201211623 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種顯示面板之製造方法及顯示面板，尤 其係關於一種液晶面板之製造方法及液晶面板。 【先前技術】 作為商效地製造液晶面板（LCD，Liquid Crystal Display) 之方法’係廣泛使用將液晶材料封入至兩塊母玻璃基板 (以下’簡稱為「基板」）之間製作面板，切斷面板而製作 複數個單元之方法（例如’參照專利文獻1}。於該方法中， 切斷面板時，使用劃線•切割法》 於劃線•切割法中’首先，將圓盤割刀之外周刀刀按壓 至構成面板之一基板上，使其一面旋轉一面移動，藉此形 成相互正父之第1及第2劃線（初始裂縫）。然後，翻轉面 板’將切割棒（break bar)按壓至另一基板上之特定位置， 對一基板施加彎曲應力。藉此，使拉伸應力作用於第1及 第2劃線之底部，使裂縫在板厚方向上伸展，從而切斷一 基板。繼而，以同樣方式切斷另一基板。如此，切斷面 板，製作複數個單元。 然而’於縱向形成第〖劃線之後，橫向形成第2劃線時， 存在產生所謂交線跳躍之情況。交線跳躍可認為係由於如 下原因而產生：形成第2劃線之圓盤割刀在橫切第1劃線 時’由於阻力之急遽變化而發生彈跳。若產生交線跳躍， 則基板會於未意圖之位置被切斷，導致切斷品質下降。 對此’於專利文獻1中，已提出使用研磨程度較形成第i 157674.doc 201211623 劃線之圓盤割刀更粗之刀刃，作為形成第2劃線之圓盤割 刀之外周刀刀的方案。較粗之刀刃易於陷人至基板，因此 可抑制於橫切第丨劃線時，產生交線跳躍。研磨程度係以 外周刀刀之刀尖角度而決定。 又於專利文獻1中，已提出於基板之切斷面中需要更 向強度之面上形成第i劃線的方案。作為形成第丨劃線之圓 盤割刀之外周刀刃，係使用研磨程度較細之鋒利之刀刀， 因此切斷面變得光滑，邊緣強度變高。 又，近年來，作為形成劃線之圓盤割刀之外周刀刃，已 開發出沿著外周設置有多個切口之刀刃（所謂高滲透刀 刃）（例如，參照專利文獻2)。若使用高滲透刀刀形成劃 線，則荷重會集中於高滲透刀刃之凸部，因而只要高涞透 刀刃之凸部陷入至基板數μιη，劃線之深度即達到板厚之 80%左右。因此，操作員能夠以用大拇指施力之程度，产 者劃線切斷基板。 [先行技術文獻] [專利文獻] [專利文獻1]曰本專利特開2007-140131號公報 [專利文獻2]曰本專利特開2010-6672號公報 【發明内容】 [發明所欲解決之問題] 然而，於專利文獻1所記載之方法中，為估κ & 勺货妆伸應力作 用於相互正交之第1及第2劃線之底部，會改鐵 々雙切割棒之方 向，進行兩次切割，故可加工性欠佳。 157674.doc 201211623 . 另-方面’於專利文獻2所記載之方法中，#需要操作 員利用大梅指施力，因而存在改善可加工性之餘地。 又，於專利讀2所記載之方法中，於高滲透刀刃之凸 部陷入至基板中時，應力會集中於所陷入之區域（於圖9 中，以斜線表示之區域）之角部，從而於與劃線ι〇ι交又之 方向上亦形成裂縫102。因此，顯示面板之邊緣強度較 低’顯示面板容易破裂。 本發明係鐾於上述情況而完成者，其目的在於提供一種 可抑制製品之破裂，且可提高可加工性之顯示面板之製造 方法。 [解決問題之技術手段] 為解決上述課題，本發明之第丨態樣係一種顯示面板之 製造方法， 其包含在母玻璃基板之表面形成相互正交之第丨及第2劃 線，使裂縫自上述第1及第2劃線在板厚方向上伸展，藉此 切斷母玻璃基板之步驟；且 於形成與上述顯示面板之長邊相對應之上述第1劃線 時，使用沿著外周具有〇〜5個切口之第1圓盤割刀； 於形成與上述顯示面板之短邊相對應之上述第2劃線 時，使用沿著外周具有50〜300個切口之第2圓盤割刀。 本發明之第2態樣如第1態樣之顯示面板之製造方法，其 中 較佳為使用上述第1圓盤割刀形成上述第1劃線之後，使 用上述第2圓盤割刀形成上述第2劃線。 157674.doc 201211623 於本發明之顯示面板之製造方法中， 較佳為上述第1劃線之深度為上述母玻璃基板之板厚之 5〜25%。 又’較佳為上述第2劃線之深度為上述母玻璃基板之板 厚之75〜85%。 又，較佳為上述母玻璃基板之厚度為〇.1〜3 mm。 又’較佳為上述第1及第2圓盤割刀係於中央具有軸孔之 圓板狀體上包含外周刀刃者。 又’本發明提供一種藉由本發明之顯示面板之製造方法 而獲得之顯示面板。 較佳為上述顯示面板為液晶面板。 [發明之效果] 根據第1態樣’可提供一種可抑制製品之破裂，且可提 高可加工性之顯示面板之製造方法。 根據第2態樣’可抑制第2圓盤割刀在橫切第1劃線時發 生彈跳，從而抑制第2劃線中斷。 【實施方式】 以下’參照圖式對用以實施本發明之形態進行說明。再 者’本發明並不限於後述之實施形態，可在不脫離本發明 之範圍之情況下’對後述之實施形態施加各種變形及替 換。 圖1係本發明之一實施形態之顯示面板之製造方法之步 驟圖。於本實施形態中’係對液晶面板（LCD)之製造方法 進行說明’但亦可將本發明應用於例如電漿顯示面板 I57674.doc 201211623 (PDP ’ Plasma Display Panel)或有機乩⑷⑽她論⑽⑽， 電致發光）面板等其他顯示面板之製造方法。 如圖1所示’液晶面板之製造方法包含：TFT(Thin Film - Transistor，薄膜電晶體）基板製作步驟（步驟Μ!)、 • CF(C〇l〇r Filter，彩色濾光片）基板製作步驟（步驟si2)、面 板製作步驟（步驟S13) '單元製作步驟（步驟S14)及模組組 裝步驟（步驟S15)。 於TFT基板製作步驟（步驟S11)中，於一個母玻璃基板 (以下，簡稱為「基板」）上以特定圖案形成TFT(薄膜電晶 體）等，製作TFT基板。於CF基板製作步驟（步驟S12)中， 於另基板上以特定圖案形成CF(彩色濾光片）等製作CF基 板。该等步驟Sll、s 12之順序並無限制，亦可同時實施。 於面板製作步驟（步驟S13)中，經由間隔片使TFT基板與 CF基板貼合。此時，以於兩塊基板之間配置TFT、CF等之 方式，使TFT基板與CF基板貼合。繼而，於TFT基板與CF 基板之間封入液晶材料，製作面板。 於單凡製作步驟（步驟S14)中，切斷面板，製作複數個 單元此時，具體情況將於後文描述，為切斷面板，將各 * 基板加以切斷。 ‘ 於模組組裝步驟（步驟s 15)中，將電性控制TFT等之控制 電路、成為光源之背光源等零件安裝於單元中，製作液晶 面板。 再者，於本實施形態中，係設為封入液晶材料之後，切 斷兩塊基板，但亦可於切斷兩塊基板之後，封入液晶材 157674.doc 201211623 料。 其次，根據圖2A〜圖2E及圖3A〜圖3B，對圖1所示之單元 製作步驟進行詳細說明。於單元製作步驟中，為切斷面 板，將各基板加以切斷。 首先，如圖2A及圖3A〜圖3B所示，於構成面板2之一基 板10之外表面11，形成相互正交之第1及第2劃線（初始裂 縫）31、32»第1劃線31係隔開間隔，相互平行地設置有複 數條。同樣地，第2劃線32亦係隔開間隔，相互平行地設 置有複數條。上述間隔既可如圖3A〜圖窈所示為不均等， 亦可為均等。再者，於一基板10之内表面12上，預先形成 有未圖示之TFT或CF等。 繼而’如圖2B所示，翻轉面板2，將切割棒3按壓至另一 基板20之外表面21之特定位置，對一基板1〇施加彎曲應 力。藉此，使拉伸應力作用於第1及第2劃線3丨、32之底 ’使裂縫自底部在板厚方向上伸展，切斷一基板1〇。 繼而，如圖2C所示，於另一基板20之外表面21上，以與 圖2A同樣之方式’形成相互正交之第1及第2劃線（於圖％ 中’僅圖示第1劃線41)。再者，於另一基板20之内表面22 上，預先形成有未圖示之CF或TFT等。 最後’如圖2D所示，再次翻轉面板2，將切割棒3按壓至 一基板10之外表面11之特定位置，以與圖2B同樣之方式， 切斷另一基板2〇。如此’如圖2E所示，切斷面板2，製作 複數個單元4。 再者，於本實施形態中’係設為於一基板10之外表面u 157674.doc 201211623 上形成第1及第2劃線31、32之後，於另一基板20之外表面 21上形成第1及第2劃線，但亦可同時進行該等步驟。 其次，對圖2A〜圖2B所示之基板1〇之切斷步驟進行詳細 說明。再者，圖2C〜圖2D所示之基板20之切斷步驟為相 同，因而省略其說明。 本實施形態中’於圖2A所示之步驟中，於形成液晶面板 之長邊，即，與圖3A〜圖3B所示之單元4之長邊6相對應之 第1畫j線3 1時使用沿著外周具有0〜5個切口之第1圓盤割 刀5〇。另一方面，於形成液晶面板之短邊，即，與單元4 之短邊8相對應之第2劃線32時，使用沿著外周具有、5〇〜3〇〇 個切口之第2圓盤割刀60。第1及第2圓盤割刀50、60可組 裝入-個固持器中’且分別可在使用位置與不使用位置之 間移動而構成，亦可視情況而分開使用。 圖4係第!圓盤割刀5〇之立體圖。圖5係第iaj盤割刀5〇之 使用狀態下之基板之剖面圖。 第1圓盤』刀50如圖4所示’為中央具有軸孔51之圓板狀 體’包含外周刀刀52。