CN103972120A - Wafer splitting position determining method and system - Google Patents
Wafer splitting position determining method and system Download PDFInfo
- Publication number
- CN103972120A CN103972120A CN201310037611.9A CN201310037611A CN103972120A CN 103972120 A CN103972120 A CN 103972120A CN 201310037611 A CN201310037611 A CN 201310037611A CN 103972120 A CN103972120 A CN 103972120A
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- splitting
- coordinate
- wafer
- panoramic view
- capture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
- H01L22/26—Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement
Abstract
The invention provides a wafer splitting position determining method and system. The system comprises a panoramic image capturing device, a splitting device, a standard sheet and a control element. The method includes A, establishing an image capturing coordinate system for the panoramic image capturing device; B, establishing a splitting coordinate system for the splitting device; C, placing the standard sheet in the position of the panoramic image capturing device and the position of the splitting device alternately, and establishing converting functions of the image capturing coordinate system and splitting coordinate system through the control element; D, acquiring contour image capturing coordinates of a wafer to be split through the panoramic image capturing device; E, converting the contour image capturing coordinates into a splitting edge coordinate through the control element according to the converting functions. Thus, the contour image capturing coordinates are acquired through the panoramic image capturing device, and the splitting edge coordinate can be acquired rapidly according to conversion of the converting functions.
Description
Technical field
The present invention relates to wafer splitting, especially relate to the method and system that obtain wafer splitting position.
Background technology
Refer to shown in Fig. 1 and Fig. 2; it is the crystal grain of a grain by wafer 1 splitting that wafer splitting machine is used for; to carry out follow-up encapsulation operation; wafer 1 is before carrying out splitting; can first go out laterally and longitudinal laser cut line 2 by laser cutting; laser cut line 2 on wafer 1 does not rupture; the thickness of its rough reservation 2/3rds is connected; then wafer 1 is attached to blue sheet 3(or a tunica albuginea); after wafer 1 top covers a diaphragm (not shown) and protected, send into a wafer splitting machine by a stationary fixture 4 and carry out splitting operation again.
Wafer splitting machine comprises a workbench 5, a chopper 6, two splitting platforms 7 and image capturing systems 8, sandwiched this stationary fixture 4 of this workbench 5, and can do movement and the rotation of in-plane, this chopper 6 and these two splitting platforms 7 are separately positioned on the both sides up and down of this wafer 1, so that this wafer 1 compresses this two splitting platforms 7, and knock by hammer (not shown) the impulsive force that this chopper 6 produces and carry out splitting operation, 8 of this image capturing systems are for intercepting the image of this wafer 1.
According to and this wafer 1 can pass through the impulsive force of this chopper 6 and the quantitative displacement of this workbench 5, multiple laser cut line 2 are carried out to splitting continuously, whether the location that this image capturing system 8 is monitored this wafer 1 in continuous splitting process is offset, re-start location with the degree depending on skew, and complete splitting operation after being laterally all split with longitudinal laser cut line 2.
Shown in Fig. 3, wafer 9 is in the process of manufacturing, likely cause wafer 9 partial fracture because of the shock of external force, technique bad, therefore for the wafer 9 that has damage, before carrying out splitting operation, must first determine the edge 10 that breaks of wafer 9, to know the lower cutter position of the first cutter when the splitting.
The assay method at the edge 10 that breaks of known wafer 9, mainly to utilize panoramic picture acquisition elements to gather image, and utilize image processing method to judge the Position Approximate at the edge 10 that breaks of wafer 9 for light and shade contrast, then recycle the image capturing system of splitting machine, respectively towards one direction displacement up and down, to search the splitting edge coordinate of obtaining the edge 10 that breaks.This kind of method at least needs to repeat to search 4 times, and to determine the splitting edge coordinate at the edge 10 that breaks up and down, it is suitable time-consuming, causes the efficiency of splitting low.
Summary of the invention
Therefore, main purpose of the present invention is to provide a kind of wafer splitting position measurement method, obtains the splitting edge coordinate of wafer with fast fetching, and to increase the efficiency of wafer splitting, improving yield, meets the demand on using.
Secondary objective of the present invention is to provide a kind of system of carrying out wafer splitting position measurement method, for carrying out wafer splitting operation.
