201216380 六、發明說明： 【發明所屬之技術領域】 本發明係有關於適用於處理半導體裝置之方法，特別 係有關於一種晶片堆疊封裝構造之開蓋方法。 【先前技術】201216380 VI. Description of the Invention: [Technical Field] The present invention relates to a method for processing a semiconductor device, and more particularly to a method for opening a wafer stack package structure. [Prior Art]
在現代的構裝技術（assembly techn〇1〇gy)中多晶片 堆疊封裝構造已經廣泛地應用於各種不同的纪憶體π 產品。因為多晶片㈣封裝構造具有較高的冑集度與較 低的成本，使得幾種不同形式的多晶片堆疊封裝構造， 如兩個晶片（2_die)、四個晶M4_die)與八個晶片（8七⑷ 的堆疊’皆作為記憶體產品的主要部分。伴隨而來的一 大挑戰則是構裝製程之複雜性 故失效分析（failure analysis，FA)之重要性也更加提升，以偵測出在構裝製程 中所產生之缺陷。然而，對於失效分析工程師（FA g neer)而5 ，為了要能夠在晶片堆疊封裝構造之多個 晶片中精確地辨識出有缺陷的晶片，需要進行「開蓋」（或 可稱為解封裴）（decapsulati〇n)作業。如何能夠在晶片散 離之後確認晶片的原始順序便成為在構装製程中尋找可 能問題之重要關鍵。 傳統的開蓋技術係採用酸沸法，先將封裝構造直接投 入至酸性溶液中，並且浸泡煮沸一段時間，以溶解封裝 構造之封膠體，使得原本密封於封裝構造内之晶片脫 離。當晶片堆疊封裝構造之開蓋亦採用酸沸法時，因封 膠體被溶解，失去了封膠體包覆的多個晶片隨意地流動 201216380 於酸性溶液中，進而混淆了每一晶片的原始堆疊順序， 加上每-晶片又具有相同的外觀，導致無法從散離的晶 片中辨別出有缺陷之晶g 、陷之日日片，因而延誤了後續的失效 析。並且’晶片在酸性、、交油 在奴性，令液之内任意流動，亦容易發生 晶片相互碰撞而損壞晶片表面之情況。 此外，有人撻中家^一括曰u 出另種曰b片封裝構造之開蓋方法， 我國專利公告編號442933號「將半導體晶片從塑膠封裝 方法」’亦是針對封裝單-晶片之封裝構造 進行開盖處理，企_尤I，石士 止圖在毋須使用化學處理的情況下取出 密封於塑膠封裝内之曰片。 出 η之日日片。首先，對形成有塑膠封裝伴 護的晶片加熱，佶撂猢趿私壯m 衣你 使侍塑膠封裝因遇熱而開始產生脆化。 接著’利用兩夾具办牡 、 』膠封襞的兩端，並同時 封裝之下方準備承哉塑膠 承載裔以作為承載晶片之用。之 兩炎具以相對相反絲 .向扭轉，使經過加熱之塑膠封据 受到轉矩而破裂，進 裝 進而使晶片自然:掉落至位於下方之承 載器中。然而，由於β古拉+丄 由於疋直接施加外力將塑膠封裝破 以取出位於其内部之Multi-wafer stacked package construction has been widely used in a variety of different memory π products in modern assembly technology (assembly techn〇1〇gy). Because of the high concentration and low cost of the multi-wafer (four) package construction, several different forms of multi-wafer stacked package structures, such as two wafers (2_die), four crystal M4_die) and eight wafers (8) The stack of seven (4) is the main part of the memory product. The biggest challenge is the complexity of the manufacturing process. The importance of failure analysis (FA) is also improved to detect Defects generated in the fabrication process. However, for failure analysis engineers (5), in order to be able to accurately identify defective wafers in multiple wafers in a wafer-stacked package configuration, "opening the cover" is required. (or can be called decapsulation) operations. How to confirm the original order of the wafer after the wafer is detached becomes an important key to finding possible problems in the fabrication process. The traditional open-cover technology is adopted. In the acid boiling method, the package structure is directly put into an acidic solution, and immersed and boiled for a period of time to dissolve the encapsulant of the package structure, so that the package is originally sealed in the package structure. The wafer is detached. When the opening of the wafer stacking and packaging structure is also subjected to the acid boiling method, since the sealing body is dissolved, the plurality of wafers which have been coated with the sealing body are free to flow 201216380 in an acidic solution, thereby confusing each wafer. The original stacking order, plus the same appearance per wafer, results in the inability to discern the defective crystal g and the trapped day wafer