JP5761457B2 - Photosensitive resin composition, photosensitive element, method for forming partition wall of image display device, method for manufacturing image display device, and image display device - Google Patents

Description

  The present invention relates to a photosensitive resin composition, a photosensitive element, a method for forming partition walls of an image display device, a method for manufacturing an image display device, and an image display device.

  2. Description of the Related Art In recent years, an image display device (PLD: Paper Like Display) that is as thin as paper, can be freely carried, and can display characters and images has attracted attention. Such an image display device has visibility and portability, which are the advantages of paper as a normal printed matter, and is capable of electrically rewriting information, so that it can be used as a substitute for paper from the viewpoint of environment and cost. Practical application is being attempted.

  As a display technique of the image display device, various types such as a type in which particles are moved by electrophoresis, a liquid crystal type, and an electrochemical type have been devised. In particular, as a type for moving particles, methods such as a microcapsule electrophoresis method, a microcup electrophoresis method, an electronic powder fluid method, and a toner display method have been studied. In these systems, white and black particles as a display medium are sealed between transparent electrodes, an electric field is applied, and these particles are electrically moved to form and display a white / black image. In addition, there are active driving and passive driving as driving methods of the image display device, and a back technology (panel circuit) for the image display device has been studied.

  In the case of the particle movement type image display device, as described above, a partition for separating white / black particles (a partition for separating pixels) is required. As a method for forming such partition walls, a mold transfer method, a screen printing method, a sand blast method, a photolithography method, an additive method, and the like have been proposed (for example, see Patent Document 1). Among these, a photolithographic method that can form a high-definition pattern efficiently by irradiation with actinic rays using a photosensitive resin composition has attracted attention.

  The partition of the image display device using the photolithographic method is a step of forming a photosensitive resin composition layer by applying a photosensitive resin composition on a substrate or laminating a photosensitive film, and the photosensitive resin composition layer. These are formed through a step of irradiating an actinic ray to a predetermined portion of the material to photocure the exposed portion and a step of removing the unexposed portion to form a photocured product pattern. Therefore, in general, the photosensitive resin composition for forming the partition walls of the image display device is required to have sensitivity, resolution, and adhesion to the substrate.

  Recently, an attempt has been made to realize the flexibility of the image display device for the purpose of handling it as easily as paper (for example, see Non-Patent Document 2). Along with this, a flexible substrate such as a PET (polyethylene terephthalate) substrate in which ITO (indium tin oxide) is sputtered from a rigid substrate such as a glass substrate or an FPC (flexible printed circuit board) substrate is used. It has moved to.

  When realizing such flexibility, it is indispensable to make the partition that separates each pixel flexible. Therefore, a partition with a low elastic modulus is required.

  However, when the elasticity of the photosensitive element is reduced, the resolution and adhesion tend to decrease. On the other hand, in order to increase the contrast between the pixels of the image display device, it is necessary to improve the resolution and adhesion of the partition walls in order to increase the display area. It tends to be difficult to form an elastic partition. Thus, it was difficult to form a partition wall having excellent resolution and adhesion and low elasticity.

  Furthermore, when manufacturing an image display device, a step of filling a display medium such as particles in the photocured product pattern obtained in the above step, a step of heat-treating the photocured product pattern, a step of attaching an electrode substrate, etc. Including. Thereby, an image display device having a cured product of the photosensitive resin composition layer as a partition is obtained. In the step of attaching the electrode substrate, a voltage is applied under high temperature and high humidity. There was a problem that the electrode part in close contact with the cured product was dissolved.

  Conventionally, as a photosensitive resin composition for forming a partition wall of an image display device, for example, there are those disclosed in Patent Documents 2 to 4 below.

JP 2007-178881 A JP 2010-066666 A JP 2010-169934 A JP 2010-256775 A

  However, although the photosensitive resin composition for forming the partition walls of the image display device disclosed in Patent Documents 2 to 4 is excellent in low elasticity, resolution, and adhesion, it suppresses dissolution of the electrode portion. In terms, there was room for improvement. Furthermore, in the case of the above-mentioned particle movement type image display device, since the charged display medium is filled with white and black particles and an electric field is applied, the photosensitive resin composition used for forming the partition walls of these image display devices The object is required not to affect the surface potential of the display medium. However, the conventional photosensitive resin composition has a problem that when the particles move, the particles come into contact with the partition walls separating the pixels, and charges are accumulated in the partition walls, thereby affecting the chargeability of the particles themselves.

  The present invention has been made in view of the above problems, and can suppress charge accumulation and reduce the dissolution of the electrode substrate. The cured film has a low elastic modulus, high resolution, and high adhesion image display. It aims at providing the photosensitive resin composition which can form the partition for apparatuses, and the photosensitive element using the same. Another object of the present invention is to provide a method for forming a partition of an image display device, a method for manufacturing the image display device, and an image display device using the photosensitive resin composition or the photosensitive element.

  The present invention comprises (A) component: an aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule, (B) component: a photopolymerizable compound, (C) component: a photopolymerization initiator, (D A photosensitive resin composition used as a partition wall forming material, comprising: a component: a compound having an epoxy group in the molecule; and a component (E): a glycerin fatty acid ester.

  Since the photosensitive resin composition of the present invention has the above-described configuration, a partition wall that does not hinder the movement of particles can be easily formed with good workability. In addition, according to the photosensitive resin composition of the present invention, by having the above-described configuration, it is possible to suppress charge accumulation and reduce dissolution of the electrode substrate, and the cured film has a low elastic modulus and high resolution. A partition wall for an image display device with high adhesion can be formed.

  The photosensitive resin composition of this invention can make a sensitivity high by containing (F) component: sensitizer further. The sensitizer preferably contains a pyrazoline compound.

  Moreover, this invention provides a photosensitive element provided with a support body and the photosensitive resin composition layer formed on this support body using the said photosensitive resin composition. In the photosensitive element of this invention, it is preferable that the film thickness of the said photosensitive resin composition layer is 10-100 micrometers. When the film thickness of the photosensitive resin composition layer is within the above range, the photosensitive element can be easily used as a partition wall of an image display device.

  Moreover, in the photosensitive element of this invention, it is preferable that the tensile elasticity modulus of the cured film which photocured the said photosensitive resin composition layer is 1 GPa or less after heat processing for 1 hour at 120 degreeC.

  The present invention also includes a laminating process for forming a photosensitive resin composition layer on the substrate using the photosensitive resin composition, and irradiating a predetermined portion of the photosensitive resin composition layer with actinic rays to generate light. There is provided a method for forming a partition wall of an image display device, comprising: an exposure step for forming a cured portion; and a developing step for removing a portion other than the photocured portion to form a photocured product pattern.

  Moreover, it is preferable that the formation method of the partition of the image display apparatus of this invention further has the heating process which heat-processes the said photocured material pattern at 60-250 degreeC after the said image development process.

  The present invention also includes a step of filling a display medium into a partition formed by the above method, and a step of attaching a substrate to the opposite side of the partition so as to face one of the substrates. A manufacturing method is provided.

  Furthermore, this invention provides the image display apparatus manufactured by the said manufacturing method.

  According to the present invention, it is possible to suppress the accumulation of electric charges and to reduce the dissolution of the electrode substrate, the cured film has a low elastic modulus, a high resolution, and a high-adhesion partition wall for an image display device. A photosensitive resin composition that can be well formed and a photosensitive element using the same can be provided. Moreover, according to this invention, the formation method of the partition of an image display apparatus using the said photosensitive resin composition or photosensitive element, the manufacturing method of an image display apparatus, and an image display apparatus can be provided. In addition, although a partition may be called a spacer, it is synonymous in this specification.

It is a schematic cross section which shows suitable one Embodiment of the photosensitive element of this invention. It is a schematic cross section for demonstrating one Embodiment of the formation method of the partition of the image display apparatus using the photosensitive element of this invention. It is a schematic plan view which shows the example in which the partition of FIG.2 (c) was formed in the grid | lattice form. It is a schematic plan view which shows the example in which the partition of FIG.2 (c) was formed in hexagon shape. It is a schematic cross section which shows the state which the image display apparatus of FIG.2 (e) is bent with a curvature radius of about 5-15 mm.

  Hereinafter, preferred embodiments of the present invention will be described. In this specification, (meth) acrylic acid means acrylic acid and methacrylic acid, (meth) acrylate means acrylate and the corresponding methacrylate, and (meth) acryloyl means acryloyl and methacryloyl. .

  The photosensitive resin composition of the present invention comprises (A) an aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D ) A compound having an epoxy group in the molecule and (E) a glycerin fatty acid ester.

