502310 A7 B7 五、發明說明（ 發明領域： 本發明係有關於一種乾膜光阻（dry filin resist ; DFR) 之壓合裝置，特別是有關於一種兼具習知用於乾膜光阻的 壓合機（laminator)與撕除機（]：emover)的功能之乾膜光阻之 壓合裝置。 發明背景： 在整個半導體的製程中，微影是舉足輕重的步驟之 一。舉凡與金氧半導體元件的結構有關的製程，大都是由 微影这個步驟所決定。因此可用一製程所需經過的微影次 數或所需要的光罩數量來表示此製程的難易程度。 微影的原理如下。事先需在晶圓的表面上覆上一層曝 光材料，此曝光材料稱為光阻。來自光源的平行光經過光 罩上的圖形後，打在光阻上，使光阻進行選擇性的曝光， 於是光罩上的圖形便完整的轉移至光阻上。 裝--------訂· (請先閱讀背面之注意事項再填冩本頁) 線 經濟部智慧財產局員工消費合作社印製 上述光阻依覆在晶圓上的方式不同而可分為溼與乾兩 大類。渔的方式係將原來液態之光阻以旋塗（spin c〇ating) 法塗佈在晶圓上’再以烘烤的方式將光阻中的水分去除β 乾的方式則係將乾膜光阻製成類似膠帶之光阻帶，並經由 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 502310502310 A7 B7 V. Description of the Invention (Field of the Invention: The present invention relates to a laminating device for dry film resist (DFR), and in particular to a press having a conventional pressure for dry film photoresist. Laminating and tearing-off (]: emover) function of a dry film photoresist pressure bonding device. BACKGROUND OF THE INVENTION: Lithography is one of the most important steps in the entire semiconductor manufacturing process. The manufacturing process of the component structure is mostly determined by this step of lithography. Therefore, the number of lithography or the number of photomasks required for a process can be used to indicate the difficulty of this process. The principle of lithography is as follows. The surface of the wafer needs to be covered with a layer of exposure material in advance. This exposure material is called photoresist. After the parallel light from the light source passes through the pattern on the photomask, it is hit on the photoresist to selectively expose the photoresist. Then the graphic on the photomask is completely transferred to the photoresist. Install -------- Order (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs Make the above light There are two types of resistance: wet and dry. The fishing method is to coat the original liquid photoresist on the wafer by spin coating, and then bake it. The baking method removes the water in the photoresist β. The dry method is to make the dry film photoresist into a photoresist tape similar to an adhesive tape, and this paper applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm). ) 502310
AT B7 五、發明說明（） 上 壓合機與撕除機的運作將此乾膜光阻貼在晶圓 印參考第1圖所繪示之習知乾膜光阻之光阻帶之剖面 圖。第1圖中的光阻帶10包括第一護膜12、光阻14、與 第二護膜16等三層結構。第一護膜12的材質例如可為聚 對笨一曱酸乙二酯（p〇lyethyiene terephthalate ; PET)，而第 二護膜16的材質例如可為聚乙烯（p〇lyethylene ; pE)。光阻 14位於第二護膜16上，且第一護膜12位於光阻14上。 第一護膜12與第二護膜16皆具有保護光阻14的作用。 經濟部智慧財產局員工消費合作社印製 上述光阻帶10必須經由壓合機與撕除機的作用方能將 第一護膜12及第二護膜16與光阻14分離並使光阻14貼 在晶圓上a請參考第2A圖至第2B圖所繪示之^知乾膜光 阻壓合機在運作時的兩種不同狀態的元件之相對位置關係 圖，其中此乾膜光阻壓合機包括移除頭2G、綠帶供應滾 袖30、晶圓桌50、第二護膜撕除滾軸7〇、第二護膜滾轴 U0、壓合頭130、切割裝置14〇、以及廢棄光阻帶滾軸Μ 等元件。由於習知乾膜綠壓合機在運作時部分元件會產 生相對運動而有位置的改變，因此有必要藉第Μ圖至第 2B圖說明兩種不同狀態的元件之相對位置關係圖。第2A 圖係繪示習知乾膜光阻之壓合機啟動時之初始狀態。接 著，移除頭20向左移動且光阻帶供應滾軸3〇開始轉動以 供應全新的光阻帶4〇。接著，晶圓桌與晶圓60向上升 502310 A7 B7 五、發明說明（） 起。原為三層的光阻帶40在光阻帶供應滾軸30及其它元 件轉動的過程中被第二護膜撕除滾軸7 〇撕開後分成如箭 號80與箭號90之兩條路線繼續行進。第一護膜及光阻1〇〇 依箭號80之路線行進，且廢棄的第二護膜110依箭號90 之路線繼續行進，最後會到達第二護膜滾軸1 20。然後， 壓合頭1 3 0向左移動。此時，元件之相對位置如第2B圖所 繪示且第一護膜及光阻100已壓合於晶亂60上。 接著，以切割裝置140對晶圓60上的第一護膜及光阻 100進行切割，使此第‘ 一護膜及光阻100上產生與晶圓60 相同形狀之割痕。接著，移除頭20與壓合頭130向右移動。 接著，晶圓桌50與晶圓60下降，此時晶圓60上便壓合一 層第一護膜及光阻100且元件之相對位置又回復至如第2A 圖所繪示。此外，廢棄光阻帶丨60依箭號丨7〇之路線繼讀 行進，最後會到達廢棄光阻帶滾軸1 5 0。 經濟部智慧財產局員工消費合作社印製 上述製程中雖已壓合一層第一護膜及光阻1〇〇於晶圓 60上，但必須進一步將晶圓6〇移至撕除機以撕除第一護 膜，才算真正完成乾膜光阻的壓合工作。請參考第3A圖至 第3B圖所繪示之習知乾膜光阻撕除機在運作時的兩種不 同狀態的元件之相對位置關係圖，其中此乾膜光阻撕除機 包括晶圓桌180、撕除頭19〇、膠帶供應滾軸2〇〇、以及廢 棄膠帶滾軸210等元件。由於習知乾膜光阻撕除機在運作 4 經濟部智慧財產局員工消費合作社印製 502310 Α7 Β7 五、發明說明（） 時部分元件會產生相對運動而有位置的改變，因此有必要 藉第3A圖至第3B圖進一步說明兩種不同狀態的兀件之相 對位置關係圖。第3 A圖係繪示習知乾膜光阻之撕除機啟動 時之初始狀態。晶圓桌18〇與晶圓6〇向上升起。