201228578 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明涉及一種散熱器，特別涉及一種用於對電子元件 散熱的散熱器及其製造方法。 【先前技術】 [0002] 隨著電子資訊業的迅速發展，微處理晶片等發熱電子元 件產生的熱量愈來愈多，為了將該等熱量散發出去以保 障電子元件的正常運行，業界通常採用在電子元件上貼 設一散熱器以對該發熱電子元件進行散熱。 [0003] 習知的散熱器通常包括一基板以及設於該基板上的複數 散熱鰭片。每一散熱鰭片包括一本體及從該本體的兩側 分別向同一方向彎折的折邊。所述散熱鰭片沿基板的縱 向依次排列，每一散熱鰭片的折邊的末端與相鄰散熱鰭 片的本體相互接觸，於該散熱器的頂端及底端分別形成 一結合面。該基板與發熱電子元件接觸，所述散熱鰭片 通過錫焊方式焊接至基板上，在錫焊過程中，需要添加 焊料以及助焊劑，尤其在不同材料的焊接過程中，如鋁 與銅焊接，還需進行鍍鎳或其他特殊處理，工序較為複 雜且成本兩。 【發明内容】 [0004] 有鑒於此，實有必要提供一種具有較低成本且組裝方便 的散熱器及其製造方法。 [0005] 一種散熱器，其包括一基座及設於該基座上的一散熱鰭 片組，所述基座上設有兩個間隔設置的固定部，每一固 定部包括由該基座向上延伸的一凸台及由該凸台於靠近 099145974 表單編號A0101 第4頁/共17頁 0992079106-0 201228578 另一凸台的一側向另一凸台的方向延伸的—抵靠部，該 抵靠部與凸台及所述基座之間圍成一凹槽，所述抵靠部 上設有一溝槽，所述散熱鰭片組的相對兩側各設有一突 出部，該散熱鰭片組通過將所述突出部收容於該基座的 凹槽内並抵壓該抵靠部的溝槽位置而裝設至該基座上。 [0006] Cl [0007] Q [0008] [0009] [0010] 一種散熱器的製造方法，包括如下步驟：提供一基座， 該基座上設有兩個間隔設置的固定部，每一固定部包括 由該基座向上延伸的一凸台及由該凸台於靠近另—凸台 的一側向另一凸台的方向延伸的一抵靠部，該抵靠部與 ώ台及所述基座之間圍成凹槽》所述抵靠部上設有一 溝槽；提供一散熱鰭片組，所述散熱鰭片組的相對兩側 各設有一突出部；將所述突虫部收容於該基產的凹槽内 並通過一治具施壓該抵靠部的溝槽位置而將該散熱鰭片 組裝設至該基座上。 與習知技術相比，該散熱器的散秦轉片組通過將所述突 出部收容於該基座的回槽内並抵；堅該抵靠部的溝槽位置 - l·.. ; 而裝設至該基座上’製作簡單’並可以使二者間無需塗 設焊錫即可達成緊密而穩固的結合，從而節約成本且環 保。 【實施方式】 下面參照附圖結合實施例對本發明作進一步的描述。 如圖1所示’該散熱器10包括一基座12及設於該基座12上 的一散熱縛片組16。 請同時參閱圖2 ’該基座12大致為矩形板狀，其包括一平 099145974201228578 VI. Description of the Invention: [Technical Field] The present invention relates to a heat sink, and more particularly to a heat sink for dissipating heat from an electronic component and a method of manufacturing the same. [Prior Art] [0002] With the rapid development of the electronic information industry, heat generated by heat-generating electronic components such as micro-processing wafers is increasing. In order to dissipate such heat to ensure the normal operation of electronic components, the industry generally adopts A heat sink is attached to the electronic component to dissipate heat from the heat-generating electronic component. [0003] A conventional heat sink generally includes a substrate and a plurality of heat dissipation fins disposed on the substrate. Each of the heat dissipation fins includes a body and a flange that is bent in the same direction from both sides of the body. The heat dissipating fins are sequentially arranged along the longitudinal direction of the substrate, and the ends of the folded edges of each of the heat dissipating fins are in contact with the body of the adjacent heat dissipating fins, and a joint surface is formed at the top end and the bottom end of the heat sink, respectively. The substrate is in contact with the heat-generating electronic component, and the heat-dissipating fin is soldered to the substrate by soldering. In the soldering process, solder and flux are added, especially in the welding process of different materials, such as aluminum and copper. Nickel plating or other special treatment is also required, which is complicated and costly. SUMMARY OF THE INVENTION [0004] In view of the above, it is necessary to provide a heat sink having a low cost and easy assembly and a method of manufacturing the same. [0005] A heat sink includes a base and a heat dissipating fin set disposed on the base, and the base is provided with two spaced fixing portions, each fixing portion including the base a boss extending upwardly and abutting portion extending from the side of the other boss to the direction of the other boss by the boss near 099145974 Form No. A0101 Page 4 / 17 pages 