  Since the photosensitive resin composition of the present invention has the above-described configuration, it is possible to suppress charge accumulation and reduce dissolution of the electrode substrate, the cured film has a low elastic modulus, high resolution, and high adhesion. It is possible to form partition walls for image display devices having the property. Here, although the expression mechanism of the effect by having the said structure is not necessarily clear, this inventor has guessed as follows. That is, by adding an aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule, a compound having an epoxy group in the molecule, and a glycerin fatty acid ester, it is possible to suppress charge accumulation and dissolve the electrode substrate. It can be lowered, and the elastic modulus of the cured film can be lowered, so that high resolution and high adhesion can be obtained. In particular, it is considered that by adding glycerin fatty acid ester, the surface of the photosensitive resin composition is hydrophilized, and the accumulated charges can easily escape, so that accumulation of charges can be suppressed.

  Hereinafter, each component will be described in detail.

(A) Component: Aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group As the component (A) used in the present invention, it has a carboxyl group and an ethylenically unsaturated group in the molecule and imparts film properties. As long as it is possible, there is no particular limitation, and examples thereof include acrylic resins, epoxy resins, amide resins, amide epoxy resins, alkyd resins, and urethane resins. When the binder polymer is composed of an aliphatic polymerizable monomer, the partition wall can be prevented from being charged as compared with a binder polymer containing an aromatic polymerizable monomer such as styrene.

  These aliphatic binder polymers can be used alone or in combination of two or more. Examples of combinations of two or more types of binder polymers include two or more types of binder polymers composed of different copolymer components, two or more types of binder polymers having different weight average molecular weights, two or more types of binder polymers having different degrees of dispersion, and the like. Can be mentioned. A polymer having a multimode molecular weight distribution described in JP-A No. 11-327137 can also be used.

  Component (A) is, for example, a monomer having a functional group that reacts with a copolymer and an ethylenically unsaturated bond after radical polymerization of a polymerizable monomer having a carboxyl group and another polymerizable monomer. It can be produced by adding a monomer (hereinafter referred to as “monomer having a reactive functional group”).

  Examples of the polymerizable monomer include esters of vinyl alcohol such as acrylamide, acrylonitrile, vinyl-n-butyl ether, alkyl (meth) acrylate, dimethylaminoethyl ester (meth) acrylate, and (meth) acrylic acid. Diethylaminoethyl ester, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, (meth) acrylic acid, α-bromo (meth) acrylic acid, α -Chloro (meth) acrylic acid, maleic acid, maleic anhydride, maleic acid monomethyl ester, maleic acid monoethyl ester, maleic acid monoisopropyl ester and other maleic acid monoesters, fumaric acid, itaconic acid, crotonic acid, propiolic acid Is mentioned.

  The polymerizable monomer having a carboxyl group is preferably (meth) acrylic acid from the viewpoint of developability and stability, and the other polymerizable monomer does not contain a cyclic structure from the viewpoint of elastic modulus ( Preferred are (meth) acrylic acid alkyl esters, vinyl alcohol esters and maleic acid alkyl esters.

  Examples of the monomer having a reactive functional group include isocyanate group-containing (meth) acrylic acid ester and glycidyl group-containing (meth) acrylic acid ester.

  The component (A) comprises a copolymer having at least a (meth) acrylic acid ester containing (meth) acrylic acid and a hydroxyl group as a structural unit, and a (meth) acrylic acid ester containing an isocyanate group. It is preferable that the aliphatic binder polymer obtained by making it react is included.

  A copolymer having at least (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic acid ester as a structural unit is a radical of (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic acid ester. It can be produced by polymerization.

  The (meth) acrylic acid ester containing a hydroxyl group is not particularly limited as long as it reacts with a (meth) acrylic acid ester containing an isocyanate group described later. For example, hydroxymethyl (meth) acrylate , Hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, hydroxybutyl (meth) acrylate, hydroxypentyl (meth) acrylate, hydroxyhexyl (meth) acrylate, hydroxyheptyl (meth) acrylate, ( Examples thereof include hydroxyoctyl (meth) acrylate and structural isomers thereof. Among these, it is preferable that the structural unit of 2-hydroxyethyl (meth) acrylate is included.

  The above copolymer having at least (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic acid ester as a structural unit may contain other polymerizable monomers as long as it does not have a cyclic structure. Good. Examples of other polymerizable monomers include (meth) acrylic acid alkyl esters.

  Examples of the (meth) acrylic acid alkyl ester include, for example, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, (meth ) Hexyl acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, and structural isomers thereof. Especially, it is preferable to contain methyl (meth) acrylate and butyl (meth) acrylate in the point which is excellent in developability and the resolution.

  The (meth) acrylic acid ester containing an isocyanate group is not particularly limited as long as it reacts with a copolymer having at least (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic acid ester as a structural unit. For example, 2-isocyanate methyl methacrylate, 2-isocyanate ethyl methacrylate, 2-isocytanate ethyl acrylate, 2-isocyanate propyl methacrylate, 2-isocyanate octyl acrylate can be used. Among these, 2-isocyanate ethyl (meth) acrylate and 2-isocyanate methyl methacrylate are preferable.

  A copolymer having at least a (meth) acrylic acid ester containing (meth) acrylic acid and a hydroxyl group as a structural unit and a (meth) acrylic acid ester containing an isocyanate group are allowed to react under normal reaction conditions. Good.

  In the above reaction, a copolymer having (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic ester in the structural unit and having no cyclic structure, and an isocyanate group-containing (meth) acrylic acid The molar ratio of the ester (the former / the latter) may be reacted in the range of 1 / 0.3 to 1/2, but preferably the molar ratio is in the range of 1 / 0.4 to 1 / 1.8. More preferably, the molar ratio is in the range of 1 / 0.6 to 1 / 1.5, and still more preferably the molar ratio is in the range of 1 / 0.8 to 1 / 1.2. In particular, in order to achieve the effects of the present invention more fully, in a copolymer having (meth) acrylic acid and a hydroxyl group-containing (meth) acrylic acid ester as a structural unit and not having a cyclic structure. It is preferable that 100% of the hydroxyl group of the above and the isocyanate group in the (meth) acrylic acid ester containing an isocyanate group react.

  As the solvent in the above reaction, a known solvent can be used without particular limitation as long as the reaction is not affected. For example, methyl isobutyl ketone, ethylene glycol monomethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, Ethylene glycol monomethyl ether acetate and propylene glycol monomethyl ether acetate can be used. Among these, it is preferable to use propylene glycol monomethyl ether acetate.

  The weight average molecular weight of component (A) (measured by gel permeation chromatography (GPC) and converted by a calibration curve using standard polystyrene) is 20,000 or more in terms of excellent developer resistance. Preferably, it is 25,000 or more, more preferably 30,000 or more. From the viewpoint of shortening the development time, it is preferably 300,000 or less, more preferably 150,000 or less, and even more preferably 100,000 or less. The weight average molecular weight of the binder polymer is measured by gel permeation chromatography and converted using a standard polystyrene calibration curve. The measurement conditions of gel permeation chromatography (GPC) are as shown below.

[GPC measurement conditions]
Pump: Hitachi L-6000 type (manufactured by Hitachi, Ltd., trade name)
Column: Gelpack GL-R420 + Gelpack GL-R430 + Gelpack GL-R440 (3 in total) (above, manufactured by Hitachi Chemical Co., Ltd., trade name)
Sample injection amount: 200 μm
Sample concentration: 120 mg / 5 mL
Eluent: Tetrahydrofuran Measurement temperature: 25 ° C
Flow rate: 2.05 mL / min Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd., trade name)

  The content of the structural unit based on (meth) acrylic acid in the component (A) is preferably 5 to 35% by mass, more preferably 10 to 30% by mass based on the total mass of the molecule, and 15 to 15%. More preferably, it is 25 mass%. In terms of excellent resolution, the content is preferably 5% by mass or more, and preferably 35% by mass or less from the viewpoint of suppressing electrode dissolution.

  When (A) component has the structural unit based on the (meth) acrylic-acid alkylester, it is preferable that the content is 5-80 mass% on the basis of a molecular total mass, and is 10-70 mass%. It is more preferable, and it is still more preferable that it is 20-60 mass%. In terms of excellent resolution, the content is preferably 5% by mass or more, and preferably 80% by mass or less from the viewpoint of suppressing electrode dissolution.

  The content of the structural unit based on the (meth) acrylic acid ester containing a hydroxyl group in the component (A) is 5 to 30% by mass based on the total mass of the molecule from the viewpoint of reducing elasticity of the cured film. Preferably, it is 10-30 mass%, More preferably, it is 15-25 mass%.

  The content of the structural unit based on the (meth) acrylic acid ester containing an isocyanate group in the component (A) is 5 to 35 mass on the basis of the total mass of the molecule from the viewpoint of suppressing electrode dissolution and reducing the elasticity of the cured film. %, More preferably 11 to 35% by mass, and still more preferably 17 to 29% by mass.

