TW200846885A - Heat dissipation device - Google Patents

Heat dissipation device Download PDF

Info

Publication number
TW200846885A
TW200846885A TW96118709A TW96118709A TW200846885A TW 200846885 A TW200846885 A TW 200846885A TW 96118709 A TW96118709 A TW 96118709A TW 96118709 A TW96118709 A TW 96118709A TW 200846885 A TW200846885 A TW 200846885A
Authority
TW
Taiwan
Prior art keywords
heat
heat sink
hole
dissipating device
buckle
Prior art date
Application number
TW96118709A
Other languages
Chinese (zh)
Other versions
TWI333142B (en
Inventor
Jun Luo
Cui-Jun Lu
Chin-Lung Chen
Original Assignee
Foxconn Tech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Foxconn Tech Co Ltd filed Critical Foxconn Tech Co Ltd
Priority to TW96118709A priority Critical patent/TWI333142B/en
Publication of TW200846885A publication Critical patent/TW200846885A/en
Application granted granted Critical
Publication of TWI333142B publication Critical patent/TWI333142B/en

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A heat dissipation device adapted for removing heat from a heat-generating component, includes a plurality of fins snapping with each other. Each of the fins has a flange extending perpendicularly from an edge thereof. The flange defines a locking part therein, through which the fins are assembled together. The fins are further divided into a first fin set and a second fin set, wherein the flanges of the first fin set are oriented in a direction opposite to that of the second fin set.

Description

200846885 九、發明說明: 【發明所屬之技術領域】 本發明涉及一種散埶奘晉,往s丨总 徑狀”、、衣置%別係指一種用於冷卻電 子7G件之散熱裝置。 【先前技術】 理訊業不斷發展,電子元件(特別係中央處 益)運仃頻率和速度不斷提升,高頻高速使電子元件產 生之熱量亦隨之增多,引起溫度升高,影200846885 IX. Description of the invention: [Technical field to which the invention pertains] The present invention relates to a heat dissipation device for cooling an electronic 7G piece, which is a type of heat dissipation device for cooling an electronic 7G piece. Technology] The communication industry is constantly evolving, and the frequency and speed of electronic components (especially the central department) are increasing. The high-frequency and high-speed causes the heat generated by electronic components to increase, causing the temperature to rise.

