TW201203062A - Conductive sheet, method of using conductive sheet and capacitive-type touch panel - Google Patents

Conductive sheet, method of using conductive sheet and capacitive-type touch panel Download PDF

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TW201203062A
TW201203062A TW100103120A TW100103120A TW201203062A TW 201203062 A TW201203062 A TW 201203062A TW 100103120 A TW100103120 A TW 100103120A TW 100103120 A TW100103120 A TW 100103120A TW 201203062 A TW201203062 A TW 201203062A
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conductive
conductive sheet
lattice
lattices
pattern
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TW100103120A
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Chinese (zh)
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TWI430161B (en
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Tadashi Kuriki
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Fujifilm Corp
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04112—Electrode mesh in capacitive digitiser: electrode for touch sensing is formed of a mesh of very fine, normally metallic, interconnected lines that are almost invisible to see. This provides a quite large but transparent electrode surface, without need for ITO or similar transparent conductive material

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Position Input By Displaying (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

A first conductive sheet (10A) includes a first transparent base (12A), at least two first conductive large grids (14A) formed first on the first transparent base (12A), and a first connection part (16A) formed on the first transparent base (12A) and which electrically connects the adjacent first large grids (14A) with each other. Each of the first large grids (14A) is formed by combining at least two small grids (18). The width Wc1 of the first connection part (16A) satisfies the relational expression Wc1 > Ps/ √ 2 where Ps is the pitch of the small grids (18).

Description

201203062 JDODipif 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種導電片、導電片的使用方法以及 靜電電容式觸控面板’例如，本發明是有關於一種適合用 於投影型靜電電容式的觸控面板的導電片、導電片的使用 方法以及靜電電容式觸控面板。 【先前技術】 關於使用金屬細線的透明導電膜，例如，如美國專利 申請公開第2004/0229028號說明書以及國際公開第 2006/001461號手冊所揭示般，正在繼續進行研究。 最近’觸控面板受到關注。一般認為，觸控面板主要 疋應用於個人數位助理（Personal Digital Assistant，PDA) 或行動電話等小尺寸設備，但由於對個人電腦用顯示器等 的應用而向大尺寸化進步。 在如此的未來的動向下，先前的電極由於使用氧化銦 錫（Indium Tin Oxide ’ ITO )’因此電阻變大，應用尺寸變 大，隨之，有電極間的電流的傳輸速度變慢、響應速度（接 觸指尖後直至檢測出該指尖的位置為止的時間）變慢的問 題0 、因此，想到了將多數個由金屬製細線（金屬細線）構 成的格子排列崎成電極’以此來降低表面電阻。作為將 金屬細線用於電極_控面板’彳物已知有專利文獻日本 ^利特開平5-224818號公報、美國專利第5113〇41號說明 曰、國際公開第1995/27334號手冊、美國專利申請公開第 4 201203062 2004/0239650號說明書、美國專利第72〇2859號說明書、 國際公開第1997/18508號手冊、日本專利特開2GG3-099185 號公報。 然而，於將金屬細線用於電極時，由於金屬細線是由 不透明之材料所製作，故透明性或視認性成問題。 【發明内容】 本發明是考慮到上述問題而成，其目的在於提供一種 即便於觸控面射时>1細線_構成電極時亦可確保高 透明性的導電片、導電片的使时法以及靜電電容式觸控 面板。 [1]本發明的第1發明的導電片的特徵在於：包括基體 =成於基體上之導電部，上述導電部形成有由金屬細線 形成的2個以上的導電性的大格子、及將相鄰接的上述大 格子間加以電性連接的由金屬細線形成的連接部，各上述 大格子分別是由2個以上的小格子組合而構m 口201203062 JDODipif VI. Description of the Invention: [Technical Field] The present invention relates to a conductive sheet, a method of using a conductive sheet, and an electrostatic capacitive touch panel. For example, the present invention relates to a suitable type for electrostatic discharge. A conductive sheet of a capacitive touch panel, a method of using the conductive sheet, and a capacitive touch panel. [Prior Art] Regarding the use of a transparent conductive film of a metal thin wire, for example, as disclosed in the specification of the U.S. Patent Application Publication No. 2004/0229028 and the International Publication No. 2006/001461, the research is continuing. Recently, touch panels have received attention. It is generally considered that the touch panel is mainly applied to a small-sized device such as a personal digital assistant (PDA) or a mobile phone, but it has been increasing in size due to applications for displays for personal computers and the like. In the future, the previous electrode uses Indium Tin Oxide 'ITO', so the resistance becomes larger, and the application size becomes larger. Accordingly, the transmission speed of the current between the electrodes becomes slower and the response speed is increased. (The time until the position of the fingertip is detected after touching the fingertip) becomes slow. Therefore, it is thought that a plurality of lattices made of metal thin wires (metal thin wires) are arranged as an electrode to reduce Surface resistance. As a metal thin wire for an electrode, a control panel is known as a patent document. Japanese Patent Laid-Open No. Hei 5-224818, U.S. Patent No. 5,113,41, International Publication No. 1995/27334, and U.S. Patent Application No. 4 201203062 2004/0239650, U.S. Patent No. 72,2859, International Publication No. 1997/18508, and Japanese Patent Laid-Open No. 2GG3-099185. However, when a metal thin wire is used for an electrode, since the fine metal wire is made of an opaque material, transparency or visibility is a problem. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the invention is to provide a timing method for a conductive sheet or a conductive sheet which can ensure high transparency even when a thin line is formed on a touch surface. And a capacitive touch panel. [1] The conductive sheet according to the first aspect of the present invention, comprising: a substrate = a conductive portion formed on the substrate, wherein the conductive portion is formed with two or more conductive large lattices formed of fine metal wires, and a phase a connecting portion formed of thin metal wires electrically connected between the adjacent large lattices, wherein each of the large lattices is composed of two or more small lattices

存在上述小格子的電性絕緣的絕緣部， 案、上述絕緣部的排列而構成上述電路。 丨系之間配置有不 藉由上述導電圖 201203062 jJOJipif =如苐i發明所賴導”，其中上述A格子的 的長度為3 mm〜1 〇 mm。 [4]如第1發明所述的導電片，其中 的長度為30 _〜500㈣。 谷千的一邊 =如第丨發明所述的導訂，其中上述小袼 相向的邊的間隔為3〇 〜5〇〇 寬為Π/下爾賴導電片’料―屬細線的線 [7]本發明的第2發明的導電月 :上==二 部:及： B . , 幻弟2導電部，上述第1導電部 ==Γ形成的2個以上的導電性的第1大格子、 線來成的帛1 第1大格子間加以雜連接的由金屬細 成的2個以上的導電性部具有由金屬細線形 楚2女炊工pu、 们弟2大格子、及將相鄰接的上述 部，各上述^ 1°^性連接的由金屬細線形成的第2連接 χ ,." 子以及各上述第2格子分別是由2個 ===，上述第1大格子經由上述第1 、 方向上從而構成1個第1導電圖案，藉 於將ίί i格子與上述第2大格子的組合而構成電路， 間距設為，上述第1連接部的寬度 C 1上述第2連接部的寬度Wc2滿足 Wcl>ps/^The electrically insulating insulating portion of the small lattice is present, and the insulating portion is arranged to form the circuit. Between the lanthanides, there is no conduction by the above-mentioned conductive pattern 201203062 jJOJipif = 苐i invention, wherein the length of the above A lattice is 3 mm 〜1 〇 mm. [4] Conductive according to the first invention a sheet having a length of 30 _ to 500 (four). One side of the valley thousand = the guide according to the invention of the third aspect, wherein the interval of the opposite sides of the small cymbal is 3 〇 5 5 〇〇 width is Π / 尔 赖 导电 conductive The sheet "material" is a thin line [7] The conductive month of the second invention of the present invention: upper == two parts: and: B. , the magical 2 conductive portion, and the first conductive portion ==Γ The first large lattice of the above conductivity, the 帛1 which is formed by the wire, and the two or more conductive portions which are made of a fine metal between the first large lattices are made of a thin metal wire. 2 large lattices, and the adjacent portions, the second connection 由, ." and each of the second lattices formed by the thin metal wires connected by the above-mentioned ^1°^ are respectively composed of two === The first large lattice forms one first conductive pattern via the first and the first direction, and is configured by combining the ίί i lattice and the second large lattice. Circuit, the pitch is set, the width C of the first connecting portion 1 of the second connecting portion Wc2 meet Wcl > ps / ^

Wc2>Ps/VJ 〇 6 201203062 》COipif [8] 如第2發明的導電片，其中上述第i大格子經由上 述第1連接部排列於第1方向上從而構成由金屬細線形成 的1個第1導電圖案’ 2個以上的上述第2大格子經由上 述第2連接部排列於與上述第丨方向正交的第2方向上從 而構成由金屬細線形成的1個第2導電圖案，於相鄰接= 上述第1導電®案之間配置林存在上料格子的電性絕 緣的第1絕緣部，於相鄰接的上述第2導電圖案之間配置 有不存在上述小格子的電性絕緣的第2絕緣部，藉由上述 第1導電圖案、上述第2導電圖案、上述第i絕^部、上 述第2絕緣部的排列而構成上述電路。 [9] 如第2發明的導電片’其中上述金屬細線的線寬為 10 Am以下。 [10] 如第2發明的導電片，其中上述第i大格子 部的直線部與上述第2大格子的邊部的直線部間之投影距 離是根據上述小格子的尺寸而設定。 [11] 如第2發明的導電片，其中上述投影距離為1〇〇 〜400 以 m。 [12] 如第2發明的導電片，其中上述第1導電部具 連接於各上述第1導電圖案的端部的第1端子配線圖案， 及形成於上述基體的—魅面的丨條邊的長度方向中央 分、且與對應的上述第丨端子配線圖案連接的多個第工、端 子；上述第2導電部具有：連接於各上述第2導電圖 端部的第2端子配線圖案’及形成於上述基體的另一主面 的1條邊的長度方向中央部分、且觸應的上述第2端子 201203062 配線圖案連接的多個第2端子。 ，排 [13]如第2發明的導電片，其中自上表面觀看時 端子 列有多個上述第1端子的部分與排列有多個上述第2 的部分相鄰接。 [14]如第2發明的導電片’其中各上述第i導電 ，端部與對應的上述第丨端子配線圖案分別經由第i結線 j而連接’各上述第2導電圖案的端部與對應的上述第2 端子配線®案是分舰由第2結線部而連接，多個上述 、、、。線。卩/σ著上述第2方向而直線狀地排列，多個上述2 結線部沿著上述第1方向而直線狀地排列。 间如f2發明的導電片，其十上述第i絕緣部與上 =第2絕緣特上述基體夾在中間而相向，自上表面觀看 ^，上述第1絕緣部與上述第2絕緣部的相向部分的形狀 為多邊形狀。 [16]如第2發明的導電片，其中上述多邊形狀為正方 市狀。 [Π]如第2發明的導電片，其中上述多邊形狀為楔形 [18] 如第1發明或第2發明的導電片，其中上述小格 子為多邊形狀。 [19] 如f 2發明的導電片，其中上述小格子為正方形 [20]本發明的第3發明的導電片的使用方法是使用第 1導電片與第2導電片的導電片的使用方法，上述第】導 8 201203062 3003 ipif 電片上形成有由金屬細線形成的2個以上的導電性的第i 大格子、及將相鄰接的上述第1大格子間加以電性連接的 由金屬細線形成的第1連接部，各上述第〗大格子分別是 由2個以上的小格子組合而構成，於將上述小格子的間距 設為Ps時，上述第1連接部的寬度Wcl滿足Wcl >ps/w， 上述第2導電片上形成有由金屬細線形成的2個以上的導 電性的第2大格子、及將相鄰接的上述第2大格子間加以 電性連接的由金屬細線形成的第2連接部，各上述第2大 格子分別是由2個以上的小格子組合而構成，於將上述小 格子的間距設為PS時，上述第2連接部的寬度Wc2滿足 Wc2>Ps/VJ ’該導電片的使財法的特徵在於：上述第i 導電片中2個以上的上述第1大格子經由上述第^連接 部排列於第1方向上從而構成丨個第〗導電圖案，上述第 2導電片中，2個以上的上述第2大格子經由上述第2連接 於與上述第1方向正交的第2方向上從而構成1個 第導電圖案，藉由將上述第1導電片與上述第2導電片 =以將上述第1電片的上述第i連接部與上述第2導 心^上述第2連接部組合以形成上述小格子的排列的方 式配置。 本發明的第4發明的靜電電容式觸控面板的特徵 在於包括上述第1發明或第2發_導電片。 用太、^以上所說明’根據本發明的導電片以及導電片的使 Η _ ’可使形成於基體上的導糊案實現低電阻化，並 便於觸控面板中以金屬細線圖案構成電極時，亦可確 201203062 JDODipif 保高透明性’例如適合用於投影型靜電電容式的觸控面板。 另外，本發明的靜電電容式觸控面板可實現形成於基 體上的導棚案的低電阻化，並且即便於以金屬細線圖案 構成電極時，亦可確保高透明性，例如亦可應對投影型^ 電電容式的觸控面板的大尺寸化。 .上述目的及其他目的、特徵以及優點可根據與隨附圖 式相配合的較佳實施形態例的說明而更為清楚明瞭。 【實施方式】 ” 以下，參照圖1〜圖17，對本發明的導電片、導電片 的使用方纽及靜電電容式馳硫的實施形態例加以 明。再者，本說明書中表示數值範圍的「〜」的含義是， 將其前後所記制數值作為下限值以及域值而包含 内0 第1實施形態之導電片（以下記作第1導電片1〇Α) 如圖1所示，具有形成於第i透明基體12A (參昭圖 的一個主面上的第1導電部13A。該第i導電部13A形成 有由金屬細線形成的2個以上的導電性的帛】 14A、及將相鄰接的第1大格子ΜΑ間加以電性連接的由 金屬細線形成的第1連接部16Α’各第丨大格子ι4α 是由2個以上的小格子18細合而構成，藉由帛i大格子 14A的組合而構成電路（導電性的電路圖案）。此處，小格 子18是設定為最小的正方形狀。金屬細線例如是由金 (Au)、銀（Ag)或銅（Cu)構成。 第1大格子14A的一邊的長度較佳為3 mm〜10 _ 201203062 35651pif 更佳為4 mm〜6 mm。若一邊的長度小於上述下限值，則 於將第1導電片1GA用於例如觸控面板時，檢測時的第1 士格子14A的靜電電容降低，故成為檢測不良的可能性變 南另方面，若一邊的長度超過上述上限值，則位置檢 z則精度可能下降。就同樣的觀點而言，構成第1大格子14A 的小格子18的—邊的長度較佳為50 μιη〜5GQ ，更 佳為150 ym〜3〇〇以瓜。於小格子18為上述範圍時，進 而，透明性亦可保持良好，於安裝於顯示裝置的前表面時， 可看到顯示而無不協調感。 進而，2個以上的第丨大格子MA經由第丨連接部i6A ，歹】於x方向（第1方向）上’構成由金屬細線形成的1 固導電1±的電路圖案（以下，記作第丨導電圖案22A)，2 個，上的第1導電圖案2从排列在與x方向正交的y方向 (第2方向）上，於相鄰接的第1導電圖案22Λ之間，配 置有不存在小格子18的電性絕緣的第丨絕緣部24A。 X方向表不例如後述的投影型靜電電容式的觸控面板 =〇 (參照®I 3)的水平方向（或垂直方向）、或設置著觸 控面板100的顯示面板110的水平方向（或垂直方向）。 而且’如圖1所示，在第丨大格子14A的四個邊部中， 和不與鄰接的第i大格子14A連接的一個頂點部分心鄰 ，的第1邊部咖以及第2邊部咖，分別成為多數個針 ^的線32(小格子18的邊）自沿著第i邊部撕以及第2 邊部28b連續的直線部3〇梳齒狀地伸出的形態（以下，將 線32亦記作梳齒32)。另一方面，和不與鄰接的第】大格 201203062 JOODipif :點部分26b鄰接的第3邊部28c以及 邊_連續： 二成去 =-個小格子18 (準確-言是鄰接的: 〜第！ 具有4個中格子20(第1中格子20a 丄Itl銀齒狀地排列的形狀’其中上述中格 =20具有包含4個小格子18的大小。即，第 3子二IS部挪的直線部3〇與第4邊部，的直線部 的形^_ 1 18形成L字形的空間 2邊㈣b0^@/2Gb與第1中格子咖的1條邊（第 的ti l:)鄰接，具有形成有正方形的空間 14、卩將4個小格子18排列成矩陣狀並去掉中央十 1 3 _子咖與第i中格子2如鄰接， 相中格子遍鄰接而配置，具有與第2令格子20b :^形狀。第4中格子2〇d存在於第3邊部说的第2 Π!部3G(自最外側朝向第1大格子14A的内部的第2 =1與第1邊部—交界·，_中格子 2鄰接，並且與第3中格子加鄰接而配置，與第】甲 L具有與1個小格子18形成L字形的空間 4中格子20d的】條邊存在於第】大袼子Μ :的第4邊部28d的直線部3〇的延長線上。而且，將小格 18的排列間距設定為Ps時，尹格子加的排列間距化 xPs的關係。另外’第i連接部i6A的寬度㈣（第 12 201203062 3i)651pif 1中格子施的頂點至第3中格子20c的頂點之間，且沿 著y方向的距離）滿足Wci>Ps/万，此處為6x (ps/^ )。 存在於各第1導電圖㈣A的—個端部側的第丄大格 子14A的開放端成為不存在第丨連接部16A的形狀。存在 於各第1導電圖案22A的另一端部側的第i大格子14八的 端部經由第1結線部4〇a(參照圖3)而電性連接於由金屬 細線形成的第1端子配線圖案41a。 如此’第1導電片10A中，2個以上的第1大格子14A 經由第1連接部16A排列於X方向上’從而構成1個第1 導電圖案22A’分別將2個以上的小格子18組合而構成各 第1大格子14A ’當將小格子18的間距設定為Ps時，使 第1連接部16A的寬度Wcl滿足Wcl>Ps/VJ，因此與由 1個ITO膜形成1個電極的構成相比較，可大幅度地降低 電阻。因此，於使用該第1導電片10A而應用於例如投影 型靜電電容式的觸控面板時，可提高響應速度，且可促進 觸控面板之大尺寸化。 繼而，參照圖3〜圖7，對使用上述第1導電片i〇A 的觸控面板100加以說明。 觸控面板100具有感測器本體102及未圖示的控制電 路（由1C電路等構成）。如圖3、圖4以及圖5A所示，感 測器本體102具有由上述第1導電片10A與後述的第2導 電片10B積層而構成的第1實施形態的觸控面板用導電片 (以下，記作第1積層導電片50A)、以及積層於該第1 積層導電片50A上的保護層106(圖5A中省略保護層1〇6 13 201203062 -5 JUJipif 的記載）。第1積層導電片5〇A以及保護層106例如是配 置於液晶顯示器等的顯示裝置忉8中的顯示面板110上。 自上表面觀看時，感測器本體102具有配置於與顯示面板 110的顯示晝面110a對應的區域中的感測器部112、以及 配置於與顯示面板110的外周部分對應的區域中的端子配 線部114 (所謂邊框）。 應用於觸控面板1〇〇中的第1導電片10A如圖4所 示，於與感測器部112相對應的部分，排列有上述多數個 第1導電圖案22A，於端子配線部114，排列有自各第1 結線部40a導出的由金屬細線形成的多個第1端子配線圖 案 41a 〇 圖3的例子中’自上表面觀看時，第1導電片1〇A的 外形具有長方形狀’感測器部112的外形亦具有長方形 狀。端子配線部114中，於第1導電片10A的一條長邊側 的周緣部，在其長度方向中央部分，在上述一條長邊的長 度方向上排列形成有多個第i端子116a❶另外，沿著感測 器部112的一條長邊（距第1導電片10A的一條長邊最近 的長邊，y方向）而直線狀地排列有多個第丨結線部4〇a。 1結線部導出的第i端子配線圖案仏被引導 ° 1導電片10A的一條長邊的大致中央部，分ΜΙ*#、# :=:=第1端子一此，與對應於感 =是以大致相同的長度而引導連=第'= 導電片10A的角落部或其附近形成第1端子U6a，然而 201203062 ^DODipif 有以下問題：多個第1端子配線圖案41a巾，最長的第1 端子配線圖案41a與最短的第1端子配線圖案2la之間長 度上產生較大的差異，對於與最長的第1端子配線圖案41a 及其附近的多個第1端子配線圖案41a對應的第1導電圖 案22A的訊號傳輸變慢。因此，藉由如本實施形態般於第 1導電片1GA的—條長邊的長度方向中央部分形成第1端 子U6a ’可抑制局部的訊號傳輸的延遲，從而實現響應速 度的尚速化。 一另方面，第2導電片10B如圖3、圖4以及圖5A 所不’具有形成於第2透明基體12B的—個主面上的第2 導電4 13B。3亥第2導電部13B形成有由金屬細線形成的 上的導電性的第4 5大格子14B、以及將鄰接的第4 MB間電性連接的由金屬細線形成的第2連接部 L6B故各第4大格子14B如圖6所示，分別是由4個以上 組合而構成’第4連接部16B是藉由配置有 為大於1的實數）的間距的1個 、 子20而構成。關於第2大格子mb的一邊的 15 1 第1大格子⑽相同，較佳為3職= 2 带成的1饱=向（第4方向）上，從而構成由金屬細線 /成的1個導電性的電路圖案（以下 3 22B)，將2個以上的第2導 ㈣4導電圖案 4 更佳為4 mm〜6 mm。 5 16B^:於將4個以上的第4大格子14B經由第4連接部 6In the conductive sheet according to the second aspect of the invention, the first i-th lattice is arranged in the first direction via the first connecting portion to constitute one first metal thin wire. Two or more of the second conductive patterns are arranged in the second direction orthogonal to the second direction via the second connection portion to form one second conductive pattern formed of thin metal wires, and adjacent to each other Between the first conductive material, the first insulating portion having the electrical insulation of the loading grid is disposed between the first conductive material, and the electrical insulating layer having the small lattice is not disposed between the adjacent second conductive patterns. The insulating portion is configured by the arrangement of the first conductive pattern, the second conductive pattern, the ith portion, and the second insulating portion. [9] The conductive sheet of the second invention, wherein the metal thin wire has a line width of 10 Am or less. [10] The conductive sheet according to the second aspect of the invention, wherein a projection distance between a straight portion of the i-th large lattice portion and a straight portion of a side portion of the second large lattice is set according to a size of the small lattice. [11] The conductive sheet according to the second invention, wherein the projection distance is 1 〜 to 400 m. [12] The conductive sheet according to the second aspect of the invention, wherein the first conductive portion has a first terminal wiring pattern connected to an end portion of each of the first conductive patterns, and a length of a side of the ridge of the base body a plurality of dies and terminals connected in the center of the direction and connected to the corresponding second terminal wiring pattern; the second conductive portion has a second terminal wiring pattern ′ connected to each end of the second conductive pattern and formed on The second terminal of the one side of the other main surface of the base body in the longitudinal direction and the second terminal of the second terminal 201203062, which is connected to the wiring pattern. [13] The conductive sheet according to the second aspect of the invention, wherein the portion of the terminal array having the plurality of first terminals when viewed from the upper surface is adjacent to a portion in which the plurality of second portions are arranged. [14] The conductive sheet of the second aspect of the invention, wherein each of the ith conductive ends and the corresponding second terminal wiring pattern are connected to an end portion of each of the second conductive patterns via an ith junction j and a corresponding one In the case of the second terminal wiring о, the sub-ship is connected by the second junction portion, and the plurality of the above-mentioned wirings are plural. line.卩/σ is linearly arranged in the second direction, and a plurality of the two junction portions are linearly arranged along the first direction. In the conductive sheet of the invention of the invention, the first ith insulating portion and the upper/second insulating layer are opposed to each other, and the opposing portions of the first insulating portion and the second insulating portion are viewed from the upper surface. The shape is polygonal. [16] The conductive sheet according to the second aspect of the invention, wherein the polygonal shape is a square shape. The conductive sheet according to the second aspect of the invention, wherein the polygonal shape is a wedge shape. [18] The conductive sheet according to the first aspect or the second aspect of the invention, wherein the small lattice has a polygonal shape. [19] The conductive sheet according to the invention of the invention, wherein the small lattice is square [20] The method of using the conductive sheet according to the third aspect of the invention is a method of using the conductive sheet of the first conductive sheet and the second conductive sheet, The above-mentioned first guide 8 201203062 3003 ipif electric sheet is formed with two or more conductive i-th large lattices formed of thin metal wires and metal thin wires electrically connecting the adjacent first large lattices. Each of the first large portions is composed of a combination of two or more small squares. When the pitch of the small lattice is Ps, the width Wcl of the first connecting portion satisfies Wcl > ps /w, the second conductive sheet is formed with two or more conductive second large lattices formed of thin metal wires and a metal thin wire electrically connected between the adjacent second large lattices In the second connecting portion, each of the second large lattices is composed of a combination of two or more small lattices. When the pitch of the small lattices is PS, the width Wc2 of the second connecting portion satisfies Wc2 > Ps/VJ ' The conductive sheet is characterized by the financial method Two or more of the first large lattices in the i-th conductive sheet are arranged in the first direction via the first connection portion to constitute one of the first conductive patterns, and two or more of the second conductive sheets are two or more of the second conductive sheets. The large lattice is connected to the second direction orthogonal to the first direction via the second connection to form one first conductive pattern, and the first conductive sheet and the second conductive sheet are used to set the first conductive sheet The ith connection portion is disposed in combination with the second guide portion and the second connection portion to form an arrangement of the small lattices. A capacitive touch panel according to a fourth aspect of the present invention includes the first invention or the second hair-conducting sheet. According to the above description, the conductive sheet according to the present invention and the conductive sheet of the conductive sheet can reduce the resistance of the paste forming film formed on the substrate, and facilitate the formation of the electrode in the thin metal pattern of the touch panel. , can also be confirmed 201203062 JDODipif high transparency 'for example, suitable for projection type capacitive touch panel. Further, the capacitive touch panel of the present invention can achieve low resistance of a vial formed on a substrate, and can ensure high transparency even when the electrode is formed by a thin metal pattern, for example, a projection type can be handled. ^ The size of the capacitive touch panel is large. The above and other objects, features, and advantages will be apparent from the description of the preferred embodiments of the invention. [Embodiment] Hereinafter, an embodiment of a conductive sheet, a conductive sheet, and a capacitive type of the conductive sheet of the present invention will be described with reference to Figs. 1 to 17. Further, in the present specification, the numerical range is shown. In the meantime, the conductive sheet (hereinafter referred to as the first conductive sheet 1) of the first embodiment is included as the lower limit value and the domain value. The first transparent portion 12A is formed on the i-th transparent substrate 12A (the first conductive portion 13A on one main surface of the reference pattern. The first conductive portion 13A is formed with two or more conductive conductive layers formed of thin metal wires) 14A, and the phase is formed. The first connecting portion 16'' of each of the first connecting portions 16'' formed by the thin metal wires electrically connected between the adjacent first large lattices is composed of two or more small lattices 18, and is formed by 帛i The combination of the lattices 14A constitutes a circuit (a conductive circuit pattern). Here, the small lattices 18 are formed in a square shape having a minimum. The metal thin wires are made of, for example, gold (Au), silver (Ag), or copper (Cu). The length of one side of the first large lattice 14A is preferably 3 mm to 10 _ 201203062 More preferably, the 35651pif is 4 mm to 6 mm. When the length of one side is less than the above lower limit, when the first conductive sheet 1GA is used for, for example, a touch panel, the electrostatic capacitance of the first square lattice 14A during detection is lowered. In addition, when the length of one side exceeds the above upper limit, the accuracy of the position detection may be lowered. From the same viewpoint, the side of the small lattice 18 constituting the first large lattice 14A The length is preferably 50 μm to 5 GQ, more preferably 150 μm to 3 μm, and when the small lattice 18 is in the above range, the transparency can be kept good, and when mounted on the front surface of the display device, Further, two or more second large lattices MA are formed in the x direction (first direction) via the second connecting portion i6A, and constitute a solid conductive 1 formed of thin metal wires. ± circuit pattern (hereinafter referred to as second conductive pattern 22A), and two upper conductive patterns 2 are arranged in the y direction (second direction) orthogonal to the x direction, adjacent to each other Between the conductive patterns 22Λ, there is an electrical connection in which no small lattices 18 are present. The second insulating portion 24A. The X direction table is not, for example, a projection type capacitive touch panel to be described later = a horizontal direction (or a vertical direction) of 〇 (refer to ® I 3 ) or a display panel provided with the touch panel 100 The horizontal direction (or the vertical direction) of 110. And 'as shown in Fig. 1, in the four sides of the second large lattice 14A, and one apex portion not connected to the adjacent i-th large lattice 14A, Each of the first side portion and the second side portion is a line 32 (a side of the small lattice 18) in which a plurality of needles are twisted, and a straight portion 3 which is continuous along the i-th edge portion and the second side portion 28b is combed. The shape in which the shape is extended (hereinafter, the line 32 is also referred to as a comb 32). On the other hand, the third side portion 28c and the side _ continuous which are not adjacent to the adjacent first large cell 201203062 JOODipif: point portion 26b: two to go = a small lattice 18 (accurately - the words are adjacent: ~ There are four intermediate lattices 20 (the first intermediate lattice 20a 丄 It1 is arranged in a silver-toothed shape), wherein the above-mentioned middle lattice = 20 has a size including four small lattices 18, that is, a straight line of the third sub-IS portion The shape of the straight portion of the third portion and the fourth side portion is formed in an L-shaped space. The side (4) b0^@/2Gb is adjacent to one side (the first ti l:) of the first medium lattice coffee, and is formed. There is a square space 14, and four small lattices 18 are arranged in a matrix and the central ten 1 3 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The shape of the ^^. The fourth middle lattice 2〇d exists in the second Π! part 3G of the third side (the second =1 and the first side from the outermost side toward the inside of the first large lattice 14A) The middle lattice 2 is adjacent to each other, and is disposed adjacent to the third intermediate lattice. The first side of the lattice 20d in the space 4 having the L-shape with one small lattice 18 exists in the first side. 】 袼 Μ 的 的 的 的 的 的 的 的 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第 第Width (4) of the connecting portion i6A (12th 201203062 3i) 651pif 1 vertices to the vertices of the third intermediate lattice 20c and the distance along the y direction satisfy Wci > Ps / 10,000, here 6x ( Ps / ^ ) The open end of the second large lattice 14A on the end side of each of the first conductive patterns (4) A has a shape in which the second connecting portion 16A does not exist. The other end of each of the first conductive patterns 22A exists. The end portion of the i-th large lattice 14 8 on the side of the portion is electrically connected to the first terminal wiring pattern 41 a formed of a thin metal wire via the first junction portion 4A (see FIG. 3 ). Thus, the first conductive sheet 10A is in the first conductive sheet 10A. Two or more first large lattices 14A are arranged in the X direction via the first connecting portion 16A, and each of the first conductive patterns 22A' is formed by combining two or more small lattices 18 to form each of the first large lattices 14A. When the pitch of the small lattice 18 is set to Ps, the width Wcl of the first connecting portion 16A is made to satisfy Wcl > Ps/VJ, When the first conductive sheet 10A is applied to, for example, a projection type capacitive touch panel, the response speed can be improved as compared with a configuration in which one electrode is formed of one ITO film. Further, the size of the touch panel can be increased. Next, the touch panel 100 using the first conductive sheet i〇A will be described with reference to FIGS. 3 to 7. The touch panel 100 has a sensor body 102 and a control circuit (consisting of a 1C circuit or the like) (not shown). As shown in FIG. 3, FIG. 4, and FIG. 5A, the sensor body 102 has a conductive sheet for a touch panel of the first embodiment which is formed by laminating the first conductive sheet 10A and a second conductive sheet 10B to be described later (hereinafter It is referred to as a first build-up conductive sheet 50A) and a protective layer 106 laminated on the first build-up conductive sheet 50A (the description of the protective layer 1〇6 13 201203062 -5 JUJipif is omitted in FIG. 5A). The first build-up conductive sheet 5A and the protective layer 106 are, for example, mounted on a display panel 110 of a display device 8 such as a liquid crystal display. The sensor body 102 has a sensor portion 112 disposed in a region corresponding to the display pupil surface 110a of the display panel 110, and a terminal disposed in a region corresponding to the outer peripheral portion of the display panel 110, when viewed from the upper surface. Wiring portion 114 (so-called frame). As shown in FIG. 4, the first conductive sheet 10A applied to the touch panel 1A has the plurality of first conductive patterns 22A arranged in the portion corresponding to the sensor portion 112, and is connected to the terminal wiring portion 114. A plurality of first terminal wiring patterns 41a formed of thin metal wires derived from the respective first wiring portions 40a are arranged. In the example of FIG. 3, when viewed from the upper surface, the outer shape of the first conductive sheet 1A has a rectangular shape. The outer shape of the detector portion 112 also has a rectangular shape. In the terminal wiring portion 114, a plurality of i-th terminals 116a are arranged in the longitudinal direction of the one long side in the longitudinal direction central portion of one of the long sides of the first conductive sheet 10A. The long side of the sensor portion 112 (the long side closest to one long side of the first conductive sheet 10A, the y direction) is linearly arranged with a plurality of second knot line portions 4A. The i-th terminal wiring pattern 导出 derived from the junction portion is guided by the substantially central portion of one long side of the conductive sheet 10A, and the first terminal is divided by *#, #:=:=1, and the corresponding sense = The first terminal U6a is formed in the corner portion of the conductive sheet 10A or the vicinity thereof at substantially the same length. However, 201203062 ^DODipif has the following problems: a plurality of first terminal wiring patterns 41a, and the longest first terminal wiring The length of the pattern 41a and the shortest first terminal wiring pattern 23a are greatly different, and the first conductive pattern 22A corresponding to the longest first terminal wiring pattern 41a and the plurality of first terminal wiring patterns 41a in the vicinity thereof The signal transmission is slower. Therefore, by forming the first terminal U6a' in the central portion in the longitudinal direction of the long side of the strip of the first conductive sheet 1GA as in the present embodiment, the delay of local signal transmission can be suppressed, and the response speed can be accelerated. On the other hand, the second conductive sheet 10B does not have a second conductive member 313B formed on one main surface of the second transparent substrate 12B as shown in Figs. 3, 4 and 5A. The 3rd second conductive portion 13B is formed with a fourth conductive large grid 14B formed of a thin metal wire and a second connecting portion L6B formed of a thin metal wire electrically connected between the adjacent fourth MBs. As shown in FIG. 6, each of the fourth large lattices 14B is composed of four or more sub-groups 20 each having a pitch of 'the fourth connecting portion 16B is a real number greater than one. The 15 1st first lattice (10) of one side of the second large lattice mb is the same, and it is preferably one of the three positions = 2 to form a full saturation direction (fourth direction), thereby constituting one conductive metal thin wire. The circuit pattern (hereinafter, 3 22B) has two or more second conductive (four) 4 conductive patterns 4 more preferably 4 mm to 6 mm. 5 16B^: 4 or more fourth large lattices 14B are passed through the fourth connecting portion 6

