201220348 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種壓合機’特別是指一種用以將薄 膜壓合在基材上的壓合機及其壓合方法。 【先前技術】 目前半導體的微影製程中，將光阻依覆在晶圓上的方 式大致可分為濕式與乾式兩種，濕式是將液態光阻以旋塗 法塗佈在晶圓上，再以烘烤方式將液態光阻烘乾。乾式是 將乾膜光阻（Dry film resist)製成光阻帶，並經由壓合機將乾 膜光阻貼附在晶圓上，例如台灣專利第5〇231〇公告號（申 請案號為090130837)專利案所揭露的乾膜光阻之壓合裝置 〇 由於晶圓表面上會設有複數個高低不同的晶粒或者是 圖案（pattern)，使得晶圓表面是呈現凹凸不平的狀態因此 如何構思出一種能將乾膜光阻壓合並填覆在晶圓之表面 的壓合裝置設計，遂成為本發明要進一步改進的主題。 【發明内容】 本發明之主要目的，在於提供一種用以將薄膜壓合在 基材上並能將薄膜填覆於基材之表面的壓合機。 本發明之另一目的，在於提供一種壓合方法，透過先 將，專膜壓合於基材上後，再由薄膜上切割出與基材大小相 當的薄膜片體。 ^本發明的目的及解決先前技術問題是採用以下技術手 來實見的依據本發明所揭露的壓合機，包含一供料裝 201220348 置、一回收元件、一高度調整装置、一壓合裝置，及一切 割元件。 供料裝置提供一薄膜；回收元件與薄膜—端連接並可 回收薄膜：高度調整裝置設置於供料裝置與回收元件之間 ，高度調整裝置包括二相間隔且供薄膜纏繞的活動滚輪， 二活動滾輪可帶動薄膜在一第一高度位置，及一高度低於 第兩度位置的第一咼度位置之間移動；壓合裝置包括一 承載座及一壓合盤，承載座位於薄膜下方並可供一基材放 置，當溥膜在第二高度位置時，薄膜鄰近於基材表面；壓 合盤位於薄膜上方並包含一設置於底端的彈性壓膜及一 可對彈性壓膜吸氣或吹氣的第一氣體流道，壓合盤可在一 間隔位於承載座與薄膜上方的初始位置，及一壓合於承載 座且彈性壓膜壓迫薄膜使其貼覆於基材表面的壓合位置之 間往復運動；切割元件設置於壓合裝置一側，切割元件可 將薄膜貼覆於基材表面的部分切割，以形成一與基材大小 相當的薄膜片體。 本發明的目的及解決先前技術問題還可以採用以下技 術手段進一步實現。 高度調整裝置還包括一供薄膜纏繞的固定滾輪，二活 動滾輪與固定滾輪位在同一水平高度位置，二活動滾輪可 相對於固定滾輪移動，以帶動薄膜在第一、第二高度位置 之間移動。 薄膜纏繞在固定滾輪與其中一活動滾輪頂端，且薄膜 纏繞在其中另一活動滾輪底端。 201220348 承載座包含-供基材放置的固定座體及一設置於固 定座體内的頂推件，頂推件可在一凸伸出固定座體以承載 基材的承載位置，及一使基材貼覆於固定座體的收合位置 之間往復運動。 固疋座體包含一頂面，及一形成於頂面的第二氣體流 道，所述第二氣體流道可對基材吸氣。 固定座體還包含一形成於頂面的第三氣體流道，當壓 盤在壓^位置時’第二氣體流道可對壓合盤與承載座之 間所形成的一腔室吸氣。 固定座體還包含一用以供頂推件安裝的安裝槽，安裝 槽的一開口形成於頂面。頂推件包含一可吸附基材的吸氣 孔。 固疋座體還包含-可對基材加熱的下加熱元件，下加 熱元件包括-用以產生熱源的加熱部、一設置於加熱部頂 =可與基材接觸的導熱部，及—設置於加熱部底端的隔 承載座還包含-設置於固定座體上用以冷卻固 的冷卻元件。 體 墨合盤還包含一可對彈性虔膜加熱的上加熱元件，上 底端一用以產生熱源的加熱部、一設置於加熱部 隔:部^的導熱部’及一設置於加熱部頂端的 彈性壓膜為梦膠或橡勝材質。 依據本發明所揭露的塵合方法，適於將一薄膜堡合於 201220348 置放在一承載座上的一基材表面，該方法包含下述步驟： (A) 向下調整薄膜高度，使薄膜鄰近於基材表面； (B) 壓合一壓合盤於承載座上，對壓合盤的一彈性壓膜 朝下吹氣’彈性壓膜壓迫薄膜使其貼覆於基材表面； (C) 對彈性壓膜朝上吸氣，使彈性壓膜與薄膜分離，並 且移離壓合盤使其與承載座分離；及 (D) 切割薄膜貼覆於基材表面部分’以形成一與基材大 小相當的薄膜片體。 藉由上述技術手段，本發明光阻帶壓合機的優點及功 效在於，藉由壓合盤之彈性壓膜設計，當壓合盤在壓合位 置時，第一氣體流道會對彈性壓膜朝下吹氣，彈性壓膜會 向下壓迫並擠壓薄膜之第一保護層及光阻層，使光阻層被 擠壓入基材之表面，使得光阻層能填覆基材之表面，藉此 ，能減少光阻層與基材之表面間的空隙，以提昇壓合的良 率。再者，透過先將薄膜之苐一保護層及光阻層壓合於基 材的表面後，再由第一保護層及光阻層上切割出與基材大 小相當的薄膜片體的方式，能提昇薄膜之壓合過程的速率 ，以縮短壓合的工時。 【實施方式】 有關本發明《前述及其他技術内s、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。透過具體實施方式的說明，當可對本發明為 達成預定目的所採取的技術手段及功效得以更加深入且具 體的了解’ ^而所附圖式只是提供參考與說明之用，並非 201220348 用來對本發明加以限制。 在本發明被詳細描述之前’要注意的是’在以下的說 明内容中，類似的元件是以相同的編號來表示。 如圖1、圖2及圖3所示，是本發明壓合機的一較佳實 施例’該壓合機3〇〇主要是用以將一薄膜1壓合在一基材2 上’在本實施例中，薄膜1是以一光阻帶為例作說明，而 基材2是以一晶圓為例作說明，當然，薄膜1也可為保護 膜或其他形式的薄膜。圖1為薄膜1的局部剖視圖，薄膜工 包括一光阻層11、一貼覆於光阻層11頂面的第一保護層12 ’及一貼覆於光阻層11底面的第二保護層13，第一保護層 12的材質可為聚對苯二甲酸乙二酯（PET)，而第二保護層U 的材質可為聚乙烯（PE)，透過第一保護層12與第二保護層 ^的設置能對光阻層n提供保護的作用。圖2為基材2的 局4視圖，由於基材2上設置有複數個高低不同的凸部 21 ’前述凸部21可為晶粒或者是圖案（pattern)，使得基材2 的表面22是呈現凹凸不平的狀態，本實施例的壓合機 300是要將薄膜1的第二保護層13撕離光阻層u底面後， 再將薄獏1的光阻層11壓合於基材2的表面22。 如圖1及圖3所示，壓合機300包含一供料裝置3、一 回收凡件4、一高度調整裝置5、一切割元件6，及一壓合 裝f 70。供料裝置3包括-供應滾軸3卜—回收滾轴32， 及一撕離滾轴33 ’供應滚轴31上捲繞著薄膜】，供應滾抽 31可透過轉動將薄膜i沿箭頭A1輸出。撕離滾轴33設置 於供應滾軸31後側，並可將供應滾軸31輸出之薄膜丄的 201220348 蔓層13撕離，使得薄膜丨形成一第 以及被撕離下來的第二保護層13，. 第一保護層及光阻 ’透過回收滾軸32 第二保護層 層14，以石 的轉動使得被撕離下來的第二㈣層13可沿著箭頭Μ方201220348 VI. Description of the Invention: [Technical Field] The present invention relates to a press machine, particularly a press machine for pressing a film onto a substrate and a press-fitting method thereof. [Prior Art] At present, in the lithography process of semiconductor, the way of blocking the photoresist on the wafer can be roughly divided into wet type and dry type. The wet type is to apply liquid photoresist to the wafer by spin coating. On the top, the liquid photoresist is dried by baking. Dry type is a dry film resist made of a photoresist strip, and a dry film photoresist is attached to the wafer via a press machine, for example, Taiwan Patent No. 5, 231 〇 (No. 090130837) The dry film resistive pressing device disclosed in the patent 〇 has a plurality of different crystal grains or patterns on the surface of the wafer, so that the surface of the wafer is uneven and thus how A design of a press device capable of photo-resisting a dry film and filling it on the surface of a wafer has been conceived, and has become a subject of further improvement of the present invention. SUMMARY OF THE INVENTION A primary object of the present invention is to provide a press machine for pressing a film onto a substrate and filling the film on the surface of the substrate. Another object of the present invention is to provide a method of laminating a film sheet having a size corresponding to a substrate by first pressing a film onto a substrate. The object of the present invention and the prior art problem is a press machine according to the present invention, which comprises a supply device 201220348, a recovery component, a height adjustment device, and a press-fit device. And a cutting element. The feeding device provides a film; the recycling component is connected to the film end and the film can be recovered: the height adjusting device is disposed between the feeding device and the recycling component, and the height adjusting device comprises a movable roller which is separated by two phases and is wound by the film, and the movable activity The roller can drive the film to move between a first height position and a first temperature position lower than the second degree position; the pressing device comprises a bearing seat and a pressing plate, and the bearing seat is located under the film and For placing a substrate, when the ruthenium film is at the second height position, the film is adjacent to the surface of the substrate; the pressure plate is located above the film and comprises an elastic film disposed at the bottom end and a film that can be inhaled or blown to the elastic film a first gas flow path of the gas, the pressure plate can be at an initial position above the carrier and the film, and a pressing position pressed against the carrier and the elastic film pressing the