外周刀刃52係由鑽石或超鋼合金等 所形成。該外周刀刀52係被稱為所謂標準刀刃者，沿著外 周具有〇〜5個(圖4令為〇個)切口。藉由將切口之數量設為j 個以下，可形成光滑之第1劃、㈣，從而可提高單元4之長 广邊緣強度。進而，可提高液晶面板之長邊之邊緣強 度°再者圓盤割刀之外周徑較佳為則1〇_。 二吏用第1圓盤割刀50時，如圖5所示，將外周刀刀5彻 上，使其—面旋轉一面移動，藉此形成第1劃線 I57674.doc 201211623 3卜此日夺，外周刀刀52僅陷入至基板1〇數_，卻使第蹦 線3 1形成至較外周刀刃52更深之位置。 第1劃線31之深度D1係由按壓外周刀刀52之荷重、外周 刀刃52之刀尖角度等而決^，較佳為基板1G之板厚T之 5〜25%。藉由設為5%以上，可於拉伸應力作用於第【劃線 3 1之底_ ’沿著第t劃線3丨進行切斷。另-方面，若超 過25 /〇 ’則何重過度升冑，®而在與第1劃線3 1交叉之方 向上亦形成裂縫’導致切斷面之強度下降。再者，基板1〇 之板厚Τ通常為o.id mm。 圖6係第2圓盤割刀60之立體Η。圖7係第2圓盤割刀之 使用狀態下之基板之剖面圖。 第2圓盤割刀60如圖6所示，為中央具有軸孔61之圓板狀 體’包含外周刀刃62。外周刀刃62係由鑽石或超鋼合金等 所形成。該外周刀刀62係被稱為所謂高滲透刀刃者，沿著 外周具有50〜3〇〇個切口 63。再者，第2圓盤割刀之外周徑 較佳為φ 1〜φ 10 mm。 於使用第2圓盤割刀60時，如圖7所示，將外周刀刃“按 壓至基板lGJi，使其-面旋轉—面移動，藉此形成第2劃 線32。此時，外周刀刃62僅陷入至基板⑺數卜爪，卻使第] 劃線32形成至較外周刀刀62更深之位置。 第2劃線32之深度D2係由按壓外周刀刃62之荷重、外周 刀刃62之刀尖角度、切口63之數量等而決定。例如，切口 63之數量越多，荷重越集中於外周刀刃62之凸部料，因此 第2劃線32之深度D2增大。另一方面，若切口 63之數量過 157674.doc •10· 201211623 度增多，則各個切口 63過度縮小’從而無法充分獲得設置 切口 63之效果。因此’切口 63之數量係設為50〜300。於 50〜300之情形時’第2劃線32之深度D2成為基板1〇之板厚 T之75〜85%左右（例如80%左右）。因此，夾著第2劃線32之 兩側之玻璃能夠以大拇指之力道程度加以分斷。 繼而，如圖2B所示’翻轉面板，將切割棒3按壓至另一 基板20之外表面21中與第1劃線3 1相對向之部分，對一基 板10施加彎曲應力。如此一來，拉伸應力作用於第1劃線 31之底部’裂缝自底部在板厚方向上伸展，到達一基板 之内表面12為止。 藉此’應力或衝擊等作用於第2劃線32。如此一來，夾 著第2劃線32之兩側之玻璃能夠以大拇指之力道程度加以 分斷’因此裂縫亦自第2劃線32之底部在板厚方向上伸 展，到達基板10之内表面12為止。 如此’於本實施形態中，不改變切割棒3之方向，僅進 行一次切割操作’即可切斷基板1 〇，因此可提高可作業 性。 再者，於本實施形態中，圖2A〜圖2B所示之基板丨〇之切 斷步驟及圖2C〜圖2D所示之基板20之切斷步驟係設為相 同’但本發明並不限定於此。例如，任一切斷步驟均可與 先前相同* 不過’於搭載有液晶面板（包含液晶手寫板或觸控面板 等）之行動設備（例如，行動電話）70中，有如圖8A〜圖犯所 示’將包含液晶面板74之第2殼體72可開啟及關閉地連結 157674.doc 11 201211623 於包含輸入鍵73等之第1殼體71者。作為連結機構，有將 第1殼體71與第2殼體72可旋轉地加以連結者。於此情形 時，多數情況如圖8A所示’使液晶面板74之短邊78與旋轉 軸75平行。 圖8 Α係表示行動設備70已開啟之狀態。於該狀態下，操 作者根據液晶面板74之畫面顯示，操作輸入鍵73等，實施 各種處理。當不使用時，則如圖8B所示，使第2殼體72相 對於第1殼體71旋轉而摺疊。藉此，行動設備70成為關閉 狀態，輸入鍵73之誤操作得以防止，並且液晶面板74受到 保護。 在該行動設備70已開啟之狀態下，於第1或第2殼體71、 72上載置有筆型輸入裝置或圓珠筆等棒狀物8〇時，若行動 設備70成為關閉狀態，則多數情況下液晶面板74之長邊76 會被棒狀物80按壓。其原因在於，由於旋轉軸75之存在， 棒狀物80容易以橫穿液晶面板74之長邊76之方式配置。 於本貫施形態中’關於液晶面板74之長邊76，由於相對 應之第1劃線3 1係利用標準刀刃而形成，故而與利用高參 透刀刃形成之情形時相比，玻璃之切斷面光滑。因此，液 晶面板74之長邊76的邊緣強度較高，即使被按壓亦難以破 裂。因此，可抑制液晶面板74之破裂。 再者’於本實施形態中，係將液晶面板74搭載於摺叠式 之行動設備70中，但液晶面板74之用途並無限制，亦可將 液晶面板74搭載於例如無圖8 A~圖8B所示之旋轉軸75之行 動設備中。於此情形時，亦係若液晶面板74之長邊76側之 157674.doc •12· 201211623 邊緣強度高，則液晶面板7 4之外緣全周之平均邊緣強度 高，因此可抑制液晶面板74之破裂。 其次’再度參照圖3 A~圖3B ’對第1劃線3丨與第2劃線32 之形成順序進行說明。 首先，如圖3 A所示，使用包含標準刀刃之第i圓盤割刀 50，形成第1劃線31。第1劃線31係隔開間隔，相互平行地 設置有複數條。 繼而，如圖3B所示，使用包含高滲透刀之第2圓盤割刀 60，形成第2劃線32。第2圓盤割刀6〇係沿著外周設置有充 足數量之切口 63,因而容易陷人至基板1()中。因此，可抑 制第2圓盤割刀60在橫切第!劃線”時，由於阻力之急遽變 化而發生彈跳，從而可抑制第2劃線32中斷。其結果為， 可提高切斷面品質。 參照特定之實施態樣對本發明進行了詳細說明，但業者 當知’可於不脫離本發明之精神與範圍之情況下施加各種 修正或變更。 本申請案係基於2 0! 〇年7月2 3日申請之日本專利申靖 2〇10-166346者，其时係作為參照併入於此。 【圖式簡單說明】 實施形態之顯示 圖1係本發明之一 驟圖； 面板之製造方法之步 之說明圖（1); 之說明圖（2); 之說明圖（3); 圖2A係單元製作步戰 圖2B係單元製作步驟 圖2C係單元製作步驟 I57674.doc 201211623 圖2D係單元製作步驟之說明圖(4); 圖_單元製作步驟之說明圖（5); 圖3A係母_基板之切斷方法之說明圖⑴ 圖係母麵騎之㈣方法之說明圖⑺ 圖4係第1圓盤割刀之立體圖； 圖 圖5係第1圓盤割 刀之使用狀態下之母玻璃基板之剖面 圖6係第2圓盤割刀之立體圖； 圖7係第2圓盤割刀之使用狀態下之母玻璃基板之剖面 圖8 A係表示顯示面板之向行動設備之搭載狀態之一例之 立體圖（1);。 圖係表示顯示面板之向行動設備之搭載狀態之一例之 立體圖（2);及 圖9係藉由先前之高滲透刀刀而形成之劃線之平面放大 圖。 【主要元件符號說明】 2 面板 3 切割棒 4 單元 6 ' 76 長邊 8 ' 78 短邊 10 ' 20 母玻璃基板 11、21 外表面 157674.doc -14· 201211623 12、 22 内表面 31 ' 41 第1劃線 32 第2劃線 50 第1圓盤割刀 51 > 61 軸孔 52、 62 外周刀刃 60 第2圓盤割刀 63 切口 64 外周刀刃62之凸部 70 行動設備 71 第1殼體 72 第2殼體 73 輸入鍵 74 液晶面板（顯示面板） 75 旋轉軸 80 棒狀物 101 劃線 102 裂缝 D1 第1劃線3 1之深度 D2 第2劃線32之深度 S1L· -S15 步驟 T 基板10之板厚 157674.doc -15-201211623 SUMMARY OF THE INVENTION [Technical Field] The present invention relates to a method of manufacturing a display panel and a display panel, and more particularly to a method of manufacturing a liquid crystal panel and a liquid crystal panel. [Prior Art] As a method for manufacturing a liquid crystal panel (LCD), it is widely used to form a panel by sealing a liquid crystal material between two mother glass substrates (hereinafter referred to as "substrate"). A method of producing a plurality of cells by a panel (for example, 'refer to Patent Document 1}. In this method, when cutting