  The content of the component (A) in the photosensitive resin composition is preferably 50 parts by mass or more in terms of excellent film formability with respect to 100 parts by mass of the total amount of the component (A) and the component (B), and 60 parts by mass. Part or more is more preferable, and 65 parts by mass or more is still more preferable. In terms of excellent mechanical strength of the photocured product, the content of the component (A) is preferably 90 parts by mass or less, and 80 parts by mass or less with respect to 100 parts by mass of the total amount of the components (A) and (B). Is more preferable, and 70 mass parts or less is still more preferable.

Component (B): Photopolymerizable compound The component (B) used in the present invention is not particularly limited as long as photocrosslinking is possible. For example, the component (B1): ethylenically unsaturated group and urethane in the molecule Compound having bond, (B2) component: compound obtained by reacting polyhydric alcohol and / or glycidyl group-containing compound with α, β-unsaturated carboxylic acid, (B3) component: ethylenically unsaturated bond in the molecule The compound which has one is mentioned.

Component (B1): Compound having an ethylenically unsaturated group and a urethane bond in the molecule It is preferable that component (B1) is included in that the elongation of the cured product can be improved and the adhesiveness to the flexible substrate is excellent. .

  Although there is no restriction | limiting in particular as (B1) component which can be used for this invention, It is preferable to contain the compound which has an isocyanuric ring structure. As a compound which has an isocyanuric ring structure, the compound represented by following General formula (1) is mentioned, for example.

［式（１）中、Ｒ^１は各々独立に、下記一般式（２）で表される基、下記一般式（３）で表される基、又は、下記一般式（４）で表される基を示し、Ｒ^１のうち少なくとも１つは下記一般式（４）で表される基である。］

[In the formula (1), each R ¹ is independently represented by a group represented by the following general formula (2), a group represented by the following general formula (3), or the following general formula (4). And at least one of R ¹ is a group represented by the following general formula (4). ]

［式（２）中、Ｒ^２は水素原子又はメチル基を示し、ｍは１〜１５の整数を示す。］

[In formula (2), ^{R 2} represents a hydrogen atom or a methyl group, m is an integer of 1 to 15. ]

［式（３）中、ｍは１〜１５の整数である。］

[In Formula (3), m is an integer of 1-15. ]

［式（４）中、Ｒ^２は水素原子又はメチル基を示し、ｎは１〜９の整数を示し、ｍは１〜１５の整数を示す。］

Wherein (4), ^{R 2} represents a hydrogen atom or a methyl group, n represents an integer of 1 to 9, m is an integer of 1 to 15. ]

From the viewpoint of elastic modulus and adhesion, at least two of R ^{1 in} the general formula (1) are more preferably groups represented by the general formula (4), and all of R ¹ are represented by the general formula. A group represented by (4) is more preferable.

  In general formulas (2), (3), and (4), m is preferably an integer of 1 to 6 in terms of excellent chemical resistance. Moreover, in general formula (4), it is preferable that m is an integer of 3-6 and n is an integer of 4-8 from the point which is excellent in mechanical strength.

Examples of commercially available compounds represented by the above general formula (1) include, for example, NK Oligo UA-21EB (manufactured by Shin-Nakamura Chemical Co., Ltd., trade name, general formula (1), wherein R ¹ is all common. A compound which is a group represented by the formula (4)).

  In addition, as the component (B1), a urethane compound having a urethane bond derived from a reaction between a hydroxyl group at a terminal of a polycarbonate compound and / or a polyester compound and an isocyanate group of a diisocyanate compound, and having an isocyanate group at a plurality of terminals And a compound that can be obtained by a condensation reaction of a compound having a hydroxyl group and an ethylenically unsaturated group.

  As these compounds, those synthesized by a conventional method may be used, or commercially available ones may be used. Examples of commercially available products include UF-8003M, UF-TCB-50, UF-TC4-55 (trade names, manufactured by Kyoeisha Chemical Co., Ltd.) and HT9082-95 (trade names, manufactured by Hitachi Chemical Co., Ltd.). Can be mentioned.

  Furthermore, as the component (B1) other than the above, for example, a (meth) acryl monomer having a hydroxyl group at the β-position, isophorone diisocyanate, 2,6-toluene diisocyanate, 2,4-toluene diisocyanate, and 1,6-hexa Addition reaction products with diisocyanate compounds such as methylene diisocyanate; EO-modified urethane di (meth) acrylate, EO, PO-modified urethane di (meth) acrylate. Examples of the EO-modified urethane di (meth) acrylate include Shin-Nakamura Chemical Co., Ltd., trade name: UA-11. Moreover, as EO and PO modified | denatured urethane di (meth) acrylate, the Shin-Nakamura Chemical Co., Ltd. make and brand name: UA-13 are mentioned, for example. Here, EO represents an oxyethylene group, and PO represents an oxypropylene group.

Component (B2): Compound obtained by reacting polyhydric alcohol and / or glycidyl group-containing compound with α, β-unsaturated carboxylic acid (B2) As component, for example, polyethylene glycol di (meth) acrylate (ethylene group) Polyalkylene glycol di (meth) acrylates such as polypropylene glycol di (meth) acrylate (having 2 to 14 propylene groups); trimethylolpropane di (meth) acrylate, tri Trimethylolpropane (meth) acrylate compounds such as methylolpropane tri (meth) acrylate, trimethylolpropane ethoxytri (meth) acrylate, trimethylolpropane propoxytri (meth) acrylate; tetramethylolmethane tri (meth) acrylate, Tetramethylolmethane (meth) acrylate compounds such as lamethylolmethane tetra (meth) acrylate; dipentaerythritol (meth) acrylate compounds such as dipentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate; bisphenol A di Bisphenol A dioxyethylene di (meth) acrylate such as oxyethylene di (meth) acrylate, bisphenol A trioxyethylene di (meth) acrylate, bisphenol A decaoxyethylene di (meth) acrylate; trimethylolpropane triglycidyl ether triacrylate And bisphenol A diglycidyl ether acrylate.

  Especially, it is preferable to contain polyalkylene glycol di (meth) acrylate as (B2) component in the point which is excellent in the resolution and adhesiveness, maintaining the low elasticity of a cured film, and the following general formula (5), (6 It is more preferable that the compound represented by (7) or (7) is included.

In said general formula (5), (6) or (7), R shows a hydrogen atom or a methyl group each independently, EO shows an oxyethylene group, PO shows an oxypropylene group. m ₁ , m ₂ , m ₃ and m ₄ represent the number of structural units composed of oxyethylene groups; n ₁ , n ₂ , n ₃ and n ₄ represent the number of structural units composed of oxypropylene groups; M ₁ + m ₂ , m ₃ and m ₄ each independently represents an integer of 1 to 30, and the total number of structural units of the oxypropylene group n ₁ , n ₂ + n ₃ and n ₄ are each independently Represents an integer of 1 to 30.

In the compound represented by the general formula (5), (6) or (7), the total number m ₁ + m ₂ , m ₃ and m ₄ of the structural unit of the oxyethylene group are each independently an integer of 1 to 30. Yes, it is preferably an integer of 1 to 10, more preferably an integer of 4 to 9, and still more preferably an integer of 5 to 8. In terms of excellent resolution and adhesion, the number of structural units is preferably 10 or less, more preferably 9 or less, and still more preferably 8 or less.

The total number of structural units n ₁ , n ₂ + n ₃ and n ₄ of the oxypropylene group is each independently an integer of 1 to 30, preferably an integer of 5 to 20, preferably an integer of 8 to 16. More preferably, it is more preferably an integer of 10-14. In terms of excellent resolution improvement and sludge reduction, the number of structural units is preferably 20 or less, more preferably 16 or less, and even more preferably 14 or less. The total number of structural units is preferably 5 or more, more preferably 8 or more, and even more preferably 10 or more in terms of reducing the elasticity of the partition walls.

As a compound represented by the general formula (5), R = methyl group, m ₁ + m ₂ = 6 (average value), n ₁ = 12 (average value) vinyl compound (manufactured by Hitachi Chemical Co., Ltd., Trade name: FA-023M). As the compound represented by the general formula (6), R = methyl group, m ₃ = 6 (average value), n ₂ + n ₃ = 12 (average value) vinyl compound (manufactured by Hitachi Chemical Co., Ltd., Product name: FA-024M). As the compound represented by the general formula (7), R = hydrogen atom, m ₄ = 1 (average value), n ₄ = 9 (average value) vinyl compound (manufactured by Shin-Nakamura Chemical Co., Ltd., product) Name: NK ester HEMA-9P).

Component (B3): Compound having one ethylenically unsaturated bond in the molecule (B3) Component is not particularly limited, but includes a compound represented by the following general formula (8) in terms of excellent resolution. It is preferable.

