TW201530392A - Conductive film - Google Patents

Abstract

The invention provides a conductive film, which can enhance the detection precision of touch location and thus can be well applied to a touch panel that is capable of corresponding to the motion command thereon. The first electrode pattern (36A) and the second electrode pattern (36B) composing multiple units (38) that are made of thin metal wires individually. The first electrode pattern (36A) comprises the main pattern (54), which is extended in one direction; the extended pattern (56A), which extended from one side of the main pattern (54A) further extending to the first electrode pattern (36A) adjacently; the other side of extended pattern (56B), which extended from the other side of the main pattern (54) further extending to the first electrode pattern (36A) adjacently in other direction. Among the first electrode pattern, both sides of the extended patterns (56A, 56B) are arranged into a nested form.

Description

Conductive film

The present invention relates to a conductive film, and more particularly to a conductive film suitable for use in an electrode for a touch panel.

Recently, as a conductive film provided in a display device, a conductive film used in a touch panel has been attracting attention. The touch panel is mainly applied to small-sized devices such as PDAs (personal digital assistants) and cellular phones, but it is considered that the large size of applications such as displays for personal computers is also developing.

In such a future trend, ITO (Indium Tin Oxide) is used for the conventional electrode (for example, refer to Patent Documents 1 and 2), and the electric resistance is large. Therefore, as the application size of the conductive film becomes larger, between the electrodes The conduction speed of the current becomes slower. As a result, in the conductive film having a large application size, there is a problem that the response speed (the time from the touch of the fingertip to the position where the position is detected) becomes slow.

Therefore, it is considered that the electrodes are formed by arranging a plurality of lattices made of thin metal wires (metal thin wires), thereby lowering the surface resistance. As a method of forming a metal thin wire, patent document 3 is mentioned, for example. Further, a conductive film for a touch panel having a conductive pattern (refer to Patent Document 4) having a plurality of large lattices formed by combining a plurality of small lattices and electrically connected between the large lattices has been proposed. The middle lattice is composed. Patent Document 4 also discloses an example in which a first conductive film and a second conductive film are laminated, wherein the first conductive film has a conductive pattern (first conductive pattern) arranged in one direction, and the second conductive film A conductive pattern (second conductive pattern) arranged in the other direction (a direction perpendicular to one direction).

Patent literature

Patent Document 1: Japanese Laid-Open Patent Publication No. 2009-259003

Patent Document 2: Japanese Special Publication No. 2009-540375

Patent Document 3: Japanese Patent Laid-Open Publication No. 2004-221564

Patent Document 4: Japanese Laid-Open Patent Publication No. 2012-163933

In the case of being applied to a capacitive touch panel, the first conductive film and the second conductive film are laminated as shown in Patent Document 4. In this case, the first conductive pattern and the second conductive pattern face each other at a plurality of locations via an insulating layer. An electrostatic capacitance is generated at a portion opposite to each electrode, and the electrostatic capacitance changes when the finger approaches or contacts the touch panel. According to the amount of change in the electrostatic capacitance, a position at which the finger approaches or comes into contact with the touch panel (hereinafter referred to as a touch position) can be detected.

However, when the detection accuracy of the touch position is low, the control circuit may, for example, be erroneously recognized as pressing a touch position different from the true touch position. This is the reason why the operation is different from the desired operation command. In order to avoid such erroneous detection, an operation such as an operation command is performed, and it is required to improve the detection accuracy of the touch position.

The present invention has been made to solve the above problems, and an object of the invention is to provide a conductive film which can improve the detection accuracy of a touch position. Therefore, the present invention is suitably applied to a touch panel capable of performing an operation corresponding to an operation command.

[1] The conductive film of the present invention has an insulator, two or more first electrode patterns, and two or more second electrode patterns, and the first electrode pattern and the second electrode pattern face each other via an insulator, and are characterized by Each of the electrode pattern and the second electrode pattern is formed by combining a plurality of cells formed of thin metal wires. The first electrode pattern has a body pattern extending in one direction, and one extended pattern from one side of the body pattern toward The adjacent one of the first electrode patterns is expanded; and the other of the expanded patterns is extended from the other side of the main body pattern toward the adjacent first first electrode pattern, and one adjacent one of the expanded patterns is inserted The other extension pattern of the one electrode pattern has one extension pattern of the adjacent other first electrode pattern interposed between the other extension patterns, and the expansion patterns are arranged in a nest shape.

[2] In the present invention, the second electrode pattern may have a stripe pattern and be disposed to face the expanded pattern of the first electrode pattern.

[3] In the present invention, the one extended pattern may include: a first expanded portion that extends toward the adjacent one of the first electrode patterns; and one or more first extended portions that are along the first expanded portion The main pattern extends, and the other expanded pattern has a second expanded portion that extends toward the adjacent first first electrode pattern, and one or more second extended portions that extend from the second expanded portion along the main pattern .

[4] In this case, the first extension portion and the second extension portion may be arranged in a nested shape with the extension portion extending from the extension portion of the adjacent first electrode pattern.

[5] The maximum width of each of the first extension portion and the second extension portion may be larger than the extension portion of the extension portion extending from the adjacent electrode pattern in which the first extension portion and the first extension portion are nested. Interval between.

[6] In [3], when k is a real number, the maximum width of each of the first expanded portion, the second expanded portion, the first extended portion, and the second extended portion may be designed as an average of the cells. Diameter × 1/2 × k.

[7] In this case, when k is a real number, the interval between the first extending portion and the second extending portion may be an average diameter of the unit × 1/2 × k.

[8] The maximum width of each of the first expanded portion, the second expanded portion, the first extended portion, and the second extended portion may be smaller than the width of the main body pattern.

[9] In the present invention, one to five second electrode patterns may be opposed to the expanded pattern.

According to the conductive film of the present invention, it is possible to obtain a conductive film which can improve the detection accuracy of the touch position, and therefore is suitably applied to a touch panel which can perform an operation corresponding to an operation command.

Hereinafter, an embodiment in which the conductive film of the present invention is applied to, for example, a touch panel will be described with reference to FIGS. 1 to 11 . The invention is not limited to the following embodiments. In addition, in the present specification, "~" indicating a numerical range is used as a meaning in which the numerical values described before and after the lower limit and the upper limit are included.

