CN1405853A - Method for tracing wafer boundary - Google Patents
Method for tracing wafer boundary Download PDFInfo
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- CN1405853A CN1405853A CN 01125712 CN01125712A CN1405853A CN 1405853 A CN1405853 A CN 1405853A CN 01125712 CN01125712 CN 01125712 CN 01125712 A CN01125712 A CN 01125712A CN 1405853 A CN1405853 A CN 1405853A
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Abstract
The method can be applicable to the cutting machine. The camera goes up, right and left to take picture and store the image of the fragment of wafer. The said image is compared with the chip of the master sample in order to obtain the upper boundary to cut. In a similar way, the low, left and right boundaries of the fragment of wafer can be determined accurately.
Description
[technical field]
The present invention relates to a kind of method for searching of wafer boundary, particularly relate to a kind of method that can accurately search the searching wafer boundary of wafer boundary automatically.
[background technology]
The area, Asia now has been world's wafer for the important area of processing, yet, violent day by day along with the globalization competition, as the mode of full blast how product being finished and delivered to has become a considerable problem in client's hand.
Existing a kind of wafer cutting machine 100, as Fig. 1,2, shown in 3, described cutting machine 100 has one can be along the X-direction move left and right, and can be around the cutting workbench 1 of Z-direction rotation, for putting a wafer (described wafer is a fragmentation wafer 101), one group of cutter shaft 2 and video camera 3 that can move forward and backward along Y direction synchronously, and described cutter shaft 2 can move up and down along Z-direction by oneself, and be provided with a blade 201, one can control the described cutting workbench 1 of driving, the central processing unit 4 of described cutter shaft 2 and described video camera 3, and a display 5 that links with described central processing unit 4, and also be provided with an analog/digital converter 401 between described video camera 3 and the described central processing unit 4 in regular turn, one image store device 402.
Whereby, the operator can utilize the described fragmentation wafer 101 after described wafer cutting machine 100 automatic cuttings align, but, please consult Fig. 4 again, because of described fragmentation wafer 101 is to be irregular shape, so, the operator can't cut described fragmentation wafer 101 in the mode of cutting full wafer, and must be before the described fragmentation wafer 101 of cutting, measure the cutting reference dimension L1 of described fragmentation wafer 101 earlier in artificial mode, L2, and with described cutting reference dimension L1, L2 imports the central processing unit 4 of described wafer cutting machine 100, with the imagination cutting border as described fragmentation wafer 101.Really, utilize the artificial measurement mode of this kind can set the imagination cutting border of described fragmentation wafer 101, still, the artificial measurement mode of this kind but has following shortcoming in practical operation:
One, the operator cuts described fragmentation wafer 101 for fear of leakage, described cutting reference dimension L1, L2 normally choose than the bigger numerical value of described fragmentation wafer 101 actual sizes, like this, tend to cause described blade 201 to produce excessive cut-in without ball, waste many times in rain in invalid cutting, when unit chip size littler (as the led chip of 0.2mm * 0.2mm), cut-in without ball is more time-consuming, thereby the production efficiency of influence integral body seriously.
Two, because the shape of each fragmentation wafer, big or small neither to the greatest extent identical, so, the operator is when each cutting, must measure the cutting reference dimension of each fragmentation wafer again and again, and the input of changing described wafer cutting machine 100 is again and again set, like this, not only trouble also can impact production efficiency.
[summary of the invention]
The object of the present invention is to provide a kind of method that can accurately search the searching wafer boundary of wafer boundary automatically when searching wafer boundary.
