201219218 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種壓合裝置，特別是指一種用以將 預壓薄膜壓合在基材上的壓合裝置及其壓合方法。 【先前技術】 目前半導體的微影製程巾，將光阻依覆在㈣上的方 式大致可分為濕式與乾式兩種，濕式是將液態光阻以旋塗 法塗佈在晶圓上，再以烘烤方式將液態光阻烘乾乾式是 將乾膜光阻（Dry film resist)製成光阻帶，並經由壓合機將乾 膜光阻貼附在晶圓上，例如台灣專利第5〇231〇公告號（申 晴案號為090130837)專利案所揭露的乾膜光阻之壓合裝置 〇 由於晶圓表面上會設有複數個高低不同的晶粒或圖案 (pattern)，使得晶圓表面是呈現凹凸不平的狀態因此，如 何構思出一種能將乾膜光阻壓合並填覆在晶圓之表面的壓 合裝置設計，遂成為本發明要進一步改進的主題。 【發明内容】 本發明之主要目的，在於提供一種用以將預壓薄膜壓 合在基材上並能將預壓薄膜填覆於基材之表面的壓合裝置 〇 本發明之另一目的，在於提供一種壓合方法，能將預 壓薄膜填覆於基材之表面。 本發明的目的及解決先前技術問題是採用以下技術手 &來實現的’依據本發明所揭露的壓合裝置，適於將一預 201219218 壓薄膜壓合於一基材表面，壓合裝置包含一承載座及一壓 合盤。 承載座包括一供基材放置的固定座體，及一設置於固 定座體内的頂推件，頂推件可在一凸伸出固定座體以承載 基材的承載位置，及一使基材貼覆於固定座體的收合位置 之間往復運動；壓合盤包含一設置於底端的彈性壓膜，及 一可對彈性壓膜吸氣或吹氣的第一氣體流道，壓合盤可在 一間隔位於承載座上方的初始位置，及一壓合於承載座且 彈性壓膜壓迫預壓薄膜使其貼覆於基材表面的壓合位置之 間往復運動。 本發明的目的及解決先前技術問題還可以採用以下技 術手段進一步實現。 固疋座體包含一頂面，及一形成於頂面的第二氣體流 道，所述第二氣體流道可對基材吸氣。 固定座體還包含一形成於頂面的第三氣體流道，當壓 合盤在壓合位置時，第三氣體流道可對壓合盤與承載座之 間所形成的一腔室吸氣。 固定座體還包含一用以供頂推件安裝的安裝槽，安裝 槽的-開口形成於頂面。頂推件包含_可吸附基材的吸氣 孔。 固定座體還包含-可對基材加熱的下加熱元件，下加 熱元件包括-用以產生熱源的加熱冑、一設置於加執部頂 端並可與基材接觸的導熱部，及—設置於加熱部底端的隔 熱部。 201219218 廢合盤還包含一可對彈性壓膜加熱的上加熱元 加熱元件包括-用以產生熱源的加熱部、—設置於加孰部 底端與彈性㈣之間的㈣部，及—設置於加 隔熱部。 ％的 彈性壓膜為矽膠或橡膠材質。 依據本發明所揭露的壓合方法，、电认@ 路J!σ万沄，適於將一預壓薄膜壓 合於一基材表面，該方法包含下述步驟： (Α)透過一承載座承載基材； (Β)壓合一壓合盤於該承載座上，對該壓合盤的一彈性 廢膜朝下吹氣，該彈性壓膜塵迫該預屋薄膜使其貼覆於該 基材表面； (C) 對該彈性壓膜朝上吸氣，使該彈性壓膜與該預壓薄 膜分離；及 (D) 移離該壓合盤使其與該承載座分離。 藉由上述技術手段，本發明壓合裝置的優點及功效在 於’藉由彈性壓膜設計，當壓合盤在壓合位置時，第一氣 體流道會對彈性壓膜朝下吹氣，彈性壓膜會向下壓迫並擠 壓預壓薄膜，使得預壓薄膜的光阻層能填覆基材的表面， 藉此，能減少光阻層與基材之表面間的空隙，以提昇壓合 的良率。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。透過具體實施方式的說明，當可對本發明為 201219218 達成預定目的所採取的技術手段及功效得以更加深入且具 體的了解，然而所附圖式只是提供參考與說明之用，並非 用來對本發明加以限制。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。201219218 VI. Description of the Invention: [Technical Field] The present invention relates to a pressing device, and more particularly to a pressing device for pressing a pre-pressed film onto a substrate and a pressing method thereof. [Prior Art] At present, the lithography process towel of semiconductor can be roughly divided into wet type and dry type according to the method of coating the photoresist on (4). The wet type is to apply liquid photoresist to the wafer by spin coating. Drying the liquid photoresist by baking means drying the dry film resist into a photoresist strip and attaching the dry film resist to the wafer via a press, such as a Taiwan patent. The dry film resistive pressing device disclosed in the Patent Publication No. 5, 231 (Shenqing Case No. 090130837) has a plurality of different crystal grains or patterns on the surface of the wafer. The surface of the wafer is rendered uneven. Therefore, how to design a press-fit device capable of photo-resisting dry film and filling the surface of the wafer has become a subject of further improvement of the present invention. SUMMARY OF THE INVENTION The main object of the present invention is to provide a pressing device for pressing a pre-pressed film onto a substrate and capable of filling the surface of the substrate with a pre-compressed film. Another object of the present invention is It is a method of pressing to fill a surface of a substrate with a pre-compressed film. OBJECT AND SUMMARY OF THE INVENTION The prior art problem is achieved by the following technical hand & a press-fit device according to the present invention, which is suitable for pressing a pre-201219218 pressure film onto a substrate surface, and the press-fit device comprises A carrier and a pressure plate. The carrier includes a fixing base for the substrate to be placed, and a pushing member disposed in the fixing body. The pushing member can extend the fixing body to carry the bearing position of the substrate, and a base The material is reciprocated between the folding positions of the fixing body; the pressing plate comprises an elastic pressing film disposed at the bottom end, and a first gas flow path capable of