As shown in FIG. 1, the touch panel 10 to which the conductive film of the present embodiment is applied has a sensor body 12 and a control circuit 14 (constructed by an IC circuit or the like, see FIG. 2). The sensor body 12 includes a laminated conductive film 18 which is formed by laminating a first conductive film 16A and a second conductive film 16B, and a cladding layer 20 laminated on the laminated conductive film 18, for example, Made of glass. The laminated conductive film 18 and the cladding layer 20 are disposed, for example, on the display panel 24 of the display device 22 such as a liquid crystal display. When viewed from above, the first conductive film 16A and the second conductive film 16B have the first sensor region 26A and the second sensor region 26B corresponding to the display screen 24a of the display panel 24; and the display panel a first terminal wiring region 28A and a second terminal wiring region 28B (so-called edge) corresponding to the outer peripheral portion of 24; a first conductive portion 30A formed so as to be from the first sensor region 26A to the first terminal wiring region 28A; The second conductive portion 30B is formed to extend from the second sensor region 26B to the second terminal wiring region 28B.

As shown in FIG. 2, the first conductive film 16A includes a first transparent substrate 32A, the first conductive portion 30A formed on the surface of the first transparent substrate 32A, and a first conductive portion 30A. The first transparent adhesive layer 34A. The first transparent substrate 32A may be formed of an insulator (dielectric) such as a plate or a layer.

As shown in FIGS. 1 and 3A, in the first sensor region 26A, a plurality of first electrode patterns 36A are formed, which are formed of a transparent conductive layer made of thin metal wires. The first electrode pattern 36A has a mesh pattern 40 (see FIG. 3A) configured by combining a plurality of cells 38 (see FIG. 3A), and the first electrode pattern 36A extends in the first direction (y direction) and is along the first The directions are arranged in the second direction (x direction) perpendicular to the direction. Here, the "unit" means a shape that is two-dimensionally divided by a plurality of thin metal wires.

As shown in FIG. 1, in the first conductive film 16A configured as described above, each end portion of the first electrode pattern 36A passes through the first connection portion 42a and the first terminal wiring portion 44a formed of a thin metal wire. Electrical connection. The first terminal wiring portion 44a that is discharged from each of the first connection portions 42a is led to the substantially central portion of one long side of the first conductive film 16A, and is electrically connected to the corresponding first terminal portion 46a. Further, in the first terminal wiring region 28A, an electrode film 48 is formed, and the electrode film 48 is electrically connected to the first ground terminal portion 50a.

Similarly, as shown in FIG. 2, the second conductive film 16B includes a second transparent substrate 32B, the second conductive portion 30B formed on the surface of the second transparent substrate 32B, and the second conductive portion 30B. The second transparent adhesive layer 34B formed in this manner. The second transparent substrate 32B may be formed of an insulator (dielectric) such as a plate or a layer.

In the second sensor region 26B, as shown in FIGS. 1 and 3A, a plurality of second electrode patterns 36B are formed, which are formed of a transparent conductive layer made of thin metal wires. The second electrode pattern 36B has a mesh pattern 40 (see FIG. 3A) configured by combining a plurality of cells 38 (see FIG. 3A), and the second electrode pattern 36B extends in the second direction (x direction) and is along the first direction. (y direction) arranged.

As shown in FIG. 1, in the second conductive film 16B configured as described above, one end portion of each of the second electrode patterns 36B passes through the second connection portion 42b and the second terminal wiring portion 44b made of metal wiring. Electrical connection. The second terminal wiring portion 44b that is discharged from each of the second connecting portions 42b is led to the substantially central portion of one long side of the second conductive film 16B, and is electrically connected to the corresponding second terminal portion 46b. Further, on the outer side of the second terminal wiring portion 44b, a mask effect is formed so as to surround the second sensor region 26B from one second ground terminal portion 50b toward the other second ground terminal portion 50b. Destination ground line 52.

Further, as shown in FIGS. 3A and 3B, the first electrode pattern 36A has a main body pattern 54 extending in the first direction (y direction) and one extended pattern 56A from the side of the main body pattern 54 toward the adjacent side. One of the first electrode patterns 36A is expanded, and the other of the expanded patterns 56B is expanded from the other side of the main body pattern 54 toward the adjacent other first electrode pattern 36A. When the one extension pattern 56A and the other extension pattern 56B are not distinguished, the extension pattern 56 is referred to.

In addition, the other extension pattern 56B of the adjacent one of the first electrode patterns 36A is inserted between the one extension pattern 56A, and the other one is inserted between the other extension patterns 56B. One of the electrode patterns 36A expands the pattern 56A. That is, the expanded patterns 56 are arranged in a nested shape.

Here, an example in which the expanded patterns 56 are arranged in a nested shape will be described with reference to FIGS. 3A to 8B.

First, as shown in FIG. 3A and FIG. 3B, in the first aspect, the one extension pattern 56A and the other extension pattern 56B are symmetrically expanded from the main body pattern 54, and the respective extension patterns 56 are every other one. The way is arranged in a nested shape. Of course, although not shown, for example, the respective extension patterns 56 may be arranged in a nest shape every two or more, for example, two.

As shown in FIG. 4A and FIG. 4B, in the second aspect, the one extension pattern 56A and the other extension pattern 56B are alternately expanded from the main body pattern 54, and the respective extension patterns 56 are arranged in every other manner. Nested. Of course, as shown in FIG. 5A and FIG. 5B, the respective extension patterns 56 may be arranged in a nest shape every two or more, for example, two.

The third aspect has the following aspects. In other words, as shown in FIG. 6A and FIG. 6B, the one extension pattern 56A includes a first extension portion 58A that expands toward the adjacent one of the first electrode patterns 36A, and one of the first extension portions 60A from which the first extension portion 60A The extension 58A extends along the body pattern 54. Similarly, the other extension pattern 56B of the first electrode pattern 36A has a second extension portion 58B that expands toward the adjacent other first electrode pattern 36A, and a second extension portion 60B that extends from the second extension portion The portion 58B extends along the body pattern 54.

In this case, the first expansion unit 58A and the second expansion unit 58B are alternately expanded from the main body pattern 54 as follows. Further, the first extension portion 58A and the second extension portion 58B are arranged in a nested shape, and the first extension portion 60A and the second extension portion 60B are arranged in a nested shape. When the first extension portion 58A and the second extension portion 58B are not described, the extension portion 58 is referred to as an extension portion 60 when the first extension portion 60A and the second extension portion 60B are not described.

