201134029 六、發明說明： 【發明所屬之技術領域】 本發明是具備可解放地選擇性地保持半導體裝置的保 持機構的半導體裝置用插槽。 【先前技術】 被安裝於電子機器等的半導體裝置[例如，積體電路 及1C封裝體（EIAJED-73 03 A :電子資訊技術產業協會規格） 所成者]’是在被安裝之前的階段進行著各種試驗而被去 除其潛在性缺陷。其試驗是例如半導體裝置被裝設於半導 體裝置用插槽內的狀態下被實施。 供作此種試驗的半導體裝置用插槽，一般是稱爲1C 插槽’配置於所定的印刷配線基板（測試板）。印刷配線基 板是具有供給有試驗電壓之同時，將表示從作爲被檢查物 的半導體裝置的短路等的異常檢測信號予以送出的輸出入 部。 半導體裝置用插槽是例如頂部開口式插槽的情形，也 • 如日本特開2 0 0 3 - 1 3 3 0 2 2號公報所示地，包含：配置於印 _ 刷配線基板（未圖示）上而將半導體裝置電性地連接於印刷 配線基板的接觸端子群予以收容的插槽本體，及對於插槽 本體內的接觸群配設於上方的位置而具有裝設著半導體裝 置的收容部的定位構件（在日本特開2〇〇3 - 1 3 3 022號公報中 被稱爲底座，及配置於定位構件的周圍而作爲具有將半導 ' 體裝置對於定位構件的收容部選擇性地保持的一對推壓構 -5- 201134029 件（例如在日本特開2 0 0 3 · 與推壓構件所構成）的保 的操作力，經由所定的驅 方式傳達至閂鎖機構的蓋 蓋體構件是半導體裝 時’在中央部具有半導體 是對於插槽本體配置成可 構。其驅動機構是例如， 推壓構件的基端部的作動 來轉動推壓構件的樞支銷 定位構件是被固定於 收容部內的半導體裝置的 體裝置的端子對於接觸端 閂鎖機構的一對推壓 體裝置相對向地配置。推 動機構的基端部，及選擇 1C封裝體的外周面的上面 插槽本體，連結其基端部 半導體裝置被裝設於 是未干擾於其半導體裝置 待機位置，又，半導體裝 構件的抵接部是作成侵入 在此構成中，半導體 於定位構件的收容部時， -133〇22號公報中，由推壓桿構件 持構件的閂鎖機構，及將所作用 動機構使之推壓構件予以動作的 體構件所構成。 置的定位構件對於收容部的裝卸 裝置所通過的開口部。蓋體構件 昇降動，被連結於上述的驅動機 包含連結蓋體構件與閂鎖機構的 銷，及因應於蓋體構件的昇降動 所構成。 插槽本體，例如藉由被裝設於其 外周部予以定位，來定位其半導 子群的相對位置者。 構件，是分別隔著所裝設的半導 壓構件是包含：被連結於上述驅 性地抵接或隔離於半導體裝置的 丨的抵接部，及可轉動地被支持於 與其抵接的連結部所構成。 收容部內時，推壓構件的抵接部 的方式對於收容部內採用隔離的 置被裝設於收容部內之後，推壓 於收容部內採用保持位置者。 裝置經蓋體構件的開口部被裝設 則蓋體構件爲藉由對於插槽本體 -6- 201134029 及定位構件從上方的位置朝下方僅推壓所定行程而被保 持，使得上述的一對推壓構件的抵接部對於定位構件的收 容部互相隔離而採用待機位置之故，因而成爲可將半導體 裝置裝設於收容部。 然後，蓋體構件藉由從被保持的狀態被解放，使得蓋 體構件以彈推構件的彈推力被上昇而恢復成初期位置’藉 此，一對推壓構件的抵接部從待機位置對於定位構件的收 容部互相地接近，滑接於半導體裝置的1C封裝體的外周 面的上面，而且推壓構件的抵接部爲將藉由定位構件所定 位的半導體裝置的端子成爲在保持位置朝著接觸端子群推 壓的情形。因此，半導體裝置爲成爲對於定位構件的收容 部被保持的情形。 又，例如，在日本特開2003-133022號公報中，具有 此種抵接部的推壓構件，爲經由彈簧構件可變位地設於可 轉動地支持於插槽本體的推壓桿構件的前端部。藉此，即 使半導體裝置的厚度等的參差不齊，藉由彈簧構件，也可 吸收著其參差不齊之故，因而以一定接觸壓力可發揮半導 體裝置被保持的效果。 又，也如日本特開2 0 〇 3 - 1 6 8 5 3 2號公報所示地，提案 若爲了抑制有局部應力或剪斷應力施加於被推壓的半導體 裝置’在作爲推壓構件的閂鎖機構的前端，滑動自如地設 有搖動構件者。 【發明內容】 201134029 半導體裝置經蓋體構件的開口部被裝設於定位構件的 收容部時，如上所述地，一對推壓構件的抵接部從待機位 置對於定位構件的收容部互相地接近。這時候，其抵接部 爲半導體裝置對於1C封裝體的外周面以微小動作進行滑 接。尤其是因應於試驗，抵接部例如複數次重複滑接於一 個半導體裝置之1C封裝體的外周面之上面時，或是在一 個半導體裝置下，因應於增大接觸端子的數量，使得其抵 接部的推壓力變大的狀態而滑接有抵接部時，則抵接部對 半導體裝置的1C封裝體的外周面有形成擦傷之虞。其結 果，被作爲良好的半導體裝置，在外觀檢查中，藉由其1C 封裝體的外周面的傷痕，外觀上被視作爲不良品，而有降 低良品率的情形。 考慮以上缺點問題，本發明是提供一種具備可解放地 選擇地保持半導體裝置的保持機構的半導體裝置用插槽， 而保持半導體裝置時，對於半導體裝置的1C封裝體的外 周面不會給予擦傷，而可保持半導體裝置的半導體裝置用 插槽作爲目的。 爲了達成上述目的，本發明的一種半導體裝置用插 槽，其特徵爲具備：具有可裝卸地裝設有半導體裝置的半 導體裝置裝設部及電性地連接於該半導體裝置的端子的接 觸端子群的插槽本體；及裝設於半導體裝置裝設部的半導 體裝置對於1C封裝體的表面接近時，對於表面大約平行 的推壓面而沿著對於表面正交的方向移動，具有抵接於表 面的推壓面的推壓構件；及對於半導體裝置裝設部隨著推 -8 - 201134029 壓構件可接近或隔離地被支持於插槽本體，一端對於推壓 構件相對地可移動地被連結，另一端被連於驅動手段的推 壓構件支持體；及推壓構件隨著依驅動手段所致的推壓構 件支持體的移動而連動，被裝設於半導體裝置裝設部的半 導體裝置對於1C封裝體的表面接近時，推壓構件的推壓 面沿著對於表面正交的方向移動而抵接於該表面的方式來 限制該推壓構件的滑動部的位置之同時進行引導的位置限 制引導部所構成。 依照本發明的半導體裝置用插槽，具備裝設於半導體 裝置裝設部的半導體裝置對於1C封裝體的表面接近時， 對於轰面大約平行的推壓面而沿著對於表面正交的方向移 動，具有抵接於表面的推壓面的推壓構件；及對於半導體 裝置裝設部隨著推壓構件可接近或隔離地被支持於插槽本 體，一端對於推壓構件的內周部相對地可移動地被連結， 另一端被連於驅動手段的推壓構件支持體；及位置限制引 導部，位置限制引導部是推壓構件，對被裝設於半導體裝 置裝設部的半導體裝置的1C封裝體的表面，而接近時， 推壓構件的推壓面沿著對於表面正交的方向移動而抵接於 表面的方式來限制推壓構件的滑動部的位置之同時進行引 導之故，因而保持半導體裝置時，對於半導體裝置用插槽 的1C封裝體的外周面不會給予擦傷而可保持半導體裝 置。 從以下的示範性實施例說明（參照附圖），本發明的進 一步特徵將是清楚的。 - 9 - 201134029 【實施方式】 第3圖是表示擴大本發明的半導體裝置用插槽的一例 的外觀。 半導體裝置用插槽是配置於印刷配線基板PB(參照第 1 5圖）上。印刷配線基板P B是作爲具有供應有所定的試 驗電壓而且分別送出表示來自作爲各被檢查物的半導體裝 置的短路等的異常檢測信號的輸出部者。又，在第3圖 中，表示代表縱橫地配置於印刷配線基板PB上的複數個 半導體裝置用插槽的一個半導體裝置用插槽。 在第3圖中，半導體裝置用插槽是包含：電性地連 接印刷配線基板PB的各電極腳位部（端子部）與下述的半 導體裝置DVA或半導體裝置DVB的端子的接觸銷模組 3 6 (參照第1 5圖），及具有收容接觸銷模組3 6的模組收 容部10A的插槽本體10，及作爲半導體裝置DVA對於 各電極的接觸銷模組3 6的各端子部進行對位的定位構件 的底座14，及可昇降動地配置於插槽本體10而對於底 座14選擇性地接近或隔離下述的推壓構件支持體18的 方式進行轉動的蓋體構件12，及可能可動地支持於推壓 構件支持體1 8，因應於蓋體構件1 2的昇降動作，對於 接觸銷模組36的接觸銷28ai施以推而進行保持或解半 導體裝置DVA的各端子的推壓構件20作爲主要要素所 構成。 又，在底座1 4的下方配置有：排列接觸銷模組3 6的 -10- 201134029 端子上部的元件側排列板1 6，及隔著接觸銷模組3 6相對 於元件側排列板1 6朝著插槽本體1 0可移動地配置，進行 排列接觸銷模組3 6之端子的固定側端子的基板側排列板 26 = 如第4圖所示地，元件側排列板1 6是包含：在其中 央部縱橫地形成有配設著下述的各接觸銷28ai的接點部 的複數細孔的接點排列部1 6B，及從大約長方形的平板狀 接點排列部1 6B的四個角部中的四個部位朝著接觸銷模組 突出的爪部16N所構成。 接點排列部1 6B的各細孔是分別對應於半導體裝置 DVA的各端.子及接觸銷所形成。又，各細孔是設定有下述 的底座1 4對於定位用突起1 4P S的相對位置。亦即，配合 各細孔，設定有定位用突起14P S的位置。因此，藉由其 定位用突起14PS，半導體裝置DVA的各端子對於各細孔 的相對位置被定位，且半導體裝置DVA的各端子對於接 觸銷模組3 6的接觸銷的相對位置成爲被定位。 各爪部16N的前端是被卡止於被省略了所對應的圖示 的半導體裝置1 〇的各卡止部。在元件側排列板1 6與接觸 銷模組3 6之間，設有將元件側排列板1 6對於接觸銷模組 3 6朝隔離的方向彈推的螺旋彈簧（未圖示）。藉此，元件側 排列板1 6是成爲可昇降動地被支持於接觸銷模組3 6的上 部。 在接點排列部1 6B的所定角隅部的一部位，設有元件 • 偏置機構。 -11 - 201134029 如第4圖所示地，基板側排列板26是具有三部位選 擇性地被卡止於插槽本體10的卡止片2 6N。卡止片2 6N 設於三部位，是製造時，將基板側排列板26安裝於插槽 本體10時，爲了防止將其安裝方向作成不是適當方向的 錯誤的方向。又，在相對於基板側排列板26的插槽本體 10之下面的表面，形成有一對突起片26P。突起片26P是 有插槽本體1 〇分別安裝於基板時，則被插入對於形成於 插槽本體10的下部的溝，或是從溝被拉出。因此，基板 側排列板26是採用如第1 5圖所示地，從插槽本體ί〇的 下端部之凹部突出而排列接觸銷模組3 6的端子之固定側 端子的狀態，及如第1圖所示地，被收容於其凹部內的狀 態者。又，藉由突起片26Ρ插入於形成在插槽本體10下 部的構，以防止保持被形成於插槽本體1 0的接觸銷模組 3 6的鈎構件（未圖示），從接觸銷模組3 6脫落的情形。 作爲被檢查物的半導體裝置DVA(參照第9Α圖），是 以BGA型的1C封裝體（EIAJED-73 03 A:電子資訊技術產 業協會規格）作成形成有外廓部的半導體裝置。在半導體 裝置DVA中，在相對於下述的元件側排列板1 6的一面， 經由元件側排列板1 6的接點排列部1 6B的細孔而須連接 於接觸銷模組3 6的凸塊型電極作爲端子，橫跨於全面以 所定互相間隔形成複數個。 又’半導體裝置DVA是並不被限定於以BGA型1C 封裝體所形成的半導體裝置，例如，以LGA型或QFN型 1C封裝體所形成的半導體裝置也可以。 -12- 201134029 如第3圖所示地，在插槽本體1 0的各邊的外周部， 以所定間隔形成有分別可昇降動地卡合有下述的蓋體構件 1 2的各導爪部1 2 Ν的導溝1 0 G。導溝1 0 G是大約垂直地 形成於插槽本體1 〇的底面部。在各溝1 〇 G的一方的端 部，如第3圖所示地有蓋體構件1 2爲在最上端位置時， 分別卡止有其導爪部1 2 Ν的前端。 在插槽本體1 〇的至少四邊中的二個長邊的一對導溝 10G相互間，如第4圖所示地，蓋體構件1 2須下降時， 使得下述的蓋體構件12的臂部12RL及12LL被插入的凹 部10RR及10LR大約平行地形成於導溝10G。 又，在第4圖中，在形成插槽本體10的外周部的長 邊側的壁部1 〇 RW與短邊側的各壁部1 〇 S W之交叉部分， 分別形成有下述的螺旋彈簧3 0之一端所配設的彈簧承受 部。又，在第4圖中，在相對於壁部1 0 R W是的壁部 10LW與短邊側的另一方的壁部10SW之交叉部分，雖未 予圖示，惟互相地鄰接形成有下述的各螺旋彈簧3 2的一 端所配設的彈簧承受部。又，在其螺旋彈簧3 2的一端所 配設的彈簧承受部的互相間，形成有下述的元件偏置機構 的彈簧收容端部1 6ΕΒ被固定的缺口部。 在插槽本體1 〇的大約中央部分，形成有接觸銷模組 36被收容的模組收容部1 0Α(參照第1 5圖）。在模組收容 部1 Ο Α的上部’配置有上述元件側排列板丨6的接點排列 部 1 6 B。 在模組收容部1 〇 A與凹部1 〇 r r及1 〇 l R之間，分別 13- 201134029 形成有下述的推壓構件支持體18及推壓構件20所通過的 缺口部。又，如第4圖所示地，在形成其各缺口部的壁 部’形成有分別引導下述的導銷27的兩端部的導溝1 〇RB 及10LB。互相地隔離所形成的一對導溝i〇RB，是大約平 行地形成於插槽本體1 〇的底面。互相地隔離所形成的一 對導溝10LB，也大約平行地形成於插槽本體10的底面。 又，在插槽本體10的接點排列部16B上，載置有底 座14。底座14是將被裝設的半導體裝置DVA的1C封裝 體的外周部之各角分別卡合的定位用突起14PS，具有於 下述的半導體裝置收容部14A的底部的三部位。藉此，在 藉由定位用突起14PS被定位的半導體裝置DVA的1C封 裝體的電極部與接點排列部1 6B的表面之間，形成有所定 間隙。 底座1 4是藉由一體地形成於側面的複數部位的爪部 被卡合於插槽本體10，被固定於插槽本體10。如第4圖 所示地，長方形框狀地形成的底座1 4是將收容配設於接 點排列部16B的上方的半導體裝置DVA的半導體裝置收 容部1 4 A具有於中央部。如下所述地，擋住半導體裝置 DV A的半導體裝置收容部1 4 A的底部對於接觸銷模組3 6 的相對位置，是對半導體裝置DVA的厚度無關地被設 定。 半導體裝置收容部14A是朝著蓋體構件12及接點排 列部1 6B進行開口。又，在半導體裝置收容部1 4A的底部 的開口部的周緣，而有定位用突起1 4 P S (參照第1 7圖）被 -14- 201134029 形成於其內側的三部位的角隅。又，如第4圖所示地，在 其內側的一部位的角隅’形成有下述的元件偏置機構的偏 置臂40的前端部所通過的孔1 4a。 又’在形成半導體裝置收容部1 4 A的外廓部各邊的中 央部，分別形成有矩形狀的孔1 4 Η。在分別相對於壁部 10RW及壁部10LW的孔14Η，裝卸半導體裝置DVA時， 使得下述的推壓構件支持體18及推壓構件20會通過。在 底座1 4的外周部的孔1 4Η的周緣，互相地平行地形成有 —對滑接面1 4 S W。各滑接面1 4 s W是對於接點排列部 1 6 Β的表面形成大約垂直。藉此，滑接面1 4 S W是在接點 排列部16Β的上方’對於包含藉由定位用突起14PS被定 位的半導體裝置DVA的1C封裝體的上面的平面大約成爲 垂直。 作爲對於上述的推壓構件20的位置限制引導部的滑 接面14SW是當半導體裝置DVA裝設至底座14時，則限 制推壓構件20的各滑動部20UE的轉動角度，而且引導各 滑動部20UE對於下方的圓滑的移動。又，滑接面14SW 是在從半導體裝置DVA拆下底座14時，則成爲引導推壓 構件20對於滑動部20UE的上方的圓滑地移動。 如第9 A圖所示地，框狀蓋體構件1 2是將半導體裝置 DVA或底座1 4的上端部所通過的開口部1 2a具有中央 部。在相對於蓋體構件1 2的上述的插槽本體1 〇的凹部 10RR及10LR的部分，分別有臂構件12RL及12LL垂直 地突出。 -15- 201134029 臂構件12RL及12LL是互相地具有同一構造之故， 因而針對於臂構件1 2RL的構造加以說明，而省略了針對 於臂構件12LL的構造之說明。 在大約Η型地所形成的臂構件1 2RL之下端，連結有 推壓構件支持體1 8之一端。在配置放臂構件1 2RL的腳部 之互相間的推壓構件支持體1 8的一端之孔，及臂構件 12RL的各腳部之孔，貫通有共通的連結銷24。藉此，推 壓構件支持體18是對於臂構件12RL的腳部作成可轉動。 在蓋體構件1 2的各邊之端部，使得分別被卡合於插槽 本體10的導溝10G的導爪部12Ν，朝著插槽本體1〇突出。 在蓋體構件12的四個角隅部中的所定一部位，如第1 圖及第4圖所示地’使得構成元件偏置機構之一部分的凸 輪片1 2 C Α對於導爪部1 2 Ν大約平行地形成。 在鄰接於設有蓋體構件1 2的凸輪片1 2 C A的角隅部的 位置，朝著上方彈推蓋體構件1 2的兩個的螺旋彈簧3 2， 互相隔離地設於蓋體構件12的下面或上述的插槽本體1〇 的彈簧承受部之間。 又’在除了蓋體構件1 2的上述角隅部以外三部位的 角隅部，具有比螺旋彈簧3 2的直徑還要大直徑的三個螺 旋彈簧3〇’設於其下面與上述插槽本體10的彈簧承受部 之間。三個螺旋彈簧30是與兩個螺旋彈簧32協動而朝上 方彈推蓋體構件1 2者。 例如’如曰本特開2002-202344號公報也所示地，接 觸銷模組3 6是將分別形成其兩端部的—對側板，及在側 -16- 201134029 板互相間’經由間隔件互相地成爲大約平行的方式重疊配 置的複數導線架作爲主要要素所構成。又，接觸銷2 8 a i 並不被限定於接觸銷模組3 6的形態，例如，如日本特開 2 003 - 1 3 3 022號公報也所示地，各接觸銷28 ai的下端部， 藉由被壓入於插槽本體的接觸銷安裝孔，固定著接觸銷 2 8 ai也可以。 如第1 6圖擴大所示地，將半導體裝置Dv A的三部位 的角隅部分別推壓接觸於定位用突起1 4P S的元件偏置機 構是包含：凸輪從動件構件3 8，及被連接於凸輪從動件構 件3 8的一端的偏置臂4 0，及裝卸半導體裝置D V A時，卡 合於凸輪從動件構件3 8的孔3 8 C F的蓋體構件1 2的凸輪 片12CA所構成。 凸輪從動件構件3 8是可移動配設於連設於元件側排 列板1 6的接點排列部1 6 B的彈簧收容端部1 6 E B的上端 所形成的滑接面1 6S。彈簧收容端部1 6EB ,是朝著外部貫 通上述的插槽本體1 0的缺口部。凸輪從動件構件3 8是相 對於彈簧收容端部1 6EB的外周部而可移動地引導至一體 地所形成的導片1 6SG互相間。在彈簧收容端部1 6E的內 側，配設有將凸輪從動件構件3 8經由底座1 4的孔1 4 a朝 著底座〗4內側彈推的螺旋彈簧42。 如第1 6圖所示地，當蓋體構件1 2採取最上端位竄 時，在凸輪從動件構件3 8的孔2 8 C F的正上方的位置，配 置有蓋體構件12的凸輪片12C A。 形成於偏置臂4 0的一端的孔，是被嵌合於凸輪從動 -17- 201134029 件構件3 8的一端的連結銷3 8P。藉此，如第1 7圖所示 地’偏置臂4〇與凸輪從動件構件3 8，是被連結成偏置臂 40的中心軸線位於與凸輪從動件構件3 8的中心軸線位於 共通的直線上。偏置臂40的前端部是具有相撞於半導體 裝置DVA的一角隅部的相撞部。相撞部是對於偏置臂40 的中心軸線朝一方側彎曲所形成，具有卡合於半導體裝置 DVA的一角隅部的凹處。 在此種構成中，半導體裝置DVA爲被載置於元件側 排列板1 6的接點排列部1 6B所載置的底座1 4內時，如第 18圖及第19圖所示地，首先，蓋體構件12朝下方被推 壓，使得凸輪片12CA的傾斜面被卡合於孔38CF的周緣 之後，凸輪片12CA被插入於孔38CF內。藉此，凸輪從 動件構件3 8頂抗螺旋彈簧42的彈推力，朝著從底座1 4 隔離的方向移動。 之後，當蓋體構件1 2被維持在最下端位置時，則半 導體裝置DVA被載置於底座14內。這時候，半導體裝置 DVA的三部位的角隅部被卡合於定位用突起部14PS。 又，第17圖及第19圖是代表表示三定位用突起部14PS 中的一定位用突起部14PS。 