inhaling or blowing the elastic pressing film, pressing The disk may reciprocate between an initial position above the carrier at a spacing and a press-fit position that is pressed against the carrier and the resilient film presses the pre-compressed film to adhere to the surface of the substrate. The object of the present invention and solving the prior art problems can be further achieved by the following technical means. The solid body includes a top surface and a second gas flow path formed on the top surface, the second gas flow path for inhaling the substrate. The fixing base further comprises a third gas flow passage formed on the top surface. When the pressing disc is in the pressing position, the third gas flow passage can inhale a chamber formed between the pressing disc and the bearing seat. . The fixing base further includes a mounting groove for mounting the pushing member, and the opening of the mounting groove is formed on the top surface. The pusher includes a suction hole that can adsorb the substrate. The fixing base further comprises a lower heating element capable of heating the substrate, the lower heating element comprising: a heating crucible for generating a heat source, a heat conducting portion disposed at a top end of the adding portion and contacting the substrate, and - disposed on The heat insulating portion at the bottom end of the heating portion. 201219218 The waste tray further comprises an upper heating element heating element capable of heating the elastic film, comprising: a heating part for generating a heat source, a (four) portion disposed between the bottom end of the twisting portion and the elasticity (4), and - disposed on Add insulation. % of the elastic film is made of silicone or rubber. According to the pressing method disclosed in the present invention, the electric pre-pressing film is suitable for pressing a pre-pressing film onto a surface of a substrate, and the method comprises the following steps: (Α) passing through a carrier Carrying a substrate; (Β) pressing a pressure-bonding plate on the carrier, blowing an elastic waste film of the pressure plate downward, the elastic film dusting the pre-house film to be attached thereto a substrate surface; (C) aspirating the elastic film upward to separate the elastic film from the pre-press film; and (D) moving away from the plate to be separated from the carrier. According to the above technical means, the advantages and effects of the press-fit device of the present invention are: 'With the elastic lamination design, when the press-fit disc is in the pressing position, the first gas flow path blows the elastic laminating film downward, and the elasticity The film presses down and compresses the pre-pressed film, so that the photoresist layer of the pre-pressed film can fill the surface of the substrate, thereby reducing the gap between the photoresist layer and the surface of the substrate to enhance the pressing. Yield. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Through the description of the specific embodiments, the technical means and effects of the present invention for achieving the intended purpose of 201219218 can be more deeply and specifically understood. However, the drawings are only for reference and explanation, and are not intended to be used for the present invention. limit. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals.
