TWI430161B - Conductive sheet, method of using conductive sheet, and capacitive touch panel - Google Patents

Description

Conductive sheet, method of using conductive sheet, and capacitive touch panel

The present invention relates to a conductive sheet, a method of using a conductive sheet, and an electrostatic capacitive touch panel. For example, the present invention relates to a conductive sheet and a conductive sheet suitable for use in a projection type capacitive touch panel. Method and electrostatic capacitive touch panel.

Regarding the use of a transparent conductive film using metal thin wires, for example, as disclosed in the specification of U.S. Patent Application Publication No. 2004/0229028 and the International Publication No. 2006/001461, the research is continuing.

Recently, touch panels have received attention. It is generally considered that the touch panel is mainly applied to a small-sized device such as a personal digital assistant (PDA) or a mobile phone, but it has been increasing in size due to applications for displays for personal computers and the like.

In the future, the previous electrode uses Indium Tin Oxide (ITO), so the resistance becomes large, and the application size becomes large. Accordingly, the transmission speed of the current between the electrodes becomes slow and the response speed is high. (The time until the position of the fingertip is detected after touching the fingertip) becomes slow.

Therefore, it has been considered that a plurality of lattices made of metal thin wires (metal thin wires) are arranged to form an electrode, thereby reducing the surface resistance. As a touch panel using a thin metal wire for an electrode, for example, a patent document is disclosed in Japanese Laid-Open Patent Publication No. Hei 5-224818, No. 5111101, and No. 1995/27334, and U.S. Patent Application Publication No. The specification of 2004/0239650, the specification of U.S. Patent No. 7,202,859, the Handbook of International Publication No. 1997/18508, and the Japanese Patent Laid-Open No. 2003-099185.

However, when a metal thin wire is used for an electrode, since the fine metal wire is made of an opaque material, transparency or visibility is a problem.

The present invention has been made in view of the above problems, and an object thereof is to provide a conductive sheet, a conductive sheet, and a capacitive touch panel which can ensure high transparency even when an electrode is formed by a thin metal pattern in a touch panel. .

[1] The conductive sheet according to the first aspect of the present invention includes a substrate and a conductive portion formed on the substrate, wherein the conductive portion is formed with two or more conductive large lattices formed of fine metal wires, and a phase Each of the large lattices is formed by a combination of two or more small lattices, and each of the large grids is electrically connected to the adjacent large grids, and the plurality of grids are combined to form a circuit. When the pitch of the small lattice is Ps, the width Wc of the connecting portion satisfies Wc>Ps/ .

[2] The conductive sheet according to the first aspect of the invention, wherein the two or more large lattices are arranged in the first direction via the connecting portion to form one conductive pattern, and the two or more conductive patterns are arranged in the same manner as the above In the second direction orthogonal to the one direction, an electrically insulating insulating portion in which the small lattice is not present is disposed between the adjacent conductive patterns, and the conductive pattern and the insulating portion are arranged to form the circuit. .

[3] The conductive sheet according to the first aspect of the invention, wherein a length of one side of the large lattice is 3 mm to 10 mm.

[4] The conductive sheet according to the first aspect of the invention, wherein a length of one side of the small lattice is 30 μm to 500 μm.

[5] The conductive sheet according to the first aspect of the invention, wherein an interval between the mutually opposing sides of the small lattice is 30 μm to 500 μm.

[6] The conductive sheet according to the first aspect of the invention, wherein the metal thin wires have a line width of 10 μm or less.

[7] The conductive sheet according to the second aspect of the present invention, comprising: a base; a first conductive portion formed on one main surface of the base; and a second conductive portion formed on the other main surface of the base The first conductive portion has two or more conductive first large lattices formed of thin metal wires, and a first connection portion formed of metal thin wires electrically connecting the adjacent first large lattices The second conductive portion has two or more conductive second large lattices formed of thin metal wires, and second conductive portions formed of thin metal wires electrically connecting the adjacent second large lattices Each of the first large lattices and each of the second large lattices is composed of a combination of two or more small lattices, and the first large lattices are arranged in the first direction via the first connecting portions to constitute one first The conductive pattern is configured by a combination of the first large lattice and the second large lattice, and when the pitch of the small lattice is Ps, the width Wc1 of the first connecting portion and the width of the second connecting portion Wc2 satisfies Wc1>Ps/

Wc2>Ps/ .

[8] The conductive sheet according to the second aspect of the invention, wherein the first large lattice is arranged in the first direction via the first connecting portion, thereby forming one first conductive pattern formed of thin metal wires, and two or more of the second conductive patterns The large lattice is arranged in the second direction orthogonal to the first direction via the second connecting portion to form one second conductive pattern formed of thin metal wires, and is disposed between the adjacent first conductive patterns The first insulating portion that is electrically insulated from the small lattice is not present, and the second insulating portion that is electrically insulated from the small lattice is disposed between the adjacent second conductive patterns, and the first conductive portion is disposed by the first conductive portion The pattern, the second conductive pattern, the first insulating portion, and the second insulating portion are arranged to constitute the circuit.

[9] The conductive sheet according to the second aspect of the invention, wherein the metal thin wire has a line width of 10 μm or less.

[10] The conductive sheet according to the second aspect of the invention, wherein a projection distance between a straight portion of a side portion of the first large lattice and a straight portion of a side portion of the second large lattice is set according to a size of the small lattice.

[11] The conductive sheet according to the second aspect of the invention, wherein the projection distance is 100 μm to 400 μm.

[12] The conductive sheet according to the second aspect of the invention, wherein the first conductive portion has a first terminal wiring pattern connected to an end portion of each of the first conductive patterns, and one side formed on one main surface of the base body a plurality of first terminals connected to the corresponding first terminal wiring pattern at a central portion in the longitudinal direction, and the second conductive portion has a second terminal wiring pattern connected to an end portion of each of the second conductive patterns, and formed a central portion in the longitudinal direction of one side of the other main surface of the base body and the corresponding second terminal A plurality of second terminals connected to the wiring pattern.

[13] The conductive sheet according to the second aspect of the invention, wherein, when viewed from the upper surface, a portion in which the plurality of first terminals are arranged is adjacent to a portion in which the plurality of second terminals are arranged.

[14] The conductive sheet according to the second aspect of the invention, wherein an end portion of each of the first conductive patterns and the corresponding first terminal wiring pattern are connected via a first junction portion, and an end portion of each of the second conductive patterns corresponds to The second terminal wiring patterns are connected via the second connection portion, and the plurality of first connection portions are linearly arranged along the second direction, and the plurality of second connection portions are along the first direction. Arranged in a straight line.

[15] The conductive sheet according to the second aspect of the invention, wherein the first insulating portion and the second insulating portion face each other with the base body interposed therebetween, and when viewed from a top surface, the first insulating portion and the second insulating portion The shape of the opposing portion is polygonal.

[16] The conductive sheet according to the second aspect of the invention, wherein the polygonal shape is a square shape.

[17] The conductive sheet according to the second aspect of the invention, wherein the polygonal shape is a wedge shape.

[18] The conductive sheet according to the first or second aspect of the invention, wherein the small lattice is polygonal.

[19] The conductive sheet according to the second aspect of the invention, wherein the small lattice is square.

[20] A method of using a conductive sheet according to a third aspect of the present invention is a method of using a conductive sheet of a first conductive sheet and a second conductive sheet, wherein two or more conductive layers formed of thin metal wires are formed on the first conductive sheet. a first large lattice and a first connecting portion formed of a thin metal wire electrically connecting the adjacent first large lattices, wherein each of the first large lattices is composed of two or more small lattices Further, when the pitch of the small lattice is Ps, the width Wc1 of the first connecting portion satisfies Wc1>Ps/ The second conductive sheet is formed with a second large grid of two or more conductive layers formed of thin metal wires and a second connection formed of thin metal wires electrically connecting the adjacent second large lattices. Each of the second large lattices is composed of a combination of two or more small lattices. When the pitch of the small lattices is Ps, the width Wc2 of the second connection portion satisfies Wc2>Ps/ In the first conductive sheet, two or more of the first large lattices are arranged in the first direction via the first connecting portion to form one first conductive pattern, and the first conductive sheet is used. In the second conductive sheet, two or more of the second large lattices are arranged in the second direction orthogonal to the first direction via the second connection portion to form one second conductive pattern, and the first conductive layer is formed by the first conductive layer. The sheet is combined with the second conductive sheet, and the first connecting portion of the first electric piece and the second connecting portion of the second conductive sheet are combined to form an arrangement of the small lattices.

[21] The capacitive touch panel of the fourth invention of the present invention is characterized by comprising the conductive sheet of the first invention or the second invention.

As described above, according to the conductive sheet of the present invention and the method of using the conductive sheet, the conductive pattern formed on the substrate can be made low-resistance, and even when the electrode is formed by a thin metal pattern in the touch panel, High transparency, for example, suitable for projection type capacitive touch panels.

Further, the capacitive touch panel of the present invention can achieve low resistance of the conductive pattern formed on the substrate, and can ensure high transparency even when the electrode is formed by the metal thin line pattern, for example, it can also cope with the projection type static electricity. The capacitive touch panel is large in size.

The above and other objects, features, and advantages will be apparent from the description of the preferred embodiments of the invention.

Hereinafter, an embodiment of a conductive sheet, a conductive sheet, and a capacitive touch panel of the present invention will be described with reference to FIGS. 1 to 17 . In the present specification, the meaning of "~" in the numerical range is that the numerical values described before and after are included as the lower limit and the upper limit.

As shown in FIG. 1, the conductive sheet (hereinafter referred to as the first conductive sheet 10A) of the first embodiment has a first conductive portion 13A formed on one main surface of the first transparent substrate 12A (see FIG. 2). The first conductive portion 13A is formed with two or more conductive first large lattices 14A formed of thin metal wires and first metal thin wires electrically connecting the adjacent first large lattices 14A. In the connection portion 16A, each of the first large lattices 14A is composed of a combination of two or more small lattices 18, and a circuit (conductive circuit pattern) is formed by a combination of the first large lattices 14A. Here, the small lattice 18 is set to a minimum square shape. The fine metal wires are made of, for example, gold (Au), silver (Ag), or copper (Cu).

The length of one side of the first large lattice 14A is preferably 3 mm to 10 mm. More preferably 4mm~6mm. When the length of one side is less than the above-described lower limit, when the first conductive sheet 10A is used for, for example, a touch panel, the capacitance of the first large lattice 14A at the time of detection is lowered, which may increase the detection failure. On the other hand, if the length of one side exceeds the above upper limit value, the position detection accuracy may decrease. From the same viewpoint, the length of one side of the small lattice 18 constituting the first large lattice 14A is preferably 50 μm to 500 μm, and more preferably 150 μm to 300 μm. When the small lattice 18 is in the above range, the transparency can be kept good, and when it is attached to the front surface of the display device, the display can be seen without any uncomfortable feeling.

Further, two or more first large lattices 14A are arranged in the x direction (first direction) via the first connecting portion 16A, and constitute one conductive circuit pattern formed of thin metal wires (hereinafter, referred to as a first conductive pattern) 22A), two or more first conductive patterns 22A are arranged in the y direction (second direction) orthogonal to the x direction, and between the adjacent first conductive patterns 22A, the small lattice 18 is not disposed. The first insulating portion 24A that is electrically insulated.

The x direction indicates, for example, a horizontal direction (or a vertical direction) of a projection type capacitive touch panel 100 (see FIG. 3 ) to be described later, or a horizontal direction (or a vertical direction) of the display panel 110 on which the touch panel 100 is provided.

Further, as shown in FIG. 1, the first side portion 28a and the second side portion 28b adjacent to one vertex portion 26a that is not connected to the adjacent first large lattice 14A are formed in the four side portions of the first large lattice 14A. Each of the plurality of needle-shaped wires 32 (the sides of the small lattices 18) is formed in a comb-like shape from the straight portion 30 continuous along the first side portion 28a and the second side portion 28b (hereinafter, line 32 is provided). Also recorded as comb teeth 32). On the other hand, and not with the first big grid Each of the third side portion 28c and the fourth side portion 28d adjacent to the other apex portion 26b to which the sub-portion 14A is connected has a form in which the straight portion 30 continuous along the third side portion 28c and the fourth side portion 28d is formed, and further, In the other vertex portion 26b, a corresponding one of the small lattices 18 (accurately, two adjacent sides) is removed.

The first connecting portion 16A has a shape in which four intermediate lattices 20 (the first intermediate lattice 20a to the fourth intermediate lattice 20d) are arranged in a zigzag shape, and the intermediate lattice 20 has a size including four small lattices 18. In other words, the first intermediate lattice 20a has a shape in which a space between the straight portion 30 of the second side portion 28b and the straight portion 30 of the fourth side portion 28d is formed in a L-shaped space with one small lattice 18. The second intermediate lattice 20b is adjacent to one side of the first intermediate lattice 20a (the linear portion 30 of the second side portion 28b), and has a shape in which a square space is formed, that is, four small lattices 18 are arranged in a matrix and removed. The shape of the central cross. The third intermediate lattice 20c is adjacent to the first intermediate lattice 20a, and is disposed adjacent to the second intermediate lattice 20b, and has the same shape as the second intermediate lattice 20b. The fourth intermediate lattice 20d is present at a boundary portion between the second straight portion 30 of the third side portion 28c (the second straight portion 30 from the outermost side toward the inside of the first large lattice 14A) and the first side portion 28a, and The second intermediate lattice 20b is adjacent to the third intermediate lattice 20c, and has a shape in which an L-shaped space is formed with one small lattice 18, similarly to the first intermediate lattice 20a. One side of the fourth middle lattice 20d exists on the extension line of the straight portion 30 of the fourth side portion 28d of the first large lattice 14A. Further, when the arrangement pitch of the small lattices 18 is set to Ps, the arrangement pitch Pm of the intermediate lattices 20 has a relationship of 2 × Ps. Further, the width Wc1 of the first connecting portion 16A (the distance from the vertex of the second intermediate lattice 20b to the apex of the third intermediate lattice 20c and along the y direction) satisfies Wc1>Ps/ , here is 6×(Ps/ ).

The open end of the first large lattice 14A which is present on one end side of each of the first conductive patterns 22A has a shape in which the first connecting portion 16A does not exist. The end portion of the first large lattice 14A existing on the other end side of each of the first conductive patterns 22A is electrically connected to the first terminal wiring pattern 41a formed of a thin metal wire via the first junction portion 40a (see FIG. 3).

In the first conductive sheet 10A, two or more first large lattices 14A are arranged in the x direction via the first connecting portion 16A, thereby constituting one first conductive pattern 22A, and two or more small lattices 18 are combined. When the first large lattice 14A is formed, when the pitch of the small lattices 18 is set to Ps, the width Wc1 of the first connecting portion 16A is made to satisfy Wc1>Ps/ Therefore, the electric resistance can be greatly reduced as compared with a configuration in which one electrode is formed by one ITO film. Therefore, when the first conductive sheet 10A is used and applied to, for example, a projection type capacitive touch panel, the response speed can be improved, and the size of the touch panel can be increased.

Next, the touch panel 100 using the first conductive sheet 10A will be described with reference to FIGS. 3 to 7.

The touch panel 100 includes a sensor body 102 and a control circuit (consisting of an IC circuit or the like) (not shown). As shown in FIG. 3, FIG. 4, and FIG. 5A, the sensor body 102 has a conductive sheet for a touch panel of the first embodiment which is formed by laminating the first conductive sheet 10A and a second conductive sheet 10B to be described later (hereinafter It is referred to as a first build-up conductive sheet 50A), and a protective layer 106 laminated on the first build-up conductive sheet 50A (the protective layer 106 is omitted in FIG. 5A). Record). The first build-up conductive sheet 50A and the protective layer 106 are, for example, disposed on the display panel 110 of the display device 108 such as a liquid crystal display. The sensor body 102 has a sensor portion 112 disposed in a region corresponding to the display screen 110a of the display panel 110 and a terminal wiring disposed in a region corresponding to the outer peripheral portion of the display panel 110 when viewed from the upper surface. Part 114 (so-called frame).