然後，當作用於蓋體構件12的推壓力被解放時，使 得蓋體構件12藉由螺旋彈簧30及32的彈推力，朝著上 方被上昇。藉此，如第16圖及第17圖所示地，凸輪片 12CA由孔38CF被隔離之故，因而使得凸輪從動件構件 38藉由螺旋彈簧42的彈推力朝著接近於底座14的方向推 -18- 201134029 壓’藉此，偏置臂40的凹處被卡合於半導體裝置DVA的 1C封裝體的一角隅部，使得ic封裝體的三部位的角隅部 被推壓於定位用突起部14PS。因此，半導體裝置DVA對 底座1 4及接點排列部1 6 B成爲定位。 一方面’從元件側排列板1 6的底座1 4拆除半導體裝 置DVA時，首先，如第18圖及第19圖所示地，把蓋體 構件1 2 —直朝著下方推壓至最下端位置，使得凸輪片 12CA的傾斜面卡合於孔38CF的周緣之後，凸輪片12CA 以被插入於孔3 8 C F內的狀態下被保持。藉此，使得凸輪 從動件構件3 8頂抗螺旋彈簧42的彈推力而朝著從底座1 4 隔離的方向移動。之後，從偏置臂4 0所解放的半導體裝 置D V A ’經蓋體構件1 2的開口部1 2 a而從底座1 4的內側 被拆下。 一組的推壓構件支持體1 8及推壓構件2 0，是分別設 於上述的插槽本體10的凹部10RR及10LR。 例如’如第5 A圖及第5 B圖所示地，推壓構件支持體 1 8是由：以樹脂材料所成形，而具有上述連結銷24所插 入的透孔1 8 a的基端部，及在兩側面具有推壓構件2 0卡 合著卡合銷2 0 P的一對長溝1 8 G的連結端部1 8 T，及耦合 基端部與連結端部的耦合部所構成。 各推壓構件1 8的基端部是經由連結銷2 4被連結於蓋 體構件12的臂部12RL及12LL。 又，連結端部1 8T的長溝1 8G，是沿著連結端部1 8T 所延伸的方向所形成。在連結端部1 8 T的長溝1 8 G，插入 -19- 201134029 有推壓構件20的連結銷20P。藉此，推壓構件20是對於 連結端部1 8 T僅對應於長溝1 8 G的長度的距離作成相對地 可往復移動。 在上述的結合部，導銷27被插入的孔18b，形成於孔 1 8 a與長溝1 8 G之間的中間位置。孔1 8 b是形成其中心軸 線對於孔1 8 a的中心軸線成爲大約平行。 如上述地，導銷27的兩端，是成爲被引導至上述導 溝 1 0RB 或 1 0LB。 又，在耦合部的孔1 8b與孔1 8b之間，形成有比孔 1 8b還要大的開口部1 8c。在開口部1 8c內，配設有捲裝 於導銷27的扭轉螺旋彈簧22。扭轉螺旋彈簧22的一端是 被卡止於開口部1 8c的周緣（參照第1 0D圖），而扭轉螺旋 彈簧22的另一端是被卡止於相連在推壓構件20的滑動部 20UE的基端部。藉此，推壓構件20的基端部是對推壓構 件支持體1 8朝抵接之方向被彈推。 又，例如，如第6A圖，第6B圖及第6C圖所示地， 推壓構件2 0是由：以樹脂材料所成形，抵接於半導體裝 置DVA的1C封裝體外周面而將推壓外周面的推壓面具有 於牺部的推壓部2 0 T，及被連結於推壓部2 0 T的基端的 滑動部20UE所構成。 溝形推壓部20T是具有將卡合推壓構件支持體18的 長溝1 8 G的連結銷2 0 P相對於內側。又，如第6 B圖所示 地，推壓部2 0 T的推壓面是對於包含形成於滑動部2 0 U E 的滑接面20Ua的平面成爲正交的方式所形成。 -20- 201134029 又，如第1圖所示地，在推壓部2 0 T的基端側，形成 有推壓構件支持體18的連結端部1 8 Τ所插入的開α部 20a。藉此，使得被插入的連結端部〗8T的下端面，藉由 扭轉螺旋彈簧22的彈力，以所定壓力被抵接於推壓部 2 0T的內面。 在連結一對滑動部20UE的連結部的中央部，形成有 被插入於上述的推壓構件支持體1 8的開口部1 8 c的突起 部20CP。突起部20CP藉由被插入於推壓構件支持體】8 的開口部1 8 c，使得推壓構件支持體1 8對於推壓構件2 〇 圓滑地可相對移動。 又，推壓構件20及推壓構件支持體18是並不被限定 於此些例子，例如，如第7A圖，第7B圖，及第8 A圖， 第8B圖，第8C圖所示地，推壓構件支持體is·爲具有連 結端部1 8 T，而推壓構件2 0爲具有長孔2 0 ’ G者也可以。 推壓構件支持體1 8 |是由：例如以樹脂材料所成形， 具有上述連結銷2 4被插入的透孔1 8 ' a的基端部，及將被 卡合於推壓構件2 0 '的長孔2 0 ' G的一對連結銷1 8 ' P具有於 兩側面的連結端部1 8'T，及耦合基端部與連結端部的耦合 部所構成。 各推壓構件支持體1 8’的基端部，是經由連結銷24而 被連結於蓋體構件1 2的臂部1 2 R L及1 2 L L。 連結端部1 8 ’Τ的連結銷1 8 'Ρ是相對的方式所形成。 連結銷1 8 ' Ρ是被插入在推壓構件2 0 ’的長孔2 0，G。藉此， 推壓構件2 0'是對於連結端部1 8 Τ僅相對地可往復移動對 -21 - 201134029 應於長孔20’G的距離。 在上述耦合部，導銷27所插入的孔18’b爲形成於孔 1 8 ’ a與連結銷1 VP之間的中間位置。孔1 8 ’b是其中心軸 線對於孔1 8 ’a的中心軸線大約平行地所形成。 又，在耦合部的孔1 8 ’b與孔1 8 'b之間，形成有比孔 18'b還要大的開口部18'c。在開口部18’c，配設有被捲裝 於導銷27的扭轉螺旋彈簧22。扭轉螺旋彈簧22的一端是 被卡止於開口部18’c的周緣，而扭轉螺旋彈簧22的另一 端是被卡止於相連於推壓構件20’的滑動部20'UE的基端 部。藉此，推壓構件20’的基端部爲對於推壓構件支持體 18朝抵接的方向被彈推。 又，如第8A圖，第8B圖，第8C圖所示地，推壓構 件20’是由：例如以樹脂材料所成形，抵接於半導體裝置 DVA的1C封裝體外周面而將推壓外周面的推壓面具有於 前端部的推壓部20’T，及被連結於推壓部2(ΓΤ的基端的 滑動部2 0 ’ U Ε所構成。 溝形推壓部20’Τ是具有相對推壓構件支持體18’的連 結銷18'Ρ所插入的長孔20'G。推壓部20'Τ的推壓面是對 於包含形成於滑動部20'UE的滑接面20'Ua的平面成爲正 交的方式所形成。 又，在推壓部20'T的基端側，形成有推壓構件支持 體18'的連結端部18’T所插入的開口部20’a。藉此，使得 被插入的連結端部1 8’T的下端面，藉由扭轉螺旋彈簧22 的彈力，以所定壓力被抵接於推壓部20'Τ的內面。 -22- 201134029 在連結一對滑動部20'UE的連結部的中央部，形成有 被插入於上述的推壓構件支持體1 8_的開口部1 8’c的突起 部20’CP。突起部20'CP藉由被插入於推壓構件支持體1 8· 的開口部18’c，使得推壓構件支持體18'對於推壓構件20· 圓滑地可相對移動。 在此些構成中，當進行半導體裝置DVA的試驗，首 先，例如藉由省略圖示的作業機器人的臂部前端，使得蓋 體構件1 2自如第1圖所示的最上端位置如第9A圖所示 地，頂抗螺旋彈簧30，32的彈推力而朝箭向表示的下方 被推壓。 藉此，各推壓構件支持體1 8連結銷27被引導至導溝 10RB及10LB下，挪到蓋體構件I2的臂部12RL及12LL 側，而且各推壓構件支持體1 8爲朝從底座1 4隔離的方向 轉動在連結銷2 7的周圍。因此，推壓構件2 0及各推壓構 件支持體18是朝著臂部12RL及12LL通過底座14的開 口部 1 4H。 之後，蓋體構件1 2再被推壓至最下端位置之後，被 保持時，則推壓構件20及被轉動的推壓構件支持體i 8成 爲配置於形成在底座1 4的外側周圍的所定待機位置。如 第18及第19圖所示地，上述元件偏置機構的偏置臂40 的前端部位置，是作爲對於底座1 4的孔1 4 a隔離的位 置。這時候，半導體裝置DVA，爲藉由省略圖示的搬運機 械人的搬運臂被吸引保持而被載置於元件側排列板i 6的 接點排列部1 6 B。 •23- 201134029 之後，如第9B圖及第9C圖所示地，蓋體構件1 2是 作業機器人的前端在抵接於蓋體構件1 2的上面的狀態下 朝表示箭向方向移動，亦即，當上昇時，藉由螺旋彈簧30 及32的彈推力上昇至最上端位置。 這時候，被載置的半導體裝置DVA是藉由上述的元 件偏置機構，如第1 6圖及第1 7圖所示地，自動地定位被 裝設於底座14的定位用突起部14PS。 又，隨著蓋體構件12的臂12RL及12LL的上昇，如 第1 0A圖所示地，推壓構件支持體1 8及推壓構件20爲以 推壓構件支持體1 8的連結銷2 7爲中心突出於底座1 4的 開口部1 4H內的方式開始轉動。這時候，連結銷27是被 引導至導溝10RB及10LB之下，從蓋體構件12的臂部 12RL及12LL隔離而朝接近於開口部14H的方向移動。 連結銷2 7再朝底座1 4的開口部1 4H移動時，如第 10B圖所示地，推壓構件20對滑動部20UE的滑接面 2 OUa，如擴大於第2圖所示地，抵接於底座14的滑接面 1 4SW。藉此，來限制推壓構件20的旋轉角度。這時候，推 壓構件支持體1 8的連結端1 8T對於推壓構件20的內面開始 移動。又，推壓構件20的推壓部20T的推壓面，爲隔著所 定間隔對於半導體裝置DV A的上面成爲大約平面。 又，如第9B圖及第10C圖所示地，蓋體構件12的臂 構件12RL及12LL再上昇時，使得推壓構件20的推壓部 20T的推壓面，不會摩擦地抵接於半導體裝置DVA的上 面。這時候，使得推壓構件支持體1 8的連接端1 8 T對於 -24- 201134029 推壓構件20的內面移動之故，因而推壓部20T的推壓面 所推壓的推壓面積PA，是如第13圖及第14圖所示地， 成爲具有比習知的閂鎖機構的推壓面積還要被擴張的所定 寬度的帶狀領域。因此，對於半導體裝置DVA，有適當地 分散的推壓力成爲作用於半導體裝置DVA的上面。 這時候，如第1 1圖所示地，使得推壓構件20的滑動部 2 0UE的滑接面20Ua在抵接於滑接面14SW的狀態下，從抵 接當初的位置H1開始移動至表示於第12圖的下方的所定位 置H2的位置。這時候，如第1 0D圖所示地，僅推壓構件支 持體1 8的連結端1 8T的前端推下推壓構件20的方式，對於 推壓構件20的內面進行滑接而僅突出所定量ΔΗ。 藉此，推壓構件20的推壓部20T的推壓面對於半導 體裝置DVA的上面不會互相摩擦，以所定壓力抵接於半 導體裝置DVA的1C封裝體的外周面。因此，其推壓面是 成爲朝著接觸銷模組3 6推壓半導體裝置DV A。結果，半 導體裝置DVA的1C封裝體是不會有藉由推壓構件20的 推壓部20T受傷之虞。 又，在把蓋體構件1 2維持在試驗位置下，例如有檢 查信號供應於印刷配線基板PB的輸出入部時，經接觸銷 模組3 6而把其檢查信號供應於半導體裝置DV A，而且其 電路的異常被檢測時，來自半導體裝置DVA的異常檢測 信號經輸出入部，例如成爲供應於外部的故障診斷裝置。 結束半導體裝置DVA的檢查時，取出其半導體裝置 DVA，爲了裝設新半導體裝置DVA而把作業機器人的臂 -25- 201134029 前端’與上述同樣地，抵接於蓋體構件1 2的上面頂抗螺 旋彈簧30及32的推壓力而朝下方被推壓。被試驗的半導 體裝置DVA是藉由搬運臂從元件側排列板16被取出，又 被試驗的新的半導體裝置DVA是與上述同樣地，成爲被 裝設。 又’如第15圖所示地，在上述例子中，假設即使裝 設具有比半導體裝置DVA的厚度還要薄厚度的半導體裝 置DVB時，把半導體裝置DVB以推壓構件20的推壓部 2 0T的推壓面被推壓時，在底座14中擋住半導體裝置 DVB的半導體裝置收容部14A的底部的最下端位置（推盡 位置）爲與裝設有半導體裝置DVA時的半.導體裝置收容部 1 4 A的底部的最下端位置成爲同一。 因此，因應於半導體裝置的厚度不必變更半導體裝置 收容部1 4A的底部對於接觸銷模組36的相對位置。 又，在上述例子中，限制推壓構件20的各滑動部 2 0UE的旋轉角，而且作爲引導朝著各滑動部20UE的下方 的圓滑地移動的位置及限制引導部的滑接面1 4SW，是形 成於底座14的外周部的孔14H的周緣，惟並不被限定於 此種例子，例如第20圖至第22圖所示地’在形成於凹部 10’RR及10’LR與模組收容部10'A之間的缺口部內，使得 作爲位置限制引導部的接線柱1 〇’po —體地形成於插槽本 體1 0也可以》 在第20圖中，在插槽本體1〇'的各邊的外周部’以所 定間隔分別形成有可昇降移動地卡合有下述的蓋體構件的 -26- 201134029 各導爪部12N的導溝1 O'G。導溝1 〇’G是對於插槽本體1 〇 的底面部大約垂直地形成。在各溝10’G的一方的端部， 當蓋體構件1 2採取最上端位置時，分別卡止有其導爪部 12Ν的前端。 在插槽本體10’的至少四邊中的兩個長邊的一對導溝 1 0 ’ G互相間’蓋體構件1 2須下降時，下述的蓋體構件12 的臂部12RL及12LL所插入的凹部i〇，rr及i〇，lR對於 導溝10G大約平行地形成。 又’在插槽本體10'的大約中央部分，形成有接觸銷 模組3 6所收容的模組收容部1 〇 ' A。在模組收容部1 〇 1 A的 上部，配置有上述元件側排列板1 6的接點排列部1 6 B。 模組收容部1 〇 ' A與凹部1 〇 ' R R及1 〇 ' l R之間，是分 別形成有上述推壓構件支持體1 8及推壓構件2 0所通過的 缺口部。在其各缺口部之內側，對於包含接點排列部1 6B 的平面成爲大約垂直的方式形成有一對接線柱1 0 1 P 〇。藉 此，如第20圖所示地，使得推壓構件20的各滑動部 2 0 U E的旋轉角藉由接線柱1 〇 ' Ρ Ο進行限制，而且對於各 滑動部20UE的下方的圓滑地移動成爲被引導。 又，在上述的本發明的半導體裝置用插槽的一例中， 推壓構件支持體1 8及1 8'的一端，在被連結於蓋體構件！ 2 的構成中，驅動著推壓構件2 0及2 0 ·，惟並不被限定於此 種例子，例如，如日本特開2 0 0 6 - 0 7 1 3 7 5號公報（參照第 53圖）也所示地，代替蓋體構件1 2，藉由材料處理部，使 得推壓構件支持體1 8及1 8’的一端被推壓或解放，藉此推 -27- 201134029 壓構件20及20'被轉動的方式所構成也可 雖然已參照示範性實施例說明本發明 本發明不受限於所揭示的示範性實施例。 項將符合最寬廣的詮釋以涵蓋所有的此種 構及功能。 【圖式簡單說明】 第1圖是包含表示本發明的半導體裝 的局部斷面圖的立體圖。 第2圖是擴大表示第1圖的一部分的; 第3圖是表示本發明的半導體裝置用 觀的立體圖。 第4圖是表示將圖示於第1圖的一例 予以分解的立體圖。 第5A圖是表示於第1圖的例子所使 持體的俯視圖，第5B圖是表示於第5A圖 體的側面圖。 第6A圖是表示於第1圖的例子所使 俯視圖，第6B圖是表示於第6A圖的推壓 第6C圖是表示於第6A圖的推壓構件的側 第7A圖是表示於第1圖的例子所使 持體的其他一例子的俯視圖，第78圖是_ 推壓構件支持體的側面圖。 第8 A圖是圖示於第1圖的例子所使 以。 ，要瞭解的是， 以下的附加請求 修改以及等效結 置用插槽的一例 i部斷面圖。 插槽的一例的外 子的各構成要素 用的推壓構件支 的推壓構件支持 用的推壓構件的 構件的前面圖， 面圖。 用的推壓構件支 :示於第7A圖的 用的推壓構件的 -28- 201134029 另一例子的俯視圖，第8 B圖是圖示於第8 A圖的推壓構件 的前視圖，第8 C圖是圖示於第8 A圖的推壓構件的側面 圖。 第9A圖，第9B圖及第9C圖是分別包含供作圖示於 第1圖的例子的動作說明的局部斷面圖的立體圖。 第10A圖，第10B圖，第10C圖及第10D圖是分別 供作圖示於第1圖的例子的動作說明的局部斷面圖。 第11圖是擴大表示圖示於第9B圖的一部分的立體 圖。 第12圖是擴大表示圖示於第9C圖的一部分的立體 圖。 第1 3圖是供作推壓構件的推壓部的推壓面積的說明 的圖式。 第1 4圖是供作推壓構件的推壓部的推壓面積的說明 的圖式。 第1 5圖是圖示於第1圖的例子中，供作分別裝設有 厚度不相同的半導體裝置時的推壓構件的推壓動作的說明 的斷面圖。 第1 6圖是表示元件偏置機構的構成的局部斷面圖。 第17圖是與半導體裝置一起表示圖示於第16圖的狀 態的元件偏置機構的俯視圖。 第1 8圖是供作元件偏置機構的動作說明的局部斷面 圖。 第19圖是與半導體裝置一起表示圖示於第〗8圖的狀 -29 - 201134029 態的元件偏置機構的俯視圖。 第20圖是與底座的一部分表示使用於本發明的半導 體裝置用插槽的一例子的插槽本體的其他例子的俯視圖。 第21圖是表示沿著圖示於第20圖的例子的χχι_χχι 線的斷面圖。 第22圖是表示沿著圖示於第20圖的例子的χχπ-XXII線的斷面圖。 【主要元件符號說明】 1〇 :插槽本體 1 2 :蓋體構件 14 :底座 14A :半導體裝置收容部 14H :開口部 14SW :滑接面 1 8 :推壓構件支持體 2〇 :推壓構件 20UE :滑動部 20Va :滑接面 22 :扭轉螺旋彈簧 24 :連結銷 27 :導銷 DVA，DVB :半導體裝置 -30-[Technical Field] The present invention is a socket for a semiconductor device including a holding mechanism that can selectively and selectively hold a semiconductor device. [Prior Art] A semiconductor device mounted on an electronic device or the like [for example, an integrated circuit and a 1C package (EIAJED-73 03 A: Electronic Information Technology Industry Association)] is performed at a stage before being installed. Various tests were removed and their potential defects were removed. The test is carried out, for example, in a state in which the semiconductor device is mounted in the socket for the semiconductor device. The slot for a semiconductor device to be used for such a test is generally referred to as a 1C slot' disposed on a predetermined printed wiring board (test board). The printed wiring board is an input/output unit that supplies an abnormality detection signal such as a short circuit of the semiconductor device as the inspection object, while the test voltage is supplied. The slot for the semiconductor device is, for example, a top-opening type slot, and is also provided as shown in Japanese Patent Laid-Open Publication No. 2000-133. The socket main body in which the