如圖1及圖2所示，是本發明壓合裝置的—較佳實施 例，該壓合裝置300主要是用以將一預壓薄膜j壓合在一 基材2上，在本實施例中，預壓薄膜丨是以一光阻帶為例 作說月iiij基材2是以一晶圓為例作說明，當然，預壓薄 膜1也可為保護膜或其他形式的薄膜。 預壓薄膜1包括一光阻層1卜及-貼覆於光阻層u頂 面的保護層12’保護層12的材f可為聚對苯二甲酸乙二醋 (PET)’ *對光阻層^提供保護的作用。由於基材2上設置 有複數個高低不同的凸部21，前述凸部21可為晶粒或者是 圖案㈣叫，使得基材2的—表面22是呈現凹凸不平的 狀態，而預壓薄膜i是以其光阻層n預先貼合在基材2的 表面22上’在本實施例中，預壓薄膜丨是呈圓形且面積略 A於㈣2的㈣’使得預壓薄《 1能完全蓋覆在基材2 的表 i ®然’預壓薄膜1面積可視實際需求設計得 比基材2面積域是等於基材2㈣並*以本實施例所 揭露的為限。 如圖2及圖3所示，壓合裝置3〇〇包含一承載座3 ,及 -間隔設置於承載座3上方的壓合盤4。承載座3包括一固 定座體，及_設置於固定座體3ι内的頂推件&固定 201219218 座體31包含一座本體310,及一設置於座本體31〇内用以 對基材2(如圖1)加熱的下加熱元件316，下加熱元件316包 括一用以產生熱源的加熱部317、一設置於加熱部317頂端 並可與基材2接觸的導熱部318，及一設置於加熱部317底 端的隔熱部319,固定座體31之導熱部318的一頂面311 可供基材2放置，導熱部318可將加熱部317所產生的熱 源傳導至基材2，藉此，可對基材2均勻地加熱。另外，隔 熱部319則用以阻隔加熱部317所產生的熱源向下發散， 使得加熱部317的熱源大部份都能有效地透過導熱部3 j 8 的傳導而對基材2加熱’藉此’能避免熱源的損失。 固定座體31的座本體310以及下加熱元件316共同形 成一用以供頂推件32安裝的安裝槽312，安裝槽312的一 開口 313形成於頂面311並可供頂推件32穿出。頂推件32 底端與一驅動機構（圖未示）相連接，頂推件32可受驅動機 構帶動而在一凸伸出固定座體31的頂面311以承載基材2 的承載位置（如圖6所示）’及一使基材2貼覆於頂面311的 收合位置（如圖7所示）之間往復運動。當移載機構（圖未示） 將基材2平移至間隔承載座3上方一段距離時，頂推件 月b上移至承載位置以承載基材2，藉此可縮短頂推件 與基材2之間的距離，以避免移載機構在放置基材2於承 載座3之頂面311的過程中因為落摔而造成基材2受損的情 形產生。 較佳地，頂推件32包含一吸氣孔321，吸氣孔321包 括一呈縱向延伸的孔部322,及複數個形成於頂端並與孔部 201219218 _ 322相連通的溝槽部323，各溝槽部323呈圓環形並可吸附 基材2藉此’當頂推件32帶動基材2在承載位置與收合 位置之間移動的過程中，能避免基材2產生晃動的情形。 如圖2及圖4所示，壓合盤4包含一座體41、一彈性 壓膜42及—壓環43 ’彈性壓膜42切膠或橡膠材質所製 成彈I·生壓膜42外周緣是透過壓環43的壓合而固定在座 體41底面，使得彈性壓膜42能接合在座體41與壓環幻 1 1°盤4還包含-設置於座體41内的上加熱元件44 ，上加熱凡件44包括一用以產生熱源的加熱部441、一設 置於加熱部441底端與彈性壓膜42之間的導熱部⑷及 又置於加熱。p 441頂端的隔熱部443，導熱部442與彈性 壓膜42内表面接觸並可將加熱部441所產生的熱源傳導至 彈性壓膜42 ’藉此，可對彈性壓膜42均勻地加熱。另外， 隔熱部443則用以阻隔加熱部441所產生的熱源向上發散 使得加熱4 441的熱源大部份都能有效地透過導敎部 # 的傳導而對刪膜42加熱，藉此，能避免熱源的損失。 壓合盤4還包含一形成於座體41與加熱元件44之間 的第轧體抓道45’第—氣體流道45的一端是與氣體供應 裝置（圖未示）相連接，而另一端則被彈性㈣42所封閉， 透過氣體供應裝置的控制使得第—氣體流道45可對彈性屢 膜42吸氣或吹氣’藉此，使得彈性壓膜42能貼覆於加熱 疋件44的導熱部442上’或者是與導熱部Μ2分離而凸伸 出壓環43底面。另外，壓合盤4可透過驅動機構的帶動在 -間隔位於承載座3上方的初始位置(如圖2所示)，及一麼 201219218 合於承載座3的壓合位置（如圖8所示）之間往復運動，當壓 合盤4在壓合位置時，透過第一氣體流道45對彈性壓膜42 吹氣使得彈㈣膜42能壓迫預㈣膜！使其貼覆在基材2 的表面22。 以下將針對壓合裝置300的壓合方法進行詳細說明： 如圖1、圖5及圖6所示，圖5為預麼薄膜j的壓合方 法流程圖，圖5的主要流程為： 如步驟51 ’透過承載座3承載基材2。 在使用壓合裝置300時，壓合盤4是在一間隔位於承 載座3上方的初始位置（如圖6所示），使得壓合盤4與承載 座3的固定座體31之間具有空間可供頂推件32活動，並 且可供移載機構伸入以進行基材2的置放動作。另外，透 過第一氣體流道45向上吸氣並抽真空，使得彈性壓膜42 能保持在貼覆於加熱元件44的導熱部442上的位置藉此 ，以便於導熱部442能將加熱部441產生的熱源傳遞至彈 性壓膜42，以對彈性壓膜42進行加熱。 藉由驅動機構帶動頂推件32由圖2所示的收合位置沿 箭頭I方向向上移動至承載位置後，移載機構能伸入壓合盤 4與固定座體31之間，以將基材2及預貼在基材2的表面 22上的預壓薄膜1移載至頂推件32上供頂推件32承載。 透過頂推件32的吸氣孔321朝下吸氣，使得基材2能被溝 槽部323吸附在頂推件32的頂面。接著，如圖7所示，驅 動機構會帶動頂推件32由承載位置沿箭頭π方向向下移動 ，由於基材2被吸氣孔321的溝槽部323所吸附，因此在 10 201219218 下移過程中，能避免基材2產生晃動的情形。當頂推件32 向下移動到收合位置時，基材2會貼覆在固定座體之下 加熱元件316的頂面311。固定座體31還包含一形成於座 本體310與下加熱元件316上的第二氣體流道315，第二氣 體流道3 15包括一與氣體供應裝置相連接的孔部32〇，及複 數個形成於頂面311並與孔部320相連通的溝槽部324，各 溝槽部324呈圓環形用以對基材2吸氣，使得基材2能平 整地貼覆在固定座體31的頂面311。 如圖5及圖8所示，如步驟52,壓合壓合盤4於承載 座3上，對壓合盤4的彈性壓膜42朝下吹氣，彈性壓膜42 壓迫預壓薄膜1使其貼覆於基材2的表面22(如圖1}。 藉由驅動機構帶動壓合盤4沿箭頭π方向下移，當壓 合盤4的壓環43抵壓於承載座3的—設置於頂面3ιι的氣 密環314時，壓合座4與承載座3之間所形成的一腔室5 呈一氣密狀態，其中，氣密環314是由橡膠或矽膠等彈性 材質所製成。在氣密狀態下，上加熱元件44的加熱部44ι 會產生熱源，使得導熱部442能對彈性壓膜42進行加熱， 而下加熱元件316的加熱部317也會產生熱源，使得導熱 部318能對基材2進行加熱。 接著，如圖9及圖1〇所示，固定座體31還包含一形 成於座本體310上的第三氣體流道325,第三氣體流道奶 包括一與氣體供應裝置相連接的孔部326，及一形成於下加 熱元件316外周圍與座本體31〇之間的溝槽部327，各溝槽 部327呈圓環形用以對腔室5向下吸氣，同時，壓合座4 11 201219218 的第一氣體流道45會對彈性壓膜42朝下吹氣而解除真空 狀態，藉此，彈性壓膜42會向下壓迫並擠壓預壓薄膜1， 使預壓薄膜1貼覆在基材2的表面22上。由於彈性壓膜42 具有彈性並且能塑性變形，因此，彈性壓膜42受第一氣體 流道45的氣體下壓以及第三氣體流道325的溝槽部327吸 附時，彈性壓膜42能將預壓薄膜！的光阻層u擠壓入基材 2之表面22的凹部221内，使得光阻層u能填覆基材2之 凹凸不平的表面22，藉此，能減少光阻層u與基材2之表 面22間的空隙。As shown in FIG. 1 and FIG. 2, it is a preferred embodiment of the pressing device of the present invention. The pressing device 300 is mainly used for pressing a pre-pressing film j onto a substrate 2, in this embodiment. In the case where the pre-pressed film is a photoresist strip, the substrate is exemplified by a wafer. Of course, the pre-pressed film 1 can also be a protective film or other forms of film. The pre-pressed film 1 comprises a photoresist layer 1 and a protective layer 12 affixed to the top surface of the photoresist layer u. The material f of the protective layer 12 may be polyethylene terephthalate (PET). The barrier layer provides protection. Since the substrate 2 is provided with a plurality of convex portions 21 having different heights, the convex portion 21 may be a crystal grain or a pattern (four), so that the surface 22 of the substrate 2 is in a state of unevenness, and the pre-pressed film i The photoresist layer n is