TW201222631A - Composite growth substrate for growing a semiconductor device - Google Patents

Composite growth substrate for growing a semiconductor device Download PDF

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Publication number
TW201222631A
TW201222631A TW100117633A TW100117633A TW201222631A TW 201222631 A TW201222631 A TW 201222631A TW 100117633 A TW100117633 A TW 100117633A TW 100117633 A TW100117633 A TW 100117633A TW 201222631 A TW201222631 A TW 201222631A
Authority
TW
Taiwan
Prior art keywords
layer
donor
strained
relaxed
substrate
Prior art date
Application number
TW100117633A
Other languages
English (en)
Chinese (zh)
Inventor
Andrew Y Kim
Original Assignee
Koninkl Philips Electronics Nv
Philips Lumileds Lighting Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninkl Philips Electronics Nv, Philips Lumileds Lighting Co filed Critical Koninkl Philips Electronics Nv
Publication of TW201222631A publication Critical patent/TW201222631A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3251—Layer structure consisting of three or more layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
    • H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
    • H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/815—Bodies having stress relaxation structures, e.g. buffer layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/29—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by the substrates
    • H10P14/2901—Materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3202—Materials thereof
    • H10P14/3214—Materials thereof being Group IIIA-VA semiconductors
    • H10P14/3216—Nitrides
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/32—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by intermediate layers between substrates and deposited layers
    • H10P14/3242—Structure
    • H10P14/3244—Layer structure
    • H10P14/3248—Layer structure consisting of two layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3414—Deposited materials, e.g. layers characterised by the chemical composition being group IIIA-VIA materials
    • H10P14/3416—Nitrides

Landscapes

  • Led Devices (AREA)
  • Recrystallisation Techniques (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
TW100117633A 2010-05-19 2011-05-19 Composite growth substrate for growing a semiconductor device TW201222631A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/783,354 US8536022B2 (en) 2010-05-19 2010-05-19 Method of growing composite substrate using a relaxed strained layer

Publications (1)

Publication Number Publication Date
TW201222631A true TW201222631A (en) 2012-06-01

Family

ID=44120315

Family Applications (1)

Application Number Title Priority Date Filing Date
TW100117633A TW201222631A (en) 2010-05-19 2011-05-19 Composite growth substrate for growing a semiconductor device

Country Status (7)

Country Link
US (1) US8536022B2 (enExample)
EP (1) EP2572370A1 (enExample)
JP (1) JP5848334B2 (enExample)
KR (1) KR101810711B1 (enExample)
CN (1) CN102893373B (enExample)
TW (1) TW201222631A (enExample)
WO (1) WO2011145012A1 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120309172A1 (en) * 2011-05-31 2012-12-06 Epowersoft, Inc. Epitaxial Lift-Off and Wafer Reuse
US10141197B2 (en) * 2016-03-30 2018-11-27 Stmicroelectronics S.R.L. Thermosonically bonded connection for flip chip packages
GB2586862B (en) 2019-09-06 2021-12-15 Plessey Semiconductors Ltd LED precursor incorporating strain relaxing structure