semiconductor device is electrically connected to the contact terminal group of the printed wiring board, and the contact group provided in the slot body is disposed at an upper position, and the semiconductor device is housed. The locating member of the portion is referred to as a base in Japanese Patent Publication No. 2-3-3 3 022, and is disposed around the positioning member as a accommodating portion for locating the semiconductor member. The holding force of the pair of pressing members -5, 2011,340,290 (for example, in the Japanese special opening 203) and the pressing member are transmitted to the cover of the latch mechanism via the predetermined driving method. When the body member is a semiconductor package, the semiconductor having the semiconductor at the center portion is configured to be configurable to the socket body. The driving mechanism is, for example, the pivoting pin positioning member of the base end portion of the pressing member to rotate the pressing member is Fixed to The terminal of the body device of the semiconductor device in the accommodating portion is disposed to face the pair of pressing body devices of the contact-end latching mechanism. The base end portion of the urging mechanism and the upper slot body of the outer peripheral surface of the 1C package are connected. The base end semiconductor device is mounted so as not to interfere with the standby position of the semiconductor device, and the contact portion of the semiconductor package member is formed to intrude into the configuration, and the semiconductor is placed in the accommodating portion of the positioning member, -133〇22 In the publication, a latching mechanism that presses a lever member member and a body member that operates a pressing member by a moving mechanism are provided. The positioning member is provided to an opening through which the attaching and detaching device of the accommodating portion passes. The cover member is moved up and down, and the driver includes a pin that connects the cover member and the latch mechanism, and is configured to move up and down according to the cover member. The slot body is mounted on the outer periphery thereof, for example. The part is positioned to locate the relative position of the semi-conducting sub-group. The member is a semi-conductive member that is installed separately from each other and includes: is connected to the above The abutting portion of the crucible of the semiconductor device is detachably or in contact with the connecting portion that is rotatably supported by the connecting portion. When the receiving portion is inside, the abutting portion of the pressing member is isolated from the receiving portion. After being placed in the accommodating portion, the device is pressed against the holding portion in the accommodating portion. When the device is installed through the opening of the cover member, the cover member is provided by the socket body -6-201134029 and the positioning member. The upper position is held downward only by the predetermined stroke, and the abutting portions of the pair of pressing members are separated from each other by the accommodating portion of the positioning member, so that the semiconductor device can be mounted on the semiconductor device. Then, the lid member is released from the held state, so that the lid member is raised to the initial position by the elastic thrust of the spring member, whereby the abutting portion of the pair of pressing members is The standby position is close to the housing portion of the positioning member, and is slidably attached to the upper surface of the outer peripheral surface of the 1C package of the semiconductor device, and the abutting portion of the pressing member is to be borrowed. The terminal positioning member positioning the semiconductor device becomes a case where the contact terminal group towards pressed in the holding position. Therefore, the semiconductor device is held as a housing portion for the positioning member. Further, in Japanese Laid-Open Patent Publication No. 2003-133022, a pressing member having such a contact portion is provided in a urging member that is rotatably supported by a socket body via a spring member. Front end. As a result, even if the thickness of the semiconductor device or the like is uneven, the spring member can absorb the unevenness, so that the effect of holding the semiconductor device can be exhibited with a constant contact pressure. Further, as disclosed in Japanese Laid-Open Patent Publication No. H02-136, the disclosure of the Japanese Patent Application Publication No. H. The front end of the latch mechanism is provided with a rocking member slidably. SUMMARY OF THE INVENTION When the semiconductor device is mounted on the accommodating portion of the positioning member via the opening of the lid member, as described above, the abutting portions of the pair of pressing members are mutually mutually from the standby position to the accommodating portion of the positioning member. Close. At this time, the contact portion is a semiconductor device that slides on the outer peripheral surface of the 1C package with a slight movement. In particular, in response to the test, the abutting portion is repeatedly slid over the outer peripheral surface of the 1C package of a semiconductor device, or under a semiconductor device, so that the number of contact terminals is increased. When the pressing force of the joint portion is increased and the abutting portion is slid, the abutting portion forms a scratch on the outer peripheral surface of the 1C package of the semiconductor device. As a result, it is regarded as a good semiconductor device, and in the visual inspection, the flaw on the outer peripheral surface of the 1C package is regarded as a defective product in appearance, and the yield is lowered. In view of the above disadvantages, the present invention provides a socket for a semiconductor device including a holding mechanism capable of selectively holding a semiconductor device, and when the semiconductor device is held, scratches are not applied to the outer peripheral surface of the 1C package of the semiconductor device. Further, it is possible to maintain a slot for a semiconductor device of a semiconductor device. In order to achieve the above object, a socket for a semiconductor device according to the present invention includes: a semiconductor device mounting portion in which a semiconductor device is detachably mounted, and a contact terminal group electrically connected to a terminal of the semiconductor device And the semiconductor device mounted on the semiconductor device mounting portion, when the surface of the 1C package is close to the surface of the 1C package, moves toward the surface in a direction perpendicular to the surface, and has a surface abutting a pushing member of the pressing surface; and the semiconductor device mounting portion is supported to the socket body in proximity or isolation with the pressing member, and one end is relatively movably coupled to the pressing member, The other end is connected to the pressing member support of the driving means; and the pressing member is interlocked with the movement of the pressing member support by the driving means, and the semiconductor device mounted in the semiconductor device mounting portion is 1C When the surface of the package approaches, the pressing surface of the pressing member restricts the pushing in such a manner as to move in a direction orthogonal to the surface to abut against the surface. Position while the position of the guide member of the sliding portion of the guide section configured limit. According to the semiconductor device socket of the present invention, when the semiconductor device mounted on the semiconductor device mounting portion is close to the surface of the 1C package, the pressing surface is approximately parallel to the surface and moves in a direction orthogonal to the surface. a pressing member having a pressing surface abutting the surface; and the semiconductor device mounting portion is supported to the socket body in proximity or isolation with the pressing member, and one end is opposite to the inner peripheral portion of the pressing member a pressing member support that is movably coupled to the other end and connected to the driving means; and a