pre-bonded to the surface 22 of the substrate 2. In the present embodiment, the pre-pressed film crucible is circular and the area is slightly equal to (four) 2 (four)' so that the pre-calender "1 can be completely The area of the pre-pressed film 1 covered on the substrate 2 can be designed to be more than the substrate 2 area area equal to the substrate 2 (four) and * limited by the present embodiment. As shown in FIG. 2 and FIG. 3, the pressing device 3A includes a carrier 3, and a pressing plate 4 spaced apart above the carrier 3. The carrier 3 includes a fixing body, and a pushing member disposed in the fixing body 3i. The fixing body 201219218 The body 31 includes a body 310, and is disposed in the seat body 31〇 for the base material 2 ( 1) a heated lower heating element 316, the lower heating element 316 includes a heating portion 317 for generating a heat source, a heat conducting portion 318 disposed at the top end of the heating portion 317 and in contact with the substrate 2, and a heating portion 318 The heat insulating portion 319 at the bottom end of the portion 317, a top surface 311 of the heat conducting portion 318 of the fixing base 31 can be placed on the substrate 2, and the heat conducting portion 318 can conduct the heat source generated by the heating portion 317 to the substrate 2, whereby The substrate 2 can be uniformly heated. In addition, the heat insulating portion 319 is configured to block the heat source generated by the heating portion 317 from diverging downward, so that most of the heat source of the heating portion 317 can effectively heat the substrate 2 through the conduction of the heat conducting portion 3 j 8 . This 'can avoid the loss of heat source. The seat body 310 of the fixed base 31 and the lower heating element 316 together form a mounting groove 312 for mounting the pushing member 32. An opening 313 of the mounting groove 312 is formed on the top surface 311 and is permeable to the pushing member 32. . The bottom end of the pushing member 32 is connected to a driving mechanism (not shown), and the pushing member 32 can be driven by the driving mechanism to protrude from the top surface 311 of the fixing base 31 to carry the bearing position of the substrate 2 ( As shown in FIG. 6 'and a reciprocating motion between the substrate 2 and the folded position of the top surface 311 (shown in FIG. 7). When the transfer mechanism (not shown) translates the substrate 2 to a distance above the spacer carrier 3, the pushing member b is moved up to the carrying position to carry the substrate 2, thereby shortening the pushing member and the substrate The distance between the two is to prevent the transfer mechanism from being damaged by the falling of the substrate 2 during the process of placing the substrate 2 on the top surface 311 of the carrier 3. Preferably, the pushing member 32 includes a suction hole 321 including a longitudinally extending hole portion 322 and a plurality of groove portions 323 formed at the top end and communicating with the hole portions 201219218 322. Each of the groove portions 323 is annular and can adsorb the substrate 2, thereby preventing the substrate 2 from being shaken during the movement of the substrate 2 between the carrying position and the folding position when the pushing member 32 is moved. . As shown in FIG. 2 and FIG. 4, the pressing plate 4 comprises a body 41, an elastic pressing film 42 and a pressing ring 43. The elastic pressing film 42 is made of rubber or rubber material, and the outer periphery of the artificial pressing film 42 is formed. It is fixed to the bottom surface of the base 41 through the pressing of the pressure ring 43, so that the elastic pressing film 42 can be engaged with the seat body 41 and the pressure ring. The disk 1 further includes an upper heating element 