交的X方導電圖案22排列於與y方向正 。（第1方向）上，且於鄰接的第2導電圖 B 201203062 間配置有不存在小格子18的紐 如圖4所示，在存在於每^第 第2導電圖案22B的—個端部侧之第奇數個）的 端、以及存在於第偶數個的第2導電圖宰22:3的， 侧之第2大格子14B的開放端 的另一端部 =Β2=Γ另;方面，存在於第奇數:二2 Ϊΐ ，案22Β的另-‘部侧之第2大格子ΜΒ的端部、 偶數個的各第2導電圖案22Β的另—端部側 ΓΒ的端部’分別經由第2結線部杨而電性連接 於由金屬細線形成的第2端子配線圖案41b。 第2 對應於感測器部112的部分’排列有多數個 第2導電圖案22B，於端子配線部114，排列有 結線部40b導出的多個第2端子配線圖案41be 如圖3所示，端子配線部114中，於第2導電片i〇b =-條長邊側的周緣部’於其長度方向中央部分在上述 一條長邊的長度方向上排列形成有多個第2端子u6b。另 外，石著感測器部112的一條短邊（距第2導電片log的 一條短邊最近的短邊，x方向），直線狀地排列有多個第2 ，線部40b (例如第奇數個的第2結線部4〇b)，沿著感測 器部112的另一短邊（距第2導電片1〇B的另一短邊最近 的短邊’ x方向），直線狀地排列有多個第2結線部4〇b(例 如第偶數個的第2結線部40b)。 多個第2導電圖案22B中，例如第奇數個的第2導電 圖案22B分別連接於對應的第奇數個的第2結線部4〇b， 201203062 ^DODipif 第偶數個的第2導電圖案22B分別連接於對應的第偶數個 的第2結線部401^自第奇數個的第2結線部4〇b導出的 第2端子配線圖案41b以及自第偶數個的第2結線部4〇b 導出的第2端子配線圖案41b被引導向第2導電片1〇B的 一條長邊的大致中央部，分別電性連接於對應的第2端子 116b。因此，例如第1個第2端子配線圖案41b與第2個 第2端子配線圖案41b是以大致相同的長度而引導，以下 相同’第2n — 1個的第2端子配線圖案41b與第2n個的第 2端子配線圖案41b是以大致相同的長度而引導（n==1、2、 3 · · · ) 〇 當然，亦可於第2導電片10B的角落部或其附近形成 第2端子116b，然而如上所述，存在以下問題：對於與最 長的第2端子配線圖案41b及其附近的多個第2端子配線 圖案41b對應的第2導電圖案22B的訊號傳輸變慢。因此， 藉由如本實施形態般於第2導電片10B的一條長邊的長度 方向中央部分形成第2端子116b，可抑制局部的訊號傳輸 的延遲，從而實現響應速度的高速化。 再者，亦可使第1端子配線圖案41a的導出形態與上 述第2端子配線圖案41b相同，使第2端子配線圖案41b 的導出形態與上述第1端子配線圖案4la相同。 而且，於將該第1積層導電片50A用作觸控面板時， 於第1導電片10A上形成保護層，並將自第1導電片i〇A 的多數個第1導電圖案22A導出的第1端子配線圖案 41a、與自第2導電片10B的多個第2導電圖案22B導出 17 201203062 ^DODipif 的第2端子配線圖案41b連接於例如控制掃描的控制電路。 作為觸控位置的檢測方式，可較佳地採用自電容(self +P ive)方式或互電谷（mutuai )方式。即， 右為自電容方式，則對第丨導電圖案22A依序供給用以檢 測觸控位置的電壓訊號’對第2導電随22B依序供給用 以檢測觸控位置的電壓訊號。使指尖接觸或接近保護層 106的上表面’由此和觸控位置相向的第^導電圖案 及第2導電圖案22B與GND (地線）之間的電容增大， 因^來自該第i導電圖案22A及第2導電圖案22b的傳輸 波形成為與來自其他導電圖案的傳輸訊號的波形不 形。因此，控制電路根據由第1導電圖案22A及第 導電圖案22B所供給的傳輸訊號來運算觸控位置。另一 方面，互電容方式的情況下，例如對第1導電圖 案22A依 序供給用以檢_控位置的電壓職，對第2導電圖案 二St:感’則(傳輸訊號的檢測)。使指尖接觸或接近 保f層106的上表面，由此對和觸控位置相向的第i導電 圖案22A與第2導電圖案22B間的 指的浮游電容，因此來自該第2二剌地增加手 的波形成為與來自其他第4;:==傳= pn , 守€圖案MB的傳輸訊號的波 導電二控制電路根據供給電壓訊號的第1 =訊，運算觸控位置。藉由採用此種自=式或 互電谷方式的觸控位置的檢測方 接觸或接近保護層106的上表面’ ^卩更㈣使2個指尖 表面’亦可檢測各觸控位置。 201203062 J^ODipif 再者，與投影型靜電電容式的檢測電路相關的先前技術文 獻有美國專利第4,582,955號說明書、美國專利第4,686,332 號說明書、美國專利第4,733,222號說明書、美國專利第 5,374,787號說明書、美國專利帛5,543,588號說明書、美 國專利第7,030,860號說明書、美國公開專利2〇〇4/〇155871 號說明書等。 而且’如圖6所示’若觀看第2導電圖案22B的第2 大格子14B的4個邊部中，鄰接於不與鄰接的第2大格子 14B連接的一個頂點部分26a的第5邊部28e以及第6邊 部28f’則第5邊部28e與第〗導電片1〇A中的第丨大格 子14A的第1邊部28a相同，成為多數個針狀的線32 (小 格子18的邊）自沿著第5邊部28e連續的直線部3〇梳齒 狀地伸出的形態。第6邊部28f與第1導電片i〇A中的第 1大格子14A的第3邊部28c相同，成為形成有沿著第6 邊部28f連續的直線部3〇的形態。若觀看和不與鄰接的第 2大格子14B連接的另一頂點部分261)鄰接的第7邊部28g 以及第8邊部28h’則第7邊部26g與第5邊部28e相同， 成為多數個針狀的線32 (小格子18的邊）自沿著第7邊 部28g連續的直線部3〇梳齒狀地伸出的形態，第8邊部 28h與第6邊部28f相同’成為形成有沿著第8邊部28h 連續的直線部30的形態。 另外，第2連接部16B具有4個中格子2〇 (第5中 格子20e〜第8中格子20h)鋸齒狀地排列的形狀，該中格 子20具有包含4個小格子18的大小。即，第5中格子2〇e 201203062 JDODipif 存在於第6邊部28f的第2條直線部3()(自最外侧朝向第 2大格子MB的内部的第2條直線部）與第8邊部娜的 直線部30的交界部分，具有與i個小格子18形成l字形 的空間的形狀。第6中格子2〇f鄰接於第5幡子—的 1條邊（第6邊部28f的第2條直線部3〇)，具有形成有正 方形的如的形狀，即，由4個小格子_列成矩陣狀並 將中央的十字去掉的形狀17中格子㈣與第5中格子 20e郴接，並且與第6中格子2〇f鄰接而配置，具有與第6 中格子20f相同的形狀。帛8中格子施存在於第7邊部 28g的直線部30與第5邊部28e的交界部分，與第6中格 子20f鄰接，並且與第7中格子2〇g鄰接而配置，與第$ 中格子20e同樣地具有與i個小格？ 18形成L字形的空 間的形狀。第8中格子2〇h的1條邊存在於第5中格子2〇e 的第8邊部28h的直線部3〇的延長線上。對於該第2導電 片10B而言，當將小格子18的排列間距設為ps時，中格 子20的排列間距亦有2xPs的關係。另外，第2連接 部的寬度Wc2 (第6中格子20f的頂點至第7中格子2〇g 的頂點之間、且沿著x方向的距離）滿足Wc2>Ps/^， 此處為 6χ (ps/VJ )。 而且，例如於第2導電片10B上積層第1導電片l〇A 而製成第1積層導電片50A時，如圖7所示，第1導電圖 案22A的第1連接部16A與第2導電圖案22B的第2連 接部16B成為將第1透明基體12A (參照圖5A)夾在中 間而相向的形態’第1導電圖案22A的第1絕緣部24A與 20 201203062 jDoaipif IZZVITf 2 24B i ϋ 與第2導電圖案22B的位置明瞭 =誇張級第1導電圖案22A的線 導 圖案22B的線寬變細。 反弟2導電 1Λ f上表面觀看積層的第1導電片1GA及第2導雷M 10B時，成為以填埋第丨導電片馳 = :則間隙的方式而排列有第2導電 =: :的形態，’成為鋪滿大格子的形態。此 ^子1則第1邊部^以及第2邊部28b的時梳齒第 各頂端成為由第2大格子14B沾梳齒32的 :識的各直線部3〇所連接的形狀^ 子18的形態，同樣，第2大格子14B的第5邊部 =7 ^P 28§的梳齒32的各頂端成為由第i大格子14A 的第3邊部28c以及第4邊部28d的各直線部3 形狀’結果成為排列有小格子18的形態，且 益法 辨別第i大格子14A與第2大格子14B的邊界的狀離，、法 此處，例如於使第1大格子14A以及第2大 的邊部全部形成為直線部3G的情形時，即，於 =子14A的第1邊部28a以及第2邊部28b伸出的多數 條線32的開放端連接而形成新的直線部3〇、同樣地將自 第2大格子14B的第5邊部28e以及第7邊部％伸出 多數條線32的開放端連接而形成新的直線部3〇的 21 201203062 -j-jyjj ipif 日Utf,下問題：由於重合的位置精度的稍許偏差， :°被此的重疊部分的寬度變大（粗線），由此第1 ^ 14A▲與第2大格子14B的邊界顯眼，視認性惡化， 开1中如上所述’藉由梳齒32的頂端與直線部 、 '，第1大格子14Α與第2大格子14Β的邊界不 」生提昇。再者’第1絕緣部24α與第2絕緣部 24Β相向的部分形财⑽中格子擁度關口，但其與 線刊’料遮光，因此在外部幾料顯眼。特別 =右為個中格子的程度的開口，則與周圍的小格子18 相比尺寸上幾乎相同，故更不顯眼。 另外例如於使第1大格子14Α以及第2大格子14Β 的f 1 28a〜第8邊部28h全部形成為直線部3〇的情 2 ’第2大格子14B的第5邊部咖〜第8邊部娜的 直線部3〇位於第1大格子⑽的第1邊部28a〜第4邊部 線部30的正下方。此時’由於各直線部30亦作 為導電^而發揮功能，故於第1大格子14Α的邊部盘第 2大格子MB的邊部之間形成寄生電容，該寄生電容的存 在對於電射訊而言起_訊（_e)成分的作用，引起 ifi雜比（slgnai t0 Noise rati0，S/N比）的顯著下降。而且， 因於各第1大格子14A與各第2大格子14B間形成有寄生 電Ϊ為第1導電圖案22A與第2導電圖案加間並 列連接有夕數個寄生電容的形態，結果存在cr時 常數變大，則可能導致供給於第 1導電圖案22A (以及第2遵安 wr*、 、汉弟2導電圖案22B)的電麼訊號的 22 201203062 JDD3ipif 波形的上升時間變慢，於特 用以檢測位置的電場。另& 3内幾乎不會產生 間亦變慢，可能於特定的 波形的變化’而導致檢測精度下降、傳輸訊號的 為了實現檢測精度的提昇、響庳 ^ '又下降。即’ ^大格子⑽錢第2大料第 ^成小適應賴示晝面的尺寸，而產生無 版、A4版及該尺寸以上的大晝面的問題。-用於B5 相對於此，本實施形態中，如圖5A所示 2子14A的邊部的直線部3〇與第2大格子ΐ4β 直線部30之投影距離Lf和小格子18的i條邊的長度（= Am〜500 #m)大致相同。進而，自第i大格子14八 第1邊部28a以及第2邊部28b伸出的針狀的線32分別是 僅頂端與第2大格子14B的第6邊部28f以及第8邊邱 的直線部30相向，且自第2大格子14B的第5 2如 以及第7邊部28g伸出的針狀的線32分別是僅頂端與第！ 大格子14A的第3邊部28c以及第4邊部28d的直線部3〇 相向，因此形成於第1大格子14A與第2大格子14B之間 的寄生電容變小。結果CR時間常數亦變小，可實現檢測 精度的提昇、響應速度的提昇。 關於上述投影距離Lf的最適距離，較佳為相較於第j 大格子14A以及第2大格子14B的尺寸而根據構成第1大 格子14A以及第2大格子14B的小格子18的尺寸（線寬 23 201203062 ^DO^ipif 以及一邊的長度）來適當設定。此時，若小格子18的尺寸 相對於具有一定尺寸的第丨大格子Ma以及第2大格子 14；^而過大，則雖然透光性提昇，但可能由於傳輸訊號的 動態，圍（dynamic range)變小而引起檢測感度下降。相 ，，若小格子18的尺寸過小，則雖然檢測感度提昇，但可 能由於線寬的減小有限而透光性惡化。 因此，於將小格子18的線寬設為1 /zm〜9 /zm時， 上述投影距離Lf的最適值（最適距離）較佳為1〇〇以瓜 〜400 ym，更佳為zoo以爪〜3〇〇 。若使小格子i8 的線寬變窄’則雖然上述最適距離亦可脑，但電阻變高， 因此即便寄生電容變小，CR _常數㈣高，結果可能 引起檢測歧τ降、響應速度獨。因此，小格 寬較佳為上述範圍。 的踝 而且，例如根據顯示面板11〇的尺寸或感測器部112 =尺^以及觸控位置檢測轉析度（驅動脈波的脈波週期） 、、、疋第1大格子14A及第2大格子14B的尺寸以及小格 =的尺寸’以小格子18的線寬為基準來算出第i大格 子14A與第2大格子14B間的最適距離。 另外 目上表面觀看第1連接部16A與第2連接名 第7 刀時第2連接部16B的第5中格子20e# 20b的I 的交點位於第1大格子MA的第2中格^ 中格2"^部16B _6中格子2〇f與第 的士功士、、交點位於第1大格子MA的第3巾格子20 、中心，藉由該些第1中格子20a〜第8中格子20] 24 201203062 JJOOipif 的組合，而成為形成有多個小格子18的形態。即，於第1 連接部16A與第2連接部16B相向的部分，藉由第！連 部16A與第2連接部】6B的組合，而成為排列有多個小格 子18的形態，與周圍的構成第！大格子14A的小格子以 ，構成第2大格子14B的小格子18糾區分，視認性提 幵0 本實施形態中，於端子配線部114中，在第丨導電片 的-條長邊側的周緣部的長度方向中央部分形成多個 第1端子116a，於第2導電片10B的一條長邊側的周緣部 的長度方向中央部分形成多個第2端？祕。特別是圖3 的例子中’第i端子116a與第2端子mb是以不重疊且 相接近的狀態而排列，進而，使第！端子配線圖案化與 第2糕子配線圖案41b上下不重疊。再者，亦可形成第工 %子116a與例如第奇數個的第2端子配線圖案4ia為一部 分上下重疊的形態。 藉此，可經由2個連接器（第i端子用連接器以及第 2端子用連接器）或1個連接器（連接於第丨端子丨丨如以 及第2端子116b的複合連接器）以及電纜（cable)，將多 個第1端子116a以及多個第2端子U6b電性連接於控制 電路。 、 另外，由於使第1端子配線圖案41a與第2端子配線 圖案41b不上下重疊，因此可抑制第丨端子配線圖案41& 與第2端子配線圖案41b之間產生寄生電容，抑制響應速 度下降。 曰“ 25 201203062 JDODipif 由於沿著感測器部112的一條長邊排列第}結線部 40a ’且沿著感測器部112的兩側的短邊排列第2結線部 40b ’故可減少^子配線部114的面積❶此種情況可促進含 有觸控面板100的顯不面板110的小型化，並且可使顯示 晝面110a給人以看起來較大的印象。另外，可使作為觸控 面板100的操作性亦提昇。 為了進一步減小端子配線部114的面積，可想到使舞 接的第1端子配線圖案41a間的距離、鄰接的第2端子酉 線圖案41b間的距離變窄，但此時，考慮到防止發生遷采 (migration)’較佳為10 以上、5〇以瓜以下。 此外，自上表面觀看時，可想到藉由在鄰接的第i対 子配線圖案41a間配置第2端子配線圖案仙而減小端^ 配線部1M的面積，但若圖案的形成有偏移，則可能第 端子配線圖案41a與第2端子配線圖案4比上下重聶，酉 線間的寄生電容變大，導致響應速度下降。因此，&則 種配置構成時’較佳為將鄰接㈣丨端子配線圖案 的距離設定為50 以上、1〇〇以瓜以下。/、 積層=片積層導電片5°A而言，於使用該第 於例如投影型靜電電容式的觸㈣ 〇時’可提高響應速度，^可促_㈣板1()() _ 導Ϊ片：第1導電片1〇A的第1大袼子14A與第: 第2大格子14B的邊界不顯眼，另外， :子第2連接部16B的組合而形成有多则 故不存在局部產生粗線等不良狀況，整體的細 26 201203062 JOODipif 性變良好。 另外，可大幅度地減小多數個第i導電圖案22A以及 第2導電圖案22B的CR時間常數，藉此可提高響應速度， 驅動時間（掃描時間）_位置檢測亦變料。此種情況 可促進觸控面板觸的畫面尺寸（縱X橫的尺寸，不含厚 度）的大型化。 上述第1積層導電片50A中，如圖4以及圖5A所示， =’Ιΐ明基體12A的一個主面上形成第1導電圖案 ;2透明基體12B的__個主面上形成第2導電圖 赠此以外，亦可如圖5B所示，於第1透明基 個主面上形成第1導電圖案22A，於第1透明 二12A的另-主面上形成第2導電圖案灿。此時，不 $第2透明基體12B，而成為於第2導電部ΐ3β =第1透明基體12A、於第lit體12A上積層有第ι ° ^外’第1導電片1GA與第2導電片 其他層’若第1導電圖案22A與第2導 圖案魏緣狀態’則該料電圖案亦可相向而配置。 此時，如圖8A〜圖8C Φ +立w· u* * -上 採用三種構絲樣。 祕地表讀，可較佳地 奘署Tns 所不的* 1構成例具有以下構成，於顯示 ^ 、、！透明黏接劑12〇而積層有圖5Β的第 片叫第i導電部13Α、第i透明基= ，進而，於該第1積層導電片5〇A上 積層有射層122 ’於該硬塗層122上積層有抗反射層 27 201203062 JJQJipif 124。此處，由顯示裝置上的透明黏接劑120、第2導 電部13B、第1透明基體12A以及第1導電部13A構成觸 控面板100，由該觸控面板1⑻上的硬塗層122以及抗反 射層124構成抗反射膜126。 圖8B所示的第2構成例具有以下構成：於顯示裝置 108上經由透明黏接劑120而積層有圖5B所示的第1積層 導電片50A及保護樹脂層128,進而，於該保護樹脂層128 上積層有硬塗層122 ’於該硬塗屬122上積層有抗反射層 124。此處，由顯示裝置108上的透明黏接劑120、第2導 電部13B、第1透明基體12A、第1導電部13A以及保護 樹脂層128構成觸控面板100，由該觸控面板100上的硬 塗層122以及抗反射層124構成抗反射膜126。 圖8C所示的第3構成例具有以下構成：於顯示裝置 108上經由第1透明黏接劑120A而積層有圖5B所示的第 1積層導電片50A及第2透明黏接劑120B，進而，於該第 2透明黏接劑120B上積層有透明膜130，於該透明膜130 上積層有硬塗層122，於該硬塗層122上積層有抗反射層 124。此處，由顯示裝置1〇8上的第1透明黏接劑120A、 第2導電部13B、第1透明基體12A、第1導電部13A以 及第2透明黏接劑120B構成觸控面板100’由該觸控面板 100上的透明膜130、硬塗層122以及抗反射層124構成抗 反射膜126。 另外，如圖3所示，較佳為於第1導電片10A及第2 導電片10B的例如各角落部，形成第1導電片10A與第2 28 201203062 ^DD^ipifThe intersecting X-square conductive patterns 22 are arranged in a positive direction with respect to the y direction. In the (first direction), a button in which the small lattice 18 is not present is disposed between the adjacent second conductive patterns B 201203062, as shown in FIG. 4, and is present on the end side of each of the second conductive patterns 22B. The end of the odd-numbered) and the other end of the open end of the second large lattice 14B on the side of the even-numbered second conductive pattern 22:3 = Β 2 = Γ another; : 2 2 Ϊΐ , the end of the 2nd large lattice 另 on the other side of the case 22 端, and the end of the other end side ΓΒ of the even-numbered second conductive patterns 22 Β via the second knot Further, it is electrically connected to the second terminal wiring pattern 41b formed of thin metal wires. In the second portion of the sensor portion 112, a plurality of second conductive patterns 22B are arranged, and in the terminal wiring portion 114, a plurality of second terminal wiring patterns 41be derived from the junction portion 40b are arranged as shown in FIG. In the wiring portion 114, a plurality of second terminals u6b are formed in the longitudinal direction of the one long side in the longitudinal direction central portion of the second conductive sheet i〇b = the long side of the strip. Further, one short side of the stone sensor portion 112 (the short side closest to one short side of the second conductive sheet log, the x direction) is linearly arranged with a plurality of second and line portions 40b (for example, the odd number The second knotting portion 4〇b) is linearly arranged along the other short side of the sensor portion 112 (the short side 'x direction closest to the other short side of the second conductive sheet 1〇B') There are a plurality of second junction portions 4〇b (for example, an even number of second junction portions 40b). In the plurality of second conductive patterns 22B, for example, the odd-numbered second conductive patterns 22B are respectively connected to the corresponding odd-numbered second connection portions 4〇b, 201203062 ^DODipif the even-numbered second conductive patterns 22B are respectively connected The second terminal wiring pattern 41b derived from the odd-numbered second junction portions 4〇b and the second derived from the even-numbered second junction portions 4〇b The terminal wiring pattern 41b is guided to a substantially central portion of one long side of the second conductive sheet 1B, and is electrically connected to the corresponding second terminal 116b. Therefore, for example, the first and second terminal wiring patterns 41b and the second and second terminal wiring patterns 41b are guided by substantially the same length, and the second and second second terminal wiring patterns 41b and 2n are the same as the following. The second terminal wiring pattern 41b is guided by substantially the same length (n==1, 2, 3 · · · ). Of course, the second terminal 116b may be formed at or near the corner portion of the second conductive sheet 10B. However, as described above, there is a problem in that the signal transmission of the second conductive pattern 22B corresponding to the longest second terminal wiring pattern 41b and the plurality of second terminal wiring patterns 41b in the vicinity thereof becomes slow. Therefore, by forming the second terminal 116b in the central portion in the longitudinal direction of one long side of the second conductive sheet 10B as in the present embodiment, the delay of local signal transmission can be suppressed, and the response speed can be increased. In addition, the lead-out pattern of the first terminal wiring pattern 41a may be the same as that of the second terminal wiring pattern 41b, and the lead-out pattern of the second terminal wiring pattern 41b may be the same as that of the first terminal wiring pattern 433a. When the first laminated conductive sheet 50A is used as a touch panel, a protective layer is formed on the first conductive sheet 10A, and the first conductive pattern 22A of the first conductive sheet i〇A is led out. The one-terminal wiring pattern 41a and the second terminal wiring pattern 41b derived from the plurality of second conductive patterns 22B of the second conductive sheet 10B are connected to a control circuit for controlling scanning, for example, the second terminal wiring pattern 41b of 201203062 ^DODipif. As a method of detecting the touch position, a self-Picture method or a Mutuai method can be preferably used. That is, if the right side is the self-capacitance mode, the voltage signal for detecting the touch position is sequentially supplied to the second conductive pattern 22A, and the voltage signal for detecting the touch position is sequentially supplied to the second conductive layer 22B. The first conductive surface of the protective layer 106 is brought into contact with or close to the upper surface of the protective layer 106, and the capacitance between the second conductive pattern 22B and the GND (ground) is increased by the fingertip. The transmission waveforms of the conductive pattern 22A and the second conductive pattern 22b are incompatible with the waveform of the transmission signal from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signals supplied from the first conductive pattern 22A and the second conductive pattern 22B. On the other hand, in the case of the mutual capacitance method, for example, the voltage position for detecting the position is sequentially supplied to the first conductive pattern 22A, and the second conductive pattern is "St: sense" (detection of the transmission signal). The fingertip is brought into contact with or close to the upper surface of the protective layer 106, whereby the floating capacitance of the finger between the ith conductive pattern 22A and the second conductive pattern 22B facing the touch position is increased from the second The waveform of the hand becomes the wave conduction control circuit of the transmission signal from the other 4th::==pass=pn, and the pattern of the MB is calculated according to the 1st signal of the supply voltage signal, and the touch position is calculated. The two fingertip surfaces can also detect the touch positions by contacting or approaching the upper surface of the protective layer 106 by using the detection of the touch position of the self-mode or the mutual valley mode. 201203062 J^ODipif Further, the prior art documents related to the projection type electrostatic capacitance type detection circuit include the specification of U.S. Patent No. 4,582,955, the specification of U.S. Patent No. 4,686,332, the specification of U.S. Patent No. 4,733,222, and the specification of U.S. Patent No. 5,374,787. U.S. Patent No. 5,543,588, U.S. Patent No. 7,030,860, U.S. Patent Application Serial No. 4/4,155,871, et al. Further, as shown in FIG. 6, the four side portions of the second large lattice 14B that views the second conductive pattern 22B are adjacent to the fifth side portion of one vertex portion 26a that is not connected to the adjacent second large lattice 14B. In the 28e and the sixth side portion 28f', the fifth side portion 28e is the same as the first side portion 28a of the second large lattice 14A in the first conductive sheet 1A, and is a plurality of needle-shaped lines 32 (small lattice 18) The side is extended in a comb shape from the straight portion 3 continuous along the fifth side portion 28e. The sixth side portion 28f is formed in the same manner as the third side portion 28c of the first large lattice 14A of the first conductive sheet iA, and has a straight portion 3〇 continuous along the sixth side portion 28f. When the seventh side portion 28g and the eighth side portion 28h' adjacent to the other vertex portion 261) which is not connected to the adjacent second large lattice 14B are viewed, the seventh side portion 26g is the same as the fifth side portion 28e, and becomes a majority. The acicular line 32 (the side of the small lattice 18) is formed in a comb-like shape from the continuous straight portion 3 along the seventh side portion 28g, and the eighth side portion 28h is the same as the sixth side portion 28f. A form in which the straight portion 30 continuous along the eighth side portion 28h is formed is formed. Further, the second connecting portion 16B has a shape in which four intermediate lattices 2〇 (the fifth intermediate lattice 20e to the eighth intermediate lattice 20h) are arranged in a zigzag shape, and the intermediate lattice 20 has a size including four small lattices 18. In other words, the fifth middle lattice 2〇e 201203062 JDODipif exists in the second straight portion 3 () of the sixth side portion 28f (the second straight portion from the outermost side toward the inside of the second large lattice MB) and the eighth side The boundary portion of the straight portion 30 of the genus has a shape that forms a space of a l-shape with the i small lattices 18. The sixth lattice 2〇f is adjacent to one side of the fifth dice—the second linear portion 3〇 of the sixth side portion 28f, and has a shape in which a square is formed, that is, four small lattices _ The lattice (4) in the shape 17 which is arranged in a matrix and has the center cross removed is connected to the fifth intermediate lattice 20e, and is disposed adjacent to the sixth intermediate lattice 2〇f, and has the same shape as the sixth intermediate lattice 20f. In the 帛8, the lattice is applied to the boundary portion between the linear portion 30 and the fifth side portion 28e of the seventh side portion 28g, and is adjacent to the sixth intermediate lattice 20f, and is disposed adjacent to the seventh intermediate lattice 2〇g, and is disposed at the In the middle of the grid 20e also has a small grid with i? 18 forms the shape of the L-shaped space. One side of the eighth lattice 2〇h exists on the extension line of the straight portion 3〇 of the eighth side portion 28h of the fifth middle lattice 2〇e. In the second conductive sheet 10B, when the arrangement pitch of the small lattices 18 is ps, the arrangement pitch of the middle lattices 20 also has a relationship of 2xPs. Further, the width Wc2 of the second connecting portion (the distance from the vertex of the sixth intermediate lattice 20f to the apex of the seventh intermediate lattice 2〇g and along the x direction) satisfies Wc2 > Ps / ^, where 6 χ ( Ps/VJ). Further, for example, when the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the first laminated conductive sheet 50A, as shown in FIG. 7, the first connecting portion 16A of the first conductive pattern 22A and the second conductive portion are formed. The second connecting portion 16B of the pattern 22B is a first insulating portion 24A and 20 201203062 jDoaipif IZZVITf 2 24B i ϋ and the first insulating portion 22A in a state in which the first transparent substrate 12A (see FIG. 5A) is opposed to each other. 2 The position of the conductive pattern 22B is clear = the line width of the line guide pattern 22B of the first conductive pattern 22A of the exaggerated stage is thinned. When the first conductive sheet 1GA and the second conductive material M 10B which are laminated are viewed from the upper surface of the second conductive layer 1 Λ f, the second conductive material is arranged such that the gap is filled with the second conductive sheet = : : Form, 'become a form that is covered with a large lattice. In the first and second sides of the second side portion 28b, the first end portion of the first side portion and the second side portion 28b are formed by the second large lattice 14B, and the shape of each of the rectilinear portions 3 is connected. In the same manner, the respective distal ends of the comb teeth 32 of the fifth side portion of the second large lattice 14B = 7 ^ P 28 § are the respective straight lines of the third side portion 28c and the fourth side portion 28d of the i-th large lattice 14A. As a result, the shape of the portion 3 is a pattern in which the small lattices 18 are arranged, and the boundary between the i-th large lattice 14A and the second large lattice 14B is determined by the method of the method. For example, the first large lattice 14A and the first When all of the two large side portions are formed as the straight portion 3G, that is, the open ends of the plurality of lines 32 extending from the first side portion 28a and the second side portion 28b of the =14A are connected to each other to form a new straight portion. In the same manner, the fifth side portion 28e and the seventh side portion % of the second large lattice 14B are connected to the open ends of the plurality of lines 32 to form a new straight portion 3〇. 201203062 -j-jyjj ipif Utf, the next problem: due to a slight deviation of the positional accuracy of the coincidence, the width of the overlap portion by ° is increased (thick line), whereby the 1st 14A ▲ and the 2nd large lattice 14B When the boundary is conspicuous, the visibility is deteriorated, and as described above, by the top end of the comb tooth 32 and the straight portion, 'the boundary between the first large lattice 14Α and the second large lattice 14Β is not raised. Further, the portion in which the first insulating portion 24α and the second insulating portion 24A face each other in the lattice form (10), but the light is blocked from the line, so that it is conspicuous in the outside. In particular, the opening of the degree of the right middle lattice is almost the same as the size of the surrounding small lattice 18, so it is less conspicuous. In addition, for example, all of the f 1 28a to the eighth side portion 28h of the first large lattice 14Α and the second large lattice 14Β are formed as the straight portion 3〇. 2 The fifth side of the second large lattice 14B is the eighth side. The straight portion 3 of the side portion is located directly below the first side portion 28a to the fourth side portion line portion 30 of the first large lattice (10). At this time, since each linear portion 30 also functions as a conductive electrode, a parasitic capacitance is formed between the side portions of the second large lattice MB of the side disk of the first large lattice 14A, and the existence of the parasitic capacitance is for the electric radiation. In the case of the _e component, a significant decrease in the ifi ratio (slgnai t0 Noise rati0, S/N ratio) is caused. In addition, a parasitic electric power is formed between each of the first large lattices 14A and each of the second large lattices 14B, and a parasitic capacitance is connected in parallel between the first conductive pattern 22A and the second conductive pattern. When the time constant becomes large, the rise time of the 22 201203062 JDD3ipif waveform supplied to the first conductive pattern 22A (and the second compliance wr*, the Handi 2 conductive pattern 22B) may become slower. To detect the electric field at the location. In addition, there is almost no slowness in the & 3, which may result in a change in the specific waveform, resulting in a decrease in detection accuracy, an increase in the detection accuracy of the transmitted signal, and a decrease in the noise. That is, the size of the large grid (10) and the second largest material is adjusted to the size of the surface, and there is no problem with the version, the A4 version, and the large surface above the size. - for B5, in the present embodiment, as shown in Fig. 5A, the projection distance Lf between the straight portion 3'' of the side portion of the 2 sub- 14A and the second large lattice ΐ4β straight portion 30 and the i-side of the small lattice 18 The length (= Am~500 #m) is roughly the same. Further, the needle-shaped lines 32 extending from the i-th large lattice 14 and the first side portion 28a and the second side portion 28b are only the distal end and the sixth side portion 28f and the eighth side of the second large lattice 14B. The linear portions 30 are opposed to each other, and the needle-shaped wires 32 extending from the fifth and fourth side portions 28g of the second large lattice 14B are only the top end and the first! Since the third side portion 28c of the large lattice 14A and the straight portion 3' of the fourth side portion 28d face each other, the parasitic capacitance formed between the first large lattice 14A and the second large lattice 14B becomes small. As a result, the CR time constant is also reduced, and the detection accuracy can be improved and the response speed can be improved. The optimum distance of the projection distance Lf is preferably a size of the small lattice 18 constituting the first large lattice 14A and the second large lattice 14B compared to the dimensions of the j-th large lattice 14A and the second large lattice 14B. Width 23 201203062 ^DO^ipif and the length of one side are set appropriately. At this time, if the size of the small lattice 18 is too large with respect to the second large lattice Ma and the second large lattice 14 having a certain size, although the light transmittance is improved, it may be due to the dynamic range of the transmission signal. ) becomes smaller and causes a decrease in detection sensitivity. Phase, if the size of the small lattice 18 is too small, although the detection sensitivity is improved, the light transmittance may be deteriorated due to the limited reduction in the line width. Therefore, when the line width of the small lattice 18 is set to 1 /zm to 9 /zm, the optimum value (optimum distance) of the projection distance Lf is preferably 1 〇〇 to 400 ym, more preferably zoo to the claw. ~3〇〇. When the line width of the small lattice i8 is narrowed, the above-mentioned optimum distance can be a brain, but the electric resistance becomes high. Therefore, even if the parasitic capacitance is small, the CR_constant (four) is high, and as a result, the detection τ is lowered and the response speed is unique. Therefore, the small lattice width is preferably in the above range. Further, for example, according to the size of the display panel 11A or the sensor portion 112 = the ruler and the touch position, the degree of resolution (pulse period of the driving pulse wave) is detected, and the first large lattice 14A and the second The size of the large lattice 14B and the size of the small grid = 'the optimum distance between the i-th large lattice 14A and the second large lattice 14B is calculated based on the line width of the small lattice 18 . Further, when the first connecting portion 16A and the second connecting name 7th blade are viewed from the upper surface, the intersection of I of the fifth intermediate lattice 20e# 20b of the second connecting portion 16B is located in the second middle lattice of the first large lattice MA. 2"^部16B_6中格子2〇f and the first taxi, the intersection is located in the first large lattice MA of the third towel grid 20, the center, by the first intermediate lattice 20a to the eighth medium lattice 20] 24 201203062 The combination of JJOOipif forms a form in which a plurality of small lattices 18 are formed. In other words, the portion facing the first connecting portion 16A and the second connecting portion 16B is by the first! The combination of the joint portion 16A and the second joint portion 6B is a form in which a plurality of small cells 18 are arranged, and the surrounding structure is the first! The small lattice of the large lattice 14A is divided into the small lattices 18 constituting the second large lattice 14B, and the visibility is improved. In the present embodiment, the terminal wiring portion 114 is on the long side of the second conductive sheet of the second conductive sheet. A plurality of first terminals 116a are formed in the central portion in the longitudinal direction of the peripheral portion, and a plurality of second ends are formed in the central portion in the longitudinal direction of the peripheral portion of one long side of the second conductive sheet 10B. secret. In particular, in the example of Fig. 3, the i-th terminal 116a and the second terminal mb are arranged in a state of not overlapping and being close to each other, and further, the first! The terminal wiring patterning and the second cake wiring pattern 41b do not overlap each other. In addition, it is also possible to form a form in which the first worker 116a and the second terminal wiring pattern 4ia, which are odd-numbered, overlap one another. Thereby, two connectors (the i-terminal connector and the second terminal connector) or one connector (the composite connector connected to the second terminal and the second terminal 116b) and the cable can be passed through (cable), the plurality of first terminals 116a and the plurality of second terminals U6b are electrically connected to the control circuit. In addition, since the first terminal wiring pattern 41a and the second terminal wiring pattern 41b are not overlapped, the parasitic capacitance between the second terminal wiring pattern 41& and the second terminal wiring pattern 41b can be suppressed, and the response speed can be suppressed from being lowered. 25" 25 201203062 JDODipif The second knot portion 40b' is arranged along the long sides of the sensor portion 112, and the second knot portion 40b is arranged along the short sides of the both sides of the sensor portion 112. The area of the wiring portion 114 can promote the miniaturization of the display panel 110 including the touch panel 100, and can give the display pupil surface 110a a large impression. In addition, it can be used as a touch panel. In order to further reduce the area of the terminal wiring portion 114, it is conceivable to narrow the distance between the first terminal wiring patterns 41a and the distance between the adjacent second terminal twist patterns 41b. In this case, it is considered that the migration prevention is preferably 10 or more and 5 or less. In addition, when viewed from the upper surface, it is conceivable that the first arrangement is arranged between the adjacent i-th sub-wiring patterns 41a. The area of the wiring portion 1M is reduced by the two-terminal wiring pattern. However, if the pattern is formed to be shifted, the second terminal wiring pattern 41a and the second terminal wiring pattern 4 may be compared with each other, and the parasitic capacitance between the lines may be increased. Become bigger, causing a slower response Therefore, when the configuration is configured, it is preferable to set the distance between the adjacent (four) 丨 terminal wiring patterns to 50 or more, 1 〇〇 or less. /, laminated = laminated layer conductive sheet 5 ° A, When the touch (four) 〇 of the projection type electrostatic capacitance type is used, the response speed can be improved, and the _ (four) board 1 () () _ guide sheet: the first large sheet of the first conductive sheet 1 〇 A 14A and the second boundary of the second large lattice 14B are inconspicuous, and the combination of the second second connecting portion 16B is large, so that there is no problem such as local occurrence of thick lines, and the overall fineness of the 2012 20126262 JOODipif is good. Further, the CR time constant of the plurality of ith conductive patterns 22A and the second conductive patterns 22B can be greatly reduced, whereby the response speed can be improved, and the driving time (scanning time) _ position detection is also changed. It is possible to increase the size of the screen of the touch panel (the size of the vertical X and the horizontal dimension, and the thickness is not included). In the first laminated conductive sheet 50A, as shown in FIG. 4 and FIG. 5A, one of the ''''''''''' Forming a first conductive pattern on the main surface; 2 forming a main surface of the transparent substrate 12B In addition to the second conductive pattern, as shown in FIG. 5B, the first conductive pattern 22A may be formed on the first transparent base main surface, and the second conductive pattern may be formed on the other main surface of the first transparent second 12A. In this case, the second transparent portion 12B is not formed, and the second conductive portion ΐ3β = the first transparent substrate 12A and the first layer 12A are laminated with the first conductive sheet 1GA and the second conductive sheet 1GA. The other layer of the conductive sheet 'the first conductive pattern 22A and the second conductive pattern of the second conductive pattern' may be disposed to face each other. At this time, as shown in Figs. 8A to 8C, three kinds of wire-like patterns are used on Φ + vertical w· u* * -. In the case of the secret table, it is better to use the *1 configuration example that Tns does not have the following structure, and display ^, ,! The transparent adhesive 12 〇 and the first sheet of FIG. 5Β are referred to as the ith conductive portion 13Α, the ith transparent substrate=, and further, the first laminated conductive sheet 5〇A is laminated with the shot layer 122′ on the hard coat layer. An anti-reflection layer 27 201203062 JJQJipif 124 is laminated on the layer 122. Here, the transparent adhesive 120, the second conductive portion 13B, the first transparent substrate 12A, and the first conductive portion 13A on the display device constitute the touch panel 100, and the hard coat layer 122 on the touch panel 1 (8) and The anti-reflection layer 124 constitutes an anti-reflection film 126. The second configuration example shown in FIG. 8B has a configuration in which the first build-up conductive sheet 50A and the protective resin layer 128 shown in FIG. 5B are laminated on the display device 108 via the transparent adhesive 120, and further, the protective resin The layer 128 is laminated with a hard coat layer 122' having an anti-reflective layer 124 laminated on the hard coat layer 122. Here, the transparent adhesive 120, the second conductive portion 13B, the first transparent substrate 12A, the first conductive portion 13A, and the protective resin layer 128 on the display device 108 constitute the touch panel 100 from the touch panel 100. The hard coat layer 122 and the anti-reflection layer 124 constitute an anti-reflection film 126. The third configuration example shown in FIG. 8C has a configuration in which the first build-up conductive sheet 50A and the second transparent adhesive 120B shown in FIG. 5B are laminated on the display device 108 via the first transparent adhesive 120A. A transparent film 130 is laminated on the second transparent adhesive 120B, and a hard coat layer 122 is laminated on the transparent film 130, and an anti-reflection layer 124 is laminated on the hard coat layer 122. Here, the first transparent adhesive 120A, the second conductive portion 13B, the first transparent substrate 12A, the first conductive portion 13A, and the second transparent adhesive 120B on the display device 1A constitute the touch panel 100'. The anti-reflection film 126 is composed of the transparent film 130, the hard coat layer 122, and the anti-reflection layer 124 on the touch panel 100. Further, as shown in FIG. 3, it is preferable that the first conductive sheet 10A and the second conductive sheet 10A and the second conductive sheet 10A and the second conductive sheet 10B form a first conductive sheet 10A and a second 28 201203062 ^ DD ^ ipif