a panel, using a scribe line and a cutting method) in the scribe line and the cutting method, 'first, the disk cutter is used. The outer peripheral blade is pressed against one of the substrates constituting the panel, and is moved while rotating, thereby forming the first and second scribe lines (initial cracks) of the positive parent. Then, the flip panel 'breaks the bar' Pressing to a specific position on the other substrate, a bending stress is applied to a substrate, whereby tensile stress acts on the bottom of the first and second scribe lines, and the crack is stretched in the thickness direction, thereby cutting a substrate Then, the other substrate is cut in the same manner. Thus, the panel is cut to form a plurality of cells. However, when the second scribe line is formed laterally after forming the scribe line in the longitudinal direction, there is a production place. In the case of a line jump, it is considered that the line jump is caused by the following reason: when the disk cutter forming the second scribe line crosses the first scribe line, the bounce occurs due to a sudden change in resistance. When the jump occurs, the substrate is cut at an unintended position, resulting in a decrease in the quality of the cut. For this, in Patent Document 1, it has been proposed to use a disc cutter having a degree of grinding more than that formed by the i-th 157 674.doc 201211623 The thick blade is a peripheral knife that forms the second scribe line cutter. The thicker blade is more likely to be trapped on the substrate, so that it is possible to suppress the occurrence of intersection jump when the second scribe line is cross-cut. The degree is determined by the angle of the blade edge of the outer blade. Further, in Patent Document 1, it has been proposed to form the i-th scribe line on the surface of the cut surface of the substrate which is required to be more strong. In the outer blade of the disc cutter, a sharp knife with a finer degree of grinding is used, so that the cut surface becomes smooth and the edge strength becomes high. In addition, in recent years, as a disc cutter forming a scribing outer circumference Blade, has been developed along A blade having a plurality of slits (so-called high-permeability blade) is provided on the outer circumference (for example, refer to Patent Document 2). If a high-permeability knife is used to form a scribe line, the load is concentrated on the convex portion of the high-permeability blade, so that it is highly permeable. The convex portion of the blade is immersed in the number of substrates, and the depth of the scribe line is about 80% of the thickness of the plate. Therefore, the operator can cut the substrate by the scribe line by the force applied by the thumb. [Previous Technical Literature] [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. 2007-140131 [Patent Document 2] Japanese Patent Laid-Open Publication No. 2010-6672 (Summary of the Invention) [Problems to be Solved by the Invention] However, the patent In the method described in Document 1, in order to estimate the stretching stress of the κ & spoon, the effect is applied to the bottom of the first and second scribe lines which are orthogonal to each other, and the direction of the double boring bar is changed, and the cutting is performed twice. Poor processability. 