JP5450309B2 - Ultrasonic cleaning apparatus, ultrasonic cleaning method, and recording medium on which a computer program for executing the ultrasonic cleaning method is recorded - Google Patents

Description

  The present invention relates to an ultrasonic cleaning apparatus, an ultrasonic cleaning method, and a computer program for executing the ultrasonic cleaning method, in which an object to be processed immersed in a cleaning liquid is cleaned using ultrasonic waves. It relates to the medium.

  Conventionally, an object to be processed such as a semiconductor wafer or a glass substrate for LCD is immersed in a cleaning liquid such as pure water or chemical stored in a cleaning tank, and ultrasonic cleaning (including megasonic processing is included) using ultrasonic waves. ) Is known (see, for example, Patent Document 1). In this ultrasonic cleaning apparatus, a vibrator capable of ultrasonic vibration is attached to the bottom of the cleaning tank, and an ultrasonic oscillator for generating ultrasonic vibration is connected to the vibrator.

  When cleaning an object to be processed in such an ultrasonic cleaning apparatus, the object to be processed is immersed in the cleaning liquid in the cleaning tank, and ultrasonic vibration is generated in the vibrator attached to the bottom of the cleaning tank by the ultrasonic oscillator. Let As a result, ultrasonic vibration is propagated to the cleaning liquid and the object to be processed is irradiated with ultrasonic waves from below, and particles and the like attached to the object to be processed are removed. In this way, the object to be processed is ultrasonically cleaned.

JP 2003-209086 A

  However, when the object to be processed is ultrasonically cleaned in such an ultrasonic cleaning apparatus, the object to be processed is held by the wafer board. In this case, a wafer board holding rod exists below the object to be processed. Thereby, the ultrasonic vibration irradiated from below is shielded by the holding rod of the wafer board. That is, the ultrasonic vibration propagated from the vibrator is highly straight. This makes it difficult for ultrasonic vibration to propagate to the region above the holding rod of the wafer board in the object to be processed, and it is difficult to uniformly ultrasonically clean the entire area of the object to be processed.

  The present invention has been made in view of the above, and an ultrasonic cleaning apparatus, an ultrasonic cleaning method, and an ultrasonic cleaning method capable of ultrasonically cleaning the entire area of the object to be processed. An object is to provide a recording medium on which a computer program for execution is recorded.

  The present invention is provided in a cleaning tank for storing a cleaning liquid, a target object holding device that is provided so as to be inserted into the cleaning tank, and that holds the target object and is immersed in the cleaning liquid, and is provided at the bottom of the cleaning tank. A vibrator, an ultrasonic oscillation device that generates ultrasonic vibrations in the vibrator, a side holding member that is provided in the cleaning tank and holds the object to be processed, and a side of the object holding apparatus that is to be processed And a control device that controls the ultrasonic oscillation device and the drive device, the control device holding the object to be processed on the side holding member, and then the object to be processed The driving device is controlled to move the body holding device to the side, the ultrasonic vibration is generated in the vibrator, and the ultrasonic vibration from the vibrator is propagated to the object to be processed. Controlling the ultrasonic oscillator To provide an ultrasonic cleaning device.

  In the ultrasonic cleaning apparatus described above, the side holding member is configured to receive and hold the object to be processed from the object to be processed holding apparatus, and the driving device includes the object to be processed holding apparatus. The control device is configured to move from a holding position that holds the object to be processed to a lateral position that is located to the side of the holding position, and the control device moves the object to be processed from the object holding device. After handing over to the side holding member, the workpiece holding device is moved from the holding position to the side position, and when the workpiece holding device is at least in the side position, The ultrasonic oscillation device and the driving device are controlled so as to generate ultrasonic vibration and propagate the ultrasonic vibration from the vibrator to a region of the target object that is held by the target object holding device. You It may be so. In this case, the target object immersed in the cleaning liquid in the cleaning tank and held by the target object holding device is delivered to the side holding member provided in the cleaning tank, and the target object holding device is When the workpiece moving device moves from the holding position to the side position and the workpiece holding device is at least in the side position, the control device generates ultrasonic vibration in the vibrator. Thereby, the ultrasonic vibration from the vibrator can be propagated to a region of the target object that is held by the target object holding device. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  Further, in the ultrasonic cleaning apparatus described above, the target object holding device includes a pair of target object holding parts for holding the target object, and each of the target object holding parts is individually movable. You may make it become.

  In the ultrasonic cleaning apparatus described above, the pair of object holders may move substantially symmetrically with respect to the object to be processed.

  In the ultrasonic cleaning apparatus described above, the control apparatus moves the object holding apparatus from the holding position to a lowered position located below the holding position, and then moves from the lowered position to the side position. The ultrasonic oscillating device and the driving device are controlled so that ultrasonic vibration is generated in the vibrator even while the object holding device is moved from the lowered position to the lateral position. You may make it do.

  In the ultrasonic cleaning apparatus described above, the control device moves the object holding device from the lateral position to the lowered position, and moves the object holding device from the lateral position to the lowered position. You may make it control the said ultrasonic oscillation apparatus and the said drive device so that an ultrasonic vibration may be produced in the said vibrator | oscillator during moving.

  In the ultrasonic cleaning apparatus described above, the side holding member moves between a delivery position for receiving and holding the object to be processed and a retreat position for retreating away from the object to be processed. Also good.

  In the ultrasonic cleaning apparatus described above, the side holding member may have a pair of clamping portions that abut against the side surface of the object to be processed and clamp the object to be processed.

  Further, in the ultrasonic cleaning apparatus described above, the side holding member is configured to receive and hold the object to be processed from the object to be processed holding apparatus, and the drive device includes the object to be processed holding apparatus. The object to be processed is configured to move from a holding position for holding the object to be processed to a side position positioned to the side of the holding position, and the object holding device holds a pair of objects to be processed that hold the object to be processed. A body holding unit, and the control device delivers the object to be processed from the object holding device to the side holding member, and then at least one of the objects to be processed of the object holding device. The holding unit is moved from the holding position to the side position, and when the one object holding unit is at least the side position, ultrasonic vibration is generated in the vibrator, Ultrasonic vibration As to propagate in the area to be held by the one of the substrate-supporting unit of the Ritai, it may control the ultrasound oscillation system and the driving device. In this case, the object to be processed, which is immersed in the cleaning liquid in the cleaning tank and is held by the object holding device, is handed over to the side holding member provided in the cleaning tank, and the object holding device When at least one target object holding part moves from the holding position to the side position and the one target object holding part is at least in the side position, the control device generates ultrasonic vibrations in the vibrator. . Thereby, the ultrasonic vibration from the vibrator can be propagated to a region held by one of the objects to be processed among the objects to be processed. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  Further, in the above-described ultrasonic cleaning apparatus, the target object holding device includes a first target object holding part and a second target object holding part that are individually movable, and the driving device includes: The first object holding unit of the object to be processed holding device is moved from a first holding position for holding the object to be processed to a first side position located on the side of the first holding position, and The second object holding unit is configured to move from a second holding position that holds the object to be processed to a second side position that is located to the side of the second holding position, and the control device includes: After the processing object is held by the side holding member and the first processing object holding part, the second processing object holding part of the processing object holding device is moved from the second holding position to the first holding position. 2 is moved to the side position, then returned to the second holding position, and After holding the physical body on the side holding member and the second object holding part, the first object holding part is moved from the first holding position to the second side position, and then The drive device is controlled to return to the first holding position, and when the first object holding part is at least in the first side position, and when the second object holding part is at least the first When in the two lateral positions, ultrasonic vibration is generated in the vibrator, and the ultrasonic vibration from the vibrator is applied to the first object holding unit and the second object to be processed in the object to be processed. You may make it control the said ultrasonic oscillation apparatus so that it may propagate to the area | region hold | maintained by a body holding part. In this case, the object to be processed which is immersed in the cleaning liquid in the cleaning tank and held by the object holding device is held by the side holding member and the first object holding part provided in the cleaning tank. The second object holding unit of the object holding device moves from the second holding position to the second side position, and then returns to the second holding position. Further, the first object holding unit , When moving from the first holding position to the first side position and then returning to the first holding position, and when the first object holder is at least in the first side position, and the second object holder Is at least in the second lateral position, the control device causes the vibrator to generate ultrasonic vibrations. Thereby, the ultrasonic vibration from the vibrator can be propagated to a region of the target object that is held by the first target object holding unit and the second target object holding unit. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  The present invention also includes a step of holding a target object held by a target object holding device and immersed in a cleaning liquid in a cleaning tank on a side holding member provided in the cleaning tank; A step of moving the processing object holding device to the side, and a step of ultrasonically cleaning the object to be processed by generating an ultrasonic vibration in a vibrator provided at a bottom of the cleaning tank. The step of moving the body holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the object to be processed by the side holding member.