film to adhere to the surface of the substrate The reciprocating motion is provided; the cutting element is disposed on one side of the pressing device, and the cutting element can cut a portion of the film attached to the surface of the substrate to form a film sheet having a size equivalent to the substrate. The object of the present invention and solving the prior art problems can be further achieved by the following technical means. The height adjusting device further comprises a fixed roller for winding the film, the movable roller and the fixed roller are at the same horizontal position, and the two movable rollers are movable relative to the fixed roller to drive the film to move between the first and second height positions. . The film is wound around the fixed roller and the top of one of the movable rollers, and the film is wound around the bottom end of the other movable roller. 201220348 The carrier includes a fixing base for the substrate and a pushing member disposed in the fixing body, and the pushing member can extend the fixing body to carry the bearing position of the substrate, and a base The material is reciprocated between the folded positions of the fixed seat. The solid body includes a top surface and a second gas flow path formed on the top surface, the second gas flow path for inhaling the substrate. The fixed seat body further includes a third gas flow path formed on the top surface. When the pressure plate is in the pressing position, the second gas flow path can inhale a chamber formed between the pressure plate and the carrier. The fixing base further includes a mounting groove for mounting the pushing member, and an opening of the mounting groove is formed on the top surface. The pusher member includes a suction hole for adsorbing the substrate. The solid body further comprises a lower heating element capable of heating the substrate, the lower heating element comprising: a heating portion for generating a heat source, a heat conducting portion disposed at the top of the heating portion = in contact with the substrate, and - disposed on The compartment of the bottom end of the heating portion further comprises a cooling element disposed on the fixing body for cooling. The body ink tray further comprises an upper heating element capable of heating the elastic diaphragm, a heating portion for generating a heat source at the upper bottom end, a heat conducting portion disposed at the heating portion and a top portion of the heating portion. The elastic film is made of Monster or Oak. The dusting method according to the present invention is suitable for placing a film film on 201220348 on a substrate surface of a carrier. The method comprises the following steps: (A) adjusting the film height downward to make the film Adjacent to the surface of the substrate; (B) pressing a press-fit disc on the carrier, blowing an elastic film against the pressing disc downwards, and pressing the elastic film to adhere the film to the surface of the substrate; Breathing the elastic film upward, separating the elastic film from the film, and moving away from the platen to separate from the carrier; and (D) dicing the film to the surface portion of the substrate to form a base A film sheet of comparable size. According to the above technical means, the advantages and effects of the photoresist strip press of the present invention are that, by the elastic lamination design of the press-disc, the first gas flow path will be elastically pressed when the press-disc is in the pressing position. The film is blown downward, and the elastic film presses down and compresses the first protective layer and the photoresist layer of the film, so that the photoresist layer is pressed onto the surface of the substrate, so that the photoresist layer can fill the substrate. The surface, by this, can reduce the gap between the photoresist layer and the surface of the substrate to improve the yield of the press. Furthermore, by laminating a protective layer and a photoresist of the film on the surface of the substrate, a film sheet having a size corresponding to the substrate is cut from the first protective layer and the photoresist layer. It can increase the rate of the film pressing process to shorten the pressing time. [Embodiment] The foregoing and other features, features, and advantages of the present invention will be apparent from the description of the appended claims. Through the description of the specific embodiments, the technical means and functions adopted by the present invention for achieving the intended purpose can be more deeply and specifically understood. The drawings are only for reference and explanation, and not 201220348 is used for the present invention. Limit it. Before the present invention is described in detail, it is to be noted that in the following description, similar elements are denoted by the same reference numerals. As shown in FIG. 1, FIG. 2 and FIG. 3, it is a preferred embodiment of the press machine of the present invention. The press machine 3 is mainly used for pressing a film 1 onto a substrate 2. In this embodiment, the film 1 is exemplified by a photoresist strip, and the substrate 2 is exemplified by a wafer. Of course, the film 1 may also be a protective film or other forms of film. 1 is a partial cross-sectional view of a film 1 including a photoresist layer 11, a first protective layer 12' attached to the top surface of the photoresist layer 11, and a second protective layer attached to the bottom surface of the photoresist layer 11. The material of the first protective layer 12 may be polyethylene terephthalate (PET), and the material of the second protective layer U may