CN102689366A - *-character searching method of wafer fragment edge - Google Patents
*-character searching method of wafer fragment edge Download PDFInfo
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- CN102689366A CN102689366A CN2011100709758A CN201110070975A CN102689366A CN 102689366 A CN102689366 A CN 102689366A CN 2011100709758 A CN2011100709758 A CN 2011100709758A CN 201110070975 A CN201110070975 A CN 201110070975A CN 102689366 A CN102689366 A CN 102689366A
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Abstract
The invention provides a *-character searching method of a wafer fragment edge, which is used for searching a cracked edge of a wafer. The wafer is provided with a plurality of vertically-crossed first laser cutting lines and second laser cutting lines; and the first laser cutting lines and the second laser cutting lines are used for separating a plurality of crystal grains on the wafer. The *-character searching method comprises the following steps A-F of: step A, selecting a searching direction; step B, selecting one of the plurality of the crystal grains; step C, capturing a single crystal grain image; step D, judging whether the image of the crystal grain is an integral crystal grain or not; step E, if the image of the crystal grain is the integral crystal grain, moving along the searching direction and repeating the step C; and step F, if the image of the crystal grain is not the integral crystal grain, finishing and marking the position. According to the invention, the integral crystal grain at the outermost edge of the wafer can be accurately marked and times of moving along the searching direction can be automatically calculated, so that cutting times needing to be cut can be known by a user in advance and the cracking work is convenient to carry out.
Description
Technical field
The present invention relates to the processing method of cutting crystal wafer, relate in particular to the method for searching at a kind of wafer fragmentation edge.
Background technology
See also Fig. 1 and shown in Figure 2; It is the crystal grain of a grain that the wafer splitting machine is used for wafer 1 splitting, and to carry out follow-up packaging operation, wafer 1 is before carrying out splitting; Can be earlier go out laterally and laser cut line 2 longitudinally with cut; Laser cut line 2 on the wafer 1 does not rupture, and the thickness of its rough reservation 2/3rds links to each other, and then wafer 1 is attached a blue sheet 3 (or tunica albuginea); After wafer 1 top covers a diaphragm (figure do not show) and protects, send into a wafer splitting machine through a stationary fixture 4 and carry out the splitting operation again.
The wafer splitting machine comprises a workbench 5, a chopper 6, two splitting platforms 7 and image acquisition systems 8; This workbench 5 inserts and puts this stationary fixture 4; And can do moving and rotating of in-plane, this chopper 6 and these two splitting platforms 7 are divided into the both sides up and down of this wafer 1, so that this wafer 1 compresses this two splitting platforms 7; And knock the impulsive force that this chopper 6 produced through hammer (figure do not show) and carry out the splitting operation, 8 images that are used for this wafer 1 of intercepting of this image acquisition system.
According to and this wafer 1 can be through this chopper 6 impulsive force and the quantitative displacement of this workbench 5; A plurality of laser cut line 2 are carried out splitting continuously; Whether this image acquisition system 8 is then monitored the location of this wafer 1 and is squinted in continuous splitting process; Degree to look skew positions again, and when laterally promptly accomplishing the splitting operation with laser cut line 2 longitudinally after all by splitting.
Please consult shown in Figure 3ly again, wafer 9 might cause wafer 9 partial fracture because of the bump of external force, technology bad in the process of making, therefore for the wafer that damage is arranged 9, and before carrying out the splitting operation, the edge 10 that breaks that must the definite wafer 9 of elder generation.
The assay method at the edge 10 that breaks of known wafer 9 mainly is to utilize the full-view image capturing element to come pick-up image, and utilizes image treatment method to be directed against the edge 10 that breaks that the light and shade contrast judges wafer 9.This kind method needs the expensive full-view image capturing element of cost, and the image data of required processing is huge, is difficult to judge fast the position at edge 10 of breaking; And after the edge 10 that breaks is confirmed; The user before carrying out the splitting operation, the splitting cutter number that must convert required voluntarily, it is not only time-consuming and be easy to generate mistake; And cause splitting cutter number too much or not enough, and cause the unnecessary wearing and tearing of chopper or good being regarded as damaged and caused the technology acceptance rate low.