from the scattered wafer, thus delaying the subsequent failure analysis. Acidic, oily in slavery, arbitrarily flowing within the liquid, it is also easy for the wafers to collide with each other and damage the surface of the wafer. In addition, some people have to use the other method to open the cover method. China Patent Publication No. 442933, "Methods for Packaging Semiconductor Wafers from Plastics" is also opened for the package structure of packaged single-wafer, which is taken out without the use of chemical treatment. Sealed in a plastic package. Out of the day of the η. First of all, the wafer formed with the plastic package is heated, 佶撂猢趿 壮 m 你 你 你 使The plastic package begins to embrittle due to heat. Then, the two ends of the package are sealed with two clamps, and the plastic carrier is prepared under the package to serve as a carrier chip. Relatively twisted, the twisted, so that the heated plastic seal is broken by the torque, and the loading makes the wafer natural: it falls to the carrier located below. However, since β Gula + 疋 is directly applied due to 疋External force breaks the plastic package to remove it inside
It日日片，除了在扭轉塑膠封裝時容 直接損害到晶片外，在B 4 一 在日日片自然掉洛至承載器之後亦可 能受到碰撞而Φ 、、。倘右，將上述開蓋方法應用於晶片 隹疊封裝構造時，g > 堆A i L之日日片更容易受到外來的 用而直接損毀，並且在晶片掉落散離至承載器之 後亦無法辨別出何者為有缺陷之晶片。 【發明内容】 鑒於此本發明之主要目的係在於提供一種晶片堆[S】 4 201216380 疊封裝構造之關筌t、+ 之開蓋方法，可保持晶月原本的堆疊順床 以利於失效分析之進行。 蟹頃序， 本發明之次一目的係在於提供一種晶片堆 造之開蓋方法，能卩大μ a w + 哀構 防止曰日片在酸性溶液中激烈移動而受 貝，以保持晶片表面完整無缺。 本一發明的目的及解決其技術問題是採用以下技術方 案來貫現的。本發明揭示—種晶片堆疊封I構造 方法，主要包含.接祉 a u ^ 3 .提供一晶片堆疊封裝構造，其係包含 有一封膠Μ、複數個密封於該封膠體内卜 黏著該些晶片之黏晶層’其中該些晶片係呈相互堆疊型 態。以一耐酸綑帶捆綁該晶片堆疊封裝構造。之後了浸 泡該晶片堆疊封裝構造與該耐酸綑帶至一酸性溶液中。 以酸沸方式使㉟晶片i隹疊封裝構造之該封膠體及該黏晶 層溶解於該酸性溶液内，直到該些晶片為顯露、散離且 仍被該耐酸綑帶所捆綁，以保持該些晶片的堆疊順序不 變。最後，取出被該耐酸綑帶所捆綁之該些晶片。 本發明的目的及解決其技術問題還可採用以下技術 措施進一步實現。 在前述之晶片堆疊封裝構造之開蓋方法中，該耐酸綑 帶之材質係可選用鐵氟龍（Teflon)。 在前述之晶片堆疊封裝構造之開蓋方法中，該咐酸綑 帶係可呈十字捆绑並具有一位於該封膠體頂面之繫結 點。 [S] 在前述之晶片堆疊封裝構造之開蓋方法中，在上述取 5 201216380 出步驟中係可利用該繋結點取出該些晶片。 在剛述之晶Η堆疊封裝填造之開蓋方法中，該蘩结點 係可為蝴罈结。 在前述之晶Μ堆疊封裝構造之開蓋方法中，該耐酸緬 帶係可具有伸縮彈性。 由以上技術方案可以看出，本發明之晶片堆疊封裝構 造之開蓋方法，具有以下優點與功效： -、可藉由以耐酸”捆綁晶片堆疊封裝構造與浸泡至 酸性溶液中作為其中之一技術手段，在酸沸方式溶 解晶片堆疊封裝構造之封膠體與黏晶層之過程中， 能夠限制晶片的銘命1 t u 月的移動而不會散離。因此，在取出晶 片之後可保持晶片原本的堆疊順序，以利於失效 分析之進行。 二、可藉由以耐酸綑帶捆綁晶片堆疊封裝構造作為其中 之技術手段，當封膠體被溶解於酸性溶液内，能 防止晶片在酸性遂：, 中激烈碰撞而受損，以保持晶 片表面完整無缺。 【實施方式】 以下將配合所附圖示詳纟 叶、、田說明本發明之實施例，然應 注意的是，該些圖示均為簡化 一 ]化之不思圖’僅以不意方法 來說明本發明之基本架構或眘 饵次實施方法，故僅顯示與本案 有關之元件與組合關係，圖中 口 τ所顯不之兀件並非以實際 實施之數目、形狀、尺寸傲 做專比例繪製，某些尺寸比例 與其他相關尺寸比例或已誇 m 兮張或疋簡化處理，以提供更 6 201216380 -清楚的描述。實際實施之數目、形狀及尺寸比例為一種 選置性之設計，詳細之元件佈局可能更為複雜。 依據本發明之第一具體實施例，一種晶片堆疊封裝構 造之開蓋方法舉例說明於第1圖之流程方塊圖、第2A 至2F圖在開蓋過程中之元件截面示意圖以及第3圖其由 酸性溶液中取出被_酸綑帶所捆綁之晶片後之立體示意 圖。根據第1圖，該晶片堆疊封裝構造之開蓋方法主要 0 包含以下步驟：「提供一晶片堆疊封裝構造」之步驟1、 「以财酸綑帶捆綁晶片堆疊封裝構造」之步驟2、「浸泡 曰曰片堆疊封裝_構造與耐酸綑帶至酸性溶液中」之步驟 3、「以酸沸方式溶解封膠體與黏晶層」之步驟*以及「取 出被而ί酸綑帶所捆綁之晶片」之步驟5，詳細步驟請參 閱第2Α至2F圖，說明如下。 請參閱第2Α圖所示，步驟ί中提供一晶片堆疊封裝 構造10,其係包含有一封膠體U、複數個密封於該封膠 9 體11内之晶片12與至少一黏著該些晶片12之黏晶層 1 3，其中該些晶片1 2係呈相互堆疊型態，利用該黏晶層 1 3黏著該些晶片1 2 ’該黏晶層1 3可為晶粒貼附材料（Die Attach Material，DAM) ’可在晶圓階段預先形成在晶片 之背面。詳細而言，該晶片堆疊封裝構造i 〇係可另包含 一基板14，用以承載該些晶片12，並且位於最下方之晶 片12係藉由一黏著材料15結合至該基板14，以完成在 該基板14上之晶片堆疊。在一較佳型態中，該封膠體 11係形成於該基板14上’並完全包覆該些晶片ί]、該 201216380 一黏0曰層1 3與該黏著材料1 5。