The present invention seeks the method for wafer boundary, applies to a cutting machine, and described cutting machine has: one can be along X-direction move left and right and can be around the cutting workbench of Z-direction rotation, for putting a workpiece to be cut; One group of cutter shaft and video camera that can move forward and backward along Y direction synchronously, and described cutter shaft can move up and down along Z-direction by oneself; One can control the central processing unit that drives described cutting workbench, described cutter shaft and described video camera; An and display that links with described central processing unit, and be placed on the workpiece described to be cut of described cutting workbench, but be formed with several and described central processing unit are photographed the identical and cutting and separating of a female sample chip of storage in advance by described video camera unit chip, described unit chip is identical shaped, and being array arranges, the per unit chip all has at least two cut direction, and the per unit chip all respectively is formed with a cutting distance on described cut direction; Be characterized in, said method comprising the steps of: one, the central point with the wherein unit chip of described workpiece to be cut is a commence search point; Two, will form coboundary point along the make progress place of translation one reference dimension of Y direction by described commence search point, corresponding described coboundary point, described commence search point forms boundary point; Three, with the mean value of the Y direction coordinate of described upper and lower boundary point, one first cutting distance divided by described workpiece to be cut one first cut direction parallel with Y direction, and round numbers, again described integer be multiply by the described first cutting distance, can obtain the new coordinate of a Y direction, the new coordinate of described Y direction forms one second and searches point; Four, described video camera is moved to described second and search point, take the described workpiece to be cut of access in the image at described place, and carry out image with described female sample chip and compare, if image relatively meets, described second coordinate of searching point then forms described lower boundary point, and subtracts each other with the described coboundary point of step 3 and to take absolute value, if image does not relatively meet, described second coordinate of searching point then forms described coboundary point, and subtracts each other with the described lower boundary point of step 3 and to take absolute value; Five, repeat recursion step three, step 4, set tolerance until the absolute value that described upper and lower boundary point subtracts each other less than one, the place that then described upper and lower boundary point approaches mutually forms one the 3rd and searches point; Six, search point with the described the 3rd and form one the 4th search point along X-direction to the place of right translation one horizontal reference distance, described horizontal reference distance equals the integral multiple length of one second cutting distance of described workpiece to be cut one second cut direction parallel with X-direction; Seven, described video camera is moved to the described the 4th search point, take the described workpiece to be cut of access in the image at described place, and carry out image with described female sample chip and compare, if image relatively meets, then search point and make progress translation one vertical reference distance to one the 5th search point along Y direction with the described the 4th, described vertical reference distance equals the integral multiple length of the described first cutting distance, and the described the 5th coordinate of searching point is formed the described the 4th search point, if image does not relatively meet, then search point and search point to the described horizontal reference distance of right translation to one the 6th, and the described the 6th coordinate of searching point is formed described the 4th search point along X-direction with the described the 4th; Eight, repeat step 7, until described four search point continuously along X-direction to the described horizontal reference distance of right translation to the described the 6th number of times of searching point greater than a parameter preset, and will the described the 4th search point and form one the 7th search point to the origin coordinates of right translation continuously; Nine, search point with the described the 7th and form one the 8th search point to the place of the described horizontal reference distance of left along X-direction; Ten, described video camera is moved to the described the 8th search point, take the described workpiece to be cut of access in the image at described place, and carry out image with described female sample chip and compare, if image relatively meets, then search point and make progress the described vertical reference distance of translation to one the 9th search point along Y direction with the described the 8th, and the described the 9th coordinate of searching point is formed the described the 8th search point, if image does not relatively meet, then search point and search point to the described horizontal reference distance of left to 1 the tenth, and the described the tenth coordinate of searching point is formed described the 8th search point along X-direction with the described the 8th; 11, repeat step 10, search point until described eight and search the number of times of point greater than described parameter preset along X-direction to the described horizontal reference distance the extremely described the tenth of left continuously, and search point with the described the 8th and form 1 the 11 to the origin coordinates of left continuously and search point, the described the 11 searches point is the absolute coboundary point of described workpiece to be cut on its first cut direction.
