fact that the inventors have studied in order to solve the above problems, the present inventors have found that if they are after solution treatment, they have improved the strength and bending workability of copper parts and connectors, as well as copper alloys. Performing a suitable heat treatment (artifrical agi: g treatment) that does not generate or generate a part of the quasi-stationary phase or the stable phase of titanium, and causes a certain degree of phase-decomposition beforehand, and then performs cold rolling and aging. The strength of the beryllium copper that is processed and finally won # will be effectively improved. In other words, the conventional method for producing titanium copper is a heat treatment step that causes phase separation in one stage of aging treatment. On the other hand, the method for producing titanium copper of the invention is largely different in cold rolling. After the second stage, the phase separation is caused. Furthermore, it is also known that the amount of addition of the third element is adjusted to an optimum range, and the second solution treatment for the purpose of solid solution can be used in the past. At the stage of the treatment, it is known that solid solution and recrystallization are simultaneously performed in the solution treatment at one time, and titanium copper having excellent production efficiency and excellent balance of strength and curvature can be obtained. VIII. The present invention based on the above-mentioned findings is a copper: gold which contains 2.G to 4. G mass% of Ti, and contains a total of G to 〇2% by mass selected from Mn, Fe, Mg, Co. , Ni, Cr, v, Can, M〇,

Zr、S”B及P構成之群中之!種或2種以上的元素作為第 3元素,剩餘部份由銅及不可避免之雜質所構成;於測定壓 延面之X射線繞射強度時,壓延面之χ射線繞射強度^目 5 201231690 對於(3 11 )面及(200 )面中之純銅粉末的χ射線繞射強 度1〇之比(1/1。)滿足以下關係式(1 : G/I〇 ( 311 ) } /{Ι/Ι〇(200)}$2.54· · · (1),且,壓延面之 χ 射 線繞射強度I相對於(220)面及(200)面中之純銅粉末的 X射線繞射強度1〇之比(1/ 1〇 )滿足以下關係式(2 ): 15${1/10 (220) }/{ΐ/ι〇(20〇) }$95· · · (2)。 本發明於另一形態中,係一種銅合金,其含有2.0〜4.0 質量%之Ti ’並含有合計〇.01〜〇.15質量〇/0之選自由Μη ' Fe、Mg、Co、Ni、Cr、V、Nb、Mo、Zr、Si、Β 及 Ρ 構成 之群中之1種或2種以上的元素作為第3元素,剩餘部份 由銅及不可避免之雜質所構成;於測定壓延面之χ射線繞 射強度時,壓延面之X射線繞射強度丨相對於(3丨丨)面及 (200 )面中之純銅粉末的χ射線繞射強度1〇之比(1〇) 滿足以下關係式(1 ) : ( 311 ) } / {1/1〇 ( 2〇〇) } -2·54 * * * ( 1 ),且,壓延面之X射線繞射強度I相對 於(2 2 0 )面及(2 0 0 )面中之純銅粉末的χ射線繞射強度 1〇之比(1/10)滿足以下關係式(3 ) : 30$ {1/1〇 ( 220 ) } /{1/1〇 ( 200 ) }$95 · · · ( 3)。 本發明於再另一形態中,係一種伸鋼品,其由上述銅 合金所構成。 本發明於再另一形態中,係一種電子零件,其由上述 銅合金所構成。 本發明於再另一形態中,係一種連接器,其具備有上 述銅合金。 201231690 务月於再另一形態中,係一種上述銅合金之製造方 法,其含有如下步驟:對含有2.0〜4.0質量%之Ti,並含 有口》十0〜0.2質量%之選自由_、Fe、Mg、Co、Ni、Cr、 V ' Nb ' M〇、Zr、Si、B及p所構成之群中之i種或2種以 上的7L素作為第3元素,剩餘部分由銅及不可避免之雜質 所構成之鋼合金素材,進行加熱至比在73〇〜88〇它内丁丨之 固溶限度變成與添加量相同的固溶限溫度高〇〜2〇χ:之溫 度,然後加以急冷的固溶處理;於固溶處理後,進行熱處 理,於熱處理後,進行加工率為5〜4〇%之最終冷壓延;於 表終冷壓延後,進行時效處理。 本發明之銅合金之製造方法於一實施態樣中,上述熱 處理包3進行下述熱處理:於將鈦濃度(質量%)設為[Ti] 之It形時’以導電率之上升值C(% IACS)滿足以下關係 式(4) . 0.5SCS ( - 〇.5〇[Ti]2 — 〇 50[Ti]+ 14) · · · ( 4) 的方式’使導電率上升。 【實施方式】 < Ti含量> 於Τι未達2質量%時’無法充分地獲得由鈦銅原本之 調變結構之形成所產生的強化機制,因此無法獲得充分之 強度,相反地若超過4.0質量%,則存在粗大之TiCu3易於 析出,且強度及f曲加卫性劣化之傾向。因此,本發明之 銅合金中之Τι的含量為2 〇〜4 〇質量%,較佳為2 7〜3 5 質量%,再更佳為2.9〜3.3質量%。藉由將Ti之含量適當 化’可同時實現適合用於電子零件之優異強度及彎曲加工 7 201231690 性。 <第3元素> 第3元素由於有助於晶粒的微細化’因此可添加特定 之第3元素。具體而言,即使在Ti充分固溶之較高溫度中 進行固溶處理’晶粒亦容易微細化’強度容易提高。又 第3元素會促進調變結構的形成。進一步,篦 不 J 7L京亦具 有抑制TiCh析出的效果。因此,可獲得鈦鋼原有的時效硬 化能(Age—hardening Power)。 鈦銅中上述效果最高者爲Fe。而且,Mn、Mg、c〇、In the group consisting of Zr, S"B and P, two or more elements are used as the third element, and the remainder is composed of copper and unavoidable impurities; when measuring the X-ray diffraction intensity of the calendering surface, χ ray diffraction intensity of the calendering surface ^ 20125690 The ratio of the χ ray diffraction intensity (1/1.) of the pure copper powder in the (3 11 ) plane and the (200 ) plane satisfies the following relationship (1: G/I〇( 311 ) } /{Ι/Ι〇(200)}$2.54· · · (1), and the radiant intensity of the radiant surface I is relative to the (220) plane and the (200) plane The ratio of the X-ray diffraction intensity of the pure copper powder to 1〇 (1/1〇) satisfies the following relation (2): 15${1/10 (220) }/{ΐ/ι〇(20〇) }$95· (2) In another aspect, the present invention is a copper alloy containing 2.0 to 4.0% by mass of Ti' and containing a total of 〇.01~〇.15 mass 〇/0 selected from Μη 'Fe, Mg One or two or more elements of the group consisting of Co, Ni, Cr, V, Nb, Mo, Zr, Si, Β, and 作为 are used as the third element, and the remainder is composed of copper and inevitable impurities. When measuring the diffraction intensity of the radiant rays of the calendering surface The ratio of the X-ray diffraction intensity of the calendering surface 〇 to the diffraction intensity of the χ-ray diffraction of the pure copper powder in the (3 丨丨) plane and the (200) plane (1〇) satisfies the following relation (1): (311 ) } / {1/1〇( 2〇〇) } -2·54 * * * ( 1 ), and the X-ray diffraction intensity I of the calendering surface is relative to the (2 2 0 ) plane and (2 0 0 ) The ratio of the χ-ray diffraction intensity of the pure copper powder in the surface (1/10) satisfies the following relation (3): 30$ {1/1〇( 220 ) } /{1/1〇( 200 ) }$95 According to still another aspect of the present invention, there is provided a steel product comprising the copper alloy. In still another aspect, the present invention provides an electronic component comprising the copper alloy. According to still another aspect of the invention, there is provided a connector comprising the copper alloy. In another aspect, the invention provides a method for producing the copper alloy, which comprises the following steps: ~4.0% by mass of Ti, and containing a mouth "10 0 to 0.2% by mass" selected from the group consisting of _, Fe, Mg, Co, Ni, Cr, V ' Nb ' M 〇 , Zr, Si, B and p i or 2 of them The 7L element is used as the third element, and the remaining part is made of a steel alloy material composed of copper and unavoidable impurities, and is heated to a solid solution having a solid solution limit of 73 〇 to 88 〇. The temperature is limited to 〇χ2〇χ: the temperature, and then the solution treatment is quenched; after the solution treatment, the heat treatment is performed, and after the heat treatment, the final cold rolling is performed at a processing rate of 5 to 4%; After cold rolling, aging treatment is performed. In a method of producing a copper alloy according to the present invention, the heat treatment package 3 is subjected to a heat treatment in which the titanium concentration (% by mass) is set to [It is a shape of [Ti], and the increase in conductivity C ( % IACS) satisfies the following relation (4). 