201010591 九、發明說明： 【發明所屬之技術領域】 種對電子元件 本發明涉及一種散熱裝置，特別係指一 散熱之散熱裝置。 【先前技術】 曰安裝於電路板上之電子元n件在運行時會產生大量之 =量’這些熱量如果不能被有效地散去，將直接導致溫度 似劇上升’而嚴重影響到電子元器件之I作性能及壽命。 為此，通常在電子元器件上安裝一散熱裝置來進行散熱。 傳統之散熱裝置包括-與電子元件導熱接觸之導執 板、一鰭片組、一位於導熱板上面用以支撐鰭片組之支撐 架及一穿設鰭片組和支撐架與導熱板相連接之熱管。該散 熱裝置在使用時，導熱板吸收電子元件產生之熱量，將熱 量傳遞給與導熱板接觸之熱管，然後熱管將熱量傳導至鰭 片組，利用鰭片組與空氣具有較大之接觸面積將熱量散發 鲁掉:然而，上述結構散熱裝置之支撐架直接與穿設其内之 熱管焊接固定而將鰭片組支撐於導熱板之上，惟，由於該 鰭片組由很多鰭片疊加而成，其通常具有較大重量，因此 在夂到外力之情況下，例如在運輸或碰撞過程中，容易出 現鰭片鬆動而脫離支撐架之情況，而使與熱管連接之鰭片 組產生變形，導致整個散熱裝置之散熱性能受到影響。 【發明内容】 有馨於此’有必要提供一種結構穩固之散熱装置。 一種散熱裝置，用於對電路板上之電子元件進行散 201010591 熱’其包括一與電子元件導熱接觸之導熱板、一由複數散 熱鰭片組成之鰭片組、一與導熱板接觸且支撐鰭片組之支 * 撐架及一向上穿設支撐架及鰭片組並與導熱板相連接之熱 « 管，所述鰭片組最下方之一散熱鰭片在臨近其二相對邊緣 位置處朝向支撐架延伸有二扣片，所述鰭片組承接在支撐 架之上且所述扣片向下穿過支撐架後彎折抵扣在支撐架下 方。 ❹ 與習知技術相比，本發明散熱裝置之鰭片組最下方之 韓片具有二扣片，支撐架具有與扣片對應之二扣孔，該複 數相互扣接之鰭片通過將該二扣片與支撐架之扣孔扣接而 將支推架與韓片組連接為一體，防止鰭片脫離支撐架，提 向了散熱装置之強度及穩定性。 【實施方式】201010591 IX. Description of the Invention: [Technical Field] The present invention relates to a heat dissipating device, and more particularly to a heat dissipating device for dissipating heat. [Prior Art] 电子 The electronic components mounted on the circuit board generate a large amount of quantity during operation. If the heat cannot be effectively dissipated, it will directly cause the temperature to rise sharply, which will seriously affect the electronic components. I for performance and longevity. To this end, a heat sink is usually mounted on the electronic component for heat dissipation. The conventional heat sink includes a guide plate that is in thermal contact with the electronic component, a fin set, a support frame on the heat transfer plate for supporting the fin set, and a through fin set and the support frame are connected to the heat conductive plate. Heat pipe. When the heat dissipating device is in use, the heat conducting plate absorbs heat generated by the electronic component, transfers heat to the heat pipe that is in contact with the heat conducting plate, and then the heat pipe conducts heat to the fin group, and the fin group has a larger contact area with air. The heat dissipation is detached: however, the support frame of the above-mentioned structural heat dissipating device is directly fixed to the heat pipe disposed therein to support the fin group on the heat conducting plate, but since the fin group is superposed by many fins , which usually has a large weight, so that in the case of external force, for example, during transportation or collision, the fins are prone to loosening out of the support frame, and the fin group connected to the heat pipe is deformed, resulting in deformation. The heat dissipation performance of the entire heat sink is affected. SUMMARY OF THE INVENTION It is necessary to provide a structurally stable heat sink. A heat dissipating device for dispersing electronic components on a circuit board 201010591 heat comprising a heat conducting plate in thermal contact with the electronic component, a fin group composed of a plurality of heat radiating fins, a contact with the heat conducting plate and supporting the fin a support of the support group* and a heat pipe that is connected to the support frame and the fin group and connected to the heat conduction plate, and one of the fin fins at the bottom of the fin group is adjacent to the opposite edge positions thereof The support frame extends with two buckle pieces. The fin set is received on the support frame and the buckle piece is bent downwardly through the support frame to be bent under the support frame.