As shown in FIG. 4, the first conductive sheet 10A applied to the touch panel 100 has a plurality of first conductive patterns 22A arranged in a portion corresponding to the sensor portion 112, and is arranged in the terminal wiring portion 114. A plurality of first terminal wiring patterns 41a formed of thin metal wires which are led out from the respective first junction portions 40a.

In the example of FIG. 3, the outer shape of the first conductive sheet 10A has a rectangular shape when viewed from the upper surface, and the outer shape of the sensor portion 112 also has a rectangular shape. In the terminal wiring portion 114, a plurality of first terminals 116a are arranged in the longitudinal direction of the one long side in the longitudinal direction central portion of one of the long sides of the first conductive sheet 10A. Further, a plurality of first junction portions 40a are linearly arranged along one long side of the sensor portion 112 (the longest side closest to one long side of the first conductive sheet 10A, the y direction). The first terminal wiring pattern 41a led out from each of the first junction portions 40a is guided to a substantially central portion of one long side of the first conductive sheet 10A, and is electrically connected to the corresponding first terminal 116a. Therefore, the first terminal wiring patterns 41a connected to the respective first connection portions 40a on both sides of one long side of the sensor portion 112 are guided by substantially the same length. Of course, the first terminal 116a may be formed at or near the corner portion of the first conductive sheet 10A. In the plurality of first terminal wiring patterns 41a, the length between the longest first terminal wiring pattern 41a and the shortest first terminal wiring pattern 41a is greatly different, and the longest first terminal wiring pattern is used. The signal transmission of the first conductive pattern 22A corresponding to the plurality of first terminal wiring patterns 41a in the vicinity of 41a and the vicinity thereof becomes slow. Therefore, by forming the first terminal 116a in the central portion in the longitudinal direction of one long side of the first conductive sheet 10A as in the present embodiment, the delay of local signal transmission can be suppressed, and the response speed can be increased.

On the other hand, as shown in FIGS. 3, 4, and 5A, the second conductive sheet 10B has the second conductive portion 13B formed on one main surface of the second transparent substrate 12B. The second conductive portion 13B is formed with two or more conductive second large lattices 14B formed of thin metal wires, and a second connecting portion 16B formed of thin metal wires electrically connecting the adjacent second large lattices 14B. As shown in FIG. 6, each of the second large lattices 14B is composed of a combination of two or more small lattices 18, and the second connecting portion 16B is provided with n times having a small lattice 18 (n is greater than 1). One or more intermediate lattices 20 having a pitch of a real number are formed. The length of one side of the second large lattice 14B is also the same as that of the first large lattice 14A, and is preferably 3 mm to 10 mm, and more preferably 4 mm to 6 mm.

Further, two or more second large lattices 14B are arranged in the y direction (second direction) via the second connecting portion 16B, thereby constituting one conductive circuit pattern formed of thin metal wires (hereinafter, referred to as second In the conductive pattern 22B), two or more second conductive patterns 22B are arranged in the x direction (first direction) orthogonal to the y direction, and adjacent to the second conductive patterns 22B The second insulating portion 24B having no electrical insulation of the small lattice 18 is disposed therebetween.

As shown in FIG. 4, the open end of the second large lattice 14B existing on one end side of every other (for example, the odd-numbered) second conductive patterns 22B, and the second conductive pattern existing in the even number are present. The open ends of the second large lattices 14B on the other end side of the 22B are in a shape in which the second connecting portions 16B are not present. On the other hand, the end portion of the second large lattice 14B on the other end side of each of the odd-numbered second conductive patterns 22B and the other end portion side of the even-numbered second conductive patterns 22B exist. The end of the second large lattice 14B is electrically connected to the second terminal wiring pattern 41b formed of thin metal wires via the second junction portion 40b.

Further, a plurality of second conductive patterns 22B are arranged in a portion corresponding to the sensor portion 112, and a plurality of second terminal wiring patterns 41b derived from the respective second connection portions 40b are arranged in the terminal wiring portion 114.

As shown in FIG. 3, in the terminal wiring portion 114, a plurality of second portions are arranged in the longitudinal direction of the one long side of the peripheral portion of the long side of the second conductive sheet 10B in the longitudinal direction. Terminal 116b. Further, a plurality of second junction portions 40b are arranged linearly along one short side of the sensor portion 112 (the short side closest to one short side of the second conductive sheet 10B, and the x direction) (for example, the odd number The second junction portion 40b) is linearly arranged along the other short side of the sensor portion 112 (the short side closest to the other short side of the second conductive sheet 10B, the x direction). The junction portion 40b (for example, the even-numbered second junction portion 40b).

Among the plurality of second conductive patterns 22B, for example, the odd-numbered second conductive patterns 22B are respectively connected to the corresponding odd-numbered second connection portions 40b. The even-numbered second conductive patterns 22B are respectively connected to the corresponding even-numbered second junction portions 40b. The second terminal wiring pattern 41b derived from the odd-numbered second junction portion 40b and the second terminal wiring pattern 41b derived from the even-numbered second junction portion 40b are guided to one long side of the second conductive sheet 10B. The substantially central portion is electrically connected to the corresponding second terminal 116b. Therefore, for example, the first and second terminal wiring patterns 41b and the second and second terminal wiring patterns 41b are guided by substantially the same length, and the second and second second terminal wiring patterns 41b and 2n are the same. The second terminal wiring patterns 41b are guided by substantially the same length (n=1, 2, 3, . . . ).

Needless to say, the second terminal 116b may be formed in the corner portion of the second conductive sheet 10B or in the vicinity thereof. However, as described above, the second terminal wiring pattern 41b and the plurality of second terminals in the vicinity thereof are the longest. The signal transmission of the second conductive pattern 22B corresponding to the wiring pattern 41b becomes slow. Therefore, by forming the second terminal 116b in the central portion in the longitudinal direction of one long side of the second conductive sheet 10B as in the present embodiment, the delay of local signal transmission can be suppressed, and the response speed can be increased.

In addition, the lead-out pattern of the first terminal wiring pattern 41a may be the same as that of the second terminal wiring pattern 41b, and the lead-out pattern of the second terminal wiring pattern 41b may be the same as that of the first terminal wiring pattern 41a.

When the first laminated conductive sheet 50A is used as a touch panel, a protective layer is formed on the first conductive sheet 10A, and the first terminal derived from the plurality of first conductive patterns 22A of the first conductive sheet 10A is formed. The wiring pattern 41a and the plurality of second conductive patterns 22B derived from the second conductive sheet 10B are derived The second terminal wiring pattern 41b is connected to, for example, a control circuit that controls scanning.

As a method of detecting the touch position, a self capacitive method or a mutual capacitive method can be preferably used. That is, in the case of the self-capacitance mode, the first conductive pattern 22A is sequentially supplied with a voltage signal for detecting the touch position, and the second conductive pattern 22B is sequentially supplied with a voltage signal for detecting the touch position. Since the fingertip is brought into contact with or close to the upper surface of the protective layer 106, the capacitance between the first conductive pattern 22A and the second conductive pattern 22B and the GND (ground) which opposes the touch position increases, and thus the first The waveforms of the transmission signals of the conductive patterns 22A and the second conductive patterns 22B are different from the waveforms of the transmission signals from the other conductive patterns. Therefore, the control circuit calculates the touch position based on the transmission signals supplied from the first conductive pattern 22A and the second conductive pattern 22B. On the other hand, in the case of the mutual capacitance method, for example, a voltage signal for detecting a touch position is sequentially supplied to the first conductive pattern 22A, and the second conductive pattern 22B is sequentially sensed (detection of a transmission signal). The fingertip is brought into contact with or close to the upper surface of the protective layer 106, thereby increasing the floating capacitance of the finger in parallel with the parasitic capacitance between the first conductive pattern 22A and the second conductive pattern 22B facing the touch position. The waveform of the transmission signal of the conductive pattern 22B is a waveform different from the waveform of the transmission signal from the other second conductive pattern 22B. Therefore, the control circuit calculates the touch position based on the order of the first conductive patterns 22A to which the voltage signals are supplied and the supplied transmission signals from the second conductive patterns 22B. By adopting such a self-capacitance method or a mutual capacitance type touch position detecting method, even if two fingertips are simultaneously brought into contact with or close to the upper surface of the protective layer 106, each touch position can be detected. Further, the prior art documents relating to the projection type electrostatic capacitance type detection circuit include the specification of U.S. Patent No. 4,582,955, the specification of U.S. Patent No. 4,686,332, the specification of U.S. Patent No. 4,733,222, the specification of U.S. Patent No. 5,374,787, and U.S. Patent No. 5,543,588. The specification, the specification of U.S. Patent No. 7,030,860, the specification of U.S. Patent Publication No. 2004/0155871, and the like.

Further, as shown in FIG. 6, when the four side portions of the second large lattice 14B of the second conductive pattern 22B are viewed, the fifth side portion of one vertex portion 26a that is not connected to the adjacent second large lattice 14B is adjacent. In the 28e and the sixth side portion 28f, the fifth side portion 28e is the same as the first side portion 28a of the first large lattice 14A in the first conductive sheet 10A, and is a plurality of needle-shaped lines 32 (edges of the small lattice 18). A form in which the straight portion 30 continuous along the fifth side portion 28e is extended in a comb shape. Similarly to the third side portion 28c of the first large lattice 14A in the first conductive sheet 10A, the sixth side portion 28f is formed to have a straight portion 30 continuous along the sixth side portion 28f. When the seventh side portion 28g and the eighth side portion 28h which are adjacent to the other apex portion 26b which is not connected to the adjacent second large lattice 14B are viewed, the seventh side portion 28g is the same as the fifth side portion 28e, and is plural. The acicular line 32 (the side of the small lattice 18) is formed in a comb-like shape from the straight portion 30 continuous along the seventh side portion 28g, and the eighth side portion 28h is formed in the same manner as the sixth side portion 28f. The form of the straight portion 30 that continues along the eighth side portion 28h.

Further, the second connecting portion 16B has a shape in which four intermediate lattices 20 (the fifth intermediate lattice 20e to the eighth intermediate lattice 20h) are arranged in a zigzag shape, and the intermediate lattice 20 has a size including four small lattices 18. In other words, the fifth intermediate lattice 20e is present in the second straight portion 30 of the sixth side portion 28f (the second straight portion from the outermost side toward the inside of the second large lattice 14B) and the straight portion 30 of the eighth side portion 28h. The boundary portion has a shape in which an L-shaped space is formed with one small lattice 18. The sixth intermediate lattice 20f is adjacent to one side of the fifth intermediate lattice 20e (the second linear portion 30 of the sixth side portion 28f), and has a shape in which a square space is formed, that is, a matrix formed by four small lattices 18 Shape that will remove the central cross. The seventh middle lattice 20g is adjacent to the fifth intermediate lattice 20e, and is disposed adjacent to the sixth intermediate lattice 20f, and has the same shape as the sixth intermediate lattice 20f. The eighth intermediate lattice 20h is present at a boundary portion between the linear portion 30 and the fifth side portion 28e of the seventh side portion 28g, is adjacent to the sixth intermediate lattice 20f, and is disposed adjacent to the seventh intermediate lattice 20g, and is arranged in the fifth intermediate lattice. 20e similarly has a shape in which an L-shaped space is formed with one small lattice 18. One side of the eighth middle lattice 20h exists on the extension line of the straight portion 30 of the eighth side portion 28h of the fifth middle lattice 20e. In the second conductive sheet 10B, when the arrangement pitch of the small lattices 18 is Ps, the arrangement pitch Pm of the intermediate lattices 20 also has a relationship of 2 × Ps. Further, the width Wc2 of the second connecting portion (the distance from the vertex of the sixth middle lattice 20f to the apex of the seventh intermediate lattice 20g and along the x direction) satisfies Wc2>Ps/ , here is 6×(Ps/ ).

When the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the first laminated conductive sheet 50A, as shown in FIG. 7, the first connecting portion 16A and the second conductive pattern 22B of the first conductive pattern 22A are formed. The second connecting portion 16B is in a state in which the first transparent substrate 12A (see FIG. 5A) is opposed to each other, and the first insulating portion 24A of the first conductive pattern 22A is Similarly, in the second insulating portion 24B of the second conductive pattern 22B, the first transparent substrate 12A is opposed to each other with the first transparent substrate 12A interposed therebetween. Further, the respective line widths of the first conductive pattern 22A and the second conductive pattern 22B are the same. However, in FIG. 7, in order to make the positions of the first conductive pattern 22A and the second conductive pattern 22B clear, the first conductive pattern is exaggerated in the drawing. The line width of 22A becomes thicker, and the line width of the second conductive pattern 22B is made thinner.

When the laminated first conductive sheet 10A and the second conductive sheet 10B are viewed from the upper surface, the second conductive sheet 10B is arranged so as to fill the gap between the first large lattices 14A formed on the first conductive sheet 10A. 2 large lattice 14B form. That is, it becomes a form in which a large lattice is spread. At this time, the respective distal ends of the comb teeth 32 of the first side portion 28a and the second side portion 28b of the first large lattice 14A are the straight portions of the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. As a result of the 30 connected shapes, the small lattices 18 are arranged. Similarly, the respective distal ends of the comb teeth 32 of the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are formed by the first large lattice 14A. The shape in which the linear portions 30 of the third side portion 28c and the fourth side portion 28d are connected is such that the small lattices 18 are arranged, and the boundary between the first large lattice 14A and the second large lattice 14B is hardly distinguishable. status.

Here, for example, when all of the side portions of the first large lattice 14A and the second large lattice 14B are formed as the straight portion 30, that is, the first side portion 28a and the second side of the first large lattice 14A are formed. The open ends of the plurality of lines 32 extending from the portion 28b are connected to form a new straight portion 30, and the plurality of lines 32 extending from the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are similarly formed. The case where the open end is connected to form a new straight portion 30 When there is a slight deviation in the positional accuracy of the overlap, the width of the overlapping portion of the straight portions 30 becomes larger (thick line), whereby the boundary between the first large lattice 14A and the second large lattice 14B is conspicuous, and the visibility is recognized. In the present embodiment, as described above, by the overlap of the distal end of the comb tooth 32 and the linear portion 30, the boundary between the first large lattice 14A and the second large lattice 14B is inconspicuous, and the visibility is improved. In addition, the portion in which the first insulating portion 24A and the second insulating portion 24B face each other has one opening in the middle lattice. However, unlike the above-described thick line, the first insulating portion 24A does not block light, and thus is hardly conspicuous to the outside. In particular, if the opening is one of the middle lattices, the size is almost the same as that of the surrounding small lattices 18, so that it is less conspicuous.

In addition, for example, when all of the first side portion 28a to the eighth side portion 28h of the first large lattice 14A and the second large lattice 14B are formed as the straight portion 30, the fifth side portion 28e of the second large lattice 14B is The linear portion 30 of the eighth side portion 28h is located directly below the straight portion 30 of the first side portion 28a to the fourth side portion 28d of the first large lattice 14A. At this time, since each linear portion 30 also functions as a conductive portion, a parasitic capacitance is formed between the side portion of the first large lattice 14A and the side portion of the second large lattice 14B, and the existence of the parasitic capacitance is for charge information. It acts as a noise component, causing a significant drop in the Signal to Noise ratio (S/N ratio). In addition, since parasitic capacitance is formed between each of the first large lattices 14A and the second large lattices 14B, a plurality of parasitic capacitances are connected in parallel between the first conductive patterns 22A and the second conductive patterns 22B, and as a result, CR is present. The problem of a large time constant. If the CR time constant becomes large, the voltage signals supplied to the first conductive pattern 22A (and the second conductive pattern 22B) may be caused. The rise time of the waveform becomes slower, and an electric field for detecting the position is hardly generated in a specific scanning time. In addition, the rising time or falling time of the waveform of the transmission signal from the first conductive pattern 22A and the second conductive pattern 22B is also slow, and the waveform of the transmission signal cannot be captured during a specific scanning time, resulting in a decrease in detection accuracy. The response speed is reduced. In other words, in order to improve the detection accuracy and improve the response speed, only the number of the first large lattices 14A and the second large lattices 14B is reduced (the resolution is lowered), or the size of the adaptive display screen is reduced. It is applied to the B5 version, the A4 version, and the large screen above this size.