［式（８）中、Ｒ^３は水素原子又はメチル基を示し、Ｒ^４は水素原子、メチル基又はハロゲン化メチル基のいずれかを示し、Ｒ^５は炭素数１〜６のアルキル基、ハロゲン原子、水酸基のいずれかを示し、ｐは０〜４の整数を示す。なお、ｐが２以上の場合、複数存在するＲ^５は同一でも異なっていてもよい。−（Ｏ−Ａ）−はオキシエチレン基及び／又はオキシプロピレン基を示し、−（Ｏ−Ａ）−の構造単位の総数ａは１〜４の整数を示す。］

[In the formula (8), R ³ represents a hydrogen atom or a methyl group, R ⁴ represents a hydrogen atom, a methyl group or a halogenated methyl group, and R ⁵ represents an alkyl group having 1 to 6 carbon atoms, a halogen atom. It represents either an atom or a hydroxyl group, and p represents an integer of 0 to 4. When p is 2 or more, a plurality of R ⁵ may be the same or different. -(OA)-represents an oxyethylene group and / or an oxypropylene group, and the total number a of structural units of-(OA)-represents an integer of 1 to 4. ]

  Examples of the compound represented by the general formula (8) include γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, β-hydroxyethyl-β ′-(meth). Examples include acryloyloxyethyl-o-phthalate and β-hydroxypropyl-β ′-(meth) acryloyloxyethyl-o-phthalate, among which γ-chloro-β-hydroxypropyl-β ′-(meth) acryloyl. Oxyethyl-o-phthalate is preferred. γ-Chloro-β-hydroxypropyl-β'-methacryloyloxyethyl-o-phthalate is commercially available as FA-MECH (manufactured by Hitachi Chemical Co., Ltd., trade name).

  The said (B) component can be used individually or in combination of 2 or more types.

  Content of (B) component in the photosensitive resin composition is 10-50 mass with respect to 100 mass parts of total amounts of (A) component and (B) component from a viewpoint of resolution, adhesiveness, and film formability. It is preferable to set it as the range of a part, and it is more preferable to set it as 20-40 mass parts.

  Moreover, content of (B1) component is the range of 5-30 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component from a viewpoint of resolution, adhesiveness, and film-formability, and It is preferable to use 10 to 25 parts by mass. The content of the component (B2) is preferably in the range of 5 to 25 parts by mass, more preferably 5 to 15 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). preferable. The content of the component (B3) is preferably in the range of 1 to 10 parts by mass and more preferably 5 to 15 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). preferable.

Component (C): Photopolymerization initiator The component (C) used in the present invention is not particularly limited as long as it matches the light wavelength of the exposure machine to be used. Specifically, for example, benzophenone, N, N '-Tetramethyl-4,4'-diaminobenzophenone (Michler ketone), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino Aromatic ketones such as -1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholino-propanone-1, 2-ethylanthraquinone, 2-tert -Butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-Fe Luanthraquinone, 2,3-diphenylanthraquinone, 1-chloroanthraquinone, 2-methylanthraquinone, 1,4-naphthoquinone, 9,10-phenanthrenequinone, 2-methyl-1,4-naphthoquinone, 2,3-dimethylanthraquinone, etc. Quinones; benzoin ether compounds such as benzoin methyl ether, benzoin ethyl ether and benzoin phenyl ether; benzoin compounds such as benzoin, methyl benzoin and ethyl benzoin; 1- (4-methoxyphenyl) -2,2-dimethoxy-2- Phenylethane-1-one, 1- (4-methoxyphenyl) -2-methoxy-2-ethoxy-2-phenylethane-1-one, 1- (4-methoxyphenyl) -2-methoxy-2-propoxy- 2-Phenylethane-1- , Benzyl derivatives such as benzyl ketals such as 2,2-dimethoxy-1,2-diphenylethane-1-one (commonly known as benzyldimethyl ketal); 9-phenylacridine, 1,7-bis (9,9′-acridinyl) ) Acridine derivatives such as heptane; N-phenylglycine, N-phenylglycine derivatives; coumarin compounds; 2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4, 5-di (methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer, Examples include imidazole dimers such as 2- (p-methoxyphenyl) -4,5-diphenylimidazole dimer. That. In addition, the substituents of the aryl groups of two 2,4,5-triarylimidazoles in the 2,4,5-triarylimidazole dimer may give the same and symmetrical compounds, or differently asymmetric Such compounds may be provided. Moreover, you may combine a thioxanthone type compound and a tertiary amine compound like the combination of diethyl thioxanthone and dimethylaminobenzoic acid. These can be used alone or in combination of two or more.

  Among them, the component (C) preferably contains a benzyl derivative such as benzyl ketal in terms of excellent curability at the bottom of the resist after curing of the photosensitive resin composition, and the resist after curing of the photosensitive resin composition. In view of excellent curability at the top, it is preferable to include an acridine derivative, and from the viewpoint of excellent curability in the upper bottom, it is preferable to include both a benzyl derivative such as benzyl ketal and an acridine derivative. In particular, as the thickness of the layer made of the photosensitive resin composition increases, it is necessary to adjust the curability at the bottom of the resist and the curability at the top of the resist in a balanced manner.

  Furthermore, the component (C) preferably contains both an acridine derivative and a benzyl derivative, particularly in terms of improving the resolution and suppressing the bottoming of the resist after curing, and in particular 1,7-bis (9,9 It is preferred to include both '-acridinyl) heptane and 2,2-dimethoxy-1,2-diphenylethane-1-one.

  The content of the component (C) in the photosensitive resin composition is 0.1 parts by mass or more in terms of excellent photosensitivity with respect to 100 parts by mass of the total amount of the components (A) and (B). Preferably, it is 0.2 parts by mass or more. In addition, with respect to 100 parts by mass of the total amount of the component (A) and the component (B), it is preferably 20 parts by mass or less, and preferably 10 parts by mass or less in terms of excellent photocurability inside the photosensitive resin composition. It is more preferable that

  In particular, when 1,7-bis (9,9′-acridinyl) heptane is included as the component (C), the content thereof is 100 parts by mass with respect to the total amount of the components (A) and (B). In terms of excellent photosensitivity, it is preferably 0.05 to 1 part by mass, and more preferably 0.1 to 0.5 part by mass.

  In addition, when 2,2-dimethoxy-1,2-diphenylethane-1-one is included as the component (C), the content is 100 parts by mass of the total of the components (A) and (B). On the other hand, 1 mass part or more is preferable and 2 mass parts or more is more preferable in the point which is excellent in a photosensitivity and adhesiveness. Further, from the viewpoint of suppressing outgassing in the heat treatment step, it is preferably 10 parts by mass or less, and more preferably 5 parts by mass or less.

Component (D): Compound having an epoxy group in the molecule The component (D) used in the present invention is not particularly limited as long as it is a compound having an epoxy group (oxirane ring) in the molecule.

  Examples of the compound having an epoxy group in the molecule include bisphenol A type epoxy resins such as bisphenol A diglycidyl ether, bisphenol F type epoxy resins such as bisphenol F diglycidyl ether, and bisphenol S type epoxy such as bisphenol S diglycidyl ether. Resin, biphenol type epoxy resin such as biphenol diglycidyl ether, bixylenol type epoxy resin such as bixylenol diglycidyl ether, hydrogenated bisphenol A type epoxy resin such as hydrogenated bisphenol A glycidyl ether, dicyclopentadiene type epoxy resin, cresol Examples thereof include novolak type epoxy resins and dibasic acid-modified diglycidyl ether type epoxy resins.

  Commercial products can be used as these compounds. For example, as bisphenol A diglycidyl ether, jER828, jER1001 and jER1002 (all manufactured by Mitsubishi Chemical Corporation, trade name (“jER” is a registered trademark)), and Epicron 1055 (made by DIC Corporation, trade name (“ "Epiclon" is a registered trademark)).

  Examples of bisphenol F diglycidyl ether include jER807 (trade name, manufactured by Mitsubishi Chemical Corporation), and examples of bisphenol S diglycidyl ether include EBPS-200 (trade name, manufactured by Nippon Kayaku Co., Ltd.), Epicron. EXA-1514 (manufactured by DIC Corporation, trade name) and the like.

  Examples of the biphenol diglycidyl ether include YL-6121 (trade name, manufactured by Mitsubishi Chemical Corporation). Examples of the bixylenol diglycidyl ether include YX-4000 (trade name, manufactured by Mitsubishi Chemical Corporation). Etc.

  Further, examples of the hydrogenated bisphenol A glycidyl ether include ST-2004 and ST-2007 (both manufactured by Nippon Kayaku Epoxy Manufacturing Co., Ltd., trade names). Dicyclopentadiene-type epoxy resins include epiclone. HP-7200L (manufactured by DIC Corporation, trade name) and the like, and examples of the cresol novolac type epoxy resin include Epicron N-665-EXP and Epicron N-670-EXP-S (trade name, manufactured by DIC Corporation). And the like. In addition, examples of the dibasic acid-modified diglycidyl ether type epoxy resin include ST-5100 and ST-5080 (both manufactured by Nippon Kayaku Epoxy Manufacturing Co., Ltd.).