該複合對準標記亦作為將該第丨積層導電片观設置於顯 示面板110上時所制的定位用的鮮標記而發揮功能。 1對準標記118a以 ° 5亥第1對準標記118a以及第2對 導電片10A與第2導電片l〇B貼合 i 50A時’形成新的複合對準標記， 繼而，參照圖9〜® 12，對第2實施形態的觸控面板 用導電片（以下’記作第2積層導電片5〇B)加以說明。 該第2積層導電5GB如圖9所示，具有與上述第！ 積層導電片5GA大致相同的構成，但於以下方面不同：如 圖10所示’第1大格子14A的第i邊部28a〜第4邊部 分別具有& 2 _上_形形狀排列而成的矩形波形 狀，如圖11所示，第2大格子14B的第5邊部28e〜第8 邊部28h分別具有由2個以上的矩形形狀排列而成的矩形 波形狀。 具體而言，關於第1大格子14A，將圖i所示的第i 導電片10A的第1大格子14A的第1邊部28a以及第2邊 部28b的各梳齒32分別一個隔一個地相連，形成將小格子 18 —個隔一個地排列的形態，且將第3邊部28c以及第4 邊部28d的各直線部30分別一個隔一個地分離，形成將小 格子18 —個隔一個地排列的形態，藉此如圖1〇所示，使 第2積層導電片50B的第1大格子μα的第1邊部28a〜 第4邊部28d分別具有由2個以上的矩形形狀排列而成的 矩形波形狀，特別是使第1大格子14A的第1邊部28a與 29 201203062 和該第1邊部28a相向的第4邊部28d的各矩形波形狀互 =相同’且使第1大格子14A的第2邊部爲與和該 邊部相向的第3邊部撕的各矩形波形狀互不相同。 同樣地，對於第2大格子14B，將圖6所示的第 電片的第2大格子14B的第5邊部撕以及第7邊部 28g的各梳齒32分別—個㉟—個地相連，形成將小格子μ -個隔-個地排列的形態，且將第6邊部观以及第8邊 = 28h的各直線部3〇分別一個隔一個地分離，形成將小格 子18 一個隔一個地排列的形態，藉此如目11所示，使第 =導電片10B的第2大格子mb的第5邊部28e〜第8邊 邛28h分別具有由2>(固以上的矩形形狀排列而成的矩形波 形狀特別疋使第2大格子14B的第5邊部28e與和該第 5邊#咖相向的第8邊部咖的各矩形波形狀互不相同， 使第2大格子14B的第6邊部28f與和該第6邊部28f相 向的第7邊部28g的各矩形波形狀互不相同。 制而且’例如於第2導電片上積層第1導電片10A 而製成第2積層導電片 a夺，如圖12所示，與第！積 1導電片50A (參照圖7)的情形相同，成為第i導電圖 ” 22A的第1連接部16A與第2導電圖案22b的第2 f琿16B將第i透明基體12八（參照圖5A) 1在中間而 目向、且第1導電圖案22A的第1絕緣部24A與第2導電 圖案22B的第2絕緣部24B將第！透明基體12A夹在中 2而相向的形態。再者，第丨導電圖案22A與第2導電圖 案22B的各線寬相同，但圖12中亦與圖？相同為了使 201203062 力 GMpif 第1導電圖案22A與第2導電_案22B的位置明瞭，圖中 誇張地使第1導電圖案22A的線寬變粗、使第2導電圖案 22B的線寬變細。 自上表面觀看所積層的第礴電片馳以及第2導電 片10B時，成為以填埋fl導電片1〇A上形成的第ι大格 子14A的間隙的方式而排列有第2導電片i〇b的第2大格 子14B的形態。此時，第！大格子MA的第！邊部咖以 及第2邊部28b的各矩形波形狀的凹部似的開口部分成 為由第2大格子14Β的第6邊部28f以及第8邊部m的 各矩形波形狀的凸部42b的頂端部分連接的形狀，結果成 為連續排列有小格子18的形態，同樣，帛！大格子MA 的第3邊部28c以及第4邊部28d的各矩形波形狀的凹部 42a的開口部分成為由第2大格子14B的第5邊部28e以 及第7邊部28g的各矩形波形狀的凸部42b的頂端部分連 接的形狀’結果成為連續排列有小格子的形態，而成為幾 ，無法區分第1大格子14A與第2大格子14B的邊界的狀 態。即，藉由矩形波形狀的凹部42a的開口部分與凸部42b 的頂端部分的重疊，第1大格子14a與第2大格子14B的 邊界不顯眼，視s忍性提昇。再者，第1絕緣部24A與第2 絕緣部24B相向的部分形成有十字形狀的開口，但其與上 述粗線不同，並不遮光，故在外部幾乎不顯眼。 關於第1連接部16A與第2連接部16B相向的部分， 亦與第1積層導電片50A相同，第2連接部16B的第5中 格子20e與第7中格子20g的交點位於第i連接部16A的 31 201203062 第2中格子20b的大致中心，第2連接部16B的第6中格 子20f與第8中格子20h的交點位於第1連接部16A的第 3中格子20c的大致中心，藉由該些第j中格子2〇a〜第8 中格子20h的組合，而成為形成有多個小格子18的形態。 即，於第1連接部16A與第2連接部16B相向的部分，藉 由第1連接部16A與第2連接部16B的組合，而成為排列 有多個小格子18的形態’與周圍的構成第1大格子MA 的小格子18或構成第2大格子14B的小格子18不相區 分，視認性提昇。 該第2積層導電片50B中，雖未圖示，但第i結線部 40a以及第2結線部40b的排列狀態、端子配線部114中 的第1端子配線圖案41a以及第2端子配線圖案41b的排 列狀態、第1端子116a以及第2端子116b的排列狀態亦 與上述第1積層導電片50A相同。 如此，對於第2積層導電片50B而言，於使用該第2 積層導電片50B而應用於例如投影型靜電電容式的觸控面 板100時，亦可提高響應速度，且可促進觸控面板1〇〇的 大尺寸化。而且，第1導電片1〇Α的第i大格子14A與第 2導電片10B的第2大格子14B的邊界不顯眼，另外，藉 由第1連接部16A與第2連接部16B的組合而形成有多個 小格子18，故不存在局部產生粗線等不良狀況，整體的視 認性變良好。The composite alignment mark also functions as a fresh mark for positioning when the second laminated conductive sheet is placed on the display panel 110. 1 Alignment mark 118a forms a new composite alignment mark when the 5th first alignment mark 118a and the second pair of conductive sheets 10A and the second conductive sheet 10B are bonded to i 50A, and then refer to FIG. 9 The conductive sheet for a touch panel of the second embodiment (hereinafter referred to as the second build-up conductive sheet 5A) will be described. The second laminated conductive 5GB is as shown in FIG. 9 and has the above-mentioned first! The laminated conductive sheets 5GA have substantially the same configuration, but differ in the following aspects: as shown in FIG. 10, the i-th side portions 28a to the fourth side portions of the first large lattice 14A are respectively arranged in an & 2 _ upper _ shape. As shown in FIG. 11, the fifth side portion 28e to the eighth side portion 28h of the second large lattice 14B each have a rectangular wave shape in which two or more rectangular shapes are arranged. Specifically, in the first large lattice 14A, the comb teeth 32 of the first side portion 28a and the second side portion 28b of the first large lattice 14A of the i-th conductive sheet 10A shown in FIG. In a state in which the small lattices 18 are arranged one by one, the linear portions 30 of the third side portion 28c and the fourth side portion 28d are separated one by one to form the small lattices 18 one by one. As shown in FIG. 1A, the first side portion 28a to the fourth side portion 28d of the first large lattice μα of the second laminated conductive sheet 50B are arranged in two or more rectangular shapes. In the rectangular wave shape, in particular, the rectangular wave shapes of the fourth side portion 28d of the first large lattice 14A and the second side portion 28a of the first side portion 28a are the same as each other and the first one is made The second side portion of the large lattice 14A is different from the rectangular wave shape which is torn by the third side portion facing the side portion. Similarly, in the second large lattice 14B, the fifth side portion of the second large lattice 14B of the first electric piece shown in Fig. 6 and the comb teeth 32 of the seventh side portion 28g are connected to each other 35-pieces. In a form in which the small lattices are arranged one by one, and the respective straight portions 3〇 of the sixth side and the eighth side = 28h are separated one by one to form the small lattices 18 one by one. In the form of the ground arrangement, the fifth side portion 28e to the eighth side line 28h of the second large lattice mb of the first conductive sheet 10B are each arranged in a rectangular shape of 2 or more. The rectangular wave shape is particularly such that the fifth side portion 28e of the second large lattice 14B and the rectangular wave shape of the eighth side portion facing the fifth side are different from each other, and the second large lattice 14B is The rectangular shape of the seventh side portion 28f and the seventh side portion 28g facing the sixth side portion 28f are different from each other. The second conductive layer 10A is laminated on the second conductive sheet to form a second laminate. As shown in FIG. 12, the conductive sheet a is the first connection portion 16A and the second portion which are the i-th conductive pattern "22A" as in the case of the first product 1 conductive sheet 50A (see FIG. 7). The second f 珲 16B of the conductive pattern 22b aligns the i-th transparent substrate 12 (see FIG. 5A) 1 in the middle, and the second insulation of the first insulating portion 24A and the second conductive pattern 22B of the first conductive pattern 22A. The portion 24B has the first transparent substrate 12A sandwiched by the middle 2 and faces each other. Further, the second conductive pattern 22A and the second conductive pattern 22B have the same line width, but the same as in Fig. 12 in order to make 201203062 force GMpif The positions of the first conductive pattern 22A and the second conductive pattern 22B are clear, and the line width of the first conductive pattern 22A is made thicker and the line width of the second conductive pattern 22B is made thinner in the drawing. The layer is viewed from the upper surface. In the case of the second electric sheet and the second conductive sheet 10B, the second large conductive sheet i〇b is arranged so as to fill the gap of the first large lattice 14A formed on the fl conductive sheet 1A. In the form of the lattice 14B, the opening portion of each of the rectangular side of the second large portion 28b and the concave portion of the second side portion 28b are the sixth side portion 28f of the second large lattice 14A and The shape in which the tip end portions of the rectangular wave-shaped convex portions 42b of the eighth side portion m are connected is successively arranged. In the same manner, the opening portion of each of the rectangular wave-shaped concave portions 42a of the third side portion 28c and the fourth side portion 28d of the large lattice MA is the fifth side portion 28e of the second large lattice 14B and The shape 'connected to the tip end portions of the rectangular wave-shaped convex portions 42b of the seventh side portion 28g is a pattern in which small lattices are continuously arranged, and the boundary between the first large lattice 14A and the second large lattice 14B cannot be distinguished. In other words, the boundary between the opening portion of the rectangular wave-shaped concave portion 42a and the distal end portion of the convex portion 42b is inconspicuous, and the boundary between the first large lattice 14a and the second large lattice 14B is inconspicuous. Further, the portion in which the first insulating portion 24A and the second insulating portion 24B face each other is formed with a cross-shaped opening. However, unlike the above-described thick line, the first insulating portion 24A does not block light, and thus is hardly conspicuous to the outside. The portion where the first connecting portion 16A and the second connecting portion 16B face each other is also the same as the first laminated conductive sheet 50A, and the intersection of the fifth intermediate lattice 20e and the seventh intermediate lattice 20g of the second connecting portion 16B is located at the i-th connecting portion. 31 201203062 The approximate center of the second intermediate lattice 20b, the intersection of the sixth intermediate lattice 20f and the eighth intermediate lattice 20h of the second connecting portion 16B is located substantially at the center of the third intermediate lattice 20c of the first connecting portion 16A. The combination of the j-th lattice 2〇a to the eighth middle lattice 20h is a form in which a plurality of small lattices 18 are formed. In other words, in the portion where the first connecting portion 16A and the second connecting portion 16B face each other, the combination of the first connecting portion 16A and the second connecting portion 16B forms a form in which a plurality of small lattices 18 are arranged and the surrounding configuration. The small lattice 18 of the first large lattice MA or the small lattice 18 constituting the second large lattice 14B are not distinguished, and the visibility is improved. In the second laminated conductive sheet 50B, the arrangement state of the i-th junction portion 40a and the second junction portion 40b, and the first terminal wiring pattern 41a and the second terminal wiring pattern 41b in the terminal wiring portion 114 are not shown. The arrangement state, the arrangement state of the first terminal 116a and the second terminal 116b are also the same as those of the first build-up conductive sheet 50A. When the second laminated conductive sheet 50B is applied to, for example, the projection type capacitive touch panel 100 by using the second laminated conductive sheet 50B, the response speed can be improved and the touch panel 1 can be promoted. The large size of the cockroach. Further, the boundary between the i-th large lattice 14A of the first conductive sheet 1A and the second large lattice 14B of the second conductive sheet 10B is inconspicuous, and the combination of the first connecting portion 16A and the second connecting portion 16B is Since a plurality of small lattices 18 are formed, there is no problem such as partial occurrence of thick lines, and the overall visibility is improved.

