201128765 六、發明說明： 【發明所屬之技術領域】 一種發光模組及其製程，經電流導通後，可產生一 面光源，並供以組設於一燈具内，作為燈具的發光源， 本發明尤指一種發光二極體晶片上成形有阻光層的高演 色性光源模組及其製程。 【先前技術】 晶片直接封裝技術（Chip on Board，C0B)，是一種 將晶片直接封裝於積體電路上的技術，其作法是將一裸 晶片直接黏貼在一電路板或一基板上，且結合晶片黏 著、導線（或電極）連接、封膠技術等三項製程，有效的 將積體電路製程中的封裝及測試步驟，轉移到電路板組 裝階段，此種封裝技術已被成熟的應用於發光二極體產 品之中；按，白光發光二極體技術的趨於成熟，其所能 產生的發光效率非常高，但對於發光模組而言，必須考 慮到照度、演色性、色溫等關鍵問題，其中，演色性係 指物體在光源下的顯色與在太陽光下顯色的真實度百分 比’然而演色性較高的光源對物體顏色的表現較為寫 實，眼睛所觀看的色彩較接近物體在太陽光下所呈現出 的色澤’又’色溫係形容某一特殊光源的色彩混合效果， 其中’低色溫亦會帶給人穩重、溫暖的感覺，中色溫給 人一種舒服的感覺，而高色溫給人清爽的感覺；請參照 201128765 「第1圖」，本圖係為一習知的發光模組電性組成結構 圖’承上所述，為使發光模組10提高其演色性，一般係 利用多個發光二極體晶片101來達成，主要係有混色及 調光兩種技術，其中，混光技術係在發光模組10中的膠 層中摻入一種以上的螢光粉，藉以使發光模組10產生光 源時’其光源可激發螢光粉產生出不同的光源，然而， 此種技術雖可達到提升發光模組10的演色性，但摻雜螢 φ 光粉使發光模組1〇的成本上揚，且螢光粉摻雜的濃度、 厚薄不均勻時，亦使發光模組10所產生的色澤偏差；又， 調光技術主要係將多種不同波長的發光二極體晶片 - 101 ’依電路設計’黏著至基板上’將各發光二極體晶片 101產生電性連接’為使發光模組10提高其演色性，需 對某一波長的發光二極體晶片101供給較少的電壓，戍 對某一波長的發光二極體晶片101供給較多的電壓，使 不同波長的發光二極體晶片101產生不同的亮度，藉此 籲 混光後，以達到提高演色性的需求，如Γ第i圖」所示， 欲改變發光二極體晶片101’的供給電壓，亦會改變原先 的電路設計’使原先簡單的電路必須被再次的設計甚 至需增設相關的電性線路、積體電路晶片等，如此使得 發光模組10的製程變得複雜。 【發明内容】 有鑑於上述的問題，本發明者係依據多年來，從事 201128765 相關產品研發的經驗’針對發光模組的結構及光源的演 色性進行研究及分析’期能研發出更為適切的結構及製 程’緣此’本發明主要的目的在於提供一種電性結構簡 的高演色性發光模組及其製程。 為達上述的目的，本發明所稱的高演色性發光模 組，其主要係由一基板以及數個發光二極體晶片所組構 而成，其中，各發光二極體晶片係分別佈設於基板的平 # 面上，各發光二極體晶片依電路設計，呈電性連接，又， 部伤發光二極體晶片的上方，成形有一阻光層；上述各 構件完成組設後，部份發光二極體晶片所呈現的光源較 ^在與其他發光一極體晶片所產生的光源混合後，可 提高發光模組的演色性。 以上關於本發明内容之說明及以下之實施方式之 說明，係用以示範與解釋本新型之精神與原理，並且提 供本新型之專利申請範圍更進一步之解釋。 【實施方式】 請參閱「第2目」，冑中所示係為本發明之立體外 觀圖’如圖所示’本發明所稱的高演色性發光模組2〇, 主要係由-基板201及數個發光二極體晶片2〇2所組構 而成，其中，各發光二極體晶片2G2依電路料與基板 • 2G1Jl的電性線路’呈串聯或並聯的電性連接，且部份發 光二極體晶片202的表面，成形有一阻光層2〇21，又， 201128765 基板201的上方係塗覆有一膠層2〇11。 明參閱第3圖」’本圖所示係為本發明之電性結 構示意圖’如圖所示，各發光二極體晶片2()2經電路設 «•十，形成串聯、並聯或串並聯的電性連接，又，為了提 高發光模組演色性的需求’使部份發光二極體晶片2〇2 所呈現的光源減少，因而在部份發光二極體晶# 2〇2的 上方’成形有一阻光層2021。 凊參閲「第4圖」，本圖所示係為本發明之剖面示 意圖，如圖所示，部份的發光二極體晶片2〇2上方係 成形有一阻光層202卜其中，阻光層2〇21係為一具有微 透光性的膠質材料，例如一矽膠等，且成形於發光二極 體晶片202的上方，而為使阻光層2〇21的效果顯著降 低較多的餘光產生，阻光層2021係完整地包覆發光二極 體晶片202，請參閱「第5圖」，本圖所示係為本發明之 實施示意圖，承上述，高演色性發光模組2〇經電流導通 後，各發光二極體晶片202產生光源，受到阻光層2021 包覆之發光二極體晶片202所能呈現的光源，較其他未 受到阻光層2021包覆的發光二極體晶片202少，藉此， 兩光源混合後’係可產生近似自然光的光源。 據上述’本發明所稱的數個發光二極體晶片，係可 為不同波長的發光二極體晶片，利用本發明所揭露的結 構’進行混光’以產生近似自然光的光源，又，發光模 組係可進一步搭配一種以上的螢光粉，摻雜於膠層内， 201128765 使所產生的光源，更為接近自然光。 請參閱「第6圖」，圖中所示係為本發明之製程的 步驟示意圖，請同時搭配參照「第2圖」及「第4圖」， 如「第6圖」所示’本發明的製程步驟如下： (1) 固晶31:將各發光二極體晶片2〇2分別固設於 基板201的表面上； (2) 完成電性連接32:使各發光二極體晶片202與 • 基板2〇1上的電性線路完成電性連接，其連接 的方式依照發光二極體晶片2〇2的規格，可區 分成導線連接或電極連接； - (3)晶片點膠33:於部份發光二極體晶片2〇2上 方，塗佈一層膠體，以形成一阻光層2〇21，所 述的膠體可例如為矽膠等膠體，主要係使被包 覆的發光二極體晶片202所能呈現的光源減 少； (4) /主膠34:於基板201的表面灌入膠體，以形成 一膠層2011’所述的膠體係可為環氧樹脂或其 他混合物，主要作用係為保護發光二極體晶片 202及電性線路，且亦可於膠層2011中摻入螢 光粉’使膠層2011具有混光的功用； (5) 烘乾35:經適當溫度烘乾後，製成高演色性發 光模組20。 請參閱「第7圖」’圖中所示係為本發明之另一實 [S] 201128765 施例，請搭配參照「第2圖」，本發明所稱的阻光層2〇21， 係可進一步成形為一阻光片2022’如圖所示，阻光片2022 係依光學設計，貼附在部份的發光二極體晶片2〇2上。 請參閱「第8圖」，圖中所示係為本發明之另一實 施例之實施示意圖，如圖所示，本實施例經電流導通後， 各發光二極體晶片202係可產生光源，然而，被阻光片 2022所貼附的發光二極體晶片202,其所呈現的光源較 Φ 少’可與其他發光二極體晶片202所產生的光源進行混 合’藉以產生近似自然光的光源，提高發光模組2〇的演 色性。 请參閱「第9圖」，圖中所示係為本發明另一實施 例之製程的步驟示意圖，請同時搭配參照「第7圖」，如 「第7圖」所示’本發明的製程步驟如下： (1)固μ 41.將各發光二極體晶片202分別固設於 基板201的平面上； 籲 ⑵元成電性連接42 :使各發光二極體晶片202 與基板201上的電性線路完成電g連接，其連 接的方式依照發光二極體晶片2〇2的規格，可 區分成導線連接或電極連接； (3)黏貼阻光片43:係在部份發光二極體晶片2〇2 的上方，黏附一阻光片2022’且將發光二極體 晶片202完整包覆，所述的阻光片2022可為 膠質材料經加工所製成’主要係使被包覆的發 201128765 光二極體晶片202所能呈現的光源減少； (4) 注膠44:於基板201的表面灌入膝體，以形成 一膠層2011，所述的膠係可為環氧樹脂或其他 混合物’主要係為保護發光二極體晶片202及 電性線路’且亦可於膠層2011中摻入螢光粉， 使膠層2011具有混光的功用； (5) 烘乾45:經適當溫度烘乾後，製成高演色性發 光模組20。 綜上所述’本發明主要係利用一阻光層成形於部份 發光二極體晶片上’藉此使部份發光二極體晶片所呈現 的光源較少，與其他發光二極體晶片所產生的光源混合 後’產生一近似自然光的光源，以提升高發光模组的演 色性；據此，本發明其據以實施後，確實可達到提供一 種結構簡單的高演色性發光模組。 唯，以上所述者，僅為本發明之較佳之實施例而 已，並非用以限定本發明實施之範圍，任何熟習此技藝 者，在不脫離本發明之精神與範圍下所作之均等變化與 修飾’皆應涵蓋於本發明之專利範圍内。 综上所述’本發明之功效，係符合申請專利要件之 「實用性」、「新穎性」與「進步性」；申請人爰依專利法 之規定’向鈞局提起發明專利之申請。 