201224461 六、發明說明： 【發明所屬之技術領域】 本發明係期娜龍子產⑤紐之探針«，更詳而言 之是指一種探針單元及其製作方法。 【先前技術】 已知高頻探針卡結構是在一電路板上佈設許多探針，前述 探針包括有贿卿_子物件表面爾制試訊號傳輸 介面的訊號針，以及連接至接地電位的接地針。所述探針卡结 構為確保檢測精準度，必須有效控制其與測試機及待測電子元 件之間的阻抗隨情形，耐知達成麵目_方法與結構有 多種，包括透過改變探針卡上的導電銲接點設置數量或利用更 換具有不同阻抗的電子元件等，又如一種同轴探針，是以降低 存在於同_針的寄生電容的方絲提升電性傳輸能力。 誠然上述各種方式雖能達成目的，卻也因為探針卡在應用 於檢測更趨精緻細微化且排列縝密（fmepitch)的待測電子元 件時’若所述為數眾多的訊號針與接地針的擺設方式仍維持在 相同平面處（或謂相同高度），則將發生各探針難以對準待測 電子元件的情形’尤其是在外徑偏大的同轴探針結構中，其更 顯難以應付技術快速發展的趨勢。 為此，若能在兼顧阻抗匹配的前提下，有效改變探針的擺 設方式，相信可使得探針卡的應用範圍更為廣泛。 201224461 【發明内容】 有鑑於此，本發明之主要目的在於提供一種探針單元及其 裝作方法不僅具有良好阻抗匹配效果，更可應用於電子元件 排列更為緊密的場合巾賤行電性檢測用。 緣以達成上述目的，本發明所提供之探針單元包含一訊號 針層與-接地電位層。其$訊號針層包括至少—訊號針；接地 電位層設置在該訊號針層的上方或下方，且包括至少一金屬線 與一接地針，其中該金屬線鄰設於該訊號針。 在實施例中，該接地電位層包括有一導電件，該導電件 電性連接邊金屬線與該接地針。具體地說，本發明所提供之探 針單元包含兩層以上的訊號針層，而該接地電位層位於該二訊 唬針層之間，且包括有兩條以上的金屬線，該導電件擺設於該 接地電位層與其中一訊號針層之間。 依據上述構思，本發明之探針單元可包括有一第一至一第 四訊號針層，以及至少二接地電位層，其中一接地電位層係位 於第一及第一sfl號針層之間，另一接地電位層係位於第三及第 四訊號針層之間。 依據上述構思，本發明之探針單元更包含一支撐座，該訊 號針、金屬線與該接地針係藉由黑膠固定於該支撐座上，而一 絕緣套筒加設於兩相鄰金屬線與訊號針之外側，且該絕緣套筒 對應位於訊號針之針尾至黑膠之間的區段。 另，本發明提供該探針單元製作方法如下，包括：a)於一 201224461 治具上塗佈-具有絕緣特性的黑膠；b)擺放至少一根 於黑膠上；G)靠具有絕緣雜膠簡蓋喊針’· d)擺 放至少-金屬線與至少—接地針於步驟e)的黑膠表面且八 金屬線與接地針互為電性連接，以及金屬線鄰設於步驟b) ^ 訊號針；e)塗佈具有絕緣雜的黑膠以覆蓋金屬線與接地針。 依據上述構思，本發明更包含—步驟q擺放至少—根气 號針於步驟執轉表面，且令步驟〇物_設於步驟 山的另-金屬線’在步_之後，塗佈具有絕緣特性的里膠 以覆蓋步驟Q的顺針。以及—步驟g)將完成步驟a)至^ 驟f)的模組化探針結合於一電路板底面。 少 另，在步驟c)中可包括放置一導電件，該導電件電性連 接該金屬線與該接地針。且，可在步驟g)之後，再於兩相鄰 金屬線與訊號針之外側加設-絕緣套筒，該絕緣套筒對應位於 訊號針之針尾至黑膠之間的區段。 ' 又步驟g)之電路板底面具有多數個訊號接點與接地接 點，步驟b)之訊號針-端連接對應的訊號接點，步驟幻之金 屬線一端連接對應的接地接點。 【實施方式】 為能更清楚地說明本發明，兹舉較佳實施例並配合圖示詳 細說明如后。 圖1至圖3所示為本發明-較佳實施例之探針單元i，揭 201224461 示在一電路板10底面佈設有多數訊號接點10a與多數接地接 點10b’以及多數訊號針12 —端與對應的訊號接點l〇a連接， 接地針14再電性連接至接地接點i〇b。特別的是，為達成應 用於更精緻細微化電子元件的檢測使用，本實施例的探針單元 1之該些訊號針12與接地針14是以分層方式設計，亦即，該 探針單元1區分有傳輸高頻訊號的訊號針層與接地電位層。 以下請配合圖4來說明用以製作該探針單元1的方法： 首先，於一治具（圖未示）上塗佈一具有絕緣特性的黑膠 16’上述訊號針層是由複數根訊號針12擺放於該黑膠16上所 構成，且該些訊號針12位處相同水平高度處，於此定義其為 第一訊號針層，接著，塗佈具有絕緣特性的黑膠18以覆蓋該 些訊號針12，並在黑膠18定型且於固化前仍具黏著性時再擺 放一以銅箔20為例但不以此為限的導電件於黑膠18表面；之 後，將本實施例結構中共同構成接地電位層的接地針14與金 屬線22 —同擺放於銅箔20上，以使彼此互為電性連接，而特 別的是，為使訊號針12獲得良好的阻抗匹配效果，前述金屬 線22是被擺放在鄰近訊號針12處。 於完成接地針14及金屬線22的排列作業後，復以流質累 膠24再塗佈於接地針14與金屬線22上。之後，再將複數根 訊號針12擺放於已定型但在固化前之黏著狀態的黑膠％上， 於此定義此程序中的所有訊號針12共同構成第二訊號針層’ 且此程序中的每一訊號針12亦以鄰近金屬線22為佳。 201224461 必須說明的是，不論訊號針12是屬於第一訊號針層或是 第二訊號針層’本實施例中的每一金屬線22皆以維持對應一 根訊號針12為佳，如此方能確保阻抗匹配效果。又，值得一 提的是，在訊號針12是用於傳輸高頻訊號時’為確保傳輸訊 號品質良好，所述金屬線22以電性隔離的方式平行訊號針 12’且金屬線22 —端連接至電路板1〇下表面之接地接點i〇b， 另一端再延伸至銅箔20且與銅箔20接觸，如此，將可確保訊 號針12在對應金屬線22的部分可獲得良好阻抗匹配效果，據 此以使訊號針12能傳輸良好品質的高頻訊號。201224461 VI. Description of the Invention: [Technical Field to Be Invented by the Invention] The present invention relates to a probe of the New Zealand 5th New Zealand, and more specifically to a probe unit and a method of fabricating the same. [Prior Art] A high-frequency probe card structure is known in which a plurality of probes are disposed on a circuit board, and the probe includes a signal pin having a transmission interface of a test signal and a connection to a ground potential. Ground pin. The probe card structure is used to ensure the detection accuracy, and the impedance between the tester and the electronic component to be tested must be effectively controlled according to the situation, and the method of understanding and the structure is various, including changing the probe card. The number of conductive solder joints is set or the replacement of electronic components having different impedances, etc., and a coaxial probe is used