0.5SCS ( - 〇.5〇[Ti]2 — 〇50[Ti]+ 14) · · · (4) The way 'increasing the conductivity. [Embodiment] <Ti content> When the Τι is less than 2% by mass, the strengthening mechanism caused by the formation of the original tuned structure of titanium copper cannot be sufficiently obtained, so that sufficient strength cannot be obtained, and if it exceeds When the amount is 4.0% by mass, the coarse TiCu3 tends to be precipitated, and the strength and the f-curvability tend to deteriorate. Therefore, the content of the oxime in the copper alloy of the present invention is 2 〇 to 4 〇 by mass, preferably 2 7 to 3 5 % by mass, and more preferably 2.9 to 3.3 % by mass. By optimizing the content of Ti, it is possible to simultaneously achieve excellent strength and bending processing suitable for use in electronic parts. <Third element> The third element contributes to the miniaturization of crystal grains. Therefore, a specific third element can be added. Specifically, even if the solution treatment is carried out at a relatively high temperature at which Ti is sufficiently solid-solved, the crystal grains are easily refined, and the strength is easily improved. The third element promotes the formation of a modulation structure. Further, 篦不 J 7L Jing also has the effect of suppressing the precipitation of TiCh. Therefore, the original age-hardening power of titanium steel can be obtained. Among the titanium copper, the highest effect is Fe. Moreover, Mn, Mg, c〇,

Ni、S!、Cr、V、Nb、Mo、Zr、B及P亦可期待與卜同等 的效果,即使單獨添加亦可表現出安丈果,/亦可複合添加2 種以上。 ,、一一、丄,只丨J 衣現出其 效果,但若合計超過0.5質量%,則Μ固溶限度變小而容 易粗大的第二相粒子,雖然強度些許提高,但彎曲加 二面:生劣化。同時,粗大的第二相粒子會促使彎曲部 ::面了變:粗糖,且會促進加壓加工中的金屬模具磨損。 之Mn、Fe、MD °〜〇_5質量%之選自由作爲第3元素群 p 所構成、 、Ni、Cr、v、Nb、Mo、Zr、Si、B&amp; P所構成之群中的j種或 量%,再更佳A ,更佳爲含有0〜0.2質 添加更第?含有一.15質量%為較佳。 此相對,會有广、,雖然對於鈦銅晶粒的細微化有效,但與 溫度高於不添加^限^度上升的情況’因此必須使固溶 兀素之情形時的固溶溫度。以往,為 201231690 3兀素充分固溶,於高溫下進行相對長時間之第一 次固溶處理後,進行最終@溶處理m因為進行2 次的固溶處理,導致於製造步驟造成負擔,且生 低之情形。於本實施形態中,藉由將欽鋼中㈣ 度調整為0〜0.2質量%,更佳為〇.〇1〜〇 15質量%,可於處 理溫度低於以往之狀態下,於1次的固溶處理同時進行第二 元素之固溶與再結晶。藉此,可實現以於製造鈦銅時所. 要之熱量比以往少之熱量即可完成、處理時間為短時間亦 可完成、生產效率增加、且可大量生產之較佳的製程。 &lt;X射線繞射之積分強度&gt; 一般而言,固溶處理後之壓延面的織構於(2〇〇)面的 組比率較高、隨著進行壓延會引起旋轉、最後(22〇)面的 組成比率變高。本發明人等之研究結果發現了,於本實施 形態之製造步驟,即於進行最終固溶處理後、冷壓延前進 行熱處理之情形時,與先前之步驟,即固溶處理—冷壓延 —時效處理之製造步驟相比,由於母材中調變結構擴展, 故而由( 200 )面朝(311)面的旋轉會變得難以發生。因 此’本實施形態之銅合金較佳為於測定壓延面之χ射線繞 射強度(積分強度)時,壓延面之X射線繞射強度J相對 於(3 11 )面及(200 )面中之純銅粉末的χ射線繞射強度 1〇之比(1/ 10 )滿足以下關係式(1 ): {Ι/Ι〇(311) }/{Ι/Ι〇( 200 ) }$2·54· · · (1) 於本發明中’純銅標準粉末係定義為325網孔(JIS 28801 )之純度99.5%的銅粉末。 9 201231690 {1/1〇(311)}/{1/ 10 ( 200 )}更佳為〇5〇〜2.〇〇, 再更佳為{I/I〇(311) }/{I/I〇(2O0) }為 〇·8〇 〜1.75。 {Ι/Ι〇 ( 31 1 ) } / {Ι/ι〇 ( 200 ) }大於 2·54 之情形時,有強 度(0.2%保證應力)變弱,彎曲加工性亦惡化之情形。 鈥銅之織構亦受最終壓延步驟的加工率所影響。亦 即’有若壓延加工率過大,則(220 )面過度擴展而彎曲性 劣化,若加工率過低,則(220 )面之擴展不足而使強度減 低之情形。本實施形態之鈦銅,較佳為加工率以5〜40%來 進行’更佳為以1 〇〜30%來進行。此情形之壓延面的織構 較佳為壓延面之Χ射線繞射強度I相對於(22〇 )面及(2〇〇 ) 面中之純銅粉末的X射線繞射強度1〇之比(1/ 1〇 )滿足以 下關係式(2 ): 15$ Π〆1。( 220 ) } / {1/ 10 ( 200 ) } $ 95 · · · ( 2)。 {1/1〇 ( 220 ) ( 200 ) }小於 15 之情形時,有 加工率減低’壓延步驟所導致之加工硬化變得不足的情形。 得知:若將進行2次固溶處理之情況與僅進行1次固 溶處理之情況的織構相比較,僅進行1次固溶處理之情況 其再結晶織構比進行2次固溶處理之情況要弱,(220 ) / (200 )比之值變大。為了得到強度與彎曲性的良好平衡, 較佳為除了關係式(1 )以外,以下述關係式(3 )取代關 係式(2 ): 30~ ( 220 ) }/{1/1〇 ( 200 ) 95 - · . (3) 更佳為 ’ {I/I〇 ( 220 ) ( 200 ) }為 40〜70, 更佳為{1/1。( 220) }/〇/][〇( 200 ) }為 40〜55。 10 201231690 &lt;用途&gt; 本實施形態之鋼合金可提供作為各種伸 板、條、管、棒、箔及線。可夢 、β °σ ' 精由加工本實施形態之銅合 金,而得到例如開關、連接器 子零件。 插孔鸲子、繼電器等電 &lt;製法&gt; 本實施形態之鋼合金的一個 德、的個特徵係’於最終固溶處理 拽^ ^ ^ ± 枓,皿度條件進行短時間的熱處 ^ 茭仔過向、時間過長,則於 之後的時效處理中對強产首纟 、 對強度貝獻不大的万,相或導致彎曲加工 性惡化的点相容易析出。又, 右熱處理時之材料溫度過低' 時間過短,則於時效處理中 · 容易變得不夠擴展。 目離相刀解而生成的調變結構 …右對固冷處理後的鈦鋼進行熱處理,則導電率會隨著 調變結構的擴展而上升, 开因此,退火之程度,可以進行退 火前後之導電率的變化作蛊 茭化作為扎標。若根據本發明人的研 九,較理想為熱處理為以導 等電率上升0.5〜8%IACS,更佳 為1〜4% I ACS的條件爽推γ 進仃。亦即’於此處較佳為以相對 於峰硬度小於90%的方放推也名 J乃式進仃熱處理。與該導電率上升對 應的具體熱處理條件為鉍Μ 干马材枓溫度300。(:以上、未達70(TC且 加熱0.001〜12小時的條件。 更具體而言,太營…At 實化形態之熱處理於鈦濃度(質量% ) 設為[Ti]之情形時,導雷 等電率之上升值C(% I ACS )可滿足以 下關係式(4 ): 11 201231690 〇·5 S CS ( - 0.50[Ti]2—0.50[Ti] + 14 ) · · · (4)。 若根據上述(4 )式’例如於Ti濃度為2.0質量。/。之情 形時,較理想為以使導電率上升0.5〜丨1%IACs的條件來進 行,於Τι濃度為3·0質量%之情形時,較理想為以使導電率 上升0.5〜8%IACS的條件來進行,於Ti濃度為4 〇質量% 之情形時,較理想為以使導電率上升〇 5〜4%IACS的條件 來進行。 本實施形態之熱處理,更佳係於鈦濃度(質量% )設 為m]之情形時,導電率之上升值c(%IAcs)滿足以下關 係式(5 ): K〇-C- ( °-25[Ti]2-3.75[Ti]+ 13) . . . (5) 〇 若根據上述(5) &lt;,例如於Ή濃度為2.0質量%之情 形時’較理想為以使導電率上升i Q〜6洲心的條件來 進灯於L遭度為3 〇質量%之情形時,較理想為以使導電 。率上^ .G〜4%IACS的條件來進行,於Ti濃度為* 〇質量 %之情形時,較理想為使導 件來進行。 &amp;導電丰上升i.Wcs的條 於最終固溶處理後之熱處理中進行使銅合金之 硬度成為峰值之時效時,導 ft〇/〇a4,, t 羊之差成為例如於Ti濃度2.ο 質置時上升13%IACS左右,於 10〇/〇IACS左右,於丁.也 、,又3.0%時上升 右於L濃度4.0%時上升 本實施形態之最終固溶 ACS左右。亦即, 、u命恩理後的熱處理, 值之時效,賦予鋼合金之熱量非常地小。起硬度成為峰 熱處理較伯 g ,、,τ, 爲以下逑任一條件進行。 12 201231690 時 •材料溫度在300〇C以上、未達40(TC,加熱0.5〜3小 小時 •材料溫度在40(TC以上、未達5〇(rc, 加熱0.01〜0·5 材料抛度在5〇〇C以上、未達6〇〇〇c,加〇 〇〇卜 〇·〇1小時。 材料,皿度在600 C以上、未達·^〇刪〜 〇·〇〇5小時。 又,熱處理更佳爲以下述任一條件進行。 時 材料皿度在350。(:以上、未達4〇(rc,加熱卜3小 時 •材料溫度在40(TC以上、未達45(rc, 加熱0.2〜0.5 加熱0.005 •材料溫度在5〇(TC以上、未達55〇t, 〇·〇1小時。 •材料溫度在55(rc以上、未達峨,加熱〇 〇〇1〜 ϋ·0〇5小時。 •材料溫度在60〇m、未達65〇t,加熱〇 〇〇25〜 〇·〇〇5小時。 以下,說明每個步驟之較佳實施形態。 1 )鑄錠製造步驟 *利用炫解及鱗造來進行的缚旋的製造,基本上是在真 二中或情性氣體環境中進行4料中殘留有添加元素, 不會有效地作用於提高強度。因此,爲了消除溶解殘留, 13 201231690 必須在添加Fe、Cr等高熔點添加元素後充分攪拌,然後保 持特定時間。