201200879 六、發明說明： 【發明所屬之技術領域】 根據本發明例示性實施例之裝置以及方法是有關於探 針（probe)，且更特定言之，是有關於穩定地傳輸測試信 號之探針。 【先前技術】 諸如半導體晶片（semiconductor chip )或晶圓（wafer) 之半導體元件（semiconductor device )應經過預定的測試， 以測試其品質。 、 使用測試插座（test S0Cket)或探針卡（pr〇be card) 來電性連接測試料半導體元件，所❹m||藉由施加預 定的測試錢來測試諸如半導體晶片或晶圓之半導體元 之品質。 施加二⑽預定的測試信號 、探針之第-末端與第二末端分別連接至半導體盘 測試器之承載板’從而電性連接半導體it件與測試器/' 探針用於將測試信號（電流或電壓）傳輸至半導 件’且穩定轉輸所述测試錢極為重要。 【發明内容】 種穩定地傳輸 因此，一個或多個例示性實施例提供一 測試信號之探針。 另一例示性實施例提供一 電性之探針。 種具有簡單組態且會改良201200879 VI. Description of the Invention: [Technical Field] The device and method according to an exemplary embodiment of the present invention relate to a probe, and more particularly, to a probe for stably transmitting a test signal . [Prior Art] A semiconductor device such as a semiconductor chip or a wafer should be subjected to predetermined tests to test its quality. Test the semiconductor component by using a test socket (test S0Cket) or a probe card (pr〇be card), and test the quality of the semiconductor element such as a semiconductor wafer or wafer by applying predetermined test money. . Applying two (10) predetermined test signals, the first end and the second end of the probe are respectively connected to the carrier plate of the semiconductor disk tester to electrically connect the semiconductor device and the tester/' probe for testing signals (current It is extremely important to transfer the voltage to the semiconductor part' and to stably transfer the test money. SUMMARY OF THE INVENTION Accordingly, one or more exemplary embodiments provide a probe for a test signal. Another exemplary embodiment provides an electrical probe. Kind of simple configuration and will improve
201200879 ，例提供一種會降低測試成本之探針。 丰導〆杜〗種電性連接半導體元件與測試器以測試 連接至所料糾元件;’其麵態以電性 J柱塞（lowerplunger)，盆瘦 組气以以，至所述測試器；彈性構件㈠她 member) ’私置_紅雜塞朗訂雜塞之間， ί彈述ί部柱塞與所述下部柱塞以使其彼此隔 開，導電構件（C〇ndUCtlvemember)，其安置於所述彈性構 件内部或外部，且電性連接所述上部柱塞與所述下部柱 塞；以及’（banrel)’其中容納所述上躲塞、所述下 部柱塞、所述彈性構件以及所述導電構件。 所述導電構件可僅當所述上部柱塞與所述下部柱塞的 至少其中之一朝向所述上部柱塞與所述下部柱塞其中之另 一者移動時才電性連接所述上部柱塞與所述下部柱塞。 所述導電構件可選擇性地接觸所述上部柱塞與所述下 部柱塞的至少其中之一。 所述導電構件可將彈力施加至所述上部柱塞與所述下 部柱塞的至少其中之一，以使所述上部柱塞與所述下部柱 塞彼此隔開。 所述導電構件可包含導電盤簧（c〇nductive coil spring)以及導電橡膠（conductive rubber)的至少其中之 〇 上述及/或其他態樣將自以下結合所附圖式來對例示 201200879 性實施例之描述而顯*易見且更容易地瞭解。 【實施方式】 在下文中，將參考所附圖式來詳細描述例示性實施 例，以便由-般熟*此技藝者容易地實現。所述例示性實 施例可以各種形絲體現’而不限於本文情述之例示性 實施例。為清晰起見，省略對熟知部件之描述，且相同參 考數字貫穿全文以代表相同元件。 / 如圖1所示’根據本發明之第一例示性實施例之探針 100包含·上部柱塞11〇 ;下部柱塞12〇 ;彈性構件⑽， 其彈性地偏置(bias)上部柱塞110肖下部柱塞12〇以使其彼 ，隔開；導電構件150，其設於彈性構件14〇内；以及圓 琦130 ’其中谷納上部柱塞11〇以及下部柱塞12〇、彈性構 件140、以及導電構件150。 上部柱塞11G包含：尖端(tip)lu，其接觸半導體元件 ίο之焊球11 ’·凹槽(groove)113 ’其形成於上部柱塞11〇之 外周邊中，以及彈性構件觸點(contact)ii5，其接觸彈性構 尖端111之外程可大於圓筒130之内徑。使用者可藉 由將上部柱塞110推動至圓筒13〇直至凹槽113固持著^ 茼130之突起131為止（稱後將描述），來將上部柱塞 固定至圓筒130。 圖1繪示尖端111被成形為王冠狀，其上形成有多個 三角錐（triangularpyramid)，但尖端111之形狀不限於此。 或者，尖端ill之形狀可取決於一接觸目標(target)之形狀 201200879 • t •一 而改嫒。舉例而言’若半導體元件10包含呈球柵陣列（bau grid array)之半導體晶片，則尖端lu可如上成形為王冠 狀。又，尖端111可具有具單一尖銳尖端之A形形狀，或 内部凹入以將焊球n插入其中之凹坑（dimple)形狀。此 外，若該接觸目標為焊墊，則尖端ηι可成形為半球狀， 諸如下部柱塞120之尖端121 (稍後將描述）。 上部柱塞110之凹槽113耦接至圓筒13〇之突起131。 # 上。卩柱塞110耦接至圓筒130以使得上部柱塞no不會上 下移動，且黏附至圓筒13〇。 彈性構件觸點115可成形為朝向下部柱塞12〇突出之 圓錐體狀。在一些情況下，彈性構件觸點115可成形為圓 柱狀，彈性構件140插入其中》彈性構件觸點115可具有 其他各種形狀’只要其可維持與彈性構件14〇之接觸即可。 上部柱塞110可形成為單一本體。 下部柱塞120包含：尖端πΐ，其接觸測試器之承載 ，20之焊墊21 ;主體122 ’其由圓筒130之尖端132固持 著；以及彈性構件觸點123，其接觸彈性構件14〇。 尖端121可成形為半球狀，以容易地接觸焊墊21。 主體122之外徑D1大於圓筒13〇之尖端132的内徑 D3 ’且小於圓筒13〇之内徑D2。因此，下部柱塞12〇可 經由圓筒130之第二末端而插入，且主體122由尖端132 固持著，以使得下部柱塞12〇不會朝向承載板2〇而分離。 彈性構件觸點123可成形為朝向上部柱塞11〇突出之 圓錐體狀。另外，彈性構件觸點123可成形為圓柱狀，彈 201200879 性構件140可插人t_ .. 種形構件觸點123可具有其他各 、要其可維持與彈性構件140之接觸即可。 下部柱塞120可形成為單一本體。 从筒130尹谷納上部柱塞110、下部柱塞120、彈性構 件140,以及導電構件15〇。 再 圓筒130可成形為圓柱狀’其上側開放以便將上部柱 塞110插入其中。 113 ίΓ^130包含·突起131，其由上部柱塞110之凹槽 3固持者；以及尖端132’其防止下部柱塞120肖下分離。 若施加大於彈性構件14〇之彈性偏置(㈣力的外力則下 部柱塞120可朝向上部柱塞11〇移動。尖端132充當播止 件（stopper)’其調節下部柱塞12〇之向下移動。 圓筒130 t容納上部柱塞110以及下部柱塞12〇，以 將上部柱塞11G之尖端111以及下部柱塞12G之尖端121 i霪於外。 彈性構件140安置於上部柱塞11〇與下部柱塞12〇之 間’且彈性地偏置上部柱塞11G與下部柱I 12()以使其彼 此隔開。 彈性構件140可包含導電金屬。 導電構件150電性連接上部柱塞11〇與下部柱塞12〇。 導電構件150之第一末端接觸上部枝塞HQ之彈性構 件觸點115,且導電構件150之第二末端接觸下部柱塞12〇 之彈性構件觸點123。 