TW201115237A - Stuck device, method for manufacturing same, and sticking apparatus for stuck device - Google Patents

Stuck device, method for manufacturing same, and sticking apparatus for stuck device Download PDF

Info

Publication number
TW201115237A
TW201115237A TW099130109A TW99130109A TW201115237A TW 201115237 A TW201115237 A TW 201115237A TW 099130109 A TW099130109 A TW 099130109A TW 99130109 A TW99130109 A TW 99130109A TW 201115237 A TW201115237 A TW 201115237A
Authority
TW
Taiwan
Prior art keywords
substrate
liquid
main
auxiliary
bonding
Prior art date
Application number
TW099130109A
Other languages
Chinese (zh)
Inventor
Michiya Yokota
Original Assignee
Shinetsu Eng Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinetsu Eng Co Ltd filed Critical Shinetsu Eng Co Ltd
Publication of TW201115237A publication Critical patent/TW201115237A/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/4805—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the type of adhesives
    • B29C65/483—Reactive adhesives, e.g. chemically curing adhesives
    • B29C65/485—Multi-component adhesives, i.e. chemically curing as a result of the mixing of said multi-components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
    • B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
    • B29C65/54—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive between pre-assembled parts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/001—Joining in special atmospheres
    • B29C66/0012—Joining in special atmospheres characterised by the type of environment
    • B29C66/0014—Gaseous environments
    • B29C66/00145—Vacuum, e.g. partial vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
    • B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
    • B29C66/112—Single lapped joints
    • B29C66/1122—Single lap to lap joints, i.e. overlap joints
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/40—General aspects of joining substantially flat articles, e.g. plates, sheets or web-like materials; Making flat seams in tubular or hollow articles; Joining single elements to substantially flat surfaces
    • B29C66/41—Joining substantially flat articles ; Making flat seams in tubular or hollow articles
    • B29C66/45—Joining of substantially the whole surface of the articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/80—General aspects of machine operations or constructions and parts thereof
    • B29C66/83—General aspects of machine operations or constructions and parts thereof characterised by the movement of the joining or pressing tools
    • B29C66/832—Reciprocating joining or pressing tools
    • B29C66/8322—Joining or pressing tools reciprocating along one axis
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1284—Application of adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/01—General aspects dealing with the joint area or with the area to be joined
    • B29C66/05—Particular design of joint configurations
    • B29C66/20—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines
    • B29C66/21—Particular design of joint configurations particular design of the joint lines, e.g. of the weld lines said joint lines being formed by a single dot or dash or by several dots or dashes, i.e. spot joining or spot welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
    • B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C66/00—General aspects of processes or apparatus for joining preformed parts
    • B29C66/90—Measuring or controlling the joining process
    • B29C66/92—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools
    • B29C66/924—Measuring or controlling the joining process by measuring or controlling the pressure, the force, the mechanical power or the displacement of the joining tools by controlling or regulating the pressure, the force, the mechanical power or the displacement of the joining tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3475—Displays, monitors, TV-sets, computer screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1269—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives multi-component adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318—Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

Abstract

Disclosed is a stuck device wherein a first board and a second board are reliably stuck together with a two-liquid mixing and curing-type adhesive obtained by mixing a main liquid adhesive and a second liquid adhesive at a predetermined rate. As the first board (1) and the second board (2) are stuck together, fine dots of the main liquid adhesive (3a) and the second liquid adhesive (3b) arranged dispersed on the facing surfaces (1a, 2a) of the first board (1) and the second board (2) respectively extend, the interfaces thereof coming into contact with each other to interconnect. This forms between the first board (1) and the second board (2) a continuous layer of two-liquid mixed portion (3c) wherein the main liquid adhesive (3a) and the second liquid adhesive (3b) are mixed at the predetermined rate. Therefore, the two-liquid mixed portion (3c) starts curing, sticking the facing surfaces (1a, 2a) of the first board (1) and the second board (2) together.

Description

201115237 六、發明說明： 【發明所屬之技術領域】 本發明係關於針對如液晶顯示器（LCD)、有機EL顯示器 (OLED)、電漿顯示器（pDp)、可撓式顯示器等平板面㈣ 示器（FPD)、或是例如（：厘〇8感測器、CCD感測器等光學元 件或MEMS元件等以蓋板將電子電路或芯片等密封元件進 行氣密封裝者、或是例如觸控面板或3D(3維）顯示器或電 子書籍寻FPD專之第1基板上貼合具有新的付加機能之第2 基板的貼合元件及其製造方法，以及用以製造貼合元件之 貼合裝置。 【先前技術】 先前以來，.作為此種液晶顯示面板之製造方法，有在第 1基板上形成混入有紫外線硬化樹脂與間隔材之間隔控制 材’且在第2基板上，將紫外線黏接劑則採用使用點膠機 的滴下描繪法而以指定圖案形成線狀密封材料，—方面貼 合第1基板與第2基板且進行加壓，一方面照射紫外線以使 液晶顯示面板之間隔控制材與密封材料硬化（例如，參照、 專利文獻1)。 [先前技術文獻] [專利文獻] [專利文獻1] 曰本專利特開平07-225384號公報（第2-4頁、圖2-8)。 【發明内容】 [發明所欲解決之問題] 150561.doc 201115237 然而，先前在此種液晶顯示面板製造方法中，當使用一 液性點接劑作為黏接劑而將^基板及第2基板貼合時，為 使夾在第！基板及第2基板之間的—液性黏接劑硬化，必需 有紫外線等光線照射或加熱等的外部能量，故而無法僅藉 由重合第1基板及第2基板而進行黏接，具有在第i基板及 第2基板之貼合方面費時’而造成貼合元件成本上升之問 題0 再者’在用以製造貼合元件之貼合裝置中，由於必需配 備上述紫外料祕照射或加熱等外部能量手段，因此具 有造成裝置整體構造複雜而成本上升之問題。 此外，例如當第1基板及第2基板以紫外線等光線無法透 過之材料所形成之情形時，無法藉由光線透過第^基板及 第2基板而使一液性黏接劑硬化’而當第!基板及第2基板 ^之任-方由熱變形材料形成之情形時，便無㈣用加熱 第1基板及第2基板而使一液性黏接劑硬化即，因必需使 第1基板及第2基板之容許特性與黏接劑之硬化條件-致， 故具有可使用的-液性黏接劑受到限制之問題。 然而，-液性黏接劑的液材本身會受到使用環境之影響 而伴隨時間之經過而使黏度上升 '易於惡化，因此，存在 必需有陰喊或進行料.冷藏保管等㈣丨之制較費工 夫的問題。 。。再者’若是誤將一液性黏接劑附著在貼合裝置之使用機 益等上時’若不去除便會因惡化而硬化，此外，使用環境 中多少會存在有紫外線或是熱等硬化能量，因此會造成開 15056 丨.doc 201115237 始硬化、形成異物而固著之問題，為了去除該異物，必需 使用專用之剝離劑等，亦具有難以完全去除之問題。 本發明之課題在於解決上述問題，其目的在於：提供一 種利用以指定之比例混合主劑液與副劑液之二液混合硬化 型黏接劑而切實地黏接第丨基板與第2基板的貼合元件利 用以指定之比例混合主劑液與副劑液之二液混合硬化型黏 2劑而切實地黏接第i基板與第2基板；即使是局部性的亦 能確保指$的混合比來混合非連續之細微點狀之主劑液與 副劑液並於指定時間内切實地硬化；以無氣泡之方式混 主劑液與副劑液等。 [解決問題之技術手段] 為達成此種目的，本發明之貼合元件之特徵在於，其係 以黏接劑貼合第1基板、以及覆蓋該η基板之第2基板， 使用包含主劑液與副劑液之二液混合硬化型黏接劑作為上 述黏接劑，於上述第〗基板及上述第2基板之對向面的雙方 或一方，將上述主劑液與上述副劑液以彼此不互相接觸之 方式，分散塗佈配置成非連續之細微點狀，藉由上述第工 基板與上述第2基板之重合’上述主劑液與上述副劑液係 分別伸展且相互連接，在上述第〗基板與上述第2基板之 間，分散配置上述主劑液與上述副劑液以形成以指定之比 例混合連續之一層二液混合部。 此外，本發明之貼合元件之製造方法之特徵在於，其係 以黏接劑貼合第1基板、以及覆蓋該第丨基板之第2基板的 貼合元件之製造方法，且包括下述步驟：於上述第丨基板 150561.doc 201115237 及上述第2基板之對向面的雙方 刑針to "fe丨 — 將—液混合硬化 型黏接劑之主劑液與副劑液作 鉬++上、 上玟黏接劑，以相互不接 觸之方式为散塗佈成非連續的細 ]、、·田喊點狀丨及，使上述第1 基板與上述第2基板重合，使上f 使上述主劑液與上述副劑液伸 展且相互連接，在上述第1基板與上述第2基板之間，形成 上述主劑液與上述副劑液以指定比例混合之連續的一層二 液混合部，以此方式進行混合。 除上述特徵之外’亦包括以下特徵：於上述第i基板及 上述第2基板之對向面的雙方，以相互對向之方式塗佈上 边主劑液與上述副劑液，藉由上述第i基板與上述第2基板 之重合，使上述主劑液與上述副劑液接觸，並且使其等沿 著上述第1基板及上述第2基板之對向面而伸屐。 除上述特徵之外，亦包括以下特徵：對上述第〖基板及 上述第2基板之周圍空間進行減壓，在該已減壓之環境下 將上述第1基板與上述第2基板重合，混合上述主劑液與上 述副劑液。 此外’本發明之貼合元件之貼合裴置之特徵在於：其係 以黏接劑貼合第1基板、以及將其覆蓋之第2基板的貼合元 件之貼合裝置’且其包括：塗佈機構，其於上述第1基板 及上述第2基板之表面上塗佈二液混合硬化型黏接劑之主 劑液與副劑液作為上述黏接劑；及貼合機，其用於以使上 述第1基板與上述第2基板表面相對向之方式而可裝卸自如 地保持該兩者且使其等重合，且，上述塗佈機構係朝向上 述第1基板及上述第2基板雙方或是單方之表面，使上述主 150561.doc 201115237 混合部 劑液與上述副劑液以分別不相互接觸之方式分散塗佈成非 連續之細微點狀’上述貼合機係藉由上述^基板與上述 第2基板之重合，而使上述主劑液與上述副劑液伸展且相 互連接，在上述第i基板與上述第2基板之間，形成上述主 劑液與上述副劑液以指定之比例所混合之連續的—層二液 上述特徵之外’亦包括以下特徵：藉由上述塗佈機構， 向上述第!基板及上述第2基板彼此之對向面，以彼此分別 對向之方式塗佈上述主劑液與上述副劑液。 /上述特徵之外，更進一步包括以下特徵：上述貼合機 係’在上述第1基板及上述第2基板之周圍形成可調整氣壓 之封閉空間，在上述封閉空間被減壓之環境下重合上述第 1基板與上述第2基板，混合上述主劑液與上述副劑液而形 成上述二液混合部。 [發明之效果] 具有上述特徵之本發明之貼合元件係，伴隨第^基板與 第2基板之重5，为散配置在第丨基板及第〕基板之對向面 上之細微點狀的主劑液與副劑液分別伸展而使其界面彼此 接觸且相互連接，藉此，在第丨基板與第2基板之間，形成 主劑液與副劑液以指定之比例所混合之連續的一層二液混 合部，該二液混合部開始硬化，由於第丨基板及第2基板之 對向面貼合，故能夠提供一種可藉由主劑液與副劑液以指 疋之比例混合之二液混合硬化型黏接劑而切實地黏接第上 基板與第2基板之貼合元件。 I50561.doc 201115237 其結果’與為了使黏接劑硬化而需要紫外線等光線照射 或加熱專外部能量的習知之貼合元件相比，可藉由簡單之 程序而將第1基板及第2基板黏接，藉此可達到降低製造成 本之目的。 再者，由於將主劑液與副劑液分散配置成非連續的細微 點狀，因此增加了該等主劑液與副劑液接觸之機會，容易 在短時間内達成均一化之混合。 此外伴隧第1基板及第2基板之重合，細微點狀之主劑 液與副劑液伸展而使其界面接觸從而相互連接，從而形成 二液混合部，因此，不會有因攪拌混合而產生氣泡之虞， 無需進行脫泡作業。利用主劑液與副劑液之塗佈圖案，亦 可將存在於細微點狀之主劑液、以及副劑液周圍的氣體擠 出至第1基板及第2基板的外部。 此外，本發明之貼合元件之製造方法係，伴隨第工 與第2基板之重合’分散塗佈於^基板及第：基板之對向 面之細微點狀主劑液與副劑液分別伸展而使其界面彼此接 觸且相互連接，藉此，在第1基板與第2基板之間，形成主 劑液與副劑液以指定之比例所混合之連續的一層二液混合 mi"開始硬化’而使第1基板及第2基板之對 向面貼合，故藉由將主劑液與副以指定比例混人之二 液混合硬化型黏接劑而可切實地將^基板與第2基板黏 其結果，與為 或加熱等外部能 了使點接劑硬化而需要紫外線等光線照射 量的習知之製造方法相比 ，可藉由簡單的 I5056I.doc 201115237 程序黏接第1基板及第2基板，藉此可達到降低製造成本之 目的。 再者，由於將主劑液與副劑液分散配置成非連續的細微 點狀，因此增加了該等主劑液與副劑液接觸之機會，容易 在短時間内達成均一化之混合。關於細微點狀之主劑液以 及副劑液，僅藉由變更每一次的塗佈量或是變更配置條 件，便可自由地對主劑液與副劑液之硬化混合比進行微 調，藉此可快速地對應第1基板及第2基板之黏接狀態。僅 僅塗佈主劑液或副劑液，若是在第丨基板及第2基板貼合前 時便可利用洗淨基板而容易地去除主劑液或副劑液，因此 便於再利用基板而具經濟效益。 此外，伴隨第1基板及第2基板之重合，細微點狀之主劑 液與副劑液伸展而使其界面接觸且相互連接，從而形成二 液混合部，因此不會有因攪拌混合而產生氣泡之虞，無需 進行脫泡作業。亦可利用主劑液與副劑液之塗佈圖案，將 存在於細微點狀之主劑液以及副劑液周圍之氣體擠出至第 1基板及第2基板的外部。 再者，在上述貼合元件之製造方法中，於上述第丨基板 及上述第2基板之對向面的雙方，以相互對向之方式塗佈 上述主劑液與上述副劑液，藉由上述第1基板及上述第2基 板之重合，使上述主劑液與上述副劑液接觸，並且使其等 沿著上述第1基板及上述第2基板之對向面而伸展，此時伴 Ik第1基板與第2基板之重合，對向的主劑液與副劑液在衝 撞、混合並且伸展，其等伸展前端界面彼此相互連結，形 】5056 丨.doc 201115237 成主劑液與副劑液以指定之比例所混合之連續的_層二液 混合部’遍布填滿於第1基板及第2基板之對向面，整體開 始硬化，因此即使是局部區域亦可確保非連續之細微點狀 之主劑液與副劑液混合成指定的混合比，而可於指定時間 内切實地進行硬化。 再者，在上述貼合元件之製造方法中，對上述第丨基板 及上述第2基板之周圍空間進行減壓，在該已減壓之環境 下將上述第1基板與上述第2基板重合，混合上述主劑液與 上述副劑液’此時減壓環境下混合主劑液與副劑液，由於 不會伴隨此種混合而導致氣泡進入，因此便可以無氣泡之 方式混合主劑液與副劑液。 其結果，無需在第1基板及第2基板貼合後由二液混合硬 化型黏接劑進行脫泡，而可縮短由開始至貼合結束為止所 需的時間。 此外，本發明之貼合元件的貼合裝置係，隨著以貼合機 重合第1基板與第2基板，以塗佈機構分散塗佈在第丨基板 及第2基板之對向面之細微點狀主劑液與副劑液分別伸展 而使其界面彼此接觸且相互連接，藉此，在第1基板與第2 基板之間’形成主劑液與副劑液為以指定之比例所混合之 連續的一層二液混合部，該二液混合部開始硬化，而使第 1基板及第2基板之對向面貼合，故藉由將主劑液與副劑液 以指定比例混合之二液混合硬化型黏接劑而可切實地將第 1基板與第2基板黏接。 其結果，與必需有使黏接劑硬化之紫外線等光線照射或 150561 .doc •10· 201115237 加熱等外部能量的習知之裝置相比，可藉由簡單的程序黏 接第1基板及第2基板，藉此可達到降低製造成本之目的。 再者，由於將主劑液與副劑液分散配置成非連續的細微 點狀，因此增加了該等主劑液與副劑液接觸的機會，容易 在短時間内達成均一化之混合。細微點狀之主劑液以及副 劑液係，僅藉由變更每一次的塗佈量或是變更配置條件， 便可自由地對主劑液與副劑液之硬化混合比進行微調，藉 此可快速地對應第1基板及第2基板之黏接狀態。僅僅塗佈 主劑液或副劑液，若是在第丨基板及第2基板貼合前時便可 利用洗淨基板而容易地去除主劑液或副劑液，因此便於再 利用基板而具經濟效益。 此外，伴隨第1基板及第2基板之重合，細微點狀之主劑 液與副劑液伸展而使其界面接觸且相互連接，從而形成二 液混合部，因此不會有因攪拌混合而產生氣泡之虞，無需 進行脫泡作業。亦可利用主劑液與副劑液之塗佈圖案，將 存在於細微點狀之主劑液以及副劑液周圍之氣體擠出至第 1基板及第2基板的外部。 再者，在上述貼合元件之貼合裝置中，藉由上述塗佈機 構而朝向上述第1基板及上述第2基板彼此的對向面，以彼 此分別對向之方式塗佈上述主劑液與上述副劑液，此時， 第1基板與第2基板重合，藉此，對向之主劑液與副劑液彼 此相互間衝撞、混合且伸展’其等伸展前端界面彼此相互 連結，形成主劑液與副劑液以指定之比例所混合之連續的 一層二液混合部’遍布填滿於第1基板及第2基板之對向 150561.doc 201115237 面，整體開始硬化，因此即使是局部區域亦可確保非連續 之細微點狀之主劑液與副劑液混合成指定的混合比，而於 指定時間内切實地進行硬化。 