  In the ultrasonic cleaning method described above, in the step of holding the object to be processed by the side holding member, the object to be processed held by the object holding device is delivered to the side holding member. In the step of moving the target object holding device to the side, the target object holding device moves from a holding position for holding the target object to a side position positioned to the side of the holding position. When the workpiece holding device is at least in the lateral position, ultrasonic vibration from the vibrator is propagated to a region of the workpiece to be held by the workpiece holding device. May be. In this case, the target object immersed in the cleaning liquid in the cleaning tank and held by the target object holding device is delivered to the side holding member provided in the cleaning tank, and the target object holding device is When the workpiece moving device moves from the holding position to the side position and the workpiece holding device is at least in the side position, the control device generates ultrasonic vibration in the vibrator. Thereby, the ultrasonic vibration from the vibrator can be propagated to a region of the target object that is held by the target object holding device. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  Further, in the ultrasonic cleaning method described above, the target object holding device has a pair of target object holding parts for holding the target object, and each of the target object holding parts is individually movable. You may make it become.

  In the ultrasonic cleaning method described above, the pair of object holders may move substantially symmetrically with respect to the object to be processed.

  In the ultrasonic cleaning method described above, in the step of moving the object holding device to the side, the object holding device moves from the holding position to a lowered position positioned below the holding position. Then, the vibrator is caused to generate ultrasonic vibration even while it is moved from the lowered position to the side position and the workpiece holding device is moved from the lowered position to the side position. It may be.

  The ultrasonic cleaning method may further include a step of moving the object holding device from the lateral position to the lowered position, and moving the object holding device from the side position to the lowered position. Even during the operation, ultrasonic vibrations may be generated in the vibrator.

  Further, in the ultrasonic cleaning method described above, in the step of holding the object to be processed by the side part holding member, the side part holding member moves the object to be processed from a retreat position where it is retracted away from the object to be processed. You may make it move to the delivery position which takes over and hold | maintains, and may hold | maintain the said to-be-processed object.

  Further, in the above-described ultrasonic cleaning method, the side holding member has a pair of holding portions that abut against the side surface of the object to be processed and hold the object to be processed. In the step of holding the holding member, the side holding member may hold the object to be processed by bringing the pair of holding parts into contact with the side surfaces of the object to be processed.

  Further, in the above-described ultrasonic cleaning method, the object holding apparatus includes a pair of object holding parts that hold the object to be processed, and the side object holding member holds the object to be processed. In the step of transferring the target object held by the target object holding device to the side holding member and moving the target object holding device to the side, At least one of the object holders moves from a holding position that holds the object to be processed to a side position that is located to the side of the holding position, and the one object to be processed of the object holding device. When the holding unit is at least in the lateral position, ultrasonic vibration from the vibrator may be propagated to a region of the target object that is held by the target object holding device. In this case, the object to be processed, which is immersed in the cleaning liquid in the cleaning tank and is held by the object holding device, is handed over to the side holding member provided in the cleaning tank, and the object holding device When at least one target object holding part moves from the holding position to the side position and the one target object holding part is at least in the side position, the control device generates ultrasonic vibrations in the vibrator. . Thereby, the ultrasonic vibration from the vibrator can be propagated to a region held by one of the objects to be processed among the objects to be processed. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  Further, in the above-described ultrasonic cleaning method, the target object holding device includes a first target object holding unit and a second target object holding unit which are individually movable, and the target object holding device is In the step of moving to the side, after the object to be processed is held on the side holding member and the first object holding part, the second object holding part of the object holding device is: The second object is moved from the second holding position for holding the object to be processed to a second side position located to the side of the second holding position, and then returned to the second holding position. After being held by the side holding member and the second object holding part, the first object holding part is moved from the first holding position holding the object to the side of the first holding position. Move to the first lateral position, then return to the first holding position, and When the first object holding part of the body holding device is at least in the first side position and when the second object holding part is at least in the second side position, The ultrasonic vibration may be propagated to a region held by the first object holder and the second object holder in the object to be processed. In this case, the object to be processed which is immersed in the cleaning liquid in the cleaning tank and held by the object holding device is held by the side holding member and the first object holding part provided in the cleaning tank. The second object holding unit of the object holding device moves from the second holding position to the second side position, and then returns to the second holding position. Further, the first object holding unit , When moving from the first holding position to the first side position and then returning to the first holding position, and when the first object holder is at least in the first side position, and the second object holder Is at least in the second lateral position, the control device causes the vibrator to generate ultrasonic vibrations. Thereby, the ultrasonic vibration from the vibrator can be propagated to a region of the target object that is held by the first target object holding unit and the second target object holding unit. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

  Furthermore, the present invention is a recording medium on which a computer program for executing an ultrasonic cleaning method is recorded. The ultrasonic cleaning method is held by a workpiece holding device and immersed in a cleaning liquid in a cleaning tank. The object to be processed is held on the side holding member provided in the cleaning tank, the process of moving the object holding apparatus to the side, and the bottom of the cleaning tank. And a step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator, wherein the step of moving the object holding device to the side and the step of ultrasonic cleaning include The recording medium is provided after the step of holding the side holding member on the side holding member.

  According to the present invention, after the object to be processed is held on the side holding member, the object holding apparatus is moved to the side to propagate the ultrasonic vibration from the vibrator to the object to be processed. it can. For this reason, it is possible to uniformly ultrasonically clean the entire area of the object to be processed.

FIG. 1 is a diagram showing an ultrasonic cleaning apparatus according to the first embodiment of the present invention. FIG. 2 is a side sectional view of FIG. FIG. 3 is a plan view of FIG. FIG. 4 is a view showing a discharge valve mechanism in the first embodiment of the present invention. FIG. 5 is a diagram showing the configuration of the workpiece holding device in the first embodiment of the present invention. FIG. 6 is a diagram showing a state in which a wafer is inserted into a cleaning tank in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 7 is a diagram showing a state in which the wafer is immersed in the cleaning liquid in the cleaning tank in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 8 is a diagram showing a state in which the wafer is delivered from the wafer board to the bus hand in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 9 is a diagram showing a state where the wafer board is moved to the lowered position in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 10 is a diagram showing a state in which the wafer board is moved to the side position in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 11 is a diagram showing a state in which the wafer board is moved to the lowered position in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 12 is a diagram showing a state where the wafer is delivered from the bus hand to the wafer board in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 13 is a diagram illustrating a state in which the bus hand has moved to the retracted position in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 14 is a diagram showing a state where a wafer is taken out from the cleaning tank in the ultrasonic cleaning method according to the first embodiment of the present invention. FIG. 15 is a diagram illustrating a state in which the second wafer holding unit is moved to the second lowered position in the ultrasonic cleaning method according to the second embodiment of the present invention. FIG. 16 is a diagram illustrating a state in which the second wafer holding unit has moved to the second lateral position in the ultrasonic cleaning method according to the second embodiment of the present invention. FIG. 17 is a diagram illustrating a state in which the second wafer holding unit has moved to the second lowered position in the ultrasonic cleaning method according to the second embodiment of the present invention.

First Embodiment Hereinafter, a first embodiment of the present invention will be described with reference to the drawings. 1 to 14 show a first embodiment of an ultrasonic cleaning apparatus, an ultrasonic cleaning method, and a recording medium on which a computer program for executing the ultrasonic cleaning method is recorded according to the first embodiment. It is a figure for demonstrating.

  First, the overall configuration of the ultrasonic cleaning apparatus 1 will be described with reference to FIG.

  As shown in FIG. 1, the ultrasonic cleaning apparatus 1 is provided with a cleaning tank 10 that stores a cleaning liquid (for example, pure water or a chemical solution), and can be inserted into the cleaning tank 10. And a wafer board (processing object holding device) 20 that holds the wafer W and simply immerses it in the cleaning liquid. Among these, the vibrator 40 is provided on the outer surface of the bottom plate (bottom part) 14 of the cleaning tank 10. An ultrasonic oscillating device 42 is connected to the vibrator 40 and is configured to generate ultrasonic vibration in the vibrator 40.

  The cleaning tank 10 is provided with a cleaning liquid supply device 60 that supplies the cleaning liquid into the cleaning tank 10, and the bottom plate 14 of the cleaning tank 10 is provided with a discharge valve mechanism 80 that discharges the cleaning liquid.

  Next, the detailed structure of each part will be described with reference to FIGS.

  As shown in FIGS. 1 to 3, the cleaning tank 10 is in close contact with the four side walls 11 and the lower end of each side wall 11 through a packing 12 in an air-tight (air-tight / water-tight) manner and fixed by fixing bolts 13. And is formed in a substantially rectangular parallelepiped shape. Of these, a notch groove 15 is formed at the upper end of the side wall 11, and the cleaning liquid flows out of the cleaning tank 10 when the level of the cleaning liquid reaches the upper end of the side wall 11.

  The side wall 11 of the cleaning tank 10 is formed of a material having high chemical resistance, such as polytetrafluoroethylene (PTFE) or fluororesin (PFA). The bottom plate 14 is formed of a material having high chemical resistance and sound wave transmission property, for example, a carbon-based material such as amorphous carbon or silicon carbide. As a result, even when ammonia hydrogen peroxide, hydrochloric acid hydrogen peroxide, dilute hydrofluoric acid, or the like, which will be described later, is used as the chemical solution, the side wall 11 and the bottom plate 14 of the cleaning tank 10 can have chemical resistance. For this reason, it can prevent that the side wall 11 and the baseplate 14 melt | dissolve with a washing | cleaning liquid, and can prevent that a metal contamination etc. generate | occur | produce. In addition, since the material of the bottom plate 14 also has sound wave permeability as described above, the ultrasonic vibration generated by the vibrator 40 can be reliably transmitted.

