201145315 六、發明說明： 【發明所屬之技術領域】 [喔]本發明係有關一種異方性導電膜及其製造方法，特別有 關於導電粒子漸次分佈結構》 【先前技術】201145315 VI. Description of the invention: [Technical field to which the invention pertains] [喔] The present invention relates to an anisotropic conductive film and a method of manufacturing the same, and more particularly to a progressive distribution structure of conductive particles. [Prior Art]
[0002] 異方性導電膜（Ani sotropi c conduct i ve f i 1 m ’ ACF )主要成分包含樹脂與導電粒子，主要用於連接不同基 材和線路’此兩種不同基材的連接需要互相導通，而異 方性導電膜具有上下（Z方向）電氣導通，左右平面（X 〇 及γ方向）絕緣的特性，並且需要具有優良的防濕、接着 、導電及絕緣的特性》 [0003] 異方性導電膜兼具單向導電及膠合固定的功能，主要應 ..:: ... .... 用在不適合以1¾溫錯錫焊接的製程，例如液晶顯示面板 與驅動1C之訊號傳輸連結。製造上是將導電粒子與樹脂 混合的漿料’藉由高精度的塗佈技術塗佈在一剝離層上 - ；：. ’該剝離層係用於保護異方隹導電膜，避免其受到外界 Q 的污染。 [讓]LCD隨著高精細化之發展’LCD面板利用捲帶式封裝（[0002] The main component of the anisotropic conductive film (Ani sotropi c conduct i ve fi 1 m ' ACF ) contains resin and conductive particles, which are mainly used to connect different substrates and circuits. The connection between the two different substrates needs to be mutually conductive. The anisotropic conductive film has upper and lower (Z-direction) electrical conduction, left and right plane (X 〇 and γ directions) insulation characteristics, and needs to have excellent moisture resistance, adhesion, electrical conductivity and insulation properties. [0003] The conductive film has the functions of unidirectional conduction and gluing, and should mainly be used in processes that are not suitable for welding with 13⁄4 temperature-corrected tin, such as the liquid crystal display panel and the signal transmission link of driving 1C. . The slurry which is prepared by mixing the conductive particles and the resin is coated on a release layer by a high-precision coating technique-;:. 'The release layer is used to protect the anisotropic conductive film from being exposed to the outside. Q pollution. [Let] LCD with high-definition development' LCD panel utilizes tape and reel packaging (
Tape carrier package，TCP)的連接或玻璃覆晶基板 (Chip on glas s，COG)連接大多要求連接間距微細化 。尤其是COG連接由於將1C晶片的凸起作為連接電極，因 而連接面積比TCP連接小，所以要確保在微小連接電極上 導通’如何捕捉足夠數量的導電粒子在獲得高連接信賴 性上為十分重要的課題。‘ [0005] 099118652 為了解決此問題，已有許多異方性導電膜結構被提出。 表單編號A0101 第3頁/共16頁 0992033034-0 201145315 一種改良結構則採用兩層式的異方性導電膜，如第一圖 所示，此種異方性導電膜1具有習知含有導電粒子之絕緣 樹脂的下層2，以及不含導電粒子而只有絕緣樹脂的上層 3。使用兩層式異方性導電膜，可降低導電粒子橫向接觸 的機率。 [0006] 例如，美國專利公告第6, 020, 059號，提供一種多層式 異方性導電膜，其包含異方性導電黏著層及與其層合的 至少一絕緣黏著層，可用於COG技術，因異方性導電膜經 假壓預貼後，可直接靠近面板上的銦錫氧化物（IT0)導 電墊，再經本壓後，可以有效提高導電墊上導電粒子的 捕捉率。但是，此種多層式異方性導電膜在成膜製程上 必須塗佈多次，在厚度精度控制上比單層結構的異方性 導電膜困難，會增加產品製造成本和機台維護或改造成 本，且由於異方性導電黏著層的厚度須減薄，因此增加 導電粒子均勻分佈的難度。 [0007] 另一種異方性導電膜之連接方法，如台灣專利1 2 74780， 係將異方性導電膜配方中加入光硬化劑，以光罩配合IC 連接電極的設計圖形進行光線照射之曝光部進行光聚合 ，而增加其熔融黏度。經本壓後，可以有效提高導電墊 上導電粒子的捕捉率。但是，此種光硬化異方性導電膜 在光硬化製程上必須對位精確，且光罩須搭配晶片之設 計圖形進行曝光，會增加產品製造成本。 [0008] 有鑑於此，本發明人為改善並解決上述之缺失，乃特潛 心研究並配合學理之運用，終於提出一種設計合理且有 效改善上述缺失之本發明。 099118652 表單編號A0101 第4頁/共16頁 0992033034-0 201145315 [0009] 【發明内容】 本發明係有關一種異方性導電膜的製造方法 習知兩層式的異方性導電膜不易加n點 成膜時’可藉由施加-分開手段，例如重力 場作用配合漿料固形份（黏度）調整而達成， 子漸次分佈集中於該樹脂材料之—側。如此 製程做出橫向不導電的異方性導電膜。 ’為了改善 。於該漿料 、電場、磁 使該導電粒 ’利用簡單 [0010]Ο 為達上述功效，本發明係提供—種異方性 方法，包含以下步驟：混合—導電 、^ ”， 材料及 一浴劑，以形成—漿料；及施加—分開手段，例如重力 、電場'磁場作用，配合_份（財）調整於 成膜時使該導電粒子漸次分佈集中於該樹脂材料:一側 [0011] [0012]Ο 藉由本發明的實施，至対相下舰步功效： 1·施加的分開手段係為物供，易於增加至原成膜製 程’利用簡單製程做轉層聰有高導電粒子補捉 率的異方性導電膜。 