  Among these, dicyclopentadiene type epoxy resin and cresol novolak type epoxy resin are preferable, and cresol novolak type epoxy resin is more preferable in terms of suppressing dissolution of the electrode. Moreover, the said (D) component can be used individually or in combination of 2 or more types.

  The content of the component (D) in the photosensitive resin composition is 5 in terms of suppressing charge accumulation and suppressing electrode dissolution relative to 100 parts by mass of the total amount of the components (A) and (B). More than mass part is preferable and 10 mass parts or more is more preferable. Moreover, in the point which the photosensitive resin composition is excellent in film forming property, 30 mass parts or less are preferable, and 20 mass parts or less are more preferable.

(E) Component: Glycerin fatty acid ester Examples of the glycerin fatty acid ester of component (E) include glycerin monostearate, glycerin monopalmitate, glycerin monobehenate, glycerin monooleate, glycerin monocaprylate, glycerin monocaprate, glycerin. Monoglycerides such as monolaurate, glycerin distearate, glycerin dipalmitate, glycerin dibehenate, diglycerides such as glycerine diolate, diglycerin laurate, diglycerin monolaurate, diglycerin monomyristate, diglycerin Diglycerin fatty acid esters such as stearate, diglycerin monostearate, diglycerin monooleate, diglycerin oleate, diglycerin monooleate, polio Ethylene oxide adducts such as xylethylene alkyl ether, polyoxyethylene sorbitan trioleate, polyoxyethylene glycerin monostearate, sorbitan laurate, sorbitan palmitate, sorbitan stearate, sorbitan stearate, sorbitan tristearate, sorbitan oleate, Examples include sorbitan fatty acid esters such as sorbitan trioleate, sorbitan tribehenate, and sorbitan caprylate, and organic acid monoglycerides such as succinic acid fatty acid monoglyceride, citric acid fatty acid monoglyceride, and diacetyltartaric acid fatty acid monoglyceride, which affect the surface potential of the display medium. Diglycerin monooleate is preferred from the standpoint of preventing it (suppressing charge accumulation of the photosensitive resin composition).

(F) component: Sensitizer The photosensitive resin composition of this embodiment can contain at least 1 sort (s) of a sensitizer (sensitizing dye) as a (F) component. Examples of the sensitizer as the component (F) include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, and triazole compounds. , Stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds. These can be used alone or in combination of two or more.

  In particular, when the photosensitive resin composition layer is exposed using actinic rays having a wavelength of 340 to 430 nm, from the viewpoint of sensitivity and adhesion, the component (F) is a dialkylaminobenzophenone compound, a pyrazoline compound, an anthracene compound, It preferably contains at least one sensitizer selected from the group consisting of a coumarin compound, a triarylamine compound, a thioxanthone compound and an aminoacridine compound, and among them, a dialkylaminobenzophenone compound, a pyrazoline compound, an anthracene compound, and a triarylamine compound More preferably, it contains at least one selected from the group consisting of, and more preferably contains at least one pyrazoline compound.

  The content of the component (F) in the photosensitive resin composition is preferably 0.01 parts by mass to 10 parts by mass with respect to 100 parts by mass of the total amount of the components (A) and (B). It is more preferable to set it as 05 mass parts-5 mass parts, and it is still more preferable to set it as 0.1 mass parts-3 mass parts. When this content is 0.01 parts by mass or more, more excellent sensitivity and resolution tend to be easily obtained, and when it is 10 parts by mass or less, a sufficiently good resist shape tends to be easily obtained. is there.

  The pyrazoline compound can be used without particular limitation. Specifically, 1-phenyl-3- (4-isopropylstyryl) -5- (4-isopropylphenyl) -pyrazoline, 1-phenyl-3- (4-tert-butyl-styryl) -5- (4- tert-butylphenyl) -pyrazoline, 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (3,5-dimethoxystyryl) -5- ( 3,5-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (3,4-dimethoxystyryl) -5- (3,4-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2,6-dimethoxy) Styryl) -5- (2,6-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2,5-dimethoxystyryl) -5- (2,5-dimethoxyphenyl) Nyl) -pyrazoline, 1-phenyl-3- (2,3-dimethoxystyryl) -5- (2,3-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2,4-dimethoxystyryl) -5 (2,4-dimethoxyphenyl) -pyrazoline.

  Also, 1-phenyl-3,5-bis (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3,5-bis (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) ) -5- (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) -5- (4-tert-octylphenyl) -pyrazoline.

  Among these, 1-phenyl-3- (4-isopropylstyryl) -5- (4-isopropylphenyl) -pyrazoline, 1-phenyl-3- (4-tert-butyl-styryl) -5- (4-tert -Butylphenyl) -pyrazoline, 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) -pyrazoline, 1-phenyl-3,5-bis (4-tert-butylphenyl) -pyrazoline 1-phenyl-3,5-bis (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) -5- (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3- It is preferable to use one selected from (4-biphenyl) -5- (4-tert-octylphenyl) -pyrazoline. 3- (4-isopropylstyryl) -5- (4-isopropylphenyl) -pyrazoline, 1-phenyl-3- (4-tert-butyl-styryl) -5- (4-tert-butylphenyl) -pyrazoline, 1 -Phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) -5- (4-tert-butylphenyl) -pyrazoline, 1- It is more preferable to use one selected from phenyl-3- (4-biphenyl) -5- (4-tert-octylphenyl) -pyrazoline, and 1-phenyl-3- (4-isopropylstyryl) -5- ( 4-Isopropylphenyl) -pyrazoline, 1-phenyl-3- (4-tert-butyl-styryl) -5- (4-tert-butyl) Phenyl) - pyrazoline, 1-phenyl-3- (4-methoxyphenyl) -5- (4-methoxyphenyl) - it is more preferable to use one selected from pyrazoline.

<Other ingredients>
The photosensitive resin composition of the present embodiment has an excellent anticorrosive effect and a residual film of an unexposed portion without corroding copper and copper alloys such as metal wiring and metal layer, ITO, IZO (indium zinc oxide) and the like. It is preferable that the (G) component: the heterocyclic compound which does not contain a mercapto group is included at the point which has a prevention effect and a film | membrane adhesion | attachment effect.

  A heterocyclic compound refers to a cyclic compound in which a ring is composed of atoms of two or more elements (carbon, nitrogen, oxygen, sulfur, etc.). Examples of the heterocyclic compound include triazole ring, pyrrole ring, furan ring, thiophene ring, imidazole ring, oxazole ring, thiazole ring, pyrazole ring, isoxazole ring, isothiazole ring, tetrazole ring, pyridine ring, pyridazine ring, pyrimidine ring, Examples thereof include compounds having a heterocyclic ring such as a pyrazine ring, a piperidine ring, a piperazine ring, a morpholine ring, a 2H-pyran ring, a 6H-pyran ring and a triazine ring, and salts of these compounds.

  Among these, compounds having one or more of a triazole ring, a pyrrole ring, a pyrazole ring, a thiazole ring, an imidazole ring and a tetrazole ring containing a carbon atom and a nitrogen atom, and salts of these compounds are preferable.

  When the heterocyclic compound not containing the mercapto group as component (G) has a tetrazole ring, it is at least one selected from the group consisting of 1H-tetrazole, 5 substituted-1H-tetrazole, 1-substituted-1H-tetrazole and derivatives thereof. A seed is preferred.

  The heterocyclic compound as the component (G) is preferably a compound having a triazole ring. Among them, 1,2,3-triazole, 1,2,4-triazole and derivatives thereof, 1,2,3-benzotriazole, 5-substituted-1H-benzotriazole, 6-substituted-1H-benzotriazole, 5,6-substituted Preferably, it is selected from the group consisting of -1H-benzotriazole and its derivatives. The heterocyclic compound (G) is an amine salt of 4-methyl-1H benzotriazole, an amine salt of 5-methyl-1H benzotriazole (for example, ANTAGE TDP (phenothiazine, manufactured by Kawaguchi Chemical Industry Co., Ltd.) , Trade name ("ANTAGE" is a registered trademark)) and the like.

  The photosensitive resin composition containing the components as described above may further include a thermochromic inhibitor, a plasticizer such as p-toluenesulfonamide, a pigment, a filler, an antifoaming agent, a flame retardant, a stabilizer, if necessary. An adhesiveness imparting agent, a leveling agent, a peeling accelerator, an antioxidant, a fragrance, an imaging agent, a thermal crosslinking agent, etc. are each 0.01 to 20 parts per 100 parts by mass of the total amount of the component (A) and the component (B). Although it can contain about a mass part, it is preferable not to contain the component which has coloring property.

  In particular, the content of the coloring compound (dye) such as leuco crystal violet or malachite green may be 0.1 parts by mass or less with respect to 100 parts by mass of the total amount of the component (A) and the component (B). Preferably, it is 0.05 parts by mass or less, and more preferably 0.01 parts by mass or less.