韩 Compared with the prior art, the Korean film at the bottom of the fin set of the heat dissipating device of the present invention has two buckle pieces, and the support frame has two button holes corresponding to the buckle piece, and the plurality of mutually fastened fins pass the two The buckle is fastened to the buckle hole of the support frame, and the support frame and the Korean film group are integrally connected to prevent the fin from coming off the support frame, and the strength and stability of the heat dissipation device are improved. [Embodiment]
如圖1所示，本發明之散熱裝置用於對安裝在一電路 板60上之一電子元件62進行散熱，該散熱裝置包括一導 熱板1〇~、通過底部與導熱板10導熱接觸之一熱管20、用 於將熱管20固定在導熱板1〇上之一固定板3〇、一鰭片組 〇及支撐鰭片組40之支稽架5〇。 杯夕時參照圖2和圖3,該導熱板10由銅等導熱性良 勒材料製成，用於吸收電路板60上電子元件產 二=:該導熱板10包括一方形本…自本體η 中央向内、向外延伸出之四凸緣16。該本體11頂部表面 深产：於凹？形成一矩形凹槽12,用以容置固定板30,其 X、；固定板3G之高度。該導熱板1G頂部表面向内凹 7 201010591 陷開設有將凹槽12垂直平分為兩部分之一通槽14,該通 槽14之輪廓與熱管20底部之輪廓一致，用以收容熱管20 參 底部，其向内凹陷之深度大於凹槽12之深度。每一凸緣 • 16開設一貫通導熱板10之固定孔160，用以供固定件64 穿過將導熱板10固定在電路板60下方之一背板66上。該 凹槽12位於通槽14兩侧之底部表面上分別開設二螺孔 120，以與穿過固定板30之螺釘36配合。 該熱管20大致呈U形彎曲，其具有一水平之蒸發段 參22、與蒸發段22垂直之二冷凝段24及分別連接蒸發段22 與冷凝段24之二弧形連接段26。該二連接段26朝二冷凝 段24共面之一侧彎曲延伸而使蒸發段22與二冷凝段24 不在同一平面上，熱管20底部之蒸發段22及部分連接段 26收容於導熱板10之通槽14内，熱管20之冷凝段24穿 設於鰭片組40内。 該固定板30用以將熱管20之底部之蒸發段22固定在 參導熱板10上，其底部開設一具有半圓弧形截面之溝槽32， 用以與導熱板10之通槽14配合夾置熱管20之蒸發段22, 該固定板30之兩端各開設一透孔34，用以供螺釘36穿過 與導熱板10之螺孔120配合而將夾置熱管20蒸發段22 之固定板3 0固定在導熱板10上。 該鰭片組40由複數相互間隔、平行之鰭片42扣接而 成，每一鰭片42由銅、鋁等導熱性良好之金屬材料形成。 每一鰭片42包括一本體422及自本體422兩端沿一侧彎折 形成之折邊424。每一鰭片42兩端折邊424之延伸方向相 201010591 靠相鄰鰭片42之本體422 ’從而在鰭片組40兩侧 平面’使鰭片組40之各鰭片42間保持等距平行 片二:間沿兩端之折邊424相互扣接。位於所述鰭 片組4〇取下方且較其他之鰭片42靠近支撐架5〇之 42上朝向支揮架5〇向下衝壓形成二扣片426，與扣片 對應之本體422上則形成二沖孔421，所述二沖孔421位 於5亥本體422相對兩端且靠近相應之折邊424，每-沖孔 421之形狀呈凸，，字形。所述二扣片426靠近該韓片42 之兩端向下衝壓形成’其形狀與沖孔421之形狀相對應， 即每一扣片426具有—矩形本體426〇及一自本體末端 4260中央位置處延伸之扣鉤4262。該鰭片組4〇開設二貫 穿鰭片組40之通孔44，用以供熱管20之二冷凝段24穿 設。 該支樓架50位於鰭片組4〇底部且與導熱板1〇接觸， "玄支撐架50之厚度大於上面鰭片組4〇中每一鰭片42之厚 春度，以將鰭片組40支撐於其上，該支撐架5〇由一水平板 經數次f折形成’從而增加了支撐架5〇之強度，有利於承 載上面鰭片組40之重量。該支撐架5〇包括一位於中間之 連接部52、自連接部52兩端垂直向下再水平向外再垂直 向上延伸而成之二抵靠部54、分別自二抵靠部54自由末 端水平向外延伸形成之二臂部56及自二臂部56末端垂直 向下延伸形成二折邊58。該二抵靠部54大致彎折成U形’ 其底部平面與導熱板1〇頂面相抵頂，用以防止鰭片組40 及穿設鰭片組40之熱管20傾斜，從而使鰭片組40及穿設 201010591 鰭片組40之熱管20穩固定位在導熱板1〇上。該二抿靠部 • 54底部中央開設二凹口 57,用以收容熱管加之連接段 26。在支撐架50對應鰭片組40最下方鰭片42之每—扣片 426位置處開設二扣孔％，用以供最下方鰭片42之扣片 426向下穿過。5亥最下方鰭片42之扣片在穿過支撐架 50之扣孔59 #垂直彎折出抵靠在支料5〇纟面之扣釣 4262，從而將支撐架50與相互扣合連接之鰭片42緊密連 接。 組裝忒散熱裝置時，首先將熱管2〇底部對準導熱板 10之通槽14嵌入，將固定板30對準導熱板10之凹槽、12 嵌入’此時固定板30底部之溝槽32與導熱板1〇頂部之通 槽14配合將熱管20夾置在導熱板1〇和固定板如之間， 一螺釘36穿過固定板30上之透孔34與導熱板1〇上之二 螺孔120螺合而將固定板30固定在導熱板1〇上；然後^ 鰭片組40最下方鰭片42之扣片426對準支撐架％相應之 籲扣孔59穿入，該最下方鰭片42之扣片426在穿過支撐架 50之扣孔59後垂直彎折出抵靠在支撐架5〇底面之扣鉤 4262 j從而將支撐架5〇與相互扣合連接之鰭片緊密連 接，最後將鰭片組40之通孔44對準導熱板1〇上之熱管 20冷凝段24之頂端，向下移動鰭片組4〇使熱管2〇冷凝 段24之頂端進入鰭片組4〇之通孔44，直至鰭片組4〇底 部之支撐架50之抵靠部54抵頂在導熱板1〇上，從而將鰭 片組40及穿設鰭片組4〇之熱管2〇穩固定位在導熱板ι〇 上，完成散熱裝置之組裝。 201010591 與習知技術相比，本發明散熱裝置之縛片组4〇最下方 ^鰭片42具有二扣片426，支撐架5〇具有與扣片似對 f之一扣孔59’該複數相互扣接之鰭片42通過將該二扣 426與支㈣％之扣孔59扣接而將支 ㈣接為一體，防止籍片42脫離支撐架5〇，提 ^ 裝置之強度及穩定性。 如圖4所示，可以理解地，本發明轉片組4 片42之間之卡扣亦可採用將扣合結構例如扣片426及心L 於每-散熱鰭片42之本體422上，使扣片 :^目鄰散熱韓片422之沖孔421中’如此可以將扣合結 ^隱=散熱鰭片，且40之内部’而不必將扣合結構設置於 母一散熱鰭片42之折邊424卜，又描τ μ如 作者造成刮傷。+僅不美觀而且容易對操 綜上所述’本發明符合發明專利要件，爰依法提出專利 本m料者僅為本發明之較佳實_，舉凡熟悉 •化I二人Γ在麦依本發明精神所作之等效修飾或變 旮應涵蓋於以下之申請專利範圍内。 【圖式簡單說明】 圖1係本發明散熱裝置之組裝示意圖。 圖2係圖1散熱裝置—種角度之立體分解圖。 圖3係圖1散熱裝置另一角度之立體分解圖。 