CN111095580A - Flexible LED (light-emitting diode) surface light source, manufacturing method and light-emitting equipment - Google Patents
Flexible LED (light-emitting diode) surface light source, manufacturing method and light-emitting equipment Download PDFInfo
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The invention discloses a press-fit flexible LED surface light source and a manufacturing method thereof.A LED chip is attached to a flexible circuit board and is directly pressed and packaged, so that the light-emitting device is uniform in light emitting, can be randomly folded, is thin in thickness, and can be widely applied to the fields of physiotherapy, health care, display and the like. The flexible LED area light source comprises: the flexible circuit board is provided with a conducting circuit on the upper surface, and a plurality of LED welding points are arranged on the conducting circuit; the flip LED chip array is arranged on the flexible circuit board through the plurality of LED welding points and is electrically connected through the conductive circuit; and the packaging layer is formed by pressing a liquid rubber material through a die, and covers the front surface of the conductive circuit and the LED chip.
Description
Technical Field
The invention relates to the field of semiconductor light emitting, in particular to a flexible LED surface light source driven by multiple chips with small current and an electronic device adopting the flexible surface light source.
Background
The flexible LED surface light source can be bent at will, is convenient to use, can be connected and cut in a delayed mode, and can be widely applied to indoor and outdoor decoration and illumination of houses, buildings, automobile decoration and the like.
At present, the packaging of the flexible LED surface light source mainly has two modes: (1) a thin film lamination technology, such as a thin-sheet LED package structure disclosed in chinese patent document CN102723324A, requires a thin film to be formed in advance by vacuum mounting, electrostatic lamination, or secondary pressing, and the thickness of the thin film is generally below 0.1mm, and secondary packaging or protection is required, and the thin film lamination technology is generally applied in the white light field; (2) for example, a FPC board light source package structure disclosed in chinese patent document CN106783827A and a method for manufacturing the same are difficult to control the thickness of the package adhesive, have different surface thicknesses and large color difference, are easy to crack when folded in a horizontal or vertical direction, and are generally applied to the general illumination field such as a bulb lamp.
With the increasing popularity and application of LEDs in the general lighting field, the application of LEDs cooperating with medical, health care and other industries to surpass lighting is also receiving much attention. If the optical therapy is applied to a beauty product, the red, blue and yellow triplet light is used for irradiating to react with the skin of a human body to activate the cell renewal speed; the neonatal jaundice phototherapy instrument has a light source which is 5cm away from the body surface of an infant and emits uniform and appropriate blue light, thereby reducing the concentration of serum non-combined bilirubin and improving the body function. Most of traditional surface light sources are manufactured by conducting or surface-mounting LEDs through optical fibers, and due to the design or process problems, the products are heavy and thick integrally, so that a good bending effect cannot be obtained.
Disclosure of Invention
In order to solve the problems, the patent provides a liquid press-fit flexible LED surface light source which is formed by laminating an LED chip on a flexible circuit board and directly pressing and packaging the LED chip, has uniform light emitting, can be folded randomly and has a thin thickness, and can be widely applied to the fields of physical therapy, health care, display and the like. The flexible LED area light source comprises: a flexible circuit board, a plurality of LED flip chips, and a compression molded (Moulding) encapsulation layer.
Furthermore, the flexible circuit board is provided with a conducting circuit and a plurality of LED welding points, the LED flip chip is installed on the LED welding points, electric connection is achieved through the conducting circuit, and the packaging layer is formed by liquid organic silica gel through high-temperature pressing of a die and covers the LED chip and the conducting circuit. The packaging layer can be ensured to be thin enough and have good flatness by adopting compression molding, the thickness of the packaging layer can reach below 0.7mm, and the flatness of the upper surface is below 0.1. When the thickness of the encapsulation layer is thin, the light source module can have a larger folding angle when being bent. Preferably, the thickness of the encapsulation layer is 0.3 to 0.5 mm.
