TW201219979A - Photosensitive resin composition, photosensitive element using the same, method for forming barrier wall of image display device, method for manufacturing image display device, and image display device - Google Patents

Abstract

A photosensitive resin composition for forming a septum for isolating pixels in an image display device that has a transparent electrode on at least a display surface and has flexibility. The photosensitive resin composition comprises a component (A) which is a binder polymer having a carboxyl group in the molecule, a component (B) which is a photopolymerizable compound, a component (C) which is a photopolymerization initiator, and a component (D) which is a compound having an epoxy group in the molecule. When a sheet-like cured article having a width of 10 mm and a thickness of 45 μ m is produced by optically curing the photosensitive resin composition and heating the cured product under air at 120 DEG C for one hour, the sheet-like cured article has an elongation ratio of 40% or more at 25 DEG C.

Description

201219979 VI. [Technical Field] The present invention relates to a photosensitive resin composition, a photosensitive element using the composition, a method of forming a partition wall of an image display device, and a method of manufacturing an image display device And an image display device. [Prior Art] In recent years, an image display device (PLD: Paper Like Dispaly) which is as thin as paper and is portable and can display characters or images is attracting attention. Such an image display device has the advantage of being superior to the paper of a general printed matter, and the portability is 'further' electrically re-inputting information, so that it is attempted to be practically used as a substitute for paper from the viewpoint of environment or cost. The display technology of the image display device is a variety of types such as a type of moving particles such as electrophoresis, a liquid crystal type, and an electrochemical type (for example, refer to Non-Patent Document 1). In particular, the type of particle movement is a mode of microcapsule type electrophoresis, microcup type electrophoresis, electronic powder fluid mode, toner display mode, and the like. In such a manner, white and black particles of the display medium are sealed between the transparent electrodes, and an electric field is applied to electrically move the particles to form a white/black image and display. Further, the driving method of the image display device has active driving and passive driving, and also the back surface technology (panel circuit) for the image display device. In the above-described particle-moving type image display device, as described above, it is necessary to have a partition wall for sealing white/black particles. In the method of forming such a partition, a mold transfer method, a screen printing method, a sand blast method, a photolithography worm-inscription, a method, an active method, and the like have been proposed (for example, refer to Patent Document 1). Among them, a photolithographic etching method in which a highly precise pattern can be efficiently formed by irradiation with active light using a photosensitive resin composition is attracting attention. Recently, there have been reports of emphasizing the flexibility of an image display device or displaying a combined color filter by a white/black image display to realize full color display (for example, refer to Non-Patent Document 2). When the image display device is made flexible, it is necessary to have the flexibility of the electrode substrate. In the past, ITO (Indium Tin Oxide) which is used as a transparent electrode has a lack of flexibility. In recent years, ITO substitutes such as IZO (Indium Zinc Oxide), Ag wire, ink, and organic conductive materials have been studied (for example, reference to non- Patent Document 3) » The degree of flexibility is limited by the extent to which the degree of flexibility can be reduced, and the volume can be reduced when it is small and round. The radius of curvature of the small and circular shape is generally about 15 to 20 mm of the bend limit of the ITO electrode substrate. However, the Ag wire, the ink or the organic conductive material, and the combination thereof can reduce the radius of curvature to about 5 to 15 mm. In addition, when the full color display is performed, the image display device of the white/black display uses a color filter. Therefore, the contrast between pixels must be improved. Therefore, it is necessary to use a light shielding layer that shields light between pixels. In the case of monochrome display, the color filter is not used, and the brightness of the image of the image display device is increased. Therefore, it is not a light-shielding property, and transparency may be sought. The partition wall of the image display device using the photolithography method is formed as follows. That is, a method comprising the steps of: laminating a light-shielding layer called a black matrix by a photolithographic etching technique on a substrate: further coating a photosensitive resin composition on the light-shielding layer, 6 - 201219979 or laminating photosensitive element 俾 forming a photosensitive resin composition layer: a step of irradiating a specific portion of the photosensitive resin composition layer with active light rays to photoharden the exposed portion; and removing the unexposed portion to form light The step of hardening the pattern is also sometimes omitted from the light-shielding layer called a black matrix. Therefore, the photosensitive resin composition for forming the partition walls of the image display device generally requires sensitivity, resolution, and adhesion to the substrate. Further, when the image display device is manufactured, the method further includes the steps of: displaying the display medium such as the particles in the photo-cured material pattern obtained in the above step, the step of heat-treating the photo-cured material pattern, and the step of adhering the electrode substrate; . Thereby, an image display device using a cured product of the photosensitive resin composition layer as a partition wall can be obtained. PRIOR ART DOCUMENT PATENT DOCUMENT Patent Document 1: JP-A-2007- 1 7 8 8 8 1 Non-Patent Document Non-Patent Document _ 1 : Suzuki Akira, "The Latest Trend of Electronic Paper 2 0 0 7", October 19, 1999 On the 10th, the Japan Society of Image Studies, Vol. 46, No. 5, 372-384 (2007) Non-Patent Document 2: Tana Yuki, "Flexible Electronic Paper Using Electronic Powder Fluid", October 10, 1999 Japanese Journal of Imagery, Vol. 46, No. 5: 396-400 (2007) Non-Patent Document 3: Genjin, "Introduction of New Materials in Transparent Electrodes" 'August 10, 2011, 曰经Electronics 59 -65 (2009) 201219979 SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION In the step of adhering the electrode substrate, a voltage is applied under high temperature and high humidity, and it may be densely bonded to a photosensitive resin composition. The electrode is partially dissolved. In fact, the IZO system which is a flexible corresponding electrode substrate has a problem that it contains amphoteric metal and dissolves in the step of adhering the electrode substrate. Further, an electrode material having a high degree of flexibility and corresponding to a radius of curvature of about 5 to 15 mm is broken, for example, when the electrode material is used as a conductor, an ink, an organic conductive material, or a combination thereof, when the partition material is bent. problem. Therefore, the present invention has been made in view of the above problems, and it is an object of the invention to provide a photosensitive resin composition capable of forming a partition wall which suppresses dissolution of an electrode while suppressing breakage during bending, a photosensitive element using the composition, and an image display. A method of forming a partition of a device, a method of manufacturing an image display device, and an image display device. In order to achieve the above object, the photosensitive resin composition of the present invention is composed of a photosensitive resin for forming a partition wall of a separate pixel of a curved image display device having a transparent electrode on a display surface. The photosensitive resin composition is characterized in that the component (A) contains a binder polymer having a carboxyl group in the molecule, (B) a component: a photopolymerizable compound, (C) component: a photopolymerization initiator, and D) Component: -8-201219979 compound having an epoxy group in the molecule, which is photohardened by the above-mentioned photosensitive resin composition, and heated at 120 ° C for 1 hour to form a sheet-like hardening of 10 mm in width. The elongation of the material at 2 5 ° C is more than 4%. According to the photosensitive resin composition having the above-described configuration, it is possible to form a partition wall which can directly suppress the dissolution of the electrode which causes a problem in forming the partition wall of the image display device, and can suppress breakage during bending. A photohardenable pattern having excellent resolution and adhesion can be formed with good sensitivity. The reason why the dissolution of the electrode can be suppressed by the photosensitive resin composition having the above-described configuration is not obvious. However, it is considered that the carboxyl group remaining in the cured product of the photosensitive resin composition is trapped by the component (D), and the electrode can be suppressed. Soluble. In addition, it is considered that the breakage of the partition wall at the time of bending is suppressed, and the crosslinking density of the cured product of the photosensitive resin composition is lowered, and the elongation is adjusted to the above range, and the stretched partition wall during bending of the image display device is not damaged, and follow. According to the photosensitive resin composition of the present invention, when the image display device is bent at a radius of curvature of about 5 to 15 mm, a partition wall capable of sufficiently suppressing the occurrence of breakage can be formed. The photosensitive resin composition of the present invention may further contain (E) a component: an inorganic black pigment. The above component (E) preferably contains titanium black. By including such a component (E), the opposite characteristics of the light sensitivity and the light blocking property can be maintained in a well-balanced manner. In