接著，撕 除頭1 9 0向右移動^此時’元件之相對位置如第3 B圖所繪 示。 接著，膠帶供應滚軸200開始轉動’便可以膠帶220 將晶圓60上的第一護膜撕離。然後，第一護膜及膠帶230 依箭號240之路線行進，最後會到達廢棄膠帶滾軸210。 接著，晶圓桌180與晶圓60下降。接著’撕除頭190向左 移動。此時，元件之相對位置又回復至如第2A圖所繪示。 上述習知用來貼合乾膜光阻於晶圓上的壓合機與撕除 機係為置於兩地之不同機台。當晶圓在壓合機完成第一護 膜及光阻的壓合工作後，尚需由操作員以人工方式將置於 晶圓匣中的晶圓搬運至撕除機中以進行第一護膜的撕除工 作。如此做法不僅浪費時間，而且間接增加生產成本。因 此有必要尋求解決之道。 發明目的及概述： 蓉於上述發明背景中，習知用於乾膜光阻的壓合機與 本紙張尺度適財_家標準（CI^S)A4規格（21G χ 297公餐） ---------------------訂--------- (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 502310 五、發明說明（ 撕除機之缺點，因&太I λ U此本發明之一目的為提供一種乾膜光阻 之壓合裝置，可用以減少操作時間。 本發月之另一目的為提供一種乾膜光阻之壓合裝置， 可用以增加每小時晶圓數量。 本發明之又一目的為提供一種乾膜光阻之壓合裝置， 可用以降低生產成本。 依據本發明之上述目的，因此本發明提供一種乾膜光 阻之壓合裝置α本發明之乾膜光阻之壓合裝置適用於具有 第一護膜、光阻、以及第二護膜之光阻帶與晶圓，且此光 阻係壓合於此晶圓上，其中此乾膜光阻之壓合裝置至少包 括：光阻帶供應滾軸，其中光阻帶係纏繞於此光阻帶供應 滾軸上；第二護膜撕除滾軸；第二護膜滾轴，其中被第二 護膜撕除滾軸所撕除之第二幾膜係纏繞於第二護膜滾軸 上；壓合頭’係用以將第一護膜與光阻壓合於晶圓上；第 一護膜撕除頭’係用以在第一護膜與光阻壓合於晶圓上之 後將第一護膜撕除；切割裝置，係用以切割晶圓上之光阻； 以及廢棄光阻帶滾軸，係用以纏繞切割光阻後未壓合於晶 圓上之部分光阻。 圖式簡單說明·· 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公f ) -------------裝------Γ—訂---------線 I (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工漭費合作社印製 502310 A7 _B7___ 五、發明說明（） 本發明的較佳實施例將於往後之說明文字中辅以下列 圖示做更詳細的闡述，其中： 第1圖係繪示習知乾膜光阻之光阻帶之剖面圖； 第2A圖及第2B圖係繪示習知乾膜光阻壓合機之示意 圖； 第3A圖及第3B圖係繪示習‘乾膜光阻撕除機之示意 圖；以及 第4A圖至第4C圖係繪示本發明之一較佳實施例之乾 膜光阻壓合裝置之示意圖。 圖號對照說明： 10 光阻帶 12 第一護膜 14 光阻 16 第二護膜 20 移除頭 30 光阻帶供應滾軸 40 光阻帶 50 晶圓桌 60 晶圓 70 第二護膜撕除滾軸 80 前齋 90 箭號 100 第一護膜及光阻 110 第二護膜 120 第二護膜滾軸 130 壓合頭 140 切割裝置 150 廢棄光阻帶滾轴 7 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -HI、 τ ϋ «ϋ In i^i Mmmammm n amm§ iamt —am— amMmme Mmmmmmm tmmmm $ « 8— n« imam& i mmm§ an ·ι · 1« 1 ·ϋ Mmmmt Mmm§ Mmmm9 tmm§ I (請先閱讀背面之注意事項再填寫本頁) 502310 A7 ___— —_Β7五、發明說明（) 160 廢 棄 光 阻 帶 170 箭 號 180 晶 圓 桌 190 撕 除 頭 200 膠 帶 供 應 滾 軸 210 廢 棄 膠 帶 滾軸 220 膠 帶 230 第 一 護 膜 及 膠 帶 240 箭 號 320 移 除 頭 330 光 阻 帶 供 應 滾 軸 340 光 阻 帶 350 晶 圓 桌 360 晶 圓 370 第 二 護 膜 撕 除 滾軸 380 箭 號 390 箭 號 400 第 一 護 膜 及 光 阻 410 第 二 護 膜 420 第 二 護 膜 滾 軸 430 壓 合 頭 440 切 割 裝 置 450 廢 棄 光 阻 帶 滾 軸 490 第 一 護 膜 撕 除 頭 500 第 一 護 膜 510 廢 棄 光 阻 帶 520 光 阻 530 箭 號 發明詳細說明： -----------—--------—訂. (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印！^ 本發明係有關.於一種兼具習知用於乾膜光阻 與撕除機的功能之乾膜光阻之壓合裝置。如前述第丨圖所 繪示之習知乾膜光阻之光阻帶之剖面圖所示，光阻帶丨〇係 由第一護膜12、光阻14、以及第二護膜16等三層所組成， 其甲第一護膜U之材質例如可為聚對苯二甲酸乙二醋，以 及第二護膜16之材質例如可為聚乙烯。本發明之乾膜光阻 的壓合機AT B7 V. Description of the invention (above) The operation of the laminator and the tear-off machine affixes this dry film photoresist to a wafer. The cross-sectional view of the photoresist band of the conventional dry film photoresist shown in Figure 1 is printed. The photoresist tape 10 in the first figure includes a three-layer structure including a first protective film 12, a photoresist 14, and a second protective film 16. The material of the first protective film 12 may be, for example, polyethyiene terephthalate (PET), and the material of the second protective film 16 may be, for example, polyethylene (pelyethylene; pE). The photoresist 14 is located on the second protective film 16, and the first protective film 12 is located on the photoresist 14. Both the first protective film 12 and the second protective film 16 have a function of protecting the photoresist 14. The above-mentioned photoresist tape 10 must be printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs in order to separate the first protective film 12 and the second protective film 16 from the photoresist 14 and the photoresist 14 Please refer to Figure 2A to Figure 2B for the relative positional relationship diagram of the two different states of the dry film photoresistor when the dry film photoresistor is in operation. The laminator includes a removal head 2G, a