另一方面,Ti由於比較容易溶在Cu中,因此 在第3元素群熔解之後添加即可,因此,於Cu中以含有合 计0〜0.2質量°/0的方式添加選自由Mn、Fe、Mg、Co、Ni、Ni, S!, Cr, V, Nb, Mo, Zr, B, and P can also be expected to have the same effect as Bu, and even if they are added alone, they can be expressed as Angu fruit, or two or more kinds can be added in combination. , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , : Health deterioration. At the same time, the coarse second phase particles will cause the bend to change: the raw sugar, and will promote the wear of the metal mold in the press working. Mn, Fe, MD °~〇_5 mass% are selected from the group consisting of Ni, Cr, v, Nb, Mo, Zr, Si, B&amp; P, which is composed of the third element group p. Kind or amount of %, more preferably A, more preferably contains 0~0.2 quality added more? It is preferably contained in an amount of 1.15% by mass. In contrast, it is broad, and although it is effective for the miniaturization of the titanium-copper crystal grain, the temperature is higher than the case where the temperature is not increased. Therefore, it is necessary to make the solid solution temperature in the case of solid solution of halogen. In the past, the solid solution was fully dissolved in 201231690, and after the first solution treatment at a high temperature for a relatively long period of time, the final @solution treatment was performed because the solution treatment was performed twice, resulting in a burden on the manufacturing steps. The situation of birth is low. In the present embodiment, the degree of (four) degrees in the steel is adjusted to 0 to 0.2% by mass, more preferably 〇.〇1 to 〇15% by mass, and the treatment temperature is lower than in the conventional state, once in the first time. The solution treatment simultaneously performs solid solution and recrystallization of the second element. Thereby, it is possible to realize a preferable process in which the amount of heat required for the production of titanium copper is less than that of the prior art, the processing time is short, the production efficiency is increased, and the mass production can be mass-produced. &lt;Integral intensity of X-ray diffraction&gt; Generally, the texture of the calendered surface after the solution treatment is higher in the group ratio of the (2〇〇) plane, and the rolling is caused by the rolling, and finally (22〇 The composition ratio of the surface becomes high. As a result of research by the present inventors, it has been found that in the manufacturing step of the present embodiment, that is, after the final solution treatment and the heat treatment before cold rolling, the previous step, that is, solution treatment-cold rolling-aging Since the modulation structure in the base material is expanded as compared with the manufacturing step of the treatment, the rotation of the (211) surface toward the (311) plane becomes difficult to occur. Therefore, the copper alloy of the present embodiment preferably has a X-ray diffraction intensity J of the calendering surface with respect to the (3 11 ) plane and the (200 ) plane when measuring the diffraction intensity (integral intensity) of the radiant ray of the calendering surface. The ratio of the χ-ray diffraction intensity of the pure copper powder (1/10) satisfies the following relation (1): {Ι/Ι〇(311) }/{Ι/Ι〇( 200 ) }$2·54· · (1) In the present invention, the 'pure copper standard powder system is defined as a copper powder having a purity of 99.5% of 325 mesh (JIS 28801). 9 201231690 {1/1〇(311)}/{1/ 10 ( 200 )} Better 〇5〇~2.〇〇, more preferably {I/I〇(311) }/{I/I 〇(2O0) } is 〇·8〇~1.75. When {Ι/Ι〇 ( 31 1 ) } / {Ι/ι〇 ( 200 ) } is larger than 2·54, there is a case where the strength (0.2% guaranteed stress) is weak and the bending workability is also deteriorated. The texture of beryllium copper is also affected by the processing rate of the final calendering step. In other words, if the rolling processing ratio is too large, the (220) surface is excessively expanded and the bending property is deteriorated. When the processing ratio is too low, the expansion of the (220) surface is insufficient and the strength is lowered. The titanium copper of the present embodiment is preferably subjected to a processing ratio of 5 to 40%, more preferably 1 to 30%. The texture of the calendering surface in this case is preferably a ratio of the X-ray diffraction intensity of the Χ-ray diffraction intensity I of the calendering surface to the pure copper powder of the (22 〇) plane and the (2 〇〇) plane (1). / 1〇) satisfies the following relation (2): 15$ Π〆1. ( 220 ) } / {1/ 10 ( 200 ) } $ 95 · · · ( 2). When {1/1 〇 ( 220 ) ( 200 ) } is less than 15, there is a case where the processing rate is lowered and the work hardening due to the rolling step becomes insufficient. It is found that when the solution treatment is performed twice, compared with the texture in the case where only one solution treatment is performed, the recrystallization texture ratio is subjected to the second solution treatment only when the solution treatment is performed once. The situation is weak, and (220) / (200) becomes larger than the value. In order to obtain a good balance between strength and flexibility, it is preferred to replace the relation (2) with the following relation (3) except for the relation (1): 30~(220)}/{1/1〇(200) 95 - · . (3) More preferably '{I/I〇( 220 ) ( 200 ) } is 40~70, more preferably {1/1. ( 220) }/〇/][〇( 200 ) } is 40~55. 10 201231690 &lt;Use&gt; The steel alloy of the present embodiment can be provided as various stretch plates, strips, tubes, rods, foils, and wires. Dreaming, β °σ 'fine processing of the copper alloy of the present embodiment, for example, a switch, a connector sub-part. Jack tweezers, relays, etc. <Production method> One of the characteristics of the steel alloy of the present embodiment is 'the final solution treatment 拽 ^ ^ ^ ± 枓, and the condition of the dish is subjected to a short time of heat ^ When the clams are over-traveled and the time is too long, in the subsequent aging treatment, the strong-yielding sputum, the tens of thousands of strengths, and the phase which causes the deterioration of the bending workability are easily precipitated. Moreover, the temperature of the material in the right heat treatment is too low. When the time is too short, it is easy to expand in the aging treatment. The modulation structure generated by the off-phase knife solution... The right heat treatment of the solid-cold titanium steel is performed, and the electrical conductivity increases with the expansion of the