時之性能,為確保電子元件能正常運作, Z 所產生之大量熱量。 為此,業界通常制—散熱器對中央處理器進行散 …,以在這類散熱器,大多係在一導埶 型複數個用於增加散熱面積之散熱片 =強度等限制下’所能加工形成之散熱片之數量及高度 目·有限,從而使其整體散熱面積受到限 二: 多實際應用中愈來愈高之散熱需要。 心付4 接而上㈣題,業界採用—種以多片散熱片並聯扣 政熱盗,其在製作裝配上較為簡單, 本幸父低’如中國專利公告第2561002Υ號所揭示之散=、 錢熱片相對上下兩側邊設有折邊,該折邊上設有:凸”, 形:扣孔及在該扣孔内從散熱片側緣相應位置向一 +在衣配時,本散熱片之扣片與前-散熱片對庫之扣 孔卡扣’同時後-散熱片之扣片又與本散熱片對J = 6 200846885 如此前後連續扣接而形成—散熱Μ人。^ …且“丽端散熱片之折邊及折邊 二:然而’該 從而形成諸如在運輸、安 …扣#均向外凸伸, 操作者之安全隱患。’ 過私中劃傷周邊物件或 【發明内容】 本=明旨錢供—種具有安全扣接結構 -種散熱裝置,用於對電子元::置。 數相互扣合之散埶# 放心,其包括複 邊,且該折邊上設置 之政緣咬置有折 石4人— 虿扣σ邛5亥散熱片通過其扣合邻如 ;二在一起’該散熱片包括-第-散熱片組及—第:: f片且夕第—散熱片組之折邊延伸方向與所述第二:: 組之折邊延伸方向相反且相向排列。 一,、、、曰片 片另上::::置具有-對相互對扣之散熱’且該兩散埶 片另一側可各再與複數散熱片同向扣合,所以這些散熱 組合而成之散熱片組最外側之兩散熱片均係向内扣人,、1 “邊既無折邊向外裸露,消除折邊:傷周 【實施方式】 圖1至圖3不出了本發明一施例中之散熱裝置,該 熱裝置用於對安裳在電路板(圖未示)正面上之電子元件 (圖未示)進行散熱,該散熱裝置包括一基座1〇及排列在 基座10上之散熱片組20。 上述基座10由導熱性能良好之金屬如鋁、銅等鑄成, 7 200846885 :電㈣彡彻之如1,該本體u 、甩子兀件接觸以吸收 ;:::熱…通過焊接等方式導熱連接,:: 兀件吸收之熱量僂導?丨1 盯攸包于 周圍空間。該基座10:本-;且20二從而將熱量散發到 置=定件⑽,以將散熱裝置固定到電路板上。°牙 办庐々门人 > 閱圖3,上述散熱鰭片組20包括均呈矩形且 =同之複數第—散熱片22、複η 二散熱片26和一盥第一邱舛μ 成…、片24 —弟 28 〇 u ”弟—放熱片26相對應之第四散埶片 。讀熱片組20由這些散熱片22、2 :片 合而成,其中第一散埶 28相互扣 第二散熱片24位於散^位於散熱片組2〇之兩側部分, 22八以+ 放熱片組20之中間部分將第-散熱片 刀工兩部分(根據附圖定義) 26、28相鄰插置在第— 弟—四放熱片 ^相片22左邊部分内之任何一處。 麄卜下1丨^⑼22具有—矩形片狀主體細,該主體220 ,上下兩側緣分別向同側垂直延伸有折邊功 設置有兩相間隔之扣合部(未扣、斤-222 “凸,,形扣孔2220和—扣片2„9卢 “ 。口Ρ包括一 :孔2220之邊框亦延折邊⑵彎折延;圍= 扣片2222在扣孔22之扣孔2220中;該 π 主體220向上凸伸,在扣合中, it二:熱片22之扣孔2220邊框卡扣並容置 在扣孔2220之‘凸”形頂部内。 谷置 該第二散熱片24之構造和第一散熱片Μ 一致,其具 8 200846885 •有一主體240及上下折邊祀,上折邊冰對摩第 • 22扣合部之位置上設置有相同之扣合部。該第二,:熱片 之扣合部對應包括一扣孔_ 2。;政熱片24 片22與第二散埶片+ 这弟—散熱 度較第-散熱;22 = 對應放-定件⑽之凹陷恤 該第二散熱片26和第四散熱片28 組合,該第三散埶片2iS勺杠, …t相向對扣之 ^ 26〇 . μ …片"^括―與第—散熱片22相同之主 體·及上下折邊262,該折邊262 Π之主 和第二散熱片24對應之“凸,,又〃賴片22 *圖4所示,該第三散熱片V與; 在於其折邊262名a 4人i 放尤、片22不同之處 各設置有-卡扣 向外寬度漸增之釣狀體,在本折邊262 一從折邊262水平向外延伸之“τ” :卡扣凸24為 ,該第四散熱片28包括—與第-料1°22才门 280及相對應之上下折邊282。如圖5所 相同之主體 上對應第三散埶片26 j人μ 斤不,該上折邊282 厕,以在盘第散i?部之位置開設有-矩形缺口 -一周圍二凸 口期歧散在對應缺 片22之扣孔222〇内。該 在/、後面之一第一散熱 第三散熱片26卡扣凸部262/位置上^斤^繼在對應 該卡孔聰與第三散熱片%之開^有卡孔聰,且 形卡扣凸部2624之 9 200846885 形狀對應’以與該卡扣凸部2624卡扣。 上述散熱裝置中,該第二 第四散熱片28相向扣合在一 ::政熱片26及 =及第四散熱片28之…82二^=後=扣片 …、片22之扣孔222〇或第二散熱片 弟-散 從而使這些散熱片22、24、2 2420扣合’ 組-,該散熱片組2。上下折邊分 該散熱片2〇底面可通過焊接或枯料成方m面, 10之頂面上。 于乃式固疋到基座 W: 20具有一對相互對扣之散熱片26、28 °Λ、政…片另一侧可再與複數第一散熱片同向扣入 以該散熱片組2G之最外側之兩散熱片均係向内扣合^ 邊相向朝内,即無折邊向外裸露,從而消除折邊劃傷月 凡件之隱患。 一用-•=上所述,本發明符合發明專利要件,爰依法提出專 利Z凊。惟,以上所述者僅為本發明之較佳實施例,舉凡 热I本案技蟄之人士,在爰依本發明精神所作之等效修飾 或變化,皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明一施例中散熱裝置之立體組裝圖。 圖2係圖1中散熱裝置之立體分解圖。 圖.3係圖2中散熱片組之部分分解圖。 200846885 • 圖4係圖3中IV部分放大圖。 - 圖5係圖3中V部分放大圖。 【主要元件符號說明】 基座 10 本體 11 固定件 100 散熱片組 20 第一散熱片 22 主體 220 、 240 、 260 、 280 折邊部 222 、 242 〜 262 、 282 扣孔 2220 ^ 2420 ^ 2620 扣片 2222 、 2422 、 2622 、 2822 第二散熱片 24 第三散熱片 26 卡扣凸部 2624 第四散熱片 28 缺口 2820 卡孔 2824 11The performance of the time, in order to ensure that the electronic components can operate normally, the amount of heat generated by Z. To this end, the industry usually manufactures - the heat sink is used to dissipate the central processor, so that most of these heat sinks can be processed under the constraints of a plurality of heat sinks and strengths for increasing the heat dissipation area. The number and height of heat sinks formed are limited, so that the overall heat dissipation area is limited to two: more and more heat is needed in practical applications. The heart pays 4 and the fourth (four) questions, the industry adopts - a variety of heat sinks in parallel with the deduction of hot thieves, which is relatively simple in the production and assembly, this good father is low as disclosed in the Chinese Patent Bulletin No. 2560100 散 = =, The heat sheet is provided with a folded edge on the upper and lower sides, and the folded edge is provided with: a convex shape, a shape: a buckle hole and a corresponding heat sink in the buckle hole from a corresponding position of the side edge of the heat sink to the clothing The buckle and the front-heat sink are attached to the buckle of the library. At the same time, the fuse of the heat sink is combined with the heat sink J = 6 200846885 so as to be continuously buckled together - heat dissipation. ^ ... and Folding and Folding Edges of Lishou Heatsinks: However, this creates a safety hazard for the operator, such as in transportation, safety, and buckle. s scratching surrounding objects in the private sector or [invention] This is a kind of money-supplied structure - a kind of heat-dissipating device for the electronic element::. The number of interlocking 埶 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放 放The heat sink includes a -th heat sink group and a -::f chip and the first heat sink group have a flange extending direction opposite to the second:: group of the flange extending direction and facing each other. The first, the, and the cymbal pieces are on the other side:::: the heat-dissipating pair of the pair of shackles is formed, and the other side of the two slabs can be respectively engaged with the plurality of heat-dissipating fins, so these heat-dissipating combinations are The two outermost fins of the formed heat sink group are buckled inwardly, 1 "the side is exposed without the hem, and the hem is eliminated: the injury week [embodiment] FIG. 1 to FIG. 3 show the invention. A heat dissipating device for dissipating heat from an electronic component (not shown) on the front surface of a circuit board (not