green belt supply sleeve 30, a wafer table 50, a second pellicle tearing roller 70, a second pellicle roller U0, a nip 130, a cutting device 14, and Discard the photoresist tape roller M and other components. Because the conventional dry film green laminator is in operation, some components will have relative movement and change in position. Therefore, it is necessary to use Figures M to 2B to explain the relative positional relationship diagrams of the components in two different states. Figure 2A shows the initial state of a conventional dry film photoresist laminator when it is started. Next, the removal head 20 moves to the left and the photoresist tape supply roller 30 starts to rotate to supply a brand new photoresist tape 40. Next, the wafer table and wafer 60 rise upward. 502310 A7 B7 V. Description of the invention (). The original three-layer photoresist tape 40 was removed by the second protective film during the rotation of the photoresist tape supply roller 30 and other components. The roller 7 was split into two such as arrow 80 and arrow 90. The route continues. The first protective film and photoresistor 100 traveled along the route of arrow 80, and the abandoned second protective film 110 continued on the route of arrow 90, and finally reached the second protective film roller 120. Then, the pressing head 130 moves to the left. At this time, the relative positions of the components are as shown in FIG. 2B and the first protective film and the photoresist 100 have been pressed onto the crystal disorder 60. Next, the first protective film and the photoresist 100 on the wafer 60 are cut by the dicing device 140, so that a cut of the same shape as that of the wafer 60 is generated on the first protective film and the photoresist 100. Then, the removal head 20 and the pressing head 130 are moved to the right. Then, the wafer table 50 and the wafer 60 are lowered. At this time, a layer of the first protective film and the photoresist 100 are laminated on the wafer 60 and the relative positions of the components are restored as shown in FIG. 2A. In addition, the discarded photoresist tape 丨 60 continues to read according to the route of the arrow 丨 70, and finally reaches the discarded photoresist tape roller 150. Although printed by the consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, a layer of the first protective film and photoresist 100 are laminated on the wafer 60 in the above process, the wafer 60 must be further moved to a tearing machine to remove The first protective film can really be considered as the pressing of the dry film photoresist. Please refer to the relative positional relationship diagrams of the components in two different states of the conventional dry film photoresist in operation shown in FIGS. 3A to 3B. The dry film photoresist includes a wafer table 180, The components such as the peeling head 19, the tape supply roller 200, and the discarded tape roller 210 are removed. As the conventional dry film photoresistive tearing machine is in operation 4 printed by 502310 Α7 Β7 of the Intellectual Property Bureau employee consumer cooperative of the Ministry of Economic Affairs 5. Description of the invention () Some components will have relative movement and position changes, so it is necessary to borrow Figure 3A FIG. 3 to FIG. 3B further illustrate the relative positional relationship diagrams of the elements in two different states. Figure 3A shows the initial state when the conventional dry film photoresist tear-off machine is started. The wafer table 18 and the wafer 