TW201123281A - Ultrasonic cleaning device, ultrasonic cleaning method, and recording medium that records computer program for executing the ultrasonic cleaning method - Google Patents

Abstract

This invention provides an ultrasonic cleaning device including a cleaning tank for storing cleaning liquid; a processed article holding device that can be inserted into the cleaning tank, and hold the processed article for immersing the processed article in the cleaning liquid; a vibrator provided at the bottom portion of the cleaning tank; and an ultrasonic oscillator that makes the vibrator generate ultrasonic vibration. In the cleaning tank is provided a lateral holding member for holding the processed article. Besides, the processed article holding device can be moved sideward by a driving device. A control device controls the driving device to move the processed article holding device sideward after the processed article is held by the lateral holding member, and meanwhile makes the vibrator generate ultrasonic vibration and propagates the ultrasonic vibration generated by the vibrator to the processed article.

Description

201123281 VI. Description of the invention: [Related application of cross-reference] • Double-based application of Japanese patent Shen Zhidi 2009-231668, filed on January 5, 2009, and 2_year, March 25, 2nd The Yizheng No. 6 case claims priority, and cites the entire Chinese patents of the Japanese patents. [Technical field of the invention] The recording medium of the computer program of the cleaning method of the object cleaning. The heart is used to slap the ultrasonic wave. [Prior Art] When the object to be treated is cleaned by a glass and ultrasonic cleaning device, the object to be treated is immersed in a conventional ultrasonic cleaning device to immerse the semiconductor and the semiconductor body. To the liquid granules stored in the washing tank. In this way, the object to be processed is ultrasonically cleaned. SUMMARY OF THE INVENTION When the ΐί sound wave cleaning device ultrasonically cleans the object to be processed, it is ‘guarantee=. Therefore, the ultrasonic vibration irradiated from below is covered by the holding rod of the wafer boat, and the ultrasonic vibration is transmitted to the machine. Therefore, the invention has the 201123281 shape cut region. The present invention has been made in view of the above, and an object of the present invention is to provide an ultrasonic cleaning device capable of providing a method for processing, = ', and soil-based, including:, main; J, f 2 vibrator produces ultrasonic vibration;; the future will exceed her " mi #上料1解対超超H wash device towel can be as follows: the current side neighborhood retaining device accepts and holds the quilt;; = body retention The device moves from the holding position 3 of the object to be processed to the side position on the side of the holding position, and the control device is handed over to the side holding member. The frequency is simply n-field. At this time, the area m holding device that is dipped in the cleaning liquid in the cleaning tank is moved from the holding position to the side position, and the body holding device holds the area. Therefore, the moving body is replaced by the object to be processed, and the object to be processed can be placed in the same manner as the body to be processed. ^ Temple is only sound wave cleaning equipment _ Again, the above! The approximate symmetrical way The control of the ultrasonic vibration device and the movement may also be as follows: the control is moved from the holding position _ located in the (four), the green object is held in the lowered position to the side position, and the fif device is moved from the The first enchanting sorcerer 4 vibrator generates ultrasonic vibration. The device controls the ultrasonic oscillating device f as follows: the control lowers the position from the side orientation so that the swaying position is kept moving. The apparatus for generating the ultrasonic vibration holding member of the vibrator may also be as follows: the object to be treated (4) of the side body is retracted from the position and retracted from the side of the side body: The ultrasonic cleaning device that is held in the second type can also be as follows: the processing body/the successful holding portion of the ultrasonic cleaning device that abuts the solution of the processed holding member can also be as follows: the side adjacent holding device accepts and holds The object to be processed is located in the holding: the holding device is moved from the holding position of the object to be processed, and the m:? is the button body, and the control device controls the ultrasonic wave to be handed over to the side portion. The processing body holding portion is moved from the holding position When the position of the square shifts to 201123281, the vibrator is generated to the supersonic wave to the side of the side of the side: the processed part of the victim is:=======—the side is affected by this side The position of the object is propagated to the body of the object to be processed, and the object is kept as follows: Therefore, the object to be processed can be loaded as follows: the body to be treated is protected, and the object to be processed is Keep the first place! The first! In the holding position, the first holding position is moved to the holding portion, and the second holding object is held in the second side of the second processed object position from the first position of the object to be processed. The side holding member drives the farm, in the first! After the object holding portion holds the holding portion, the second holding position is controlled, and the super-vibration is controlled: the first object to be processed holding portion is located at the second position, at least in the object to be processed The second vibration is generated by the holding portion at the second lateral position, and the ultrasonic vibration from the vibrator is transmitted to generate the ultrasonic wave, the first object to be processed body and the second body. : the object to be processed portion is processed, 201123281, the second holding position, and the position, and at least when the physical body holding portion is located at the i-th side control device, the vibrating sub-portion is located at the second lateral position, the sound wave The vibration propagates into the object to be processed and is subjected to the ft to maintain the super-resonance from the vibrator. _ heart ===: cleaning tank, storage cleaning supersonic = device, including: let the frequency be transferred to #jn 子子Cut acoustic wave; crane device, wave oscillating device and the driving device 2, 2 and control device 'control the supersonic part === is set in the vertical axis with the U-holding rod phase, 2^ the body center In the second, the second object to be processed, which is placed on the scale of the fresh body, the second object is protected. And a processing unit for controlling the holder driving means enabling the body to be in, the control means oscillating means enabling the transducer movement 'and controlling the vibration transmission to the ultrasonic sound waves to be processed. . The chopper vibration 'and controls the ultrasonic device from the vibrator to control the sonic cleaning device as follows: after the control, the body is immersed in the cleaning liquid in the cleaning tank, and moved to the present position = Hold # hold the first side position of the first holding position of the first holding position of the object to be processed, and then return to the position of the second holding position of the 亥 ^ * 2011 2011 2011 , , , The second object to be processed holding unit holds the processed position, and then returns to the second side of the holding position of the second holding unit to hold the ship ultrasonic wave device at least in the first object to be processed. When the second object to be processed is held at the side position of the portion 1 and at least in the ultrasonic wave, and the position from the side of the 袒2f is obtained, the first object is received by the vibrator. The acoustic vibration 'propagates' to the area being treated. The object to be processed and the second to-be-processed body holding unit may be provided with the processed body and the ultra-m wire. The first one of the first holding member and the third holding member may be provided with the third holding bar. , the second holding stick scales should be ^. Between the first holding bar and the first co-protecting bar, and the first holding body wave cleaning device may be as follows: the first holding bar is provided with a V-shaped shape In the second holding rod and the third-shaped cross-section, the first object to be processed and the first holding rod of the object to be processed are provided with a Y-shaped groove in which the Y-shaped groove 5 receives the body to be processed. section. #槽听有可可可可在此处理设置控制 The ϋ ϋ 归 归 归 归 归 归 归 T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T T The intermediate holding portion is placed at the second lowered position of the second holding position. When moving between the sets, the ultrasonic oscillation can be controlled by the device located below the second holding position as follows: the control down position and the first! The side obstacle retaining portion moves the first holding portion between the second lowering position and the &=, and the second processed object vibrator generates ultrasonic vibration: 'The third solution of this turn is provided - _ sonic cleaning method, the package 201123281 will be held by the 31 body holding device and immersed, and the Ί 允 允 允 保持 保持 冼 冼 冼; The supersonic n-washing (4) of the side holding structure (4) can be as follows: the member is moved sideways by the holding device, and the body is touched by the processing body. This is less in the area where the side position of the holding position is processed. At this time, the body L to be processed which is immersed in the main body to be held by the body to be held by the body is held in February, and is subjected to the body to be processed, and is processed. The side retaining body retaining means in the monthly washing tank is located at a side position, at least in the object to be treated which is placed at the side to be maintained: the vibration is propagated to the object to be processed and uniformly ultrasonically cleaned by the entire area. Therefore, the body to be treated can be held as follows: the object to be treated can hold the object to be processed individually, and the body to be treated is washed The method may also be as follows: in pairs, in the third solution, the limbs are moved in a tree-symmetrical manner. The object holding device moves to the side in the H. The month may be as follows: During the movement of the processing body holding device below the simple position i from the lowering position to the simple _#down position, and then moving from the lower side to the side position, the turbulent t-production body==4 set=hai. 201123281 The method to be processed can also be as follows: the step of placing the object holding device from the lateral position is further included to cause the ultrasonic vibration of the § hai vibrator. During the cattle position, the side portion is also maintained. The washing method may also be as follows: in addition to the object to be treated, the third: the (10) 'heart holding member' is paired: the clip, the square 3 may also be as follows: the side body is in The side holding member keeps the position of the holder = abutting the pair of holding portions When the breaking treatment body holding portion is located at the lateral position, the vibration of the object is received by the object to be processed by the object to be processed: ί:=ί 梦 番 & 2 & In the middle of the body, it is only treated as a static body. The side holding member of the washing tank is vibrated by ultrasonic vibration. Thereby, the x-zone x domain from the vibrator can be specifically smashed; ί?: it is protected by the object-retaining body holding portion of the one side. Therefore, the entire region of the object to be processed is uniformly ultrasonically cleaned. . The ultrasonic cleaning method of the above-mentioned third solution is as follows: 12 201123281 The fifth part C holds the second part of the side portion: the side position, and then returns to the side of the second side 2 holding position. The second == and the area to be held at least in the position of the second object to be processed. At this time, the cleaning position of the second side is moved from the second holding position to the area where the entire area of the object to be processed can be uniformly super-cleared = ^°. Therefore, the ultrasonic cleaning method is provided by the following method, which