position restricting guiding portion that is a pressing member and that is attached to the semiconductor device mounted on the semiconductor device mounting portion. When the surface of the package is approached, the pressing surface of the pressing member guides the position of the sliding portion of the pressing member while moving in a direction orthogonal to the surface and abutting against the surface, thereby guiding When the semiconductor device is held, the semiconductor device can be held without scratching the outer peripheral surface of the 1C package of the semiconductor device socket. Further features of the present invention will be apparent from the description of the exemplary embodiments illustrated herein. - 9 - 201134029 [Embodiment] FIG. 3 is an external view showing an example of expanding a slot for a semiconductor device of the present invention. The slot for the semiconductor device is placed on the printed wiring board PB (see FIG. 15). The printed wiring board P B is an output unit that supplies an abnormality detection signal indicating a short circuit or the like from a semiconductor device as a test object, which is supplied with a predetermined test voltage. In the third embodiment, a slot for a semiconductor device that is a plurality of slots for semiconductor devices that are vertically and horizontally arranged on the printed wiring board PB is shown. In the third embodiment, the semiconductor device socket is a contact pin module including a terminal portion (terminal portion) electrically connected to the printed wiring board PB and a terminal of the semiconductor device DVA or the semiconductor device DVB described below. 3 6 (refer to FIG. 15), and the socket body 10 having the module housing portion 10A for accommodating the contact pin module 36, and the terminal portions of the contact pin module 36 for the respective electrodes of the semiconductor device DVA a base member 14 for aligning the positioning member, and a cover member 12 that is rotatably disposed on the slot body 10 to selectively close or isolate the pressing member support 18 to the base 14 And the movable member support body 18 may be movably supported by the contact pin 28ai of the contact pin module 36 in accordance with the lifting operation of the cover member 12, and the terminals of the semiconductor device DVA may be held or unwound. The pressing member 20 is constituted as a main element. Further, under the pedestal 14 4, an element side aligning plate 1 6 on the upper portion of the -10-201134029 terminal of the contact pin module 36 is arranged, and the plate 16 is arranged with respect to the element side via the contact pin module 36. The substrate-side alignment plate 26 that is movably disposed toward the slot body 10 and that performs the fixed-side terminal of the terminal of the contact pin module 36 is replaced. As shown in FIG. 4, the component-side alignment plate 16 includes: A contact array portion 16B in which a plurality of fine holes of a contact portion of each of the contact pins 28ai described below are disposed in the center portion is formed vertically and horizontally, and four from the approximately rectangular flat contact array portion 16B The four portions of the corner portion are formed toward the claw portion 16N that protrudes from the contact pin module. The respective holes of the contact arrangement portion 16B correspond to the respective ends of the semiconductor device DVA. The child and the contact pin are formed. Further, each of the fine holes is set to have a relative position of the base 14 to the positioning projections 1 4P S as follows. That is, the position of the positioning projection 14P S is set in accordance with each of the fine holes. Therefore, the relative positions of the respective terminals of the semiconductor device DVA with respect to the respective fine holes are positioned by the positioning projections 14PS, and the relative positions of the respective terminals of the semiconductor device DVA with respect to the contact pins of the contact pin module 36 are positioned. The distal end of each of the claw portions 16N is locked to each of the locking portions of the semiconductor device 1A shown in the figure. Between the element-side arranging plate 16 and the contact pin module 36, a coil spring (not shown) that pushes the element-side aligning plate 16 toward the contact pin module 36 in the direction of isolation is provided. Thereby, the element side alignment plate 16 is supported by the upper portion of the contact pin module 36 so as to be liftable. A component/biasing mechanism is provided at a portion of the fixed corner portion of the contact array portion 16B. -11 - 201134029 As shown in Fig. 4, the substrate-side aligning plate 26 is a locking piece 26N having three portions that are selectively locked to the socket body 10. The locking piece 26N is provided in three places, and when the substrate-side aligning plate 26 is attached to the socket main body 10 at the time of manufacture, the erroneous direction in which the mounting direction is not the proper direction is prevented. Further, a pair of projecting pieces 26P are formed on the lower surface of the socket main body 10 of the board 26 on the substrate side. When the projection body 26P is attached to the substrate, the projection body 26P is inserted into the groove formed in the lower portion of the socket main body 10 or pulled out from the groove. Therefore, the substrate-side aligning plate 26 is in a state in which the fixed-side terminal of the terminal of the pin module 36 is arranged to protrude from the concave portion of the lower end portion of the socket main body as shown in FIG. As shown in Fig. 1, the state is accommodated in the recessed portion. Further, the projecting piece 26 is inserted into the lower portion of the socket body 10 to prevent the hook member (not shown) of the contact pin module 36 formed in the socket body 10 from being held by the contact pin die. Group 3 6 falls off. The semiconductor device DVA (see Fig. 9) which is an object to be inspected is a semiconductor device in which a peripheral portion is formed by a BGA type 1C package (EIAJED-73 03 A: Electronic Information Technology Association Standard). In the semiconductor device DVA, the surface of the plate 16 is arranged on the element side to be described later, and the contact of the contact pin module 36 is connected via the hole of the contact arrangement portion 16B of the element side arrangement plate 16 . The block type electrode serves as a terminal, and a plurality of layers are formed across the entire interval. Further, the semiconductor device DVA is not limited to a semiconductor device formed of a BGA type 1C package, and may be, for example, a semiconductor device formed of an LGA type or QFN type 1C package. -12- 201134029 As shown in Fig. 3, at the outer peripheral portions of the respective sides of the slot main body 10, the respective guide claws of the cover member 1 2 described below are respectively engaged with the movable member at a predetermined interval Part 1 2 Ν guide groove 1 0 G. The guide groove 10 G is formed substantially perpendicularly to the bottom surface portion of the socket body 1 . At the end of each of the grooves 1 〇 G, as shown in Fig. 3, when the lid member 12 is at the uppermost position, the leading end of the guide claw portion 1 2 Ν is locked. Between the pair of guide grooves 10G of the two long sides of at least four sides of the socket body 1 ,, as shown in Fig. 4, when the cover member 12 has to be lowered, the following cover member 12 is made The recesses 10RR and 10LR into which the arms 12RL and 12LL are inserted are formed approximately parallel to the guide groove 10G. In the fourth embodiment, the coil springs of the long side of the outer peripheral portion of the socket main body 10 and the wall portions 1 〇SW of the short side are formed, respectively, and the following coil springs are formed. A spring receiving portion provided at one end of the 30. In addition, in the fourth figure, the portion between the wall portion 10LW that is the wall portion 10 RW and the other wall portion 10SW on the short side is not shown, but the following portions are formed adjacent to each other. A spring receiving portion disposed at one end of each of the coil