On the other hand, in the present embodiment, as shown in FIG. 5A, the projection distance Lf between the straight portion 30 of the side portion of the first large lattice 14A and the straight portion 30 of the side portion of the second large lattice 14B and the small lattice 18 are formed. The length of one side (50 μm to 500 μm) is substantially the same. Further, the needle-shaped wires 32 extending from the first side portion 28a and the second side portion 28b of the first large lattice 14A are only the distal end and the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. The linear portions 30 are opposed to each other, and the needle-shaped wires 32 extending from the fifth side portion 28e and the seventh side portion 28g of the second large lattice 14B are only the distal end and the third side portion 28c of the first large lattice 14A, and Since the straight portions 30 of the fourth side portion 28d face each other, the parasitic capacitance formed between the first large lattice 14A and the second large lattice 14B becomes small. As a result, the CR time constant is also reduced, and the detection accuracy can be improved and the response speed can be improved.

The optimum distance of the projection distance Lf is preferably a size of the small lattice 18 constituting the first large lattice 14A and the second large lattice 14B compared to the sizes of the first large lattice 14A and the second large lattice 14B. width And the length of one side) is set as appropriate. At this time, if the size of the small lattice 18 is too large with respect to the first large lattice 14A and the second large lattice 14B having a certain size, the light transmittance is improved, but the dynamic range of the transmission signal may be small. And the detection sensitivity is reduced. On the contrary, if the size of the small lattice 18 is too small, although the detection sensitivity is improved, the light transmittance may be deteriorated due to the limited reduction in the line width.

Therefore, when the line width of the small lattice 18 is 1 μm to 9 μm, the optimum value (optimum distance) of the projection distance Lf is preferably 100 μm to 400 μm, and more preferably 200 μm to 300 μm. When the line width of the small lattice 18 is narrowed, the optimum distance can be shortened, but the electric resistance is increased. Therefore, even if the parasitic capacitance is small, the CR time constant is also increased, and as a result, the detection sensitivity is lowered and the response speed is lowered. Therefore, the line width of the small lattice 18 is preferably in the above range.

Further, for example, the size of the first large lattice 14A and the second large lattice 14B is determined according to the size of the display panel 110 or the size of the sensor portion 112 and the resolution of the touch position detection (pulse period of the driving pulse wave). The size of the small lattice 18 is calculated based on the line width of the small lattice 18, and the optimum distance between the first large lattice 14A and the second large lattice 14B is calculated.

When the portion where the first connecting portion 16A and the second connecting portion 16B face each other is viewed from the upper surface, the intersection of the fifth intermediate lattice 20e and the seventh intermediate lattice 20g of the second connecting portion 16B is located at the second of the first large lattice 14A. The substantially center of the middle lattice 20b, the intersection of the sixth intermediate lattice 20f and the eighth intermediate lattice 20h of the second connecting portion 16B is located substantially at the center of the third intermediate lattice 20c of the first large lattice 14A, and the first intermediate lattice 20a~8th grid 20h The combination is formed into a form in which a plurality of small lattices 18 are formed. In other words, in the portion where the first connecting portion 16A and the second connecting portion 16B face each other, a combination of the first connecting portion 16A and the second connecting portion 16B forms a plurality of small lattices 18, and the surrounding configuration The small lattice 18 of the first large lattice 14A or the small lattice 18 constituting the second large lattice 14B are not distinguished, and the visibility is improved.

In the present embodiment, a plurality of first terminals 116a are formed in the central portion in the longitudinal direction of the peripheral portion of one long side of the first conductive sheet 10A in the terminal wiring portion 114, and one long side of the second conductive sheet 10B is formed. A plurality of second terminals 116b are formed in a central portion in the longitudinal direction of the peripheral portion. In particular, in the example of FIG. 3, the first terminal 116a and the second terminal 116b are arranged in a state in which they are not overlapped, and the first terminal wiring pattern 41a and the second terminal wiring pattern 41b are not vertically overlapped. In addition, for example, the first terminal 116a and the second terminal wiring pattern 41b of the odd number may be vertically overlapped.

Thereby, it is possible to pass through two connectors (the first terminal connector and the second terminal connector) or one connector (the composite connector connected to the first terminal 116a and the second terminal 116b) and the cable (cable) The plurality of first terminals 116a and the plurality of second terminals 116b are electrically connected to the control circuit.

In addition, since the first terminal wiring pattern 41a and the second terminal wiring pattern 41b are not vertically overlapped, generation of parasitic capacitance between the first terminal wiring pattern 41a and the second terminal wiring pattern 41b can be suppressed, and the decrease in response speed can be suppressed.

Since the first junction portion 40a is arranged along one long side of the sensor portion 112, and the second junction portion 40b is arranged along the short sides of both sides of the sensor portion 112, the area of the terminal wiring portion 114 can be reduced. Such a situation can promote miniaturization of the display panel 110 including the touch panel 100, and can cause the display screen 110a to give a large impression. In addition, the operability as the touch panel 100 can also be improved.

In order to further reduce the area of the terminal wiring portion 114, it is conceivable to narrow the distance between the adjacent first terminal wiring patterns 41a and the distance between the adjacent second terminal wiring patterns 41b. However, in this case, it is considered that migration is prevented ( Migration) is preferably 10 μm or more and 50 μm or less.

Further, when viewed from the upper surface, it is conceivable that the area of the terminal wiring portion 114 is reduced by arranging the second terminal wiring pattern 41b between the adjacent first terminal wiring patterns 41a. However, if the pattern is formed, the pattern may be shifted. The first terminal wiring pattern 41a and the second terminal wiring pattern 41b are vertically overlapped, and the parasitic capacitance between the wirings is increased, resulting in a decrease in response speed. Therefore, in the case of such an arrangement, it is preferable to set the distance between the adjacent first terminal wiring patterns 41a to 50 μm or more and 100 μm or less.

When the first multilayer conductive sheet 50A is applied to, for example, the projection type capacitive touch panel 100, the first multilayer conductive sheet 50A can improve the response speed and can facilitate the touch panel 100. Large size. Further, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B is inconspicuous, and a combination of the first connecting portion 16A and the second connecting portion 16B is formed. A plurality of small lattices 18, so there is no bad condition such as partial thick lines, and the overall visibility Sex has changed.

Further, the CR time constant of the plurality of first conductive patterns 22A and the second conductive patterns 22B can be greatly reduced, whereby the response speed can be improved, and position detection within the driving time (scanning time) can be facilitated. In this case, the size of the screen of the touch panel 100 (longitudinal × horizontal size, no thickness) can be increased.

In the first laminated conductive sheet 50A, as shown in FIGS. 4 and 5A, the first conductive pattern 22A is formed on one main surface of the first transparent substrate 12A, and the second conductive layer 22A is formed on one main surface of the second transparent substrate 12B. In addition to the conductive pattern 22B, as shown in FIG. 5B, the first conductive pattern 22A may be formed on one main surface of the first transparent substrate 12A, and the second surface of the first transparent substrate 12A may be formed on the other main surface. Conductive pattern 22B. In this case, the second transparent substrate 12B is not present, and the first transparent substrate 12A is laminated on the second conductive portion 13B, and the first conductive portion 13A is laminated on the first transparent substrate 12A. Further, another layer may be present between the first conductive sheet 10A and the second conductive sheet 10B. When the first conductive pattern 22A and the second conductive pattern 22B are insulated, the conductive patterns may be arranged to face each other.

At this time, as schematically shown in FIGS. 8A to 8C, three constitutional aspects can be preferably employed.

In other words, the first configuration example shown in FIG. 8A has the following configuration, and the first laminated conductive sheet 50A shown in FIG. 5B is laminated on the display device 108 via the transparent adhesive 120 (the first conductive portion 13A and the first transparent portion). Further, a base layer 12A and a second conductive portion 13B) are further provided with a hard coat layer 122 on the first build-up conductive sheet 50A, and an anti-reflection layer is laminated on the hard coat layer 122. 124. Here, the touch panel 100 is constituted by the transparent adhesive 120, the second conductive portion 13B, the first transparent substrate 12A, and the first conductive portion 13A on the display device 108, and the hard coat layer 122 on the touch panel 100 is formed. And the anti-reflection layer 124 constitutes an anti-reflection film 126.

The second configuration example shown in FIG. 8B has a configuration in which the first build-up conductive sheet 50A and the protective resin layer 128 shown in FIG. 5B are laminated on the display device 108 via the transparent adhesive 120, and further, the protective resin A hard coat layer 122 is laminated on the layer 128, and an anti-reflection layer 124 is laminated on the hard coat layer 122. Here, the transparent adhesive 120, the second conductive portion 13B, the first transparent substrate 12A, the first conductive portion 13A, and the protective resin layer 128 on the display device 108 constitute the touch panel 100 from the touch panel 100. The hard coat layer 122 and the anti-reflection layer 124 constitute an anti-reflection film 126.

The third configuration example shown in FIG. 8C has a configuration in which the first build-up conductive sheet 50A and the second transparent adhesive 120B shown in FIG. 5B are laminated on the display device 108 via the first transparent adhesive 120A. A transparent film 130 is laminated on the second transparent adhesive 120B, and a hard coat layer 122 is laminated on the transparent film 130, and an anti-reflection layer 124 is laminated on the hard coat layer 122. Here, the touch panel 100 is configured by the first transparent adhesive 120A, the second conductive portion 13B, the first transparent substrate 12A, the first conductive portion 13A, and the second transparent adhesive 120B on the display device 108. The transparent film 130, the hard coat layer 122, and the anti-reflection layer 124 on the touch panel 100 constitute an anti-reflection film 126.

Further, as shown in FIG. 3, it is preferable to form the first conductive sheet 10A and the second portion at, for example, corner portions of the first conductive sheet 10A and the second conductive sheet 10B. The positioning first alignment mark 118a and the second alignment mark 118b used when the conductive sheet 10B is bonded together. When the first conductive sheet 10A and the second conductive sheet 10B are bonded together to form the first laminated conductive sheet 50A, the first alignment mark 118a and the second alignment mark 118b form a new composite alignment mark, and the composite is formed. The alignment mark also functions as an alignment mark for positioning when the first build-up conductive sheet 50A is placed on the display panel 110.

Next, a conductive sheet for a touch panel (hereinafter referred to as a second build-up conductive sheet 50B) according to the second embodiment will be described with reference to FIG. 9 to FIG.

As shown in FIG. 9, the second build-up conductive sheet 50B has substantially the same configuration as the first laminated conductive sheet 50A, but differs in the following points: as shown in FIG. 10, the first side portion 28a of the first large lattice 14A The fourth side portion 28d has a rectangular wave shape in which two or more rectangular shapes are arranged. As shown in Fig. 11, the fifth side portion 28e to the eighth side portion 28h of the second large lattice 14B have two A rectangular wave shape in which a plurality of rectangular shapes are arranged.

Specifically, in the first large lattice 14A, the comb teeth 32 of the first side portion 28a and the second side portion 28b of the first large lattice 14A of the first conductive sheet 10A shown in FIG. 1 are separated one by one. In the form of arranging the small lattices 18 one by one, the linear portions 30 of the third side portion 28c and the fourth side portion 28d are separated one by one, and the small lattices 18 are arranged one by one. As shown in FIG. 10, each of the first side portion 28a to the fourth side portion 28d of the first large lattice 14A of the second laminated conductive sheet 50B has a rectangular shape in which two or more rectangular shapes are arranged. The wave shape, in particular, the first side portion 28a of the first large lattice 14A and The rectangular wave shape of the fourth side portion 28d facing the first side portion 28a is different from each other, and the second side portion 28b of the first large lattice 14A and the third side portion facing the second side portion 28b are formed. The rectangular wave shapes of 28c are different from each other.

Similarly, in the second large lattice 14B, the fifth side portion 28e of the second large lattice 14B and the comb teeth 32 of the seventh side portion 28g of the second conductive sheet 10B shown in Fig. 6 are connected one by one. In a form in which the small lattices 18 are arranged one by one, the linear portions 30 of the sixth side portion 28f and the eighth side portion 28h are separated one by one, and the small lattices 18 are arranged one by one. As shown in FIG. 11, the fifth side portion 28e to the eighth side portion 28h of the second large lattice 14B of the second conductive sheet 10B have a rectangular wave shape in which two or more rectangular shapes are arranged. In particular, the rectangular shape of the fifth side portion 28e of the second large lattice 14B and the eighth side portion 28h facing the fifth side portion 28e are different from each other, and the sixth side portion of the second large lattice 14B is made different. The shape of each rectangular wave of 28f and the seventh side portion 28g facing the sixth side portion 28f are different from each other.

When the first conductive sheet 10A is laminated on the second conductive sheet 10B to form the second laminated conductive sheet 50B, as shown in FIG. 12, it is the same as in the case of the first laminated conductive sheet 50A (see FIG. 7). The first connection portion 16A of the first conductive pattern 22A and the second connection portion 16B of the second conductive pattern 22B are opposed to each other with the first transparent substrate 12A (see FIG. 5A) interposed therebetween, and the first insulation of the first conductive pattern 22A The portion 24A and the second insulating portion 24B of the second conductive pattern 22B are opposed to each other with the first transparent substrate 12A interposed therebetween. Further, the first conductive pattern 22A and the second conductive pattern 22B have the same line width, but in FIG. 12, the same as FIG. The positions of the first conductive pattern 22A and the second conductive pattern 22B are clear, and the line width of the first conductive pattern 22A is made thicker in the drawing, and the line width of the second conductive pattern 22B is made thinner.

When the laminated first conductive sheet 10A and the second conductive sheet 10B are viewed from the upper surface, the second conductive sheet 10B is arranged so as to fill the gap between the first large lattices 14A formed on the first conductive sheet 10A. The form of the second large lattice 14B. At this time, the opening portions of the rectangular wave-shaped concave portions 42a of the first side portion 28a and the second side portion 28b of the first large lattice 14A are the sixth side portion 28f and the eighth side portion 28h of the second large lattice 14B. The shape in which the distal end portions of the rectangular wave-shaped convex portions 42b are connected to each other is such that the small lattices 18 are continuously arranged. Similarly, the rectangular waves of the third side portion 28c and the fourth side portion 28d of the first large lattice 14A are similarly formed. The opening portion of the concave portion 42a of the shape is connected to the distal end portion of each of the rectangular wave-shaped convex portions 42b of the fifth side portion 28e of the second large lattice 14B and the seventh side portion 28g, and as a result, a small lattice is continuously arranged. In the form, it is almost impossible to distinguish the state of the boundary between the first large lattice 14A and the second large lattice 14B. In other words, by the overlap of the opening portion of the rectangular wave-shaped concave portion 42a and the distal end portion of the convex portion 42b, the boundary between the first large lattice 14A and the second large lattice 14B is inconspicuous, and the visibility is improved. In addition, the portion in which the first insulating portion 24A and the second insulating portion 24B face each other is formed with a cross-shaped opening. However, unlike the thick line, the first insulating portion 24A does not block light, and thus is hardly conspicuous to the outside.