includes the first object to be processed holding unit and the liquid to be placed in the second object to be processed; and the object to be processed is impregnated into the cleaning tank. Cleaning the body holding portion to the side ^: at the portion, so that the ultrasonic wave is vibrated, and the vibrator at the bottom of the washing machine is generated, and the ultrasonic cleaning of the fourth solution is performed. The method may also be as follows: further includes 201123281. The following steps are performed: after the step of the i-th processed object is held in the i-th processed object = the move is moved, the body is moved. The second object to be processed holding unit is held by the first object to be processed Ι ί ί 波 f : : : : f f f f f f f f f f f f f f f f f f f f f f f f f f f 第 f f 第 f 第 第 第 第In the step of moving the phase 1 holding position side body holding portion, the holding position 'in the second holding position of the second object to be processed is changed, and the body holding portion is held from the processed position. Then, returning to the side of the second side of the second position of the second jersey 2, the cleaning method can also be as follows: When the position of the ultrasonic wave from the vibrator is at the position of the second object, the holding portion and the second portion are moved by the _° first object to be processed holding portion of the fourth solution. The skin is as follows: The step of moving the holding portion that is located below the second holding position at the first lowering position of the side is as follows: · Ultrasonic The first embodiment of the present invention provides an ultrasonic cleaning process during the movement between the lateral positions, the lowering position of the I1, and the body holding portion between the lowered position and the second lateral position. In the computer program of the method, the holding device for holding the cleaning liquid held in the cleaning tank in the cleaning chamber is moved to the side; the holding member, the object to be processed = the object to be processed Supersonic: Clear = bottom == The steps of generating the side movement of the ultrasonic wave and the step of ultrasonic cleaning are performed after the step of holding the object to be processed in 14 201123281 - Providing a recording medium and recording in the solution It is useful to be immersed in the cleaning tank by the treated body. The washing liquid is placed on the side 3, and the body holding portion is held, and the first object to be processed is held, and the ultrasonic body vibrating body is generated by the bottom body of the body, and the object to be processed is held on the side. After the holding member is held, the processed object 2 is uniformly ultrasonically cleaned in the entire region of the object to be processed. [Embodiment] (First Embodiment) The first day of the day, the forest hair (four) 1 is returned to the state. Fig. 1 to Fig. 14 Record the useful ultrasonic cleaning device, ultrasonic cleaning method, and record the memory of the ultra-g wave cleaning green and shouting. ^ 'Hunting from Figure 1 illustrates the ultrasonic cleaning device i: 1 , storage cleaning insert, raw ίf, UA wafer boat (being ruined) 2G, set to have U sub-cleaning tank 1G bottom plate (bottom) 14 outside the 4;: r40 connected with ultrasonic vibration Following "to make the vibrator J 眚 10 10 10 10 10 10 10 10 10 10 « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « « From the wall 11 to the top of FIG. 3, the cleaning tank 10 has four side walls 11 and is closely adhered to the air and water in a gas-tight and water-tight manner by means of the fixing mat 12 on each side. 13 and a fixed bottom plate 14, the stroke is approximately rectangular. And the middle side 15 201123281 The upper end of the wall 11 is formed with a groove 15 which reaches the level of the cleaning liquid so that the cleaning liquid flows out of the washing tank 10. At the upper end of the soil 1, the side wall 11 of the washing tank 10 is formed of a highly resistant chemical-resistant vinyl chloride (PTFE) or fluororesin (PFA). Further, the bottom plate is made of, for example, an anti-drug property and a sound-penetrating material such as amorphous carbon or a carbonized material. Therefore, even if the aqueous solution of ammonia aqueous hydrogen peroxide, the genus, or the diluted hydrofluoric acid described later is used as the chemical liquid, the aqueous solution of the side wall 1 of the cleaning tank 1G is resistant to chemicals. Therefore, it is possible to prevent the side wall u and the bottom plate 14 from being subjected to the production of the material and the material of the bottom plate 14 because of the permeability as described above, so that the ultrasonic vibration generated by the vibrator 4 确实 can surely have the chopping wave cleaning groove. 10 is housed in the container 16. The bottom of the container 16 is recovered from the groove j liquid formed at the upper end of the side wall „ of the cleaning tank 1G. This recovery tray is provided with a drain (not shown) to turn back and return. As shown in FIG. 2 and FIG. 5, the wafer boat 2's and the f-parts (subjects to be processed) 21a and 21b hold L (for example, the holding base portions 22a and 22b are connected to the respective wafer holding portions 21γ and 3, respectively. , extending in the vertical direction, wherein the pair of wafer holding portions 2la = ; b = the vertical direction axis only refers to FIG. 6 to the figure, approximately the pair = 24b, 'the long-term holding rod 3 231) the front end of the connecting member Shi, Bao = 23a t / the base end is connected to the base melon, orphan, each, the knife does not open; the child can be freely engaged in the wafer W 4 · thick; Mr animal and ^ 'each holding groove仏, 25b, having approximately the same shape 曰Ϊ circle W is engaged with such a retaining groove 25a, wish, because w is maintained in a direction approximately orthogonal to the retaining bars 23a, 23b, that is, the vertical round 2 'Using high-resistance quartz to form, and gas Gu Long (registered trademark) money film or Sic (carbonized stone shi) mineral film. The day and night boat 20 miscellaneous drive device 26 to lift and drive the wafer boat 2 〇. 16 201123281. The driving farm 26 has: the lifting and lowering drive units 27a and 27b are respectively raised and lowered, 21b; and the lifting/lowering driving force transmitting portion 28a, the moving portion, the driving portions 27a and 27b, and the base portions 22a and 22b. The driving force of the lifting/lowering voltage 27b is transmitted, and the lifting/lowering force transmitting portions 28a and 2 are connected to the base portion 22a and the coffee chamber. Thus, each of the wafers is configured to be individually connected to each other. Free movement (free lifting). Further, the positional relationship of each of the wafer holding portions 21 & 211 can be adjusted by the moving portions 27 & 2713 '. - The respective lifting and lowering driving portions 27a and 27b are connected to the control device 44. The control device 44 broadcasts and drives the respective lift driving units 27a and 27b. Thus, the lift drive 27b causes the wafer holding portions 21&, 2 to be lowered to insert the wafer W into the cleaning tank in accordance with a control signal from the control unit 44. 10 is immersed in the cleaning liquid, or the crystal portions 21a and 21b are raised to carry the wafer W out of the cleaning tank 1 ”. Further, the wafer boat 20 is in the cleaning tank by the driving device 26 Hold position of W (hand over the wafer w to the position of the wash arm 5〇 described later) : This holding position between a lowered position slightly below the 'roughly in the vertical direction by the lift from =). That is, in accordance with the control signal from the control device 44, the portions 21a, 21b are held in the holding position and the lowered position by the elevation driving portions 27a, 27b, and the wafer boat 20 is also at the lowered position and at the side of the descending position. The lateral positions are freely moved in the approximate horizontal direction, and the wafers 21a and 21b are also freely movable individually in the approximate horizontal direction. In addition, Ben Mingkui is a "side" and does not strictly mean a horizontal direction. For example, in the wafer w, the ultrasonic vibration transmitted from the vibrator 40 by the cadaver holding portions 20a and 20b is shielded by the crystal portion 20b. The regional bit noise can propagate the ultrasonic vibration to the test, and can also refer to the direction that is inclined with respect to the horizontal direction. n ° ° squeaking Connected to the drive unit 26 of the wafer boat 20, the wafer boat 2 is placed at the side of the lowering position (five). In other words, the drive unit 26 has a front side drive for moving the wafer holding units 21a and 21b at the lowering position and the side position, and the side driving force transmitting units 31a and 31b are respectively connected to the The lateral movements of the movable portions 30a and 30b are transmitted between the lateral movement units 30a and 30b and the elevation driving force transmission unit and the spring 28a. A control device 44 is connected to the spear-moving drive unit. Thus, the side = wafer security ===: motion two; the direction axis Y moves in an approximately symmetrical manner.至 and as shown in FIG. 6 to FIG. 14, the washing tank 1G is provided with a washing arm (the side portion can be rounded and received by the wafer w. The washing arm 50 is retracted from the washing tank 10 to keep it rounded. The position, and the waters that detached from and retreat from the wafer trade, are moved in an approximately horizontal direction. That is, the wash arm 50 has a pair of wafers that are held on the wafer boat 20 The two sides are abutted against the wafer W. Each of the clamping portions 51 includes: two abutting rods 52, a $tr surface; and a connecting member 53 that connects the respective abutting rods 2. Each of the clips 2 The two abutting bars 52 of the crucible 51 are arranged so as to be read by the horizontal direction of the center of the wafer w to FIG. 14), and the ultrasonic vibration propagating below the wafer t 5 W is subjected to each clip. The domain is maintained, and the entire area of the wafer W can be uniformly ultrasonically cleaned. The scoop area ^ 匕 = each part of the bar arm 50 is formed by high chemical resistance and the same as the wafer boat 2, and the surface is respectively coated with a Teflon coating or a Sic coating. Each of the nip portions 51 is connected to the arm holding portion (not shown) so that the nip portions 51 are interlocked between the accommodating/retracting positions, and the arm driving unit is connected to the control device 44. In this manner, the moving portion causes the respective clamping portions 5 to be forked between the position and the retracted position in accordance with a control signal from the control device 44. The cleaning liquid supply device 60 has two cleaning liquid supply nozzles 61 disposed along it. Each of the cleaning liquid supply nozzles 61 includes a tube extending in a substantially horizontal direction in accordance with 11; a plurality of first, first, and second nozzle holes 61c' are formed in the tubular nozzle body 61a, and are spaced apart at appropriate intervals. Arranged in the side direction. Among them, the i-th nozzle hole ejects the cleaning liquid toward the w-side, and the second nozzle hole 61e faces the bottom plate of the cleaning tank 1G. The cleaning liquid supply nozzle 61 is connected to the pure water supply source 65 via the pure water supply pipe 64 via the cleaning liquid supply pipe 62, and is connected to the chemical supply source 65 via the pure water supply pipe 64. Slot) 67. The switching valve 63 > monthly washing, i is supplied to the supply pipe of the pipe 62 (pure water supply pipe 64 or chemical liquid supply pipe 66). Shishui, the pipe 64 has a history of opening and closing valve 68 to adjust the pure ^ ^ ^ ° open + closed valve 68 through the pure water supply pipe 64 is connected to the control device 44, the control device 44 by opening and closing Γ - 2 | 攸 pure The water supply source 65 is supplied to the pure water of the washing tank ίο. The sputum liquid ^ supply ^! / 7 is provided with a liquid medicine chest 69 to supply the chemical liquid to the washing tank 10. This ίί; 67 tXT!^4,mmE 44 69 and the use of gas water Λ Λ music supply. Here, the chemical solution is used for the purpose of cleaning, and the hydrochloric acid is mixed with j _ blue 2 〇 2 _, acid (DHF) and the like. _. For the bottle 2〇2沮2〇) ’ or dilute the hydrogen fluoride device ί if heavy f liquid ί69 ’ and in the liquid tank 67 according to the control