導電構件150之第一末端以及第二末端維持與彈性構 201200879 件觸點115以及彈性構件觸點123之接觸，而 120向上移動還是向下移動無關。 〃。卩柱塞 導電構件150可在上部柱塞11〇與 上施:彈力至上部柱塞㈣下部柱塞= 至~中之一。如圖1所示，導電構件15 狀。導電構件15G之外徑小於雜槿心⑼祕為盤簧 導電構件150可容納於彈性構件14〇中。之内控。因此， 導電構件15〇可包含導電金屬H情況下 可包含導電橡膠鱗電塑膠。當諸如♦之非ΪΪ 質。導雷舰κΓΛΓ 料橡膠可具有導電性 f々導電構件15G之材料並稀於前述材料，且可包含其 他各種材料，只要其可導電即可。 、 導電構件150之導電性較佳等於或高於 當殼體且可導電，殼體中容納柱塞 件140以及導電構件15〇。因此，具 有高==以及良好導電性的材料可用於圓筒130。 導電構件150可由導電性¥ 導電性的材料製成。 门仏坪f生構仵之 導電構件150可與上都飪宏11Λ 含相同之材料。興上#塞110以及下部柱塞120包 態下’ ΐ針100容納於插座外殼210中。 塞則之尖=0以該探針100，以將上部柱 若握拷車道辨_钟下。卩柱塞120之尖端121暴露於外。 70 10之操作者（未圖示）向下按壓半 201200879 導體元件10’且使半導體元件10之焊球u接觸上部柱塞 11〇 ’則測試信號（電流）經由彼此接觸之下部柱塞12〇 與承載板20而自承載板20傳輸至半導體元件1〇。&性構 件140可吸收可能由向下按壓半導體元件1〇而引起的任何 衝擊(shock)。 由測試器之承載板20施加之測試信號（電流）根據以 下三條路徑，經由上部柱塞110而傳輸至半導體元件ι〇 之焊球11 : 1) 第一路徑：接觸焊墊21之下部柱塞12〇—彈性構 件140->上部柱塞110 ; 2) 第二路徑：下部柱塞12〇—導電構件15〇—上部柱 塞110 ;以及 3) 第三路徑：下部柱塞120 (藉由下部柱塞12〇之主 體122與_ 13〇之尖端132之接觸）〜圓筒i3〇— 柱塞110。 以上三條路徑與具有三個並列電路之閉合電路具有相 同組態。因A，探冑100之總體電阻值顯著減小以穩定地 傳輸該測試信號。 在本發明之第-例示性實施例中，上部柱塞110黏附 至圓筒130’且下部柱塞120相對於圓筒13〇而上下移動， 但不限於此。或者，上部柱塞11G可上下移動，且下部柱 塞120可黏附至圓筒13〇。 圖2繪示比較根據本發明之第一例示性實施例之探針 100與不具有導電構件160的探針之電阻值之圖表。 201200879 如圖1所示’導電構件⑼可包含盤 個探針進行測試。 w财〃別對100 阻值，士且;茸量測上部柱塞與下部柱塞之間的總電 塞與上部標準差。總電阻值意謂來自下部柱 〜在=之間的二條錢傳輸路徑的電阻值之總和。 子導電構件15〇之情況下（[表1]中之「b )， 自100個探針量測之電阻值（ 丄 值為⑽，平均值為27.3,且跑m為9G.8最小 發Γ之第—例示性實_，在存在導電構件 之^兄下（[表1]中之「A」），自相同數目之探斜|.0| 之電阻值（ΠΙΩ) 探針量測 & 1Q 大值為41.6，最小值為15.0，平均值 為19.3,且標準差為31。 卞]值 將上述内容如下概述於表格中。 [表1] 平均值 —準差 最大值 最小值 19.3 一 3.1 41.6 15.0 27.3 _7.0 90.8 18.9 量測之電阻丨ιηΩΙ _中設置導電構件trt例示性實施例，若於探針 標準差減小55%錢p ^平均電阻錢小約3G%，且 探針動具有更穩定根據第一例不性實施例之 兀件之間穩定地傳輸剌試信號。 等體 201200879 如圖3至圖5所示，根據本發明之第二例示性實施例 之探針100a包含上部柱塞ι1〇、下部柱塞12〇、彈性構件 140、導電構件16〇以及圓筒13〇。 在根據本發明之第一例示性實施例之導電構伴15〇的 情況下，導電構件150之多個相對末端分別接觸上部柱塞 11〇與下部柱塞120。同時，根據本例示性實施例之導電構 件160的多個相對末端的至少其中之一並不接觸上部柱塞 110與下部柱塞120。 圖3以及圖4繪示第一末端被隔開而不與上部柱塞 110接觸之導電構件160。然而，導電構件16〇之多個相對 末端可與上部柱塞11G以及下部柱塞12G隔開而不與其接 觸。在此種情況下，導電構件160可由圓筒130經由連接 至圓筒130之連接件（未圖示）來支撐。 如圖5所示，由於導電構件之外徑小於彈性構件 140之内徑，故導電構件16〇可容納於彈性構件14〇中。 導電構件160之第一末端與上部柱塞11〇關達 足間隙G，且其第二末端接觸下部柱塞12〇。 返回至圖3 ’除非半導體元件1〇向下移動，且焊球^ 接觸上部柱塞11G並施加外力至探針難，爛上 110與下部柱塞12G由彈性構件⑽彼此關。因此，導 =冓件160的多個相對末端的至少其中之—是與上部柱塞 以及下部柱塞120隔開而不與其接觸。 導電構件160在不被按壓時具有長度H1。 上部柱塞110與下部柱塞12〇之間的間隙為g +钔。 12 201200879 0圔4所示，若將外力施加至探針1〇〇a ,則上 110以及下部柱塞120克服彈性構件14〇之彈性 移，且彼此接近。更具體言之，由於上部柱塞U0黏= 圓同130 ’且下部柱塞12G峰載板2G支樓，故彈性構件 1JK)被_，且上部柱塞11〇以及圓筒13〇肖下移動。接 者’上部柱塞U0之彈性構件觸點出接觸導電構件⑽。 因此’測試信號（電流）得以經由導電構件16〇、彈201200879, the example provides a probe that will reduce the cost of testing. The conductive device is connected to the semiconductor device and the tester to test the connection to the material to be corrected; 'the surface is electrically J plunger, and the tester is Elastic member (a) her member) 'private _ red sage between the plugs, ί pluck the pl plunger and the lower plunger to separate them from each other, the conductive member (C〇ndUCtlvemember), its placement Inside or outside the elastic member, and electrically connecting the upper plunger and the lower plunger; and '(banrel)' accommodating the upper escaping, the lower plunger, the elastic member, and The conductive member. The conductive member may electrically connect the upper post only when at least one of the upper plunger and the lower plunger moves toward the other of the upper plunger and the lower plunger Plug with the lower plunger. The electrically conductive member selectively contacts at least one of the upper plunger and the lower plunger. The conductive member may apply an elastic force to at least one of the upper plunger and the lower plunger to space the upper plunger and the lower plunger from each other. The electrically conductive member may comprise at least one of a conductive coil spring and a conductive rubber. The above and/or other aspects will be exemplified from the following figures: 201200879. The description is easy to see and easier to understand. [Embodiment] Hereinafter, the exemplary embodiments will be described in detail with reference to the accompanying drawings, so as