2·本方法製造的異方性導電膜係為單層結構，且其中 之導電粒子係漸次分佈集中於該樹脂材料之一側， 而具有高的導電粒子捕捉率。 [0013] 為了使任何熟習相關技藝者了解本發明之技術内容並據 以實施，且根據本說明書所揭露之内容、”專利範圍 及圖式’任何熟習相關技藝者可輕易地理解本發明相關 之目的及優點’因此將在實施方式巾詳細敘述本發明之 詳細特徵以及優點。 099118652 表單編號A0I01 第5頁/共16頁 0992033034-0 201145315 【實施方式】 [0014] 請參閱第二圖，第二圖係顯示根據本發明之實施例所製 造的異方性導電膜之結構，如第二圖所示，該異方性導 電膜10，包含一導電粒子20及一樹脂材料層30，其中該 導電粒子20係漸次分佈集中於該樹脂材料層30之一側。 使該導電粒子20漸次分佈集中於該樹脂材料層30之一側 ，係藉由施加一分開手段，例如重力、電場、磁場作用 配合漿料固形份（黏度）調整而達成。 [0015] 請參閱第三圖，第三圖係顯示本實施例之異方性導電膜 的製造方法之步驟，如第三圖所示，該製造方法包含以 下步驟：首先如步驟100，混合一導電粒子、一樹脂材料 及一溶劑，以'形成一漿料。其中，該導電粒子成份為鎳 、金、鋁、銅等，或表面以金屬（鎳、金、鋁、銅等） 鍍敷被覆之樹脂粒子及將此等絕緣被覆之粒子等；該樹 脂材料係熱固或熱塑高分子材料或二者混合，如環氧樹 脂或聚亞醯或壓克力樹脂或PU樹脂等。 [0016] 步驟102，施加一分開手段，例如重力、電場、磁場作用 ，於漿料成膜時使導電粒子漸次分佈集中於樹脂材料之 一側。請一併參閱第四圖，第四圖係顯示利用重力使導 電粒子沈降於漿料下部，由於導電粒子皆具有一定比重 ，一段時間後可因重力逐漸沈降於漿料下部。又，為了 使粒子在重力作用下容易發生沈降，可降低漿料中固形 份的量，使漿料的黏度下降，減少粒子的黏滯力，降低 導電粒子移動的阻力，如第四圖所示，導電粒子20沈降 於漿料下部，達成導電粒子漸次分佈單層結構之目的。 099118652 表單編號A0101 第6頁/共16頁 0992033034-0 201145315 [0017] Ο 再者’請參閱第五圖，第五圖侧示施加電場使導電粒 子移動至賴下部。首先為了使粒子容易發生沈降可 降低激料中固形份的量，使㈣的黏度下降，減少粒子 、黏滞力降低導電粒子移動的阻力，再於成膜製程綱 中增加-電場2G2,該電場2〇2係利用上下兩片金屬板分 别，至—功電池（未圖示）的正負極而形成。應注意 的是’該導電粒子2G通過該電場2()2前須先賦予電荷。接 者’將紫料均勻傾倒於成膜製程中的刮刀204前，藉由滾 筒206帶動往前經過刮刀綱，如第五圖所示，當抵達八位 置時，此時尚未受到電場2〇2作用，導電粒子2〇係均勻分 佈於漿料中’當聚料經過電場後，抵達β位置由於電場 作用’使導電粒子20朝向外加電場2Q2作用力所設計的移 動方向移動’達到導電粒子2〇漸次分佈單層結構之目的 ，最後通過一烘箱208進行乾燥處理。 [0018] Ο 此外，清參閱第六圖，第六圖係顯示施加磁場使導電粒 子移動至漿料下部。首先為了使粒子容易發生沈降，可 降低漿料中固形份的量，使槳才丼吟黏度下降，減少粒子 的黏滯力，降低導電粒子移動的阻力，再於成膜製程3〇〇 中増加一磁場302，該磁場302係利用一磁鐵3〇3形成。 接著’將漿料均勻傾倒於成膜製程中的刮刀304前，藉由 滾筒306帶動往前經過刮刀3〇4，如第六圖所示，當抵達a 位置時’此時尚未受到磁場302作用，導電粒子20係均勻 分佈於漿料中，當漿料經過磁場後，抵達B位置，由於含 鐵、鈷、鎳成份之粒子’例如鎳粒子、鎳金合金粒子或 表面塗佈鎳金合金的樹脂球皆含有磁性材料及將此等絕 099118652 表單編號A0101 第7頁/共16頁 0992033034-0 201145315 緣被覆之粒子等，會受到磁場作用，使導電粒子20朝向 外加磁場302作用力所設計的移動方向移動，達到導電 粒子20漸次分佈單層結構之目的，最後通過一烘箱308進 行乾燥處理。 [0019] 請參閱第七圖，第七圖係顯示使用習知兩層結構、習知 單層結構與本實施例漸次分佈單層結構於COG上進行本壓 後的光學顯微鏡（0M)影像。第七圖中（A) 、（B)及 (C)分別代表習知兩層結構、習知單層結構與本實施例 漸次分佈單層結構之導電粒子捕捉率，比較可看出本實 施例漸次分佈單層結構之異方性導電膜確實能以簡單製 程製造，並具有高的導電粒子捕捉率。 [0020] 以上所述僅為本發明之較佳實施例，非用以限定本發明 之專利範圍，其他運用本發明之專利精神之等效變化， 均應倶屬本發明之專利範圍。 【圖式簡單說明】 [0021] 第一圖係顯示習知兩層式異方性導電膜的結構。 [0022] 第二圖係顯示根據本發明之實施例所製造的異方性導電 膜之結構。 [0023] 第三圖係顯示本實施例之異方性導電膜的製造方法之步 驟。 [0024] 第四圖係顯示利用重力使導電粒子沈降於漿料下部。 [0025] 第五圖係顯示施加電場使導電粒子移動至漿料下部。 [0026] 第六圖係顯示施加磁場使導電粒子移動至漿料下部。 099118652 表單編號A0101 第8頁/共16頁 0992033034-0 201145315 [0027] 第七圖係顯示習知兩層結構、習知單層結構與本實施例 漸次分佈單層結構之粒子捕捉率的比較。 【主要元件符號說明】 [0028] 1異方性導電膜 ' 2含有導電粒子之絕緣 3不含導電粒子之絕緣 10異方性導電膜 20導電粒子 3 0樹脂材料層 〇 100~102 步驟 200成膜製程 2 0 2電場 204刮刀 206滚筒 208烘箱 300成膜製程 -r-v 3 0 2 磁場 〇 303磁鐵 304刮刀 306滚筒 308烘箱 099118652 表單編號A0101 第9頁/共16頁 0992033034-0The connection of the tape carrier package (TCP) or the chip on glas s (COG) connection requires a fine connection pitch. In particular, since the COG connection uses the bump of the 1C wafer as the connection electrode, the connection area is smaller than that of the TCP connection, so it is important to ensure conduction on the micro connection electrode. How to capture a sufficient number of conductive particles is highly important in achieving high connection reliability. Question. [0005] 099118652 In order to solve this problem, many anisotropic conductive film structures have been proposed. Form No. A0101 Page 3 of 16 0992033034-0 201145315 A modified structure uses a two-layered