be polyethylene (PE), which is transmitted through the first protective layer 12 and the second protective layer. The setting of ^ can provide protection for the photoresist layer n. 2 is a partial view of the substrate 2, since the substrate 2 is provided with a plurality of protrusions 21 having different heights. The protrusions 21 may be grains or patterns, so that the surface 22 of the substrate 2 is In a state in which the unevenness is present, the press machine 300 of the present embodiment is to peel the second protective layer 13 of the film 1 away from the bottom surface of the photoresist layer u, and then press the photoresist layer 11 of the thin film 1 to the substrate 2 . Surface 22. As shown in Figs. 1 and 3, the press machine 300 includes a feeding device 3, a recycling member 4, a height adjusting device 5, a cutting member 6, and a press fitting f70. The feeding device 3 includes a supply roller 3 - a recovery roller 32, and a tearing roller 33 'a supply roller 31 is wound with a film", and the supply roller 31 can transmit the film i along the arrow A1 by rotation. . The tear-off roller 33 is disposed on the rear side of the supply roller 31, and can peel off the 201220348 vine layer 13 of the film bundle output from the supply roller 31, so that the film 丨 forms a second protective layer 13 which is peeled off and peeled off. The first protective layer and the photoresist 'transmitted through the recovery roller 32 and the second protective layer 14 are rotated by the stone so that the second (four) layer 13 which is torn off can be along the arrow
一保護層及光阻層14捲繞在一起。A protective layer and a photoresist layer 14 are wound together.
向輸送至回收滾車-。另外，第一保訇 回收元件4的轉| 中’回收元件4 且間隔位於薄膜1的第一保護層及光阻層14下方壓合盤 8間隔位於薄膜丨的第一保護層及光阻層14上方且對應於 承載座7上方的位置。承載座7包括一固定座體71，及一 設置於固定座體71内的頂推件72,固定座體71包含一座 本體710，及一設置於座本體71〇内用以對基材2(如圖幻加 熱的下加熱元件716，下加熱元件716包括一用以產生熱源 的加熱部717、一設置於加熱部717頂端並可與基材2接觸 的導熱部718，及一設置於加熱部717底端的隔熱部719， 固定座體71之導熱部718的一頂面711可供基材2放置， 導熱部718可將加熱部717所產生的熱源傳導至基材2,藉 此’可對基材2均勻地加熱。另外，隔熱部719則用以阻 隔加熱部717所產生的熱源向下發散，使得加熱部717的 熱源大部份都能有效地透過導熱部718的傳導而對基材2 加熱’藉此，能避免熱源的損失。 10 201220348 固定座體71的座本體71G以及下加熱元件716共同形 成—用以供頂推件72安裝的安裝槽712，安裝槽712、的二 開口 713形成於頂面711並可供頂推件72穿出。頂推件η 底舳與一驅動機構（圖未示）相連接，頂推件72可受驅動機 構帶動而在一凸伸出固定座體71的頂面711以承載基材2 的承載位置（如圖7所示）’及一使基材2貼覆於頂面711的 收合位置（如圖8所示）之間往復運動。#移載機構（圖未示） 將基材2平移至間隔承載座7上方一段距離時頂推件μ 能上移至承載位置以承載基材2,藉此’可縮短頂推件72 與基材2之間的距離，以避免移載機構在放置基材2於承 載座7之頂面711的過程中因為落摔而造成基材2受損的情 形產生。較佳地，頂推件72包含一吸氣孔72丨，吸氣孔 721包括一呈縱向延伸的孔部722(如圖7所示），及複數個 形成於頂端並與孔部722相連通的溝槽部723，各溝槽部 723呈圓環形並可吸附基材2，藉此，當頂推件72帶動基 材2在承載位置與收合位置之間移動的過程中，能避免基 材2產生晃動的情形。 如圖3及圖5所示’壓合盤8包含一座體81、一彈性 壓膜82及一壓環83 ,彈性壓膜82為矽膠或橡膠材質所製 成，彈性壓膜82外周緣是透過壓環83的壓合而固定在座 體81底面’使得彈性壓膜82能接合在座體81與壓環83 之間。壓合盤8還包含一設置於座體81内的上加熱元件84 ’上加熱元件84包括一用以產生熱源的加熱部841、一設 置於加熱部841底端與彈性壓膜82之間的導熱部842，及 201220348 —設置於加熱部841頂端的隔熱部843,導熱部842與彈性 壓膜82内表面接觸並可將加熱部841所產生的熱源傳導至 彈性虔膜82 ’藉此’可對彈性㈣82均勻地加熱。另外， 隔熱部843則用以阻隔加熱部841所產生的熱源向上發散 ，使得加熱部841的熱源大部份都能有效地透過導熱部842 的傳導而對彈性壓膜82加熱’藉此，能避免熱源的損失。 壓合盤8還包含一形成於座體81與上加熱元件84之 間的第-氣體流道85’第-氣體流道85的―端是與氣體供 應裝置（圖未示）相連接，而另一端則被彈性壓膜82所封閉 ，透過氣體供應裝置的控制使得第一氣體流道85可對彈性 壓膜82吸氣或吹氣，藉此，使得彈性壓膜82能貼覆於上 加熱元件84的導熱部842上，或者是與導熱部842分離而 凸伸出壓環83底面。另外，壓合盤8可透過驅動機構的帶 動在一間隔位於承載座7上方的初始位置（如圖3所示卜及 壓σ於承载座7的壓合位置（如圖所示）之間往復運動 ，當壓合盤8在壓合位置時，透過第一氣體流道85對彈性 壓膜82吹氣使得彈性壓膜82能壓迫薄膜i的第一保護層 及光阻層14使其貼覆在基材2的表面22(如圖2所示 高度調整裝置5包括二相間隔且鄰近於撕離滾軸33的 活動滾輪51、52，及一鄰近於回收元件4的固定滾輪兄， 二活動滾輪51、52及固定滾輪53用以供薄膜丨的第一保 護層及光阻層14纏繞，二活動滾輪51、52可相對於固定 滚輪53水平地移動，以帶動薄膜丨的第一保護層及光阻層 14在一第一高度位置（如圖3所示），及一高度低於第一高度 12 201220348 位置的第二高度位置（如圖9所示）之間移動。當在第一高度 位置時，第一保護層及光阻層14間隔位於承裁座7的上方 ，藉此，使得第一保護層及光阻層14與承载座7之間具有 空間可供移載機構伸入以進行基材2的置放動作。當在第 二高度位置時，第一保護層及光阻層14靠近承載座7並且 鄰近於基材2的表面22。 在本實施例t，二活動滚輪51、52與固定滾輪53位 鲁在同—水平高度位置，薄膜1的第一保護層及光阻層U纏 繞在固定滾輪53頂端與其中一活動滾輪51頂端，使得第 一保護層及光阻層14能被支撐在第一高度位置。由於第一 保護層及光阻層14穿過二活動滾輪51、52之間並且纏繞 在其中另一活動滾輪52底端，且活動滾輪52底端鄰近於 承載座7之固定座體71的頂面711，藉此，透過二活動滾 輪51、52水平地移動並朝固定滾輪53方向靠近，即可將 第—保護層及光阻層14下壓使其調整到第二高度位置。 • 以下將針對壓合機300的壓合方法進行詳細說明： 如圖3、圖6及圖7所示’圖6為薄膜！的壓合方法流 程圖’圖6的主要流程為： 如步驟91，透過承载座7承載基材2。 在使用壓合機300時，壓合盤8是在一間隔位於承載 座7上方的初始位置（如圖7所示），且二活動滾輪51、52 是在一鄰近於撕離滾軸33的第一位置，此時，活動滾輪Η 及固定;袞輪53可將第-保護層及光阻層14支樓在第—高 X位置，藉此，第一保護層及光阻層14與固定座體71之 13 201220348 間具有s間可供頂推件72活動，並且可供移載機構伸入以 進盯基材2的置放動作。另外，透過第一氣體流道85向上 吸氣並抽真空，使得彈性壓膜82能保持在貼覆於上加熱元 件84的導熱部842上的位置，藉此，以便於導熱部842能 將加熱部841產生的熱源傳遞至彈性壓膜82，以對彈性壓 膜82進行加熱。 藉由驅動機構帶動頂推件72由圖3所示的收合位置沿 箭頭I方向向上移動至承載位置後，移載機構能伸入第一保 護層及光阻層14與固定座體71之間，以將晶圓2移載至 頂推件72上供頂推件72承載。透過頂推件72的吸氣孔 721朝下吸氣，使得基材2能被溝槽部723吸附在頂推件 72的頂面。接著，如圖8所示，驅動機構會帶動頂推件u 由承載位置沿箭頭II方向向下移動，由於基材2被吸氣孔 721的溝槽部723所吸附，因此在下移過程中，能避免基材 2產生晃動的情形。當頂推件72向下移動到收合位置時， 基材2會貼覆在固定座體71之下加熱元件716的頂面7ιι 。固定座體71還包含一形成於座本體71〇與下加熱元件 716上的第二氣體流道715，第二氣體流道715包括一與氣 體供應裝置相連接的孔部720,及複數個形成於頂面711並 與孔部720相連通的溝槽部724,各溝槽部724呈圓環形用 以對基材2吸氣，使得基材2能平整地貼覆在固定座體7 j 的頂面711，以避免基材2只透過吸氣孔721吸附時會造成 外周圍處往上翹的情形。 如圖6及圖9所示，如步驟92，向下調整薄膜i高度 14 201220348 ，使薄膜1鄰近於基材2的表面22。 驅動供應滚軸31、回收滾軸32及回收元件4旋轉，使 得薄膜1的第-保護層及光阻層14能沿箭頭A3方向被輸 送至回收元件4上。接著，驅動二活動滾輪51、52由第一 位置沿箭頭A3方向水平移動，活動滾輪52在移動過程中 會逐漸地將第一保護層及光阻層14往下壓，待二活動滾輪 51、52移動到一鄰近於固定滾輪53的第二位置(如圓9所Transport to the recycling roller -. In addition, the first recovery layer 4 of the first recovery and recovery element 4 is separated from the first protective layer of the film 1 and the lower surface of the photoresist layer 14 is disposed at the first protective layer and the photoresist layer of the film stack. 