  The photosensitive resin composition of the present invention containing the components as described above can be obtained, for example, by uniformly kneading and mixing the contained components with a roll mill, a bead mill or the like. If necessary, it can be dissolved in a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether or a mixed solvent thereof to obtain a solid content of 30 It can be used as a solution of about ˜60% by mass.

  A method for forming a photosensitive resin composition layer on a substrate for an image display device using the obtained photosensitive resin composition is not particularly limited, but the photosensitive resin composition is used as a liquid resist on the substrate. A method of applying and drying can be used. Moreover, a protective film can be coat | covered on the photosensitive resin composition layer as needed. Further, as will be described in detail later, it is preferable to use the photosensitive resin composition layer in the form of a photosensitive element.

  The thickness of the photosensitive resin composition layer to be applied varies depending on the use, but is preferably 10 to 100 μm after drying. Examples of the protective film in the case where the protective film is used after being coated as a liquid resist include polymer films such as polyethylene and polypropylene.

  The photosensitive element of this invention is equipped with a support body and the photosensitive resin composition layer formed on the support body using the said photosensitive resin composition.

  FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the photosensitive element of the present invention. As shown in FIG. 1, a photosensitive element 10 of the present invention comprises a support 1 and a photosensitive resin composition layer 2 (hereinafter referred to as “photosensitive layer 2”) formed on the support 1 using the above photosensitive resin composition. And a protective film 3 formed on the photosensitive resin composition layer 2. In addition, the protective film 3 is provided as needed.

  As the support, for example, a polyester film such as polyethylene terephthalate, or a polymer film such as polypropylene or polyethylene can be preferably used. The thickness of the polymer film is preferably about 1 to 100 μm, more preferably 5 to 50 μm, and still more preferably 10 to 30 μm.

  Although the formation method of the photosensitive resin composition layer on a support body is not specifically limited, It can implement preferably by apply | coating and drying the solution of the photosensitive resin composition. The thickness of the photosensitive resin composition layer to be applied varies depending on the application, but when used for the partition, it is preferably 10 to 100 μm in thickness after drying.

(Partition formation method)
Next, the method for forming the partition wall according to the present invention will be described by taking a method for manufacturing an image display device as an example. First, as shown in FIG. 2A, an electrode substrate 30 comprising an electrode 4 and a substrate 5 is prepared. As shown in FIG. 2B, the above-described photosensitive element 10 is formed on the electrode substrate 30. The photosensitive layer 2 and the support 1 are laminated (lamination step).

  The substrate 5 constituting the electrode substrate 30 is not particularly limited as long as it is a flexible substrate, and examples thereof include an insulating substrate such as a polymer film substrate and a semiconductor substrate such as a silicon substrate. Examples of the electrode substrate 30 include a substrate 5 on which a flexible electrode 4 such as ITO, IZO, and Ag wire ink is formed. Examples of the method of forming the electrode 4 include a method of patterning an electrode material laminated by a method such as vapor deposition and sputtering using a photolithography method, a method of patterning a photosensitive electrode material, and the like. There are no particular restrictions on the method of forming this electrode 4.

  As a method of laminating the photosensitive layer 2 on the electrode substrate 30, in addition to the method using the photosensitive element 10 described above, a method of applying a solution of the photosensitive resin composition onto the electrode substrate 30 and drying can also be used. .

  In the lamination method using the photosensitive element 10, when the protective film 3 exists on the photosensitive layer 2, the photosensitive element 10 is laminated on the electrode substrate 30 while removing the protective film 3. As the lamination conditions, for example, the photosensitive layer 2 is laminated by being pressure-bonded onto the electrode substrate 30 with a pressure of about 0.1 to 1 MPa (about 1 to 10 kgf / cm 2) while heating to about 70 to 130 ° C. The method etc. are mentioned, It is also possible to laminate | stack under reduced pressure. The surface of the electrode substrate 30 is usually formed with an electrode pattern, but may be flat or uneven as needed.

  After the lamination of the photosensitive layer 2, as shown in FIG. 2B, the photosensitive layer 2 is irradiated with an actinic ray 8 in an image form to photocur the exposed portion (exposure process). As a method of irradiating actinic rays 8 in an image form, as shown in FIG. 2 (b), a mask pattern 7 is placed on the photosensitive layer 2 to irradiate actinic rays 8 in an image form, and a photosensitive layer in an exposed portion. There is a method of photocuring 2. The mask pattern 7 may be a negative type or a positive type, and those generally used can be used. As the light source of the actinic ray 8, a known light source, for example, a light source that effectively emits ultraviolet light, visible light, or the like, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, or a xenon lamp is used. As an exposure method, a direct drawing exposure method in which a pattern is directly drawn with a laser without using the mask pattern 7 can also be used.

  After the exposure, as shown in FIG. 2C, the photocured material pattern 20 is formed on the substrate (electrode substrate 30) for the image display device by selectively removing the unexposed portion of the photosensitive layer 2 by development. It is formed (development process). 3 and 4 show an example of the pattern of the photocured product. FIG. 3 is a schematic plan view showing an example in which the partition walls (photocured material pattern 20) of FIG. 2C are formed in a lattice shape, and FIG. 4 is a partition wall (photocured material pattern) of FIG. 20) is a schematic plan view illustrating an example in which a hexagonal shape is formed. 3 and 4, the substrate 5 is disposed under the electrode 4 and the photocured material pattern 20 as shown in FIG. 2C. However, the electrode 4 may be an ITO electrode, and the substrate 5 is a PET substrate. But you can. In the development step, when the support 1 is present, the support 1 is removed prior to development.

  Development is performed by removing unexposed portions by wet development, dry development, or the like using a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent. In the present embodiment, it is preferable to use an alkaline aqueous solution. As alkaline aqueous solution, 0.1-5 mass% sodium carbonate solution, 0.1-5 mass% potassium carbonate solution, 0.1-5 mass% potassium hydroxide solution etc. are mentioned, for example. The pH of the alkaline aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive layer. Moreover, you may mix surfactant, an antifoamer, an organic solvent, etc. in alkaline aqueous solution. Examples of the current image method include a dip method, a spray method, brushing, and slapping. The spray method is preferable for improving the resolution.

  As the treatment after development, it is preferable that the formed photocured product pattern 20 is further cured by a heat treatment at about 60 to 250 ° C. as necessary. The curing temperature is preferably about 80 to 200 ° C, and more preferably about 100 to 150 ° C. The curing time is not particularly limited, but is preferably 10 minutes to 3 hours, and more preferably 30 minutes to 2 hours.

  Further, a step of filling a display medium such as particles in the photocured product pattern 20 formed in the above step, a step of attaching another electrode substrate 30 to the photocured product pattern 20 ((d) and ( Through e)) and the like, the formation of the partition walls of the image display device and the manufacture of the image display device 100 can be completed.

  As shown in FIG. 2D, a display medium 50 such as particles is filled in the photocured product pattern 20 formed in the above development step. Although it does not specifically limit as a display medium, An electronic powder body, pigment ink, a white fine particle, etc. are mentioned. When using electronic powder particles, white fine particles, or the like, the space in the photocured material pattern 20 other than those is filled with air, an olefin solvent, silicone oil, or the like. Also, depending on the application, a display medium may not be necessary.

  The step of attaching another electrode substrate 30 to the photocured material pattern 20 can be performed as follows. That is, in the above process, the adhesive 40 is laminated on the photocured material pattern 20 as shown in FIG. 2D, and the electrode substrate 30 and the photocured material are cured by the adhesive 40 as shown in FIG. This is done by adhering the object pattern 20. The electrode substrate 30 may be directly bonded to the photocured material pattern 20 without using the adhesive 40.

  A transparent electrode substrate is used for at least the display substrate of the image display device 100. A preferable embodiment of the image display device 100 includes an embodiment in which a transparent glass substrate is used as the substrate 5 and a transparent ITO electrode is used as the electrode 4.

  The image display device formed through the above-described steps includes an electrode substrate 30 having flexibility and a partition made of a photocured material pattern 20 having high elongation, and achieves excellent flexibility. Can do. In particular, depending on the selection of the material of the electrode 4, an image display device having a high degree of flexibility capable of dealing with a curvature radius of about 5 to 15 mm can be obtained. Moreover, the partition formed using the photosensitive resin composition of the present invention can sufficiently suppress the occurrence of breakage even when the image display device is bent with a curvature radius of about 5 to 15 mm (see FIG. 5). ).

  The method for producing an image display device of the present invention includes a step of filling a display medium such as particles in the partition obtained in the above step, a step of attaching a substrate to the opposite side of the partition so as to face one substrate, Have Examples of the substrate include an insulating substrate such as a glass substrate or a polymer substrate, a semiconductor substrate such as a silicon substrate, or a semiconductor substrate on which an electrode such as ITO or IZO is formed.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples without departing from the technical idea of the present invention.

