JP6019791B2 - Partition wall forming material, photosensitive element using the same, partition wall forming method, and image display device manufacturing method - Google Patents

Description

  The present invention relates to a partition forming material, a photosensitive element using the same, a method for forming a partition for an image display device, and a method for manufacturing an image display device.

  2. Description of the Related Art In recent years, an image display device (PLD: Paper Like Display) that is as thin as paper, can be freely carried, and can display characters and images has attracted attention. Such an image display device has visibility and portability, which are the advantages of paper as a normal printed matter, and is capable of electrically rewriting information, so that it can be used as an alternative to paper in terms of environment and cost. Practical application is being attempted.

  As a display technique of an image display device, various types such as a type in which particles are moved by electrophoresis, a liquid crystal type, and an electrochemical type have been devised.

  In particular, as a type for moving particles, methods such as a microcapsule electrophoresis method, a microcup electrophoresis method, an electronic powder fluid method, and a toner display have been studied. In these systems, white and black particles as a display medium are sealed between transparent electrodes, an electric field is applied, and these particles are electrically moved to form and display a white / black image. In addition, there are active driving and passive driving as driving methods of the image display device, and a back technology (panel circuit) for the image display device has been studied.

  In the case of the particle movement type image display device, a partition for enclosing white / black particles as described above is required. As a method for forming such partition walls, a mold transfer method, a screen printing method, a sand blast method, a photolithography method, an additive method, and the like have been proposed. Among these, a photolithographic method that can form a high-definition pattern efficiently by irradiation with actinic rays using a photosensitive resin composition has attracted attention.

  Recently, there is a report example of realizing full color display by combining a color filter with white / black image display.

  When performing such full-color display, since a color filter is used in combination with a white / black display image display device, it is essential to improve the contrast between the pixels, and it is necessary to improve the aperture ratio. Accordingly, a high-definition material that can form fine wires is required for the partition wall material. Further, as a method for improving the contrast, it is also possible to increase the height of the partition walls and to fill the display medium with many particles.

  Incidentally, for example, the following Patent Documents 1 to 4 disclose partition wall forming materials.

JP 2010-066666 A JP 2010-169934 A JP 2010-256775 A JP2012-018410A

  However, in the partition forming material described in Patent Documents 1 to 4 described above, a thin line can be formed due to insufficient adhesion to a smooth substrate such as glass in a development process in which an unexposed portion is removed to form a photocured product pattern. Therefore, there is a problem that a photocured product pattern having a high aspect ratio cannot be obtained.

  The present invention has been made in view of the above problems, and has a partition forming material capable of forming a high-aspect-ratio photocured material pattern with excellent adhesion even on a smooth substrate such as glass, and a photosensitive element using the same. provide.

  The present invention also provides a partition wall forming material capable of forming the partition wall easily and with good workability, a photosensitive element using the material, a method of forming the partition wall of the image display device, and a method of manufacturing the image display device.

  The present invention comprises (A) component: binder polymer, (B) component: photopolymerizable compound having an ethylenically unsaturated bond, (C) component: photopolymerization initiator, (D) component: thiol compound, and ( E) Component: A partition wall forming material containing a silane coupling agent is provided.

  Since the partition wall forming material of the present invention has the above-described configuration, it is possible to form fine lines even on a smooth substrate such as glass, and the partition wall for an image display device having excellent adhesion and high aspect ratio can be easily and easily operated. Can be well formed.

  In the partition wall forming material of the present invention, the (C) photopolymerization initiator preferably contains a 2,4,5-triarylimidazole dimer. Thereby, the effect of the present invention can be further improved.

  Moreover, this invention provides the photosensitive element provided with a support body and the coating film which consists of the said partition formation material formed on this support body.

  By providing the photosensitive element of the present invention with a coating film made of the partition wall forming material of the present invention, it is possible to easily form a partition for an image display device with good workability without impairing the appearance of the coating film.

  Moreover, the photosensitive element of this invention WHEREIN: It is preferable that the film thickness of the said coating film containing the said partition formation material is 10-100 micrometers. Thereby, the partition for image display apparatuses can be formed more simply and with sufficient workability without impairing the appearance of the coating film.

  The present invention also includes a lamination step of laminating a coating film containing the partition wall forming material of the present invention on a substrate, and an exposure step of irradiating a predetermined portion of the coating film with an actinic ray to photocure an exposed portion. And a developing step of forming a photocured product pattern by removing portions other than the exposed portion of the coating film.

  The partition wall forming method of the present invention uses the partition wall forming material of the present invention, so that fine lines can be formed even on a smooth substrate such as glass, and has excellent adhesion and a high aspect ratio. Can be easily formed with good workability.

  Moreover, it is preferable that the formation method of the partition of this invention further has the heating process which heat-processes and heat-hardens the said photocured material pattern formed at the said image development process at 60-250 degreeC.

  Further, the present invention includes a step of filling the display medium in the partition formed by the method for forming a partition according to the present invention, a step of attaching a substrate to the opposite side of the partition so as to face one substrate, A method for manufacturing an image display device is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the partition formation material which can form the photocured material pattern which is excellent in adhesiveness also on smooth substrates, such as glass, and has a high aspect ratio, and the photosensitive element using this can be provided.

  In addition, according to the present invention, there are provided a partition wall forming material capable of easily forming a partition wall with good workability, a photosensitive element using the same, a method of forming a partition wall of an image display device, and a method of manufacturing an image display device. be able to.

It is a schematic cross section which shows suitable one Embodiment of the photosensitive element of this invention. It is a schematic cross section for demonstrating one Embodiment of the formation method of the partition of the image display apparatus using the photosensitive element of this invention. 2 is a SEM photograph of a photocured product pattern formed using the photosensitive element of Example 1.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings as the case may be. In the drawings, the same or corresponding parts are denoted by the same reference numerals, and redundant description is omitted. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. In the present specification, (meth) acrylic acid means acrylic acid or methacrylic acid, (meth) acrylate means acrylate or a corresponding methacrylate, and (meth) acryloyl means acryloyl or methacryloyl. .

(Partition material)
The partition wall forming material of the present invention includes (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond, (C) a photopolymerization initiator, (D) a thiol compound, and (E) a silane cup. It contains a ring agent. The partition wall forming material is a photosensitive resin composition that is cured by light.