shown), the heat dissipating device including a base 1 and a base The heat sink group 20 on the seat 10. The base 10 is made of a metal having good thermal conductivity such as aluminum, copper, etc., 7 200846885: electric (4) is as good as 1, the body u, the rafter member is in contact for absorption; :::Hot...Thermal connection by means of soldering, etc.:: The heat absorbed by the 偻 偻 丨 丨 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座 基座Piece (10) to fix the heat sink to the circuit board. °Tooth Gatekeeper> Referring to Figure 3, the heat sink fin set 20 includes It is rectangular and = the same as the plural - the heat sink 22, the complex η two heat sink 26 and the first 舛 舛 成 、 、 、 、 、 、 、 、 、 、 ” ” ” ” ” ” ” ” ” ” ” ” 弟 放 放 放 放 放 放 放 放 放 放 放 放sheet. The heat reading set 20 is formed by laminating the heat sinks 22, 2, wherein the first heat sinks 28 are interlocked with each other, and the second heat sinks 24 are located on both sides of the heat sink group 2, 22 The middle portion of the sheet set 20 has two portions of the first fin-scraper (defined according to the drawings) 26, 28 adjacently placed in any one of the left portions of the first-fourth heat release sheet photo 22.丨 下 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( Convex, the shape of the buttonhole 2220 and the clasp 2 „9 ”. The mouth Ρ includes one: the frame of the hole 2220 is also extended and folded (2) to bend; the rim = the buckle 2222 is in the buttonhole 2220 of the buttonhole 22; The π body 220 is upwardly protruded. In the fastening, the frame of the button hole 2220 of the hot film 22 is buckled and received in the top of the 'convex shape' of the button hole 2220. The second heat sink 24 is placed in the valley. The structure is identical to the first heat sink ,, which has 8 200846885 • has a main body 240 and upper and lower hem, and the upper hem is provided with the same fastening portion at the position of the 第 22 fastening portion. : The fastening part of the hot piece corresponds to a button hole _ 2; the political piece 24 piece 22 and the second piece of sputum piece + the younger one - the heat dissipation is the first - heat dissipation; 22 = the corresponding release - the fixed piece (10) The second heat sink 26 and the fourth heat sink 28 are combined, and the third heat sinking piece 2iS is separated from the second heat sinking piece 2, ... t is opposite to the first heat sinking piece 22 The body and the upper and lower flanges 262, the flanges 262 and the second heat sink 24 corresponding to the "convex, and the sheet 22 * shown in Figure 4, the third heat sink V and; 262 a, 4, i, and 22, each having a different shape - a fishing body with an outwardly widened width, and a "τ" extending horizontally from the flange 262 at the flange 262: a card The buckle 24 is such that the fourth heat sink 28 includes a top edge 280 corresponding to the first material and a lower bottom edge 282. The same body as the third heat sink 26 is as shown in FIG. If the weight is not, the upper side of the 282 toilet is opened at the position of the disk portion - a rectangular notch - a surrounding two convex period is dissipated in the corresponding hole 222 of the missing piece 22. One of the first heat dissipation third heat sink 26 snaps the convex portion 262 / position on the ^ ^ ^ in the corresponding card hole and the third heat sink % open ^ has a card hole Cong, and the shape of the buckle convex portion 2624 9 200846885 The shape corresponds to 'to buckle with the buckle protrusion 2624. In the above heat dissipation device, the second and fourth heat sinks 28 are oppositely fastened together:: the political heat sheet 26 and the fourth heat sink 28 ... 82 two ^ = after = The film ..., the button hole 222 片 or the second heat sink - 散 散 散 散 散 散 散 散 散 散 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The bottom surface can be welded or dry into a square surface, 10 on the top surface. Yu Nai is fixed to the base W: 20 has a pair of mutually opposite fins 26, 28 °, the other side of the sheet The two heat sinks on the outermost side of the heat sink group 2G are inwardly inwardly facing each other, that is, no folds are exposed outward, thereby eliminating the fold edge. The hidden danger of the wounded moon. As described above, the invention complies with the requirements of the invention patent, and the patent Z 凊 is proposed according to law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art of the present invention should be included in the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective assembled view of a heat dissipating device in an embodiment of the present invention. 2 is an exploded perspective view of the heat sink of FIG. 1. Fig. 3 is a partially exploded view of the heat sink group of Fig. 2. 200846885 • Fig. 4 is an enlarged view of a portion IV of Fig. 3. - Figure 5 is an enlarged view of a portion V in Figure 3. [Main component symbol description] Base 10 Body 11 Fixing member 100 Heat sink group 20 First heat sink 22 Main body 220, 240, 260, 280 Folded portions 222, 242 ~ 262, 282 Button holes 2220 ^ 2420 ^ 2620 Clasp 2222, 2422, 2622, 2822 second heat sink 24 third heat sink 26 snap projection 2624 fourth heat sink 28 notch 2820 card hole 2824 11