The portion where the first connecting portion 16A and the second connecting portion 16B face each other is also the same as the first laminated conductive sheet 50A, and the intersection of the fifth intermediate lattice 20e and the seventh intermediate lattice 20g of the second connecting portion 16B is located at the first connecting portion. 16A The approximate center of the second intermediate lattice 20b, the intersection of the sixth intermediate lattice 20f and the eighth intermediate lattice 20h of the second connecting portion 16B is located substantially at the center of the third intermediate lattice 20c of the first connecting portion 16A, and the first The combination of the middle lattice 20a and the eighth intermediate lattice 20h is a form in which a plurality of small lattices 18 are formed. In other words, in the portion where the first connecting portion 16A and the second connecting portion 16B face each other, a combination of the first connecting portion 16A and the second connecting portion 16B forms a plurality of small lattices 18, and the surrounding configuration The small lattice 18 of the first large lattice 14A or the small lattice 18 constituting the second large lattice 14B are not distinguished, and the visibility is improved.

In the second laminated conductive sheet 50B, the arrangement state of the first junction portion 40a and the second junction portion 40b, and the first terminal wiring pattern 41a and the second terminal wiring pattern 41b in the terminal wiring portion 114 are not shown. The arrangement state, the arrangement state of the first terminal 116a and the second terminal 116b are also the same as those of the first build-up conductive sheet 50A.

When the second laminated conductive sheet 50B is applied to, for example, the projection type capacitive touch panel 100, the second laminated conductive sheet 50B can improve the response speed and can facilitate the touch panel 100. Large size. Further, the boundary between the first large lattice 14A of the first conductive sheet 10A and the second large lattice 14B of the second conductive sheet 10B is inconspicuous, and a combination of the first connecting portion 16A and the second connecting portion 16B is formed. Since a plurality of small lattices 18 are provided, there is no problem such as local occurrence of thick lines, and the overall visibility is good.

In particular, in the second laminated conductive sheet 50B, the four sides (the first side portion 28a to the fourth side portion 28d) of the first large lattice 14A and the second large lattice 14B The four sides (the fifth side portion 28e to the eighth side portion 28h) have a rectangular wave shape, and the shapes of the respective sides are equivalently the same. Therefore, the ends of the first large lattice 14A or the second large lattice 14B can be suppressed. The localization of the charge to prevent false detection of the position of the fingertip.

Further, as shown in FIG. 5A, the second laminated conductive sheet 50B has a projection distance Lf between the straight portion 30 of the side portion of the first large lattice 14A and the straight portion 30 of the side portion of the second large lattice 14B. The length (50 μm to 500 μm) of one side of the lattice 18 is substantially the same. Further, since only the apexes of the rectangular wave shape extending from the respective side portions of the first large lattice 14A and the vertices of the rectangular wave shape extending from the respective side portions of the second large lattice 14B are opposed to each other, the first large lattice 14A and The parasitic capacitance formed between the second large lattices 14B becomes small. As a result, the CR time constant is also reduced, and the detection accuracy can be improved and the response speed can be improved.

Next, a modification of the second build-up conductive sheet 50B will be described with reference to FIGS. 13 and 14.

The first conductive sheet 10Aa of the laminated conductive sheet 50Ba of the modified example has substantially the same configuration as the first conductive sheet 10A (see FIG. 10) of the second laminated conductive sheet 50B, but differs in the following points: The first connecting portion 16A is not formed in a lattice shape but in a substantially zigzag (zigzag) linear shape. The first connecting portion 16A is a boundary portion between the straight portion 30 of the second side portion 28b of the first large lattice 14A and the straight portion 30 of the fourth side portion 28d, and the first side portion 28a of the first large lattice 14A. Between the straight portion 30 and the boundary portion of the straight portion 30 of the third side portion 28c.

Similarly, the second conductive sheet 10Ba has the second laminated conductive sheet The second conductive sheet 10B (see FIG. 11) of 50B has substantially the same configuration, but differs in the following points: as shown in FIG. 14, the second connecting portion 16B is formed in a substantially zigzag shape (zigzag shape) instead of a lattice shape. Linear. The second connecting portion 16B is a boundary portion between the straight portion 30 of the sixth side portion 28f of the second large lattice 14B and the straight portion 30 of the eighth side portion 28h, and the fifth side portion 28e of the second large lattice 14B. Between the straight portion 30 and the boundary portion of the straight portion 30 of the seventh side portion 28g.

Moreover, the width Wc1 of the first connecting portion 16A (the distance between one inflection point and the other inflection point and along the y direction) satisfies Wc1>Ps/ , here is 2×(Ps/ ). Similarly, the width Wc2 of the second connecting portion 16B (the distance between one inflection point and the other inflection point and along the x direction) satisfies Wc2>Ps/ , here is 2×(Ps/ ).

When the laminated conductive sheet 50Ba of the present modification is applied to, for example, a projection type capacitive touch panel, the laminated conductive sheet 50Ba can improve the response speed and can promote the size of the touch panel. .

In the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba), when the width of the first connecting portion 16A and the width of the second connecting portion 16B are too large, the arrangement of the large lattices 14 may become difficult. Variation, so the upper limit is preferably 2 × (Ps / )~20×(Ps/ ), more preferably 8 × (Ps / )~14×(Ps/ ).

In the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba), the size of the small lattice 18 (the length of one side or the length of the diagonal line) or the small lattice constituting the first large lattice 14A. The number of 18s and the number of small lattices 18 constituting the second large lattice 14B may also be applied according to the application. The size or resolution (number of wirings) of the touch panel is appropriately set.

In the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba), the arrangement pitch Pm of the intermediate lattices 20 constituting the first connecting portion 16A and the second connecting portion 16B is set to the arrangement pitch Ps of the small lattices 18 In addition to this, it can be arbitrarily set to 1.5 times, 3 times, etc. according to the number of medium grids. When the arrangement pitch Pm of the intermediate lattices 20 is too narrow or too large, the arrangement of the first large lattice 14A or the second large lattice 14B becomes difficult, and the appearance is deteriorated. Therefore, the arrangement pitch Ps of the small lattices 18 is preferable. 1 to 10 times, more preferably 1 to 5 times.

Further, the size of the small lattice 18 (the length of one side or the length of the diagonal line), the number of the small lattices 18 constituting the first large lattice 14A, and the number of the small lattices 18 constituting the second large lattice 14B may be It is set as appropriate according to the size or resolution (number of wirings) of the touch panel to be applied.

In the above example, the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) are applied to the projection type capacitive touch panel 100, and of course, it can be applied to the surface. A capacitive touch panel or a resistive touch panel.

Next, as a method of producing the first conductive sheet 10A (10Aa) or the second conductive sheet 10B (10Ba), for example, an emulsion containing a photosensitive silver halide salt can be applied to the first transparent substrate 12A and the second transparent substrate 12B. The photosensitive material of the layer is exposed and subjected to development processing, whereby the metal silver portion and the light transmissive portion are formed in the exposed portion and the unexposed portion, respectively, and the first conductive pattern 22A and the second conductive pattern 22B are formed. Furthermore, the metal silver portion can be further subjected to physical development and/or electroplating treatment, thereby making the metal silver portion Carrying a conductive metal.

On the other hand, when the first conductive pattern 22A is formed on one main surface of the first transparent substrate 12A and the second conductive pattern 22B is formed on the other main surface of the first transparent substrate 12A, as shown in FIG. 5B, If the first main surface is exposed by exposure and then the other main surface is exposed in accordance with a usual method, the desired first conductive pattern 22A and second conductive pattern 22B may not be obtained. In particular, it is difficult to uniformly form a pattern in which the comb teeth 32 are extended from the side portions of the first large lattice 14A and the second large lattice 14B, or a rectangular wave shape is extended from the side portions of the first large lattice 14A and the second large lattice 14B. picture of.

Therefore, the manufacturing method shown below can be preferably employed.

That is, the photosensitive silver halide emulsion layer formed on both surfaces of the first transparent substrate 12A is collectively exposed, and the first conductive pattern 22A is formed on one main surface of the first transparent substrate 12A, and the other is formed on the first transparent substrate 12A. The second conductive pattern 22B is formed on the main surface.

A specific example of the manufacturing method will be described with reference to Figs. 15 to 17 .

First, in step S1 of Fig. 15, a long photosensitive material 140 is produced. As shown in FIG. 16A, the photosensitive material 140 has a first transparent substrate 12A, a light-forming silver halide emulsion layer (hereinafter referred to as a first photosensitive layer 142a) formed on one main surface of the first transparent substrate 12A, and a formation. A photosensitive silver halide emulsion layer (hereinafter referred to as a second photosensitive layer 142b) on the other main surface of the first transparent substrate 12A.

In step S2 of Fig. 15, the photosensitive material 140 is exposed. In the exposure processing, the first exposure processing and the second exposure processing are performed (both sides are the same) In the first exposure process, the first photosensitive layer 142a is irradiated with light toward the first transparent substrate 12A, and the first photosensitive layer 142a is exposed along the first exposure pattern, and the second exposure process is the second exposure process. The photosensitive layer 142b is irradiated with light toward the first transparent substrate 12A, and the second photosensitive layer 142b is exposed along the second exposure pattern (both surfaces are simultaneously exposed). In the example of FIG. 16B, on the one hand, the long photosensitive material 140 is conveyed in one direction, and the first photosensitive layer 142a is shielded from the first light-receiving layer 146a by the first light 144a (parallel light), and the second light is applied to the first light-receiving layer 142a. The photosensitive layer 142b is irradiated with the second light 144b (parallel light) via the second mask 146b. The first light 144a is obtained by converting the light emitted from the first light source 148a into parallel light by the first collimating lens 150a in the advantageous use, and the second light 144b is obtained by the second collimating lens 150b in the advantageous use. The light emitted from the second light source 148b is converted into parallel light and obtained. In the example of FIG. 16B, when two light sources (the first light source 148a and the second light source 148b) are used, light emitted from one light source may be divided by the optical system to form the first light 144a and the first light. The light 144b is irradiated to the first photosensitive layer 142a and the second photosensitive layer 142b.

Then, in step S3 of FIG. 15, the exposed photosensitive material 140 is subjected to development processing, whereby the first laminated conductive sheet 50A is produced as shown in FIG. 5B. The first laminated conductive sheet 50A includes a first transparent substrate 12A, a first conductive portion 13A (such as a first conductive pattern 22A) formed along a first exposure pattern formed on one main surface of the first transparent substrate 12A, and a first transparent layer 12A. The second conductive portion 13B (the second conductive pattern 22B or the like) according to the second exposure pattern on the other main surface of the first transparent substrate 12A. Furthermore, the exposure time and development time of the first photosensitive layer 142a and the second photosensitive layer 142b are rooted. There are various changes depending on the type of the first light source 148a and the second light source 148b, the type of the developer, and the like. Therefore, the preferred numerical range is not always limited, but the exposure time is adjusted to 100% of the development rate and Development time.

In the manufacturing method of the first embodiment, as shown in FIG. 17, the first photomask 146a is placed in close contact with each other on the first optical layer 142a, and the first photomask 146a is disposed opposite to the first photomask 146a. The light source 148a irradiates the first light 144a toward the first mask 146a, thereby exposing the first photosensitive layer 142a. The first photomask 146a is composed of a glass substrate formed of transparent soda glass and a mask pattern (first exposure pattern 152a) formed on the glass substrate. Therefore, the portion of the first photosensitive layer 142a along the first exposure pattern 152a formed on the first mask 146a is exposed by the first exposure processing. A gap of about 2 μm to 10 μm may be provided between the first photosensitive layer 142a and the first mask 146a.

Similarly, in the second exposure processing, for example, the second photomask 146b is placed in close contact with the second photosensitive layer 142b, and the second light source 148b disposed to face the second mask 146b is irradiated with the second light toward the second mask 146b. 144b, thereby exposing the second photosensitive layer 142b. Similarly to the first mask 146a, the second mask 146b is composed of a glass substrate formed of transparent soda glass and a mask pattern (second exposure pattern 152b) formed on the glass substrate. Therefore, the portion of the second photosensitive layer 142b along the second exposure pattern 152b formed on the second mask 146b is exposed by the second exposure processing. At this time, a gap of about 2 μm to 10 μm may be provided between the second photosensitive layer 142b and the second mask 146b.

In the first exposure processing and the second exposure processing, the emission timing of the first light 144a from the first light source 148a and the emission timing of the second light 144b from the second light source 148b may be simultaneously set, and the emission may be performed. The timing is different. At the same time, the first photosensitive layer 142a and the second photosensitive layer 142b can be simultaneously exposed by one exposure process, and the processing time can be shortened.

Further, when the first photosensitive layer 142a and the second photosensitive layer 142b are not spectrally sensitized, if the photosensitive material 140 is exposed from both sides, the exposure from one side will be on the other side (back side). Image formation has an impact.

In other words, the first light 144a from the first light source 148a that has reached the first photosensitive layer 142a is scattered by the silver halide particles in the first photosensitive layer 142a, and passes through the first transparent substrate 12A as scattered light, and a part of the light reaches the first transparent substrate 12A. The second photosensitive layer 142b. Then, a large range of the boundary portion between the second photosensitive layer 142b and the first transparent substrate 12A is exposed to form a latent image. Therefore, in the second photosensitive layer 142b, exposure of the second light 144b from the second light source 148b and exposure of the first light 144a from the first light source 148a are performed, and in the subsequent development processing, the first laminated conductive layer is formed. In the sheet 50A, in addition to the conductive pattern (second conductive portion 13B) obtained by the second exposure pattern 152b, a thin conductive layer formed by the first light 144a from the first light source 148a is formed between the conductive patterns. The desired pattern (the pattern along the second exposure pattern 152b) cannot be obtained. This case is also the same in the first photosensitive layer 142a.

The inventors of the present invention conducted intensive studies to avoid such a situation, and as a result, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b is set to a specific range, or the first photosensitive layer 142a and the second photosensitive layer are defined. The amount of silver applied to 142b, the silver halide itself absorbs light, and can restrict light transmission toward the back surface. In the present embodiment, the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b can be set to 1 μm or more and 4 μm or less. The upper limit is preferably 2.5 μm. Further, the amount of silver applied to the first photosensitive layer 142a and the second photosensitive layer 142b is set to 5 g/m ² to 20 g/m ² .

In the exposure method in which the two surfaces are in close contact with each other, image defects caused by dust or the like adhering to the surface of the film are prevented from being exposed. It is known that the conductive material is applied to the film, but the metal oxide or the like remains after the treatment, which impairs the transparency of the final product, and the conductive polymer has problems in storage stability and the like. . Therefore, the present inventors conducted intensive studies, and as a result, it has been found that the silver/bonding of the first photosensitive layer 142a and the second photosensitive layer 142b can be specified by obtaining a silver halide having a reduced binder amount to obtain conductivity necessary for antistatic property. The volume ratio of the agent. That is, the silver/adhesive volume ratio of the first photosensitive layer 142a and the second photosensitive layer 142b is 1/1 or more, preferably 2/1 or more.

As described above, by setting and defining the thickness of the first photosensitive layer 142a and the second photosensitive layer 142b, the amount of applied silver, and the volume ratio of the silver/binder, as shown in FIG. 17, the first photosensitive layer 142a is reached. The first light 144a from the first light source 148a does not reach the second photosensitive layer 142b, and the second light 144b from the second light source 148b that has reached the second photosensitive layer 142b does not reach the first photosensitive layer 142a. When the first build-up conductive sheet 50A is formed by the development process thereafter, as shown in FIG. 5B, only the conductive pattern obtained by the first exposure pattern 152a is formed on one main surface of the first transparent substrate 12A (constituting the first conductive portion). 13A pattern), in the first transparent Only the conductive pattern (the pattern constituting the second conductive portion 13B) obtained by the second exposure pattern 152b is formed on the other main surface of the base 12A, and a desired pattern can be obtained.