圖一4係本發明另一實施例中散熱鰭片之立體組裝圖 主要元件符號說明】 導熱板 10 本體 11 11 201010591 凹槽 12 螺孔 120 通槽 14 凸緣 16 固定孔 160 熱管 20 蒸發段 22 冷凝段 24 連接段 26 固定板 30 溝槽 32 透孔 34 螺釘 36 鳍片組 40 鳍片 42 衝孑L 421 本體 422 折邊 424 折片 426 本體 4260 扣鈎 4262 支撐架 50 連接部 52 抵靠部 54 臂部 56 凹口 57 折邊 58 扣孔 59 ❹ 電路板 60 電子元件 62 固定件 64 背板 66 12As shown in FIG. 1 , the heat dissipating device of the present invention is used for dissipating heat from an electronic component 62 mounted on a circuit board 60. The heat dissipating device includes a heat conducting plate 1 〇~, and one of the heat conducting plates 10 is thermally contacted through the bottom portion. The heat pipe 20 is used for fixing the heat pipe 20 to one of the fixing plates 3 导热 on the heat conducting plate 1 , a fin group 〇 and the supporting frame 5 supporting the fin group 40 . Referring to FIG. 2 and FIG. 3, the heat conducting plate 10 is made of a thermal conductive material such as copper for absorbing the electronic components on the circuit board 60. The heat conducting plate 10 includes a square shape... from the body η The four flanges 16 extend inwardly and outwardly from the center. The top surface of the body 11 is deep: in concave? A rectangular recess 12 is formed for receiving the fixing plate 30, X, and the height of the fixing plate 3G. The top surface of the heat conducting plate 1G is inwardly recessed 7 201010591. The through groove 14 is formed by vertically dividing the groove 12 into two parts. The contour of the through groove 14 is consistent with the contour of the bottom of the heat pipe 20 for accommodating the heat pipe 20 to the bottom. The depth of the inward depression is greater than the depth of the groove 12. Each of the flanges 16 defines a fixing hole 160 extending through the heat conducting plate 10 for fixing the fixing member 64 to fix the heat conducting plate 10 to one of the back plates 66 below the circuit board 60. The groove 12 defines two screw holes 120 on the bottom surfaces of the two sides of the through groove 14 to cooperate with the screws 36 passing through the fixing plate 30. The heat pipe 20 is generally U-shaped and has a horizontal evaporating section 22, two condensing sections 24 perpendicular to the evaporating section 22, and two arcuate connecting sections 26 connecting the evaporating section 22 and the condensing section 24, respectively. The two connecting sections 26 are bent and extended toward one side of the two condensing sections 24 so that the evaporation section 22 and the two condensing sections 24 are not in the same plane, and the evaporation section 22 and the partial connecting section 26 at the bottom of the heat pipe 20 are received in the heat conducting plate 10 In the through groove 14, the condensation section 24 of the heat pipe 20 is bored in the fin set 40. The fixing plate 30 is configured to fix the evaporation section 22 at the bottom of the heat pipe 20 to the heat conducting plate 10, and a groove 32 having a semi-circular cross section is formed at the bottom thereof for clamping with the through groove 14 of the heat conducting plate 10. The evaporation section 22 of the heat pipe 20 defines a through hole 34 at each end of the fixing plate 30 for the screw 36 to pass through the screw hole 120 of the heat conducting plate 10 to sandwich the fixing plate 3 of the evaporation section 22 of the heat pipe 20. 