anisotropic conductive film. As shown in the first figure, the anisotropic conductive film 1 has a conventional conductive particle. The lower layer 2 of the insulating resin and the upper layer 3 containing no conductive particles and only an insulating resin. The use of a two-layered anisotropic conductive film reduces the probability of lateral contact of the conductive particles. [0006] For example, US Patent Publication No. 6,020,059 provides a multilayered anisotropic conductive film comprising an anisotropic conductive adhesive layer and at least one insulating adhesive layer laminated thereon, which can be used for COG technology. Since the anisotropic conductive film is pre-adhered by the pseudo pressure, it can be directly adjacent to the indium tin oxide (IT0) conductive pad on the panel, and after the pressing, the capture rate of the conductive particles on the conductive pad can be effectively improved. However, such a multilayer anisotropic conductive film must be coated a plurality of times in the film forming process, and it is more difficult to control the thickness precision than the asymmetrical conductive film of a single layer structure, which increases the manufacturing cost of the product and the maintenance or modification of the machine. The cost, and because the thickness of the anisotropic conductive adhesive layer has to be thinned, it is difficult to increase the uniform distribution of the conductive particles. [0007] Another method for connecting an anisotropic conductive film, such as Taiwan Patent 1 2 74780, is to add a light hardener to an anisotropic conductive film formulation, and expose the light to a design pattern of a photomask and an IC connection electrode. The photopolymerization is carried out to increase its melt viscosity. After the pressure, the capture rate of the conductive particles on the conductive pad can be effectively improved. However, such a photohardenable anisotropic conductive film must be aligned accurately in the photohardening process, and the photomask must be exposed to the design pattern of the wafer, which increases the manufacturing cost of the product. In view of the above, the present inventors have made great efforts to improve and solve the above-mentioned shortcomings, and have finally made a proposal to rationally and effectively improve the above-mentioned defects. 099118652 Form No. A0101 Page 4 / Total 16 Page 0992033034-0 201145315 [0009] [Invention] The present invention relates to a method for manufacturing an anisotropic conductive film. It is known that a two-layered anisotropic conductive film is difficult to add n points. The film formation can be achieved by an application-separation means such as a gravitational field action in combination with a slurry solid content (viscosity) adjustment, and the sub-gradual distribution is concentrated on the side of the resin material. Such a process produces an anisotropic conductive film that is laterally non-conductive. ‘To improve. In the slurry, electric field, and magnetic, the conductive particles are simply utilized [0010]. To achieve the above-mentioned effects, the present invention provides an anisotropic method