Summary of the invention
Therefore, main purpose of the present invention is to provide the rice word method for searching at a kind of wafer fragmentation edge, and it is with low cost and accurate, and the person of being easy to use carries out the splitting operation, and promotes acceptance rate, satisfies the demand on using.
Know via above; For realizing above-mentioned purpose; The present invention is the rice word method for searching at a kind of wafer fragmentation edge, is used to search the edge that breaks of a wafer, and this wafer has a plurality of first laser cut line that intersect vertically and second laser cut line; This first laser cut line and this second laser cut line are distinguished on this wafer and are separated out a plurality of crystal grain, and this method comprises:
Steps A: any moving direction of selecting to be parallel to this first laser cut line and this second laser cut line is a search direction;
Step B: select one of them of this a plurality of crystal grain;
Step C: capture single crystal grain image;
Step D: whether the image of judging this crystal grain is full die;
Step e: if the image of this crystal grain is a full die, then move, select this crystal grain of the next position and carry out step C again along this search direction;
Step F: if the image of crystal grain non-is full die, then finish and demarcate position here.
The further improved technical scheme according to the present invention, preferential this crystal grain selected of step B is the edge near this wafer, is the center towards this wafer and should search direction.
The further improved technical scheme according to the present invention; When carrying out step F,, carry out step G earlier and carry out a meter word bit and move if the image of this crystal grain is non-when being full die; Step G moves to left for vertical this search direction; With this crystal grain of selecting the left side and carry out step C again,, then finish and demarcate position here if when the image of double this crystal grain is non-when being full die.
The further improved technical scheme according to the present invention; When being full die as if the image of double this crystal grain is non-; The rice word bit of step G moves to vertical this search direction and moves to right; Select this crystal grain on right side and carry out step C again,, then finish and demarcate position here if when the image of continuous three these crystal grain is non-when being full die.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous three these crystal grain is non-; The rice word bit of step G moves to spending displacements along this search direction towards upper right 45 earlier; Select this crystal grain at diagonal angle and carry out step C again,, then finish and demarcate position here if when the image of continuous four these crystal grain is non-when being full die.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous four these crystal grain is non-; Then the rice word bit of step G moves to this crystal grain with the diagonal angle is datum mark, and vertical this search direction moves to right, and selects this crystal grain on right side and carries out step C again; If when the image of continuous five these crystal grain is non-when being full die, then finishes and demarcate position here.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous five these crystal grain is non-; Then the rice word bit of step G moves to this crystal grain with the diagonal angle is datum mark, and vertical this search direction moves to left, and selects this crystal grain in left side and carries out step C again; If when the image of continuous six these crystal grain is non-when being full die, then finishes and demarcate position here.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous six these crystal grain is non-; Also can get back to the capture position first time of continuous six captures earlier, and the rice word bit of step G move into along this searchs direction towards upper left 45 degree displacements, select this crystal grain at diagonal angle also to carry out step C again; If when the image of continuous seven these crystal grain is non-when being full die, then finishes and demarcate position here.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous seven these crystal grain is non-; The rice word bit of step G moves to this crystal grain with the diagonal angle is datum mark, and vertical this search direction moves to left, and selects this crystal grain in left side and carries out step C again; If when the image of continuous eight these crystal grain is non-when being full die, then finishes and demarcate position here.
The further improved technical scheme according to the present invention; When being full die as if the image of continuous eight these crystal grain is non-; The rice word bit of step G moves to this crystal grain with the diagonal angle is datum mark, and vertical this search direction moves to right, and selects this crystal grain on right side and carries out step C again; And when the image of continuous nine these crystal grain is non-when being full die, then finishes and demarcate position here.