在本實施例中，該晶片 隹且封裝構k 10係、已進行電性失效分析(electric failure y s’ EFA)量測，並測得該些晶片ι2其中之一為一 有缺陷的b曰片"A ’並確定該有缺陷的晶片12A之位 置俏如該些晶片1 2中堆疊於第二層之晶片（以由下 而上方式的堆疊方向）。其中，所稱之「電性失效分析」 係扣利用電性方式進行失效分析者，例如：量測電流、 φ wafer map判定等。如以習知的酸沸法，多個晶 片會散離而益法亩姐说山 .、、'居直接取出正確的缺陷晶片進行分析檢 查。 ^步驟2凊參閱第2Β圖所示，以一耐酸綑帶2〇捆綁 片堆嗳封裝構造10。更具體而言，該耐酸綑帶20 糸被貼附固疋於該晶片堆疊封裝構造】〇之該封膠體11 表面所稱之「貼附固定」係指捆綁方式須使該耐酸 綑1 20 f冑地平貼於該該封膠體^之表面而不可滑動 •或鬆脫，不需要直接黏著於該封膠體11之表面。在一較 佳型態中，該耐酸綑帶20係可呈十字捆綁並具有一位於 5 ^膠體11頂面之繫結點21。具體而言，所稱之「十 子捆綁」係指在該晶片堆疊封裝構造1〇之底面對該耐酸 綑帶20做第一次十字交又，再由該晶片堆疊封裝構造 1 0之底面沿著該晶片堆疊封裝構造J 〇四周向上包綑， 並於該封膠體11之頂面將該耐酸綑帶20做第二次十字 交又且以打結方式形成該繫結點21。因此，能夠穩固地 捆綁該晶片堆疊封裝構造1〇的四側邊，以防止在後續步 8 201216380 驟中發生脫離或傾斜之情況，並且不影響在後續步驟中 酸性溶液對該封膠體11溶解。此外，該繫結點21係可 為螂蝶結’以便於在去除封膠體之後拆除該耐酸綑帶 20。或者，該繫結點2 1亦可選用其它形式的活結，例如： 平結、接繩結、雙半結等，以提供易於解開之功效，且 不影響該繫結點21本身之牢固性。在一較佳實施例中， 該耐酸綑帶20之材質係可選用鐵氟龍（Tefl〇n)，藉由鐵 肇 氟龍本身的化學與物理特性，以抵抗高溫與強酸強驗， 並且質地柔軟而光滑。在一變化例中，該耐酸綑帶之〇 之材質亦可選自於聚對笨二曱酸乙二醇（PET)與聚氯乙 烯（PVC)之其中之一 ’或者是其它同樣具有耐高/低溫性 與抗腐蝕性之材質。 步驟3請參閱第2C圖所示’將已被該耐酸綑帶2〇 所捆綁之該晶片堆疊封裝構造1 〇放入至一酸性溶液 3 0 ’使該晶片堆疊封裝構造1 〇與該耐酸綑帶2 〇浸泡於 • 該酸性溶液30中。該酸性溶液30係可包含發煙硝酸， 用以溶解封膠體但保留半導體晶片的完整β在本實施例 中，該酸性溶液30係可儲放於一耐酸容器4〇之内，該 耐酸容器40之材質係可選用玻璃或是其它耐高/低溫與 耐酸鹼之材質’通常該耐酸容器40係選用玻璃器皿為 佳。此外，該酸性溶液3 0係可預先加熱至一定溫度，例 如攝氏7 0 - 9 0度，以縮短整體的製程時間。 步驟4請參閱第2D與2Ε圖所示，在該耐酸容器4〇 内以酸沸（acid-boiling)方式使該晶片堆疊封裝構造1〇 [S】 9 201216380It's a Japanese film, except for the direct damage to the wafer when twisting the plastic package, it can also be bumped after the B 4 is naturally lost to the carrier. If the above-mentioned opening method is applied to the wafer folding package structure, the day surface of the g > A A L is more susceptible to external damage and directly damaged, and after the wafer is dropped and scattered to the carrier, It is impossible to tell which one is a defective wafer. SUMMARY OF THE INVENTION In view of the above, the main object of the present invention is to provide a method for opening a lid of a wafer stack [S] 4 201216380 stacked package structure, which can maintain the original stacking of the crystal moon to facilitate failure analysis. get on. Crab order, the second object of the present invention is to provide a method for opening a wafer stack, which can increase the μ aw + sorrow to prevent the smashing of the slab in the acidic solution and to protect the wafer surface to keep the surface intact. . The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. The invention discloses a method for constructing a wafer stacking package I, which mainly comprises: 祉 au ^3. A wafer stacking package structure is provided, which comprises a plastic capsule, and a plurality of seals are sealed in the sealing body to adhere the wafers. The die layer 'where the wafers are stacked on each other. The wafer stack package structure is bundled with an acid resistant strap. The wafer stack package construction is then immersed in the acid-resistant ribbon to an acidic solution. The sealant and the adhesive layer of the 35 wafer i-fold package structure are dissolved in the acidic solution by acid boiling until the wafers are exposed, scattered and still bound by the acid-resistant strap to maintain the The stacking