[description of drawings]
The present invention is described in detail below in conjunction with accompanying drawing and preferred embodiment:
Fig. 1 is the three-dimensional appearance schematic diagram of existing a kind of wafer cutting machine;
Fig. 2 is the schematic perspective view after existing described cutting machine is removed an external shell;
Fig. 3 is that the system of existing described cutting machine links schematic diagram;
Fig. 4 is a fragmentation wafer placement on a cutting workbench, and the floor map after aligning;
Fig. 5 is that a window of existing described kind of cutting machine shows that one is placed in the image of the master slice wafer on the described cutting workbench, and sets up the part plan schematic diagram of a female sample chip;
Fig. 6 is the floor map that is placed in before another fragmentation wafer does not align on the described cutting workbench;
Fig. 7 is the floor map of described fragmentation wafer sampling;
Fig. 8 is that described fragmentation wafer aligns schematic diagram automatically;
Fig. 9 is that aligning automatically of described fragmentation wafer finished schematic diagram;
Figure 10 is the flow chart of a preferred embodiment of the present invention;
Figure 11 is that schematic diagram () is searched in the coboundary of described preferred embodiment;
Figure 12 is that schematic diagram (two) is searched in the coboundary of described preferred embodiment;
Figure 13 is that schematic diagram (three) is searched in the coboundary of described preferred embodiment;
Figure 14 is that schematic diagram (four) is searched in the coboundary of described preferred embodiment;
Figure 15 is that schematic diagram (five) is searched in the coboundary of described preferred embodiment;
Figure 16 is that schematic diagram (six) is searched in the coboundary of described preferred embodiment;
Figure 17 is that schematic diagram (seven) is searched in the coboundary of described preferred embodiment;
Figure 18 is that schematic diagram (eight) is searched in the coboundary of described preferred embodiment;
Figure 19 is that schematic diagram (nine) is searched in the coboundary of described preferred embodiment;
Figure 20 is that schematic diagram (ten) is searched in the coboundary of described preferred embodiment;
Figure 21 is that schematic diagram (11) is searched in the coboundary of described preferred embodiment;
Figure 22 is that schematic diagram (12) is searched in the coboundary of described preferred embodiment;
Figure 23 is that schematic diagram is finished in the coboundary search of described preferred embodiment;
Figure 24 is that schematic diagram is finished in border, the upper and lower, left and right search of described preferred embodiment;
Figure 25 puts the floor map that multi-disc fragmentation wafer is arranged on the described cutting workbench.
[embodiment]
The present invention seeks a preferred embodiment of the method for wafer boundary, is to use with described cutting machine 100 collocation, and in the present embodiment, be to carry out a wafer earlier to align program automatically, and then carry out step of the present invention, still, this embodiment also is regardless of limit range of application of the present invention.
See also Fig. 5, the previous operations that described wafer aligns program automatically is earlier a master slice wafer 10 to be placed on the described cutting workbench 1, the image of then described master slice wafer 10 can be by a camera lens 301 of described video camera 3, by described analog/digital converter 401, described image store device 402 and described central processing unit 4 and in a window 501 of described display 5, show, but and be formed with the unit chip 11 of several cutting and separating on the described master slice wafer 10, described unit chip 11 all has one first cut direction y and one second cut direction x, and be array and arrange, and be separated with all between equal to each other and cut 12, described first, the second cut direction y, the last per unit chip 11 of x all respectively is formed with one first cutting distance D 1 and one second cutting distance D 2 (width (length) that described first (the second) the cutting distance D 1 (D2) equals described unit chip 11 adds the width of the above Cutting Road 12), and described first, the second cutting distance D 1, the length of D2 is the central point space D 3 that equals wantonly two unit chip 11 respectively, the length of D4, and when the window 501 of operator with visual described display 5, and after the mode that cooperates described cutting workbench 1 of manual adjustment and described video camera 3 aligns described master slice wafer 10, described video camera 3 can be photographed storage with the wherein image of a unit chip 11 on the described master slice wafer 10, and form it into a female sample chip 13, like this, promptly finish the previous operations that described wafer aligns program automatically, then when aligning one during with the fragmentation wafer 20 of described master slice wafer 10 same sizes, promptly can the described wafer program that aligns automatically be aligned automatically, the described wafer program of aligning automatically may further comprise the steps:
One, makes zero: see also Fig. 6, described central processing unit 4 can will be placed with that (the per unit chip 21 of described fragmentation wafer 20 is all unidimensional with described unit chip 11 with the described fragmentation wafer 20 of described master slice wafer 10 same sizes, and have identical first, second cut direction y, x and first, second cutting distance D 1, D2) described cutting workbench 1 and described video camera 3 drive and be adjusted to an initial point, make the camera lens 301 of described video camera 3 can be positioned at the top of described cutting workbench 1.
Two, sampling: see also Fig. 7, described central processing unit 4 is taken the image of the described fragmentation wafer 20 of access by the camera lens 301 of described video camera 3, and carry out image with described female sample chip 13 and compare, thereby select the unit chip that meets with described female sample chip 13, and it is respectively formed a subsample, adopt in the present embodiment three complete subsamples 22,23,24, and write down its center point coordinate value, in addition, in this step if can't choose at least two subsamples (for example on described fragmentation wafer 20 borders), described central processing unit 4 can drive described cutting workbench 1 along the X-direction translation, and drive described video camera 3 along the Y direction translation, so that described video camera 3 can photograph the image of at least two subsamples.
Three, calculate spacing: see also Fig. 7, described central processing unit 4 calculates interval S 1, S2, the S3 between the central point of wantonly two subsamples 22 and 23,23 and 24,22 and 24 respectively.