  The manifestation mechanism of the effect by having the said structure is not necessarily clear, but this inventor estimates as follows. That is, the thiol compound containing a mercapto group donates hydrogen to the photopolymerization initiator, thereby maintaining the sensitivity within the usable range, and by the coupling action of the silane coupling agent and the inorganic base material to the base material. It is presumed that the adhesion of was improved. A base material having a smooth surface such as glass or PET does not exhibit an anchor effect that can be expected to provide physical adhesion between the partition wall forming material and the substrate. The forming material can achieve high adhesion even to a substrate having such a smooth surface.

  Hereinafter, each component will be described in detail.

(A) Component: Binder Polymer The partition wall forming material contains at least one binder polymer as the component (A). The binder polymer is obtained, for example, by radical polymerization of a polymerizable monomer (monomer).

  As the polymerizable monomer (monomer), (meth) acrylic acid; (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, (meth) acrylic acid benzyl, (meth) acrylic acid benzyl derivative, ( (Meth) acrylic acid furfuryl, (meth) acrylic acid tetrahydrofurfuryl, (meth) acrylic acid isobornyl, (meth) acrylic acid adamantyl, (meth) acrylic acid dicyclopentanyl, (meth) acrylic acid dimethylaminoethyl, (meta) ) Diethylaminoethyl acrylate, glycidyl (meth) acrylate, 2,2,2-trifluoroethyl (meth) acrylate, 2,2,3,3-tetrafluoropropyl (meth) acrylate, α-bromoacrylic acid, α -Chloracrylic acid, (meth) acrylic acid dicyclopenteni Ruoxyethyl, dicyclopentanyloxyethyl (meth) acrylate, isobornyloxyethyl (meth) acrylate, cyclohexyloxyethyl (meth) acrylate, adamantyloxyethyl (meth) acrylate, dicyclo (meth) acrylate Pentenyloxypropyloxyethyl, dicyclopentanyloxypropyloxyethyl (meth) acrylate, dicyclopentenyloxypropyloxyethyl (meth) acrylate, adamantyloxypropyloxyethyl (meth) acrylate, β-furyl (meth) (Meth) acrylic acid esters such as acrylic acid and β-styryl (meth) acrylic acid; styrene; polymerizable styrene derivatives substituted at the α-position or aromatic ring such as vinyltoluene and α-methylstyrene; Acrylamide such as rilamide; acrylonitrile; ether compound of vinyl alcohol such as vinyl-n-butyl ether; maleic acid; maleic anhydride; maleic acid monoester such as monomethyl maleate, monoethyl maleate, monoisopropyl maleate; fumaric acid, Examples thereof include cinnamic acid, α-cyanocinnamic acid, itaconic acid, crotonic acid, propiolic acid and other unsaturated carboxylic acid derivatives. These may be used alone or in any combination of two or more.

  Component (A) is at least one polymer selected from the group consisting of benzyl (meth) acrylate, benzyl (meth) acrylate, styrene, and styrene derivatives from the viewpoint of developability, sensitivity, and adhesion to glass. It is preferable to have a structural unit derived from a polymerizable monomer. Moreover, it is more preferable that both at least one selected from the group consisting of benzyl (meth) acrylate and a benzyl derivative (meth) acrylate and at least one selected from the group consisting of styrene and a styrene derivative are included. That is, the component (A) is preferably obtained by radical polymerization of two or more polymerizable monomers including these polymerizable monomers, and is derived from these polymerizable monomers. It is preferable that it has a structural unit.

  In the case where the component (A) has a structural unit derived from benzyl (meth) acrylate or a derivative thereof, the content is all of the polymerizable monomers constituting the component (A) in terms of excellent adhesion. It is preferably 3% by mass to 85% by mass, more preferably 5% by mass to 75% by mass, more preferably 10% by mass to 70% by mass, based on mass (100% by mass, the same applies hereinafter). More preferably, it is 10 mass%-50 mass% especially preferable. In terms of excellent resolution, the content is preferably 3% by mass or more, more preferably 5% by mass or more, and still more preferably 10% by mass or more. In terms of excellent peelability and adhesion, the content is preferably 85% by mass or less, more preferably 75% by mass or less, still more preferably 70% by mass or less, and 50% by mass. % Or less is particularly preferable.

  When the component (A) has a structural unit derived from styrene or a derivative thereof, the content is 10 on the basis of the total mass of the polymerizable monomer constituting the component (A) in terms of excellent adhesion. It is preferable that it is mass%-70 mass%, It is more preferable that it is 15 mass%-60 mass%, It is still more preferable that it is 20 mass%-55 mass%. In terms of excellent adhesion, the content is preferably 10% by mass or more, more preferably 15% by mass or more, and further preferably 20% by mass or more. In view of excellent peelability, the content is preferably 70% by mass or less, more preferably 60% by mass or less, and further preferably 55% by mass or less.

  Moreover, it is preferable that (A) component has a structural unit derived from (meth) acrylic-acid alkylester from a viewpoint of improving alkali developability and peelability.

  The (meth) acrylic acid alkyl ester is preferably a (meth) acrylic acid alkyl ester having an alkyl group having 1 to 12 carbon atoms. Examples of (meth) acrylic acid alkyl esters include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, and (meth) acrylic. Hexyl acid, heptyl (meth) acrylate, octyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, undecyl (meth) acrylate, (meth) An example is dodecyl acrylate. These may be used alone or in any combination of two or more.

  When the component (A) has a structural unit derived from a (meth) acrylic acid alkyl ester, the content is high in peelability, resolution and adhesion, and the polymerizable monomer constituting the component (A). It is preferably 1% by mass to 30% by mass, more preferably 2% by mass to 20% by mass, and still more preferably 3% by mass to 10% by mass based on the total mass of the body. In terms of excellent peelability, the content is preferably 1% by mass or more, more preferably 2% by mass or more, and further preferably 3% by mass or more. In view of excellent resolution and adhesion, the content is preferably 30% by mass or less, more preferably 20% by mass or less, and further preferably 10% by mass or less.

  (A) The acid value of the binder polymer is preferably 30 mgKOH / g or more from the viewpoint of resolution, preferably 250 mgKOH / g or less from the viewpoint of developer resistance and adhesion, and 40 to 230 mgKOH / g. g is more preferable, 50 to 210 mgKOH / g is further preferable, and 60 to 190 mgKOH / g is particularly preferable. When performing development with a solvent as the development step, it is preferable to prepare while suppressing the amount of polymerizable monomer having a carboxyl group.