springs 3 2 . Further, between the spring receiving portions provided at one end of the coil springs 3 2, a notch portion in which the spring receiving end portions 16 6 of the element biasing means described below are fixed is formed. At a central portion of the socket body 1 ,, a module housing portion 10 Α in which the contact pin module 36 is housed is formed (see Fig. 15). The contact arrangement portion 1 6 B of the element-side array plate 6 is disposed at the upper portion □ of the module housing portion 1 . Between the module housing portion 1A and the recesses 1 〇 r r and 1 〇 l R, 13-201134029 respectively form a notch portion through which the pressing member support 18 and the pressing member 20 pass. Further, as shown in Fig. 4, the guide grooves 1 〇 RB and 10LB for guiding the both end portions of the guide pins 27 to be described later are formed in the wall portions ??? The pair of guide grooves i RB RB formed by mutual isolation are formed on the bottom surface of the socket body 1 大约 approximately in parallel. A pair of guide grooves 10LB formed by mutual isolation are also formed in parallel on the bottom surface of the socket body 10. Further, a bottom seat 14 is placed on the contact array portion 16B of the socket body 10. The chassis 14 is a positioning protrusion 14PS that is engaged with each corner of the outer peripheral portion of the 1C package of the semiconductor device DVA to be mounted, and has three portions at the bottom of the semiconductor device housing portion 14A to be described later. Thereby, a predetermined gap is formed between the electrode portion of the 1C package of the semiconductor device DVA positioned by the positioning protrusion 14PS and the surface of the contact array portion 16B. The base portion 14 is engaged with the socket body 10 by a claw portion of a plurality of portions integrally formed on the side surface, and is fixed to the socket body 10. As shown in Fig. 4, the base portion 14 formed in a rectangular frame shape has a semiconductor device housing portion 1 4A that houses the semiconductor device DVA disposed above the contact array portion 16B at the center portion. As described below, the relative position of the bottom portion of the semiconductor device housing portion 14A that blocks the semiconductor device DV A to the contact pin module 36 is set regardless of the thickness of the semiconductor device DVA. The semiconductor device housing portion 14A is opened toward the lid member 12 and the contact array portion 16B. Further, at the periphery of the opening of the bottom portion of the semiconductor device accommodating portion 14A, there are corners of the three portions in which the positioning projections 1 4 P S (see Fig. 7) are formed on the inner side by -14-201134029. Further, as shown in Fig. 4, a hole 14a through which the tip end portion of the biasing arm 40 of the element biasing mechanism described below passes is formed at a corner 隅' of the inner portion. Further, a rectangular hole 1 4 Η is formed in each of the central portions of the outer peripheral portions of the semiconductor device housing portion 14A. When the semiconductor device DVA is attached or detached to the hole 14 分别 of the wall portion 10RW and the wall portion 10L, respectively, the pressing member support 18 and the pressing member 20 described below pass. On the peripheral edge of the hole 14 4 of the outer peripheral portion of the base portion 14, a pair of sliding surfaces 1 4 S W are formed in parallel with each other. Each of the sliding surfaces 1 4 s W is formed to be approximately perpendicular to the surface of the contact array portion 16 6 . Thereby, the sliding surface 1 4 S W is above the contact array portion 16A. The plane of the upper surface of the 1C package including the semiconductor device DVA positioned by the positioning protrusion 14PS is approximately vertical. When the semiconductor device DVA is attached to the chassis 14 as the sliding contact surface 14SW of the position restricting guide portion of the above-described pressing member 20, the rotation angle of each sliding portion 20UE of the pressing member 20 is restricted, and each sliding portion is guided. 20UE for the smooth movement below. Further, when the chassis 14 is detached from the semiconductor device DVA, the sliding contact surface 14SW is a smooth movement of the guide pressing member 20 above the sliding portion 20UE. As shown in Fig. 9A, the frame-shaped cover member 12 has a central portion in which the opening portion 12a through which the upper end portion of the semiconductor device DVA or the chassis 14 passes. The arm members 12RL and 12LL are vertically protruded from the portions of the recessed portions 10RR and 10LR of the above-described slot main body 1 of the cover member 12, respectively. -15-201134029 Since the arm members 12RL and 12LL have the same structure with each other, the structure of the arm member 1 2RL will be described, and the description of the structure of the arm member 12LL will be omitted. One end of the pressing member support 18 is coupled to the lower end of the arm member 1 2RL formed at approximately the land shape. The hole of one end of the pressing member support body 18 between the leg portions of the arm member 1 2RL and the hole of each leg portion of the arm member 12RL are passed through the common connecting pin 24. Thereby, the pressing member support 18 is made rotatable with respect to the leg portion of the arm member 12RL. At the end portions of the respective sides of the cover member 12, the guide claw portions 12 of the guide grooves 10G that are respectively engaged with the slot body 10 are protruded toward the socket body 1''. At a predetermined one of the four corner portions of the cover member 12, as shown in Figs. 1 and 4, the cam piece 1 2 C 构成 constituting a part of the element biasing mechanism is guided to the guide claw portion 1 2 The crucibles are formed approximately parallel. At a position adjacent to the corner portion of the cam piece 1 2 CA in which the cover member 12 is provided, the two coil springs 3 2 of the cover member 12 are pushed upward, and are provided to the cover member 12 in isolation from each other. Below or between the spring receiving portions of the slot body 1〇 described above. Further, in the corner portion of the three portions other than the above-mentioned corner portion of the cover member 12, three coil springs 3' having a diameter larger than the diameter of the coil spring 32 are provided below the slot The spring receiving portions of the body 10 are between. The three coil springs 30 are engaged with the two coil springs 32 to push the cover member 1 2 upward. For example, as shown in Japanese Laid-Open Patent Publication No. 2002-202344, the contact pin module 36 is a pair of side plates which will respectively form both end portions thereof, and a side piece between the side-16-201134029 plates. The plurality of lead frames which are arranged in an overlapping manner in a mutually parallel manner are mainly composed of main elements. Further, the contact pin 28 8 ai is not limited to the form of the contact pin module 36. For example, as shown in Japanese Laid-Open Patent Publication No. 2 003 - 13 3 022, the lower end portion of each contact pin 28 ai, The contact pin 28 ai may be fixed by being pressed into the contact pin mounting hole of the socket body. As shown in the enlarged view of Fig. 16, the element biasing mechanism for pressing the corner portions of the three portions of the semiconductor device Dv A to the positioning projections 1 4P S respectively includes: the cam follower member 3, and The biasing arm 40 connected to one end of the cam follower member 38, and the cam piece of the cover member 1 2 engaged with the hole 3 8 CF of the cam follower member 38 when the semiconductor device DVA is attached or detached 12CA is composed. The cam follower member 38 is a sliding contact surface 16S which is movably disposed at the upper end of the spring receiving end portion 16Eb of the contact arranging portion 16B of the element side array plate 16. The spring receiving end portion 16 6EB is a notch portion that penetrates the above-described socket body 10 toward the outside. The cam follower member 38 is a guide piece 16 6 which is movably guided integrally with respect to the