60 rise upward. Next, the removal head 190 is moved to the right ^ At this time, the relative position of the 'component is as shown in Fig. 3B. Then, the tape supply roller 200 starts to rotate ', and the first protective film on the wafer 60 can be peeled off by the tape 220. Then, the first protective film and the adhesive tape 230 follow the route of the arrow 240, and finally reach the waste tape roller 210. Then, the wafer table 180 and the wafer 60 are lowered. Then the 'peeling head 190 moves to the left. At this time, the relative positions of the components return to those shown in FIG. 2A. The above-mentioned conventional laminator and peeler used for laminating dry film photoresist on wafers are different machines placed in two places. After the first laminating film and photoresist are pressed in the laminator, the operator still needs to manually transfer the wafers placed in the wafer cassette to the tear-off machine for the first protection. Film tearing work. This approach not only wastes time, but also indirectly increases production costs. It is therefore necessary to find a solution. Purpose and summary of the invention: In the above background of the invention, Rong is familiar with the laminator for dry film photoresistors and the paper size suitable financial standard _ home standard (CI ^ S) A4 specification (21G χ 297 meals) --- ------------------ Order --------- (Please read the precautions on the back before filling out this page) Manufacturing 502310 V. Description of the invention (the shortcomings of the tear-off machine, because & too I λ U. One of the purposes of the present invention is to provide a dry film photoresistive lamination device, which can be used to reduce the operating time. Another one of this month The purpose is to provide a dry film photoresist pressing device, which can be used to increase the number of wafers per hour. Another object of the present invention is to provide a dry film photoresist pressing device, which can be used to reduce production costs. The above purpose, therefore, the present invention provides a dry film photoresist pressing device α The dry film photoresist pressing device of the present invention is suitable for a photoresist band and a crystal having a first protective film, a photoresist, and a second protective film Round, and the photoresist is laminated on the wafer, where the dry film photoresist pressing device at least includes: photoresist tape supply Shaft, in which the photoresist tape is wound on the photoresist tape supply roller; the second protective film removing roller; the second protective film roller, wherein the second protective film removing roller is the second Several films are wound on the second protective film roller; the pressing head is used for pressing the first protective film and the photoresist onto the wafer; the first protective film removing head is used for the first protective film After the film and the photoresist are laminated on the wafer, the first protective film is removed; the cutting device is used to cut the photoresist on the wafer; and the discarded photoresist tape roller is used to wind the cut photoresist. Part of the photoresist laminated on the wafer. Brief description of the drawing ·· This paper size applies to China National Standard (CNS) A4 (210 X 297 male f) ------------- ------ Γ—Order --------- Line I (Please read the notes on the back before filling out this page) Printed by the Employees ’Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 502310 A7 _B7___ V. Invention