addition, in order to increase the brightness of the image display device, a photosensitive resin composition for forming a partition wall which does not contain the inorganic black pigment (component (E)) and a photosensitive member using the composition may be used. Therefore, the component (E) may be added as needed. The present invention provides a photosensitive element comprising a photosensitive resin composition layer comprising the -9 - 201219979 body and the photosensitive resin composition of the present invention formed on the support. By using such a photosensitive member, it is possible to form a partition wall which can directly suppress the dissolution of the electrode which causes a problem in forming the partition wall of the image display device, and can suppress breakage during bending. According to such a photosensitive resin composition, a photocured material pattern excellent in resolution and adhesion can be formed with good sensitivity. The present invention provides a method of forming a partition wall of an image display device, which is a method for forming a partition wall of an image display device having at least a partition wall of a transparent electrode and a separate pixel disposed on a display surface, and is characterized by a laminating step of laminating a photosensitive resin composition layer composed of the photosensitive resin composition of the present invention on a substrate of the image display device; and irradiating the active light to the photosensitive resin composition layer And an exposure step of photocuring the exposed portion; and removing a portion other than the exposed portion of the photosensitive resin composition layer to form a development step of the photocured pattern. The present invention further provides a method of manufacturing an image display device, comprising: a method of manufacturing an image display device having at least a partition wall of a transparent electrode and a separate pixel on a display surface, and having flexibility; In the method of forming the partition wall of the image display device of the invention, the step of forming the partition wall is performed. According to the method for forming a partition wall of the image display device and the method for producing the image display device, the partition wall is formed by the photosensitive resin composition of the present invention described above, so that dissolution of the electrode when the partition wall is formed can be suppressed. At the same time, it can suppress the broken partition wall when bending. -10- 201219979 In the method of manufacturing the image display device described above, it is preferable that the transparent electrode is made of a material formed by applying a solution containing at least one type of metal conductive fiber. Thereby, an image display device having excellent flexibility comparable to a curvature radius of about 5 to 15 mm can be formed. Further, the electrode material may, for example, be an Ag wire or an ink. In the method of manufacturing the image display device described above, it is preferable to further include a step of "filling the display medium in the partition wall" and a step of adhering the substrate to the opposite side of the partition wall so that the substrate faces one of the substrates. The present invention provides an image display device characterized by being manufactured by the above-described manufacturing method. Since the image display device is manufactured by the above-described manufacturing method, it has a partition wall which can suppress the dissolution of the transparent electrode and can suppress breakage during bending, and has high reliability as a device. According to the present invention, it is possible to provide a photosensitive resin composition for a partition wall of an image display device which can suppress the dissolution of an electrode when a voltage is applied under high temperature and high humidity, and can suppress breakage during bending. A photosensitive element of a composition, a method of forming a partition of an image display device, a method of manufacturing an image display device, and an image display device. MODE FOR CARRYING OUT THE INVENTION Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the drawings. In the drawings, the same or corresponding portions are denoted by the same reference numerals, and the description thereof will not be repeated. Also, the dimensional ratio of the drawings is not -11 - 201219979 Limited to the ratio shown. Further, '(meth)acrylic acid in the present specification means acrylic acid and methacrylic acid corresponding thereto, '(meth)acrylic acid vinegar means acrylate and methacrylate corresponding thereto' (methyl group) The acrylonitrile group means a propylene fluorenyl group and a methacryl oxime group (photosensitive resin composition) corresponding thereto. The photosensitive resin composition of the present invention has flexibility in providing a transparent electrode at least on the display surface. The photosensitive resin composition for forming a partition wall of a separate pixel of the image display device, wherein the photosensitive resin composition contains the component (A): a binder polymer having a carboxyl group in the molecule, and the component (B): Photopolymerizable compound, (C) component: photopolymerization initiator and (D) component: a compound having an epoxy group in the molecule, and the photosensitive resin composition is photocured, and then air-dried at 1 20 ° C. The sheet-like cured product having a width of 1 mm and a thickness of 45 μm which was heated for 1 hour had an elongation at 50 ° C of 40% or more. Hereinafter, each component which can be used in the photosensitive resin composition of the present invention will be described in detail. (A) component: a binder polymer having a carboxyl group in the molecule. The component (A) used in the present invention has a carboxyl group in the molecule, and is not particularly limited as long as it can impart film properties, and examples thereof include an acrylic resin and benzene. A vinyl resin, an epoxy resin, a guanamine resin, a guanamine epoxy resin, an alkyd resin, a phenol resin, or a urethane resin. Among them, from the viewpoint of alkali developability, an acrylic resin is preferred. These can be used alone or in combination of two or more types. Examples of the combination of two or more types of binder polymers include two or more types of binder polymers composed of different copolymerized components, and two or more types of binder polymers having different weight average molecular weights. Two or more kinds of binder polymers and the like having different degrees of dispersion. Further, a polymer having a complex mode molecular weight distribution described in JP-A-11-2727137 may be used. Further, the binder polymer may have a photosensitive group as needed. The component (A) can be produced, for example, by radically polymerizing a polymerizable monomer having a carboxyl group with another polymerizable monomer. The polymerizable monomer may, for example, be styrene; a polymerizable styrene derivative such as vinyl toluene, α-methylstyrene, p-methylstyrene or p-ethylstyrene; acrylamide; acrylonitrile; Ester of vinyl alcohol such as butyl-n-butyl ether; alkyl (meth) acrylate, tetrahydrofuran (meth) acrylate, dimethylaminoethyl (meth) acrylate, diethyl (meth) acrylate Glycosyl ethyl ester, glycidyl (meth)acrylate, 2,2,2-trifluoroethyl(meth)acrylate vinegar, 2,2,3,3-tetrafluoropropyl (methyl) propylene Sour vinegar, (meth)acrylic acid, α-bromo (meth)acrylic acid, α-chloro(meth)acrylic acid, 0-furyl (meth)acrylic acid, /3-styryl (meth)acrylic acid (meth)acrylic monomer; maleic acid; maleic acid monoester of maleic anhydride, monomethyl maleate, monoethyl maleate, monoisopropyl maleate; Acid, cinnamic acid, α-cyano cinnamic acid, itaconic acid, crotonic acid, propionic acid. The polymerizable monomer having a carboxyl group is preferably (meth)acrylic acid from the viewpoint of developability and stability. Further, these may be used as a copolymer as a homopolymer or a combination of two or more kinds as a copolymer. -13- 201219979 The alkyl (meth)acrylate may, for example, be methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, or (methyl) Ethyl acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and the like, and the like. The component (A) is preferably an acrylic copolymer containing methacrylic acid, methyl methacrylate, and butyl methacrylate, in terms of development and excellent resolution. The acid value of the component (A) is preferably 30 mgKOH/g or more, more preferably 80 mgKOH/g or more, most preferably 130 mgKOH/g or more, and particularly preferably 180 mgKOH/g or more. The point of excellent liquid resistance and adhesion is preferably 250 mgKOH/g or less, more preferably 240 mgKOH/g or less, most preferably 230 mgKOH/g or less, and particularly preferably 220 mgKOH/g or less. Further, in the case of developing in a solvent for the development step, it is preferred to suppress the amount of the polymerizable monomer having a carboxyl group to be used. Here, the acid value can be measured as follows. Namely, first, in order to measure about 1 g of the solution of the acid value fine resin, 30 g of acetone was added to the resin solution, and the solution was uniformly dissolved. Then, an appropriate amount of the phenolphthalein of the indicator was added to the solution, and the measurement was carried out using a 0.1 N aqueous KOH solution. Then, the acid value is calculated according to the following formula. A=1 0xVfx56.1/ ( Wpxl )

In the formula, A represents an acid value (mgKOH/g), Vf represents a titration amount (ml) of a 0.1 N KOH aqueous solution, Wp represents a mass (g) of the measured resin solution, and lanthanide means a measured resin solution. The ratio of non-volatile components -14 - 201219979 (% by mass). The weight average molecular weight of the component (A) is measured by gel permeation (GPC), and it is preferably 20,000 or more, which is preferably 30,000 or more, by using a standard polystyrene test system. The above can shorten the development time, preferably 300,000 or less, more preferably 1 5 0000 or less, most preferably. The weight average molecular weight of the binder polymer is determined by gel analysis, using standard polystyrene The measurement conditions of the calibration curve and the color change layer analysis (GPC) are as follows [GPC measurement conditions] Pump: Hitachi L-6000 type (Hitachi, Hitachi, Co., Ltd., column: Gelpack GL-R420 + Gelpack