特別是該第2積層導電片50B中，第1大格子ha的 4條邊（第1邊部28a〜第4邊部28d)以及第2大格子14B 32 201203062 JDODipif 子14A或第2tH貝地相同，因此可抑制第1大格 位置的誤檢測。14B的端部的電荷的定域’防止指尖 #笛該第2積層導電片5 g b中，亦如圖5 A所示， 格子14A的邊部的直線部30與第2大格子14B 且邊部的直料30之投影㈣Lf與小格子18 長度(w5〇“m)A致相同。進而，僅自= 格子14八的各邊部伸出的矩形波形狀的職與自第2大格 :14B的各邊部伸出的矩形波形狀的頂點分別相向，因此 大格子14A與第2大格子14B間形成的寄生電容變 J 、、’σ果，CR時間常數亦變小，可實現檢測精度的提 響應速度的提昇。 繼而，參照圖13以及圖14，對第2積層導電片5〇Β 的變形例進行說明。 該變形例的積層導電片50Ba的第1導電片i〇Aa具有 與上述第2積層導電片5〇B的第i導電片1〇A(參照圖'1〇) 基本相同的構成，但於以下方面不同：如圖13所示，第1 連接部16A並非格子形狀，而是形成為大致z字形（鋸齒 狀）的線狀。該第1連接部16A是形成於第丨大格子14A 的第2邊部28b的直線部3〇和第4邊部28d的直線部3〇 的交界部分、與第1大格子14A的第1邊部28a的直線部 30和第3邊部28c的直線部30的交界部分之間。 同樣，第2導電片10Ba具有與上述第2積層導電片 33 201203062 50B的第2導電片10B (參照圖11 )基本相同的構成’但 於以下方面不同：如圖14所示，第2連接部16B並非格 子形狀，而是形成為大致z字形（鋸齒狀）的線狀。該第 2連接部16B是形成於第2大格子14B的第6邊部28f的 直線部30和第8邊部28h的直線部30的交界部分、與第 2大格子14B的第5邊部28e的直線部30和第7邊部28g 的直線部30的交界部分之間。 而且，第1連接部16A的寬度Wcl (—個拐點至另一 拐點之間、且沿著y方向的距離）滿足Wcl>ps/^，此 處為2x(ps/VJ)。同樣，第2連接部16B的寬度Wc2 (一 個心點至另-拐點之間、且沿著χ方向的距離）滿足Wc2 >Ps/A，此處為 2x (Ps/VJ)。 對於該變形例的積層導電片5〇Ba而言，於使用該積 層導電片5GBa而應用於例如投影型靜電電容式的觸控面 板時亦可k向響應速度，且可促進觸控面板的大尺寸化。 上述第1導電片l〇A (10Aa)以及第2導電片i〇b (10Ba)中，右第1連接部16A的寬度以及第2連接部 16B的寬度過大，财時大格子14的配置變曝外觀變 差’因此其上限較佳為2x (Ps/VJ )〜2〇x (ps/w)， 為 8χ ( Ps/VJ )〜Ι4χ (Ps/VJ )。 另外，上述第1導電片10A(10Aa)以及第 則狐）中，小格子18的尺寸（1邊的長度或對角二 的長度等）或構成第丨大格子14Α的小格子18的個數、 構成第2大格子14Β的小格子18的個數亦可根據所應用 34 201203062 WOMpif 的觸控面板的尺寸或解析度（配線數）而適當設定。 上述第1導電片10A (1〇Aa)以及第2導電片腦 10Ba)中’將構成第1連接部16八以及第2連接部 的中格子20的排列間距Pm設定為小格子18的排列間距 Ps的2倍’除此以外，可根據中格子的數量任意設定為i 5 倍、3倍等。關於中格子2〇的排列間距pm，若其間隔過 窄、或過大，則第1大格子14A或第2大格子14B的配置 1困難’外觀邊差，故較佳為小格子18的排列間距&的 1倍〜10倍，更佳為1倍〜5倍。 A另外’小格子18的尺寸（1邊的長度或對角線的長度 等）或構成第1大格子14A的小格子18的個數、構成第2 大格子14B的小格子18的個數亦可根據所應用的觸控面 板的尺寸或解析度（配線數）而適當設定。 上述例子中，表示出了將第i導電片1〇A(1〇Aa)以 及第2導電片10B (l〇Ba)應用於投影型靜電電容式的觸 控面板100的例子，除此以外，當然亦可應用於表面型靜 電電容式的觸控面板或電阻膜式的觸控面板。 其次，作為製造第i導電片1〇A (1〇Aa)或第2導電 片10B (10Ba)的方法，例如可於第丨透明基體12A上以 及第2透明基體12B上對具有含有感光性齒化銀鹽的乳劑 層的感光材料進行曝光，並實施顯影處理，藉此於曝光部 以及未曝光部分別形成金屬銀部以及透光性部，而形成第 1導電圖案22A以及第2導電圖案22B。再者，亦可進而 對金屬銀部實施物理顯影及/或電鍍處理，藉此使金屬銀部 35 201203062 ODODipii 承載導電性金屬。 另一方面’於如圖5B所示般在第1透明基體i2A的 一個主面上形成第1導電圖案22A’並於第1透明基體12A 的另一主面上形成第2導電圖案22B時，若依照通常的製 法而採用最初對一個主面進行曝光、然後對另一主面進行 曝光的方法，則有時無法獲得所需的第1導電圖案22A以 及第2導電圖案22B。特別是難以均勻地形成自第i大格 子14A以及第2大格子14B的邊部伸出梳齒32的圖案、 或自第1大格子14A以及第2大格子14B的邊部伸出矩形 波形狀的圖案。 因此，可較佳地採用以下所示的製造方法。 即，對第1透明基體12A的兩面上形成的感光性鹵化 銀乳劑層進行統括曝光’於第1透明基體12A的一個主面 上形成第1導電圖案22A，於第1透明基體12A的另一主 面上形成第2導電圖案22B。 參照圖I5〜圖17,對該製造方法的具體例加以說明。 首先，於圖15的步驟S1中，製作長條的感光材料 140。感光材料140如圖16A所示，具有第丨透明基體12A、 形成於該第1透明基體12A的一個主面上的感光性函化銀 乳劑層（以下稱為第1感光層142a)、以及形成於第^透 明基體12A的另一主面上的感光性鹵化銀乳劑層（以下稱 為第2感光層142b)。 於圖15的步驟S2中，對感光材料14〇進行曝光。該 曝光處理中，進行第1曝光處理與第2曝光處理（兩面同 36 201203062 JDOMpif 時曝光）’上述第1曝光處理是對第1感光層142a朝向第 1透明基體12A而照射光，沿著第1曝光圖案對第1咸光 層142a進行曝光’上述第2曝光處理是對第2感光層142b 朝向第1透明基體12A而照射光，沿著第2曝光圖^對第 2感光層142b進行曝光（兩面同時曝光）。圖16B的例子 中’一方面將長條的感光材料14〇朝一個方向搬送，一方 面對第1感光層142a介隔第1光罩146a而照射第1光i44a (平行光），並且對第2感光層142b介隔第2光罩146b 而照射第2光144b (平行光）。第1光144a是藉由利用途 中的第1準直透鏡15〇a將自第1光源148a出射的光轉換 成平行光而獲得，第2光144b是藉由利用途中的第2準直 透鏡150b將自第2光源148b出射的光轉換成平行光而獲 得。圖16B的例子中，表示出使用2個光源（第1光源148a 以及第2光源148b)的情形，亦可使自1個光源出射的光 經由光學系統而加以分割，形成第1光144a以及第2光 144b ’且照射於第1感光層142a以及第2感光層142b。 繼而，於圖15的步驟S3中，對曝光後的感光材料140 進行顯影處理’藉此如圖5B所示般製作第1積層導電片 50A °第1積層導電片50A具有第1透明基體12A、形成 於該第1透明基體12A的一個主面上的沿著第1曝光圖案 的第1導電部13A (第1導電圖案22A等）、以及形成於 第1透明基體12A的另一主面上的依照第2曝光圖案的第 2導電部13B (第2導電圖案22B等）。再者，第1感光層 142a以及第2感光層i42b的曝光時間以及顯影時間會根 37 201203062 據第1光源148a以及第2光源148b的種類或顯影液的種 類等不同而有各種各樣的變化，故較佳數值範圍不可一概 而定，但要調整為顯影率達到100%的曝光時間以及顯影 時間。 而且，本實施形態的製造方法中，第丨曝光處理如圖 17所示’於第1光層142a上例如密接配置第丄光罩146a， 自與該第1光罩146a相向而配置的第i光源148a朝向第 1光罩146a照射第1光144a，藉此對第丨感光層142&進 行曝光。第1光罩146a是由以透明的鈉玻璃形成的玻璃基 板、及形成於該玻璃基板上的遮罩圖案（第1曝光圖案 152a)所構成。因此，藉由該第1曝光處理，對第i感光 層142a中沿著第1光罩i46a上形成的第丨曝光圖案f52a 的部分進行曝光。亦可於第1感光層142a與第丨光罩146a 之間設置2 /zm〜10 左右的間隙。 同樣’第2曝光處理中’於第2感光層腿上例如 密接配置第2光罩146b，自與該第2光罩灘相向而配 置的第2光源148b朝向第2光罩H6b照射第2光144b， 藉此對第2感光層142b進行曝光。第2光罩i46b與第1 光罩146a相同，是由以透明的鈉玻璃形成的玻璃基板、及 形成於該玻璃基板上的遮罩圖案（第2曝光圖案咖）所 構成。因此，藉由該第2曝光處理，對第2感光層⑽ 中沿著第2光罩祕上形成的第2曝光圖案服的部分 進行曝光。此時，亦可於第2感光層l42b與第2光軍咖 之間設置2 /zm〜10 左右的間隙。 38 201203062 力 Wlpif 第1曝光處理以及第2曝光處理中，可使來自第i光 源148a的第1光144a的出射時序與自第2光源148b的第 2光144b的出射時序設為同時，亦可使該些出射時序不 同。若為同時’則可利用1次曝光處理對第1感光層142a 與第2感光層l42b同時曝光，可縮短處理時間。 再者’於第1感光層142a以及第2感光層142b均未 經光譜增感時，若自兩侧對感光材料140進行曝光，則來 自一側的曝光會對另一侧（背側）的圖像形成造成影響。 即，關於到達第1感光層142a的來自第1光源i48a 的第1光144a，由於第1感光層142a中的鹵化銀粒子而 發生散射，作為散射光而透過第1透明基體12A，其一部 分到達第2感光層·。於是，第2感光層腸與第i 透明基體12A的交界部分之較大範圍受到曝光，形成潛 像。因此，第2感光層上，進行了來自第2光源148b 的第2光144b的曝光與來自帛1光源148a的第1光144aIn particular, in the second laminated conductive sheet 50B, the four sides (the first side portion 28a to the fourth side portion 28d) of the first large lattice ha and the second large lattice 14B 32 201203062 JDODipif 14A or the second tH shell are the same. Therefore, erroneous detection of the first large cell position can be suppressed. The localization of the charge at the end of 14B 'prevents the fingertip # 笛 The second laminated conductive sheet 5 gb, as shown in Fig. 5 A, the straight portion 30 of the side of the lattice 14A and the second large lattice 14B The projection of the straight material 30 (4) Lf is the same as the length of the small lattice 18 (w5 〇 "m) A. Further, only the rectangular wave shape extending from the sides of the square 14 is the second largest grid: Since the apexes of the rectangular wave shape extending from the respective sides of the 14B face each other, the parasitic capacitance formed between the large lattice 14A and the second large lattice 14B becomes J, and the σ fruit, and the CR time constant also becomes small, and the detection accuracy can be realized. A modification of the second laminated conductive sheet 5A will be described with reference to Fig. 13 and Fig. 14. The first conductive sheet i〇Aa of the laminated conductive sheet 50Ba of the modified example has the above-described The i-th conductive sheet 1A (see FIG. 1A) of the second build-up conductive sheet 5A has substantially the same configuration, but differs in the following points: as shown in FIG. 13, the first connecting portion 16A is not in a lattice shape, but It is formed in a substantially zigzag shape (zigzag shape). The first connecting portion 16A is formed on the second side of the second large lattice 14A. The boundary portion between the straight portion 3〇 of the 28b and the straight portion 3〇 of the fourth side portion 28d, and the boundary portion between the straight portion 30 of the first side portion 28a of the first large lattice 14A and the straight portion 30 of the third side portion 28c Similarly, the second conductive sheet 10Ba has substantially the same configuration as the second conductive sheet 10B (see FIG. 11) of the second laminated conductive sheet 33 201203062 50B, but differs in the following points: as shown in FIG. 2 The connecting portion 16B is not formed in a lattice shape but in a substantially zigzag (zigzag) line shape. The second connecting portion 16B is a straight portion 30 and an eighth portion formed on the sixth side portion 28f of the second large lattice 14B. The boundary portion between the straight portion 30 of the side portion 28h and the boundary portion between the straight portion 30 of the fifth side portion 28e of the second large lattice 14B and the straight portion 30 of the seventh side portion 28g. Further, the first connecting portion 16A The width Wcl (the distance between the one inflection point and the other inflection point and in the y direction) satisfies Wcl > ps / ^, here 2x (ps / VJ). Similarly, the width Wc2 of the second connecting portion 16B ( The distance from one heart point to the other - inflection point and along the χ direction satisfies Wc2 > Ps / A, here 2x (Ps / VJ). For the product of this modification In the layer conductive sheet 5〇Ba, when the laminated conductive sheet 5GBa is used and applied to, for example, a projection type capacitive touch panel, the response speed can be k-direction and the size of the touch panel can be increased. In the conductive sheet 10A (10Aa) and the second conductive sheet i〇b (10Ba), the width of the right first connecting portion 16A and the width of the second connecting portion 16B are excessively large, and the configuration of the large lattice 14 is exposed. The variation 'so its upper limit is preferably 2x (Ps/VJ)~2〇x (ps/w), which is 8χ (Ps/VJ)~Ι4χ (Ps/VJ). Further, in the first conductive sheet 10A (10Aa) and the first fox, the size of the small lattice 18 (the length of one side or the length of the diagonal two) or the number of the small lattices 18 constituting the second large lattice 14 Α The number of the small lattices 18 constituting the second large lattice 14 亦可 may be appropriately set according to the size or resolution (number of wirings) of the touch panel to which the application of 2012 20126262 WOMpif is applied. In the first conductive sheet 10A (1AAa) and the second conductive sheet 10Ba), the arrangement pitch Pm of the intermediate lattices 20 constituting the first connecting portion 16 and the second connecting portion is set to the arrangement pitch of the small lattices 18 In addition to this, the number of Ps can be arbitrarily set to i 5 times, 3 times, etc. according to the number of the middle lattices. Regarding the arrangement pitch pm of the middle lattice 2〇, if the interval is too narrow or too large, the arrangement 1 of the first large lattice 14A or the second large lattice 14B is difficult to be 'appearance side difference, so the arrangement pitch of the small lattices 18 is preferable. & 1 to 10 times, more preferably 1 to 5 times. A: The size of the small lattice 18 (the length of one side or the length of the diagonal line), the number of the small lattices 18 constituting the first large lattice 14A, and the number of the small lattices 18 constituting the second large lattice 14B are also It can be set as appropriate depending on the size or resolution (number of wirings) of the touch panel to be applied. In the above example, the example in which the i-th conductive sheet 1A (1AAa) and the second conductive sheet 10B (1〇Ba) are applied to the projection type capacitive touch panel 100 is shown. Of course, it can also be applied to a surface-type capacitive touch panel or a resistive touch panel. Next, as a method of manufacturing the ith conductive sheet 1A (1AAa) or the second conductive sheet 10B (10Ba), for example, the photosensitive substrate can be provided on the second transparent substrate 12A and the second transparent substrate 12B. The photosensitive material of the emulsion layer of the silver salt is exposed and subjected to development processing to form a metal silver portion and a light transmissive portion in the exposed portion and the unexposed portion, thereby forming the first conductive pattern 22A and the second conductive pattern 22B. . Further, the metal silver portion may be further subjected to physical development and/or electroplating treatment, whereby the metallic silver portion 35 201203062 ODODipii carries the conductive metal. On the other hand, when the first conductive pattern 22A' is formed on one main surface of the first transparent substrate i2A and the second conductive pattern 22B is formed on the other main surface of the first transparent substrate 12A, as shown in FIG. 5B, If the first main surface is exposed by exposure and then the other main surface is exposed in accordance with a usual method, the desired first conductive pattern 22A and second conductive pattern 22B may not be obtained. In particular, it is difficult to uniformly form a pattern in which the comb teeth 32 are extended from the side portions of the i-th large lattice 14A and the second large lattice 14B, or a rectangular wave shape is extended from the sides of the first large lattice 14A and the second large lattice 14B. picture of. Therefore, the manufacturing method shown below can be preferably employed. That is, the photosensitive silver halide emulsion layer formed on both surfaces of the first transparent substrate 12A is collectively exposed. The first conductive pattern 22A is formed on one main surface of the first transparent substrate 12A, and the other is formed on the first transparent substrate 12A. The second conductive pattern 22B is formed on the main surface. A specific example of the manufacturing method will be described with reference to Figs. First, in step S1 of Fig. 15, a long photosensitive material 140 is produced. As shown in FIG. 16A, the photosensitive material 140 has a second transparent substrate 12A, a photosensitive functionalized silver emulsion layer (hereinafter referred to as a first photosensitive layer 142a) formed on one main surface of the first transparent substrate 12A, and formed. A photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 142b) on the other main surface of the first transparent substrate 12A. In step S2 of Fig. 15, the photosensitive material 14 is exposed. In the exposure processing, the first exposure processing and the second exposure processing are performed (both sides are the same as 36 201203062 JDOMpif exposure). The first exposure processing is to irradiate the first photosensitive substrate 142a toward the first transparent substrate 12A. The exposure pattern is exposed to the first salt layer 142a. The second exposure process is to irradiate the second photosensitive layer 142b toward the first transparent substrate 12A, and expose the second photosensitive layer 142b along the second exposure pattern. (both sides exposed at the same time). In the example of FIG. 16B, the long photosensitive material 14 is conveyed in one direction, and the first photosensitive layer 142a is interposed between the first photosensitive cover 146a and the first light i44a (parallel light) is irradiated. The photosensitive layer 142b illuminates the second light 144b (parallel light) via the second mask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimating lens 15A in the advantageous use, and the second light 144b is the second collimating lens 150b by the use. The light emitted from the second light source 148b is converted into parallel light and obtained. In the example of FIG. 16B, when two light sources (the first light source 148a and the second light source 148b) are used, light emitted from one light source may be divided by the optical system to form the first light 144a and the first light. The 2 light 144b' is irradiated to the first photosensitive layer 142a and the second photosensitive layer 142b. Then, in step S3 of FIG. 15, the exposed photosensitive material 140 is subjected to development processing. Thus, the first laminated conductive sheet 50A is produced as shown in FIG. 5B. The first laminated conductive sheet 50A has the first transparent substrate 12A, The first conductive portion 13A (the first conductive pattern 22A or the like) along the first exposure pattern formed on one main surface of the first transparent substrate 12A, and the other main surface of the first transparent substrate 12A are formed on the other main surface of the first transparent substrate 12A. The second conductive portion 13B (the second conductive pattern 22B or the like) according to the second exposure pattern. In addition, the exposure time and the development time of the first photosensitive layer 142a and the second photosensitive layer i42b are different from each other depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like. Therefore, the preferred range of values may not be uniform, but it is adjusted to an exposure time of 100% development rate and development time. Further, in the manufacturing method of the present embodiment, as shown in FIG. 17, the first exposure process is as follows: for example, the first photomask 146a is placed in close contact with the first photomask 142a, and the i-th photomask 146a is disposed opposite to the first photomask 146a. The light source 148a irradiates the first light 144a toward the first mask 146a, thereby exposing the second photosensitive layer 142&. The first photomask 146a is composed of a glass substrate formed of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the portion of the i-th photosensitive layer 142a along the first exposure pattern f52a formed on the first mask i46a is exposed by the first exposure processing. A gap of about 2 /zm to 10 may be provided between the first photosensitive layer 142a and the second mask 146a. Similarly, in the second exposure processing, for example, the second photomask 146b is placed in close contact with the second photosensitive layer leg, and the second light source 148b disposed to face the second photomask beach is irradiated with the second light toward the second mask H6b. 144b, thereby exposing the second photosensitive layer 142b. Similarly to the first mask 146a, the second mask i46b is composed of a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern coffee) formed on the glass substrate. Therefore, by the second exposure processing, the portion of the second photosensitive layer (10) that is placed along the second exposure pattern formed on the second mask is exposed. At this time, a gap of about 2 /zm to 10 may be provided between the second photosensitive layer l42b and the second light military coffee. 38 201203062 Force Wlpif In the first exposure processing and the second exposure processing, the emission timing of the first light 144a from the ith light source 148a and the emission timing of the second light 144b from the second light source 148b may be simultaneously set. Make these exit timings different. If it is simultaneous, the first photosensitive layer 142a and the second photosensitive layer 142b can be simultaneously exposed by one exposure process, and the processing time can be shortened. Furthermore, when neither the first photosensitive layer 142a nor the second photosensitive layer 142b is spectrally sensitized, if the photosensitive material 140 is exposed from both sides, the exposure from one side will be on the other side (back side). Image formation has an impact. In other words, the first light 144a from the first light source i48a that has reached the first photosensitive layer 142a is scattered by the silver halide particles in the first photosensitive layer 142a, and passes through the first transparent substrate 12A as scattered light, and a part of the light reaches the first transparent substrate 12A. The second photosensitive layer·. Then, a large extent of the boundary portion between the second photosensitive layer intestine and the i-th transparent substrate 12A is exposed to form a latent image. Therefore, on the second photosensitive layer, the exposure of the second light 144b from the second light source 148b and the first light 144a from the first light source 148a are performed.

的曝光，於其後的顯影處理中製成第丨積層導電片5〇A 時’除了由第2曝光圖案152b所得的導電圖案（第2導電 13B)以外，於該導電圖案間形成有由來自第}光源购 的第1光144a_成的薄導電層，而無法獲得所需的圖案 (沿者第2曝光圖案㈣的圖案此種情況於第【感光 層142a中亦相同。 本，明者為了避免此種情況而進行了潛心研究，結果 表明’藉由將f 1感光層142a以及第2感光層的厚 度設定於特定朗’或規定第1感柄1似錢第2感光 39 201203062 i^Wlpif 層142b的塗佈銀量，鹵化銀自身吸收光，可限制朝向背面 的透光。本實施形態中，可將第1感光層142a以及第2 感光層142b的厚度設定為1 以上、4 以下。上 限值較佳為2.5 /zm。另外，將第1感光層142a以及第2 感光層142b的塗佈銀量規定為5g/m2〜2〇g/m2。 上述兩面密接的曝光方式中，由於附著於膜表面的塵 埃等抑制曝光而導致的圖像缺陷成問題。關於防止塵埃附 著，已知有於膜上塗佈導電性物質，但在處理後亦會殘存 金屬氧化物等，有損最終產品的透明性，另外，導電性高 分子於保存性等方面有問題。因此，本發明者進行了潛心 研究，結果得知，藉由減少了黏合劑量的減銀可獲得抗 靜電所必需的導電性，而規定第丨感光層142a以及第2 感光層142b的銀/黏合劑的體積比。即，第i感 以及第2感光層142b的銀/黏合劑體積比為1A以上，較 佳為2/1以上。 上所述，藉由對第丨感光層142a以及第2感光層 的厚度、塗佈銀量、銀/黏合劑的體積比進行設定及 ^疋，如® 17所示，到達第1感光層142a的來自第i光 ^上4=第1 * 14如不到達第2感光層，同樣，到 $，層:•的來自第2光請b的第咖: 贺忐笛1感1層142&’結果，於利用此後的顯影處理來 積層導電片观時，如圖5B所示，於第^ ΐ^2Α的上僅形成由第1曝光圖案i52a所得 的導電圖案（構成第1導電部W的圖案），於第 201203062 J3D3ipif 2曝光圖案152b所得 的圖案），可獲得所需 基體12A的另一主面上僅形成由第 的導電圖案（構成第2導電部 的圖案。 W道㈣^ 統括蚊的製造方法中，可獲得 ϋ ^ 光的適應性的第1感光層池以及第 1 /外’可藉由1次對第1透明基體以的 :=Γ丄Γ基體12Α的兩面上任意形成相同圖 ί或不。圖案，稭此，可容易地形成觸控面板⑽的電極， 並且可貫現觸控面板刚的薄型化（低背化 上述例子疋使用感光性鹵化銀乳劑層形成第i導電圖 及第2導電圖案22B的製造方法，其他製造方法 有如下製造方法。 即亦可對形成於第i透明基體12A以及第2透明基 = 12f上_紅的光阻酸行曝光、顯聽理而形成阻 案’對自阻劑圖案露出的銅行ϋ刻，藉此形成第 電圖案22Α以及第2導電圖案22Β。 或者，亦可於第1透明基體12Α以及第2透明基體 Ρ刷3有金屬微粒子的漿料，對該漿料進行金屬電 鑛’藉此形成第1導電圖案22Α以及第2導電圖 案 22Β。 +亦可於第1透明基體12Α以及第2透明基體12Β上， 藉由網版印刷版或凹版印刷版而印刷形成第1導電圖案 22Α以及第2導電圖案22Β。 亦可於第1透明基體12Α以及第2透明基體12Β上藉 由喷墨而形成第1導電圖案22Α以及第2導電圖 案 22Β。 201203062 35651pif 繼而，對於本實施形態的第1導電片1〇A ( i〇Aa)以 及第2導電片10B(10Ba)，以作為特佳態樣的使用鹵化銀 照相感光材料的方法為中心加以描述。 本實施形態的第1導電片l〇A ( l〇Aa)以及第2導電 片10B (10Ba)的製造方法，視感光材料與顯影處理的形 態不同而包含以下三種形態。 (1) 對不含物理顯影核的感光性鹵化銀黑白感光材 料進行化學顯影或熱顯影，於該感光材料上形成金屬銀部 的態樣。 (2) 對鹵化銀乳劑層中含有物理顯影核的感光性鹵 化銀黑白感光材料進行溶解物理顯影，於該感光材料上形 成金屬銀部的態樣。 =行擴散轉印顯影，於非感光性祕片上形成金屬銀部的 態樣。 ；(3)將不含物理顯影核的感光性鹵化銀黑白感光材 料、與具有含有物理顯影核的非感光性層的顯像片重合，The exposure is performed in the subsequent development process of the second conductive layer 5A, except for the conductive pattern (second conductive 13B) obtained by the second exposure pattern 152b, and the conductive pattern is formed between the conductive patterns. The thin conductive layer formed by the first light 144a_ obtained by the light source cannot obtain the desired pattern (the pattern along the second exposure pattern (4) is the same as in the first [photosensitive layer 142a]. In order to avoid such a situation, painstaking research has been conducted, and as a result, it has been shown that 'by setting the thickness of the f 1 photosensitive layer 142a and the second photosensitive layer to a specific level' or specifying the first handle 1 like money 2nd photosensitive 39 201203062 i^ The coating silver amount of the Wlpif layer 142b, the silver halide itself absorbs light, and can restrict the light transmission toward the back surface. In the present embodiment, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b can be set to 1 or more and 4 or less. The upper limit is preferably 2.5 / zm, and the amount of silver applied to the first photosensitive layer 142a and the second photosensitive layer 142b is set to 5 g/m 2 to 2 〇 g/m 2 . An image caused by dust or the like adhering to the surface of the film to suppress exposure It is known that it is known to apply a conductive material to a film to prevent adhesion of dust. However, after treatment, a metal oxide remains, which impairs the transparency of the final product, and the conductivity of the conductive polymer is preserved. The present inventors have conducted intensive studies, and as a result, it has been found that the electroconductive property necessary for antistatic can be obtained by reducing the silver amount of the binder, and the second photosensitive layer 142a and the second photosensitive layer are specified. The volume ratio of the silver/adhesive agent of 142b, that is, the silver/binder volume ratio of the i-th sense and the second photosensitive layer 142b is 1 A or more, preferably 2/1 or more. The thickness of the layer 142a and the second photosensitive layer, the amount of coated silver, and the volume ratio of the silver/adhesive are set, as shown by ® 17, and the first photosensitive layer 142a is obtained from the ith light. 1 * 14 If you do not reach the 2nd photosensitive layer, the same as the $, the layer: • The second coffee from the second light b: He Hedi 1 sense 1 layer 142 & 'Results, using the subsequent development process to laminate When the conductive sheet is viewed, as shown in FIG. 5B, only the first exposure map is formed on the second surface. a conductive pattern obtained by i52a (a pattern constituting the first conductive portion W), a pattern obtained by the 201203062 J3D3ipif 2 exposure pattern 152b), and the other main surface of the desired substrate 12A can be formed only by the first conductive pattern (constituting Pattern of the second conductive portion. W (4) ^ In the method for manufacturing a mosquito, the first photosensitive layer pool and the first/outer' which can be adapted to the light can be obtained by the first transparent substrate. := Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 任意 Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ 任意 Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ Γ丄Γ For example, a method of manufacturing the i-th conductive pattern and the second conductive pattern 22B using a photosensitive silver halide emulsion layer, and other manufacturing methods have the following production methods. In other words, the photoresist which is formed on the i-th transparent substrate 12A and the second transparent base = 12f and which is red can be exposed and oscillating to form a resist to the copper line exposed by the resist pattern. The first electric pattern 22A and the second conductive pattern 22'' are formed. Alternatively, a slurry having metal fine particles may be brushed on the first transparent substrate 12A and the second transparent substrate, and the slurry may be subjected to metal ore, thereby forming the first conductive pattern 22'' and the second conductive pattern 22''. + The first conductive pattern 22A and the second conductive pattern 22A may be formed by printing on the first transparent substrate 12A and the second transparent substrate 12A by a screen printing plate or a gravure printing plate. The first conductive pattern 22A and the second conductive pattern 22'' can be formed by inkjet on the first transparent substrate 12'' and the second transparent substrate 12''. 201203062 35651pif Next, the first conductive sheet 1A (i〇Aa) and the second conductive sheet 10B (10Ba) of the present embodiment are described as a particularly preferable method using a silver halide photographic light-sensitive material. . The method for producing the first conductive sheet 10A (a) and the second conductive sheet 10B (10Ba) of the present embodiment includes the following three aspects depending on the shape of the photosensitive material and the development processing. (1) A photosensitive silver halide black-and-white photosensitive material not containing a physical developing core is subjected to chemical development or thermal development to form a metallic silver portion on the photosensitive material. (2) A photosensitive silver halide black-and-white photosensitive material containing a physical development core in a silver halide emulsion layer is subjected to dissolution physical development, and a metallic silver portion is formed on the photosensitive material. = Line diffusion transfer development to form a metallic silver portion on a non-photosensitive film. (3) superimposing a photosensitive silver halide black-and-white photosensitive material containing no physical developing core on a developing sheet having a non-photosensitive layer containing a physical developing core,

