CN103367982B - Socket - Google Patents
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- CN103367982B CN103367982B CN201210081168.0A CN201210081168A CN103367982B CN 103367982 B CN103367982 B CN 103367982B CN 201210081168 A CN201210081168 A CN 201210081168A CN 103367982 B CN103367982 B CN 103367982B
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- China
- Prior art keywords
- buckling part
- base component
- lock buckling
- socket
- backing plate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
A kind of socket, it includes the base component of built-in multiple conducting terminal；It is mounted on the cap assembly of base component, and can move on the reciprocating direction that described base component is toward or away from；Mounting parts, are be mounted on base component；Lock buckling part, is be articulated in described cap assembly, and can rotate formation closed position and open position with mobile generation of described cap assembly；Backing plate parts, are be articulated in described mounting parts, and described backing plate parts have the first moving surface for lock buckling part sliding.Such that it is able to the upper surface of protection chip module will not form contact damage when pressurized, also which thereby enhance the yield rate of chip module.
Description
[technical field]
Disclosure one socket, refers in particular to and a kind of is electrically connected the chip module socket to printed circuit board (PCB).
[background technology]
The chip module of BGA or LGA package etc. needs to carry out to be applied the burn-in test of stress by high temperature before shipment, and this is to remove the chip module broken down in the certain period after from shipment to market in advance.Refer to a kind of socket that TaiWan, China patent announcement the 560110th is disclosed, comprising: base component, can at the cap assembly that the direction that opposite base parts are toward or away from reciprocatingly is installed, be fixed on base component and the multiple contacts being electrically connected with each terminal of the chip module in the mounting surface being placed on base body parts, the latch that is rotatably supported on base component.It is provided with swingable tilting member in the front end of latch, tilting member presses chip module.Thus, it is possible to do not make slim chip module install damagedly.
But, the aforesaid sockets upper surface pressing chip module in rotary moving by latch.Thus, when being pressed into chip module, the front end of described latch presses the upper surface of chip module and moves in the horizontal direction.That it brings as a result, chip module upper surface occur moved horizontally the contact damage caused by latch.When there being such contact damage, can be defective during visual examination, it is impossible to as product turnout.
In consideration of it, the socket of a kind of improvement of necessary offer, with the defect overcoming aforesaid sockets to exist.
[summary of the invention]
It is an object of the invention to provide a kind of surface that can protect chip module and avoid the socket of contact damage.
nullFor solving above-mentioned technical problem，The present invention adopts the following technical scheme that a kind of socket，It is for electrically connecting to chip module，Described socket includes base component、It is contained in some conducting terminals of base component、It is mounted on base component and is formed with the cap assembly housing frame mouth、It is mounted on base component and is articulated in the lock buckling part of cap assembly，Described mounting parts have towards the mounting surface housing frame mouth，Described cap assembly can move on the reciprocating direction that described base component is toward or away from，Described lock buckling part can rotate relative to the generation of moving of described base component with described cap assembly，When described cap assembly is in the position leaving described base component，Described lock buckling part is positioned at closed position，When described cap assembly is in the position close to base component，Described lock buckling part is positioned at open position，Described socket also includes the backing plate parts being articulated in described mounting parts，Described lock buckling part has the press section being positioned at free terminal，Described lock buckling part compresses aforementioned backing plate parts，Described backing plate parts have the first moving surface for the sliding of lock buckling part press section.
nullThe present invention additionally uses following technical scheme: a kind of socket，It is for electrically connecting to chip module，It includes base component、It is fixed on some conducting terminals of described base component、It is mounted on the mounting parts of base component、Backing plate parts、It is mounted on base component and can at the cap assembly moved on the reciprocating direction that described base component is toward or away from and the lock buckling part being articulated in described cap assembly，Described conducting terminal has the contact site protruding out base component，Described mounting parts have mounting surface and normality is positioned away from the position of base component to be located at below mounting surface by latent for conductive terminal contacts portion，Described chip module has the contact surface with mounting surface engagement and the end face relative with contacting surface，The chip module pressing surface that described backing plate parts coordinate with the end face of chip module after having rotation，Described lock buckling part can rotate formation open position and closed position with the described cap assembly mobile generation on reciprocating direction，Described backing plate parts are articulated in described mounting parts，When aforementioned lock buckling part moves to closed position from open position，Lock buckling part compresses aforementioned backing plate parts，Aforementioned mounting parts are driven to realize contacting with chip module the electric connection on surface to the direction motion close to base component so that conductive terminal contacts portion to expose mounting surface.