Claims (1)

200846885 、申請專利範圍: 1. :種散熱裝置’用於對電子元件進行散熱, 相互扣合之勒埶H 甘士 a /、匕括複數 口之政熱片,其令母—散熱片 邊’且該折邊上設置有扣合部,1 置有折 部相互扣合在_#,i t *、、'片通過其扣合 ^起其改良在於:該等散埶Μ今权一结 ::熱片組及一第二散熱片組,該第—散:: 排列。弟一籍片組之折邊延伸方向相反且相向 2. ^申請專利範圍第!項所述之散熱裝置 向形成於每-散熱片之上下邊緣,包、=折邊同 邊。 匕括上折邊與下折 3. :申請專利範圍第2項所述之散熱裝置 熱片組與第二散熱片組、中:亥弟-政 上之折邊上形成有卡扣部。之—相鄰散熱片 ,4. 範圍第3項所述之散熱裝置,其中該卡扣部 部及從;—相;t=r邊向外延伸且漸大之卡扣凸 部配合之卡孔。之上形成之並與該卡扣凸 5=申=利範圍第4項所述之散熱裝置,其 卡扣凸部為-從折邊水平向外延伸之“τ ^片 另-散熱片之卡孔為相應之“τ”形孔。少片肢,該 6mr/j範圍第1項所述之散熱裝置,其中該扣μ 為在折邊上形成之一 “a”形扣孔及在散熱丄= 12 200846885 • 該扣孔位置向上延設之一扣片。 • 7.如申請專利範圍第6項所述之散熱裝置,其中該散熱片 折邊上圍成所述扣孔之邊框向外突出,其中前一所述散 熱片之扣片與後一散熱片之扣孔邊框卡扣並容置在扣 孔之所述“凸”形頂部内。 8.如申請專利範圍第7項所述之散熱裝置,其中該相向扣 合之兩散熱片中一散熱片之扣合部為一矩形缺口,以容 置另一散熱片之扣合部。 13200846885, the scope of application for patents: 1. : A kind of heat dissipating device' is used to dissipate heat from electronic components, and to interlock with each other, such as 埶H 甘士 a /, including a number of political hot films, the mother-heat sink side And the folding edge is provided with a fastening portion, and the folding portion is fastened to each other at the _#,it*,, and the piece is fastened by the fastening thereof, and the improvement is as follows: The heat sheet group and a second heat sink group, the first-scatter:: arrangement. The fold of the younger brother's group extends in the opposite direction and faces each other. 2. ^ Patent application scope! The heat dissipating device described in the item is formed on the lower edge of each of the heat sinks, and the package and the flange are on the same side.匕 上 上 上 3. : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : 3. : 3. 3. 3. 3. 3. 3. 3. 3. 3. The heat dissipating device of the third aspect of the invention, wherein the latching portion and the latching portion of the latching portion that extends outwardly from the t-r edge and that is gradually enlarged . The heat dissipating device formed on the upper side and the buckle convex portion 5============================================================================== The hole is a corresponding "τ"-shaped hole. The small-length limb, the heat-dissipating device of the above-mentioned item of the 6mr/j range, wherein the buckle μ is formed with an "a"-shaped button hole on the flange and is disposed in the heat sink. = 12 200846885 • The fastening hole is extended upwardly from the fastening hole. The heat dissipation device according to the sixth aspect of the invention, wherein the flange of the heat sink is surrounded by the frame of the buttonhole. The buckle of the first heat sink and the button frame of the latter heat sink are snapped and received in the "convex" top of the buckle hole. 8. As described in claim 7 The heat dissipating device, wherein the fastening portion of one of the two heat dissipating fins is a rectangular notch for accommodating the engaging portion of the other heat sink.
TW96118709A 2007-05-25 2007-05-25 Heat dissipation device TWI333142B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW96118709A TWI333142B (en) 2007-05-25 2007-05-25 Heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW96118709A TWI333142B (en) 2007-05-25 2007-05-25 Heat dissipation device