Gelpack GL-R440 (3 pieces) (above, manufactured by Hitachi Chemical Co., Ltd.) Dissolved solution: Tetrahydrofuran Measurement temperature: 2 5 °C Flow rate: 2.05 mL/min Detector: Hitachi L-3 3 00 type RI (share Hitachi, Ltd.: In the photosensitive resin composition, the total amount of the component (A) and the component (B) in the photosensitive resin composition is 100 parts by mass, and the coating property of the composition is preferably 40 parts by mass. The amount of the component A) and the component (B) which are excellent in the mechanical strength of the photocured material are preferably 100 parts by mass or less, more preferably 60 parts by mass or less. Translucent layer analysis. Quantitative line conversion) ί宜 is 25000 points, and it is 1 0 0 0 0 0 to calculate the permeation color layer. GL-R430 + manufactured by GL-R430 + Industrial Co., Ltd.) The amount is more than 4 5 based on the photosensitive resin * (70 parts by -15 - 201219979 (B) Composition: Light The polymerizable compound can be used in the component (B) of the present invention, and is not particularly limited, and examples thereof include (B 1 ) component: a compound of an ethylenically unsaturated group and a urethane bond, a polyol, and/or a compound containing a glycidyl group, a compound obtained by the α reaction, and a (Β3) component: a compound having an ethylenically unsaturated bond. (Β1) Component: a compound having an ethylenic acid-free bond in the molecule to enhance the hardened substance In the case of the flexible group, it is preferable to contain the component (Β1). The component (?1) used in the present invention may not have a compound having a trimeric isocyanate ring structure. The compound having a ring structure may, for example, be as follows. The formula (1 is photocrosslinkable to have a B (Β2) component in the molecule: in the cold-unsaturated carboxylic acid--there is an ethyl bromide group and the amine deck is excellent in adhesion. But preferably contains trimeric isocyanate) Compound [Chemical 1]

[In the formula (1), R1 each independently represents a group represented by the following formula (2)-16-201219979, represented by the following formula (3) or a group of the following formula (4), among R1 At least one of the groups represented by the following formula (4)] [Chemical 2] - {ch2ch2o)^-c-c = IO R2 : ch2 (2) [In the formula (2), R2 represents a hydrogen atom or Methyl, m represents an integer], as shown in Fig. 5, [3] (CH2CH2〇)-^-H (3) [In the formula (3), m is an integer of 1 to 15] [Chemical 4] I Ο-(ch2ch2o) ο :― —c==ch2 I ο I R2 [In the formula (4), R2 represents a hydrogen atom or a methyl group, n represents a number, and m is an integer from 1 to 15] From elasticity The R1 c in the general formula (1) is preferably a group represented by the following formula (4), and more preferably a group represented by the above formula (4). In the general formulae (2), (3), and (4), the chemical resistance is excellent (4) to 9, and at least 2 is the following point, and -17-201219979 is preferably an integer of 1 to 6. Further, in the general formula (4), the mechanical strength is recommended, and m is preferably an integer of 3 to 6. The compound represented by the above formula (1) can be exemplified by the K oligomer UA-21EB (Naka Nakamura Chemical Industry Co., Ltd., Shangyue Formula (1), and R1 is all in the formula (4). Show compound). Further, the component (B1) preferably contains a urethane bond having a reaction of a hydroxyl group derived from a polycarbonate and/or a terminal of the polyester compound with a cyanate group of a diisocyanate compound, and is at the end of the plural A compound obtained by condensation reaction of a cyanate group-containing urethane compound with a compound having a hydroxyl group and an ethylenic group. These compounds may also be synthesized by conventional methods or may be commercially available. For the market, for example, UF-8003M, UF-TCB-50 TC4-55 (the above-mentioned product name, manufactured by Kyoeisha Chemical Co., Ltd.) 9082-95 (trade name, manufactured by Hitachi Chemical Co., Ltd.). Further, the component (B1) other than the above may, for example, be a (meth)acrylic monomer having a hydroxyl group at the /3 position, 2,6-toluene diisocyanate with isophorone diisocyanate, or 2,4-toluene diisocyanate. And addition reactants of diisocyanate compounds such as 1,6-hexyl diisocyanate; urethane di(meth)acrylate, EO, PO modified amine diester (meth) acrylate . EO-modified urethane di(methacrylate) is, for example, Shin-Nakamura Chemical Industry Co., Ltd., product name 11. Further, EO, PO-modified urethane di(meth)acrylic acid, for example, Shin-Nakamura Chemical Industrial Co., Ltd., product name UA -1 3. (B2) Ingredients · In the case of polyols and / or containing glycidyl groups, such as N 丨,, the composition of the difference. Different: not enough to use « UF -, HT has an ester, methylene EO-modified methyl group) ^ UA-ester can be compounded -18-201219979 A compound obtained by reacting an α,/3-unsaturated carboxylic acid. The (Β2) component may, for example, be a polyethylene glycol di(meth)acryl vinyl group having a number of 2 to 14), or a polypropylene glycol di(methyl)propyl group (the number of the propylene groups may be 2 to 14). Olefin Glycol Di(methacrylate); Trimethylolpropane Di(meth)acrylate, Trihydroxyalkyl Tri(meth)acrylate, Trimethylolpropane Ethoxy Tris(Acrylate, Trishydroxyl Propanepropoxy tris(meth)acrylic acid trimethylolpropane (meth) acrylate compound; tetramethylol (meth) acrylate, tetramethylol methane tetra(methyl) propylene tetrahydroxyl Methane (meth) acrylate compound; dipentaerythritol (meth) acrylate, dipentaerythritol hexa(meth) acrylate dipentaerythritol (meth) acrylate compound; bisphenol quinone dioxy (meth) acrylate, double Bisphenol ethylene di(meth)acrylate such as phenol A trioxyethylene di(methyl)propyl, bisphenol A nonyloxy ethylene di(meth)acrylate; trimethylolpropane triglycol triacrylate And bisphenol A diglycidyl ether acrylate. The (B2) component preferably contains a polyolefin glycol diacrylate acrylate, and preferably contains a compound represented by the following general formula (5), (6) 7), wherein the cured film is low in elasticity and excellent in analytical performance. Compound. 1: 5] 0 II (

H2C=C—C—O-^-EO R

ο ^ II EO-j-C-C=CH2 R (5) Ethyl esters such as methane triesters such as methane triesters, etc. Oxygen oleyl ether and dense (methyl, or ( -19- 201219979)

Ο h2c=c-c-o-fPO PO-

R %

0 II -c-c=ch2 R (8) h2c =c -co -|eo-^po^-c -c =CH2 (7) R ΓΠ4 Π4 j In the above formula (5), (6) or (7) R forms each independently represents a hydrogen atom or a methyl group, EO represents an oxyethylene group, and PO represents an oxypropylene group. Mi, m2, m3, and πΐ4 represent the number of repetitions of the structural unitary oxime composed of oxyethylene groups, and iM, n2, n3, and n4 represent the number of repeating units of the structural unit composed of oxypropylene groups, and oxyethylene The total number of repetitions "11+1112, m3, and m4 independently represent an integer of 1 to 30, and the total number of repetitions ηι, n2 + n3, and n4 of the oxypropylene groups independently represent an integer of 30. In the compound represented by the above formula (5), (6) or (7), the total number of repeats of oxyethylene groups η Μ + ιη ζ, m3 and m4 each independently represents an integer of from 1 to 30, preferably an integer of 1 〇 More preferably, it is an integer of 4 to 9, and is preferably an integer of 5 to 8. In the case where the resolution and the adhesion are excellent, the total number of the repeats is preferably 10 or less, more preferably 9 or less, and most preferably 8 or less. The total number of repeats of oxypropylene groups, 112 + 113 and n4 each independently represents an integer of 1 to 3 Å, preferably an integer of 5 to 2 0, more preferably an integer of 8 to 16, and most preferably an integer of 10 to 14. The total number of repetitions is preferably 20 or less, more preferably 16 or less, and most preferably 14 or less, and the compound represented by the above formula (5) is, for example, r, for the improvement of the resolution and the improvement of the sludge. = vinyl compound of methyl, mi + m2 = 6 (average 値), 〜 = 12 (average 値) (manufactured by Hitachi Chemical Co., Ltd., trade name: FA-023M). The compound represented by the formula (6) in the above -20-201219979 is, for example, a vinyl compound having R = methyl group, I»3 = 6 (average 値) 'n2 + n3 = 12 (average 値) (Hitachi Chemical Industry Co., Ltd. Stock company system, product name: FA*024M). The compound represented by the above formula (7) is, for example, a vinyl compound of R = hydrogen atom, m4 = 1 (average 値), and n4 = 9 (average 値) (manufactured by Shin-Nakamura Chemical Co., Ltd., sample name: NK ester HEMA-9P) and the like. (B3) component: The compound (B3) having an ethylenically unsaturated bond in the molecule is not particularly limited, and is preferably a compound represented by the following formula (8). [Chem. 6] Q OR3