order of these wafers is unchanged. Finally, the wafers bound by the acid resistant strap are removed. The object of the present invention and solving the technical problems thereof can be further realized by the following technical measures. In the opening method of the wafer stack package structure described above, the material of the acid-resistant strap is Teflon. In the opening method of the wafer stack package structure described above, the tannic acid strap may be cross-bundled and have a tie point on the top surface of the sealant. [S] In the above-described method of opening the wafer-stacked package structure, the wafers can be taken out by the splicing point in the above-mentioned step of taking out 201216,380. In the opening method of the wafer stacking package just described, the knot point may be a butterfly knot. In the opening method of the above-described wafer stacking package structure, the acid-resistant Burmese belt may have stretch elasticity. It can be seen from the above technical solution that the method for opening the wafer stack package structure of the present invention has the following advantages and effects: - It can be one of the technologies by immersing the wafer in a package structure and immersing it in an acidic solution. In the process of dissolving the sealant and the adhesive layer of the wafer stacking and packaging structure in an acid boiling manner, the movement of the wafer can be restricted without being scattered. Therefore, the original wafer can be maintained after the wafer is taken out. Stacking order to facilitate the failure analysis. Second, the chip stacking package structure can be bundled with acid-resistant straps as a technical means. When the sealant is dissolved in an acidic solution, the wafer can be prevented from being acidic. Damaged by collision to keep the surface of the wafer intact. [Embodiment] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings, and the drawings are simplified. "I don't think about it", the basic structure of the present invention or the implementation method of the bait is only explained by an unintentional method, so only the relevant cases are shown. The relationship between the parts and the combination, the elements of the figure τ are not drawn in proportion to the actual number, shape and size of the actual implementation. Some ratios of scales and other related sizes are either exaggerated or simplified. To provide a more detailed description of the number 6, shape and size of the actual implementation is an optional design, the detailed component layout may be more complicated. According to the first embodiment of the present invention, a wafer stack The opening method of the package structure is illustrated in the flow block diagram of FIG. 1 , the cross-sectional view of the components in the process of opening the cover in FIGS. 2A to 2F, and the drawing of the wafer bundled by the acid strip in the acidic solution. According to FIG. 1 , the method for opening the wafer stack package structure mainly includes the following steps: “providing a wafer stack package structure” step 1. “binding the wafer stack package structure with the acid and acid bundle” Step 2, “Immersing the enamel stacking package _ structure and acid-proof binding to the acidic solution” Step 3, “Dissolving the sealant and the viscous layer by acid boiling And * the step "being taken out and the bound strap acid ί the wafer" of Step 5, see the detailed steps of FIG 2Α to 2F, described below. Referring to FIG. 2, a wafer stack package structure 10 is provided in the step 355, which comprises a glue U, a plurality of wafers 12 sealed in the seal body 11, and at least one of the wafers 12 bonded thereto. The die layer 13 is formed by stacking the wafers 1 2 with the die layer 1 2 '. The die bond layer 13 can be a die attach material (Die Attach Material) , DAM) ' can be pre-formed on the back side of the wafer during the wafer stage. In detail, the wafer stack package structure may further include a substrate 14 for carrying the wafers 12, and the bottommost wafer 12 is bonded to the substrate 14 by an adhesive material 15 to complete The wafers on the substrate 14 are stacked. In a preferred embodiment, the encapsulant 11 is formed on the substrate 14 and completely covers the wafers, the 201216380 adhesive layer 13 and the adhesive material 15. In this embodiment, the wafer is packaged and the electrical failure y s' EFA is measured, and one of the wafers ι2 is measured as a defective b曰. The sheet "A' and determines that the defective wafer 12A is positioned as the wafer stacked on the second layer in the wafers 1 (in a stacking direction from the bottom up). Among them, the so-called "electrical failure analysis" is used to perform failure analysis by electrical means, such as measuring current, φ wafer map determination, and the like. For example, according to the conventional acid boiling method, a plurality of crystal wafers will be dispersed, and Yifa Mujie said that the mountain is directly taken out of the correct defective wafer for analysis and inspection. ^Step 2 凊 Referring to Figure 2, an acid-resistant strap 2 〇 bundle stacking package construction 10 is shown. More specifically, the acid-resistant strap 20 糸 is attached to the wafer stack package structure. The surface of the sealant 11 is referred to as “attach-fixed” means that the binding method is such that the acid-resistant bundle 1 20 f The surface of the sealant is not slidable or loose, and does not need to be directly adhered to the surface of the sealant 11. In a preferred form, the acid resistant strap 20 can be cross-bundled and have a tie point 21 on the top surface of the 5 colloid 11. Specifically, the term "ten-bundle" refers to the first cross-over of the acid-resistant strap 20 on the bottom surface of the wafer stacking and packaging structure, and then the bottom surface of the wafer-stacked package structure 10 The wafer stacking structure J is wrapped around the wafer, and the acid-resistant strip 20 is cross-crossed on the top surface of the sealant 11 and the tie point 21 is formed in a knotted manner. Therefore, the