157674.doc 201211623. In the method described in Patent Document 2, # requires the operator to apply force with the big finger, and thus there is room for improvement in workability. Further, in the method described in Patent Reading 2, when the convex portion of the high-permeability blade is caught in the substrate, the stress concentrates on the corner portion of the trapped region (the region indicated by oblique lines in FIG. 9), thereby A crack 102 is also formed in the direction of the line and the line. Therefore, the edge of the display panel is low in strength. The display panel is easily broken. The present invention has been made in view of the above circumstances, and an object thereof is to provide a method of manufacturing a display panel which can suppress cracking of a product and improve workability. [Means for Solving the Problems] In order to solve the above problems, a first aspect of the present invention is a method of manufacturing a display panel, comprising forming a second and second scribe lines orthogonal to each other on a surface of a mother glass substrate to cause cracks a step of cutting the mother glass substrate by extending the first and second scribe lines in the thickness direction; and forming the first scribe line corresponding to the long side of the display panel, and using the outer circumference a first disk cutter having 〇~5 slits; and a second disk cutter having 50 to 300 slits along the outer circumference when forming the second scribe line corresponding to the short side of the display panel . According to a second aspect of the invention, in the method of manufacturing the display panel of the first aspect, the first disc is preferably formed by using the first disc cutter, and the second disc cutter is used to form the first 2 lines. In the method of manufacturing the display panel of the present invention, it is preferable that the depth of the first scribe line is 5 to 25% of the thickness of the mother glass substrate. Further, it is preferable that the depth of the second scribe line is 75 to 85% of the thickness of the mother glass substrate. Further, it is preferable that the thickness of the mother glass substrate is 〇1 to 3 mm. Further, it is preferable that the first and second disk cutters include a peripheral blade on a disk-shaped body having a shaft hole at the center. Further, the present invention provides a display panel obtained by the method of manufacturing a display panel of the present invention. Preferably, the display panel is a liquid crystal panel. [Effects of the Invention] According to the first aspect, a method of manufacturing a display panel which can suppress cracking of a product and improve workability can be provided. According to the second aspect, it is possible to suppress the second disc cutter from bouncing when the first scribing line is cross-cut, thereby suppressing the second scribing interruption. [Embodiment] Hereinafter, embodiments for carrying out the invention will be described with reference to the drawings. Further, the present invention is not limited to the embodiments described below, and various modifications and substitutions may be made to the embodiments described below without departing from the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a step-by-step view showing a method of manufacturing a display panel according to an embodiment of the present invention. In the present embodiment, the method of manufacturing a liquid crystal panel (LCD) will be described. However, the present invention can also be applied to, for example, a plasma display panel I57674.doc 201211623 (PDP 'Plasma Display Panel) or organic 乩(4)(10) (10)(10) , other methods of manufacturing panels such as electroluminescence panels. As shown in FIG. 1 , a method for manufacturing a liquid crystal panel includes: a TFT (Thin Film - Transistor) substrate fabrication step (step Μ!), and a CF (C〇l〇r Filter, color filter) substrate fabrication. Step (step si2), panel making step (step S13) 'unit making step (step S14) and module assembling step (step S15). In the TFT substrate manufacturing step (step S11), a TFT (thin film dielectric) or the like is formed in a specific pattern on one mother glass substrate (hereinafter simply referred to as "substrate") to fabricate a TFT