As shown in FIG. 7A and FIG. 7B, the fourth aspect has substantially the same configuration as that of the third embodiment, but differs in that the plurality of first extending portions 60A are expanded from the first expanding portion 58A, and the plurality of second extending portions 60B are formed. The second extension unit 58B is expanded.

As shown in FIG. 8A and FIG. 8B, the fifth aspect has substantially the same configuration as that of the second embodiment, but differs in that the outer shape of each of the one extension pattern 56A and the other extension pattern 56B has a triangular shape. In other words, for example, it is not limited to the rectangular shape as in the first aspect and the second aspect, and may be a triangular shape or another polygonal shape.

As shown in the examples of FIGS. 3B, 4B, 5B, 6B, 7B, and 8B, the width Wh of the expanded pattern 56 means that a rectangular shape formed by the virtual electrode line La in which the expanded pattern 56 is divided is projected to The direction in which the direction in which the main body pattern 54 extends (the first direction: the y direction) (the second direction: the x direction) is the length of the line segment formed by the normal plane Ma of the normal line. In the third aspect or the fourth aspect, the rectangular shape formed by the virtual electrode line La in which the expanded pattern 56 is divided and the rectangular shape formed by the virtual electrode line La in which the extending portion 60 is divided are projected onto the virtual surface Ma. The length of the line segment. Further, as shown in FIG. 6B, when the shapes of the one extension pattern 56A and the other extension pattern 56B are different, the width Wh of one of the extension patterns 56A and the width Wh of the other extension pattern 56B may be different.

6B and 7B, the maximum widths Wa1, Wb1, Wa2, and Wb2 of the first expanded portion 58A, the second expanded portion 58B, the first extended portion 60A, and the second extended portion 60B are smaller than the width Wd of the main body pattern 54. .

Preferably, the widths Wa1, Wa2, Wb1, and Wb2 are each designed to have an average diameter D × 1/2 × k (k is a real number) of the unit 38. As shown in FIG. 9 , when the shape formed by the line (center line) passing through the center of the metal thin wire constituting one unit 38 is observed, the direction along the extending direction of the main body pattern 54 (the first direction: the y direction) is defined. The length Dy of the diagonal line and the length Dx of the second diagonal line along the direction perpendicular to the first direction (the second direction: the x direction) are extracted from five or more units 38 in the extended portion or the extended portion, The average Dx and the average Dy were obtained, and the average diameter in each direction was defined as the average diameter D. Further, the width of the expanded portion or the extended portion is compared with the average diameter D (average Dx or average Dy) in the width direction of each electrode. Specifically, the width Wa1 and the width Wa2 are compared with the average Dy, and the width Wb1 and the width Wb2 are compared with the average Dx. At this time, it is preferable that the widths Wa1, Wa2, Wb1, and Wb2 are each designed to have an average diameter D × 1/2 × k (k is a real number) of the unit 38.

If the width Wa1 or the like is not designed as described above, the design of the mesh structure constituting the first expanded portion 58A, the second expanded portion 58B, the first extended portion 60A, and the second extended portion 60B becomes difficult, and these may occur. The problem that the resistance value of the first extension portion 58A changes due to the position. In particular, by designing the widths Wa1, Wa2, Wb1, and Wb2 to be equal to, for example, the average diameter D of the unit 38 in the case where k=2 or 4 is set, or to be equal to twice the average diameter D of the unit 38. Since the resistance value hardly changes and the number of the first extension portion 60A and the second extension portion 60B can be increased, the detection of the touch position can be performed with high precision.

On the other hand, the second electrode pattern 36B is preferably formed of a stripe pattern extending in the second direction (x direction). Further, it is preferable that the second electrode pattern 36B is disposed to face each of the expanded patterns 56. The width We of the second electrode pattern 36B is, for example, as shown in FIG. 3A, in the rectangular shape formed by the virtual electrode line La in which the second electrode pattern 36B is divided, along the extending direction of the first electrode pattern 36A (first Direction: length in the y direction). The width We of the second electrode pattern 36B may be smaller than the width Wh of the expanded pattern 56 of the first electrode pattern 36A, or may be larger than the width Wh. It can be set as appropriate according to the resolution of the first direction (y direction). For example, a form in which 1 to 5 second electrode patterns 36B are opposed to the expanded pattern 56 can be cited. In the third aspect and the fourth aspect shown in FIG. 6A to FIG. 7B, one or five second electrode patterns 36B are opposed to the first extending portion 60A or the second extending portion 60B.

Furthermore, when the laminated conductive film 18 is used as the touch panel 10, the cladding layer 20 is laminated on the second conductive film 16B, and the first terminal wiring portion 44a and the second terminal wiring portion 44b are, for example, The second terminal wiring portion 44a is connected from the plurality of first electrode patterns 36A of the first conductive film 16A, and the second terminal wiring portion 44b is connected from the second conductive line. The control circuit 14 (see FIG. 2) for controlling the scanning is connected. The plurality of second electrode patterns 36B of the film 16B are discharged.

As a method of detecting the touch position, a self-capacitance or a mutual capacitance type can be preferably used.

As shown in FIG. 2, in the self-contained mode, the first pulse signal P1 for detecting the touch position is sequentially supplied from the control circuit 14 to the first terminal wiring portion 44a, and is sequentially supplied from the control circuit 14 to the second terminal wiring portion 44b. A second pulse signal P2 for detecting a touch position.

By bringing the fingertip into contact with or close to the upper surface of the cladding layer 20, the capacitance between the first electrode pattern 36A and the GND (earth) and the second electrode pattern 36B and GND are opposite to the touch position. Since the capacitance is increased, the waveform of the conduction signal from the first electrode pattern 36A and the second electrode pattern 36B is a waveform different from the waveform of the conduction signal from the other first electrode pattern 36A and the second electrode pattern 36B. Therefore, in the control circuit 14, the touch position is calculated based on the conduction signals from the first electrode pattern 36A and the second electrode pattern 36B.