再者，在上述貼合元件之貼合裝置中，上述貼合機係在 上述第1基板及上述第2基板之周圍形成可調整氣壓之封閉 空間，在上述封閉空間被減壓的環境下使上述第丨基板與 上述第2基板重合，混合上述主劑液與上述副劑液而形成 上述二液混合部，此時於減壓的環境下混合主劑液與副劑 液，由於不会伴隨二液混合部之製作而造成氣泡進入，故 可以無氣泡之方式混合主劑液與副劑液。 其結果，無需在第1基板及第2基板貼合後由二液混合硬 化型黏接劑進行脫泡，而可縮短由開始至貼合結束為止所 需的時間。 【實施方式】 以下，依據圖式詳細說明本發明之實施形態。 本發明之實施形態之貼合元件A如圖1〜圖4所示，具備配 置成對向狀且重合之一對第丨基板丨及第2基板2、以及塗佈 在該等第1基板1及第2基板2之對向面ia、2a的雙方或是一 方的二液混合硬化型黏接劑3。 第1基板1及第2基板2係例如液晶顯示器（Lcd)、有機EL 顯示器（OLED)、電漿顯示器（PDP)、可撓式顯示器等平板 面板顯示器（FPD)中使用之玻璃製基板或PES(p〇iy_Ether_ Sulphone)等塑膠薄膜或合成樹脂製基板，亦或是例如 CMOS感測器CCD感測器等光學元件或MEMS元件等中 15056 丨.doc -12- 201115237 使用之覆蓋在電子電路或芯片表面的晶圓或蓋玻璃（c〇ver glass) 4之蓋板’或是使用在例如觸控面板或3d(3維）顯示 器或電子書籍等中的FPD或蓋玻璃等。 所謂二液混合硬化型黏接劑3，係主要具有主劑液3&及 副劑液3b，藉由混合該等主劑液3a及副劑液3b而開始硬化 之黏接劑。 作為此種二液混合硬化型黏接劑3，係可列舉如環氧系 黏接劑、第2代丙烯系黏接劑（SGA)胺基甲酸酯系黏接劑、 矽酮系黏接劑等。 此外，在該種二液混合硬化型黏接劑3中，作為主劑液 3a及副劑液3b以外之添加劑’亦可添加交聯促進劑或硬化 觸媒等。 並且’在第1基板1及第2基板2之對向面的表面ia、2a之 雙方或是任一方上，分別使未硬化之主劑液3a及副劑液3b 以不相互接觸之方式以非連續狀塗佈二液混合硬化型黏接 劑3 ’而使第1基板i與第2基板2重合，藉此，使主劑液3a 及副劑液3b伸展且相互連結而形成二液混合部3c，以此分 散配置。 即，主劑液3a及副劑液3b係隨著第1基板1與第2基板2之 重合’使分散配置之主劑液33及副劑液孙伸展而使其界面 彼此接觸藉此相互連結’從而形成二液混合部3 c。 為了使主劑液3a及副劑液3b容易伸展，較佳為使用低黏 度（200 Pa· s = 20萬cP左右以下）者。 對於第1基板1及第2基板2之對向面（表面）la、2a塗佈成 150561.doc 13 201115237 非連續狀之主劑液3 a及副劑液3 b的整體量，係以第1美板1 與第2基板2之重合而形成之主劑液3a及副劑液3b的伸展形 狀、以及貼合後之第1基板1及第2基板2間的間距g等決 定。 非連續狀之主劑液3 a及副劑液3 b的每一次的塗佈量係例 如為1000 pg以下’詳細而言，較佳為藉由塗佈成1〇 gg〜100 pg左右之細微的大致半球形之點狀，而利用各個 點狀主劑液3a及副劑液3b之表面上所產生之表面張力而維 持半球狀。 在此情況下具有如下優點：即使將塗佈後之第1基板1與 第2基板2以其表面la、2a傾斜之方式移動、或翻轉成朝下 時’亦不會有液體滴下而使主劑液3 a及副劑液3 b接觸。 此外’該等主劑液3 a及副劑液3 b之塗佈比例或塗佈量， 係由二液混合硬化型黏接劑3中之主劑液“及副劑液3b的 適當混合比（硬化混合比）決定。 例如，如圖示例所示，當主劑液3a及副劑液31?之適當混 合比設為1 : 1時，主劑液3a及副劑液3b則塗佈成大致相同 大小的點狀。 相對於此，當主劑液3a及副劑液3b的適當混合比（硬化 混合比）為1 : n或是n : i而相異時，將主劑液3&及副劑液 3b之每一次的塗佈量設定成與適當混合比相同，或是相同 塗佈里之主劑液3 a及副劑液3b的配置條件與適當混合比相 同。 即，例如，當主劑液3a及副劑液3b之適當混合比（硬化 150561.doc 1y! 201115237 混合比）為2 : 1時’將主劑液3a的塗佈量設成副劑液3b之 塗佈量的兩倍，或是設成對於一種副劑液3b配置兩倍等量 之主劑液3 a。 作為該種主劑液3a及副劑液％之塗佈例，如圖1(a)及圖 2(a)(b)所示，在第i基板1及第2基板2之對向面^、以雙 方’以使第1基板1與第2基板2重合時相互對向之方式，分 別分散配置主劑液3 a及副劑液3 b。 亦即，對於對向面1 a、2a雙方，將未硬化之主劑液3&及 田1J劑液3b以對向之相同之細微點狀圖案進行塗佈。 在如圖1 (a)所示之實施例中，對於配置在下方之第1基板 1的表面la、以及配置在上方之第2基板2的表面&，以在 第1基板1與第2基板2重合時各個主劑液3a與各個副劑液3b 彼此對向之方式，將主劑液3a及副劑液3b混合且分散配 置。 在圖2(a)(b)所示之實施例中，對於配置在下方之第丄基 板1之表面la僅塗佈副劑液3b，對於配置在上方的第2基板 2之表面2a僅塗佈主劑液3a。 此外，雖然圖中未揭示其他例，但亦可以使在第^基板丄 與第2基板2重合日夺主劑液3a及副劑液％對向之方式，分別 將主劑液3a及副劑㈣混合分散配置於第i基板i之表面“ 或第2基板2之表面2a上。 再者，在如圖2(a)(b)所示之實施例中，帛i基板i及第2 基板2形成為矩形之平板狀，遍佈該等對向面la、2a之大 致整面，以相等之間隔分散配置主劑液3a及副劑液3be 150561.doc 15 201115237 此外’圖中雖然未揭示其他示例’但亦可僅在形成為矩 形之對向面1 a、2a之周緑上’分別以相等間隔分散配置主 劑液3a及副劑液3b，而使其沿著該對向面la、2&之四邊形 成為矩形之框狀’或是亦可在對向面la、23之局部上，將 主劑液3a及副劑液3b分散配置成直線狀或曲線狀等任意形 狀。 此外，亦可在形成為矩形以外之形狀的第丨基板丨及第2 基板2之對向面la、仏上，將主劑液3a及副劑液儿分散配 置成任意形状。 在此種實施形態中，如圖1(b)所示，藉由第丨基板丨與第 2基板2之重合，對向之主劑液3a及副劑液3b彼此之間分別 衝扣而開始混合，並且沿著對向面丨a、2a伸展。 接著，如圖1(C)所示，若使第1基板1及第2基板2之對向 面1 a、2a彼此之間更加接近，則主劑液及副劑液3b進一 步此合，並且沿著對向面丨a、2a伸展的主劑液“及副劑液 3b之前端界面彼此相互連結，藉此，在第i基板丨與第二基 板2之間，形成主劑液3&及副劑液3b以指定之比例所混合 之連續的層一液混合部3c，伴隨該等主劑液3a及副劑液 3b之混合而整體上開始硬化。 之後’如圖1(d)所示，若對第1基板1及第2基板2之對向 面1 a 2a之間加&直至形成指定#間距g，％三液混合部 3cit 申&，遍佈兩對向面^&間之指定區域而二液 犯〇。卩3c以所需之形狀伸展且填滿，在此狀態下第1基板^ 及第2基板2之對向面la、2a貼合。 150561.doc -16· 201115237 、此時’在主劑液3认副劑液3b以等間隔分別分散 遍佈於矩形之對向面la、以的大致整面之情形時，如圖 2⑷⑻之兩點煉線所示，：液混合部化以大致㈣狀_ 展且填滿。 此二’雖絲圖示，但當主劑液3a及副劑液⑪分散配置 於沿者矩形之對向面la、23的周緑之矩形框狀時二液混 合部3c以邊框狀伸展，從而於其内側形成用以封入液晶 之密封空間。 '曰曰、 藉此，僅藉由第1基板丨與第2基板2之重合而以指定之比 =混合非連續狀之主劑液以及副劑液扑而開始硬化，且切 實地將對向面la、2a彼此黏接從而形成貼合元件A。 作為其他塗佈例，如圖3(a)及圖4(a)(b)所示在第丨基板 1及第2基板2之對向面la、2a中之任一方上，向沿著該對 向面1a、2a的方向交替地分別分散配置主劑液3a及副劑液 3b ° 亦即，於對向面la、2a中之任一方以細微點狀圖案塗佈 未硬化之主劑液3 a，並且以與主劑液3 a的細微點狀圖案之 相位偏移之方式，以相同之細微點狀圖案塗佈未硬化之副 劑液3b。 於圖4(a)(b)所示之實施例中’僅在配置於下方之矩形的 第1基板1之表面la上，向與正交之兩邊平行的直線方向交 替塗佈主劑液3&及副劑液3b ’但並不僅限於此，取而代之 亦可僅在配置於上方之第2基板2的表面2&上交替塗佈主劑 液3a及副劑液3b。 150561.doc •17· 201115237 再者，於圖4(a)(b)所示之實施例中，第！基板i及第2基 板2形成為矩形之平板狀，遍佈在配置於下方之矩形之第丄 基板1之表面la的大致整面，以相等間隔分散配置主劑液 3a及副劑液3b。 此外’圖中雖然未揭示其他示例，但亦可僅在形成為矩 形之對向面la、2a中之任_方的周緣上，冑主劑液3a及副 劑液3b分別以等間隔而分散配置成沿著該對向面、“之 四邊的矩形框狀，或是亦可在對向面u、2a之局部，將主 劑液3a及副劑液3b分散配置成直線狀或是曲線狀等任意形 狀。 此外，在形成為矩形以外之形狀的第丨基板丨及第2基板2 之對向面la、2a上，亦可將主劑液“及副劑液儿分散配置 成任意之形狀。 在此種實施形態中，如圖3(b)所示’藉由第丨基板丨與第 2基板2之重合，在其對向面la' 2a之間，交替分散配置之 主劑液3a及副劑液3b分別沿著對向面la、2a伸展。 接著，如圖3(c)所示，若使第丨基板丨及第2基板2之對向 面la、2a彼此進一步接近，則沿著對向面u、以伸展之主 劑液3a及副劑液3b之前端界面會彼此衝撞而相互連結，且 其等開始混合，從而，形成主劑液3a及副劑液3b以指定之 比例混合之連續的一層二液混合部3 c ’伴隨該等主劑液3 a 及副劑液3b之混合整體開始硬化。 之後，如圖3(d)所示’若對第丨基板丨及第2基板2的對向 面1 a、2a之間加壓直至形成指定的間距g時，二液混合部 150561.doc •18· 201115237 3進步伸展’遍佈兩對向面ia、〜間之指定區域而二液 混合部3。以所需形狀而伸展且填滿，在此狀態下第】基板1 及第2基板2之對向面la、2a貼合。 此寺在遍佈矩形之對向面2a的大致整面上，主劑液3a 及副劑液3b以等間隔分別分散配置之情形時，如叫㈣ 之兩點煉線所不，二液混合部3c以大致矩形狀而伸展且填 滿。 此：，雖然未圖示’但當主劑液3a及副劑液扑分散配置 成/口著矩开乂之對向面la、2玨的周緣之矩形框狀時’二液混 合部3c以邊框狀伸展’從而在其内側形成用以封入液晶等 之密封空間。 藉此’僅藉由第！基板i與第2基板2之重合，將非連續的 主劑液3a及副劑液扑即使是局部性的亦 比，以此財式進行混合㈣始硬化，在指定_内㈣ 地黏接對向面b、2a而形成貼合元件A。 其次，針對為了製造此貼合元件八而使用之貼合 行說明。 本發明之實施形態之工件貼合裝置係如圖5〜圖7所示， 塗佈機構1〇,其朝向第1基板1之表面Η及第2基板2 -相面，分別塗佈二液混合硬化型黏接劑之主劑液3a及 田1J劑液3 b ;以；5扯人機2 0，i # 心 及貼口枝G其用於對該等糾基板i及第2 卷扳2以表面la、2a相對向之方 持且使其等重合。 丨而可裝卸自如地進行保 作為塗佈機構1〇係如圖5所示’較佳為使用例如點膠機 150561.doc 19· 201115237 等液體定量吐出機u，幸月向第1基板^之表面la及第2基板2 之表面2a，間歇性且定晉+丄：电τ 地滴下二液混合硬化型黏接劑之 主劑液34副劑液3b，藉此，以指定之間距例如1〇 盹〜100 pg左右之細微的半球形點狀進行塗佈。 作為其他塗佈例，亦可去丨丨田< Λ1 j利用網版印刷等以非連續狀塗佈 主劑液3a及副劑液3b。 於圖5所示之情況下’作為塗佈機構1G係使用液體定量 吐出機U，以表面la、2a朝上之方式設置第i基板 ，板2，於其上方以吐出口朝下之方式設置點膠機等液體 疋里吐出機11，一方面你碎望笛1龙Λ 乃®Μ更”亥#第1基板i及第2基板2或液體 定量吐出機11中之任-方或雙方進行相對移動，-方面朝 向第1基板i之表面la及第2基板2之表面2a，由液體定量吐 出機11之吐出口以疋$且間歇地滴下主劑液3a或是副劑液 3b ’藉此，如圖i⑷、圖2⑷(b)或是圖3⑷圖_⑻所 不，分別以指定間隔塗佈細微之半球形的點狀。 液體定量吐出機11上電性連接有控制來自吐出口之滴下 量等的控制器12，#由改變每一滴之滴下量，除了可調整 =下至第1基板i及第2基板2之表面la、2a之主劑液3&或副 劑液3b的直徑(滴下直徑)D之外’亦可藉由改變其滴下之 時間間隔，而調整滴下間距p。 ▲在液體定量吐出機n之附近，具備：計測部13，其用以 計測由液體定量吐出仙之吐出4量滴下之主劑液W 副劑液3b的滴下間距或滴下直徑等，·以及記憶部14，其保 存該計測部U之計測資料或設定資料等，較佳為可藉由將 150561.doc 20· 201115237 該等部件與控制器12電性連接，而依據該記憶部i4所儲存 之計測資料或設定資㈣設定主劑液3a或關液3b之滴下 直徑或滴下間距。 另一方面，貼合機20係如圖6及圖7所示，具備··上下一 對之保持板2 i、22 ’其可裝卸自如地保持第i基板】及第2 基板2 ;升降驅動部23，其使該上下保持板21、22中之任 一方朝向另一方移動而使第1基板1與第2基板2重合；基板 搬送機構24，其朝向上下保持板21、22而搬入.搬出第} 基板1及第2基板2 ;以及控制部25，其分別作動控制該等 升降驅動部23及基板搬送機構24等。 下保持板2 1及上保持板22，係以例如金屬或陶瓷等剛體 且不會扭曲（撓曲）變形的厚度形成平板狀，且設置成其平 滑的保持面21a ' 22a成相互對向，在該等保持面21&、22a 中，作為分別可裝卸自如保持第丨基板丨及第2基板2的保持 機構（未圖不），設置有例如靜電夾具、吸附夾具或黏著夾 具亦或是其等之組合等。 再者，下保持板2 1及上保持板22中之任一方或雙方係以 使保持面21a、22a朝上下方向（Z方向）以平行狀態相互靠近 或是分離之方式可往返自如地受到支撐。 在圖示例的情況中，設有僅上下移動上保持板22的升降 驅動部23。 作為其他例’亦可以升降驅動部23僅上下移動下保持板 21 ’或是使上下保持板21、22雙方進行上下移動。 此外’較佳為於下保持板21及上保持板22之周圍形成可 150561.doc 21 201115237 進行氣壓調整之封閉空間s，當該封閉空間s減壓成真空或 是靠近真空狀態之環境下，相互靠近移動保持面2丨a、22a 而重合第1基板1與第2基板2。 基板搬送機構24係由例如以吸附片等可裝卸自如地保持 第1基板1及第2基板2的搬送用機器人等所形成，係構成為 由配備塗佈機構10的外部區域朝上下保持板21、22之保持 面21a、22a搬入第i基板i及第2基板2，在結束貼合步驟 後’朝向外部區域進行搬出作業。 控制部2 5係為一種與升降驅動部2 3及基板搬送機構2 4等 電性連接的控制器，將利用塗佈機構1〇結束主劑液3a及副 劑液3b的塗佈步驟後之第！基板丨及第2基板2’藉由基板搬 送機構2 4朝上下保持板2 1、2 2搬入，且傳遞到保持面 21a、22a後，以升降驅動部23靠近移動上下保持板2i、U 中之任一方或雙方，藉此使第1基板1及第2基板2之對向面 U、2a夾着主劑液3a及副劑液讣以重合，之後，進行控制 使付已結束第1基板丨與第2基板2之貼合步驟的第丨基板五及 第2基板2以基板搬送機構24搬出。 乂下依據圖式說明本發明之各實施例。 [實施例1] 本實施例1係表示如下之大氣開放型的真空貼合機: 如圖6(a)〜(c)所示’在可朝上下方向分割之分割室叫、 26b 的内苦p，洲士 叹有下保持板21及上保持板22，將該等分 j室26a 26b藉由開閉驅動部27a的作動而閉動，當劃分 形成在其内部之封閉空間s達到指定的真空度，開始進行 150561 .doc •22· 201115237 第1基板1與第2基板2之重合，之後，使封閉空間s進行大 氣開放。 根據而要，較佳為对於分割室26a、26b中之任一方或雙 方乂叮朝X平方向（ΧΥ0方向）調整移動之方式進行支揮， 或是對於該等分割室26a、26b以可將上下保持板21 ' 22中 之任一方或雙方朝水平方向（ΧΥΘ方向）調整移動之方式進 行支撐。 在圖6(a)〜（c)所示之實施例中，僅將設有上保持板。之 上方的分割室26a ’以相對於設有下保持板21之下方的分 割至26b朝上下方向（z方向）靠近或是分離之方式可往復移 動自如地支撐’藉由開閉驅動部27a的作動而使其開閉。 對於該等上下之分割室26a、26b，將下保持板21及上保 持板22中之任一方或雙方，在圖中所示之實施例為僅將上 保持板22 ’藉由升降驅動部23而可上下移動自如地支樓， 當分割室26a、26b開閉後則將上方的第2基板2朝下方的第 1基板1靠近移動。 此外’作為其他例，藉由將上下保持板2丨、22對於分割 室26a、26b設置成一體，而可使上下保持板21、22的升降 驅動部23與分割室26a、26b的開閉驅動部27a形成為一 體。 在此情況下’例如利用設置在分割室26a、26b之間的例 如〇型環等環狀密封部28之彈性變形，在分割室26a、26b 閉動後能更加靠近移動，藉此可進行第1基板1與第2基板2 之重合。 I50561.doc 23- 201115237 於分割室26a、26b中之任一方或雙方，設有貫通其内 外’且出入該腔室内之氣體的壓力調整部29，以控制部25 作動控制該壓力調整部29，從已閉動之分割室26a、26b内 的封閉空間S將内部氣體朝外部進行排氣，藉此減壓而形 成指定的真空狀態’相反地，藉由將外部的氣體朝内部供 給’而可將該封閉空間S的内壓恢復成與周圍氣壓（大氣 壓）相同之狀態。 再者，於圖6(a)〜(c)所示之實施例之情形時，作為利用 塗佈機構10之主劑液3a及副劑液3b的塗佈例，如圖1(a)及 圖2(a)(b)所示，於第1基板1及第2基板2之對向面ia、2&雙 方’以使第1基板1與第2基板2重合時相互對向之方式分別 分散配置有主劑液3a及副劑液3b。 此外’作為其他例，如圖3(a)及圖4(a)(b)所示，可僅在 第1基板1及第2基板2之對向面la、2a中之任一方上，交替 地分別分散配置主劑液3a及副劑液3b。 接著，依據步驟順序說明藉由該工件貼合裝置所進行之 貼合元件A之製造方法。 首先，如圖6(a)之實線所示，在已啟動分割室26a、26b 之狀態下，藉由基板搬送機構24而朝其内部搬入已由塗佈 機構10塗佈主劑液3a及副劑液3b之第1基板1及第2基板2， 利用設在上下保持板21、22之保持面21a、22a的保持機 構，對下保持板2 1之保持面21 a傳遞第1基板1，並且對上 保持板2 2之保持面2 2 a傳遞第2基板2，且分別將其進行保 持。 150561.doc -24- 201115237 之後，如圖6(a)的兩點鍊線所示，藉 .^ 精由開閉驅動部27a的 作動而閉動分割室26a、26b，在1内邻报士 ^ 你/、鬥〇丨形成封閉空間S。 在該種閉動前或是閉動進行中，蕤 ρ τ藉由來自封閉空間S之 壓力調整部29的作動而開始真空抽引 旲工柚5丨，達到指定的真空 度。 接著，如圖6(b)之實線所示，藉由升降驅動部η的作 動’自動地靠近移動下保持板21及上保持板22，保持在該 等保持面2U、22a上之第i基板i與第2基板2便經由預先塗 佈的主劑液3 a及副劑液3 b而重合。 再者’在即將開始该重合前’根據需要可將上下保持板 21 22相對性地朝與該重合方向垂直之水平方向（χγθ方 向）調整移動，藉此亦可將其所保持的第丨基板丨與第2基板 2彼此相互進行定位。 如圖例所示，當第i基板丨及第2基板2之對向面u、。雙 方上之主劑液3a及副劑液补被分散配置成相互對向之情形 時，藉由重合第1基板1與第2基板2，主劑液3 a及副劑液3b 彼此之間衝撞且開始進行混合，同時沿著對向面丨a、〜進 行伸展。 接著’如圖6(b)之兩點煉線所示’若使第1基板1及第2 基板2之對向面1 a、2a彼此之間更加接近時，進一步混合 主劑液3a及副劑液3b，並且沿著對向面1 a、2a而伸展的主 劑液3a及副劑液％之前端界面便彼此相互連結，主劑液3a 及副劑液3b以指定之比例混合而形成連續一層的二液混合 部3c ’伴隨該等主劑液3&及副劑液讣的混合而開始整體性 150561.doc •25- 201115237 的硬化。 在此，如圖2(a)(b)或圖4(a)(b)所示，當主劑液3a及副劑 液3b以等間隔分散配置在遍佈矩形的對向面之大致整面 之情形時，之後便如圖6(c)之一點煉線所示，將第1基板】 及第2基板2之對向面la、23間加壓至形成指定間距G時， 二液混合部3c便伸展且充滿至對向面2a之大致整面上，於 其内部使液晶或電子電路或是芯片等密封元件形成氣密封 裝。 此外，當主劑液3a及副劑液3b分散配置成沿著矩形之對 向面1 a、2a的周緣之矩形框狀時，二液混合部3以更伸展成 邊框狀，在其内側形成用以封入液晶等之密封空間。 因此，如圖6(c)之實線所示，利用上保持板22之保持機 構的作動而解除上方之第2基板2的保持，緊接著再藉由壓 力調整部29的作動而使分割室26a、26b内的封閉空間s大 氣開放，使得在其内部壓力，以及以邊框狀之二液混合部 3c所包圍的密封元件之内壓之間產生壓力差。 藉由该密封空間内外所產生的氣壓差，整體性且均等地 對第1基板1與第2基板2施壓而在維持平行之狀態下進行壓 縮，伴隨於此，二液混合部3c則被擠壓成均勻地遍佈全 周將°亥荨第1基板1與第2基板2平行貼合，並且兩者的間 隔形成指定的間距G。 在、、、。束該種貼合步驟之後’如圖6(c)之兩點煉線所示， 利用開閉驅動部27a的作動而開啟分割室26a、2补，藉由 下保持板21之保持機構的作動解除第1基板1之保持，利用 150561.doc -26- 201115237 基板搬送機構24將已完成貼人 金丨〜。 風貼α之第1基板1及第2基板2由分 割至26a、26b的内部朝外部搬出。 之後，便反覆上述之作動。 因此，於圖6(aHc)所示之實施例1係為，由於在第 板1及第2基板2之周圍空間的封閉空間s達到指定真空度的 環境下混合主劑液3a及副劑液1做出二液混合部I因 此不會產生伴隨主劑液化及副劑㈣的混合而造成氣泡進 入的情況產生。 藉此，可在無氣泡狀態下混合主劑液％及副劑液儿於 第1基板1與帛2基板2的貼合後亦無需由二液混合部3c進行 脫泡’而具有可縮短由開始至貼合結束為止所需時間的優 點。 [實施例2] 本實施例2係如圖7(a)〜(c)所示，設置無法分離的腔室 26c以取代上述分割室26a、2讣，門扉26d可開閉運作自如 地付到支撐而用以覆蓋該出入口，藉由開閉驅動部27b的 作動而開閉该門扉26d，在該腔室26c的内部，配設下保持 板21及上保持板22之閉鎖室型的真空貼合機2〇之構成係與 圖6(a)〜(c)所示之實施例j相異，除此以外的構成係如圖 60)〜(c)所示，為與實施例1相同。 於圖7(a)〜(c)所示之實施例中’僅將上保持板22藉由升 降驅動部23而可上下移動自如地支撐，腔室2^閉鎖後’ 雖將上方的第2基板2朝下方的第1基板1靠近移動，但並不 僅限於此’取而代之亦可與實施例1相同的，使下保持板 150561.doc •27- 201115237 21及上保持板22雙方靠近，或是僅移動下保持板21。 ;· 70)〜(C)所示之實施例之情形時，利用塗佈 機構10所達成$ t漁 主剎液3 a及副劑液3 b的塗佈例，係如圖 3(a)及圖4(a)(b)所示，第i基板i及第2基板2之對向面“、 以的任一方，例如僅在下方的第1基板1上，交替且分別分 散配置主劑液3a及副劑液儿。 為八他例如圖1 (a)及圖2(a)(b)所示，於第1基板1及 第2基板2之對向面la、2a雙方亦可以使第丄基板^與第2 基板2重合時相對向之方式分別分散配置主劑液3a及副劑 液3b而。 其次，依據步驟順序說明藉由此工件貼合裝置所進行之 貼合元件A之製造方法。 首先，如圖7(a)的實線所示，在腔室26c的出入口成開啟 之狀態下，朝其内部藉由基板搬送機構24，搬入已藉由塗 佈機構10塗佈主劑液3a及副劑液儿的第丨基板丨及第2基板 2，利用設置在上下保持板21、22之保持面21&、22&的保 持機構，對於下保持板21之保持面21a傳遞第丨基板丨，並 且對於上保持板22之保持面22a傳遞第2基板2，且分別進 行保持。 之後，如圖7(a)之兩點煉線所示，利用開閉驅動部2几之 作動而以門扉26d封閉腔室26c之出入口，在其内部形成封 閉空間S。 在該種閉鎖前或是閉鎖進行中，藉由來自封閉空間s之 壓力調整部29的作動而開始真空抽引，達到指定的真空 150561.doc -28- 201115237 度。 接著’如圖7(b)之實線所 下保持板21及上保持板22自 持面21a、22a之第1基板1與 劑液3a及副劑液3b而重合。 示，利用升降驅動部23之作動 動靠近移動，將保持在該等保 第2基板2，經由預先塗佈之主 再者，在即將開始重合前，根據需要可將上下保持板 21、22相對性地朝著與該重合方向垂直之水平方向（州方 向）調整移動，藉此亦可將其所保持的第丄基板i與第2基板 2彼此相互進行定位。 