TW201133691A - A test system for detecting shape and/or orientation errors of wafers - Google Patents

A test system for detecting shape and/or orientation errors of wafers Download PDF

Info

Publication number
TW201133691A
TW201133691A TW99124774A TW99124774A TW201133691A TW 201133691 A TW201133691 A TW 201133691A TW 99124774 A TW99124774 A TW 99124774A TW 99124774 A TW99124774 A TW 99124774A TW 201133691 A TW201133691 A TW 201133691A
Authority
TW
Taiwan
Prior art keywords
wafer
light source
test system
holding device
light
Prior art date
Application number
TW99124774A
Other languages
English (en)
Chinese (zh)
Inventor
Thomas Bee
Martin Wedler
Armin Seitz
Original Assignee
Amb App & Maschb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Amb App & Maschb filed Critical Amb App & Maschb
Publication of TW201133691A publication Critical patent/TW201133691A/zh

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like

Landscapes

  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW99124774A 2009-07-27 2010-07-27 A test system for detecting shape and/or orientation errors of wafers TW201133691A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009034824 2009-07-27

Publications (1)

Publication Number Publication Date
TW201133691A true TW201133691A (en) 2011-10-01

Family

ID=43027580

Family Applications (1)

Application Number Title Priority Date Filing Date
TW99124774A TW201133691A (en) 2009-07-27 2010-07-27 A test system for detecting shape and/or orientation errors of wafers

Country Status (3)

Country Link
DE (1) DE102010032381A1 (de)
TW (1) TW201133691A (de)
WO (1) WO2011012291A1 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803412B (zh) * 2021-11-16 2023-05-21 大陸商西安奕斯偉材料科技有限公司 矽片方位調準裝置及矽片缺陷檢測設備

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112642731A (zh) * 2020-12-04 2021-04-13 苏州天准科技股份有限公司 联合检测装置及硅片智能分选机

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6002793A (en) * 1992-01-30 1999-12-14 Cognex Corporation Machine vision method and apparatus for finding an object orientation angle of a rectilinear object
US6471464B1 (en) * 1999-10-08 2002-10-29 Applied Materials, Inc. Wafer positioning device
WO2002054139A2 (en) * 2001-01-02 2002-07-11 Robotic Vision Systems, Inc. Lcc device inspection module
DE102004015326A1 (de) * 2004-03-30 2005-10-20 Leica Microsystems Vorrichtung und Verfahren zur Inspektion eines Halbleiterbauteils
US7315361B2 (en) * 2005-04-29 2008-01-01 Gsi Group Corporation System and method for inspecting wafers in a laser marking system
US7639861B2 (en) * 2005-09-14 2009-12-29 Cognex Technology And Investment Corporation Method and apparatus for backlighting a wafer during alignment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI803412B (zh) * 2021-11-16 2023-05-21 大陸商西安奕斯偉材料科技有限公司 矽片方位調準裝置及矽片缺陷檢測設備

Also Published As

Publication number Publication date
DE102010032381A1 (de) 2011-02-03
WO2011012291A1 (de) 2011-02-03

Similar Documents

Publication Publication Date Title
JP4157037B2 (ja) 欠陥検査装置
TWI524064B (zh) 多重瑕疵檢出之光學檢測設備
KR101585916B1 (ko) 물체 비전 검사 장치 및 물체 비전 검사 방법
TWI284623B (en) Alignment apparatus
TW201306161A (zh) 基板處理裝置、基板保持裝置及基板保持方法
KR20120084738A (ko) 고속, 고해상도, 3차원 태양 전지 검사 시스템
KR101756904B1 (ko) 광학 필름 첩부 위치 측정 장치
JP2017523312A (ja) 基板上の材料を処理するための装置、及び基板上で処理される材料の光学特性を測定するための方法
US20200378899A1 (en) Glass processing apparatus and methods
TW201805614A (zh) 視覺檢查模組以及具有該視覺檢查模組的元件處理器
TW201632876A (zh) 基板監視裝置及基板監視方法
TWI613460B (zh) 偏光光線照射裝置
JP2015169449A (ja) ガラスびんの胴径測定器
TW201133691A (en) A test system for detecting shape and/or orientation errors of wafers
TW200829909A (en) Device for detecting foreign object on flat panel display
US11002685B2 (en) Surface foreign substance detector for transparent or translucent film
JP3176803U (ja) 検査用照明装置
TW201426900A (zh) 基板定向腔室
JP2015127689A (ja) 外観検査装置
JP2014092489A (ja) 検査装置および検査方法
CN208674091U (zh) 承载盘组件和机械手臂
CN217588857U (zh) 一种晶圆校准器以及晶圆生产设备
TWI664130B (zh) 晶圓匣
TWI637165B (zh) 視覺檢測模組及包含該模組的元件檢測系統
CN101363973A (zh) 在线检测装置及在线检测方法