Furthermore, the flexible circuit board comprises a flexible substrate and a conductive circuit thereon, the flexible substrate can be a polyimide organic material or other flexible insulating materials, and the flexible substrate and the surface strip-shaped conductive circuit can be formed by bonding through a thermosetting adhesive. Preferably, the thickness of the flexible circuit board is less than 0.1 mm.
Further, the line width of the conductive circuit can be 0.1-0.5 mm. In some embodiments, to ensure high flexibility of the flexible circuit board, the line width of the conductive circuit is preferably 0.1-0.2 mm. In some embodiments, the conductive lines are etched to form stripe structures.
Preferably, the surface of the LED welding point is treated by OSP oxidation resistance.
Preferably, a white solder mask is coated on the area of the conductive circuit, which is not the LED welding point.
Preferably, a white high-temperature protective film is pasted on the back surface of the flexible base material of the flexible circuit board, and the protective film can reflect light on the side surface or the bottom of the LED out of the front surface, so that the light extraction rate is improved.
Further, the LED flip chip comprises a substrate, a light emitting layer, an N electrode and a P electrode, light of the LED chip is taken out from the substrate, the P, N electrode is arranged below the chip, and the distance between the N electrode and the P electrode is preferably more than 0.1 mm.
Preferably, the LED is a strip-shaped small-power chip with the length of less than 0.5 mm; the width is less than 0.15 mm.
Preferably, the LED chip is a low-power chip, the driving current is less than or equal to 8mA, and the light emitting power can be less than 50 mw, so that more chips can be used, and the light is emitted uniformly without heating. In some embodiments, the driving current of the LED chip is 0.4-0.6 mA.
The invention also provides a manufacturing method of the flexible LED area light source, which comprises the following steps: providing a flexible circuit board, wherein a conducting circuit is arranged on the upper surface of the flexible circuit board, and a plurality of LED welding points are arranged on the conducting circuit; mounting the flip LED chip array on a plurality of LED welding points of the flexible circuit board, and realizing electrical connection through the conductive circuit; and covering a packaging layer on the front surface of the conductive circuit and the LED chip array, and pressing and molding the packaging layer by adopting a liquid glue material through a mold.
Further, firstly, a flexible substrate is provided, then a conductive layer is adhered on the flexible substrate, then strip-shaped conductive circuits are formed through etching, and then LED chip welding points are arranged on the conductive circuits. The LED flip chip is bonded on the welding point area of the flexible circuit board through solder paste, and connection is completed through reflow soldering.
Further, the surface of the LED chip solder joint may be treated with osp (organic solder resist preservatives) while a white solder resist layer is provided in the area other than the LED solder joint.
Furthermore, the packaging layer is formed by high-temperature curing in a pressing mold, the curing temperature is about 120 ℃ and 180 ℃, and the size of the pressing mold is slightly larger than that of the flexible circuit board. In some embodiments, in order to ensure that the mixed liquid silicone adhesive overflows before curing, the periphery of the pressing mold may be provided with an adhesive overflowing groove.
Preferably, in order to ensure that the LED surface light source has certain strength and moisture resistance, liquid organic silica gel with hardness of more than Shore D50 after curing is selected for compression molding, and the flexible circuit board is integrally wrapped and pressed by the organic silica gel.
Preferably, in order to improve the light uniformity and flexibility of the LED surface light source, the packaging layer can be mixed with 1-10% of different titanium dioxide diffusion powder to form an opal film.
The invention also provides a light-emitting device, comprising a power supply and a flexible LED surface light source, wherein the flexible LED surface light source comprises: the flexible circuit board is provided with a conducting circuit on the upper surface, and a plurality of LED welding points are arranged on the conducting circuit; the flip LED chip array is arranged on the flexible circuit board through the plurality of LED welding points and is electrically connected through the conductive circuit; and the packaging layer is formed by pressing a liquid rubber material through a die, and covers the front surface of the conductive circuit and the LED chip.