Four, calculate the spacing remainder: described central processing unit 4 will wantonly two subsamples 22 and 23,23 and 24,22 and 24 interval S 1, S2, S3, earlier the second cutting distance D 2 of the described second cut direction x is got remainder, the remainder reckling represents that described group of subsample is similarly to be positioned on the described second cut direction x.
Five, judge and choose wherein one group of subsample of remainder minimum: by Fig. 5,7 as can be known, described two subsamples 23, interval S 2 between 24 central point is central point space D 4 (considering the error of foozle and floating-point operation) of wantonly no better than two unit chip 11, and described central point space D 4 is to equal the described second cutting distance D 2, so, described two subsamples 23, the remainder that 2 pairs of described cutting distance D 2 of 24 interval S are got will approach zero, be that described central processing unit 4 is got and selected described two subsamples 23,24 is one group of subsample of remainder minimum, in addition, if the remainder of getting in this step is greater than a default tolerance value, represent that promptly described fragmentation wafer 20 is different with described master slice wafer 10 specifications, be to misplace on described cutting workbench 1, then described central processing unit 4 can stop the carrying out of subsequent step immediately, the concurrent information that makes mistake.
Six, as can be known, described group of subsample the 23, the 24th similarly is positioned on the described second cut direction x, sees also Fig. 8, and described central processing unit 4 drives described cutting workbench 1 with its table top central point (x by step 4, five
0, y
0) be centre of gyration point, rotate around Z-direction, the second cut direction x of described group of subsample 23,24 is turned on the horizontal line.
Seven, last, see also Fig. 9, described central processing unit 4 drives described cutting workbench 1 again along the X-direction translation, and drives described video camera 3 along the Y direction translation, so that the central point adjustment of a mark 502 of described window 501 moves to the wherein central spot of a unit chip 21.
Like this, by above-mentioned steps, can make described fragmentation wafer 20 finish the action that aligns automatically, then, can method of the present invention be that described fragmentation wafer 20 is sought the border promptly, please cooperate and consult Figure 10, said method comprising the steps of:
One, see also Figure 11, described central processing unit 4 is a commence search point (x with the central point of a wherein unit chip 21 of described fragmentation wafer 20
1, y
1);
Two, see also Figure 11, described central processing unit 4 will be by described commence search point (x
1, y
1) form coboundary point (x along the make progress place of translation one reference dimension R (described reference dimension R can adopt the actual size of described master slice wafer 1/10th 2) of Y direction
Up, y
Up), corresponding described coboundary point (x
Up, y
Up), described commence search point (x
1, y
1) form boundary point (x
Down, y
Down).
Three, see also Figure 11, described central processing unit 4 is with described upper and lower boundary point (x
Up, y
Up), (x
Down, y
Down) the mean value of Y direction coordinate, the first cutting distance D 1 divided by the described fragmentation wafer 20 described first cut direction y parallel with Y direction, and round numbers, again described integer be multiply by the described first cutting distance D 1, can obtain the new coordinate of a Y direction, the new coordinate of described Y direction forms one second and searches point (x
2, y
2).
Four, see also Figure 12, described central processing unit 4 moves to described second with described video camera 3 and searches point (x
2, y
2), take the described fragmentation wafer 20 of access and search point (x in described second
2, y
2) image, and carry out image relatively with described female sample chip 13; If image relatively meets, described second searches point (x
2, y
2) coordinate then form described lower boundary point (x
Down, y
Down), and with the described coboundary point (x of step 3
Up, y
Up) subtract each other and take absolute value, if image does not relatively meet, described second searches point (x
2, y
2) coordinate then form described coboundary point (x
Up, y
Up), and with the described lower boundary point (x of step 3
Down, y
Down) subtract each other and take absolute value.And by among Figure 12 as can be known, described second searches point (x
2, y
2) image of the unit chip 21 located is that image with described female sample chip 13 meets, so described second searches point (x
2, y
2) coordinate form described lower boundary point (x
Down, y
Down), and with the described coboundary point (x of step 3
Up, y
Up) subtract each other and take absolute value.
Five, see also Figure 13, by repeating recursion step three, step 4, until described upper and lower boundary point (x
Up, y
Up), (x
Down, y
Down) absolute value that subtracts each other sets tolerance T (described in the present embodiment setting tolerance T equals the length of the described first cutting distance D 1 of twice), the described upper and lower boundary point (x that then approaches mutually less than one
Up, y
Up), (x
Down, y
Down) one of them form one the 3rd and search point (x
3, y
3), be with described lower boundary point (x in the present embodiment
Down, y
Down) form the described the 3rd and search point (x
3, y
3).