outer peripheral portion of the spring receiving end portion 16 6EB. On the inner side of the spring receiving end portion 16E, a coil spring 42 that pushes the cam follower member 38 toward the inner side of the base 4 via the hole 14a of the base 14 is disposed. As shown in Fig. 16, when the lid member 12 takes the uppermost position, the cam piece 12C of the cover member 12 is disposed at a position directly above the hole 2 8 CF of the cam follower member 38. A. The hole formed at one end of the biasing arm 40 is a coupling pin 38P that is fitted to one end of the cam follower -17-201134029 member 38. Thereby, as shown in Fig. 17, the 'biasing arm 4' and the cam follower member 38 are connected such that the central axis of the biasing arm 40 is located at the center axis of the cam follower member 38. Common on the straight line. The front end portion of the biasing arm 40 is a collision portion having a corner portion that collides with the semiconductor device DVA. The collision portion is formed by bending the center axis of the bias arm 40 toward one side, and has a recess that engages with a corner portion of the semiconductor device DVA. In such a configuration, when the semiconductor device DVA is placed in the pedestal 14 in which the contact arranging portion 16B of the element-side arranging plate 16 is placed, as shown in Figs. 18 and 19, first The cover member 12 is pushed downward so that the inclined surface of the cam piece 12CA is engaged with the periphery of the hole 38CF, and the cam piece 12CA is inserted into the hole 38CF. Thereby, the cam follower member 38 is moved against the spring force of the coil spring 42 in a direction separating from the base 14. Thereafter, when the cover member 12 is maintained at the lowermost position, the semiconductor device DVA is placed in the chassis 14. At this time, the corner portions of the three portions of the semiconductor device DVA are engaged with the positioning projections 14PS. Further, Fig. 17 and Fig. 19 are diagrams showing a positioning projection 14PS in the three positioning projections 14PS. Then, when the pressing force for the lid member 12 is released, the lid member 12 is raised upward by the spring force of the coil springs 30 and 32. Thereby, as shown in Figs. 16 and 17, the cam piece 12CA is isolated by the hole 38CF, so that the cam follower member 38 is moved toward the direction close to the base 14 by the spring force of the coil spring 42. Push -18-201134029 Pressure 'by this, the recess of the biasing arm 40 is engaged with a corner of the 1C package of the semiconductor device DVA, so that the corners of the three parts of the ic package are pushed against the positioning Projection portion 14PS. Therefore, the semiconductor device DVA is positioned to the chassis 14 and the contact array portion 16B. On the one hand, when the semiconductor device DVA is removed from the base 14 of the element-side alignment plate 16, first, as shown in Figs. 18 and 19, the cover member 12 is pushed straight downward to the lowermost end. The position is such that after the inclined surface of the cam piece 12CA is engaged with the circumference of the hole 38CF, the cam piece 12CA is held in a state of being inserted into the hole 38F. Thereby, the cam follower member 38 is moved against the spring force of the coil spring 42 toward the direction separated from the base 14. Thereafter, the semiconductor device D V A ' released from the biasing arm 40 is detached from the inside of the chassis 14 by the opening 1 2 a of the cover member 1 2 . The pressing member support member 18 and the pressing member 20 are a pair of recesses 10RR and 10LR provided in the above-described slot body 10. For example, as shown in FIG. 5A and FIG. 5B, the pressing member support 18 is formed of a resin material and has a base end portion of the through hole 18 8 into which the coupling pin 24 is inserted. And a connecting end portion 18T of a pair of long grooves 1 8 G in which the pressing member 20 is engaged with the engaging pin 20P on both side surfaces, and a coupling portion of the coupling base end portion and the connecting end portion. The proximal end portions of the pressing members 18 are connected to the arm portions 12RL and 12LL of the lid member 12 via the coupling pins 24, respectively. Further, the long groove 18G connecting the end portions 18T is formed along the direction in which the connecting end portion 18T extends. At the long groove 1 8 G of the connecting end portion 18 T, the joining pin 20P of the pressing member 20 is inserted -19-201134029. Thereby, the pressing member 20 is relatively reciprocally movable with respect to the distance at which the connecting end portion 18 T corresponds to only the length of the long groove 18 G. In the above-mentioned joint portion, the hole 18b into which the guide pin 27 is inserted is formed at an intermediate position between the hole 18 8 a and the long groove 18 G. The hole 18b is formed such that its central axis becomes approximately parallel to the central axis of the hole 18a. As described above, both ends of the guide pin 27 are guided to the above-described guide groove 1 0RB or 10LB. Further, between the hole 18b of the coupling portion and the hole 18b, an opening portion 18c larger than the hole 18b is formed. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening portion 18c. One end of the torsion coil spring 22 is locked to the periphery of the opening portion 18c (see FIG. 10D), and the other end of the torsion coil spring 22 is locked to the base of the sliding portion 20UE connected to the pressing member 20. Ends. Thereby, the proximal end portion of the pressing member 20 is elastically urged in the direction in which the pressing member support 18 is abutted. Further, for example, as shown in FIG. 6A, FIG. 6B and FIG. 6C, the pressing member 20 is formed by a resin material and is pressed against the outer peripheral surface of the 1C package of the semiconductor device DVA. The pressing surface of the outer peripheral surface is composed of a pressing portion 20T of the sacrificial portion and a sliding portion 20UE connected to the base end of the pressing portion 210T. The groove-shaped pressing portion 20T has a coupling pin 20P that has a long groove of 18 G that engages the pressing member support 18 with respect to the inner side. Further, as shown in Fig. 6B, the pressing surface of the pressing portion 20T is formed to be orthogonal to the plane including the sliding surface 20Ua formed on the sliding portion 2 0 U E . Further, as shown in Fig. 1, on the proximal end side of the pressing portion 20T, an opening α portion 20a into which the connecting end portion 18 of the pressing member support 18 is inserted is formed. Thereby, the lower end surface of the inserted connecting end portion 8T is brought into contact with the inner surface of the pressing portion 20T at a predetermined pressure by the elastic force of the torsion coil spring 22. A projection portion 20CP that is inserted into the opening portion 18c of the above-described pressing member support member 18 is formed at a central portion of the coupling portion that connects the pair of sliding portions 20UE. The projection 20CP is inserted into the opening portion 18c of the pressing member support 8 so that the pressing member holder 18 is relatively smoothly movable with respect to the pressing member 2'. Further, the pressing member 20 and the pressing member support 18 are not limited to these examples, and are, for example, as shown in Fig. 7A, Fig. 7B, and Fig. 8A, Fig. 8B, and Fig. 8C. The pressing member support is provided with a connecting end portion 18 T, and the pressing member 20 has a long hole 20 0 'G. The pressing member support 18 is formed, for example, of a resin material, having a base end portion through which the coupling pin 24 is inserted, and a base end portion to be engaged with the pressing member 20' The pair of connecting pins 1 8 'P of the long holes 20't have a connecting end portion 18'T on both side faces, and a coupling portion between the coupling base end portion and the connecting end portion. The base end portions of the pressing member supports 18' are connected to the arm portions 1 2 R L and 1 2 L L of the lid member 1 2 via the connecting pins 24 . The connecting pin 18'' of the connecting end