In some embodiments, the light emitting device is a device with medical function, the flexible LED surface light source is disposed on the inner surface of the clothing material body, and when the flexible LED surface light source is powered on, the surface illuminance is 400-. The flexible LED surface light source emits blue light, red light, purple light, infrared light or a combination thereof and is used for human body physical therapy.
In some embodiments, the light-emitting device is used for blue light treatment of infant jaundice, and the light-emitting wavelength of the flexible LED surface light source is 425-480 nm.
Preferably, the driving current of the LED chip is less than or 8mA, and the power of the LED chip is below 50 milliwatts.
Preferably, the flexible LED surface light source is detachably disposed on an inner surface of the device body.
Preferably, a white protective film is attached to the back surface of the flexible circuit board, and reflects light emitted to the side surface or the bottom of the LED chip to be reflected out of the front surface.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. Furthermore, the drawing figures are for a descriptive summary and are not drawn to scale.
Fig. 1 is a perspective structural view of a flexible LED surface light source according to the present invention.
Fig. 2 is a schematic plan view of a flexible LED area light source implemented according to the present invention.
Fig. 3 is a side cross-sectional view of a flexible LED area light source implemented in accordance with the present invention.
Fig. 4 is a schematic plan view of a flexible circuit board implemented in accordance with the present invention.
Fig. 5 is a schematic diagram of an LED chip for a flexible LED surface light source according to the present invention.
Fig. 6 is a schematic view of an application of the physiotherapy health-care device according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the attached drawings, which are to be understood as illustrative only and not limiting the scope of the invention.
Example 1
Fig. 1-3 show a flexible LED area light source comprising: the LED package includes a flexible circuit board 110, a plurality of LED chips 120 arranged on the flexible circuit board, and a package layer 130 sealing the plurality of LED chips.
Specifically, the flexible circuit board 110 includes a flexible substrate 111, a conductive trace 112 formed on the flexible substrate 111, and an LED bonding pad 113, wherein the LED bonding pad is connected to the conductive trace 112, as shown in fig. 4. The material of flexible substrate 111 is polyimide organic material or other flexible insulating material, and conducting wire 112 forms the upper surface at flexible substrate, can form the strip structure through screen printing or etching, and the linewidth of conducting wire can be 0.1~0.5mm, and for guaranteeing this flexible circuit board 110 high flexibility, the linewidth of this conducting wire is preferred 0.1~0.2 mm. The arrangement of the LED chips (mainly including arrangement rule, arrangement pitch, electrical connection mode, etc.) is designed according to the required output intensity of the LED surface light source and the driving mode, etc., and the conductive traces 112 are arranged. For example, the LED surface light source is mainly used for phototherapy, the product does not need high intensity due to short-distance irradiation, but the light is required to be soft and uniform, the surface illumination of the surface light source is preferably 400-600lx, so that low-power chips are preferably adopted, and the distance between the LED chips is 3-10 mm; when the LED surface light source is mainly used for display, the LED chips are required to be arranged at an ultra-small pitch, preferably 1mm or less, for example, 0.1 to 0.8mm or less, or 0.1mm or less. A pad 113 is provided at each LED chip mounting region, and preferably, the surface of the pad 113 for LED bonding is treated with OSP oxidation resistance. Preferably, the area of the conductive circuit, which is not the LED welding point, is coated with a white solder resist layer, so that the phenomenon that solder overflows to flow to the conductive circuit to cause short circuit when the LED chip is subsequently welded is avoided.