Six, see also Figure 14, described central processing unit 4 is searched point (x with the described the 3rd
3, y
3), along the place of X-direction, form one the 4th and search point (x to right translation one horizontal reference distance H
4, y
4), described horizontal reference distance H equals a double-length degree of the second cutting distance D 2 of the described fragmentation wafer 20 described second cut direction x parallel with X-direction.
Seven, see also Figure 15, described central processing unit 4 moves to the described the 4th with described video camera 3 and searches point (x
4, y
4), take the described fragmentation wafer 20 of access and search point (x in the described the 4th
4, y
4) image, and carry out image relatively with described female sample chip 13; If image relatively meets, then search point (x with the described the 4th
4, y
4) make progress translation one vertical reference apart from V to the 5th search point (x along Y direction
5, y
5), described vertical reference equals described first apart from V and cuts a double-length degree of distance D 1, and searches point (x with the described the 5th
5, y
5) coordinate form the described the 4th and search point (x
4, y
4), if image does not relatively meet, then search point (x with the described the 4th
4, y
4) search point (x along X-direction to the described horizontal reference of right translation distance H to the 6th
6, y
6), and with described the 6th search point (x
6, y
6) coordinate form the described the 4th and search point (x
4, y
4).And by among Figure 15,16 as can be known, the described the 4th searches point (x
4, y
4) image of locating and the image of described female sample chip 13 and do not meet, so described central processing unit 4 is searched point (x with the described the 4th
4, y
4) search point (x along X-direction to the described horizontal reference distance H of right translation the extremely described the 6th
6, y
6), and with described the 6th search point (x
6, y
6) coordinate form the described the 4th and search point (x
4, y
4).
Eight, see also Figure 15,17,, search point (x until the described the 4th via repeating step 7
4, y
4) search point (x along X-direction to the described horizontal reference distance H of right translation the extremely described the 6th continuously
6, y
6) number of times greater than a parameter preset P, and search point (x with the described the 4th
4, y
4) continuously form one the 7th to the origin coordinates of right translation and search point (x
7, y
7), this 7th search point (x
7, y
7) promptly represent the described the 3rd and search point (x
3, y
3) right side the highest a bit.
Nine, see also Figure 18, described central processing unit 4 is searched point (x with the described the 7th
7, y
7) form one the 8th search point (x along X-direction to the place of the described horizontal reference distance H of left
8, y
8).
Ten, see also Figure 19, described central processing unit 4 moves to the described the 8th with described video camera and searches point (x
8, y
8), take the described fragmentation wafer 20 of access and search point (x in the described the 8th
8, y
8) image, and carry out image relatively with described female sample chip 13.If image relatively meets, then search point (x with the described the 8th
8, y
8) make progress the described vertical reference of translation apart from V to the 9th search point (x along Y direction
9, y
9), and with described the 9th search point (x
9, y
9) coordinate form the described the 8th and search point (x
8, y
8), if image does not relatively meet, then search point (x with the described the 8th
8, y
8) search point (x along X-direction to the described horizontal reference of left distance H to the tenth
10, y
10), and with described the tenth search point (x
10, y
10) coordinate form the described the 8th and search point (x
8, y
8).And by among Figure 19,20 as can be known, the described the 8th searches point (x
8, y
8) image of the unit chip 21 located is that image with described female sample chip 13 meets, so described central processing unit 4 is searched point (x with the described the 8th
8, y
8) make progress the described vertical reference of translation apart from extremely described the 9th search point (x of V along Y direction
9, y
9), and with described the 9th search point (x
9, y
9) coordinate form the described the 8th and search point (x
8, y
8).
11, see also Figure 21,22,23,, search point (x until described eight by repeating step 10
8, y
8) search point (x along X-direction to the described horizontal reference distance H of left the extremely described the tenth continuously
10, y
10) number of times greater than described parameter preset P, the then described the 8th searches point (x
8, y
8) continuously form 1 the 11 to the origin coordinates of left and search point (x
11, y
11), the described the 11 searches point (x
11, y
11) be the absolute coboundary point of described fragmentation wafer 20 on its first cut direction y.