substrate. In the CF substrate fabrication step (step S12), a CF substrate is formed by forming CF (color filter) or the like on a different substrate in a specific pattern. The order of the steps S11 and s 12 is not limited and may be carried out simultaneously. In the panel manufacturing step (step S13), the TFT substrate and the CF substrate are bonded via a spacer. At this time, the TFT substrate and the CF substrate are bonded to each other such that TFTs, CFs, and the like are disposed between the two substrates. Then, a liquid crystal material was sealed between the TFT substrate and the CF substrate to fabricate a panel. In the single manufacturing step (step S14), the panel is cut and a plurality of units are produced. In this case, the details will be described later, and the respective substrates are cut to cut the panel. In the module assembly step (step s 15), components such as a control circuit such as an electrically controlled TFT and a backlight as a light source are mounted in a cell to fabricate a liquid crystal panel. Further, in the present embodiment, after the liquid crystal material is sealed, the two substrates are cut, but after the two substrates are cut, the liquid crystal material 157674.doc 201211623 may be sealed. Next, the unit fabrication steps shown in Fig. 1 will be described in detail based on Figs. 2A to 2E and Figs. 3A to 3B. In the cell fabrication step, each of the substrates is cut to cut the panel. First, as shown in FIG. 2A and FIG. 3A to FIG. 3B, first and second scribe lines (initial cracks) 31, 32» first strokes are formed on the outer surface 11 of the substrate 10 constituting the panel 2. The lines 31 are spaced apart from each other and are provided in parallel with each other in parallel. Similarly, the second scribe lines 32 are also spaced apart from each other, and a plurality of strips are provided in parallel with each other. The above interval may be unequal as shown in FIG. 3A to FIG. 2, or may be equal. Further, on the inner surface 12 of the substrate 10, a TFT, a CF, or the like (not shown) is formed in advance. Then, as shown in Fig. 2B, the panel 2 is turned over, and the cutting bar 3 is pressed to a specific position on the outer surface 21 of the other substrate 20, and a bending stress is applied to a substrate 1?. Thereby, the tensile stress acts on the bottom of the first and second scribe lines 3, 32, so that the crack extends from the bottom in the thickness direction, and one substrate 1 切断 is cut. Then, as shown in FIG. 2C, on the outer surface 21 of the other substrate 20, the first and second scribe lines which are orthogonal to each other are formed in the same manner as in FIG. 2A (in the figure %, only the first figure is shown). Line 41). Further, on the inner surface 22 of the other substrate 20, CF, TFT, or the like (not shown) is formed in advance. Finally, as shown in Fig. 2D, the panel 2 is again turned over, and the cutting bar 3 is pressed to a specific position on the outer surface 11 of the substrate 10, and the other substrate 2 is cut in the same manner as in Fig. 2B. Thus, as shown in Fig. 2E, the panel 2 is cut, and a plurality of units 4 are produced. Further, in the present embodiment, the first and second scribe lines 31 and 32 are formed on the outer surface u 157674.doc 201211623 of the substrate 10, and then the outer surface 21 of the other substrate 20 is formed. 