Referring to fig. 5, the LED chip 120 may be a general flip-chip LED chip having a first surface S21 and a second surface S22 opposite to each other, wherein the first surface S21 is an outgoing light, and the second surface S22 is provided with a pair of electrodes, and further, the LED chip 120 may include a first semiconductor layer 122, an active layer 123 and a second semiconductor layer 124, which may be a p-type semiconductor layer and an n-type semiconductor layer, respectively. For example, the first semiconductor layer and the second semiconductor layer may be formed of Al by the chemical formulaxInyGa(1-x-y)N (wherein 0. ltoreq. x.ltoreq.1, 0. ltoreq. y.ltoreq.1, 0. ltoreq. x + y. ltoreq.1), but is not limited thereto, and a GaAs-based semiconductor or a GaP-based semiconductor may be used. The active layer 123 may have a Multiple Quantum Well (MQW) structure in which quantum well layers and quantum barrier layers are alternately stacked. For example, the active layer 1112 may have nitride-based MQWs such as InGaN/GaN or GaN/AlGaN, but is not limited thereto, and other semiconductors such as GaAs/AlGaAs, InGaP/GaP, or GaP/AlGaP may be used. In some embodiments, the LED chip 110 may further include a transparent substrate 121. The electrodes include a first electrode 125 electrically connected to the first semiconductor layer 122, and a second electrode 126 electrically connected to the second semiconductor layer 124. Preferably, the LED chip 120 is a low power chip, the driving current is less than or equal to 8mA, and the light emitting power can be less than 50 mw, so that more chips can be used, and the light emitting is uniform and has no trouble of heat generation. In some embodiments, the driving current of the LED chip is 0.4-0.6 mA, preferably 0 is a strip-shaped small-sized chip with a length of less than 0.5mm and a width<0.15mm or less, and the distance between the first electrode 125 and the second electrode 126 is 0.1mm or more.
The encapsulation layer 130 covers the LED chip 120 and the conductive traces by using a molding (molding) method, and only exposes the driving terminals for connecting an external power source. Specifically, the encapsulation layer 130 is formed by high-temperature press molding of liquid silicone rubber through a mold, and the cured silicone rubber has a hardness of not less than shore D50, a thickness of not more than 0.7mm, and a flatness of the upper surface S11 of not more than 0.1 mm. Preferably, the thickness of the encapsulation layer is 0.3-0.5 mm, so that the light source assembly has a larger folding angle when being bent. Preferably, in order to improve the light uniformity and flexibility of the LED surface light source, the encapsulation layer 130 may be mixed with 1-10% of different titanium dioxide diffusion powders to form an opal film.
Preferably, a protective film may be formed on the rear surface S12 of the flexible circuit board 110 to a thickness of 0.05mm or less. In some applications, the protective film can be used as a reflective film at the same time, and can be made of a white material to reflect light from the side or bottom of the LED out of the front surface, so as to improve the light extraction rate. In other applications, such as in display devices, the protective film may be a black material, which may improve contrast.
The flexible LED surface light source is driven by multiple chips at low current, is packaged in a compression molding mode, can be controlled in thickness and uniform in light emitting according to needs, the light emitting surface of the packaging layer is flat, a finished product can be directly used without secondary packaging protection, and the manufacturing cost can be reduced.
The following describes a method for manufacturing the flexible LED surface light source with reference to specific embodiments.
Firstly, manufacturing the flexible circuit board 110
A flexible circuit board 110 is provided, in which a flexible substrate 111 and a surface conductive trace 112 are bonded by a thermosetting adhesive, and the total thickness of the flexible circuit board 110 is preferably 0.3mm or less, for example 0.1 mm. Specifically, a flexible circuit board 110 with the size of 130mm × 50mm can be selected, the LED chips are uniformly arranged on the flexible circuit board 110 at equal intervals in a 20-8-string manner, the line width of a conductive circuit among the LEDs is designed to be 0.15mm, a driving terminal is reserved, the conductive circuit is a conductive copper foil, the conductive copper foil is bonded on the upper surface of the flexible substrate through a thermosetting adhesive, and a strip-shaped structure is formed through etching; and coating a white solder mask layer on the area, which is not the LED welding point, of the conductive circuit, and performing oxidation resistance treatment on the surface of a pad area which is about to be used for mounting the LED chip by adopting OSP (organic solderability preservative).