14 above and corresponding to the position above the carrier 7. The mounting base 7 includes a fixing base 71 and a pushing member 72 disposed in the fixing base 71. The fixing base 71 includes a body 710, and is disposed in the seat body 71 for the base material 2 ( The lower heating element 716 includes a heating portion 717 for generating a heat source, a heat conducting portion 718 disposed at the top end of the heating portion 717 and in contact with the substrate 2, and a heat conducting portion 718 disposed on the heating portion. The heat insulating portion 719 at the bottom end of the 717, a top surface 711 of the heat conducting portion 718 of the fixing base 71 can be placed on the substrate 2, and the heat conducting portion 718 can conduct the heat source generated by the heating portion 717 to the substrate 2, thereby The heat insulating portion 719 is configured to block the heat source generated by the heating portion 717 from being diverged downward, so that most of the heat source of the heating portion 717 can effectively transmit through the heat conducting portion 718. The substrate 2 is heated 'by this, the loss of the heat source can be avoided. 10 201220348 The seat body 71G of the fixed seat 71 and the lower heating element 716 are jointly formed - a mounting groove 712 for mounting the pusher 72, the mounting groove 712, Two openings 713 are formed in the top surface 711 and are permeable to the pusher 72. The pusher η bottom 舳 is connected to a driving mechanism (not shown), and the pushing member 72 can be driven by the driving mechanism to protrude from the top surface 711 of the fixing base 71 to carry the bearing position of the substrate 2 (such as Figure 7) and a reciprocating motion between the folded position of the substrate 2 on the top surface 711 (as shown in Figure 8). #移移机构 (not shown) Translating the substrate 2 to the interval The pusher μ can be moved up to the carrying position to carry the substrate 2 at a distance above the carrier 7, whereby the distance between the pushing member 72 and the substrate 2 can be shortened to prevent the transfer mechanism from placing the substrate. 2, in the process of the top surface 711 of the carrier 7, the substrate 2 is damaged due to falling. Preferably, the pushing member 72 includes an air suction hole 72, and the air suction hole 721 includes a longitudinal direction. An extended hole portion 722 (shown in FIG. 7) and a plurality of groove portions 723 formed at the top end and communicating with the hole portion 722, each groove portion 723 being annular and capable of adsorbing the substrate 2 When the pushing member 72 drives the substrate 2 to move between the carrying position and the folding position, the situation in which the substrate 2 is shaken can be avoided. As shown in FIGS. 3 and 5 The pressing plate 8 includes a body 81, an elastic pressing film 82 and a pressing ring 83. The elastic pressing film 82 is made of silicone rubber or rubber material, and the outer peripheral edge of the elastic pressing film 82 is pressed by the pressing ring 83. The bottom surface of the base 81 is fixed such that the elastic pressing film 82 can be engaged between the seat body 81 and the pressure ring 83. The pressing plate 8 further includes an upper heating element 84 disposed in the base 81. The heating element 84 includes a A heating unit 841 for generating a heat source, a heat transfer portion 842 disposed between the bottom end of the heating portion 841 and the elastic pressing film 82, and 201220348, a heat insulating portion 843 provided at the top end of the heating portion 841, a heat conducting portion 842 and an elastic pressing film 82 The inner surface contacts and can conduct the heat source generated by the heating portion 841 to the elastic diaphragm 82', whereby the elastic (four) 82 can be uniformly heated. In addition, the heat insulating portion 843 is configured to block the heat source generated by the heating portion 841 from being diverged upward, so that most of the heat source of the heating portion 841 can effectively heat the elastic pressing film 82 through the conduction of the heat conducting portion 842. Can avoid the loss of heat source. The pressure plate 8 further includes a first gas passage 85' formed between the seat body 81 and the upper heating element 84. The end of the gas passage 85 is connected to a gas supply device (not shown). The other end is closed by the elastic pressing film 82, and the first gas flow path 85 can inhale or blow the elastic pressing film 82 through the control of the gas supply device, whereby the elastic pressing film 82 can be attached to the upper heating. The heat conducting portion 842 of the element 84 is separated from the heat conducting portion 842 and protrudes from the bottom surface of the pressing ring 83. In addition, the pressing disc 8 can be driven by the driving mechanism to reciprocate between an initial position above the bearing seat 7 (as shown in FIG. 3 and a pressure σ at the pressing position of the carrier 7 (as shown). Movement, when the pressing plate 8 is in the pressing position, the elastic pressing film 82 is blown through the first gas flow path 85 so that the elastic pressing film 82 can press the first protective layer and the photoresist layer 14 of the film i to be attached. On the surface 22 of the substrate 2 (the height adjusting device 5 shown in Fig. 2 comprises two movable rollers 51, 52 spaced apart from the tearing roller 33, and a fixed roller brother adjacent to the recycling member 4, The rollers 51 and 52 and the fixed roller 53 are used for winding the first protective layer and the photoresist layer 14 of the film stack, and the movable rollers 51 and 52 are horizontally movable relative to the fixed roller 53 to drive the first protective layer of the film stack. And the photoresist layer 14 moves between a first height position (as shown in FIG. 3) and a second height position (shown in FIG. 9) whose height is lower than the first height 12 201220348. When in the first In the height position, the first protective layer and the photoresist layer 14 are spaced apart above the socket 7. Therefore, a space is