1 and 2nd scribe lines, but these steps can also be performed simultaneously. Next, the cutting step of the substrate 1 shown in Figs. 2A to 2B will be described in detail. Incidentally, the cutting steps of the substrate 20 shown in Figs. 2C to 2D are the same, and the description thereof will be omitted. In the present embodiment, in the step shown in FIG. 2A, when the long side of the liquid crystal panel, that is, the first j line 3 1 corresponding to the long side 6 of the unit 4 shown in FIGS. 3A to 3B is formed, A first disc cutter 5 having 0 to 5 slits along the outer circumference was used. On the other hand, when forming the short side of the liquid crystal panel, that is, the second scribe line 32 corresponding to the short side 8 of the unit 4, the second disc having 5 〇 to 3 切口 slits along the outer circumference is used. Knife 60. The first and second disc cutters 50, 60 may be incorporated in a holder" and may be configured to move between a use position and a non-use position, respectively, and may be used separately as appropriate. Figure 4 is a perspective view of the fifth disc cutter. Fig. 5 is a cross-sectional view showing the substrate in the state in which the iija disk cutter is used. As shown in Fig. 4, the first disc "knife 50" is a disc-shaped body having a shaft hole 51 at the center, and includes a peripheral cutter 52. The peripheral cutting edge 52 is formed of diamond or super steel alloy or the like. The outer peripheral blade 52 is referred to as a so-called standard blade, and has a knuckle of five to five (one in FIG. 4) slits along the outer circumference. By setting the number of slits to j or less, the smooth first stroke and (four) can be formed, and the long and wide edge strength of the unit 4 can be improved. Further, the edge strength of the long side of the liquid crystal panel can be increased. Further, the outer diameter of the disk cutter is preferably 1 〇. When the first disc cutter 50 is used for the second disc, as shown in Fig. 5, the outer peripheral cutter 5 is completely moved, and the surface is moved while rotating, thereby forming the first scribing line I57674.doc 201211623 3 The peripheral blade 52 is only caught in the number of turns of the substrate 1, but the second wire 31 is formed to a position deeper than the outer peripheral blade 52. The depth D1 of the first scribe line 31 is determined by pressing the load of the outer peripheral blade 52, the angle of the blade edge of the outer peripheral blade 52, and the like, and is preferably 5 to 25% of the thickness T of the substrate 1G. When it is set to 5% or more, the tensile stress can be applied to the [dotted line 3 1 _ ” along the t-th scribe line 3 切断. On the other hand, if it exceeds 25 / 〇 ', the weight is excessively increased, and the crack is formed in the direction intersecting the first scribe line 3 1 ', resulting in a decrease in the strength of the cut surface. Further, the thickness 基板 of the substrate 1 Τ is usually o. id mm. Fig. 6 is a perspective view of the second disc cutter 60. Fig. 7 is a cross-sectional view showing the substrate in the state in which the second disk cutter is used. As shown in Fig. 6, the second disk cutter 60 has a disk-shaped body ” having a shaft hole 61 at its center, and includes a peripheral blade 62. The peripheral cutting edge 62 is formed of diamond or super steel alloy or the like. The peripheral blade 62 is referred to as a so-called high-permeability blade and has 50 to 3 slits 63 along the outer circumference. Further, the outer diameter of the second disc cutter is preferably φ 1 to φ 10 mm. When the second disk cutter 60 is used, as shown in Fig. 7, the outer peripheral blade "presses the substrate lGJi to rotate the surface-surface, thereby forming the second scribe line 32. At this time, the outer peripheral blade 62 It is only trapped in the substrate (7), but the scribe line 32 is formed deeper than the outer peripheral blade 62. The depth D2 of the second scribe line 32 is controlled by the load of the outer peripheral blade 62 and the tip of the outer peripheral blade 62. The angle, the number of the slits 63, and the like are determined. For example, the more the number of the slits 63 is, the more the load is