to reduce the parasitic capacitance existing in the same pin to enhance the electrical transmission capability. Although the above various methods can achieve the goal, it is also because the probe card is used to detect the electronic components to be tested which are more delicate and finer and finely arranged (fmepitch), if the number of signal pins and ground pins are large. If the mode is still maintained at the same plane (or the same height), it will happen that each probe is difficult to align with the electronic component to be tested, especially in the coaxial probe structure with large outer diameter, which is more difficult to cope with technology. The trend of rapid development. Therefore, if the probe can be effectively changed under the premise of impedance matching, it is believed that the application range of the probe card is wider. 201224461 SUMMARY OF THE INVENTION In view of this, the main object of the present invention is to provide a probe unit and a mounting method thereof, which not only have good impedance matching effect, but also can be applied to the electrical detection of the electronic components in a tighter arrangement. use. In order to achieve the above object, the probe unit provided by the present invention comprises a signal pin layer and a ground potential layer. The signal layer includes at least a signal pin; the ground potential layer is disposed above or below the signal pin layer, and includes at least one metal wire and a ground pin, wherein the metal wire is adjacent to the signal pin. In an embodiment, the ground potential layer includes a conductive member electrically connected to the edge metal line and the ground pin. Specifically, the probe unit provided by the present invention includes two or more signal pin layers, and the ground potential layer is located between the two signal pin layers, and includes two or more metal wires, and the conductive member is disposed. Between the ground potential layer and one of the signal pin layers. According to the above concept, the probe unit of the present invention may include a first to a fourth signal pin layer, and at least two ground potential layers, wherein a ground potential layer is located between the first and first sfl pin layers, and A ground potential layer is between the third and fourth signal pin layers. According to the above concept, the probe unit of the present invention further includes a support base, the signal pin, the metal wire and the grounding pin are fixed on the support by the black glue, and an insulating sleeve is added to the adjacent metal. The wire is outside the signal pin, and the insulating sleeve corresponds to a section between the needle end of the signal pin and the black glue. In addition, the present invention provides the probe unit in the following manner, comprising: a) coating on a fixture of 201224461 - a black plastic having insulating properties; b) placing at least one on a black rubber; The glue is simply covered with a needle '· d) placed at least - the metal wire and at least - the grounding pin is in the black rubber surface of the step e) and the eight metal wires and the grounding pin are electrically connected to each other, and the metal wire is adjacent to the step b ^ ^ Signal pin; e) coated with black rubber with insulation impurities to cover the metal