to be easily implemented by those skilled in the art. The illustrative embodiments may be embodied in a variety of shapes and are not limited to the illustrative embodiments described herein. Descriptions of well-known components are omitted for clarity, and the same reference numerals are used throughout to represent the same elements. / As shown in FIG. 1 'The probe 100 according to the first exemplary embodiment of the present invention includes an upper plunger 11 〇; a lower plunger 12 〇; an elastic member (10) elastically biasing the upper plunger 110 下部 lower plunger 12 〇 to be separated from each other; conductive member 150 disposed in the elastic member 14 ;; and 琦 130 130 ' wherein the upper plunger 11 〇 and the lower plunger 12 〇, elastic member 140, and a conductive member 150. The upper plunger 11G includes a tip lu which contacts the solder ball 11' of the semiconductor element ί's groove 113' which is formed in the periphery of the upper plunger 11〇, and the elastic member contact (contact ) ii5, the outer diameter of the contact elastic tip 111 may be larger than the inner diameter of the cylinder 130. The upper plunger can be fixed to the cylinder 130 by the user by pushing the upper plunger 110 to the cylinder 13 until the recess 113 holds the projection 131 of the crucible 130 (to be described later). Fig. 1 shows that the tip end 111 is shaped like a crown, on which a plurality of triangular pyramids are formed, but the shape of the tip end 111 is not limited thereto. Alternatively, the shape of the tip ill may depend on the shape of a contact target 201200879 • t • One change. For example, if the semiconductor element 10 comprises a semiconductor wafer in the form of a bau grid array, the tip end lu can be shaped like a crown as above. Further, the tip end 111 may have an A-shape having a single sharp tip or a dimple shape in which the inside is recessed to insert the solder ball n therein. Further, if the contact target is a pad, the tip ηι may be formed into a hemispherical shape such as the tip end 121 of the lower plunger 120 (to be described later). The groove 113 of the upper plunger 110 is coupled to the protrusion 131 of the cylinder 13 . #上. The 卩 plunger 110 is coupled to the cylinder 130 such that the upper plunger no does not move up and down and adheres to the cylinder 13 〇. The elastic member contact 115 may be shaped to have a conical shape that protrudes toward the lower plunger 12b. In some cases, the elastic member contact 115 may be formed in a cylindrical shape, and the elastic member 140 is inserted therein. The elastic member contact 115 may have other various shapes as long as it can maintain contact with the elastic member 14A. The upper plunger 110 can be formed as a single body. The lower plunger 120 includes a tip πΐ that contacts the load of the tester, 20 of the pads 21; a body 122' that is held by the tip end 132 of the cylinder 130; and an elastic member contact 123 that contacts the resilient member 14''. The tip 121 may be shaped in a hemispherical shape to easily contact the pad 21. The outer diameter D1 of the main body 122 is larger than the inner diameter D3' of the tip end 132 of the cylinder 13'' and smaller than the inner diameter D2 of the cylinder 13''. Therefore, the lower plunger 12A can be inserted via the second end of the cylinder 130, and the body 122 is held by the tip 132 so that the lower plunger 12〇 does not separate toward the carrier plate 2〇. The elastic member contact 123 may be shaped like a cone that protrudes toward the upper plunger 11b. Further, the elastic member contact 123 may be formed in a cylindrical shape, and the elastic member 201200879 may be inserted into the t_.. The geometric member contact 123 may have other portions which are required to maintain contact with the elastic member 140. The lower plunger 120 can be formed as a single body. From the cylinder 130, the upper plunger 110, the lower plunger 120, the elastic member 140, and the conductive member 15A. The reciprocating cylinder 130 may be formed in a cylindrical shape with its upper side open to insert the upper plunger 110 therein. 