As described above, in the above-described manufacturing method using the double-sided exposure, the first photosensitive layer 142a and the second photosensitive layer 142b having both conductivity and double-sided exposure can be obtained, and the first transparent substrate 12A can be used once. In the exposure process, the same pattern or a different pattern is arbitrarily formed on both surfaces of the first transparent substrate 12A, whereby the electrodes of the touch panel 100 can be easily formed, and the touch panel 100 can be made thinner (lower). .

The above example is a method of producing the first conductive pattern 22A and the second conductive pattern 22B using a photosensitive silver halide emulsion layer, and other manufacturing methods have the following manufacturing methods.

In other words, the resist film formed on the copper foil formed on the first transparent substrate 12A and the second transparent substrate 12B may be exposed and developed to form a resist pattern, and the copper foil exposed from the resist pattern may be etched. Thereby, the first conductive pattern 22A and the second conductive pattern 22B are formed.

Alternatively, a slurry containing metal fine particles may be printed on the first transparent substrate 12A and the second transparent substrate 12B, and the slurry may be subjected to metal plating to form the first conductive pattern 22A and the second conductive pattern 22B.

The first conductive pattern 22A and the second conductive pattern 22B may be printed on the first transparent substrate 12A and the second transparent substrate 12B by a screen printing plate or a gravure printing plate.

The first conductive pattern 22A and the second conductive pattern 22B may be formed by inkjet on the first transparent substrate 12A and the second transparent substrate 12B.

In the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) of the present embodiment, a method of using a silver halide photographic light-sensitive material as a particularly preferable embodiment will be mainly described.

The method for producing the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) according to the present embodiment includes the following three aspects depending on the form of the photosensitive material and the development processing.

(1) Chemically developing or thermally developing a photosensitive silver halide black-and-white photosensitive material containing no physical developing core to form a metallic silver portion on the photosensitive material.

(2) Dissolving physical development of a photosensitive silver halide black-and-white photosensitive material containing a physical development nucleus in a silver halide emulsion layer, and forming a metallic silver portion on the photosensitive material.

(3) A photosensitive silver halide black-and-white photosensitive material containing no physical development core is superposed on a developing sheet having a non-photosensitive layer containing a physical development nucleus, and diffusion-transfer development is carried out to form a metal on the non-photosensitive display sheet. The state of the silver department.

The aspect of the above (1) is an integrated black-and-white development type, and a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The resulting developed silver is chemically developed silver or thermally developed silver, which is highly active in subsequent plating or physical development in terms of a filament having a high specific surface.

In the aspect of the above (2), the silver halide particles in the vicinity of the physical development nucleus are dissolved and deposited on the developing nucleus in the exposed portion, whereby a light-transmitting conductive film such as a light-transmitting conductive film is formed on the photosensitive material. The aspect of (2) is also an integrated black and white development type. Analysis due to development on the physical development nucleus Out, the activity is high, but the developed silver is spherical smaller than the surface.

In the aspect of the above (3), the silver halide particles are dissolved and diffused in the unexposed portion, and are deposited on the developing core on the developing sheet, thereby forming a light-transmitting conductive film such as a light-transmitting conductive film on the developing sheet. Sex film. The aspect of the (3) is a so-called separate type, and is an aspect used for peeling off a developing sheet from a photosensitive material.

Any of the negative development processing and the reverse development processing may be selected in any of the aspects (in the case of the diffusion transfer method, by using an auto positive type photosensitive material as a photosensitive material, it is possible to realize Negative development processing).

Here, chemical development, thermal development, dissolved physical development, and diffusion transfer development refer to the meaning of the term as used in the industry. In general textbooks of photographic chemistry, such as Kikuchi, "Photography Chemistry" (Kyoritsu Press, Issued in 1955), CEK Mees, "The Theory of Photographic Processes, 4th ed." (Mcmillan, 1977). This case is an invention related to liquid processing, but it is also possible to refer to a technique in which a thermal development method is applied as another development method. For example, Japanese Laid-Open Patent Publication No. 2004-184693, Japanese Patent Laid-Open No. 2004-334077, Japanese Patent Laid-Open No. Hei No. 2005-010752, Japanese Patent Application No. 2004-244080, Japanese Patent Application No. 2004-085655 The technology described in each specification.

Here, the configuration of each layer of the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) of the present embodiment will be described in detail below.

[First transparent substrate 12A, second transparent substrate 12B]

Examples of the first transparent substrate 12A and the second transparent substrate 12B include a plastic film, a plastic plate, and a glass plate.

For the raw materials of the plastic film and the plastic plate, for example, polyesters such as polyethylene terephthalate (PET) and polyethylene naphthalate (PEN); polyethylene (PE) and polypropylene (PP) can be used. Polyolefins such as polystyrene, EVA (Ethylene Vinyl Acetate), and vinyl resins; in addition, polycarbonate (PC), polyamide, polyimine, acrylic acid can be used. Resin, triethyl cellulose (TAC), and the like.

The first transparent substrate 12A and the second transparent substrate 12B are preferably PET (melting point: 258 ° C), PEN (melting point: 269 ° C), PE (melting point: 135 ° C), PP (melting point: 163 ° C), The melting point of polystyrene (melting point; 230 ° C), polyvinyl chloride (melting point: 180 ° C), polyvinylidene chloride (melting point: 212 ° C) or TAC (melting point: 290 ° C) is about 290 ° C The following plastic film or plastic plate is preferably PET in terms of light transmittance or workability. The conductive film such as the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) used in the first laminated conductive sheet 50A or the second laminated conductive sheet 50B (50Ba) is required to have transparency, and therefore it is preferably The transparency of the transparent substrate 12A and the second transparent substrate 12B is high.

[Silver Salt Emulsion Layer]

The conductive layer (the first large lattice 14A, the first connecting portion 16A, the second large lattice 14B, the second connecting portion 16B, the small lattice 18, etc.) of the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) The silver salt emulsion layer of the conductive portion contains an additive such as a solvent or a dye in addition to the silver salt and the binder.

The silver salt used in the present embodiment may, for example, be an inorganic silver salt such as silver halide or an organic silver salt such as silver acetate. In the present embodiment, it is preferable to use silver halide which is excellent in characteristics as a photosensor.

The amount of coated silver (coating amount of the silver salt) of the silver salt emulsion layer is preferably 1 g/m ² to 30 g/m ² , more preferably 1 g/m ² to 25 g/m ² , and more preferably 1 g/m ² to 25 g/m ² . 5g/m ² ~ 20g/m ² . By setting the amount of coated silver to the above range, a desired surface resistance can be obtained when the first build-up conductive sheet 50A or the second build-up conductive sheet 50B (50 Ba) is formed.

Examples of the binder used in the present embodiment include gelatin, polyvinyl alcohol (PVA), polyvinylpyrrolidone (PVP), polysaccharides such as starch, cellulose and derivatives thereof, and polyvinyloxide. ), polyvinylamine, chitosan, polylysine, polyacrylic acid, polyalginic acid, polyhyaluronic acid, carboxy cellulose, and the like. These binders have neutral, anionic, and cationic properties depending on the ionicity of the functional groups.

The content of the binder contained in the silver salt emulsion layer of the present embodiment is not particularly limited, and can be appropriately determined within a range in which dispersibility and adhesion can be exhibited. The content of the binder in the silver salt emulsion layer is preferably 1/4 or more, more preferably 1/2 or more in terms of a silver/binder volume ratio. The volume of the silver/binder is preferably 100/1 or less, more preferably 50/1 or less. Further, the silver/binder volume ratio is preferably from 1/1 to 4/1, and most preferably from 1/1 to 3/1. By setting the silver/binder volume ratio in the silver salt emulsion layer to this range, unevenness in resistance value can be suppressed even when the amount of coated silver is adjusted, and the first laminated conductive sheet 50A having uniform surface resistance can be obtained or The second build-up conductive sheet 50B. Furthermore, the silver/gluer body The product ratio can be converted into silver amount/adhesive amount (volume ratio) by converting the amount of silver halide/binder (weight ratio) of the raw material into silver amount/binder amount (weight ratio). It is obtained by comparison.

<solvent>

The solvent for forming the silver salt emulsion layer is not particularly limited, and examples thereof include water and an organic solvent (for example, an alcohol such as methanol, a ketone such as acetone, a guanamine such as formamide, or an anthraquinone such as dimethyl hydrazine. , an ester such as ethyl acetate, an ether or the like), an ionic liquid, and a mixed solvent of the solvents.

The content of the solvent to be used in the silver salt emulsion layer of the present embodiment is in the range of 30% by weight to 90% by weight, preferably 50% by weight to 80% by weight based on the total weight of the silver salt, the binder, and the like contained in the silver salt emulsion layer. The scope.

<Other additives>

The various additives used in the present embodiment are not particularly limited, and known additives can be preferably used.

[Other layer composition]

A protective layer (not shown) may be provided on the silver salt emulsion layer. In the present embodiment, the term "protective layer" means a layer formed of a binder such as gelatin or a polymer, and is formed into a photosensitive silver salt emulsion in order to exhibit an effect of preventing scratches or improving mechanical properties. On the floor. The thickness thereof is preferably 0.5 μm or less. The coating method and the formation method of the protective layer are not particularly limited, and a known coating method and formation method can be appropriately selected. Further, for example, an undercoat layer may be provided further below the silver salt emulsion layer 16.

Next, each step of the method of producing the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) will be described.

[exposure]

In the present embodiment, the first conductive pattern 22A and the second conductive pattern 22B are applied by printing, and the first conductive pattern 22A and the second conductive pattern 22B are formed by exposure, development, or the like in addition to the printing method. . That is, the photosensitive material having the layer containing the silver salt provided on the first transparent substrate 12A and the second transparent substrate 12B or the photosensitive material coated with the photopolymer for photolithography is exposed. Exposure can be performed using electromagnetic waves. Examples of the electromagnetic wave include visible light, ultraviolet light, and the like, and radiation such as X-ray. Further, a light source having a wavelength distribution or a light source having a specific wavelength may be used for the exposure.

[development processing]

In the present embodiment, after the emulsion layer is exposed, development processing is further performed. For the development treatment, a technique of usual development treatment used for a silver salt photographic film or a printing paper, a film for printing plate, a latex mask for a photomask, or the like can be used. The developer is not particularly limited, and a PQ developer, an MQ developer, a MAA developer, or the like may be used. For commercial products, for example, CN-16, CR-56, CP45X, FD-3, and Papitol formulated by Fujifilm Co., Ltd. may be used. A developing solution contained in a developing solution such as C-41, E-6, RA-4, D-19, D-72 or a kit thereof prepared by KODAK. Alternatively, a lithographic developer can be used.

The development treatment of the present invention may include a fixing treatment for achieving stabilization in order to remove the silver salt of the unexposed portion. The fixing treatment of the present invention can be carried out using a silver salt photographic film or a printing paper, a film for printing plate, a latex mask for a mask, and the like.

The fixing temperature in the above fixing step is preferably from about 20 ° C to about 50 ° C, and more preferably from 25 ° C to 45 ° C. In addition, the fixed time is preferably from 5 seconds to 1 minute, and more preferably from 7 seconds to 50 seconds. The amount of the fixing liquid to be added is preferably 600 ml/m ² or less, more preferably 500 ml/m ² or less, and particularly preferably 300 ml/m ² or less, based on the amount of the photosensitive material.

The photosensitive material subjected to development and fixation treatment is preferably subjected to a water washing treatment or a stabilization treatment. In the water washing treatment or the stabilization treatment, the amount of the water washing water is usually 20 L or less with respect to 1 m ^{2 of the} photosensitive material, and can be carried out with a replenishing amount of 3 L or less (including 0, that is, water washing).

The weight of the metallic silver contained in the exposed portion after the development treatment is preferably 50% by weight or more, more preferably 80% by weight or more, based on the weight of the silver contained in the exposed portion before the exposure. When the weight of the silver contained in the exposed portion is 50% by weight or more based on the weight of the silver contained in the exposed portion before the exposure, high conductivity can be obtained, which is preferable.

The gray scale after the development treatment in the present embodiment is not particularly limited, but is preferably more than 4.0. When the gradation after the development treatment exceeds 4.0, the conductivity of the conductive metal portion can be improved while maintaining the light transmittance of the light-transmitting portion high. Examples of the method of setting the gradation to 4.0 or more include doping of the above-described cerium ions and cerium ions.

The conductive sheet can be obtained through the above steps, and the surface resistance of the obtained conductive sheet is preferably in the range of 0.1 Ω/sq. to 100 Ω/sq. The lower limit is preferably 1 Ω/sq. or more, more preferably 3 Ω/sq. or more, further preferably 5 Ω/sq. or more, and further preferably 10 Ω/sq. The upper limit is preferably 70 Ω/sq. or less, more preferably 50 Ω/sq. or less. In addition, the conductive sheet after the development process can be further subjected to calendering treatment, and can be adjusted to a desired surface electric power by calendering treatment. Resistance.

[Physical development and plating treatment]

In the present embodiment, in order to improve the conductivity of the metal silver portion formed by the exposure and development processes, physical development and/or plating treatment for carrying the conductive metal particles on the metal silver portion may be performed. In the present invention, the metallic silver portion may carry the conductive metal particles by any of physical development or plating treatment, or the metal silver portion may be carried by the physical development and the plating treatment. Further, a portion obtained by subjecting the metal silver portion to physical development and/or plating treatment is referred to as a "conductive metal portion".

The term "physical development" in the present embodiment means that metal ions such as silver ions are reduced by a reducing agent on a core of a metal or a metal compound to precipitate metal particles. This physical phenomenon is used in one-time black and white film (one-step B&W film), one-step slide film or printing plate manufacturing, and the like, which can be used in the present invention.

Further, the physical development may be performed simultaneously with the development processing after the exposure, or may be additionally performed after the development processing.

In the present embodiment, electroplating treatment may be performed by electroless plating (chemical reduction plating or displacement plating), electrolytic plating, or electroless plating or electrolytic plating. In the electroless plating of the present embodiment, a known electroless plating technique can be used. For example, an electroless plating technique used in a printed wiring board or the like can be used, and electroless plating is preferably electroless copper plating.

[Oxidation treatment]

In the present embodiment, it is preferable that the metal silver portion after the development treatment and the conductive metal portion formed by the physical development and/or the plating treatment are subjected to an oxidation treatment.

When the oxidation treatment is performed, for example, when a metal is slightly deposited on the light-transmitting portion, the metal can be removed to make the transmittance of the light-transmitting portion almost 100%.

[Electrically conductive metal part]

The lower limit of the line width (the line width of the first conductive portion 13A and the second conductive portion 13B) of the conductive metal portion of the present embodiment is preferably 1 μm or more, 3 μm or more, 4 μm or more, or 5 μm or more, and the upper limit is preferably 10 μm or less. , 9 μm or less, and 8 μm or less. When the line width is less than the above lower limit value, the conductivity becomes insufficient, and the detection sensitivity becomes insufficient when used for the touch panel 100. On the other hand, when the line width exceeds the above upper limit value, the moire caused by the conductive metal portion becomes conspicuous, or when the touch panel 100 is used, the visibility is deteriorated. Further, by setting within the above range, the streaks of the conductive metal portion are improved, and the visibility is particularly excellent. The line spacing (here, the interval between the sides of the small lattices 18 facing each other) is preferably 30 μm or more and 500 μm or less, more preferably 50 μm or more and 400 μm or less, and most preferably 100 μm or more and 350 μm or less. Further, the conductive metal portion may have a portion having a line width wider than 200 μm to perform grounding or the like.

In the conductive metal portion of the present embodiment, the aperture ratio is preferably 85% or more, more preferably 90% or more, and most preferably 95% or more in terms of visible light transmittance. The aperture ratio means the first large lattice 14A, the first connection portion 16A, the second large lattice 14B, the second connection portion 16B, and the small lattice. The proportion of the light-transmitting portion other than the conductive portion such as 18 is as a whole, and for example, a square lattice-like aperture ratio of a line width of 15 μm and a pitch of 300 μm is 90%.