The liquid tank 67 of the it X valve 63 is not limited to one, and a chemical solution of the type 1 =::::= may be supplied to the cleaning unit 8 to discharge the cleaning liquid. Each row is provided with two discharge valve machines on the outer surface of the bottom plate 14; the valve body 82 /, the abutted portion 81, the mounting joint portion 81, and the steam red device 84 are freely abutted against the abutted portion 81 and the bottom plate μ penetrates the piston rod 83 of the valve body 82. It is abutted and corrected, and the steaming device controls 82. In addition, the liquid discharge port 85 is provided with a control signal for the 44 to drive the valve body to clean (4) the bottom plate of the bottom portion; By the discharge valve mechanism 80, the liquid discharge port 85 in the present embodiment is not disposed at the position where the vibrator can be mounted, and the wafer W is surely cleaned. Further, the discharge shape of the cleaning tank 10 may be any shape such as a dome shape.

The number of rows _ scales 8 封 is 2 secrets, or W 19 201123281 or more. As shown in Figs. 1 and 2, the vibrator of the cleaning tank 10 ==i〇·r r is the outer surface acoustic wave device 42. In addition, the vibration of the cleaning tank 1 41 单体 丄 丄 单体 单体 单体 单体 丄 丄 丄 丄 ϋ Η Η Η Η Η Η Η , , , , , , , , , , , , , , , , , , , , , , , , 1 The surface power supply unit 43 is connected to supply electric power. Further, the setting = device 44, the ultrasonic vibrating unit 42 transmits the 驱动 frequency driving power (drive signal) to the vibrator 4 in accordance with the control m 〇. And the control device 44 moves the wafer goods from the wafer boat, the round holding portion 21a, and the bird from the holding device to the lower position of the falling position. The ultrasonic vibration of the rounded vibrator 40 is propagated to the crystal to propagate uniformly to the crystal 1]W, "1. After the ultrasonic vibration cleaning is completed, the wafer holding portions 21a, flb ^ 曰曰, the position, the wafer W is handed over from the cleaning arm 50 to the wafer boat 2 and the moving position to the maintenance mode, the control device 44 contains the computer, and the circle == first _ 45 _ wave cleaning The g crystal is the action of the present embodiment of the present configuration, and is also ri0 (first step). At this time, first, pure water is turned on from the pure water supply source 65 = f = the control signal of the device 44, 61. The switching valve 63 receives; = 奂::, and the supply to the cleaning liquid supply nozzle passes to the cleaning liquid supply i 62 to the control device 44 to control the pure water supply pipe 64 to 20 201123281 after supplying pure water 'chemical liquid The pump 69 accepts the whitening =, and the liquid medicine 67 is controlled by the control device 44 via the switching "^: the concave of the upper end of the medicine = 1 slot. Out of U6 outside. Thereafter, the drug solution is supplied from the chemical solution tank 67, and the cleaning liquid in the cleaning tank 10 is collapsed (the second step). In this way, the wafer holding portions 21a and 2b are held (the sorrows, the protections 25a, 25b, and 27b are received from the control | f (: two). The person, the lifting drive unit 27a,

The wafer holding portion 21 is driven by two lbs of reduction, and the wafer W is held. At this time, the crystal holding (4) a, the training is not maintained, and the wafer boat 20 is first handed over to the washing arm 5G (third step). Each of the clamping portions 51 is driven from a control signal that is retracted from the control device 44. The side surface 2 is set to 1 =: set to be in the protection circle w. 50. At this time, the position of the wafer holding portion 仏, the training maintaining the lifting/lowering driving unit 曰2Hbn, and the position of the circle w (the fourth step) is lowered. That is, the wafer holding portion 21a is separated from the wafer w by the control drive signal for controlling the mounting of the blade. This Japanese, ^ Figure 9 Mai Zhao). This is the lowering position of the wafer holding portion 2la. $ '曰曰 round holding portions 21a, 21b are located below the holding position step), and the Ϊ time crystal continuously moves between the falling position and the side position (the fifth side private driving portions 30a, 30b receive the control device ^ 21 201123281 is driven by the control signal, and the wafer holding portions 21a and 21b are moved in a substantially symmetrical manner across the wafer w center holding portion 21a in the left direction in the left direction in FIG. The wafer 21b is moved in the right direction, and the wafer holding portions 21a and 2 are the wafer holding portions 1). Thereafter, the wafer on the left side (fourth) side is moved and moved to the other side of the wafer holding portion 2 in the right direction, and the circular holding portions 21a and 21b are returned to the lowered position (refer to Fig.: The direction is moved, and the crystals 21a, 2lb are held between the lowered position and the lateral position by about 7 days laj.卩21a, 21b return to the lowered position. The other is that the number of reciprocations between the falling position and the side position is not "=; 21b the wafer boat 20 is in the falling position and the financial position ^ is multiple times. Ultrasonic vibration ^1 1 shifting ultrasonic vibration and ultrasonic cleaning wafer w. As in the holding position;: set and = = = solidly prevent the wafer holding portions 21a, 21b from moving in the next two. Hunt this, It is possible to surely contact the wafer W. The movement period between the side positions of the crucible, etc. This period of liquid is such that 'the particles attached to the wafer w are removed, and the tf liquid is supplied to the cleaning tank 10. The particles from the wafer 10 can be maintained in a clean state from the cleaning tank with the overflowing cleaning liquid, and the ultrasonic cleaning process of the round wlilt81 w can be improved. Crystal (Step 7). At this time, the liquid fruit 69 is first stopped, and the supply of the liquid to the cutting door is prevented. Next, the control split 44 opens the opening and closing valve 68 and causes the switching valve 63 to operate, and the pure water is purified from pure water. The supply source 65 is supplied to the cleaning tank 1〇. Thereafter, 22 201123281 is the same as the sixth step described above, and the person is twisted and propagated to the clear 7. The sub-40 generates ultrasonic vibration and the ultrasonic vibration is 9 steps. At this time, it is first handed over to the wafer boat 20 (the 8th step and the first control signal are synchronously driven, and f 27a, 27b are controlled from the control). The device 44 is held in place by the holding bars 23a, 23b, and 21b, and the wafer w is in a batch (the eighth step, the image holding portion 21a, 25b* is held in the wafer holding portion 21a, the wafer boat 20. At this time, the wafer ): at 2°, the wafer W is transferred from the brace arm 50 to the position. The round holding portion 21a is held in the holding nip 5 St portion of the holding wafer W, and the control signal of 44 is set. At this time, the wafer holding portions 21a and 21b are maintained next, and the wafer is immersed in the cleaning liquid. At this time, the lifting/lowering driving unit 27a, the round two: the washing tank 10 is carried out. (The first step is synchronously driven to maintain the roundness of the wafer W, and the control circle of the device 44 is raised, and the sunday holding portions 21a and 21b of the main body and the soil 4* ι.λ ία rise. The spleen is shown in the image of the moving machine. After that, the wafer % is transferred from the wafer boat 20 to the 超 超 超 由 由 由 由 由 由 由 由 由 由 由 由 由 由 由The circle W according to the figure washing = the central white washing liquid is replaced according to necessity. At this time, first, the cylinder device 84 of 80 causes the valve control signal to drive the discharge valve mechanism to discharge the cleaning liquid, and then drive the steam for 1 day. The cleaning liquid in the device ^1G. At 81, the abutting portion 81 abuts the (five) body 82 of the valve body 82 in the first step of the abutting portion, and the washing water is double-tight. The liquid is transferred to the cleaning tank (1) _ 5Qb W from the wafer holding portion 21a H10 in the wafer holding portion 21a H10, and the holding unit 23a and 21b are held from the holding unit 23 201123281