  The cleaning tank 10 is accommodated in a container 16. A pan (not shown) for collecting the cleaning liquid flowing out from the notch groove 15 formed at the upper end of the side wall 11 of the cleaning tank 10 is provided at the bottom of the container 16, and the recovered cleaning liquid is discharged to this pan. A drain (not shown) is provided.

  As shown in FIGS. 1, 2, and 5, the wafer board 20 includes a pair of wafer holding units (target object holding units) 21 a and 21 b that hold a plurality of (for example, 50) wafers W, A pair of base portions 22a and 22b are connected to the wafer holding portions 21a and 21b, respectively, and extend in a substantially vertical direction. Among these, the pair of wafer holding portions 21 a and 21 b are disposed substantially symmetrically with respect to the vertical axis Y (see FIGS. 6 to 14) passing through the center of the wafer W.

  Each wafer holding portion 21a, 21b includes two holding rods 23a, 23b extending in a substantially horizontal direction, and connecting members 24a, 24b connected to the tips of the holding rods 23a, 23b, respectively. Base portions 22a and 22b are connected to the base ends of the holding rods 23a and 23b, respectively. Each holding rod 23a, 23b is formed with a plurality of holding grooves 25a, 25b (see FIGS. 1 and 4) that can be engaged with the wafer W, and each holding groove 25a, 25b has substantially the same shape. Are aligned with each other. By engaging the wafer W with such holding grooves 25a and 25b, the wafer W can be held in a direction substantially perpendicular to the holding rods 23a and 23b, that is, in a vertical direction.

  Here, each part of the wafer board 20 is formed using quartz having high chemical resistance, and each surface is provided with a Teflon (registered trademark) coating or a SiC (silicon carbide) coating.

  A drive device 26 that drives the wafer board 20 to move up and down is connected to the wafer board 20. That is, the driving device 26 is connected between the elevating drive units 27a and 27b that elevate and lower the wafer holding units 21a and 21b, and the elevating drive units 27a and 27b and the bases 22a and 22b, respectively. Ascending / descending driving force transmitting portions 28a and 28b for transmitting the driving force of 27a and 27b are provided. Among these, each raising / lowering driving force transmission part 28a, 28b is each connected with the base parts 22a and 22b via the adapters 29a and 29b. In this way, the wafer holding portions 21a and 21b are configured to be individually movable (movable up and down). In addition, it is also possible to adjust the positional relationship of each wafer holding part 21a, 21b by using each raising / lowering drive part 27a, 27b.

  A control device 44 is connected to each of the lift drive units 27a and 27b, and the control device 44 is configured to drive each of the lift drive units 27a and 27b in synchronization. In this manner, the elevation drive units 27a and 27b lower the wafer holding units 21a and 21b based on the control signal from the control device 44, insert the wafer W into the cleaning tank 10, and immerse in the cleaning liquid. Alternatively, the wafer holders 21 a and 21 b are raised to carry the wafer W out of the cleaning tank 10.

  The wafer board 20 is located between a holding position for holding the wafer W in the cleaning tank 10 (a position for delivering the wafer W to the bus hand 50 described later) and a lowered position slightly below the holding position. The drive device 26 is configured to be movable (movable up and down) in a substantially vertical direction. That is, based on a control signal from the control device 44, the wafer holding units 21a and 21b are moved between the holding position and the lowered position by the elevating drive units 27a and 27b.

  Further, the wafer board 20 is configured to be movable in a substantially horizontal direction between a lowered position and a lateral position located on the side of the lowered position (holding position), and each wafer holding portion 21a, 21b. Are configured to be individually movable in a substantially horizontal direction. Note that the term “side” in this specification does not mean a strict horizontal direction, but, for example, ultrasonic vibrations propagated from the transducer 40 in the wafer W are shielded by the wafer holders 20a and 20b. If the wafer holders 20a and 20b can be displaced from the region to which the ultrasonic vibration is propagated to the region, it is used as including a direction oblique to the horizontal direction.

  The driving device 26 connected to the wafer board 20 is configured to move the wafer board 20 between a lowered position and a side position. In other words, the driving device 26 includes side movement driving units 30a and 30b that move the wafer holding units 21a and 21b between the lowered position and the side position, and the side movement driving units 30a and 30b and the elevation driving force. Side drive force transmission portions 31a and 31b are connected between the transmission portions 28a and 28b, respectively, and transmit the drive force of the lateral movement drive portions 30a and 30b.

  A control device 44 is connected to each lateral movement drive unit 30a, 30b. In this way, the lateral movement driving units 30a and 30b are configured to move the wafer holding units 21a and 21b between the lowered position and the lateral position, respectively, based on the control signal from the control device 44. ing. In this case, the control device 44 moves the wafer holders 21 a and 21 b substantially symmetrically with respect to the vertical axis Y passing through the center of the wafer W.

  As shown in FIGS. 2 and 6 to 14, a bath hand (side holding member) 50 that receives and holds the wafer W from the wafer board 20 is provided in the cleaning tank 10. In the cleaning tank 10, the bus hand 50 is configured to be movable in a substantially horizontal direction between a delivery position for receiving and holding the wafer W and a retreat position for retreating away from the wafer W. In other words, the bus hand 50 has a pair of sandwiching portions 51 that are located on both sides of the wafer W held on the wafer board 20 and abut against the side surface of the wafer W to sandwich the wafer W. Each clamping unit 51 includes two contact bars 52 that contact the side surface of the wafer W and a connecting member 53 that connects each contact bar 52. Among these, the two contact rods 52 of each clamping part 51 are arranged symmetrically with respect to the horizontal axis X (see FIGS. 6 to 14) passing through the center of the wafer W, and the horizontal axis of the wafer W. It is arranged near the intersection of X and the outer edge of the wafer W. Thus, it is possible to prevent the wafer W from being formed with a region where the ultrasonic vibrations propagated from below are shielded by the respective sandwiching portions 51, and to uniformly clean the entire area of the wafer W by ultrasonic cleaning. Can do.

  Here, each part of the bus hand 50 is formed using quartz having high chemical resistance like the wafer board 20, and each surface is coated with Teflon coating or SiC coating.

  In addition, a hand driving unit (not shown) that links each clamping unit 51 between a delivery position and a retracted position is coupled to each clamping unit 51, and a control device 44 is coupled to the hand driving unit. As described above, the hand drive unit is configured to interlock each clamping unit 51 between the delivery position and the retracted position based on the control signal from the control device 44.

  The cleaning liquid supply device 60 has two cleaning liquid supply nozzles 61 provided along the opposite side walls 11 of the cleaning tank 10. Each of the cleaning liquid supply nozzles 61 has a tubular nozzle body 61a extending in a substantially horizontal direction on the side wall 11 of the cleaning tank 10, and a plurality of cleaning liquid supply nozzles 61 formed in the tubular nozzle body 61a and arranged at appropriate intervals along the longitudinal direction. The first nozzle hole 61b and the second nozzle hole 61c are included. Among these, the first nozzle hole 61 b is configured to inject the cleaning liquid toward the center side of the wafer W, and the second nozzle hole 61 c is configured to inject the cleaning liquid toward the bottom plate 14 of the cleaning tank 10. Has been.

  A switching valve 63 is connected to the cleaning liquid supply nozzle 61 via a cleaning liquid supply pipe 62. A pure water supply source 65 is connected to the switching valve 63 via a pure water supply pipe 64, and a chemical liquid supply source (chemical liquid tank) 67 is connected via a chemical liquid supply pipe 66. The switching valve 63 is connected to the control device 44, and the control device 44 controls switching of the supply pipe (the pure water supply pipe 64 or the chemical liquid supply pipe 66) that communicates with the cleaning liquid supply pipe 62 via the switching valve 63. It has become.

  The pure water supply pipe 64 is provided with an opening / closing valve 68 that adjusts the flow rate of pure water passing through the pure water supply pipe 64. The on-off valve 68 is connected to the control device 44, and the control device 44 controls the supply of pure water from the pure water supply source 65 to the cleaning tank 10 through the on-off valve 68.

A chemical solution pump 69 for supplying the chemical solution to the cleaning tank 10 is provided in the chemical solution supply pipe 66. The chemical solution pump 69 is connected to the control device 44, and the control device 44 controls supply of the chemical solution from the chemical solution tank 67 to the cleaning tank 10 via the chemical solution pump 69. Here, as the chemical solution, depending on the purpose of cleaning, ammonia perwater (SC1, specifically NH ₄ OH / H ₂ O ₂ / H ₂ O), hydrochloric acid perwater (SC2, specifically HCl / H ₂ O ₂ / H ₂ O) or dilute hydrofluoric acid (DHF) is used.