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681472B1 (fr) 1991-09-18 1993-10-29 Commissariat Energie Atomique Procede de fabrication de films minces de materiau semiconducteur.
FR2817394B1 (fr) 2000-11-27 2003-10-31 Soitec Silicon On Insulator Procede de fabrication d'un substrat notamment pour l'optique, l'electronique ou l'optoelectronique et substrat obtenu par ce procede
US6603156B2 (en) * 2001-03-31 2003-08-05 International Business Machines Corporation Strained silicon on insulator structures
US6717213B2 (en) * 2001-06-29 2004-04-06 Intel Corporation Creation of high mobility channels in thin-body SOI devices
US7279718B2 (en) 2002-01-28 2007-10-09 Philips Lumileds Lighting Company, Llc LED including photonic crystal structure
US6774015B1 (en) * 2002-12-19 2004-08-10 International Business Machines Corporation Strained silicon-on-insulator (SSOI) and method to form the same
KR100889886B1 (ko) 2003-01-07 2009-03-20 에스. 오. 이. 떼끄 씰리꽁 오 냉쉴라또흐 떼끄놀로지 박층을 박리한 후 다층 구조를 포함하는 웨이퍼의 재활용방법
FR2851848B1 (fr) 2003-02-28 2005-07-08 Soitec Silicon On Insulator Relaxation a haute temperature d'une couche mince apres transfert
FR2857983B1 (fr) * 2003-07-24 2005-09-02 Soitec Silicon On Insulator Procede de fabrication d'une couche epitaxiee
US7012279B2 (en) 2003-10-21 2006-03-14 Lumileds Lighting U.S., Llc Photonic crystal light emitting device
US20050205883A1 (en) 2004-03-19 2005-09-22 Wierer Jonathan J Jr Photonic crystal light emitting device
US6956247B1 (en) 2004-05-26 2005-10-18 Lumileds Lighting U.S., Llc Semiconductor light emitting device including photonic band gap material and luminescent material
US7442964B2 (en) 2004-08-04 2008-10-28 Philips Lumileds Lighting Company, Llc Photonic crystal light emitting device with multiple lattices
US7244630B2 (en) * 2005-04-05 2007-07-17 Philips Lumileds Lighting Company, Llc A1InGaP LED having reduced temperature dependence
US7273798B2 (en) * 2005-08-01 2007-09-25 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Gallium nitride device substrate containing a lattice parameter altering element
US20070069225A1 (en) 2005-09-27 2007-03-29 Lumileds Lighting U.S., Llc III-V light emitting device
US8334155B2 (en) * 2005-09-27 2012-12-18 Philips Lumileds Lighting Company Llc Substrate for growing a III-V light emitting device
US7547908B2 (en) * 2006-12-22 2009-06-16 Philips Lumilieds Lighting Co, Llc III-nitride light emitting devices grown on templates to reduce strain
US20080259980A1 (en) * 2007-04-19 2008-10-23 Philips Lumileds Lighting Company, Llc Semiconductor Light Emitting Device Including Oxide Layer
US20090278233A1 (en) * 2007-07-26 2009-11-12 Pinnington Thomas Henry Bonded intermediate substrate and method of making same
FR2931293B1 (fr) 2008-05-15 2010-09-03 Soitec Silicon On Insulator Procede de fabrication d'une heterostructure support d'epitaxie et heterostructure correspondante
TWI457984B (zh) * 2008-08-06 2014-10-21 Ｓ Ｏ Ｉ Ｔｅｃ絕緣層上矽科技公司 應變層的鬆弛方法
EP2329517A1 (en) * 2008-09-24 2011-06-08 S.O.I.Tec Silicon on Insulator Technologies Methods of forming relaxed layers of semiconductor materials, semiconductor structures, devices and engineered substrates including same
JP5109912B2 (ja) * 2008-10-03 2012-12-26 セイコーエプソン株式会社 半導体装置の製造方法、半導体装置
US8227791B2 (en) * 2009-01-23 2012-07-24 Invenlux Limited Strain balanced light emitting devices
US8481991B2 (en) * 2009-08-21 2013-07-09 The Regents Of The University Of California Anisotropic strain control in semipolar nitride quantum wells by partially or fully relaxed aluminum indium gallium nitride layers with misfit dislocations
US8105852B2 (en) * 2010-01-15 2012-01-31 Koninklijke Philips Electronics N.V. Method of forming a composite substrate and growing a III-V light emitting device over the composite substrate

Also Published As

Publication number Publication date
CN102893373B (zh) 2016-07-20
US20110284993A1 (en) 2011-11-24
WO2011145012A1 (en) 2011-11-24
US8536022B2 (en) 2013-09-17
CN102893373A (zh) 2013-01-23
KR101810711B1 (ko) 2017-12-19
KR20130113337A (ko) 2013-10-15
EP2572370A1 (en) 2013-03-27
JP2013528945A (ja) 2013-07-11
JP5848334B2 (ja) 2016-01-27

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