113 Γ 130 includes a protrusion 131 which is held by the recess 3 of the upper plunger 110; and a tip 132' which prevents the lower plunger 120 from being separated downward. If an external force greater than the elastic bias of the elastic member 14(4) is applied, the lower plunger 120 can move toward the upper plunger 11〇. The tip 132 acts as a stopper, which adjusts the lower plunger 12 downward. The cylinder 130 t accommodates the upper plunger 110 and the lower plunger 12A to smash the tip end 111 of the upper plunger 11G and the tip end 121 of the lower plunger 12G. The elastic member 140 is disposed on the upper plunger 11〇. The upper plunger 11G and the lower post I 12 () are elastically biased from the lower plunger 12 以 to be spaced apart from each other. The elastic member 140 may include a conductive metal. The conductive member 150 is electrically connected to the upper plunger 11 The first end of the conductive member 150 contacts the elastic member contact 115 of the upper branch plug HQ, and the second end of the conductive member 150 contacts the elastic member contact 123 of the lower plunger 12〇. The first end and the second end of 150 maintain contact with the resilient member 201200879 contact 115 and the resilient member contact 123, while 120 moves upward or downward regardless of the downward movement. 卩. The plunger conductive member 150 can be in the upper plunger 11〇 and Shang Shi: The force is one of the upper plunger (4) lower plunger = to ~. As shown in Fig. 1, the conductive member 15 is shaped. The outer diameter of the conductive member 15G is smaller than the miscellaneous core (9). The coil spring conductive member 150 can be accommodated in the elastic member. 14. The internal control of the conductive member 15 can therefore comprise a conductive rubber scale plastic in the case of a conductive metal H. When it is not a ruthenium such as ♦, the mine guide κ 橡胶 rubber can have a conductive f 々 conductive member The material of 15G is thinner than the foregoing materials, and may include other various materials as long as it is electrically conductive. The conductivity of the conductive member 150 is preferably equal to or higher than that of the housing and is electrically conductive, and the plunger member is accommodated in the housing. 140 and the conductive member 15A. Therefore, a material having high == and good electrical conductivity can be used for the cylinder 130. The conductive member 150 can be made of a material that is electrically conductive and electrically conductive. The conductive member 150 of the crucible It can be the same material as Shangdu Mahong 11Λ. Xingshang #塞110 and lower plunger 120 are in the state of 'the needle 100 is accommodated in the socket housing 210. The tip of the plug is 0 to the probe 100, to If the upper column is gripped, the lane will be recognized. The tip end 121 of the crucible plunger 120 is exposed to the outside. The operator of the 70 10 (not shown) presses down the half 201200879 conductor element 10' and causes the solder ball u of the semiconductor element 10 to contact the upper plunger 11'' to test the signal ( The current) is transmitted from the carrier 20 to the semiconductor element 1 via contact with the lower plunger 12 〇 and the carrier 20 . The & member 140 can absorb any shock that may be caused by pressing down the semiconductor element 1 ( (shock) The test signal (current) applied by the carrier 20 of the tester is transmitted to the solder ball 11 of the semiconductor component via the upper plunger 110 according to the following three paths: 1) First path: contact lower portion of the pad 21 Plunger 12〇-elastic member 140-> upper plunger 110; 2) second path: lower plunger 12〇—conductive member 15〇—upper plunger 110; and 3) third path: lower plunger 120 ( By the contact of the main body 122 of the lower plunger 12 with the tip 132 of the _ 13 )), the cylinder i3 〇 - the plunger 110. The above three paths have the same configuration as a closed circuit with three parallel circuits. Due to A, the overall resistance value of the probe 100 is significantly reduced to stably transmit the test signal. In the first exemplary embodiment of the present invention, the upper plunger 110 is adhered to the cylinder 130' and the lower plunger 120 is moved up and down with respect to the cylinder 13 but is not limited thereto. Alternatively, the upper plunger 11G can be moved up and down, and the lower plunger 120 can be adhered to the cylinder 13 〇. 2 is a graph comparing the resistance values of the probe 100 and the probe having no conductive member 160 in accordance with the first exemplary embodiment of the present invention. 201200879 As shown in Fig. 1, the conductive member (9) may include a disk probe for testing. The 〃 〃 对 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 The total resistance value means the sum of the resistance values from the lower column ~ between the two money transmission paths between =. In the case of the sub-conductive member 15 ("b" in [Table 1], the resistance value measured from 100 probes (the value of 丄 is (10), the average value is 27.3, and the running m is 9G.8 minimum hairpin The first - exemplary real _, in the presence of conductive members of the brother ("A" in [Table 1]), from the same number of probes |. 0 | resistance value (ΠΙ Ω) probe measurement & The 1Q large value is 41.6, the minimum value is 15.0, the average value is 19.3, and the standard deviation is 31. 卞] Values The above are summarized in the table below. [Table 1] Average value - the maximum value of the standard deviation is 19.3 A 3.1 41.6 15.0 27.3 _7.0 90.8 18.9 The measured resistance 丨ιηΩΙ _ is set in the illustrative embodiment of the conductive member trt, if the standard deviation of the probe is reduced by 55%, the average resistance is about 3G%, and the probe is moved. The test signal is stably transmitted between the components according to the first exemplary embodiment. The body 201200879 is shown in FIGS. 3 to 5, and the probe 100a according to the second exemplary embodiment of the present invention includes The upper plunger ι1〇, the lower plunger 12〇, the elastic member 140, the conductive member 16〇, and the cylinder 13〇. In the first aspect according to the present invention In the case of the conductive configuration of 15 〇 of the exemplary embodiment, the plurality of opposite ends of the conductive member 150 contact the upper plunger 11 〇 and the lower plunger 120, respectively. Meanwhile, the plurality of conductive members 160 according to the present exemplary embodiment At least one of the opposite ends does not contact the upper plunger 110 and the lower plunger 120. Figures 3 and 4 illustrate the conductive member 160 with the first end spaced apart from contact with the upper plunger 110. However, the conductive member A plurality of opposite ends of 16 turns may be spaced apart from contact with the upper plunger 11G and the lower plunger 12G. In this case, the conductive member 160 may be connected to the cylinder 130 via the connector 130 (not shown) As shown in Fig. 5, since the outer diameter of the conductive member is smaller than the inner diameter of the elastic member 140, the conductive member 16A can be accommodated in the elastic member 14A. The first end of the conductive member 160 and the upper plunger 11 is closed to the gap G, and the second end thereof contacts the lower plunger 12〇. Returning to Fig. 3 'unless the semiconductor element 1〇 moves downward, and the solder ball ^ contacts the upper plunger 11G and applies an external force to the probe. , rotten on 110 and under The plungers 12G are closed