201227857 六、發明說明： f發明所屬之技術領域】 f先前技術】 助二：明係一種晶圓劈裂之前置檢測方法，尤指-種協 ㈤Μ破片晶圓的晶圓劈裂之前置檢測方法。 晶圓係藉由晶圓劈裂機被分割成多數晶粒，晶粒進一 1 載體上並執行電路佈設’接著進行封裝作業而製 片产7°件，其_ ’晶®在運送途中會因碰撞而產生破 月情形，又因晶圓的價格昂貴， λ曰π 貝尸吓Μ破片的晶圓仍需要進 八日日圓劈裂機進行分割作紫 丁刀4菜，避免浪費材料與成本，其中 ’曰日圓在進行劈裂之前，需要在曰 為要在日日圓上雷射切割出橫向、 縱向的預切線，接著進行保嗜虛理 曰^ 返仃保邊處理之後，再將處理過後的 曰:圓放置於晶圓劈裂機的工作台i，並以單一影像 凡：取晶圓的輪廓影像’並將資料傳輸至—運算單：，進 而：位晶圓，i晶圓劈裂機上的劈刀受驅動而對晶圓的預 切線處進行劈裂作業。 然而’破片晶圓的邊界呈不規則狀，以及預切線的長 二不-定，晶圓劈裂機對於不同長度的預切線均施加相 :的劈裂深度，於劈裂晶圓長度較短的預切線，施加的批 1強度超過其負荷而易損壞， ,, %方聚日日圓長度較長的預切 到，可能造成無法—次即劈斷預切線的情形，因此晶圓劈 【發明内容】 裂機需要對同—預切線重複劈裂，造成l費時之問題。 本七月之主要目的在於提供一種晶圓劈裂之前置檢測 201227857 =法’希藉此設計，改善現有晶κ劈裂方法無法破片 晶圓提供適當劈裂深度的問題。 為達：前揭㈣’本發明所設計之晶圓劈 置檢 /則万法，包含有： 一^像步驟’ n攝像單元操取破片晶圓的輪廊 ’並將資料傳送至一運算單元； 一定位步驟，將破片晶圓定位於一旋轉台上； 資料:步驟…—基準點，以破片晶圓的輪廟 =决疋-第二攝像單元的移動路徑，由第二攝像單元取 :切線與輪廓交界之座標資料，並傳送至運算單元以計 异每一預切線的長度；以及 運笪/疋劈裂深度步驟’依據每-預切線的長度，可由 運算早π的資料庫中找出對應的劈裂深度。 !上，，本發明晶圓劈裂之前置檢測方法利用第一 早X取得破片晶圓的輪廟，依此輪較料決定第二攝 片：：：：動路杈’讓第二攝像單元可以取得預切線與破 片=廊交界的座標資料，進一步計算出破片晶圓上每 員刀線的長度…資料庫中找出相應的 =度的資料可傳送至-控制單^該控制單元可控制晶 的:裂：的劈” ’以適當的劈裂深度劈裂破片晶圓上對應 广破片晶圓於劈裂之前，藉由晶圓劈裂之前 广法’彳以得知破片晶圓上預切線所需要的適當劈 τ以協助晶圓劈裂機的劈刀順利劈裂破片晶圓的 :冑免劈裂深度過大而損壞晶圓的情形，以及 劈裂深度過小而需要多次劈裂所造成的耗工費時問題。 201227857 【實施方式】 6月參閱圖1 ’為本發明晶圓劈裂之前置檢測方法之一較 佳貫施例，其包含有一攝像步驟、一定位步驟、一決定長 度步驟及一決定劈裂深度步驟。 該攝像步驟中，以一第一攝像單元擷取破片晶圓的輪 廓’並將資料傳送至一運算單元。 該定位步驟中，將破片晶圓定位於一旋轉台上，其中 忒疋位步驟係先調整破片晶圓的傾斜角度，再調整破片 曰^圓上縱向預切線、橫向預切線的位置，使縱向預切線、 橫向預切線與旋轉台的對位線對位。 該決定長度步驟中，先在旋轉台上的破片晶圓中取出 一基準點，可以取破片晶圓的端點作為基準點，如最高端 點或最低端點，再依據破片晶圓的輪廓資料決定一第二攝 像單元的移動路徑，由第二攝像單元取得預切線與輪廓交 界，座標資料，座標資料傳送至運算單元以計算破片晶圓 上每一預切線的長度。 該決定劈裂深度步驟中，依據該決定長度步驟中所計 算出每-預切線的長度’經由運算單元的資料庫中預設的 長度/深度對照表比對’可找出每一預切線適合的劈裂深度 〇 ^ JL· rrj ，丨四 < 刖，可|j 本發明晶圓劈裂之前置檢測方法，順利取得不同長度4 切線所需要的劈裂深度，便於晶圓劈裂機的劈刀有=碑 劈斷破片晶圓上的預切線，$而改善劈裂深度過大而衫 晶圓的情形，以及改善劈裂深度過小而需要多次劈裂所 201227857 成的耗工費時問題，提升破片晶圓的利用率並提高劈裂作 業的效率。 【圖式簡單說明】 圖1 :為本發明晶圓劈裂之前置檢測方法之一較佳實施 例之流程示意圖。 【主要元件符號說明】201227857 VI. Description of the invention: The technical field to which f invention belongs] f Prior art] Help 2: A method for detecting the pre-cracking of wafers, especially the wafer cleaving of the chip (5) Detection method. The wafer is divided into a plurality of crystal grains by a wafer splitting machine, the crystal grains are placed on a carrier, and the circuit layout is performed, and then the package operation is performed to produce a 7° piece, and the _ 'Crystal® is in transit. Collision and breakage of the moon, and because of the high price of the wafer, the λ曰π 尸 Μ Μ Μ Μ 的 的 的 仍 仍 仍 仍 仍 仍 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆 晶圆Among them, before the Japanese yen is splitting, it is necessary to cut the horizontal and vertical pre-cut lines on the laser on the Japanese yen, and then carry out the protection of the sputum and the sputum.曰: The circle is placed on the workbench i of the wafer splitting machine, and the single image is taken: the contour image of the wafer is taken and the data is transmitted to the operation sheet: and then: the wafer wafer, the i wafer splitting machine The upper boring tool is driven to split the pre-cut line of the wafer. However, the boundary of the fragmented wafer is irregular and the length of the pre-cut line is not fixed. The wafer splitting machine applies a phase splitting depth to the pre-cut lines of different lengths, and the length of the splitting wafer is shorter. The pre-cut line, the strength of the applied batch 1 exceeds its load and is easily damaged, and the pre-cut of the length of the square of the Japanese square is longer, which may result in the failure to cut the pre-cut line. Contents] The cracking machine needs to repeat the same-pre-cutting line, which causes a problem of time-consuming. The main purpose of this July is to provide a wafer splitting pre-detection. 201227857 = The law is designed to improve the existing cleavage of the κ splitting method. In order to achieve: (4) 'The wafer 检 / / 则 则 , , , , , , , , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本a positioning step of positioning the fragment wafer on a rotating table; data: step...