modulation structure. Therefore, the degree of annealing can be performed before and after annealing. The change in the rate is used as a standard. According to the research of the present inventors, it is preferable that the heat treatment is to increase the gamma concentration by 0.5 to 8% IACS, more preferably 1 to 4% I ACS. That is, it is preferable here that the heat treatment is carried out with a relative hardness of less than 90%. The specific heat treatment conditions corresponding to the increase in conductivity are 铋Μ dry horse 枓 temperature 300. (: Above, less than 70 (TC and heating for 0.001 to 12 hours. More specifically, Taiying...At heat treatment in the form of titanium in the case of titanium concentration (% by mass) is set to [Ti], The rising value of the isoelectric rate C (% I ACS ) satisfies the following relation (4): 11 201231690 〇·5 S CS ( - 0.50 [Ti] 2 - 0.50 [Ti] + 14 ) · · · (4). According to the above formula (4), for example, when the Ti concentration is 2.0 mass%, it is preferable to carry out the condition of increasing the conductivity by 0.5 to 丨1% IACs, and the concentration of Τι is 3.0% by mass. In the case of the case, it is preferable to carry out the condition that the conductivity is increased by 0.5 to 8% IACS, and in the case where the Ti concentration is 4 〇 mass%, it is preferable to increase the conductivity by 5 to 4% IACS. In the heat treatment of the present embodiment, when the titanium concentration (% by mass) is m], the increase in conductivity c (% IAcs) satisfies the following relation (5): K〇-C- ( °-25[Ti]2-3.75[Ti]+ 13) (5) If it is according to the above (5) &lt;, for example, when the concentration of cerium is 2.0% by mass, it is preferable to make it conductive. Rate rises i Q~ When the condition of the 6th heart is to enter the lamp at a temperature of 3 〇 mass%, it is preferable to carry out the condition of the electric conductivity at a rate of .G to 4% IACS, and the concentration of Ti is * 〇 mass%. In the case of the case, it is preferable to carry out the guide. &amp; Conductively increasing the i.Wcs strip in the heat treatment after the final solution treatment, when the hardness of the copper alloy is peaked, the lead ft / 〇 a4 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , In the final embodiment, the solid solution ACS is about the same, that is, the heat treatment after the u-energy treatment, and the aging of the value, the heat imparted to the steel alloy is extremely small. The hardness is the peak heat treatment, and the τ is the following. 2012 Any condition is carried out. 12 201231690 • Material temperature is above 300〇C, less than 40 (TC, heating for 0.5~3 hours • Material temperature is above 40 (TC, less than 5〇 (rc, heating 0.01~0) ·5 Material throwing is above 5〇〇C, less than 6〇〇〇c, plus 〇〇〇·〇·〇1 hour. Material, dish at 600 C The above is not reached. 〇 〇 〜 〇 〇〇 〇〇 〇〇 〇〇 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又 又Hour • Material temperature is above 40 (TC, less than 45 (rc, heating 0.2~0.5 heating 0.005 • Material temperature is 5 〇 (TC or more, less than 55 〇t, 〇·〇 1 hour). • The material temperature is above 55 (rc, less than rc, heating 〇〇〇1~ ϋ·0〇5 hours. • Material temperature is 60〇m, less than 65〇t, heating 〇〇〇25~ 〇·〇〇 5 hours. Hereinafter, a preferred embodiment of each step will be described. 1) Ingot manufacturing step * The manufacture of the anchoring by the dazzling and scale making is basically carried out in the true two or the emotional gas environment. The added elements remain in the 4 materials and do not effectively act to increase the strength. Therefore, in order to eliminate the dissolution residue, 13 201231690 must be thoroughly stirred after adding elements such as Fe and Cr, and then kept for a specific period of time. On the other hand, since Ti is relatively easily dissolved in Cu, it may be added after the third element group is melted. Therefore, it is added in a manner of containing 0 to 0.2 mass%/0 in Cu to be selected from Mn, Fe, and Mg. , Co, Ni,

Cr、V、Nb、Mo、Zr、Si、B及p所組成之群之i種或2 種以上的兀素,接著以含有2〇〜4 〇質量%的方式添加丁卜 來製造鑄錠。 2)均質化退火及熱壓延 此處,較佳為盡可能地消除凝固偏析或鱗造中所產生 的⑽BB物。其原@在於’為了在之後的固溶處理中,使第 Γ相粒^析出微細且均句地分散,且亦具有防止混粒的 效果。車父佳爲在鎮^ 2A. ah. ffBst _ ^ 裝知·步驟之後,加熱至900〜970 °C並 進行3〜24小時的的晳仆·ρ 的勺質化退火,然後實施熱壓延。爲了防 止液體金屬脆性,較佳爲 爲熟壓延刖及熱壓延中設在960〇C以 3 )第一固溶處理 其後,較佳為適當及费、任r ^ e ^ ^ _ 覆進仃冷壓延與退火後進行固溶 處理。具體而言,篦— °Γ » Η % - /合處理係將加熱溫度設爲850〜900 行2〜1 〇分鐘即可。 ^ ,, 較佳爲此時的升溫速度及冷 部迷厪極快以使第_如 又 7 添加量為O.Oi'O b '笫 兀素之 .•容處理,&lt;ϊή彳# 〇 、1。之情形時,由於可不經過第一固 命處理,而僅以最終固溶處 # Λ 4' ^ m 采進仃固溶與再結晶,故較 佳為4略第一固溶處理步驟。 4 )中間壓延 14 201231690 最後固溶處理前的中 溶處理中的第二相粒子越會=中的加工度越高’最後固 提高加工度來進行最後固、、容處^且微細地析出。但若過度 , ^ A: m ,處,則有時會使得再結晶織 構擴展’産生塑性異向枓 p 生知害加壓整形性。因此,中間 壓延的加工度較佳爲7〇〜 厂曰产膝&amp; ^厂 &quot;A。加工度係以ί ((壓延前的 乂子度一壓延後的厚度)/两 乂 墊I則的厚度)xlOO%}來定義。 5)最終固溶處理 於最終固溶處理A + 、 、銅δ金素材中存在由鑄造或中間 座延過程所生成之析㈣。因為此析出物有時阻礙彎曲性 及時效處理後之機械特性增加’故於最終固溶處理中,較 理想為於使銅合金素材中的析出物完全固溶之溫度下加熱 銅合金素材。'然而’若加熱至完全去除析出物,則析出物 所生成之粒界的釘♦丨对里,. 幻7扎效果(Pmnmg effect)消失,晶粒劇烈 粗大化。若晶粒劇烈粗大化,則有強度下降之傾向。 因此作為加熱溫度,係將固溶前的銅合金素材加熱 至第二相粒子組成的固溶限度附近的溫度。在Ti的添加量 爲2.: 4.G質量%的範圍,Ή的固溶限度成為與添加量相 。5 ’又(於本發明中稱為「固溶限溫度」)爲〜“Ο c = ’例如Ti的添加量爲質量%時爲刪。c左右。而 且右急逮加熱至該溫度,且亦加快冷卻速度,則粗大的第 才津子的産生會受到抑制。因此,較典型的是加熱至730 〜8 8 0 °Γ 夕 丁. 1之固溶限度變成與添加量相同之溫度以上,更 二型的疋加熱至比730〜880°c之Ti之固溶限度變成與添加 里相同之溫度高G〜2G°C之溫度,較佳為加熱至高0〜1〇。(: 15 201231690 之溫度。 為了抑制最終固溶處理中之粗大的第二相粒子之產 生’較佳為儘可能地急速進行銅合金素材的加熱及冷卻。 具體而έ ’於比第二相粒子組成的固溶限度附 ⑼〜5崎左右,較佳W15G〜5帆左右之環境中配^ 合金素材,藉此可進行急速加熱。冷卻亦可藉由水冷等來 進行。 6 )熱處理 熱處理的條件如上所 在最終固溶處理後進行熱處理 述 7 )最終冷壓延 β於上述退火後進行最終冷壓延。可藉由最終冷加工以 :高鈦銅的強度。此時,若加工度未達5%,則無法獲得充 义的效[因此較佳爲將加工度設在5%以上 '然而,若加 又過π則因晶粒之扁平所生成的加工應變變得比粒内 斤出所生成之晶格應變要大,彎曲加工性劣化。進—步因 :視而要而實施的時效處理或去應變退火容易引起粒界析 〜30:加:度設為卿°以下’較佳為5〜4〇%’更佳為1〇 0再更佳為15〜25 %。 8)時效處理 最、、冷壓延之後進行時效處理。效處理 常用的條件即可,伸甚盘^…α 條件爲 則可進-步提古強:: 地進行時效處理, .^ 同強度與彎曲加工性的平衡。具體而言,時 政處理較佳爲以材料 Ψ 何Ή酿度300〜400 C加熱3〜12小時的條 16 201231690 件來進行。再者,於不進行時效 時間較短(未逵” … 時效處理 達29(TC:H小時)的情況、時效處理溫度較低(未 於時效時門=況下,會有強度及導電率下降之情形。又, 文時間較長的情況(13丨時以上)、或時效 的情況“5rc以上),會有雖 ::“ 的情形。 守电手變同,但強度下降 時效處理更佳爲以下述任一條件進行。 時。·材料溫度在赠以上、未達36〇t,加熱5〜8小 •材料溫度在360T:以上 '未達38(rc,加熱卜7小 時。