to each other by the elastic members (10). Therefore, at least one of the plurality of opposite ends of the guide member 160 is spaced apart from and not in contact with the upper plunger and the lower plunger 120. The conductive member 160 is not The pressing has a length H1. The gap between the upper plunger 110 and the lower plunger 12〇 is g + 钔. 12 201200879 0圔4, if an external force is applied to the probe 1〇〇a, the upper 110 and the lower portion The plunger 120 overcomes the elastic movement of the elastic members 14 and is close to each other. More specifically, since the upper plunger U0 is viscous = the same as 130' and the lower plunger 12G is the peak carrier 2G branch, the elastic member 1JK) is moved, and the upper plunger 11 〇 and the cylinder 13 are moved downward. . The elastic member contact of the upper plunger U0 contacts the conductive member (10). Therefore, the test signal (current) can be smashed and bombed via the conductive member 16.
件H0以及上部柱塞11〇❿自承載板2〇傳輸至半導體元 10。 i 意即 :據第 ，.例示性實施例，導電構件160僅當測 =+導^元件_指時接觸上雜塞⑽以及下部柱塞 。右未進行測試，則導電構件⑽與上部柱塞ιι〇以及 :部柱塞12G兩者皆隔開，或與上部柱塞m以及下部柱 塞120的至少其中之—隔開而不接觸。 當因向下按壓半導體元件1〇而使圓筒13〇向下移動 130之_與下部柱塞12()之外表面彼此接觸， 下部柱塞12G、圓筒130以及上部柱塞110之電流 。此外，亦形成下部柱塞120、彈性構件14〇以 雜塞110之路徑以及下部柱塞12〇、導電構件16〇 f啼上雜塞11G之路徑。因此，可更穩定地傳輸該測試 1吕就0 ，筒13G在施加外力前後之雜距離了是與導電構件 與上部柱塞丨i〇之_預定_ G相同或大於該預定 ，、。該移動距離J屬於圓筒之尖端132在施加外力前 13 201200879 之位置γ〇與施加外力後之位置Y1之間的差異。 思即，上部柱塞110與下部柱塞12〇之間在施加外力 後之間隙H2是與導電構件i 6 〇之長度Η丨相同或小於該長 度 HI (H2<H1)。 如圖6戶斤示，根據本發明之第三例示性實施例之探針 100b包含上部柱塞110、下部柱塞12〇、彈性構件14〇、導 電構件170以及容納前述元件之圓筒。 根據第二例示性實施例之導電構件16〇包含盤簧但 根據第三例示性實施例之導電構件17G可包含圓柱形管， 但不限於此。或者，根據本例雜實施狀導電構件17〇 可具有各種雜，例如三肖形、矩形或其他多邊形或擴圓 形。 下部柱塞120可更包含朝向導電構件17〇突出之突起 I24。成形為桿狀之導電構件m可以按壓方式插入於突 124 中。 導電構件170可包含薄且可高度地導電之金屬。 導電構件170可包含導電合成樹脂（c〇nducdve synthetic resin ) 〇導電合成樹脂中可包括具有多個金屬球之 矽樹脂或橡膠以具有導電性。導電構件170可改變，只要 其可導電即可。 突起（未圖示）可形成於導電構件17〇中，且插入部 (未圖示）可升>成於下部柱塞中而以按壓方式將突起 插入其中。所述插入部可包含凹槽或突起。 如圖7所示，根據本發明之第四例示性實施例之探針 201200879 含上雜塞U〇、下部柱塞120、彈性構件190、導 電構件180以及容納前述元件之圓筒13〇。 彈性構件190之多個相對末端接觸上部柱塞削以及 下部柱塞120 ’且彈性地偏置柱塞11〇與12〇則吏其彼此 隔開。 導電構件180設於彈性構件19〇外部。意即，導電構 件180之内徑大於彈性構件19〇之外徑。 、導電構件180之第-末端與上部柱塞UQ隔開達預定 間隙G’且其第二末端接觸下部柱塞m。當施加外力時， 導電構件180之多個相對末端可與上部柱塞110以及下部 柱塞120隔開。在施加外力的情況下，意即，僅當半導體 兀件ίο向下移動且按壓上部柱塞110時，上部柱塞11〇 與下。卩柱塞120之間的間隙才減小，且導電構件18〇之多 個相對末端可接觸上部柱塞11〇以及下部柱塞12〇。 如圖8所示，根據本發明之第五例示性實施例之探針 l〇〇d包含上下移動之上部柱塞110a、下部柱塞12〇、彈性 地偏置上部柱塞ll〇a與下部柱塞12〇以使其彼此隔開之彈 性構件140、導電構件150以及圓筒130a。 儘管根據第一至第四例示性實施例之上部柱塞11()黏 附至圓琦130，但根據本例示性實施例之上部柱塞11〇a可 相對於圓筒130a而上下移動。 圓筒130a將上部柱塞110a以及下部柱塞120可移動 地容納於其中。 圓筒130a更包含尖端133，所述尖端133向内彎曲以 15 201200879 防止上部柱塞ll〇a向上分離。 在^到屢力時，上部柱塞施向下移動且上部柱塞 目=錐輸生構件觸點115接觸導電構件150。因此， ，私號（電流）經由下部柱塞m、圓筒ma 件150以及彈性構件14〇而傳輸至上部柱塞隐。 所7’根據本發明之第六例示性實施例之探針 職包含上下飾之上躲塞施、下部減隱、彈 1生22，塞隱與下部柱塞12如以使其彼此隔開 之彈|±構件140、導電構件17〇以及圓筒13〇a。 如上所述，根據本發明之探針具有以下效果·· 1) 由於在探針中設有另—導電構件， 一測試信號； 心t埒鞠 2) 可獲得相對簡單之組態’且可改良導電性；以及 3) 可降低測試成本。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明’任何熟習此技藝者，在不脫離本發明之 和範圍内，當可作些許之更動與潤飾，因此本發明之保 範圍當視後附之申請專利範圍所界定者為準。 ° 【圖式簡單說明】 圖1為根據本發明之第一例示性實施例之探針以 納有所述探針之測試插座之示意性剖視圖。The piece H0 and the upper plunger 11 are transported from the carrier plate 2 to the semiconductor element 10. i means that, according to the exemplary embodiment, the conductive member 160 contacts the upper plug (10) and the lower plunger only when the sensor is measured. When the test is not performed right, the conductive member (10) is spaced apart from both the upper plunger ι and the portion plunger 12G, or is spaced apart from at least one of the upper plunger m and the lower plunger 120. When the cylinder 13 is moved downward by the downward pressing of the semiconductor element 1 to the lower surface of the lower plunger 12 (), the lower plunger 12G, the cylinder 130, and the upper plunger 110 are in contact with each other. Further, a path is formed in which the lower plunger 120, the elastic member 14 is in the path of the plug 110, and the lower plunger 12, and the conductive member 16 is on the plug 11G. Therefore, the test 1 can be transmitted