[Translucent part]

The "translucent portion" of the present embodiment refers to a portion having light transmissivity other than the conductive metal portion in the first conductive sheet 10A and the second conductive sheet 10B. As described above, the transmittance of the translucent portion is the transmittance of the minimum value of the transmittance in the wavelength region of 380 nm to 780 nm excluding the effects of light absorption and reflection by the first transparent substrate 12A and the second transparent substrate 12B. It is 90% or more, preferably 95% or more, more preferably 97% or more, still more preferably 98% or more, and most preferably 99% or more.

As for the exposure method, a method of interposing a glass mask or a pattern exposure method using laser drawing is preferred.

[First conductive sheet 10A (10Aa) and second conductive sheet 10B (10Ba)]

The thickness of the first transparent substrate 12A and the second transparent substrate 12B in the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) of the present embodiment is preferably 5 μm to 350 μm, and more preferably 30 μm to 150 μm. If it is in the range of 5 μm to 350 μm, the required transmittance of visible light can be obtained, and the operation is also easy.

The thickness of the metal silver portion provided on the first transparent substrate 12A and the second transparent substrate 12B can be appropriately determined depending on the coating thickness of the coating material for the silver salt-containing layer applied on the first transparent substrate 12A and the second transparent substrate 12B. . The thickness of the metal silver portion may be selected from 0.001 mm to 0.2 mm, preferably 30 μm or less, more preferably 20 μm or less, and further preferably 0.01 μm. ~9 μm, preferably 0.05 μm to 5 μm. Further, the metallic silver portion is preferably in the form of a pattern. The metal silver portion may be one layer or may be composed of two or more layers. When the metal silver portion is in the form of a pattern and is composed of a plurality of layers of two or more layers, different color sensitivities can be imparted so that light can be received at different wavelengths. Thereby, if the exposure wavelength is changed and exposure is performed, different patterns can be formed on each layer.

Regarding the thickness of the conductive metal portion, the thinner the thickness of the display panel in the use of the touch panel, the better the viewing angle of the display panel is, and the thinning is also required from the viewpoint of improving visibility. From this point of view, the thickness of the layer formed of the conductive metal carried by the conductive metal portion is preferably less than 9 μm, more preferably 0.1 μm or more and less than 5 μm, and further preferably 0.1 μm or more and less than 3 μm.

In the present embodiment, the metal silver portion having a desired thickness is formed by controlling the coating thickness of the silver salt-containing layer, and the conductive metal particles are freely controlled by physical development and/or plating treatment. Since the thickness of the layer is such that the first conductive sheet 10A (10Aa) and the second conductive sheet 10B (10Ba) having a thickness of less than 5 μm, preferably less than 3 μm, can be easily formed.

Further, in the method of manufacturing the first conductive sheet 10A (10Aa) or the second conductive sheet 10B (10Ba) of the present embodiment, it is not always necessary to perform steps such as plating. The reason for this is that in the method for producing the first conductive sheet 10A (10Aa) or the second conductive sheet 10B (10Ba) of the present embodiment, the silver amount and the silver/binder volume ratio of the silver salt emulsion layer can be adjusted. And get the required surface resistance. Further, calendering treatment or the like may be performed as needed.

(hard film treatment after development treatment)

After the silver salt emulsion layer is subjected to development treatment, it is preferably immersed in a hard coating agent to perform a hard film treatment. Examples of the hardener include glutaraldehyde, adipaldehyde, dialdehyde such as 2,3-dihydroxy-1,4-dioxane, and boric acid, etc., in Japanese Patent Laid-Open No. Hei 2-141279 The hardener described.

[Laminated conductive sheet]

The antireflection film 126 can also be provided for the laminated conductive sheet. In this case, the first to third configuration examples shown in FIGS. 8A to 8C described above can be preferably used.

The anti-reflection film 126 is formed, for example, by forming the hard coat layer 122 and the anti-reflection layer 124 on the first build-up conductive sheet 50A (see the first configuration example and the second configuration example), or forming the transparent film 130 on the first build-up conductive sheet 50A. The hard coat layer 122 and the anti-reflection layer 124 are produced (see the third configuration example).

Hereinafter, a preferred embodiment of the antireflection film 126 will be described with reference to the third configuration example.

<Transparent film 130>

Since the transparent film 130 is used for the viewer side surface of the display device 108, it is required to be a colorless film having high light transmittance and excellent transparency. Such a transparent film 130 is preferably a plastic film. Examples of the polymer forming the plastic film include deuterated cellulose (for example, TAC-TD80U, TD80UF, etc. manufactured by Fujifilm Co., Ltd., triethylene phthalate cellulose, diethyl phthalocyanine, acetaminophen cellulose, acetaminophen醯 cellulose), polyamide, polycarbonate, polyester (eg polyethylene terephthalate, polyethylene naphthalate), polystyrene, polyolefin, norbornene resin (Arton: Product name, JSR (share) manufacturing), Amorphous polyolefin (Zeonex: trade name, manufactured by Zeon, Japan), (meth)acrylic resin (Acrypet VRL20A: trade name, manufactured by Mitsubishi Rayon Co., Ltd., Japanese Patent Laid-Open No. 2004-70296 Or a ring-shaped acrylic resin described in JP-A-2006-171464. Among them, preferred is triethyl hydrazine cellulose, acetamidine cellulose, acetamidine cellulose, polyethylene terephthalate, polyethylene naphthalate, and particularly preferred is triacetyl cellulose. .

<hard coating 122>

In order to impart physical strength to the anti-reflection film 126, it is preferable to provide a hard coat layer 122 on the anti-reflection film 126. The hard coat layer 122 may also be composed of two or more layers.

Regarding the refractive index of the hard coat layer 122, the refractive index is preferably in the range of 1.48 to 1.90, more preferably 1.50 to 1.80, and further preferably 1.52 to 1.65, depending on the optical design of the film for obtaining antireflection. In the present embodiment, since at least one low refractive index layer is provided on the hard coat layer 122, when the refractive index is too small, the antireflection property is lowered, and if it is too large, the color tone of the reflected light tends to be strong.

The hard coat layer 122 has a thickness of usually 0.5 μm to 50 μm, preferably 1 μm to 20 μm, more preferably from the viewpoint of imparting sufficient durability and impact resistance to the antireflection film 126. It is 2 μm to 15 μm, preferably 3 μm to 10 μm. Further, the strength of the hard coat layer 122 is preferably 2H or more, more preferably 3H or more, and most preferably 4H or more in the pencil hardness test. Further, in the Taber test conducted in accordance with JIS K5400, the amount of wear of the test piece before and after the test is preferably as small as possible.

The hard coat layer 122 is preferably formed by a crosslinking reaction or a polymerization reaction of an ionizing radiation curable compound. For example, a composition containing an ionizing radiation-curable polyfunctional monomer or a polyfunctional oligomer may be applied to the transparent film 130 to crosslink the polyfunctional monomer or the polyfunctional oligomer. Or formed by polymerization. The functional group of the ionizing radiation-curable polyfunctional monomer or polyfunctional oligomer is preferably a light, electron beam, or radiation polymerizable substance, and among them, a photopolymerizable functional group is preferable. The photopolymerizable functional group may, for example, be an unsaturated polymerizable functional group such as a (meth)acryl fluorenyl group, a vinyl group, a styryl group or a propylene group. Among them, a (meth) acrylonitrile group is preferred. For the specific compound, the monomers described in paragraphs [0087] and [0088] of JP-A-2006-30740 can be used, and the curing method described in paragraph [0089] of the publication can be used. In the case of photopolymerization, the photopolymerization initiator described in paragraphs [0090] to [0093] of the publication can be used.

The hard coat layer 122 may contain matting particles having an average particle diameter of 1.0 μm to 10.0 μm, preferably 1.5 μm to 7.0 μm, for example, particles of an inorganic compound or resin particles, in order to impart internal scattering properties. For the particles, the particles described in paragraph [0114] of JP-A-2006-30740 can be used.

In order to control the refractive index of the hard coat layer 122, a high refractive index monomer or inorganic fine particles of a size that does not cause light scattering (the primary particles have a diameter of 10 nm to 200 nm) or both may be added to the adhesive of the hard coat layer 122. . In addition to the effect of controlling the refractive index, the inorganic fine particles have an effect of suppressing the hardening shrinkage caused by the crosslinking reaction. The inorganic fine particles can be used as an inorganic filler in the paragraph [0120] of JP-A-2006-30740. The compound described.

<Anti-reflection layer 124>

The anti-reflection film 126 is a film in which the anti-reflection layer 124 is formed on the hard coat layer 122 (and sometimes includes the lower transparent film 130). Since optical interference is utilized, the anti-reflection layer 124 preferably has the following structure. Refractive index and optical thickness. The anti-reflection layer 124 may be only one layer, and when a lower reflectance is sought, a plurality of anti-reflection layers 124 may be laminated. Regarding the lamination of the plurality of anti-reflection layers 124, optical interference layers having different refractive indices may be alternately laminated, or two or more layers of optical interference layers having different refractive indices may be laminated. Specifically, a state in which only a low refractive index layer is provided on the hard coat layer 122, and a high refractive index layer and a low refractive index layer are sequentially disposed on the hard coat layer 122 on the hard coat layer 122. The medium refractive index layer, the high refractive index layer, and the low refractive index layer are sequentially disposed. Furthermore, the low, medium and high refractive index layers are representations of the relative magnitude relationship of the refractive indices. Further, the refractive index of the low refractive index layer is preferably set to be lower than the refractive index of the hard coat layer 122. When the difference in refractive index between the low refractive index layer and the hard coat layer 122 is too small, the antireflection property is lowered, and if it is too large, the color tone of the reflected light tends to be strong. The difference in refractive index between the low refractive index layer and the hard coat layer 122 is preferably 0.01 or more and 0.40 or less, more preferably 0.05 or more and 0.30 or less.

The refractive index and thickness of each layer preferably satisfy the following conditions.

That is, the refractive index of the low refractive index layer is preferably from 1.20 to 1.46, more preferably from 1.25 to 1.42, and particularly preferably from 1.30 to 1.38. Further, the thickness of the low refractive index layer is preferably from 50 nm to 150 nm, more preferably from 70 nm to 120 nm.

Antireflection is made to laminate a low refractive index layer on the high refractive index layer The refractive index of the film 126 and the high refractive index layer is preferably from 1.55 to 2.40, more preferably from 1.60 to 2.20, further preferably from 1.65 to 2.10, and most preferably from 1.80 to 2.00.

When the anti-reflection film 126 is formed by laminating the medium refractive index layer, the high refractive index layer, and the low refractive index layer from the transparent film 130 (or the touch panel 100) in a near-to-far manner, the refractive index of the high refractive index layer It is preferably 1.65 to 2.40, more preferably 1.70 to 2.20. The refractive index of the medium refractive index layer is adjusted so as to be a value between the refractive index of the low refractive index layer and the refractive index of the high refractive index layer. The refractive index of the medium refractive index layer is preferably from 1.55 to 1.80. Further, the thickness of the high refractive index layer and the medium refractive index layer can be set to an optical thickness corresponding to the range of the refractive index.

[Low refractive index layer]

The low refractive index layer is preferably hardened after forming a layer. The haze of the low refractive index layer is preferably 3% or less, more preferably 2% or less, and most preferably 1% or less.

A preferred composition for forming the low refractive index layer of the present invention is preferably a composition containing at least one of the following. (1) a composition containing a fluorine-containing polymer having a crosslinkable or polymerizable functional group, (2) a composition containing a hydrolysis-condensation product of a fluorine-containing organodecane material as a main component, and (3) A composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure.

(1) A fluorine-containing compound having a crosslinkable or polymerizable functional group

A fluorine-containing compound having a crosslinkable or polymerizable functional group can be enumerated A copolymer of a fluorine-containing monomer and a monomer having a crosslinkable or polymerizable functional group.

In the above copolymer, a copolymer in which a main chain consists only of carbon atoms and which contains a polymerized unit of a fluorine-containing vinyl monomer and a polymerized unit having a (meth)acryloyl group on the side chain can be used in Japanese Patent Laid-Open 2004. P-1 to P-40 described in paragraphs [0043] to [0047] of the '45 publication. Further, a fluorine-containing polymer having a polyfluorene component introduced therein to improve scratch resistance and slidability, a graft polymer having a polymerized unit containing a polyoxyalkylene moiety in a side chain, and a fluorine atom in the main chain can be used. The compounds described in Tables 1 and 2 of the paragraphs [0074] to [0076] of JP-A-2003-222702, wherein the main chain contains an ethylenically unsaturated group derived from a structural unit of a polyoxyalkylene compound. As the fluoropolymer, a compound described in JP-A-2003-183322 can be used.

For the above-mentioned polymer, a curing agent having a polymerizable unsaturated group can be suitably used in combination as described in JP-A-2000-17028. Further, as described in JP-A-2002-145952, it is also preferred to use a compound having a polyfunctional polymerizable unsaturated group containing fluorine. Examples of the polyfunctional polymerizable unsaturated group-containing compound include the above-mentioned monomers having two or more ethylenically unsaturated groups. In addition, a hydrolysis condensate of an organic decane described in JP-A-2004-170901 is also preferable, and a hydrolysis condensate of an organic decane containing a (meth) acryloyl group is particularly preferable. These compounds are particularly preferable when a compound having a polymerizable unsaturated group is used for the polymer main body, and the effect of improving the abrasion resistance is large.

When the polymer itself does not have sufficient hardenability alone, A cross-linking compound is added to impart the necessary hardenability. For example, when the polymer body contains a hydroxyl group, it is preferred to use various amine compounds as a hardener. The amine-based compound to be used as the cross-linking compound is, for example, a compound containing two or more of a hydroxyalkylamino group and an alkoxyalkylamino group in combination, and specific examples thereof include a melamine-based compound. A urea compound, a benzoguanamine compound, a glycoluril compound, or the like. When these compounds are hardened, it is preferred to use an organic acid or a salt thereof.

(2) Hydrolysis condensate of fluorine-containing organic decane material

The composition containing the hydrolysis condensate of the fluorine-containing organodecane compound as a main component is preferably a refractive index low and a high hardness on the surface of the coating film. A condensate of a compound in which a fluorinated alkyl group contains a hydrolyzable stanol at a single terminal or both ends and a tetraalkoxy decane is preferred. The specific composition is described in Japanese Laid-Open Patent Publication No. 2002-265866, and Japanese Patent Laid-Open No. 2002-317152.

(3) A composition containing a monomer having two or more ethylenically unsaturated groups and inorganic fine particles having a hollow structure

Further, as another preferable aspect, a low refractive index layer formed of particles having a low refractive index and a binder may be mentioned. The low refractive index particles may be organic or inorganic, and are preferably particles having pores inside. As a specific example of the hollow particles, cerium oxide-based particles are described in JP-A-2002-79616 (see, for example, paragraphs [0041] to [0049]). The refractive index of the particles is preferably from 1.15 to 1.40, more preferably from 1.20 to 1.30. The binder may be a monomer having two or more ethylenically unsaturated groups as described in the above item of the hard coat layer 122.

In the low refractive index layer, a polymerization initiator described in the section of the above-mentioned hard coat layer 122 is preferably used (for example, refer to paragraphs [0090] to [0093] of JP-A-2006-30740). In the case of containing a radically polymerizable compound, 1 part by weight to 10 parts by weight, preferably 1 part by weight to 5 parts by weight, based on 100 parts by weight of the compound, of a polymerization initiator can be used.

Inorganic particles may be used in combination in the low refractive layer. In order to impart scratch resistance, fine particles having a particle diameter of 15% to 150%, preferably 30% to 100%, more preferably 45% to 60%, of the thickness of the low refractive index layer may be used.

In the low refractive index layer, a known polyoxyalkylene-based or fluorine-based antifouling agent, a lubricant, or the like can be appropriately added in order to impart characteristics such as antifouling property, water resistance, chemical resistance, and lubricity.