44 disposed in the base 41. The heating member 44 includes a heating portion 441 for generating a heat source, a heat conducting portion (4) disposed between the bottom end of the heating portion 441 and the elastic pressing film 42, and being placed in heating. The heat insulating portion 443 at the top end of the p 441, the heat transfer portion 442 is in contact with the inner surface of the elastic pressure film 42, and the heat source generated by the heating portion 441 can be conducted to the elastic pressure film 42', whereby the elastic pressure film 42 can be uniformly heated. In addition, the heat insulating portion 443 is configured to block the heat source generated by the heating portion 441 from being radiated upward, so that most of the heat source of the heating 4 441 can effectively heat the cut film 42 through the conduction of the guide portion #, thereby enabling Avoid loss of heat. The press-fit disc 4 further includes a first rolling body gripper 45' formed between the seat body 41 and the heating element 44. One end of the gas passage 45 is connected to a gas supply device (not shown), and the other end is connected. Then, it is closed by the elastic (four) 42 and the first gas passage 45 can inhale or blow the elastic membrane 42 through the control of the gas supply device, thereby enabling the elastic pressure film 42 to adhere to the heat conduction of the heating element 44. The portion 442 is 'either separated from the heat conducting portion 而 2 and protrudes from the bottom surface of the pressing ring 43. In addition, the pressing plate 4 can be driven by the driving mechanism at an initial position above the carrier 3 (as shown in FIG. 2), and a 201219218 combined with the pressing position of the carrier 3 (as shown in FIG. During the reciprocating motion, when the pressing plate 4 is in the pressing position, the elastic pressing film 42 is blown through the first gas flow path 45 so that the elastic film (4) can press the pre-(four) film! It is applied to the surface 22 of the substrate 2. The following is a detailed description of the pressing method of the pressing device 300: As shown in FIG. 1, FIG. 5 and FIG. 6, FIG. 5 is a flow chart of the pressing method of the pre-film j, and the main flow of FIG. 5 is as follows: 51 'The substrate 2 is carried through the carrier 3 . When the press-fit device 300 is used, the press-fit disc 4 is in an initial position (shown in FIG. 6) spaced above the carrier 3 such that there is space between the press-fit disc 4 and the fixed seat 31 of the carrier 3. The pusher 32 is movable and the transfer mechanism can be extended to perform the placement of the substrate 2. In addition, the first gas passage 45 is sucked up and evacuated, so that the elastic pressing film 42 can be held at a position on the heat conducting portion 442 of the heating element 44, so that the heat conducting portion 442 can heat the portion 441. The generated heat source is transmitted to the elastic pressing film 42 to heat the elastic pressing film 42. After the driving mechanism drives the pushing member 32 to move upward from the folding position shown in FIG. 2 in the direction of the arrow I to the carrying position, the transfer mechanism can extend between the pressing plate 4 and the fixing base 31 to The material 2 and the pre-compressed film 1 pre-applied to the surface 22 of the substrate 2 are transferred to the pushing member 32 for carrying by the pushing member 32. The air is sucked downward through the air suction hole 321 of the pushing member 32, so that the base material 2 can be attracted to the top surface of the pushing member 32 by the groove portion 323. Next, as shown in FIG. 7, the driving mechanism drives the pushing member 32 to move downward from the carrying position in the direction of