concentrated on the convex portion of the outer peripheral blade 62, so that the depth D2 of the second scribe line 32 is increased. When the number is 157674.doc •10·201211623 degrees increase, the slits 63 are excessively reduced', so that the effect of providing the slits 63 cannot be sufficiently obtained. Therefore, the number of the slits 63 is set to 50 to 300. In the case of 50 to 300 The depth D2 of the second scribe line 32 is about 75 to 85% (for example, about 80%) of the thickness T of the substrate 1 。. Therefore, the glass on both sides of the second scribe line 32 can be used as the thumb. The degree is divided. Then, as shown in Fig. 2B, 'turn the panel, press the cutting rod 3 Pressing to a portion of the outer surface 21 of the other substrate 20 opposite to the first scribe line 3 1 applies a bending stress to a substrate 10. Thus, tensile stress acts on the bottom of the first scribe line 31. The bottom portion extends in the thickness direction to reach the inner surface 12 of the substrate. The stress or impact or the like acts on the second scribe line 32. Thus, the glass sandwiching the two sides of the second scribe line 32 can The degree of force of the thumb is divided. Thus, the crack also extends from the bottom of the second scribe line 32 in the thickness direction to reach the inner surface 12 of the substrate 10. Thus, in the present embodiment, the cutting rod 3 is not changed. In the direction, the substrate 1 can be cut only by one cutting operation, so that workability can be improved. In the present embodiment, the substrate 丨〇 cutting step shown in FIGS. 2A to 2B and FIG. 2C are performed. The cutting step of the substrate 20 shown in FIG. 2D is the same. However, the present invention is not limited thereto. For example, any cutting step may be the same as before. However, the liquid crystal panel (including the liquid crystal tablet) is mounted. Mobile devices such as touch panels, etc. In the mobile phone 70, as shown in FIG. 8A to FIG. 8A, the second casing 72 including the liquid crystal panel 74 can be opened and closed to be connected to 157674.doc 11 201211623 in the first casing 71 including the input key 73 and the like. As the connection mechanism, the first case 71 and the second case 72 are rotatably coupled. In this case, as shown in FIG. 8A, the short side 78 and the rotation axis of the liquid crystal panel 74 are often used. Fig. 8 shows a state in which the mobile device 70 is turned on. In this state, the operator performs various processes in accordance with the screen display of the liquid crystal panel 74, the operation of the input key 73, and the like. When not in use, as shown in Fig. 8B, the second casing 72 is folded in relation to the rotation of the first casing 71. Thereby, the mobile device 70 is turned off, the erroneous operation of the input key 73 is prevented, and the liquid crystal panel 74 is protected. When the mobile device 70 is turned on, when the pen type input device or the ball 8 such as a ballpoint pen is placed on the first or second casings 71 and 72, if the mobile device 70 is turned off, most cases are performed. The long side 76 of the lower liquid crystal panel 74 is pressed by the rod 80. The reason for this is that the rod 80 is easily disposed to traverse the long side 76 of the liquid crystal panel 74 due to the presence of the rotating shaft 75. In the present embodiment, the long side 76 of the liquid crystal panel 74 is formed by using a standard blade as the corresponding first scribe line 3 1 is formed, so that the glass is cut off compared with the case where the high-reflection blade is used. The surface is smooth. Therefore, the long side 76 of the liquid crystal panel 74 has a high edge strength and is hard to be broken even if it is pressed. Therefore, cracking of the liquid crystal