On the other hand, as shown in FIG. 10, in the mutual capacitance type, the voltage signal S1 for detecting the touch position is sequentially applied from the control circuit 14 to the first electrode pattern 36A, and the second electrode pattern 36B is sequentially sensed (conducted). Detection of signal S2). By bringing the fingertip into contact with or close to the upper surface of the cladding layer 20, the parasitic capacitance (initial electrostatic capacitance) between the first electrode pattern 36A and the second electrode pattern 36B opposed to the touch position is connected in parallel. Since the stray capacitance of the finger is increased, the waveform of the conduction signal S2 from the second electrode pattern 36B corresponding to the touch position is a waveform different from the waveform of the conduction signal S2 from the other second electrode pattern 36B. Therefore, in the control circuit 14, the touch position is calculated based on the order of the first electrode pattern 36A that supplies the voltage signal S1 and the supplied conduction signal S2 from the second electrode pattern 36B.

By adopting such a self-capacitive or mutual-capacitance touch position detecting method, even if the two fingertips are brought into contact with or close to the upper surface of the cladding layer 20 at the same time, each touch position can be detected.

In addition, as a prior art document related to a projection type electrostatic capacitance type detection circuit, there are a specification of U.S. Patent No. 4,582,955, a specification of U.S. Patent No. 4,686,332, and a specification of U.S. Patent No. 4,733,222. U.S. Patent No. 5,374,787, U.S. Patent No. 5,543,588, U.S. Patent No. 7,030,860, U.S. Patent Application Publication No. 2004/0155871, and the like.

When the extension pattern 56 is not present in the first electrode pattern 36A, there is no case between the adjacent two body patterns 54 of the first electrode pattern 36A and between the adjacent two second electrode patterns 36B. A pattern of electrodes that capture changes in electrostatic capacitance. Therefore, when the finger is in contact with or close to such a portion, the position detection accuracy of the finger is lowered, and when an object having a small touch range such as a pen is touched, the touch position cannot be detected, and there is a possibility that the intention of the operator is different. Actions.

On the other hand, in the first electrode pattern 36A, since the second electrode pattern 36B is arranged to face each of the expanded patterns 56, even if the finger is in the adjacent two bodies of the first electrode pattern 36A. When the patterns 54 are in contact with or close to each other between the adjacent two second electrode patterns 36B, the change in electrostatic capacitance can be captured. Therefore, even at such a portion, the touch position can be detected. In other words, the detection accuracy of the touch position is improved. As a result, an operation corresponding to an operation command desired by the operator is performed.

In the present embodiment, even when the finger is in contact with or close between the adjacent two main body patterns 54 of the first electrode pattern 36A and between the adjacent two second electrode patterns 36B, it is possible to capture The change in electrostatic capacitance. In particular, since the first extending portion 60A and the second extending portion 60B are arranged in a nested shape as in the third aspect or the fourth aspect, the detection resolution of the touch position between the first electrode patterns 36A is improved, and The detection accuracy of the touch position is improved as compared with the pattern shown in the first mode or the second mode.

Further, the plurality of cells 38 are arranged in the extending direction to form the first expanded portion 58A and the second expanded portion 58B, and the plurality of cells 38 are arranged in the extending direction of the main body pattern 54 to constitute the first extending portion 60A and the second portion. Since the extending portion 60B can maximize the detection resolution of the touch position between the first electrode patterns 36A, the first expanded portion 58A, the second expanded portion 58B, the first extended portion 60A, and the second can be secured. The electrical conductivity of the extension 60B.

In addition, the maximum widths Wb1 and Wb2 of the first extending portion 60A and the second extending portion 60B are larger than the interval Wc between the first extending portion 60A and the second extending portion 60B (see FIGS. 6A and 7A). To the following effect. In other words, the combs arranged in a nested shape are arranged so as to be filled between the adjacent two main body patterns 54 of the first electrode pattern 36A and between the adjacent two second electrode patterns 36B. One of the teeth is expanded by the pattern 56A and the other of the expanded pattern 56B. Therefore, it is possible to eliminate a portion where the touch position cannot be detected or which is difficult to detect, and to further improve the detection accuracy of the touch position. In particular, by setting the interval Wc to the average diameter D × 1/2 × k (k is a real number) of the cells 38 constituting the mesh, the design of the mesh structure such as the first expanded portion 58A or the second expanded portion 58B can be designed. It becomes easy to suppress the resistance value from locally varying. Further, by designing the interval Wc to be equal to 1/2 of the average diameter D of the unit 38 when k=1, for example, the design of the mesh structure of the first expanded portion 58A and the second expanded portion 58B can be changed. It is easy to carry out the design in which the resistance value hardly changes, and the arrangement pitch of the first expanded portion 58A and the second expanded portion 58B can be made small, and the touch position can be detected with high precision. In addition, the average diameter D of the unit 38 is obtained by arbitrarily extracting five or more elements 38 constituting the first electrode pattern 36A and calculating the average value (average Dx) of the length in the width direction (x direction).

Each unit 38 is composed of a polygon. Examples of the polygon include a triangle, a quadrangle (square, rectangle, parallelogram, diamond, etc.), a pentagon, a hexagon, a random polygon, and the like. Further, a part of the side constituting the polygon may be constituted by a curved line. The length of one side of the unit 38 is preferably from 100 μm to 300 μm. When the length of one side is too short, there is a problem that the aperture ratio and the transmittance are lowered, and the transparency is also deteriorated. On the other hand, when the length of one side is too long, the aperture ratio and the transmittance are improved, but the electric resistance of the first electrode pattern 36A and the second electrode pattern 36B is increased, and the detection accuracy of the touch position is deteriorated. When the length of one side of the unit 38 is in the above range, the transparency can be further improved, and when mounted on the display panel 24 of the display device 22, the display can be recognized without discomfort.

The line width of the fine metal wires is preferably 0.1 μm or more and 15 μm or less, more preferably 0.5 μm or more and 9 μm or less, and still more preferably 1 μm or more and 7 μm or less. The surface resistance of the first electrode pattern 36A and the second electrode pattern 36B is preferably in the range of 0.1 to 100 ohms/sq. The lower limit value is 1 ohm/sq. or more, 3 ohm/sq. or more, 5 ohm/sq. or more, and preferably 10 ohm/sq. or more. The upper limit is 70 ohm/sq. or less, preferably 50 ohm/sq. or less.

Next, a preferred embodiment of the conductive film of the present embodiment will be described below.

The first terminal wiring portion 44a, the second terminal wiring portion 44b, the first terminal portion 46a, the second terminal portion 46b, the electrode film 48, the first ground terminal portion 50a, the second ground terminal portion 50b, and the ground line 52 are formed. Each of the metal wiring and the metal thin wires constituting the first electrode pattern 36A and the second electrode pattern 36B is preferably made of a single conductive material. The single conductive material is preferably made of a metal composed of one of silver, copper, and aluminum, or an alloy containing at least one of them.