the arrow π. Since the substrate 2 is adsorbed by the groove portion 323 of the air suction hole 321, the downward movement is performed at 10 201219218. In the process, the substrate 2 can be prevented from being shaken. When the pusher 32 is moved down to the collapsed position, the substrate 2 will be applied against the top surface 311 of the heating element 316 below the fixed seat. The fixing base 31 further includes a second gas flow path 315 formed on the seat body 310 and the lower heating element 316. The second gas flow path 3 15 includes a hole 32 与 connected to the gas supply device, and a plurality of holes The groove portion 324 is formed on the top surface 311 and communicates with the hole portion 320. Each groove portion 324 is annularly shaped to inhale the substrate 2, so that the substrate 2 can be flatly attached to the fixing body 31. The top surface 311. As shown in FIG. 5 and FIG. 8, in step 52, the pressure-bonding disc 4 is pressed onto the carrier 3, and the elastic pressing film 42 of the pressing disc 4 is blown downward, and the elastic pressing film 42 presses the pre-pressing film 1 so that It is attached to the surface 22 of the substrate 2 (Fig. 1). The driving mechanism drives the pressing plate 4 to move downward in the direction of the arrow π, and the pressing ring 43 of the pressing plate 4 is pressed against the carrier 3 In the airtight ring 314 of the top surface 3, the chamber 5 formed between the press seat 4 and the carrier 3 is in an airtight state, wherein the airtight ring 314 is made of an elastic material such as rubber or silicone rubber. In the airtight state, the heating portion 44 of the upper heating element 44 generates a heat source such that the heat conducting portion 442 can heat the elastic pressing film 42, and the heating portion 317 of the lower heating element 316 also generates a heat source, so that the heat conducting portion 318 The substrate 2 can be heated. Next, as shown in FIG. 9 and FIG. 1A, the fixed seat body 31 further includes a third gas flow path 325 formed on the seat body 310. The third gas flow path milk includes a a hole portion 326 to which the gas supply device is connected, and a groove portion 327 formed between the outer periphery of the lower heating element 316 and the seat body 31〇, each groove The groove portion 327 has a circular shape for sucking the chamber 5 downward, and at the same time, the first gas flow path 45 of the press seat 4 11 201219218 blows the elastic pressure film 42 downward to release the vacuum state, thereby releasing the vacuum state. The elastic pressing film 42 presses down and presses the pre-compressed film 1 to adhere the pre-compressed film 1 to the surface 22 of the substrate 2. Since the elastic pressing film 42 is elastic and plastically deformable, the elastic laminating film When the gas is depressed by the first gas flow path 45 and the groove portion 327 of the third gas flow path 325, the elastic pressure film 42 can press the photoresist layer u of the pre-pressed film! onto the surface of the substrate 2. In the recess 221 of 22, the photoresist layer u can fill the uneven surface 22 of the substrate 2, whereby the gap between the photoresist layer u and the surface 22 of the substrate 2 can be reduced.
如圖5、圖11及圖12所示，如步驟幻，對彈性壓膜 42朝上吸氣，使彈性壓膜42與預壓薄膜ι分離。 透過第二氣體流道325的溝槽部327停止吸氣以及 第-氣體流道45向上吸氣，使得彈性壓膜42能被向上吸 附而與預壓薄膜i的保護層12分離，藉此，使彈性壓膜Μ 能回復到貼覆於上加熱元件44的導熱部442上的位置。 如圖5及圖13所示，如步驟dif ±tt nr κ 如步驟54,移離壓合盤4使其與 承載座3分離。As shown in Fig. 5, Fig. 11, and Fig. 12, as in the case of the step, the elastic pressing film 42 is sucked upward, and the elastic pressing film 42 is separated from the pre-pressing film ι. The air suction is stopped through the groove portion 327 of the second gas flow path 325 and the first gas flow path 45 is sucked upward, so that the elastic pressure film 42 can be adsorbed upward to be separated from the protective layer 12 of the pre-pressed film i, whereby The elastic film Μ can be returned to a position attached to the heat transfer portion 442 of the upper heating element 44. As shown in Figs. 5 and 13, the step dif ± tt nr κ is removed from the carrier 3 as in step 54 as shown in step 54.
