M260773 八、新型說明： 【新型所屬之技術領域】 本創作係’-種散熱則，特·指—種相互堆疊卡扣在 用 以電子元件散熱之散熱鰭片組合結構。 w 【先前技術】 而若 件上安裝一散熱器進行輔助散熱 中央處理器等電子元件在正常之運行過程中都將産生大量的埶 不及時排出其産生之歸，將會影響電子元件之運行敎縣至造成: 燒毀=嚴重後果》因此，爲麵電子元件之正常運行，業界通常在電村 散熱器通常具有複數散_片，以增大散熱接觸面積，且目 多採用堆疊卡扣之方式製成所述散熱器之複數散熱鰭片結構，即利用銅= 铭等導熱金屬薄片以機械沖壓方式製得多個散熱則，並同時在散熱讀片 之間形成可相互卡扣連接之機構，之後再利用該機構將所述多個散^片 組合成-整體。第-圖即揭示-種由複數散熱鰭片202堆疊形成之散^ 片結構，每一散熱鰭片202之上下相對邊緣形成之折邊2〇4上設有由凸'= 206及嵌孔208組成之嵌卡機構，通過將後一散熱鰭片2〇2之凸起2〇6嵌入 前一散熱鰭片202之嵌孔208中而將多個散熱鰭片2〇2堆疊在一起。然二， 這種利用凸起206與嵌孔208相互組合之方式缺乏組裝穩固性，雖然散熱 縛片202之間具有-定之抵頂作用，但在外力之作用下很容易出現前後及 上下脫卡現象。 【新型内容】 本創作之目之在於提供一種散熱鰭片組合結構，其由複數散熱鰭片通 過卡扣機構堆疊形成，結合穩固且不易脫落。 本創作散熱鰭片組合結構具有複數散熱鰭片，每一散熱鰭片包括一板 體，板體之兩相對邊緣上各延伸設有折邊，折邊之前緣彎折延伸有一抵板， 折邊上形成有向後翻折之扣片，並于扣片形成位置留有一插口，後位散熱 鰭片之扣片可插入前位散熱鰭片之插口並鈎扣在前位散熱鰭片之抵板上， 而將所述複數散熱鰭片組合在一起。 本創作散熱鰭片組合結構通過在散熱鰭片板體之折邊上設置扣片，並 M260773 將扣片插入至形成之插口中而與抵板鈎扣，可將散熱鰭片穩固牢靠地堆疊 在一起，有效避免脫卡現象發生。 【實施方式】 請參照第二圖與第三圖，本創作散熱鰭片組合結構由複數散熱韓片10 堆疊形成，每一散熱鰭片10包括一板體12及設於板體12四角位置且相互 對稱之卡扣部14。 所述卡扣部14設在板體12之頂緣及底緣之二端部，每一^^扣部14包 括與板體12垂直延伸之一折邊142及由折邊142前緣彎折延伸之一抵板 144，該抵板144與板體12平行，用以抵靠相鄰散熱鰭片1〇之板體12而 使散熱續片10間保持一定間距。該折邊142上切製形成有向後翻折之扣片 146，同時在扣片146形成之位置留有一插口 148，其中扣片146連接在板 體12與折邊142之交接處，而插口 148由扣片146位置延伸至折邊142與 抵板144之交接處。另外，散熱鰭片10底緣進一步設有一基板16，該基板 16連接位於底緣二端部之折邊142並且與其位於同一平面上。 組裝時，後位散熱鰭片10之扣片146對應前位散熱鰭片1〇之插口 148, 通過組裝工具如沖頭等將扣片146折彎並伸入至前位散熱鰭片1〇之插口 148内，此時扣片146被折彎大體呈“U”形並鈎扣在前位散熱鰭片1〇之抵 板144上’而將所述複數散熱鰭片穩固地組合在一起。組裝完成之散熱 鰭片組可通過其底緣之平面貼設在一導熱基座（圖未示）上，或者直接貼 設於電子元件上進行散熱，或結合熱管運用。 第四圖揭示本創作所使用散熱鰭片之另一種實施例，其與第三圖不同 之處在於所述卡扣部14形成在該散熱鰭片1〇，板體12兩側之上下二端部， 而板體12之底緣則形成爲一基板16,。 綜上所述，本創作符合新型專利要件，爰依法提出專利申請。惟，以 上所述者僅為本創作之較佳實施例，舉凡熟悉本紐藝之人士，在爱依本 創作精神所作之等效修飾或變化，皆應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 第一圖係現有散熱鰭片組合結構之立體圖。 第一圖係本創作散熱藉片組合結構之立體圖。 第二圖係第二圖中單個散熱籍片之立體圖。 M260773 第四圖係本創作散熱鰭片組合結構中散熱鰭片之又一實施例。 【主要元件符號說明】 散熱鰭片 10、10 丨 板體 12 卡扣部 14 折邊 142 抵板 144 扣片 146 插口 148 基板 16、16丨M260773 8. Description of the new type: [Technical field to which the new type belongs] This creative system is a kind of heat dissipation rule, especially refers to a kind of heat sinking fin combination structure that is used for heat dissipation of electronic components. w [Previous technology] And if a radiator is installed on the piece to assist the cooling of electronic components such as the central processing unit, a large number of them will be generated during normal operation. Failure to timely discharge the results will affect the operation of electronic components. County to cause: Burning = serious consequences. Therefore, for the normal operation of electronic components, the industry usually has a plurality of scattered radiators in the village to increase the contact area for heat dissipation. The heat sink has a plurality of heat dissipation fin structures, that is, a plurality of heat dissipation rules are produced by mechanical stamping using a thermally conductive metal sheet such as copper = ming, and at the same time, a mechanism that can be snap-connected to each other is formed between the heat dissipation readers. The mechanism is then used to combine the multiple pieces into a whole. The first figure is a kind of scattered fin structure formed by stacking a plurality of heat dissipation fins 202. Each of the heat dissipation fins 202 has a folded edge 204 formed by a convex edge 206 and a recess 208. The card inserting mechanism is formed by stacking a plurality of heat radiating fins 202 together by inserting the protrusions 206 of the latter heat radiating fins 202 into the insertion holes 208 of the previous heat radiating fins 202. However, this combination of using the protrusions 206 and the insertion holes 208 lacks assembly stability. Although the heat-dissipating fins 202 have a fixed resistance, it is easy to get stuck back and forth and up and down due to external forces. phenomenon. [New content] The purpose of this creation is to provide a heat sink fin combination structure, which is formed by stacking a plurality of heat sink fins through a snap mechanism, which is stable and not easy to fall off. This creative fin combination structure has a plurality of fins. Each fin includes a plate body. Two opposite edges of the plate body are provided with folds, and