An ingot or a mixture of two or more kinds of halogen, which is composed of Cr, V, Nb, Mo, Zr, Si, B, and p, is then added in an amount of 2 to 4% by mass to produce an ingot. 2) Homogenization annealing and hot rolling Here, it is preferred to eliminate (10) BB which is generated in solidification segregation or scale formation as much as possible. In the subsequent solution treatment, the first ruthenium phase particles are finely dispersed and uniformly dispersed, and also have an effect of preventing mixing. The car father Jia Wei in the town ^ 2A. ah. ffBst _ ^ after the installation step, heated to 900 ~ 970 ° C and 3 to 24 hours of clear servant ρ scooping annealing, and then hot rolling . In order to prevent the brittleness of the liquid metal, it is preferably set at 960 ° C for the mature rolling calender and hot rolling, and 3) after the first solution treatment, preferably the appropriate cost, or r ^ e ^ ^ _ The solution treatment is carried out after cold rolling and annealing. Specifically, 篦- °Γ » Η % - / combined processing system sets the heating temperature to 850~900 lines for 2~1 〇 minutes. ^ , , It is better to increase the temperature and the cold part at this time so that the amount of the first and the seventh is O.Oi'O b '笫兀素.•容处理,&lt;ϊή彳# 〇 ,1. In the case of the first solid solution treatment step, since the solid solution and recrystallization are carried out only at the final solid solution point Λ 4' ^ m. 4) Intermediate rolling 14 201231690 The second phase particles in the intermediate solution treatment before the final solution treatment will have a higher degree of processing. The final solidification improves the degree of processing, and the final solid, the contents are finely precipitated. However, if it is excessive, ^ A: m , it will sometimes cause the recrystallized texture to expand to produce plastic anisotropy. Therefore, the processing degree of the intermediate calendering is preferably 7 〇 曰 曰 曰 曰 & & & & & ^ ^ ^ ^ ^ ^ ^. The degree of processing is defined by ί ((thickness after rolling, thickness after rolling) / thickness of two 垫 pad I) xlOO%}. 5) Final solution treatment There is analysis (4) generated by the casting or intermediate seating process in the final solution treatment A + , copper δ gold material. Since the precipitate sometimes hinders the bending property and the mechanical property after the treatment is increased, it is preferable to heat the copper alloy material at a temperature at which the precipitate in the copper alloy material is completely dissolved in the final solution treatment. 'However', if heated to completely remove the precipitates, the pmnmg effect of the grain boundary formed by the precipitates disappears, and the crystal grains are greatly coarsened. If the crystal grains are greatly coarsened, the strength tends to decrease. Therefore, as the heating temperature, the copper alloy material before solid solution is heated to a temperature near the solid solution limit of the composition of the second phase particles. The amount of addition of Ti is in the range of 2.: 4.G mass%, and the solid solution limit of ruthenium is in the amount of addition. 5' (also referred to as "solid solubility limit temperature" in the present invention) is "Ο c = ', for example, when the amount of addition of Ti is mass%, it is about c. and the right is caught and heated to the temperature, and When the cooling rate is increased, the production of the coarse ginseng will be suppressed. Therefore, it is more typical to heat up to 730 ~ 8 8 0 ° Γ 丁 .. The solid solution limit becomes the same as the added amount, and The second type of ruthenium is heated to a temperature of 730 to 880 ° C. The solid solution limit becomes the same as the temperature at the temperature of G to 2 G ° C, preferably to a temperature of 0 to 1 〇. (: 15 201231690 In order to suppress the generation of coarse second phase particles in the final solution treatment, it is preferable to rapidly heat and cool the copper alloy material as much as possible. Specifically, the solid solution limit of the composition of the second phase particles is attached. (9) ~5 saki, preferably in the environment of W15G~5 sails, the alloy material can be used for rapid heating. Cooling can also be carried out by water cooling, etc. 6) The heat treatment heat treatment conditions are as above. After heat treatment, 7) final cold rolling β After the above annealing, the final cold rolling is performed. The final cold working can be carried out to: the strength of the high titanium copper. At this time, if the degree of processing is less than 5%, the effect of the charge cannot be obtained [therefore, it is preferable to set the workability to 5 % or more 'However, if π is added, the processing strain generated by the flatness of the crystal grains becomes larger than the lattice strain generated by the intragranular pulverization, and the bending workability is deteriorated. The aging treatment or strain relief annealing is likely to cause grain boundary analysis~30: addition: the degree is set to less than qing, preferably 5 to 4%%, more preferably 1 〇 0, and even more preferably 15 to 25%. Aging treatment, aging treatment after cold rolling. The usual conditions can be used for the treatment. In particular, the current treatment is preferably carried out with a material of 300 to 400 C for 3 to 12 hours of strips of 201231690 pieces. Furthermore, the aging time is short (unsuccessful) ” ... aging treatment up to 29 (TC: H hours), aging treatment temperature is low (not In the case of aging time, there is a case where the strength and the electrical conductivity are lowered. Moreover, in the case of a long time (above 13 hrs) or the case of aging (5 rc or more), there may be a case of ":" The power-saving hand is the same, but the strength reduction aging treatment is better under any of the following conditions. · The material temperature is above the gift, less than 36〇t, heating 5~8 small•Material temperature is above 360T: Not up to 38 (rc, heating b for 7 hours.