  (A) The weight average molecular weight of the binder polymer (measured by gel permeation chromatography (GPC) and converted by a calibration curve using standard polystyrene) is preferably 5,000 or more from the viewpoint of developer resistance. From the viewpoint of shortening the development time, it is preferably 300,000 or less, more preferably 10,000 to 100,000, and particularly preferably 20,000 to 60,000.

  (A) As a compounding quantity of a binder polymer, it is preferable that it is 30-70 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, and it is more preferable that it is 35-65 mass parts. 40 to 60 parts by mass is particularly preferable. If the blending amount is 30 parts by mass or more, a good partition shape tends to be easily obtained, and if it is 70 parts by mass or less, good sensitivity, resolution, and adhesion tend to be easily obtained.

Component (B): Photopolymerizable Compound Having Ethylenically Unsaturated Bond As the photopolymerizable compound of component (B) in the present invention, a compound having one ethylenically unsaturated bond in the molecule, ethylenic in the molecule Examples thereof include compounds having two or more unsaturated bonds.

  The component (B) preferably contains at least one compound having two or more ethylenically unsaturated bonds in the molecule. When the component (B) includes a compound having two or more ethylenically unsaturated bonds in the molecule, the content is 5 parts by mass to 100 parts by mass of the total amount of the component (A) and the component (B). The amount is preferably 60 parts by mass, more preferably 5 parts by mass to 55 parts by mass, and still more preferably 10 parts by mass to 50 parts by mass.

  Examples of the compound having two or more ethylenically unsaturated bonds in the molecule include a bisphenol A di (meth) acrylate compound (2,2-bis (4-((meth) acryloxypolyalkoxy) phenyl) propane). Hydrogenated bisphenol A-based di (meth) acrylate compound (2,2-bis (4-((meth) acryloxypolyalkoxy) cyclohexyl) propane), di (meth) acrylate compound having a urethane bond in the molecule, molecule Examples thereof include polyalkylene glycol di (meth) acrylate and trimethylolpropane di (meth) acrylate having both (poly) oxyethylene groups and (poly) oxypropylene groups.

  Examples of the compound having three or more ethylenically unsaturated bonds in the molecule include trimethylolpropane tri (meth) acrylate, EO-modified trimethylolpropane tri (meth) acrylate (the number of oxyethylene group constituent units is 1 to 5). ), PO-modified trimethylolpropane tri (meth) acrylate, EO / PO-modified trimethylolpropane tri (meth) acrylate, tetramethylolmethane tri (meth) acrylate and tetramethylolmethanetetra (meth) acrylate, pentaerythritol tri ( And (meth) acrylate or dipentaerythritol hexa (meth) acrylate. These can be used alone or in combination of two or more.

  As a compounding quantity of the photopolymerizable compound which is (B) component, it is preferable that it is 30-70 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, and is 35-65 mass parts. More preferably, it is particularly preferably 40 to 60 parts by mass. When this blending amount is 30 parts by mass or more, good sensitivity, resolution, and adhesion tend to be easily obtained, and when it is 70 parts by mass or less, a favorable partition shape tends to be easily obtained.

Component (C): Photopolymerization initiator The partition wall forming material contains at least one photopolymerization initiator as the component (C). There is no restriction | limiting in particular as a photoinitiator which is (C) component, It can select suitably from the photoinitiator used normally. As the photopolymerization initiator, benzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholino- Aromatic ketones such as propanone-1; quinones such as alkylanthraquinones; benzoin ether compounds such as benzoin alkyl ether; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyldimethyl ketal; 2- (o-chlorophenyl)- 2,4,5-triarylimidazole dimer such as 4,5-diphenylimidazole dimer, 2- (o-fluorophenyl) -4,5-diphenylimidazole dimer; 9-phenylacridine, 1, Acridine derivatives such as 7- (9,9′-acridinyl) heptane Is mentioned. These can be used alone or in combination of two or more.

  The component (C) preferably contains at least one 2,4,5-triarylimidazole dimer from the viewpoint of improving sensitivity and adhesion, and 2- (o-chlorophenyl) -4,5- More preferably, it contains a diphenylimidazole dimer. The 2,4,5-triarylimidazole dimer may be symmetric or asymmetric in structure.

  The content of the component (C) in the partition wall forming material is preferably 0.1 parts by mass to 10 parts by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B). It is more preferably 7 parts by mass, further preferably 2 parts by mass to 6 parts by mass, and particularly preferably 3 parts by mass to 5 parts by mass. When this content is 0.1 parts by mass or more, good sensitivity, resolution or adhesion tends to be obtained, and when it is 10 parts by mass or less, a good resist shape tends to be obtained.

  The partition wall forming material of the present embodiment can contain at least one sensitizing dye.

  Examples of sensitizing dyes include dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, coumarin compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds. , A thiophene compound, a naphthalimide compound, a triarylamine compound, and an aminoacridine compound. These can be used alone or in combination of two or more.

  In particular, when exposure of a coating film containing a partition wall forming material using an actinic ray of 340 to 430 nm is carried out, from the viewpoint of sensitivity and adhesion, a dialkylaminobenzophenone compound, a pyrazoline compound, an anthracene compound, a coumarin compound, a triaryl It is preferable to contain at least one sensitizing dye selected from the group consisting of amine compounds, thioxanthone compounds and aminoacridine compounds, and in particular, selected from the group consisting of dialkylaminobenzophenone compounds, pyrazoline compounds, anthracene compounds, and triarylamine compounds. It is more preferable that at least one selected from the group consisting of pyrazoline compounds is further included.

  The content of the sensitizing dye in the partition wall forming material is preferably 0.01 parts by mass to 10 parts by mass with respect to 100 parts by mass of the total amount of the component (A) and the component (B), and 0.05 parts by mass. It is more preferable to set it as -5 mass parts, and it is still more preferable to set it as 0.1 mass part-3 mass parts. When this content is 0.01 parts by mass or more, sensitivity and resolution tend to be easily obtained, and when it is 10 parts by mass or less, a sufficiently good resist shape tends to be easily obtained.

