M403742 五、新型說明： 【新型所屬之技術領域】 本創作係一種晶圓劈裂攝像裝置，尤指一種設於晶圓 劈裂機上並對晶圓輪廓攝像的晶圓劈裂攝像裝置。 【先前技術】 晶圓藉由晶圓劈裂機分割為多數晶粒，將晶粒固設於 載體上並執行電路佈設，接著進行封裝作業而製成半導體 A 兀件，其中，晶圓在運送途中，會因碰撞而造成破片，由 ,於晶圓的價格昂貴，因此破片的晶圓仍需要進入晶圓劈裂 機進行分割作業，晶圓在進行劈裂之前，需要藉由雷射切 割出橫向、縱向的預切線，接續保護處理之後，再放置於 晶圓劈裂機的工作台上，並以一影像擷取單元擷取晶圓的 輪廓影像，並將資料傳輸至一運算單元，接著晶圓劈裂機 上的劈刀受驅動而分割晶圓。 其中，破片的晶圓因為邊界呈現不規則狀，因此預切 • 線的長度也不盡相@，晶圓劈裂機對於不同長度的預切線 均％加相同的劈裂強度，會造成長度較短的預切線承受的 身裂強度超過其負荷而損壞，無法提高破片之晶圓的利用 ，另外長度較長的預切線可能會造成一次劈裂無法劈斷 的隋形’使得晶圓劈裂機需要重複劈裂，造成耗工費時之 問題。 【新型内容】 本創作之主要目的在於提供一種晶圓劈裂攝像裝置， 希藉此設計，改善現有晶圓劈裂機以單一影像擷取單元攝 M403742 取晶圓影像，無法提高破片晶圓之 問趨。 千汉粍工費時的 為達成刖揭目的，本創作你_ < >丄 本創作所设计之晶圓劈裂攝 其係搭配晶圓劈裂機並擷取s 裝置 词取日日®的輪廓影像與尺寸，兮 晶圓劈裂攝像裝置包含： 〜了該 ΑΛΤ XJXJ 一 一運具早7L ; 一輪廓擷取單元，其係電性連接該 晶圓輪廓影像並傳送至運算單元；以及 可擷取 一尺寸擁取單元，其係電性連接且受控於該運算單元 ，該尺寸擷取單元可神敌日圆趴产，升平凡 至運算單元。 Θ取SB®㈣邊界的座標資料並傳送 上述中，本創作晶圓劈裂攝像裝置利用該輪廊操取單 兀取得晶圓輪廓影像，冑算單元藉由晶圓輪廓影像的資料 ’控制該尺寸掏取單元操取晶圓輪廊邊界的座標資 座標資料傳送至運算單Μ行運算，㈣取得晶圓上每一 預切線的長度，讓晶圓劈裂機可以依據不同長度的預切線 施加適當的劈裂強度’避免重複劈裂的耗工費時問題，以 及可降低晶圓劈裂的毀損率。 【實施方式】 請參閱圖卜為本創作晶圓劈裂攝像裝置之—較佳實施 例’其係配合晶圓劈裂機’用以掏取晶圓30的輪廓影像， 以及計异晶圓30上每一預切線之長度，該晶圓劈裂攝像裝 置包括有-運算單元、一輪廓棟取單元10及―尺寸擷取單 元20,該輪廓擷取單元1〇係電性連接該運算單元，可擷取 晶圓30的輪廓影像且進一步傳送至運算單元，運算單元依 4 M403742 據晶圓30輪廓影像的資料，可控制該尺寸擷取單元20擷 取晶圓30輪廓邊界的座標資料，並將座標資料傳送至運算 單元’進而運算晶圓3〇上預切線的長度，讓晶圓劈裂機藉 由計算出的預切線長度，使晶圓劈裂機上的劈刀40提供適 當的劈裂強度將晶圓30的預切線處劈斷。 如圖2所示’該輪廓擷取單元1 〇可位於該晶圓劈裂機 - 的前端作業區，因此待劈裂的晶圓30進入劈刀40的作業 . 區之前’會先經過該輪廓擷取單元10,讓輪廓擷取單元 •丨 擷取晶圓30的輪廓外形，該尺寸擷取單元20設置於該晶 圓劈裂機上，另如圖3所示，該輪廓擷取單元1〇與尺寸擷 取單元20皆設置於該晶圓劈裂機上。 其中’本創作晶圓劈裂攝像裝置係利用該輪廓擷取單 凡1 0摘取待劈裂之晶圓30的輪廓影像，於該輪廓擷取單 兀1 0擷取晶圓30輪廓後’該尺寸擷取單元2〇再負責擷取 晶圓30輪廓邊界的座標資料，該運算單元負責運算及資料 -傳輸’計算出晶圓30上預切線的長度，以利於進行後續晶 • 圓劈裂機之劈刀40的劈裂晶圓30作業。 综上所述，本創作晶圓劈裂攝像裝置藉由該輪廓擷取 單元10與尺寸擷取單元20的配合，使得該運算單元可以 計算出晶® 30上每一預切線的長度，讓晶H劈裂機可以依 據不同長度的預切線施加適當的劈裂強度，尤其適用於不 規則形狀的破片晶圓30的劈裂作業，使晶圓劈裂機有效 率地劈開晶圓30的預切線，避免重複劈裂、耗工費時的 情形發生，以及降低晶圓30的劈裂損壞率，提升晶圓3〇 的有效利用率，故利於產業之利用。 M403742 f圖式簡單說明】 圖1 :為本創作晶圓劈裂攝像裝置之一 取晶圓影像的流程示意圖。 知例之擷 圖2 _·為本創作晶圓劈裂攝像裝置搭配劈刀 施例之使用狀態示意圖。 之〜較佳實 圖3 :為本創作晶圓劈裂攝像裝置搭配劈刀 實施例之使用狀態示意圖。 之另〜較佳 【主要元件符號說明】 1〇輪廓擷取單元 20尺寸擷取單元 30晶圓 40劈刀M403742 V. New Description: [New Technology Field] This is a wafer splitting camera, especially a wafer splitting camera mounted on a wafer splitting machine and imaging the contour of the wafer. [Prior Art] The wafer is divided into a plurality of crystal grains by a wafer splitting machine, the crystal grains are fixed on the carrier, circuit layout is performed, and then a package operation is performed to form a semiconductor A device, wherein the wafer is transported. On the way, the film will be fragmented due to the collision. Because the wafer is expensive, the fragmented wafer still needs to enter the wafer splitting machine for segmentation. Before the wafer is cleaved, it needs to be cut by laser. The transverse and longitudinal pre-cut lines are then placed on the workbench of the wafer splitting machine after the subsequent protection process, and the image of the wafer is captured by an image capturing unit, and the data is transmitted to an arithmetic unit, and then The trowel on the wafer splitter is driven to split the wafer. Among them, the wafer of the fragment is irregular because of the boundary, so the length of the pre-cutting line is not the same. @The wafer splitting machine adds the same splitting strength to the pre-cutting lines of different lengths, which will result in a longer length. The short pre-cut line is damaged by the strength of the crack beyond its load, and the use of the wafer of the fragment cannot be improved. In addition, the long-cut pre-cut line may cause a split-shaped shape that can not be broken. It is necessary to repeat the splitting, which causes labor and time consuming problems. [New content] The main purpose of this creation is to provide a wafer splitting camera device, which is designed to improve the existing wafer splitting machine to take a wafer image with a single image capturing unit M403742, which cannot improve the fragment wafer. Asking questions. Qian Han’s time-consuming work for the purpose of achieving this, _ <> 丄 创作 创作 创作 设计 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 劈 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配 搭配Contour image and size, 兮 wafer splitting camera device includes: ~ ΑΛΤ XJXJ one transporter 7L early; a contour capture unit, which electrically connects the wafer contour image and transmits it to the arithmetic unit; A size acquisition