Through as known from the above, for reaching above-mentioned purpose, system of the present invention comprises a panoramic view pick-up device, a splitting device, a standard film and a control element, and its method comprises steps A ~ E, wherein steps A: set up capture coordinate-system, for making a panoramic view pick-up device set up a capture coordinate-system, this panoramic view pick-up device is used for gathering an appearance profile of an object, and obtains a capture coordinate of this appearance profile; Step B: set up splitting coordinate-system, for making a splitting device set up a splitting coordinate-system, this splitting device has an image acquisition element, this image acquisition element is used for gathering a detail drawing picture of this object, and obtains a splitting coordinate of this detail drawing picture; Step C: set up transfer function, for making a standard film be placed in turn this panoramic view pick-up device place and this splitting device place, this standard film has the reference point of appearance profile and two known location coordinates of a known dimensions, it gathers the appearance profile of this standard film by this panoramic view pick-up device, and obtain this standard film one with reference to capture coordinate; Gather again two reference points of this standard film by this image acquisition element, and obtain respectively described two reference points one with reference to splitting coordinate; Finally by a control element, according to this appearance profile size of this standard film and this two reference point locations coordinates, this with reference to splitting coordinate, sets up a transfer function of this capture coordinate-system and this splitting coordinate-system with reference to capture coordinate and this; Step D: profile capture, for obtain a profile capture coordinate for the treatment of splitting wafer in this panoramic view pick-up device place; Step e: converted coordinate, for passing through this control element according to this transfer function, is a splitting edge coordinate by this profile capture Coordinate Conversion.
Accordingly, the present invention obtains this profile capture coordinate by panoramic view pick-up device, again according to the conversion of this transfer function, can fast fetching must this splitting edge coordinate,, the present invention does not need to look for this and treats the splitting edge coordinate of splitting wafer, and can save this and treat the edge search time of splitting wafer yet, to increase the efficiency of wafer splitting, meet the demand on using.
Brief description of the drawings
Fig. 1 is the partial structurtes schematic diagram of known wafer splitting device.
Fig. 2 is the known structural representation for the treatment of splitting wafer.
Fig. 3 is the structural representation of known wafer fragmentation.
Fig. 4 is the step schematic diagram of flow process of the present invention.
Fig. 5 is the schematic diagram of structure of the present invention.
Fig. 6 is the structure chart of standard film of the present invention.
Embodiment
For the those of ordinary skill that makes described field has more deep understanding and approval to feature of the present invention, object and effect, now enumerate preferred embodiment and coordinate brief description of the drawings as follows:
Refer to shown in Fig. 4, Fig. 5 and Fig. 6, the present invention is a kind of wafer splitting position measurement method and system, its system comprises a panoramic view pick-up device 20, a splitting device 30, a standard film 40 and a control element 50, and its method comprises: steps A: set up capture coordinate-system; Step B: set up splitting coordinate-system; Step C: set up transfer function; Step D: profile capture and step e: converted coordinate.
Wherein, steps A: set up capture coordinate-system, set up a capture coordinate-system for making this panoramic view pick-up device 20, this panoramic view pick-up device 20 is for gathering an appearance profile 41 of an object (not shown), and obtain a capture coordinate of this appearance profile 41, indication is set up coordinate-system herein, for referring to the capture optical condition of fixing panoramic view pick-up device 20, and only replaces by the object of capture.
Step B: set up splitting coordinate-system, set up a splitting coordinate-system for making this splitting device 30, this splitting device 30 has an image acquisition element 31, this image acquisition element 31 is for gathering a detail drawing picture of this object, and obtain a splitting coordinate of this detail drawing picture, same, indication is set up coordinate-system herein, for referring to the relative position of each parts of fixing splitting device 30.
Step C: set up transfer function, for making this standard film 40 be placed in turn these panoramic view pick-up device 20 places and this splitting device 30 places, this standard film 40 has the reference point 42 of appearance profile 41 and two known location coordinates of a known dimensions, also the specification of this standard film 40 is known, and can be used as Fundamentals of Measurement, therefore can gather the appearance profile 41 of these standard films 40 by this panoramic view pick-up device 20, and obtain this standard film 40 one with reference to capture coordinate; Gather two reference points 42 of these standard films 40 by this image acquisition element 31 again, and obtain respectively these two reference points 42 one with reference to splitting coordinate; Because this standard film 40 can be used as Fundamentals of Measurement, its appearance profile 41 sizes and two reference point 42 position coordinateses are all known, therefore can pass through this control element 50, according to these appearance profile 41 sizes and this two reference point 42 position coordinateses of this standard film 40, this is with reference to capture coordinate and this is with reference to splitting coordinate, set up a transfer function of this capture coordinate-system and this splitting coordinate-system, in other words, can fast this capture coordinate-system be converted to this splitting coordinate-system by this transfer function.