  The pyrazoline compound can be used without particular limitation, and specifically, 1-phenyl-3- (4-isopropylstyryl) -5- (4-isopropylphenyl) -pyrazoline, 1-phenyl-3- (4-tert-butyl-styryl) -5- (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) -pyrazoline, 1-phenyl -3- (3,5-dimethoxystyryl) -5- (3,5-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (3,4-dimethoxystyryl) -5- (3,4-dimethoxyphenyl) -Pyrazolin, 1-phenyl-3- (2,6-dimethoxystyryl) -5- (2,6-dimethoxyphenyl) -pyrazoline, 1-phenyl 3- (2,5-dimethoxystyryl) -5- (2,5-dimethoxyphenyl) -pyrazoline, 1-phenyl-3- (2,3-dimethoxystyryl) -5- (2,3-dimethoxyphenyl)- Examples include pyrazoline and 1-phenyl-3- (2,4-dimethoxystyryl) -5- (2,4-dimethoxyphenyl) -pyrazoline.

  Also, 1-phenyl-3,5-bis (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3,5-bis (4-methoxyphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) ) -5- (4-tert-butylphenyl) -pyrazoline, 1-phenyl-3- (4-biphenyl) -5- (4-tert-octylphenyl) -pyrazoline.

  Here, the 2,4,5-triarylimidazole dimer which is the photopolymerization initiator of the component (C) is cleaved by a chemical change caused by exposure alone or in the presence of the sensitizing dye, It is considered as a compound to be produced. It is considered that the generated radicals extract hydrogen from a compound that can be a hydrogen donor such as a thiol compound, and S radicals generated therefrom react with the polymerizable compound to photocur the exposed region. Therefore, the partition wall forming material of the present invention contains (D) a thiol compound in addition to the components (A) to (C) described above.

(D) Component: Thiol Compound The partition wall forming material contains at least one thiol compound as the (D) component. (D) As a thiol compound which is a component, an aliphatic thiol compound is preferable.
Examples of the aliphatic thiol compound include 1,2-ethanedithiol, 1,3-propanedithiol, 1,4-butanedithiol, 2,3-butanedithiol, 1,5-pentanedithiol, 1,6-hexane. Dithiol, 1,9-nonanedithiol, 2,3-dimercapto-1-propanol, dithioerythritol, 2,3-dimercaptosuccinic acid, 1,2-benzenedithiol, 1,3-benzenedimethanethiol, 1,4 -Benzenedimethanethiol, 3,4-dimercaptotoluene, 4-chloro-1,3-benzenedithiol, 1,4-benzenedimethanethiol, 3,4-dimercaptotoluene, 4-chloro-1,3- Benzenethiol, 2,4,6-trimethyl-1,3-benzenedimethanethiol, 4,4'-thiodiph Enol, 2-hexylamino-4,6-dimercapto-1,3,5-triazine, 2-diethylamino-4,6-dimercapto-1,3,5-triazine, 2-cyclohexylamino-4,6-dimercapto- 1,3,5 triazine, 2-di-n-butylamino-4,6-dimercapto-1,3,5-triazine, ethylene glycol bis (3-mercaptopropionate), butanediol bisthioglycolate, ethylene Glycol bisthioglycolate, 2,5-dimercapto-1,3,4-thiadiazole, 2,2 '-(ethylenedithio) diethanethiol, 2,2-bis (2-hydroxy-3-mercaptopropoxyphenylpropane) Bifunctional thiol compounds such as 1,2,6-hexanetrithiol trithioglycolate, 1 , 3,5-trithiocyanuric acid, trimethylolpropane tris (3-mercaptopropionate), trifunctional thiol compounds such as trimethylolpropane tristhioglycolate; tetrafunctional such as pentaerythritol tetrakis (3-mercaptobutyrate) These thiol compounds are mentioned.

  Moreover, it is preferable that the compounding quantity of the thiol compound which is (D) component is 0.1-15 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, and 0.5-12 mass Is more preferably 1 to 9 parts by mass, and particularly preferably 2 to 8 parts by mass. When the blending amount is 0.1 parts by mass or more, the sensitivity improvement, resolution, and adhesion tend to be easily obtained, and when it is 15 parts by mass or less, a resist having a good shape as desired. It tends to be easy to obtain a pattern. If the blending amount exceeds 15 parts by mass, the odor is deteriorated and there is a tendency that a resist pattern having a good shape as desired cannot be obtained, for example, the pattern line width is increased. (D) The thiol compound which is a component is used individually by 1 type or in combination of 2 or more types.

(E) Component: Silane Coupling Agent Examples of the silane coupling agent of component (E) include, for example, amino silane coupling agents, ureido silane coupling agents, glycid silane coupling agents, and vinyl silane coupling agents. Agents, methacrylic silane coupling agents, epoxy silane coupling agents, mercapto silane coupling agents, and isocyanate silane coupling agents. These hydrolyzable groups include alkoxy groups, chloro groups, acetoxy groups, and oximes. Group, isopropenoxy group, amide group and the like.
Among the above, a silane coupling agent having a photoreactive group is preferable, and a vinyl silane coupling agent, a methacrylic silane coupling agent, or an epoxy silane coupling agent is preferable, and a vinyl silane coupling agent or It is more preferable to include a methacrylic silane coupling agent, and it is more preferable to include a methacrylic silane coupling agent.
Specific examples of the silane coupling agent include γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β- (aminoethyl) -γ-aminopropyltrimethoxysilane, and γ-phenylamino. Propyltrimethoxysilane, ureidopropyltriethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, vinyltris (β-methoxyethoxy) silane, γ-methacryloxypropyltrimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, and γ-isocyanatopropyltrimethoxysilane. These can be used singly or in combination of two or more.

  The component (E) according to the present embodiment is preferably a silane coupling agent having an alkoxy group as a hydrolyzable group because the control range of the hydrolysis reaction is wide and handling is easy.

  Moreover, it is preferable that the compounding quantity of the silane coupling agent which is (E) component is 0.1-15 mass parts with respect to 100 mass parts of total amounts of (A) component and (B) component, 0.5- More preferably, it is 10 mass parts, and it is especially preferable that it is 1-6 mass parts. When this amount is 0.1 part by mass or more, high adhesion tends to be easily obtained, and when it is 15 parts by mass or less, stability of characteristics tends to be improved.