如圖例所示，當僅在第丨基板丨及第2基板2之對向面h、 2a的任一方，例如僅在下方之第丨基板丨，交替分散配置主 劑液3a及副劑液扑之情形時，藉由重合第ι基板丨與第二基 板2，在其對向面la、2a之間，交替分散配置的主劑液“ 及副劑液3b分別沿著對向面1&、2a伸展。 接著，如圖7(b)之兩點煉線所示，若使第丨基板丨及第2 基板2之對向面la、2a彼此之間更加接近時，沿著對向面 la、2a伸展的主劑液33及副劑液补之前端界面便會彼此衝 才里而相互連結，開始進行混合，主劑液3a及副劑液3b以指 疋之比例混合而形成連續一層的二液混合部3 c，伴隨該等 主劑液3 a及副劑液3 b的混合而開始整體性的硬化。 在此’如圖2(a)(b)或圖4(a)(b)所示，當主劑液3a及副劑 液3b以等間隔分散配置在遍佈矩形的對向面2a之大致整面 之情形時’之後如圖7(c)之一點煉線所示，將第1基板1及 第2基板2之對向面丨a、2a間加壓至形成指定間距〇時，二 J5056I.doc -29· 201115237 液混合部3c便伸展且充滿至對向面。之大致整面上，於其 内部使液晶或電子電路或是芯片等密封元件形成氣密封 裝。 此外，當主劑液3a及副劑液3b分散配置成沿著矩形之對 向面la、2a的周緣之矩形框狀時，二液混合部“便伸展成 邊框狀，在其内側形成用以封入液晶等之密封空間。 因此，如圖7(c)的實線所示’藉由上保持板22之保持機 構的作動’解除上方之第2基板2的保持，接著便藉由壓力 調整部29的作動而使腔室26c内的封閉空間s進行大氣開 放在其内壓力與以邊框狀二液混合部&所包圍之密封 元件的内壓之間產生壓力差。 精由該密封空間内外所產生的氣壓差，整體性且均等地 對第1基板1與第2基板2施壓而在維持平行之狀態下進行塵 縮’伴隨於此，二液混合部3c則被擠壓成均勻地遍佈全 周將-亥等第1基板1與第2基板2平行貼合，並且兩者的間 隔形成指定的間距G。 在結束該種貼合步驟之後，如圖7⑷之兩點煉線所示， 利用開閉驅動部27b的作動啟動門扉26d而使腔室—的出 入口開啟，藉由下保持板21之保持機構的作動解 其 W之保持，由腔室26c的内部藉由基板搬送機構24，將已 元成貼合之第1基板1及第2基板2朝外部搬出。 之後，便反覆上述之作動。201115237 VI. Description of the Invention: [Technical Field] The present invention relates to a flat surface (four) display for a liquid crystal display (LCD), an organic EL display (OLED), a plasma display (pDp), a flexible display, etc. FPD) or, for example, an optical element such as a PCT sensor or a CCD sensor, or a MEMS element, such as a touch panel, a hermetic sealing member such as an electronic circuit or a chip, or a touch panel or A 3D (3D) display or an electronic book-finding FPD-dedicated first substrate is provided with a bonding element having a new second functional substrate, a method of manufacturing the same, and a bonding apparatus for manufacturing a bonding element. In the prior art, as a method of manufacturing such a liquid crystal display panel, a spacer control material in which an ultraviolet curable resin and a spacer are mixed is formed on a first substrate, and an ultraviolet adhesive is applied to the second substrate. The linear sealing material is formed in a predetermined pattern by a dripping drawing method using a dispenser, and the first substrate and the second substrate are bonded together and pressurized, and ultraviolet rays are irradiated on the one hand to make the liquid crystal display surface The space control material and the sealing material are hardened (for example, refer to Patent Document 1). [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open No. Hei 07-225384 (pages 2-4, 2-8) [Explanation] [Problems to be Solved by the Invention] 150561.doc 201115237 However, in the method of manufacturing such a liquid crystal display panel, when a liquid point bonding agent is used as an adhesive, the substrate is used. When the second substrate is bonded, in order to cure the liquid-based adhesive sandwiched between the first substrate and the second substrate, external energy such as ultraviolet rays or the like is required to be irradiated or heated, so that it is not possible to merely overlap. The bonding between the substrate and the second substrate causes a problem that the bonding between the i-th substrate and the second substrate is time-consuming, and the cost of the bonding device increases. 0 Further, the bonding device for manufacturing the bonding device In addition, it is necessary to provide an external energy means such as ultraviolet irradiation or heating, which causes a problem that the overall structure of the apparatus is complicated and the cost is increased. Further, for example, when the first substrate and the second substrate are opaque to light such as ultraviolet rays, When the material is formed, it is not possible to cure the liquid-based adhesive by the light passing through the second substrate and the second substrate, and the first substrate and the second substrate are formed of a thermally deformable material. In the case where the first substrate and the second substrate are heated to cure the one-liquid adhesive, the allowable properties of the first substrate and the second substrate and the curing conditions of the adhesive are required to be obtained. The liquid-adhesive agent that can be used is limited. However, the liquid material of the liquid-adhesive agent itself is affected by the use environment, and the viscosity rises with the passage of time, and it is easy to deteriorate. Therefore, there is a need to have If you accidentally attach a liquid adhesive to the use of the bonding device, etc. It will harden due to deterioration. In addition, there will be some hardening energy such as ultraviolet rays or heat in the environment. Therefore, it will cause the problem that the hardening of the foreign body is hardened and the foreign matter is formed. In order to remove the foreign matter, it is necessary to use it. Special stripper Also has a problem difficult to completely remove it. An object of the present invention is to solve the above problems, and an object of the invention is to provide a two-liquid mixed-hardening type adhesive which mixes a main component liquid and a sub-agent liquid in a predetermined ratio, and reliably bonds the second substrate and the second substrate. The bonding element is obtained by mixing the two-liquid mixed-hardening type adhesive agent of the main-agent liquid and the auxiliary-agent liquid in a predetermined ratio, and reliably bonding the i-th substrate and the second substrate; even if it is local, it can ensure the mixing of the finger $ The non-continuous fine dot-like main agent liquid and the auxiliary agent liquid are mixed and solidified in a predetermined time; the main solution liquid and the auxiliary agent liquid are mixed in a bubble-free manner. [Means for Solving the Problems] In order to achieve such an object, the bonding device of the present invention is characterized in that a first substrate and a second substrate covering the n substrate are bonded together by an adhesive, and a main solvent solution is used. And a two-liquid mixed-hardening type binder of the auxiliary agent liquid as the adhesive agent, the main agent liquid and the auxiliary agent liquid are mutually mutually in the one or both of the opposing surfaces of the said first board|substrate and the said 2nd board|substrate In a manner that is not in contact with each other, the dispersion coating is arranged in a discontinuous fine dot shape, and the main solution liquid and the second liquid substrate are respectively stretched and connected to each other by the overlapping of the first substrate and the second substrate. Between the first substrate and the second substrate, the main solution liquid and the auxiliary liquid are dispersed to form a continuous one-layer two-liquid mixing unit at a predetermined ratio. Further, the method for producing a bonding device according to the present invention is characterized in that it is a method of manufacturing a bonding device in which a first substrate and a second substrate covering the second substrate are bonded together by an adhesive, and includes the following steps : Both the needles of the second substrate 150561.doc 201115237 and the opposite surface of the second substrate are used for the main solvent and the auxiliary liquid of the liquid-solid mixing adhesive. The upper and upper adhesives are applied in a non-continuous manner so as not to be in contact with each other, and the first substrate and the second substrate are superposed on each other so that the upper substrate is overlapped with the second substrate. The main solution liquid and the auxiliary agent liquid are stretched and connected to each other, and a continuous two-liquid mixing unit in which the main agent liquid and the auxiliary agent liquid are mixed at a predetermined ratio is formed between the first substrate and the second substrate. Mixing in this way. In addition to the above-described features, the present invention also includes the feature that the upper main solution liquid and the auxiliary liquid are applied to each other on the opposite surfaces of the i-th substrate and the second substrate. The i substrate and the second substrate are placed one on top of the other, and the main solution liquid is brought into contact with the auxiliary liquid, and is stretched along the opposing surfaces of the first substrate and the second substrate. In addition to the above features, the method further includes decompressing a space around the substrate and the second substrate, and superposing the first substrate and the second substrate in the decompressed environment, and mixing the above The main agent liquid and the above-mentioned auxiliary agent liquid. Further, the bonding device of the bonding device of the present invention is characterized in that it is a bonding device for bonding a first substrate and a bonding member of a second substrate covered with an adhesive, and includes: a coating mechanism for applying a main solution liquid and a sub-solution liquid of a two-liquid mixing-curing type adhesive agent to the surface of the first substrate and the second substrate as the adhesive; and a bonding machine for The first substrate and the second substrate are detachably held so as to face each other so as to face each other, and the coating mechanism is directed to both the first substrate and the second substrate or It is a unilateral surface, and the above-mentioned main 150561.doc 201115237 mixed portion liquid and the above-mentioned auxiliary liquid are dispersed and applied in a non-continuous fine point shape so as not to be in contact with each other. When the second substrate is overlapped, the main solution liquid and the auxiliary liquid are stretched and connected to each other, and the main solution liquid and the auxiliary liquid are formed at a predetermined ratio between the i-th substrate and the second substrate. Mixed continuous-layer two liquid In addition to the above-described features, the coating agent is configured to apply the main agent liquid and the auxiliary agent to the opposing surfaces of the first substrate and the second substrate, respectively, so as to face each other. liquid. In addition to the above-described features, the bonding machine further includes a closed space in which the air pressure can be adjusted around the first substrate and the second substrate, and the above-described closed space is superposed under the reduced pressure. The first substrate and the second substrate are mixed with the main solution liquid and the auxiliary liquid to form the two-liquid mixing unit. [Effects of the Invention] The