1333142 [0001] [0002] [0003] [0004] 096118709 039年07月12日梭正替換頁 發明說明： 【發明所屬之技術領域】 本發明涉及一種散熱裝置，特別係指一種用於冷卻電子 元件之散熱裝置。 【先前技術】 隨著電子資訊業不斷發展，電子元件（特別係中央處理 器）運行頻率和速度不斷提升，高頻高速使電子元件產 生之熱量亦隨之增多，引起溫度升高，影響電子元件運 行時之性能，為確保電子元件能正常運作，必須及時排 出其所產生之大量熱量。 為此，業界通常使用一散熱辜夢#今處麥器:行散熱， * J* ^ i -- 續':' 以往這類散熱器，大多係在上:導'篆’金屬.基:座上一體成型 複數個用於增加散熱面積之散熱片，然而在製造技術與 模具強度等限制下，所能加工形成之散熱片之數量及高 度相當有限，從而使其整體散熱面積受到限制，難以符 .Γ:; : 合許多實際應用中愈來愈高之散熱需要。 為解決上述問題，業界採用一種以多片散熱片並聯扣接 而成之散熱器，其在製作裝配上較為簡單，從而製作成 本較低，如中國專利公告第2561 002Υ號所揭示之散熱片 ，該散熱片相對上下兩側邊設有折邊，該折邊上設有“ 凸”形之扣孔及在該扣孔内從散熱片側緣相應位置向上 延設一扣片。在裝配時，本散熱片之扣片與前一散熱片 對應之扣孔卡扣，同時後一散熱片之扣片又與本散熱片 對應之扣孔卡扣，如此前後連續扣接而形成一散熱片組 合。然而，該組合最前端散熱片之折邊及折邊上之卡扣 表單編號Α0101 第3頁/共14頁 0993249816-0 1333142 099年07月12日修正替换頁 部均向外凸伸，從而形成諸如在運輸、安裝及使用過程 中劃傷周邊物件或操作者之安全隱患。 【發明内容】 [0005] 本發明旨在提供一種具有安全扣接結構之散熱裝置。 [0006] 一種散熱裝置，用於對電子元件進行散熱，其包括複數 相互扣合之散熱片，其中每一散熱片之邊緣設置有折邊 ，且該折邊上設置有扣合部，該散熱片通過其扣合部相 互扣合在一起，該散熱片包括一第一散熱片組及一第二 散熱片組，該第一散熱片組之折邊延伸方向與所述第二 籍片組之折邊延伸方向相反且相向排列。 [0007] 上述散熱裝置具有一對相互卦扣之散熱，且該兩散熱片 另一侧可各再與複數散熱片同向扣合，所以這些散熱片 组合而成之散熱片組最外側之兩散熱片均係向内扣合， 其折邊相向朝内，既無折邊向外裸露，從而消除折邊劃 傷周邊元件之隱患。 【實施方式】 [0008] 圖1至圖3示出了本發明一施例中之散熱裝置，該散熱裝 置用於對安裝在電路板（圖未示）正面上之電子元件（ 圖未示）進行散熱，該散熱裝置包括一基座10及排列在 基座10上之散熱片組20。 [0009] 上述基座10由導熱性能良好之金屬如鋁、銅等鑄成，該 基座10包括一大體呈矩形平板形之本體11，該本體11之 底面與電子元件接觸以吸收其產生之熱量，該本體11上 表面與散熱片組20通過焊接等方式導熱連接，以將從電 096118709 表單編號A0101 第4頁/共14頁 0993249816-0 1333142 099年07月12日梭正替换頁 子元件吸收之熱量傳導到散熱片組20上，從而將熱量散 發到周圍空間。該基座10之本體11中間靠近兩側之位置 各穿置一固定件100，以將散熱裝置固定到電路板上。 [0010] 請再次參閱圖3，上述散熱鰭片組20包括均呈矩形且寬度 相同之複數第一散熱片22、複數第二散熱片24、一第三 散熱片26和一與第三散熱片26相對應之第四散熱片28。 該散熱片組20由這些散熱片22、24、26、28相互扣合而 成，其中第一散熱片22位於散熱片組20之兩側部分，第 二散熱片24位於散熱片組20之中間部分將第一散熱片22 分成左右兩部分（根據附圖定義），而第三、四散熱片 26、28相鄰插置在第一散熱22左邊:部.分内.之任何一處 [0011] 該第一散熱片22具有一矩形片狀主體220，該主體220上 下兩側緣分別向同側垂直延伸有折邊222，其上折邊222 設置有兩相間隔之扣合部（未標號），該扣合部包括一 “凸”形扣孔2220和一扣片2222。在該折邊222上圍成 該扣孔2220之邊框亦延折邊222彎折延伸方向呈“凸”形 凸伸，以在扣合中容置在前一散熱片22之扣孔2220中； 該扣片2222在扣孔2220内從主體220向上凸伸，在扣合 中，該扣片2222與後一散熱片22之扣孔2220邊框卡扣並 容置在扣孔2220之“凸”形頂部内。 [0012] 該第二散熱片24之構造和第一散熱片22—致，其具有一 主體240及上下折邊242，上折邊242對應第一散熱片22 扣合部之位置上設置有相同之扣合部。該第二散熱片24 之扣合部對應包括一扣孔2420及一扣片2422。該第一散 096118709 表單編號A0101 第5頁/共14頁 0993249816-0 1333142 099年07月12日按正替換頁 熱片22與第二散熱片24之不同之處係該第二散熱片24之 長度較第一散熱片22短，以在散熱片組20中部兩端形成 兩對應放置固定件10 0之凹陷部（未標號）。 [0013] 該第三散熱片26和第四散熱片28為一對相向對扣之組合 ，該第三散熱片26包括一與第一散熱片2 2相同之主體260 及上下折邊262，該折邊262設有與第一散熱片22和第二 散熱片24對應之“凸”形扣孔2620及扣片2622。如圖4 所示，該第三散熱片26與第一散熱片22不同之處在於其 折邊262在兩扣合部之間並分別與兩扣合部靠近處各設置 有一卡扣凸部2624，該卡扣部2624可為由折邊262向外 寬度漸增之鉤狀體，在本實施例中該卡扣凸部2624為一 從折邊262水平向外延伸之“T”形片體。 [0014] 該第四散熱片28包括一與第一散熱片22相同之主體280及 相對應之上下折邊282。如圖5所示，該上折邊282上對應 第三散熱片26扣合部之位置開設有一矩形缺口 2820，以 在與第三散熱片26相向對扣時，容置第三散熱片26扣孔 2620周圍凸出之邊框。該第四散熱片28在對應缺口 2820 處設置有扣片2822,以卡置在其後面之一第一散熱片22 之扣孔2220内。該第四散熱片28上折邊28 2在對應第三 散熱片26卡扣凸部2624位置上開設有卡孔2824，且該卡 孔2824與第三散熱片26之“T”形卡扣凸部2624之形狀 對應，以與該卡扣凸部2 6 2 4卡扣。 [0015] 上述散熱裝置中，該第三散熱片26之卡扣凸部2624卡置 在第四散熱片28之卡孔2824内，使第三散熱片26及第四 散熱片28相向扣合在一起，該第三散熱片26之扣片2622 096118709 表單編號A0101 第6頁/共14頁 0993249816-0 1333142 099年07月12日修正替換頁 及第四散熱片28之扣片2822再分別與其後之第一散熱片 22之扣孔2220或第二散熱片24之扣孔2420扣合，從而使 這些散熱片22、24、26、28相互扣合組合成散熱片組20 ，該散熱片組20上下折邊分別組合成其頂面及底面，該 散熱片組20底面可通過焊接或粘貼等方式固定到基座10 之頂面上。 [0016] 上述散熱片組20具有一對相互對扣之散熱片26、28，且 該兩散熱片另一側可再與複數第一散熱片同向扣合，所 以該散熱片組20之最外側之兩散熱片均係向内扣合，其 折邊相向朝内，即無折邊向外裸露，從而消除折邊劃傷 周邊元件之隱患。 