portion 18' is formed in a relative manner. The joint pin 18' is a long hole 20, G inserted into the pressing member 20'. Thereby, the pressing member 20' is a distance which is relatively reciprocally movable to the connecting end portion 18 对 -21 - 201134029 at the long hole 20'G. In the coupling portion, the hole 18'b into which the guide pin 27 is inserted is formed at an intermediate position between the hole 18' a and the joint pin 1 VP. The hole 18'b is formed such that its central axis is approximately parallel to the central axis of the hole 18'a. Further, between the hole 18'b and the hole 18'b of the coupling portion, an opening portion 18'c larger than the hole 18'b is formed. A torsion coil spring 22 wound around the guide pin 27 is disposed in the opening 18'c. One end of the torsion coil spring 22 is locked to the periphery of the opening portion 18'c, and the other end of the torsion coil spring 22 is locked to the base end portion of the sliding portion 20' UE connected to the pressing member 20'. Thereby, the proximal end portion of the pressing member 20' is elastically pushed in the direction in which the pressing member support 18 abuts. Further, as shown in FIG. 8A, FIG. 8B, and FIG. 8C, the pressing member 20' is formed by, for example, a resin material, and abuts against the outer peripheral surface of the 1C package of the semiconductor device DVA, and pushes the outer periphery. The pressing surface of the surface has a pressing portion 20'T at the front end portion and a sliding portion 20' U Ε connected to the pressing portion 2 (the base end of the crucible). The groove-shaped pressing portion 20' has The long hole 20'G inserted into the coupling pin 18'' of the pressing member support 18'. The pressing surface of the pressing portion 20' is for the sliding surface 20'Ua including the UE formed on the sliding portion 20' The plane of the pressing portion 20'T is formed on the proximal end side of the pressing portion 20'T, and the opening portion 20'a into which the connecting end portion 18'T of the pressing member support 18' is inserted is formed. Thereby, the lower end surface of the inserted connecting end portion 18'T is abutted against the inner surface of the pressing portion 20'' by a predetermined pressure by the elastic force of the torsion coil spring 22. -22- 201134029 A projection 20'CP inserted into the opening portion 18'c of the above-described pressing member support 18_ is formed in a central portion of the connecting portion of the sliding portion 20'UE. The protruding portion 2 is formed. The 0'CP is inserted into the opening portion 18'c of the pressing member support 18, so that the pressing member support 18' is relatively smoothly movable with respect to the pressing member 20·. In these configurations, when In the test of the semiconductor device DVA, first, for example, by omitting the front end of the arm of the working robot, the lid member 1 is placed at the uppermost position shown in FIG. 1 as shown in FIG. 9A. The springs of the springs 30, 32 are pressed toward the lower side of the arrow direction. Thereby, the respective pressing member support members 18 are guided to the guide grooves 10RB and 10LB, and are moved to the arms of the cover member I2. On the side of the portions 12RL and 12LL, and each of the pressing member supports 18 is rotated around the coupling pin 27 in a direction separating from the base 14. Therefore, the pressing member 20 and the pressing member supporting members 18 are facing toward each other. The arm portions 12RL and 12LL pass through the opening portion 14H of the chassis 14. After that, after the lid member 12 is pressed to the lowermost position, the pressing member 20 and the pressed pressing member supporting body are held. i 8 is disposed at a predetermined standby position formed around the outer side of the base 14 . As shown in Figs. 18 and 19, the position of the front end portion of the biasing arm 40 of the element biasing mechanism is a position which is isolated from the hole 14a of the base 14. At this time, the semiconductor device DVA is used. The transport arm of the transport robot (not shown) is sucked and held and placed on the contact array unit 16B of the element side array plate i 6 . • 23- 201134029, as shown in Figs. 9B and 9C. The cover member 12 is a tip end of the working robot that moves in the direction of the arrow direction in a state of abutting against the upper surface of the cover member 12, that is, when the lift is raised, the spring force of the coil springs 30 and 32 rises. To the top position. At this time, the semiconductor device DVA to be mounted is automatically positioned to position the positioning projection 14PS attached to the chassis 14 by the above-described component biasing mechanism as shown in Figs. 6 and 17 . Further, as the arms 12RL and 12LL of the lid member 12 rise, as shown in FIG. 10A, the pressing member support 18 and the pressing member 20 are the connecting pins 2 that press the member support 18. 7 starts to rotate in such a manner that the center protrudes from the opening portion 1 4H of the base 14 . At this time, the joint pin 27 is guided under the guide grooves 10RB and 10LB, and is separated from the arm portions 12RL and 12LL of the lid member 12 and moved in a direction approaching the opening portion 14H. When the connecting pin 2 7 moves toward the opening portion 1 4H of the base 14 , as shown in FIG. 10B , the sliding surface 2 OUa of the pressing member 20 to the sliding portion 20 UE is expanded as shown in FIG. 2 . It abuts against the sliding surface 1 4SW of the base 14. Thereby, the rotation angle of the pressing member 20 is restricted. At this time, the joint end 18T of the pressing member support 18 starts to move toward the inner surface of the pressing member 20. Further, the pressing surface of the pressing portion 20T of the pressing member 20 is approximately flat with respect to the upper surface of the semiconductor device DV A with a predetermined interval therebetween. Further, as shown in FIGS. 9B and 10C, when the arm members 12RL and 12LL of the lid member 12 are raised again, the pressing surface of the pressing portion 20T of the pressing member 20 is prevented from abutting against friction. The upper surface of the semiconductor device DVA. At this time, the connection end 18T of the pressing member support 18 is moved to the inner surface of the pressing member 20 of -24-201134029, and thus the pressing area PA pressed by the pressing surface of the pressing portion 20T is pressed. As shown in Fig. 13 and Fig. 14, it is a band-shaped field having a predetermined width which is expanded more than the pressing area of the conventional latch mechanism. Therefore, with respect to the semiconductor device DVA, the appropriately dispersed pressing force acts on the upper surface of the semiconductor device DVA. At this time, as shown in FIG. 1, the sliding surface 20Ua of the sliding portion 20 UE of the pressing member 20 is moved from the initial position H1 to the display state in a state of abutting on the sliding surface 14SW. The position of the predetermined position H2 below the 12th figure. At this time, as shown in FIG. 10D, only the front end of the connecting end 18T of the pressing member support 18 is pushed down from the pressing member 20, and the inner surface of the pressing member 20 is slidably joined to protrude only. Quantitative ΔΗ. Thereby, the pressing surface of the pressing portion 20T of the pressing member 20 does not rub against the upper surface of the semiconductor device DVA, and abuts against the outer circumferential surface of the 1C package of the semiconductor device DVA at a predetermined pressure. Therefore, the pressing surface thereof is to push the semiconductor device DV A toward the contact pin module 36. As a result, the 1C package of the semiconductor device DVA is not damaged by the pressing portion 20T of the pressing member 20. Further, when the lid member 12 is maintained at the test position, for example, when an inspection signal is supplied to the input/output portion of the printed wiring board PB, the inspection signal is supplied to the semiconductor device DV A via the contact pin module 36, and When the abnormality of the circuit is detected, the abnormality detection signal from the semiconductor device