0992079106-0 201228578 a recess is formed between the abutting portion and the boss and the base, and a groove is formed on the abutting portion, and a protruding portion is disposed on each of opposite sides of the heat dissipating fin group, the heat dissipating fin The set is mounted to the base by receiving the projection in a recess of the base and pressing the groove position of the abutment. [0006] Q [0008] [0009] [0010] A method of manufacturing a heat sink, comprising the steps of: providing a base, the base is provided with two spaced-apart fixing portions, each fixed The portion includes a boss extending upward from the base and an abutting portion extending from a side of the boss adjacent to the other boss to the other boss, the abutting portion and the platform and the a groove is formed between the bases; a groove is formed on the abutting portion; a heat dissipation fin group is provided, and a protruding portion is disposed on each of opposite sides of the heat dissipation fin group; The heat dissipating fins are assembled to the pedestal in the recess of the base product and by a jig to press the groove position of the abutting portion. Compared with the prior art, the sun-transfer group of the heat sink is received in the groove of the base by the protrusion; the groove position of the abutment portion is -l..; Mounting to the pedestal is 'easy to make' and allows for a tight and stable bond without the need for soldering between the two, resulting in cost savings and environmental friendliness. [Embodiment] Hereinafter, the present invention will be further described with reference to the accompanying drawings. As shown in FIG. 1 , the heat sink 10 includes a base 12 and a heat dissipation tab set 16 disposed on the base 12 . Please also refer to FIG. 2'. The base 12 is substantially rectangular and includes a flat 099145974.
表單編號A010I 第5頁/共17頁 0992079106-0 201228578 整的下表面120及與該下表面120相對的一上表面122。 該下表面120用於與一發熱電子元件相貼合。該上表面 12 2的相對兩側各設有一固定部121。該兩個固定部121 相互平行間隔設置，其可通過擠壓或其他方式形成。每 一固定部121包括由該基座12的上表面122向上延伸的一 凸台123及由該凸台123的頂端於靠近另一凸台123的一 側向另一凸台123的方向延伸的一抵靠部125，該抵靠部 125與凸台123及該基座12的上表面122之間圍成一凹槽 126。每一凸台123由該基座12的上表面122向上垂直延 伸形成，其橫截面為矩形。每一抵靠部125由其所在的凸 台123的一側向另一凸台123的方向水平延妙，其上表面 上設有一溝槽128。該溝槽128沿該抵靠部125的縱向延 伸並貫穿該基座12相對的前後兩側。 [0011] 該散熱鰭片組16由複數平行的散熱片16〇排列而成。請同 時參閱圖3,每一散熱片16〇包括一本體部161、由該本體 部161的外緣同向彎折延伸的一第一折邊162、一第二折 邊163、兩個第三折邊164及兩個第四折邊165。該本體 部161大致為一倒“τ”形結構，其包括一矩形板狀的中 間部166及由該中間部166於靠近其底端位置的相對兩侧 向外延伸的兩個延伸部167。該兩延伸部167亦為矩形平 板狀，其所在的平面與該本體部161所在的平面在同一平 面内。該第一折邊1 6 2由該中間部1 6 6的頂端垂直彎折延 伸而成。該第二折邊163與第一折邊162相對，其由該中 間部166及兩個延伸部167的底端垂直彎折延伸而成。該 兩個第三折邊164分別由該兩個延伸部Μ 7的頂端垂直彎 099145974 表單編號Α0101 第6頁/共17頁 0992079106-0 201228578 折延伸而成。該兩個第四折邊165分別連接設於該第三折 邊164與該第二折邊163之間，其分別由該兩個延伸部 167的遠離中間部166的一側垂直彎折延伸而成。每一散 熱片1 60的第一折邊162及第二折邊163上分別設有與其 相鄰的散熱片160的第一折邊162及第二折邊163配合的 卡扣結構168，該散熱鰭片組16通過該等卡扣結構168相 互扣合而組裝到一起，組裝後的各散熱片160的延伸部 167於該散熱鰭片組j 6的底端的相對兩側分別形成一突出 部169。每一散熱片ι6〇的第一折邊162、第二折邊163、 第二及第四折邊164、由,該本體部161向外延伸的寬 度相同，在該等散熱片組裝到一起時，後組裝的一散熱 片160的第一折邊162、第二折邊163、第三及第四拆邊 164、165分別抵靠於前一散熱片16〇的本艘部161上，從 而使該等第一折邊162及第二折邊163分別於該散熱鰭片 組16的頂端及底端形成一平整的頂面及底面，該等第三 折邊164於該兩個突忠部169的頂端形成4承載面17()， 該等第四折邊165於該兩個突出部4 69的側端分別形成一 支撐面172。 [0012] 請同時參閱圖4，提供一治具20，該治具20包括一基板21 及由β亥基板21的相對兩側向下延伸的兩沖頭2 2，每一沖 頭22呈板狀，其末側端設有一刀口 221，該刀口 221由該 治具20的外側斜向内延伸《該兩沖頭22之間的距離略大 於每一散熱片160的中間部166沿其兩突出部169連線方 向上的寬度。 [0013] 組裝該散熱器1 0時，該散熱鰭片組16由該基座12的一側 099145974 表單編號Α0101 第7頁/共17頁 0992079106-0 201228578 滑入裝設在該基座12的上表面1 22上，使該兩個突出部 1 6 9收谷於該基座1 2的兩個凹槽1 2 6内。將該治具2 〇跨設 於°亥政熱轉片組16上’並使該治具2 〇的兩沖頭2 2的刀口 2 21 ^7別對準該基座1 2的兩個抵靠部1 2 5的溝槽1 2 8位置 且同時向下施加壓力’使該兩個抵靠部125向下壓制該散 熱韓片組16的突出部169的承載面170，從而將該散熱趙 片組16穩固的組裝至該基座12上，製作簡單，並可以使 二者間無需塗設焊錫即可達成緊密而穩固的結合，從而 節約成本且環保。由於該兩個抵靠部125分別設有溝槽 128 ’在治具2〇向下同時衝擊該兩個抵靠部125的溝槽 128位置而使抵靠部125向下變形壓制該散熱鰭片組16的 突出部169時’可使該抵靠部125不會帶動該基座12的凸 台123的上表面變形’從而可防止通過設於該兩凸台123 上的女裝件將該散熱器1〇組裝至一電子元件上時而影響 其組裝。另外，該突出部169的兩個承載面170的設置， 並通過治具20向下同時衝壓該散熱器10>的兩個抵靠部ι25 ’可以使其使其受力更均勻，從而增強其可靠性。同時 ，該承載面170的下方分別設有支撐面172，該支撐面 172可加強該承載面170的承載力，從而加強該兩承載面 170對該抵靠部125的支撐，進而達成二者緊密的結合。 其次’由於該治具的兩沖頭2 2均呈板狀，因此，每一沖 頭22在向下衝壓該基座12對應的抵靠部125後，會使抵靠 部125與該散熱鰭片組16的突出部169形成線性緊配合， 有利於增加該基座12與散熱鰭片組16的接觸面積，提高 散熱器10的結合的緊固程度與散熱效率。 099145974 表單編號A0101 第8頁/共17頁 0992079106-0 201228578 [0014] 综上所述，本發明符合發明專利要件，爰依法提出專利 [0015] 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1為本發明一較佳實施例中的散熱器的立體組裝圖。& [0016] 圖2為圖1所示散熱器的分解圖。 [0017] 圖3為圖2所示散熱器中的一散熱片的立體圖。 CI Γ η [0018] 圖4為圖1所示的散熱器通過一治具衝壓時的侧面示意圖 〇 ............. ................... [0019] 【主要元件符號說明】 散熱器：10 [0020] 基座：12 [0021] 散熱鰭片組：16 [0022] 治具：20 [0023] 基板：21 [0024] 沖頭：22 [0025] 下表面：120 [0026] 固定部：121 [0027] 上表面：122 [0028] 凸台：123 099145974 表單編號A0101 第9頁/共17頁 0992079106-0 201228578 [0029] 抵靠部：125 [0030] 凹槽·· 126 [0031] 溝槽：128 [0032] 散熱片：160 [0033] 本體部：161 [0034] 第一折邊：162 [0035] 第二折邊：163 [0036] 第三折邊：164 [0037] 第四折邊：165 [0038] 中間部：166 [0039] 延伸部：167 [0040] 卡扣結構：168 [0041] 突出部：169 [0042] 承載面：1 7 0 [0043] 支撐面：172 [0044] 刀口 ： 221 099145974 表單編號A0101 第10頁/共17頁 0992079106-0Form No. A010I Page 5 of 17 0992079106-0 201228578 The entire lower surface 120 and an upper surface 122 opposite the lower surface 120. The lower surface 120 is for conforming to a heat generating electronic component. A fixing portion 121 is disposed on each of opposite sides of the upper surface 12 2 . The two fixing portions 121 are spaced apart from each other in parallel, which can be formed by extrusion or other means. Each of the fixing portions 121 includes a boss 123 extending upward from the upper surface 122 of the base 12 and extending from a side of the boss 123 toward a side of the other boss 123 toward the other boss 123. An abutting portion 125 defines a recess 126 between the abutting portion 125 and the boss 123 and the upper surface 122 of the base 12. Each of the bosses 123 is formed vertically extending upward from the upper surface 122 of the base 12 and has a rectangular cross section. Each of the abutting portions 125 is horizontally extended from one side of the boss 123 where it is located to the other of the bosses 123, and a groove 128 is formed on the upper surface thereof. The groove 128 extends in the longitudinal direction of the abutting portion 125 and extends through the opposite front and rear sides of the base 12. [0011] The heat dissipation fin group 16 is formed by arranging a plurality of parallel heat dissipation fins 16 . Referring to FIG. 3, each of the heat sinks 16A includes a body portion 161, a first flange 162 extending from the outer edge of the body portion 161, a second flange 163, and two third portions. Folding edge 164 and two fourth folding edges 165. The body portion 161 is generally an inverted "τ"-shaped structure including a rectangular plate-shaped intermediate portion 166 and two extending portions 167 extending outwardly from opposite sides of the intermediate portion 166 near the bottom end thereof. The two extensions 167 are also rectangular plate-shaped, and the plane in which they are located is in the same plane as the plane in which the body portion 161 is located. The first flange 162 is formed by vertically bending the top end of the intermediate portion 166. The second flange 163 is opposite to the first flange 162, and is formed by vertically bending the bottom portion 166 and the bottom ends of the two extension portions 167. The two third flanges 164 are respectively formed by the top end of the two extensions Μ 7 being vertically bent 099145974 Form No. Α0101 Page 6 / Total 17 pages 0992079106-0 201228578. The two fourth flanges 165 are respectively connected between the third flange 164 and the second flange 163, and are respectively bent and extended by a side of the two extension portions 167 away from the intermediate portion 166. to make. The first flange 162 and the second flange 163 of each of the heat dissipation fins 160 are respectively provided with a buckle structure 168 that cooperates with the first flange 162 and the second flange 163 of the adjacent heat dissipation fins 160. The fins 16 are assembled by being fastened to each other by the fastening structures 168. The extensions 167 of the assembled heat sinks 160 respectively form a protrusion 169 on opposite sides of the bottom end of the heat dissipation fin group j 6 . . The first flange 162, the second flange 163, the second and fourth flanges 164 of each of the heat sinks ι6〇, the width of the body portion 161 extending outward is the same, when the heat sinks are assembled together The first flange 162, the second flange 163, and the third and fourth flanges 164, 165 of the rear heat sink 160 are respectively abutted against the ship portion 161 of the previous heat sink 16〇, thereby The first flange 162 and the second flange 163 respectively form a flat top surface and a bottom surface at the top end and the bottom end of the heat dissipation fin group 16, and the third flange 164 is at the two protruding portions 169. The top end forms a bearing surface 17 (), and the fourth flange 165 forms a supporting surface 172 at the side ends of the two protruding portions 4 69, respectively. [0012] Referring to FIG. 4, a jig 20 is provided. The jig 20 includes a substrate 21 and two punches 2 2 extending downward from opposite sides of the β-wood substrate 21. Each punch 22 is a plate. a cutting edge 221 is provided at a distal end thereof, and the cutting edge 221 extends obliquely inwardly from the outer side of the jig 20. The distance between the two punches 22 is slightly larger than the intermediate portion 166 of each fin 160. The width of the line 169 in the direction of the line. [0013] When the heat sink 10 is assembled, the heat dissipation fin set 16 is slid into the base 12 by one side of the base 12, 099145974, form number Α0101, page 7/17 pages, 0992079106-0 201228578. On the upper surface 1 22, the two protrusions 169 are received in the two grooves 1 2 6 of the base 12 . The jig 2 is placed across the Heizhen thermal transfer film set 16 and the two edges of the two punches 2 2 of the jig 2 are aligned with the two bases of the base 1 2 The position of the groove 1 2 8 of the portion 1 2 5 and the pressure applied downward simultaneously causes the two abutting portions 125 to press down the bearing surface 170 of the protruding portion 169 