1二、 一 乂 ^ Γ [0017] 綜上所述，本發明符合發眼利，要件，爰法提出專利 申請。惟，以上所述者僅為本發明之較佳實施例，舉凡 熟悉本案技藝之人士，在爰依本發明精神所作之等效修 飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 [0018] 圖1係本發明一施例中散熱裝置之立體組裝圖。 [0019] 圖2係圖1中散熱裝置之立體分解圖。 [0020] 圖3係圖2中散熱片組之部分分解圖。 [0021] 圖4係圖3中IV部分放大圖。 [0022] 圖5係圖3中V部分放大圖。 【主要元件符號說明】 [0023] 基座：10 · 096118709 表單編號Α0101 第7頁/共14頁 0993249816-0 1333142 099年07月12日修正替換頁 [0024] 本體：11 [0025] 固定件：100 [0026] 散熱片組：20 [0027] 第一散熱片：22 [0028] 主體：220、240、 [0029] 260、280 : [0030] 折邊部：222、242、 [0031] 262、282 : [0032] 才口子L : 2220、2420、 [0033] 2620 ： [0034] 扣片：2222、2422、 [0035] 2622、2822 : [0036] 第二散熱片：24 [0037] 第三散熱片：26 [0038] 卡扣凸部：2624 [0039] 第四散熱片：28 [0040] 缺口 ： 2820 [0041] 卡孔：2824 096118709 表單編號A0101 第8頁/共14頁 0993249816-0BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat dissipating device, and more particularly to a cooling electronic component. [0001] [0001] [0003] [0003] [0004] 096118709 The heat sink. [Prior Art] With the continuous development of the electronic information industry, the operating frequency and speed of electronic components (especially the central processing unit) are constantly increasing, and the high-frequency and high-speed causes the heat generated by the electronic components to increase, causing an increase in temperature and affecting electronic components. In operation, in order to ensure the normal operation of electronic components, it is necessary to discharge a large amount of heat generated in time. To this end, the industry usually uses a heat-dissipating dream #今麦麦器: 行散热, * J* ^ i -- Continued ':' In the past, such radiators were mostly on the top: guide '篆' metal. Base: seat A plurality of heat sinks for increasing the heat dissipation area are integrally formed on the upper surface. However, under the limitation of manufacturing technology and mold strength, the number and height of heat sinks that can be processed are quite limited, so that the overall heat dissipation area is limited, and it is difficult to .Γ:; : The need for heat dissipation in many practical applications. In order to solve the above problems, the industry adopts a heat sink which is formed by connecting a plurality of heat sinks in parallel, which is relatively simple in production and assembly, and has low manufacturing cost, such as the heat sink disclosed in Chinese Patent Publication No. 2561 002. The heat sink is provided with a folded edge on the upper and lower sides, the flange is provided with a "convex" shaped button hole, and a buckle is extended upward from the corresponding position of the side edge of the heat sink. During assembly, the buckle of the heat sink and the buckle of the previous heat sink are buckled, and the buckle of the latter heat sink is buckled with the buckle corresponding to the heat sink, so that the front and rear are continuously buckled to form a buckle. Heat sink combination. However, the buckle form number on the flange and the flange of the frontmost heat sink of the combination is 1010101. Page 3/14 pages 0993249816-0 1333142 On July 12, 