•材料溫度在38(TC以上、未達4〇(rc,加熱3 時。 J 時效處理再更佳爲以下述任一條件進行。 •材料溫度在3401以上、未達36(rc,加熱6〜 時。 •材料溫度在360°C以上、未達3贼,加熱5〜6 •材料溫度在38(TC以上、未達4〇(rc,加熱4〜6小 時。 再者,本領域技術人員應可理解,可在上述各步驟之 間適田地進行用以除去表面氧化銹皮之磨削、研磨、珠粒 喷擊酸洗等步驟。 [實施例] s 17 201231690 以下一併表示本發明之實施例及比較例,但該等實施 例係為增進理解本發明及其優點而提供者,並非欲限定發 明。 製造本發明例之銅合金時,由於將活性金屬Ti作為第 2成分而添加,因此於熔製時使用真空熔解爐。又,為避免 由於混入本發明中規定之元素以外之雜質元素而產生預想 外之副作用,原料係嚴格挑選純度比較高者來使用。 對具有下述組成的鑄錠進行以95〇〇c加熱3小時之均質 化退火後,以900〜95CTC進行熱壓延,而得到板厚為1〇mm 之熱壓延板,該铸鍵係具有:將表i之第3元素視需要添 ; 後添加表1之濃度的Ti,剩餘部份由銅及不可避 免的雜質之組成。進行利用端面切削之消除鎮皮後,進行 冷壓延而形成條料的板厚(i 5_ ),視需要(根據第3元 素的添加量)進行條料狀態下的第一次固溶處理。第一次 固溶處理之條件係設為於85代加熱75分鐘。接著,於中 間之冷壓延中’以使最終板厚達到Q25mm 延而調整中間之柘卢尨, ^ ^ 7 ^ 而…1 於可進行迅速加熱的退火爐 而進订最終固溶處理,之後, 灸用水冷部。此時的加熱條件 係叹為.材料溫度係以Ti 的-度(Tl漠度為3.2質量%時約 吁 量0/。時約73(TC,Ti澶声Α Τι浪度為2.0質 /又為4·〇質量%時約84〇°c)在其! 以Ti之固溶限度變成與添 40c)為基準’ 件的方式,以表i n之W〜之條 接著n… 別保持1分鐘。• The material temperature is 38 (TC or more, less than 4 〇 (rc, heating 3). J aging treatment is more preferably carried out under any of the following conditions. • The material temperature is above 3401, not up to 36 (rc, heating 6~) • Material temperature above 360 ° C, less than 3 thieves, heating 5 ~ 6 • Material temperature is 38 (TC or more, less than 4 〇 (rc, heating 4 to 6 hours. Furthermore, those skilled in the art should It is to be understood that steps such as grinding, polishing, bead blasting, and the like for removing surface rust scales may be performed in an appropriate manner between the above steps. [Examples] s 17 201231690 The following shows the practice of the present invention. The examples and the comparative examples are provided to enhance the understanding of the present invention and its advantages, and are not intended to limit the invention. When the copper alloy of the present invention is produced, since the active metal Ti is added as the second component, In the case of melting, a vacuum melting furnace is used. Further, in order to avoid the occurrence of unexpected side effects due to the incorporation of impurity elements other than the elements specified in the present invention, the raw materials are strictly selected for use with higher purity. Ingots are carried out at 95〇 c, after heating for 3 hours, homogenization annealing, hot rolling at 900~95 CTC, to obtain a hot rolled sheet having a thickness of 1 〇 mm, the cast bond system having: adding the third element of the table i as needed; Ti is added at the concentration of Table 1, and the remainder is composed of copper and unavoidable impurities. After the skin is removed by the end face cutting, cold rolling is performed to form the thickness of the strip (i 5_ ), as needed ( The first solution treatment in the strip state is carried out according to the amount of addition of the third element. The conditions of the first solution treatment are set to be heated for 75 minutes in the 85th generation. Then, in the middle of the cold rolling, The final plate thickness reaches Q25mm and the middle of the adjustment is 柘Lu尨, ^ ^ 7 ^ and...1 The final solution treatment is carried out in an annealing furnace that can be heated rapidly, and then the moxibustion water is cooled. The heating condition at this time is Sigh. The temperature of the material is Ti-degree (Tl desert is 3.2% by mass when the amount is about 0/. When it is about 73 (TC, Ti澶 Α Τ ι is 2.0 mass / 4 〇 mass%) At about 84 〇 ° c) in it! The solid solution limit of Ti becomes the basis of the addition of 40c) as a reference to the table in the form of W~ Articles Next n... Don't keep it for 1 minute.

^根據试驗片以表1斛#讲A 斤。•己載的條件進行冷壓延後, 18 201231690 於Ar環境中以表1所記載的條件進行熱處理。進行利用酸 洗之脫銹皮後,以表1所記載的條件進行最終冷壓延,最 後以表1所記載的各加熱條件進行時效處理,而製成實施 例及比較例的試驗片。 19 201231690 [表i] NO. 合金成份 製造步驟 Ti 第3 元素 第一 固溶 處理 最终固溶 處理 熱處理 冷壓 延 時效處理 (wt%) (wt%) 溫度 (°C) 時間 ⑻ 溫度 (°C) 時間 (h) 熱處理前後之 EC差 (%IACS) 加工 度(%) 溫度 (°C) 時間 ⑴ 比 較 例 1 3.2 0 - 800 1 — - 0 25 400 6 2 3.2 0.0 IFe — 805 1 一 - 0 25 400 6 3 3.2 0.15Fe — 810 — - 0 25 400 6 4 3.2 0.17Fe ~ 815 - - 0 25 400 6 5 2.9 0.17Fe - 805 - - 0 25 400 6 6 3.2 0 850 〇C7.5 分鐘 800 1 — - 0 25 400 6 7 3.2 0.04Fe 850 〇C7.5 分鐘 805 - - 0 25 400 6 8 3.2 0.09Fe 850 °C 7.5. 分鐘 810 — — 0 25 400 6 9 3.2 0.13Fe 850 〇C7.5 分鐘 815 — - 0 25 400 6 10 2.9 0.17Fe 850 〇C7.5 分鐘 805 - - 0 25 400 6 11:: 3.2 0.06Fe — 805 500 0,01 4 1 350 6 12ί 3.2 0.06Fe — 805 1 500 0.01 4 50 350 6 3.2 :v-o ! — n8Q5‘。 Ά1Λ: C:450/r .5 . • 9, 20 400 0.0167 實 施 例 1 3.2 0 — 820 500 0.01 4 25 350 6 2 3.2 O.OlFe — 805 500 0.01 4 25 350 6 3 3.2 0.15Fe - 810 1 500 0.01 3 25 350 6 4 3.2 0.20Fe 850 &quot;C7.5 分鐘 820 1 550 0.006 4 25 350 6 3.2 O.OSFe - 805 I 500 0.01 4 25 350 6 2.0 0.08Fe - 750 1 450 0.1 6 25 350 6 _丨 4.0 0.08Fe — 850 1 600 0.003 4 25 350 6 3.2 0.08Fe — 805 1 500 0.01 4 5 350 6 鑛 3.2 0.08Fe — 805 500 0.01 4 40 350 6 _ m 3.2 O.OlCo O.OINi O.OlCr 0.01V O.OlNb O.OlMo — 810 1 550 0.006 5 25 350 6 攀 Φ 論 3.2 O.OIMn O.OlZr O.OlSi O.OlMg 0.01B 0.01P — 810 1 550 0.006 4 25 350 6 利用以下之條件對所獲得之各試驗片進行特性評價。 20 201231690 將結果示於表2。 〈強度〉 以拉伸方向與壓延方向平行的方式’使用加壓機製作^ According to the test piece to Table 1 斛 # speak A kg. • After the cold rolling is carried out under the conditions of the load, 18 201231690 is heat-treated under the conditions described in Table 1 in the Ar environment. After the derusting by pickling, the final cold rolling was carried out under the conditions shown in Table 1, and finally subjected to aging treatment under the respective heating conditions shown in Table 1, to prepare test pieces of the examples and the comparative examples. 