In view of the above, the present invention can calibrate the full die that is positioned at the edge of this wafer accurately, and through the number of times that statistics moves along this search direction, can learn needs the cutter of splitting number.Therefore can make the quantity that the user learns in advance needs splitting, carry out, capture the image acquisition system that the crystal grain image can use known splitting machine again, therefore can save equipment cost, satisfy the demand that reduces cost with the splitting operation that makes things convenient for the user.
Description of drawings
Fig. 1 is the partial structurtes sketch map of known wafer splitting device;
Fig. 2 is the known structural representation of treating the splitting wafer;
Fig. 3 is the structural representation of known wafer fragmentation;
Fig. 4 is a process step sketch map of the present invention;
Fig. 5 is the structural representation of wafer fragmentation of the present invention; And
Fig. 6 is another process step sketch map of the present invention.
The specific embodiment
For making the auditor to characteristic of the present invention, purpose and effect, more deep understanding and approval are arranged, enumerate explanation of preferred embodiment and conjunction with figs. as back now:
See also Fig. 4 and shown in Figure 5; The present invention is the rice word method for searching at a kind of wafer fragmentation edge; Be used to search the edge 21 that breaks of a wafer 20, this wafer 20 has a plurality of first laser cut line 31 that intersect vertically and second laser cut line 32, and this first laser cut line 31 is distinguished on this wafer 20 with this second laser cut line 32 and is separated out a plurality of crystal grain 40; It comprises steps A～step F, and explanation is as follows:
Steps A is for selecting to search direction, and its moving direction that can select parallel this first laser cut line 31 or this second laser cut line 32 is as searching direction.
Step B is for selecting crystal grain 40; It is these a plurality of crystal grain 40 of selection one of them; And the preferable practice does; Preferential this crystal grain 40 selected of step B is the edge near this wafer 20, is towards the center of this wafer 20 and should search direction, to search the edge until these wafer 20 opposite sides by the edge of this wafer 20 towards these wafer 20 centers.
Step C is acquisition crystal grain 40 images, and it captures single crystal grain 40 images, and its equipment image acquisition system that can use splitting machine itself to be used to locate, and with reduction cost is set.
Step D is that image comparison is judged; Whether its image of judging this crystal grain 40 is full die, because the present invention captures the image of single crystal grain 40, its fixed in shape is simple; Therefore as long as handle, can confirm whether the image of this crystal grain 40 is full die via simple operation.
Step e is the next position capture, if the image of this crystal grain 40 is a full die, then continues to move along this search direction, and selects this crystal grain 40 of the next position and carry out step C again, to crystal grain 40 pick-up images of the next position.
Step F is a calibration position, if the image of crystal grain 40 non-be full die, then representative is here for the edge of wafer 20 or break edge 21, so can finish search and demarcate position here.And the statistics user searches direction moving displacement number of times along this, can learn total total several full die side by side, that is it needs the number of times of splitting to learn apace, if five full die are arranged side by side, then it needs splitting six times for instance.
Please consult shown in " Fig. 6 ", because the edge 21 that breaks of wafer 20 seldom breaks along this first laser cut line 31 and the direction of this second laser cut line 32, so the present invention is when carrying out step F again; If the image of this crystal grain 40 is non-when being full die, can carry out step G earlier and carry out a meter word bit and move, at first step G vertically this search direction move to left; With this crystal grain 40 of selecting the left side and get back to and carry out step C again; Its purpose is to confirm whether the crystal grain 40 in left side is full die, if full die, then representative needs to continue to search; If, could finish and demarcate position here when the image of double this crystal grain 40 is non-when being full die.
The flow process of leading portion perhaps can continue; When being full die as if the image of double this crystal grain 40 is non-; The rice word bit of step G moves vertically that this searchs direction moves to right, select this crystal grain 40 on right side and carry out step C again, its purpose be to confirm the crystal grain 40 on right side whether really non-be full die; If, can finish and demarcate position here when the image of continuous three these crystal grain 40 is non-when being full die.