The position is moved to the lowered position and the apricot wafer holding portions 21a, 21b are moved between the lowered position and the side position between the lowered position and the side position: = The device 44 causes the vibrator 4 to generate ultrasonic vibration. Therefore, the ultrasonic vibration from B propagates to the wafer W and is subjected to the wafer holding portion = ? region (shadowed _, and the ultrasonic vibration is equal to two regions. Therefore, the wafer W can be uniformly over the entire region. In addition, according to the present embodiment, the vertical axis of the center of the wafer holding portions 21a and 21b, and the line γ, are arranged in a substantially symmetrical manner between the position and the lateral position. In the vertical direction, the axis γ is moved approximately symmetrically. In this case, the wafer w can be shortened from the wafer boat 20 to the circle of the formula i, and the distance is reduced (the holding position and the falling position k are t-shaped. In the present embodiment, an example in which the crystal itrif position of the wafer boat 20 is continuously moved is described. However, it is not limited to the side of the wafer, and the crystallization is stopped. Arrival: ? Circle = self-vibration 4 in the ultrasonic vibration propagation. The upper portion of the training is held and the ultrasonic vibration is uniform I; and the control device 44 makes the 2 = limit to the lateral position as described above. At the time of the time, the ultrasonic vibration can be generated only by the vibrator 4 during the period of Na and ==. ^方^字^曰圆 W is handed over from the wafer boat 2 to the washing arm 5〇^] 21b can be moved from the lowered position to the side position, and at least 2la, in the lateral position, the vibrator 40 is even _ Keeping the area where the m training 21a, 21b is maintained 'and transmitting the ultrasonic vibration uniformly and broadcasting 24 201123281. Further, in the present embodiment, the continuous movement between the wafer holding portion 21 & 2 ratio and the lateral position is described. In the meantime, the control device 44 oscillates the vibrator 4U sound wave. However, the present invention is not limited thereto, and the ultrasonic wave 2 wafer holding portion 2la may be generated only by the side of the wafer holding portion 21°. When the 2ib moves from the side position to the lowering position, the vibration H generates a supersonic motion. In these cases, the wire can be propagated from the wire to the wafer w and held by the wafer holding portions 21a and 21b. The acoustic vibration propagates uniformly to the entire area of the wafer W. 4 ϋ In the present embodiment, the wafer boat 2 has a pair of wafer holdings 2U, 21b and the wafer holding portions 21a, 21b are individually moved. For example, the wafer holding portions 21a and 21b may be formed integrally and lowered. The fish side orientation 2-body movement. At this time, the ultrasonic wave from the vibrator 4Q can be received by the wafer boat 2G, and the super= is propagated to the entire area of the wafer W. @JJ地地In the present embodiment, the wafer holding portions 21a and 21b are described as being lowered from the lower position by the lowering position than the lower position, and are lowered from the side position to the maintenance machine. However, this is not the case. Further, the holding portions 21a and 21b can be moved in the holding position and the side direction without passing through the lowered position. At this time, the drive control of the circular holding portions 21a and 21b can be simplified. The door shift is further described in the present embodiment. The wafer holding portions 21a and 21b are moved in a substantially symmetrical manner with respect to the vertical axis A of the center of the sun. However, ^ ^ 匕 叫 、 、 2 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 、 The side position is two to two on the right side toward the lower position, and the other side of the wafer holding portion (second wafer holding portion) is moved from the lower side of the lower side to the right side of the month. The holding portion 2ib moves from the 21a, 21b period door to the left direction. The vibrator 4〇 can also be subjected to ultrasonic vibration during the movement of the wafer holding portion 21b. The number of times from the vibrator 25 201123281 can be determined to be arbitrary. The boat 20 that reciprocates between the descending position and the side position is handed over to the wash arm 5〇, and the i circle W is from the crystal=holding portion 21a, and the green side is set from the lowered position to the side. ';===== The position is shifted to the descending position = and = the super-wave (four) ri is lowered, the _ green is set to _, the vibrator 40 is produced = w ί is transmitted by the ultrasonic vibration from the vibrator 40 The wave vibration is evenly spread 5 and the area held by 0' and the cleaning tank 1G of the supersonic 16 is accommodated in the container 16, and the container is cleaned. The cleaning liquid supply nozzle in the clearing or the setting of the cleaning tank 〇 in the 贫μ and 本 施 ” ” ” ” ” ” ” ” ” ” ” ” ” ” ” 4 cleaning liquid supply nozzles (ii, show:) 10 Μ This yoke L describes the formation of a cleaning sample 2 = plate 14 by amorphous carbon or niobium carbide, so that the bottom plate 14 is thick (for example, 65 mm) And directly ampere = sex ^ 2, but limited to this, the bottom plate 14 can be made thinner, and the vibrator 40 is mounted on the bottom plate 14 via the sound wave penetration and the eight miscellaneous reinforcement plate. In the present embodiment, the vibrator 40 is directly attached to the bottom plate 14 of the λ, 杳 办 。 。 。 。 。 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 An additional ^ can be provided under the cleaning tank 1 (not shown in FIG. 7 to store at least pure water to the bottom of the cleaning tank 10) and the vibrator 40 is placed at the bottom of the additional tank. The ultrasonic vibration generated by the vibrator 4 is propagated to the cleaning tank 1 by the additional pure water of the groove, and the wafer W can be surely superseded in the cleaning tank 1清洗 ί ί ί ί 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 数 ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( ( The method of the neutral super-sonic cleaning device, the ultrasonic cleaning method, and the recording medium for the computer program for performing the ultrasonic cleaning method are shown in Fig. 1. The main difference is that the solid body is held behind the i-th wafer holding portion of the wire arm and the wafer boat: the shape of the first-shell target is approximately the same. In addition, the first embodiment of FIG. 15 to FIG. Partially labeled the same Yuanmian County: holding the Qiu t-solid 11-shaped crystal 81 boat 2G with individual free-moving pairs of round 俾曰n placed in the day of the yen W in the washing arm 5G and the wafer boat After the Japanese yen holding portion 21a of 20, the first ^ portion 21b that controls the driving device % 曰 is passed from the second holding position to the second ^ G = 2 wafer, and then passes through the second lateral position. 2 Falling position 2 The position of the clock 2 moves, and the 'control device 44 holds the wafer to the position of the wafer. After 2 lb, the control drive unit 26 causes the 'the circle' and the f-wafer holding unit to move to the i-th slave 1 holding position position through the first lowering position and return to the i-th holding unit. / Thereafter, from the first side, the device 44 controls the ultrasonic vibration μ, and the vibrator m3 is moved during the movement between the descending position of the e 27 201123281 and the first lateral position. In other words, the region (the concealed region) held by the second holding portion 21a and the second wafer holding portion 21b. Further, the control device * 曰 1^21a 2 2iJb ^ is equal to the second day of the day when the yen holding portion 21b shields the ultrasonic vibration. Further, the ultrasonic cleaning method of the first embodiment. Here, it is mainly explained that the wafer w holding the liquid portion is moved by the second wafer holding portion 21_ of the pair of the gripping device control portion wafer W of the washing arm 5G.