four sides of the wafer stack package structure 1 can be firmly bundled to prevent the occurrence of detachment or tilting in the subsequent step 8 201216380, and the dissolution of the acidic solution to the sealant 11 in the subsequent step is not affected. In addition, the tie point 21 can be a blister knot to facilitate removal of the acid resistant strap 20 after removal of the sealant. Alternatively, the knot 2 1 may also use other forms of slip knots, such as: flat knots, knots, double half knots, etc., to provide an easy-to-unlock effect without affecting the firmness of the knot 21 itself. . In a preferred embodiment, the acid-resistant strap 20 is made of Teflon (Tefl〇n), which is resistant to high temperature and strong acid by the chemical and physical properties of the iron fluorocarbon itself, and has a texture. Soft and smooth. In a variant, the material of the acid-resistant strap may also be selected from one of polyethylene terephthalic acid (PET) and polyvinyl chloride (PVC) or other high resistance. / Low temperature and corrosion resistant materials. Step 3, as shown in FIG. 2C, 'put the wafer stack package structure 1 bundled with the acid-resistant strap 2 into an acidic solution 30' to make the wafer stack package structure 1 and the acid-resistant bundle Soak in 2 〇 in the acidic solution 30. The acidic solution 30 may comprise fuming nitric acid for dissolving the encapsulant but retaining the intact β of the semiconductor wafer. In the present embodiment, the acidic solution 30 may be stored in an acid-resistant container 4, the acid-resistant container 40. The material is available in glass or other materials resistant to high/low temperature and acid and alkali resistance. Generally, the acid-resistant container 40 is preferably made of glassware. Further, the acidic solution 30 can be preheated to a certain temperature, for example, 70 to 90 degrees Celsius, to shorten the overall process time. Step 4 Referring to Figures 2D and 2, the wafer is packaged in an acid-boiling manner in the acid-resistant container 4〇 [S] 9 201216380
之該封膠體11及該黏S 日日層3浴解於該酸性溶液30内。 施例卜在該晶片堆疊封裝構造^放入該酸 之後’亦可持續對該酸性溶液30進行加敎， ^吏該酸性溶液30具有溶解封膠體之較佳活性。此;， 由於該封膠體a 膠體11該黏晶層13與該黏著材料15均具有 可洛解於該酸性溶 封朦骑η 之樹月曰材質，所以在本步驟中該 封谬體11、該黏晶層〗3盥 ^ ^ /、5亥黏考材料15皆會漸漸地溶 解於該酸性溶液3〇内 與該基板“。特別、如一：壞到該些晶片12 疋13第2Ε圖所不，該晶片堆疊封 造1〇之酸沸時間應到達該些…2為顯露、散離 且仍被該耐酸綑帶20所捆綁，以保持該些晶片12的堆 疊順序不變，故太士杳 θ 在本實鉍例中，該有缺陷的晶片12Α仍 疋該些晶片12中堆属於笙_ , 堆且於第一層之晶片。具體而言，在該 封膠體11被溶解之後’使得整體體積縮小，但該耐酸綑 帶20仍可束缚該些晶# 12與該基板Μ，該些晶片12 並不會因失去了該封膠體u之包覆而隨意地飄浮流動 於該酸性溶液3"。在一較佳型態中，該对酸綑帶2〇 可八有伸縮彈性，所以在該封膠體11、該黏晶層1 3 ”該黏著材料1 5被溶解後，該耐酸綑帶20能適當地縮 小捆綁空間，依然能緊密且穩固地捆綁住該些晶片12 與該基板14。 步驟5吻參閲第21?與3圖所示，待確定該封膠體11 已'合解且該些晶片1 2呈現層層散離狀態之後，取出被該 耐酸綑帶2G所捆綁之該些晶片12。並且，由於該基板m 10 201216380 14係未溶解於該酸性溶液30之内（如第2E圖所示），所 以當在取出該些晶片12時，該基板14仍可用以承載已 散離之該些晶片12(包含該有缺陷的晶片！ 2 A)，晶片堆 疊之排列順序仍不會改變或混亂。較佳地，在上述取出 該些晶片1 2之步驟中係可利用該繫結點2 1取出該些晶 片12。由於該耐酸綑帶2〇所形成之該繫結點2 1係位於 該封膠體11之頂面，有助於操作人員在取出該些晶片 _ 1 2之後進行初步辨識該些晶片12之堆疊順序。此外， 操作人員亦可於該些晶片12之上方解開該繫結點21， 即此輕易地拆除該耐酸綑帶20而毋須執行額外的翻轉 動作’故該些晶片12無論是在浸泡前與取出後皆能夠維 持其原來的堆疊順序。 综上所述’在本發明中可藉由以該耐酸綑帶2 0捆綁 該晶片堆疊封裝構造1〇與浸泡至該酸性溶液30中作為 其中之一技術手段’在酸沸過程中該晶片堆疊封裝構造 ® 之該封膠體與該黏晶層13之溶解不會造成該些晶 片12之散離。