In the formula (8), R3 represents a hydrogen atom or a methyl group, R4 represents any one of a hydrogen atom, a methyl group or a halogenated methyl group, and R5 represents a group having a carbon number of 1 to 6, a crypto atom, and a hydroxyl group. Either P represents an integer of 0 to 4. Further, when p is 2 or more, the plural R5 systems may be the same or different. -(〇_A )- represents an oxyethylene group and/or an oxypropylene group, and the total number of repeats of -(Ο-A)- represents a whole number of 1 to 4. The compound represented by the above formula (8) may, for example, be r-chloro-^ _ -21 - 201219979 hydroxypropyl-(meth)acryloyloxyethyl-indole-phthalate, hydroxyethyl- Cold '_(meth)acryloyloxyethyl-0-decanoate, and /5-hydroxypropyl-(meth)acryloyloxyethyl-indole-caprate, wherein r-chloro is preferred - cold-hydroxypropyl-dot'-(meth)acryloyloxyethyl-indole-phthalate. The r-chloro-cold-hydroxypropyl-cold'-(meth)acryloyloxyethyl-indole-decanoate is commercially available as FA_MECH (manufactured by Hitachi Chemical Co., Ltd., product name). The above component (B) may be used alone or in combination of two or more. The content of the component (B) in the photosensitive resin composition is preferably 100 parts by mass based on the total amount of the components (A) and (B) from the viewpoints of resolution, adhesion, and film formability. The range of 30 to 60 parts by mass is more preferably 40 to 55 parts by mass. The crosslinking density of the cured product of the photosensitive resin composition can be mainly adjusted by a combination of the above components (A) and (B). After adjusting the composition, the photosensitive resin composition is cured, and the cured product having a width of 10 mm and a thickness of 45 μm is heated at 120 ° C for 1 hour under air to adjust the elongation at 25 ° C to 40 °C. When the image display device is bent, the extension partition wall is not damaged, and can be followed, and the damage of the partition wall can be sufficiently suppressed. When the image display device is bent at a curvature radius of about 5 to 15 mm according to the photosensitive resin composition of the present invention, a partition wall capable of sufficiently suppressing breakage can be formed. (C) component: the photopolymerization initiator can be used as the component (C) of the present invention as long as it is in accordance with the wavelength of light used in the exposure--22-201219979 optical machine, and is not particularly limited. Methyl ketone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michlerone) 'N,N,-tetraethyl-4,4'-diaminodiphenyl Methyl ketone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2,dimethylamino-1-(4-morpholinylphenyl)-butanone -1,2-Aromatic ketone of methyl-1-[4-(methylthio)phenyl]-2-morpholinyl-acetone-1; 2-ethyl fluorene, phenanthrenequinone, 2- Tributyl hydrazine, octamethyl hydrazine, 1,2-benzopyrene, 2,3-benzopyrene, 2-phenyl fluorene, 2,3-diphenyl fluorene, 1-chloro Anthraquinones such as hydrazine, 2-methylhydrazine, 1,4-naphthoquinone, 9,10-phenanthrenequinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylhydrazine; a benzoin ether compound such as benzoin methyl ether, benzoin ethyl ether or benzoin phenyl ether; a benzoin compound such as benzoin, methyl benzoin or ethyl benzene; 1-(4-methoxyphenyl)_2,2-dimethoxy-2-phenylethane- 1-ketone, 1-(4-methoxyphenyl)-2-methoxy-2-ethoxy-2-phenylethan-1-one, 1-(4-methoxyphenyl) 2-methoxy-2-propoxy-2-phenylethane-1-one, 2,2-dimethoxy-!,2-diphenylethane-buxone (commonly known as benzyl) a benzyl derivative such as benzyl ketal or the like; an acridine derivative such as 9-phenyl acridine or I,7-bis(9,9,-acridinyl)heptane N-phenylglycine, N-phenylglycine derivative; coumarin compound; 2-(o-chlorophenyl)-4,5-diphenylimidazolium, 2-(o-chlorobenzene) -4,5-bis(methoxyphenyl)imidazole, 2_(o-fluorophenyl)-4,5-diphenylimidazolium, 2_(o-methoxyphenyl)- An imidazole couple of 4,5-diphenylimidazolium, 2-(p-methoxyphenyl)-4,5-diphenylimidazolium or the like. Also, the substituent of the 2,4,5-triaryl aryl group of the 2,4,5' triarylimidazole couple can also give the same and symmetrical compound, -23-201219979 Obtain a compound that is different and not symmetric. Further, in combination with diethyl thioxanthone and dimethylamino benzoic acid, a thioxanthone-based compound and a tertiary amine compound may be combined. These may be used alone or in combination of two or more. In the case where the (C) component is excellent in the curability of the bottom of the photoresist after curing of the photosensitive resin composition, it is preferable to contain a benzyl derivative such as benzyl ketal, and to harden the photosensitive resin composition. In the case where the hardenability of the upper portion of the photoresist is excellent, it is preferable to contain an acridine derivative, and it is preferable to contain a benzyl derivative such as benzyl ketal or an acridine derivative, which is excellent in the hardenability of the upper portion. Both. In particular, when the thickness of the layer composed of the photosensitive resin composition is thicker, it is necessary to constantly adjust the curability of the bottom of the resist and the hardenability of the upper portion of the photoresist. Among them, the component (C) has a good resolution and can suppress the tailing of the photoresist after hardening, and preferably contains an acridine derivative and a benzyl derivative, and particularly preferably contains 1,7-bis (9). Both 9'-acridinyl)heptane and 2,2-dimethoxy-1,2-diphenylethane-1-one. The content of the component (C) in the photosensitive resin composition is preferably 0.1 part by mass or more, more preferably 0.2 mass, based on 100 parts by mass of the total of the components (A) and (B). More than one. The amount of the photocurable property in the photosensitive resin composition is preferably 20 parts by mass or less, and more preferably 1 part by mass or less, based on 100 parts by mass of the total of the components (A) and (B). Wherein, in the case of the above component (C), when 1,7-bis(9,9'-acridinyl)heptane is contained, the content is in the range of -24-201219979 with respect to the above-mentioned (A) component and (B). In terms of the total amount of light, it is preferably (^(^~丨 by mass, more preferably 0.1 to 0.5 parts by mass). Further, in terms of the above (C) component, it contains 2,2. -dimethoxy-1,2-diphenylethane-1 ketone, the content is 100% by mass based on the total amount of the components (A) and (B), and the light sensitivity and adhesion are In particular, it is preferably 1 part by mass or more, and more preferably 2 parts by mass or more. The step of heat treatment is preferably 10 parts by mass or less, more preferably 5 parts by mass or less from the viewpoint of suppressing outgassing. (D) Component: a compound having an epoxy group in a molecule, the component (D) used in the present invention is a compound having an epoxy group (oxetane ring) in a molecule. A compound having an epoxy group in a molecule may be used. For example, bisphenol A type epoxy resin such as bisphenol A diglycidyl ether, bisphenol F type epoxy resin such as bisphenol F diglycidyl ether, bisphenol S diglycidyl ether Bisphenol type epoxy resin such as bisphenol S type epoxy resin or bisphenol diglycidyl ether, bisphenol type epoxy resin such as bisphenol diglycidyl ether, hydrogenated bisphenol A shrinkage Hydrogenated bisphenol A type epoxy resin such as glyceryl ether, dicyclopentadiene type epoxy resin, cresol novolak type epoxy resin, and the like acid-modified diglycidyl ether type epoxy A commercially available product can be used as the compound. Examples of the bisphenol A diglycidyl ether include Epikote 828, Epikote 1001, and Epikote 1002 (all of which are manufactured by Japan Epoxy Resin Co., Ltd., trade name). And Epichlon 1 05 5 (manufactured by DIC Corporation, trade name) -25- 201219979 Bisphenol F diglycidyl ether, for example, Epikote 8 07 (manufactured by Japan Epoxy Resin Co., Ltd., trade name), bisphenol S Examples of the glycidyl ether include EBPS-200 (manufactured by Nippon Chemical Co., Ltd., trade name) and Epichlon EXA-1514 (manufactured by DIC Corporation, trade name). Examples of the bisphenol diglycidyl ether include YL-6. 121 (made by Japan Epoxy Resin Co., Ltd., product name) The dimethyl diglycidyl ether may, for example, be YX-4 000 (manufactured by Japan Epoxy Resin Co., Ltd., trade name). Further, hydrogenated bisphenol A glycidyl ether may, for example, be ST-2004 and ST-2007. (Either are manufactured by Toho Chemical Co., Ltd., and a product name), and the dicyclopentadiene type epoxy resin may, for example, be Epichlon HP-72 00L (manufactured by DIC Corporation, trade name), and a cresol novolak type ring. Examples of the oxygen resin include Epichlon N-665-EXP, Epichlon N-670-EXP-S (manufactured by DIC Corporation, trade name), and the like. The dibasic acid-modified diglycidyl ether type epoxy resin may, for example, be ST-5100 or ST-5080 (any of which is manufactured by Tosei Kasei Co., Ltd., trade name). Among these, in order to suppress the dissolution of the electrode, it is preferably a dicyclopentadiene type epoxy resin and a cresol novolak type epoxy resin, and more preferably a cresol novolak type epoxy resin. Further, the above component (D) may be used singly or in combination of two or more. The content of the component (D) in the photosensitive resin composition is preferably 5 parts by mass or more, and more preferably 10 parts by mass based on 100 parts by mass of the total of the components (A) and (B). Quality. Parts or more. The photosensitive resin composition is preferably 30 parts by mass or less in -26 to 201219979, more preferably 20 parts by mass or less in the film formability. (E) component: an inorganic black pigment can be used in the present invention ( The component E) may, for example, be titanium black, carbon black or cobalt black, and is preferably black in terms of good transmittance of light having a wavelength of 360 nm and 40 5 nm. The content of the component (E) in the photosensitive resin composition is preferably 0.1 part by mass or more, more preferably 0.2, in terms of the light-shielding property of the total amount of the components (A) and (B). More than the mass. The point of excellent adhesion and resolution is preferably 1 part by mass or less, more preferably 5 parts by mass or less. The photosensitive resin composition containing the above components further contains a dye such as malachite green, a photochromic agent such as tribromophenylphosphonium or reduced crystal violet, a thermal coloring inhibitor, and p-toluene. Plasticizers such as decylamine, pigments other than black, chelating agents, antifoaming agents, flame retardants, stabilizers, adhesion imparting agents, leveling agents, peeling accelerators, antioxidants, perfumes, imaging agents, heat The amount of the crosslinking agent or the like is 1 to 20 parts by mass per 1 part by mass of the total of the components (A) and (B). These may be used alone or in combination of two or more. The photosensitive resin composition of the present invention containing the above components can be obtained by uniformly kneading and mixing the components contained in a roll mill, a bead honing machine or the like. Further, if necessary, it may be dissolved in a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide or propylene glycol monomethyl ether or These mixed solvents are used to form a solution of about 30 to 60% by mass of the solid -27-201219979. The method of forming the photosensitive resin composition layer on the substrate for an image display device using the obtained photosensitive resin composition is not particularly limited, but the photosensitive resin composition may be applied to the substrate as a liquid. The method of drying the photoresist. Further, a protective film is coated on the photosensitive resin composition layer as needed. Further, although it will be described in detail later, it is preferable to use a photosensitive resin composition layer in the form of a photosensitive element. A protective film which is used as a liquid photoresist and which is coated with a protective film after coating is used, for example, a polymer film such as polyethylene or polypropylene. The photosensitive resin composition is obtained by photohardening the photosensitive resin composition, and then heating at 120 ° C for 1 hour to obtain an elongation at 25 ° C of a sheet-like cured product having a width of 10 mm and a thickness of 45 μm. More than 40%. The elongation is 4 〇 % or more, and more preferably 60% or more from the viewpoint of suppressing breakage at the time of bending. The elongation of the cured product can be adjusted by reducing the crosslinking density of the cured product by a combination of the component (A) and the component (B). Here, the photocuring of the photosensitive resin composition is carried out by using the photosensitive resin composition to form a partition wall, exposing it with necessary energy, and developing it as needed. The energy is preferably such that the number of residual segments after the development of the 41-step tablet is 29.0. The specific measurement method of the elongation of the cured product can be used: the cured product is formed into a sheet having a width of l〇mm and a thickness of 45 μm, and is stretched at a constant speed of 25 ° C, a distance between the chucks of 50 mm, and a speed of 2 cm/min. The elongation (%) at the time of fracture of the cured product 'is determined by the following formula. -28- 201219979