In the first conductive film 16A and the second conductive film 16B of the present embodiment, the aperture ratio of at least the sensor regions 26A and 26B is preferably 85% or more, and more preferably 90%, from the viewpoint of visible light transmittance. The above is most preferably 95% or more. The aperture ratio refers to a ratio of the light transmissive portion other than the fine metal wires in the whole, and for example, a square grid-like aperture ratio of a line width of 6 μm and a fine line pitch of 240 μm is 95%.

In the laminated conductive film 18, for example, as shown in FIG. 2, the first conductive portion 30A is formed on the surface of the first transparent substrate 32A, and the second conductive portion 30B is formed on the surface of the second transparent substrate 32B. As shown in FIG. 11, the first conductive portion 30A may be formed on one surface (for example, the lower surface) of the second transparent substrate 32B, and the second conductive portion may be formed on the other surface (for example, the upper surface) of the second transparent substrate 32B. 30B. In this case, the first transparent substrate 32A is not present, and the second transparent substrate 32B is laminated on the first conductive portion 30A, and the second conductive portion 30B is laminated on the second transparent substrate 32B. In this case, it is preferable to form the first transparent adhesive layer 34A so as to cover the first conductive portion 30A, and to form the second transparent adhesive layer 34B so as to cover the second conductive portion 30B. Further, another layer may exist between the first conductive film 16A and the second conductive film 16B, and the first electrode pattern 36A and the second electrode pattern 36B may be disposed to face each other if they are insulated.

As shown in FIG. 1, it is preferable to use, for example, each corner portion of the first conductive film 16A and the second conductive film 16B to bond the first conductive film 16A and the second conductive film 16B. The first positioning mark 62a and the second positioning mark 62b for positioning. When the first conductive film 16A and the second conductive film 16B are bonded to each other as the laminated conductive film 18, the first positioning mark 62a and the second positioning mark 62b become new composite positioning marks. The composite positioning mark can also be utilized as a positioning mark for positioning used when the laminated conductive film 18 is placed on the display panel 24.

In the above example, the first conductive film 16A and the second conductive film 16B are applied to the projection type capacitive touch panel 10, and the surface can be applied to the surface type electrostatic capacitance method. Touch panel or resistive film touch panel.

In addition, the first conductive film 16A and the second conductive film 16B of the present embodiment can be used as an electromagnetic wave mask film of the display device 22 in addition to the conductive film for the touch panel of the display device 22 or The optical film provided on the display panel 24 of the display device 22 is utilized. Examples of the display device 22 include a liquid crystal display, a plasma display, an organic EL, an inorganic EL, and the like.

Next, a method of manufacturing the first conductive film 16A will be briefly described. The second conductive film 16B is also the same.

As a method of producing the first conductive film 16A, for example, a photosensitive material having an emulsion layer can be exposed on the first transparent substrate 32A to perform development processing, whereby metal silver is formed in the exposed portion and the unexposed portion, respectively. The first conductive portion 30A is formed by the portion and the light transmissive portion, and the emulsion layer contains a photosensitive silver halide salt. Further, the metal silver portion may be further subjected to physical development and/or plating treatment, whereby the metallic silver portion is maintained as a conductive metal.

Alternatively, a plating pretreatment material may be used on the first transparent substrate 32A to form a photosensitive plating layer, and then subjected to a plating treatment after exposure and development processing, whereby the exposed portion and the unexposed portion are formed. The metal portion and the light transmissive portion are formed separately to form the first conductive portion 30A. Further, the metal portion can be held by the conductive metal by performing physical development and/or plating treatment on the metal portion.

As a more preferable aspect of the method of using a plating pretreatment material, the following two methods are mentioned. In addition, in the case of the following, the Japanese Patent Laid-Open Publication No. Hei. No. 2006-213237, JP-A-2006-64923, JP-A-2006-58797, JP-A-2006-135271, etc. It was made public.

(a): a plated layer containing a functional group that interacts with a plating catalyst or a precursor thereof is applied onto the first transparent substrate 32A, and then subjected to plating treatment after exposure/development A metal portion is formed on the material to be plated.

(b): On the first transparent substrate 32A, a substrate layer containing a polymer and a metal oxide and a plated layer containing a functional group that interacts with the plating catalyst or its precursor are sequentially laminated, and then exposed After development, plating treatment is performed to form a metal portion on the material to be plated.

Alternatively, the photoresist film on the metal foil formed on the first transparent substrate 32A may be exposed to a development process to form a resist pattern, and the metal foil exposed from the resist pattern may be etched. Thus, the first conductive portion 30A is formed.

Alternatively, a paste containing metal fine particles may be printed on the first transparent substrate 32A, and the paste may be metal plated to form a mesh pattern.

Alternatively, a mesh pattern may be printed on the first transparent substrate 32A by using a screen printing plate or a gravure print plate.

Alternatively, the first conductive portion 30A may be formed on the first transparent substrate 32A by inkjet.

Next, in the first conductive film 16A of the present embodiment, a method of using a silver halide photo-sensitive material as a particularly preferable embodiment will be described. The same applies to the second conductive film 16B.

The method for producing the first conductive film 16A of the present embodiment includes the following three aspects depending on the method of the photosensitive material and the development process.

(1) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei is subjected to chemical development or thermal development, and a metallic silver portion is formed on the photosensitive material.

(2) A photosensitive silver halide black-and-white photosensitive material containing a physical development nuclei in a silver halide emulsion layer is subjected to electrolytic physical development, and a metallic silver portion is formed on the photosensitive material.

(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development nuclei is superposed on a photoreceptor having a non-photosensitive layer containing a physical development nuclei, and diffusion-transfer imaging is performed to form a metal on the non-photosensitive photoreceptor. Silver Department.

The aspect of the above (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting imaging silver is chemically imaged silver or thermally developed silver, which is highly active during subsequent plating or physical imaging at the point of filaments having a high specific surface.

In the aspect of the above (2), in the exposed portion, the silver halide fine particles in the vicinity of the physical development nucleus are dissolved and deposited on the developing nucleus, whereby a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. Sex film. This is also an integrated black and white imaging type. The imaging effect is the precipitation on the physical imaging nucleus, so the activity is higher, and the imaging silver is a spherical shape smaller than the surface.