provided between the first protective layer and the photoresist layer 14 and the carrier 7 for the transfer mechanism to be inserted for the substrate 2 to be placed. When in the second height position, the first protective layer and The photoresist layer 14 is adjacent to the carrier 7 and adjacent to the surface 22 of the substrate 2. In the embodiment t, the two movable rollers 51, 52 and the fixed roller 53 are in the same horizontal position, and the first protective layer of the film 1 And the photoresist layer U is wound around the top end of the fixed roller 53 and the top end of one of the movable rollers 51, so that the first protective layer and the photoresist layer 14 can be supported at the first height position. Since the first protective layer and the photoresist layer 14 pass through Between the two movable rollers 51, 52 and wrapped around the bottom end of the other movable roller 52, and the bottom end of the movable roller 52 is adjacent to the top surface 711 of the fixed base 71 of the carrier 7, thereby passing through the two movable rollers 51, 52 moves horizontally and approaches the fixed roller 53 to press the first protective layer and the photoresist layer 14 to adjust to the second height position. The following describes the pressing method for the press 300 in detail. : As shown in Figure 3, Figure 6 and Figure 7, 'Figure 6 is the film! The main flow of the method flow diagram of FIG. 6 is as follows: The substrate 2 is carried through the carrier 7 as in step 91. When the press machine 300 is used, the pressure plate 8 is in an initial position above the carrier 7 at intervals ( As shown in FIG. 7 and the two movable rollers 51, 52 are in a first position adjacent to the tear-off roller 33, at this time, the movable roller is fixed and fixed; the wheel 53 can be used to protect the first protective layer and the photoresist The layer 14 is at the first-high X position, whereby the first protective layer and the photoresist layer 14 and the fixed seat body 71 13 201220348 have s between the movable members 72 and can be used for the transfer mechanism In addition, the action of placing the substrate 2 is performed. Further, the first gas flow path 85 is sucked up and evacuated, so that the elastic pressure film 82 can be held at a position attached to the heat transfer portion 842 of the upper heating element 84. Thereby, the heat transfer portion 842 can transfer the heat source generated by the heating portion 841 to the elastic pressure film 82 to heat the elastic pressure film 82. After the driving mechanism drives the pushing member 72 to move upward from the folding position shown in FIG. 3 in the direction of the arrow I to the carrying position, the transfer mechanism can extend into the first protective layer and the photoresist layer 14 and the fixed seat 71. In between, the wafer 2 is transferred to the pushing member 72 for carrying by the pushing member 72. The suction hole 721 of the pushing member 72 is sucked downward so that the substrate 2 can be attracted to the top surface of the pushing member 72 by the groove portion 723. Next, as shown in FIG. 8, the driving mechanism drives the pushing member u to move downward from the carrying position in the direction of the arrow II. Since the substrate 2 is adsorbed by the groove portion 723 of the suction hole 721, during the downward movement, It is possible to avoid the situation in which the substrate 2 is shaken. When the pusher 72 is moved down to the collapsed position, the substrate 2 will be applied to the top surface 7 of the heating element 716 below the fixed seat 71. The fixing base 71 further includes a second gas flow path 715 formed on the seat body 71 and the lower heating element 716. The second gas flow path 715 includes a hole portion 720 connected to the gas supply device, and a plurality of formations The groove portion 724 of the top surface 711 and communicating with the hole portion 720 is annular in shape for inhaling the substrate 2 so that the substrate 2 can be flatly attached to the fixing body 7 j The top surface 711 prevents the substrate 2 from being lifted up through the suction hole 721, causing the outer circumference to be upturned. As shown in Figures 6 and 9, as in step 92, the film i height 14 201220348 is adjusted downward to bring the film 1 adjacent to the surface 22 of the substrate 2. The supply supply roller 31, the recovery roller 32, and the recovery member 4 are rotated, so that the first protective layer and the photoresist layer 14 of the film 1 can be transported to the recovery member 4 in the direction of the arrow A3. Then, the two movable rollers 51, 52 are horizontally moved by the first position in the direction of the arrow A3, and the movable roller 52 gradually presses the first protective layer and the photoresist layer 14 downward during the movement, and the two movable rollers 51 are 52 moves to a second position adjacent to the fixed roller 53 (such as a circle 9