[High refractive index layer / medium refractive index layer]

For the anti-reflection film 126, a layer having a high refractive index can be provided between the low refractive index layer and the hard coat layer 122 as described above to improve the antireflection property.

The high refractive index layer and the medium refractive index layer are preferably formed of a curable composition containing high refractive inorganic fine particles and a binder. As the high refractive index inorganic fine particles which can be used herein, high refractive index inorganic fine particles which can be contained in order to increase the refractive index of the hard coat layer 122 can be used. The inorganic fine particles having a high refractive index are preferably, for example, particles of an inorganic compound such as cerium oxide particles or TiO ₂ particles; acrylic particles, crosslinked acrylic particles, polystyrene particles, crosslinked styrene particles, melamine resin particles, and the like. Resin particles such as benzomelamine resin particles.

The high refractive index layer and the medium refractive index layer are preferably formed by further adding a matrix to the dispersion in which the inorganic particles are dispersed in the dispersion medium. A binder precursor (for example, an ionizing radiation-curable polyfunctional monomer or a polyfunctional oligomer to be described later), a photopolymerization initiator, or the like to form a high refractive index layer and a medium refractive index layer are formed. A coating composition for coating a high refractive index layer and a coating composition for forming a medium refractive index layer on a transparent film by ionizing a radiation curable compound (for example, a polyfunctional monomer or a polyfunctional oligomer) The crosslinking reaction or the polymerization reaction is hardened to form.

Further, it is preferred that the binder of the high refractive index layer and the medium refractive index layer be subjected to a crosslinking reaction or a polymerization reaction with the dispersing agent at the same time as or after the coating.

The binder of the high refractive index layer and the medium refractive index layer produced in this manner is, for example, the above-mentioned preferred dispersant, which is crosslinked or polymerized with an ionizing radiation curable polyfunctional monomer or polyfunctional oligomer to cause dispersion. The anionic group of the agent enters the form of the binder. Further, in the binder of the high refractive index layer and the medium refractive index layer, the anionic group has a function of maintaining the dispersed state of the inorganic particles, and the crosslinking or polymerizing structure imparts a film forming ability to the binder, and improves the high refractive index of the inorganic particles. The physical strength, chemical resistance, and weather resistance of the layer and the medium refractive index layer.

The binder of the high refractive index layer is added in an amount of 5 wt% to 80 wt% with respect to the solid content of the coating composition of the high refractive index layer.

The content of the inorganic particles in the high refractive index layer is preferably from 10% by weight to 90% by weight, more preferably from 15% by weight to 80% by weight, even more preferably from 15% by weight to 75% by weight based on the weight of the high refractive index layer. The inorganic particles may be used in combination of two or more kinds in the high refractive index layer.

When the high refractive index layer has a low refractive index layer, the refractive index of the high refractive index layer is preferably higher than that of the transparent film 130.

The film thickness when the high refractive index layer is used as the optical interference layer is preferably from 30 nm to 200 nm, more preferably from 50 nm to 170 nm, and particularly preferably from 60 nm to 150 nm.

The lower the haze of the high refractive index layer and the medium refractive index layer, the better. It is preferably 5% or less, more preferably 3% or less, and particularly preferably 1% or less.

The preferred integrated reflectance of the antireflection film 126 having the low refractive index layer is preferably 3.0% or less, more preferably 2.0% or less, and most preferably 1.5% or less and 0.3% or more.

Further, from the viewpoint of improving the antifouling property, it is preferred to reduce the surface free energy of the surface of the low refractive index layer. Specifically, a fluorine-containing compound or a compound having a polysiloxane structure is preferably used for the low refractive index layer. Further, an antifouling layer containing the following compound may be further provided on the low refractive index layer to distinguish it from the low refractive index layer.

Regarding the additive having a polyoxane structure, it is also preferred to add the following additives: a polyoxyalkylene containing a reactive group {for example, "KF-100T", "X-22-169AS", "KF-102", "X" -22-3701IE", "X-22-164B", "X-22-5002", "X-22-173B", "X-22-174D", "X-22-167B", "X-22 -161AS" (trade name), the above is manufactured by Shin-Etsu Chemical Co., Ltd.; "AK-5", "AK-30", "AK-32" (trade name), and the above is manufactured by East Asia Synthetic Co., Ltd.; Silaplane FM0725", "Silaplane FM0721" (trade name), the above is Chisso (share) manufacturing, etc.}. In addition, it is also preferable to use Japan. The polyfluorene-based compound described in Tables 2 and 3 of JP-A-2003-112383. These polyoxyalkylenes are preferably added in the range of 0.1% by weight to 10% by weight based on the total solid content of the low refractive index layer, and particularly preferably in the range of 1% by weight to 5% by weight.

[Manufacturing Method of Anti-Reflection Film 126]

The anti-reflection film 126 can be formed by the following coating methods, but is not limited to the coating methods.

(preparation of coating)

First, a coating liquid containing a component for forming each layer of the hard coat layer 122 or the anti-reflection layer 124 is prepared. In general, since the coating liquid is mainly an organic solvent, it is necessary to suppress the water content to 2% or less, and to seal the solvent to suppress the amount of volatilization of the solvent. The organic solvent used is selected depending on the materials used for each layer. A mixer or a disperser is suitably used in order to obtain uniformity of the coating liquid.

The prepared coating liquid is desirably filtered before coating to prevent coating failure. The filter to be filtered is preferably a filter having a pore diameter as small as possible within a range in which the components in the coating liquid are not removed, and the filtration pressure is appropriately selected within a range of 1.5 MPa or less. The filtered coating liquid is preferably subjected to ultrasonic dispersion, defoaming, and maintaining a dispersed state of the dispersion immediately before coating.

The transparent film 130 may also be subjected to a heat treatment for correcting the deformation of the substrate or a surface treatment for improving the coatability or improving the adhesion to the coating layer before coating. Specific methods of surface treatment include corona discharge treatment, glow discharge treatment, flame treatment, acid treatment, alkali treatment or ultraviolet irradiation. Reason. Further, as described in Japanese Laid-Open Patent Publication No. Hei 7-333433, the treatment of providing an undercoat layer can be preferably used.

Further, it is preferable to provide a dust removing step as a pre-coating step, and the dust removing method used in the dust removing step can be carried out by the method described in paragraph [0119] of JP-A-2010-32795. Further, in terms of improving the dust removing efficiency and suppressing the adhesion of the garbage, it is particularly preferable to remove the static electricity on the transparent film 130 before the dust removing step. Such a method of removing electricity can be carried out by the method described in paragraph [0120] of JP-A-2010-32795. Further, the planarity of the transparent film 130 and the improved adhesion can be ensured by the methods described in paragraphs [0121] and [0123] of the above publication.

(coating step)

The respective layers of the anti-reflection film 126 can be formed by the following coating methods, but are not limited to the methods. A dip coating method, an air knife coating method, an air curtain coating method, a roll coating method, a wire bar coating method, a gravure coating method, or an extrusion coating method (die coating method) may be used (refer to the US patent) A known method such as the specification of No. 2681294, International Publication No. 05/123274, and a micro gravure coating method is preferably a micro gravure coating method or a die coating method. The micro gravure coating method is described in paragraphs [0125] and [0126] of Japanese Patent Laid-Open Publication No. 2010-32795, and the die coating method is described in paragraphs [0127] and [0128] of the above publication. It is described that these methods can also be used in the present embodiment. In terms of productivity, it is preferably applied by a die coating method at a rate of 20 m/min or more.

(drying step)

The anti-reflection film 126 is preferably directly or separately on the transparent film 130. After coating the layers, they are transferred to a heated zone by a web to dry the solvent.

As a method of drying the solvent, various methods can be utilized. Specific examples of the method include Japanese Patent Laid-Open No. 2001-216817, Japanese Patent Laid-Open No. 2001-314798, Japanese Patent Laid-Open No. 2003-126768, Japanese Patent Laid-Open No. 2003-315505, and Japanese Patent Laid-Open No. 2004- The technique described in the publication No. 34002.

As for the temperature condition of the dry region, the conditions described in paragraph [0130] of JP-A-2010-32795 can be used, and the conditions described in paragraph [0131] of the publication can be used for the conditions of the dry air.

(hardening step)

The anti-reflection film 126 can cure the coating film by a region in which the respective coating films are hardened by ionizing radiation and/or heat in the form of a web after the solvent is dried or in the late drying stage. The ionizing radiation is not particularly limited, and may be appropriately selected from ultraviolet rays, electron beams, near ultraviolet rays, visible light, near infrared rays, infrared rays, X rays, etc., depending on the type of the curable composition forming the film, and is preferably ultraviolet rays or electron beams. Particularly, in terms of ease of handling and high energy availability, ultraviolet rays are preferred.

A light source described in paragraph [0133] of JP-A-2010-32795, which is described in the paragraph [0134] of the above-mentioned publication, can be used as a light source for ultraviolet light to photopolymerize an ultraviolet curable compound. Electron beam. Further, regarding the irradiation conditions, the amount of irradiation light, and the irradiation time, the conditions described in paragraphs [0135] and [0138] of the publication can be used. Further, regarding the film surface temperature, oxygen concentration, and oxygen concentration of the film before and after the irradiation For the degree of control method, the conditions and methods described in paragraph [0136], paragraph [0137], paragraph [0139] to paragraph [0144] of the publication can be used.

(for continuous manufacturing operations)

In order to continuously manufacture the anti-reflection film 126, the following steps are performed: continuously feeding a roll-shaped transparent film 130; applying a coating liquid and drying; hardening the coating film; and winding the transparent film 130 having a hardened layer .

The above steps may be carried out separately for forming each layer, or a plurality of coating portions-drying chambers-hardened portions (so-called tandem systems) may be provided to continuously form the respective layers.

In order to produce the antireflection film 126, it is preferred to carry out the coating step of the coating portion and the drying step in the drying chamber in a clean environment with high cleanliness while performing a precision filtration operation of the coating liquid as described above. The garbage and dust on the transparent film 130 are sufficiently removed before coating. The air cleanliness of the coating step and the drying step is preferably 10 or more (particles of 0.5 μm or more or 353 particles/m ³ or less) or more preferably 1 level according to the standard of air cleanliness according to US Federal Standard 209E. The particles of 0.5 μm or more are 35.5 pieces/m ³ or less) or more. Further, the air cleanliness is preferably higher in the delivery, the winding portion, and the like other than the coating-drying step.

In order to maintain the sharpness of the image, the anti-reflection film 126 preferably adjusts the transparency of the transmission image in addition to adjusting the surface shape as smooth as possible. The transmission image sharpness of the anti-reflection film 126 is preferably 60% or more. The transmission image sharpness is generally an index indicating the degree of blurring of the image reflected by the film, and the larger the value, the clearer the image seen through the film. The transmission image sharpness is preferably 70% or more, more preferably 80% or more.

The anti-reflection film 126 can be used as a surface film on the viewing side of the display device 108. The display device 108 can be applied to various display devices such as various liquid crystal display devices, plasma displays, organic electroluminescence (EL), and touch panels. Depending on the nature of the outermost surface of the display device 108 using the anti-reflection film 126, an adhesive may be provided on the surface of the transparent film 130 of the anti-reflection film 126 that does not have the coating layer (hereinafter sometimes referred to as the back surface). The layer or the back surface of the transparent film 130 is gelated and bonded to the touch panel 100.

For the method of gelling the back surface of the transparent film 130, the technique described in paragraphs [0149] to [0160] of JP-A-2010-32795 can be used.

Furthermore, the present invention can be suitably used in combination with the techniques disclosed in Tables 1 and 2 below and the techniques of the International Publication Manual. The expressions "Japanese Patent Special", "No. Bulletin", "No. Manual" and the like are omitted.

[Example]

Hereinafter, the present invention will be more specifically described by way of examples of the invention. In addition, the materials, usage amounts, ratios, processing contents, processing order, and the like shown in the following examples can be appropriately changed without departing from the gist of the present invention. Therefore, the scope of the invention should not be construed as being limited by the specific examples shown below.

Conduction of Comparative Example 1 and Comparative Example 2, Examples 1 to 6 Sheet, surface resistance and transmittance were measured, and streaks and visibility were evaluated. The details, measurement results, and evaluation results of Comparative Example 1 and Comparative Example 2, and Examples 1 to 6 are shown in Table 3.

<Example 1 to Example 6, Comparative Example 1, Comparative Example 2>

(silver halide photosensitive material)

An emulsion containing 10.0 g of gelatin and containing silver iodobromochloride particles having an approximate spherical diameter of 0.1 μm (I = 0.2 mol%, Br = 40 mol%) was prepared in an amount of 150 g of Ag in an aqueous medium.

Further, K ₃ Rh ₂ Br ₉ and K ₂ IrCl ₆ were added to the emulsion at a concentration of 10 ^-7 (mol/mol silver), and the silver bromide particles were doped with Rh ions and Ir ions. Na ₂ PdCl ₄ was added to the emulsion, and gold sulphur sensitization was carried out using chloroauric acid and sodium thiosulfate, and then coated with a gelatin hardener at a coating amount of 10 g/m ² of silver. The first transparent substrate 12A and the second transparent substrate 12B (here, both of polyethylene terephthalate (PET)). At this time, the Ag/gelatin volume ratio was set to 2/1.

20 m was coated on a PET support having a width of 30 cm on a width of 25 cm, and 3 cm was cut at both ends so as to keep the center portion of the coating at 24 cm, thereby obtaining a roll-shaped silver halide photosensitive material.

(exposure)

Regarding the exposure pattern, the first conductive sheet 10A has the pattern shown in FIGS. 1 and 4, and the second conductive sheet 10B has the pattern shown in FIGS. 4 and 6 for the first transparent substrate 12A of A4 size (210 mm × 297 mm). And the second transparent substrate 12B is exposed. The exposure is a mask that is interposed with the above pattern, and exposure is performed using parallel light using a high pressure mercury lamp as a light source.

(development processing)

‧ Developer 1L formula

. Fixative 1L formula

Using the above treatment agent, the exposed photosensitive material was treated under the conditions of development of 35 ° C for 30 seconds, fixed 34 ° C for 23 seconds, and water-washed running water (5 L / min) for 20 seconds using an automatic developing machine FG-710PTS manufactured by Fujifilm. Process it.

(Example 1)

The line width of the conductive portions (the first conductive pattern 22A and the second conductive pattern 22B) of the first conductive sheet 10A and the second conductive sheet 10B to be produced is 1 μ. m, the length of one side of the small lattice 18 is 50 μm, and the length of one side of the large lattice (the first large lattice 14A and the second large lattice 14B) is 3 mm.

(Example 2)

The first conductive sheet and the second conductive sheet of Example 2 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 5 μm and the length of one side of the small lattice 18 was 50 μm.

(Example 3)

The first conductive sheet and the second conductive sheet of Example 3 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 9 μm, the length of one side of the small lattice 18 was 150 μm, and the length of one side of the large lattice was 5 mm.

(Example 4)

The first conductive sheet and the second conductive sheet of Example 4 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 10 μm, the length of one side of the small lattice 18 was 300 μm, and the length of one side of the large lattice was 6 mm.

(Example 5)

The first conductive sheet and the second conductive sheet of Example 5 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 15 μm, the length of one side of the small lattice 18 was 400 μm, and the length of one side of the large lattice was 10 mm.

(Example 6)

The first conductive sheet and the second conductive sheet of Example 6 were produced in the same manner as in Example 1 except that the line width of the conductive portion was 20 μm, the length of one side of the small lattice 18 was 500 μm, and the length of one side of the large lattice was 10 mm.

(Comparative Example 1)

In addition to making the line width of the conductive portion 0.5 μm, one side of the small lattice 18 The first conductive sheet and the second conductive sheet of Comparative Example 1 were produced in the same manner as in Example 1 except that the length was 40 μm and the length of one side of the large lattice was 3 mm.