Elongation (%) = {(length at break - initial length) / length of initial stage} xlOO Further, the photosensitive resin composition is formed on the transparent electrode to form a photosensitive resin composition composed of the photosensitive resin composition After the layer 'photohardens the photosensitive resin composition layer', it is heated at 120 ° C for 1 hour under air, and a DC voltage of 80 V is applied to the transparent electrode at 60 ° C and 90% RH for 100 hours, which is preferably continuous. By. Here, the photocuring of the photosensitive resin composition is carried out by using the photosensitive resin composition layer to form a partition wall, exposing it with necessary energy, and developing it as needed. The energy is preferably such that the number of residual segments after the development of the 41-step tablet is 29.0. The specific judgment method for the dissolution of the transparent electrode is to test the impedance 値 of the anode by the tester, and the measurable person is used as the dissolution unbroken line, and the unmeasured person judges that the disconnection is caused by dissolution. Further, for a measurable person, it is also possible to seek an increase rate derived from the initial impedance 値. (Photosensitive element) Fig. 1 is a schematic cross-sectional view showing an appropriate embodiment of the photosensitive element of the present invention. As shown in Fig. 1, the photosensitive element 10 of the present invention comprises a support 1 and a photosensitive resin composition layer 2 composed of the photosensitive resin composition formed thereon, and is formed on a photosensitive resin. The protective film 3 on the composition layer 2. Further, the protective film 3 is provided as needed. The support 1 is preferably a polymer film such as polyethylene terephthalate, polypropylene, polyethylene, polyester or the like. The thickness of the polymer film -29- 201219979 should be about 1~ΙΟΟμηι, more preferably 5~50μιη, most preferably 10~30μηι. Further, when the support 1 is transparent, when the photosensitive resin composition layer 2 is exposed, exposure can be performed via the support 1, which is preferable. The method for forming the photosensitive resin composition layer 2 on the support 1 is not particularly limited, but it is preferably carried out by applying and drying a solution of the photosensitive resin composition. The thickness of the photosensitive resin composition layer to be applied differs depending on the desired characteristics, but the thickness after drying is preferably about 10 to ιοομηη, more preferably 20 to ΙΟΟμιη, and most preferably 30 to ΙΟΟμηι'. For 40~ΙΟΟμιη. The coating system is carried out by a known method such as a roll coater, a notch coater, a gravure coater, an air knife coater, a die coater, or a bar coater. The drying system can be carried out, for example, at 70 to 150 ° C for about 2 to 30 minutes. In addition, the amount of the residual organic solvent in the photosensitive resin composition layer 2 is preferably 2% by mass or less from the diffusion of the organic solvent in the subsequent step. The protective film 3 may be laminated on the photosensitive resin composition layer 2 formed on the support 1, and the surface of the photosensitive resin composition layer 2 may be coated. In the case of the protective film 3, it is preferable that the adhesion between the photosensitive resin composition layer 2 and the protective film 3 is smaller than the adhesion between the photosensitive resin composition layer 2 and the support 1 'polyethylene, polypropylene can be used. A polyester film represented by an olefin-based film or polyethylene terephthalate. When a polyester film is used as the support 1', when the same polyester film is used as the protective film 3, it is preferable to use a surface which is in contact with the photosensitive resin composition layer of the protective film 3. Moreover, these protective films 3 are preferably films of low fish eyes. Here, the so-called "fisheye" is a hot-melt material, and when a film is produced by kneading, extrusion, biaxial stretching, casting, etc., foreign matter, undissolved matter, oxidative degradation, etc. of the material are taken into the film. By. That is, the "low fisheye" means that the foreign matter or the like in the film is small. Further, the photosensitive element 1 may have an intermediate layer of a buffer layer, an adhesive layer, a light absorbing layer, a gas barrier layer or the like in addition to the photosensitive resin composition layer 2, the support 1 and any protective film 3. Protective film. The photosensitive element 10 to be produced is generally wound around a cylindrical core and stored. Further, at this time, it is preferable to wind up the support body 1 to the outside. Further, it is preferable that the end surface of the above-mentioned roll-shaped photosensitive element roller is provided with an end surface separation film from the viewpoint of end surface protection, and a moisture-proof end surface separation film is preferably provided from the viewpoint of edge-resistant melting. Here, the side melting means that the photosensitive resin composition layer 2 bleeds out from the end surface which is also referred to as a cold flow. If this occurs, it becomes a source of foreign matter when the partition wall is formed, which is a poor phenomenon. Further, the packing method should be packaged in a black sheet having a small moisture permeability and excellent light blocking properties. The material of the above-mentioned winding core may, for example, be a plastic such as a polyethylene resin, a polypropylene resin, a polystyrene resin, a polyvinyl chloride resin or an ABS resin (acrylonitrile-butadiene-styrene copolymer). (Method of Forming Partition Wall of Image Display Device, Method of Manufacturing Image Display Device, and Image Display Device) Next, a method of forming a photosensitive resin composition of the present invention or a partition wall of an image display device using the photosensitive element will be described A method of manufacturing an image display device and an image display device. First, as shown in FIG. 2(a), the electrode substrate 30 composed of the electrode 4 and the substrate 5 is prepared, as shown in FIG. 2(b), and the above-mentioned electrode substrate 30 is laminated on -31 - 201219979. The photosensitive resin composition layer 2 and the support 1 in the photosensitive element 10 (layering step). The substrate 5 constituting the electrode substrate 30 is not particularly limited as long as it is a substrate having flexibility, and examples thereof include an insulating substrate of a polymer film substrate and a semiconductor substrate such as a ruthenium substrate. The electrode substrate 30 is, for example, an electrode 4 having a bendability of ITO, IZO, Ag wire, and ink formed on the substrate 5. The method of forming the electrode 4 may be, for example, a method of patterning an electrode material laminated by a method such as vapor deposition or sputtering, or a method of patterning a photosensitive electrode material. The method of forming the electrode 4 is not particularly limited. In the method of laminating the photosensitive resin composition layer 2 on the electrode substrate 30, a solution of the photosensitive resin composition can be applied onto the electrode substrate 30 in addition to the method of using the above-described photosensitive element 1 ,, and Dry method. When the protective film 3 is present on the photosensitive resin composition layer 2 by the laminating method using the photosensitive element, the protective film 3 is removed and laminated on the electrode substrate 30. For example, the photosensitive resin composition layer 2 is heated to about 70 to 130 ° C, and is pressure-bonded to the electrode substrate 30 at a pressure of about 0.1 to about 1 MPa (about 1 to 10 kgf/cm 2 ). The laminate may be laminated under reduced pressure by a lamination method or the like. The shape of the surface of the electrode substrate 30 is generally formed into an electrode pattern, but it may be flat or irregular as necessary. After laminating the photosensitive resin composition layer 2, as shown in Fig. 2(b), the photosensitive resin composition layer 2 is irradiated with the active light ray 8 in an image form, and the exposed portion is photocured (exposure step). The method of irradiating the active light ray 8 in an image form is as shown in FIG. 2(b), and the active light ray 8 is irradiated on the photosensitive resin composition layer 2 by providing a mask pattern 7 on the -32-201219979 mask pattern. A method of photocuring the photosensitive resin composition layer 2 of the exposed portion. The mask pattern 7 series can be either a negative type or a positive type, and can be used by a general user. The light source of the active light 8 can effectively emit ultraviolet light or visible light of a known light source such as a carbon arc lamp, a mercury vapor arc lamp, a high pressure mercury lamp, a xenon lamp or the like. Further, the exposure method can also be used: a direct drawing exposure method in which a pattern is directly drawn by a laser without using the mask pattern 7. After the exposure, as shown in FIG. 2(c), the photosensitive resin composition layer 2 of the unexposed portion is selectively removed by development to form a photocured material on the substrate (electrode substrate 30) for the image display device. Figure 20 (development step). Further, in the case where the support 1 is present in the development step, the support 1 is removed first. The development is carried out by removing the unexposed portions by wet development or dry development using an aqueous solution such as an aqueous alkaline solution, an aqueous developing solution or an organic solvent. In the present invention, an alkaline aqueous solution is preferably used. The alkaline aqueous solution may, for example, be a thin solution of 0.1 to 5% by mass of sodium carbonate, a thin solution of 0.1 to 5% by mass of potassium carbonate, or a thin solution of 0.1 to 5% by mass of potassium hydroxide. The pH of the alkaline aqueous solution is preferably in the range of 9 to 1 1 and the temperature is adjusted in accordance with the developability of the photosensitive resin composition layer. Further, a surfactant, an antifoaming agent, an organic solvent or the like may be mixed in the alkaline aqueous solution. The above-mentioned development method may be, for example, a dipping method, a spraying method, a brush coating type, a rubbing type, or the like, but it is preferable to use a spraying method for improving the resolution. For the post-development treatment, it is preferred that the formed photo-cured pattern 20 is further hardened by heat treatment at about 60 to 250 °C as needed. The hardening temperature is preferably about 80 to 200 ° C, more preferably about 1 〇〇 to 15 ° ° C. Also - -33- 201219979 The hardening time is not particularly limited, but it should be 10 minutes to 3 hours, more preferably 30 minutes to 2 hours. Further, in the photo-cured material pattern 20 formed in the above step, the step of charging the display medium such as particles; and the step of adhering the other electrode substrate 30 to the photo-cured pattern 20 (Fig. 2(d) And (e)) or the like, the formation of the partition wall of the image display device and the manufacture of the image display device can be completed. The step of adhering the photocured pattern 20 to the other electrode substrate 30 is carried out as follows. That is, the above steps are as shown in FIG. 2(d), and the adhesive 40 is laminated on the photo-cured pattern 20, and as shown in FIG. 2(e), the electrode substrate 30 and the light are adhered by the adhesive 40. The hardened pattern 20 is carried out. Further, a transparent electrode substrate can be used for at least the electrode substrate on the display surface side of the image display device. The image display device formed by the above-described respective steps includes a partition wall composed of the electrode substrate 30 having flexibility and the photocured material pattern 20 having a high degree of elongation, and excellent bending property can be achieved. In particular, by selecting the material of the electrode 4, an image display device having a bendability to a height corresponding to a radius of curvature of about 5 to 15 mm can be obtained. Further, when the partition wall formed by using the photosensitive resin composition of the present invention bends the image display device with a curvature radius of 5 to 15 mm, the occurrence of breakage can be sufficiently suppressed. [Embodiment] Hereinafter, the present invention will be more specifically described by way of examples. However, the present invention is not limited to the embodiment - 34 - 201219979, as long as the technical idea of the present invention is not exceeded. (Examples 1 to 4 and Comparative Examples 1 to 5) After the components (A), (B), (C), (E), and other components shown in Table 1 were blended, Table 1 was added. The component (D) is shown dissolved, and Examples 1 to 4 and Comparative Examples are obtained! ~5 photosensitive resin composition. The amount of each component (unit: g) is as shown in Table 1. [Table 1] Project example] Example 1 2 3 4 1 2 3 4 5 (A) Component Resin A" 45 45 45 45 45 45 45 45 - Resin B « - - - - - - - - 45 (B )Component HT-9082-95*3 6 6 6 6 6 6 6 6 6 UA-21EB*4 23 23 23 23 23 23 23 23 23 FA-023M*5 10 10 10 10 10 10 10 10 10 FA-024M* ® 6 6 6 6 6 6 6 6 6 FA-MECH*7 10 10 10 10 10 10 10 10 10 (C) Component EAB*8 0.05 0.05 0.05 0.05 0.05 0.05 0.05 TPS*8 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0,5 N-1717*10 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3 651*&quot; 3 3 3 3 3 3 3 3 3 (D) Component N-670-EXP-S02 12.81 - - - - - - - HP-7200L*13 - 15.31 - Ink - - - - - 1055*'4 - - 29.69 - - - - - - N-665-EXP*'5 - - - 13 - - - - - Block isocyanic acid Brewing compound BL3175*&quot; - - - - 10 - - - - BL3475*,7 - - - - - 10 - - - VPLS2253·'8 - - - - - - 10 - - (E) component BT-1HCA*' 9 0.59 0.59 0.59 0.59 0.59 0.59 0.59 0.59 0.59 Other ingredients DOPA-17HF*20 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.25 0.2? SZ-6030*s, 5 5 5 5 5 5 5 5 5 Toluene 12 12 12 12 12 12 12 12 12 methanol 4 4 4 4 4 4 4 4 4 The contents of the respective components in Table 1 are as follows. Further, the component (A) is blended as the following amount of the resin solution, but the amount of the solid component is shown in Table 1. 