因此，由該酸性溶液3 〇中取出該些晶片 12之後，仍可保持該些晶片12原本的堆疊順序，所以 有助於操作人員進行後續的失效分析（failure analySis， FA) ’除了使得操作人員易於辨識之外，亦可縮短整體檢 測時間。此外’由於該封膠體丨丨被溶解之後，該耐酸綑 帶2〇依然有效地捆綁住該些晶片12不致散離，故能防 止該些晶片12在該酸性溶液3 〇中激烈碰撞而受損，以 保持該些晶片1 2表面完整無缺。 11 201216380The encapsulant 11 and the viscous S day layer 3 are dissolved in the acidic solution 30. The acidic solution 30 is also continuously applied after the wafer stacking structure is placed in the wafer stacking structure. The acidic solution 30 has a preferred activity for dissolving the encapsulant. Because of the sealant a colloid 11 , the adhesive layer 13 and the adhesive material 15 have a material that can be dissolved in the acid-soluble seal , η , , , , , , , , , , , , , , The viscous layer layer 3 盥 ^ ^ /, 5 hai adhesion test material 15 will gradually dissolve in the acidic solution 3 与 and the substrate ". In particular, such as: bad to the wafers 12 疋 13 second map No, the acid boiling time of the wafer stack sealing should reach that... 2 is exposed, scattered and still bound by the acid resistant strap 20, so as to keep the stacking order of the wafers 12 unchanged, so the priest杳 θ In the present embodiment, the defective wafer 12 is still stacked in the wafer 12 and belongs to the wafer of the first layer. Specifically, after the encapsulant 11 is dissolved, The overall volume is reduced, but the acid-resistant strap 20 can still bind the crystals 12 and the substrate, and the wafers 12 are not randomly floated and flowed to the acidic solution due to the loss of the coating of the sealant u. In a preferred form, the pair of acid strips can be elastically stretched, so in the sealant 11, the stick After the adhesion layer 15 is dissolved, the acid-resistant ribbon 20 can appropriately shrink the binding space, and the wafer 12 and the substrate 14 can still be tightly and firmly bonded. Step 5: Referring to Figures 21 and 3, after the sealant 11 has been determined to have been resolved and the wafers 12 are in a layered state, the bundles of the acid-resistant straps 2G are taken out. Wafer 12. Moreover, since the substrate m 10 201216380 14 is not dissolved in the acidic solution 30 (as shown in FIG. 2E), when the wafers 12 are taken out, the substrate 14 can still be used to carry the separated These wafers 12 (including the defective wafers! 2 A), the order of arrangement of the wafer stacks remains unchanged or confusing. Preferably, in the step of taking out the wafers 1 2, the wafers 12 can be taken out by the node 2 1 . Since the tie point 21 formed by the acid-resistant strap 2 is located on the top surface of the sealant 11, it helps the operator to initially identify the stacking order of the wafers 12 after taking out the wafers _12. . In addition, the operator can also untie the tie point 21 above the wafers 12, that is, the acid-resistant strap 20 can be easily removed without performing an additional flipping action, so the wafers 12 are before being soaked. After being taken out, it can maintain its original stacking order. In summary, in the