TWI236538B - The testing apparatus and method of the high frequency probe - Google Patents

Abstract

The present invention discloses a testing apparatus, used for measuring a high frequency probe. The testing apparatus comprises a substrate, having a first surface and a second surface; two transmission lines, placed on the first surface of the substrate and one port of each transmission lines being in opposition; a groove, placed on the center area of the first surface of the substrate; a pairs of the testing connectors, connected to another ports of each transmission lines without opposition to provide the connecting function between the instrument and the testing apparatus. The present invention also discloses a testing method using the testing apparatus and provides a equivalent circuit extracting method using the testing apparatus. The use of the testing apparatus according to the present invention can reduce the testing cost and improve the testing efficiency effectively.

Description

1236538 V. Description of the invention (1) [Technical field to which the invention belongs] = Beiming is related to a test device, a test device and a test device thereof; a test device and a test method thereof. The test device has the advantages of good installation; easy operation, low cost, high eye-capacity and accurate needle. Eight can be widely used to test various high-frequency probes of different sizes. [Prior technology] The input and output system of the remote integrated circuit chip and other ... The connection lines are very complicated. The chip needs to be constructed. The main functions of the electronic circuit of the Japanese chip are: (1) a circuit that provides a current path, and is thin and portable; (2) the signal for distributing the chip in and out; and (3) emitting to the outside on the moving chip (4) In a destructive environment, the degree of accumulation of thermal energy conductors produced by Baoyue Road is gradually increasing, but the chip is occupied by .., because it is semi-small. Relatively, the development of assembly technology is also moving towards The development of high-density sound, f, but want to shrink the frequency and high-performance semiconductor device development. Due to the Lei Duo pin, high-speed increase gradually. In terms of personal computers, the mid-fighting "road where the parts reach the GHz era. In the radio frequency circuit of the communication system, Ritek Semiconductor has been designed into the circuit. Therefore, the performance of the high frequency and high frequency electrical performance will be relatively improved. Especially the test is for testing The effect of the time setting also requires the accuracy of the measurement data T to be set at the local frequency operation. Refer to Figure 1. Traditionally, the frequency probe for the high frequency probe is placed in the test card (Socket). Xia Xi will be a high plate or a rigid substrate It is based on a short circuit system ^ ^ q 4 and-open circuit test

1236538 V. Description of the invention (2) The high-frequency probe is used to measure the electrical parameters of the equivalent circuit of the 1m-m pin and the electrical parameters of the device, and then obtain the high-frequency probe test equipment (mL) and Capacitance. However, traditional disadvantages. With this in mind, it is difficult, high cost, and low compatible test methods to achieve production: To provide a new type of measurement device and its high-frequency probe test ring; easy, low cost, compatible High accuracy and accuracy [Summary of the invention] The present invention is easy and cost-effective. The second high-frequency probe of the present invention. The measurement method of the high-frequency probe is the first extraction method of the present invention, which is used to test the environment and obtain the effective circuit characteristics. In order to achieve the above-mentioned substrate, the substrate is formed by placing an intermediate region on the first surface of the substrate on the rain side of the substrate. The main purpose is to provide a test device with high accuracy and high accuracy of the dry beer inversion 1 < frequency-return pin test ring. The purpose of the two-purpose test method is to measure the height of the three objectives and pass the first one. The surface; a pair to improve the test side is to provide a test method for easy measurement, simple operation, and accurate measurement is to provide a high frequency probe equivalent circuit frequency probe. The extraction method can use simple computer assistance to quickly obtain high-frequency probes and the like. The test device of the present invention consists of a surface and a second surface, two transmission line segments, and a groove. The first part of the substrate — test connector, the test connector is used to connect the test instrument and the test device, which is characterized by:

Page 12 1236538 V. Description of the invention (3) Separate and transfer wheel test methods. Ming provides a high-frequency probe probe that uses a first surface connector that corresponds to each other to provide tester wire connections, and the test party uses a middle section of the transmission line segment to connect to the device and test. Connect at least one high-frequency corresponding transmission line segment to the two transmissions to provide the test instrument and the high-frequency probes with the same parameters. , Characteristics, and combined with the accompanying advantages, it can be placed on the substrate more easily. The two contact ends of the high frequency probe are used to extract the equivalent circuit parameters of the high frequency probe. This method is used to measure high frequency probes. The test substrate and a second surface of the substrate are provided, and two sub-substrates are provided on the first surface of the substrate. A groove is provided in the substrate area, and a pair of non-corresponding ends of the two transmission lines for testing are provided to connect the device. In order to achieve the third object of the present invention, an extraction method of an equivalent circuit of the present invention is used to measure a trench where a high-frequency probe is placed on the substrate. Relatively different ^ One-point test device = electrical property: test to extract high frequencies. In order to let the above and other aspects of the present invention mention the preferred embodiments of the present invention, the details are as follows. [Embodiment] Although the present invention can be described in the same form as the finned version below, the drawings show the embodiments disclosed by the following: Is an example of the invention and is not intended to be used