Again for for the purpose of prudent; The flow process of leading portion can continue; The present invention can be in that the image of continuous three these crystal grain 40 be non-when being full die, the rice word bit of step G move can be earlier along this searchs direction towards upper right 45 degree displacements, select this crystal grain 40 at diagonal angle also to carry out step C again; Its purpose is to confirm whether the crystal grain 40 of upper right 45 degree is full die; If then need continuing to search, full die goes down, if, then can finish and demarcate position here when the image of continuous four these crystal grain 40 is non-when being full die.
The flow process of leading portion likewise can continue; When being full die as if the image of continuous four these crystal grain 40 is non-; Then the rice word bit of step G move can the diagonal angle this crystal grain 40 be datum mark, vertical this searchs direction moves to right, this crystal grain 40 on selection right side also carries out step C again; If when the image of continuous five these crystal grain 40 is non-when being full die, then finishes and demarcate position here.
The flow process of leading portion continues; When being full die as if the image of continuous five these crystal grain 40 is non-; Then the rice word bit of step G move can the diagonal angle this crystal grain 40 be datum mark, vertical this searchs direction moves to left, this crystal grain 40 on the left of selecting also carries out step C again; If when the image of continuous six these crystal grain 40 is non-when being full die, then finishes and demarcate position here.
When being full die as if the image of continuous six these crystal grain 40 is non-in addition; Also can get back to the capture position first time of continuous six captures earlier; And the rice word bit of step G moves to spending displacements along this search direction towards upper left 45; Select this crystal grain 40 at diagonal angle and carry out step C again,, then finish and demarcate position here if when the image of continuous seven these crystal grain 40 is non-when being full die.
The image of perhaps continuous seven these crystal grain 40 is non-when being full die; The rice word bit of step G move can the diagonal angle this crystal grain 40 be datum mark; Vertical this search direction moves to left; Select this crystal grain 40 in left side and carry out step C again,, finish again and demarcate position here if when the image of continuous eight these crystal grain 40 is non-when being full die.
The image of perhaps continuous eight these crystal grain 40 is non-when being full die; The rice word bit of step G move can the diagonal angle this crystal grain 40 be datum mark; Vertical this search direction moves to right; Select this crystal grain 40 on right side also to get back to and carry out step C again, and when the image of continuous nine these crystal grain 40 is non-when being full die, then finish and demarcate position here.
As stated, the present invention compares through capturing single crystal grain 40 images, if be judged as full die; Then move along this search direction, the capture of displacement the next position is if be judged as non-full die; Then finish and demarcate position here; Perhaps can the rice word bit mode of moving select contiguous crystal grain 40 to judge whether to be full die, what need specify at this be the order that meter word bit moves direction, not certain criterion; Just the present invention proposes a feasible order as stated, is not to be unique order.
In view of the above, the present invention can calibrate the full die that is positioned at the edge of this wafer 20 accurately, and the number of times that moves along this search direction through statistics, and learns and need the cutter of splitting number.It can make the number of times that the user learns needs splitting, carries out with the splitting operation that makes things convenient for the user, and it must not install the full-view image acquisition system additional in addition again, therefore the demand that satisfies in the use with low cost.
Claims (10)
1. the rice word method for searching at a wafer fragmentation edge; Be used to search the edge that breaks of a wafer (20); Said wafer (20) has a plurality of first laser cut line (31) that intersect vertically and second laser cut line (32); Said first laser cut line (31) goes up the district with said second laser cut line (32) in said wafer (20) and is separated out a plurality of crystal grain (40), it is characterized in that said method comprises:
Steps A: any moving direction of selecting to be parallel to said first laser cut line (31) and said second laser cut line (32) is one to search direction;
Step B: select one of them of said a plurality of crystal grain (40);
Step C: capture single crystal grain (40) image;
Step D: whether the image of judging said crystal grain (40) is full die;
Step e: if the image of said crystal grain (40) is a full die, then move, select the said crystal grain (40) of the next position and carry out step C again along said search direction;
Step F: if the image of said crystal grain (40) non-is full die, then finish and demarcate position here.