The position of the second wafer holding portion 21b is changed from the control signal for holding the wafer W to the first wafer, and the portion of the second wafer holding portion 21b is received from the control package, and the wafer W is held at the H. The 0 tamping holding portion 21b is lowered (see Fig. 15). 21b ^ a ^ 2U 5 2 - 2nd position of the 2nd holding position. The second round holding portion 21b is continuously moved between lower positions (the second portion ^1 moves to the left in the second lower position and the second side position 44 Z7slTJ^〇b^ portion 21b) In the second wafer holding period in the right direction, the first wafer holding portion 2U refers to FIG. 17). In addition, this section of the magic day "the holding portion m continuously reciprocates between the 2nd τ drop position and the 2nd side = 28 201123281. In addition, the number of times of reciprocation between the second wafer holding position and the second fiscal position is not limited to the number of times, and the second wafer holding unit is taught to be the second. During the continuous movement, the control unit 44 causes the vibrator 40 to be placed in such a manner that the ultrasonic vibration can be propagated to the area where the wafer holding portion 21b is shielded. Jnd day, the second round of the second wafer holding portion 21b is from the second holding position of the second wafer W (the second step, the inflammation returns to the holding portion 27b and receives the control from the vibration 4: ^ = ° The lift drive training is increased. Thereby, the i-th wafer is maintained at approximately the same height, and the wafer w is engaged with the holding portion 2lb in the second wafer holding portion 2! b. By holding the core, the second wafer holding portion 21b holds the wafer: the first holding position 21b is located at the second holding position of the holding wafer w. The circular holding axis 1 25 is driven to the side, and the first "Japanese yen holding portion 21a is lowered to the upper control signal. At this time, the i-th wafer holding portion 21a is left at the position j. The wafer is lowered in position. The oy is lower than the first lower side 1st position of the position where the younger brother 1 holds the position. Then, it moves to the left direction of the solid 1D, moves in the direction of arrival, and returns to the i-th yen holding portion 21a to the right. 21a is in the "down" position: the "first wafer holding unit 2U is held in the first 1st wafer: 29 201123281. The number of times is one or more times. 1 Between the side positions _. In this way, can =======27 The area covered by the holding part 21a. j 曰 曰 之中 W to the first wafer 曰 曰 t t i i i i i The portion is now raised from the first descending position and returned to the support signal f driven by the control device 44. The second portion 21a rises. By this, the first 丨 crystal_cast 21 fa ^ ^ ^ holding unit ΪΤΪ ^ "1;" ® W ^ , Η:®, 3⁄4 1st round holding portion 21a. Thus, the wafer w is held by the cleaning arm 5 and the second wafer holding portion 21b holds the wafer w.曰/compensation 21a is located at the first holding position of the holding wafer W. The round holding 邠21a is the person, and the wafer w in the cleaning tank 1 is cleaned, and the medicine in the cleaning tank 1G is discharged. The liquid is supplied to the second 329. The same as the 28th step, the first wafer 2, the 曰 step is moved, and the ultrasonic vibration is propagated to the cleaning liquid. After the shirt 2 曰曰 保持 2 is moved, the wafer W is transferred. According to the present embodiment, the first wafer holding portion 21a and the first surname which are immersed in the cleaning tank 1 of the cleaning tank 1 are held by the crystal W' in the washing tank 1G. Wafer followed by second wafer The holding portion 21b moves from the second holding position ί to the 21st position, and then wei, _ 2 keeps the falling position and the 丨 side position between the continuous f and at 1 ilf cast 21a at the first falling position and the third 以 = = During the inter-movement, the control device 44 causes the vibrator 4 to transmit the ultrasonic vibration from the vibrator 4〇 to the round to g to the crystal 201123281 - the circular holding portion 2la and the second crystal The region 坫t held by the circular holding portion 21b can uniformly propagate the ultrasonic vibration to the entire region w of the wafer w. 5 [the area that defeated a), and

- Uniform ultrasonic cleaning throughout the area. °π. In this way, the wafer W can be superimposed on one side of the washing arm 50 and the wafer boat 20 in accordance with the present embodiment, and the wafer W can stably hold the wafer W. It is maintained by the 逯 曰曰® Holder. As a result, various modifications are possible in the second embodiment described above and in the scope of the first embodiment. In the second embodiment, the second wafer holding portion 21b of the present invention moves between the ninth position of the younger brother 2 and the first wafer. Vibration; example. However, the present invention is not limited to the first _th: the square 状态 状态 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 44 The set period and the second wafer holding portion are held at _5G and the second crystal holding portion 2!b from the second holding position to the second side back crystal®