2008, the replacement page portion is outwardly convex, thereby forming Such as the safety hazards of scratching surrounding objects or operators during transportation, installation and use. SUMMARY OF THE INVENTION [0005] The present invention is directed to a heat sink having a safety fastening structure. [0006] A heat dissipating device for dissipating heat from an electronic component, comprising a plurality of heat-dissipating fins, wherein each fin is provided with a flange at an edge thereof, and the flange is provided with a fastening portion, the heat dissipation The fins are fastened to each other by a fastening portion thereof. The heat sink includes a first heat sink group and a second heat sink group, and the first heat sink group has a flange extending direction and the second chip group The flanges extend in opposite directions and are aligned in opposite directions. [0007] The heat dissipating device has a pair of mutually dissipating heat dissipation, and the other side of the two heat dissipating fins can be respectively engaged with the plurality of heat dissipating fins in the same direction, so the outermost two of the fins are combined The heat sinks are fastened inwardly, and the flanges are facing inward, and no folds are exposed to the outside, thereby eliminating the hidden danger of the edges of the flanges. [Embodiment] FIG. 1 to FIG. 3 show a heat dissipating device for an electronic component (not shown) mounted on a front surface of a circuit board (not shown) according to an embodiment of the present invention. For heat dissipation, the heat sink includes a base 10 and a heat sink assembly 20 disposed on the base 10. [0009] The susceptor 10 is cast from a metal having good thermal conductivity such as aluminum, copper, etc., and the susceptor 10 includes a body 11 having a substantially rectangular plate shape, and the bottom surface of the body 11 is in contact with an electronic component to absorb the generated portion thereof. Heat, the upper surface of the body 11 and the heat sink group 20 are thermally connected by soldering, etc., and will replace the page component with the 096118709 form number A0101 page 4 / 14 pages 0993249816-0 1333142 099 July 12 The absorbed heat is conducted to the heat sink group 20 to dissipate heat to the surrounding space. A fixing member 100 is disposed in the middle of the body 11 of the base 10 near the two sides to fix the heat sink to the circuit board. [0010] Referring again to FIG. 3, the heat dissipation fin set 20 includes a plurality of first heat sinks 22, a plurality of second heat sinks 24, a third heat sink 26, and a third heat sink, each having the same rectangular shape and the same width. 