示)時，活動滾輪52及撕離滾軸33共同將第一保護層及光 阻層Η支樓在第二高度位置’使得第_保護層及光阻層μ 能鄰近於基材2的表面22並與表面22保持—段距離以 便於廢合盤8將第一保護層及光阻層14平整地壓合在基材 2的表面22,能防止壓合過程中第—保護層及光阻層^產 生敏折的情形。 ,π方！甘蛮8於承裁 對厂堅合盤8的彈性壓膜82朝下吹氣，彈性屡膜％ 壓迫溥臈1使其貼覆於基材2的表面22。 驅使供應滾轴31、时錄32及回收元件4停 層及光阻層14保持不動的狀態，接著，藉由 := 構帶動壓合盤8沿箭頭η方向下移，當壓合盤8的 的—將相！的第—保護層及光阻層ΐ4㈣於承載座7 之間：开Γ面711的氣密環714時1合盤8與承載座7 日斤形成的_腔冑9呈一氣密狀 是由橡膠切膠等彈性材w%714 熱元# μ 製成。在氣密狀態下，上加 的加熱部841會產生熱源，使得導熱部⑷能對 15 201220348 彈性壓膜82進行加熱，而下加熱元件716的加熱部η?也 會產生熱源，使得導熱部718能對基材2進行加熱。 接著，如圖11及圖12所示，固定座體71還包含一形 成於座本體71G上的第三氣體流道725，第三氣體流道725 包括一與氣體供應裝置相連接的孔部726，及一形成於下加 熱元件716外周圍與座本體71〇之間的溝槽部727，各溝槽 727呈圓％开^用以對腔室9向下吸氣，同時，壓合盤8 的第一氣體流道85會對彈性壓膜82朝下吹氣而解除真空 狀態，藉此，彈性壓膜82會向下壓迫並擠壓薄膜丨的第一 保護層及光阻層14，使光阻層11貼覆在基材2的表面22 上。由於彈性壓膜82具有彈性並且能塑性變形，因此，彈 性壓膜82受第一氣體流道85的氣體下壓以及第三氣體流 道725的溝槽部727吸附時，彈性壓膜82能將光阻層u擠 壓入基材2之表面22的凹部221内，使得光阻層u能填覆 基材2之凹凸不平的表面22,藉此，能減少光阻層u與基 材2之表面22間的空隙。 如圖6、圖13及圖14所示，如步驟94，對彈性壓膜 82朝上吸氣，使彈性壓膜82與薄膜1分離，並且移離壓合 盤8使其與承載座7分離。 透過第三氣體流道725的溝槽部727停止吸氣，以及 第一氣體流道85向上吸氣，使得彈性壓膜82能被向上吸 附而’、第保護層及光阻層14的第一保護層12分離，藉 此，使彈性壓膜82能回復到貼覆於上加熱元件84的導熱 部842上的位置。如圖15所示，藉由驅動機構帶動壓合盤 16 201220348 碟 8沿箭頭1方向上移’使壓合盤8回復到間隔位於承載座7 上方的初始位置。 如圖6、圖16及圖17所示，如步驟％，切割薄膜1 貼覆於基材2的表面22部分以形成一與基材2大小相當的 薄膜片體15。 s 切割元件6在本實施例中是以-切刀為例作說明，藉 由移載機構（圖未示）帶動切割元件6移動至第一保護層及光 ' 阻層14上，接著，帶動切割元件6沿箭頭m方向旋轉並 • 切割第一保護層及光阻層14貼覆於基材2的表面22部份 ，以形成-與基材2大小相當的薄膜片體15。需說明的是 ，在應用上，切割元件6也可透過雷射對第一保護層及光 阻層14進行裁切的動作，並不以切刀的形式為限。 如圖6及圖18所示，如步驟％，冷卻承載座7，向上 調整薄膜1高度，使薄膜1剝離承載座7 ^ 由於彈性壓膜82壓迫第一保護層及光阻層14於基材2 •鲁 的表面22過程中，受到上、下加熱元件84、716的加熱， 使得光阻層11會黏附在基材2的表面22以及承載座7之 固疋座體71的頂面711。因此，為了便於將光阻層u剝離 固定座體71的頂面7U，承載座7還包含一設置於固定座 體7丄上用以冷卻固定座體71的冷卻元件73，藉由冷卻元 件73冷卻固疋座體71，使得黏附在固定座體71的頂面 上的光阻層11溫度能夠下降。接著，二活動滾輪5卜52由 第二位置沿箭頭IV方向朝第一位置復位的過程中，二活動 滾輪51、52會旋轉且能輕易地將第—保護層及光阻層Μ 17 201220348 如離固定座體71的頂面711，並同時與貼覆於基材2的表 面22之薄膜片體15分離，待二活動滾輪m復位到第 位置時’第—保護層及光阻層14會完全剝離固定座體71 的頂面711並且與薄膜片體15分離。 如圖6及圖19所示，如步驟97，將基材2及貼覆於基 材2的表面22的薄膜片體15頂離承載座7。 藉由第一氣體流道715的溝槽部724停止吸氣，使得 基材2不會被吸附在頂面川，藉此，當驅動機構帶動頂推 件沿箭頭J方向向上移動時，基材2能輕易地被頂推件 /頂备頂推件72上移至承載位置後移載機構即可 伸入第—保護層及綠層14_定座體71之間將基材2 移離頂㈣72，此時，即完成薄膜1的壓合作業。之後， 重覆步驟91〜97即可進行薄膜i與下一個基材2的壓合作 業。 歸納上述，本實施例的壓合機300，藉由壓合盤8之彈 性壓膜82設計，杳厭人如_。+ 在壓合位置時，第-氣體流道 、性壓膜82朝下吹氣’彈性壓膜82會向下壓迫並 ㈣薄膜i之第一保護層及光阻層14，使光阻層^被擠壓 入基材2之表面22的凹部221内 9 ^ ^ 使得先阻層11能填覆基 材 面22，藉此，能減少光阻層11與基材2之表面22 間的空隙’以提昇壓合的良率。再者，透過先將薄… 第一保護層及光阻層14壓合於基材2的表面22後再由 第一保遵層及光阻層14上 Η雜15 W 刀以與基材2大小相當的薄膜 片體15的方式’能提㈣膜！之壓合過程的速率，以縮短 18 201220348 壓合的工時’故確貫能達成本發明所訴求之目的。 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請專利 範圍及發明說明内容所作之簡單的等效變化與修飾，皆仍 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖1是本發明壓合機的一較佳實施例的薄臈的局部剖 視圖； ® 圖2是本發明壓合機的一較佳實施例的基材的局部剖 視圖； 圖3是本發明壓合機的一較佳實施例的示意圖，說明 頂推件位在收合位置，壓合盤位在初始位置，薄膜的第一 保護層及光阻層位在第一高度位置； 圖4是本發明壓合機的一較佳實施例的承載座的俯視 圖； - 圖5是本發明壓合機的一較佳實施例的壓合盤的仰視 圖； 圖6是本發明壓合機的一較佳實施例的薄膜的壓合方 法流程圖； 圖7是本發明壓合機的一較佳實施例的示意圖，說明 頂推件位在承載位置； 圖8是本發明壓合機的一較佳實施例的示意圖，說明 頂推件下移到收合位置； 圓9是本發明壓合機的一較佳實施例的示意圖，說明 19 201220348 薄膜的第一保護層及光阻層位在第二高度位置； 圖1 〇是本發明壓合機的一較佳實施例的示意圖，說明 壓合盤下移到壓合位置； 圖11是本發明壓合機的一較佳實施例的示意圖，說明 第一氣體流道對彈性壓膜朝下吹氣，彈性壓膜會向下壓迫 薄膜的第一保護層及光阻層使其貼覆在基材的表面； 圖12是本發明壓合機的一較佳實施例的局部剖視圖， 說明彈性壓膜將光阻層擠壓入基材表面的凹部内； 圖13是本發明壓合機的一較佳實施例的示意圖，說明 第一氣體流道對彈性壓膜朝上吸氣； 圖14是本發明壓合機的一較佳實施例的局部剖視圖， 說明光阻層填覆於基材表面的凹部内； 圖15是本發明壓合機的一較佳實施例的示意圖，說明 壓合盤復位到初始位置； 圖16是本發明壓合機的一較佳實施例的示意圖，說明 切割元件裁切薄膜的第一保護層及光阻層； 圖17是本發明壓合機的一較佳實施例的示意圖，說明 第一保護層及光阻層上切割形成薄膜片體； 圖18是本發明壓合機的一較佳實施例的示意圖，說明 薄膜的第一保護層及光阻層復位到第—高度位置；及 圖19是本發明壓合機的一較佳實施例的示意圖，說明 頂推件將基材及薄膜片體頂推到承載位置。 20 201220348When the movable roller 52 and the tear-off roller 33 together, the first protective layer and the photoresist layer are at the second height position, so that the first protective layer and the photoresist layer μ can be adjacent to the surface of the substrate 2. 22 and maintaining a distance from the surface 22 so that the waste sealing disk 8 flatly presses the first protective layer and the photoresist layer 14 on the surface 22 of the substrate 2, thereby preventing the first protective layer and the photoresist during the pressing process. Layer ^ produces a situation of sensitive folding. , π side! Gan Man 8 is under the contraction. The elastic pressure film 82 of the factory holding plate 8 is blown downward, and the elastic film is pressed against the surface 22 of the substrate 2. Driving the supply roller 31, the recording 32 and the recovery element 4 to stop the layer and the photoresist layer 14 to remain stationary, and then: by: = constituting the dynamic compression plate 8 in the direction of the arrow n, when the disk 8 is pressed - will be phase! The first protective layer and the photoresist layer ΐ4 (4) are between the carrier 7: when the airtight ring 714 of the opening surface 711 is opened, the first disk 8 and the carrier 9 are formed in a gas-tight manner. Elastic material such as cut rubber is made of w%714 heat element # μ. In the airtight state, the applied heating portion 841 generates a heat source, so that the heat conducting portion (4) can heat the 15 201220348 elastic pressing film 82, and the heating portion η of the lower heating element 716 also generates a heat source, so that the heat conducting portion 718 The substrate 2 can be heated. Next, as shown in FIG. 11 and FIG. 12, the fixed seat body 71 further includes a third gas flow path 725 formed on the seat body 71G. The third gas flow path 725 includes a hole portion 726 connected to the gas supply device. And a groove portion 727 formed between the outer periphery of the lower heating element 716 and the seat body 71〇, each groove 727 is opened to draw the chamber 9 downward, and at the same time, the pressure plate 8 is pressed. The first gas flow path 85 blows the elastic pressing film 82 downward to release the vacuum state, whereby the elastic pressing film 82 presses down and presses the first protective layer of the film stack and the photoresist layer 14 so that the first gas flow path 85 is pressed downward. The photoresist layer 11 is attached to the surface 22 of the substrate 2. Since the elastic pressing film 82 is elastic and plastically deformable, when the elastic pressing film 82 is adsorbed by the gas of the first gas flow path 85 and the groove portion 727 of the third gas flow path 725, the elastic pressing film 82 can The photoresist layer u is extruded into the concave portion 221 of the surface 22 of the substrate 2, so that the photoresist layer u can fill the uneven surface 22 of the substrate 2, whereby the photoresist layer u and the substrate 2 can be reduced. A gap between the surfaces 22. As shown in FIG. 6, FIG. 13, and FIG. 14, as in step 94, the elastic pressing film 82 is sucked