藉由驅動機構帶動麼合盤4沿箭頭J方向上移，使壓 盤4回復到間隔位於承载座3上方的初始位置。 如圖5及圖U所示，如步驟55,將基材2及貼覆.於 材2的表面22的龍薄膜1頂離承載座3。 藉由第二氣體流道315 丨5的溝槽部324停止吸氣，使;j 基材2不會被吸附在頂面3 ^， 藉此，當驅動機構帶動頂4 件32沿箭頭I方向向上移 動時’預壓薄膜1及基材2能幸 12 201219218 易地被卿件32往上頂。當頂推件32上移至承載位置後 ’移載機構即可伸人壓合盤4與固定座體31之間將基材2 移離頂推# 32，此時，即完成預壓薄膜1的壓合作業。之 後’重覆步驟51〜55即可進行下—個預壓薄膜i與基材2 的壓合作業。 彈性塵臈42設計，當壓合盤4在壓合位置時，第—氣體流 道45會對彈性壓膜42朝下吹氣，彈性_ 42會向下磨迫 並擠壓預麼薄膜卜使預壓薄膜i的光阻層u被擠壓入基 歸納上述，本實施例的壓合裝置3〇〇，藉由壓合盤The drive plate 4 is moved upward in the direction of the arrow J by the driving mechanism to return the pressure plate 4 to the initial position at which the space is located above the carrier 3. As shown in Fig. 5 and U, as in step 55, the substrate 2 and the dragon film 1 attached to the surface 22 of the material 2 are lifted off the carrier 3. The suction is stopped by the groove portion 324 of the second gas flow path 315 丨 5 so that the substrate 2 is not adsorbed on the top surface 3 ^, whereby the driving mechanism drives the top member 32 in the direction of the arrow I When moving up, the pre-pressed film 1 and the substrate 2 can be fortunately 12 201219218. When the pushing member 32 is moved up to the carrying position, the transfer mechanism can extend between the pressing plate 4 and the fixing base 31 to move the substrate 2 away from the top pushing #32. At this time, the pre-pressing film 1 is completed. The pressure of cooperation. Thereafter, the steps 51 to 55 are repeated to perform the pressing operation of the lower pre-pressed film i and the substrate 2. The elastic dust mites 42 are designed. When the pressing plate 4 is in the pressing position, the first gas flow path 45 blows the elastic pressing film 42 downward, and the elastic _ 42 will be pressed downward and squeezed. The photoresist layer u of the pre-pressed film i is extruded into the base, and the pressing device 3 of the present embodiment is pressed by the pressing plate.
材2之表面22的凹部2心，使得光阻層u能填覆基材2 之表面22,藉此’能減少光阻層u與基材2之表面22間 的空隙，以提昇壓合的良率，故確實能達成本發明所訴求 之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與㈣，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是本發明壓合裝置的-較佳實施例的局部放大圖 ，說明預壓薄膜貼覆於基材上； 圖2是本發明壓合裝置的—較佳實施例的剖視示意圖 ’說明頂推件位在收合位置，壓合盤位在初始位置； 圖3是本發明壓合裝置的-較佳實施例的承載座的俯 視圖； 13 201219218 圖4是本發明壓合裝置的一較佳實施例的壓合盤的仰 視圖， 圖5是本發明壓合裝置的一較佳實施例的壓合方法流 程圖； 圖6是本發明壓合裝置的一較佳實施例的剖視示意圖 ，說明頂推件位在承載位置； 圖7是本發明壓合裝置的一較佳實施例的剖視示意圖 ，說明頂推件下移到收合位置； 圖8是本發明壓合裝置的一較佳實施例的剖視示意圖 ，說明壓合盤下移到壓合位置； 圖9是本發明壓合裝置的一較佳實施例的剖視示意圖 ，說明第一氣體流道對彈性壓膜朝下吹氣，彈性壓膜脅^向 下壓迫預壓薄膜使其貼覆在基材的表面； 圖10是本發明壓合裝置的一較佳實施例的局部放大圖 ’說明彈性壓膜將預壓薄膜的光阻層擠壓入基材表面的凹 部内； 圖11是本發明壓合裝置的一較佳實施例的剖視示意圖 ’說明第一氣體流道對彈性壓膜朝上吸氣； 圖12是本發明壓合裝置的一較佳實施例的局部放大圖 ’說明預壓薄膜的光阻層填覆於基材表面的凹部内； 圖13是本發明壓合裝置的一較佳實施例的剖視示意圖 ’說明壓合盤復位到初始位置；及 圖14是本發明壓合裝置的一較佳實施例的剖視示意圖 ’說明頂推件將基材及預壓薄膜頂推到承載位置。 14 201219218The concave portion 2 of the surface 22 of the material 2 enables the photoresist layer u to fill the surface 22 of the substrate 2, thereby reducing the gap between the photoresist layer u and the surface 22 of the substrate 2 to enhance the press-fit The yield is good, so it can achieve the purpose of the invention. The above is only the preferred embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and (4) according to the scope of the present invention and the description of the invention, All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partially enlarged view of a preferred embodiment of a press-fit apparatus of the present invention, illustrating a pre-pressed film attached to a substrate; FIG. 2 is a preferred embodiment of the press-fit