more stably. The misalignment of the barrel 13G before and after the application of the external force is the same as or greater than the predetermined value of the conductive member and the upper plunger Gi. The moving distance J belongs to the difference between the position γ of the tip end 132 of the cylinder before the application of the external force 13 201200879 and the position Y1 after the application of the external force. It is to be understood that the gap H2 between the upper plunger 110 and the lower plunger 12A after applying an external force is the same as or smaller than the length HI of the conductive member i 6 H (H2 < H1). As shown in Fig. 6, the probe 100b according to the third exemplary embodiment of the present invention includes an upper plunger 110, a lower plunger 12A, an elastic member 14A, a conductive member 170, and a cylinder accommodating the aforementioned elements. The conductive member 16A according to the second exemplary embodiment includes a coil spring, but the conductive member 17G according to the third exemplary embodiment may include a cylindrical tube, but is not limited thereto. Alternatively, the conductive member 17A according to the present embodiment may have various kinds of impurities such as three-Shaw shape, rectangular shape or other polygonal shape or rounded shape. The lower plunger 120 may further include a protrusion I24 that protrudes toward the conductive member 17A. The conductive member m formed into a rod shape can be inserted into the projection 124 in a pressing manner. Conductive member 170 can comprise a thin, highly conductive metal. The conductive member 170 may include a conductive synthetic resin. The conductive synthetic resin may include a ruthenium resin or a rubber having a plurality of metal balls to have conductivity. The conductive member 170 can be changed as long as it is electrically conductive. A protrusion (not shown) may be formed in the conductive member 17A, and an insertion portion (not shown) may be raised into the lower plunger to insert the protrusion therein in a pressing manner. The insertion portion may include a groove or a protrusion. As shown in Fig. 7, a probe 201200879 according to a fourth exemplary embodiment of the present invention includes a plug U 〇, a lower plunger 120, an elastic member 190, a conductive member 180, and a cylinder 13 accommodating the aforementioned elements. The plurality of opposite ends of the resilient member 190 contact the upper plunger and the lower plunger 120' and elastically bias the plungers 11 and 12 to be spaced apart from one another. The conductive member 180 is provided outside the elastic member 19〇. That is, the inner diameter of the conductive member 180 is larger than the outer diameter of the elastic member 19'. The first end of the conductive member 180 is spaced apart from the upper plunger UQ by a predetermined gap G' and the second end thereof is in contact with the lower plunger m. When an external force is applied, the plurality of opposite ends of the conductive member 180 may be spaced apart from the upper plunger 110 and the lower plunger 120. In the case where an external force is applied, that is, only when the semiconductor element ίο moves downward and the upper plunger 110 is pressed, the upper plunger 11 is depressed. The gap between the jaws 120 is reduced, and the plurality of opposite ends of the conductive member 18 can contact the upper plunger 11 and the lower plunger 12A. As shown in FIG. 8, the probe 10d according to the fifth exemplary embodiment of the present invention includes moving the upper plunger 110a up and down, the lower plunger 12a, and elastically biasing the upper plunger 11a and the lower portion. The plunger 12 is bent to be separated from each other by the elastic member 140, the conductive member 150, and the cylinder 130a. Although the upper plunger 11() is adhered to the circular 130 according