the front edge of the fold is extended with an abutting plate. A buckle folds backward is formed on the top, and a socket is left at the position where the buckle is formed. The buckle of the rear heat radiation fin can be inserted into the socket of the front heat radiation fin and hooked on the abutting plate of the front heat radiation fin. And combining the plurality of heat dissipation fins together. This creative heat sink fin combination structure is provided with a buckle on the hem of the heat sink fin body, and M260773 inserts the buckle into the formed socket and hooks it against the board, so that the heat sink fins can be stably stacked on the board. Together, it can effectively prevent the occurrence of card jamming. [Embodiment] Please refer to the second and third figures. The combined heat sink fin structure is formed by stacking a plurality of heat sink fins 10. Each heat sink fin 10 includes a board 12 and four corners of the board 12 and Symmetric symmetrical buckle portion 14. The buckle portions 14 are provided at two ends of the top edge and the bottom edge of the plate body 12, and each of the buckle portions 14 includes a fold 142 extending perpendicular to the plate body 12 and bent by the front edge of the fold 142. One extension plate 144 extends parallel to the plate body 12 and is used to abut the plate body 12 of the adjacent heat dissipation fins 10 so as to maintain a certain distance between the heat dissipation continuous pieces 10. The folded edge 142 is cut and formed with a buckle 146 folded back, and a socket 148 is left at the position where the buckle 146 is formed. The buckle 146 is connected to the intersection of the board 12 and the flange 142, and the socket 148 Extending from the position of the buckle 146 to the intersection of the folded edge 142 and the abutting plate 144. In addition, a bottom plate 16 is further provided on the bottom edge of the heat dissipation fin 10, and the base plate 16 is connected to the folds 142 at the two ends of the bottom edge and is located on the same plane as the bottom edge. During assembly, the buckle 146 of the rear heat radiation fin 10 corresponds to the socket 148 of the front heat radiation fin 10, and the buckle 146 is bent and extended to the front heat radiation fin 10 through an assembly tool such as a punch. In the socket 148, at this time, the buckle 146 is generally bent into a “U” shape and is hooked on the abutting plate 144 of the front heat radiation fin 10 to firmly combine the plurality of heat radiation fins together. The assembled heat-dissipating fin group can be attached to a heat-conducting base (not shown) through the plane of its bottom edge, or directly attached to electronic components for heat dissipation, or combined with heat pipes. The fourth figure reveals another embodiment of the heat dissipation fin used in this creation, which is different from the third figure in that the buckle portion 14 is formed on the heat dissipation fin 10, and the upper and lower ends of the two sides of the plate 12 The bottom edge of the plate body 12 is formed as a substrate 16. In summary, this creation complies with the requirements for new patents, and a patent application is filed in accordance with the law. However, the above is only a preferred embodiment of this creation. For example, those who are familiar with this new art, the equivalent modifications or changes made in the spirit of this creation should be covered by the following patent applications. [Brief Description of the Drawings] The first figure is a perspective view of a conventional heat sink fin combination structure. The first picture is a three-dimensional view of the combined structure of the cooling fins. The second figure is a perspective view of a single heat sink sheet in the second figure. The fourth picture of M260773 is another embodiment of the cooling fins in the combined cooling fin structure. [Description of main component symbols] Radiating fins 10, 10 丨 Plate 12 Clip portion 14 Folding edge 142 Abutting plate 144 Buckle 146 Socket 148 Substrate 16, 16 丨