In the aspect of the above (3), the silver halide fine particles are dissolved in the unexposed portion, diffused and deposited on the image forming core on the image receiving sheet, whereby light-transmitting conductivity such as a light-transmitting conductive film is formed on the image receiving sheet. membrane. This is a so-called separation type, which is a method in which the image receiving sheet is peeled off from the photosensitive material.

In either of the modes, any one of the negative-type development processing and the reverse development processing can be selected (in the case of the diffusion transfer method, the negative film can be performed by using the automatic positive-type photosensitive material as the photosensitive material). Type imaging processing).

The chemical imaging, thermal imaging, dissolved physical imaging, and diffusion transfer imaging mentioned herein are the meanings of the terms commonly used in the art, and in the general textbooks of photographic chemistry, such as Kikuchi, "Photochemistry" ( Kyoritsu Press, issued in 1955), CEK Mees compiled "The Theory of Photographic Processes, 4th ed." (Mcmillan, issued in 1977) has a commentary. The present invention is an invention of liquid processing, but as another development method, a technique of applying a thermal development method can also be referred to. For example, each of the specifications of the Japanese Patent Publication No. 2004-184693, the Japanese Patent Application Publication No. 2004-334077, the Japanese Patent Application Laid-Open No. Hei. The technology described.

Here, the structure of each layer of the first conductive film 16A of the present embodiment will be described in detail below. The same applies to the second conductive film 16B.

[1st transparent substrate 32A]

Examples of the first transparent substrate 32A include a plastic film, a plastic plate, and a glass plate. As a raw material of the plastic film and the plastic plate, for example, polyester such as polyethylene terephthalate (PET) or polyethylene naphthalate (PEN), triethylene fluorene cellulose (TAC), or the like can be used. Polycarbonate, cyclic olefin (COP), and the like. As the first transparent substrate 32A, a plastic film or a plastic plate having a melting point of about 290 ° C or less is preferable, and PET is more preferable from the viewpoint of light transmittance, workability, and the like.

[Silver Salt Emulsion Layer]

The silver salt emulsion layer in the metal thin wires of the first conductive film 16A contains an additive such as a solvent or a dye in addition to the silver salt and the binder.

The silver salt used in the present embodiment may, for example, be an inorganic silver salt such as silver halide or an organic silver salt such as silver acetate. In the present embodiment, it is preferable to use silver halide which is excellent in characteristics as a photosensor.

The amount of silver coated (the amount of coating of the silver salt) in the silver salt emulsion layer is preferably from 1 g/m ² to 30 g/m ² , more preferably from 1 g/m ² to 25 g/m ² , in terms of silver. It is preferably 5 g/m ² to 20 g/m ² . When the amount of applied silver is in the above range, when the first conductive film 16A is used, a desired surface resistance can be obtained.

Examples of the binder to be used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, polyethylene oxide, and the like. Polyethylamine, chitosan, polypropane, polyacrylic acid, alginic acid, polyhyaluronic acid, carboxy cellulose, and the like. They have neutral, anionic, and cationic properties depending on the ionicity of the functional map.

The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer is preferably such that the silver/bonding agent volume ratio is 1/4 or more, and more preferably 1/2 or more. The silver/binder volume ratio is preferably 100/1 or less, and more preferably 50/1 or less. Further, it is more preferable to make the silver/bonding agent volume ratio 1/1 to 4/1. Most preferably, it is 1/1 to 3/1. By setting the silver/bonding agent volume ratio in the silver salt emulsion layer to this range, even when the amount of coated silver is adjusted, variation in resistance value can be suppressed, and first conductivity having uniform surface resistance can be obtained. Film 16A. Further, regarding the silver/binder volume ratio, it is possible to convert the amount of silver halide/binding amount (weight ratio) of the raw material into a silver amount/binding amount (weight ratio), and further convert the amount of silver/binding amount (weight ratio) into The amount of silver/binding dose (volume ratio) was determined.

<solvent>

The solvent to be used for the formation of the silver salt emulsion layer is not particularly limited, and examples thereof include water and an organic solvent (for example, an alcohol such as methanol, a ketone such as acetone, a guanamine such as formamide, or a dimethyl group. Anthraquinones such as anthraquinones, esters such as ethyl acetate, ethers, etc.), ionic liquids, and mixed solvents thereof.

<Other additives>

The various additives used in the present embodiment are not particularly limited, and known additives can be preferably used.

[Other layer structure]

A protective layer (not shown) may be provided on the silver salt emulsion layer. Further, for example, a substrate coating may be provided under the silver salt emulsion layer.

Next, each step of the method of manufacturing the first conductive film 16A will be described.

[exposure]

In the present embodiment, the first conductive portion 30A is formed by using a printing method. However, in addition to the printing method, the first conductive portion 30A is formed by exposure, development, or the like. That is, the photosensitive material having the silver salt-containing layer or the photosensitive material coated with the photopolymer for photolithography provided on the first transparent substrate 32A is exposed. Exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include light such as visible light and ultraviolet light, and radiation such as X-ray. Further, in the exposure, a light source having a wavelength distribution may be used, or a light source having a specific wavelength may be used.

[Dynamic processing]

In the present embodiment, after the emulsion layer is exposed, the development process is further performed. In the development processing, a technique of usual development processing used in a silver salt photo film, a printing paper, a film for printing plate, or an emulsion mask for a photomask can be used. In the development process of the present invention, a silver salt which removes an unexposed portion may be contained, and a fixing process for the purpose of stabilization may be included. The fixing treatment of the present invention can be carried out by a fixing treatment used in a silver salt photo film or a printing paper, a film for printing plate, an emulsion mask for a photomask, or the like.

The photosensitive material subjected to the development and fixing treatment is preferably subjected to a water washing treatment or a stabilization treatment.

The mass of the metal portion included in the exposed portion after the development process is preferably 50% by mass or more, more preferably 80% by mass or more, based on the mass of the metal contained in the exposed portion before exposure. When the mass of the metal contained in the exposed portion is 50% by mass or more based on the mass of the metal contained in the exposed portion before the exposure, high conductivity can be obtained, which is preferable.