  The partition wall-forming material containing the above components may further include a thermochromic inhibitor, a plasticizer such as p-toluenesulfonamide, a pigment, a filler, an antifoaming agent, a flame retardant, a stabilizer, and adhesiveness, if necessary. 0.01 to 20 parts by mass of an imparting agent, a leveling agent, a peeling accelerator, an antioxidant, a fragrance, an imaging agent, a thermal crosslinking agent, etc. with respect to 100 parts by mass of the total amount of component (A) and component (B). It can be contained to the extent. These may be used alone or in combination of two or more.

  The partition wall forming material of the present invention containing the above components (hereinafter, also referred to as “photosensitive resin composition”) can be obtained, for example, by uniformly kneading and mixing the contained components with a roll mill, a bead mill or the like. . If necessary, it can be dissolved in a solvent such as methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N, N-dimethylformamide, propylene glycol monomethyl ether, or a mixed solvent thereof to obtain a solid content of 30 It can be used as a solution of about ˜60% by mass.

  A method for forming a coating film (hereinafter also referred to as “photosensitive resin composition layer”) on the substrate for an image display device using the obtained photosensitive resin composition is not particularly limited. A method in which the photosensitive resin composition is applied as a liquid resist and dried can be used. Moreover, a protective film can be coat | covered on the photosensitive resin composition layer as needed. Further, as will be described in detail later, it is preferable to use the photosensitive resin composition layer in the form of a photosensitive element. The thickness of the photosensitive resin composition layer to be applied varies depending on the use, but is preferably about 1 to 100 μm after drying. Examples of the protective film in the case where the protective film is used after being coated as a liquid resist include polymer films such as polyethylene and polypropylene.

(Photosensitive element)
FIG. 1 is a schematic cross-sectional view showing a preferred embodiment of the photosensitive element of the present invention. As shown in FIG. 1, the photosensitive element 10 of the present invention includes a support 1, a photosensitive resin composition layer 2 made of the photosensitive resin composition formed thereon, and a photosensitive resin composition layer. Protective film 3 formed on 2. In addition, the protective film 3 is provided as needed.

  As the support 1, for example, a polymer film of polyethylene terephthalate, polypropylene, polyethylene, polyester, or the like can be preferably used. The thickness of the polymer film is preferably about 1 to 100 μm, more preferably 5 to 50 μm, and still more preferably 10 to 30 μm.

  Although the formation method of the photosensitive resin composition layer 2 on the support body 1 is not specifically limited, It can implement preferably by apply | coating and drying the solution of the photosensitive resin composition. The thickness of the applied photosensitive resin composition layer 2 varies depending on the use, but is preferably about 1 to 100 μm in thickness after drying. When used in this application, the thickness of the photosensitive resin composition layer 2 is more preferably 10 to 100 μm, more preferably 20 to 90 μm, and more preferably 30 to 80 μm after drying. Is particularly preferred.

  The coating can be performed by a known method such as a roll coater, a comma coater, a gravure coater, an air knife coater, a die coater, or a bar coater. Drying can be performed at 70 to 150 ° C. for about 5 to 30 minutes. Moreover, it is preferable that the amount of the residual organic solvent in the photosensitive resin composition layer 2 shall be 2 mass% or less from the point which prevents the spreading | diffusion of the organic solvent in a next process.

  The surface of the photosensitive resin composition layer 2 may be coated using the polymer film used as the support 1 as the protective film 3. The protective film 3 has a smaller adhesive force between the photosensitive resin composition layer 2 and the protective film 3 than the adhesive force between the photosensitive resin composition layer 2 and the support 1. Also preferred is a low fisheye film. Further, the photosensitive element 10 includes an intermediate layer and a protective layer such as a cushion layer, an adhesive layer, a light absorption layer, and a gas barrier layer in addition to the photosensitive resin composition layer 2, the support 1 and the optional protective film 3. You may do it.

  The manufactured photosensitive element 10 is usually wound around a cylindrical core and stored. At this time, it is preferable that the support 1 is wound up so as to be on the outside. An end face separator is preferably installed on the end face of the roll-shaped photosensitive element roll from the viewpoint of end face protection, and a moisture-proof end face separator is preferably installed from the viewpoint of edge fusion resistance. Moreover, as a packing method, it is preferable to wrap and package in a black sheet with low moisture permeability. Examples of the core include plastics such as polyethylene resin, polypropylene resin, polystyrene resin, polyvinyl chloride resin, and ABS resin (acrylonitrile-butadiene-styrene copolymer).

(Method for forming partition of image display device and method for manufacturing image display device)
Next, a method for forming the partition wall of the image display device and a method for manufacturing the image display device of the present invention will be described. A method for forming partition walls of an image display device includes a step of laminating a photosensitive resin composition or a photosensitive resin composition layer using a photosensitive element on a substrate of the image display device, and the photosensitive resin composition. An exposure step of irradiating a predetermined portion of the layer with an actinic ray to photo-cure the exposed portion; a developing step of removing a portion other than the exposed portion of the photosensitive resin composition layer to form a photocured product pattern; Have

  First, a photosensitive resin composition layer is laminated on a substrate of an image display device using the above-described photosensitive resin composition of the present invention. Examples of the substrate include an insulating substrate such as a glass substrate or a polymer substrate, a semiconductor substrate such as a silicon substrate, a substrate on which an electrode such as ITO is formed, or a glass substrate on which a color filter is formed. As a lamination method, the above-described coating method is used, and a photosensitive element can also be used.

In the laminating method using the photosensitive element, when a protective film is present on the photosensitive resin composition layer, it is laminated on the substrate while removing the protective film. As the lamination condition, for example, by heating the photosensitive resin composition layer to about 70 to 130 ° C., it is pressure-bonded on the substrate with a pressure of about 0.1 to 1 MPa (about 1 to 10 kgf / cm ² ). The method of laminating | stacking etc. is mentioned, It is also possible to laminate | stack under reduced pressure. The shape of the substrate surface is usually flat, but irregularities and electrode patterns may be formed as necessary.

  After lamination of the photosensitive resin composition, the photosensitive resin composition layer is irradiated with an actinic ray in an image form to photocur the exposed portion. As a method of irradiating actinic rays in an image form, there is a method of setting a mask pattern on the photosensitive resin composition layer and irradiating the image form with an actinic ray and photocuring the photosensitive resin composition layer in the exposed portion. is there. The mask pattern may be a negative type or a positive type, and a commonly used one can be used. As the light source of actinic light, a known light source, for example, a light source that effectively emits ultraviolet light, visible light, or the like, such as a carbon arc lamp, a mercury vapor arc lamp, a high-pressure mercury lamp, or a xenon lamp is used. As an exposure method, a direct drawing exposure method in which a pattern is directly drawn with a laser without using a mask pattern can also be used.