Without using such a chemical pump 69, nitrogen (N ₂ ) gas or the like is supplied into the chemical tank 67 based on a control signal from the control device 44 to supply the chemical to the chemical supply pipe 66. You may comprise. Further, the number of chemical liquid tanks 67 connected to the switching valve 63 is not limited to one, and a plurality of chemical liquid tanks 67 may be connected. In this case, a plurality of types of chemical solutions can be supplied to the cleaning tank 10.

  As shown in FIGS. 3 and 4, two discharge valve mechanisms 80 for discharging the cleaning liquid are provided on the bottom plate 14 of the cleaning tank 10. Each discharge valve mechanism 80 includes a contacted portion 81 attached to the outer surface of the bottom plate 14, a valve body 82 that can be in contact with the contacted portion 81 in an air-watertight manner, and a piston rod that drives the valve body 82. And a cylinder device 84 including 83. A drainage port 85 is formed through the contacted portion 81 and the bottom plate 14. The control device 44 is connected to the cylinder device 84, and the cylinder device 84 is configured to drive the valve element 82 based on a control signal from the control device 44. The drainage port 85 is disposed at a position directly below the base of the wafer board 20. Accordingly, the discharge valve mechanism 80 is not disposed at a position corresponding to the wafer W on the outer surface of the bottom plate 14 of the cleaning tank 10, the vibrator 40 can be attached, and the wafer W is reliably cleaned. Can do. In addition, in this Embodiment, although the drainage port 85 is formed in the rectangular shape, it can also be made into arbitrary shapes, such as circular. Further, the number of discharge valve mechanisms 80 provided in the cleaning tank 10 is not limited to two, and may be one or three or more.

  As shown in FIG. 1 and FIG. 2, the vibrator 40 of the cleaning tank 10 includes a plurality of vibrator single bodies 41, and the plurality of vibrator single bodies 41 are attached to the outer surface of the bottom plate 14 of the cleaning tank 10. Each transducer unit 41 is connected to form a transducer 40 and is connected to the ultrasonic oscillator 42. The number of the single vibrator 41 attached to the cleaning tank 10 may be one as long as it can occupy a position corresponding to the wafer W held on the wafer board 20 on the outer surface of the bottom plate 14 of the cleaning tank 10. Any number can be used.

  An ultrasonic oscillator 42 is connected to the vibrator 40, and a drive power supply unit 43 that supplies power is connected to the ultrasonic oscillator 42. Further, a control device 44 is connected to the ultrasonic oscillation device 42, and the ultrasonic oscillation device 42 is configured to send high-frequency drive power (drive signal) to the vibrator 40 based on an instruction from the control device 44. Yes.

  After delivering the wafer W from the wafer board 20 to the bus hand 50, the control device 44 moves the wafer holding portions 21a and 21b of the wafer board 20 from the holding position to the lowered position, and between the lowered position and the side position. Move continuously in a substantially symmetrical manner. The control device 44 is configured to generate ultrasonic vibration in the vibrator 40 while moving between the lowered position and the side position. In this way, the ultrasonic vibration from the vibrator 40 is propagated to the area of the wafer W held by the wafer holders 21a and 21b, and the ultrasonic vibration is propagated uniformly throughout the entire area of the wafer W. ing. Further, after the ultrasonic cleaning of the wafer W is completed, the control device 44 moves the wafer holders 21a and 21b to the holding position via the lowered position, and delivers the wafer W from the bus hand 50 to the wafer board 20. It is configured.

  In the present embodiment, the control device 44 includes a computer, and the computer executes a program stored in advance in the recording medium 45 so that the wafer W is cleaned using the ultrasonic cleaning device 1. It has become.

  Next, the operation of the present embodiment having such a configuration, that is, the ultrasonic cleaning method according to the present embodiment will be described with reference to FIGS.

  First, the cleaning liquid is stored in the cleaning tank 10 (first step). In this case, first, as shown in FIG. 1, the open / close valve 68 is opened in response to a control signal from the control device 44, and pure water is supplied from the pure water supply source 65 to the cleaning liquid supply nozzle 61 through the switching valve 63. The At this time, the switching valve 63 is controlled by the control device 44, and the pure water supply pipe 64 is communicated with the cleaning liquid supply pipe 62.

  After supplying pure water, the chemical liquid pump 69 is driven in response to a control signal from the controller 44, and the chemical liquid is supplied from the chemical liquid tank 67 to the cleaning liquid supply nozzle 61 via the switching valve 63. At this time, the switching valve 63 is controlled by the control device 44, and the chemical liquid supply pipe 66 is communicated with the cleaning liquid supply pipe 62.

  When the liquid level of the stored cleaning liquid reaches the notch groove 15 provided at the upper end of the side wall 11 of the cleaning tank 10, the cleaning liquid flows out of the cleaning tank 10 through the notch groove 15. The cleaning liquid that has flowed out is collected in a pan (not shown) of the container 16 that houses the cleaning tank 10, and is discharged from a drain (not shown) to the outside of the container 16. Even after this, the supply of the chemical solution from the chemical solution tank 67 is continued.

  Next, the wafer W is immersed in the cleaning liquid in the cleaning tank 10 (second step). In this case, first, a plurality of, for example, 50 wafers W transferred by a transfer mechanism (not shown) are engaged with the holding grooves 25a and 25b formed in the holding rods 23a and 23b of the wafer board 20 to hold the wafer. It hold | maintains at the parts 21a and 21b (refer FIG. 6). Next, in response to a control signal from the control device 44, the elevating drive units 27a and 27b are driven synchronously, and the wafer holding units 21a and 21b holding the wafer W are lowered and inserted into the cleaning tank 10. (See FIG. 7). In this way, the wafer W is immersed in the cleaning liquid. At this time, the wafer holding portions 21a and 21b are located at holding positions for holding the wafer W.

Next, the wafer W is delivered from the wafer board 20 to the bus hand 50 (third step).
In this case, first, the hand drive unit is driven in response to a control signal from the control device 44, each clamping unit 51 moves from the retracted position to the delivery position, and each clamping unit 51 comes into contact with the side surface of the wafer W ( (3rd process, refer FIG. 8). As a result, the wafer W is held between the pair of holding portions 51 and held by the bus hand 50. At this time, the wafer holders 21a and 21b are maintained at holding positions for holding the wafer W.

Next, the wafer board 20 descends from the position where the wafer W was held (fourth step).
That is, in response to a control signal from the control device 44, the elevating drive units 27a and 27b are driven in synchronization, and the wafer holding units 21a and 21b are lowered (see FIG. 9). As a result, the wafer holders 21 a and 21 b are separated from the wafer W. At this time, the wafer holders 21a and 21b are in a lowered position located below the holding position.

  Next, the wafer board 20 continuously moves between the lowered position and the side position (fifth step). In this case, the lateral movement drive units 30 a and 30 b are driven in response to a control signal from the control device 44, and the wafer holding units 21 a and 21 b are substantially symmetrical with respect to the vertical axis Y passing through the center of the wafer W. Moving. That is, one wafer holding portion 21a moves to the left in FIG. 9, and the other wafer holding portion 21b moves to the right, so that the wafer holding portions 21a and 21b reach the side positions (see FIG. 10). ). Thereafter, the one wafer holding portion 21a moved to the left moves to the right, the other wafer holding portion 21b moved to the right moves to the left, and the wafer holding portions 21a and 21b return to the lowered position. (See FIG. 11). In this way, the wafer holders 21a and 21b reciprocate continuously and symmetrically between the lowered position and the side position. That is, when the ultrasonic cleaning step (sixth step) described later is completed, the wafer holders 21a and 21b return to the lowered position. Note that the number of times the wafer holders 21a and 21b reciprocate between the lowered position and the side position is not limited to one, and may be a plurality of times.

  While the wafer board 20 is continuously moving between the lowered position and the side position, the control device 44 causes the vibrator 40 to generate ultrasonic vibration (sixth step). In this case, high frequency driving power (drive signal) is sent from the ultrasonic oscillator 42 to the vibrator 40 of the cleaning tank 10 to cause ultrasonic vibration in the vibrator 40 and the wafer W is ultrasonically cleaned. . Thus, ultrasonic cleaning can be efficiently performed in a short time by generating ultrasonic vibration while moving the wafer board 20. During this time, the wafer holders 21a and 21b continuously move between a lowered position and a side position located below the holding position. Thus, it is possible to reliably prevent the wafer holders 21a and 21b from contacting the wafer W while moving between the lowered position and the side position.

  While the vibrator 40 is ultrasonically vibrated, the ultrasonic vibration is transmitted through the bottom plate 14 of the washing tank 10 and propagated to the washing liquid. In this way, particles and the like attached to the wafer W are removed. During this time, the chemical solution continues to be supplied into the cleaning tank 10. Thus, particles removed from the wafer W and floating on the surface of the cleaning liquid can flow out of the notch groove 15 of the cleaning tank 10 together with the overflowing cleaning liquid. For this reason, the cleaning liquid can be maintained in a clean state, and the cleaning efficiency of the wafer W can be improved.