35- 201219979 (A) Component: Adhesive polymer *1: (meth)acrylic acid / methyl methacrylate / butyl methacrylate copolymer (resin A, mass ratio 3 0/3 5/3 5, weight Average molecular weight 5 0000, acid value 196) 48% by mass methyl cellosolve / toluene (mass ratio 6/4) solution 93.75g (solid content 45g) *2: methacrylic acid / methyl methacrylate / benzo 48% by mass of methyl cellosolve/toluene (mass ratio 6/) of methacrylate/styrene copolymer (resin B, mass ratio 3 0/5/25/40, weight average molecular weight 56000, acid price 196) 4) solution 93.75 g (solid content: 45 g) (B) component: photopolymerizable compound *3: photopolymerizable compound obtained by reacting a polycarbonate compound having a hydroxyl group at the terminal, an organic isocyanate, and a hydroxyethyl acrylate (weight average molecular weight 4000, manufactured by Hitachi Chemical Co., Ltd., trade name: HT-9082-95) * 4 : UA-2 1EB (New Nakamura Chemical Industry Co., Ltd.) Company system, product name) * 5 : FA-02 3 M (made by Hitachi Chemical Co., Ltd., product name) * ό : FA-024M (made by Hitachi Chemical Co., Ltd., trade name) *7: 7-Chlorine yS·Hydroxypropyl-indole, methacryloyloxyethyl-indole-decanoate (manufactured by Hitachi Chemical Co., Ltd., trade name FA-MECH) -36- 201219979 (C) Ingredients: Photopolymerization initiator 氺8: N,N,-tetraethyl-4,4,-diaminobenzophenone (manufactured by Hodogaya Chemical Industry Co., Ltd., trade name: EAB) * 9 : Tribromomethylphenyl roller (Sumitomo Chemical Co., Ltd.: Product Name: TPS) *10: 1,7·bis(9-acridinyl)heptane (manufactured by ADEKA, Inc., trade name: N-1717) * 11 : Benzylmethyl A ketal (manufactured by Ciba Specialty Chemical Co., Ltd.: trade name: 1-651) (D) Component: a compound having an epoxy group in the molecule * 12 : a cresol novolac type epoxy resin (manufactured by DIC Corporation, product) Name: EPICLONN-670-EXP-S) *13: Dicyclopentadiene type epoxy resin (manufactured by DIC Corporation, trade name: EPICLON HP-7200L) * 14: Bisphenol A type epoxy resin (DIC Corporation) , Product name: EPICLON 1 055 ) * 15: Cresol novolac type epoxy resin (manufactured by DIC Corporation, trade name: EPICLON N-665 -EXP) Block isocyanate compound 氺16: Block isocyanate (Sumitomo Bayer Urethane shares Co., Ltd., manufactured by Sumitomo Bay Co. Name: Sumidule VPL225 3) (E) Component: Inorganic black pigment* 19: Titanium black dispersion (manufactured by Jamco Co., Ltd., trade name: BT-1 HCA) Other components* 20 : Pigment dispersant (manufactured by Kyoeisha Chemical Co., Ltd.) , trade name: Flowlen DOPA-1 7HF ) *21: methacrylic acid methoxypropyl trimethoxy decane (manufactured by Tor ay Dow Corning Co., Ltd., trade name: SZ-6030) Then, the obtained photosensitive resin is composed The solution of the solution was uniformly applied to a 16 μm thick polyethylene terephthalate film (manufactured by Teijin Dupont Film Co., Ltd., trade name: HTR-02), and dried by a hot air convection dryer of 9 (TC). Minutes to form a photosensitive resin composition layer. Thereafter, the photosensitive resin composition layer was protected by a polyethylene protective film (tensile strength in the longitudinal direction of the film: 16 MPa, tensile strength in the film width direction: 12 MPa, manufactured by Tamapoly Co., Ltd., trade name: MF-1 5 ). , to obtain a photosensitive element. The film thickness after drying of the photosensitive resin composition layer was 45 μm. In the ITO surface of the PET substrate (manufactured by Toyobo Co., Ltd., trade name: R-3 00), the photosensitive resin composition layer was brought into contact with the surface of the photosensitive element as shown in Table-38-201219979. The polyethylene protective film was peeled off and laminated by heating to a laminate roll of 1 1 〇 °c. The composition of the obtained laminate was a PET substrate with ITO, a photosensitive resin composition layer, and a polyethylene terephthalate film from below. Evaluation of sensitivity, adhesion, resolution, and sheet metal bending was performed for the obtained laminate. <Evaluation of Sensitivity> Using a parallel light exposure machine EXM-1201 (manufactured by Oak Manufacturing Co., Ltd.) with a high-pressure mercury lamp, a polyethylene terephthalate film having a 41-slice number of PhotoTool adhered to a laminate was used. On 'exposure. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C for 20 seconds to remove the unexposed portion of the photosensitive resin composition layer. The number of residual segments after the development of the number of 41 segments is 2 9.0 (exposure) to form a sensitivity ("1&gt;1/(:1112). The smaller the amount of energy, the higher the sensitivity. The results of the evaluation are shown in Table 2. Further, when exposed with the above energy, the actual number of remaining fragments is shown in Table 2. <Evaluation of Adhesion> Parallel light exposure machine EXM-120 1 with high pressure mercury lamp (Oak Manufacturing Co., Ltd.) The company has a line pattern with a line width/pitch width of 10/300 to 80/300 (unit: μηι, and a wide pitch) as a Photo Tool for the adhesion evaluation negative film, and has 41 segments. PhotoTools with the number of patches are attached to the polyethylene terephthalate film of the laminate, and the number of residual segments after the imaging of the number of segments of 41 segments becomes the energy of 29.0 -39-201219979 After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C for 20 seconds to remove the unexposed portion of the photosensitive resin composition layer to evaluate the adhesion. The adhesion is the smallest line width remaining without being peeled off by the developer liquid. (μηι ) indicates that the smaller the number, the smaller the thickness, and the lower the adhesion from the glass substrate, the higher the adhesion. The evaluation results are shown in Table 2. <Evaluation of resolution> With 41 segments The Photo Tool of the number of the chips and the photo-patterned PhotoTool in the laminate of the film with the line width/pitch width of 30/30 to 200/200 (unit: μιη) as the resolution evaluation negative film The ester film was adhered to each other, and a parallel light exposure machine EXM-1201 (manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp was used, and the number of residual fragments after the development of the number of segments of the 41st film was 29.0. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C for 20 seconds to remove the unexposed portion of the photosensitive resin composition layer to evaluate the resolution. It is shown by the minimum pitch width (μηι) in which the unexposure degree is well removed by the development processing, and the smaller the number, the better the resolution. The evaluation results are shown in Table 2. <Evaluation of Sheet Metal Bending 〉 Use high pressure mercury lamp The exposure light ΕΧΜ-1201 (manufactured by Oak Manufacturing Co., Ltd.) was exposed to an energy of 29.0 after the number of fragments having a resolution of 41 segments. After exposure, 'peeling pairs-40-201219979 The ethylene phthalate film was sprayed with a 1% by mass aqueous sodium carbonate solution at 30 ° C for 20 seconds to remove the unexposed portion of the photosensitive resin composition layer, and then dried in a box type heated to 120 ° C. The machine (manufactured by Mitsubishi Electric Corporation, model: NV50-CA, air environment) was allowed to stand for 1 hour. The obtained evaluation sheet metal is bent, and the cured product of the ITO-attached PET substrate photosensitive resin composition layer is not peeled off, and no damage is observed as A, and peeling can be seen from the PET substrate with IT Ο Or see the broken person as B. <Solubility of Electrode> On the IZO-TEG (Test Element Group) substrate and the IZO and ITO surfaces of the ITO-TEG (Test Element Group) substrate, the photosensitive resin composition layer was brought into contact with the IZO-TEG substrate and ITO, respectively. In the same manner as the surface of the TEG substrate, the photosensitive element is laminated by heating to a build-up roll of ho °c while peeling off the protective film made of polyethylene. The composition of the obtained laminate was a TEG substrate, a photosensitive resin composition layer, and a polyethylene terephthalate film from below. The PhotoTool having a number of 41-piece sheets was adhered to a polyethylene terephthalate film of a laminate, and a parallel light exposure machine EXM-1201 (manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp was used for image formation. The number of remaining fragments is 29.0, and the exposure is performed. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 t for 20 seconds to remove the unexposed portion of the photosensitive resin composition layer. Thereby, an evaluation substrate on which a photocured material of the photosensitive resin composition layer was formed on the TEG substrate was obtained. Then, the obtained evaluation substrate was allowed to stand in a box type dryer (Mitsubishi Electric Co., Ltd. -41 - 201219979, model: NV50-CA) heated to 120 °C for 1 hour. Thereafter, a DC voltage of 80 V was applied to the electrodes of the evaluation substrate under conditions of 60 ° C and 90% RH, and the impedance 値 of the anode after 100 hours was measured by a tester. The evaluation results are shown in Table 2. In the table, the a system can measure the impedance 値, and it is judged that the wire is not dissolved. The B line cannot be measured, and it is judged that the wire is broken due to dissolution. Further, it is described that A' is such that the impedance of the anode after 1 hour is divided by the initial impedance and is equal to 1 〇〇 as the impedance increase rate (%). It can be evaluated that the smaller the impedance rise rate, the more the electrode can be dissolved. <Extension of hardened material> On a polytetrafluoroethylene sheet (manufactured by Nitto Denko Co., Ltd., product name: Nittoflon Film No. 900U), the photosensitive resin composition layer is brought into contact with the surface of the polytetrafluoroethylene sheet, and the polymer is peeled off. The above-mentioned photosensitive element was laminated on the vinyl protective film by a laminate roll heated to 110 °C. The composition of the obtained laminate was in the order of a polytetrafluoroethylene sheet, a photosensitive resin composition layer, and a polyethylene terephthalate film. Exposure was carried out by using a parallel light exposure machine EXM-1201 (manufactured by Oak Industries, Ltd.) on the polyethylene terephthalate film of the above laminate. Further, the exposure of the laminate was such that the number of residual fragments after the development of the number of segments of the 41 segments was 2 9.0. After the exposure, the polyethylene terephthalate film was peeled off, and a 1% by mass aqueous sodium carbonate solution was sprayed at 30 ° C for 30 seconds to remove the unexposed portion of the photosensitive resin composition layer. Thereby, an evaluation piece in which a photocured material of the photosensitive resin composition layer was formed on a polytetrafluoroethylene sheet was obtained. Then, the obtained evaluation piece was left to stand in a box type dryer (manufactured by Rigaku Corporation, model: NV50-CA, air environment) heated to 1200 °C for 1 hour. The heat-treated evaluation piece was cut out to a width of 10 mm, and the distance between the chucks was 50 mm. At a constant speed of 2 cm/min, the hardened material stretched to the photosensitive resin composition layer was broken, and found at 25 °. The elongation (%) of the cured product of C. The evaluation results are shown in Table 2. [Table 2]