2. the rice word method for searching at wafer fragmentation according to claim 1 edge is characterized in that the preferential said crystal grain of selecting (40) of step B is the edge near said wafer (20), and said search direction is the center towards said wafer (20).
3. the rice word method for searching at wafer fragmentation according to claim 2 edge is characterized in that, when carrying out step F; When being full die as if the image of said crystal grain (40) is non-; Carry out step G earlier and carry out a meter word bit and move, step G is that vertical said search direction moves to left, with the said crystal grain (40) of selecting the left side and carry out step C again; If when the image of double said crystal grain (40) is non-when being full die, then finishes and demarcate position here.
4. the rice word method for searching at wafer fragmentation according to claim 3 edge; It is characterized in that; When being full die as if the image of double said crystal grain (40) is non-, the rice word bit of step G moves to vertical said search direction moves to right, and selects the said crystal grain (40) on right side and carries out step C again; If when the image of continuous three said crystal grain (40) is non-when being full die, then finishes and demarcate position here.
5. the rice word method for searching at wafer fragmentation according to claim 4 edge; It is characterized in that; When being full die as if the image of continuous three said crystal grain (40) is non-, it is that displacements are spent by the said search direction in edge court upper right 45 earlier that the rice word bit of step G moves, and selects the said crystal grain (40) at diagonal angle and carries out step C again; If when the image of continuous four said crystal grain (40) is non-when being full die, then finishes and demarcate position here.
6. the rice word method for searching at wafer fragmentation according to claim 5 edge; It is characterized in that, if the image of continuous four said crystal grain (40) is non-when be full die, then meter word bit of step G move into the said crystal grain (40) with the diagonal angle be datum mark; Vertical said search direction moves to right; Select the said crystal grain (40) on right side and carry out step C again,, then finish and demarcate position here if when the image of continuous five said crystal grain (40) is non-when being full die.
7. the rice word method for searching at wafer fragmentation according to claim 6 edge; It is characterized in that, if the image of continuous five said crystal grain (40) is non-when be full die, then meter word bit of step G move into the said crystal grain (40) with the diagonal angle be datum mark; Vertical said search direction moves to left; Select the said crystal grain (40) in left side and carry out step C again,, then finish and demarcate position here if when the image of continuous six said crystal grain (40) is non-when being full die.
8. the rice word method for searching at wafer fragmentation according to claim 7 edge; It is characterized in that, when being full die, also can get back to the capture position first time of continuous six captures earlier as if the image of continuous six said crystal grain (40) is non-; And the rice word bit of step G moves to spending displacements along said search direction towards upper left 45; Select the said crystal grain (40) at diagonal angle and carry out step C again,, then finish and demarcate position here if when the image of continuous seven said crystal grain (40) is non-when being full die.
9. the rice word method for searching at wafer fragmentation according to claim 8 edge; It is characterized in that, if the image of continuous seven said crystal grain (40) is non-when be full die, meter word bit of step G move into the said crystal grain (40) with the diagonal angle be datum mark; Vertical said search direction moves to left; Select the said crystal grain (40) in left side and carry out step C again,, then finish and demarcate position here if when the image of continuous eight said crystal grain (40) is non-when being full die.
10. the rice word method for searching at wafer fragmentation according to claim 9 edge; It is characterized in that, if the image of continuous eight said crystal grain (40) is non-when be full die, meter word bit of step G move into the said crystal grain (40) with the diagonal angle be datum mark; Vertical said search direction moves to right; Select the said crystal grain (40) on right side and carry out step C again, and when the image of continuous nine said crystal grain (40) is non-when being full die, then finish and demarcate position here.
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| CN2011100709758A CN102689366A (en) | 2011-03-23 | 2011-03-23 | *-character searching method of wafer fragment edge |
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| CN2011100709758A CN102689366A (en) | 2011-03-23 | 2011-03-23 | *-character searching method of wafer fragment edge |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103972120A (en) * | 2013-01-30 | 2014-08-06 | 正恩科技有限公司 | Wafer splitting position determining method and system |
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Application publication date: 20120926 |