Through the above steps, the first conductive film 16A is obtained. The first conductive film 16A after the development process can be further subjected to calendering treatment, and the surface resistance of each transparent conductive layer can be adjusted to a desired surface resistance (0.1 ohm/sq. to 100 ohm/sq) by calendering. Scope).

[Physical imaging and plating treatment]

In the present embodiment, in order to improve the conductivity of the metal portion formed by the exposure and the development processing, physical development and/or plating treatment for holding the metal portion with the conductive metal particles may be performed. In the present invention, the conductive metal fine particles may be held by the metal silver portion only by any one of physical development and plating treatment, or the metal portion may be held by the physical development and the plating treatment to hold the conductive metal particles. Further, the portion including the physical development and/or the plating treatment of the metal portion is referred to as a "conductive metal portion".

The "physical development" in the present embodiment means that metal ions such as silver ions are reduced by a reducing agent on a core of a metal or a metal compound to precipitate metal fine particles. This physical phenomenon is used for an instant B&W film, instant slide or printing plate manufacturing, etc., and this technique can also be used in the present invention. Further, the physical development may be performed simultaneously with the development processing after the exposure, or may be performed separately after the development processing.

In the present embodiment, electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or electroless plating and electrolytic plating may be used for the plating treatment. The electroless plating of the present embodiment can use a known electroless plating technique. For example, an electroless plating technique used for a printed wiring board or the like can be used, and electroless plating is preferably electroless copper plating.

[Oxidation treatment]

In the present embodiment, it is preferable to perform an oxidation treatment on the metal portion after the development processing and the conductive metal portion formed by the physical development and/or the plating treatment. By performing the oxidation treatment, for example, when a metal is slightly deposited on the light-transmitting portion, the metal can be removed, and the transmittance of the light-transmitting portion is approximately 100%.

[Thickness of the first transparent substrate 32A or the like]

The thickness of the first transparent substrate 32A in the first conductive film 16A of the present embodiment is preferably 5 to 350 μm, and more preferably 30 μm to 150 μm. If it is in the range of 5 μm to 350 μm, the desired transmittance of visible light can be obtained and it is easy to handle.

The thickness of the metal portion provided on the first transparent substrate 32A can be appropriately determined depending on the coating thickness of the coating material for the silver salt-containing layer applied on the first transparent substrate 32A. The thickness of the metal portion may be selected from 0.01 μm to 200 μm, but is preferably 30 μm or less, more preferably 20 μm or less, further preferably 0.01 μm to 9 μm, and most preferably 0.05 μm to 5 μm. Further, the metal portion is preferably in the form of a pattern. The metal portion may be one layer or a multilayer structure of two or more layers. In the case where the metal portion has a multi-layered structure of two or more layers, it is possible to impart different color sensitivities and to be sensitive to different wavelengths. Thus, if the exposure wavelength is changed and exposure is performed, different patterns can be formed in each layer.

As the thickness of the conductive metal portion is used as the touch panel 10, the thinner the viewing angle of the display panel 24 is, the thinner the thickness is, and the thinner the film thickness is required. From such a viewpoint, the thickness of the layer composed of the conductive metal held in the conductive metal portion is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and still more preferably 0.1 μm or more and less than 3 μm.

In the present embodiment, the metal portion having a desired thickness can be formed by controlling the coating thickness of the silver salt-containing layer, and the layer composed of the conductive metal particles by physical development and/or plating treatment can be freely controlled. Therefore, even if it is a conductive film having a thickness of less than 5 μm, preferably less than 3 μm, it can be easily formed.

Further, in the method of manufacturing the first conductive film 16A of the present embodiment, it is not always necessary to perform a process such as plating. This is because, in the method for producing the first conductive film 16A of the present embodiment, the desired surface resistance can be obtained by adjusting the amount of coated silver and the silver/binder volume ratio of the silver salt emulsion layer. Further, calendering treatment or the like can be performed as needed.

[Diamembrane treatment after development processing]

After the silver salt emulsion layer has been subjected to development processing, it is preferably immersed in a hard coat agent and subjected to a hard coat treatment. Examples of the hardener include aldehydes such as glutaraldehyde, adipaldehyde, 2,3-dihydroxy-1,4-dioxane, and materials disclosed in JP-A-2-141279, such as boric acid.

A functional layer such as an antireflection layer or a hard coat layer may be added to the first conductive film 16A of the present embodiment.

[calendering treatment]

The metal portion can be calendered for smoothing. Thereby, the electrical conductivity of the metal portion is remarkably increased. The calendering treatment can be carried out using a calender roll. Preferably, the calender rolls are formed from a common pair of rolls.

As the roll used in the calendering treatment, a plastic roll or a metal roll such as epoxy, polyimide, polyamide or polyamidamine is suitably used. In particular, in the case where the two faces have an emulsion layer, the metal rolls are preferably treated with each other. In the case where one side has an emulsion layer, in order to prevent wrinkles, a metal roll and a plastic roll can be combined. The upper limit of the line pressure is 1960 N/cm (200 kgf/cm, which is 699.4 kgf/cm ^{2 in} terms of surface pressure), more preferably 2940 N/cm (300 kgf/cm, and 935.8 kgf/cm in terms of surface pressure). ² ) Above. The upper limit of the line pressure is 6880 N/cm (700 kgf/cm) or less.

The application temperature of the smoothing treatment typified by the calender rolls is preferably 10 ° C (unregulated temperature) to 100 ° C, and more preferably, the temperature according to the metal mesh pattern or the metal wiring pattern, the line density, the shape or the bonding agent It varies depending on the type, but is approximately in the range of 10 ° C (unregulated temperature) to 50 ° C.

Further, the present invention can be suitably used in combination with the techniques disclosed in Tables 1 and 2 below and the techniques of the International Publication Manual. Descriptions such as "Japanese special open", "No. bulletin", and "number manual" are omitted.

[Table 1]

[Table 2]

Further, the conductive film of the present invention is not limited to the above embodiment, and various configurations can of course be employed without departing from the gist of the invention.

The above is only a part of the embodiments of the present invention, and is not intended to limit the present invention. It is intended to be included in the scope of the present invention.

In summary, the embodiments of the present invention can achieve the expected use efficiency, and the specific technical means disclosed therein have not been seen in similar products, nor have they been disclosed before the application, and have completely complied with the patent law. The regulations and requirements, the application for invention patents in accordance with the law, and the application for review, and the grant of patents, are truly sensible.