  After performing the ultrasonic cleaning process of the wafer W, the rinse process of the wafer W in the cleaning tank 10 is performed (seventh step). In this case, first, the chemical liquid pump 69 is stopped, and the supply of the chemical liquid to the cleaning tank 10 is stopped. Next, the control device 44 opens the on-off valve 68 and operates the switching valve 63 so that pure water is supplied from the pure water supply source 65 to the cleaning tank 10. Thereafter, in the same manner as in the sixth step described above, ultrasonic vibration is generated in the vibrator 40 to propagate the ultrasonic vibration to the cleaning liquid.

  Next, the wafer W is delivered from the bus hand 50 to the wafer board 20 (eighth step, ninth step). In this case, first, in response to a control signal from the control device 44, the elevating drive units 27a and 27b are driven in synchronization, the wafer holding units 21a and 21b are raised, and the wafer W is held in the holding grooves 25a of the holding bars 23a and 23b. , 25b and held by the wafer holders 21a, 21b (eighth step, see FIG. 12). In this way, the wafer W is delivered from the bus hand 50 to the wafer board 20. At this time, the wafer holders 21a and 21b are in a holding position for holding the wafer W.

  Thereafter, the hand drive unit is driven in response to a control signal from the control device 44, and each clamping unit 51 moves from the delivery position to the retracted position (see the ninth step, FIG. 13). As a result, the bus hand 50 moves away from the wafer W. At this time, the wafer holders 21a and 21b are maintained at the holding positions.

  Next, the wafer W immersed in the cleaning liquid is unloaded from the cleaning tank 10 (tenth step). In this case, in response to a control signal from the control device 44, the elevation drive units 27a and 27b are driven in synchronization, the wafer holding units 21a and 21b holding the wafer W are raised, and the wafer W is unloaded from the cleaning tank 10. Is done. Thereafter, the wafer W is delivered from the wafer board 20 to a transfer mechanism (not shown).

  Thereafter, the wafers W can be sequentially ultrasonically cleaned in the cleaning tank 10 by appropriately repeating the above-described steps.

  Note that the cleaning liquid in the cleaning tank 10 is replaced as necessary. In this case, first, as shown in FIG. 3, the cylinder device 84 of the discharge valve mechanism 80 is driven based on the control signal from the control device 44, and the valve body 82 is pulled away from the contacted portion 81. As a result, the cleaning liquid is discharged through the liquid discharge port 85, and the cleaning liquid in the cleaning tank 10 can be discharged in a short time. After the discharge of the cleaning liquid is completed, the cylinder device 84 is driven to bring the valve body 82 into contact with the contacted portion 81, and the space between the contacted portion 81 and the valve body 82 is kept airtight. Thereafter, the cleaning liquid is stored in the cleaning tank 10 in the same manner as in the first step described above. In this way, the cleaning liquid is replaced.

  As described above, according to the present embodiment, the wafer W immersed in the cleaning liquid in the cleaning tank 10 and held by the wafer holding portions 21 a and 21 b of the wafer board 20 is provided in the cleaning tank 10. Then, the wafer holders 21a and 21b are moved from the holding position to the lowered position and continuously moved between the lowered position and the side position. While the wafer holders 21a and 21b are moving between the lowered position and the side position, the control device 44 causes the vibrator 40 to generate ultrasonic vibration. As a result, the ultrasonic vibration from the vibrator 40 is propagated to a region (shielded region) held by the wafer holders 21a and 21b in the wafer W, and the ultrasonic vibration is uniformly distributed over the entire area of the wafer W. Can be propagated to. For this reason, the entire area of the wafer W can be uniformly ultrasonically cleaned.

  Further, according to the present embodiment, the wafer holders 21a and 21b are arranged substantially symmetrically with respect to the vertical axis Y passing through the center of the wafer W, and between the lowered position and the side position. It moves substantially symmetrically with respect to the vertical axis Y. Thus, after the wafer W is transferred from the wafer board 20 to the bus hand 50, the distance (the distance between the holding position and the lowered position) for lowering the wafer holding portions 21a and 21b can be shortened. In addition, the moving distance between the lowered position and the lateral position of the wafer holding portions 21a and 21b can be shortened. For this reason, the structure of the drive device 26 can be simplified.

  In addition, in this Embodiment mentioned above, a various deformation | transformation is possible within the range of the summary of this invention. Hereinafter, typical modifications will be described.

  That is, in the present embodiment, the example in which the wafer holding portions 21a and 21b of the wafer board 20 continuously move between the lowered position and the side position has been described. However, the present invention is not limited to this, and the wafer holders 21a and 21b stop for a predetermined time after reaching the side position from the lowered position, and then move from the side position to the lowered position. The control device 44 may be configured. Also in this case, the ultrasonic vibration from the vibrator 40 can be propagated to the area of the wafer W held by the wafer holding portions 21a and 21b, and the ultrasonic vibration can be uniformly propagated to the entire area of the wafer W. it can.

  In addition, as described above, when the wafer holding units 21a and 21b that have reached the lateral position are stopped for a predetermined time, the transducer 40 is superposed only while the wafer holding units 21a and 21b are stopped at the lateral position. The control device 44 may be configured to generate sonic vibration. That is, the controller 44 transfers the wafer W from the wafer board 2 to the bus hand 50 and then moves the wafer holders 21a and 21b from the lowered position to the side position, so that the wafer holders 21a and 21b are at least at the side positions. In this case, the ultrasonic vibration from the vibrator 40 is held by the wafer holders 21a and 21b of the wafer W. The ultrasonic vibration can be propagated to the entire region of the wafer W and the ultrasonic vibration can be propagated uniformly.

  In the present embodiment, the control device 44 causes the vibrator 40 to generate ultrasonic vibration while the wafer holders 21a and 21b are continuously moving between the lowered position and the side position. Said. However, the present invention is not limited to this, and the vibrator 40 may generate ultrasonic vibration only while the wafer holders 21a and 21b are moving from the lowered position to the side position. The transducer 40 may generate ultrasonic vibration only while the wafer holders 21a and 21b are moving from the lateral position to the lowered position. In any case, the ultrasonic vibration from the vibrator 40 is propagated to the area of the wafer W held by the wafer holders 21a and 21b, and the ultrasonic vibration is uniformly propagated to the entire area of the wafer W. Can do.

  In the present embodiment, the wafer board 20 has a pair of wafer holding portions 21a and 21b, and the wafer holding portions 21a and 21b are individually moved. However, the present invention is not limited to this, and the wafer holding portions 21a and 21b may be integrally formed so as to move integrally between the lowered position and the side position. Also in this case, the ultrasonic vibration from the vibrator 40 can be propagated to a region of the wafer W held by the wafer board 20 and the ultrasonic vibration can be uniformly propagated to the entire area of the wafer W.

  In the present embodiment, the wafer holders 21a and 21b move from the holding position to the lateral position via the lowered position located below the holding position, and laterally pass through the lowered position. The example of moving from the position to the holding position has been described. However, the present invention is not limited to this, and the wafer holders 21a and 21b may be configured to move between the holding position and the side position without going through the lowered position. In this case, the drive control of the wafer holders 21a and 21b can be simplified.

  Further, in the present embodiment, the example in which the wafer holding portions 21a and 21b move substantially symmetrically with respect to the vertical axis Y passing through the center of the wafer W has been described. However, the present invention is not limited to this, and the wafer holders 21a and 21b may be configured to move between the lowered position and the side position in the same direction. In this case, for example, first, one wafer holding part (first wafer holding part) 21a is moved leftward (see FIG. 10) from the lowered position to the side position. Next, the first wafer holding unit 21a is moved rightward from the side position to the lowered position, and the other wafer holding unit (second wafer holding unit) 21b is moved rightward from the lowered position to the side position. . Thereafter, the second wafer holder 21b is moved leftward from the lateral position to the lowered position. In this way, ultrasonic vibration may be generated in the vibrator 40 while moving the wafer holders 21a and 21b. Also in this case, the ultrasonic vibration from the vibrator 40 can be propagated to the area of the wafer W held by the wafer holding portions 21a and 21b, and the ultrasonic vibration can be uniformly propagated to the entire area of the wafer W. it can. In this case, the number of times the wafer holders 21a and 21b reciprocate between the lowered position and the side position can be any number.

  When the wafer holding units 21a and 21b are moved in the same direction between the lowered position and the side position as described above, the control device 44 delivers the wafer W from the wafer board 20 to the bus hand 50. Thereafter, any one of the wafer holding units, for example, the first wafer holding unit 21a is moved from the lowered position to the side position, and when the first wafer holding unit 21a is at least in the side position, You may comprise so that a sonic vibration may be produced. Alternatively, while the first wafer holding part 21a is moved from the lowered position to the side position, and while the other wafer holding part (second wafer holding part) 21b is moved from the side position to the lowered position. Only the ultrasonic vibration may be generated in the vibrator 40. Alternatively, ultrasonic vibration is generated in the vibrator 40 only while the first wafer holding part 21a is moved from the lateral position to the lowered position and the second wafer holding part 21b is moved from the lowered position to the lateral position. You may let them. Also in this case, the ultrasonic vibration from the vibrator 40 can be propagated to the area of the wafer W held by the wafer holding portions 21a and 21b, and the ultrasonic vibration can be uniformly propagated to the entire area of the wafer W. it can.