(Comparative Example 2)

The first conductive sheet and the second conductive sheet of Comparative Example 2 were produced in the same manner as in Comparative Example 1, except that the line width of the conductive portion was 25 μm, the length of one side of the small lattice 18 was 500 μm, and the length of one side of the large lattice was 10 mm. .

(surface resistance measurement)

In order to confirm the accuracy of the detection, the surface resistivity of the first conductive sheet 10A and the second conductive sheet 10B was measured using a Loresta GP (Model MCP-T610) tandem four-probe detector (ASP) manufactured by Dia Instruments. The average value of the measured values was obtained.

(Measurement of transmittance)

In order to confirm the transparency, the transmittance was measured for the first conductive sheet 10A and the second conductive sheet 10B using a spectrophotometer.

(evaluation of stripes)

In Comparative Example 1 and Comparative Example 2, and Examples 1 to 6, a first conductive sheet 10A was laminated on the second conductive sheet 10B to form a laminated conductive sheet, and then a laminated conductive sheet was attached to the display screen of the liquid crystal display device. And constitute a touch panel. Thereafter, the touch panel is placed on the turntable to drive the liquid crystal display device to display white. In this state, the turntable was rotated between angling angles -45° to +45°, and the stripes were visually observed and evaluated.

The evaluation of the streaks was performed at an observation distance of 1.5 m from the display screen of the liquid crystal display device, and when the streaks were not displayed, it was evaluated as ○, and the streaks were extremely small. The horizontal time which is visible and is problem-free is evaluated as Δ, and when the streaks are obvious, it is evaluated as ×.

(evaluation of visibility)

Before the evaluation of the stripe, the touch panel is placed on the turntable, and when the liquid crystal display device is driven to display white, it is visually confirmed whether there is a thick line or a black spot, and the first large grid 14A of the touch panel is confirmed. And whether the boundary of the second large lattice 14B is conspicuous.

As is clear from Table 3, in Comparative Example 1, although the evaluation of the streaks and the visibility was good, the surface resistance of Comparative Example 1 was 1 kΩ/sq. or more, and the conductivity was low, and the detection sensitivity was insufficient. In Comparative Example 2, although both the conductivity and the transmittance were good, the streaks were conspicuous, and the conductive portion itself was easily recognized by the naked eye, and the visibility was deteriorated.

On the other hand, in Examples 1 to 6, the conductivity, the transmittance, the streaks, and the visibility in Examples 1 to 5 were good. In Example 6, although the evaluation of the streaks and the evaluation of the visibility were inferior to those of Examples 1 to 5, the degree of streaks which were extremely small and visible without problems was not difficult to see. The case where the display image of the device is displayed.

In addition, the conductive sheet of the present invention, the method of using the conductive sheet, and the capacitive touch panel are not limited to the above-described embodiments, and of course, various configurations can be employed without departing from the gist of the present invention.

10A, 10Aa‧‧‧1st conductive sheet

10B, 10Ba‧‧‧2nd conductive sheet

12A‧‧‧1st transparent substrate

12B‧‧‧2nd transparent substrate

13A‧‧‧1st Conductive Department

13B‧‧‧2nd Conductive Department

14A‧‧‧1st large grid

14B‧‧‧2nd plaid

16A‧‧‧1st connection

16B‧‧‧2nd connection

18‧‧‧Small lattice

20‧‧‧ medium lattice

20a~20h‧‧‧1st plaid~8th plaid

22A‧‧‧1st conductive pattern

22B‧‧‧2nd conductive pattern

24A‧‧‧1st insulation

24B‧‧‧2nd insulation

26a, 26b‧‧‧ vertices

28a~28h‧‧‧1st to 8th

30‧‧‧ Straight line

32‧‧‧ comb teeth

40a‧‧‧1st line

40b‧‧‧2nd line

41a‧‧‧1st terminal wiring pattern

41b‧‧‧2nd terminal wiring pattern

42a‧‧‧ recess

42b‧‧‧ convex

50A‧‧‧1st laminated conductive sheet

50B, 50Ba‧‧‧2nd laminated conductive sheet

100‧‧‧ touch panel

106‧‧‧Protective layer

108‧‧‧Display device

110‧‧‧ display panel

110a‧‧‧Display screen

112‧‧‧Sensor Department

114‧‧‧Terminal wiring department

116a‧‧‧1st terminal

116b‧‧‧2nd terminal

118a‧‧‧1st alignment mark

118b‧‧‧2nd alignment mark

120‧‧‧Transparent adhesive

120A‧‧‧1st transparent adhesive

120B‧‧‧2nd transparent adhesive

122‧‧‧hard coating

124‧‧‧Anti-reflective layer

126‧‧‧Anti-reflective film

128‧‧‧Protective resin layer

130‧‧‧Transparent film

140‧‧‧Photosensitive materials

142a‧‧‧1st photosensitive layer

142b‧‧‧2nd photosensitive layer

144a‧‧‧1st light

144b‧‧‧2nd light

146a‧‧‧1st mask

146b‧‧‧2nd mask

148a‧‧‧1st light source

148b‧‧‧2nd light source

150a‧‧‧1st collimating lens

150b‧‧‧2nd collimating lens

152a‧‧‧1st exposure pattern

152b‧‧‧2nd exposure pattern

Lf‧‧‧projection distance

Pm, Ps‧‧‧ arrangement spacing

S1~S3‧‧‧ steps

Wc1, Wc2‧‧‧ width

FIG. 1 is a plan view showing a pattern example of a first conductive pattern formed on a first conductive sheet.

Fig. 2 is a cross-sectional view showing a part of the first conductive sheet omitted.

3 is an exploded perspective view showing the configuration of a touch panel.

4 is an exploded perspective view showing a part of the first laminated conductive sheet omitted.

FIG. 5A is a cross-sectional view showing an example in which a part of the first laminated conductive sheet is omitted.

FIG. 5B is a cross-sectional view showing a part of the first multilayered electrically conductive sheet, partially omitted.

6 is a plan view showing an example of a pattern of a second conductive pattern formed on a second conductive sheet.

FIG. 7 is a plan view showing an example in which a first laminated conductive sheet is formed by combining a first conductive sheet and a second conductive sheet.

8A is a schematic view showing a first configuration example in which an antireflection film is provided.

Fig. 8B is a schematic view showing a second configuration example.

Fig. 8C is a schematic view showing a third configuration example.

Fig. 9 is an exploded perspective view showing a part of the second laminated conductive sheet omitted.

FIG. 10 is a plan view showing a pattern example of a first conductive pattern formed on a first conductive sheet of a second laminated conductive sheet.

FIG. 11 is a plan view showing a pattern example of a second conductive pattern formed on the second conductive sheet of the second build-up conductive sheet.

FIG. 12 is a plan view showing an example in which a part of the first conductive sheet and the second conductive sheet are combined to form a second conductive sheet for a touch panel.

FIG. 13 is a plan view showing a pattern example of a first conductive pattern formed on a first conductive sheet of a laminated electrically conductive sheet according to a modification.

FIG. 14 is a plan view showing a pattern example of a second conductive pattern formed on a second conductive sheet of a laminated electrically conductive sheet according to a modification.

Fig. 15 is a flow chart showing a method of producing the transparent conductive film of the embodiment.

Fig. 16A is a cross-sectional view showing a part of the produced photosensitive material omitted.

Fig. 16B is an explanatory view showing simultaneous exposure of both surfaces of a photosensitive material.

17 is a state in which the light irradiated to the first photosensitive layer does not reach the second photosensitive layer, and the light irradiated to the second photosensitive layer does not reach the first photosensitive layer, and the first exposure process and the second exposure process are performed. Illustrating.

10A‧‧‧1st conductive sheet

13A‧‧‧1st Conductive Department

14A‧‧‧1st large grid

16A‧‧‧1st connection

18‧‧‧Small lattice

20a~20d‧‧‧1st plaid~4th plaid

22A‧‧‧1st conductive pattern

24A‧‧‧1st insulation

26a, 26b‧‧‧ vertex part 26b

28a~28d‧‧‧1st side to 4th side

30‧‧‧ Straight line

32‧‧‧ comb teeth

Pm, Ps‧‧‧ arrangement spacing

50A‧‧‧1st laminated conductive sheet

Claims (21)

A conductive sheet comprising: a base body (12A); and a conductive portion (13A) formed on the base body (12A), wherein the conductive portion (13A) has two or more conductive layers formed of thin metal wires a lattice (14A) and a connecting portion (16A) formed of a thin metal wire electrically connecting the adjacent large lattices (14A), each of the large lattices (14A) being composed of two or more small lattices (18) A combination is formed by a combination of the large lattices (14A), and when the pitch of the small lattices (18) is Ps, the width Wc of the connecting portion (16A) satisfies Wc>Ps/ Further, the connecting portion (16A) has a configuration in which two adjacent squares are individually connected by one side, and one side of the two middle squares is shared. The conductive sheet according to claim 1, wherein the two or more large lattices (14A) are arranged in the first direction via the connecting portion (16A) to form one conductive pattern (22A), two The conductive patterns (22A) are arranged in a second direction orthogonal to the first direction, and electrical properties of the small lattices (18) are not disposed between the adjacent conductive patterns (22A). The insulating insulating portion (24A) is arranged by the conductive pattern (22A) and the insulating portion (24A) The above circuit is constructed in columns. The conductive sheet according to claim 1, wherein a length of one side of the large lattice (14A) is 3 mm to 10 mm. The conductive sheet according to claim 1, wherein a length of one side of the small lattice (18) is 30 μm to 500 μm. The conductive sheet according to claim 1, wherein an interval between the mutually opposing sides of the small lattice (18) is 30 μm to 500 μm. The conductive sheet according to claim 1, wherein the metal thin wire has a line width of 10 μm or less. A conductive sheet comprising: a base body (12A); a first conductive portion (13A) formed on one main surface of the base body (12A); and a main surface formed on the other main surface of the base body (12A) In the second conductive portion (13B), the first conductive portion (13A) has two or more conductive first large lattices (14A) formed of thin metal wires, and the first large lattice (14A) adjacent thereto a first connection portion (16A) formed of a thin metal wire electrically connected to each other, wherein the second conductive portion (13B) has two or more second conductive large lattices (14B) formed of thin metal wires, and a second connecting portion (16B) made of a thin metal wire electrically connected between the adjacent second large lattices (14B), each of the first large lattices (14A) and each of the second large lattices (14B) Each of the first large lattices (14A) is arranged in the first direction via the first connecting portion (16A) to form one first conductive pattern ( 22A), a circuit is formed by combining the first large lattice (14A) and the second large lattice (14B), and when the pitch of the small lattice (18) is Ps, the first connection Wc1 width portion (16A) and the second connecting portion (16B) satisfies the Wc2 Wc1> Ps / Wc2>Ps/ Further, the first connecting portion (16A) and the second connecting portion (16B) each have a configuration in which two adjacent squares are individually connected by one side, and one side of the two middle squares is shared. The conductive sheet according to claim 7, wherein the first large lattice (14A) is arranged in the first direction via the first connecting portion (16A) to constitute one first conductive line formed of thin metal wires. In the pattern (22A), two or more of the second large lattices (14B) are arranged in the second direction orthogonal to the first direction via the second connecting portion (16B), and one of the thin metal wires is formed. In the second conductive pattern (22B), between the adjacent first conductive patterns (22A), the first insulating portion (24A) in which the small lattice (18) is not electrically insulated is disposed adjacent to each other Between the second conductive patterns (22B) connected to the second conductive pattern (22B) The second insulating portion (24B) that is electrically insulated from the small lattice (18) is not present, and the first conductive pattern (22A), the second conductive pattern (22B), and the first insulating portion (24A) are The arrangement of the second insulating portions (24B) constitutes the above-described circuit. The conductive sheet according to claim 7, wherein the metal thin wire has a line width of 10 μm or less. The conductive sheet according to claim 7, wherein a projection distance (Lf) between a straight portion of a side portion of the first large lattice (14A) and a straight portion of a side portion of the second large lattice (14B) It is set according to the size of the above small lattice (18). The conductive sheet according to claim 10, wherein the projection distance (Lf) is 100 μm to 400 μm. The conductive sheet according to claim 7, wherein the first conductive portion (13A) has a first terminal wiring pattern (41a) connected to an end portion of each of the first conductive patterns (22A), and is formed. a plurality of first terminals (116a) connected to the corresponding first terminal wiring pattern (41a) at a central portion in the longitudinal direction of one side of one main surface of the base body (12A); and the second conductive portion (13B) a second terminal wiring pattern (41b) connected to an end portion of each of the second conductive patterns (22B), and a central portion in the longitudinal direction of one side of the other main surface of the base body (12A) A plurality of second terminals (116b) connected to the corresponding second terminal wiring pattern (41b). The conductive sheet of claim 12, wherein When viewed from the upper surface, a portion in which the plurality of first terminals (116a) are arranged is adjacent to a portion in which the plurality of second terminals (116b) are arranged. The conductive sheet according to claim 12, wherein an end of each of the first conductive patterns (22A) and the corresponding first terminal wiring pattern (41a) are connected via a first junction portion (40a), respectively. The end of each of the second conductive patterns (22B) and the corresponding second terminal wiring pattern (41b) are connected via a second junction portion (40b), and the plurality of first junction portions (40a) are along the first The two second line connecting portions (40b) are linearly arranged along the first direction in a linear manner in two directions. The conductive sheet according to claim 8, wherein the first insulating portion (24A) and the second insulating portion (24B) are opposed to each other with the base body (12A) interposed therebetween, and when viewed from the upper surface, The shape of the opposing portion of the first insulating portion (24A) and the second insulating portion (24B) is polygonal. The conductive sheet according to claim 15, wherein the polygonal shape is a square shape. The conductive sheet of claim 15, wherein the polygonal shape is a wedge shape. The conductive sheet according to claim 1, wherein the small lattice (18) is polygonal. The conductive sheet of claim 18, wherein the small lattice (18) is square. A method of using a conductive sheet, which is a method of using a conductive sheet using a first conductive sheet (10A) and a second conductive sheet (10B), wherein the first conductive sheet (10A) is formed with two thin metal wires The first large lattice (14A) having the above conductivity and the first connecting portion (16A) formed of a thin metal wire electrically connecting the adjacent first large lattices (14A), each of the first Each of the large lattices (14A) is composed of a combination of two or more small lattices (18). When the pitch of the small lattices (18) is Ps, the width Wc1 of the first connecting portion (16A) satisfies Wc1> Ps/ The second conductive sheet (10B) is formed with two or more conductive second large lattices (14B) formed of thin metal wires and electrically connected between the adjacent second large lattices (14B). The second connection portion (16B) formed of thin metal wires is connected, and each of the second large lattices (14B) is composed of a combination of two or more small lattices (18), and the pitch of the small lattices (18) is set. When Ps is set, the width Wc2 of the second connecting portion (16B) satisfies Wc2>Ps/ In the method of using the conductive sheet, in the first conductive sheet (10A), two or more of the first large lattices (14A) are arranged in the first direction via the first connecting portion (16A), thereby One of the first conductive patterns (22A) is formed, and in the second conductive sheet (10B), two or more of the second large lattices (14B) are arranged in the first direction via the second connecting portion (16B). In the second direction of the intersection, one second conductive pattern (22B) is formed, and the first connecting portion (16A) and the second connecting portion (16B) each have the following configuration: two adjacent middle lattices Each of the two intermediate lattices is shared by one side, and the first conductive sheet (10A) is combined with the second conductive sheet (10B) to bond the first conductive sheet (10A). The first connecting portion (16A) is disposed in combination with the second connecting portion (16B) of the second conductive sheet (10B) so as to form an arrangement of the small lattices (18). An electrostatic capacitive touch panel comprising the conductive sheet according to claim 1 of the patent application.