Secondly, mounting the LED chip 120
Firstly, an LED flip chip 120 is provided, the LED chip is a strip blue chip, the size of the chip is 0.5mm multiplied by 0.15mm, the size of a PN electrode is 0.2mm multiplied by 0.1mm, and the light-emitting wavelength is 425 mm-480 nm. In other embodiments, the LED chip 120 can emit light in other wavelength bands, such as ultraviolet, violet, green, yellow, red, or infrared light.
Next, the LED chip is mounted on the circuit board 110. Specifically, the solder paste is placed on the corresponding pad 113 of the flexible circuit board 110 by silk-screen printing; selecting a chip mounter with the stroke precision of 0.5 mu m, placing the flexible circuit board 110 on a machine table clamp, and adsorbing the LED core 120 on the corresponding solder paste of the flexible circuit board through a suction nozzle and a swing arm of the chip mounter; the flexible circuit board is arranged in a reflow soldering furnace for heating and curing, and the LED chips are soldered in the corresponding area of the circuit board 110 by using the surface tension of the solder paste and are stably connected with other LED chips.
Thirdly, manufacturing the packaging layer 130
Firstly, a square pressing mould is arranged, the size of the square pressing mould is slightly larger than that of the flexible circuit board 110, the circuit board can be integrally wrapped, the thickness of the square pressing mould is the size of the pressing colloid 130, meanwhile, in order to ensure that the liquid silica gel has a telescopic overflow space, glue overflow grooves are formed in the periphery of the pressing mould, and the inner surface of the pressing mould is provided with a high-temperature release film through vacuum adsorption. The size of the pressing mold in this embodiment is 132mm × 52mm, and the thickness is 0.3 mm.
Next, a liquid silicone gel was prepared. Preferably, the liquid silicone rubber is added with a proper amount of titanium dioxide diffusion powder to form a milk white body, and a mixture of the silicone rubber is prepared and defoamed according to the requirements of brightness and uniform brightness of the surface light source. In this example, 2% titanium dioxide dispersion powder was added to the silicone gum.
Then, press molding was performed. Specifically, the prepared glue is poured into a release film, the flat plate adhered with the flexible circuit board 110 is placed on an upper die of a pressing die through vacuum adsorption, the die is closed, vacuum is released and heated to 120-150 ℃, the die is opened after about 6 minutes, the organic silicon adhesive is cured and completely wraps the flexible circuit board, and the driving terminal is taken out.
Example 2
The embodiment discloses an equipment that is used for icterus neonatorum blue light to shine treatment, this equipment include at least one flexible LED area light source and external power supply, and this flexible LED area light source passes through the contact pin and connects external power supply. The equipment can be arranged on the inner surface of infant clothes, for example, a pocket for placing the LED surface light source can be arranged on the inner surface of the clothes, the pocket is made of cotton cloth or environment-friendly fabric with good soft light transmission, and the LED surface light source is placed in the pocket.
The LED area light source adopts the structure of embodiment 1, the driving current is 0.5mA, and the emission wavelength is 425-480 nm. And traditional icterus neonatorum blue light shines treatment facility contrast, this embodiment LED area light source adopts the drive of multicore piece low current, and its holistic low, the soft even of light that generate heat can directly set up in neonatal's clothes internal surface, closely shines infant's skin. Simultaneously this LED area light source is not integrative with the clothes, can set up the pocket of cloth as required in the inboard of clothes can, when needs carry out the blue light and shine the treatment, place this equipment in the inboard pocket of clothes again.
Example 3
The embodiment discloses a physiotherapy health-care device. The physiotherapy health-care equipment comprises at least one flexible LED surface light source and an external power supply, wherein the flexible LED surface light source can be connected with the external power supply through a contact pin. The difference from example 2 is: the flexible LED surface light source of this embodiment emits red light, and the flexible LED surface light source can be fixed to different portions of the inner surface of the garment body 200 by sewing, as shown in fig. 6. Different parts of the garment body comprise a head part, a neck part, shoulder parts, a cervical vertebra part, a waist part and a back part, namely, the flexible LED area light source in the embodiment can be arranged on a plurality of parts of the garment body, so that red light irradiation is carried out on different parts of the body of a user at the same time, and the irradiation area is large. More preferably, the flexible red LED lighting strip is specifically disposed on the neck, shoulder, cervical vertebra and back of the garment body, which are prone to strain.