201128765 【圖式簡單說明】 第 1圖 ，為一習知的發光模組電性組成結構圖。 第 2圖 ，為本發明之立體外觀圖。 第 3圖 ，為本發明之電性結構示意圖。 第 4圖 ，為本發明之剖面示意圖。 第 5圖 ，為本發明之實施示意圖。 第 6圖 ，為本發明之製程的步驟示意圖。 第 7圖 ，為本發明之另一實施例。 第 8圖 ，為本發明之另一實施例之實施示意圖。 第 9圖 ，為本發明另一實施例之製程的步驟示意圖 【主要元件符號說明】 10 發光模組 101 發光二極體晶片 101’ 發光二極體晶 20 高演色性發光模組 201 基板 202 發光二極體晶 2011 膠層 2021 阻光層 2022 阻光片 31 固晶 32 完成電性連接 33 晶片點膠 34 注膠 35 烘乾 m 10 201128765 41 固晶 42 完成電性連接 43 黏貼阻光片 44 注膠 45 烘乾201128765 VI. Description of the invention: [Technical field of invention] A lighting module and a manufacturing process thereof, after being turned on by a current, can generate a light source and are arranged in a lamp as a light source of the lamp, the invention Refers to a high color rendering light source module with a light blocking layer formed on a light emitting diode wafer and a process thereof. [Prior Art] Chip on Board (C0B) is a technology for directly packaging a wafer on an integrated circuit by directly bonding a bare wafer to a circuit board or a substrate, and combining Three processes, such as wafer bonding, wire (or electrode) connection, and sealing technology, effectively transfer the packaging and testing steps in the integrated circuit process to the board assembly stage. This packaging technology has been maturely applied to light. Among the diode products, according to the white light-emitting diode technology, the luminous efficiency can be very high, but for the light-emitting module, key issues such as illumination, color rendering and color temperature must be considered. Among them, color rendering refers to the color development of an object under the light source and the true degree of color development under sunlight. However, the light source with higher color rendering is more realistic about the color of the object, and the color viewed by the eye is closer to the object. The color and color temperature displayed under the sunlight describe the color mixing effect of a special light source, and the 'low color temperature will also bring people stability and temperature. The warm feeling, the medium color temperature gives a comfortable feeling, and the high color temperature gives a refreshing feeling; please refer to 201128765 "1st picture", this picture is a conventional light-emitting module electrical composition structure diagram In order to improve the color rendering of the light-emitting module 10, a plurality of light-emitting diode chips 101 are generally used, and the two technologies are mainly mixed color and dimming, wherein the light mixing technology is in the light-emitting module 10 . In the middle layer of the glue layer, more than one type of phosphor powder is incorporated, so that the light source module 10 can generate the light source to generate different light sources when the light source module 10 generates a light source. However, this technology can achieve the improvement of the light emitting module 10 Color rendering, but the doping of fluorescing φ light powder increases the cost of the illuminating module 1 ,, and when the concentration of the phosphor powder is doped and the thickness is uneven, the color deviation caused by the illuminating module 10 is also changed; The light technology mainly uses a plurality of different wavelengths of the LED chip 101-adhered to the substrate to electrically connect the LED chips 101 to improve the color rendering of the light-emitting module 10. Need to send a certain wavelength The diode chip 101 supplies a small voltage, and 较多 supplies a large voltage to the light-emitting diode chip 101 of a certain wavelength, so that the light-emitting diode chips 101 of different wavelengths