Compared with prior art, electric connector of the present invention at least has the advantage that the present invention passes through to be articulated in the backing plate parts of mounting parts, accept come from lock buckling part is set move horizontally friction, geo-stationary due to mounting parts, chip module and backing plate parts, horizontal movement will not be produced on chip module, thus being effectively guaranteed the presentation quality that chip module is good, improve yield rate.
[accompanying drawing explanation]
Fig. 1 is the three-dimensional combination figure of socket of the present invention.
Fig. 2 is the three-dimensional exploded view of socket of the present invention.
Fig. 3 is the sectional view along A-A direction shown in Fig. 1, and wherein chip module is unassembled is in closed position to socket and lock buckling part.
Fig. 4 is the cross-sectional schematic of socket of the present invention, and wherein chip module is unassembled in an open position to socket and lock buckling part.
Fig. 5 is another cross-sectional schematic of socket of the present invention, and wherein chip module is assembled to electric connector and lock buckling part is in closed position.
[detailed description of the invention]
The detailed description of the invention of socket 100 of the present invention is described in detail below in conjunction with accompanying drawing.
Referring to shown in Fig. 1 to Fig. 5, socket 100 of the present invention is provide the electric connection between chip module 40 and circuit board (non-icon), it is achieved the test to chip module.Described socket 100 includes base component 10；Multiple conducting terminals 20, be fixed on described base component 10 and there is holding parts 201, the weld part 203 that downwardly extends from holding parts 201 and the contact site 205 upwardly extending and protruding out base component 10 from holding parts 201；Mounting parts 30, are be mounted on base component 10 and have mounting surface 301；Aforementioned chip module 40 has the contact surface 401 and the end face 403 relative with contacting surface 401 that coordinate with mounting surface 301；Backing plate parts 50, are be articulated in described mounting parts 30, and the chip module pressing surface 5032 coordinated with the end face 403 of chip module 40 after having rotation；Cap assembly 60, is be mounted on base component 10 and can move on the reciprocating direction I that described base component 10 is toward or away from, owing to the effect of spring 600 makes its normality be positioned away from the position of base component 10；Lock buckling part 70, is be articulated in described cap assembly 60 and can rotate formation open position (ginseng Fig. 4) and closed position (ginseng Fig. 3 and Fig. 5) with the described cap assembly 60 mobile generation on reciprocating direction I.
Refer to Fig. 2 and Fig. 3, the thin portion structure of this socket 100 significant components is described below.Aforementioned cap assembly 60 is formed with collecting frame mouth 601 and by leading pulling buckle 602 movable assembling joint on base component 10, and described socket 100 is further configured with being fixed on the guiding frame portion 80 of base component 10 in collecting frame mouth 601.The mounting surface 301 of described mounting parts 30 is towards housing frame mouth 601, and can move on described reciprocating direction I equally.Aforementioned lock buckling part 70 is installed on described cap assembly 60 by a drive-connecting shaft 700, the described lock buckling part 70 position inside described drive-connecting shaft 700 is additionally provided with support shoulder 701, and described base component 10 is provided with groove portion 101 open, upper and lower spacing described support shoulder 701, left and right and rotates with mobile generation of described cap assembly 60 to realize lock buckling part 70.It is provided with fluting 703 in the middle part of described lock buckling part 70, in described fluting 703, is provided with the press section 705 of column.When described cap assembly 60 is in the position leaving base component 10, described lock buckling part 70 is positioned at closed position, and when described cap assembly 60 is in the position close to described base component 10, described lock buckling part 70 is positioned at open position.
Referring to Fig. 4, described backing plate parts 50 have the forked free terminal 503 housing aforementioned column press section 705, that is the forked free terminal 503 of described backing plate parts 50 is mounted in aforementioned fluting 703 and coordinates with described press section 705.Aforementioned forked free terminal 503 includes upper bifurcation 503a and lower bifurcation 503b, aforementioned lower bifurcation 503b has upper and lower surface, described upper surface forms the first moving surface 5031 when lower clinching is closed for press section 705 sliding, and described lower surface forms described chip module pressing surface 501.Described upper bifurcation 503a has the second moving surface 5033 when backing plate parts 50 are opened with the linkage of described lock buckling part 70.