  A photocured material pattern is formed on the substrate for an image display device by selectively removing the photosensitive resin composition layer in the unexposed portion after the exposure by development. In the development step, when a support is present, the support is removed prior to development. Development is performed by removing unexposed portions by wet development, dry development, or the like using a developer such as an alkaline aqueous solution, an aqueous developer, or an organic solvent. In the present invention, it is preferable to use an alkaline aqueous solution. Examples of the alkaline aqueous solution include a dilute solution of 0.1 to 5 mass% sodium carbonate, a dilute solution of 0.1 to 5 mass% potassium carbonate, a dilute solution of 0.1 to 5 mass% sodium hydroxide, and the like. . The pH of the alkaline aqueous solution is preferably in the range of 9 to 11, and the temperature is adjusted according to the developability of the photosensitive resin composition layer. Moreover, you may mix surfactant, an antifoamer, an organic solvent, etc. in alkaline aqueous solution. Examples of the development method include a dip method, a spray method, brushing, and slapping.

  As a treatment after development, the formed photocured product pattern may be further cured by a heat treatment at about 60 to 250 ° C., if necessary.

  The method for producing an image display device of the present invention includes a step of filling a display medium such as particles in the partition obtained in the above step, a step of attaching a substrate to the opposite side of the partition so as to face one substrate, Have Examples of the substrate include an insulating substrate such as a glass substrate or a polymer substrate, a semiconductor substrate such as a silicon substrate, or a substrate on which an electrode such as ITO is formed.

  Hereinafter, an embodiment in which a photosensitive element is used for a method for forming a partition wall of an image display device and a method for manufacturing an image display device described above will be described with reference to the drawings.

  First, as shown in FIG. 2 (a), an electrode substrate 30 for an image display device comprising an electrode 4 and a substrate 5 is prepared. The electrode 4 is previously patterned.

  Next, as shown in FIG. 2B, the photosensitive resin composition layer 2 and the support 1 in the photosensitive element 10 described above are laminated on the electrode substrate 30 (lamination process). After the lamination of the photosensitive resin composition layer 2, as shown in FIG. 2B, the photosensitive resin composition layer 2 is irradiated with an actinic ray 8 in an image form using a mask pattern 7, and an exposed portion is formed. Photocuring (exposure process).

  After the exposure, as shown in FIG. 2C, the photocured material pattern 20 is formed on the substrate 5 by selectively removing the unexposed photosensitive resin composition layer 2 by development (development). Process).

  After that, as shown in FIG. 2D, the display medium 50 such as particles is filled in the photocured product pattern 20 formed in the above development step. Although it does not specifically limit as a display medium, An electronic powder body, pigment ink, a white fine particle, etc. are mentioned. When using electronic powder particles, white fine particles, or the like, the space in the photocured material pattern 20 other than those is filled with air, an olefin solvent, silicone oil, or the like.

  After that, through the process of attaching another electrode substrate 30 to the photocured material pattern 20 ((d) and (e) in FIG. 2), the formation of the partition walls of the image display device and the manufacture of the image display device are performed. Can be completed.

  The step of attaching another electrode substrate 30 to the photocured material pattern 20 can be performed as follows. That is, in the above process, the adhesive 40 is laminated on the photocured material pattern 20 as shown in FIG. 2D, and the electrode substrate 30 and the photocured material are cured by the adhesive 40 as shown in FIG. This can be done by bonding the object pattern 20. The electrode substrate 30 may be directly bonded to the photocured material pattern 20 without using the adhesive 40.

  A transparent electrode substrate is used at least for the electrode substrate on the display surface side of the image display device. A preferable embodiment of the image display device includes an embodiment in which a transparent glass substrate is used as the substrate 5 and a transparent ITO electrode is used as the electrode 4.

  In the image display device manufactured by the manufacturing method of the present embodiment, as shown in FIG. 2, a photocured material pattern 20 serving as a partition is formed on a substrate 5 having a smooth surface such as a glass substrate. By using the photosensitive resin composition of the present invention, a narrow photocured product pattern 20 can be formed with good adhesion.

  Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples without departing from the technical idea of the present invention.

(Examples 1-7 and Comparative Examples 1-3)
The materials shown in Table 1 were mixed with stirring to obtain a photosensitive resin composition solution as a partition wall forming material. In addition, resin (1)-(3) which is (A) component in Table 1 was synthesize | combined according to the following synthesis examples 1-3. Moreover, the unit of the compounding quantity of each material in Table 1 is g, and the compounding quantity of resin (1)-(3) shows the compounding quantity of solid content.

[Synthesis of binder polymer]
(Synthesis Example 1)
In a pressure synthesis flask equipped with a stirrer, reflux condenser, thermometer, dropping funnel and nitrogen gas introduction tube, acetone 71.5 g, methanol 5 g, propylene glycol monomethyl ether 18.5 g, methacrylic acid 5 g, styrene 5 g, A solution in which 5 g of benzyl methacrylate was mixed (hereinafter referred to as “solution a”) was charged and stirred while blowing nitrogen gas to raise the pressure to 1.2 kg / cm ² . The solution a was heated to 85 ° C. and kept for 30 minutes. Meanwhile, a solution (hereinafter referred to as “solution b”) prepared by mixing 19 g of methacrylic acid, 2.5 g of methacrylic acid methyl ester, 5 g of styrene, 58.5 g of benzyl methacrylate, and 0.65 g of azobisisobutyronitrile was prepared. The solution b was added dropwise to the solution a over 4 hours, and then kept at 85 ° C. with stirring for 2 hours. Further, a solution prepared by dissolving 0.1 g of azobisisobutyronitrile in 7.8 g of acetone was dropped into the flask over 40 minutes. The solution after dropping was kept at 85 ° C. for 3 hours with stirring, and then cooled and diluted with acetone so that the nonvolatile content (solid content) was 51% by mass to obtain a binder polymer (resin (1)). It was. The obtained binder polymer had a weight average molecular weight of 45,000, a dispersity of 2.0, and an acid value of 77 mgKOH / g.

  In addition, the weight average molecular weight of the binder polymer was measured by gel permeation chromatography, and was derived by conversion using a standard polystyrene calibration curve. The measurement conditions of gel permeation chromatography (GPC) are shown below.