generate different brightness, thereby absorbing the light after the light is mixed. In order to achieve the improvement of color rendering, as shown in Fig. ith, to change the supply voltage of the LED chip 101', the original circuit design will be changed, so that the original simple circuit must be redesigned or even The related electrical circuit, the integrated circuit chip, and the like need to be added, which complicates the manufacturing process of the light-emitting module 10. SUMMARY OF THE INVENTION In view of the above problems, the inventors have developed a more appropriate experience based on the experience of research and development of 201128765 related products for the research and analysis of the structure of the light-emitting module and the color rendering of the light source. Structure and Process 'There' is a main object of the present invention to provide a high color rendering light-emitting module with an electrical structure and a process thereof. In order to achieve the above object, the high color rendering light-emitting module of the present invention is mainly composed of a substrate and a plurality of light-emitting diode chips, wherein each of the light-emitting diode chips is respectively disposed on On the flat surface of the substrate, each of the light-emitting diode chips is electrically connected according to a circuit design, and a light-blocking layer is formed on the upper side of the light-emitting diode chip; after the components are assembled, part The light source of the light-emitting diode wafer can improve the color rendering of the light-emitting module after being mixed with the light source generated by the other light-emitting diode chip. The above description of the present invention and the following description of the embodiments are intended to illustrate and explain the spirit and principles of the present invention, and to provide further explanation of the scope of the present invention. [Embodiment] Please refer to "2nd item", which is a three-dimensional appearance of the present invention. As shown in the drawing, the high color rendering light-emitting module 2 of the present invention is mainly composed of a substrate 201. And a plurality of light-emitting diode chips 2〇2, wherein each of the light-emitting diode chips 2G2 is electrically connected in series or in parallel according to the circuit material and the electrical circuit of the substrate 2G1J1, and a part thereof A light-blocking layer 2〇21 is formed on the surface of the light-emitting diode chip 202. Further, a top layer of the substrate 201 is coated with a glue layer 2〇11. Referring to Figure 3, 'this figure shows the electrical structure of the present invention' as shown in the figure, each of the LED chips 2 () 2 is set by the circuit to form series, parallel or series-parallel The electrical connection, in order to improve the color rendering of the light-emitting module, 'the light source of the partial light-emitting diode chip 2〇2 is reduced, so that it is above the partial light-emitting diode crystal #2〇2' A light blocking layer 2021 is formed. Referring to "Fig. 4", the figure is a schematic cross-sectional view of the present invention. As shown in the figure, a portion of the light-emitting diode chip 2 is formed with a light-blocking layer 202 thereon, which blocks light. The layer 2〇21 is a micro-transparent gelatinous material, such as a silicone or the like, and is formed on the LED array 202, and the effect of the light-blocking layer 2〇21 is significantly reduced. The light-blocking layer 2021 completely covers the LED chip 202. Please