After the training, the third wafer holding portion 2f is held. P moves, and then returns to the first! When the position is maintained, 1 and =^ are placed at the first lateral position, and at least at the position of the tamping holding portion 晋h# 〆 at the second day, the yen holding portion 21b is located at the second position The area (shaded area)' and the ultrasonic vibration are vibrated (third embodiment). The third embodiment of the present invention will be described with reference to FIG. Fig. 18 to Fig. 28 are: Ultrasonic cleaning devices and supersonic circles = in the brothers and sisters. An electro-acoustic recording medium for performing this ultrasonic cleaning method has been recorded. In the third embodiment shown in FIG. 28, the main difference is that the wafer (four) t rf holding portion and the second crystal listening portion can be separately held, and the other first embodiment shown in FIG. The shape is about the same. In addition, the parts of Fig. 18 to (4) are the first one to mark the phase liquid. The ultra-wave cleaning device 1 includes: the cleaning tank 1G, the storage cleaning, the Xie-Yi, the protection map, 21, The wafer boat 120 has a first wafer holding portion (No. 1 28), and s mm 2 aSa®^#^120b: ^ i is parallel to this! ^ = = ; 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及 以及';> between the second holding bar 122a, the holding portion = the first, the second wafer holding portion 120b (four) w2, and the mouthguard bar 122b. At this time, the first holding bar (2)a and the first first wafer holding portion (10)a are alternately arranged with each other: the first holding bar between the holding bars and each of the second holding bars 122a and the rods The second and second wafer holding portion holding rods 123a are parallel to the second holding member 123, and the third holding rods 123a are provided between the second holding rods of the second holding member 1. The third holding member and the first holding rod 121a are provided. And the second mate/] is extended by the rod 122a, and similarly, the wafer W is held together in the second round. The first holding stick of the aa® holding part (four) and the second holding 32 201123281 = 122b Specifically, between the i-th retaining rod 122a, a third holding rod crowbar (four) is provided to extend, and as shown in FIG. 2!, the i-th accompanying 2222 fitL holds the wafer w together. The 123b 〇 holding rod 121b is the same as the 苐2 holding rod (4) and the holding rod 121a of the third holding rod second wafer holding portion 12A, and the base portion 124b is extended, and the fine rotation ib^ = the step difference near the wafer w side In this way, the bases 124 & which are respectively connected to the base portion 124a and the third holding member 不 ί & are not in contact with each other, and the base tp 124\, = 12 in the second holding rod 122a portion 120b is the same. Ground (2) The bottom portion 124b of the wafer holding 2 - is in contact with the 曰 曰 · 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 防止 第 第 第 第 第 第 第 第 第 第 第 第/ /) crystal = and the second wafer holding portion 1 shown in Figure 22 (a), the second holding rods i22a, 122b and 篦 3 * legs are provided with a plurality of V-shaped grooves 127, which have two, lower than the i keep the bar = t12ia, /22b and the third to maintain the load of the bar, coffee wafer W, to prevent the two, use V-shaped groove _ receiving groove 12 = it is provided by the rods 121a, 121b most γ-shaped groove has a free card The Y-shaped cross section of the wafer W. The γ-shaped groove 33 201123281 The groove 128 is composed of the following: the opening side pushing surface 128a, the inclination angle is larger than the wafer W to be engaged; the deep side pushing surface 128b is disposed on the side of the opening side push-out surface 128a, the inclination angle is smaller with respect to the wafer w, the groove width is narrow, and the cross-sectional shape is Y-sub-opening. By the γ-shaped groove 128 When the wafer w is engaged with the wafer w, the wafer W is stuck to the deep side pushing surface 128b having a narrow groove width, and the wafer W can be surely engaged. Moreover, since the Y-shaped groove 128 is higher than the load-bearing V word The groove 127 can effectively prevent the wafer W from falling down. Thereby, the wafer boat 120 can stand up and stably maintain the wafer in the vertical direction. Here, the parts of the wafer boat 120 are highly resistant to chemicals. The quartz is formed, and the respective surfaces are coated with a Teflon film or a SiC (carbonized stone) money film. As shown in Fig. 21, the wafer boat 12 is coupled with a driving device 13 to lift and drive the wafer boat 120 y. In other words, the driving device 13A has: the elevation driving units 131 & 13 ratio, respectively raising and lowering the first wafer holding unit 12a and the second wafer holding unit 12b; and the lifting and lower driving force transmitting units 132a and 132b. The driving force of the elevation driving unit 131a is transmitted between each of the elevation driving units 131a and 13 and the base units 124a and 124b. Each of the elevation driving force transmitting portions 132a and 132b is connected to the base portions 124a and 124b by the adapters 133a and =3b, respectively. In this manner, the first wafer holding portion 12 and the j-th wafer holding portion 120b are freely movable (freely movable). In addition, by using each of the elevation drive units 131a and coffee, it is also possible to adjust the number! The positional relationship between the wafer holding portion 12A & and the second wafer holding portion i20b. The control device 44 of the present embodiment is connected to each of the elevation driving units 131a and 131b (see Figs. 18 and 19). In this manner, the elevation drive units 131a and 131b synchronously lower the ribs of the i-th wafer holding unit 12a and the second wafer holding unit 12 according to the control signal from the control unit 44, and insert the wafer W into the cleaning tank 1〇. When the cleaning liquid is immersed, the i-th wafer holding portion 120a and the second wafer holding portion 120b are simultaneously raised to carry out the crystals from the cleaning tank 10. Further, the first wafer holding unit 120a holds between the first holding position of the wafer W and the third lowering position slightly lower than the second holding position in the cleaning tank 10 by the driving device 130, and is approximately vertical The direction moves freely (freely lifting). Similarly, the second wafer holding portion 120b holds the 34th 201123281 2 holding position of the wafer w in the cleaning tank 1A by the driving device 130, and moves in a direction slightly lower than the second holding position. In this way, according to the second 7th, along the approximately 1 wafer holding unit, the signal is moved by the lifting crane 131^, and the lowering position is moved. The second wafer = the holding position and the first one. 2, the movement between the second lower and the second two temples is moved by the elevation drive unit im, and the first wafer holding unit 120a is between the first position of the first lower side and the side of the holding position. The first wafer holding portion 120a is freely movable in the drawing direction. That is, the first wafer must be moved closer to the second wafer 2 to the second holding rod, and the second wafer holds the rod. Similarly, the second side position of the side is located at the second holding position. The wafer holding unit (4) is free to move in the direction of the drawing. In other words, the second wafer holding portion 120b is connected to the wafer boat 120 in the approximate horizontal direction, and the second wafer holding portion (10) is held in each wafer holding portion. The inspection unit 120a moves the driving unit in the i-th lower position, so that the i-th wafer holding force transmitting unit 1 wishes to move the gentleman between the side positions and the side driving unit 132a. . The mobile drive unit 13 is known to have a driving force of the portion i34a with the lifting/lowering driving force transmitting device 13. Similarly, the drive transmission unit 135b moves between the right and the right positions of the company; and the side drive force, and _^====liter_force transmission unit 0 > ^, ι breaks 44, The wafer w held by the first wafer holding portion 120a and the second wafer holding portion 35 201123281 is immersed in the clear 130, and the i-th wafer holding portion is applied to the inside of the wafer. After the night, the crane device moves to the first side position by the first descending position, and returns to the first holding position. In addition, the phantom descending position 120a and the second wafer holding portion 12b are held together, and the wafer holding unit 44 controls the driving devices 13〇/曰 and W. Thereafter, the control device returns to the second holding position after the second descending position. 1 *, after which the control device 44 controls the ultrasonic oscillating device 42, 黛 超 超 黛 第 第 第 第 第 第 第 = = = = = = = = = = = = = = = = = = = 。 。 。 。 。 In this way, the vibration is broadcasted onto the wafer w, and the ultrasonic vibration transmission secret domain (the concealing solid holding portion 120a and the second wafer holding portion coffee) is received. In the present invention, the control device 44 includes a computer, and the crystals of the wire processing device i are implemented by the program of the recording medium 45, and the present invention is described with reference to FIGS. 23 to 28. In the same manner as in the first embodiment, the cleaning liquid is stored in the cleaning tank 1 (the first wafer holding portion 12a and the second wafer holding portion of the crucible 20 are held). The wafer w is immersed in the cleaning liquid in the cleaning tank 10 (step 1 〇 2). This is a plurality of wafers w that are transported by a transport mechanism (not shown). The wafer 〇120a and the second wafer holding portion i2〇b of the wafer boat 12 are arranged at the same height. At this time, the wafer w is engaged with the second holders 122a and 122b' and is engaged with The v-shaped grooves 127' of the third holding bars 123a, 123b are engaged with the γ-shaped grooves formed in the first holding bars 121a, 121b, and the lifting drive portion 1 31a and 131b are controlled by the control device 44 and are synchronously driven to cause the first wafer holding unit 12A and the second wafer holding unit 12 to be lowered into the cleaning tank 10 (see Fig. 23). In this way, the wafer w is dipped into the cleaning 36 201123281 liquid (refer to Fig. 24). At this time, the first round position is kept at the position === holding part] the bird moves and the side 'from' secures: t; Lower: round; 1 wafer holding portion holds the wafer W in the state of the second day, the second holding unit 120b is in the first position, and is lowered; the moving wafer is placed; and the * side position is placed The person's side movement drive unit 134a is driven by the number, and the control position of the first wafer holding unit mag41 is held at the side of the first side of the control position and held at the first first wafer. The part ma is lowered from the i-th), that is, when the i-th crystal_section is transported to the cleaning = 0, the high frequency drive power is driven (the drive is activated, the crystal is vibrated, and the vibrator 40 produces the ultrasonic vibration). Ultrasonic cleaning is performed efficiently in a short time. Between if20a is in the first falling position and the first side azimuth circle W & the first acoustic vibration propagates to the crystal 37 201123281 Next, as shown in Fig. 28, the flute 1 sm rises from the rising back to the holding wafer W _ 丨 二 i i i 在 在 在 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持1 wafer is attached to the state] Chuan β Li. The second holding position (step 106). The portion 120b is held. The second holder 51 holds the second wafer holding 120 1 through the second falling position A. The second holding position of the wafer W is held, and the second moving position is returned to the second side position, and then passes through the second lowering position and is lowered from the position at which the wafer W is held. At this time, the second wafer holds ^2^=the first _;=^1 (the second holding position of the second moving step W. #^弟2lowing position, lower than the holding crystal. The second lower _ and the second side azimuth lowering position and the second side abutting ϋ wafer holding unit 120b are plural times. The number of times between the positions is not limited to one time, and may be determined as continuous movement. The step between the period ^ position and the second side position). : ( 7 vibrator 40 produces ultrasonic vibration (the first 置 9 = continuation ii 2 = tn2 〇 b in the middle of the second falling position and the second side azimuth circle W) month b will be the ultrasonic wave from the vibrator 40 In the vibration transmission crystal 1 A, the area which is blocked by the wafer holding portion 12 〇 b is raised to the position of the second holding position 曰laj w, and the second wafer holding portion 12 〇 & 38 201123281 = 'falling back to the first holding position in the state of 3 Γ η (step (10)). The same period of the uppermost portion 120a and the second wafer holding portion 120b are approximately phased: The wafer w is held by the first wafer holding unit 120a and the second wafer at the time of cleaning the wafer w in the washing tank 10 (step 111). The green pump 69 stops the supply of the cleaning tank 1G. Next, W8 and the shredder 63 are operated, and the pure water supply source is 槐 楚 1 1 ' ' ' ' ' ' 1 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 And the wafer W that has passed through the cleaning liquid is carried out from the cleaning tank 1G (the 12th step _131a, 131b receives the control from the control unit 44), and the first wafer holding portion of the wafer W is held. 12〇a and 2nd work曰ί L rises and the wafer w is carried out from the cleaning tank 10. Thereafter, the wafer boat 120 is handed over to a transport mechanism (not shown), and the cleaning step is repeated by repeating the above steps. In the slot 1G, the _W sequential ultrasonic wave i is maintained according to this embodiment, and the wafer W is held and immersed into & 2 i2〇b^, ^ ! bWL·, and the worker i2〇b can separately hold the wafer w. Thereby, the wafer w held by the US second wafer holding portion 12Ab is immersed in the 纳 ο 持 持 1 1 =============================== 〇a simultaneously keeps the read and move of the second wafer; ΐ上;:, 12% moves between the ...th drop position and the uth position =, 曰: circle, and the wafer holding portion 120b is at the second drop position盥The second side azimuth door 1 is arranged at the bottom plate 14 of the cleaning tank 1〇,