[GPC measurement conditions]
Pump: Hitachi L-6000 (manufactured by Hitachi, Ltd.)
Column: Gelpack GL-R440 + GL-R450 + GL-R400M
Column specifications: 10.7mmφ x 300mm
Eluent: Tetrahydrofuran Measurement temperature: Room temperature (20-25 ° C)
Flow rate: 2.05 mL / min Concentration: 120 mg / 5 mL
Injection volume: 200 μL
Pressure: 49Kgf / cm ²
Detector: Hitachi L-3300 type RI (manufactured by Hitachi, Ltd.)

(Synthesis Example 2)
To a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel and a nitrogen gas introduction tube, 100 g of propylene glycol monomethyl ether acetate was added, stirred while blowing nitrogen gas, and heated to 100 ° C. On the other hand, 20 g of methacrylic acid, 30 g of methyl methacrylate, 30 g of butyl methacrylate, 20 g of 2-hydroxyethyl methacrylate and 20 g of propylene glycol monomethyl ether acetate as a polymerizable monomer were mixed with 0.85 g of azobisisobutyronitrile. The solution was added dropwise to propylene glycol monomethyl ether acetate heated to 100 ° C. in the flask over 2 hours, and then kept warm at 100 ° C. with stirring for 0.5 hours. Further, a solution prepared by dissolving 0.25 g of azobisisobutyronitrile in 12 g of propylene glycol monomethyl ether acetate was dropped into the flask over 5 minutes. The solution after dropping was kept warm at 100 ° C. for 0.5 hours while stirring, then heated to 140 ° C. over 0.5 hours, and kept warm for 2 hours while stirring. Furthermore, it is cooled to 70 ° C. over 0.5 hours, stirred while switching from nitrogen gas to dry air and mixed with 0.2 g of methoquinone, 0.02 g of dibutyltin laurate, and 25 g of propylene glycol monomethyl ether acetate. The mixture was kept at 70 ° C. for 0.5 hours with stirring. Finally, 23.4 g of isocyanate ethyl methacrylate was added dropwise over 2 hours, and the mixture was cooled and diluted with propylene glycol monomethyl ether acetate so that the nonvolatile content (solid content) was 41% by mass. 2)) was obtained. The obtained binder polymer had a weight average molecular weight of 50,000, a dispersity of 2.0, and an acid value of 75 mgKOH / g.

(Synthesis Example 3)
To a flask equipped with a stirrer, a reflux condenser, a thermometer, a dropping funnel and a nitrogen gas introduction tube, 500 g of a mixture of methyl cellosolve and toluene having a mass ratio of 3: 2 was added and stirred while blowing nitrogen gas, Heated to 85 ° C. On the other hand, 150 g of methacrylic acid as a polymerizable monomer, 110 g of methacrylic acid methyl ester, 65 g of acrylic acid ethyl ester, 50 g of butyl methacrylate, 125 g of styrene and 2.5 g of azobisisobutyronitrile (hereinafter referred to as “polymeric monomer”) The solution c was added dropwise to the above mixture of methyl cellosolve and toluene with a mass ratio of 3: 2 heated to 85 ° C. over 4 hours, and then stirred at 85 ° C. Incubated for 2 hours. Further, a solution prepared by dissolving 0.5 g of azobisisobutyronitrile in 150 g of a mixture of methyl cellosolve and toluene having a mass ratio of 3: 2 was dropped into the flask over 10 minutes. Mixing acetone and propylene glycol monomethyl ether in a mass ratio of 3: 2 so that the solution after dripping is kept at 85 ° C. for 5 hours while stirring and then cooled to have a non-volatile content (solid content) of 43% by mass. Dilution with a solvent gave a binder polymer (resin (3)). The obtained binder polymer had a weight average molecular weight of 50,000, a dispersity of 2.0, and an acid value of 195 mgKOH / g.

(A) A component shows solid content and the numerical value of each component shows mass ratio.

Each component in the table is as follows.
* 1; EO-modified bisphenol A dimethacrylate (10 mol of ethylene oxide (EO) group added in one molecule), manufactured by Hitachi Chemical Co., Ltd. Product name: FA-321M
* 2: Pentaerythritol triacrylate, manufactured by Nippon Kayaku Co., Ltd. Trade name: PET-30
* 3: Polyoxyalkylene glycol dimethacrylate, manufactured by Hitachi Chemical Co., Ltd. Product name: FA-023M
* 4: Modified product of dipentaerythritol hexaacrylate, manufactured by Nippon Kayaku Co., Ltd. Trade name: DPEA-12
* 5; Bis (acryloxyethyl) hydroxyethyl isocyanurate, manufactured by Toa Gosei Co., Ltd. Product name: M-215
* 6; Acrylic resin solution, manufactured by Hitachi Chemical Co., Ltd. Trade name: HT-9082-95
* 7; γ-chloro-2-hydroxypropyl-β′-methacryloyloxyethyl-o-phthalate, manufactured by Osaka Organic Chemical Industry Co., Ltd. Product name: FA-MECH
* 8; Nonylphenyl EO-modified monoacrylate (4 mol of ethylene oxide (EO) group added in one molecule), manufactured by Hitachi Chemical Co., Ltd. Product name: FA314A
* 9; Trimethylolpropane EO-modified triacrylate (21 mol of ethylene oxide (EO) group added in one molecule), manufactured by Hitachi Chemical Co., Ltd. Trade name: TMPT-21
* 10; 2- (2-Chlorophenyl) -1- [2- (2-chlorophenyl) -4,5-diphenyl-1,3-diazol-2-yl] -4,5-diphenylimidazole, Hodogaya Chemical Co., Ltd. Product name: B-CIM
* 11: Pentaerythritol tetrakis (3-mercaptobutyrate), manufactured by Showa Denko KK Product name: PE-1
* 12; Methacryloxypropyltrimethoxysilane, manufactured by Toray Dow Corning Co., Ltd. Product name: SZ-6030
* 13; 1-phenyl-3- (4-methoxystyryl) -5- (4-methoxyphenyl) pyrazoline, manufactured by Nippon Chemical Industry Co., Ltd. Product name: NF-PZ-501D
* 14; N, N′-tetraethyl-4,4′-diaminobenzophenone, manufactured by Hodogaya Chemical Co., Ltd. Product name: EAB
* 15; 2-mercaptobenzimidazole, manufactured by Aldrich, Inc. Product name: 2-MBI

  The solution of the photosensitive resin composition obtained in Table 1 was uniformly applied onto a 16 μm thick polyethylene terephthalate film (trade name: FB-40, manufactured by Toray Industries, Inc.), and heated with a hot air convection dryer at 90 ° C. After drying for 10 minutes, the photosensitive element is protected with a polyethylene protective film (tensile strength in the film longitudinal direction: 16 MPa, tensile strength in the film width direction: 12 MPa, trade name: NF-15, manufactured by Tamapoly Co., Ltd.). Got. The film thickness after drying of the photosensitive resin composition layer was 50 μm.