refer to FIG. 5, which is a schematic diagram of the implementation of the present invention. After the current is turned on, each of the light-emitting diode chips 202 generates a light source, and the light source that can be presented by the light-emitting diode chip 202 covered by the light-blocking layer 2021 is lighter than other light-emitting diodes not covered by the light-blocking layer 2021. The number of wafers 202 is small, whereby the two light sources are mixed to produce a light source that approximates natural light. According to the above-mentioned "single light-emitting diode wafers of the present invention, light-emitting diode chips of different wavelengths can be used, and the structure of the present invention can be used to "mix light" to generate a light source that approximates natural light, and The module can be further matched with more than one type of phosphor powder, which is doped into the glue layer. 201128765 makes the generated light source closer to natural light. Please refer to "Figure 6", which is a schematic diagram of the steps of the process of the present invention. Please refer to "Figure 2" and "Figure 4" at the same time, as shown in "Figure 6". The process steps are as follows: (1) solid crystal 31: each of the light-emitting diode chips 2〇2 is fixed on the surface of the substrate 201; (2) completing the electrical connection 32: making each of the light-emitting diode chips 202 and The electrical lines on the substrate 2〇1 are electrically connected, and the manner of connection is in accordance with the specifications of the LEDs 2〇2, which can be divided into wire connections or electrode connections; - (3) wafer dispensing 33: in the department Above the luminescent diode chip 2〇2, a layer of colloid is applied to form a light blocking layer 2〇21. The colloid may be, for example, a colloid such as silicone, mainly for coating the coated LED wafer 202. The light source that can be presented is reduced; (4) / main glue 34: the colloid is poured into the surface of the substrate 201 to form a glue layer 2011', the glue system can be epoxy resin or other mixture, the main function is to protect Light-emitting diode chip 202 and electrical circuit, and can also incorporate phosphor powder in the glue layer 2011 to make the glue layer 2 011 has the function of mixing light; (5) Drying 35: After drying at an appropriate temperature, a high color rendering light module 20 is formed. Please refer to "Figure 7". The figure shown in the figure is another embodiment of the present invention [S] 201128765. Please refer to "Figure 2" for reference. The light-blocking layer 2〇21 of the present invention can be used. Further formed into a light-blocking sheet 2022' as shown, the light-blocking sheet 2022 is optically designed and attached to a portion of the light-emitting diode wafer 2〇2. Please refer to FIG. 8 , which is a schematic diagram of another embodiment of the present invention. As shown in the figure, after the current is turned on, each of the LED chips 202 can generate a light source. However, the light-emitting diode chip 202 attached by the light-blocking sheet 2022 exhibits a light source that is less than Φ 'can be mixed with the light source generated by the other light-emitting diode chips 202' to generate a light source that approximates natural light. Improve the color rendering of the light-emitting module 2〇. Please refer to FIG. 9 , which is a schematic diagram showing the steps of a process according to another embodiment of the present invention. Please refer to FIG. 7 together with the process steps of the present invention as shown in FIG. 7 . The following are as follows: (1) solid μ 41. Each of the light-emitting diode chips 202 is fixed on the plane of the substrate 201; the (2) element is electrically connected 42: the light on each of the light-emitting diode chips 202 and the substrate 201 The electrical line is connected to the electric g, and the connection manner is according to the specification of the LED 2 2, which can be divided into a wire connection or an electrode connection; (3) Adhesive film 43 is attached to the partial LED chip. Above the 2〇2, a light blocking sheet 2022' is adhered and the light emitting diode chip 202 is completely covered. The light blocking sheet 2022 can be processed by the processing of the gel material. 201128765 The light source of the photodiode wafer 202 can be reduced; (4) injection 44: the surface of the substrate 201 is poured into the knee body to form a glue layer 2011, the glue system can be epoxy resin or other mixture 'Mainly to protect the LED chip 202 and electrical wiring' and also in the glue layer 20 11 is mixed with phosphor powder to make the glue layer 2011 have the function of mixing light; (5) Drying 45: After drying at a suitable temperature, a high color rendering light module 20 is formed. In summary, the present invention mainly uses a light blocking layer to be formed on a portion of a light-emitting diode wafer, thereby making the light-emitting diode wafer exhibit less light source, and other light-emitting diode wafers. After the generated light source is mixed, a light source that approximates natural light is generated to enhance the color rendering of the high light-emitting module. Accordingly, the present invention can achieve a high color rendering light-emitting module with a simple structure. The above is only the preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Any change and modification made by those skilled in the art without departing from the spirit and scope of the invention. 'All should be covered by the patent of the present invention. In summary, the effect of the present invention is in accordance with the "practicality", "novelty" and "progressiveness" of the patent application requirements; the applicant filed an application for an invention patent to the bureau in accordance with the provisions of the Patent Law. 201128765 [Simple description of the figure] Figure 1 is a schematic diagram of the electrical composition of a conventional light-emitting module. Fig. 2 is a perspective view of the present invention. Fig. 3 is a schematic view showing the electrical structure of the present invention. Figure 4 is a schematic cross-sectional view of the present invention. Figure 5 is a schematic view showing the implementation of the present invention. Figure 6 is a schematic view showing the steps of the process of the present invention. Figure 7 is another embodiment of the present invention. Figure 8 is a schematic view showing the implementation of another embodiment of the present invention. FIG. 9 is a schematic diagram showing the steps of a process according to another embodiment of the present invention. [Main component symbol description] 10 Light-emitting module 101 Light-emitting diode wafer 101' Light-emitting diode crystal 20 High color rendering light-emitting module 201 Substrate 202 Light-emitting Diode crystal 2011 adhesive layer 2021 light blocking layer 2022 light blocking sheet 31 solid crystal 32 complete electrical connection 33 wafer dispensing 34 injection glue 35 drying m 10 201128765 41 solid crystal 42 complete electrical connection 43 adhesive light block 44 Injection glue 45 drying