因顯影作用為於物理顯影核上的析 42 201203062 3565 lpif 出 ==，但顯影銀為比表面小的球形。 #师日1的態樣中’於未曝光部，鹵化銀粒子溶解 、擴散此積於顯像片上的顯影核上，藉此於 :=tr膜等透光性導電性膜。該曰⑺的態樣為 使用的態樣。sep峨）型’且為自感光材料剝離顯像片而 理中f可選擇負型顯影處理以及反轉顯影處 2的任—顯影（擴散轉印方式的情況下，藉由使用直接 聖（aUtoP〇sltlvetype)感光材料作為感光材才斗可實現 負型顯影處理）。 此處所明化學顯影、熱顯影、溶解物理顯影、擴散轉 印顯衫’是指如業界通使用的術語般的含意，於照相化學 的通常教科書、例如菊地真—著「照相化學」（共立出版社， 1955 年發行）、c.E.K.Mees 編「The Theory of Photographic Processes, 4th ed.」（Mcmillan 公司，1977 年發行）中有所 解說。本案是與液體處理有關的發明，但亦可參考應用熱 顯影方式作為其他顯影方式的技術。例如可應用日本專利 特開2004-184693號、日本專利特開2004-334077號、曰 本專利特開2005-010752號的各公報，日本專利特願 2004-244080號、日本專利特願2004-085655號的各說明書 中記載的技術。 此處’以下對本實施形態的第1導電片10A (l〇Aa) 以及第2導電片l〇B( l〇Ba)的各層的構成加以詳細說明。 [第1透明基體12A、第2透明基體12B] 43 201203062 第1透明基體12A以及第2透明基體nB可列舉塑膠 膜、塑膠板、玻璃板等。 上述塑膠膜以及塑膠板的原料例如使 甲酸乙二自旨⑽）、聚萘二猶乙二§旨（酬等^旨^； 聚乙烯（ΡΕ )、聚丙烯（ΡΡ )、聚苯乙婦、EVA ( Ethylene Vinyl 心敝’乙稀乙酸乙烯醋）等聚烯烴類；乙烯系樹脂；除 此之，’可使用聚碳酸g旨（pc)、聚醯胺、聚醯亞胺、丙 烯酸系樹脂、三乙醯纖維素（TAC)等。 第1透明基體12A以及第2透明基體12B較佳為 PET 。（融點：258°C )、PEN (融點：269。(：）、PE (融點：135 C)、PP (融點：163。〇、聚苯乙烯（融點；23〇。〇、聚 氯乙婦（融點·· 18〇。〇、聚偏二氣乙婦（融點：212。〇或 TAC (融點：290。〇等融點為約29(rc以下的塑膠膜或塑 膠板，特別就透光性或加工性等觀點而言，較佳為ρΕτ。 第1積層導電片50Α或第2積層導電片50B(50Ba)中使 用的第1導電片l〇A(l〇Aa)以及第2導電片1〇B(1〇Ba) 般的導電性膜要求透明性，故較佳為第丨透明基體12A以 及第2透明基體12B的透明度高。 [銀鹽乳劑層] 成為第1導電片1〇A (10Aa)以及第2導電片10B (10Ba)的導電層（第j大格子14A、第1連接部說、 第2大格子mb、第2連接部16B、小格子18等導電部） 的銀鹽乳_除了含有銀鹽與黏合_外，還含有溶劑或 染料等添加劑。 44 201203062 OJODipif 本實施形態中使用的銀鹽可列舉_化銀等無機銀鹽 以及乙酸銀等有機銀鹽。本實施形態中，較佳為使用作為 光感測器的特性優異的鹵化銀。 銀鹽乳劑層的塗佈銀量（銀鹽的塗佈量）換算成銀而 較佳為1 g/m2〜30 g/m2，更佳為i g/m2〜25 g/m2，進而佳 為5 g/m2〜20 g/m2。藉由將該塗佈銀量設定為上述範圍， 於製成第1積層導電片50A或第2積層導電片5〇B(5〇Ba) 時可獲得所需的表面電阻。 本實施形態中使用的黏合劑例如可列舉：明膠 (gelatin)、聚乙烯醇（pvA)、聚乙烯n比咯烷_ (pvp)、 殿粉等多_、纖維素及其衍生物、聚環氧乙稀（p〇iy vinyloxide)、^^乙埽基胺、殼聚糖（chit〇san)、聚離胺酸、 聚丙稀酸、聚海祕、聚玻紐、縣纖維料。該些黏 合劑視官能基的離子性不同而具有巾性、陰離子性、陽離 子性的性質》 本實施形態的㈣乳_ 巾含有的齡劑的含量 j特別限定，可於能發揮分散性及密接性的範圍内適當 較佳為100/1、， 更佳為1/2以上。銀/黏合劑體積比 積比進而佳為i下。另外’銀’黏合劑體 劑層中的最為1/1〜3/卜藉由將銀鹽乳 銀量時^ σ麵積比設定為雜目，即便調整了塗佈 電阻值的不均’獲得具有均勻表面== 第1積層導電片50A或第2積層導電片·。再者，銀/ 45 201203062 黏合劑體積比可藉由將原料的4化 比)轉換成銀量燦合劑量(重量比)，進=丨量量= 量（重量比）轉換成銀量/黏合劑量（體積比）而求出。 <溶劑> 用於形成銀鹽乳劑層的溶劑並無特別限定，例如可列 舉水、有機溶劑（例如甲醇等醇類、丙_等嶋、甲醢胺 等醯胺類、二甲基亞辦亞補、乙酸乙料麵、鍵類 等）、離子性液體以及該些溶劑的混合溶劑。 本實施形態的銀鹽乳劑層中使用的溶劑的含量相對 於銀鹽乳劑層所含的銀鹽、黏合劑等的合計重量而為 Wt。/。〜9Gwt%的範圍，較佳為5Gwt%〜8Gwt%的範圍。 <其他添加劑> 關於本實卿態巾使用的各種添加劑，並無特別限 制’可較佳地使用公知的添加劑。 [其他層構成] 亦可於銀鹽乳劑層上設置未圖示的保護層。本實施形 態中所謂「保護層」’是指由明膠或高分子聚合物之類的黏 合劑形成的層，是為了表現出防擦傷或改良力學特性的效 果而形成於具有感光性的銀鹽乳劑層上^其厚度較佳為〇 5 仁m以下。保護層的塗佈方法以及形成方法並無特別限 定，可適當選擇公知的塗佈方法以及形成方法。另外，^ 可於銀鹽乳劑層10的更下方設置例如底塗層。 、 接著’對第1導電片l〇A(10Aa)以及第2導電片1〇B (10Ba)的製作方法的各步驟加以說明。 46 201203062 力 COiplf [曝光] 本實施形態中，包括藉由印刷方式來施加第1導電圖 案22A以及第2導電圖案22B的情形，除了印刷方式以 外，藉由曝光與顯影等來形成第【導電圖案22A以及第2 導電圖案22B。即，對設於第i透明基體12A以及第2透 明基體12B上的具有含銀鹽的層的感光材料或塗佈有光微 影用光聚合物的感光材料進行曝光。曝光可使用電磁波來 ，行。電磁波例如可列舉可見光線、紫外線等光、χ射線 等放射線等。進而’曝光時亦可利用具有波長分佈的光源， 亦可使用特定波長的光源。 [顯影處理] 本實施形態中，對乳劑層進行曝光後，進而進行顯影 處理、。顯影處理可使用銀鹽相片膜或列印紙、印刷製版用 膜、光罩用乳膠料等所使帛的通常的㈣纽的技術。 顯影液並無特別限定，亦可使用pQ顯影液、MQ顯影液、 从顯影液等，市售品例如可使職士膠片公司調配的 =6 ' CR_56 ' CP45X、_、pa_ _ακ 公司調 SSw·19、0·72等顯影液或其套組㈤） 所3的顯影液。另外，亦可使用平版顯影液。 =明的顯影處理可包含為了去除未曝光部分的銀 用銀鹽相片膜或列印紙、印刷製版用膜、 等所使用的固定處理的技術。 先罩用礼膠遮罩 上述固衫驟中的固定溫度較佳為約抑〜約5〇 47 201203062 ^DODipif 二為佳 ，處理量而較佳為_二：充=於感 mI/m—以下，特佳為3〇Oml/m2以下。下更佳為_The development is based on the physical development of the nucleus. 42 201203062 3565 lpif out ==, but the developed silver is spherical smaller than the surface. In the unexposed portion, the silver halide particles are dissolved and diffused on the developing nucleus on the developing sheet to form a light-transmitting conductive film such as :=tr film. The aspect of the 曰(7) is the aspect of use. The type of the film is peeled off from the photosensitive material, and f can be selected from the negative development process and the development of the reverse development zone 2 (in the case of the diffusion transfer mode, by using the direct saint (aUtoP) 〇sltlvetype) The photosensitive material can be used as a photosensitive material to achieve negative development processing). Chemical development, thermal development, dissolved physical development, diffusion transfer printing shirts as used herein refers to the meaning of the term used in the industry, in the usual textbooks of photographic chemistry, such as Judizhen - "Photography Chemistry" (co-published The Society, issued in 1955), cEKMees, "The Theory of Photographic Processes, 4th ed." (Mcmillan, 1977). This case is an invention relating to liquid processing, but it is also possible to refer to a technique in which a thermal development method is applied as another development method. For example, Japanese Patent Laid-Open No. 2004-184693, Japanese Patent Laid-Open No. 2004-334077, and Japanese Patent Laid-Open No. Hei No. 2005-010752, Japanese Patent Application No. 2004-244080, Japanese Patent Application No. 2004-085655 The technology described in each specification. Here, the configuration of each layer of the first conductive sheet 10A (10A) and the second conductive sheet 10B (1〇Ba) of the present embodiment will be described in detail below. [First Transparent Substrate 12A and Second Transparent Substrate 12B] 43 201203062 The first transparent substrate 12A and the second transparent substrate nB include a plastic film, a plastic plate, a glass plate, and the like. The raw materials of the above-mentioned plastic film and plastic plate are, for example, formic acid Ethylene (10), Polynaphthalene, and the like (polyethylene), polyethylene (ΡΡ), polystyrene, Polyolefins such as EVA (Ethylene Vinyl), such as ethylene glycol vinegar; vinyl resins; in addition, 'polycarbonate can be used (pc), polyamide, polyimine, acrylic resin, Triacetyl cellulose (TAC), etc. The first transparent substrate 12A and the second transparent substrate 12B are preferably PET (melting point: 258 ° C), PEN (melting point: 269. (:), PE (melting point). : 135 C), PP (melting point: 163. 〇, polystyrene (melting point; 23 〇. 〇, chloromethane (melting point · · 18 〇. 〇, 聚二二气乙妇(融点: 212. 〇 or TAC (melting point: 290. 融. The melting point is about 29 (plastic film or plastic plate below rc, especially from the viewpoint of light transmittance or workability, etc., preferably ρ Ετ. The conductive film of the first conductive sheet 10A (10A) and the second conductive sheet 1B (1〇Ba) used in the sheet 50Α or the second laminated conductive sheet 50B (50Ba) requires transparency, so that transparency is required. Preferred as the third The bright base 12A and the second transparent base 12B have high transparency. [Silver salt emulsion layer] The conductive layer of the first conductive sheet 1A (10Aa) and the second conductive sheet 10B (10Ba) (jth large lattice 14A, first 1 The silver salt milk of the connecting portion, the second large lattice mb, the second connecting portion 16B, and the small lattice 18) contains an additive such as a solvent or a dye in addition to the silver salt and the binder. 44 201203062 OJODipif The silver salt used in the embodiment may, for example, be an inorganic silver salt such as silver or an organic silver salt such as silver acetate. In the present embodiment, it is preferred to use silver halide which is excellent in characteristics as a photosensor. The amount of coated silver (coating amount of silver salt) is preferably 1 g/m 2 to 30 g/m 2 , more preferably ig/m 2 to 25 g/m 2 , and further preferably 5 g/m 2 to 20 in terms of silver. g/m2. By setting the amount of coated silver to the above range, a desired surface resistance can be obtained when the first laminated conductive sheet 50A or the second laminated conductive sheet 5〇B (5〇Ba) is formed. Examples of the binder used in the embodiment include gelatin, polyvinyl alcohol (pvA), polyethylene n-pyrrolidine (pvp), and temple powder. Cellulose and its derivatives, p〇iy vinyloxide, ethoxylated amine, chitosan, polylysine, polyacrylic acid, polymarinic acid, polyglass New or county fiber materials. These binders have the properties of non-woven, anionic, and cationic depending on the ionicity of the functional group. The content of the ageing agent contained in the milk of the fourth embodiment is particularly limited. The range in which the dispersibility and the adhesion are exhibited is preferably 100/1, more preferably 1/2 or more. The silver/binder volume ratio is in turn better. In addition, the most 1/1 to 3/b in the 'silver' binder composition layer is set to be miscellaneous by setting the silver salt amount in the silver salt amount, even if the unevenness of the coating resistance value is adjusted Having a uniform surface == 1st build-up conductive sheet 50A or 2nd build-up conductive sheet. Furthermore, the silver/45 201203062 binder volume ratio can be converted into a silver amount/bond by converting the raw material ratio into a silver amount (weight ratio), and the amount (weight ratio). The dose (volume ratio) was determined. <Solvent> The solvent used for forming the silver salt emulsion layer is not particularly limited, and examples thereof include water and an organic solvent (for example, an alcohol such as methanol, a guanidine such as propylene or the like, a guanamine such as formamide, or a dimethylene group. A sub-complement, an ethyl acetate surface, a key, etc.), an ionic liquid, and a mixed solvent of the solvents. The content of the solvent used in the silver salt emulsion layer of the present embodiment is Wt with respect to the total weight of the silver salt, the binder, and the like contained in the silver salt emulsion layer. /. A range of ~9 Gwt%, preferably in the range of 5 Gwt% to 8 Gwt%. <Other Additives> The various additives used in the present invention are not particularly limited. A known additive can be preferably used. [Other Layer Configuration] A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the term "protective layer" means a layer formed of a binder such as gelatin or a polymer, and is formed into a photosensitive silver salt emulsion in order to exhibit an effect of preventing scratches or improving mechanical properties. The thickness of the layer is preferably 〇5 仁m or less. The coating method and the formation method of the protective layer are not particularly limited, and a known coating method and formation method can be appropriately selected. Further, for example, an undercoat layer may be provided further below the silver salt emulsion layer 10. Next, each step of the method of producing the first conductive sheet 10A (10Aa) and the second conductive sheet 1B (10Ba) will be described. 46 201203062 Force COiplf [Exposure] In the present embodiment, the first conductive pattern 22A and the second conductive pattern 22B are applied by printing, and the second conductive pattern is formed by exposure, development, or the like in addition to the printing method. 22A and the second conductive pattern 22B. That is, the photosensitive material having the layer containing the silver salt provided on the i-th transparent substrate 12A and the second transparent substrate 12B or the photosensitive material coated with the photopolymer for photolithography is exposed. Exposure can be done using electromagnetic waves. Examples of the electromagnetic wave include radiation such as visible light, ultraviolet light, and radiation such as xenon rays. Further, it is also possible to use a light source having a wavelength distribution during exposure, or to use a light source having a specific wavelength. [Developing treatment] In the present embodiment, after the emulsion layer is exposed, development processing is further performed. For the development treatment, a conventional (four) technique using a silver salt photographic film or a printing paper, a film for printing plate, a latex for a mask, or the like can be used. The developing solution is not particularly limited, and a pQ developing solution, an MQ developing solution, a developing solution or the like may be used, and a commercially available product such as =6 'CR_56 'CP45X, _, pa_ _ακ, which is prepared by the company's film company, may be adjusted to SSw· Developing solution of the developing solution of 19, 0·72, etc. or its set (5)). Alternatively, a lithographic developer can be used. The development processing of the bright film may include a technique for fixing the silver salt photo film or the printing paper, the film for printing plate, and the like used for removing the unexposed portion. The fixing temperature of the first cover with the masking rubber is preferably about 〜~about 5〇47 201203062 ^DODipif is better, the processing amount is preferably _two: charging=inductive mI/m-below , especially good for 3〇Oml/m2 or less. Better next _