  Moreover, in this Embodiment, the washing tank 10 was accommodated in the container 16, and the example in which the pan which collect | recovers the washing | cleaning liquid which flowed out from the washing tank 10 was arrange | positioned at the bottom part of this container 16 was described. However, the present invention is not limited to this, and the cleaning tank 10 may have an inner tank that stores the cleaning liquid and an outer tank that collects the cleaning liquid that overflows from the inner tank. In this case, the outer tank may be connected to a circulation pipe for supplying the cleaning liquid to the cleaning liquid supply nozzle disposed in the inner tank, or a discharge valve mechanism for discharging the cleaning liquid to the outer tank is provided. Also good.

  In the present embodiment, the example in which the two cleaning liquid supply nozzles 61 are provided in the cleaning tank 10 has been described. However, the present invention is not limited to this, and four cleaning liquid supply nozzles (not shown) may be provided.

  Further, in the present embodiment, the bottom plate 14 of the cleaning tank 10 is formed of amorphous carbon or silicon carbide, the thickness of the bottom plate 14 is relatively thick (for example, 6.5 mm), and the vibrator 40 is directly attached. An example was given. However, the present invention is not limited to this, and the thickness of the bottom plate 14 is made thinner than this, and the vibrator 40 is attached to the bottom plate 14 with a stainless steel reinforcing plate having good sound wave permeability interposed therebetween. May be. Even in this case, the ultrasonic waves from the transducer 40 can be transmitted efficiently.

  Further, in the present embodiment, the vibrator 40 is directly attached to the bottom plate 14 of the cleaning tank 10. However, the present invention is not limited to this, and an additional tank (not shown) storing pure water is provided below the cleaning tank 10 so that at least the bottom of the cleaning tank 10 is immersed. You may comprise so that the vibrator | oscillator 40 may be attached to a bottom part. In this case, the ultrasonic vibration generated from the vibrator 40 is transmitted to the cleaning tank 10 through the pure water of the additional tank, and the wafer W can be reliably ultrasonically cleaned in the cleaning tank 10.

  In addition, although several modifications about embodiment mentioned above were described, it is also possible to apply combining several modifications suitably.

Second Embodiment Next, a second embodiment of the present invention will be described with reference to FIGS. 15 to 17 show a second embodiment of an ultrasonic cleaning apparatus, an ultrasonic cleaning method, and a recording medium on which a computer program for executing the ultrasonic cleaning method is recorded according to the second embodiment. It is a figure for demonstrating.

  In the second embodiment shown in FIGS. 15 to 17, after the wafer is held by the first wafer holding part of the bus hand and the wafer board, the second wafer holding part moves to the side, and the ultrasonic wave The main difference is that cleaning is performed, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 15 to 17, the same parts as those of the first embodiment shown in FIGS. 1 to 14 are denoted by the same reference numerals, and detailed description thereof is omitted.

  The wafer board 20 in the present embodiment has a pair of wafer holders 21a and 21b (that is, a first wafer holder 21a and a second wafer holder 21b) that are individually movable.

  The controller 44 holds the wafer W on the bus hand 50 and the first wafer holding part 21a of the wafer board 20, and then moves the second wafer holding part 21b of the wafer board 20 from the second holding position to the second lowered position. Then, the driving device 26 is controlled to move to the second lateral position and then return to the first holding position from the second lateral position via the second lowered position. Thereafter, the controller 44 holds the wafer W on the bus hand 50 and the second wafer holding part 21b, and then moves the first wafer holding part 20a from the first holding position to the first side via the first lowered position. The drive device 26 is controlled to move to the first position and then return to the first holding position from the first lateral position via the first lowered position.

  The control device 44 is configured so that the second wafer holding portion 21b moves between the second lowered position and the second lateral position, and the first wafer holding portion 21a moves to the first lowered position and the first side. While moving between the two positions, the ultrasonic oscillator 42 is controlled so as to generate ultrasonic vibrations in the vibrator 40. In this manner, the ultrasonic vibration from the vibrator 40 is propagated to the area (shielded area) held by the first wafer holding part 21a and the second wafer holding part 21b in the wafer W. Yes. The controller 44 equalizes the movement of the first wafer holding part 21a and the movement of the second wafer holding part 21b so that the ultrasonic vibration is shielded by the first wafer holding part 21a in each region of the wafer W. The driving device 26 is controlled so that the time is equal to the time during which the ultrasonic vibration is shielded by the second wafer holding unit 21b.

  The ultrasonic cleaning method in the present embodiment will be described. Here, the steps different from those of the first embodiment will be mainly described.

  First, the wafer W immersed in the cleaning liquid is sandwiched between the pair of sandwiching portions 51 of the bus hand 50 (third process, see FIG. 8). In this case, the hand driving unit is driven in response to a control signal from the control device 44, each clamping unit 41 moves from the retracted position to the delivery position, and each clamping unit 51 comes into contact with the side surface of the wafer W. As a result, the wafer W is held between the pair of holding portions 51. At this time, the first wafer holding part 21a and the second wafer holding part 21b are respectively maintained at the first holding position and the second holding position for holding the wafer W.

  Next, the second wafer holding part 21b of the wafer board 20 moves to the side, and the wafer W is subjected to ultrasonic cleaning.

  In this case, first, the second wafer holding portion 21b of the wafer board 20 is lowered from the position where the wafer W is held (21st step). That is, in response to a control signal from the control device 44, the elevation drive unit 27b is driven, and the second wafer holding unit 21b is lowered (see FIG. 15). As a result, the wafer W is held by the bus hand 50 and the first wafer holding part 21a, and the second wafer holding part 21b is separated from the wafer W. At this time, the second wafer holding part 21b is in a second lowered position located below the second holding position.

  Next, the second wafer holding unit 21b continuously moves between the second lowered position and the second side position (22nd step). In this case, the lateral movement drive unit 30b is driven in response to a control signal from the control device 44, and moves to the right in FIG. 15 to reach the second lateral position (see FIG. 16). Thereafter, the second wafer holding part 21b moved to the right moves to the left and returns to the second lowered position (see FIG. 17). During this time, the first wafer holding unit 21a is stopped while holding the wafer W together with the bus hand 50. In this way, the second wafer holder 21b reciprocates continuously between the second lowered position and the second side position. The number of times the second wafer holding part 21b reciprocates between the second lowered position and the second side position is not limited to one, and may be a plurality of times.

  While the second wafer holding unit 21b is continuously moving between the second lowered position and the second lateral position, the control device 44 causes the vibrator 40 to generate ultrasonic vibration (23rd step). In this way, ultrasonic vibration can be propagated to a region of the wafer W that is shielded by the second wafer holding part 21b.

  Next, the second wafer holding part 21b moves up from the second lowered position and returns to the second holding position for holding the wafer W (24th step, see FIG. 12). In this case, in response to a control signal from the control device 44, the elevation drive unit 27b is driven, and the second wafer holding unit 21b is raised. As a result, the first wafer holding part 21a and the second wafer holding part 21b have substantially the same height, and the wafer W engages with the holding groove 25b of the holding bar 23b, so that the second wafer holding part 21b It will be retained. In this way, the wafer W is held by the bus hand 50, the first wafer holding unit 21a, and the second wafer holding unit 21b. At this time, the second wafer holding unit 21b is in the second holding position for holding the wafer W.

  Thereafter, in the same manner as the second wafer holding unit 21b, the first wafer holding unit 21a moves to the side to perform ultrasonic cleaning of the wafer W.

  In this case, first, the first wafer holder 21a is lowered from the position where the wafer W is held (25th step). That is, in response to a control signal from the control device 44, the elevating drive unit 27a is driven, and the first wafer holding unit 21a is lowered. As a result, the wafer W is held by the bus hand 50 and the second wafer holding unit 21b, and the first wafer holding unit 21a is separated from the wafer W. At this time, the first wafer holding part 21a is in a first lowered position located below the first holding position.

  Next, the first wafer holder 21a continuously moves between the first lowered position and the first lateral position (26th step). In this case, the lateral movement drive unit 30a is driven in response to a control signal from the control device 44, moves to the left in FIG. 15, and reaches the first lateral position. Thereafter, the first wafer holding part 21a moved in the left direction moves in the right direction and returns to the first lowered position. During this time, the second wafer holding unit 21b is stopped while holding the wafer W together with the bus hand 50. In this way, the first wafer holder 21a reciprocates continuously between the first lowered position and the first lateral position. The number of times the first wafer holding part 21a reciprocates between the first lowered position and the first side position is not limited to one, and may be a plurality of times.

  While the first wafer holding unit 21a continuously moves between the first lowered position and the first lateral position, the control device 44 causes the vibrator 40 to generate ultrasonic vibrations (27th step). In this way, the ultrasonic vibration can be propagated to the area of the wafer W that is shielded by the first wafer holder 21a.