The start process of of the present invention socket 100 is described below.Refer to Fig. 3 to Fig. 5; when not loading chip module 40; described mounting parts 30 make its normality be positioned away from the position of aforementioned base component 10 due to the effect supporting spring 300, be located at mounting surface less than 301 play the effect of protection thus being dived by the contact site 205 of conducting terminal 20.Backing plate parts 50 now do not contact described mounting parts 30 with lock buckling part 70；Refer to the 4th figure and the five figure, when needs load chip module 40, described reciprocating direction I presses down on cap assembly 60, the drive-connecting shaft 700 making lock buckling part 70 synchronizes to move downward, meanwhile, support shoulder 701 inside drive-connecting shaft 700 is positioned at groove portion 101 by bound, effect by lever, the press section 705 being positioned at lock buckling part 70 free terminal rotates up tilting, second moving surface 5033 of described backing plate parts 50 is because of the matching relationship with press section 705, also by coordinated operation to open position, thus can smoothly chip module 40 be loaded in receiving space 601；After loading chip module 40, aforementioned lock buckling part 70 from open position move to closed position time, described lock buckling part 70 compresses aforementioned backing plate parts 50, and then drives aforementioned mounting parts 30 to realize contacting with chip module the electric connection on surface 401 to the direction motion close to base component 10 so that the contact site 205 of conducting terminal 20 to expose mounting surface 301；During final buckling state, the chip module pressing surface 5032 of described backing plate parts 50 is parallel to described mounting surface 301, and described lower bifurcation 503b extends to the width of lock buckling part 70 to providing dispersion and uniform pressure more to both sides.
This creation emphasis structure is in that: be articulated in the backing plate parts 50 of mounting parts 30, accept come from lock buckling part 70 is set move horizontally friction；And due to the geo-stationary of mounting parts 30, chip module 40 and backing plate parts 50, because of without producing horizontal movement on chip module 40, thus being effectively guaranteed the good presentation quality of chip module 40 and yield rate.In this creation, backing plate parts 50 and aforementioned lock buckling part 70 are provided with link gear (press section 705 and forked free terminal 503), and when described lock buckling part 70 is opened, described backing plate parts 50 are opened therewith；In some other design, backing plate parts 50 can also link according to practical application selection with cap assembly formation or be independently arranged.Additionally, the lock buckling part 70 in the present embodiment produces to rotate by supporting the cooperation in the groove portion 101 of shoulder 701 and base component 10, in some other design, also can becoming other pattern according to practical application unrestricted choice, the principle mainly all prized by lever is reached.Furthermore, the chip module pressing surface 5032 of backing plate parts 50 of the present invention is designed to the concordant laminating of end face 303 with chip module 40 to realize all even scattered pressure, the different-thickness according to chip module 40 is needed to do adaptability processing, and when some other precision and manufacture requirements are not high, can also be the point do not fitted or line compresses, because after chip module 40 and backing plate parts 50 fasten and put in place, the two is geo-stationary can avoid the slip damage to chip module outward appearance.
The foregoing is only one embodiment of the present invention, it is not all of or unique embodiment, the change of any equivalence that technical solution of the present invention is taked by those of ordinary skill in the art by reading description of the present invention, the claim being the present invention is contained.
Claims (9)
- null1. a socket，It is for electrically connecting to chip module，Described socket includes base component、It is contained in some conducting terminals of base component、It is mounted on base component and is formed with the cap assembly housing frame mouth、It is mounted on the mounting parts of base component and is articulated in the lock buckling part of cap assembly，Described mounting parts have towards the mounting surface housing frame mouth，Described cap assembly can move on the reciprocating direction that described base component is toward or away from，Described lock buckling part can rotate relative to the generation of moving of described base component with described cap assembly，When described cap assembly is in the position leaving described base component，Described lock buckling part is positioned at closed position，When described cap assembly is in the position close to base component，Described lock buckling part is positioned at open position，It is characterized in that: described socket also includes being articulated in the backing plate parts of described mounting parts，Described lock buckling part has and is positioned at free terminal and in the press section of column，Described lock buckling part compresses aforementioned backing plate parts，Described backing plate parts have the first moving surface for the sliding of lock buckling part press section and house the forked free terminal of described column press section.
- 2. socket as claimed in claim 1, it is characterised in that: being provided with fluting in the middle part of described lock buckling part, described press section is located in fluting, and described backing plate parts are mounted in fluting and coordinate in described press section.