bonding element of the present invention having the above-described characteristics is arranged in a fine dot shape on the opposing surface of the second substrate and the second substrate with the weight 5 of the second substrate and the second substrate. The main solution liquid and the auxiliary agent liquid are respectively extended to bring the interfaces into contact with each other and connected to each other, whereby a continuous mixture of the main solution liquid and the auxiliary liquid at a predetermined ratio is formed between the second substrate and the second substrate. In the two-liquid mixing portion, the two-liquid mixing portion starts to be hardened, and since the second substrate and the second substrate are bonded to each other, it is possible to provide a mixture of the main agent liquid and the auxiliary agent liquid in a ratio of a finger. The two-liquid mixed-hardening type adhesive adheres to the bonding element of the upper substrate and the second substrate. I50561.doc 201115237 The result is that the first substrate and the second substrate can be adhered to by a simple procedure as compared with a conventional bonding device that requires ultraviolet light or the like to heat the adhesive to harden the adhesive. In order to achieve the purpose of reducing manufacturing costs. Further, since the main solution liquid and the auxiliary liquid are dispersed and arranged in a discontinuous fine dot shape, the chance of contact between the main solution liquid and the auxiliary liquid is increased, and it is easy to achieve uniform mixing in a short time. Further, since the first substrate and the second substrate overlap with each other, the fine-pointed main solution liquid and the auxiliary liquid are stretched and brought into contact with each other to form a two-liquid mixing portion, so that there is no mixing by mixing. After the bubble is generated, no defoaming operation is required. The coating pattern of the main component liquid and the auxiliary agent liquid can also be used to extrude the gas existing around the fine dot-like main solution liquid and the auxiliary agent liquid to the outside of the first substrate and the second substrate. Further, in the method for producing a bonding device of the present invention, the fine dot-like main liquid and the auxiliary liquid which are dispersed and applied to the opposite surfaces of the substrate and the substrate are respectively stretched by the overlap of the first work and the second substrate. And the interfaces are brought into contact with each other and connected to each other, whereby a continuous layer of the two-liquid mixture of the main solution liquid and the auxiliary agent liquid mixed at a predetermined ratio is formed between the first substrate and the second substrate. Since the opposing surfaces of the first substrate and the second substrate are bonded to each other, the two-liquid mixed-hardening adhesive which is mixed with the main component liquid and the sub-group at a predetermined ratio can reliably secure the substrate and the second substrate. As a result of the adhesion, the first substrate and the second substrate can be bonded by a simple I5056I.doc 201115237 program, compared with a conventional manufacturing method in which the external agent can harden the contact agent and require ultraviolet light or the like. The substrate can thereby achieve the purpose of reducing manufacturing costs. Further, since the main solution liquid and the auxiliary liquid are dispersed and arranged in a discontinuous fine dot shape, the chance of contact between the main solution liquid and the auxiliary liquid is increased, and it is easy to achieve uniform mixing in a short time. With regard to the fine dot-like main solution liquid and the auxiliary liquid, it is possible to finely adjust the hardening mixture ratio of the main agent liquid and the auxiliary liquid liquid only by changing the coating amount per time or changing the arrangement conditions. The bonding state of the first substrate and the second substrate can be quickly responded to. When only the main solution liquid or the auxiliary liquid is applied, the main solution liquid or the auxiliary liquid can be easily removed by washing the substrate before the second substrate and the second substrate are bonded together, so that it is economical to reuse the substrate. benefit. Further, as the first substrate and the second substrate are overlapped, the fine dot-like main solution liquid and the auxiliary liquid are stretched to be in contact with each other and connected to each other to form a two-liquid mixing portion, so that no stirring or mixing occurs. After the bubble, no defoaming operation is required. The coating pattern of the main solution liquid and the auxiliary liquid may be used to extrude the gas existing around the fine dot-like main solution liquid and the auxiliary liquid to the outside of the first substrate and the second substrate. Furthermore, in the method of manufacturing the bonding device, the main solution liquid and the auxiliary agent liquid are applied to each other on the opposite surfaces of the second substrate and the second substrate. The first substrate and the second substrate are superposed on each other, and the main solution liquid is brought into contact with the auxiliary liquid, and is stretched along the opposing surface of the first substrate and the second substrate. The first substrate and the second substrate overlap each other, and the opposing main agent liquid and the auxiliary agent liquid collide, mix, and stretch, and the stretching front end interfaces are connected to each other, and the shape is 5056 丨.doc 201115237 as the main liquid and the auxiliary agent. The continuous _ layer two-liquid mixing unit in which the liquid is mixed at a predetermined ratio spreads over the opposing surfaces of the first substrate and the second substrate, and the entire surface is hardened. Therefore, even a partial region can ensure discontinuous fine points. The main solution liquid and the auxiliary liquid are mixed to a predetermined mixing ratio, and can be reliably hardened within a predetermined time. Further, in the method of manufacturing the bonding device, the space around the second substrate and the second substrate is decompressed, and the first substrate and the second substrate are overlapped in the decompressed environment. Mixing the above-mentioned main solution liquid and the above-mentioned auxiliary agent liquid' at this time, the main solution liquid and the auxiliary agent liquid are mixed under a reduced pressure environment, and since the bubbles do not enter accompanying such mixing, the main solution liquid can be mixed without bubbles. Auxiliary agent solution. As a result, it is not necessary to defoam the two-liquid mixed hardening adhesive after bonding the first substrate and the second substrate, and the time required from the start to the end of the bonding can be shortened. Further, in the bonding apparatus of the bonding device of the present invention, the first substrate and the second substrate are superposed on each other by the bonding machine, and the coating mechanism is dispersed and applied to the opposing surface of the second substrate and the second substrate. The point-like main solution liquid and the auxiliary agent liquid are respectively extended and the interfaces are brought into contact with each other and connected to each other, whereby the main component liquid and the auxiliary agent liquid are formed between the first substrate and the second substrate to be mixed at a prescribed ratio. In the continuous two-liquid mixing portion, the two-liquid mixing portion starts to be hardened, and the opposing surfaces of the first substrate and the second substrate are bonded to each other. Therefore, the main solution liquid and the auxiliary liquid are mixed at a predetermined ratio. The liquid-hardening type adhesive can reliably bond the first substrate to the second substrate. As a result, the first substrate and the second substrate can be bonded by a simple procedure as compared with a conventional device that requires ultraviolet light such as ultraviolet rays to cure the adhesive or external energy such as 150561.doc •10·201115237 heating. Thereby, the purpose of reducing the manufacturing cost can be achieved. Further, since the main solution liquid and the auxiliary liquid are dispersed and arranged in a discontinuous fine dot shape, the chance of contact between the main solution liquid and the auxiliary liquid is increased, and it is easy to achieve uniform mixing in a short time. In the fine dot-like main solution liquid and the auxiliary liquid system, the hardening and mixing ratio of the main agent liquid and the auxiliary agent liquid can be freely adjusted by merely changing the coating amount per time or changing the arrangement conditions. The bonding state of the first substrate and the second substrate can be quickly responded to. When only the main solution liquid or the auxiliary liquid is applied, the main solution liquid or the auxiliary liquid can be easily removed by washing the substrate before the second substrate and the second substrate are bonded together, so that it is economical to reuse the substrate. benefit. Further, as the first substrate and the second substrate are overlapped, the fine dot-like main solution liquid and the auxiliary liquid are stretched to be in contact with each other and connected to each other to form a two-liquid mixing portion, so that no stirring or mixing occurs. After the bubble, no defoaming operation is required. The coating pattern of the main solution liquid and the auxiliary liquid may be used to extrude the gas existing around the fine dot-like main solution liquid and the auxiliary liquid to the outside of the first substrate and the second substrate. Further, in the bonding apparatus of the bonding device, the main solution liquid is applied to the opposing surfaces of the first substrate and the second substrate by the coating means so as to face each other In the case of the above-mentioned auxiliary agent liquid, the first substrate and the second substrate are overlapped with each other, whereby the main component liquid and the auxiliary agent liquid collide with each other, and are mixed and stretched. The continuous layer of the two-liquid mixing portion of the main agent liquid and the auxiliary agent liquid mixed at a predetermined ratio is spread over the opposite surface of the first substrate and the second substrate, 150561.doc 201115237, and the whole portion is hardened, so that even the portion The area also ensures that the discontinuous fine dot-like main solution liquid and the auxiliary liquid are mixed to a specified mixing ratio, and the hardening is reliably performed within a predetermined time. Further, in the above-described bonding apparatus of the bonding device, the bonding machine forms a closed space in which the air pressure can be adjusted around the first substrate and the second substrate, and is made in an environment in which the closed space is depressurized. The second substrate and the second substrate are superposed on each other, and the main solution liquid and the auxiliary liquid are mixed to form the two-liquid mixing unit. In this case, the main liquid and the auxiliary liquid are mixed in a reduced pressure atmosphere, and the main solution and the auxiliary liquid are not accompanied. The preparation of the two-liquid mixing portion causes air bubbles to enter, so that the main solvent liquid and the auxiliary agent liquid can be mixed without bubbles. As a result, it is not necessary to defoam the two-liquid mixed hardening adhesive after bonding the first substrate and the second substrate, and the time required from the start to the end of the bonding can be shortened. [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 to 4, the bonding element A according to the embodiment of the present invention includes a pair of second substrate 丨 and a second substrate 2 which are disposed to face each other and are overlapped, and are applied to the first substrate 1 And both of the opposing faces ia and 2a of the second substrate 2 or one of the two-liquid mixed-hardening type adhesives 3. The first substrate 1 and the second substrate 2 are glass substrates or PES used in a flat panel display (FPD) such as a liquid crystal display (Lcd), an organic EL display (OLED), a plasma display (PDP), or a flexible display. (p〇iy_Ether_ Sulphone) and other plastic film or synthetic resin substrates, or optical components such as CMOS sensor CCD sensors or MEMS components, etc. 15056 丨.doc -12- 201115237 used to cover electronic circuits or The wafer surface of the chip or the cover glass of the cover glass 4 is used for FPD or cover glass in, for example, a touch panel or a 3D (3D) display or an electronic book. The two-liquid mixing-curing type adhesive 3 mainly comprises a main agent liquid 3& and a sub-agent liquid 3b, and an adhesive which starts to harden by mixing the main-agent liquid 3a and the auxiliary-agent liquid 3b. Examples of the two-liquid mixing-curing type adhesive 3 include an epoxy-based adhesive, a second-generation propylene-based adhesive (SGA) urethane-based adhesive, and an anthrone-based adhesive. Agents, etc. Further, in the two-liquid mixing-curing type adhesive 3, a crosslinking accelerator or a curing catalyst may be added as the additive other than the main component liquid 3a and the auxiliary agent liquid 3b. Further, the uncured main solution liquid 3a and the auxiliary liquid 3b are not in contact with each other on either or both of the surfaces ia and 2a of the opposing surfaces of the first substrate 1 and the second substrate 2, respectively. The two-pack hybrid curing adhesive 3' is applied in a discontinuous manner, and the first substrate i and the second substrate 2 are superposed on each other, whereby the main solution liquid 3a and the auxiliary liquid 3b are stretched and connected to each other to form a two-liquid mixture. The part 3c is distributed in this way. In other words, the main solution liquid 3a and the sub-agent liquid 3b are overlapped with the first substrate 1 and the second substrate 2, and the main solution liquid 33 and the sub-agent liquid-spray disposed in a dispersed manner are stretched to bring the interfaces into contact with each other. 'Therefore a two-liquid mixing portion 3 c is formed. In order to facilitate the stretching of the main solution liquid 3a and the auxiliary agent liquid 3b, it is preferred to use a low viscosity (about 200 Pa·s = 200,000 cP or less). The total amount of the main solution liquid 3 a and the auxiliary agent liquid 3 b which are non-continuously applied to the opposing surfaces (surfaces) 1a and 2a of the first substrate 1 and the second substrate 2 is 150561.doc 13 201115237 The stretched shape of the main component liquid 3a and the auxiliary agent liquid 3b which are formed by the overlap of the first substrate 1 and the second substrate 2, and the pitch g between the first substrate 1 and the second substrate 2 after bonding are determined. The coating amount of the non-continuous main component liquid 3 a and the auxiliary agent liquid 3 b is, for example, 1000 pg or less. In detail, it is preferably applied by a coating of about 1 〇 gg to 100 pg. The substantially hemispherical shape is maintained in a hemispherical shape by the surface tension generated on the surface of each of the dot-like main liquid 3a and the auxiliary liquid 3b. In this case, there is an advantage that even when the first substrate 1 and the second substrate 2 after coating are moved so as to be inclined with respect to the surfaces la and 2a, or when they are turned downward, the liquid does not drip and the main body The solution 3 a and the auxiliary solution 3 b are in contact. Further, the coating ratio or coating amount of the main solvent liquid 3 a and the auxiliary agent liquid 3 b is an appropriate mixing ratio of the main solvent liquid and the auxiliary agent liquid 3b in the two-liquid mixing and hardening type adhesive 3 For example, as shown in the example, when the proper mixing ratio of the main solution liquid 3a and the auxiliary agent liquid 31 is 1:1, the main solution liquid 3a and the sub-agent liquid 3b are coated. In contrast, when the appropriate mixing ratio (hardening mixing ratio) of the main solution liquid 3a and the auxiliary agent liquid 3b is different from 1: n or n: i, the main solution 3 & And the coating amount of each of the auxiliary agent liquids 3b is set to be the same as the appropriate mixing ratio, or the arrangement conditions of the main solution liquid 3a and the auxiliary agent liquid 3b in the same coating are the same as the appropriate mixing ratio. When the appropriate mixing ratio of the main solution 3a and the auxiliary solution 3b (hardening 150561.doc 1y! 201115237 mixing ratio) is 2:1, the coating amount of the main solution 3a is set to be the coating of the auxiliary liquid 3b. The amount of the main agent liquid 3 a is set to be twice the amount of the auxiliary agent liquid 3b. As a coating example of the main agent liquid 3a and the auxiliary agent liquid, as shown in Fig. 1(a) And Figure 2(a)(b) In the opposite direction of the i-th substrate 1 and the second substrate 2, the main solution 3a is dispersedly disposed so as to face each other when the first substrate 1 and the second substrate 2 are overlapped with each other. And the auxiliary agent liquid 3b. That is, the unhardened main solution liquid 3& and the field 1J agent liquid 3b are applied to the same fine dot pattern in the opposite direction to the opposing surfaces 1a and 2a. In the embodiment shown in FIG. 1(a), the surface 1a of the first substrate 1 disposed below and the surface & of the second substrate 2 disposed above the first substrate 1 and the second substrate In the case where the two main solution liquids 3a and the respective sub-agent liquids 3b are opposed to each other, the main solution liquid 3a and the sub-agent liquid 3b are mixed and dispersed. In the embodiment shown in Fig. 2 (a) and (b) The auxiliary agent liquid 3b is applied only to the surface la of the second substrate 1 disposed below, and the main solution 3a is applied only to the surface 2a of the second substrate 2 disposed above. Further, other examples are not shown in the drawings. However, the main solution liquid 3a and the auxiliary agent (4) may be mixed and dispersed in such a manner that the main substrate liquid 3a and the auxiliary agent liquid are aligned in the manner in which the second substrate 2 and the second substrate 2 are overlapped with each other. I i the surface of the substrate ". 2A or the second surface 2 of the substrate. Further, in the embodiment shown in FIGS. 2(a) and 2(b), the 基板i substrate i and the second substrate 2 are formed in a rectangular flat shape, and spread over substantially the entire surfaces of the opposing faces la and 2a. Dispersing the main solution liquid 3a and the auxiliary agent liquid at equal intervals 3be 150561.doc 15 201115237 Further, although other examples are not shown in the drawing, it may be only on the green of the opposite faces 1 a, 2a formed into a rectangle 'The main solution liquid 3a and the sub-agent liquid 3b are dispersed and disposed at equal intervals, respectively, so as to form a rectangular frame shape along the four sides of the opposite faces la, 2 & or may be in the opposite faces la, 23 Partially, the main solution liquid 3a and the sub-agent liquid 3b are dispersed and arranged in an arbitrary shape such as a straight line or a curved shape. Further, the main solution liquid 3a and the auxiliary liquid may be dispersed in an arbitrary shape on the opposing surfaces la and 仏 of the second substrate 丨 and the second substrate 2 which are formed in a shape other than a rectangular shape. In this embodiment, as shown in FIG. 1(b), by the overlap of the second substrate 丨 and the second substrate 2, the main component liquid 3a and the auxiliary liquid 3b are flushed and started. Mix and stretch along the opposing faces 丨a, 2a. Then, as shown in FIG. 1(C), when the opposing faces 1a and 2a of the first substrate 1 and the second substrate 2 are brought closer to each other, the main solution liquid and the auxiliary agent liquid 3b are further combined, and The main solution liquid "and the front end liquid 3b extending along the opposing surfaces 丨a, 2a" and the front end interface of the auxiliary agent liquid 3b are connected to each other, thereby forming a main liquid 3 & between the ith substrate 丨 and the second substrate 2; The continuous layer-liquid mixing portion 3c in which the auxiliary agent liquid 3b is mixed at a predetermined ratio is solidified as a result of the mixing of the main solution liquid 3a and the auxiliary agent liquid 3b. Thereafter, as shown in Fig. 1(d) When the opposite surface 1 a 2a of the first substrate 1 and the second substrate 2 is added to the surface of the first substrate 1 and the second substrate 2, the % three-liquid mixing portion 3cit is applied to the two surfaces, and is spread over the two opposing surfaces. In the designated area, the two liquids are smashed. The 卩3c is stretched and filled in a desired shape, and in this state, the opposing faces la and 2a of the first substrate and the second substrate 2 are bonded together. 