Explanation () The preferred embodiment of the present invention will be described in more detail in the following explanatory text with the following diagrams, in which: Figure 1 is a sectional view showing a photoresist band of a conventional dry film photoresist; 2A And Figure 2B is a schematic diagram of a conventional dry film photoresist laminating machine; Figures 3A and 3B are schematic diagrams of a conventional dry film photoresist tearing machine; and Figures 4A to 4C are diagrams Schematic diagram of a dry film photoresistive lamination device according to a preferred embodiment of the present invention. Comparative illustration of drawing numbers: 10 photoresist tape 12 first protective film 14 photoresist 16 second protective film 20 removal head 30 photoresist tape supply Roller 40 Photoresist tape 50 Wafer table 60 Wafer 70 Second protective film removal roller 80 Qianzhai 90 Arrow 100 First protective film and photoresist 110 Second protective film 120 Second protective film roller 130 Lamination Head 140 Cutting device 150 Abandoned photoresist tape roller 7 This paper size applies to Chinese National Standard (CNS) A4 (210 X 297 mm) -HI, τ ϋ «ϋ In i ^ i Mmmammm n amm§ iamt —am— amMmme Mmmmmmm tmmmm $ «8— n« imam & i mmm§ an · ι · 1 «1 · ϋ Mmmmt Mmm§ Mmmm9 tmm§ I (Please read the precautions on the back before filling out this page) 502310 A7 ___ — —_Β7 五、 Explanation of the invention () 160 waste photoresist tape 170 arrow 180 wafer table 190 tearing head 200 Tape supply roller 210 Discarded tape roller 220 Tape 230 First protective film and tape 240 Arrow 320 Removal head 330 Photoresist tape supply roller 340 Photoresist tape 350 Wafer table 360 Wafer 370 Second protective film removal Roller 380 Arrow 390 Arrow 400 First protective film and photoresist 410 Second protective film 420 Second protective film roller 430 Pressing head 440 Cutting device 450 Discarded photoresist tape roller 490 First protective film removing head 500 First protective film 510 Abandoned photoresist tape 520 Photoresist 530 Arrow invention detailed description: ----------------------- Order. (Please read the note on the back first Please fill in this page for matters) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs! ^ The present invention relates to a lamination device for a dry film photoresist that has the functions of a conventional dry film photoresist and a tearing machine. As shown in the sectional view of the photoresist band of the conventional dry film photoresist shown in the previous figure, the photoresist band is composed of a first protective film 12, a photoresist 14, and a second protective film 16. The material of the first protective film U may be, for example, polyethylene terephthalate, and the material of the second protective film 16 may be, for example, polyethylene. Pressing machine for dry film photoresist of the present invention
線 502310 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（） 之壓合裝置係用於先後將第二護膜16與第一護膜12撕除 並將光阻14壓合於晶圓上。請參考第4A圖至第4C圖所 緣示之本發明之一較佳實施例之乾膜光阻壓合裝置之示意 圖。此第4A圖至第4C圖係繪示本發明之一較佳實施例在 運作時的三種不同狀態的元件之相對位置關係圖，其中此 乾膜光阻之壓合裝置至少包括光阻帶供應滾軸33〇、第二 護膜撕除滾軸370、第二護膜滾軸420、壓合頭430、第一 護膜撕除頭490、切割裝置440、移除頭320以及廢，棄光阻 帶滾軸450等元件。以下說明這些元件間的用途以及連接 關係。 光阻帶供應滾轴3f〇係用以纏繞全新的光阻帶34〇。第 二護膜撕除滾軸370的數目為複數個，例如可為二個，係 用以使原·為三層的光阻帶340撕開後分成如箭號3 8〇與箭 號3 90之兩條路線繼續行進。第一護膜及光阻4〇〇依箭號 380之路線行進，且第二護膜41〇依箭號3 9〇之路線行進。 第二護膜滾轴420係用以纏繞被第二護膜撕除滾軸37〇所 撕除之第二護膜410。壓合頭43〇係用以將第一護膜及光 阻400壓合在置於晶圓桌35〇之晶圓36〇上。 本發明之最主要特徵係為第一護膜撕除頭49〇,用以在 第一護膜與光阻400壓合於晶圓36〇上之後將第一護膜5〇〇 撕除。