貝衫、固定處理的感光材料較佳為實施水兮卢 以下(亦包㈣，即積水水洗行以3L 對於曝光前的曝光部所含的“二3的銀的重量相 可獲得高導電性，故触 ⑼為50 wt%以上，則 本實施形態中的顯影處理後的灰階並 佳為超過4.0 〇若顯影處理後的灰階超過、义疋’較 的透光性保持得較高的狀態下提高導電 較佳驟可獲得導電片，所得導電片絲面電阻 ，.以上，更佳的範圍内。下限值較佳為1 進-步佳為㈣ 步進㈣光處理’可藉由石牙光處理來調整成所需的表i電 48 201203062 3555 lpif 阻 [物理顯影以及電鍍處理] 本實施形態中，為了使藉由上述曝 形成的金屬銀部的導電性提昇，亦可進行用以; 銀部承載導電性金屬粒子的物理顯影及/或電鑛處理。本^ 明中，可僅利用物理卿或電鍍處理的任—種而使 銀部承载導電性金屬粒子，亦可將物理顯影與電錢處理组 合而使金屬銀部承載導電性金屬粒子。再者，將對 部實施物理顯影及/或電鍍處理而成的部分包 為「導電性金屬部」。 所謂本實施形態中的「物理顯影」，是指於金屬或金 屬化合物的核上利用還原劑將銀離子等金屬離子還原而使 金屬粒子析出。該物理現象是用於—步黑白膠片（心加 black and white film，一步 B&amp;W 膠片）、_步幻燈膠片 (instant slide film)或印刷版製造等中，本發明中可^用 該技術。 另外，物理顯影可與曝光後的顯影處理同時進行，亦 可於顯影處理後另外進行。 本實施形態中’電鍍處理可使用無電電鍍（化學還原 電鑛或置換電鍍）、電解電鑛、或無電電鍍與電解電鍍兩 種。本實施形態的無電電鍍可使用公知的無電電鐘技術， 例如可使用印刷配線板等中使用的無電電鍍技術，無電電 鍍較佳為無電鍍銅。 [氧化處理] 49 201203062 jOCOipif 萨由形態中’較佳為對顯影處理後的金屬銀部以及 i化處理 或魏處理㈣成的導電性金屬部實施 金屬Si Γ化處理’例如於在透紐部上稍許沈積有 乎為時’可將该金屬去除而使透光性部的透射性幾 [導電性金屬部] m ifί形態的導電性金屬部的線寬（第1導電部ΠΑ 、等電部13Β的線寬）的下限較佳為1 以上、 ^以上、4 _以上或5 以上，上限較佳為10 // 、9 _以下、8 &quot;m以下。當線寬小於上述下限 導電性變得不充分’用於觸控面板100時檢測威度 變得不右八 J w q W /又 .刀另方面，右線寬超過上述上限值，則由導 電f生金屬部5丨起的條紋（mGire)變顯著，或用於觸控面板 1〇〇時視認性變差。再者，藉由設定於上述範圍内，導電 性金屬部的條紋得到改善，視認性變得特佳。線間隔（此 處為小格子18的彼此相向的邊的間隔）較佳為30 /zm以 上500 以下，更佳為50 //m以上400 以下，最 佳為100 /zm以上350 &quot;m以下。另外，導電性金屬部 亦可具有線寬較2〇〇 更寬的部分以進行接地等。 本實施形態的導電性金屬部就可見光透射率的方面 而言，開口率較佳為85%以上，更佳為9〇%以上最隹為 95%以上。所謂開口率，是指除了第1大格子14A、第1 連接部16A、第2大格子14B、第2連接部16B、小格子 50 201203062 18等導電部以外的透光性部分佔整體的比例，例如線寬為 15 /zm、間距為300 /zm的正方形的格子狀的開口率為 90%。 [透光性部] 所謂本實施形態的「透光性部」，是指第1導電片1〇A 以及第2導電片10B中導電性金屬部以外的具有透光性的 部分。透光性部的透射率如上所述，第1透明基體12A以 及第2透明基體12B的將光吸收及反射的作用除外的38〇 nm〜780 nm的波長區域下的透射率的最小值所表示的透 射率為90%以上，較佳為95%以上，更佳為97¾以上，進 而更佳為98%以上，最佳為99%以上。 關於曝光方法’較佳為介隔玻璃遮罩的方法或利用雷 射繪圖的圖案曝光方式。 [第1導電片10A(10Aa)以及第2導電片l〇B(l〇Ba)] 本實施形態的第1導電片l〇A(10Aa)以及第2導電 片10B (l〇Ba)中的第1透明基體12A以及第2透明基體 12B的厚度較佳為5以瓜〜35〇 ，更佳為3〇 &quot;瓜〜15〇 &quot;m。若為5 &quot;m〜350 的範圍，則可獲得所需的可 見光的透射率’且操作亦容易。 第1透明基體12A以及第2透明基體12B上設置的金 屬銀部的厚度可根據第1透明基體12A以及第2透明基體 12B上塗佈的含銀鹽的層用塗料的塗佈厚度而適當決定。 金屬銀部的厚度可自〇 〇〇1 mm〜〇2 mm中選擇較佳為 30 以下，更佳為2〇㈣以下，進而佳為〇〇1 _ 51 201203062 ^^ODipif 〜9 Am，最佳為0.05以m〜5以瓜。另外，金屬銀部較 佳為圖案狀。金屬銀部可為一層，亦可為二層以上的多層 構成於金屬銀部為圖案狀、且為二層以上的多層構成的 =形時，可賦予不同感色性以可於不同波長下感光。藉此， 右改變曝光波長進行曝光，則可於各層上形成不同圖案。 *關於導電性金屬部的厚度，於觸控面板的用途中厚度 越薄則顯示面板的視角越廣故而較佳，就視認性提昇的觀 點而言亦要求薄膜化。就此種觀點而言，由導電性金屬部 所承載的導電性金屬所形成的層的厚度較佳為小於9以 m，更佳為0.1 &quot;m以上且小於5 ，進而佳為以 m以上且小於3 // m。 本貫施形態令，藉由控制上述含銀鹽的層的塗佈厚度 而形成所需厚度的金屬銀部，進而藉由物理顯影及/或電鍍 處理而可自如地控制由導電性金屬粒子形成的層的厚度， 故即便是具有小於5 /zm、較佳為小於3 的厚度的第 1導電片lOA(lOAa)以及第2導電片10B(1〇Ba)，亦可 谷易地形成。 再者，本實施形態的第1導電片10A (10Aa)或第2 導電片10B (l〇Ba)的製造方法中，未必一定要進行電鑛 等步驟。其原因在於’本實施形態的第i導電片1〇Α(1〇Α^ 或第2導電片10B (10Ba)的製造方法中，可藉由調整銀 鹽乳劑層的塗佈銀量、銀/黏合劑體積比而獲得所需的表面 電阻。再者’視需要亦可進行讶光處理等。 (顯影處理後的硬膜處理） 52 201203062 3505ipif 對銀鹽乳劑層進行顯影處理後，較佳為浸潰於硬膜劑 中而進行硬膜處理。硬膜劑例如可列舉戊二醛 (glutaraldehyde )、己二醛（adipaldehyde )、2,3-二羥基4 + 二噁烷等二醛類以及硼酸等日本專利特開平2_141279號 中記載的硬膜劑。 [積層導電片] 對於積層導電片，亦可賦予抗反射膜126。此時，可 較佳地採用上述圖8A〜圖8C所示的第1構成例〜第3構 成例。 抗反射膜126例如是在第丨積層導電片5〇A上形成硬 塗層122以及抗反射層124 (參照第1構成例以及第2構 成例）、或在第1積層導電片50A上形成透明膜13〇、硬塗 層122以及抗反射層124而製作（參照第3構成例）。 以下，以第3構成例為主體，對抗反射膜126的較佳 態樣進行說明。 &lt;透明膜130&gt; 、透明臈130是用於顯示裝置1〇8的視認者側表面，故 要求其為透光率高、且透明性優異的無色的膜。此種透明 膜丨3〇較佳為使用塑膠膜。形成塑膠膜的聚合物可列舉： 醯化纖維素（例如富士膠片（股）製造的TAC-TD80U、 TD80UF等二乙醯纖維素，二乙醯纖維素，乙醯丙醯纖維 素丄乙醯丁醯纖維素）、聚醯胺、聚碳酸酯、聚酯（例如聚 對本一甲酉文乙一醋、聚萘二曱酸乙二g旨）、聚苯乙婦、聚稀 烴、降冰片烯系樹脂（Arton :商品名，JSR (股）製造）、 53 201203062 非晶質聚烯烴（Zeonex:商品名，日本Zeon (股）製造）、 (甲基)丙烯酸系樹脂（Acrypet VRL20A:商品名，三菱麗 陽（股）製造’日本專利特開2004-70296號公報或日本專 利特開2006-171464號公報記載的含環結構的丙烯酸系樹 脂）等。其中，較佳為三乙醯纖維素、乙醯丙醯纖維素、 乙醯丁醯纖維素、聚對苯二曱酸乙二酯、聚萘二曱酸乙二 醋’特佳為三乙醯纖維素。 &lt;硬塗層122&gt; 為了賦予抗反射膜126的物理強度，較佳為於該抗反 射膜126上設置硬塗層122 ^硬塗層122亦可由2層以上 的積層構成。 關於硬塗層122的折射率，根據用以獲得抗反射性的 膜的光學設計’折射率較佳為在1_48〜1.90的範圍内，更 佳為1.50〜1.80,進而佳為。本實施形態中， 於硬塗層122上具有至少一層低折射率層，因此若折射率 較該範圍過小則抗反射性下降，若過大則有反射光的色調 變強的傾向。 關於硬塗層122，就對抗反射膜丨26賦予充分的耐久 陡、耐衝擊性的觀點而言，硬塗層122的厚度通常是設為 以m〜50 /zm左右，較佳為1 〜2〇 ，更佳為 β m〜15 μ m，最佳為3〆m〜10 // m。另外，硬塗層 122的強度於鉛筆硬度試驗中，較佳為2H以上，更佳為 以上，最佳為4H以上。進而，於依照JISK54〇〇而進 行的Taber試驗中，試驗前後的試驗片的磨損量越少越好。 54 201203062 J303ipif 硬塗層m較佳為藉由電離放射線硬化性化合物的交 聯反應、《合反應㈣成。例如，亦可藉由將含有電離 放射線硬化性的多官能單體或多官能低聚物的組成物塗佈 於透明膜130上，並❹官能單體或多官能低⑽進行交 聯反應或聚合反應㈣成。電離放射線硬化性的多官能單 體或多官能低聚物㈣能基較佳為光、電子束、放射線聚 合性的物質’其中較佳為光聚合性官能基。光聚合性官能 基可列舉（甲基)丙烯醯基、乙埽基、苯乙稀基、丙稀基等 不飽和聚合性官能基等，其中較佳為（曱基)丙_基。關 於具體的化合物，可使用日本專鄕開鳩_3_號公報 的段落_7]以及_8]中記载的單體，且可使用該公報的 段落_9]巾域的硬化方法。絲合的情料可使用 該公報的段落[〇_]〜卿3]巾記載的光聚合起始劑。 硬塗層122中’為賦予内部散射性，亦可含有平均粒 徑為1.0 〜10.0 _，較佳為15難〜7 〇㈣的消 光粒子，例如無機化合物的粒子或樹脂粒子。該些粒子可 使用日本專利特開2〇〇6_3〇74〇號公報的段落[〇ιΐ4]中記載 的粒子。 為了控制硬塗層122的折射率，可於硬塗層122的黏 合劑中添加高折料單體或减生光散射的大小的無機微 粒子（一次粒子的直徑為1〇nm〜2〇()nm)或者此兩者。 …、機微粒子除了具有控制折射率的效果以外，亦具有抑制 由交聯反應導致的硬化收_效果。無機微粒子可使用日 本專利特開2006-30740號公報的段落[0〗20]中作為無機填 55 201203062 料而記載的化合物。 &lt;抗反射層124&gt; 抗反射膜⑶是於上述硬塗層⑵均財抗反射層 124的膜（有時亦包括下層❸透明膜13〇)，由 2，故抗反射層124較佳為具有以下所述的折射率及= $度;Ϊ二層二24可僅為一層’而於謀求更低的反射 ^夺，亦可將多個抗反射層124積層而形成。關於多個抗 ^層m的積層，可將具有不同折射率的光 Γ1：亦可將，不同折射率的光學干涉層積層2層以 上。具體而言，常使用於硬塗層122上僅設置 樣於ΓΓ22上依序設置高折射率層:低折射率 再者，折射率層的低、中、高 目對大小_的表現。另外，低折射率層的折 羊較佳為’設定得較上述硬塗層122的折射率更低。者 塗層122的折射率差過小時，抗反射性； :塗調變強的傾向。低折射率層與 =122的折射率差較佳為0.01以上、0.40以下，更佳 為0.05以上、0.30以下。 更佳 各層的折射率與厚度難為献町條件。 即’低折射率層的折射率較佳為l j〇〜Μ6，更佳 較佳=2，特佳為⑶〜U8。另外，低折射率層的厚度 較佳為50 nm〜15G nm，更佳為％腿〜i2() nm。旱又 為了於高折射率層上積層低折射率層而製作抗反射 56 201203062 ^DOMpif m 126 圭為w〜w，⑽ 選而佳為L65〜210’最佳為18 於自透明膜m (或觸控面板 順序積層中折射率層、高折 近至逖的 =2二？折射率層二==抗 :層:折射率與高折射率層的折射率之間的二= 整。中折射率層的折射率較佳為1.55〜1.80。再者，1折 厚:折射率層的厚度可設定為與折射率的範圍:應 [低折射率層] 上述低折射率層較佳為於形成層後進行硬化。低 率層的霧度較佳為3%以下，更佳為2%以下，最佳為1% 以下。 W 〇 用以形成本發明的低折射率層的較好組成物較佳為 至少包含以下任一種的組成物。可列舉： (1) 含有具有交聯性或聚合性的官能基的含氟聚合 物的組成物、 (2) 以含氟的有機矽烷材料的水解縮合物為主成分 的組成物、 (3) 含有具有2個以上的乙烯性不飽和基的單體及 具有中空結構的無機微粒子的組成物。 (1)具有交聯性或聚合性的官能基的含氟化合物 具有交聯性或聚合性的官能基的含氟化合物可列舉 57 201203062 O JOJipif 含氟單體與具有交聯性或聚合性的官能基的單體的共聚 物。 上述共聚物中，主鏈僅由碳原子構成、且含有含氣乙 稀基單體聚合單元及顺上具有（甲基)丙埽醯基的聚合單 元而成的共聚物可使用日本專利特開2004_45462號公報 的段落[0043]〜[0047]中記載的P4〜p_4〇。另外，為了改 良耐擦傷性及賴㈣導人有聚魏成分的含氟聚合物、 侧鏈上具有含有料氧烧部位的聚合單元且主鏈上具有 原子的接枝聚合物可使用日本專利特開2〇〇3_2227〇2號公 報的段落[0074]〜[0076]的表1以及表2中記載的化合物， 主鏈上含有來·聚魏敍(合物的結構單元的含乙稀性 不飽和基的氟聚合物可使用日本專利特開測_183322號 公報中記載的化合物。 對於上述聚合物，亦可如日本專利制2GG0-17028 號公報所記餘射併料絲合性錢和基的硬化劑。 另外’如日本專利特開聰-⑽52號公報所記載般與含 ，的多官能的具有聚合性不飽和基的化合物併用亦較佳。 夕官能的具有聚合性不飽和基的化合物的例子可列舉上述 =有2個以上的乙稀性不餘和基的單體。另外， ^Γ4·1·1號公報所記載的有機魏的水解縮合物 佳為含有(甲基)丙烯醯基的有機矽烷的水解缩 ί=ι?物特別於對聚合物本趙使用具有聚= 二人r物時’與耐擦傷性改良的併用效果大而較佳。 於聚口物自身單獨不具有充分的硬化性時，可藉由調 58 201203062 ^oooipif 配交聯性化合物而賦予必要的硬化性。例如於聚合物本體 含有羥基時，較佳為使用各種胺基化合物作為硬化劑。用 作父聯性化合物的胺基化合物例如為合計含有2個以上的 羥基烷基胺基以及烷氧基烷基胺基的任一種或兩種的化合 物，具體而言，例如可列舉三聚氰胺系化合物、脲系化合 物、苯代三聚氰胺系化合物、甘脲系化合物等。該些化合 物的硬化時，較佳為使用有機酸或其鹽。 一。 (2)含氟的有機碎烧材料的水解縮合物 以含氟的有機矽烷化合物的水解縮合物為主成分的 組，物亦是折射率低、塗膜表面的硬度高而較佳。較佳為 使氟化絲於單末端或兩末端含有水雜⑽鱗的化合 物與四絲基魏的縮合物。具體組成物於日本專° 2002-265866號公報、日本專利特開細2_317152號公報; 有所記載。 且右有具有2個以上的乙烯性不姊基的單體與 八有中二、構的無機微粒子的組成物 早作為其他的較佳祕，可列舉由低折射率的粒 低折射率層。低折料粒子為有機或益 機句可，較佳為内部具有孔隙的粒子 且 體例，於曰本專利特開2〇〇2 7、上中二粒子的具 砂糸物4 〇 特 *公報t記财二氧化 ^^ 參照段落[(Κ)41]〜_9]) °粒子折射率較 硬塗声更佳為⑶〜UG。黏合劑可列舉上述 的= 中所述的具有2個以上的乙稀性不飽和基 59 201203062 */\/·/ Λ. 低折射率層中，較佳為添加上述硬塗層122的項中所 述的聚合起始劑（例如參照日本專利特開2⑼6_3〇74〇號公 報的段落[0090]〜[0093])。含有自由基聚合性化合物的情 形時，相對於該化合物100重量份可使用i重量份〜1〇重 量份、較佳為1重量份〜5重量份的聚合起始劑。 低折射層中可併用無機粒子β為了賦予财擦傷性，可 使用具有低折射率層的厚度的15%〜150%、較佳為 〜100%、更佳為45%〜6〇%的粒徑的微粒子。 低折射率層中，為了賦予防汙性、耐水性、耐化學品 性、潤滑性等特性，可適當添加公知的聚石夕氧烧系或乳系 的防污劑、潤滑劑等。 [高折射率層/中折射率層] 對於杬反射膜126，可如上述般於低折射率層與硬塗 θ 12^之間設置折射率高的層而提高抗反射性。 嫉佩射率層以及巾折射率層較佳為由含有高折射無 古:及黏合劑的硬化性組成物所形成。此處可使用的 :可入3無?微粒子可使料了提高硬塗層122的折射率 有的高折料的無機微粒子。高折射率的無機微粒 合物的佳：:粒:氧化雜子、Ti〇2粒子等無機化 二 丙烯酸粒子、交聯丙烯酸粒子、聚苯乙烯粒 樹腊；三聚氛胺樹脂粒子、苯代三聚氛胺 分散率層以及巾折射率層較佳為，於在分散介質中 散有無_子的分餘巾，錄為進-步添加基質形成 201203062 JOOOipif 所必需的黏合劑前驅物（例如，下文將述的電離放射線硬 化性的多錢·❹官能低聚鱗）、光聚合雜劑等而 形成南折射㈣以及中折射率層形成用的塗佈組成物，例 如於透明膜上塗佈高折射率層以及+折射率層形成用的塗 佈組成物，藉由電離放射線硬化性化合物（例如多官能單 體或夕S⑪低聚物等）的交聯反應絲合反應硬化而 形成。 進而，較佳為，使高折射率層以及中折射率層的黏合 ^層塗佈的同時或塗佈後與分散劑進行交聯反應或聚合 反應。 如此而製作的高折射率層以及中折射率層的黏合 ，如成為上述較佳的分制與電離放射線硬化性的多 體或多官能低聚物進行交聯或聚合反應、使分散劑 的陰離子性基進人至黏合射的賴。進而，高折射率層 折射率層_合射，_子性基具有維持無機粒 的功能’交聯或聚合結構對黏合綱予皮膜 二=，改良含有無機粒子的高折射率層以及中折射率 層的物理強度、耐化學品性、耐候性。 ，折射率層_合劑是㈣於該高折射 組成物的m體成分量而添加5 wt%〜8G Wt%。 师 ，折射率層中的無機粒子的含量較佳為相對於 射率層的重量而為H) wt%〜9G wt%，更佳為15游 Γ，特佳為15 wt%〜75峨。無·子亦可於高折射率 層内併用兩種以上。 丰 201203062 當高折射率層上具有低折射率 射率較佳為高於透日靖m的折群。科廣的折 使用高折射率層作為絲干涉層時的膜厚較佳為30 nm 200nm’更佳為5〇nm〜17〇nm，特佳為6〇啦〜⑼ 高折射率層以及中折射率層的霧度越低越好 5%以下，更佳為3%以下，特佳為1%以下。 *、、、 ▲設有低折射率層的抗反制126雜佳的積分反射 較佳為3.0〇/〇以下，更佳為2 〇%以下，最佳為ι 5%以下㈣❶ 另外，就防汗性提昇的觀點而言，較佳為減少低折射 率層表面的表面自由能量。具體而言，較佳為將含說化合 物或具有聚矽氧烷結構的化合物用於低折射率層^另外， 亦可於低折射率層上與低折射率層相區分*另設置含有 述化合物的防汙層。 關於具有聚石夕氧烧結構的添加劑，添加以下添加劑亦 車乂佳·含反應性基的聚^夕氧烧{例如、 X-22-3701IE” 、 “X_22-173B” 、 X-22-169AS” 、“KF-102” X-22-164B”、“X-22-5002” X-22-174D”、“X-22_167B”、“X_22_161AS”（商品 名），以上為信越化學工業（股）製造；“AK5”、 AK-30 、“ΑΚ-32” （商品名），以上為東亞合成（股） 製造；「Silaplane FM0725」、「Silaplane FMXmi」（商品名）， 以上為Chisso (股）製造等卜另外，亦可較佳地使用曰本 62 201203062 專利特開2003-112383號公報的矣 氧系化合物。該些聚石夕氧燒較佳為以低^ = = 2 分的0.1 wt%〜10 wt%的範圍·、率層、.息固體成 祕的情況。 如圍而添加’特佳為lwt%〜5 [抗反射膜126的製作方法j 抗反射膜126可利用以下的泠饮士 a A 於該些塗佈方式。 下的塗佈方式來形成，但不限 (塗佈的準備作業） 製備含有用以形成硬塗層122或抗&amp;_以 的塗佈液。通常’塗佈液以有機溶劑系為主， 的捏水量抑制為2%以下，且加以密閉而抑制溶劑 ^發^。所使用的有機溶劑是根據各層所使用的材料而 機。。：、、了獲得塗佈液的均勻性而適當使用攪拌機或分散 ，調整的塗佈液較理想為於塗佈前進行過濾以不發 二故障。過濾的過濾器較佳為使用在不將塗佈液中的 於=除的fen内孔徑儘可能小的過濾器，過濾、壓力亦是 生.5 MPa町的範_適#麵。㈣㈣塗佈液較佳 ^將塗佈刖進行超音波分散、脫泡並保持分散物的分 敖狀態。 熱處^明，13 〇亦可於塗佈前實施用以績正基底變形的加 '或者用以改良塗佈性或改良與塗設層的接著性的 光放处理。表面處理的具體方法可列舉電暈放電處理、輝 電處理、火焰處理、酸處理、鹼處理或紫外線照射處 63 201203062 ipif 理另外，如日本專利特開平7_333433號公報所記載般， 亦可較佳地利用設置底塗層的處理。 進而，較佳為設置除塵步驟作為塗佈的前步驟，該除 ，步驟中使用的除塵方法可使用日本專利特開 號公報的段落[0119]中記載的方法。另外，就提高除塵效 率抑制垃圾附著的方面而言，特佳為於進行此種除塵步 驟之前將透_ 13G上的靜電去除。此種除電方法可使用 日本專利特開2010-32795號公報的段落[012〇]中記載的方 法進而，亦可利用上述公報的段落[〇12丨]以及[〇123]記載 的方法來峰保透明膜130的平面性、改良接著性。 (塗佈步驟） 抗反射膜126的各層可藉由以下的塗佈方法來形成， 但不限於該些方法。可使用浸潰塗佈法、氣刀塗佈法、廉 幕塗佈法、報塗佈法、線棒塗佈法、凹版塗佈法或擠壓塗 佈法（模塗佈法）（參照美國專利第2681294號說明書、國 際公開第05/123274號手冊）、微凹版塗佈法等公知方法， 其令較佳為微凹版塗佈法、模塗佈法。關於微凹版塗佈法， 於日本專利特開2〇10-32795號公報的段落[〇125]以及 [0126] 中有所記載，關於模塗佈法，於上述公報的段落 [0127] 以及[0128]中有所記載，本實施形態中亦可使用該些 方法。就生產性的方面而言’較佳為使用模塗佈法以2〇m/ 分鐘以上的速度塗佈。 (乾燥歩驟） 抗反射膜126較佳為於透明膜13〇上直接或介隔其他 64 201203062 JJUJipif f而塗佈後，用網（web)搬送至經加熱的 中以將溶劑乾燥。 、z〇ne) 作為將溶劑乾燥的方法，可利用各種方法。 可列舉日本專利特開麗德幻7號公報、日本專决 2001-314798號公報、日本專利特開綱3 12676八名開 日本專利特開細-皿仍號公報、日本專利^' 2004-34002號公報等的記載技術。 、竭 關於乾燥區域的溫度條件，可使用日本 2010-32795號公報的段落[〇13〇]中記載的條件，關於^ 風的條件，可使用該公報的段落[0131]中記載的條件广、 (硬化步驟） 抗反射膜126可於溶劑乾燥後或乾燥後期，以網的带 式通過藉由電離放射線及/或熱而使各塗膜硬化的區域，使 塗膜硬化。上述電離放射線並無特別限制，可根據形成皮 膜的硬化性組成物的種類而自紫外線、電子束、近紫外線、 可見光、近紅外線、紅外線、X射線等中適當選擇，較佳 為紫外線、電子束，特別就操作簡便且容易獲得高能量的 方面而言’較佳為紫外線。 關於使紫外線硬化性化合物進行光聚合的紫外線的 光源’可使用日本專利特開2010-32795號公報的段落[0133] 中s己載的光源，關於電子束，可該上述公報的段落[〇134] 中記載的電子束。另外，關於照射條件、照射光量、照射 時間，可使用該公報的段落[〇135]以及[0138]中記載的條 件。進而，關於照射前後的膜的膜面溫度、氧濃度、氧濃 65 201203062 J303ipif 度的控制方法，可使用該公報的段落[0136]、段 段落[0139]〜段落[0144]中記載的條件、方法。 (用以進行連續製造的操作） 為了連續地製造抗反射膜126，進行以下步驟：連續 地送出輥狀的透_ 13G ;㈣塗佈液並加以乾燥；使塗 膜硬化；以及捲取具有經硬化的層的該透明膜13〇。 上述步驟可於形成各層時分別進行，亦可設置多個塗 佈部，燥室-硬化部⑽胃㈣方式）而連續進行各層 的形成。 為了製作抗反射膜126，較佳為在如上述般進行塗佈 液的精密過_作的同時，在潔淨度高的域環境下 塗佈部的塗佈步㈣及於錢室中進行的乾料驟，且於 f塗佈之前將透明膜13G上的垃圾、塵埃充分去除。塗 步驟的空氣潔淨度較理想為根據美國聯邦 ^旱2_的空氣潔淨度的標準而為1G級（0.5㈣以上 的粒子為353俯W以下）以上，更佳為i級（〇 $㈣以 上的粒子為35.5個/m3以下）以上。另外 佳為於塗佈—賴㈣财卜的送出、捲取料度更 為了維持圖像的清晰性，抗反射膜126較 ，面形狀調整得儘可能平滑以外，調整透射 又。杬反射膜126的透射圖像清晰度較佳為6〇%以上。 射圖像清晰度財為表科過竊映出的®像的模糊程产 的指標，該值越大表示通過膜而見到的圖像越清晰良好二 透射圖像清晰度較佳為鄕以上，更佳為8()%以上。 66 201203062 抗反射膜126可用作顯示裝置108的視認侧的表面 膜。關於顯示裝置108，可應用於各種液晶顯示裝置、電 漿顯示器、有機電致發光（Electroluminescence，EL)、觸 控面板等各種顯示裝置。視使用抗反射膜126的顯示裝置 108的最表面的性質不同，可於抗反射膜126的透明膜no 的不具有塗佈層之側的表面（以下有時記作背面）上設置 黏接劑層’或使透明膜130的上述背面凝膠化後貼合於觸 控面板100。 關於使透明膜13〇的上述背面凝膠化的方法，可使用 曰本專利特開2010-32795號公報的段落[〇149]〜段落 [0160]中記载的技術。 再者’本發明可與下述表1以及表2中記載的公開公 報以及國際公開手冊的技術適當組合使用。將「日本專利 特開」、「號公報」、「號手冊」等的表述省略。 67 201203062 JDODlplf [表l] 2004- 221564 2007-235115 2006- 332459 2007- 102200 2006-228478 2006- 348351 2007- 134439 2007- 310091 2005- 302508 2008- 267814 2008-283029 2009-4213 2008-147507 2008-218096 2008-241987 2004-221565 2007-207987 2009-21153 2006-228473 2006- 228836 2007- 270321 2007-149760 2007- 116137 2008- 218784 2008-270405 2008- 288305 2009- 10001 2008-159770 2008-218264 2008-251274 2007-200922 2006- 012935 2007- 226215 2006- 269795 2007- 009326 2007-270322 2007-208133 2007- 088219 2008- 227350 2008-277675 2008- 288419 2009- 16526 2008-159771 2008-224916 2008-251275 2006-352073 2006-010795 2006-261315 2006-269795 2006- 336090 2007- 201378 2007-178915 2007- 207883 2008- 227351 2008-277676 2008- 300720 2009- 21334 2008-17156B 2008-235224 2008-252046 2007-129205 2006- 228469 2007- 072171 2006-324203 2006- 336099 2007- 335729 2007-334325 2007- 013130 2008- 244067 2008-282840 2008- 300721 2009- 26933 2008-198388 2008-235467 2008-277428 [表2] 2006/001461 2006/088059 2006/098333 2006/098336 2006/098338 2006/098335 2006/098334 2007/001008 [實例] 以下’列舉本發明的實例對本發明加以更具體說明。 再者，以下實例中所示的材料、使用量、比例、處理内容、 處理順序等，只要不偏離本發明的主旨則可適當變更。因 此’本發明的範圍不應由以下所示的具體例限定性地解釋。 關於比較例1以及比較例2、實例1〜實例6的導電 68 201203062 表面電阻以及透射率’並評價條紋以及視認性。 =例i以及比較例2、實例i〜實例6的詳細情況及測 疋結果以及評價結果示於表3中。 〈實例1〜實例6、比較例1、比較例2&gt; (鹵化銀感光材料） 製備相對於水介質中的Ag 150 g而含有明膠i〇 〇 g、 且含有球近錄平均為(u 的賴氯化錄子（ι=〇2 mol X)、Br=40 mol% )的乳劑。 另外’於乳劑中以濃度為1〇·7 (m〇1/m〇1銀）的方式 添加KsRMr9以及KyrCl6 ’於漠化銀粒子中摻雜灿離子 及ΙΓ離子。於該乳劑中添加咖祕丨4，進而使用氣化金酸 及硫代硫酸鈉進行金硫敏化後，與明膠硬膜劑一起以銀的 塗佈董達到10 g/m2的方式塗佈於第1透明基體12Α以及 第2透明基體12B(此處均為聚對苯二曱酸乙二醋（pET)) 上。此時，Ag/明膠體積比是設定為2/1。 於寬度為30 cm的PET支持體上以25 cm的寬度塗佈 20 m，以保留塗佈的中央部24 cm的方式於兩端各切下3 cm，獲得輥狀的齒化銀感光材料。 (曝光） 關於曝光圖案，第1導電片10A採用圖1以及圖4所 示的圖案’第2導電片10B採用圖4以及圖6所示的圖案， 對A4尺寸（210 mm&gt;&lt;297 mm)的第1透明基體12A以及 第2透明基體12B進行曝光。曝光是介隔上述圖案的光罩 使用將高壓水銀燈作為光源的平行光來進行曝光。 69 201203062 (顯影處理） •顯影液1L配方 對苯二酚 20 g 亞硫酸納 50 g 碳酸斜 40 g 乙二胺四乙酸 2g 溴化鉀 3g 聚乙二醇2000 1 g 氫氧化鉀 4 g pH 調整為10.3 •固定液1 L配方 硫代硫酸銨液（75%) 300 ml 亞硫酸敍一水合物 25 g 1，3-二胺基丙烷-四乙酸 8g 乙酸 5 g 氨水（27%) 1 g pH 調整為6.2 使用上述處理劑，利用富士膠片公司製造的自動顯影 機FG-710PTS，於顯影35°C30秒、固定34°C23秒、水洗 流水（5 L/m iη ) 2 0秒的處理條件下對經曝光的感光材料進 行處理。 (實例1 ) 所製作的第1導電片10Α以及第2導電片10Β的導電 部（第1導電圖案22Α、第2導電圖案22Β)的線寬為1 # 201203062 JDODipif m、小格子18的一邊的長度為50 //m、大格子（第1大 格子14A以及第2大格子14B)的一邊的長度為3 mm。 (實例2) 除了使導電部的線寬為5 /zm、小格子18的一邊的 長度為50 //m以外，與實例1同樣地製作實例2的第1 導電片以及第2導電片。 (實例3 ) 除了使導電部的線寬為9 //m、小格子18的一邊的 長度為150 //m、大格子的一邊的長度為5 mm以外，與 實例1同樣地製作實例3的第1導電片以及第2導電片。 (實例4) 除了使導電部的線寬為10 um、小格子18的一邊的長 度為300 //m、大格子的一邊的長度為6 mm以外，與實 例1同樣地製作實例4的第1導電片以及第2導電片。 (實例5 ) 除了使導電部的線寬為15 ym、小格子18的一邊的 長度為400 //m、大格子的一邊的長度為10mm以外，與 實例1同樣地製作實例5的第1導電片以及第2導電片。 (實例6) 除了使導電部的線寬為20 gm、小格子18的一邊的 長度為500 #m、大格子的一邊的長度為10 mm以外，與 實例1同樣地製作實例6的第1導電片以及第2導電片。 (比較例1) 除了使導電部的線寬為0.5 #m、小格子18的一邊的 71 201203062 3D03ipif 長度為40 //m、大格子的一邊的長度為3 mm以外，與實 例1同樣地製作比較例1的第1導電片以及第2導電片。 (比較例2) 除了使導電部的線寬為25 //m、小格子18的一邊的 長度為500 #m、大格子的一邊的長度為1〇111111以外，與 比較例1同樣地製作比較例3的第1導電片以及第2導電 片。 (表面電阻測定） 為了確6忍檢測精度的好壞，使用Dia instnjments公司 製造的L0resta GP (型號Μ〇&gt;·Τ61〇)串聯四探針探測器 (ASP)對第丨導電片1QA以及第2導電片1⑽的表面電 阻率敎任意1G處，求出測定所得的值的平均值。 (透射率的測定） 為了確認翻性騎壞，使时光光度計對第【導電 片1〇A以及第2導電片10B測定透射率。 (條紋的評價） 導電較例1以及比較例2、實例1〜實例6，於1 後，於f積層第1導電片而製作積層導電片， 觸控面= 上貼附積層導電㈣ 示裝置祕n觸控面板⑨胁轉盤上，驅動液晶 觀察距疋示竣置的顯示晝面15 m 將條紋不顯現時評價為〇，條紋極少 72 201203062 JSWipif 地可見且為無問題的水準時評價為△，條紋賴時評價為 X 0 (視認性的評價） 於上述條紋的評價之前，將觸控面板設置於轉盤上， 驅動液晶顯示裝置而使其顯示白色時，以肉眼確認是否存 在粗線或黑色的斑點’另外確認觸控面板的第1大格子 14A以及第2大格子14B的邊界是否顯眼。 [表3] 導電部的 線寬 (Aim) 小格子的 一邊的長度 (Aim) 大格子的 一邊的長度 3 表面電阻 (Ω/sq.) lk以上 透射率 (%) 90 ' 條紋 評價 ΤΓ 視認性 評價 比較例1 0.5 &quot;&quot;40 &quot; 實例1 1 50 3 80 90 〇 〇一 實例2 5 50 3 15 75 〇 〇 實例3 9 150 5 25 86 〇 〇 實例4 10 300 &quot;6 50 87 〇 實例5 15 400 10 45 86 〇 實例6 20 500 10 40 86 Λ 比較例2 25 500 10 33 83 X X ——&quot; — 根據表3可知，比較例1中，雖然條紋以及視認性的 評價均良好’但比較例1的表面電阻為1 kQ/sq·以上，導 電性低’可能檢測感度變得不充分。比較例2中，雖然導 電性以及透射率均良好，但條紋明顯，易由肉眼識別導電 部自身，視認性惡化。 相對於此，實例1〜實例6中，實例1〜實例5中的 導電性、透射率、條紋、視認性均良好。實例6中，雖然 條紋的評價以及視認性的評價差於實例1〜實例5，但條紋 為極少量地可見且無問題的水準的程度，不存在難以看到 73 201203062 3iWlplf 顯示裝置的顯示圖像的情況。 再者，本發明的導電片、導電片的使用方法以及靜電 電容式觸控面板並不限於上述實施形態，當然可於不偏離 本發明主旨的情況下採用各種構成。 【圖式簡單說明】 圖1是表示第1導電片上形成的第1導電圖案的圖案 例的平面圖。 圖2是將第1導電片省略一部分而表示的剖面圖。 圖3是表示觸控面板的構成的分解立體圖。 圖4是將第1積層導電片省略一部分而表示的分解立 體圖。 圖5A是將第1積層導電片的一例省略一部分而表示 的剖面圖。 圖5B是將第1積層導電片的其他例省略一部分而表 示的剖面圖。 圖6是表示第2導電片上形成的第2導電圖案的圖案 例的平面圖。 圖7是將第1導電片與第2導電片組合而形成第1積 層導電片的例子省略一部分而表不的平面圖。 圖8A是表示賦予有抗反射膜的第1構成例的示意圖。 圖8B同樣是表示第2構成例的示意圖。 圖8C同樣是表示第3構成例的示意圖。 圖9是將第2積層導電片省略一部分而表示的分解立 體圖。 201203062 3^05 ipif 圖10是表示第2積層導電片的第i導電片上形成的 第1導電圖案的圖案例的平面圖。 圖π是表示第2積層導電片的第2導電片上形成的 第2導電圖案的圖案例的平面圖。 圖12是將第1導電片與第2導電片組合而形成第2 觸控面板用導電片的例子省略一部分而表示的平面圖。 圖13是表示變形例的積層導電片的第1導電片上形 成的第1導電圖案的圖案例的平面圖。 圖14是表示變形例的積層導電片的第2導電片上形 成的第2導電圖案的圖案例的平面圖。 圖15是表示本實施形態的透明導電性膜的製造方法 的流程圖。 圖16A是將所製作的感光材料省略一部分而表示的 剖面圖。 圖16B是表示對感光材料的兩面同時曝光的說明圖。 圖Π是表示使照射至第1感光層的光不到達第2感 光層、且使照射至第2感光層的光不到達第1感光層而進 行第1曝光處理以及第2曝光處理的狀態的說明圖。 【主要元件符號說明】 IOA、 10Aa :第1導電片 IOB、 lOBa :第2導電片 12A :第1透明基體 12B :第2透明基體 13A :第1導電部 75 201203062 ipif 13B :第2導電部 14A :第1大格子 14B :第2大格子 16A :第1連接部 16B :第2連接部 18 :小格子 20 :中格子 20a〜20h :第1中格子〜第8中格子 22A :第1導電圖案 22B :第2導電圖案 24A :第1絕緣部 24B :第2絕緣部 26a、26b :頂點部分 28a〜28h :第1邊部〜第8邊部 30 :直線部 32 :梳齒 40a :第1結線部 40b :第2結線部 41a:第1端子配線圖案 41b :第2端子配線圖案 42a :凹部 42b :凸部 50A :第1積層導電片 50B、50Ba :第2積層導電片 76 201203062 ipif 100 觸控面板 106 保護層 108 顯示裝置 110 顯示面板 110a :顯示晝面 112 :感測器部 114 :端子配線部 116a :第1端子 116b :第2端子 118a :第1對準標記 118b ··第2對準標記 120 :透明黏接劑 120A :第1透明黏接劑 120B :第2透明黏接劑 122 :硬塗層 124 :抗反射層 126 :抗反射膜 128 :保護樹脂層 130 :透明膜 140 :感光材料 142a :第1感光層 142b :第2感光層 144a :第1光 144b :第2光 77 201203062 JJVJ lpif 146a :第1光罩 146b :第2光罩 148a :第1光源 148b :第2光源 150a :第1準直透鏡 150b :第2準直透鏡 152a :第1曝光圖案 152b :第2曝光圖案 Lf :投影距離 Pm、Ps :排歹|J間距 S1〜S3 :步驟 Wcl、Wc2 :寬度 78The vestibule and the fixed-process photographic material are preferably made of water slag or less (also included in (4), that is, the water-washing water is washed to 3L, and the high-conductivity of the weight of the silver of the two-third is contained in the exposed portion before the exposure, When the contact (9) is 50 wt% or more, the gray scale after the development treatment in the present embodiment is preferably more than 4.0 〇 if the gray scale after the development treatment is exceeded, and the light transmittance of the 疋 疋 is kept high. The conductive sheet is preferably improved to obtain a conductive sheet, and the obtained conductive sheet has a surface resistance of more than 0.1. More preferably, the lower limit value is preferably 1 step-by-step (four) step (four) light treatment 'by stone Tooth light treatment is adjusted to the required surface power. 201203062 3555 lpif resistance [physical development and plating treatment] In the present embodiment, in order to improve the conductivity of the metal silver portion formed by the above exposure, it is also possible to perform The silver portion carries the physical development and/or the electric ore treatment of the conductive metal particles. In the present invention, the silver portion may be used to carry the conductive metal particles by any of the physical or electroplating treatments, or may be physically developed. Combined with electric money processing to make the metal silver department The conductive metal particles are loaded, and the portion where the physical development and/or the plating treatment is performed on the opposite portion is referred to as a "conductive metal portion". The "physical development" in the present embodiment means metal or metal. The metal nucleus such as silver ions is reduced by a reducing agent on the core of the compound to precipitate metal particles. The physical phenomenon is used for black and white film (black and white film, one step B&W film), _step slide film ( In the instant slide film), printing plate manufacturing, etc., the technique can be used in the present invention. Further, the physical development can be performed simultaneously with the development processing after the exposure, or can be additionally performed after the development processing. Electroless plating (chemical reduction ore plating or displacement plating), electrolytic ore plating, electroless plating, and electrolytic plating can be used. The electroless plating of the present embodiment can use a known electroless clock technology, for example, a printed wiring board or the like can be used. Electroless plating technology used, electroless plating is preferably electroless copper plating [Oxidation treatment] 49 201203062 jOCOipif Sa is in the form of 'better pair The metal silver portion after the development treatment and the conductive metal portion formed by the i-treatment or the Wei treatment (4) are subjected to a metal Si deuteration treatment, for example, when the deposition is slightly performed on the transmissive portion, the metal may be removed. The lower limit of the linearity of the conductive metal portion (the line width of the first conductive portion 、 and the isoelectric portion 13Β) of the conductive metal portion in the form of the light-transmitting portion is preferably 1 or more and ^ or more. 4 _ or more or 5 or more, the upper limit is preferably 10 //, 9 _ or less, 8 &quot; m or less. When the line width is smaller than the lower limit, the conductivity becomes insufficient. When the touch panel 100 is used, the detection power becomes In the other case, when the right line width exceeds the above upper limit value, the stripe (mGire) picked up by the conductive f-metal portion 5 becomes conspicuous, or when used for the touch panel 1〇〇 The visibility is worse. Further, by setting within the above range, the streaks of the conductive metal portion are improved, and the visibility is particularly excellent. The line spacing (here, the interval between the sides of the small lattices 18 facing each other) is preferably 30 /zm or more and 500 or less, more preferably 50 / m or more and 400 or less, and most preferably 100 / zm or more and 350 &quot;m or less; . Further, the conductive metal portion may have a portion having a wider line width than 2 turns to perform grounding or the like. In the conductive metal portion of the present embodiment, the aperture ratio is preferably 85% or more, more preferably 9% by weight or more, and most preferably 95% or more in terms of visible light transmittance. The aperture ratio is a ratio of the translucent portion other than the conductive portion such as the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, and the small lattice 50 201203062 18, and the like. For example, a grid-like aperture ratio of a square having a line width of 15 /zm and a pitch of 300 /zm is 90%. [Translucent portion] The "translucent portion" of the present embodiment refers to a portion having light transmissivity other than the conductive metal portion of the first conductive sheet 1A and the second conductive sheet 10B. As described above, the transmittance of the translucent portion is represented by the minimum value of the transmittance in the wavelength region of 38 〇 nm to 780 nm excluding the effects of light absorption and reflection by the first transparent substrate 12A and the second transparent substrate 12B. The transmittance is 90% or more, preferably 95% or more, more preferably 973⁄4 or more, still more preferably 98% or more, and most preferably 99% or more. The exposure method 'is preferably a method of interposing a glass mask or a pattern exposure method using a laser drawing. [First conductive sheet 10A (10Aa) and second conductive sheet 10B (1〇Ba)] in the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10B) of the present embodiment The thickness of the first transparent substrate 12A and the second transparent substrate 12B is preferably 5 to 35 Å, more preferably 3 Å & λ 〜 15 〇 &quot; m. If it is in the range of 5 &quot;m~350, the desired transmittance of visible light can be obtained' and the operation is easy. The thickness of the metal silver portion provided on the first transparent substrate 12A and the second transparent substrate 12B can be appropriately determined depending on the coating thickness of the coating material for the silver salt-containing layer applied on the first transparent substrate 12A and the second transparent substrate 12B. . The thickness of the metal silver portion may be selected from the range of 〇〇〇1 mm to 〇2 mm, preferably 30 or less, more preferably 2 〇(4) or less, and further preferably 〇〇1 _ 51 201203062 ^^ODipif 〜9 Am, the best For 0.05 to m~5 to melon. Further, the metallic silver portion is preferably patterned. The metal silver portion may be one layer, or a plurality of layers of two or more layers may be formed in a pattern in which the metal silver portion is patterned and two or more layers are formed, and different color sensitivities may be imparted to sensitize at different wavelengths. . Thereby, by changing the exposure wavelength to the right for exposure, different patterns can be formed on the respective layers. * Regarding the thickness of the conductive metal portion, the thinner the thickness of the display panel in the use of the touch panel, the better the viewing angle of the display panel is, and the thinning is also required in view of the improvement in visibility. From such a viewpoint, the thickness of the layer formed of the conductive metal carried by the conductive metal portion is preferably less than 9 m, more preferably 0.1 &quot;m or more and less than 5, and further preferably m or more. Less than 3 // m. According to the present invention, the metal silver portion having a desired thickness is formed by controlling the coating thickness of the silver salt-containing layer, and the conductive metal particles are freely controlled by physical development and/or plating treatment. The thickness of the layer is such that even the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (1〇Ba) having a thickness of less than 5 /zm, preferably less than 3, can be easily formed. Further, in the method of manufacturing the first conductive sheet 10A (10Aa) or the second conductive sheet 10B (10 Ba) of the present embodiment, it is not always necessary to perform steps such as electric ore. The reason for this is that in the method for producing the ith conductive sheet 1〇Α (1〇Α^ or the second conductive sheet 10B (10Ba) of the present embodiment, the amount of coated silver of the silver salt emulsion layer can be adjusted, and silver/ The desired surface resistance can be obtained by the volume ratio of the binder. Further, it can be subjected to a surprise treatment, etc. (dough film treatment after development treatment) 52 201203062 3505ipif After developing the silver salt emulsion layer, it is preferably Dyeing is carried out by dipping in a hard coating agent, and examples of the hardener include dialdehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy 4 + dioxane, and boric acid. The hard coat agent described in JP-A No. 2-141279. [Laminated conductive sheet] The laminated conductive sheet may be provided with the anti-reflection film 126. In this case, the first embodiment shown in Figs. 8A to 8C may be preferably used. 1 constituting example to third constituting example. The antireflection film 126 is formed, for example, by forming a hard coat layer 122 and an antireflection layer 124 on the second laminated conductive sheet 5A (see the first configuration example and the second configuration example), or A transparent film 13 〇, a hard coat layer 122, and anti-reflection are formed on the first build-up conductive sheet 50A. The layer 124 is produced (see the third configuration example). Hereinafter, a preferred embodiment of the antireflection film 126 will be described with reference to the third configuration example. &lt;Transparent film 130&gt; The transparent crucible 130 is used for the viewer side surface of the display device 1 to 8 and is required to be a colorless film having high light transmittance and excellent transparency. It is preferable to use a plastic film for such a transparent film. The polymer forming the plastic film may be exemplified by deuterated cellulose (for example, TAC-TD80U, TD80UF, etc. manufactured by Fujifilm Co., Ltd.), diethyl phthalocyanine, diethyl phthalocyanine, acetaminophen cellulose 丄 醯醯Cellulose), Polyamide, Polycarbonate, Polyester (for example, Poly-Phosphorus, Acetone, Polyethylene Naphthalate), Polystyrene, Polycarbonate, Norbornene Resin (Arton: trade name, manufactured by JSR), 53 201203062 Amorphous polyolefin (Zeonex: trade name, manufactured by Zeon, Japan), (meth)acrylic resin (Acrypet VRL20A: trade name, Mitsubishi The "acrylic resin containing a ring structure" described in Japanese Laid-Open Patent Publication No. 2004-70296, or JP-A-2006-171464, and the like. Among them, preferred is triacetonitrile cellulose, acetamidine cellulose, acetaminophen cellulose, polyethylene terephthalate, and polyethylene naphthalate. Cellulose. &lt;Hard Coat Layer 122&gt; In order to impart physical strength to the anti-reflection film 126, it is preferable to provide a hard coat layer 122 on the anti-reflection film 126. The hard coat layer 122 may be composed of two or more layers. The refractive index of the hard coat layer 122 is preferably in the range of from 1 to 48 to 1.90, more preferably from 1.50 to 1.80, depending on the optical design of the film for obtaining antireflection. In the present embodiment, since at least one low refractive index layer is provided on the hard coat layer 122, if the refractive index is too small, the antireflection property is lowered, and if it is too large, the color tone of the reflected light tends to be strong. With respect to the hard coat layer 122, the thickness of the hard coat layer 122 is usually set to about m 50 50 /zm, preferably 1 to 2, from the viewpoint of imparting sufficient durability and impact resistance to the reflective film sheet 26 . Preferably, it is β m 15 μm, and most preferably 3 〆 m 10 10 // m. Further, the strength of the hard coat layer 122 is preferably 2H or more, more preferably 10 or more, and most preferably 4H or more in the pencil hardness test. Further, in the Taber test conducted in accordance with JIS K54, the amount of wear of the test piece before and after the test is preferably as small as possible. 