Page 13 1236538 5. The invention will be described with "i! :::" in the illustration and / or the specific embodiment described. The more severe the frequency characteristics of the probe: when the frequency is not in the "f-frequency" range, the high frequency may be ^ A frequency picking needle and a high frequency probe have been revealed: ΐ ΐ Learn about the loss caused by high frequency probes. The equivalent circuit model of the Λ Linan frequency probe of the pass wire is important. Therefore, the method needs to place a frequency probe on a test card (sock), which has the disadvantages of difficulty, high cost, and low compatibility. Figure 2 (a) is a top view of the test according to the first embodiment of the present invention. The device has 100 main line segments 101 and 102, a single circuit board, three substrates, two transmissions 1 r] A, grooves 105, and a pair of test connectors 103, with one to the right. 〃 Provide the connection function of test instruments and test devices. The substrate 106 is selected from the upper surface) and a second surface (lower surface). Its material β: is glass bad-oxygen resin, bismaleimide, imine, and epoxy resin. One kind of material in the group consisting of glass fiber and ceramics can also be two electric materials. Dig a first surface near the center of the substrate 106, and place the high-frequency probe 108 flat in the groove 105 to fix the position of the wooden needle. The size of the groove 丨 0 5 needs to be slightly larger than that of the high-frequency probe 丨 〇 8 ′. The position of the high-frequency probe ^ 8 can be fixed by using silver glue or other adhesive media. The two transmission line segments 1 (π and 102 are placed on the second surface of the substrate 100 'and each end of the two transmission line segments corresponds to each other. The two contact ends of the high frequency guide pin 108 are respectively It is electrically connected to the opposite ends of the transmission line segments 〇01 and 102. The transmission line segments 101 and 102 can be a metal microstrip line. Its characteristic impedance is preferably 50 ohms, so Its line width is determined by the

1ΙΙ1Η, p. 14 1236538

; 1 Determined by the number of electric cranes and the degree. The two transmission line segments 1 0 1 and 10 2 are preferably placed in a straight line 'and there is a small gap between the two transmission line segments 10 1 and 102, which is approximately the width of the groove 105. The test joints 103, 104 are on both sides of the substrate 106. The edges are connected to the transmission line segments 101 and 102, respectively, forming a loop. Referring to Figure 2 (b), it is a side view of a single test set of 100 high frequency probes. The second surface of the substrate 11 is a ground surface 7. The groove 105 can be made by an engraving machine or other digging tools, and the purpose is to fix the position of the high frequency board pin 108. Figures 2 (a) and 2 (b) are suitable for measuring the high-frequency equivalent circuit parameters of a single high-frequency probe, and Figure 3 (a) is the first figure according to the present invention. Top view of the test device 2 of the second embodiment, which is suitable for the test of two high-frequency probes 209 and 208. = Clothing set 2 0 0 mainly includes a substrate; two transmission line segments 2 01, 2 02; trench! 2 0 6; and a pair of test connectors 2 0 3, 2 0 4 to provide tester status and measurement Test the connection function of the device. Its main structure is roughly similar to that of the first embodiment. The substrate 207 has a first surface (upper surface) and a second surface (lower surface). The substrate 207 is selected from the group consisting of glass epoxy resin, bismaleimide bis-imide, fluorene resin, and glass fiber. And ceramics is one of the ethnic groups, shell can also be used; 丨 electrical material. The two transmission line segments 201 and 202 are placed on it. The first surface of the substrate 200 is corresponding to each end of the two transmission line segments. The two contact ends of the high-frequency probe 108 are electrically connected to the transmission line section 201 and the terminal, respectively. Dig two grooves in the central area of 2 ° 7 of the substrate. 9n% 1 Two frequency probes 209 and 210 are placed flat on the groove to fix the position of the high-frequency probe. Groove 20 5, 206 ruler