Whereby, as shown in figure 24, utilize the method for the invention described above can obtain the absolute coboundary point of described fragmentation wafer 20 on its first cut direction y, promptly obtain described fragmentation wafer 20 and on its first cut direction y, cut the border, and to be on the safe side, also can search point (x with the described the 11
11, y
11) form described absolute coboundary point (described in the present embodiment safe enough and to spare S equals a double-length degree of the described first cutting distance D 1) along the make progress place of translation one safe enough and to spare S of Y direction again.In addition, utilize identical step, and, can obtain the absolute lower boundary point (x of described fragmentation wafer 20 on its first cut direction y changing into along the downward translation of Y direction along the make progress operation of translation of Y direction in the step 2, seven, ten
12, y
12).In like manner, behind described cutting workbench 1 rotation 90 degree, utilize above-mentioned step, also can obtain the absolute right margin point (x of described fragmentation wafer 20 on its second cut direction x
13, y
13) and an absolute left margin point (x
14, y
14).Like this, can obtain described fragmentation wafer 20 complete, cut the border accurately.
By above explanation, can again advantage of the present invention be summarized as follows:
One, by method of the present invention, can accurately define the cut-boundary of described fragmentation wafer 20, institute With, described blade 201 can not produce excessive cut-in without ball, thereby can effectively promote whole production efficiency.
Two, by method of the present invention, described wafer cutting machine 100 after once the phase related parameter is set in input, Each shape, the fragmentation wafer that size is all not identical can be applicable to, and setting needn't be changed again and again, institute With, the setting operation of method of the present invention is easy, and can further promote whole production efficiency again.
What deserves to be mentioned is, method of the present invention is after upwards searching, also can be earlier to the left search, again to the right translation search, then also can reach purpose and effect same as described above, and the program that aligns of previous operations also can change by the artificial mode of aligning and finishes, in addition, as shown in figure 25, also can put several fragmentation wafer 30 on the described cutting workbench 1 simultaneously, 40,50,60, each fragmentation wafer 30 then, 40,50,60, distinctly aligning aligning of program automatically via described wafer, and after the search of method of the present invention, also can successively define the cutting border of himself respectively, be convenient to carry out multi-disc and cut automatically.
Conclude above-mentionedly, the method for searching wafer boundary of the present invention not only can accurately define wafer cutting border, and after once input is set, can search the cutting border of several same size wafers automatically, so can reach the purpose of invention really.
Claims (3)
1. method of seeking wafer boundary, described method applies to a cutting machine, and described cutting machine has: one can be along X-direction move left and right and can be around the cutting workbench of Z-direction rotation, for putting a workpiece to be cut; One group of cutter shaft and video camera that can move forward and backward along Y direction synchronously, and described cutter shaft can move up and down along Z-direction by oneself; One can control the described cutting workbench of driving; The central processing unit of described cutter shaft and described video camera; An and display that links with described central processing unit, and be placed on the workpiece described to be cut of described cutting workbench, but be formed with several and described central processing unit are photographed the identical and cutting and separating of a female sample chip of storage in advance by described video camera unit chip, described unit chip is identical shaped, and being array arranges, the per unit chip all has at least two cut direction, and the per unit chip all respectively is formed with a cutting distance on described cut direction; It is characterized in that, said method comprising the steps of:
One, the central point with the wherein unit chip of described workpiece to be cut is a commence search point;
Two, will form coboundary point along the make progress place of translation one reference dimension of Y direction by described commence search point, corresponding described coboundary point, described commence search point forms boundary point;
Three, get the mean value of the Y direction coordinate of described upper and lower boundary point, can obtain the new coordinate of a Y direction, the new coordinate of described Y direction forms one second and searches point;
Four, described video camera is moved to described second and search point, take the described workpiece to be cut of access, and carry out image relatively with described female sample chip in the image at described place;
If image relatively meets, described second coordinate of searching point then forms described lower boundary point, and subtracts each other with the described coboundary point of step 3 and to take absolute value;
If image relatively do not meet, described second coordinate of searching point then forms described coboundary point, and subtracts each other with the described lower boundary point of step 3 and to take absolute value;
Five, repeat recursion step three, step 4, set tolerance until the absolute value that described upper and lower boundary point subtracts each other less than one, the place that then described upper and lower boundary point approaches mutually forms one the 3rd and searches point;