Ultrasonic vibration from the vibrator 4G propagates to the wafer wit? to ί 5 2 , aK W 39 201123281 The material turns over the wafer W, and as a result, the entire area can be uniformly distributed by ultrasonic waves. Cleaning treatment. Turning over (the chopping wave will cast another evil person into the above-mentioned member can enter the rod in the main scope of the invention for a long time to insert w jjy. The representative modification is described below. J 曰 围 进 进 各种 各种 各种 各种 各种 各种 各种 各种 各种 各种 各种 各种It is to be noted that the first wafer holding unit 1 applies the second round circle = the holding portion mb has the third holding rod 123 = ^ 120a ^ ^ 2 ', and can be used only by the first holding rods 121a, 121b and the second 122^ Also, you and the wafer W are held separately. At this time, the wafer W can be separately held by the second holding rod 122a and the vertical square θ gold green y ^ holding portion 120b passing through the center of the wafer W. The 2nd 曰Η 第 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 2 wafer holding portion G〇b and ith 'a κ; [= between the first holding rod 121b of the second crystal scalar 1 and the second holding rod 122a of the same & However, it is not limited to being arranged in the 笫::, the third holding bar of the first wafer holding portion i2〇a = the Ba==b0a=2 holding bar (four) and the second wafer holding the third holding bar Between the 2nd wafer holding part, the holding stick, this f2t The second retaining bar, the (10) and the third retaining 123b have a V-shaped groove 127, and the 121b is provided with a first example. However, the first retaining of the core groove and the third guarantee While maintaining the i = true state, the middle description describes an example in which the first wafer holding portion applies the second wafer device 44 to record the recording, and the control generates the super-theta wave vibration. However, the present invention is not limited thereto. Only in 201123281 ^The first crystal, the holding portion 12Ga and the second wafer are moved during the movement of each side position, and the vibrator 4 is produced: the ultrasonic vibration of the vibrator 40 is transmitted to the 曰H from the first cell and the second crystal. (4) The daily holding portion and the first wafer holding portion of the description wafer boat 120 are hidden. } 1 i2〇a^^ tilt The lateral position is moved at each lowering position. Crystal _=:= Wafer holding portion (4) stop: 3Ϊϊί side position, and when the first wafer holding unit 1 is placed at the IS side position, the vibrator 4G generates a supersonic crane, and the shell 120b is moved from the second lower position. Move to the 2nd side 曰曰曰 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 保持 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 振动 曰 曰 曰In the region where the a and the second wafer holding portion are shielded by 12%, the wave vibration is uniformly propagated to the entire area of the wafer w. Further, in the present embodiment, the wafer boat 12G is described as "holding the wafer" The first holding position of W is set by the ith lowering position === bit ii, and the second and/the wafer holding portion leg is held from the holding example of the holding wafer W. ί is maintained at this position during the movement of the holding portion 120a It is not limited to this, and the movement of the postal maintenance unit ma and the second wafer 41 201123281 is not limited to this. Specifically, the second wafer holding portion 1 is high, and the cleaning liquid Φ in the core wall 10, the pure W held by τ X μ ~ and the wafer holding portion UOb of the holding portion 12 rise, and the 凊 凊After the washing liquid, the second holding position of the second holding portion is not lowered until the lower round holding portion 1 is applied to hold the wafer from moving to the side to avoid 'θ, ρ ' as long as the first 曰曰曰The circular holding portion 12〇2 = descends to the ith lowering position; and the holding portion and the second wafer holding portion 120b move between the holding portion and the second wafer without passing through each of the lower portions. At this time, the drive control of each of the f-side positions can be simplified. The , , a and the 2nd bb circle holding unit 120b hold the ί 1 and apply the second wafer. The present invention is not limited to this, and the case of the ώ ώ 资 资 资 均匀 均匀 。 。 。 。 。 。 。 。 。 。. However, the wafer holding portion on the side of a 9 ^ moves, and the wafer W region shielded by the H-two holding portion can be surely cleaned: 44. The burial by the adult-like ultrasonic cleaning device 1 has a control skirt containing a computer and is recorded for use in the implementation of ultrasonic cleaning

The _ Γ Γ 5 is also the object of the program ._ ΑΛ / Γ ^ executed by the computer. Here, the recording medium 45 may be a ROM = memory or a disc-type recording medium 45 0 such as a hard disk or a cd_r〇m, and the other embodiment of the present invention will be described in detail with a JlS paste towel. The cleaning device Bu ultrasonic π washing method, and the recording medium 45 having a computer program for executing the ultrasonic cleaning method are applied to the cleaning processing of the semiconductor wafer w. However, the present invention is not limited thereto, and the present invention may be finer than the cleaning of various substrates such as an LCD substrate or a CD substrate. 42 201123281 [Brief Description of the Drawings] Fig. 1 shows an ultrasonic cleaning apparatus according to a third embodiment of the present invention. Figure 2 is a side cross-sectional view of Figure 1. Figure 3 is a plan view of Figure 1. Fig. 4 is a view showing a discharge valve mechanism in the first embodiment of the present invention. Fig. 5 is a view showing the configuration of a workpiece holding device in a third embodiment of the present invention. Fig. 6 is a view showing a state in which the ultrasonic cleaning method according to the embodiment of the present invention inserts a wafer into a cleaning tank.

Fig. 7 is a view showing the state in which the ultrasonic wave of the second embodiment of the present invention is impregnated into the cleaning towel. U Fig. 8 is a view showing a state in which the ultrasonic cleaning method in the i-th embodiment of the present invention transfers the wafer from the wafer boat to the washing arm. Fig. 9 is a view showing a state in which the ultrasonic cleaning method according to the first embodiment of the present invention moves the boat to the lowered position. Fig. 10 is a view showing a state in which the ultrasonic cleaning method according to the first embodiment of the present invention moves the wafer boat to the side position. Fig. 11 is a view showing a state in which the ultrasonic cleaning method according to the first embodiment of the present invention moves the wafer boat to the lowered position. Fig. 12 is a view showing a state in which the ultrasonic cleaning method according to the first embodiment of the present invention is transferred from the washing arm to the wafer boat. Fig. 13 is a view showing the ultrasonic cleaning method according to the first embodiment of the present invention, which causes the arm to move to the retracted state. In the ultrasonic cleaning method according to the first embodiment of the present invention, the state in which the wafer is taken out from the main groove is shown. In the ultrasonic cleaning method according to the second embodiment of the present invention, the wafer holding unit is moved to the second lowering position. [Embodiment 2] Fig. 16 shows a state in which the ultrasonic cleaning method in the ultrasonic cleaning method according to the second embodiment of the present invention is moved to the +2 side position. 1 2 is a state in which the ultrasonic cleaning method according to the second embodiment of the present invention causes the wafer holding unit to move to the second lowering position. Fig. 18 is a view showing an ultrasonic cleaning device according to a third embodiment of the present invention. Figure 19 is a side cross-sectional view of Figure 18. Fig. 20 is a view showing a discharge valve mechanism in a third embodiment of the present invention. Fig. 21 is a view showing the configuration of a wafer boat in a third embodiment of the present invention. In the third embodiment of the invention, the second holding rod and the second groove holding groove are formed, and FIG. 22(b) shows the Y-shaped insertion of the first holding rod in the third embodiment. Ultrasonic cleaning method Ultrasonic cleaning method in wafer immersion method The wafer wafer ultrasonic cleaning method is used to make the first wafer i. The ultrasonic cleaning method in the embodiment is shown in FIG. #1 The status of the side position. In the wafer holding unit, the ultrasonic cleaning method in the third implementation county is instructed to make the first page of FIG. In the first embodiment, the ultrasonic cleaning method in the third embodiment is in a state in which the crystal day return holding portion and the second wafer holding portion are held. 1 [Description of main symbols] 11. 12. 13. 14. Q', tapping cleaning device 10*.·Cleaning tank. Side wall • Liner. Fixing bolt. Bottom pole (bottom) 15... Groove 16·· Container 44 201123281 20.. Wafer boat (subject to be processed) 20a, 20b... Wafer holding portions 21a, 21b... Wafer holding portion (subject to be processed) 22a, 22b, 124a, 124b ...bases 23a, 23b... holding bars 24a, 24b, 53, 125a, 125b... connecting members 25a, 25b... holding grooves 26, 130... drive means 27a, 27b, 131a, 131b. .. lifting drive unit 28a, 28b, 132a, 132b... lifting drive force transmitting unit 29a, 29b, 133a, 133b... adapters 30a, 30b, 134a, 134b... side moving drive parts 31a, 31b. .. side drive force transmitting unit 40.. vibrator 41.. vibrating unit 42.. ultrasonic wave oscillating device 43.. drive power unit 44.. control device 45.. recording medium 50. . Washing arm 51.. Clamping portion 52.. Abutting bar 60.. Cleaning liquid supply device 61.. Cleaning liquid supply nozzle 61a... Tubular nozzle body 61b... First nozzle hole 61c ...the second nozzle hole 62.. cleaning liquid supply pipe 63.. switching valve 64.. pure water Feeding pipe 45 201123281 65.. . pure water supply source 66.. chemical liquid supply pipe 67... chemical liquid supply source (medicine liquid tank) 68.. . opening and closing valve 69.. . Le liquid chestnut 80.. . Mechanism 81.. Abutted part 82.. Valve body 83.. Piston rod 84.. Cylinder unit 85.. Discharge port 120·.. Wafer boat (subject to be processed) 120a. .. first wafer holding portion (first processed object holding portion) 120b... second wafer holding portion (second processed object holding portion) 121a, 121b... first holding bars 122a, 122b. .. 2nd holding bars 123a, 123b... 3rd holding bars 126a, 126b... recesses 127.. V-shaped grooves 128.. Y-shaped grooves 128a... Opening side push-out faces 128b... Deep side push surface W. .. wafer X. .. horizontal direction axis Y. .. vertical direction axis 46

Claims (1)