wire and the grounding pin. According to the above concept, the present invention further comprises the steps of: placing at least the gas needle in the step of performing the step, and causing the step material to be disposed on the other metal wire of the step mountain. The lining of the characteristic covers the smoothing of step Q. And - step g) bonding the modular probes of steps a) through f) to the bottom surface of a circuit board. In addition, in step c), a conductive member may be placed, and the conductive member is electrically connected to the metal wire and the ground pin. Moreover, after step g), an insulating sleeve is further disposed on the outer sides of the two adjacent metal wires and the signal pin, and the insulating sleeve corresponds to a section between the needle end of the signal pin and the black glue. The step bottom of the circuit board has a plurality of signal contacts and ground contacts, and the signal pin-end of the step b) is connected to the corresponding signal contact, and one end of the magic metal line is connected to the corresponding ground contact. [Embodiment] In order to explain the present invention more clearly, the preferred embodiment will be described in detail with reference to the accompanying drawings. 1 to 3 show a probe unit i according to a preferred embodiment of the present invention. The 201224461 shows that a plurality of signal contacts 10a and a plurality of ground contacts 10b' and a plurality of signal pins 12 are disposed on the bottom surface of a circuit board 10. The terminal is connected to the corresponding signal contact l〇a, and the grounding pin 14 is electrically connected to the ground contact i〇b. In particular, in order to achieve the detection and application of the finer and finer electronic components, the signal pins 12 and the ground pins 14 of the probe unit 1 of the present embodiment are designed in a layered manner, that is, the probe unit 1 Differentiate between the signal pin layer and the ground potential layer for transmitting high frequency signals. Hereinafter, the method for fabricating the probe unit 1 will be described with reference to FIG. 4. First, a black plastic 16 having insulating properties is applied to a jig (not shown). The signal pin layer is composed of a plurality of signal signals. The needle 12 is disposed on the black plastic 16 and the signal pins 12 are at the same level, which is defined as the first signal pin layer, and then coated with black rubber 18 having insulating properties to cover The signal pins 12 are placed on the surface of the black glue 18 after the black glue 18 is shaped and still adhesive before curing, and the conductive member is not limited thereto; In the structure of the embodiment, the grounding pins 14 constituting the ground potential layer together with the metal wires 22 are placed on the copper foil 20 so as to be electrically connected to each other, and in particular, to obtain a good impedance of the signal pin 12. For the matching effect, the aforementioned wire 22 is placed adjacent to the signal pin 12. After the alignment of the grounding pin 14 and the metal wire 22 is completed, the liquid electrolyte 24 is applied to the grounding pin 14 and the metal wire 22. Then, the plurality of signal pins 12 are placed on the black glue % which has been set but adhered before curing, and all the signal pins 12 in the program are defined to constitute the second signal pin layer' and in this program Each of the signal pins 12 is also preferably adjacent to the metal wire 22. 