DVA passes through the input/output portion, and is, for example, a fault diagnosis device supplied to the outside. When the inspection of the semiconductor device DVA is completed, the semiconductor device DVA is taken out, and the front end of the arm 25-201134029 of the working robot is brought into contact with the upper surface of the cover member 1 2 in the same manner as described above in order to mount the new semiconductor device DVA. The pressing forces of the coil springs 30 and 32 are pushed downward. The semiconductor device DVA to be tested was taken out from the element side array plate 16 by the transfer arm, and the new semiconductor device DVA which was tested was mounted in the same manner as described above. Further, as shown in Fig. 15, in the above example, it is assumed that the semiconductor device DVB is used as the pressing portion 2 of the pressing member 20 even when the semiconductor device DVB having a thickness thinner than the thickness of the semiconductor device DVA is mounted. When the pressing surface of 0T is pressed, the lowermost end position (extension position) of the bottom portion of the semiconductor device housing portion 14A that blocks the semiconductor device DVB in the chassis 14 is half when the semiconductor device DVA is mounted. The lowermost positions of the bottoms of the conductor device housing portions 1 4 A are the same. Therefore, it is not necessary to change the relative position of the bottom portion of the semiconductor device housing portion 14A to the contact pin module 36 in accordance with the thickness of the semiconductor device. Moreover, in the above-described example, the rotation angle of each sliding portion 20 UE of the pressing member 20 is restricted, and the position that smoothly moves toward the lower side of each sliding portion 20UE and the sliding surface 1 4SW of the restriction guide portion are controlled. It is a peripheral edge of the hole 14H formed in the outer peripheral portion of the base 14, but is not limited to such an example, for example, as shown in Figs. 20 to 22, in the recesses 10'RR and 10'LR and the module. In the notch portion between the accommodating portions 10'A, the terminal 1 〇'po as the position restricting guide portion may be integrally formed in the socket body 10. In Fig. 20, in the slot body 1' Each of the outer peripheral portions of each side is formed with a guide groove 1 O'G of each of the guide claw portions 12N of the -26-201134029 which can be moved and moved to the lid member at a predetermined interval. The guide groove 1 〇'G is formed approximately perpendicularly to the bottom surface portion of the socket body 1 。. At the end of each of the grooves 10'G, when the lid member 12 takes the uppermost end position, the leading end of the guide claw portion 12A is locked. When the pair of guide grooves 1 0 ′ G of the two long sides of at least four sides of the socket body 10 ′ are to be lowered, the arm portions 12RL and 12LL of the cover member 12 described below are The inserted recesses i rr, rr and i 〇, lR are formed approximately parallel to the guide groove 10G. Further, in a central portion of the socket body 10', a module housing portion 1A' received in the contact pin module 36 is formed. The contact array portion 16B of the element side alignment plate 16 is disposed on the upper portion of the module housing portion 1 〇 1 A. Between the module housing portion 1A and the recesses 1 〇 'R R and 1 〇 '1 R, the notch portions through which the pressing member support 18 and the pressing member 20 are respectively formed are formed. Inside the respective notch portions, a pair of terminals 1 0 1 P 形成 are formed so that the plane including the contact array portion 16B is approximately vertical. Thereby, as shown in Fig. 20, the rotation angle of each sliding portion 20 UE of the pressing member 20 is restricted by the terminal 1 〇' Ρ ,, and the lower portion of each sliding portion 20UE is smoothly moved. Become a guide. Further, in an example of the above-described socket for a semiconductor device of the present invention, one end of the member support members 18 and 18' is pressed and connected to the lid member! In the configuration of 2, the pressing members 20 and 20 are driven, but are not limited to such an example. For example, Japanese Laid-Open Patent Publication No. 2 0 0 6 - 0 7 1 3 7 5 (refer to Chapter 53) Also shown, in place of the cover member 12, one end of the pressing member supports 18 and 18' is pushed or released by the material processing portion, thereby pushing -27-201134029 pressing member 20 The present invention is not limited to the disclosed exemplary embodiments, and the present invention has been described with reference to the exemplary embodiments. The item will conform to the broadest interpretation to cover all such constructs and functions. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a partial cross-sectional view showing a semiconductor package showing the present invention. Fig. 2 is a perspective view showing a part of Fig. 1 in an enlarged manner; and Fig. 3 is a perspective view showing a view of the semiconductor device of the present invention. Fig. 4 is a perspective view showing an example of Fig. 1 in an exploded manner. Fig. 5A is a plan view showing the holding body of the example of Fig. 1, and Fig. 5B is a side view showing the body of Fig. 5A. Fig. 6A is a plan view showing an example of Fig. 1 and Fig. 6B is a view showing a pressing view of Fig. 6A. Fig. 6C is a view showing a side of a pressing member of Fig. 6A. Fig. 78 is a plan view showing another example of the holding body, and Fig. 78 is a side view of the pressing member support. Fig. 8A is a diagram showing the example of Fig. 1. To understand, the following additional request modification and an example of the slot for the equivalent configuration are shown in section i. The components of the outer member of the example of the slot are the front view and the plan view of the member of the pressing member for supporting the pressing member of the pressing member. Pushing member for use: -28-201134029 for the pressing member shown in Fig. 7A. Fig. 8B is a front view of the pressing member shown in Fig. 8A, 8 C is a side view of the pressing member shown in Fig. 8A. Fig. 9A, Fig. 9B and Fig. 9C are perspective views respectively showing a partial cross-sectional view for explaining an operation of an example shown in Fig. 1. Fig. 10A, Fig. 10B, Fig. 10C and Fig. 10D are partial cross-sectional views for explaining the operation of the example shown in Fig. 1, respectively. Fig. 11 is a perspective view showing an enlarged view of a part of Fig. 9B. Fig. 12 is a perspective view showing an enlarged view of a part of Fig. 9C. Fig. 1 is a view for explaining the pressing area of the pressing portion serving as the pressing member. Fig. 14 is a view for explaining the pressing area of the pressing portion serving as the pressing member. Fig. 15 is a cross-sectional view showing the pressing operation of the pressing member when the semiconductor devices having different thicknesses are respectively mounted in the example of Fig. 1. Fig. 16 is a partial cross-sectional view showing the configuration of the element biasing mechanism. Fig. 17 is a plan view showing the element biasing mechanism shown in Fig. 16 together with the semiconductor device. Fig. 18 is a partial cross-sectional view showing the operation of the element biasing mechanism. Fig. 19 is a plan view showing the element biasing mechanism in the state of the -29 - 201134029 state shown in Fig. 8 together with the semiconductor device. Fig. 20 is a plan view showing another example of the socket body which is an example of a socket for a semiconductor device used in the present invention, with a part of the base. Fig. 21 is a cross-sectional view showing a line χχι_χχι along the example shown in Fig. 20. Fig. 22 is a cross-sectional view showing the χχπ-XXII line along the example shown in Fig. 20. [Description of main component symbols] 1〇: socket body 1 2 : cover member 14 : base 14A : semiconductor device housing portion 14H : opening portion 14SW : sliding surface 1 8 : pressing member support 2 : pressing member 20UE: sliding portion 20Va: sliding surface 22: torsion coil spring 24: coupling pin 27: guide pin DVA, DVB: semiconductor device-30-