19 201231690 [Table i] NO. Alloy composition manufacturing step Ti Element 3 First solution treatment Final solution treatment Heat treatment Cold pressure delay treatment (wt%) (wt%) Temperature (°C) Time (8) Temperature (°C) Time (h) EC difference before and after heat treatment (%IACS) Processability (%) Temperature (°C) Time (1) Comparative Example 1 3.2 0 - 800 1 — - 0 25 400 6 2 3.2 0.0 IFe — 805 1 A - 0 25 400 6 3 3.2 0.15Fe — 810 — — 0 25 400 6 4 3.2 0.17Fe ~ 815 - - 0 25 400 6 5 2.9 0.17Fe - 805 - - 0 25 400 6 6 3.2 0 850 〇C7.5 minutes 800 1 — - 0 25 400 6 7 3.2 0.04Fe 850 〇C7.5 minutes 805 - - 0 25 400 6 8 3.2 0.09Fe 850 °C 7.5. Minute 810 — — 0 25 400 6 9 3.2 0.13Fe 850 〇C7.5 minutes 815 — — 0 25 400 6 10 2.9 0.17Fe 850 〇C7.5 minutes 805 - - 0 25 400 6 11:: 3.2 0.06Fe — 805 500 0,01 4 1 350 6 12ί 3.2 0.06Fe — 805 1 500 0.01 4 50 350 6 3.2 : vo ! — n8Q5'. Ά1Λ: C:450/r .5 . • 9, 20 400 0.0167 Example 1 3.2 0 — 820 500 0.01 4 25 350 6 2 3.2 O.OlFe — 805 500 0.01 4 25 350 6 3 3.2 0.15Fe - 810 1 500 0.01 3 25 350 6 4 3.2 0.20Fe 850 &quot;C7.5 minutes 820 1 550 0.006 4 25 350 6 3.2 O.OSFe - 805 I 500 0.01 4 25 350 6 2.0 0.08Fe - 750 1 450 0.1 6 25 350 6 _丨4.0 0.08Fe — 850 1 600 0.003 4 25 350 6 3.2 0.08Fe — 805 1 500 0.01 4 5 350 6 Mine 3.2 0.08Fe — 805 500 0.01 4 40 350 6 _ m 3.2 O.OlCo O.OINi O.OlCr 0.01 V O.OlNb O.OlMo — 810 1 550 0.006 5 25 350 6 Climbing Φ Theory 3.2 O.OIMn O.OlZr O.OlSi O.OlMg 0.01B 0.01P — 810 1 550 0.006 4 25 350 6 Use the following conditions Each of the obtained test pieces was subjected to characteristic evaluation. 20 201231690 The results are shown in Table 2. <Strength> Made by a press machine in a manner in which the stretching direction is parallel to the rolling direction

Si : ί:二:依照爪—Z2241對該測試片進行拉伸測 、 延平仃方向的〇·2%保證應力(γδ)。 〈彎曲加工性〉 依照m H 3U0,測定進行Badway (f曲袖與壓延方 向爲同方向)的w冑曲測試而不産生裂縫的最小半徑 (MBR )相對於板厚(t )的比即MBR/ t值。 〈導電率〉 根據JIS Η 0505,以4端子法測定導電率(Ec · %IACS) 〇 * &lt;結晶方位&gt; .針對各試驗片,使用理學電機公司製造之型號為 Ultima 2000之x射線繞射裝置,於以下之 壓延面之繞射強度曲線,並測定(mi结晶面、(下二 結阳面、(220 )結晶面、(3丨丨)結晶面的χ射線繞射強 度(積分值)h於相同之測定條件下,亦針對純銅粉標準 忒樣求出對於(i i i )結晶面、(2〇〇 )結晶面、(22〇 )結 晶面、(311)結晶面的X射線繞射強度(積分值)^。分 另 J。十算 I/IoOn)」/!〇() (311 )、並求出 〇/!〇 ( 311 ) } / {工/1〇 ( 2〇〇) }及{】/工〇 (220 ) }/ {1/1〇 ( 200 ) }。 •靶:Cu管球 21 201231690 min •管電壓:40kV •管電流:40mA •掃描速度:5 ° / •取樣寬度:0.02 22 201231690 [表2] NO. U/I〇( 3 11)}/{l/I〇( 2〇〇 )} {I/I〇( 220 )}/{I/I〇( 2〇〇)j 弩曲 比較例 * 實施例Si : ί: 2: According to the claw-Z2241, the test piece was subjected to tensile measurement, and the 2·2% guaranteed stress (γδ) in the direction of the flattening direction was obtained. <Bending workability> According to m H 3U0, the ratio of the minimum radius (MBR) to the plate thickness (t) which is the ratio of the minimum radius (MBR) of the Badway (f-sleeve and the rolling direction in the same direction) without the crack is measured. /t value. <Electrical conductivity> According to JIS Η 0505, the conductivity (Ec · % IACS) 〇 * &lt; crystal orientation &gt; was measured by the 4-terminal method. For each test piece, an x-ray winding of Ultima 2000 model manufactured by Rigaku Electric Co., Ltd. was used. The diffraction intensity curve of the firing device on the following calendering surface, and the diffraction intensity (integral value) of the 结晶 ray of the crystal surface of the mi crystal surface, the lower surface, the (220) crystal surface, and the (3 丨丨) crystal surface h Under the same measurement conditions, the X-ray diffraction intensity for (iii) crystal plane, (2〇〇) crystal plane, (22〇) crystal plane, and (311) crystal plane was also determined for the pure copper powder standard sample. (Integral value) ^. Divide another J. Ten count I/IoOn)"/!〇() (311), and find 〇/!〇( 311 ) } / {工/1〇( 2〇〇) } and {]/Working (220) }/ {1/1〇( 200 ) }. • Target: Cu tube 21 201231690 min • Tube voltage: 40kV • Tube current: 40mA • Scanning speed: 5 ° / • Sampling width: 0.02 22 201231690 [Table 2] NO. U/I〇( 3 11)}/{l/I〇( 2〇〇)} {I/I〇( 220 )}/{I/I〇( 2〇〇) j Distortion comparison example* Example

&lt;考察&gt; 比較例1〜5係表示將第3元素的添加元素設為〇〜〇 n 質s %,且不進行第一固溶處理,僅進行1次最終固溶處 乂最、’冬固溶處理—冷壓延—時效處理之先前的順序 力口以劁批+也 , ^ 之情形的例子。於比較例1〜5中,無法得到充八 的強度。 刀 較例6〜10係表示將第3元素的添加元素設為〇〜 〇 · 1 7 質.g 〇 /() ’且進行兩階段的固溶處理(第一固溶處理及# s固溶處理彳 ^ _ 至)’以最終固溶處理—冷壓延—時效處理之头 别的順序來λ &amp; 九 水加以製造之情形的例子。於比較例5〜1 〇中’ 維然寿曲性拗t A增加,但無法得到充分的強度。 23 201231690 比軼例11係表示於以最終固溶處理—熱處理—冷壓延 寺效處理之順序來加以製造之情形t,冷壓延時的加工 度過低之情开4 Μ 7 的例子。於比較例1丨中,因為加工度過低, 故無法得到充分的強度。 比較例12係表示於以最終固溶處理—熱處理—冷壓延 —時效處理之順序來加以製造之情形中,㈣延時的加工 度過高之情形的例子。於比較例12中,雖然可得到充分的 強度,但因為加工度過高,故彎曲性劣化。 比較例13係表示於以最終固溶處理—熱處理—冷壓延 -時效處理之順序來加以製造之情形中,以使鈦銅的硬度 接近峰值之條峰值時效條件)來進行最終固溶處理, 進一步,以極短時間進行最終時效處理之情形的例子。於 比較例U中’因為將固溶後之熱處理設為峰值附近,故粗 大的穩定相析出,且‘弯曲性劣化。 若與比較例卜u相比,可得知實施例卜&quot;&amp;μ 與彎曲加工性平衡佳地增加。 【圖式簡單說明】 無 【主要元件符號說明】 無 24&lt;Exploration&gt; Comparative Examples 1 to 5 show that the additive element of the third element is 〇~〇n s %, and the first solution treatment is not performed, and only the final solid solution is performed once, ' Winter solid solution treatment - cold calendering - the previous sequence of aging treatments is an example of the case of 劁 batch + also, ^. In Comparative Examples 1 to 5, the strength of the filling was not obtained. The knives of Examples 6 to 10 indicate that the additive element of the third element is 〇~ 〇·1 7 ..g 〇/() ' and the two-stage solution treatment (first solution treatment and # s solid solution) An example of the case where 彳^ _ to ) ' is manufactured by λ &amp; Jiu Shui in the order of the final solution treatment - cold calendering - aging treatment. In Comparative Example 5 to 1 ’, the viability of 寿t A increased, but sufficient strength could not be obtained. 