  Next, the first wafer holding unit 21b moves up from the first lowered position and returns to the holding position for holding the wafer W (step 28, see FIG. 12). In this case, in response to a control signal from the control device 44, the elevation drive unit 27a is driven, and the first wafer holding unit 21a is raised. As a result, the first wafer holding part 21a and the second wafer holding part 21b have substantially the same height, and the wafer W engages with the holding groove 25a of the holding bar 23a and is held by the first wafer holding part 21a. Will come to be. In this way, the wafer W is held by the bus hand 50, the first wafer holding unit 21a, and the second wafer holding unit 21b. At this time, the first wafer holding part 21a is in the first holding position for holding the wafer W.

  Next, rinsing processing of the wafer W in the cleaning tank 10 is performed (29th step). In this case, the chemical solution in the cleaning tank 10 is discharged and pure water is supplied, and the first wafer holding unit 21a or the second wafer holding unit 21b is moved in the same manner as in the 21st to 28th steps described above. , Propagate ultrasonic vibrations in the cleaning solution.

  Thereafter, the wafer W is unloaded from the cleaning tank 10.

  As described above, according to the present embodiment, the wafer W immersed in the cleaning liquid in the cleaning tank 10 and held by the first wafer holding unit 21a and the second wafer holding unit 21b of the wafer board 20 is converted into the cleaning tank. 10 is held by the bus hand 50 and the first wafer holding portion 21a provided in the inside 10 and then the second wafer holding portion 21b is moved from the second holding position to the second lowered position, and the second lowered position and the first wafer holding portion 21a are moved. It moves continuously between the two lateral positions and returns to the second holding position. Thereafter, the wafer W is held by the bus hand 50 and the second wafer holding part 21b, and the first wafer holding part 21a is moved from the first holding position to the first lowered position, and the first lowered position and the first It moves continuously between the one side position and returns to the first holding position. While the first wafer holder 21a is moving between the first lowered position and the first lateral position, and the second wafer holder 21b is moved between the second lowered position and the second lateral position. During this time, the control device 44 causes the vibrator 40 to generate ultrasonic vibration. As a result, the ultrasonic vibration from the transducer 40 is propagated to the area (shielded area) held by the first wafer holding part 21a and the second wafer holding part 21b in the wafer W, and the wafer W Ultrasonic vibrations can be propagated uniformly throughout the entire area. For this reason, the entire area of the wafer W can be uniformly ultrasonically cleaned.

  Further, according to the present embodiment, when the wafer W is ultrasonically cleaned, the wafer W is held by one of the wafer holding portions of the bus hand 50 and the wafer board 20. As a result, the wafer W can be stably held.

  In the second embodiment described above, various modifications can be made within the scope of the present invention, as in the first embodiment.

  In particular, in the second embodiment, the second wafer holding unit 21b is moved between the second lowered position and the second lateral position, and the first wafer holding unit 21a is the first wafer holding unit 21b. An example in which ultrasonic vibration is generated in the vibrator 40 while moving between the lowered position and the first lateral position has been described. However, the present invention is not limited to this. When the first wafer holding unit 21a and the second wafer holding unit 21b that have reached the first side position and the second side position are stopped for a predetermined time, the first wafer holding unit is held. Control is performed so that ultrasonic vibration is generated in the vibrator 40 only while the portion 21a is stopped at the first lateral position and only while the second wafer holding portion 21b is stopped at the second lateral position. The device 44 may be configured. That is, the controller 44 holds the wafer W on the bus hand 50 and the first wafer holding part 21a, then moves the second wafer holding part 21b from the second holding position to the second lateral position, and thereafter 2 After returning to the holding position and holding the wafer W on the bus hand 50 and the second wafer holding part 21b, the first wafer holding part 21a is moved from the first holding position to the first lateral position, and thereafter Returning to the first holding position, when the first wafer holding part 21a is at least in the first lateral position and when the second wafer holding part 21b is at least in the second lateral position, the vibrator 40 is ultrasonically vibrated. What is necessary is just to comprise so that it may produce. Also in this case, the ultrasonic vibration from the transducer 40 is propagated to the area (shielded area) held by the first wafer holding part 21a and the second wafer holding part 21b in the wafer W, and the wafer W The ultrasonic vibration can be propagated uniformly throughout the entire area.

  Incidentally, as described above, the ultrasonic cleaning device 1 has the control device 44 including a computer. The control device 44 is configured to operate each component of the ultrasonic cleaning apparatus 1 so that the wafer W is cleaned. A recording medium 45 that records a program executed by the computer of the control device 44 in order to perform cleaning of the wafer W using the ultrasonic cleaning apparatus 1 is also a subject of this case. Here, the recording medium 45 may be a memory such as a ROM or a RAM, or may be a disk-shaped recording medium 45 such as a hard disk or a CD-ROM.

  In the above description, the ultrasonic cleaning apparatus 1 according to the present invention, the ultrasonic cleaning method, and the recording medium 45 on which the computer program for executing the ultrasonic cleaning method is recorded, the semiconductor wafer W cleaning process. The example applied to is shown. However, the present invention is not limited to this, and the present invention can be applied to cleaning various substrates such as an LCD substrate or a CD substrate.

DESCRIPTION OF SYMBOLS 1 Ultrasonic cleaning apparatus 10 Cleaning tank 11 Side wall 12 Packing 13 Fixing bolt 14 Bottom plate 15 Notch groove 16 Container 20 Wafer board 21a, 21b Wafer holding part 22a, 22b Base part 23a, 23b Holding rod 24a, 24b Connecting member 25a, 25b Holding groove 26 Drive devices 27a, 27b Elevation drive units 28a, 28b Elevation drive force transmission units 29a, 29b Adapters 30a, 30b Lateral movement drive units 31a, 31b Lateral drive force transmission units 40 Transducer 41 Transducer unit 42 Ultrasonic oscillation device 43 drive power supply unit 44 control device 45 recording medium 50 bus hand 51 clamping unit 52 contact rod 53 connecting member 60 cleaning liquid supply device 61 cleaning liquid supply nozzle 61a tubular nozzle body 61b first nozzle hole 61c second nozzle hole 62 cleaning liquid supply pipe 63 Switching valve 64 Pure water supply pipe 65 Pure water supply source 66 Chemical liquid supply pipe 67 Chemical liquid tank 68 On-off valve 69 Chemical liquid pump 80 Discharge valve mechanism 81 Contacted portion 82 Valve body 83 Piston rod 84 Cylinder device 85 Drain port W Wafer

Claims (19)