54 201203062 J303ipif The hard coat layer m is preferably a cross-linking reaction by ionizing radiation curable compound, "combination reaction (4). For example, a composition containing an ionizing radiation-curable polyfunctional monomer or a polyfunctional oligomer may be applied to the transparent film 130, and a hydrazine functional monomer or a polyfunctional low (10) may be subjected to a crosslinking reaction or polymerization. Reaction (four) into. The ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer (IV) is preferably a light, electron beam or radiation-polymerizable substance. Among them, a photopolymerizable functional group is preferred. The photopolymerizable functional group may, for example, be an unsaturated polymerizable functional group such as a (meth)acryl fluorenyl group, an ethyl fluorenyl group, a styrene group or an acryl group, and among them, a (fluorenyl) propyl group is preferred. As the specific compound, the monomer described in paragraphs _7 and _8 of the Japanese Patent Laid-Open No. _3_ can be used, and the method of curing the towel field can be used in the paragraph _9 of the publication. For the silky material, the photopolymerization initiator described in the paragraph [〇_]~卿3] of the publication can be used. The hard coat layer 122 may have internal scattering properties, and may also contain matting particles having an average particle diameter of 1.0 to 10.0 Å, preferably 15 to 7 〇 (4), for example, particles of an inorganic compound or resin particles. The particles described in the paragraph [〇ιΐ4] of the Japanese Patent Publication No. 2〇〇6_3〇74〇 can be used for the particles. In order to control the refractive index of the hard coat layer 122, high-folding monomers or inorganic fine particles of reduced light scattering size may be added to the adhesive of the hard coat layer 122 (the diameter of the primary particles is 1 〇 nm 〜 2 〇 () Nm) or both. In addition to the effect of controlling the refractive index, the fine particles of the machine also have an effect of suppressing the hardening due to the crosslinking reaction. As the inorganic fine particles, the compound described in the section [02]20 of JP-A-2006-30740 can be used as the inorganic filler 55 201203062. &lt;Anti-reflection layer 124&gt; The anti-reflection film (3) is a film of the hard coat layer 124 of the hard coat layer (2) (including the lower layer of the transparent film 13), and the anti-reflection layer 124 is preferably The refractive index and the value of = $ degrees are as follows; the second layer two 24 may be only one layer', and a lower reflection is sought, and a plurality of anti-reflection layers 124 may be laminated. With respect to the lamination of the plurality of anti-layers m, the photoreceptors 1 having different refractive indices may be formed by layering the optical interference layers of different refractive indices. Specifically, it is often used on the hard coat layer 122 to provide only a high refractive index layer on the crucible 22 in order: a low refractive index, and a low, medium, and high refractive index of the refractive index layer. Further, the folded portion of the low refractive index layer is preferably set to be lower than the refractive index of the hard coat layer 122. The refractive index difference of the coating layer 122 is too small, and the antireflection property; the tendency of the coating to become strong. The difference in refractive index between the low refractive index layer and =122 is preferably 0.01 or more and 0.40 or less, more preferably 0.05 or more and 0.30 or less. Better The refractive index and thickness of each layer are difficult to provide. Namely, the refractive index of the low refractive index layer is preferably from 1 j 〇 to Μ 6, more preferably from 2, particularly preferably from (3) to U8. Further, the thickness of the low refractive index layer is preferably from 50 nm to 15 G nm, more preferably from % leg to i2 () nm. Drought and anti-reflection for the deposition of a low-refractive-index layer on the high-refractive-index layer 201203062 ^DOMpif m 126 is w~w, (10) preferably L65~210' is preferably 18 from the transparent film m (or The refractive index layer in the sequential stack of the touch panel, the high-definition to 逖=2 ?? refractive index layer 2 == resistance: layer: the refractive index and the refractive index of the high refractive index layer are two = integer. The refractive index of the layer is preferably from 1.55 to 1.80. Further, the thickness of the refractive index layer can be set to be in the range of the refractive index: [low refractive index layer] The low refractive index layer is preferably formed in the layer. Thereafter, the low-strength layer has a haze of preferably 3% or less, more preferably 2% or less, most preferably 1% or less. W 〇 is preferably a preferred composition for forming the low refractive index layer of the present invention. The composition containing at least one of the following: (1) a composition containing a fluorine-containing polymer having a crosslinkable or polymerizable functional group, and (2) a hydrolysis condensate of a fluorine-containing organodecane material a composition containing a main component, (3) a monomer having two or more ethylenically unsaturated groups, and a non-hollow structure (1) Fluorine compound having a crosslinkable or polymerizable functional group The fluorine-containing compound having a crosslinkable or polymerizable functional group may be exemplified by 57 201203062 O JOJipif fluorine-containing monomer and having cross-linking Copolymer of a monomer having a functional or polymerizable functional group. In the above copolymer, the main chain is composed only of carbon atoms, and contains a polymerized unit of a vinylidene group monomer and has a (meth) propyl fluorenyl group. The copolymer obtained by the polymerization unit may be P4 to p_4〇 described in paragraphs [0043] to [0047] of JP-A-2004-45462. In addition, in order to improve the scratch resistance and the (four) lead, there is a Weiwei component. The fluoropolymer, the graft polymer having a polymerized unit containing an oxygen-burning site on the side chain and having an atom in the main chain can be used in the paragraph [0074] to [Japanese Patent Laid-Open Publication No. Hei. The compound described in Table 1 and Table 2 of 0076], the fluoropolymer containing an ethylenically unsaturated group in the main chain containing the structural unit of the polymer can be used in Japanese Patent Application No. _183322 The compound described in the publication. Further, it is also possible to use a sizing agent such as the one disclosed in Japanese Patent Laid-Open Publication No. 2 GG0-17028, and the like. The compound having a polymerizable unsaturated group is also preferably used in combination. Examples of the compound having a polymerizable unsaturated group in the oxime function include the above-mentioned monomers having two or more ethylidene groups. The hydrolyzed condensate of organic Wei described in the publication of Γ4·1·1 is preferably a hydrolyzed condensed product of an organic decane containing a (meth) acrylonitrile group, particularly having a poly = two for the polymer. When the human object is used, the combined effect with the improvement of the scratch resistance is large and preferable. When the agglomerate itself does not have sufficient sclerosing properties, the necessary sclerosing property can be imparted by blending the conjugated compound with 201203062^oooipif. For example, when the polymer body contains a hydroxyl group, it is preferred to use various amine compounds as a hardener. The amine-based compound to be used as a parent-linked compound is, for example, a compound containing two or more of a hydroxyalkylamino group and an alkoxyalkylamino group in combination, and specific examples thereof include a melamine-based compound. A urea compound, a benzoguanamine compound, a glycoluril compound, or the like. When the compounds are hardened, it is preferred to use an organic acid or a salt thereof. One. (2) Hydrolyzed condensate of fluorine-containing organic calcined material A group containing a hydrolyzed condensate of a fluorine-containing organodecane compound as a main component has a low refractive index and a high hardness on the surface of the coating film. Preferably, the fluorinated filament is a condensate of a compound containing a water (10) scale at one or both ends and a tetrasyl group. The specific composition is described in Japanese Patent Application Laid-Open No. Hei. No. 2002-265866, and Japanese Patent Application Laid-Open No. Hei No. Hei. Further, a composition having a monomer having two or more ethylenic unfluorenyl groups on the right side and a composition of an inorganic fine particle having an octagonal structure may be used as a preferred embodiment, and a low refractive index layer having a low refractive index may be mentioned. The low-folding particles are organic or beneficial, preferably the particles with pores inside, and the method is as described in Japanese Patent Laid-Open No. 2〇〇27, the upper and middle two particles of the sand-stained material. Remember the dioxin ^^ Refer to the paragraph [(Κ)41]~_9]) ° The refractive index of the particles is better than the hard coating (3) ~ UG. The binder may have two or more ethylenically unsaturated groups as described above in the above = 59 201203062 */\/·/ Λ. In the low refractive index layer, it is preferred to add the above hard coat layer 122. The polymerization initiator (for example, refer to paragraphs [0090] to [0093] of JP-A-2-(9) 6_3〇74〇). In the case of containing a radically polymerizable compound, i parts by weight to 1 part by weight, preferably 1 part by weight to 5 parts by weight, based on 100 parts by weight of the compound, of a polymerization initiator can be used. In the low refractive layer, the inorganic particles β may be used in combination to impart a scratch resistance, and a particle diameter of 15% to 150%, preferably 〜100%, more preferably 45% to 6% by weight of the low refractive index layer may be used. Microparticles. In the low-refractive-index layer, in order to impart characteristics such as antifouling property, water resistance, chemical resistance, and lubricity, a known polysulfide or milk-based antifouling agent, a lubricant, or the like can be appropriately added. [High refractive index layer/medium refractive index layer] With respect to the ruthenium reflection film 126, a layer having a high refractive index can be provided between the low refractive index layer and the hard coat θ 12^ as described above to improve the antireflection property. Preferably, the enamel layer and the reticle layer of the towel are formed of a hardenable composition containing a high refractive index and a binder. It can be used here: the optional microparticles can be used to increase the refractive index of the hard coating layer 122. Preferred for high refractive index inorganic microparticles:: granules: inorganic diacrylic acid particles such as oxidized impurities and Ti 〇 2 particles, crosslinked acrylic particles, polystyrene granule wax; trimeric amine resin particles, benzene Preferably, the trimeric amine dispersion layer and the towel refractive index layer are dispersed in the dispersion medium, and are recorded as a binder precursor which is necessary for the addition of the matrix to form 201203062 JOOOipif (for example, A coating composition for forming a south refraction (four) and a medium refractive index layer, such as an ionizing radiation-curable polyvalent ruthenium-based functional oligomerization scale, a photopolymerization dopant, or the like, which is described later, for example, is coated on a transparent film. The coating composition for forming the refractive index layer and the +refractive index layer is formed by a crosslinking reaction of an ionizing radiation curable compound (for example, a polyfunctional monomer or an S11 oligomer). Further, it is preferred that the adhesion layer of the high refractive index layer and the medium refractive index layer be coated or subjected to a crosslinking reaction or a polymerization reaction with the dispersing agent after application. The adhesion of the high-refractive-index layer and the medium-refractive-index layer thus produced is such that the above-described preferred compounding and ionizing radiation-curable multi- or polyfunctional oligomer are cross-linked or polymerized to form an anion of the dispersant. Sex base into the glue to the ray. Further, the high refractive index layer has a refractive index layer, which has a function of maintaining the inorganic particles. The crosslinked or polymerized structure is bonded to the film. The high refractive index layer containing the inorganic particles and the medium refractive index are improved. Physical strength, chemical resistance, and weather resistance of the layer. The refractive index layer_mixing agent is (4) added to the amount of the m-body component of the high-refractive composition to add 5 wt% to 8 G Wt%. The content of the inorganic particles in the refractive index layer is preferably from H) wt% to 9 G wt%, more preferably 15 Torr, and particularly preferably 15 wt% to 75 Å, relative to the weight of the luminosity layer. Neither can be used in combination with two or more types in the high refractive index layer. Feng 201203062 When the high refractive index layer has a low refractive index, the radiance is preferably higher than that of the transparent ray. When the high refractive index layer is used as the wire interference layer, the thickness of the film is preferably 30 nm 200 nm', more preferably 5 〇 nm to 17 〇 nm, particularly preferably 6 〇 ~ (9) high refractive index layer and medium refraction The lower the haze of the rate layer is preferably 5% or less, more preferably 3% or less, and particularly preferably 1% or less. *,,, ▲The anti-reflective 126 with a low refractive index layer has a good integral reflection of preferably 3.0 〇 / 〇 or less, more preferably 2 〇 % or less, and most preferably ι 5% or less (4) ❶ From the viewpoint of improving sweatiness, it is preferred to reduce the surface free energy of the surface of the low refractive index layer. Specifically, it is preferred to use a compound containing a compound or a polysiloxane structure for the low refractive index layer, or to distinguish it from the low refractive index layer on the low refractive index layer. Antifouling layer. For the additive having a polyoxo-oxygen structure, the following additives are added: 乂 · · Reactive group-containing polyoxygenation {e.g., X-22-3701IE", "X_22-173B", X-22-169AS ", "KF-102" X-22-164B", "X-22-5002" X-22-174D", "X-22_167B", "X_22_161AS" (trade name), the above is Shin-Etsu Chemical Industry Co., Ltd. Manufacturing; "AK5", AK-30, "ΑΚ-32" (trade name), the above is manufactured by East Asia Synthetic Co., Ltd.; "Silaplane FM0725", "Silaplane FMXmi" (trade name), the above is manufactured by Chisso (stock) Alternatively, the oxime compound of the Japanese Patent Publication No. 2003-112383 can be preferably used. These polyoxo oxy-sinter are preferably in the range of 0.1 wt% to 10 wt% of the lower ^ = = 2 points, and the rate layer is secreted. If it is added, it is particularly preferable that it is 1 wt% to 5 [Production Method of Anti-Reflection Film 126] The anti-reflection film 126 can utilize the following coatings a A in these coating methods. The following coating method is formed, but is not limited (preparation of coating). A coating liquid containing a hard coat layer 122 or an anti-ample is prepared. In general, the coating liquid is mainly composed of an organic solvent, and the amount of water kneaded is suppressed to 2% or less, and is sealed to suppress the solvent. The organic solvent used is based on the materials used in each layer. . When the uniformity of the coating liquid is obtained and a stirrer or dispersion is used as appropriate, the adjusted coating liquid is preferably filtered before coating to prevent no failure. The filter to be filtered is preferably a filter which does not have a pore diameter as small as possible in the coating liquid, and the filtration and pressure are also 5 MPa. (4) (4) The coating liquid is preferred. The coating crucible is ultrasonically dispersed, defoamed, and maintained in a state of separation of the dispersion. At the hot spot, 13 〇 can also be applied before the coating to increase the coating deformation or to improve the applicability or improve the adhesion of the coating layer. Specific examples of the surface treatment include a corona discharge treatment, a glow treatment, a flame treatment, an acid treatment, an alkali treatment, or an ultraviolet irradiation. The method is also described in Japanese Patent Laid-Open Publication No. Hei 7-333433. The treatment of setting the undercoat layer is utilized. Further, it is preferable to provide a dust removing step as a pre-coating step, and the dust removing method used in the step can be carried out by the method described in paragraph [0119] of the Japanese Patent Laid-Open Publication No. Hei. Further, in terms of improving dust removal efficiency and suppressing the adhesion of garbage, it is particularly preferable to remove static electricity on the _ 13G before performing such a dust removal step. Such a method of removing electricity can be carried out by using the method described in paragraph [012〇] of JP-A-2010-32795, or by using the method described in paragraphs [〇12丨] and [〇123] of the above-mentioned publication. The planarity of the transparent film 130 and improved adhesion. (Coating Step) Each layer of the anti-reflection film 126 can be formed by the following coating method, but is not limited to these methods. A dip coating method, an air knife coating method, an air curtain coating method, a newspaper coating method, a wire bar coating method, a gravure coating method, or an extrusion coating method (die coating method) may be used (refer to the United States). A known method such as the patent No. 2681294, the International Publication No. 05/123274, and the micro gravure coating method is preferably a micro gravure coating method or a die coating method. The micro gravure coating method is described in paragraphs [〇125] and [0126] of Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. 10-32795. It is described in 0128], and these methods can also be used in the present embodiment. In terms of productivity, it is preferable to apply it at a rate of 2 〇m/min or more using a die coating method. (Drying step) The anti-reflection film 126 is preferably applied to the transparent film 13 直接 directly or after being coated with another 64 201203062 JJUJipif f, and then transferred to a heated web to dry the solvent. , z〇ne) As a method of drying the solvent, various methods can be utilized. Japanese Patent Laid-Open No. 7 Bulletin, Japanese Patent No. 2001-314798, Japanese Patent Special Publication No. 3 12676, Eight Open Japanese Patent Special Open-Dish No. Gazette, Japanese Patent ^' 2004-34002 The technique described in the bulletin and the like. For the temperature conditions of the dry area, the conditions described in paragraph [〇13〇] of Japanese Patent Publication No. 2010-32795 can be used, and the conditions described in paragraph [0131] of the publication can be used for the conditions of the wind. (Curing Step) The anti-reflection film 126 can cure the coating film by passing the region of the web by ionizing radiation and/or heat after the solvent is dried or in the late drying stage. The ionizing radiation is not particularly limited, and may be appropriately selected from ultraviolet rays, electron beams, near ultraviolet rays, visible light, near infrared rays, infrared rays, X rays, and the like depending on the type of the curable composition forming the film, and is preferably ultraviolet rays or electron beams. In particular, it is preferably ultraviolet light in terms of ease of handling and high energy availability. A light source of ultraviolet light for photopolymerizing an ultraviolet curable compound can be used as a light source of the above-mentioned paragraph [0133] of JP-A-2010-32795, and the electron beam can be used in the paragraph of the above-mentioned publication [〇134 The electron beam described in ]. Further, regarding the irradiation conditions, the amount of irradiation light, and the irradiation time, the conditions described in the paragraphs [〇135] and [0138] of the publication can be used. Further, regarding the control method of the film surface temperature, the oxygen concentration, and the oxygen concentration 65 201203062 J303ipif degree of the film before and after the irradiation, the conditions described in paragraph [0136], paragraph [0139] to paragraph [0144] of the publication can be used. method. (Operation for Continuous Manufacturing) In order to continuously manufacture the anti-reflection film 126, the following steps are carried out: continuously feeding a roll-shaped permeable 133G; (4) coating liquid and drying; hardening the coating film; and winding the film The transparent film 13 of the hardened layer. The above steps may be carried out separately for forming each layer, or a plurality of coating portions, and a drying chamber-hardening portion (10) stomach (four) method may be provided to continuously form the respective layers. In order to produce the antireflection film 126, it is preferable to carry out the coating step of the coating portion (4) and the drying in the money chamber in a high-purity environment, while performing the precision of the coating liquid as described above. The material was washed, and the garbage and dust on the transparent film 13G were sufficiently removed before the application of f. The air cleanliness of the coating step is preferably 1 G class (0.5 (four) or more particles are 353 b or less W or more) or more preferably i class (〇 $ (four) or more) according to the standard of the air cleanliness of the U.S. federal drought 2_. The particles are 35.5 pieces/m3 or less) or more. In addition, in order to maintain the sharpness of the image, the anti-reflection film 126 is adjusted to be as smooth as possible, and the transmission is adjusted. The transmission image sharpness of the ruthenium reflection film 126 is preferably 6% or more. The image clarity is an indicator of the fuzzy production of the ® image that has been smuggled by the watch. The larger the value, the clearer the image seen through the film. The better the clarity of the transmitted image is. More preferably, it is 8 ()% or more. 66 201203062 The anti-reflection film 126 can be used as a surface film on the viewing side of the display device 108. The display device 108 can be applied to various display devices such as various liquid crystal display devices, plasma displays, organic electroluminescence (EL), and touch panels. Depending on the nature of the outermost surface of the display device 108 using the anti-reflection film 126, an adhesive may be provided on the surface of the transparent film no of the anti-reflection film 126 on the side not having the coating layer (hereinafter sometimes referred to as the back surface). The layer 'or the above-mentioned back surface of the transparent film 130 is gelated and bonded to the touch panel 100. For the method of gelling the back surface of the transparent film 13A, the technique described in the paragraph [〇149] to [0160] of the Japanese Patent Laid-Open Publication No. 2010-32795 can be used. Further, the present invention can be suitably used in combination with the techniques of the public publications and the international publication manuals described in Tables 1 and 2 below. The expressions "Japanese Patent Special", "No. Bulletin", "No. Manual" and the like are omitted. 67 201203062 JDODlplf [Table 1] 2004-221564 2007-235115 2006- 332459 2007-102200 2006-228478 2006- 348351 2007- 134439 2007- 310091 2005- 302508 2008- 267814 2008-283029 2009-4213 2008-147507 2008-218096 2008 -241987 2004-221565 2007-207987 2009-21153 2006-228473 2006- 228836 2007- 270321 2007-149760 2007- 116137 2008- 218784 2008-270405 2008- 288305 2009- 10001 2008-159770 2008-218264 2008-251274 2007-200922 2006- 012935 2007- 226215 2006- 269795 2007- 009326 2007-270322 2007-208133 2007- 088219 2008- 227350 2008-277675 2008- 288419 2009- 16526 2008-159771 2008-224916 2008-251275 2006-352073 2006-010795 2006- 261315 2006-269795 2006- 336090 2007- 201378 2007-178915 2007- 207883 2008- 227351 2008-277676 2008-300720 2009- 21334 2008-17156B 2008-235224 2008-252046 2007-129205 2006- 228469 2007- 072171 2006-324203 2006 - 336099 2007- 335729 2007-334325 2007- 013130 2008- 244067 2008-282840 2008-300721 2009- 26933 2008-198388 2008-235467 2008-277428 [Table 2] 2006/001461 2006/088059 2006/098333 2006/098336 2006/098338 2006/098335 2006/098334 2007/001008 [Examples] Hereinafter, the present invention will be more specifically described by way of examples of the invention. In addition, the materials, usage amounts, ratios, processing contents, processing order, and the like shown in the following examples can be appropriately changed without departing from the gist of the invention. Therefore, the scope of the invention should not be construed as being limited by the specific examples shown below. With respect to Comparative Example 1 and Comparative Example 2, Conductivity 68 201203062, Surface Resistance and Transmittance of Example 1 to Example 6, and evaluation of streaks and visibility. The details of the example i and the comparative example 2, the examples i to the example 6, and the results of the measurement and the evaluation results are shown in Table 3. <Example 1 to Example 6, Comparative Example 1, Comparative Example 2> (Silver halide photosensitive material) The gelatin i〇〇g was contained in relation to 150 g of Ag in an aqueous medium, and the average value of the ball containing the ball was (u) An emulsion of a chlorinated record (ι = 〇 2 mol X), Br = 40 mol%). Further, KsRMr9 and KyrCl6' were added to the emulsion in a concentration of 1 〇·7 (m〇1/m〇1 silver) to dope ions and cerium ions. After adding the curcuma 4 to the emulsion, and then sensitizing the gold sulfur with vaporized gold acid and sodium thiosulfate, it is applied to the gelatin hardener together with a silver coating of 10 g/m 2 . The first transparent substrate 12Α and the second transparent substrate 12B (here, both of polyethylene terephthalate (pET)). At this time, the Ag/gelatin volume ratio was set to 2/1. A 20 mm wide PET support was coated with a width of 25 cm for 20 m, and a center of 24 cm was applied to cut 3 cm at both ends to obtain a roll-shaped toothed silver photosensitive material. (Exposure) Regarding the exposure pattern, the first conductive sheet 10A has the pattern shown in Figs. 1 and 4. The second conductive sheet 10B has the pattern shown in Figs. 4 and 6, and has a size of A4 (210 mm &gt; The first transparent substrate 12A and the second transparent substrate 12B of &lt;297 mm) are exposed. Exposure is a mask that intervenes in the above pattern. Exposure is performed using parallel light using a high pressure mercury lamp as a light source. 69 201203062 (Development treatment) • Developer 1L formulation hydroquinone 20 g sodium sulfite 50 g carbonic acid oblique 40 g ethylenediaminetetraacetic acid 2 g potassium bromide 3 g polyethylene glycol 2000 1 g potassium hydroxide 4 g pH adjustment 10.3 • Fixation solution 1 L Formulation ammonium thiosulfate solution (75%) 300 ml Sulfite sulphate 25 g 1,3-diaminopropane-tetraacetic acid 8 g Acetic acid 5 g Ammonia (27%) 1 g pH Adjusted to 6.2 using the above-mentioned treatment agent, using the automatic developing machine FG-710PTS manufactured by Fujifilm Co., Ltd. under the conditions of developing 35 ° C for 30 seconds, fixing 34 ° C for 23 seconds, and washing the running water (5 L / m iη ) for 20 seconds. The exposed photosensitive material is processed. (Example 1) The line widths of the conductive portions (the first conductive pattern 22 and the second conductive pattern 22) of the first conductive sheet 10A and the second conductive sheet 10A are 1 #201203062 JDODipif m and one side of the small lattice 18 The length of one side of the large lattice (the first large lattice 14A and the second large lattice 14B) of 50 // m is 3 mm. (Example 2) The first conductive sheet and the second conductive sheet of Example 2 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 5 /zm and the length of one side of the small lattice 18 was 50 //m. (Example 3) Example 3 was produced in the same manner as in Example 1 except that the line width of the conductive portion was 9 // m, the length of one side of the small lattice 18 was 150 // m, and the length of one side of the large lattice was 5 mm. The first conductive sheet and the second conductive sheet. (Example 4) The first example 4 was produced in the same manner as in Example 1 except that the line width of the conductive portion was 10 μm, the length of one side of the small lattice 18 was 300 // m, and the length of one side of the large lattice was 6 mm. a conductive sheet and a second conductive sheet. (Example 5) The first conductivity of Example 5 was produced in the same manner as in Example 1 except that the line width of the conductive portion was 15 μm, the length of one side of the small lattice 18 was 400 // m, and the length of one side of the large lattice was 10 mm. Sheet and second conductive sheet. (Example 6) The first conductivity of Example 6 was produced in the same manner as in Example 1 except that the line width of the conductive portion was 20 gm, the length of one side of the small lattice 18 was 500 #m, and the length of one side of the large lattice was 10 mm. Sheet and second conductive sheet. (Comparative Example 1) A sample was produced in the same manner as in Example 1 except that the line width of the conductive portion was 0.5 #m, and the length of the 71 201203062 3D03ipif of the small lattice 18 was 40 // m, and the length of one side of the large lattice was 3 mm. The first conductive sheet and the second conductive sheet of Comparative Example 1. (Comparative Example 2) A comparison was made in the same manner as in Comparative Example 1, except that the line width of the conductive portion was 25 // m, the length of one side of the small lattice 18 was 500 #m, and the length of one side of the large lattice was 1〇111111. The first conductive sheet and the second conductive sheet of Example 3. (Measurement of surface resistance) In order to confirm the accuracy of the test, the L0resta GP (model Μ〇>·Τ61〇) tandem four-probe detector (ASP) manufactured by Dia instnjments was used for the first conductive sheet 1QA and the first 2 The surface resistivity of the conductive sheet 1 (10) is arbitrarily 1 G, and the average value of the measured values is obtained. (Measurement of Transmittance) In order to confirm the rudder riding, the time luminometer was used to measure the transmittance of the first conductive sheet 1A and the second conductive sheet 10B. (Evaluation of the stripe) Conductively compare Example 1 and Comparative Example 2, and Example 1 to Example 6. After 1st, laminate the first conductive sheet to form a laminated conductive sheet, and touch the surface = attach a layer of conductive (4) n Touch panel 9 on the flank of the touch panel, driving the liquid crystal to observe the display surface of the 竣 15 15 15 m. When the stripe is not visible, it is evaluated as 〇, and the stripe is very small 72 201203062 JSWipif is visible and the problem is not evaluated as △, When the stripe is evaluated, it is evaluated as X 0 (evaluation of visibility). Before the evaluation of the stripe, the touch panel is placed on the turntable, and when the liquid crystal display device is driven to display white, it is visually confirmed whether there is a thick line or a black color. It is also confirmed whether or not the boundary between the first large lattice 14A and the second large lattice 14B of the touch panel is conspicuous. [Table 3] Line width of conductive portion (Aim) Length of one side of small grid (Aim) Length of one side of large grid 3 Surface resistance (Ω/sq.) Transmittance of lk or more (%) 90 'Streak evaluation ΤΓ Visuality Evaluation Comparative Example 1 0.5 &quot;&quot;40 &quot; Example 1 1 50 3 80 90 Example 1 5 50 3 15 75 Example 3 9 150 5 25 86 Example 4 10 300 &quot;6 50 87 〇 Example 5 15 400 10 45 86 〇 Example 6 20 500 10 40 86 Λ Comparative Example 2 25 500 10 33 83 XX ——&quot; — According to Table 3, in Comparative Example 1, although the evaluation of streaks and visibility was good' However, the surface resistance of Comparative Example 1 was 1 kQ/sq· or more, and the conductivity was low. In Comparative Example 2, although the electrical conductivity and the transmittance were good, the streaks were conspicuous, and the conductive portion itself was easily recognized by the naked eye, and the visibility was deteriorated. On the other hand, in Examples 1 to 6, the conductivity, the transmittance, the streaks, and the visibility in Examples 1 to 5 were good. In Example 6, although the evaluation of the streaks and the evaluation of the visibility were inferior to those of Examples 1 to 5, the streaks were extremely small in visibility and level of no problem, and there was no display image of the 2012 20126262 3iWlplf display device. Case. Further, the conductive sheet, the method of using the conductive sheet, and the capacitive touch panel of the present invention are not limited to the above-described embodiments, and of course, various configurations can be employed without departing from the gist of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view showing an example of a pattern of a first conductive pattern formed on a first conductive sheet. Fig. 2 is a cross-sectional view showing a part of the first conductive sheet omitted. 3 is an exploded perspective view showing the configuration of a touch panel. Fig. 4 is an exploded perspective view showing a part of the first laminated conductive sheet omitted. Fig. 5A is a cross-sectional view showing an example in which a part of the first laminated conductive sheet is omitted. Fig. 5B is a cross-sectional view showing a part of the first laminated electrically conductive sheet, partially omitted. Fig. 6 is a plan view showing an example of a pattern of a second conductive pattern formed on the second conductive sheet. Fig. 7 is a plan view showing an example in which a first conductive sheet and a second conductive sheet are combined to form a first laminated conductive sheet, and a part thereof is omitted. 8A is a schematic view showing a first configuration example in which an antireflection film is provided. Fig. 8B is a schematic view showing a second configuration example. Fig. 8C is a schematic view showing a third configuration example. Fig. 9 is an exploded perspective view showing a part of the second laminated electrically conductive sheet omitted. 201203062 3^05 ipif FIG. 10 is a plan view showing a pattern example of the first conductive pattern formed on the i-th conductive sheet of the second build-up conductive sheet. Fig. π is a plan view showing an example of a pattern of a second conductive pattern formed on the second conductive sheet of the second laminated conductive sheet. FIG. 12 is a plan view showing an example in which a part of the first conductive sheet and the second conductive sheet are combined to form a second conductive sheet for a touch panel. Fig. 13 is a plan view showing a pattern example of a first conductive pattern formed on a first conductive sheet of a laminated electrically conductive sheet according to a modification. Fig. 14 is a plan view showing a pattern example of a second conductive pattern formed on the second conductive sheet of the laminated electrically conductive sheet of the modification. Fig. 15 is a flow chart showing a method of producing the transparent conductive film of the embodiment. Fig. 16A is a cross-sectional view showing a part of the produced photosensitive material omitted. Fig. 16B is an explanatory view showing simultaneous exposure of both surfaces of a photosensitive material. In the state in which the light irradiated to the first photosensitive layer does not reach the second photosensitive layer and the light irradiated to the second photosensitive layer does not reach the first photosensitive layer, the first exposure process and the second exposure process are performed. Illustrating. [Description of main component symbols] IOA, 10Aa: first conductive sheet 10B, lOBa: second conductive sheet 12A: first transparent substrate 12B: second transparent substrate 13A: first conductive portion 75 201203062 ipif 13B: second conductive portion 14A The first large lattice 14B: the second large lattice 16A: the first connecting portion 16B: the second connecting portion 18: the small lattice 20: the intermediate lattice 20a to 20h: the first intermediate lattice to the eighth intermediate lattice 22A: the first conductive pattern 22B: second conductive pattern 24A: first insulating portion 24B: second insulating portions 26a, 26b: apex portions 28a to 28h: first side to eighth side portion 30: straight portion 32: comb tooth 40a: first knot Portion 40b: second terminal line portion 41a: first terminal wiring pattern 41b: second terminal wiring pattern 42a: concave portion 42b: convex portion 50A: first laminated conductive sheet 50B, 50Ba: second laminated conductive sheet 76 201203062 ipif 100 touch Panel 106 Protective layer 108 Display device 110 Display panel 110a: Display pupil 112: Sensor portion 114: Terminal wiring portion 116a: First terminal 116b: Second terminal 118a: First alignment mark 118b · Second alignment Marking 120: transparent adhesive 120A: first transparent adhesive 120B: second transparent adhesive 122: hard coating 124: anti-reflection 126: anti-reflection film 128: protective resin layer 130: transparent film 140: photosensitive material 142a: first photosensitive layer 142b: second photosensitive layer 144a: first light 144b: second light 77 201203062 JJVJ lpif 146a: first photomask 146b: second photomask 148a: first light source 148b: second light source 150a: first collimating lens 150b: second collimating lens 152a: first exposure pattern 152b: second exposure pattern Lf: projection distances Pm, Ps:排歹|J spacing S1~S3: steps Wcl, Wc2: width 78