23 201231690 Example 11 is shown in the case of the final solution treatment-heat treatment-cold calendering process, and the case where the cold press delay is too low is 4 Μ 7 . In Comparative Example 1, since the degree of processing was too low, sufficient strength could not be obtained. Comparative Example 12 shows an example in which (4) the processing of the time delay is too high in the case of being manufactured in the order of the final solution treatment-heat treatment-cold calendering-aging treatment. In Comparative Example 12, although sufficient strength was obtained, the degree of workability was too high, so that the flexibility was deteriorated. Comparative Example 13 shows that in the case of the final solution treatment-heat treatment-cold calendering-aging treatment, the final solution treatment is carried out in such a manner that the hardness of the titanium copper is close to the peak peak aging condition). An example of a situation in which final aging treatment is performed in a very short time. In Comparative Example U, since the heat treatment after solid solution was set to the vicinity of the peak, a coarse stable phase was precipitated, and "the bendability was deteriorated. As compared with the comparative example, it can be seen that the balance between the embodiment &quot;&amp; μ and bending workability is preferably improved. [Simple description of the diagram] None [Key component symbol description] None 24

Claims (1)

201231690 七、申請專利範圍: 1. 一種銅合金,其含有2.0〜4.0質量%之Ti,並含有合 計 0〜0.2 質量 %之選自由 Mn、Fe、Mg、Co、Ni、Cr、V、 Nb、Mo、Zr、Si、B及P構成之群中之i種或2種以上的 元素作為第3元素’剩餘部份由銅及不可避免之雜質所構 成;於測定壓延面之X射線繞射強度時, 壓延面之X射線繞射強度I相對於(3 11 )面及(2〇〇 ) 面中之純銅粉末的X射線繞射強度1〇之比(1/ 1〇 )滿足以 下關係式(1 ): {Ι/Ι〇(311) }/{Ι/Ι0 ( 200 ) }$2.54· · · (1) 且, 壓延面之X射線繞射強度I相對於(220 )面及(200 ) 面中之純銅粉末的X射線繞射強度I 〇之比(I / I 〇 )滿足以 下關係式(2 ): 15${1/1〇( 220 )}/{1/1〇(20〇)}$95· · · (2)。 2.—種銅合金’其含有2.0〜4.0質量%之Ti,並含有合 計 0.01 〜0.15 質量%之選自由 Mn、Fe、Mg、Co、Ni、〇、 V、Nb、Mo、Zr、Si、B及P構成之群中之1種或2種以上 的元素作為第3元素,剩餘部份由銅及不可避免之雜質所 構成;於測定壓延面之X射線繞射強度時, 壓延面之X射線繞射強度I相對於(3丨丨)面及(2〇〇 ) 面中之純銅粉末的X射線繞射強度1〇之比(丨/ 1())滿足以 下關係式(1 ): {1/1〇 ( 311 )}/{1/1〇 ( 200 ) 2.54 - · · (1) — 25 201231690 且, 壓延面之X射線繞射強度I相對於(220)面及(200) 面中之純銅粉末的X射線繞射強度1〇之比(I〆“)滿足以 下關係式(3 ): 3〇SU/I0 ( 220 )}/{I/I0(20〇)}$95. · · (3)。 3. —種伸鋼品,其係由申請專利範圍第1或2項之銅合 金所構成。 4. 一種電子零件,其係由申請專利範圍第1或2項之銅 合金所構成。 5. 一種連接器,其具備有申請專利範圍第丨或2項之銅 合金。 6. 種申睛專利範圍第1或2項之銅合金之製造方法, 其含有如下步驟: 對含有2.0〜4.0質量%之Ti,並含有合計〇〜〇2質量 %之選自由 Mn、Fe、Mg、Co、Ni、Cr、V、Nb、Mo、Zr、 Si、B及P所構成之群中之i種或2種以上的元素作為第3 元素,剩餘部分由銅及不可避免之雜質所構成之銅合金素 材,進行加熱至比在730〜88(rCR Ti之固溶限度變成與添 加量相同的固溶限溫度高〇〜2(rc之溫度,然後加以急冷的 固溶處理; 於固溶處理後’進行熱處理; 於熱處理後,進行加工率為5〜4〇%之最終冷壓延; 於最終冷壓延後,進行時效處理。 7. 如申請專利範圍第6項之銅合金之製造方法,該熱處 26 201231690 理包含進行下述熱處理: 於將鈦濃度(質量% )設為[Ti]之情形時,以導電率之 上升值C ( % IACS )滿足以下關係式(4): 0.5S CS ( - 0.50[Ti]2- 0.50[Ti]+ 14) · · · (4) 的方式,使導電率上升。 27201231690 VII. Patent application scope: 1. A copper alloy containing 2.0 to 4.0% by mass of Ti and containing a total of 0 to 0.2% by mass selected from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, One or two or more elements of the group consisting of Mo, Zr, Si, B, and P are used as the third element 'the remainder is composed of copper and unavoidable impurities; and the X-ray diffraction intensity of the rolled surface is measured. The X-ray diffraction intensity I of the calendering surface satisfies the following relationship (1/1〇) with respect to the X-ray diffraction intensity (1/1〇) of the pure copper powder in the (3 11 ) plane and the (2〇〇) plane ( 1): {Ι/Ι〇(311) }/{Ι/Ι0 ( 200 ) }$2.54· · · (1) Moreover, the X-ray diffraction intensity I of the calendering surface is relative to the (220) plane and the (200) plane The ratio of the X-ray diffraction intensity I 〇 of the pure copper powder in the middle (I / I 〇) satisfies the following relation (2): 15${1/1〇( 220 )}/{1/1〇(20〇)} $95· · · (2). 2. A copper alloy which contains 2.0 to 4.0% by mass of Ti and contains 0.01 to 0.15 mass% in total selected from the group consisting of Mn, Fe, Mg, Co, Ni, Niobium, V, Nb, Mo, Zr, Si, One or two or more elements of the group consisting of B and P are used as the third element, and the remainder is composed of copper and unavoidable impurities. When measuring the X-ray diffraction intensity of the calendering surface, the X of the calendering surface The ratio of the X-ray diffraction intensity of the ray diffraction intensity I to the pure copper powder in the (3 丨丨) plane and the (2 〇〇) plane (〇 / 1()) satisfies the following relation (1): 1/1〇( 311 )}/{1/1〇( 200 ) 2.54 - · · (1) — 25 201231690 Moreover, the X-ray diffraction intensity I of the calendering surface is relative to the (220) plane and the (200) plane The X-ray diffraction intensity ratio of the pure copper powder (I〆") satisfies the following relation (3): 3〇SU/I0 (220 )}/{I/I0(20〇)}$95. · · ( 3) 3. A steel-stretching product consisting of a copper alloy of the first or second patent application scope. 4. An electronic component consisting of a copper alloy of claim 1 or 2. 5. A connector having There is a copper alloy of the second or second application of the patent scope. 6. A method for producing a copper alloy according to claim 1 or 2, which comprises the following steps: containing 2.0 to 4.0% by mass of Ti, and containing the total 〇~〇2% by mass of one or two or more elements selected from the group consisting of Mn, Fe, Mg, Co, Ni, Cr, V, Nb, Mo, Zr, Si, B, and P as the first 3 elements, the remaining part of the copper alloy material consisting of copper and unavoidable impurities, heated to a ratio of 730~88 (rCR Ti solid solution limit becomes the same as the solid solution limit temperature of the addition amount ~ 2 (rc The temperature is then subjected to quenching solution treatment; after the solution treatment, the heat treatment is performed; after the heat treatment, the final cold rolling is carried out at a processing rate of 5 to 4%; and after the final cold rolling, the aging treatment is carried out. According to the method for producing a copper alloy according to claim 6, the heat treatment 26 201231690 includes the following heat treatment: when the titanium concentration (% by mass) is set to [Ti], the rise value of the conductivity C ( % IACS ) satisfies the following relation (4): 0.5S CS ( - 0. 50[Ti]2- 0.50[Ti]+ 14) · · · (4) The way the conductivity is increased.
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