此外’切割裝置440係用以切割晶圓36〇上之光阻 本紙張尺度顧帽目家標準（CNS)A4規格（210 X 297公f ) n n i i n tn n IK n i iammm n I · n ϋ If t_l i n n 一 of I n fn ϋΒ nv ί ·ϋ I (請先閱讀背面之注意事項再填寫本頁) 502310 A7 —---------- —_B7______ 五、發明說明（） 5 2 〇 ’其中此切割裝置例如可使用雷射進行切割。移除頭 320係用以移除切割後剩下的廢棄光阻帶$ 1 〇。廢棄光阻帶 滾轴450係用以纏繞切割光阻520後未壓合於晶圓360上 之部分光阻520 〇 由於本發明在運作時部分元件會產生相對運動而有位 置的改變，因此有必要藉第4A圖至第4C圖進一步說明三 種不同狀態的元件之相對位置關係圖。第4a圖係繪示本發 明之乾膜光阻之壓合裝置啟動時之初始狀態。移除頭32〇 向左移動。接著，第一護膜撕除頭490亦向左移動且光阻 帶供應滾軸330開始轉動以供應全新的光阻帶340。接著， 晶圓桌3 5 0與晶圓3 6 0向上升起。此時，元件之相對位置 如第4B圖所繪示。此外，原為三層的光阻帶34〇在光阻帶 供應滾軸330及其它元件轉動的過程中被第二護膜撕除滾 軸370撕開後分成如箭號380與箭號39〇之兩條路線繼續 行進。第一護膜及光阻400依箭號380之路線行進，且廢 棄的、第二濩膜4 1 0依箭號3 90之路線繼續行進，最後會到 達第二護膜滾軸420。 經濟部智慧財產局員工消費合作社印製 然後’壓合頭430向左移動。接著，壓合頭43〇向右 移動。經由此壓合頭〃 430的左右移動，便可將第一護膜及 光阻4〇〇壓合务晶圓360上。接著，第一護膜撕除頭 向右移動且開始轉動，便可將第一護膜5〇〇撕除。此時， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 502310 A7 B7 五、發明說明（） 元件之相對位置如第4 C圖所繪示β接著，以切割裝置4 4 0 對晶圓360上的光阻52〇進行切割，使此光阻52〇上產生 與晶圓360相同形狀之割痕。接著，移除頭32〇向右移動。 接著，晶圓桌3 50與晶圓360下降，此時晶圓360上便壓 合一層光阻520且元件之相對位置又回復至如第4Α圖所繪 示。此外，廢棄光阻帶510依箭號530之路線繼續行進， 最後會到達廢棄光阻帶滾軸450。 綜合上述，本發明之乾膜光阻之壓合裝置的優點為可 減少操作時間、增加每小時晶圓數量、以及降低生產成本 等。 如熟悉此技術之人員所瞭解的，以上所述僅為本發明 之較佳實施例而已，並非用以限定本發明之申請專利範 圍；凡其它未脫離本發明所揭示之精神下所完成之等效改 變或修飾，均應包含在下述之申請專利範圍内。 -------------裝·------—訂---------線 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用令國國家標準（CNS)A4規格（210x 297公t )Line 502310 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention The compression device is used to tear off the second protective film 16 and the first protective film 12 and press the photoresist 14 on On the wafer. Please refer to FIGS. 4A to 4C for a schematic diagram of a dry film photoresistive lamination device according to a preferred embodiment of the present invention. Figures 4A to 4C are diagrams showing the relative positional relationship of three different states of the components during operation of a preferred embodiment of the present invention. The dry film photoresist pressing device includes at least a photoresist band supply. Roller 33〇, second protective film removing roller 370, second protective film roller 420, pressing head 430, first protective film removing head 490, cutting device 440, removing head 320, and waste, discard Stop band roller 450 and other components. The use and connection relationship between these components are described below. The photoresist tape supply roller 3f0 is used to wind a new photoresist tape 34o. The number of the second protective film tearing rollers 370 is plural, for example, two, which are used to make the original three-layer photoresist tape 340 torn apart into arrows 3 880 and 3 90 Both routes continue. The first protective film and photoresistor 400 follow the route of arrow 380, and the second protective film 41 follow the route of arrow 390. The second protective film roller 420 is used to wind the second protective film 410 removed by the second protective film removing roller 370. The pressing head 43 is used for pressing the first protective film and the photoresist 400 on the wafer 36 of the wafer table 35. The main feature of the present invention is the first protective film removing head 49, which is used to remove the first protective film 500 after the first protective film and the photoresist 400 are laminated on the wafer 36. In addition, the 'cutting device 440 is used to cut the photoresist on the wafer 36. This paper is a standard of CNS A4 (210 X 297 male f). Nniin tn n IK ni iammm n I · n ϋ If t_l inn 一 of I n fn ϋΒ nv ί · ϋ I (Please read the notes on the back before filling out this page) 502310 A7 ———-------- —_B7 ______ 5. Description of the invention () 5 2 〇 ' The cutting device can be cut using a laser, for example. The removal head 320 is used to remove the discarded photoresist tape $ 10 remaining after cutting. The waste photoresist tape roller 450 is used to wind a part of the photoresist 520 that is not pressed onto the wafer 360 after cutting the photoresist 520. As the components of the present invention may move relative to each other and change their positions during operation, there are It is necessary to further explain the relative positional relationship diagrams of the components in three different states by using FIGS. 4A to 4C. Figure 4a shows the initial state of the laminating device of the dry film photoresistor of the present invention when it is started. Remove head 32〇 Move to the left. Then, the first pellicle tearing head 490 also moves to the left and the photoresist tape supply roller 330 starts to rotate to supply a brand new photoresist tape 340. Then, the wafer table 350 and the wafer 360 rise upward. At this time, the relative positions of the components are shown in Figure 4B. In addition, the original three-layer photoresist tape 34o was peeled off by the second protective film peeling roller 370 during the rotation of the photoresist tape supply roller 330 and other components, and was divided into arrows 380 and 39. Both routes continue. The first protective film and photoresistor 400 follow the route of arrow 380, and the abandoned, second diaphragm 4 1 0 continues on the route of arrow 3 90, and finally reaches the second protective film roller 420. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, and then the 'compression head 430 moves to the left. Then, the pressing head 43 is moved to the right. By moving the pressing head 由此 430 to the left and right, the first protective film and the photoresist 400 can be pressed on the wafer 360. Then, the first protective film removal head is moved to the right and starts to rotate, and the first protective film 500 can be removed. At this time, the paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) 502310 A7 B7 V. Description of the invention () The relative position of the components is as shown in Figure 4C. Next, the cutting device 4 40 The photoresist 52 on the wafer 360 is cut, so that a cut of the same shape as the wafer 360 is generated on the photoresist 52. Then, the removal head 32 is moved to the right. Then, the wafer table 3 50 and the wafer 360 are lowered. At this time, a layer of a photoresist 520 is laminated on the wafer 360 and the relative positions of the components are returned to those shown in FIG. 4A. In addition, the waste photoresist tape 510 continues on the route of arrow 530, and finally reaches the waste photoresist tape roller 450. To sum up, the advantages of the dry film photoresist lamination device of the present invention are that it can reduce operating time, increase the number of wafers per hour, and reduce production costs. As will be understood by those familiar with this technology, the above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the patent application for the present invention; all others completed without departing from the spirit disclosed by the present invention, etc. Effective changes or modifications should be included in the scope of patent application described below. ------------- Equipment ---------- Order --------- line (Please read the precautions on the back before filling this page) Intellectual Property of the Ministry of Economic Affairs The paper size printed by the Bureau's Consumer Cooperatives applies the national standard (CNS) A4 specification (210x 297 g)