Claims (1)

201203062 35651pif 七、申請專利範圍： L 一種導電片，其特徵在於包括： 基體（12A)、及 形成於上述基體（12A)上的導電部（13A)， 上述導電部U3A)具有由金屬細線形成的2個以上 的導電性的大格子（14A)、及將相鄰接的上述大格子（Μ) 間加以電性連接的由金屬細線形成的連接部（16A)， 各上述大格子（14A)分別是由2個以上的小格子 組合而構成， 藉由上述大格子（14a)的組合而構成電路， 時，上述連接 於將上述小格子（18)的間距設為Ps 部（16A)的寬度Wc滿足 Wc&gt;Ps/VJ。 2. 如申請專利範圍第1項所述之導電片，其中 2個以上的上述大格子（14A)經由上述連接吾p ( i6a) 排列於第1方向上，從而構成i個導電圖案（22a)， 2個以上的上述導電圖案（22A)排列於與上述第1 方向正交的第2方向上， 於相鄰接的上述導電圖案（22A)之間’配置有不存 在上述小格子（18)的電性絕緣的絕緣部（24A)， 藉由上述導電圖案（22A)、上述絕緣部（24A)的排 列而構成上述電路。 3. 如申請專利範圍第1項所述之導電片，其中 上述大格子（14A)的一邊的長度為3mm〜1〇mm。 79 201203062 ipif 4. 如申請專利範圍第1項所述之導電片，其中 上述小格子（18)的一邊的長度為30 /zm〜500从诅。 5. 如申請專利範圍第1項所述之導電片，其中 上述小格子（18)的彼此相向的邊的間隔為3〇以爪 〜500 6. 如申請專利範圍第1項所述之導電片，其中 上述金屬細線的線寬為10 以下。 7. —種導電片’其特徵在於包括： 基體（12A)、 形成於上述基體（12A)的一個主面上的第丨導電部 (13A)、及 11 形成於上述基體（12A)的另一主面上的第2導 (13B)， 上述第1導電部（13A)具有由金屬細線形成的2個 以上的導電性的第丨大格子（14A)、及將相鄰接的上述第 1大格子（14A)間加以電性連接的由金屬細線形成的第i 連接部（16A)， 、上述第2導電部⑴B)具有由金屬細線形成的2個 以上的導電性的第2大格子（14B)、及將相鄰接的上述第 2大格子（14B)間加以電性連接的由金屬細線形成的 連接部（16B)， 各上述第1大格子（14A)以及各上述第2格子（14B) 分別是由2個以上的小格子（18)組合而構成， 上述第1大格子（14A)經由上述第丨連接部（l6A) 201203062 35651pif 排列=第1方向上’從而構成1個第1導電圖案（22A)， 猎由上述第1大格子（14A)與上 的組合_成電路， 於將上述小格子（18)㈣距設為Ps時，上 連接部（16A)的寬度Wcl以及上述第2連 的寬度Wc2滿足 Wcl &gt; Ps/VI Wc2&gt;Ps/V2 8.如申請專利範圍第7項所述之導電片，其中 伽1大格子（14A)經由上述第1連接部（16A) =列於第1方向上’從而構成由金屬細線形成 導電圖案（22A)， 2個以上的上述第2大格子（14B)經由上述第2連 ，部（16B)排列於與上述第1方向正交的第2方向上， 從而構成由金屬細線形成的1個第2導電圖案（22B)， 於相鄰接的上述第1導電圖案（22A)之間，配置有 不存在上述小格子（18)的電性絕緣的第i絕緣部（24A)， 於相鄰接的上述第2導電圖案（22B)之間，配置有 不存在上述小格子（i 8 )的電性絕緣的第2絕緣部（2 4 B )， 藉由上述第1導電圖案U2A)、上述第2導電圖案 (22B)、上述第1絕緣部（24A)、上述第2絕緣部（24B) 的排列而構成上述電路。 9·如申請專利範圍第7項所述之導電片，其中 上述金屬細線的線寬為10 以下。 201203062 10. 如申請專利範圍第7項所述之導電片，其中 上述第1大格子（14A)的邊部的直線部與上述第2 大格子（14B)的邊部的直線部間之投影距離（Lf)是根 據上述小格子（18)的尺寸而設定。 11. 如申請專利範圍第1〇項所述之導電片，其中 上述投影距離（Lf)為1〇〇 //m〜400 &quot;m。 12. 如申請專利範圍第7項所述之導電片，其中 上述第1導電部（13A)具有：連接於各上述第i導 電圖案（22A)的端部的第1端子配線圖案（41a)，及形 成於上述基體（12A)的一個主面的1條邊的長度方向中 央部分、且與對應的上述第丨端子配線圖案（41a)連接的 多個第1端子（116a); 上述第2導電部（13B)具有：連接於各上述第2導 電圖案（22B)的端部的第2端子配線圖案（41b)，及形 成於上述基體（12A)的另一主面的1條邊的長度方向中 央部分、且與對應的上述第2端子配線圖案（41b)連接的 多個第2端子（116b)。 13. 如申請專利範圍第12項所述之導電片，其中 自上表面觀看時，排列有多個上述第丨端子（116 的部分與制衫個上述第2端子⑽b)的部分相鄰接。 14. 如申請專利範圍第12項所述之導電片，其中 各上述第1導電圖案（22A)的端部與 上 ^端子配線圖案（41a)分別經由第！結線部（應= 82 201203062 的蠕部與對應的上述第 客2結線部（4〇b)而連 沿著上述第2方向而直 各上述第2導電圖案（22B)的 2端子配^_(4lb)分別經由第2 接， 多個上述第1結線部（40a) ^ 線狀地排列，201203062 35651pif VII. Patent Application Range: L A conductive sheet, comprising: a base body (12A) and a conductive portion (13A) formed on the base body (12A), wherein the conductive portion U3A) has a thin metal wire. Two or more conductive large lattices (14A) and a connection portion (16A) formed of metal thin wires electrically connecting the adjacent large lattices (Μ), and each of the large lattices (14A) It is composed of a combination of two or more small lattices, and when the circuit is formed by a combination of the large lattices (14a), the width is Wc which is connected to the pitch of the small lattices (18) as the Ps portion (16A). Meet Wc&gt;Ps/VJ. 2. The conductive sheet according to claim 1, wherein the two or more large lattices (14A) are arranged in the first direction via the connection p (i6a) to form i conductive patterns (22a) Two or more conductive patterns (22A) are arranged in a second direction orthogonal to the first direction, and a small lattice (18) is not disposed between the adjacent conductive patterns (22A) The electrically insulating insulating portion (24A) is configured by arranging the conductive pattern (22A) and the insulating portion (24A). 3. The conductive sheet according to item 1, wherein the length of one side of the large lattice (14A) is 3 mm to 1 mm. 79 201203062 ipif 4. The conductive sheet according to claim 1, wherein the length of one side of the small lattice (18) is from 30/zm to 500. 5. The conductive sheet according to claim 1, wherein the spacing of the opposite sides of the small lattice (18) is 3 〇 to the claws to 500. 6. The conductive sheet according to claim 1 Wherein the above metal thin wires have a line width of 10 or less. 7. A conductive sheet' characterized by comprising: a base (12A), a second conductive portion (13A) formed on one main surface of the base (12A), and 11 another formed on the base (12A) In the second guide (13B) on the main surface, the first conductive portion (13A) has two or more conductive second large lattices (14A) formed of thin metal wires, and the first large adjacent ones The i-th connection portion (16A) formed of a thin metal wire electrically connected between the lattices (14A) and the second conductive portion (1) B) have two or more second conductive large lattices (14B) formed of thin metal wires. And a connecting portion (16B) formed of a thin metal wire electrically connecting the adjacent second large lattices (14B), each of the first large lattices (14A) and each of the second lattices (14B) Each of the first large lattices (14A) is configured by a combination of two or more small lattices (18A), and the first large lattices (14A) are arranged in the first direction (the first direction) to form one first conductive layer via the second connecting portion (16A) 201203062 35651pif Pattern (22A), hunting by the combination of the above 1st large grid (14A) and the upper _ into a circuit, When the small lattice (18) (four) distance is Ps, the width Wcl of the upper connecting portion (16A) and the width Wc2 of the second connecting portion satisfy Wcl &gt; Ps / VI Wc2 &gt; Ps / V2 8. The conductive sheet according to item 7, wherein the gamma 1 large lattice (14A) is formed by the first connecting portion (16A) = listed in the first direction to form a conductive pattern (22A) formed of thin metal wires, and two or more of the above-mentioned conductive sheets (22A) The second large lattice (14B) is arranged in the second direction orthogonal to the first direction via the second joint portion (16B), thereby constituting one second conductive pattern (22B) formed of thin metal wires. An electrically insulating ith insulating portion (24A) in which the small lattice (18) is not present is disposed between the adjacent first conductive patterns (22A), and adjacent to the second conductive pattern (22B) Between the second insulating portion (2 4 B ) having no electrical insulation of the small lattice (i 8 ), the first conductive pattern U2A), the second conductive pattern (22B), and the The first insulating portion (24A) and the second insulating portion (24B) are arranged to form the above-described circuit. 9. The conductive sheet according to item 7, wherein the metal thin wire has a line width of 10 or less. The conductive sheet according to claim 7, wherein a projection distance between a straight portion of a side portion of the first large lattice (14A) and a straight portion of a side portion of the second large lattice (14B) (Lf) is set according to the size of the above-described small lattice (18). 11. The conductive sheet according to Item 1 of the patent application, wherein the projection distance (Lf) is 1 〇〇 //m~400 &quot;m. 12. The conductive sheet according to claim 7, wherein the first conductive portion (13A) has a first terminal wiring pattern (41a) connected to an end of each of the ith conductive patterns (22A), And a plurality of first terminals (116a) formed in a central portion in the longitudinal direction of one side of one main surface of the base body (12A) and connected to the corresponding second terminal wiring pattern (41a); the second conductive portion (13B) has a second terminal wiring pattern (41b) connected to an end portion of each of the second conductive patterns (22B), and a central portion in the longitudinal direction of one side of the other main surface of the base body (12A) And a plurality of second terminals (116b) connected to the corresponding second terminal wiring pattern (41b). 13. The conductive sheet according to claim 12, wherein a portion of the plurality of the second terminals (116 is arranged adjacent to a portion of the second terminal (10) b of the shirt) when viewed from the upper surface. 14. The conductive sheet according to claim 12, wherein the end of each of the first conductive patterns (22A) and the upper terminal wiring pattern (41a) are respectively passed through! a two-terminal arrangement of the second conductive pattern (22B) along the second direction along the second portion and the second terminal of the second customer (2B) 4lb) is respectively arranged in a line, and a plurality of the first knotting portions (40a) are linearly arranged. 上述基體（12Α)夾在中間而相向， I5·如申請專利範圍第S項所述之導電片，其中 上述第1絕緣部（24Α)與上述第2絕緣部（24β) 自上表面觀看時’上述第1絕緣部（24Α)與上述第 2絕緣部（24Β)的相向部分的形狀為多邊形狀。 16. 如申請專利範圍第15項所述之導電片，其中 上述多邊形狀為正方形狀。 17. 如申請專利範圍第15項所述之導電片，其中 上述多邊形狀為楔形狀。 18. 如申請專利範圍第1項所述之導電片，其中 上述小格子（18)為多邊形狀。 19·如申請專利範圍第18項所述之導電片，其中 上述小格子（18)為正方形狀。 20· —種導電片的使用方法，其是使用第1導電片 (1〇Α)與第2導電片（10Β)的導電片的使用方法， 上述第1導電片（10Α)上形成有由金屬細線形成的 2個以上的導電性的第1大格子（14Α)、及將相鄰接的上 83 201203062 述第1大格子（14A)間加以電性連接的由金屬細線 的第1連接部（16A)，各上述第！大格子（14A)分 由2個以上的小格子（18)組合而構成，於將上述小格子 〇8)的間距設為巧時，上述第】連接部（16a Wcl 滿足 Wcl&gt;ps/Vi， 見又 上述第2導電片（10B)上形成有由金屬細線形成的 2^以上的導電性的第2大格子（14B )、及將相鄰接的上 ^ , f子（14B)間加以電性連接的由金屬細線形成 的第2連接部（16B)’各上述第2大格子（i4B)分 由2個以上的小格子（18)組合而構成，於將上述小格^ (18)的間距設為匕時，上述第2連接部（i6B) Wc2滿足We2&gt;Ps/VJ，該導電片的使財法的特徵在於二 上述第1導電片（10A)中，2個以上的上述第i大 格子mA)經由上述第！連接部（16A)排列於第i方向 上，從而構成1個第1導電圖案（22A)， 上述第2導電片（10B)中，2個以上的上 格子（MB)經由上述第2連接部⑽） 藉由將上述第i導電片（10A)與上述第2導 上導T導電&quot;(1〇A)的上述第1連接部(魔) = 】 = 1〇B)的上述第2連接部⑽)組合 以幵y成上述小格子（18)的排列的方式配置。 儿-種靜電電容式觸控面板，其特徵在於包含如申 84 201203062 請專利範圍第1項所述之導電片。 85The above-mentioned first insulating portion (24Α) and the second insulating portion (24β) are viewed from the upper surface when the first insulating portion (24Α) and the second insulating portion (24β) are viewed from the upper surface. The shape of the opposing portion between the first insulating portion (24Α) and the second insulating portion (24Β) is polygonal. 16. The conductive sheet of claim 15, wherein the polygonal shape is a square shape. 17. The conductive sheet of claim 15, wherein the polygonal shape is a wedge shape. 18. The conductive sheet of claim 1, wherein the small lattice (18) is polygonal. 19. The conductive sheet of claim 18, wherein the small lattice (18) is square. 20. A method of using a conductive sheet, which is a method of using a conductive sheet using a first conductive sheet (1 〇Α) and a second conductive sheet (10 Β), wherein the first conductive sheet (10 Α) is formed of a metal a first large lattice (14 turns) of two or more conductive layers formed by thin wires, and a first connecting portion of metal thin wires electrically connected between adjacent adjacent upper ones 83 201203062 (first large lattices (14A)) 16A), each of the above! The large lattice (14A) is composed of a combination of two or more small lattices (18). When the pitch of the small lattices 8) is made fine, the first connection portion (16a Wcl satisfies Wcl>ps/Vi, Further, the second conductive sheet (10B) is formed with a second large lattice (14B) having a conductivity of 2 or more formed of thin metal wires, and electrically connected between the adjacent upper and lower portions (14B). The second connection portion (16B) of each of the second connection portions (16B) formed of thin metal wires is formed by combining two or more small lattices (18), and the small lattices (18) are formed. When the pitch is 匕, the second connecting portion (i6B) Wc2 satisfies We2 &gt; Ps/VJ, and the conductive sheet is characterized in that two or more of the first ii are in the first conductive sheet (10A). Large lattice mA) via the above! The connection portion (16A) is arranged in the i-th direction to constitute one first conductive pattern (22A), and in the second conductive sheet (10B), two or more upper lattices (MB) are passed through the second connection portion (10) The second connecting portion of the first connecting portion (magic) = 〇 = 〇 B) of the first ii conductive sheet (10A) and the second conductive upper conductive portion T ("1A") (10)) The combination is arranged such that 幵y is arranged in the above-described small lattice (18). The electro-capacitive touch panel of the invention is characterized in that it comprises a conductive sheet as described in claim 1 of claim 84 201203062. 85
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TWI625652B (en) * 2013-04-18 2018-06-01 Sharp Kk Sensor sheet, sensor sheet module, touch sensor panel module, and electronic device with position input device
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CN111338515A (en) * 2013-10-22 2020-06-26 富士胶片株式会社 Electrode for touch panel, and display device
CN111338515B (en) * 2013-10-22 2023-09-15 富士胶片株式会社 Electrode for touch panel, and display device
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CN111176497B (en) * 2013-10-22 2023-11-21 富士胶片株式会社 Electrode for touch panel, and display device

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WO2011093421A1 (en) 2011-08-04

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