Six, search point with the described the 3rd and form one the 4th search point along X-direction to the place of right translation one horizontal reference distance, described horizontal reference distance equals the integral multiple length of one second cutting distance of described workpiece to be cut one second cut direction parallel with X-direction;
Seven, described video camera is moved to the described the 4th and search point, take the described workpiece to be cut of access, and carry out image relatively with described female sample chip in the image at described place;
If image relatively meets, then search point and make progress translation one vertical reference distance to one the 5th search point along Y direction with the described the 4th, described vertical reference distance equals the integral multiple length of one first cutting distance of described workpiece to be cut one first cut direction parallel with Y direction, and the described the 5th coordinate of searching point is formed described the 4th search point;
If image relatively do not meet, then will the described the 4th search point and search point to the described horizontal reference distance of right translation to one the 6th, and a coordinate of will the described the 6th searching forms described the 4th search point along X-direction;
Eight, repeat step 7, search point is searched point continuously to the described horizontal reference distance the extremely described the 6th of right translation along X-direction number of times until described four, greater than a parameter preset, and search point with the described the 4th and form one the 7th to the origin coordinates of right translation continuously and search point;
Nine, search point with the described the 7th and form one the 8th search point to the place of the described horizontal reference distance of left along X-direction;
Ten, described video camera is moved to the described the 8th and search point, take the described workpiece to be cut of access, and carry out image relatively with described female sample chip in the image at described place;
If image relatively meets, then will the described the 8th search point and search point to one the 9th, and a coordinate of will the described the 9th searching forms described the 8th search point along the Y direction described vertical reference distance of translation that makes progress;
If image relatively do not meet, then will the described the 8th search point and search point to the described horizontal reference distance of left to 1 the tenth, and a coordinate of will the described the tenth searching forms described the 8th search point along X-direction;
11, repeat step 10, search point until described eight and search the number of times of point greater than described parameter preset along X-direction to the described horizontal reference distance the extremely described the tenth of left continuously, and search point with the described the 8th and form 1 the 11 to the origin coordinates of left continuously and search point, the described the 11 searches point is the absolute coboundary point of described workpiece to be cut on its first cut direction.
2. the method for searching wafer boundary as claimed in claim 1 is characterized in that:
Search point with the described the 11 and form described absolute coboundary point along the make progress place of translation one safe enough and to spare of Y direction again, and described safe enough and to spare equals the integral multiple length of the described first cutting distance.
3. the method for searching wafer boundary as claimed in claim 1 is characterized in that:
When step 3, mean value with the Y direction coordinate of described upper and lower boundary point, one first cutting distance divided by described workpiece to be cut one first cut direction parallel with Y direction, and round numbers, again described integer be multiply by the described first cutting distance, to obtain the new coordinate of a Y direction, the new coordinate of described Y direction forms one second and searches point.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01125712 CN1199244C (en) | 2001-08-16 | 2001-08-16 | Method for tracing wafer boundary |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01125712 CN1199244C (en) | 2001-08-16 | 2001-08-16 | Method for tracing wafer boundary |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1405853A true CN1405853A (en) | 2003-03-26 |
| CN1199244C CN1199244C (en) | 2005-04-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01125712 Expired - Fee Related CN1199244C (en) | 2001-08-16 | 2001-08-16 | Method for tracing wafer boundary |
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| Country | Link |
|---|---|
| CN (1) | CN1199244C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101469986B (en) * | 2007-12-27 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Automatic point search system and method for fuzzy boundary |
| CN102689366A (en) * | 2011-03-23 | 2012-09-26 | 正恩科技有限公司 | *-character searching method of wafer fragment edge |
| CN103972120A (en) * | 2013-01-30 | 2014-08-06 | 正恩科技有限公司 | Wafer splitting position determining method and system |
-
2001
- 2001-08-16 CN CN 01125712 patent/CN1199244C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101469986B (en) * | 2007-12-27 | 2011-06-22 | 鸿富锦精密工业（深圳）有限公司 | Automatic point search system and method for fuzzy boundary |
| CN102689366A (en) * | 2011-03-23 | 2012-09-26 | 正恩科技有限公司 | *-character searching method of wafer fragment edge |
| CN103972120A (en) * | 2013-01-30 | 2014-08-06 | 正恩科技有限公司 | Wafer splitting position determining method and system |
| CN103972120B (en) * | 2013-01-30 | 2017-04-26 | 正恩科技有限公司 | Wafer splitting position determining method and system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1199244C (en) | 2005-04-27 |
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