Publications (2)

Publication Number Publication Date
TW200846885A true TW200846885A (en) 2008-12-01
TWI333142B TWI333142B (en) 2010-11-11

Family

ID=44823348

Family Applications (1)

Application Number Title Priority Date Filing Date
TW96118709A TWI333142B (en) 2007-05-25 2007-05-25 Heat dissipation device

Country Status (1)

Country Link
TW (1) TWI333142B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102917566A (en) * 2011-08-01 2013-02-06 富瑞精密组件(昆山)有限公司 Radiator

Also Published As

Publication number Publication date
TWI333142B (en) 2010-11-11

Similar Documents

Publication Publication Date Title
US7855889B2 (en) Resilient fastener and thermal module incorporating the same
US7866375B2 (en) Heat dissipation device with heat pipes
US7443676B1 (en) Heat dissipation device
US7723844B2 (en) Heat dissipation device having a locking device
US7952878B2 (en) Heat dissipation device
US8381801B2 (en) Heat dissipation device
TWM243912U (en) Heating dissipating device
US8069909B2 (en) Heat dissipation device
US7190588B2 (en) Heat-dissipating fin assembly for heat sink
US7663882B2 (en) Heat dissipating assembly having a fan duct
US20080128118A1 (en) Heat dissipation device with a heat pipe
JP2005175246A (en) Radiation fin, cooling system, electronic equipment, and manufacturing method of cooling system
TW201249314A (en) Heat dissipation device and electronic device having the same
TWI266599B (en) Clip adapted to heat sink
US20120043058A1 (en) Heat dissipation device
TW200846885A (en) Heat dissipation device
TW201315360A (en) Heat dissipation device
JP2000340726A (en) Heat sink with fan
TW201008473A (en) Heat dissipation device
TW201010591A (en) Heat dissipation device
US20070216022A1 (en) Fin structure for a heat sink
TWM260773U (en) Heat dissipating fins structure
TWI489077B (en) Heat sink
TW200813387A (en) Heat dissipation device
TW546802B (en) Electronic component cooling device

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees