201132452 六、發明說明： 【發明所屬之技術領域】 電池（太陽光發電板）之基板 之原材料的角柱狀之多晶矽 本發明係關於可將作為太陽 而使用之正方形或長方形基板 錠塊或單晶矽錠塊之侧面或圓周如進行倒角加工之複合 式倒角加工裝置。用於以線切割方法，將錢塊切片成厚 度200〜24G㈣’同時在獲得複數之太陽電池时基板時， 倒角加工C軸端面經切斷之圓柱狀錠塊表面以使以短時 間製造錠塊切斷時無碎4或裂痕之角柱狀或圓柱狀石夕鍵 塊。 【先前技術】 在製造太陽電池用矽基板之步驟中，進行有以帶鋸切下 圓柱狀單晶石夕錠之圓剖面4周片.，於4角部殘留有圓弧（r角 4 )作為角柱狀矽錠（工件）’其次，以橫形圓筒研削裝置之 包含主軸台與尾架之夾緊裝置支撐，並以杯形砂輪型砂 輪，將四側面之表面以期望之厚度（8〜1〇 mm)進行倒角， 其-人，進行切片，製造厚度2〇〇〜3 3 0 μηι之正方形狀矽基板 (例如’參照非專利文獻1)。 又，作為角柱狀矽錠塊，利用有將於角柱狀石墨容器内 /主入/谷解之金屬石夕（\)溶液’並於一方向凝固後，將與容 器内面接觸污染之下端面與側面進行倒角而獲得之多晶矽 錠，切斷成2至4塊之錠塊，或在半導體基板之生產停歇之 時期，殘留一部份R部份，藉由切片裝置，切斷半導體基 板製造用圓柱狀矽錠塊之四側面，其次，將兩端面進行倒 M7938.doc 201132452 角加工，其後，進行柱狀錠塊之角落R面倒角加工（倒角量 為7.5〜8 mm)後’將四側面平面進行倒角加工（倒角量為 0.5〜1 mm)而作為太陽電池用之角柱狀單晶矽錠塊者。認 為單晶矽基板光轉換率高於多晶矽基板，但倒角加工較 難0 例如，曰本特開平8_73297號公報（專利文獻丨）提出一種 方法，係將在電爐中還原矽石或矽砂而獲得之.金屬矽熔 液，流入至耐熱性柱狀容器内，從容器下端向上端逐步進 行冷卻，藉此作為一方向凝固之角柱狀多晶矽錠棒，將與 容器内面接觸污染之下端面與側面研削5 mm倒角量，進行 研磨倒角’進而以氟酸.硝酸混合水溶液進行蝕刻而製造 多晶矽錠。 美國專利第6679759號公報（專利文獻2)提出一種方法， 係以研磨工具，將經垂直切斷c轴端面之石夕錢塊側面之粗 面’進行研磨加1，使表面平滑度％為8 _以下後，將石夕 鍵塊作成厚度2GG〜33〇叫之太陽電池时基板。 再者，日本特開2_·99734號公報（專利文獻3)提出-種 石夕晶圓之製造方法’其係將藉由铸造成形之石夕鍵切斷，成 ^複數個料，其次，將财塊W，作成複數個石夕晶圓 且5亥方法之特徵為包含研削步驟，其係將藉由鑄造而 ，形之錢切斷，作成複數個錢時，滅將料之 面水^削；切塊切取步驟，其係將枝以其磨平研 個矽塊。 、基口上，並從該矽錠切取複數 147938.doc 201132452, 日本特開2004-6997號公報（專利文獻4)提出一種方法， 係以帶錄’將太陽電池用矽晶圓製造用之圓柱狀矽塊，進 行角’使其成為角柱狀石夕塊後，使用滾筒型金剛石海綿 平砂輪，研磨加工側平面，其後，進行切片加工製造角狀 晶圓。 . 曰本特開2009-55039號公報（專利文獻5)提出一種方法， . 係亦以帶鋸，將圓柱狀矽塊進行倒角，使其成為角柱狀矽 後以研磨粒徑為80〜60 μηι之杯形砂輪型砂輪，將側平 面進行粗研削加工，其次，以研磨粒徑為3〜4〇 之杯形 >'輪型砂輪，將側平面進行拋光研削加工，進而於將表面 進行蝕刻處理後，進行切片加工製造角狀晶圓。 曰本專利第4133935號說明書（專利文獻6)提出一種方 法係將藉由鑄造成形之石夕錠，進行圓筒研削，使外周面 平滑後，以切片裝置等之側面剝離機，切下四側面，成為 具有4角R之大致正方形剖面之矽錠’並將其切斷成為複數 • Μ夕錠塊’進而以研磨工具’將上述四側面進行磨平研磨 加工，使其側面之平滑度心為1〇〜2〇 _，以線切割方法， - 冑該矽錠塊垂直方向切斷，從而製造大致正方形之薄矽基 板0 曰本特開2_·233794號公報（專利文獻7)提出一種方 法，係於研削/研磨石夕塊之表面時，以機械性央持（夹緊）之 7-對炎持構件(主軸台與尾架)保持矽塊之長度方向之前 後，並在該狀態下，使用粗研削砂輪與精密抛光砂輪，將 石夕塊之側面及連結該等之4個角部（4角之r角部），進行研 147938.doc 201132452 削研磨。由於藉由該方法，可在非接觸且由夾持構件懸空 的狀態下’保持矽塊之4個角部及4側面，故可防止於其側 面及角部留下傷痕，進而不僅石夕塊之側面，且角部亦可進 行研削研磨，從而進行倒角’因此可在將石夕塊進行切片加 工製造石夕晶圓時’避免其周緣部缺損等，從而可提高良品 〇 由基板加工製造商指出隨著角柱狀矽錠之一邊之長度從 50 mm增長為 125 mm、156 mm、200 mm、240 mm，以線 切割錄同時切片一邊為156 mm至240 mm之角柱狀石夕錠， 大量生產厚度200〜330 μιη之太陽電池用矽基板時，如上所 述，通常有在角柱狀矽錠之R角落部分，產生碎屑的情 況，矽基板之生產損耗率增高。如上述專利文獻3、專利 文獻6所示，以研磨工具，將側面進行平坦研磨加工後， 進打線切割之因應方法，或日本特開2〇〇2 252188號公報 (專利文獻8)所示，以研磨刷研磨加工之方法、或以蝕刻處 理方法，可防止上述切斷為晶圓時產生碎屑現象。 實際情況是目前，一邊為156 mm，高度為25〇 mm，且 於四角殘留R角部而切斷之角柱狀單晶矽錠之倒角加工需 要大約95〜120分鐘，而一邊為156 mm、高度為5〇〇 mm , 且於四角殘留R角部而㈣之角柱狀單晶核之倒角加工 需要大約180〜210分鐘。該加工時間可追加矽錠從粗研削 裝置至拋光研削裝置之交接時間大約1 〇分鐘。 另-方S，日本特公昭49·164〇〇號公報（專利文獻9)、日 本特開平4-322965號公報（專#文獻1〇)、曰本特開平卜 147938.doc 201132452 166600號公報（專利文獻1丨）及日本特開平6-246630號公報 (專利文獻12)提出倒角加工半導體基板用矽基板製造用之 圓柱狀石夕錠之表面的橫形之圓筒研削裝置。 "玄等專利文獻9至專利文獻12所揭示之橫形之圓筒研削 裝置包3 .包含一對經由減速裝置，藉由伺服馬達使中心 軸旋轉之主軸台，與可於左右方向移動之尾架的夾緊機 構；以使®板狀平砂輪之圓形平面㈣藉由該线機構之 主軸台中心與尾架中心’於水平(橫)方向且可旋轉地支 撐圓柱狀矽錠之軸心之圓柱狀錠之圓周上面部的方式，使 以砂輪軸為㈣之研肖㈣降之升降機構；及使上述研削 頭相對於圓柱㈣之上述軸心平行地左右直線移動之移動201132452 VI. Description of the Invention: [Technical Field of the Invention] Corner-shaped polycrystalline silicon of a raw material of a substrate of a battery (solar photovoltaic panel) The present invention relates to a square or rectangular substrate ingot or single crystal which can be used as the sun. The side or circumference of the ingot is a compound chamfering device for chamfering. For the wire cutting method, the money piece is sliced into a thickness of 200 to 24 G (four)' while the substrate of the plurality of solar cells is obtained, and the C-axis end face is chamfered to cut the surface of the cylindrical ingot to make the ingot in a short time. When the block is cut, there is no broken column or cracked columnar or cylindrical stone block. [Prior Art] In the step of manufacturing a tantalum substrate for a solar cell, a circular cross section of a cylindrical single crystal ingot is cut by a band saw, and a circular arc (r angle 4) remains at the four corners. As a columnar bismuth ingot (workpiece), secondly, it is supported by a clamping device including a headstock and a tailstock of a horizontal cylindrical grinding device, and the surface of the four sides is made to have a desired thickness by a cup-shaped grinding wheel type. ～1〇mm) is chamfered, and a person is sliced to produce a square-shaped ruthenium substrate having a thickness of 2 〇〇 to 3 3 0 μη (see, for example, Non-Patent Document 1). In addition, as a prismatic ingot ingot, the end face which is in contact with the inner surface of the container is contaminated by a metal slab (\) solution which is to be solidified in a prismatic graphite container/main/in solution. The polycrystalline germanium ingot obtained by chamfering the side surface is cut into two to four ingots, or a part of the R portion remains during the period in which the production of the semiconductor substrate is stopped, and the semiconductor substrate is cut by the slicing device. The four sides of the cylindrical ingot block, and then the end faces are subjected to the corner machining of M7938.doc 201132452, after which the corner R-side chamfering of the column ingot is performed (the amount of chamfering is 7.5~8 mm) The four side planes are chamfered (the amount of chamfering is 0.5 to 1 mm) and used as a columnar single crystal ingot for solar cells. It is considered that the single-crystal ruthenium substrate has a higher light-conversion rate than the polycrystalline ruthenium substrate, but the chamfering process is difficult. For example, Japanese Laid-Open Patent Publication No. Hei 8-73297 (Patent Document No.) proposes a method of reducing vermiculite or strontium sand in an electric furnace. The obtained metal crucible melt flows into the heat-resistant cylindrical container, and is gradually cooled from the lower end to the upper end of the container, thereby serving as a cylindrical solidified ingot bar which is solidified in one direction, and will be in contact with the inner surface of the container and contaminated the end surface and the side surface. A polycrystalline antimony ingot was produced by grinding a chamfering amount of 5 mm, performing a chamfering 'and further etching with a mixed solution of hydrofluoric acid and nitric acid. U.S. Patent No. 6,679,759 (Patent Document 2) proposes a method of grinding and adding 1 to the rough surface of the side surface of the Shi Xi Qian block which is vertically cut off the c-axis end face by an abrasive tool, so that the surface smoothness % is 8 _ After the following, the stone stalk block is made into a substrate with a thickness of 2GG~33 screaming solar cells. In addition, Japanese Laid-Open Patent Publication No. Hei No. 2-99734 (Patent Document 3) proposes a method for producing a Shih-ray wafer, which is cut by a stone-shaped bond of a cast molding to form a plurality of materials, and secondly, The block W, which is made into a plurality of Shixi wafers, and the 5 hai method is characterized in that it includes a grinding step, which is cut by the casting, and the money is cut off, and when the plurality of money is made, the surface of the material is cut off. The dicing cutting step is to grind the slab with the slab. In the base port, a plurality of 147938.doc 201132452 is cut out from the bismuth ingot, and Japanese Patent Laid-Open Publication No. 2004-6997 (Patent Document 4) proposes a method of recording a cylindrical shape for manufacturing a solar cell for a wafer. After the slab was subjected to the angle 'to make it a prismatic slab, the drum-shaped diamond sponge flat grinding wheel was used to grind the side surface, and then the dicing wafer was fabricated by slicing. Japanese Laid-Open Patent Publication No. 2009-55039 (Patent Document 5) proposes a method in which a cylindrical saw is chamfered by a band saw to form a prismatic crucible and then ground to a particle size of 80 to 60. The cup-shaped grinding wheel of μηι is used for rough grinding of the side plane, and secondly, the grinding of the side plane is carried out by grinding the cup-shaped grinding wheel with a particle size of 3 to 4 &, and then the surface is subjected to polishing. After the etching process, the wafer is sliced to produce an angular wafer. Japanese Patent No. 4,133,935 (Patent Document 6) proposes a method in which a cylindrical casting is performed by casting, a cylindrical grinding is performed, and the outer peripheral surface is smoothed, and a side stripping machine such as a slicing device is used to cut the four sides.矽 矽 ' 具有 具有 具有 具有 具有 具有 ' ' ' ' ' ' 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 大致 ' 大致 大致 大致 大致 大致 大致 ' ' ' ' 1〇~2〇_, by a wire cutting method, - 胄 the 矽 ingot is cut in the vertical direction to produce a substantially square thin 矽 substrate 0 曰 特 2 2 _ _ _ 2 2 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利 专利When the surface of the stone block is ground/grinded, the mechanically held (clamped) 7-to-inflame holding member (the spindle head and the tailstock) is held in the longitudinal direction of the block, and in this state, Using a rough grinding wheel and a precision polishing wheel, the side of the stone block and the four corners (the corners of the four corners) of the stone block are ground and ground 147938.doc 201132452. By this method, the four corners and the four side faces of the block can be held in a state of being non-contacted and suspended by the holding member, so that it is possible to prevent the scar on the side and the corner of the block, and thus not only the stone block The side surface can be chamfered by grinding and grinding at the corners. Therefore, it is possible to avoid the defects of the peripheral portion when the Si Xi block is sliced and manufactured to make the stone wafer, thereby improving the quality and manufacturing of the substrate. It is pointed out that as the length of one side of the columnar bismuth ingot increases from 50 mm to 125 mm, 156 mm, 200 mm, 240 mm, the line is cut and the side of the column is 156 mm to 240 mm. When a tantalum substrate for a solar cell having a thickness of 200 to 330 μm is produced, as described above, in the R corner portion of the prismatic ingot, cracks are generated, and the production loss rate of the tantalum substrate is increased. As shown in the above-mentioned Patent Document 3 and Patent Document 6, a method of performing a flat grinding process on a side surface by a polishing tool, and a method of performing a wire-cutting process, as shown in Japanese Laid-Open Patent Publication No. Hei. No. 2 252 188 (Patent Document 8) The method of polishing by a polishing brush or the etching treatment method can prevent the occurrence of chipping when the wafer is cut into a wafer. The actual situation is that the chamfering process of a cylindrical single crystal bismuth ingot with a side of 156 mm and a height of 25 〇mm and a residual R corner at the four corners takes about 95 to 120 minutes, and one side is 156 mm. The height is 5 〇〇mm, and the R corner is left at the four corners, and the chamfering of the cylindrical single crystal core at the corner of (4) takes about 180 to 210 minutes. This processing time can be added to the transfer time of the bismuth ingot from the rough grinding device to the polishing and grinding device for about 1 minute. --S, Japanese Patent Publication No. Sho 49.164 (Patent Document 9), Japanese Patent Laid-Open No. 4-322965 (Specialized Document No. 1), and 曰本特开平卜 147938.doc 201132452 166600 ( Japanese Laid-Open Patent Publication No. Hei 6-246630 (Patent Document 12) proposes a horizontal cylindrical grinding device for chamfering the surface of a cylindrical slab for the manufacture of a ruthenium substrate for a semiconductor substrate. A horizontal cylindrical grinding device package 3 disclosed in Patent Document No. 9 to Patent Document 12 includes a pair of spindle tables that are rotated by a servo motor by a servo motor, and are movable in the left and right direction. The clamping mechanism of the tailstock; so that the circular plane of the plate-shaped flat grinding wheel (four) rotatably supports the axis of the cylindrical cymbal in the horizontal (horizontal) direction by the center of the spindle table of the wire mechanism and the center of the tailstock a method of arranging the upper surface of the cylindrical ingot of the heart such that the grinding wheel shaft is a lifting mechanism of the fourth (four) descending movement; and moving the grinding head linearly to the left and right in parallel with respect to the axial center of the cylinder (four)
到達至圓柱狀錠之右端位置後， 降切入量之高度量，並藉由 左向移動，而圓板狀平砂輪 ’藉由升降機構’使圓板狀 I47938.doc 201132452 平/輪下降切入量之高度量，並藉由線性移動機構使圓 狀平/輪之移動方向反轉至左方向，其次，圓板狀平砂 達至圓桎狀錠之左端位置後，以下同樣地，重複圓板 狀平砂輪之下$、反轉、倒角、下降、反轉、倒角，並進 行’月望之厚度（1G μϊη〜5 之倒角加工。 本申μ案申請人在日本專利申請案2〇〇9_2966〇2號說明 (專利文獻13)中，提出有將工件裝載機，附屬於可以短 時間製k線切割時不產生碎屑之角柱狀矽錠塊（角柱狀矽 鍵塊）之具有工件裝載/卸載台、工件之側面粗研削台、工 件之側面拋光研削台及工件四角R拋光研削台之倒角加工 裝置的複合式倒角加工裝置（參照圖3)。 本申晴案申請人在日本專利申請案2〇1〇_1734號說明書 (專利文獻14)中，又提出一種上述複合式倒角加工裝置之 工件之側面粗研削台或工件之側面拋光研削台，其可將圓 柱狀矽錠進行圓筒研削加工，或可進行角柱狀錠塊之四角 R圓弧研削加工。 [專利文獻1]曰本特開平8-73297號公報 [專利文獻2]美國公開專利2〇〇8/〇22335 1Α1說明書 [專利文獻3]日本特開2009-99734號公報 [專利文獻4]日本特開2〇〇4_6997號公報 [專利文獻5]日本特開2〇〇9_55〇39號公報 [專利文獻6]日本專利第4133935號說明書 [專利文獻7]曰本特開2009_233794號公報 [專利文獻8]曰本特開2〇〇2_252188號公報 147938.doc 201132452 [專利文獻9]日本特公昭49_164〇〇號公報 [專利文獻10]曰本特開平4-322965號公報 [專利文獻11]曰本特開平6_166600號公報 [專利文獻12]日本特開平6_24663〇號公報 [專利文獻13]日本專利第2〇〇9_2996〇2號說明書（非公開） [專利文獻I4]曰本專利第2〇 1〇_〇〇 1734號說明書（非公開） [非專利文獻1]曰本株式會社JCM，「太陽電池製造裝置 單晶體全自動線路」[線上式]平成21年3月9日檢索’網 際、，周路 <URL.http://www.e-jcm.co.jp/SolarCell/Mono/Auto/> 【發明内容】 [發明所欲解決之問題] 本發明之第一目的在於提供一種可將上述專利文獻13記 載之複合式倒角裝置之四側面粗研削台，變更為角柱狀錠 鬼之四角R研削加工的角柱狀塊之四側面平坦化加工及四 角R研削加工之複合式倒角加工裝置。 本發明之第二目的在於提供-種可於上述複合式倒角加 工裝置之左端側，附層切片裝置，且進行圓柱狀塊之四側 之面到離加I、與進行該面剝離加卫所形成之角柱狀塊 之四側面平坦化加工及四角R研削加工的複合式倒角加工 裝置X使將上述專利文獻13記載之複合式倒角加工I置 2塊之工件裝载/㈣台所承載之卫件之夾緊機構（主轴 口二尾架则於塊之面剝離加工台之夾緊機構。 [解決問題之技術手段] 本發明 之技術方案1係提供一 種錠塊之複合式倒角 加工 147938.doc 201132452 裝置’其特徵為設置有： a) 以可在機框上設置於左右方向之導軌上向 向往復移動的方式而加以設置之工件台； b) 包含於該工件台上左右分離搭載之— 架的夾緊機構； Ά 0使裝載有於上述夾緊機構所支撐之工件之上述工件 台於左右方向往復移動之驅動機構； 且從左側方 d)從正面側直角觀察上述工件台之方向 向朝向右側方向； e) 以使一對可前後移動之砂輪軸為軸承之—對杯形砂 輪型砂輪或環狀砂輪其砂輪面相對向方式，夾住工件台且 设置於工件台前後之第一研削台； f) 以使平行地設置於上述第一研削台之右橫側之可前 後移動之一對砂輪軸為軸承的一對杯形砂輪型砂輪或環狀 砂輪其砂輪面相對向的方式，夾住工件台且設置於工件台 前後之第二研削台； g) 在位於上述第二研削台之右橫側且上述工件台之前 側之外殼材’具備可使工件朝上述夾緊機構移出/入之開 口部的載入埠；及 h) 使在對向於上述載入埠之上述工件台之後側，具有 妙輪車之砂輪軸平行於工件台之左右方向，且使該砂輪軸 其轴心可於前後方向移動地設置於工具台上之R角部拋光 研削台。 (再者’上述第一研削台與上述第二研削台中任意一者 147938.doc 201132452. 係用於四角R研削加工，而另一者用於工件之側面研削加 工者）。 本發明之技術方案2記載之錠塊之複合式倒角加工裝 置’其特徵為記載於本發明.之技廣方案丨之矽錠之倒角加 工裝置中’上述第一研削台所使用之砂輪係用於工件之四 角R研削加工之粗研削砂輪’且該一對粗研削砂輪之杯形 砂輪直徑或環形砂輪直徑不同，其中一者之直徑較另一者 之直徑短5〜20 mm。 本發明之技術方案3之錠塊之複合式倒角加工裝置，係 錠塊之複合式倒角加工裝置，其特徵為於上述技術方案2 δ己載之鍵塊之複合式倒角加工裝置之左端面，延長設置上 述工件台之左右移動導執..，且設有將搭載；件台之夾緊機 構之主軸台與尾架之工件支撐軸（(：軸）夾住使一對旋轉刀 片（切片刀片）其旋轉刀片直徑面相對向的方式夾住工件台 之設置於工件台前後之側面剝離加工台。 [發明效果] 使用本發明之錠塊之複合式倒角加工裝置，可在將〇軸 端面經切斷之圓柱狀錠塊，支撐於夾緊機構的狀態下，藉 切片刀片之旋轉，進行四側面剝離加工後，使用一對第一 研削砂輪，進行錠塊之四角R粗研削加工（倒角加工），接 著使用-對第二研削砂輪，進行錠塊之四側面之研削加工 (倒角加工)後’最後以砂輪車，進行錠塊之四角r拋光研 削加工（倒角加工）。 本發明之錠塊之複合式倒角加卫|置係可使將角柱狀石夕 147938.doc -11 · 201132452 錠懸空之夾緊機構一面於左右方向往復移動，且—面使主 軸台之夾緊軸旋轉360度’ II由圓筒狀砂輪車，進行鍵塊 之四角R(角部)之倒角加工’且所獲得之四角尺之表面平滑 度Ry為0.05〜0·2 μηι而為光澤度極其優良者。又以第二 研削砂輪進行倒角之錠塊之四㈣面之表面+滑度心為 〇,5〜2 μΐη，相較於記載於專利文獻3之實施例記載之$ 值為特別優良之值。 由於相對於專利文獻7記載之錠塊之倒角加工裝置之尺角 部倒角2步驟、平面粗研削4步驟及平面拋光研削4步驟合 計10步驟，本發明之倒角加工裝置可利用第一研削砂輪之 四角R面之粗研削加工丨步驟、利用第二研削砂輪之側面倒 角加工2步驟（2次主軸台之90度旋轉）、及利用四角R面之 砂輪車之拋光研削加工1步驟合計5步驟，進行倒角作業， 因此倒角加工時間大約減少一半。可以大約45分鐘產能加 工時間’生產一邊為156 mm、高度為250 mm，且於四角 殘留R部’以帶鋸切斷之角柱狀單晶矽錠之倒角加工。 又，邊長15 6 mm、高度500 mm之角柱狀矽錠之倒角加工 之產能加工時間可以大約90分鐘進行。 【實施方式】 如圖1、圖2、圖4及圖8所示，本發明之複合式倒角加工 裝置1是以下述方式而設置有工件台4，即，該工件台4係 可於向左右方向延伸敷設在機框（基底）2之一對導轨3,3上 向左右方向往復移動《該工件台4之左右往復移動係由滾 珠螺栓6承受利用伺服馬達5之旋轉驅動而旋轉，並使螺合 147938.doc -12· 201132452 於該之滾珠螺栓之固定台（未圖示）向左方向或 進，猎此使將工件台4之背面固定於 表°剛 ..., 口又σ录面之工杜 :向左方向或右方向前進。工件台4之左方向或右方向 剛進係依存於伺服馬達5之旋轉軸為順時針旋轉方向 是逆時針旋轉方向。 還 於該工件台4上，搭載有包含左右分離而搭載之—對主 軸台73與尾架7b之夾緊機構7。因此，附隨著工件台4之左 方向或右方向之㈣’該夾緊機構7亦向左方向或右方向 私動且藉由夾緊機構7之主軸台中心支撐軸％與尾架中 心支撐軸7b,支撐，呈懸空狀態之工件(角柱狀錠塊)w可朝 四角R抛光研削台9、第二研削台1〇、帛一四角錄研削台 11、或載入埠8位置移動。 如專利文獻7所記載，夾緊機構7為眾所周知之夾具機 構，且經常於圓筒研削盤中使用。主轴台7a具有以飼服馬 達73[11旋轉主軸台中心支撐軸7ai，藉此使工件w旋轉36〇度 或90度之功此^尾架几設置於藉氣缸7e驅動而可於導轨上 左右移動之移動台7bt上，且以夾緊機構7支撐工件後，藉 由；£下懸臂而固定，防止因工件台4之移動導致搭載尾架 7b之移動台7bt移動。 上述四角R拋光研削台9、第二研削台1 〇、第一研削台 11、及載入埠8之位置關係’從正面側直角地觀察上述工 件4之方向，且從左側方向朝右側方向，設置面剝離加工 台90、第一四角R粗研削台丨J、第二研削台1〇、載入埠8， 且於該載入琿8之背面，設置四角r拋光研削台9。面剝離 147938.doc 201132452 加工台90、四角R拋光研削台9、第一研削台u及第二研削 台10係以密閉外罩12覆蓋（參照圖1、圖3)。又，載入埠8係 藉由單手橫拉滑門12a關閉。在以密閉外罩12覆蓋之各研 削台9、10、11之空間，連接排氣管道13，將浮游於該空 間内之煙霧或研削屑向外部排出。 第二研削台1〇之構造為以使以設置於藉由伺服馬達 l〇m、l〇m之旋轉驅動而可前後移動之工具台1〇〖、丨…上之 一對砂輪軸10a、l〇a為軸承之一對杯形砂輪型砂輪或環狀 砂輪i〇g、i〇g’以其研削砂輪面10gs、1〇匕相對向的方 式’夾住工件台4,並設置於對稱於工件台4前後且砂輪軸 心ίο。、ίο。為相同線上之位置’且該等砂輪軸i〇a、心係 藉由伺服馬達10M、1 0M之旋轉驅動而旋轉。 由滾珠螺栓承受利W服馬達1Qm、1Qm之旋轉驅動並 旋轉，螺合於該滾珠螺栓之固定台向前方向或後方向前進 或後退，藉此’使工具台1〇t、⑽之背面固定於該固定台 表面之工具台1〇t、10t進行前進移動或後退移動。該工具 台之前進或後退之移動方向係依存於伺服馬達咖、心 之旋轉軸為順時針旋轉方向、還是逆時針旋轉方向。 第研削口 11之構造為以使以設置於藉由飼服馬達 Um、Um之旋轉驅動而可前後移動之卫具台lit、llt上之 -對砂輪軸Ua、lla為軸承之一對杯形砂輪型砂輪或環狀 砂輪iig、以’以其研削砂輪面Ugs、％相對向的方 式並設置於對稱於卫件台4前後且砂輪轴 心U。、11〇為相同線上之位置，且該等砂輪轴up &係 147938.doc 201132452 « 藉由伺服馬達11M、11m之旋轉驅動而旋轉。 滾珠螺检承受利用伺服馬達1 lm、1 lm之旋轉驅動並旋 轉’螺合於該滾珠螺栓之固定台向前方向或後方向前進或 後退’藉此，使工具台1 It、1 It之背面固定於該固定台表 面之工具台111、111前進或後退。該工具台之前進或後退 • 之移動方向係依存於伺服馬達11 m、11 m之旋轉轴為順時 針旋轉方向、還是逆時針旋轉方向。 第一研削台11係設置成平行於上述第二研削台1〇之右橫 側。即’兩研削台10、u之砂輪轴心1〇。、u。係設置為呈 平行。 再者’在上述第二研削台10中使用之砂輪及在上述第一 研削台11中使用之砂輪左右砂輪之砂輪盤可相同亦可不 同。 以製造一邊為150 mm之正方形狀之太陽電池用矽基板 為目的時，研削砂輪10g、10g 、llg、 llg之杯形砂輪直 仏或環狀砂輪直徑為240~260 ,從防止矽錠之研磨燒 著之觀點，杯形砂輪片之寬度較佳為3〜10 mm，環狀砂輪 • 寬度較佳為5〜15 mm。砂輪之中心點至砂輪寬外周之距離 (半從）較好為1個或2個第一研削砂輪與2個第二研削砂輪為 相同半徑，但一對第一研削砂輪1〇§、1〇g之杯形砂輪直徑 或環狀砂輪直徑為其中一者之直徑較另一者之直徑短5〜20 mm ° 研削砂輪l〇g、1 lg之研磨粒較佳為金剛石研磨粒、CBN 研磨粒，結合劑（bond)可為金屬結合劑、陶瓷結合劑、環 147938.doc •15- 201132452 氧樹脂結合劑。例如，杯形砂輪型研削砂輪1〇g、llg較佳 為m曰本特開平9_38866號公報、曰本特開2秦_94342號 公報或'本特開2004_167617號公報等所揭示之在有底筒 、尘wu之下°卩J衣狀輪，以逸散有研削液之間隙間隔， 環㈣己置有複數個砂輪刀片之杯形砂輪型砂輪’且為供給 至型蕊内側之研削液會從上述間隙逸散的構造者。該杯形 砂輪型砂輪llg之環狀砂輪刀片之直徑較佳為角柱狀石夕鍵 之邊長度的1.2〜1.5倍之直徑。上述杯形砂輪型第一粗研 削砂輪1 lg之環狀砂輪刀片較佳為磨料號⑽〜號之樹脂 、。口 Μ金剛石石> 輪、或陶瓷結合劑金剛石砂輪。又，杯形 砂輪型第二研削砂輪1〇g之環狀砂輪刀片較佳為磨料號 300〜1,200號之樹脂結合劑金剛石砂輪、陶瓷結合劑金剛 石石少輪、或金屬結合劑金剛石砂輪。χ，作為後述之砂輪 車9g，較佳為磨料號號之金剛石砂輪車。 " 作為研削液係純水、膠體二氧切水分散液、氧化飾水 分散液、SC-1液、SC_2液、或併用純水與該等上述之水分 散液或研削液。再者，作為研削液，從考慮環境之水處= 之方面，較佳為僅利用純水。 載入埠8係在第二研削台1〇之右橫側之位於工件台*之前 側之外殼材，設置可使工件〜朝上述夾緊機構移出/入之開 口部’籍此而形成。 四角R拋光研削加工台9採用之構造為使對向於上述載入 琿8之上述工件台4之後侧，具有砂輪車〜之砂輪㈣平行 於工件台4之左右方向，且將該砂輪軸9a之軸心9。設置於 147938.doc .16 · 201132452 可於前後方向移動之工具台9t上。 從圖1、圖4及圖7,可瞭解 飼服馬料之旋轉驅動而進行，丄:％轉驅動係藉由 it ^ ^ ^ < 具13 91之前進後退係由 滾珠·Μ利用伺服馬達 合於該滾珠螺栓之固定台向前方^15動心轉，並使螺 Μ..^ °白則方向或後方向前進或後退， 藉此而使工具台9t背After reaching the right end position of the cylindrical ingot, the height of the cutting amount is lowered and moved by the left direction, and the circular plate-shaped flat grinding wheel 'by the lifting mechanism' causes the circular plate shape I47938.doc 201132452 flat/round drop amount The height is increased by the linear movement mechanism to reverse the direction of movement of the circular flat/wheel to the left direction. Secondly, after the disc-shaped flat sand reaches the left end position of the round-shaped ingot, the circular plate shape is repeated as follows. Under the flat grinding wheel, $, reverse, chamfer, descend, reverse, chamfer, and carry out the thickness of the moon (the chamfering of 1G μϊη~5. The applicant of this application is in Japanese patent application 2〇 In the description of 〇9_2966〇2 (Patent Document 13), there is proposed a workpiece loader attached to a workpiece having a corner columnar ingot block (corner-shaped 矽 key block) which does not generate debris when k-line cutting is performed in a short time. Loading/unloading table, rough grinding table on the side of the workpiece, side polishing table for the workpiece, and compound chamfering device for the chamfering device of the workpiece R angle polishing table (refer to Figure 3). Japanese Patent Application 2〇1〇_1734 In the specification (Patent Document 14), there is also proposed a side rough grinding table for a workpiece of the above-described composite chamfering device or a side polishing polishing table for a workpiece, which can perform cylindrical grinding of a cylindrical ingot, or can perform a corner column In the case of the four-corner R-arc grinding process of the ingot block, JP-A-H08-73297 [Patent Document 2] US Patent Publication No. 2〇〇8/〇22335 1Α1 specification [Patent Document 3] [Patent Document 5] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. 4, No. Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Patent Document 11] Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 6-24663 No. [Patent Document 13] Japanese Patent No. 2-9-9996 No. 2 (non-public) Document I4] 曰本专利第2〇1〇_〇〇1734号 (Non-public) [Non-patent Document 1] JCM, "Solar cell manufacturing equipment, single crystal automatic line" [online type] Searched for the Internet on March 9, 2011 , ZHOU Lu <URL.http://www.e-jcm.co.jp/SolarCell/Mono/Auto/> [Summary of the Invention] [Problems to be Solved by the Invention] A first object of the present invention is to provide The four-side rough grinding table of the composite chamfering device described in the above-mentioned Patent Document 13 can be changed into a four-side flattening process and a four-corner R-grinding process of a corner-column block of a four-corner R-corner of a corner-column ingot. Chamfer processing unit. A second object of the present invention is to provide a layering device which can be applied to the left end side of the above-mentioned composite chamfering apparatus, and to perform the surface of the four sides of the cylindrical block to and from the surface. The composite chamfering apparatus X of the four-side flattening processing and the four-corner R-grinding of the formed angular column block is carried by the workpiece loading/(four) of the composite chamfering processing I described in Patent Document 13 The clamping mechanism of the fastener (the spindle tailstock is used to peel the clamping mechanism of the processing table on the surface of the block. [Technical means for solving the problem] The technical solution 1 of the present invention provides a composite chamfering processing of the ingot 147938.doc 201132452 The device 'is characterized by: a) a workpiece table that can be set to reciprocate on a guide rail that is disposed on the frame in the left and right direction; b) is included on the workpiece table and is separated left and right a clamping mechanism for mounting the frame; Ά 0 a driving mechanism for reciprocating the workpiece table loaded with the workpiece supported by the clamping mechanism in the left-right direction; and viewing from the left side d) from the front side The direction of the workpiece table is oriented toward the right side; e) so that a pair of grinding wheel shafts that can move back and forth are bearings--for the cup-shaped grinding wheel type or the ring-shaped grinding wheel, the grinding wheel surface is opposed to each other, and the workpiece table is clamped and disposed on a first grinding table before and after the workpiece table; f) a pair of cup-shaped grinding wheel or ring grinding wheel which is arranged in parallel on the right lateral side of the first grinding table and which can be moved forward and backward a grinding wheel surface facing the second grinding table which is clamped to the workpiece table and disposed on the front and rear of the workpiece table; g) the outer casing on the right lateral side of the second grinding table and on the front side of the workpiece table Loading 埠 of the opening portion that is moved out/into the clamping mechanism; and h) so that the grinding wheel axis of the wheelbarrow is parallel to the left and right direction of the workpiece table on the rear side of the workpiece table opposite to the loading magazine Moreover, the grinding wheel shaft is arranged on the R-corner polishing and grinding table on the tool table so that its axis can be moved in the front-rear direction. (Further, 'any of the above-mentioned first grinding table and the second grinding table 147938.doc 201132452. is used for the four-corner R grinding process, and the other is used for the side grinding machine of the workpiece). A composite chamfering apparatus for an ingot according to the second aspect of the present invention is characterized in that the grinding wheel system used in the first grinding table is described in the chamfering processing apparatus of the ingot of the present invention. The rough grinding wheel for the four-corner R grinding of the workpiece' and the diameter of the cup-shaped grinding wheel or the diameter of the ring-shaped grinding wheel of the pair of coarse grinding wheels are different, and one of the diameters is 5 to 20 mm shorter than the diameter of the other. The composite chamfering apparatus for the ingot of the third aspect of the present invention is a composite chamfering apparatus for an ingot, which is characterized by the composite chamfering apparatus of the above-mentioned technical scheme 2 The left end surface is provided with the left and right movement guides of the workpiece table extended, and the workpiece support shaft ((: shaft) of the spindle table of the clamping mechanism of the workpiece table and the tailstock is clamped to make a pair of rotating blades (Slicing blade) The side peeling processing table provided on the front and rear of the workpiece stage of the workpiece stage is sandwiched by the rotating blade diameter surface. [Effect of the Invention] The composite chamfering apparatus using the ingot of the present invention can be used The cylindrical ingot whose end face of the boring shaft is supported by the clamping mechanism is subjected to the four-side peeling process by the rotation of the dicing blade, and then the pair of first grinding wheels are used to perform the rough grinding of the four corners of the ingot. Machining (chamfering), then using - for the second grinding wheel, grinding the four sides of the ingot (chamfering), and finally grinding the four corners of the ingot with a grinding wheel (chamfering) The composite chamfering and erecting of the ingot of the present invention can reciprocate the clamping mechanism of the angular column-shaped Shi Xi 147938.doc -11 · 201132452 ingot in the left and right direction, and the surface makes the spindle The clamping axis of the table is rotated 360 degrees. II. The cylindrical grinding wheel is used to perform the chamfering process of the four corners R (corner) of the key block, and the surface smoothness Ry of the obtained four-square ruler is 0.05~0·2 μηι In addition, the glossiness is extremely excellent. The surface of the four (four) faces of the ingot which is chamfered by the second grinding wheel is + 滑, which is 5 to 2 μΐ, which is described in the embodiment described in Patent Document 3. The value of the value is particularly excellent. The present invention is based on the step of the chamfering step 2 of the chamfering processing apparatus of the ingot of the patent document 7, the step of the planar rough grinding 4 and the step of the planar polishing grinding 4 step 10 The chamfering processing device can use the rough grinding processing step of the R-face of the first grinding wheel, the two-step chamfering process of the second grinding wheel (the 90-degree rotation of the spindle head twice), and the use of the four-corner R-face. Polishing and grinding of the wheeled wheeler 1 step total 5 steps Chamfering work, so the chamfering processing time is reduced by about half. It can be processed in about 45 minutes. The production side is 156 mm, the height is 250 mm, and the R part at the four corners is cut by the band saw. Chamfering of the crystal ingots. The processing time of the chamfering of the columnar crucible with a side length of 15 6 mm and a height of 500 mm can be carried out for about 90 minutes. [Embodiment] Figure 1, Figure 2, Figure 4 and FIG. 8, the composite chamfering apparatus 1 of the present invention is provided with a workpiece stage 4 in such a manner that the workpiece stage 4 can be attached to the frame (base) 2 in the left-right direction. The pair of guide rails 3, 3 reciprocate in the left-right direction. "The left and right reciprocating movement of the workpiece table 4 is rotated by the ball screw 6 by the rotation of the servo motor 5, and the screw is 147938.doc -12· 201132452 The fixing table (not shown) of the ball screw is moved in the left direction, and the hunting is performed to fix the back surface of the workpiece table 4 to the table just... The mouth and the σ recording surface are: left or right Go ahead. The left or right direction of the workpiece stage 4 depends on the rotation axis of the servo motor 5 in the clockwise direction of rotation. Further, on the workpiece stage 4, a clamping mechanism 7 for the main shaft stage 73 and the tailstock 7b which are mounted on the right and left sides is mounted. Therefore, the (4) of the left or right direction of the workpiece table 4 is attached. The clamping mechanism 7 is also moved to the left or right direction and supports the shaft center and the tailstock center support by the spindle table center of the clamping mechanism 7. The shaft 7b, supported, and suspended workpieces (corner ingots) w can be moved toward the four corners R polishing table 9, the second grinding table 1 帛, the 帛 four corner recording table 11, or the loading 埠 8 position. As described in Patent Document 7, the clamp mechanism 7 is a well-known jig mechanism and is often used in a cylindrical grinding disc. The spindle table 7a has a feeding motor 73 [11 rotating the spindle table center supporting shaft 7ai, thereby rotating the workpiece w by 36 degrees or 90 degrees. The tail frame is disposed on the guide rail by the cylinder 7e. After the workpiece is supported by the clamping mechanism 7 on the moving table 7bt that moves left and right, it is fixed by the cantilever, and the movement of the moving table 7bt on which the tailstock 7b is mounted is prevented from moving due to the movement of the workpiece table 4. The positional relationship of the four-corner R-polishing grinding table 9, the second grinding table 1 〇, the first grinding table 11, and the loading cassette 8 is viewed from the front side at right angles to the direction of the workpiece 4, and from the left side to the right side. A surface peeling processing table 90, a first four-corner R-grinding table 丨J, a second grinding table 1〇, and a loading 埠8 are provided, and a four-corner r-polishing grinding table 9 is provided on the back surface of the loading 珲8. Surface peeling 147938.doc 201132452 The processing table 90, the four-corner R polishing table 9, the first grinding table u, and the second grinding table 10 are covered with a sealed outer cover 12 (see Figs. 1 and 3). Further, the loading cassette 8 is closed by the one-handed horizontal sliding door 12a. The space of each of the grinding tables 9, 10, 11 covered by the hermetic cover 12 is connected to the exhaust duct 13, and the smoke or the grinding debris floating in the space is discharged to the outside. The second grinding table 1 is configured such that one of the tool stages 1 〇, 丨, ... which is disposed to be movable back and forth by the rotation of the servo motors 10 、 m, l 〇 m is the pair of grinding wheel shafts 10a, l 〇a is a bearing to the cup-shaped grinding wheel type or the ring-shaped grinding wheel i〇g, i〇g' in the manner of grinding the grinding wheel surface 10gs, 1〇匕 in the opposite direction 'clamping the workpiece table 4, and is set in symmetry The workpiece table 4 is front and rear and the grinding wheel axis is ίο. , ίο. The positions on the same line are rotated by the rotation of the servo motors 10M and 10M. The ball screw is driven by the rotation of the motor 1Qm and 1Qm, and is rotated and screwed to the fixed or forward direction of the ball screw to advance or retreat, thereby fixing the back of the tool table 1〇t, (10). The tool stages 1〇t, 10t on the surface of the fixed table are moved forward or backward. The direction of movement of the tool table before or after retracting depends on whether the servo motor or the axis of rotation of the heart rotates clockwise or counterclockwise. The first grinding port 11 is configured such that the pair of grinding wheel shafts Ua and 11a which are disposed on the centerpieces lit, llt which are movable forward and backward by the rotation of the feeding motors Um and Um are one of the bearings The grinding wheel type or the ring grinding wheel iig is arranged to be symmetric with respect to the guard table 4 and the grinding wheel axis U in a manner of "grinding the grinding wheel surface Ugs and %." 11〇 is the position on the same line, and the grinding wheel shaft up & 147938.doc 201132452 « is rotated by the rotation of the servo motors 11M, 11m. The ball screw is driven by the rotation of the servo motor 1 lm, 1 lm and rotates the 'fixed table screwed to the ball screw forward or backward in the forward direction or the backward direction', thereby making the back of the tool table 1 It, 1 It The tool tables 111, 111 fixed to the surface of the fixing table advance or retreat. The tool table moves forward or backward. • The direction of movement depends on whether the rotary axes of the servo motors 11 m and 11 m are in the clockwise direction or the counterclockwise direction. The first grinding table 11 is disposed parallel to the right lateral side of the second grinding table 1〇. That is, the two grinding tables 10 and the grinding wheel shaft of the u are 1 inch. u. The system is set to be parallel. Further, the grinding wheel used in the second grinding table 10 and the grinding wheel of the left and right grinding wheel used in the first grinding table 11 may be the same or different. For the purpose of manufacturing a square substrate for a solar cell having a side of 150 mm on one side, the diameter of the cup-shaped grinding wheel or the ring-shaped grinding wheel of the grinding wheel 10g, 10g, llg, llg is 240 to 260, and the grinding of the antimony ingot is prevented. From the viewpoint of burning, the width of the cup-shaped grinding wheel is preferably 3 to 10 mm, and the ring-shaped grinding wheel has a width of preferably 5 to 15 mm. The distance from the center point of the grinding wheel to the outer circumference of the grinding wheel width (semi-slave) is preferably one or two first grinding wheels and two second grinding wheels having the same radius, but a pair of first grinding wheels 1〇, 1〇 The diameter of the cup-shaped grinding wheel or the diameter of the ring-shaped grinding wheel is 5 to 20 mm shorter than the diameter of the other one. The grinding wheel of the grinding wheel l〇g, 1 lg is preferably diamond abrasive grain, CBN abrasive grain. The bond may be a metal bond, a ceramic bond, a ring 147938.doc • 15-201132452 oxyresin bond. For example, the cup-shaped grinding wheel type grinding wheel 1 〇 g, llg is preferably m 曰 特 开 9 9 _ _ _ _ _ _ _ _ _ _ _ _ 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 943 Under the cylinder, dust wu ° 衣 J clothing wheel, to escape the gap between the grinding fluid gap, the ring (four) has a plurality of grinding wheel blade cup-shaped grinding wheel type 'and the grinding fluid supplied to the inside of the core The constructor that escapes from the above gap. The diameter of the ring-shaped grinding wheel blade of the cup-shaped grinding wheel type llg is preferably 1.2 to 1.5 times the length of the side of the corner-shaped stone-shaped key. The ring-shaped grinding wheel of the cup-shaped grinding wheel type first rough grinding wheel 1 lg is preferably a resin of the abrasive number (10)~. Oral diamond stone> Wheel, or ceramic bond diamond wheel. Further, the ring-shaped grinding wheel blade of the cup-shaped grinding wheel type second grinding wheel 1 〇g is preferably a resin-bonded diamond grinding wheel of 300 to 1,200, a ceramic bond diamond stone wheel, or a metal bond diamond wheel. Specifically, as a grinding wheel 9g to be described later, a diamond wheeled wheel of the abrasive number is preferable. " As grinding fluid pure water, colloidal dioxygenate dispersion, oxidized water dispersion, SC-1 liquid, SC_2 liquid, or combined with pure water and the above-mentioned moisture dispersion or grinding fluid. Further, as the grinding liquid, it is preferable to use only pure water from the viewpoint of the water content of the environment. The loading 埠8 is formed on the right lateral side of the second grinding table 1〇 on the front side of the workpiece table*, and is formed by the opening portion which allows the workpiece to be moved out/into the clamping mechanism. The four-corner R polishing and polishing table 9 is configured such that the grinding wheel (the fourth) is parallel to the left and right direction of the workpiece table 4 on the rear side of the workpiece stage 4 opposite to the loading cassette 8, and the grinding wheel shaft 9a is The axis of the shaft 9. Set on 147938.doc .16 · 201132452 It can be moved on the tool table 9t in the front and rear direction. From Fig. 1, Fig. 4 and Fig. 7, it can be seen that the rotary drive of the feed horse is carried out, and the 转:% drive system is operated by it ^ ^ ^ < 13 91 before and after the retraction system is used by the ball and cymbal by the servo motor The fixed table of the ball bolt is turned to the front side of the ^15, and the thread Μ..^° white is moved forward or backward in the direction or the rear direction, thereby making the tool table 9t back
Qt μ 成面固疋於該固定台表面之工具台 9t，在導執9r、9r上前進移動戍 進或後退之移動方向… 該工具台之前 4 11，、、存於伺服馬達9m之旋轉軸為順時 針旋轉方向，還是為逆時針旋轉方向。 中’符號㈣表示研削液供給管，在圖㈠，符號 二係表示乾燥空氣（Dry Ai賴給口。該乾燥空氣用於係喷 、於經倒角加工且藉由研削液(純水)洗淨之角柱狀錠(工 。表面用以队散研削液，從而使角柱狀錠表面乾 在圖1及圖3中，符號20係表示控制裴置，符號2 j 係表示操作盤。 a如圖1、圖3、圓4、圖5及圖6所示，本發明之錠塊之複 口式倒角加工裝置1在機框2上，並設有將工件裝載/卸載 裝置13及3塊錠塊保存於在上述工件台4之前側之上述載入 埠8與上述第二研削台1〇之空間部的工件暫存盒14 ^符號 15係載置於具備有折疊梯車之搬運台車16之工作台上之預 備工件暫存盒。 工件暫存盒I4、I5可將3塊鍵塊w、vv、w傾斜45度而政 納之剖面具備倒2等邊三角形狀之V字棚段，載置於從機框 突出之定位銷16上。 147938.doc 201132452 上述工件裝載/卸載裝置13以一對爪13a、13b，夾持保 管於工件暫存盒14V字棚段之1塊錠塊，並使兩爪上升，藉 此懸吊工件’其次，後退，向右方向移動，並下降位於載 入埠8前，進而後退，藉此將工件從該載入埠8向夾緊裝置 7之主軸台7a與尾架几之間搬送。將工件之一端抵接於主 轴〇 7a之中〜支撐軸7al後，以氣缸7e，使尾架7b向右方 向移動，使另一端抵接於中心支撐軸7bl，從而將工件支 撐為45度V傾斜且四面懸空之狀態。其次，分離上述爪 13a、13b，鬆開工件之把持，其次，使支撐兩爪13&、丄扑 之固定台13f上升，向左方向移動，進而向前方向後退， 使兩爪13a、13b返回至待機位置。 又，以兩爪13a、13b，將四面支撐為懸空狀態之經倒角 加工及洗淨、風乾之工件，夾持於上述夾緊裝置7，其 次’使支樓兩爪13a、13b之固定台I3f上升，向左方向移 動，進而向前方向後退，使兩爪13&、13b移動至工件暫存 器14、15之空棚上方後下降，將工件載置於上述空棚後， 分離兩爪13a、13b並鬆開工件，之後，將兩爪13&、ub返 回至上述待機位置。 如圖4及圖7所示，支撐兩爪i3a、i3b之固定台13f之前 後方向之移動，係藉由使背面螺合於以伺服馬達丨3m而旋 轉驅動之滾珠螺栓13k之固定台nf的滑行面丨心，於設置 在立柱13c側面之導軌13g上滑行而進行。支撐兩爪Ua、 13b之固定台i3f之上下方向之移動，係藉由氣缸i3p進 行。兩爪13a、13b之分離，係使用圖7之圓内所示之 147938.doc -18· 201132452Qt μ is fixed to the tool table 9t on the surface of the fixed table, and moves forward or backward on the guides 9r and 9r. The tool axis is before the spindle 11 and the rotation axis of the servo motor 9m. Whether to rotate clockwise or counterclockwise. The middle symbol '4' indicates the grinding fluid supply pipe. In the figure (1), the symbol 2 indicates the dry air (Dry Ai feed port. The dry air is used for the spray, is chamfered, and is washed by the grinding fluid (pure water). The net angle of the column ingot (work. The surface is used to disperse the grinding liquid, so that the surface of the columnar ingot is dried in Fig. 1 and Fig. 3, the symbol 20 is the control device, and the symbol 2 j is the operation panel. 1. As shown in FIG. 3, circle 4, FIG. 5 and FIG. 6, the double-face chamfering apparatus 1 of the ingot of the present invention is on the machine frame 2, and is provided with a workpiece loading/unloading device 13 and three ingots. The block is stored in the workpiece temporary storage box 14 in the space portion of the loading cassette 8 and the second grinding table 1A on the front side of the workpiece stage 4, and the symbol 15 is placed on the transport carriage 16 having the folding ladder. The preparatory workpiece temporary storage box on the workbench. The workpiece temporary storage box I4, I5 can tilt the three key blocks w, vv, w by 45 degrees, and the cross section of the political support has a V-shaped shed section of the inverted two-sided triangular shape. The workpiece loading/unloading device 13 is held by a pair of claws 13a and 13b. In the workpiece temporary storage box 14V shed section of the ingot, and the two claws rise, thereby suspending the workpiece 'secondary, backward, moving to the right, and descending before loading 埠8, and then back, thereby The workpiece is conveyed from the loading magazine 8 to the spindle table 7a of the clamp device 7 and the tailstock. One end of the workpiece abuts against the spindle bore 7a to the support shaft 7al, and the tailstock is made with the cylinder 7e. 7b moves to the right direction, and the other end abuts against the center support shaft 7b1, thereby supporting the workpiece to a state of 45 degree V inclination and four sides hanging. Secondly, the claws 13a, 13b are separated, the holding of the workpiece is released, and secondly, The fixing table 13f supporting the two claws 13& and the slap is raised, moves to the left, and then retreats in the forward direction to return the two claws 13a, 13b to the standby position. Further, the four sides 13a, 13b support the four sides to be suspended The workpiece subjected to chamfering, washing, and air drying is clamped to the clamp device 7, and secondly, the fixed table I3f of the two claws 13a and 13b of the branch is raised, moved to the left, and then retreated in the forward direction. Moving the two jaws 13&, 13b to the workpiece registers 14, 15 After the upper shed is lowered, the workpiece is placed on the empty shed, the two claws 13a, 13b are separated and the workpiece is released, and then the two claws 13 & ub are returned to the standby position. As shown in Fig. 4 and Fig. 7 The movement of the fixed table 13f supporting the two claws i3a and i3b in the front-rear direction is performed by screwing the back surface to the sliding surface of the fixed table nf of the ball screw 13k that is rotationally driven by the servo motor 丨3m. The slide 13g on the side surface of the column 13c slides. The movement of the fixed table i3f supporting the two claws Ua and 13b in the up-down direction is performed by the cylinder i3p. The separation of the two claws 13a, 13b is as shown in the circle of Fig. 7 147938.doc -18· 201132452
Microweek氣缸I3e而使兩爪13a、13b分離。兩爪13a、13b 之略微升降之微調整係使用Microweek氣缸131進行。兩爪 13a、13b之略微前後移動之微調整係使用Microweek氣缸 13r進行。 如圖1所示’圓柱狀錠塊之四側面剝離加工台90，係將 上述工件台4之左右移動導軌延長設置於上述錠塊之複合 式倒角加工裝置之左端面’且夾住搭載於該工件台4之夾 緊機構7之主抽台7a與尾架7b之工件支撑軸（C軸）’並以使 一對旋轉刀片（切片刀片）91 a、91 b以其旋轉刀片直徑面相 對向的方式，夾住工件台4，且設置於工件台前後之側面 剝離加工台9 〇。 一對旋轉刀片（内周刀片）91 a、9 lb係以一對旋轉軸92a ' 92b為轴承’該等旋轉軸係藉由驅動馬達％^、93m旋轉， 旋轉刀片91a、91b以50〜7,500 min·丨之旋轉速度，相對於 工件於相同之時針旋轉方向旋轉（兩旋轉軸之旋轉方向為 相互相反之方向）。上述旋轉軸92a、92b在工具台94、94 别後移動，藉此可向錠塊评之面剝離加工開始位置移動。 工件台4可以5〜200 mm/分鐘之速度移動，且旋轉軸92a、 92b之升降可上下移動至1〇〇 mm為止。作為上述旋轉刀 片’係使用於直徑450〜800 mm、厚度O.iq.o 板’電沉積有金剛石微粒子之金剛石刀具。 mm之鋼板薄 使搭載將工件（圓柱狀錠塊）之C軸於水平方向支撐之夾 緊機構7之工件台4，向左方向移動，藉此卫件端面之前後 抵接於一對旋轉刀片91a、91b’並藉由該等旋轉刀片，進 147938.doc -19· 201132452 行將圓柱狀工件前面及後面圓弧狀削落之面剝離加工。若 工件前後面之面剝離加工完成，則使夾緊機構7之主軸台 7a之支撐軸旋轉90度，將未進行剝離加工之工件之圓弧面 朝向前後位置，其次，使工件台4向右方向反轉，以驅動 馬達93m、93m使上述-對旋轉刀片9U、心向相反方向 旋轉而進行面剝離加卫。四側面之面剝離加工時間在直徑 200 mm、高度250 mm之圓柱狀單晶矽錠塊中可以〗〇〜2〇分 鐘進4亍’而在直20〇ΓΪ11Τ1、古Ficrm _ 0旦>1 mm间度500 mm之圓柱狀單晶矽 錠塊中可以1 8~36分鐘進行。 使用本發明之錠塊之複合式倒角加工裝置丨，將兩端經 平面切斷之圓柱狀錠塊，進行面剝離加工及倒角加工，而 加工成於四角殘留有長度5〜3〇 mm之圓弧之角柱狀矽錠塊 以作為工件w的作業，係如下進行。 1) .使用工件裝載/卸載裝置13，將保管於工件暫存盒 14 V子棚段之1塊鍵塊（工件），向夾緊機構7搬送，其次， 以夹緊機構7之主軸台7a與尾架7b支樓工件。 2) .以1〜15 mm/分鐘之速度，使搭載將錠塊懸空支撐之 夾緊機構7之工件台，向左方向移動，將工件之端面之前 後抵接於一對旋轉刀片91a、91b，並藉由該等旋轉刀片， 進行將圓柱狀工件前面及後面削落成圓弧狀半月之面剝離 加工。 3) .若工件前後面之面剝離加工完成，則使失緊機構7 之主軸用7a之支撐軸旋轉90度，將未面剝離加工之工件之 圓弧面朝向前後位置，其次，使工件台4向右方向反轉， 147938.doc •20- 201132452 以驅動馬達93m、93m，使上述一對旋轉刀片…、川向 相反方向旋轉’從而進行面剝離加工。例如，直徑2〇〇 之圓柱狀鍵塊係以使其成為一邊之長度為大約155 mm之正 方形剖面的方式，削落圓弧部。 4) ，一面使搭載將面剝離加工成四角柱狀之錠塊懸空支 撐之夾緊機構7之工件台4，以丨〜15 mm/分鐘之速度向右方 向移動，一面以主軸台7a旋轉工件。另一方面，一面使一 對第一粗研削砂輪Ug、UgU1〇〇〜3〇〇 rpm之旋轉速度同 期控制旋轉’一面對作業點供給研削液20~1，000 cc/分鐘 之置’一面對上述工件之前後面，進行上述四角柱狀錠塊 之四角R粗研削加工，從而完成2〜7 mm厚度之R倒角加工 作業。-圖9顯示該四角R粗研削加工作業之流程。 5) .上述錠塊之第一粗研削加工之四角r倒角作業完成 後’一面使搭載將經四角尺倒角加工之錠塊懸空支撐之夾 緊機構7之工件台4’以卜15 mm/分鐘之速度向右方向移 動’ 一面以1，2〇〇〜3,〇〇〇 rpm之旋轉速度旋轉一對精密拋光 研削砂輪10g、l〇g ’抵接於工件之前後面滑動摩擦，從而 將鍵塊之前後面同時進行同期控制精密拋光研削加工（進 行0.05〜0.1 111„1量之切入之作業）。工件台1次之右方向移動 未元成時’進行以1〜15 mm/分鐘之速度於工件台4之左右 方向往復移動及精密拋光研削砂輪10g、l〇g之切入式研削 (infeed-grinding)。該精密拋光側面倒角加工時，朝向抵接 角柱狀疑塊與杯形砂輪型精密拋光研削砂輪之加工作業 點’以50〜1，〇〇〇 cC/分鐘之供給量供給研削液。 147938.doc -21 - 201132452 ό).使藉由使將懸空支撐錠塊之夾緊機構7之主軸台之 中心支樓軸7al旋轉90度，藉此使支撐之錠塊之未加工之 第一研削加工面位於前後位置，其次，一面使搭載將該角 柱狀鍵塊懸空支撐之夾緊機構7之工件台4以卜15 mm/分鐘 之速度向右方向移動，一面以1，2〇〇〜3〇〇〇卬111之旋轉速度 旋轉一對精进抛光研削砂輪丨〇g、1 〇g，抵接於工件之前後 面滑動摩擦，從而將錠塊之前後面同時進行同期控制精密 拋光研削加工（進行〇_〇5〜〇·ι mm量之切入之作業）。工件台 1次之右方向移動未完成時，進行以卜15 mm/分鐘之速度 於工件台4之左右方向往復移動及精密拋光研削砂輪1 0g、 i〇g之切入式研肖，丨（lnfeed_grinding)。該精密拋光平面倒角 加工時，朝向抵接角柱狀錠塊與杯形砂輪型精密拋光研削 砂輪之加工作業點，以5〇〜1，〇〇〇 cc/分鐘之供給量供給研 削液。 7) · 一面使將四側面經平坦加工研削之四角柱狀錠塊懸 空支撐之夹緊機構7 ,以1〜15 mm/分鐘之速度向右方向往 復移動，一面使主軸台之中心支撐軸以1〇〜3〇〇 rpm之旋轉 速度旋轉，一面使圓筒狀砂輪車98以8〇〇〜3〇〇〇卬111之旋轉 速度％:轉，並且進行對以5〜1〇〇 cc/分鐘之量供給研削液之 作業點橫向進給之圓筒研削，從而進行將錠塊之四角R予 以0.2〜1·〇 mm倒角之精密圓弧研削加工。 8) .上述四角R精密圓弧研削加工之倒角作業完成後， 使搭載夾緊機構7之工件台向右方向移動，從而使工件向 載入埠8位置後退。因此，一面使角柱狀錠塊以主轴台 147938.doc • 22- 201132452 旋轉，一面將壓縮空氣噴射至錠塊表面而使之風乾。若風 乾、。束’則利用夾緊機構7之主轴台7a進行之角柱狀石夕旋 之旋轉作業完成。 使用工件裝載/卸載裝置13之兩爪13a、13b，把持由失 緊機構7支撐之錠塊’其次，使尾架几向左方向後退，解 除工件之支撐後，使兩爪丨3a、i3b移動至工件暫存盒1The Microweek cylinder I3e separates the two claws 13a, 13b. The slight adjustment of the slight lifting of the two claws 13a, 13b is performed using the Microweek cylinder 131. The slight adjustment of the slight movement of the two claws 13a, 13b is performed using a Microweek cylinder 13r. As shown in Fig. 1, the four-side peeling processing table 90 of the cylindrical ingot extends the left and right moving rails of the workpiece stage 4 to the left end surface of the composite chamfering apparatus of the ingot, and is clamped and mounted thereon. The main drawing table 7a of the clamping mechanism 7 of the workpiece table 4 and the workpiece supporting shaft (C axis) of the tailstock 7b are such that a pair of rotating blades (slicing blades) 91a, 91b are opposed to each other with their rotating blade diameter faces. In the manner of the orientation, the workpiece table 4 is clamped, and the side surface of the workpiece table is peeled off from the processing table 9 〇. A pair of rotating blades (inner peripheral blades) 91a, 9 lb are a pair of rotating shafts 92a' 92b as bearings. The rotating shafts are rotated by the drive motors %^, 93m, and the rotating blades 91a, 91b are 50 to 7,500. The rotation speed of min·丨 is rotated relative to the workpiece in the same clockwise direction (the directions of rotation of the two rotating shafts are opposite to each other). The rotation shafts 92a and 92b are moved rearwardly of the tool stages 94 and 94, whereby the surface of the ingot can be peeled from the processing start position. The workpiece table 4 can be moved at a speed of 5 to 200 mm/min, and the elevation of the rotary shafts 92a, 92b can be moved up and down to 1 mm. As the above-mentioned rotary blade, a diamond cutter for depositing diamond fine particles with a diameter of 450 to 800 mm and a thickness of O.iq. The thin steel plate of mm is mounted on the workpiece table 4 of the clamp mechanism 7 that supports the C axis of the workpiece (cylindrical ingot) in the horizontal direction, and the workpiece end face abuts against the pair of rotary blades before and after the guard end face. 91a, 91b' and by the rotating blades, into the 147938.doc -19·201132452 row, the cylindrical workpiece front and rear arc-shaped face is peeled off. When the surface peeling process of the front and rear surfaces of the workpiece is completed, the support shaft of the spindle table 7a of the clamp mechanism 7 is rotated by 90 degrees, the arcuate surface of the workpiece which has not been subjected to the peeling process is directed to the front and rear positions, and secondly, the workpiece table 4 is turned to the right. The direction is reversed, and the drive motors 93m and 93m rotate the above-described rotating blade 9U and the opposite direction of the core to perform surface peeling and lifting. The peeling processing time of the four sides is in a cylindrical single crystal ingot block with a diameter of 200 mm and a height of 250 mm. It can be 〇~2〇 minutes into 4亍' and in straight 20〇ΓΪ11Τ1, ancient Ficrm_0旦>1 The cylindrical single crystal crucible ingots with a mm between 500 mm can be carried out in 18 to 36 minutes. By using the composite chamfering apparatus of the ingot of the present invention, the cylindrical ingots which are cut at both ends by plane are subjected to surface peeling processing and chamfering processing, and processed to have a length of 5 to 3 mm at the four corners. The operation of the cylindrical column ingots as the workpiece w is performed as follows. 1) Using the workpiece loading/unloading device 13, one of the key blocks (workpieces) stored in the V-segment of the workpiece temporary storage cassette 14 is transported to the clamp mechanism 7, and secondly, the spindle table 7a of the clamp mechanism 7 is used. With the tailstock 7b branch building workpiece. 2) The workpiece table on which the clamp mechanism 7 for supporting the ingot is suspended is moved at a speed of 1 to 15 mm/min, and the end surface of the workpiece is abutted against the pair of rotary blades 91a, 91b. And by the rotating blades, the surface of the cylindrical workpiece is cut and cut into an arc-shaped half-moon surface peeling process. 3) If the surface of the front and back of the workpiece is peeled off, the main shaft of the unstrained mechanism 7 is rotated by 90 degrees with the support shaft of the 7a, and the arcuate surface of the workpiece that has not been peeled off is oriented toward the front and rear positions. 4 Reversed in the right direction, 147938.doc • 20-201132452 The motor 51m and 93m are driven to rotate the pair of rotating blades... and the opposite direction to perform the surface peeling process. For example, a cylindrical key block having a diameter of 2 turns is formed such that it has a square cross section having a length of about 155 mm on one side, and the arc portion is cut. 4), the workpiece stage 4 of the clamping mechanism 7 which is mounted with the ingots which are peeled off into a square column shape is moved to the right direction at a speed of 丨 15 mm/min, and the workpiece is rotated by the spindle table 7a. . On the other hand, the rotation speed of the pair of first rough grinding wheels Ug, UgU1 〇〇 3 〇〇 rpm is controlled to rotate at the same time, and the grinding fluid is supplied to the working point by 20 to 1,000 cc/min. The R-angle grinding process of the four corners of the above-mentioned square-corner ingot is performed before and after the above-mentioned workpiece, thereby completing the R chamfering operation of a thickness of 2 to 7 mm. - Figure 9 shows the flow of the four-corner R roughing operation. 5) After the four-corner r-chamfering operation of the first rough grinding process of the ingot block is completed, the workpiece table 4' of the clamping mechanism 7 which is suspended and supported by the ingots which are chamfered by the four-corner is mounted as a 15 mm. The speed of /min is moved to the right direction. One side rotates at a rotation speed of 1,2〇〇~3, 〇〇〇rpm, and a pair of precision polishing grinding wheels 10g, l〇g 'sliding friction before the workpiece is pressed, so that Simultaneously control the precision polishing and grinding process at the same time before the key block (perform the cutting operation of 0.05~0.1 111 „1). When the workpiece table moves in the right direction once, the speed is 1~15 mm/min. Reciprocating movement in the left-right direction of the workpiece table 4 and precision-polishing grinding wheel 10g, l〇g in-feed-grinding. This precision-polished side chamfering process, facing the abutment angle column-shaped doubt block and cup-shaped grinding wheel type The processing point of the precision polishing grinding wheel is supplied to the grinding fluid at a supply of 50 to 1, 〇〇〇cC/min. 147938.doc -21 - 201132452 ό). By clamping mechanism that will support the ingot Center branch of the spindle head of 7 7al is rotated by 90 degrees, whereby the unprocessed first grinding surface of the supported ingot is located at the front and rear positions, and secondly, the workpiece table 4 carrying the clamping mechanism 7 for supporting the angular columnar key block is provided The speed of mm/min is moved to the right, and a pair of precision polishing grinding wheels 丨〇g, 1 〇g are rotated at a rotation speed of 1, 2 〇〇 to 3 〇〇〇卬 111, and the rear sliding friction is abutted against the workpiece. Therefore, the precision polishing grinding process is performed simultaneously with the simultaneous control of the ingot before and after the ingot (the operation of cutting the amount of 〇_〇5~〇·ι mm). When the movement of the workpiece table in the right direction is not completed, 15 mm is performed. The speed of /min is moved back and forth in the left and right direction of the workpiece table 4, and the precision polishing grinding wheel 10g, i〇g is cut-in type, 丨(lnfeed_grinding). When the precision polishing plane is chamfered, the column is oriented toward the abutment angle. The processing work point of the block and cup-shaped grinding type precision polishing grinding wheel is supplied to the grinding fluid at a supply of 5 〇 〜1, 〇〇〇 cc / min. 7) · The four corners of the four sides are flattened by flat machining Ingot suspension The supporting clamping mechanism 7 reciprocates in the right direction at a speed of 1 to 15 mm/min, and rotates the center support shaft of the main spindle table at a rotation speed of 1 〇 to 3 rpm, thereby making the cylindrical grinding wheel 98 is rotated at a rotation speed of 8 〇〇 to 3 〇〇〇卬 111%, and is subjected to cylindrical grinding for the lateral feed of the working point of the grinding fluid in an amount of 5 to 1 〇〇 cc/min. The four corners of the ingot are subjected to precision arc grinding of 0.2 to 1·〇mm chamfering. 8) After the chamfering of the above-mentioned four-corner R precision arc grinding is completed, the workpiece table on which the clamping mechanism 7 is mounted is turned to the right. The direction is moved so that the workpiece is retracted toward the load 埠8 position. Therefore, while the angular column ingot is rotated by the spindle table 147938.doc • 22-201132452, compressed air is sprayed onto the surface of the ingot to be air-dried. If the air is dry, The beam ' is completed by the rotation of the angular columnar sway by the spindle table 7a of the clamp mechanism 7. Using the two claws 13a, 13b of the workpiece loading/unloading device 13, the ingot held by the detoning mechanism 7 is gripped, and the tailstock is retracted to the left, and the support of the workpiece is released, and the two jaws 3a, i3b are moved. To workpiece temporary storage box 1
子棚段上方並下降，將角柱狀錠塊載置於工件暫存盒14V 子棚段，其次，分離兩爪13a、13b，解除角柱狀錠塊之把 持。 作為本發明之其他實施態樣，亦有對第一研削砂輪1 ^ 擔負四角R粗研削加工與側面粗研削加工2種加工作業，以 使角柱狀錠塊之側面之平滑度Ry提高至〇卜〇 2 _左右為 止的if况。進仃該作業a夺，第二研削砂輪％使用有磨料 號1，〇〇〇〜4,000之金剛石杯形砂輪型砂輪。 角柱狀鍵塊之四角R粗研削加工與側面粗研削加工係無 論先進行何者皆可。例如，上述4)之四角R粗研削加工^ 成後’上述錠塊之第-粗研削加工之四角R倒角作業完成 後’使搭載將經四角R倒角加工之錠塊懸空支樓之夹緊機 構7之工件台4向左方向移動並返回，其次，-面以卜15 mm/分鐘之速度向右方向移動，—面使一對粗研削砂輪 Ug llg以1，200〜3，_ rpm之旋轉速度旋#，並且抵接於 工件之前後面滑動摩擦，.從而將錠塊之前後面同時進行同 期控制粗研削加工（進行卜2 _量之切入之作業），且，再 次使工件台4向左方, 及万向移動，從而將懸空支撐錠塊之夾緊 147938.doc -23· 201132452 機構7之主軸台之中心支撐軸7al旋轉9〇度，藉此，使經支 撲之紅塊之未加工之第一研削加工面位於前後位置，其 次，一面使搭載將該角柱狀錠塊懸空支撐之夾緊機構之工 件台4以1〜15 mm/分鐘之速度向右方向移動，—面以 1’200〜3,000 rpm之旋轉速度旋轉，並且一對粗研削砂輪 llg、llg抵接於工件之前後面滑動摩擦，從而將錠塊之前 後面同時進行同期控制粗研削加工（進行卜2 mm量之切入 之作業）。 由於加入上述作業，使產能時間，例如一邊為j 56 mm、高度為250 mm，且於四角殘留尺部，以帶鋸切斷之 角柱狀單晶矽錠塊之倒角加工之產能時間增長大約⑽分 鐘。又，邊長1S6 mm、高度500 mm之角柱狀矽錠之倒角 加工時間之產能時間為大約155分鐘。 [產業上之可利用性] 本發明之複合式倒角加工裝置，係可以核塊之倒角加 工作業之產能時間為先前（傳統）加工裝置之大約一半而進 行的石夕錠塊之複合式倒角加工裝置。 【圖式簡單說明】Above the sub-shed section and descending, the angular column ingot is placed in the 14V sub-sleeve of the workpiece temporary storage box, and secondly, the two claws 13a, 13b are separated to release the holding of the angular column ingot. As another embodiment of the present invention, the first grinding wheel 1 ^ is subjected to two kinds of processing operations of four corner R rough grinding and side rough grinding processing, so that the smoothness Ry of the side surface of the corner column ingot is improved to If2 _ around the if condition. In the operation, the second grinding wheel uses a diamond cup-shaped grinding wheel with an abrasive number of 1, 〇〇〇 to 4,000. The four corners of the corner column-shaped key block R rough grinding and side rough grinding processing can be done first. For example, in the above-mentioned 4), the four corners R are rough-grinding processing, and after the completion of the four-corner R-chamfering operation of the first-rough grinding processing of the above-mentioned ingots, the mounting of the ingots which are subjected to the chamfering of the four-corner R is suspended. The workpiece table 4 of the tightening mechanism 7 moves to the left direction and returns, and secondly, the - surface moves to the right direction at a speed of 15 mm/min, and the surface makes a pair of rough grinding wheels Ug llg at 1,200 to 3, _ rpm The rotation speed is rotated by #, and the sliding friction is applied to the front surface of the workpiece, so that the coarse and vertical grinding processing is performed simultaneously on the front and the back of the ingot, and the workpiece table 4 is again turned toward the workpiece. The left side, and the universal movement, thereby clamping the suspended support ingot 147938.doc -23· 201132452 The central support shaft 7al of the spindle table of the mechanism 7 is rotated by 9 degrees, thereby making the red block of the branch The unprocessed first grinding surface is located at the front and rear positions, and secondly, the workpiece table 4 carrying the clamping mechanism for supporting the angular column ingot is moved to the right direction at a speed of 1 to 15 mm/min. 1'200~3,000 rpm rotation speed rotation, and one Llg rough grinding wheel, behind the sliding friction contact with the workpiece prior to contact llg, thereby simultaneously controlling later period prior to the ingot coarse grinding process (for cutting the 2 mm BU amounts of work). Due to the above-mentioned work, the production time, for example, j 56 mm on one side and 250 mm in height, and the ruler at the four corners, the production time of the chamfering of the columnar single crystal ingots cut by the band saw is about time. (10) minutes. In addition, the chamfering of the columnar bismuth ingots with a side length of 1 S6 mm and a height of 500 mm is about 155 minutes. [Industrial Applicability] The composite chamfering apparatus of the present invention is a composite type of Shixi ingot which can be used for the chamfering processing operation of the core block which is about half of the previous (conventional) processing apparatus. Chamfer processing unit. [Simple description of the map]
圖1係具備有面剝離加工台之複合式倒角加工裝 面圖； T 圖2係具備有面剝離加工台之複合式倒角加工裝置之正 視圖； 圖3係從正面左側斜大約15度之角度觀察㈣加工裝置 147938.doc •24· 201132452 圖4係倒角加工裝置之平面圖； 圖5係倒角加工裝置之正視圖； 圖6係倒角加工裝置之左側視圖； 圖7係倒角加工裝置之右側視圖； 圖8係將密閉外罩、工件暫存盒、及工件裝載/卸載裝置 拆卸觀察之倒角加工裝置之平面圖；及 圖9係顯示以杯形砂輪將角柱狀錠塊之四角r部，進疒 弧研削加工之狀態之平面圖’圖9⑷係顯示圓弧研削::： 之初期狀態，圖9(b)係顯示圓弧研削加工之中期狀離。 【主要元件符號說明】 & ° 1 複合式倒角加工裝置 2 機框 4 工件台 7 夾緊機構 7a 主車由台 7b 尾架 8 載入埠 9 R角部研削台 9g 四角R拋光研削加工用之圓筒狀砂輪車 ΙΟ 第二研削台（四側面研削加工） lOg 杯形砂輪型精密拋光研削砂輪 11 第一研削台（四角R粗研削加工） Hg 杯形砂輪型粗研削砂輪 13 工件裝載/卸載裝置 147938.doc -25- 201132452 14 90 91a' 91b 工件暫存盒 面剝離加工台 旋轉刀片 錠塊 147938.doc -26·1 is a front view of a composite chamfering machine having a face peeling processing table; T FIG. 2 is a front view of a compound chamfering apparatus having a face peeling processing table; FIG. 3 is inclined about 15 degrees from the front left side. Angle observation (4) Processing device 147938.doc •24· 201132452 Figure 4 is a plan view of the chamfering device; Figure 5 is a front view of the chamfering device; Figure 6 is a left side view of the chamfering device; Figure 7 is a chamfer Figure 8 is a plan view of the chamfering device for obscuring the closed cover, the workpiece temporary storage box, and the workpiece loading/unloading device; and Figure 9 is a view showing the corners of the angular column ingots with a cup-shaped grinding wheel The r-section, the plan view of the state of the boring arc grinding process, Fig. 9 (4) shows the initial state of the arc grinding:::, and Fig. 9 (b) shows the period of the arc grinding process. [Main component symbol description] & ° 1 Compound chamfering machine 2 Frame 4 Workpiece table 7 Clamping mechanism 7a Main car is loaded by table 7b Tailstock 8 埠9 R corner grinding table 9g Four-corner R polishing grinding Cylindrical grinding wheel ΙΟ Second grinding table (four side grinding) lOg Cup grinding wheel precision polishing grinding wheel 11 First grinding table (four-corner R rough grinding) Hg Cup-shaped grinding wheel coarse grinding wheel 13 Workpiece loading /Unloading device 147938.doc -25- 201132452 14 90 91a' 91b Workpiece temporary storage box peeling processing table rotary blade ingot 147938.doc -26·