comprising the following steps: mixing-conducting, ^", material and one bath. The agent is used to form a slurry; and an application-separating means, such as gravity, an electric field, a magnetic field, and a portion of the conductive particles are adjusted to form a film to gradually distribute the conductive particles to the resin material: one side [0011] [0012] By the implementation of the present invention, the effect of the ship to the next phase: 1 · The separate means of application is for the material supply, and it is easy to increase to the original film forming process 'Using a simple process to make the layered Cong with high conductive particles to capture An anisotropic conductive film. 2. The anisotropic conductive film produced by the method is a single layer structure, and the conductive particles are gradually distributed on one side of the resin material, and have a high conductive particle capture rate. [0013] In order to familiarize those skilled in the art with the technical content of the present invention and to implement it, and according to the disclosure of the present specification, "patent scope and schema" can be easily geographically familiar to those skilled in the art. Related objects and advantages of the present invention, 'therefore will be described in detail features and advantages of the present invention in detail embodiments towel. 099118652 Form No. A0I01 Page 5 of 16 0992033034-0 201145315 [Embodiment] [0014] Referring to the second drawing, the second drawing shows the structure of the anisotropic conductive film manufactured according to an embodiment of the present invention, As shown in the second figure, the anisotropic conductive film 10 includes a conductive particle 20 and a resin material layer 30, wherein the conductive particles 20 are gradually distributed on one side of the resin material layer 30. The gradual distribution of the conductive particles 20 on one side of the resin material layer 30 is achieved by applying a separate means such as gravity, electric field, or magnetic field to adjust the solid content (viscosity) of the slurry. [0015] Please refer to the third drawing, which shows the steps of the manufacturing method of the anisotropic conductive film of the embodiment. As shown in the third figure, the manufacturing method comprises the following steps: first, as in step 100, mixing one Conductive particles, a resin material and a solvent to form a slurry. Wherein, the conductive particle component is nickel, gold, aluminum, copper, or the like, or a resin particle coated with a metal (nickel, gold, aluminum, copper, etc.) and an insulating coated particle; the resin material is Thermosetting or thermoplastic polymer materials or a mixture of the two, such as epoxy resin or poly-arylene or acrylic resin or PU resin. [0016] Step 102, applying a separate means, such as gravity, electric field, magnetic field action, to gradually distribute the conductive particles on one side of the resin material when the slurry is formed into a film. Please refer to the fourth figure. The fourth figure shows that the conductive particles are settled in the lower part of the slurry by gravity. Since