1236538 Fifth invention description (6) The inch needs to be slightly larger than the high-frequency control paste medium to fix: diameter, silver glue or other glue can be used: yes: the distance between the two high-frequency probes 209, 210 must conform to the second two = 疋Take 0 · 8_ as an example. The test joints 203 and 20 and the transmission line sections 201 and 202 are far away from each other. There will be a phase between 9, 9, and 210 on the edge of the upper base plate 207 of Yamashita II. Due to the effects of the two high-frequency probes and the mutual electric valley and mutual inductance, the equivalent circuit of two μ dry and short-circuit and the equivalent circuit of the short-circuit state are measured. From: Open the two high-frequency probes 2 〇9,21〇 Placed as shown in Figure 3U), = (b) Figure 'is two high-frequency probes 209, Sichuan.蓼 Zhao Two pictures. The second surface of the heart 207 is a ground plane 208. Its; ^ 2H can be made with an engraving machine or other digging tools: =, 疋 The two high-frequency probes 209, 21 are located in the solid can also be combined together, and "compared to; n: in : 3?) Diagram and 3⑻ diagram +, suitable for measuring two high steps;: A test device for the equivalent number of A-frequency equivalent circuit 2000. 9. ‘Needle Shou Maizhi on the same day, Figure 2 (a) and Figure 4 (a), 4 = Equivalent circuit of pin 08. Among them, the self-inductance is 8 $ and the height is the spring inside the pin 108. Due to the phenomenon of "two-self" at high frequencies. Electricity is derived from high-resistance products (heart EffeCt). As the frequency increases, the skin depth ㈣ skin two-sided resistance value becomes larger. Self-capacitance 8 〇 3, 804: To find the gap between the metal part of the 108 housing and the ground plane. From this, the single-phase ^^ pin :: equivalent circuit 800 is established to clearly understand the single-frequency pin 108. Frequency response parameter at south frequency and equivalent circuit component values ^

1236538 V. Description of the invention (7) =. = According to Figure 3 ") and Figure 4 (b), Figure 4 (b) shows two high-frequency probes: the equivalent circuit 300 of 10. The self-capacitance 301, 302, 303, and 304 are from The gap between the metal parts of the two high-frequency probes 209, 2 0 and the connection ^ = the mutual capacitance 3 ii, 3 i 2 are from the two high-frequency probes. In general, the The larger the distance is, the mutual capacitance values are 3 11, 11, 91 η: 3. The self-inductances 331, 332 are from two high-frequency probes 20, 9 and the standard spring. Because at high frequencies, the spring itself will generate Sensitivity: like =. Resistances 321 and 322 are derived from the skin effect under high frequency characteristics: electric 22 ...). As the frequency increases, the skin depth becomes shallower, making Table i. The test using the present invention will be described below. The device is used to obtain the path, and the obtained S parameters are converted into a set of γ parameters to obtain 2 = mutual: the value 1 is equivalent to the short circuit of the two high-frequency probes. The parameters are divided into a group of Z parameters to find the self-inductance and mutual inductance. The value of the figure 8 is as shown in Figure 5. The two high-frequency probes have an open circuit, and the road is 400. In order to extract their own electric lakes, 303, and each other: the special = will be two, the south frequency probe 209 ,2 The equivalent circuit 10 of 10 is in an open circuit state, and 001 is the tol Γί pins 209 and 210, and will not be connected with the two transmission line segments. The other ends of # 9, 210 are suspended to form Open circuit. Measurement: d] = s parameter when disconnected to get the valley values of these high-frequency probe discharges. Two two-frequency probes 209, 2〇 self capacitance 30.1, 3 mutual parameter 311 Y parameter formula , Can be expressed by (1) _ (3) ',

Page 12 1236538

(1) (2) Y, j〇jCm Yn ^ J (^ {C ^ Cm) where C1 and C2 are the Lei Sang of the high-frequency probe, Γίη A ^ ~ 广 4+ PI ia ^ Φ ^ 丄 < Eye and Body% This is a combination of needle catching and picking. A ,. v ...; From the two high-frequency probes 20g and 210 in an open circuit shape, ΓΓΐ :; 'plate γ parameter, the two high-frequency probes 301, 3 03 and the mutual capacitance 311 value can be derived, such as (4 )-(6) What c '= — c, =

Im

ί + gJ (l ^ J + ^, (g „-2) i + sA where f is the frequency, Z 〇 is the characteristic impedance, and)] is the number of scattered teas. (4) (5) (6), S12, S21 And S22 (see Figure 6), the equivalent circuit of two high-frequency probes in a short-circuit state is ° V. To take the values of their own inductances 331, 332 and mutual inductance 341, two south-frequency probes need to be connected. The equivalent circuit 300 of 210 is in a short-circuited state, that is, in the high-frequency probes 20 9, 210, the other ends of the two transmission line segments 201, 2 02 will not be in opposition to the other ends 2, 9, 2 1 0. Both are grounded to form a short circuit. Measure the S-parameters of these high-frequency probes at the time of the road to obtain the equivalent inductance of these high-frequency probes. Two strict frequency probes 2 0 9, 210 own inductance 331, The Z-parameter formula of 332 and mutual inductance 341 can be expressed by (7)-(9)