unit is electrically connected and controlled by the operation unit, and the size extraction unit can be produced by the enemy, and is upgraded to the arithmetic unit. Taking the coordinate data of the SB® (four) boundary and transmitting the above, the created wafer splitting camera uses the wheel to take a single image of the wafer contour image, and the calculation unit controls the data by the wafer contour image The size capture unit operates the coordinate coordinates of the boundary of the wafer wheel to be transferred to the operation unit, and (4) obtains the length of each pre-cut line on the wafer, so that the wafer splitting machine can be applied according to different length pre-cut lines. Proper splitting strength' avoids the labor and time-consuming problems of repeated splitting and reduces the rate of wafer splitting. [Embodiment] Referring to the drawings, a preferred embodiment of the wafer splitting camera device is coupled with a wafer splitting machine for capturing a contour image of the wafer 30, and a different wafer 30. For the length of each pre-cut line, the wafer splitting camera device includes an operation unit, a contour building unit 10, and a size capturing unit 20, and the contour capturing unit 1 is electrically connected to the computing unit. The contour image of the wafer 30 can be captured and further transferred to the arithmetic unit. The computing unit can control the size capturing unit 20 to capture the coordinate data of the contour boundary of the wafer 30 according to the data of the contour image of the wafer 30 according to 4 M403742, and Transfer the coordinate data to the arithmetic unit' to calculate the length of the pre-cut line on the wafer 3, and let the wafer splitting machine provide the appropriate file by using the calculated pre-cut length to provide the file 40 on the wafer splitting machine. The crack strength breaks the pre-tangent line of wafer 30. As shown in FIG. 2, the profile extraction unit 1 can be located in the front end working area of the wafer splitting machine, so that the wafer 30 to be cleaved enters the operation of the file 40. The capturing unit 10 allows the contour capturing unit to capture the contour of the wafer 30. The size capturing unit 20 is disposed on the wafer splitting machine. As shown in FIG. 3, the contour capturing unit 1 is disposed. Both the cymbal and the size capturing unit 20 are disposed on the wafer splitting machine. Wherein, the created wafer splitting camera device utilizes the contour capture unit to extract the contour image of the wafer 30 to be split, and after the contour capture unit 10 draws the contour of the wafer 30 The size capturing unit 2 is further responsible for capturing the coordinate data of the contour boundary of the wafer 30, and the computing unit is responsible for calculating and data-transferring 'calculating the length of the pre-cut line on the wafer 30 to facilitate subsequent crystal splitting. The splitting wafer 30 of the boring tool 40 of the machine operates. In summary, the splitting and imaging device of the present invention cooperates with the size capturing unit 20 by the contour capturing unit 10, so that the computing unit can calculate the length of each pre-cut line on the crystal® 30. The H splitting machine can apply appropriate splitting strength according to pre-tangents of different lengths, and is particularly suitable for the splitting operation of the irregularly shaped fragmented wafer 30, so that the wafer splitting machine can efficiently open the pre-cut line of the wafer 30. The use of the industry is avoided by avoiding repeated cracking, time-consuming and labor-intensive situations, and reducing the cracking damage rate of the wafer 30 and improving the effective utilization rate of the wafer. M403742 f simple description of the figure] Figure 1: Schematic diagram of the wafer image taken for one of the wafer cleaving camera devices.知 撷 撷 撷 撷 撷 撷 撷 撷 撷 撷 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 为本 创作 为本 为本~ Figure 3 is a schematic diagram of the use state of the embodiment of the wafer splitting camera device. The other ~ preferred [main component symbol description] 1 〇 contour extraction unit 20 size extraction unit 30 wafer 40 trowel