upward, the elastic pressing film 82 is separated from the film 1, and the pressing plate 8 is separated from the bearing block 7 to be separated from the carrier 7. . The suction is stopped through the groove portion 727 of the third gas flow path 725, and the first gas flow path 85 is sucked upward, so that the elastic pressure film 82 can be adsorbed upward, and the first protective layer and the photoresist layer 14 are first. The protective layer 12 is separated, whereby the elastic laminate 82 can be returned to a position that is attached to the heat transfer portion 842 of the upper heating element 84. As shown in Fig. 15, the drive mechanism drives the pressure plate 16 201220348 to move the disk 8 in the direction of the arrow 1 to return the pressure plate 8 to the initial position above the carrier 7. As shown in Figs. 6, 16, and 17, in step %, the dicing film 1 is applied to the surface 22 portion of the substrate 2 to form a film sheet 15 having a size equivalent to that of the substrate 2. In the embodiment, the cutting element 6 is exemplified by a cutter, and the cutting member 6 is driven to move to the first protective layer and the light resist layer 14 by a transfer mechanism (not shown), and then, The cutting member 6 is rotated in the direction of the arrow m and • the first protective layer and the photoresist layer 14 are cut over the surface 22 portion of the substrate 2 to form a film sheet 15 having a size equivalent to that of the substrate 2. It should be noted that, in application, the cutting element 6 can also cut the first protective layer and the photoresist layer 14 by laser, and is not limited to the shape of the cutter. As shown in FIG. 6 and FIG. 18, in step %, the carrier 7 is cooled, and the height of the film 1 is adjusted upward to peel the film 1 from the carrier 7 ^. The elastic film 82 presses the first protective layer and the photoresist layer 14 on the substrate. During the surface 22 of the Lu, the upper and lower heating elements 84, 716 are heated, so that the photoresist layer 11 adheres to the surface 22 of the substrate 2 and the top surface 711 of the solid body 71 of the carrier 7. Therefore, in order to facilitate the peeling of the photoresist layer u from the top surface 7U of the fixing body 71, the carrier 7 further includes a cooling element 73 disposed on the fixing body 7丄 for cooling the fixing body 71, by the cooling element 73. The solid seat body 71 is cooled so that the temperature of the photoresist layer 11 adhered to the top surface of the fixed seat body 71 can be lowered. Then, during the resetting of the second movable roller 5 52 from the second position in the direction of the arrow IV toward the first position, the two movable rollers 51 and 52 rotate and can easily remove the first protective layer and the photoresist layer 17 201220348. Separating from the top surface 711 of the fixed base 71 and simultaneously separating the film sheet 15 attached to the surface 22 of the substrate 2, when the movable roller m is reset to the first position, the first protective layer and the photoresist layer 14 The top surface 711 of the fixed seat body 71 is completely peeled off and separated from the film sheet body 15. As shown in Figs. 6 and 19, in step 97, the substrate 2 and the film sheet 15 attached to the surface 22 of the substrate 2 are lifted off the carrier 7. The suction is stopped by the groove portion 724 of the first gas flow path 715, so that the substrate 2 is not adsorbed on the top surface, whereby when the driving mechanism drives the pushing member to move upward in the direction of the arrow J, the substrate 2 can be easily moved up to the carrying position by the pushing/topping pushing member 72, and then the transfer mechanism can extend between the first protective layer and the green layer 14_the fixed body 71 to move the substrate 2 away from the top (4) 72. At this time, the press cooperation of the film 1 is completed. Thereafter, the press bonding of the film i and the next substrate 2 can be carried out by repeating steps 91 to 97. In summary, the press machine 300 of the present embodiment is designed by the elastic film 82 of the press-disc disc 8, which is annoying. + In the press-fit position, the first gas flow path and the pressure film 82 are blown downwards. The elastic pressure film 82 is pressed downward and (4) the first protective layer of the film i and the photoresist layer 14 are used to make the photoresist layer. The inside of the concave portion 221 of the surface 22 of the substrate 2 is extruded so that the first resist layer 11 can fill the substrate surface 22, whereby the gap between the photoresist layer 11 and the surface 22 of the substrate 2 can be reduced. To improve the yield of the press. Furthermore, by first pressing the first protective layer and the photoresist layer 14 onto the surface 22 of the substrate 2, the first protective layer and the photoresist layer 14 are doped with 15 W knives and the substrate 2 The way of the film body 15 of the same size can be raised (four) film! The rate of the press-fit process is shortened by 18 201220348 press-fitting hours, so that the object of the present invention can be achieved. The above is only the preferred embodiment of the present invention, and the scope of the invention is not limited thereto, that is, the simple equivalent changes and modifications made by the scope of the invention and the description of the invention are All remain within the scope of the invention patent. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial cross-sectional view of a thinner embodiment of a preferred embodiment of a press machine of the present invention; FIG. 2 is a partial cross-sectional view of a substrate of a preferred embodiment of the press of the present invention; 3 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating that the pusher is in the folded position, the press position is at the initial position, and the first protective layer and the photoresist layer of the film are at the first height position. Figure 4 is a plan view of a carrier of a preferred embodiment of the press of the present invention; - Figure 5 is a bottom plan view of a compression plate of a preferred embodiment of the press of the present invention; Figure 6 is a pressure of the present invention; Figure 7 is a schematic view of a preferred embodiment of the film of the present invention; Figure 7 is a schematic view of a preferred embodiment of the press of the present invention, illustrating the pusher position in the carrying position; Figure 8 is a press fit of the present invention. A schematic view of a preferred embodiment of the machine, illustrating that the pusher member is moved down to the collapsed position; the circle 9 is a schematic view of a preferred embodiment of the press machine of the present invention, illustrating the first protective layer and photoresist of the film of 201220348 The layer is at the second height position; Figure 1 is a preferred embodiment of the press machine of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 11 is a schematic view of a preferred embodiment of a press machine of the present invention, illustrating a first gas flow path for blowing an elastic film downward, elastic pressure The film presses down the first protective layer and the photoresist layer of the film to adhere to the surface of the substrate; FIG. 12 is a partial cross-sectional view of a preferred embodiment of the press machine of the present invention, illustrating that the elastic film will have a photoresist The layer is extruded into the recess of the surface of the substrate; Figure 13 is a schematic view of a preferred embodiment of the press of the present invention illustrating the first gas flow path for inhaling the elastic film upward; Figure 14 is a press fit of the present invention. A partial cross-sectional view of a preferred embodiment of the machine illustrating the photoresist layer being filled in a recess in the surface of the substrate; FIG. 15 is a schematic view of a preferred embodiment of the press of the present invention, illustrating the reduction of the press plate to the initial position Figure 16 is a schematic view of a preferred embodiment of the press of the present invention, illustrating the first protective layer and the photoresist layer of the cutting element; Figure 17 is a schematic view of a preferred embodiment of the press of the present invention. , indicating that the first protective layer and the photoresist layer are cut thinly Figure 18 is a schematic view of a preferred embodiment of the press of the present invention, illustrating that the first protective layer and the photoresist layer of the film are reset to the first height position; and Figure 19 is a comparison of the press machine of the present invention. A schematic diagram of a preferred embodiment illustrates the pusher pushing the substrate and the film sheet to the load bearing position. 20 201220348
【主要元件符號說明】 1 ......... •薄膜 710… •…座本體 11........ •光阻層 711… •…頂面 12........ •第 保護層 712… •…安裝槽 13........ •第二保護層 713… …·開口 14........ •第保5蒦層及光阻層 714… •…氣密環 15........ •薄膜片體 715… •…第二氣體流道 2 ......... •基材 716… •…下加熱元件 21........ •凸部 717… •…加熱部 22........ •表面 718… •…導熱部 221…… •凹部 719… •…隔熱部 300…… •壓合機 720… •…孔部 3 ......... •供料裝置 72…… •…頂推件 31........ -供應滚軸 721… •…吸氣孔 32........ •回收滾轴 722 ··· …·孔部 33........ •撕離滚軸 723 …·溝槽部 4 ......... •回收元件 724… •…溝槽部 5 ......... •高度調整裝置 725… •…第—氣體流道 51 、 52· •活動滾輪 726 ··· …·孔部 53........ •固定滚輪 727 ··· •…溝槽部 6 ......... •切割元件 73…… …·冷卻元件 70........ •壓合裝置 8 ....... …·壓合盤 7 ......... •承載座 81…… …·座體 71........ •固疋座體 82…… …·彈性壓膜 21 201220348 83…… •…壓環 9................腔室 84…… …·上加熱元件 A卜A2····箭頭 841… …·加熱部 A3 ........箭頭 842… …·導熱部 I、II ••…箭頭 843… …·隔熱部 III、IV··箭頭 85…… …·第一氣體流道 22[Description of main component symbols] 1 ......... • Film 710... • Seat body 11........ • Photoresist layer 711... • Top surface 12... .. • The first protective layer 712... • The mounting groove 13... • The second protective layer 713... The opening 14........ • The fifth layer and the photoresist layer 714... •...Airtight ring 15........ • Film sheet 715... •...Second gas flow path 2 ......... • Substrate 716... •... Lower heating element 21 ........ • convex part 717... •...heating part 22........ • surface 718... •...heat conducting part 221... • recessed part 719... •...insulating part 300... Press machine 720... •... hole part 3 ......... • Feeding device 72... •...Pushing piece 31........ - Supply roller 721... •...sucking Hole 32........ • Recycling roller 722 ····· hole portion 33........ • tearing off roller 723 ...·groove portion 4 ....... .. • Recycling element 724... •...groove part 5 ......... • height adjustment device 725... •...first gas flow path 51, 52· • movable roller 726 ····· hole 53........ • Fixed roller 727 ··· •...Ditch Part 6 ......... • Cutting element 73... ...·Cooling element 70........ • Pressing device 8 ........... Pressing plate 7 .. ....... • Carrier 81...... .... Seat 71........ • Solid body 82... ...· elastic film 21 201220348 83... •...pressure ring 9. ...............The chamber 84...the upper heating element Ab A2····the arrow 841...the heating part A3 ........the arrow 842 ...·heat conducting parts I, II ••...arrow 843...insulation part III, IV··arrow 85......first gas flow path 22