apparatus of the present invention. Figure 2 is a plan view of the carrier of the preferred embodiment of the press-fit device of the present invention; 13 201219218 Figure 4 is a view of the present invention FIG. 5 is a bottom view of a press-fitted disc of a preferred embodiment of the press-fit apparatus, FIG. 5 is a flow chart of a press-fit method of a preferred embodiment of the press-fit apparatus of the present invention; FIG. 6 is a preferred embodiment of the press-fit apparatus of the present invention. FIG. 7 is a cross-sectional view of a preferred embodiment of the press-fit device of the present invention, illustrating the pusher member moved down to the collapsed position; FIG. 8 is a view of the embodiment; BRIEF DESCRIPTION OF THE DRAWINGS FIG. 9 is a cross-sectional view of a preferred embodiment of a compression device of the present invention, illustrating a first gas flow. FIG. The road blows the elastic film downward, and the elastic film presses down The pre-pressed film is applied to the surface of the substrate; FIG. 10 is a partially enlarged view of a preferred embodiment of the press-fit apparatus of the present invention, illustrating that the elastic film presses the photoresist layer of the pre-pressed film onto the surface of the substrate. Figure 11 is a cross-sectional schematic view of a preferred embodiment of the press-fit apparatus of the present invention illustrating the first gas flow path for inhaling the elastic film upward; Figure 12 is a preferred embodiment of the press-fit apparatus of the present invention. A partially enlarged view of the embodiment illustrates the photoresist layer of the pre-pressed film being filled in the recess of the surface of the substrate; FIG. 13 is a schematic cross-sectional view showing a preferred embodiment of the press-fit apparatus of the present invention The initial position; and Figure 14 is a cross-sectional schematic view of a preferred embodiment of the press-fit apparatus of the present invention illustrating the pusher pushing the substrate and the pre-compressed film to the load bearing position. 14 201219218
【主要元件符號說明】 1 ..........預壓薄膜 11 .........光阻層 12 .........保護層 2 ..........基材 21 .........凸部 22 .........表面 221 .......凹部 300 .......壓合裝置 3 ..........承載座 31.........固定座體 310 .......座本體 311 .......頂面 312……安裝槽 313 .......開口 314 .......氣密環 315 .......第二氣體流道 316 .......下加熱元件 317 .......加熱部 318 .......導熱部 319 .......隔熱部 320 .......孔部 32.........頂推件 321 .......吸氣孔 322 .......孔部 323……溝槽部 324……溝槽部 325 .......第三氣體流道 326 .......孔部 327……溝槽部 4 ..........壓合盤 41 .........座體 42 .........彈性壓膜 43 .........壓環 44 .........上加熱元件 441 .......加熱部 442 .......導熱部 443 .......隔熱部 45 .........第一氣體流道 5 ..........腔室 51〜55····步驟 I、II ••…箭頭 15[Description of main component symbols] 1 ..... pre-pressing film 11 ......... photoresist layer 12 ... ... protective layer 2 .... ...substrate 21 .........protrusion 22 ......... surface 221 .... recess 300 .... press Device 3 ..... bearing seat 31 ... ... fixed seat body 310 ... ... seat body 311 ... ... top surface 312 ... Mounting groove 313 . . . opening 314 .... airtight ring 315 .... second gas flow path 316 .... lower heating element 317 ... ....heating portion 318.......heat conducting portion 319.......insulating portion 320.......hole portion 32......pushing member 321 . . . the suction hole 322 .... the hole portion 323 ... the groove portion 324 ... the groove portion 325 ... ... the third gas flow path 326 ... .... hole portion 327...groove portion 4 ..........compression plate 41 .... seat body 42 .... elastic pressure Film 43 ... ... pressure ring 44 ... ... upper heating element 441 ... ... heating portion 442 ... ... heat conducting portion 443 ... ....insulation portion 45 ....the first gas flow path 5 ..... chamber 51~55····Step I, II ••...arrow 15