to the first to fourth exemplary embodiments, the upper plunger 11〇a may be moved up and down with respect to the cylinder 130a according to the present exemplary embodiment. The cylinder 130a movably houses the upper plunger 110a and the lower plunger 120 therein. The cylinder 130a further includes a tip end 133 that is bent inwardly to 15 201200879 to prevent the upper plunger ll 〇 a from separating upward. When the force is repeatedly applied, the upper plunger is moved downward and the upper plunger = cone-shaped member contact 115 contacts the conductive member 150. Therefore, the private number (current) is transmitted to the upper plunger through the lower plunger m, the cylindrical member 150, and the elastic member 14?. According to a sixth exemplary embodiment of the present invention, the probe position includes a top and bottom trim, a lower recess, a lower 22, and a lower plug 12 to separate them from each other. The spring|± member 140, the conductive member 17〇, and the cylinder 13〇a. As described above, the probe according to the present invention has the following effects: 1) Since another conductive member is provided in the probe, a test signal; the heart t埒鞠2) can obtain a relatively simple configuration' and can be improved Conductivity; and 3) reduce test costs. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the invention, and the invention may be modified and modified without departing from the scope of the invention. The scope of coverage is subject to the definition of the scope of the patent application attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view of a test socket in which a probe according to a first exemplary embodiment of the present invention is incorporated.
圖2繪示用於比較本發明之第一例示性實施例之 的電阻之圖表。 T 圖3以及圖4為根據本發明之第二例示性實施例之探 201200879 針在接受外力前後的縱向剖面圖。 圖5為圖3中之探針之橫。 圖6為根據本發明之第= 性縱向剖面圖。 二例示性實施例之探針的示意 性縱據本發明之第四例示性實施例之探針的示意Fig. 2 is a diagram for comparing the resistance of the first exemplary embodiment of the present invention. Figure 3 and Figure 4 are longitudinal cross-sectional views of the 201200879 needle before and after receiving an external force in accordance with a second exemplary embodiment of the present invention. Figure 5 is a cross section of the probe of Figure 3. Figure 6 is a longitudinal cross-sectional view showing the same according to the present invention. Schematic representation of the probe of the two exemplary embodiments in accordance with the schematic of the probe of the fourth exemplary embodiment of the present invention
性縱據本發明之第五例示性實施例之探針的示意 圖9為根據本發明之第六例示性實施例之 性縱向剖面圖。 不思 【主要元件符號說明】 10 :半導體元件 11 :焊球 20 :承载板 21 :焊墊 100 ··探針 l〇〇a :探針 100b :探針 100c :探針 i〇〇d :探針 l〇〇e :探針 110 :上部柱塞 110a :上部柱塞 111 :尖端 17 201200879 113 :凹槽 115 :彈性構件觸點 120 :下部柱塞 121 :尖端 122 :主體 123 :彈性構件觸點 124 :突起 130 :圓筒 130a :圓筒 131 :突起 132 :尖端 133 :尖端 140 :彈性構件 150 :導電構件 160 :導電構件 170 :導電構件 180 :導電構件 190 :彈性構件 210 :插座外殼 D1 :外徑 D2 :内徑 D3 :内徑 G :間隙 H1 :長度 18 201200879BRIEF DESCRIPTION OF THE DRAWINGS A schematic view of a probe according to a fifth exemplary embodiment of the present invention is a longitudinal sectional view of a sixth exemplary embodiment of the present invention. Do not think [main component symbol description] 10: semiconductor component 11: solder ball 20: carrier plate 21: pad 100 · probe l〇〇a: probe 100b: probe 100c: probe i〇〇d: probe Needle l〇〇e: probe 110: upper plunger 110a: upper plunger 111: tip 17 201200879 113: groove 115: elastic member contact 120: lower plunger 121: tip 122: body 123: elastic member contact 124: protrusion 130: cylinder 130a: cylinder 131: protrusion 132: tip 133: tip 140: elastic member 150: conductive member 160: conductive member 170: conductive member 180: conductive member 190: elastic member 210: socket housing D1: Outer diameter D2: Inner diameter D3: Inner diameter G: Clearance H1: Length 18 201200879
H2 :間隙 J:移動距離 Y0 :位置 Y1 :位置 19H2 : clearance J: moving distance Y0 : position Y1 : position 19