On the other hand, a glass substrate (SiO ₂ dip; length 370 mm, width 480 mm, thickness 0.7 mm, manufactured by Kuramoto Seisakusho Co., Ltd.) is heated to 80 ° C., and the above photosensitive film is formed on the glass surface (SiO ₂ dip surface). The photosensitive element was laminated through a laminating roll heated to 110 ° C. while peeling off the polyethylene protective film so that the photosensitive resin composition layer was in contact with the glass surface. The resulting laminate has a glass substrate, a photosensitive resin composition layer, and a polyethylene terephthalate film from the bottom. The resulting laminate was evaluated for sensitivity and adhesion on a glass substrate.

<Evaluation of sensitivity>
The obtained laminated substrate was allowed to cool, and when the temperature reached 23 ° C., on the polyethylene terephthalate film of the laminate, a concentration region of 0.00 to 2.00, a concentration step of 0.05, and a tablet size of 20 mm × A phototool having a 41-step tablet having a size of 187 mm and each step having a size of 3 mm × 12 mm was adhered. Then, after exposure using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) EXM-1201 having a high-pressure mercury lamp, the polyethylene terephthalate film is peeled off and sprayed with a 1% by mass aqueous sodium carbonate solution at 30 ° C. for 60 seconds. To remove the unexposed area. In this case, the sensitivity was evaluated by measuring the amount of energy at which the number of steps remaining after development of the 41-step tablet was 26.0. Table 2 shows the evaluation results.

<Evaluation of adhesion>
Using a parallel light exposure machine (manufactured by Oak Manufacturing Co., Ltd.) EXM-1201 having a high-pressure mercury lamp, the line width / space width is 6/400 to 47/400 (unit: μm, line width 2 μm) as an adhesive evaluation negative. Alternatively, a phototool having a wiring pattern with an increment of 3 μm and a constant space width) and a phototool having a 41-step tablet are brought into close contact with the polyethylene terephthalate film of the laminate, and the 41-step tablet remains after development. The exposure was performed with an energy amount of 26.0 step steps. After exposure, the polyethylene terephthalate film is peeled off and sprayed for 1.5 times the minimum time (minimum development time) in which the resin can be developed with a 1% by weight aqueous sodium carbonate solution at 30 ° C. (the unexposed area can be removed). Thus, the unexposed portion was removed and the adhesion was evaluated. Adhesiveness is expressed by the width (μm) of the thinnest line that remains without being peeled off by the developer. The smaller this value, the tighter the line is attached without peeling from the glass substrate. Indicates high. Table 2 shows the evaluation results. Moreover, the scanning electron microscope (SEM) photograph of the photocured material pattern of 8 micrometers in line width formed using the photosensitive element of Example 1 is shown in FIG. The aspect ratio is calculated from the resist pattern thickness (μm) / resist pattern line width (μm).

In Comparative Example 1, pattern formation was impossible.

  From Table 2, it is clear that Examples 1 to 7 have good adhesion even on smooth glass and can form a pattern of a photocured product having an aspect ratio of 3 or more.

DESCRIPTION OF SYMBOLS 1 ... Support body, 2 ... Photosensitive resin composition layer, 3 ... Protective film, 4 ... Electrode, 5 ... Substrate, 10 ... Photosensitive element, 20 ... Hardened | cured material (photocured material pattern) of the photosensitive resin composition, 30 ... Electrode substrate, 40 ... Adhesive, 50 ... Display medium.

Claims (10)

(A) component: binder polymer,
(B) component: a photopolymerizable compound having an ethylenically unsaturated bond,
Component (C): photopolymerization initiator,
(D) component: an aliphatic thiol compound, and
(E) Component: A partition wall forming material for forming partition walls for encapsulating particles of a display medium in a particle movement type image display device , which contains a silane coupling agent. (A) component: binder polymer,
(B) component: a photopolymerizable compound having an ethylenically unsaturated bond,
Component (C): photopolymerization initiator,
(D) component: a thiol compound, and
(E) component: contains a silane coupling agent,
The partition wall forming material, wherein the component (B) contains a bisphenol A-based di (meth) acrylate compound and pentaerythritol tri (meth) acrylate. The partition wall forming material according to claim 1 or 2 , wherein the (C) photopolymerization initiator contains a 2,4,5-triarylimidazole dimer. A photosensitive element provided with a support body and the coating film containing the partition wall formation material as described in any one of Claims 1-3 formed on this support body. The photosensitive element of Claim 4 whose film thickness of the said coating film containing the said partition formation material is 10-100 micrometers. A laminating step of laminating a coating film containing the partition wall forming material according to any one of claims 1 to 3 on a substrate;
An exposure step of irradiating a predetermined portion of the coating film with an actinic ray to photocure the exposed portion; and
A development step of removing a portion other than the exposed portion of the coating film to form a photocured product pattern;
A method for forming a partition wall. The method for forming partition walls according to claim 6 , further comprising a heating step of heat-treating the photocured product pattern at 60 to 250 ° C. to thermally cure the pattern. Filling the display medium into the partition formed by the method according to claim 6 or 7 ,
A step of attaching the substrate to the opposite side of the partition so as to face one of the substrates;
A method for manufacturing an image display device. A support, and a coating film containing a partition wall forming material formed on the support,
The partition wall forming material is composed of (A) component: binder polymer, (B) component: photopolymerizable compound having an ethylenically unsaturated bond, (C) component: photopolymerization initiator, (D) component: thiol compound, and , (E) component: containing a silane coupling agent,
The photosensitive element whose film thickness of the said coating film containing the said partition formation material is 20-100 micrometers. The photosensitive element according to claim 9, wherein the (C) photopolymerization initiator contains a 2,4,5-triarylimidazole dimer.