201123281 VII. Patent application scope: l An ultrasonic cleaning device, comprising: a cleaning tank for storing the cleaning liquid; and a processing body holding device, which is set to be inserted and dipped into the cleaning liquid; The treatment body vibrator is disposed at the bottom of the cleaning tank; the chopping wave is recorded to cause ultrasonic vibration of the hetero mover; and the side f holding member is disposed in the cleaning tank for holding the object to be processed and driving The apparatus causes the object to be processed to transmit the object to be processed to the ultrasonic wave (four) device and the ultrasonic vibration of the vibrator of the side holding member rear member of the control device. From the "Xiao 2", such as ^ please patent scope of the first item of the ultrasonic cleaning device, in which the body, the side of the listening component (four) was treated to Guanxian County to accept the secret to hold the position to handle the position of Wei County , 鄕 _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ _ The ultrasonic vibration from the 5 hai vibrator is transmitted to the region of the object to be processed and held by the sputum object holding device. 3. The ultrasonic cleaning device of claim 2, wherein the physical body holding device has a pair for holding the object to be processed, and the respective object holding portions are individually freely available. mobile. 4. If you apply for the ultrasonic cleaning device of item 3, the towel, which is the place to be moved, will be moved. The ultrasonic vibration device is arranged, wherein the control device moves to the lateral position, and is moved from the lower position to the side position after the eight old calf, and the position is moved by the lower position. She listens to the sound, and the control device controls the lowered position to have a position in which the side retains the structure. It is said that the thief is abutting the thief and the thief is rushing to the city and continues to be treated. The ultrasonic cleaning installation of the first item, i, body,. /. The holding member receives from the object holding device and holds the processed δH drive device to move the processed step position f to the holding body of the object to be processed located at the side of the holding position. The locating portion for holding the object to be processed is placed in the arranging position, and after at least one of the processed portion holding members is moved to the side position, the side position is moved, and When the physical body holding portion is at the position of the holding position, the vibrating child corpus holding portion is located in a region where the side sound wave vibration propagates to the position where the two are from the super-holding of the vibrator. 2011 Μ 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 2011 In the second maintenance position, the object to be processed is held in the second holding position on the side to the holding member and the second object to be processed; and the side portion is at least located in the side When the first target object holding portion is in the second lateral position, the body holding portion is at least in the cleaning tank for storing the cleaning liquid; and the setting is set to be insertable, and the object vibrator is held. It is disposed at the bottom of the cleaning tank; the ΐ ΐ is used to cause the vibrator to generate ultrasonic vibration; ; 4 ίί ' Ξ ί the object to be treated to move the device to the side; and, like, the rib control ship super n The first and the second body to be held, and the first to be treated, the first to be treated Each of the body holding portion and the second target object holding portion has: 49 201123281 1st holding rod And the second holding rod, the vertical axis of the center of the processing body, and the opposite side to the first object to be processed holding portion; the first holding rod of the object holding portion And being disposed between the second holding rods, and the second ground holding body holding portion and the second processed object holding portion of the second hollow processed body holding portion can individually control the driving by the control device庐 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The body vibration of the body is oscillated, and the ultrasonic device is controlled from 2. The ultrasonic wave is applied to the motor device, and the first device is processed after the control device 2 is subjected to the second, middle, and second The holding portion is moved from the holding position in the cleaning liquid in the accompanying body, and then the second object to be processed is returned to the first position, and moved to the second object to be held at the second holding position. Located in the first ^= 立 ^ 盛 : : : : : : : : : : : : : : : : : : : : : When set, J: The 2 is processed to be super-reading from the recorder, wave vibration = ultrasonic cleaning of the patent range „item: holding the area. ff between the first holding rod and the second holding rod And ^ there should be / = hold the rod ' it holds the stick to keep the object to be treated together. ^ Keep the rod and the ultrasonic cleaning device of the second item, in which the material of the broken body is laid 1 body holding. The first holding rod of the Taohai and the second object to be processed are held between the 201123281 rods, the body mi; between the second rods to be treated. The second holding of the body 1 holding body holding portion 15 The ultrasonic cleaning device of the first and second holdings of the first and second holding rods and the third holding rod of the first and second holdings of the first and third holdings are provided with the second holding unit of the v ^ skin holding portion The V-shaped cross-section of the treatment body, the groove, which is freely engageable with (4) the first object-receiving body holding portion and the second object to be processed; The control device and the second lateral position move the first holding position and the second lateral position = ^ < the second falling position of the holding portion below the second holding position 1 when moving, 'make it (4) in the second holding position 17. Control the ultrasonic vibration device according to item 16 of the patent application, the first/month of the control device is in the second lowering position The "1曰", and when the second is located ί! During the movement between the side positions of the ultrasonic vibration generated by the body vibration vibrator, the 18. ultrasonic cleaning method is also included, which comprises the following steps:清洗 Cleaning solution treatment body ===pieces are kept; body vibrates 振动ίίΓ The vibrator at the bottom of the tank produces an ultrasonic axis and the processed object = the object to be treated is moved to the side to move to the side The side holding member holds the object to be treated to hold the side portion 51 201123281. In the application of the moon cow 'in which the holding position of the object is held, the ultrasonic vibration of the moving object will be maintained from the vibrating Area. And the ultrasonic cleaning method of the object to be processed, wherein the physical body holding portion, the holding body has a body holding portion for holding the pair of the object to be processed The system can move freely individually. 22. If the ultrasonic cleaning method t in item 19 of the application is held ί 'the object to be processed is then held from the τ drop position _ the position of the position below the financial position, in the The processing body holding device also causes ultrasonic vibration of the vibrator from the lower portion. "Visit position movement period 23. As described in the ultrasonic cleaning method of claim 22, the g is contained in the object to be processed The holding device moves from the lateral position _ between the falling positions, and the position moves to the falling position. 24. In the step of holding the object to be processed by the holding member of claim 18, in the side portion The retracted position of the body retreat moves to accept and maintain the 52 201123281 and maintains the object to be processed. 25. The ultrasonic cleaning method of claim 24, in the middle, the two pairs of the body have abutting The side of the object to be treated loses the position Processing 26. In the ultrasonic cleaning method of claim = (4), the physical body = physical body holding device has a means for maintaining the treated body: the body is held by the side holding member to hold the body body = the object to be processed held by the device; the intersection is controlled by the object to be moved to the side of the object to be processed: the holding member, at least the side (four) is being treated/processed When the body position is moved to the side position of the one side of the holding field holding device of the holding device on the side of the holding position, the portion from the vibrator is at least located in the middle position. The object to be processed maintains the ultrasonic wave cleaning method in which the vibration of the region is transmitted to the object to be processed 27·=,=利范_18, and the clock is held by the device to be freely movable. i], the old person holds the D卩 and the second object to be processed holding portion, and the first object to be processed holds the object holding device and the first object to be processed in the side body to be held by the side body The second object to be processed of the device t is 'processed to maintain positional shift When the second position is the second holding position in the second holding position, the second holding position is again, and the second object to be processed holds the second holding member and the holding member. The i-th retaining the second side position of the second holding portion, and then returning to the second sea-holding position side when the U-thick processing body holding portion in the processed object holding device is at least 53 201123281 ===From The 被 被 被 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少 至少An ultrasonic cleaning method for immersing a target object held by an ith to-be-processed body of a to-be-processed object holding device in a second position of the rinsing tank, and holding the sputum in the second object to be processed holder The body holding portion moves to the side; and, 'χ —,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, After the second step of moving, 'the first one is treated as f is the body', the second is the second Sleeper pretend treating body break up cylinder 30. Post Patent Application range of ultrasonic cleaning method of 29, (iv) Xi = Temple movable. The group holding unit that moves the first object to be processed holding unit is held at the i-th side position on the side of the third side from the i-th holding position of the object to be processed, and thereafter the first one is In the step of moving the second to-be-processed body holding portion, the ninth body holding portion is placed from the second, second, and second processes held by the object to be processed, 2/_, and then returned to the second The second sound is that the ultrasonic vibration of the i-th object to be processed is propagated to the area held by the body holding body in the object to be processed, and the ultrasonic cleaning of the patent lniU item 31 is performed. Method, in the pot, in the step of holding the body, the part is moved, and after the step of moving the second object to be processed, the second step is lowered below the holding position of the second 54 201123281. position. 33. If the step of claim 32 is exceeded, the first step is also to protect the movement between the side positions of the ultrasonic cleaning and the position of the phantom drop and the first The position of the drop position and the position of the 财2 ^ = = = = = = = = = = = = = = = = = = = = = = = = § § § § § § § The ultrasonic cleaning method & 'clearing method computer program, the object to be processed which is smashed by the object holding device, is processed by the cleaning device which is placed in the cleaning tank and dipped into the cleaning tank. The vibrator at the bottom of the tank is subjected to ultrasonic vibration, and the step of holding the portion of the object to be processed is followed by the step of cleaning with the side. - a kind of recording medium, after the step of processing the body. The super body, the computer program, the body protection unit and the second body are treated with the body fluid; the body holding unit is moved sideways; and the body is held by 12; 1 is over the body of the cleaning ship (four) vibration material produces ultrasonic vibration __ processed pattern 55