the conductive particles have a certain specific gravity, they can gradually settle in the lower part of the slurry due to gravity. Moreover, in order to make the particles easily settle under the action of gravity, the amount of the solid content in the slurry can be reduced, the viscosity of the slurry can be lowered, the viscous force of the particles can be reduced, and the resistance of the movement of the conductive particles can be reduced, as shown in the fourth figure. The conductive particles 20 are deposited on the lower portion of the slurry to achieve the purpose of gradually distributing the single layer structure of the conductive particles. 099118652 Form No. A0101 Page 6 of 16 0992033034-0 201145315 [0017] Ο Again, please refer to the fifth figure. The fifth figure shows the application of an electric field to move the conductive particles to the lower part. Firstly, in order to make the particles easy to settle, the amount of solids in the catastrophe can be reduced, the viscosity of (4) can be reduced, the resistance of particles and viscous force can be reduced, and the resistance of the movement of the conductive particles can be reduced, and then the electric field 2G2 is added to the film forming process. The 2〇2 system is formed by using two upper and lower metal plates to the positive and negative electrodes of a power battery (not shown). It should be noted that the conductive particles 2G must first be charged before passing through the electric field 2()2. The picker 'pour the purple material evenly before the scraper 204 in the film forming process, and the drum 206 drives forward through the scraper. As shown in the fifth figure, when the eight positions are reached, the electric field is not yet subjected to the electric field 2〇2 As a function, the conductive particles 2 are uniformly distributed in the slurry. 'When the polymer passes through the electric field, it reaches the β position. The electric field acts to move the conductive particles 20 toward the moving direction designed by the applied electric field 2Q2' to reach the conductive particles. The purpose of gradually distributing the single layer structure is finally dried by an oven 208. [0018] Further, referring to the sixth drawing, the sixth figure shows that the application of a magnetic field causes the conductive particles to move to the lower portion of the slurry. Firstly, in order to make the particles easy to settle, the amount of solid content in the slurry can be reduced, the viscosity of the paddle can be reduced, the viscosity of the particles can be reduced, and the resistance of the conductive particles can be reduced, and then the film formation process can be increased. A magnetic field 302 is formed by a magnet 3〇3. Then, 'the slurry is evenly poured before the scraper 304 in the film forming process, and the drum 306 is driven forward to pass the scraper 3〇4. As shown in the sixth figure, when it reaches the a position, it is not yet subjected to the magnetic field 302. The conductive particles 20 are uniformly distributed in the slurry. When the slurry passes through the magnetic field, it reaches the B position, because the particles