201224461 It should be noted that, regardless of whether the signal pin 12 belongs to the first signal pin layer or the second signal pin layer, each metal wire 22 in this embodiment preferably maintains a corresponding signal pin 12, so that Ensure impedance matching. Moreover, it is worth mentioning that when the signal pin 12 is used for transmitting high frequency signals, 'to ensure good transmission signal quality, the metal wires 22 are electrically isolated to parallel the signal pins 12' and the metal wires 22 are terminated. Connected to the ground contact i〇b of the lower surface of the circuit board 1 and the other end extends to the copper foil 20 and is in contact with the copper foil 20, thus ensuring good impedance of the signal pin 12 at the portion corresponding to the metal line 22. The matching effect is based on the fact that the signal pin 12 can transmit a good quality high frequency signal.
I 之後，選擇塗佈黑膠26以覆蓋屬於第二訊號針層的訊號 針12 ’待黑膠26完全固化後即獲得模組化的探針結構A。而 在完成前述模組化製作過程中，需將絕緣支撐座u擺放於已 定型但在®化前讀絲態的歸26 ±，待歸％完全固化 後’即可使模組化的探針結構A結合於絕緣支撐座u上，之 後復將絕緣域座11結合於電输1G底面，且令訊號針12 -端連接訊號接點1Ga、金屬線22 —端連接對應的細妾點 10b ’以及’於兩兩相鄰的金屬線22與訊號針12之外側加設 -絕緣套筒30以維持訊號針12與金屬線22之間的間距，且 絕緣套筒30對紐於城針12之針尾至轉之_區段，如 此即告完成圖1至圖3所示的探針單Μ，另特別說明的是， 前述區段+_線22可預先包覆―絕賴（圖未示）以確 保訊號針I2與金屬線η彼此間不會有接觸的情形發生。 201224461 由於該探針單元1對用於傳輸高頻訊號的訊號針層，及將 包含有作為阻抗匹配用的金屬線22之接地電位層，採分層製 作，不僅此維持良好阻抗匹配效果，更因巧妙運用空間，使得 各訊號針12之間的距離得在不彼此干涉的情況下，更緊密地 罪近’進一步地可應用於電子元件排列更為緊密的場合中以進 行電性檢測使用。 圖5為本發明另一較佳實施例之探針單元2，與上述實施 例不同處在於：本實施例中的導電件（即銅箔28)是改在該 接地電位層製作之後始擺放於接地針14與金屬線22上。該探 針單το 2之功效同上述，容不贅述。依照圖5的結構，對照圖 1至圖3以及圖4的方法中，將銅箔20的導電件置於黑膠18 表面的步驟將不會存在，因此接地針14及金屬線22是擺放於 黑膠18表面上，在擺放接地針14及金屬線22完成後，才會 放置導電件28於接地針〗4及金屬線22上。 另一提的是’所述訊號針層及接地電位層的層數不以上述 為限，其等得視需求而予以適當地增減，以達符合實際使用需 求為止，如圖6所示，即表示探針單元3共包括有第一至第四 訊號針層31〜34，且於第一及第二訊號針層、第三及第四訊號 針層之間分別具有-個由金屬線及接地針構成的接地電位層 35, 36。以上所述僅為本發明較佳可行實施例而已，舉凡應用 本發明說明書及申請專概圍所為之等效結構及製作方法之 變化，理應包含在本發明之專利範圍内。 201224461 【圖式簡單說明】 圖1為一刻視圖，揭示本發明一較佳實施例之探針單元； 圖2為一俯視圖，揭示上述較佳實施例之探針單元； 圖3為圖2之3-3方向剖視圖； 圖4為一流程圖，說明製作本實施例探針單元之方法； 圖5為一刳視圖’揭示本發明另一較佳實施例之探針單元； 圖6為-剖視圖’揭示探針單元包括複數層訊號針層及接地電 位層。 【主要元件符號說明】 1、2、3探針單元 10電路板 11支撐座 16黑膠 22金屬線 28銅箱 l〇a訊號接點 10b接地接點 12訊號針 14接地針 18黑膠 20銅箔 24黑膠 26黑膠 30絕緣套筒 31〜34第一至第四訊號針層 35、36接地電位層 A模組化探針結構After I, the black gel 26 is selected to cover the signal pin 12 belonging to the second signal pin layer. After the black rubber 26 is completely cured, the modular probe structure A is obtained. In the process of completing the above-mentioned modular production, it is necessary to place the insulating support u on the shape that has been shaped but read the silk state before the product is corrected. The needle structure A is coupled to the insulating support base u, and then the insulating domain seat 11 is coupled to the bottom surface of the power transmission 1G, and the signal pin 12-end is connected to the signal contact 1Ga, and the metal wire 22 is connected to the corresponding fine point 10b. 'and' are provided with an insulating sleeve 30 on the outer side of the two adjacent wires 22 and the signal pin 12 to maintain the spacing between the signal pin 12 and the wire 22, and the insulating sleeve 30 is opposite to the pin 12 The needle tail to the transition section, so that the probe unit shown in FIG. 1 to FIG. 3 is completed, and the above-mentioned section +_line 22 can be pre-wrapped. ) to ensure that the signal pin I2 and the metal wire η do not come into contact with each other. 