Item Example Comparative Example 1 2 3 4 1 2 3 4 5 Sensitivity exposure 168 298 282 259 137 152 152 130 158 Number of residual segments 28.5 28.9 28.9 29.0 29.1 28.1 28.9 28.5 29.1 Adhesion (Wm) 20 40 35 35 20 45 32 25 25 Resolution (//m) 70 70 70 70 70 70 70 60 70 Solvent presence or absence of JTO AAAABBBBB IZO AAAABBBBB Anode resistance rise rate (%) ITO 210 300 300 250 -. - - - - IZO 380 400 420 400 - - - - - Elongation (%) 44 42 43 45 68 60 57 60 21 Sheet metal bending test AAAAAAAAB From the results shown in Table 2, it is apparent that the presence of (D) component can suppress the dissolution of the electrode. Further, in relation to the elongation, an elongation of 40% or more was obtained, and it was confirmed that the breakage of the partition wall at the time of bending was suppressed. INDUSTRIAL APPLICABILITY As described above, according to the present invention, it is possible to provide a partition wall for an image display device which can suppress the dissolution of the electrode when a voltage is applied under high temperature and high humidity while suppressing breakage during bending. A photosensitive resin composition, a photosensitive element using the composition, a method of forming a partition of an image display device, a method of producing an image display device, and an image display device. -43-201219979 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an appropriate embodiment of a photosensitive element of the present invention. Fig. 2 is a schematic cross-sectional view showing an embodiment of a method of forming a partition wall of an image display apparatus using the photosensitive element of the present invention. [Explanation of main component symbols] 1 : Support 2 : Photosensitive resin composition layer 3 : Protective film 4 : Electrode 5 : Substrate 10 : Photosensitive element 20 : Hardened material of photosensitive resin composition (light cured product pattern) 3 0 : electrode substrate 40 : adhesive -44 -