In a modified embodiment, the flexible LED surface light source can be detachably fixed to different parts of the inner surface of the garment body 200 through a hook and loop fastener, so that the flexible LED surface light source is convenient to assemble and disassemble, and can be replaced and cleaned at any time.
Example 4
The present embodiment discloses a display device. The device comprises at least one flexible LED area light source and a driving power supply. The flexible LED surface light source adopts the structure of embodiment 1, and comprises three chips, namely a blue LED chip, a green LED chip and a red LED chip, wherein the distance between every two LED chips is less than 1mm, for example, the distance can be 0.1-0.8 mm, or less than 0.1 mm. The back of the flexible LED surface light source can be pasted with a black protective film, and the black protective film is beneficial to improving the contrast of the display panel. In a variant, it is also possible to add a black colorant to the encapsulation layer.
In this embodiment, the encapsulation layer of LED area source adopts the mould pressing to take shape, has good planarization (the roughness is within 0.1mm, reaches below 0.05mm according to the demand), and the light-emitting is even and can fold wantonly, and thickness is thin, and length and width size can splice, uses in a flexible way.
As described above, the present invention is specifically explained based on the embodiments with reference to the drawings, but the embodiments are only explained as the preferred examples of the present invention, and thus it should not be understood that the present invention is limited to the embodiments, and the technical solution of the present invention and the equivalent concept thereof should be understood.
Claims (27)
1. A flexible LED area light source comprising:
the flexible circuit board is provided with a conducting circuit on the upper surface, and a plurality of LED welding points are arranged on the conducting circuit;
the flip LED chip array is arranged on the flexible circuit board through the plurality of LED welding points and is electrically connected through the conductive circuit;
and the packaging layer is formed by pressing a liquid rubber material through a die, and covers the front surface of the conductive circuit and the LED chip.
2. A flexible LED area light source as defined in claim 1, wherein: the thickness of the packaging layer is less than 0.7mm, and the flatness of the upper surface of the packaging layer is within 0.1 mm.
3. A flexible LED area light source as defined in claim 1, wherein: the hardness of the packaging layer after curing is above Shore D50.
4. A flexible LED area light source as defined in claim 2, wherein: the thickness of the packaging layer is 0.3-0.5 mm.
5. A flexible LED area light source as defined in claim 1, wherein: the driving current of the LED chip is less than or equal to 8 mA.
6. A flexible LED area light source as defined in claim 1, wherein: the power of the LED chip is below 50 milliwatts.
7. A flexible LED area light source as defined in claim 1, wherein: the LED chip comprises a substrate, a light emitting layer, an N electrode and a P electrode, and light of the LED chip is taken out from the substrate of the chip.
8. A flexible LED area light source as defined in claim 7, wherein: the distance between the N electrode and the P electrode is more than or equal to 0.1 mm.
9. A flexible LED area light source as defined in claim 1, wherein: the LED chip is a strip-shaped small-size chip, and the length of the chip is less than or equal to 0.5 mm; the width is less than or equal to 0.15 mm.
10. A flexible LED area light source as defined in claim 1, wherein: and a protective film is pasted on the back surface of the flexible circuit board, and the thickness of the protective film is less than or 0.05 mm.
11. A flexible LED area light source as defined in claim 1, wherein: the thickness of the flexible circuit board is less than or equal to 0.1 mm.
12. A flexible LED area light source as defined in claim 1, wherein: the line width of the conducting circuit is 0.1-0.5 mm.
13. A flexible LED area light source as defined in claim 1, wherein: the conductive circuit is formed into a strip shape by etching.
14. A flexible LED area light source as defined in claim 1, wherein: and a white solder mask is coated on a non-LED welding point of the conducting circuit.
15. A flexible LED area light source as defined in claim 1, wherein: the surface illumination of the flexible LED surface light source is 400-600 lx.
16. The manufacturing method of the flexible LED area light source comprises the following steps:
providing a flexible circuit board, wherein a conducting circuit is arranged on the upper surface of the flexible circuit board, and a plurality of LED welding points are arranged on the conducting circuit;
mounting the flip LED chip array on a plurality of LED welding points of the flexible circuit board, and realizing electrical connection through the conductive circuit;
and covering a packaging layer on the front surface of the conductive circuit and the LED chip array, and pressing and molding the packaging layer by adopting a liquid glue material through a mold.
17. A method of making a flexible LED area light source as claimed in claim 16, wherein: firstly, providing a flexible substrate, then adhering a conductive layer on the flexible substrate, then forming a strip-shaped conductive circuit by etching, and then arranging an LED chip welding point on the conductive circuit.
18. A method of making a flexible LED area light source as claimed in claim 17, wherein: and processing the surface of the welding point of the LED chip by adopting the OSP, and arranging a white solder mask layer in the area other than the LED welding point.
19. A method of making a flexible LED area light source as claimed in claim 16, wherein: the thickness of the packaging layer is less than 0.7mm, and the flatness of the upper surface of the packaging layer is within 0.1 mm.
20. A light emitting device comprising a power source and a flexible LED area light source, the flexible LED area light source comprising:
the flexible circuit board is provided with a conducting circuit on the upper surface, and a plurality of LED welding points are arranged on the conducting circuit;
the flip LED chip array is arranged on the flexible circuit board through the plurality of LED welding points and is electrically connected through the conductive circuit;
and the packaging layer is formed by pressing a liquid rubber material through a die, and covers the front surface of the conductive circuit and the LED chip.
21. The light emitting apparatus of claim 22, wherein: the light-emitting device is a device with a medical function, the flexible LED surface light source is arranged on the inner surface of the clothing material body, and when the flexible LED surface light source is powered on, the surface illumination is 400-600 lx.
22. The light emitting apparatus of claim 22, wherein: the flexible LED area light source emits blue light, red light, purple light, infrared light or a combination thereof.
23. The light emitting apparatus of claim 22, wherein: the light-emitting equipment is used for blue light treatment of infant jaundice, and the light-emitting wavelength of the flexible LED surface light source is 425-480 nm.
24. The light emitting apparatus of claim 22, wherein: the driving current of the LED chip is less than or 8mA, and the power of the LED chip is less than 50 milliwatts.
25. The light emitting apparatus of claim 22, wherein: the flexible LED surface light source is detachably arranged on the inner surface of the clothing body.
26. The light emitting apparatus of claim 21, wherein: and a white protective film is pasted on the back surface of the flexible circuit board and reflects light emitted to the side surface or the bottom of the LED chip to enable the light to be reflected out from the front surface.
27. The light emitting apparatus of claim 21, wherein: the flexible LED surface light source comprises a red light LED chip, a blue light LED chip and a green light LED chip, and the flatness of the upper surface of the packaging layer is within 0.1 mm.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/079337 WO2020191546A1 (en) | 2019-03-22 | 2019-03-22 | Flexible led surface light source and manufacturing method therefor, and light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111095580A true CN111095580A (en) | 2020-05-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201980003937.5A Pending CN111095580A (en) | 2019-03-22 | 2019-03-22 | Flexible LED (light-emitting diode) surface light source, manufacturing method and light-emitting equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN111095580A (en) |
| WO (1) | WO2020191546A1 (en) |
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| WO2022036681A1 (en) * | 2020-08-21 | 2022-02-24 | 柯银湖 | Led light-emitting source device and manufacturing method therefor |
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| Publication number | Publication date |
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| WO2020191546A1 (en) | 2020-10-01 |
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