(Examples 1-5 and Comparative Examples 1-8)
First, the following components were mixed to obtain a solution.
(B) Component: Photopolymerizable compound HT-9082-95 (obtained by reacting organic isocyanate and 2-hydroxyethyl acrylate, a polycarbonate compound having a hydroxyl group at the terminal, weight average molecular weight 4000, manufactured by Hitachi Chemical Co., Ltd. , Product name) 3.8g
UA-21EB (a compound in which R ¹ is a group represented by the general formula (4) in the above general formula (1), Shin-Nakamura Chemical Co., Ltd., trade name) 14.6 g
FA-023M (trade name, manufactured by Hitachi Chemical Co., Ltd.) 6.4g
FA-024M (trade name, manufactured by Hitachi Chemical Co., Ltd.) 3.8 g
FA-MECH (γ-chloro-β-hydroxypropyl-β′-methacryloyloxyethyl-o-phthalate, manufactured by Hitachi Chemical Co., Ltd., trade name) 6.4 g
Component (C): Photopolymerization initiator N-1717 (1,7-bis (9-acridinyl) heptane, manufactured by ADEKA Corporation, trade name) 0.3 g
IRGACURE 651 (2,2-dimethoxy-1,2-diphenylethane-1-one, manufactured by BASF Japan Ltd., trade name (“IRGACURE” is a registered trademark)) 3.0 g
Nonen KY-TB (α, α, α-tribromomethylphenyl sulfone, manufactured by Maruhishi Oil Chemical Co., Ltd., trade name (“Nonen” is a registered trademark)) 1.0 g
Component (D): Compound having an epoxy group in its molecule Epicron N-670-EXP-S (cresol novolac type epoxy resin, manufactured by DIC Corporation, trade name) 8.0 g
(E) component: Glycerin fatty acid ester Electro stripper ME-1 (diglycerol monooleate, manufactured by Kao Corporation, trade name (“Electro Stripper” is a registered trademark)) 1.0 g
(Other ingredients)
BT-1HCA (titanium black dispersion, manufactured by Mitsubishi Materials Electronics Chemical Co., Ltd., trade name) 0.45 g
Floren DOPA-17HF (dispersant, manufactured by Kyoeisha Chemical Co., Ltd., trade name) 0.145 g
SH-193 (leveling agent, manufactured by Toray Dow Corning Co., Ltd., trade name) 0.04 g
Toluene 3g
1g of methanol
10g of methyl ethyl ketone

  The component (A) shown in Table 1 and other components were dissolved in this solution to obtain a photosensitive resin composition solution. The unit of the amount of each component in Table 1 is g. Next, this photosensitive resin composition solution was uniformly applied onto a 16 μm thick polyethylene terephthalate film (trade name: FB-40, manufactured by Toray Industries, Inc.) using a Baker type applicator, and a hot air convection type at 90 ° C. The photosensitive resin composition layer was formed by drying for 10 minutes with a dryer. This photosensitive resin composition layer is protected with a polyethylene protective film (tensile strength in the film longitudinal direction: 16 MPa, tensile strength in the film width direction: 12 MPa, manufactured by Tamapoly Co., Ltd., trade name: NF-15). A photosensitive element was obtained. It was 45 micrometers when the film thickness after drying of the photosensitive resin composition layer was measured with the digital thickness gauge.

  On the ITO surface of R300 (PET substrate with ITO, product name, manufactured by Toyobo Co., Ltd.), the above-mentioned photosensitive element is peeled off from the polyethylene protective film so that the photosensitive resin composition layer is in contact with the ITO surface. Then, the film was laminated through a laminating roll heated to 110 ° C. The structure of the completed laminate is, from below, a PET substrate with ITO, a photosensitive resin composition layer, and a polyethylene terephthalate film. The obtained laminate was evaluated for sensitivity, adhesion, resolution, and display characteristics.

<Evaluation of sensitivity>
Using a parallel light exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp, a phototool having a 41-step tablet is brought into close contact with the polyethylene terephthalate film of the above laminate and exposed. It was. After the exposure, the polyethylene terephthalate film is peeled off and sprayed with a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Co., Ltd.) at 26 ° C. for 90 seconds. The unexposed part was removed. An energy amount (mJ / cm ² ) was applied so that the number of remaining step steps after development of the 41-step tablet was about 29.0. This amount of energy was taken as sensitivity. It shows that a sensitivity is so high that the numerical value of this energy amount is small. Table 1 shows the evaluation results. Table 1 also shows the actual number of remaining steps when exposure and development are performed with the above energy amount.

<Evaluation of resolution>
A phototool having a 41-step tablet and a phototool having a wiring pattern with a line width / space width of 30/30 to 200/200 (unit: μm) as a negative for resolution evaluation are formed on the polyethylene terephthalate film of the laminate. Using a parallel light exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp, the exposure is performed with an energy amount of 29.0 after the development of the 41-step tablet. Went. After the exposure, the polyethylene terephthalate film is peeled off and sprayed with a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Co., Ltd.) at 26 ° C. for 90 seconds. The unexposed part was removed and the resolution was evaluated. The resolution is represented by the smallest space width (μm) in which the unexposed portion is well removed by the development processing, and the smaller the numerical value, the better the resolution. Table 1 shows the evaluation results.

<Evaluation of adhesion>
Using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd., trade name: EXM-1201) having a high-pressure mercury lamp, the line width / space width is 10/300 to 80/300 (unit: μm, as a negative for adhesion evaluation) A phototool having a wiring pattern with a constant space width) and a phototool having a 41-step tablet are adhered to the polyethylene terephthalate film of the above laminate, and the number of remaining steps after development of the 41-step tablet is 29.0. The exposure was performed with an energy amount of After the exposure, the polyethylene terephthalate film is peeled off and sprayed with a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Co., Ltd.) at 26 ° C. for 90 seconds. The unexposed part was removed and the adhesion was evaluated. Adhesiveness is expressed by the width (μm) of the line that remains without being peeled off by the developer. The smaller this value, the higher the adhesiveness, because even thin lines are stuck without peeling from the ITO surface. Indicates. Table 1 shows the evaluation results.

<Evaluation of accumulated charge>
The photosensitive element was laminated on a SUS plate through a laminating roll heated to 110 ° C. while peeling off the polyethylene protective film so that the photosensitive resin composition layer was in contact with the SUS plate surface. The structure of the obtained laminate is the order of the SUS plate, the photosensitive resin composition layer, and the polyethylene terephthalate film from the bottom. The obtained laminate was exposed using a parallel light exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.). In the exposure of the laminated body, the energy amount was such that the number of remaining step stages after development of the 41-step tablet was 29.0. After the exposure, the polyethylene terephthalate film is peeled off, and then a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Industry Co., Ltd.) is sprayed at 26 ° C. for 90 seconds. Development was carried out. Subsequently, ultraviolet irradiation (ultraviolet irradiation degree: ² J / cm ² ) was performed using an ultraviolet irradiation device (Toshiba Electric Materials Co., Ltd., rated voltage 200 V, rated power consumption 7.2 kW). Finally, it left still for 60 minutes in the box-type dryer (Mitsubishi Electric Corporation make, model number: NV50-CA) heated to 120 degreeC. 8340A ULTRA HIGH using a brass electrode (main electrode: 37 mm, back electrode: 50 mm) with a surface cleaning degree measuring device (Nanocoat TS Co., Ltd., trade name: Corona Surf) on the photosensitive element after heat treatment A DC voltage of 100 V was applied for 1 minute by RESISTANCE METER (manufactured by ADC Co., Ltd., product name), the current value and time at the time of application were measured, and the charge accumulated for 20 seconds was obtained. Table 1 shows the evaluation results.

<Solubility of electrode>
Laminating roll heated at 110 ° C. while peeling the protective film made of polyethylene so that the photosensitive resin composition layer is in contact with the ITO surface on the ITO surface of an ITO-TEG (Test Element Group) substrate Laminated through. The structure of the finished laminate is an ITO-TEG substrate, a photosensitive resin composition layer, and a polyethylene terephthalate film from the bottom. Using a parallel light exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp, the obtained laminate is exposed with an energy amount such that the number of remaining steps after development is 29.0. went. After the exposure, the polyethylene terephthalate film is peeled off and sprayed with a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Co., Ltd.) at 26 ° C. for 90 seconds. The unexposed part was removed. Then, it left still for 1 hour in the box-type dryer (Mitsubishi Electric Corporation make, model number: NV50-CA) heated to 120 degreeC. Next, under the conditions of 60 ° C. and 90% RH (relative humidity), a direct current voltage of 80 V was applied, and the resistance value of the electrode (anode) after 200 hours was measured. The rate of increase was calculated. Table 1 shows the evaluation results.
Increase rate of resistance value (%) = [(Anode resistance value after 200 hours) × 100 / (initial value of anode resistance value)] − 100