0 is fixed on the heat conducting plate 10. The fin group 40 is formed by a plurality of fins 42 spaced apart from each other and parallel to each other, and each of the fins 42 is formed of a metal material having good thermal conductivity such as copper or aluminum. Each fin 42 includes a body 422 and a flange 424 formed from one end of the body 422 and bent along one side. The extending direction of the two ends 424 of each fin 42 is 201010591, and the body 422 ' of the adjacent fins 42 so that the fins on both sides of the fin group 40 keep the fins 42 of the fin set 40 equidistantly parallel. Piece 2: The hem 424 is fastened to each other along the two ends. The second fin 426 is formed on the body 54 of the fin assembly 4 and is closer to the support frame 5 than the other fins 42. The second body 422 is formed on the body 422 corresponding to the buckle. The two punching holes 421 are located at opposite ends of the 5 hai body 422 and adjacent to the corresponding hem 424. The shape of each punching hole 421 is convex and shaped. The two cleats 426 are stamped down near the ends of the Korean piece 42 to form a shape corresponding to the shape of the punching holes 421, that is, each cleat 426 has a rectangular body 426 and a central position from the body end 4260. Extending the hook 4262. The fin group 4 defines a through hole 44 extending through the fin group 40 for the two condensation sections 24 of the heat pipe 20. The truss 50 is located at the bottom of the fin set 4〇 and is in contact with the heat conducting plate 1 ,. The thickness of the sill support frame 50 is greater than the thickness of each fin 42 of the upper fin set 4 , to the fins. The group 40 is supported thereon, and the support frame 5 is formed by a plurality of f-folds of a horizontal plate to increase the strength of the support frame 5, which is advantageous for carrying the weight of the upper fin set 40. The support frame 5 includes a connecting portion 52 at the middle, two abutting portions 54 extending vertically from the two ends of the connecting portion 52, and then horizontally extending outwardly and vertically upwards, respectively, from the free end of the two abutting portions 54 The two arm portions 56 formed to extend outwardly extend perpendicularly downward from the ends of the two arm portions 56 to form a double folded edge 58. The two abutting portions 54 are substantially bent into a U-shaped shape, and the bottom plane thereof abuts against the top surface of the heat conducting plate 1 to prevent the fin group 40 and the heat pipe 20 passing through the fin group 40 from tilting, thereby making the fin group 40 and the heat pipe 20 of the 201010591 fin set 40 are stably fixed on the heat conducting plate 1〇. The two yokes are provided with two notches 57 at the center of the bottom of the 54 for accommodating the heat pipes and the connecting section 26. At the position of the buckle 426 of each of the lowermost fins 42 of the support frame 50 corresponding to the fin set 40, two buttonholes 5% are opened for the gusset 426 of the lowermost fin 42 to pass downward. The cleat of the lowermost fin 42 of the 5th hem is bent vertically through the buckle hole 59 of the support frame 50 to be bent against the buckle 4262 of the support 5, thereby fastening the support frame 50 to each other. The fins 42 are tightly connected. When assembling the heat sink, first insert the bottom of the heat pipe 2〇 into the through groove 14 of the heat conducting plate 10, align the fixing plate 30 with the groove of the heat conducting plate 10, and insert 12 into the groove 32 at the bottom of the fixing plate 30. The through groove 14 at the top of the heat conducting plate 1 is disposed to sandwich the heat pipe 20 between