150561.doc -16· 201115237, at this time, when the main agent liquid 3 and the auxiliary agent liquid 3b are dispersed at equal intervals on the opposite faces of the rectangular faces, as shown in the two points of the line shown in Fig. 2 (4) and (8), The liquid mixing portion is formed in a substantially (four) shape and filled. Although the second portion is shown in the figure, the main solution liquid 3a and the auxiliary agent liquid 11 are dispersed and disposed on the circumferential surface of the opposite faces la, 23 of the rectangle. In the rectangular frame shape, the two-liquid mixing portion 3c is stretched in a frame shape to form a sealed space for enclosing the liquid crystal on the inner side thereof. '曰曰, whereby only the first substrate 丨 and the second substrate 2 are overlapped. The predetermined ratio = mixing of the non-continuous main agent liquid and the auxiliary liquid wicking starts to harden, and the opposing faces la and 2a are reliably adhered to each other to form the bonding element A. As another coating example, as shown in the figure 3(a) and FIG. 4(a) and (b) show the direction along the opposing faces 1a and 2a on either of the opposing faces 1a and 2a of the second substrate 1 and the second substrate 2. The main solution liquid 3a and the auxiliary agent liquid 3b are alternately disposed, that is, the unhardened main solution liquid 3a is applied in a fine dot pattern on either of the opposing faces la, 2a, and the main agent is applied The uncured auxiliary liquid 3b is applied in the same fine dot pattern by the phase shift of the fine dot pattern of the liquid 3 a. In the embodiment shown in Fig. 4 (a) (b), only The main solution liquid 3& and the auxiliary liquid 3b' are alternately applied to the surface la of the first substrate 1 arranged on the lower rectangular shape in a direction parallel to the orthogonal sides, but the present invention is not limited thereto, and instead The main solution liquid 3a and the sub-agent liquid 3b are alternately applied to the surface 2& of the second substrate 2 disposed above. 150561.doc •17·201115237 Furthermore, the implementation shown in Fig. 4(a)(b) In the example, the first substrate i and the second substrate 2 are formed in a rectangular flat shape, and are disposed over the entire surface of the surface la of the rectangular second substrate 1 disposed below, and the main solution 3a and the sub-distribution are dispersed at equal intervals. Solution liquid 3b. Further, although other examples are not disclosed in the drawings, the main solvent liquid 3a and the auxiliary liquid 3b may be dispersed at equal intervals only on the periphery of any of the opposing faces la and 2a formed in a rectangular shape. The main solution liquid 3a and the auxiliary liquid 3b may be arranged in a straight line or a curved shape along the opposite surface, in the rectangular frame shape of the four sides, or in the portions of the opposing surfaces u and 2a. Further, in the second substrate 2 and the opposing surfaces la and 2a of the second substrate 2, the main solution liquid and the auxiliary liquid may be dispersed and arranged in an arbitrary shape. . In this embodiment, as shown in FIG. 3(b), by the overlap of the second substrate 丨 and the second substrate 2, the main solution 3a and the main solution 3a are alternately dispersed between the opposing faces la' 2a. The auxiliary liquid 3b extends along the opposing faces la, 2a, respectively. Then, as shown in FIG. 3(c), when the opposing faces la and 2a of the second substrate 丨 and the second substrate 2 are further brought closer to each other, the main solution liquid 3a and the pair extending along the opposing surface u are extended. The front end interfaces of the solution liquid 3b collide with each other and are connected to each other, and the likes are mixed, thereby forming a continuous two-liquid mixing portion 3c' in which the main solution liquid 3a and the sub-agent liquid 3b are mixed in a prescribed ratio. The mixture of the main solution liquid 3 a and the auxiliary agent liquid 3b starts to harden. Thereafter, as shown in FIG. 3(d), when the second substrate 丨 and the opposing faces 1a and 2a of the second substrate 2 are pressurized until a predetermined pitch g is formed, the two-liquid mixing portion 150561.doc • 18· 201115237 3 Progressive extension 'The two-liquid mixing part 3 is spread over the designated area between the two opposite faces ia and ～. The film is stretched and filled in a desired shape, and in this state, the opposing faces la and 2a of the first substrate 1 and the second substrate 2 are bonded together. In the case where the main solution 3a and the auxiliary liquid 3b are dispersed at equal intervals on the substantially entire surface of the rectangular opposite surface 2a, the two-liquid mixing unit is not called the two-point mixing line. 3c is stretched and filled in a substantially rectangular shape. This is not shown in the figure, but when the main solution 3a and the side liquid fuspone are dispersed and arranged in a rectangular frame shape at the periphery of the opposing faces la and 2玨 of the opening of the mouth, the two-liquid mixing unit 3c The frame is stretched to form a sealed space for enclosing liquid crystal or the like on the inner side thereof. By this, only by the first! The substrate i and the second substrate 2 are superposed on each other, and the discontinuous main solution 3a and the auxiliary liquid fuzz are mixed locally (four), and the bonding is performed in the specified _ (four). The bonding element A is formed on the faces b and 2a. Next, a description will be given of the bonding method used to manufacture the bonding component eight. In the workpiece bonding apparatus according to the embodiment of the present invention, as shown in FIG. 5 to FIG. 7, the coating mechanism 1 is applied to the surface of the first substrate 1 and the second substrate 2, and is coated with a two-liquid mixture. The main agent liquid 3a of the hardening type adhesive agent and the liquid 1b of the field 1 3; the body 5 of the hardening type 2, the #2, the heart and the sticking branch G are used for the correction of the substrate i and the second roll 2 The surfaces la and 2a are opposed to each other and are superposed.丨 丨 可 进行 作为 作为 作为 涂布 涂布 涂布 涂布 涂布 涂布 涂布 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' The surface 1a and the surface 2a of the second substrate 2 are intermittently and intermittently added to the main solution 34 of the two-liquid mixed-hardening type adhesive agent, and the auxiliary agent liquid 34b is applied to the surface of the second substrate 2, thereby giving a predetermined distance, for example, 1 The coating is applied in a fine hemispherical shape of about ～100 pg. As another coating example, you can also go to Putian < Λ1 j The main solution liquid 3a and the sub-agent liquid 3b are applied in a discontinuous manner by screen printing or the like. In the case shown in Fig. 5, 'the liquid quantitative discharge machine U is used as the coating means 1G, and the i-th substrate is placed such that the surfaces la, 2a face upward, and the plate 2 is placed above the discharge port downward. A liquid squeezing machine 11 such as a dispenser, on the one hand, you can make any one or both of the first substrate i and the second substrate 2 or the liquid quantitative discharge machine 11 on the first substrate i and the second substrate 2 or the liquid quantitative discharge machine 11 The relative movement is directed to the surface 1a of the first substrate i and the surface 2a of the second substrate 2, and the main solution 3a or the auxiliary solution 3b is intermittently dropped by the discharge port of the liquid quantitative discharge machine 11 Therefore, as shown in Fig. i (4), Fig. 2 (4) (b) or Fig. 3 (4) Fig. (8), fine hemispherical dots are applied at predetermined intervals. The liquid quantitative discharge machine 11 is electrically connected to control from the discharge port. The controller 12, # of the amount of dropping or the like is changed by the amount of dripping of each drop, except that the diameter of the main solution 3& or the auxiliary liquid 3b which can be adjusted down to the surfaces 1a and 2a of the first substrate i and the second substrate 2 (Drop diameter) D can also be adjusted by changing the time interval between drops. In the vicinity of the machine n, the measuring unit 13 is provided for measuring the dropping pitch or the dropping diameter of the main solvent W, the dropping agent liquid 3b, which is discharged by the liquid amount, and the storage unit 14 and the storage unit 14 Preferably, the measurement data or the setting data of the measurement unit U can be electrically connected to the controller 12 by using the components of the memory unit i4, and the measurement data or the setting resource stored according to the memory unit i4. (4) Setting the dropping diameter or the dropping pitch of the main solution liquid 3a or the closing liquid 3b. On the other hand, the bonding machine 20 is provided with a pair of upper and lower holding plates 2i, 22' as shown in Figs. 6 and 7 The i-th substrate and the second substrate 2 are detachably held, and the elevation drive unit 23 moves one of the upper and lower holding plates 21 and 22 toward the other to overlap the first substrate 1 and the second substrate 2; The substrate transfer mechanism 24 is carried in the upper and lower holding plates 21 and 22, and the first substrate 1 and the second substrate 2 are carried out, and the control unit 25 is operated to control the lift drive unit 23 and the substrate transfer mechanism 24, respectively. The holding plate 2 1 and the upper holding plate 22 are made of, for example, metal or ceramics. The thickness of the body which is not deformed by twisting (flexing) is formed into a flat shape, and the holding surfaces 21a to 22a which are provided so as to be smooth are opposed to each other, and the holding surfaces 21 & 22a are detachably held as a separate one. The substrate 丨 and the holding