Claims (1)

201219979 VII. Patent application: 1. A photosensitive resin composition which is a photosensitive resin composition for forming a partition wall of a separation pixel of a curved image display device having a transparent electrode at least on a display surface, The photosensitive resin composition is characterized in that (A) component: a binder polymer having a carboxyl group in a molecule, (B) a component: a photopolymerizable compound, (C) component: a photopolymerization initiator, and (D) component a compound having an epoxy group in a molecule, which is photocured by the photosensitive resin composition, and then heated at 120 ° C for 1 hour in air to have a sheet-like cured product having a width of 10 mm and a thickness of 45 μm at 25 ° C. The lower elongation is 40% or more. 2. The photosensitive resin composition of claim 1, which further comprises (E) a component: an inorganic black pigment. 3. The photosensitive resin composition of claim 2, wherein the component (E) contains titanium black. 4. A photosensitive element comprising a photosensitive resin composition layer comprising a support and a photosensitive resin composition according to any one of claims 1 to 3, which is formed on the support. . 5. A method of forming a partition wall of an image display device, comprising: a method of forming a partition wall of an image display device having at least a partition wall of a transparent electrode and a separation pixel disposed on a display surface; a laminating step of laminating a photosensitive resin composition layer of the photosensitive resin composition of any one of claims 1 to 3 on the substrate of the image display device; An exposure step of irradiating the predetermined portion of the photosensitive resin composition layer with the active light, and exposing the exposed portion to light; removing a portion other than the exposed portion of the photosensitive resin composition layer to form a photo-curing pattern . 6. A method of manufacturing an image display device comprising: a method of manufacturing an image display device having at least a partition wall of a transparent electrode and a separate pixel disposed on a display surface; and having a patentability The method of the fifth aspect forms the step of forming the partition wall described above. 7. The method of manufacturing an image display device according to claim 6, wherein the transparent electrode is made of a material formed by applying a solution containing at least one type of metal conductive fiber. 8. The method of manufacturing an image display device according to claim 6 or 7, further comprising the step of filling the display medium in the partition wall; bonding the substrate to the opposite side of the partition wall so that the substrate and the one side The step of facing the substrate. An image display device, which is characterized in that it is manufactured by the method of manufacturing an image display device according to any one of claims 6 to 8.