-reference point, the wheel temple of the fragment wafer=decision-the movement path of the second camera unit, taken by the second camera unit: The coordinate data of the tangent and the contour boundary is transmitted to the arithmetic unit to calculate the length of each pre-cut line; and the transport/cracking depth step 'according to the length of each pre-cut line, can be found in the database of the early π operation The corresponding splitting depth is obtained. Above, the wafer chopping front detection method of the present invention utilizes the first early X to obtain the wheel temple of the fragment wafer, and according to this round, the second film is determined:::: moving path 杈 'for the second camera The unit can obtain the coordinate data of the pre-cut line and the fragment=lane boundary, and further calculate the length of each cutter line on the fragment wafer... The data of the corresponding degree can be found in the database to be transmitted to the control unit. Controlling the crystal: crack: 劈" 'clearing the fragmented wafer on the wafer with the appropriate splitting depth before the splitting of the wafer, before the crack is formed by the wafer splitting The appropriate 劈τ required for pre-cutting to assist the cleavage of the wafer splitting machine to crack the rupture of the wafer: the cleavage of the cleavage depth is too large and the wafer is damaged, and the cleavage depth is too small and requires multiple cracking The problem of labor and time-consuming is caused. 201227857 [Embodiment] Referring to FIG. 1 in June, FIG. 1 is a preferred embodiment of the wafer chopping front detection method, which comprises an imaging step, a positioning step, and a Determining the length step and a step of determining the splitting depth In the image capturing step, the contour of the fragmented wafer is captured by a first image capturing unit and the data is transferred to an arithmetic unit. In the positioning step, the fragment wafer is positioned on a rotating table, wherein the clamping step is First adjust the tilt angle of the fragment wafer, and then adjust the position of the longitudinal pre-cut line and the horizontal pre-cut line on the fragment ,^ circle, so that the longitudinal pre-cut line and the transverse pre-cut line are aligned with the alignment line of the rotary table. First, a reference point is taken out from the fragment wafer on the rotating table, and the end point of the fragment wafer can be taken as a reference point, such as the highest end point or the lowest end point, and then a second imaging unit is determined according to the contour data of the fragment wafer. The moving path, the second camera unit obtains the pre-cut line and the contour boundary, the coordinate data, and the coordinate data are transmitted to the arithmetic unit to calculate the length of each pre-cut line on the fragment wafer. The determining the splitting depth step is based on the determined length. The length of each pre-cut line calculated in the step 'matches the length/depth comparison table preset in the database of the operation unit' to find out that each pre-cut line is suitable Splitting depth 〇^ JL· rrj , 丨 & 刖 可 j j j j j j j j j j 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本The boring tool has a pre-cut line on the broken wafer, and the problem of improving the cracking depth is too large and the wafer wafer is too large, and the time required to improve the cracking depth is too small and the multiple cracking of the 201227857 is required. Improve the utilization rate of the chip wafer and improve the efficiency of the cleaving operation. [Simplified Schematic] FIG. 1 is a schematic flow chart of a preferred embodiment of the wafer cleaving detection method according to the present invention. Description]