mechanism (not shown) of the second substrate 2 are provided, for example, an electrostatic chuck, an adsorption jig, an adhesive jig, or the like, or the like. Further, the lower holding plate 2 1 and the upper holding plate 22 are provided. Either or both of the holding surfaces 21a and 22a are supported to be reciprocally supported in such a manner that the holding surfaces 21a and 22a are close to each other or separated in a parallel direction in the vertical direction (Z direction). In the case of the illustrated example, the elevation drive unit 23 that moves only the upper holding plate 22 up and down is provided. As another example, the elevation drive unit 23 may move the lower holding plate 21' up and down or the upper and lower holding plates 21 and 22 to move up and down. In addition, it is preferable to form a closed space s for air pressure adjustment by 150561.doc 21 201115237 around the lower holding plate 21 and the upper holding plate 22, and when the closed space s is decompressed into a vacuum or close to a vacuum state, The first substrate 1 and the second substrate 2 are superposed on each other so as to move the holding surfaces 2a and 22a closer to each other. The substrate transfer mechanism 24 is formed by, for example, a transfer robot that detachably holds the first substrate 1 and the second substrate 2 by an adsorption sheet or the like, and is configured such that the outer region of the application mechanism 10 is placed toward the upper and lower holding plates 21 . The holding surfaces 21a and 22a of the 22 are carried into the i-th substrate i and the second substrate 2, and after the bonding step is completed, the unloading operation is performed toward the outer region. The control unit 25 is a controller that is electrically connected to the elevation drive unit 23 and the substrate transfer mechanism 24, and the coating unit 1 is used to terminate the application step of the main solution 3a and the auxiliary solution 3b. The first! The substrate cassette and the second substrate 2' are carried into the upper and lower holding plates 2 1 and 2 2 by the substrate transfer mechanism 24, and are transferred to the holding surfaces 21a and 22a, and then moved up and down the holding plates 2i and U by the lifting and lowering driving unit 23. Either or both of the opposing surfaces U and 2a of the first substrate 1 and the second substrate 2 are overlapped with each other by the main solution liquid 3a and the auxiliary liquid, and then controlled to complete the first substrate. The second substrate 5 and the second substrate 2 in the bonding step of the second substrate 2 are carried out by the substrate transfer mechanism 24. The embodiments of the present invention are described in the following drawings. [Embodiment 1] In the first embodiment, the following is an open-air vacuum laminating machine: as shown in Figs. 6(a) to 6(c), the partitioning chamber which can be divided in the vertical direction is called the internal pain of 26b. p, the sigh has the lower holding plate 21 and the upper holding plate 22, and the divided chambers ja 26bb are closed by the operation of the opening and closing driving portion 27a, and the closed space formed in the interior thereof is divided into designated vacuums. At the beginning, 150561 .doc •22· 201115237 The first substrate 1 and the second substrate 2 are overlapped, and then the closed space s is opened to the atmosphere. Preferably, it is preferable that one or both of the divided chambers 26a and 26b are slidably moved in the X-flat direction (ΧΥ0 direction), or may be used for the divided chambers 26a and 26b. One or both of the upper and lower holding plates 21'22 are supported so as to be moved in the horizontal direction (ΧΥΘ direction). In the embodiment shown in Figs. 6(a) to (c), only the upper holding plate will be provided. The partitioning chamber 26a' above is reciprocally supported by the partitioning to 26b in the vertical direction (z direction) with respect to the partitioning 26b provided below the lower holding plate 21, by the opening and closing driving portion 27a And make it open and close. For either or both of the upper and lower divided chambers 26a, 26b, either or both of the lower holding plate 21 and the upper holding plate 22 are shown, and the embodiment shown in the drawing is only the upper holding plate 22' by the lifting drive portion 23 On the other hand, when the division chambers 26a and 26b are opened and closed, the upper second substrate 2 is moved toward the lower first substrate 1 . In addition, as another example, the upper and lower holding plates 2A and 22b are integrally provided to the divided chambers 26a and 26b, and the opening and lowering drive unit 23 of the upper and lower holding plates 21 and 22 and the opening and closing drive unit of the divided chambers 26a and 26b can be opened. 27a is formed in one body. In this case, for example, the elastic deformation of the annular seal portion 28 such as a 〇-shaped ring provided between the division chambers 26a and 26b can be moved closer to the movement after the division chambers 26a and 26b are closed. 1 The substrate 1 and the second substrate 2 are overlapped. I50561.doc 23-201115237 a pressure adjusting unit 29 that passes through the inside and outside of the dividing chambers 26a and 26b and that passes through the inside and outside of the chambers, and controls the pressure adjusting unit 29 by the control unit 25, The internal air is exhausted to the outside from the closed space S in the closed compartments 26a and 26b, thereby decompressing to form a designated vacuum state. Conversely, by supplying the external gas to the inside. The internal pressure of the closed space S is restored to the same state as the ambient air pressure (atmospheric pressure). Further, in the case of the embodiment shown in Figs. 6(a) to 6(c), as a coating example of the main solution liquid 3a and the auxiliary agent liquid 3b by the coating mechanism 10, as shown in Fig. 1(a) and As shown in Fig. 2 (a) and (b), the opposing faces ia, 2 & both of the first substrate 1 and the second substrate 2 are opposite to each other when the first substrate 1 and the second substrate 2 are overlapped. The main solution liquid 3a and the sub-agent liquid 3b are dispersedly disposed. Further, as another example, as shown in FIG. 3(a) and FIG. 4(a) and FIG. 4(b), only one of the opposing faces la and 2a of the first substrate 1 and the second substrate 2 may be alternated. The main solution liquid 3a and the sub-agent liquid 3b are separately dispersed. Next, a method of manufacturing the bonding member A by the workpiece bonding apparatus will be described in the order of steps. First, as shown by the solid line in FIG. 6(a), in the state in which the division chambers 26a and 26b have been activated, the main solution liquid 3a is applied by the application mechanism 10 into the inside by the substrate transfer mechanism 24, The first substrate 1 and the second substrate 2 of the auxiliary agent liquid 3b transfer the first substrate 1 to the holding surface 21 a of the lower holding plate 2 1 by the holding means provided on the holding faces 21a and 22a of the upper and lower holding plates 21 and 22 And the second substrate 2 is transferred to the holding surface 2 2 a of the upper holding plate 2 2 and held separately. 150561.doc -24- 201115237 After that, as shown by the two-dot chain line in Fig. 6(a), the splitting chambers 26a and 26b are closed by the operation of the opening and closing drive unit 27a. You /, the fight forms a closed space S. Before this kind of closing or during the closing operation, 蕤 ρ τ starts the vacuum pumping of the pudding pouch 5 by the action of the pressure adjusting unit 29 from the closed space S to reach the specified degree of vacuum. Then, as shown by the solid line in FIG. 6(b), the lower holding plate 21 and the upper holding plate 22 are automatically moved closer to the lower surface of the holding surfaces 2U, 22a by the operation of the elevation driving portion η. The substrate i and the second substrate 2 are superposed on each other by the main solution liquid 3 a and the auxiliary liquid 3 b which are applied in advance. Further, 'before the coincidence is started', the upper and lower holding plates 21 22 can be relatively moved in a horizontal direction (χγθ direction) perpendicular to the overlapping direction as needed, whereby the second substrate held thereby can be held. The crucible and the second substrate 2 are positioned to each other. As shown in the example, the i-th substrate 丨 and the opposite surface u of the second substrate 2 are. When the main solution 3a and the auxiliary agent liquid are dispersed and arranged to face each other, the first substrate 1 and the second substrate 2 are overlapped, and the main solution 3a and the auxiliary liquid 3b collide with each other. At the same time, mixing is started, and stretching is performed along the opposing faces 丨a, 〜. Then, as shown in the two-point line as shown in Fig. 6(b), when the opposing faces 1a and 2a of the first substrate 1 and the second substrate 2 are brought closer to each other, the main solution 3a and the pair are further mixed. The agent liquid 3b and the main agent liquid 3a extending along the opposing faces 1a, 2a and the front end liquid interface are connected to each other, and the main solution liquid 3a and the auxiliary agent liquid 3b are mixed at a predetermined ratio to form a mixture. The two-liquid mixing unit 3c' of one continuous layer starts the hardening of the integrity 150561.doc •25-201115237 with the mixing of the main liquid 3& and the auxiliary liquid helium. Here, as shown in Fig. 2 (a) (b) or Fig. 4 (a) and (b), the main solution liquid 3a and the sub-agent liquid 3b are dispersed and arranged at substantially equal intervals over substantially the entire surface of the rectangular opposing surface. In the case where the first substrate 】 and the opposing faces la and 23 of the second substrate 2 are pressurized to form a predetermined pitch G, the two-liquid mixing portion is formed as shown in a line of one of FIG. 6(c). 