the heat conducting plate 1 and the fixing plate, and a screw 36 passes through the through hole 34 of the fixing plate 30 and the two screw holes on the heat conducting plate 1 120 is screwed to fix the fixing plate 30 on the heat conducting plate 1; then the cleat 426 of the lowermost fin 42 of the fin group 40 is aligned with the corresponding snap hole 59 of the support frame, the lowermost fin The cleat 426 of the 42 is bent perpendicularly through the clasp 59 of the support frame 50 and is bent against the hook 4262 j of the bottom surface of the support frame 5 to tightly connect the support frame 5 to the fins that are fastened to each other. Finally, the through hole 44 of the fin set 40 is aligned with the top end of the condensation section 24 of the heat pipe 20 on the heat conducting plate 1 , and the fin set 4 is moved downward so that the top end of the heat pipe 2 〇 the condensation section 24 enters the fin group 4 The through hole 44 is up to the abutting portion 54 of the support frame 50 at the bottom of the fin group 4〇 on the heat conducting plate 1〇, thereby the fin group 40 and the through fin group 4〇 The heat pipe 2 is firmly fixed on the heat conducting plate ι〇 to complete the assembly of the heat sink. 201010591 Compared with the prior art, the lowermost fin 42 of the heat dissipating device of the present invention has two buckles 426, and the support frame 5 has a buttonhole 59' which is similar to the buckle. The fastened fins 42 are connected to each other by fastening the two buckles 426 and the four (four)% of the buttonholes 59 to prevent the pieces 42 from coming off the support frame 5, thereby improving the strength and stability of the device. As shown in FIG. 4, it can be understood that the buckle between the four sets 42 of the rotating film set of the present invention can also adopt a fastening structure such as the buckle piece 426 and the core L on the body 422 of each of the heat dissipation fins 42. The buckle: the eye is adjacent to the heat sink 422 of the punching hole 421 'so can be buckled ^ hidden = heat sink fins, and the inside of 40' without having to fasten the fastening structure to the female heat sink fin 42 Side 424, and τ μ as the author caused scratches. + It is only unsightly and easy to handle. The invention conforms to the patent requirements of the invention, and the patents are legally based on the fact that the invention is only a better example of the invention, and the familiar one is in the Maiyiben. Equivalent modifications or variations of the spirit of the invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing the assembly of a heat sink according to the present invention. Figure 2 is a perspective exploded view of the heat sink of Figure 1. 3 is an exploded perspective view of another embodiment of the heat sink of FIG. 1. FIG. 1 is a perspective view of a main assembly of a heat dissipating fin in another embodiment of the present invention.] heat conducting plate 10 body 11 11 201010591 groove 12 screw hole 120 through groove 14 flange 16 fixing hole 160 heat pipe 20 evaporation portion 22 Condensation section 24 Connection section 26 Fixing plate 30 Groove 32 Through hole 34 Screw 36 Fin set 40 Fin 42 Punching L 421 Body 422 Folding 424 Folding 426 Body 4260 Clasp 4262 Supporting frame 50 Connecting part 52 Abutment 54 Arm 56 Notch 57 Folding 58 Buckle 59 ❹ Circuit board 60 Electronics 62 Mounting 64 Backing plate 66 12