present invention, the wafer stacking process can be performed by bundling the wafer stack package structure with the acid-resistant strap 20 and immersing in the acidic solution 30 as one of the technical means of the wafer stacking process. The encapsulation of the encapsulant and the doped layer 13 of the package construction® does not cause scattering of the wafers 12. Therefore, after the wafers 12 are taken out from the acidic solution 3, the original stacking order of the wafers 12 can be maintained, thereby facilitating the operator to perform subsequent failure analysis (Failure analySis, FA) 'except for the operator Easy to identify, it also reduces overall inspection time. In addition, after the sealant is dissolved, the acid-resistant strap 2 is still effectively bound to the wafers 12 so as not to be scattered, so that the wafers 12 can be prevented from colliding and colliding in the acidic solution. In order to keep the surface of the wafers 12 intact. 11 201216380
發明你^所述僅是本發明的較佳實施例而已，並非對本 揭露如何形式上的限制，雖然本發明已以較佳實施例 術：，：’然而並非用以限定本發明，任何熟悉本項技 終 不脫離本發明之技術範圍内，所作的任何簡單 ;改、等效性變化與修錦，均仍屑於本發明的技術範圍 【圖式簡單說明】 第1圖：依據本發明之—具體實施例的—種晶片堆疊封 第 褒構造之開蓋方法之流程方塊圖。 至2F圖.依據本發明之一具體實施例的晶片堆疊 封裝構造之開蓋方法在開蓋過程中之元件截面 示意圖。 依據本發明之一具體實施例的晶片堆疊封裝構 造之開蓋方法繪示其由酸性溶液中取出被耐酸 綑帶所捆綁之晶片後之立體示意圖。 L主要元件符號說明】 乂驟1提供一晶片堆疊封裝構造 步驟9 以耐酸綑帶捆綁晶片堆疊封裝構造 浸泡晶片堆疊封裝構造與耐酸綑帶至酸性溶液 中 / 以酸沸方式溶解封膠體與黏晶層 取出被耐酸綑帶所捆綁之晶片 1 0晶片堆疊封裝構造 11封膠體 12晶片 第 圖 步驟3 步驟4 步驟5 [S] 12 201216380 12A有缺陷的晶片 13黏晶層 14基板 1 5黏著材料 2 0 封酸綑帶 21繫結點 3 0 酸性溶液 4 0 耐酸容器 • • [s] 13The invention is only a preferred embodiment of the invention, and is not intended to limit the scope of the disclosure, although the invention has been described in the preferred embodiments: The present invention does not depart from the technical scope of the present invention, and any simple changes, modifications, and repairs are still in the technical scope of the present invention. [Simplified description of the drawings] FIG. 1 : According to the present invention - A block diagram of a method of opening a lid of a wafer stacking structure of a specific embodiment. Figure 2 is a cross-sectional view showing the element opening method of the wafer stack package structure in accordance with an embodiment of the present invention. A method of opening a wafer stack package according to an embodiment of the present invention is a schematic view showing the removal of a wafer bundled with an acid-resistant strap from an acidic solution. L main component symbol description] Step 1 provides a wafer stack package construction step 9 with acid-resistant strap bundled wafer stack package structure soak wafer stack package structure and acid-resistant bandage to acidic solution / acid boiling method to dissolve the sealant and die-bonding The layer is taken out of the wafer bundled by the acid-resistant strap. 10 Wafer stacking and packaging structure 11 Sealing body 12 wafer Step 3 Step 4 Step 5 [S] 12 201216380 12A defective wafer 13 bonded layer 14 substrate 1 5 adhesive material 2 0 Sealed acid strap 21 line node 3 0 Acid solution 4 0 Acid-resistant container • • [s] 13