<Evaluation of elastic modulus>
The photosensitive element is placed on a PTFE sheet (polytetrafluoroethylene, manufactured by Nitto Denko Corporation, trade name: NITOFLON (“NITOFLON” is a registered trademark)), and the photosensitive resin composition layer is in contact with the PTFE sheet surface. The film was laminated through a laminating roll heated to 110 ° C. while peeling off the polyethylene protective film. The structure of the obtained laminate is in the order of PTFE sheet, photosensitive resin composition layer, and polyethylene terephthalate film from the bottom. The obtained laminate was exposed using a parallel light exposure machine (trade name: EXM-1201, manufactured by Oak Manufacturing Co., Ltd.) having a high-pressure mercury lamp. In the exposure of the laminate, the energy amount was such that the number of remaining step steps after development of the 41-step tablet was 29.0. After the exposure, the polyethylene terephthalate film is peeled off and sprayed with a mixed solution of 0.3% by mass sodium carbonate aqueous solution and 0.2% by mass nonal 912A (trade name, manufactured by Toho Chemical Co., Ltd.) at 26 ° C. for 90 seconds. Developed. Subsequently, ultraviolet irradiation (ultraviolet irradiation degree: ² J / cm ² ) was performed using an ultraviolet irradiation device (Toshiba Electric Materials Co., Ltd., rated voltage 200 V, rated power consumption 7.2 kW). Finally, it left still for 60 minutes in the box-type dryer (Mitsubishi Electric Corporation make, model number: NV50-CA) heated to 120 degreeC. The photosensitive element after the heat treatment was cut into a width of 10 mm and a length of 70 mm, the distance between chucks was set to 50 mm, and a tensile tester (manufactured by Rheotech Co., Ltd., trade name: FUDOH rheometer) was used. A tensile test was carried out in accordance with JIS K 7127 at a constant speed of minutes to obtain a tensile elastic modulus. Table 1 shows the evaluation results.

The details of each component in Table 1 are as follows.
Resin A: A copolymer obtained by reacting 20 g of methacrylic acid, 30 g of methyl methacrylate, 30 g of butyl methacrylate, and 20 g of 2-hydroxyethyl methacrylate was reacted with 23.4 g of 2-isocyanatoethyl methacrylate. 151 g of propylene glycol monomethyl ether acetate solution (solid content 65 g) of the compound (weight average molecular weight 50,000) obtained by
Resin B: 20 g of methacrylic acid, 30 g of methyl methacrylate, 30 g of butyl methacrylate, and 20 g of 2-hydroxyethyl methacrylate were reacted with 19.3 g of 2-isocyanatoethyl methacrylate. 151 g of propylene glycol monomethyl ether acetate solution (solid content 65 g) of the compound (weight average molecular weight 50,000) obtained by
Resin C: 11.7 g of 2-isocyanatoethyl methacrylate was reacted with a copolymer obtained by reacting 20 g of methacrylic acid, 35 g of methyl methacrylate, 35 g of butyl methacrylate, and 10 g of 2-hydroxyethyl methacrylate. 151 g of propylene glycol monomethyl ether acetate solution (solid content 65 g) of the compound (weight average molecular weight 50,000) obtained by
Resin D: 48% by mass ethylene glycol monomethyl ether / toluene (mass ratio 6/4) solution of methacrylic acid / methyl methacrylate / butyl methacrylate copolymer (mass ratio 20/45/35, weight average molecular weight 50,000) 135g (solid content 65g)
Resin E: 48% by mass ethylene glycol monomethyl ether / toluene (mass ratio 6/4) solution of methacrylic acid / methyl methacrylate / butyl methacrylate copolymer (mass ratio 25/40/35, weight average molecular weight 50,000) 135g (solid content 65g)
Resin F: 48% by mass ethylene glycol monomethyl ether / toluene (mass ratio 6/4) solution of methacrylic acid / methyl methacrylate / butyl methacrylate copolymer (mass ratio 30/35/35, weight average molecular weight 50,000) 135g (solid content 65g)
Resin G: A copolymer obtained by reacting 12 g of methacrylic acid, 11.1 g of N-cyclohexylmaleimide, 27.2 g of dicyclopentanyl methacrylate, and 31.1 g of 2-hydroxyethyl methacrylate, -168.6 g (solid content 59 g) of a 35 mass% propylene glycol monomethyl ether acetate / methyl lactate (mass ratio 88/12) solution of a compound (weight average molecular weight 25,000) obtained by reacting 18.6 g of isocyanate ethyl methacrylate )
Resin H: 48% by mass ethylene glycol monomethyl ether / toluene (mass ratio 6/4) solution of methacrylic acid / methyl methacrylate / butyl acrylate copolymer (mass ratio 12/68/20, weight average molecular weight 65,000) 12.5g (solid content 6g)
Resin I: 48% by mass of ethylene glycol monomethyl ether / methacrylic acid / methyl methacrylate / butyl acrylate / 2-hydroxyethyl methacrylate copolymer (mass ratio 20/30/30/20, weight average molecular weight 50,000) / 135 g of toluene (mass ratio 6/4) solution (solid content 65 g)
Resin J: 48% by mass of ethylene glycol monomethyl ether / methacrylic acid / methyl methacrylate / butyl acrylate / methacrylic acid 2-hydroxyethyl copolymer (mass ratio 20/35/35/10, weight average molecular weight 50,000) 135 g of toluene (mass ratio 6/4) solution (solid content 65 g)
EAB (4,4′-bis (diethylamino) benzophenone, manufactured by Hodogaya Chemical Co., Ltd., trade name) 0.05 g
PZ-501D (1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) pyrazoline, manufactured by Nippon Chemical Industry Co., Ltd., trade name) 0.05 g
ME-1: Diglycerin oleate (trade name: Electro Stripper ME-1 manufactured by Kao Corporation) 1.0 g
ANTAGE TDP: Phenothiazine (Kawaguchi Chemical Co., Ltd., trade name) 1.0 g
DIC-TBC 5P: p-tert-butylcatechol (manufactured by DIC Corporation, trade name (“DIC-TBC” is a registered trademark)) 1.0 g

  As is apparent from Table 1, the photosensitivity of Examples 1 to 5 including (A) an aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group and (E) a glycerin fatty acid ester (ME-1). The conductive element was able to suppress charge accumulation and prevent dissolution of the electrode substrate. On the other hand, in Comparative Example 1, although dissolution of the electrode was suppressed, charge accumulation was too large, and in Comparative Examples 2 to 8, dissolution of the electrode was large and disconnection occurred.

  As described above, according to the present invention, it is possible to suppress the accumulation of electric charges and reduce the dissolution of the electrode substrate, and the cured film has a low elastic modulus, a high resolution, and a high partition wall for an image display device. Can be formed easily and with good workability, and a photosensitive element using the same can be provided. Moreover, according to this invention, the formation method of the partition of an image display apparatus using the said photosensitive resin composition or photosensitive element, the manufacturing method of an image display apparatus, and an image display apparatus can be provided.

  DESCRIPTION OF SYMBOLS 1 ... Support body, 2 ... Photosensitive layer, 3 ... Protective film, 4 ... Electrode, 5 ... Substrate, 10 ... Photosensitive element, 20 ... Hardened | cured material (photocured material pattern) of photosensitive resin composition, 30 ... Electrode board | substrate 40 ... Adhesive, 50 ... Display medium.

Claims (10)

(A) component: an aliphatic binder polymer having a carboxyl group and an ethylenically unsaturated group in the molecule;
(B) component: a photopolymerizable compound,
Component (C): photopolymerization initiator,
(D) component: The photosensitive resin composition used as a partition formation material containing the compound which has an epoxy group in a molecule | numerator, and (E) component: glycerol fatty acid ester.   Furthermore, (F) component: The photosensitive resin composition of Claim 1 containing a sensitizer.   The photosensitive resin composition of Claim 2 in which the said (F) component contains a pyrazoline compound.   A photosensitive element provided with a support body and the photosensitive resin composition layer formed using the photosensitive resin composition as described in any one of Claims 1-3 on this support body.   The photosensitive element of Claim 4 whose tensile elasticity modulus of the cured film which photocured the said photosensitive resin composition layer is 1 GPa or less after heat processing for 1 hour at 120 degreeC.   The photosensitive element of Claim 4 or 5 whose film thickness of the photosensitive resin composition layer is 10-100 micrometers. A lamination step of forming a photosensitive resin composition layer on the substrate of the image display device using the photosensitive resin composition according to any one of claims 1 to 3,
An exposure step of irradiating a predetermined portion of the photosensitive resin composition layer with an actinic ray to form a photocured portion;
A development step of forming a photocured product pattern by removing portions other than the photocured portion;
A method for forming a partition wall of an image display device.   The method for forming partition walls of an image display device according to claim 7, further comprising a heating step of heat-curing the photocured product pattern at 60 to 250 ° C. after the developing step. Filling the display medium into the partition formed by the method according to claim 7 or 8, and
A step of attaching the substrate to the opposite side of the partition so as to face one of the substrates;
A method for manufacturing an image display device.   An image display device manufactured by the manufacturing method according to claim 9.

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