panel 74 can be suppressed. In the present embodiment, the liquid crystal panel 74 is mounted on the folding mobile device 70. However, the use of the liquid crystal panel 74 is not limited, and the liquid crystal panel 74 may be mounted on, for example, FIG. 8A to FIG. 8B is shown in the mobile device of the rotating shaft 75. In this case, if the edge strength of the long side 76 side of the liquid crystal panel 74 is 157674.doc •12·201211623, the average edge strength of the outer periphery of the liquid crystal panel 74 is high, so that the liquid crystal panel 74 can be suppressed. The rupture. Next, the order in which the first scribe line 3 丨 and the second scribe line 32 are formed will be described with reference to Figs. 3A to 3B' again. First, as shown in Fig. 3A, the first scribing line 31 is formed using the i-th disc cutter 50 including a standard blade. The first scribe line 31 is spaced apart from each other, and a plurality of strips are provided in parallel with each other. Then, as shown in Fig. 3B, the second scribing blade 32 is formed using the second disc cutter 60 including the high-permeability knife. The second disc cutter 6 is provided with a sufficient number of slits 63 along the outer circumference, and thus is easily trapped in the substrate 1 (). Therefore, it is possible to suppress the second disc cutter 60 from bouncing due to a sudden change in the resistance when the second scribing blade 60 is transversely cut, thereby suppressing the interruption of the second scribing line 32. As a result, the quality of the cut surface can be improved. The present invention has been described in detail with reference to the specific embodiments thereof, and it is understood that various modifications and changes can be made without departing from the spirit and scope of the invention. The present application is based on 2 0! Japanese Patent Application Laid-Open No. Hei 10-166346, the entire disclosure of which is hereby incorporated by reference in its entirety in its entirety in the the the the the the the the Description of the steps (1); Description of the diagram (2); Description of the diagram (3); Figure 2A is a unit production step 2B system unit production steps Figure 2C system unit production steps I57674.doc 201211623 Figure 2D system unit Explanation of the production steps (4); Figure _ explanatory diagram of the unit fabrication steps (5); Figure 3A is a description of the cutting method of the mother _ substrate (1) Diagram of the method of the mother-side riding (4) (7) Figure 4 The perspective view of the first disc cutter; Fig. 5 is the first disc cutter FIG. 6 is a perspective view of the second disc cutter in the state of the mother glass substrate in the state of use; FIG. 7 is a cross-sectional view of the mother glass substrate in the state in which the second disc cutter is used. FIG. 8 shows the action of the display panel. A perspective view (1) of an example of a mounted state of the device; Fig. 9 is a perspective view (2) showing an example of a mounting state of the display panel to the mobile device; and Fig. 9 is a scribe line formed by the previous high-permeability knife Plane enlargement. [Main component symbol description] 2 Panel 3 Cutting bar 4 Unit 6 ' 76 Long side 8 ' 78 Short side 10 ' 20 Mother glass substrate 11, 21 External surface 157674.doc -14· 201211623 12, 22 Surface 31 ' 41 1st scribe line 32 2nd scribe line 50 1st disc cutter 51 > 61 Shaft hole 52, 62 Peripheral blade 60 Second disc cutter 63 Notch 64 Projection of peripheral blade 62 70 Mobile device 71 1st housing 72 2nd housing 73 Input key 74 Liquid crystal panel (display panel) 75 Rotary shaft 80 Rod 101 Cross stitch 102 Crack D1 1st scribe line 3 1 depth D2 2nd scribe line 32 depth S1L · -S15 Step T Substrate 10 Plate thickness 157674.doc -15-