Step D: profile capture, obtain a profile capture coordinate for the treatment of splitting wafer 60 at these panoramic view pick-up device 20 places, and in practical operation after step D, can also further comprise a step D1: detect profile, for having judged whether profile capture, if continue next step, give the alarm if not.And in order to increase capture success rate, these panoramic view pick-up device 20 places can also be equiped with a polisher 21, and luminous in the time of this panoramic view pick-up device 20 capture, and this polisher 21 can be a backlight, so that uniform light source to be provided.
Step e: converted coordinate, for passing through this control element 50 according to this transfer function, be a splitting edge coordinate by this profile capture Coordinate Conversion, and before step e, this can be treated to splitting wafer 60 transfers load to this splitting device 30 places, and after this profile capture Coordinate Conversion is this splitting edge coordinate, can carry out splitting operation.
In addition, the present invention is after step C, also comprise a step C1: find out pivot, for making this standard film 40 be carried on 90-degree rotation on a rotation platform 70 in these splitting device 30 places, and obtain again a rotary reference splitting coordinate of described two reference points 42, to find out the pivot coordinate of this rotation platform 70, and after finding out pivot coordinate, can convert and learn that this treats the coordinate position after splitting wafer 60 90-degree rotations, thereby can directly carry out the splitting operation of other direction.
This panoramic view pick-up device 20 can be for obtaining the resolution of this panoramic view pick-up device 20 by these appearance profile 41 size conversions of this standard film 40 again, and can be converted by the resolution of this panoramic view pick-up device 20, this treats the distance of the edge of splitting wafer 60 and the central point of this panoramic view pick-up device 20, and learns the size that this treats splitting wafer 60.
As mentioned above, the present invention obtains this profile capture coordinate by panoramic view pick-up device, then according to the conversion of this transfer function, can obtain this splitting edge coordinate, and its advantage is at least as described below:
1. do not need to detect whether fragmentation of wafer, the present invention directly obtains this and treats the edge coordinate value of splitting wafer, and can directly arrange the lower cutter position of splitting, the complete wafer of its one size fits all and fragmentation wafer.
2. by first finding crystal round fringes profile, can quick computing and learn splitting edge coordinate, can increase the efficiency of carrying out splitting operation.
3. do not need to search the upper lower limb for the treatment of splitting wafer, can save search time.
4. can calculate and learn crystal circle center, even if wafer position skew (pasting askew with blue sheet) also can be carried out splitting operation.
Therefore, the present invention can increase the efficiency of wafer splitting really, meets the demand on using.
Claims (10)
1. a wafer splitting position measurement method, is characterized in that, comprises:
Steps A: set up capture coordinate-system, wherein, make a panoramic view pick-up device set up a capture coordinate-system, described panoramic view pick-up device is used for gathering an appearance profile of an object, and obtains a capture coordinate of described appearance profile;
Step B: set up splitting coordinate-system, wherein, make a splitting device set up a splitting coordinate-system, described splitting device has an image acquisition element, described image acquisition element is used for gathering a detail drawing picture of described object, and obtains a splitting coordinate of described detail drawing picture;
Step C: set up transfer function, wherein, make a standard film be placed in turn described panoramic view pick-up device place and described splitting device place, described standard film has two reference points of appearance profile and the known location coordinate of a known dimensions, gather the described appearance profile of described standard film by described panoramic view pick-up device, obtain described standard film one with reference to capture coordinate; Gather again described two reference points of described standard film by described image acquisition element, obtain respectively described two reference points one with reference to splitting coordinate; Finally by a control element, according to the size of described appearance profile and the position coordinates of described two reference points, described with reference to capture coordinate and described with reference to splitting coordinate of described standard film, and set up a transfer function of described capture coordinate-system and described splitting coordinate-system;
Step D: profile capture, wherein, obtains a profile capture coordinate for the treatment of splitting wafer in described panoramic view pick-up device place;
Step e: converted coordinate wherein, according to described transfer function, is a splitting edge coordinate by described profile capture Coordinate Conversion by described control element.
2. wafer splitting position measurement method according to claim 1, it is characterized in that, after described step C, also comprise a step C1: find out pivot, wherein, make described standard film be carried on 90-degree rotation on a rotation platform in described splitting device place, and obtain again a rotary reference splitting coordinate of described two reference points, to find out the pivot coordinate of described rotation platform.
3. wafer splitting position measurement method according to claim 1, is characterized in that, at described panoramic view pick-up device, place is also equiped with a polisher, and described polisher is luminous in the time of described panoramic view pick-up device capture.