A cleaning tank for storing the cleaning liquid;
A target object holding device provided so as to be insertable into the cleaning tank, and holding the target object and immersing it in a cleaning liquid;
A vibrator provided at the bottom of the cleaning tank;
An ultrasonic oscillator for generating ultrasonic vibration in the vibrator;
A side holding member that is provided in the cleaning tank and holds the object to be processed;
A driving device for moving the object holding device to the side;
A control device for controlling the ultrasonic oscillation device and the driving device,
The control device controls the driving device so as to move the target object holding device laterally after holding the target object on the side holding member, and ultrasonic vibration is applied to the vibrator. And controlling the ultrasonic oscillation device to propagate the ultrasonic vibration from the vibrator to the object to be processed ,
The side holding member is configured to receive and hold the object to be processed from the object to be processed holding device,
The drive device is configured to move the object holding device from a holding position that holds the object to be processed to a side position that is located to the side of the holding position.
The control device transfers the object to be processed from the object holding device to the side holding member, and then moves the object to be processed from the holding position to the side position. When the holding device is at least in the lateral position, ultrasonic vibration is generated in the vibrator, and the ultrasonic vibration from the vibrator is held by the target object holding device among the target objects. Controlling the ultrasonic oscillating device and the driving device to propagate to a region;
The target object holding device has a pair of target object holding parts for holding the target object,
The ultrasonic cleaning apparatus according to claim 1, wherein each of the objects to be processed is individually movable . The ultrasonic cleaning apparatus according to claim 1 , wherein the pair of processing object holding units moves substantially symmetrically with respect to the processing object. The control device moves the workpiece holding device from the holding position to a lowered position located below the holding position, and then moves the workpiece holding device from the lowered position to the side position. to cause ultrasonic vibration to the vibrator even while from the lowered position are moved to the side position, the claim 1, characterized in that to control the ultrasonic oscillator and the driving device or 2. The ultrasonic cleaning apparatus according to 2. The control device moves the workpiece holding device from the lateral position to the lowered position, and also moves the vibrator while moving the workpiece holding device from the lateral position to the lowered position. The ultrasonic cleaning apparatus according to claim 3 , wherein the ultrasonic oscillating device and the driving device are controlled so as to generate ultrasonic vibrations. It said side holding member has a delivery position for holding undertake the workpiece, one of the claims 1 to 4, characterized in that moves between a retracted position retracted away from the workpiece The ultrasonic cleaning apparatus described in 1. The ultrasonic cleaning apparatus according to claim 5 , wherein the side holding member has a pair of holding portions that contact the side surface of the object to be processed and hold the object to be processed. A cleaning tank for storing the cleaning liquid;
A target object holding device provided so as to be insertable into the cleaning tank, and holding the target object and immersing it in a cleaning liquid;
A vibrator provided at the bottom of the cleaning tank;
An ultrasonic oscillator for generating ultrasonic vibration in the vibrator;
A side holding member that is provided in the cleaning tank and holds the object to be processed;
A driving device for moving the object holding device to the side;
A control device for controlling the ultrasonic oscillation device and the driving device,
The control device controls the driving device so as to move the target object holding device laterally after holding the target object on the side holding member, and ultrasonic vibration is applied to the vibrator. And controlling the ultrasonic oscillation device to propagate the ultrasonic vibration from the vibrator to the object to be processed,
The side holding member is configured to receive and hold the object to be processed from the object to be processed holding device,
The driving device is configured to move the object holding device from a holding position that holds the object to be processed to a side position that is located to the side of the holding position.
The workpiece holding device, have a pair of workpiece holding portion for holding the object to be processed,
Each of the object holders is individually movable,
The control device transfers the object to be processed from the object holding device to the side holding member, and then moves at least one of the object holding portions of the object holding device from the holding position to the side. It is moved to a square position, when those 該被-supporting unit in at least the lateral position, causing ultrasonic vibrations to the vibrator, the ultrasonic vibrations from the transducer, of the object to be processed out to propagate in the area to be held by a person 該被-supporting unit, the ultrasonic oscillator and the driving unit ultrasonic cleaning apparatus you and controlling the. A cleaning tank for storing the cleaning liquid;
A target object holding device provided so as to be insertable into the cleaning tank, and holding the target object and immersing it in a cleaning liquid;
A vibrator provided at the bottom of the cleaning tank;
An ultrasonic oscillator for generating ultrasonic vibration in the vibrator;
A side holding member that is provided in the cleaning tank and holds the object to be processed;
A driving device for moving the object holding device to the side;
A control device for controlling the ultrasonic oscillation device and the driving device,
The control device controls the driving device so as to move the target object holding device laterally after holding the target object on the side holding member, and ultrasonic vibration is applied to the vibrator. And controlling the ultrasonic oscillation device to propagate the ultrasonic vibration from the vibrator to the object to be processed,
The target object holding device includes a first target object holding part and a second target object holding part that are individually movable,
The drive device has a first lateral position at which the first target object holding portion of the target object holding device is positioned on a side of the first holding position from a first holding position that holds the target object. And the second object holder is moved from a second holding position for holding the object to be moved to a second side position located on the side of the second holding position. ,
The control device holds the object to be processed on the side holding member and the first object holding portion, and then holds the second object holding portion of the object holding device to the second holding. After moving from the position to the second side position, and then returning to the second holding position, and further holding the object to be processed by the side holding member and the second object holding part, The first object holding unit is moved from the first holding position to the first side position, and then the driving device is controlled to return to the first holding position, and the first object holding unit is held. When the portion is at least in the first lateral position and when the second object holding portion is at least in the second lateral position, ultrasonic vibration is generated in the vibrator, Ultrasonic vibration of the first object to be treated among the objects to be treated. Parts and to propagate in the second region which is held by the workpiece holding portion, said you and controls the ultrasonic oscillator ultrasonic cleaning device. A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member ,
In the step of holding the object to be processed on the side holding member, the object to be processed held by the object holding device is transferred to the side holding member,
In the step of moving the target object holding device to the side, the target object holding device moves from a holding position for holding the target object to a side position located to the side of the holding position,
When the object holding device is at least in the lateral position, the ultrasonic vibration from the vibrator is propagated to a region of the object to be held by the object holding device,
The target object holding device has a pair of target object holding parts for holding the target object,
The ultrasonic cleaning method according to claim 1, wherein each of the objects to be processed is individually movable . The ultrasonic cleaning method according to claim 9 , wherein the pair of objects to be processed is moved substantially symmetrically with respect to the object to be processed. In the step of moving the object holding device to the side, the object holding device moves from the holding position to a lowered position located below the holding position, and then from the lowered position to the side. Move to position
11. The ultrasonic cleaning according to claim 9 , wherein ultrasonic vibration is generated in the vibrator even while the workpiece holding device is moved from the lowered position to the lateral position. Method. The vibrator further includes a step of moving the workpiece holding device from the lateral position to the lowered position, and the vibrator is also moved while the workpiece holding device is moved from the lateral position to the lowered position. The ultrasonic cleaning method according to claim 11 , wherein ultrasonic vibration is generated in the surface. In the step of holding the object to be processed by the side part holding member, the side part holding member moves from a retracted position away from the object to be processed to a delivery position for receiving and holding the object to be processed. the ultrasonic cleaning method according to any one of claims 9 to 12, characterized in that holding the object to be processed. The side portion holding member has a pair of sandwiching portions that abut against the side surface of the object to be processed and sandwich the object to be processed.
In the step of holding the object to be processed by the side holding member, the side holding member holds the object to be processed by bringing a pair of the holding parts into contact with the side surfaces of the object to be processed. The ultrasonic cleaning method according to claim 13 . A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member,
The target object holding device has a pair of target object holding parts for holding the target object,
Each of the object holders is individually movable,
In the step of holding the object to be processed on the side holding member, the object to be processed held by the object holding device is transferred to the side holding member,
In the step of moving the target object holding device to the side, at least one of the target object holding portions of the target object holding device is moved from the holding position for holding the target object to the side of the holding position. Move to the side position
Wherein when prior Symbol workpiece holding portion of the specimen holding device in at least the lateral position, the ultrasonic vibration from the vibrator is held by the workpiece holding device of the workpiece ultrasonic cleaning how to characterized by propagating the that region. A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member,
The target object holding device has a first target object holding part and a second target object holding part that are individually movable,
In the step of moving the target object holding device to the side, after the target object is held by the side holding member and the first target object holding unit, the second of the target object holding device. The workpiece holding unit moves from a second holding position holding the workpiece to a second side position located to the side of the second holding position, and then returns to the second holding position. After the object to be processed is held by the side part holding member and the second object to be processed holding part, the first object to be processed holding part is moved from the first holding position for holding the object to be processed. Move to a first lateral position located to the side of one holding position, then return to the first holding position,
When the first object holding unit of the object holding device is at least in the first lateral position, and when the second object holding unit is at least in the second lateral position, ultrasonic vibration from the vibrator, the ultrasonic cleaning method you characterized by propagating in the area to be held by the first workpiece holding portion and the second workpiece holding portion of the object to be processed . A recording medium on which a computer program for executing an ultrasonic cleaning method is recorded,
The ultrasonic cleaning method is
A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member ,
In the step of holding the object to be processed on the side holding member, the object to be processed held by the object holding device is transferred to the side holding member,
In the step of moving the target object holding device to the side, the target object holding device moves from a holding position for holding the target object to a side position located to the side of the holding position,
When the object holding device is at least in the lateral position, the ultrasonic vibration from the vibrator is propagated to a region of the object to be held by the object holding device,
The target object holding device has a pair of target object holding parts for holding the target object,
Each of the object-to-be-processed holding parts is individually movable . A recording medium on which a computer program for executing an ultrasonic cleaning method is recorded,
The ultrasonic cleaning method is
A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member,
The target object holding device has a pair of target object holding parts for holding the target object,
Each of the object holders is individually movable,
In the step of holding the object to be processed on the side holding member, the object to be processed held by the object holding device is transferred to the side holding member,
In the step of moving the target object holding device to the side, at least one of the target object holding portions of the target object holding device is moved from the holding position for holding the target object to the side of the holding position. Move to the side position
When the target object holding unit of the target object holding device is at least in the lateral position, the ultrasonic vibration from the vibrator is held by the target object holding device among the target objects. A recording medium characterized by being propagated to an area. A recording medium on which a computer program for executing an ultrasonic cleaning method is recorded,
The ultrasonic cleaning method is
A step of holding the object to be processed, which is held by the object holding device and immersed in the cleaning liquid in the cleaning tank, on the side holding member provided in the cleaning tank;
Moving the workpiece holding device to the side;
A step of ultrasonically cleaning the object to be processed by generating ultrasonic vibration in a vibrator provided at the bottom of the cleaning tank, and
The step of moving the target object holding device to the side and the step of ultrasonic cleaning are performed after the step of holding the target object on the side holding member,
The target object holding device has a first target object holding part and a second target object holding part that are individually movable,
In the step of moving the target object holding device to the side, after the target object is held by the side holding member and the first target object holding unit, the second of the target object holding device. The workpiece holding unit moves from a second holding position holding the workpiece to a second side position located to the side of the second holding position, and then returns to the second holding position. After the object to be processed is held by the side part holding member and the second object to be processed holding part, the first object to be processed holding part is moved from the first holding position for holding the object to be processed. Move to a first lateral position located to the side of one holding position, then return to the first holding position,
When the first object holding unit of the object holding device is at least in the first lateral position, and when the second object holding unit is at least in the second lateral position, A recording medium that propagates ultrasonic vibration from a vibrator to a region of the object to be processed that is held by the first object holding unit and the second object holding unit.

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