containing iron, cobalt, and nickel components, such as nickel particles, nickel-gold alloy particles, or surface-coated nickel-gold alloy. The resin balls are all contained in a magnetic material and are designed such that they are subjected to a magnetic field to cause the conductive particles 20 to be biased toward the applied magnetic field 302, such as the particles of the edge-coated particles, etc., which are subjected to a magnetic field. The moving direction is moved to achieve the purpose of gradually distributing the single-layer structure of the conductive particles 20, and finally dried by an oven 308. Referring to the seventh drawing, the seventh drawing shows an optical microscope (0M) image after performing the local pressure on the COG using a conventional two-layer structure, a conventional single-layer structure, and a progressively distributed single-layer structure of the present embodiment. In the seventh figure, (A), (B) and (C) respectively represent the conventional two-layer structure, the conventional single-layer structure and the conductive particle capture rate of the gradually distributed single-layer structure of the present embodiment, and the present embodiment can be seen by comparison. The anisotropic conductive film in which the single-layer structure is gradually distributed can be manufactured in a simple process and has a high conductive particle capture rate. The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention, and other equivalent variations of the patent spirit of the present invention are intended to be within the scope of the invention. BRIEF DESCRIPTION OF THE DRAWINGS [0021] The first figure shows the structure of a conventional two-layered anisotropic conductive film. [0022] The second drawing shows the structure of an anisotropic conductive film manufactured according to an embodiment of the present invention. [0023] The third diagram shows the steps of the method of manufacturing the anisotropic conductive film of the present embodiment. [0024] The fourth figure shows that the conductive particles are settled to the lower portion of the slurry by gravity. [0025] The fifth figure shows the application of an electric field to move the conductive particles to the lower portion of the slurry. The sixth figure shows the application of a magnetic field to move the conductive particles to the lower portion of the slurry. 099118652 Form No. A0101 Page 8 of 16 0992033034-0 201145315 [0027] The seventh figure shows a comparison of the particle capture rates of the conventional two-layer structure, the conventional single-layer structure, and the progressively distributed single-layer structure of the present embodiment. [Description of main component symbols] [0028] 1 anisotropic conductive film ' 2 Insulation containing conductive particles 3 Insulation without conductive particles 10 Anisotropic conductive film 20 Conductive particles 3 0 Resin material layer 〇 100~102 Step 200 Membrane Process 2 0 2 Electric Field 204 Scraper 206 Roller 208 Oven 300 Film Forming Process - rv 3 0 2 Magnetic Field 303 Magnet 304 Scraper 306 Roller 308 Oven 099118652 Form No. A0101 Page 9 / Total 16 Page 0992033034-0