26 corresponds to the fourth heat sink 28. The heat sink group 20 is formed by fastening the heat sinks 22, 24, 26, and 28, wherein the first heat sink 22 is located at two sides of the heat sink group 20, and the second heat sink 24 is located between the heat sink groups 20. The first heat sink 22 is divided into left and right portions (as defined in the drawings), and the third and fourth heat sinks 26, 28 are adjacently inserted on the left side of the first heat sink 22: any part of the portion. [0011 The first heat sink 22 has a rectangular sheet-shaped body 220. The upper and lower edges of the body 220 respectively extend perpendicularly to the same side with a folded edge 222, and the upper folded edge 222 is provided with two spaced apart fastening portions (not labeled) The fastening portion includes a "convex" shaped button hole 2220 and a buckle piece 2222. The frame of the buckle hole 2220 is defined by the flange 222, and the extension edge 222 is convexly protruded in the extending direction to be received in the button hole 2220 of the front heat sink 22 during the fastening; The buckle 2222 protrudes upward from the main body 220 in the fastening hole 2220. During the fastening, the buckle 2222 and the button hole 2220 of the rear heat sink 22 are snapped and received in the "convex" shape of the fastening hole 2220. Inside the top. [0012] The second heat sink 24 has the same structure as the first heat sink 22, and has a main body 240 and upper and lower flanges 242. The upper flange 242 is provided with the same position corresponding to the first heat sink 22 fastening portion. The buckle. The fastening portion of the second heat sink 24 correspondingly includes a button hole 2420 and a buckle piece 2422. The first scatter 096118709 Form No. A0101 Page 5 / Total 14 Page 0993249816-0 1333142 On July 12, 2009, the difference between the hot sheet 22 and the second heat sink 24 is the second heat sink 24 The length is shorter than that of the first fins 22 to form two recessed portions (not labeled) corresponding to the fixing members 10 at the central ends of the fin group 20. [0013] The third heat sink 26 and the fourth heat sink 28 are a combination of a pair of opposing buckles, and the third heat sink 26 includes a body 260 and a top and bottom flange 262 which are identical to the first heat sink 2 2 . The flange 262 is provided with a "convex" shaped button hole 2620 and a buckle piece 2622 corresponding to the first heat sink 22 and the second heat sink 24. As shown in FIG. 4, the third heat sink 26 is different from the first heat sink 22 in that a flange 262 is disposed between the two fastening portions and is respectively provided with a buckle protrusion 2624 near the two fastening portions. The buckle portion 2624 can be a hook-shaped body whose outer width is gradually increased by the flange 262. In the embodiment, the buckle protrusion 2624 is a "T"-shaped sheet extending horizontally outward from the flange 262. . [0014] The fourth heat sink 28 includes a body 280 identical to the first heat sink 22 and a corresponding upper lower flange 282. As shown in FIG. 5, a rectangular notch 2820 is defined in the upper flange 282 corresponding to the fastening portion of the third heat sink 26, so as to receive the third heat sink 26 when the third heat sink 26 is oppositely buckled. A frame that protrudes around the hole 2620. The fourth heat sink 28 