201224461 Since the probe unit 1 pairs the signal pin layer for transmitting the high-frequency signal and the ground potential layer including the metal wire 22 for impedance matching, the layer is fabricated, which not only maintains a good impedance matching effect but also maintains a good impedance matching effect. Due to the clever use of space, the distance between the signal pins 12 can be more closely related to the case where the electronic components are arranged more closely, for the purpose of electrical detection. FIG. 5 is a probe unit 2 according to another embodiment of the present invention, which is different from the above embodiment in that the conductive member (ie, the copper foil 28) in this embodiment is placed after the ground potential layer is fabricated. On the grounding pin 14 and the metal wire 22. The effect of the probe single το 2 is the same as above, and will not be described. According to the structure of FIG. 5, in the method of FIG. 1 to FIG. 3 and FIG. 4, the step of placing the conductive member of the copper foil 20 on the surface of the black rubber 18 will not exist, so the grounding pin 14 and the metal wire 22 are placed. On the surface of the black plastic 18, after the grounding pin 14 and the metal wire 22 are placed, the conductive member 28 is placed on the grounding pin 4 and the metal wire 22. It is to be noted that the number of layers of the signal pin layer and the ground potential layer is not limited to the above, and may be appropriately increased or decreased according to requirements, so as to meet the actual use requirements, as shown in FIG. That is, the probe unit 3 includes a first to fourth signal pin layers 31 to 34, and has a metal wire between the first and second signal pin layers, and the third and fourth signal pin layers. Ground potential layers 35, 36 formed by ground pins. The above description is only for the preferred embodiments of the present invention, and variations of the equivalent structures and manufacturing methods of the present invention and the application of the present invention are intended to be included in the scope of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a plan view showing a probe unit according to a preferred embodiment of the present invention; FIG. 2 is a plan view showing the probe unit of the above preferred embodiment; FIG. 3 is a diagram of FIG. FIG. 4 is a flow chart illustrating a method of fabricating the probe unit of the present embodiment; FIG. 5 is a view showing a probe unit of another preferred embodiment of the present invention; FIG. 6 is a cross-sectional view The probe unit is disclosed to include a plurality of layer signal pin layers and a ground potential layer. [Main component symbol description] 1, 2, 3 probe unit 10 circuit board 11 support seat 16 black plastic 22 metal wire 28 copper box l〇a signal contact 10b ground contact 12 signal pin 14 grounding pin 18 black plastic 20 copper Foil 24 black plastic 26 black plastic 30 insulating sleeve 31~34 first to fourth signal pin layer 35, 36 ground potential layer A modular probe structure