- 3. socket as claimed in claim 2, it is characterised in that: described forked free terminal includes upper bifurcation and lower bifurcation, and described lower bifurcation extends to the width of lock buckling part to both sides.
- 4. socket as claimed in claim 3, it is characterised in that: described lower bifurcation has upper and lower surface, and described upper surface forms described first moving surface for press section sliding, and described lower surface forms chip module pressing surface.
- 5. socket as claimed in claim 4, it is characterised in that: described upper bifurcation has the second moving surface, and described second moving surface, when aforementioned lock buckling part moves from closed position to open position, drives aforementioned backing plate parts to open.
- 6. socket as claimed in claim 5, it is characterised in that: when chip module loads described socket, after described lock buckling part is positioned at closed position, the pressing surface of described backing plate parts is parallel to described mounting surface.
- 7. the socket as according to any one of claim 1 to 6, it is characterized in that: described lock buckling part is installed on described cap assembly by a drive-connecting shaft, described lock buckling part position inside described drive-connecting shaft is additionally provided with support shoulder, described base component is provided with the groove portion of upper and lower spacing described support shoulder, thus lock buckling part can be made to produce when drive-connecting shaft moves up and down with cap assembly to rotate.
- null8. a socket，It is for electrically connecting to chip module，It includes base component、It is fixed on some conducting terminals of described base component、It is mounted on the mounting parts of base component、Backing plate parts、It is mounted on base component and can at the cap assembly moved on the reciprocating direction that described base component is toward or away from and the lock buckling part being articulated in described cap assembly，Described conducting terminal has the contact site protruding out base component，Described mounting parts have mounting surface and normality is positioned away from the position of base component to be located at below mounting surface by latent for conductive terminal contacts portion，Described chip module has the contact surface with mounting surface engagement and the end face relative with contacting surface，The chip module pressing surface that described backing plate parts coordinate with the end face of chip module after having rotation，Described lock buckling part can rotate formation open position and closed position with the described cap assembly mobile generation on reciprocating direction，It is characterized in that: described lock buckling part has and is positioned at free terminal and in the press section of column，Described backing plate parts have the forked free terminal housing described column press section and are articulated in described mounting parts，When aforementioned lock buckling part moves to closed position from open position，Lock buckling part compresses aforementioned backing plate parts，Aforementioned mounting parts are driven to realize contacting with chip module the electric connection on surface to the direction motion close to base component so that conductive terminal contacts portion to expose mounting surface.
- 9. socket as claimed in claim 8, it is characterised in that: described backing plate parts and aforementioned lock buckling part are provided with link gear, and when described lock buckling part is opened, described backing plate parts are opened therewith.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210081168.0A CN103367982B (en) | 2012-03-26 | 2012-03-26 | Socket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210081168.0A CN103367982B (en) | 2012-03-26 | 2012-03-26 | Socket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103367982A CN103367982A (en) | 2013-10-23 |
| CN103367982B true CN103367982B (en) | 2016-07-13 |
Family
ID=49368805
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210081168.0A Active CN103367982B (en) | 2012-03-26 | 2012-03-26 | Socket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103367982B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201430249Y (en) * | 2009-04-02 | 2010-03-24 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN201498642U (en) * | 2009-04-10 | 2010-06-02 | 富士康(昆山)电脑接插件有限公司 | Electrical connector |
| CN101919128A (en) * | 2007-12-04 | 2010-12-15 | 森萨塔科技公司 | Socket |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20090009179U (en) * | 2008-03-10 | 2009-09-15 | 센싸타테크놀러지스코리아 주식회사 | Socket for electrical parts |
| JP2011023164A (en) * | 2009-07-14 | 2011-02-03 | Yamaichi Electronics Co Ltd | Socket for semiconductor device |
-
2012
- 2012-03-26 CN CN201210081168.0A patent/CN103367982B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101919128A (en) * | 2007-12-04 | 2010-12-15 | 森萨塔科技公司 | Socket |
| CN201430249Y (en) * | 2009-04-02 | 2010-03-24 | 富士康(昆山)电脑接插件有限公司 | Electric connector |
| CN201498642U (en) * | 2009-04-10 | 2010-06-02 | 富士康(昆山)电脑接插件有限公司 | Electrical connector |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103367982A (en) | 2013-10-23 |
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| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |