TW201129429A - Ultrasonic cleaning method - Google Patents
Ultrasonic cleaning methodInfo
- Publication number
- TW201129429A TW201129429A TW99144789A TW99144789A TW201129429A TW 201129429 A TW201129429 A TW 201129429A TW 99144789 A TW99144789 A TW 99144789A TW 99144789 A TW99144789 A TW 99144789A TW 201129429 A TW201129429 A TW 201129429A
- Authority
- TW
- Taiwan
- Prior art keywords
- cleaning
- ultrasonic
- cleaned
- aforementioned
- cleaning method
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010012801A JP2011151282A (ja) | 2010-01-25 | 2010-01-25 | 超音波洗浄方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201129429A true TW201129429A (en) | 2011-09-01 |
Family
ID=44306496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW99144789A TW201129429A (en) | 2010-01-25 | 2010-12-20 | Ultrasonic cleaning method |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2011151282A (ja) |
| TW (1) | TW201129429A (ja) |
| WO (1) | WO2011089673A1 (ja) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5729351B2 (ja) * | 2012-05-18 | 2015-06-03 | 信越半導体株式会社 | 半導体ウェーハの洗浄方法 |
| US20170213705A1 (en) * | 2016-01-27 | 2017-07-27 | Applied Materials, Inc. | Slit valve gate coating and methods for cleaning slit valve gates |
| CN112974396B (zh) * | 2021-01-22 | 2022-07-22 | 北京北方华创微电子装备有限公司 | 半导体清洗设备及晶片清洗方法 |
| CN112992740A (zh) * | 2021-03-01 | 2021-06-18 | 李军平 | 一种切割晶圆用的清洗设备 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02247650A (ja) * | 1989-03-20 | 1990-10-03 | Hoya Corp | 洗浄方法 |
| JPH04164324A (ja) * | 1990-10-29 | 1992-06-10 | Nec Corp | 半導体製造装置 |
| JPH06168928A (ja) * | 1992-11-30 | 1994-06-14 | Nec Kansai Ltd | ウェーハ洗浄装置およびウェーハ洗浄方法 |
| JP2007059868A (ja) * | 2005-07-28 | 2007-03-08 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
-
2010
- 2010-01-25 JP JP2010012801A patent/JP2011151282A/ja active Pending
- 2010-12-15 WO PCT/JP2010/007274 patent/WO2011089673A1/ja active Application Filing
- 2010-12-20 TW TW99144789A patent/TW201129429A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011089673A1 (ja) | 2011-07-28 |
| JP2011151282A (ja) | 2011-08-04 |
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