is provided with a buckle piece 2822 at a corresponding notch 2820 for being caught in the button hole 2220 of the first heat sink 22 at the rear side thereof. The upper flange 28 of the fourth heat sink 28 is provided with a card hole 2824 at a position corresponding to the latching protrusion 2624 of the third heat sink 26, and the “T” shaped snap protrusion of the card hole 2824 and the third heat sink 26 The shape of the portion 2624 corresponds to the buckle protrusion 2 6 2 4 . [0015] In the heat dissipation device, the latching protrusions 2624 of the third heat sink 26 are locked in the card holes 2824 of the fourth heat sink 28, so that the third heat sink 26 and the fourth heat sink 28 are oppositely engaged with each other. Together, the cleat of the third heat sink 26 is 2622 096118709. Form No. A0101 Page 6 / 14 pages 0993249816-0 1333142 The reversal page of the second heat sink 28 and the clasp 2822 of the fourth heat sink 28 are respectively followed by The button hole 2220 of the first heat sink 22 or the button hole 2420 of the second heat sink 24 is fastened, so that the heat sinks 22, 24, 26, 28 are fastened to each other to form a heat sink group 20, and the heat sink group 20 The upper and lower flanges are respectively combined into a top surface and a bottom surface, and the bottom surface of the heat sink group 20 can be fixed to the top surface of the base 10 by welding or pasting. [0016] The heat sink group 20 has a pair of mutually opposing heat sinks 26 and 28, and the other side of the heat sinks can be coupled to the plurality of first heat sinks in the same direction, so the heat sink group 20 is the most The two outer fins are fastened inwardly, and the folded edges are facing inward, that is, no folds are exposed outwards, thereby eliminating the hidden danger of the peripheral members being scratched by the folds. 1 2, 1 乂 ^ Γ [0017] In summary, the present invention is in line with the eye-catching, essential, and patent-pending applications. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS [0018] FIG. 1 is a perspective assembled view of a heat sink device in an embodiment of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. 3 is a partially exploded view of the heat sink assembly of FIG. 2. [0021] FIG. 4 is an enlarged view of a portion IV of FIG. 3. [0022] FIG. 5 is an enlarged view of a portion V of FIG. 3. [Main component symbol description] [0023] Base: 10 · 096118709 Form number Α 0101 Page 7 / Total 14 page 0993249816-0 1333142 Correction replacement page [0024] of July 12, 2017 [1024] Body: 11 [0025] Fixing parts: 100 [0026] Heat sink group: 20 [0027] First heat sink: 22 [0028] Main body: 220, 240, [0029] 260, 280: [0030] Folding portion: 222, 242, [0031] 262, 282 : [0032] Talent L : 2220, 2420, [0033] 2620 : [0034] Clasp: 2222, 2422, [0035] 2622, 2822: [0036] Second heat sink: 24 [0037] Third heat dissipation Sheet: 26 [0038] Snap projection: 2624 [0039] Fourth heat sink: 28 [0040] Notch: 2820 [0041] Card hole: 2824 096118709 Form number A0101 Page 8 of 14 0993249816-0