4. wafer splitting position measurement method according to claim 3, is characterized in that, described polisher is a backlight.
5. wafer splitting position measurement method according to claim 1, it is characterized in that, described panoramic view pick-up device is that conversion obtains the resolution of described panoramic view pick-up device by the size of the described appearance profile of described standard film, and described in being converted by the described resolution of described panoramic view pick-up device, treats the distance of the edge of splitting wafer and the central point of described panoramic view pick-up device.
6. wafer splitting position measurement method according to claim 1, is characterized in that, after described step D, also comprises a step D1: detect profile, wherein, judged whether described profile capture, if so, carry out next step; If not, shut down and give the alarm.
7. a wafer splitting PALS (positioning and location system), is characterized in that, comprises:
One panoramic view pick-up device, described panoramic view pick-up device is set up a capture coordinate-system, and described panoramic view pick-up device is for gathering an appearance profile of an object, and obtains a capture coordinate of described appearance profile;
One splitting device, described splitting device is set up a splitting coordinate-system, and described splitting device has an image acquisition element, and described image acquisition element is used for gathering a detail drawing picture of described object, and obtains a splitting coordinate of described detail drawing picture;
One standard film, described standard film is placed in described panoramic view pick-up device place and described splitting device place in turn, described standard film has two reference points of appearance profile and the known location coordinate of a known dimensions, and described panoramic view pick-up device gathers the described appearance profile of described standard film, and obtain described standard film one with reference to capture coordinate; Described image acquisition element gathers described two reference points of described standard film again, and obtain respectively described two reference points one with reference to splitting coordinate;
One control element, described control element is according to the size of described appearance profile and the position coordinates of described two reference points, described with reference to capture coordinate and described with reference to splitting coordinate of described standard film, and set up a transfer function of described capture coordinate-system and described splitting coordinate-system, so that described control element treats that by one a profile capture Coordinate Conversion of splitting wafer is a splitting edge coordinate according to described transfer function.
8. wafer splitting PALS (positioning and location system) according to claim 7, is characterized in that, at described panoramic view pick-up device, place is also equiped with a polisher.
9. wafer splitting PALS (positioning and location system) according to claim 8, is characterized in that, described polisher is a backlight.
10. wafer splitting PALS (positioning and location system) according to claim 7, is characterized in that, described splitting device also comprises a rotation platform.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310037611.9A CN103972120B (en) | 2013-01-30 | 2013-01-30 | Wafer splitting position determining method and system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201310037611.9A CN103972120B (en) | 2013-01-30 | 2013-01-30 | Wafer splitting position determining method and system |
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| CN103972120A true CN103972120A (en) | 2014-08-06 |
| CN103972120B CN103972120B (en) | 2017-04-26 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105826255A (en) * | 2016-05-27 | 2016-08-03 | 扬州乾照光电有限公司 | LED wafer splitting method |
| CN110391159A (en) * | 2019-07-31 | 2019-10-29 | 沛顿科技（深圳）有限公司 | Wafer level packaging map error correction system solution |
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| US20070045574A1 (en) * | 2005-08-26 | 2007-03-01 | Bruland Kelly J | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target |
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| CN102689366A (en) * | 2011-03-23 | 2012-09-26 | 正恩科技有限公司 | *-character searching method of wafer fragment edge |
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2013
- 2013-01-30 CN CN201310037611.9A patent/CN103972120B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1405853A (en) * | 2001-08-16 | 2003-03-26 | 优力特科技股份有限公司 | Method for tracing wafer boundary |
| US20070045574A1 (en) * | 2005-08-26 | 2007-03-01 | Bruland Kelly J | Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target |
| CN102646611A (en) * | 2011-02-17 | 2012-08-22 | 竑腾科技股份有限公司 | Method for detecting height of wafer splitting breakpoint |
| CN102689366A (en) * | 2011-03-23 | 2012-09-26 | 正恩科技有限公司 | *-character searching method of wafer fragment edge |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105826255A (en) * | 2016-05-27 | 2016-08-03 | 扬州乾照光电有限公司 | LED wafer splitting method |
| CN110391159A (en) * | 2019-07-31 | 2019-10-29 | 沛顿科技（深圳）有限公司 | Wafer level packaging map error correction system solution |
| CN110391159B (en) * | 2019-07-31 | 2021-06-25 | 沛顿科技（深圳）有限公司 | Wafer packaging map error correction system solution |
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| CN103972120B (en) | 2017-04-26 |
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