of the heat-dissipating Korean sheet group 16, thereby dissipating the heat dissipation Zhao The chip set 16 is firmly assembled to the susceptor 12, which is simple to manufacture and can achieve a tight and stable combination without soldering between the two, thereby saving cost and being environmentally friendly. Since the two abutting portions 125 are respectively provided with the grooves 128 ′, the position of the groove 128 of the two abutting portions 125 is impacted downward while the jig 2 〇 downwards, and the abutting portion 125 is deformed downward to press the heat dissipating fins. When the protrusion 169 of the group 16 is 'can make the abutting portion 125 not deform the upper surface of the boss 123 of the base 12', the heat dissipation can be prevented by the women's clothing provided on the two bosses 123. The assembly of the device 1 to an electronic component affects its assembly. In addition, the two bearing surfaces 170 of the protruding portion 169 are disposed, and the two abutting portions ι25' of the heat sink 10> can be punched downward by the jig 20 to make the force more uniform, thereby enhancing reliability. At the same time, the supporting surface 172 is respectively disposed under the bearing surface 170, and the supporting surface 172 can strengthen the bearing capacity of the bearing surface 170, thereby reinforcing the supporting of the abutting portion 125 by the two bearing surfaces 170, thereby achieving close cooperation between the two. Combination of. Secondly, since the two punches 2 2 of the jig are plate-shaped, each punch 22 presses the corresponding abutting portion 125 of the base 12 downward, and the abutting portion 125 and the heat radiating fin are caused. The protruding portion 169 of the sheet set 16 forms a linear tight fit, which is advantageous for increasing the contact area of the susceptor 12 with the heat dissipation fin group 16, and improving the fastening degree and heat dissipation efficiency of the heat sink 10. 099145974 Form No. A0101 Page 8 of 17 0992079106-0 201228578 [0014] In summary, the present invention meets the requirements of the invention patent, and the patent is filed according to law [0015]. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an assembled, isometric view of a heat sink in accordance with a preferred embodiment of the present invention. 2 is an exploded view of the heat sink shown in FIG. 1. 3 is a perspective view of a heat sink in the heat sink shown in FIG. 2. CI Γ η [0018] FIG. 4 is a side view of the heat sink shown in FIG. 1 when punched by a jig 〇......................... ........ [0019] [Main component symbol description] Heat sink: 10 [0020] Base: 12 [0021] Heat sink fin set: 16 [0022] Fixture: 20 [0023] Substrate: 21 [0024] Punch: 22 [0025] Lower surface: 120 [0026] Fixing portion: 121 [0027] Upper surface: 122 [0028] Boss: 123 099145974 Form No. A0101 Page 9/Total 17 Page 0992079106-0 201228578 Abutting portion: 125 [0030] Groove · · 126 [0031] Groove: 128 [0032] Heat sink: 160 [0033] Body portion: 161 [0034] First hemming: 162 [0035] Twisted edge: 163 [0036] Third hemming: 164 [0037] Fourth hemming: 165 [0038] Intermediate part: 166 [0039] Extension: 167 [0040] Snap structure: 168 [0041] :169 [0042] Bearing surface: 1 7 0 [0043] Support surface: 172 [0044] Cutting edge: 221 099145974 Form number A0101 Page 10 of 17 0992079106-0