10‧‧‧Touch panel
12‧‧‧ Sensor body

14‧‧‧Control circuit
16A‧‧‧1st conductive film

16B‧‧‧2nd conductive film
18‧‧‧Laminated conductive film

20‧‧‧Cladding
22‧‧‧ display device

24‧‧‧ display panel
24a‧‧‧Display

26A‧‧‧1st sensor area
26B‧‧‧2nd sensor area

28A‧‧‧1st terminal wiring area
28B‧‧‧2nd terminal wiring area

30A‧‧‧1st Conductive Department
30B‧‧‧2nd Conductive Department

32A‧‧‧1st transparent substrate
32B‧‧‧2nd transparent substrate

34A‧‧‧1st transparent adhesive layer
34B‧‧‧2nd transparent adhesive layer

36A‧‧‧1st electrode pattern
36B‧‧‧2nd electrode pattern

38‧‧‧ unit
40‧‧‧ mesh pattern

42a‧‧‧1st connection
42b‧‧‧2nd Connection

44a‧‧‧1st terminal wiring part
44b‧‧‧2nd terminal wiring section

46a‧‧‧1st terminal part
46b‧‧‧2nd terminal section

48‧‧‧Electrode film
50a‧‧‧1st grounding terminal

50b‧‧‧2nd grounding terminal
52‧‧‧ Grounding wire

54‧‧‧ body pattern
56‧‧‧Extended pattern

56A‧‧‧One extended pattern
56B‧‧‧The other side extension pattern

58A‧‧‧1st extension
58B‧‧‧2nd extension

60‧‧‧Extension
60A‧‧‧1st extension

60B‧‧‧2nd extension
62a‧‧‧1st positioning mark

62b‧‧‧2nd positioning mark

1 is an exploded perspective view showing a configuration example in which a conductive film of the present embodiment is applied to a touch panel.

2 is an explanatory view showing an example of a cross-sectional structure of a laminated conductive film and an example of a control system (self-capacitance type)

3A is a plan view showing a main portion of the first conductive film and the second conductive film of the first embodiment, and FIG. 3B is an enlarged view of the main body pattern, the one extended pattern, and the other expanded pattern of the first aspect. Top view shown

4A is a plan view showing a main portion of the first conductive film and the second conductive film of the second embodiment, and FIG. 4B is an enlarged view of the main body pattern, the one extended pattern, and the other expanded pattern of the second aspect. Top view shown

5A is a plan view showing a main portion of a first conductive film and a second conductive film in another example of the second aspect, and FIG. 5B is a main body pattern in another example of the second aspect, Top view of one extended pattern and the other extended pattern enlarged

6A is a plan view showing a main portion of the first conductive film and the second conductive film of the third embodiment, and FIG. 6B is an enlarged view of the main body pattern, the one extended pattern, and the other expanded pattern of the third aspect. Top view shown

7A is a plan view showing a main portion of the first conductive film and the second conductive film of the fourth embodiment, and FIG. 7B is an enlarged view of the main body pattern, the one extended pattern, and the other expanded pattern of the fourth aspect. Top view shown

8A is a plan view showing a main portion of a first conductive film and a second conductive film of a fifth embodiment as seen from above, and FIG. 8B is an enlarged view of the main body pattern, the one extended pattern, and the other expanded pattern of the fifth aspect. Top view shown

Figure 9 is a diagram for explaining the average diameter of the unit

FIG. 10 is an explanatory diagram showing an example of a cross-sectional structure of a laminated conductive film and an example of a control system (mutual capacitance type).

11 is an explanatory view showing another example of a cross-sectional structure of a laminated conductive film.

26A‧‧‧1st sensor area

36A‧‧‧1st electrode pattern

36B‧‧‧2nd electrode pattern

38‧‧‧ unit

40‧‧‧ mesh pattern

54‧‧‧ body pattern

56A‧‧‧One extended pattern

56B‧‧‧The other side extension pattern

Claims (10)

A conductive film having an insulator, two or more first electrode patterns, and two or more second electrode patterns, wherein the first electrode pattern and the second electrode pattern are opposed to each other via the insulator, and are characterized in that Each of the first electrode pattern and the second electrode pattern is formed by combining a plurality of cells formed of thin metal wires, the first electrode pattern having a body pattern extending in one direction and one extending pattern And extending from one side of the main body pattern toward the adjacent one of the first electrode patterns; and the other of the expanded patterns extending from the other side of the main body pattern toward the adjacent one of the other first electrode patterns. The other extension pattern of the adjacent one of the first electrode patterns is inserted between one of the extension patterns, and the other of the adjacent ones is inserted between the other of the extension patterns The one of the first electrode patterns is expanded in a pattern such that the expanded patterns are arranged in a nest shape. The conductive film according to the first aspect of the invention, wherein the second electrode pattern has a stripe pattern and is disposed to face the expanded pattern of the first electrode pattern. The conductive film according to the first or second aspect of the invention, wherein the one of the expanded patterns includes: a first expanded portion that extends toward the adjacent one of the first electrode patterns; and one or more a first extension portion extending from the first extension portion along the body pattern, wherein the other extension pattern has a second extension portion that expands toward the adjacent first one of the first electrode patterns; One or more second extending portions extend from the second expanded portion along the main body pattern. The conductive film according to the third aspect of the invention, wherein the first extending portion and the second extending portion are respectively arranged in an extending portion extending from an expanded portion of the adjacent first electrode pattern. Nested. The conductive film according to claim 4, wherein a maximum width of each of the first extending portion and the second extending portion is larger than the first extending portion and the first extending portion The spacing between the extensions extending from the extension of the adjacent electrode pattern in the nested state. The conductive film according to claim 3, wherein when k is a real number, the first expanded portion, the second expanded portion, the first extended portion, and the conductive portion are The maximum width of each of the second extensions is designed as the average diameter of the unit x 1/2 x k. The conductive film according to claim 6, wherein when k is a real number, the interval between the first extending portion and the second extending portion is the unit Average diameter × 1/2 × k. The conductive film according to claim 3, wherein a maximum width of each of the first expanded portion, the second expanded portion, the first extended portion, and the second extended portion is smaller than The width of the body pattern. The conductive film according to claim 1 or 2, wherein 1 to 5 of the second electrode patterns are opposed to the expanded pattern. The conductive film according to claim 3, wherein 1 to 5 of the second electrode patterns are opposed to the expanded pattern.