Page 18 1236538 V. Description of the invention (9)

Zll ~ 7 ^ 1 ⑺ (8) (9) Lin is the angular frequency of the ^ parameter ^ in which the cypress needle probes 2 0, 210 are in a short-circuit state. The two high-frequency probes are used to derive two chirp probes of 2 0 Θ, 21 〇 and turn them into a set of Z parameters. The value of 3 41 can be inferred, as shown in (10)-(12). Self inductance 331 , 332 and mutual electricity, where L1 and L2 are mutual inductances between the high-frequency probe needles, and ω is the self-inductance of the high-frequency probe. Slope 2 (19, 2 1 0 is a short post energy—γΛ, ten angular frequency- ^ p -Tm 6 '2nf 1 2nf [h-^ uh-sJhs7T: \ Ίί, a Trn ff_1 · 2π / (10) (Π) Refer to Figures 7 and 8 for Kisada Shiba (1 2) Horse spear J uses the high-frequency skew of the present invention

Set and its test method to perform the actual measurement. Among them, thunderous tears 丨 | self-insertion loss (S21), reflection loss (tested as far as A. __, u 11), electrical isolation, electrical coupling, transmission delay, signal attenuation should be ridiculous A test item in the group formed by the combination of the Japanese Renren 4 and Dianzhuang Buji Qiqi Temple. Figure 7 shows the actual measurement results of the states of the two high-frequency probes 209 and 208. Among them, the insertion loss 6of at 6 GHZ is -6.45 dB, the insertion loss 601 at 6.4 GHz is -428 dB, and the insertion loss 601 at 7 GHz is-2.98 (1B. Figure 8 shows the two The high-frequency needle 2 0 9 and 2 1 0 are the actual measurement results of the short-circuit state. Among them, the insertion loss 601 at 6 ^ GHZ is -14.41dB, and the insertion loss 601 at 6.4GHz is -14. 6dB and in The insertion loss 601 at 7GHZ is _14 · 65dB.

1236538 V. Description of the invention (10) The test results revealed by this invention are mathematically combined with the above-mentioned test methods. Different valley test cards can be used as a test device, and this technique can be more widely used by those skilled in the art. In the case of invariable changes and retouching, please use the patent boundary method. The component probe test uses Gaoming to provide a compatible environment. In the present invention, when the test device is converted and extracted, the present invention is based on the traditional test. It is easy to make the test device and applied to the high-stepped people. Therefore, the present invention shall prevail. Its tester and its equivalent circuit are required in a high-frequency method. The cost of using the device is low, the spirit of the probe test and the protection range of the probe can be the actual value. The test device and its cost and low-phase high-frequency probe are high and accurate. Any familiarity can be attached as a small application

1236538 Brief description of the diagram Figure 1 shows the traditional high-frequency probe test environment. Fig. 2 (a) shows a top view of a test apparatus according to a first embodiment of the present invention. Fig. 2 (b) shows a side view of the test apparatus according to the first embodiment of the present invention. Figure 3 (a) shows a top view of a test device according to a second embodiment of the present invention. Figure 3 (b) shows a side view of a test apparatus according to a second embodiment of the present invention. Figure 4 (a) shows the equivalent circuit for extracting a single high-frequency probe. Figure 4 (b) shows an equivalent circuit for extracting two high-frequency probes. Figure 5 shows the open circuit state of the equivalent circuit. Figure 6 shows the short circuit state of the equivalent circuit. Figure 7 shows the measured results of the open circuit state of the equivalent circuit. Figure 8 shows the measured results of the short circuit status of the equivalent circuit. [Illustration of drawing number] 1 0 0 Test device 1 0 1, 1 0 2 Transmission line segment 1 0 5 Groove 1 0 6 Substrate 1 0 7 Ground plane 1 0 8 High-frequency probe 2 0 0 Test device 2 0 1, 2 0 2 Transmission line segment 2 0 3, 2 0 4 Test connector 2 0 6 Groove 2 0 7 Base plate 2 0 8 Ground plane 2 0 9, 2 1 0 High-frequency probe 3 0 0 Equivalent circuit

1236538 on the page 21 Schematic description 301, 302, 303, 304 Self-capacitance 311, 312 Mutual capacitance 321, 322 Resistance 3 3 1, 3 3 2, 8 0 1 Self-inductance 341 Mutual inductance 400 Equivalent circuit 500 Equivalent circuit 601 Insertion loss 800 Equivalent circuit 801 own inductance 802 resistance 803, 804 own capacitance

Page 22

Claims (1)

1236538 A groove, the other ends of a pair of tests 2 · If the application is specifically selected from the middle area of the first surface of the glass ring glass fiber substrate, which is made of resin and glass placed on the connector; and 'respectively connect The connection function between non-compliance test instruments and test devices in the two transfer lines. ^ The test device of item 1 wherein the material of the substrate is one of the group consisting of oxyresin, bismaleimide, imide, and ceramics:% 3. As described in item i of the scope of patent application The testing device, wherein the substrate is the first one. — The surface is defined by a metal layer to form a test circuit surface. 4. For the test device under the scope of patent application, the surface of the substrate is a ground plane. 5. The test device according to item 1 of the scope of patent application, wherein the impedance of the two transmission sections is 50 ohms. 6. The testing device according to item 1 of the scope of patent application, wherein the groove can be placed with a surface frequency needle and one end of the south frequency picking needle must be adjacent to the two corresponding ends of the two transmission line segments. Then ,, 7 · If the test device of the scope of patent application No. 1 is used, two non-contact high-frequency probes can be placed in the groove in parallel, and each ~ end of the two high-frequency probes must be adjacent to the two transmission line segments. The two ends that correspond to each other. 8 · A test method for measuring a high-frequency probe, comprising the following steps: providing a substrate having a first surface and a second surface; Page 23 1236538 6. The scope of the patent application provides two transmission line segments placed on the first surface of the substrate, and each end of the transmission line segments corresponds to each other; or two months & = for a groove, placed on the substrate The middle area of the first surface; and a pair of test connectors are provided, which are respectively connected to the non-corresponding ends of the two transfer lines to provide the connection function between the test instrument and the test device. The test method of item 8, wherein the material f of the substrate is one selected from the group consisting of glass epoxy resin, bismaleic acid imine, chocolate resin, glass fiber, and ceramic. π. An extraction method for an equivalent circuit of a high-frequency probe, including the following steps: Place at least one high-frequency probe in a groove on a substrate, a first surface and a second surface in i ; Two transmission lines, two bases and surfaces, and the two transmission line segments should be matched; a pair of test connectors, respectively connected to the two penetrating, car piles: 1 to provide testing equipment and testing The middle area; and A groove is placed on the first surface of the substrate. Each end of the south frequency board pin is connected to the corresponding two ends of the% r% -rf -VJU -T · ^; and ... the high frequency probes on the substrate near the two transmission line segments 11. If the scope of the patent application is the 10th electric H type ,,, Μ < ask the 乂 shell 4 wood needle net effect of the _ tomb method, where these high frequency | 罙 针 系 A 半 予 / 文 文 路Ten of the square grooves. It is placed on the substrate in the form of ten lays. For example, the extraction method of the equivalent circuit of the frequency pin is 10 Page 24 1236538 Apply for patent Fanyuan 3: Shen 进 enters the second power generation method, the steps of the τ retreat power saving test are further established in these high frequency probes, the ship 1 I 彳 in the & grounding shape & & will not The two adjacent ends of the two transmission line segments are grounded to form a short circuit; and the equivalent inductances of the high frequency probes on the handle &# ec & & ΐ are measured by s ^ to obtain the high frequencies. Probe 14, if the patent application scope No. 丨 0 Jg Gufeng, the straight-to-the-rod Φ t, the frequency return pin operation equivalent circuit extraction method, in which the step of conducting the electrical test further includes: In the needle, suspend both the fish and the chip to form an open circuit; ^ Measure the audio probes at the other ends of the two transmission wheel segments adjacent to each other: the equivalent capacitance of the needle is replaced by 8 parameters. Get these high-frequency probes. 15. Take the extraction or Z-parameters of the equivalent circuit of the high-frequency probes such as Fangshen's special item 13 or 14 /, and the s-parameters when the short circuit or the open circuit can be converted into Υ The parameters are taken in various ways, wherein the electrical test is selected from the group consisting of < milli-loss, electrical isolation, electrical coupling, transmission insertion μ, and reflection loss. mp; Delay and signal attenuation A test item in a private group of corpses that are bad and successful. Page 25 I