3c is stretched and filled to substantially the entire surface of the opposing surface 2a, and a sealing member such as a liquid crystal or an electronic circuit or a chip is formed in a hermetic package. Further, when the main solution liquid 3a and the auxiliary liquid 3b are dispersedly arranged in a rectangular frame shape along the circumference of the rectangular opposing faces 1a, 2a, the two-liquid mixing portion 3 is further extended into a frame shape and formed on the inner side thereof. It is used to seal a sealed space such as a liquid crystal. Therefore, as shown by the solid line in FIG. 6(c), the holding of the upper second substrate 2 is released by the operation of the holding mechanism of the upper holding plate 22, and then the dividing chamber is further actuated by the operation of the pressure adjusting portion 29. The closed space s in the 26a, 26b is open to the atmosphere so that a pressure difference is generated between the internal pressure thereof and the internal pressure of the sealing member surrounded by the frame-shaped two-liquid mixing portion 3c. The first substrate 1 and the second substrate 2 are pressed integrally and uniformly by the pressure difference between the inside and the outside of the sealed space, and are compressed in a state of being kept parallel. Accordingly, the two-liquid mixing unit 3c is The first substrate 1 and the second substrate 2 are bonded in parallel so as to be uniformly spread over the entire circumference, and the interval between the two forms a predetermined pitch G. in,,,. After the above-described bonding step, as shown in the two-point line of FIG. 6(c), the division chambers 26a and 2 are opened by the operation of the opening and closing drive unit 27a, and the movement of the holding mechanism of the lower holding plate 21 is released. The holding of the first substrate 1 is completed by the substrate transfer mechanism 24 of 150561.doc -26-201115237. The first substrate 1 and the second substrate 2 of the air paste α are carried out to the outside by the insides divided into 26a and 26b. After that, it will repeat the above actions. Therefore, in the first embodiment shown in FIG. 6 (aHc), the main solution liquid 3a and the auxiliary liquid are mixed in an environment where the closed space s of the space around the first plate 1 and the second substrate 2 reaches a predetermined degree of vacuum. (1) When the two-liquid mixing portion I is formed, there is no possibility that air bubbles enter due to the mixing of the main agent and the mixing of the auxiliary agent (d). Thereby, the main component liquid % and the auxiliary agent liquid can be mixed in the bubble-free state, and after the bonding between the first substrate 1 and the 帛 2 substrate 2, it is not necessary to perform defoaming by the two-liquid mixing portion 3c. The advantage of the time required from the start to the end of the fit. [Embodiment 2] In the second embodiment, as shown in Figs. 7(a) to 7(c), a chamber 26c that cannot be separated is provided instead of the divided chambers 26a and 2b, and the threshold 26d can be opened and closed to be freely supported. In order to cover the entrance and exit, the threshold 26d is opened and closed by the operation of the opening and closing drive unit 27b, and a lock chamber type vacuum laminator 2 having a lower holding plate 21 and an upper holding plate 22 is disposed inside the chamber 26c. The configuration of the crucible is different from the embodiment j shown in Figs. 6(a) to 6(c), and the other configurations are the same as those of the first embodiment as shown in Figs. 60) to (c). In the embodiment shown in Figs. 7(a) to 7(c), only the upper holding plate 22 can be supported by the elevation driving unit 23 so as to be movable up and down, and after the chamber 2 is locked, the second upper portion is The substrate 2 moves toward the lower first substrate 1, but is not limited thereto. Alternatively, the lower holding plates 150561.doc • 27-201115237 21 and the upper holding plate 22 may be brought close to each other, or Only the lower holding plate 21 is moved. In the case of the embodiment shown in (70) to (C), the application example of the fisherman's brake fluid 3a and the auxiliary fluid 3b achieved by the coating mechanism 10 is as shown in Fig. 3(a). As shown in Fig. 4 (a) and (b), the opposing surface of the i-th substrate i and the second substrate 2 is alternately disposed on the first substrate 1 on the lower side, for example. For example, as shown in Fig. 1 (a) and Fig. 2 (a) and (b), the liquid 3a and the auxiliary liquid may be formed on both of the opposing faces la and 2a of the first substrate 1 and the second substrate 2. When the second substrate 2 and the second substrate 2 are overlapped with each other, the main solution liquid 3a and the auxiliary liquid 3b are dispersed and disposed. Next, the bonding member A by the workpiece bonding apparatus will be described in the order of steps. First, as shown by the solid line in Fig. 7(a), in the state in which the inlet and outlet of the chamber 26c are opened, the substrate transfer mechanism 24 is moved inside, and the main body is coated by the coating mechanism 10. The second substrate 2 and the second substrate 2 of the solution liquid 3a and the auxiliary liquid are transferred to the holding surface 21a of the lower holding plate 21 by the holding means provided at the holding faces 21 & 22 & of the upper and lower holding plates 21 and 22; Dijon The second substrate 2 is transferred to the holding surface 22a of the upper holding plate 22, and is held separately. Then, as shown by the two-point line in Fig. 7(a), the opening and closing drive unit 2 is operated by a few The sill 26d closes the entrance and exit of the chamber 26c, and forms a closed space S therein. Before this kind of occlusion or during the occlusion, the vacuum extraction is started by the action of the pressure adjusting portion 29 from the closed space s, and the specified Vacuum 150561.doc -28- 201115237 degrees. Next, as shown in Fig. 7(b), the first substrate 1 of the holding plate 21 and the upper holding plate 22 holding surfaces 21a and 22a, the liquid material 3a and the auxiliary liquid 3b In addition, it is shown that the movement of the elevation drive unit 23 is close to the movement, and the second substrate 2 is held by the second substrate 2, and the upper and lower holding plates 21 can be held as needed before the superposition is started. And 22 are relatively moved in a horizontal direction (state direction) perpendicular to the overlapping direction, whereby the second substrate i and the second substrate 2 held by the second substrate 2 can be positioned relative to each other. When only on the second substrate and the second substrate 2 When either of the surfaces h and 2a, for example, only when the main solution liquid 3a and the side liquid droplet are alternately dispersed, the first substrate 丨 and the second substrate 2 are overlapped, and the pair The main component liquid "and the auxiliary agent liquid 3b which are alternately dispersed between the faces la and 2a are stretched along the opposing faces 1 & 2a, respectively. Next, as shown in the two-point line of Fig. 7(b), when the opposing faces la, 2a of the second substrate 丨 and the second substrate 2 are brought closer to each other, they extend along the opposing faces la, 2a. The main agent liquid 33 and the auxiliary agent liquid filling front end interface are flushed with each other and connected to each other, and mixing is started, and the main liquid 3a and the auxiliary liquid 3b are mixed in the ratio of the finger to form a continuous liquid two-liquid mixture. The portion 3c starts to be integrally cured along with the mixing of the main solution liquid 3a and the auxiliary agent liquid 3b. Here, as shown in Fig. 2 (a) (b) or Fig. 4 (a) and (b), the main solution liquid 3a and the sub-agent liquid 3b are distributed at equal intervals at substantially equal intervals across the rectangular opposing surface 2a. In the case of a surface, the pressure between the opposing faces 丨a and 2a of the first substrate 1 and the second substrate 2 is pressed to form a predetermined pitch , as shown in the line of the line in Fig. 7(c), and the second J5056I. Doc -29· 201115237 The liquid mixing unit 3c is stretched and filled to the opposite side. On the entire surface, a sealing member such as a liquid crystal or an electronic circuit or a chip is formed in a hermetic seal. Further, when the main solution liquid 3a and the sub-agent liquid 3b are dispersedly arranged in a rectangular frame shape along the circumference of the rectangular opposing faces la, 2a, the two-liquid mixing portion "extends into a frame shape and is formed inside thereof. The sealing space of the liquid crystal or the like is sealed. Therefore, as shown by the solid line in FIG. 7(c), the holding of the second substrate 2 above is released by the operation of the holding mechanism of the upper holding plate 22, and then the pressure adjusting portion is used. The operation of 29 causes the closed space s in the chamber 26c to open to the atmosphere, and a pressure difference is generated between the internal pressure and the internal pressure of the sealing member surrounded by the frame-shaped two-liquid mixing portion & The generated air pressure difference is uniformly and uniformly applied to the first substrate 1 and the second substrate 2, and the dust is contracted while being maintained in parallel. The two-liquid mixing portion 3c is extruded uniformly. The first substrate 1 and the second substrate 2 are bonded in parallel throughout the entire circumference, and the interval between the two is formed at a predetermined pitch G. After the end of the bonding step, as shown by the two-point line in Fig. 7 (4) , opening and closing the driving portion 27b to activate the threshold 26d to make the chamber When the inlet is opened, the holding mechanism of the lower holding plate 21 is actuated to hold the W, and the first substrate 1 and the second substrate 2 which have been bonded together are guided by the substrate transfer mechanism 24 from the inside of the chamber 26c. The outside is moved out. After that, the above actions are repeated.

因此’如圖7⑷〜⑷所*之實施例2係為，除了且有愈 實施例!相同的作用與效果，當在如圖所示之僅在； 150561.doc -30· 201115237 之第1基板1上交替分散配置主劑液3a及副劑液3b之情形 時，由於從藉由塗佈機構1〇之主劑液3&及副劑液扑的塗佈 步驟到貼合步驟為止無需翻轉或是傾斜該第1基板1，因此 更可防止塗佈於其上之主劑液知及副劑液扑的滴下，而具 有防止因滴下而造成主劑液3a及副劑液3b在貼合前混合的 優點。 此外，在本發明的實施形態中，作為主劑液3a及副劑液 3b的塗佈例係例示有，以相對向之方式分散配置在第丄基 板1及第2基板2之對向面13、2a雙方之例、以及僅交替分 政配置在第1基板1及第2基板2之對向面丨a、2a中之任—方 之例，但並非僅限定於此，亦可將該兩種塗佈例組合配置 在一組的第1基板1及第2基板2之對向面1&、2a之中。 此外，在圖示例中，為將主劑液3&及副劑液儿全部以形 成相同大小之方式塗佈在第丨基板丨及第2基板2之對向面 la、2a上，但並非僅限定於此，亦可對應主劑液&及副劑 液3b之適當的混合比例，塗佈成不同的大小。 【圖式簡單說明】 圖1係有關本發明之一實施形態之貼合元件之整體構成 的說明圖（縱剖正面圖），（a)表示第丨基板及第2基板重合前 之狀態’（b)(c)表示第丨基板及第2基板重合途中之狀態， (d)表示第1基板及第2基板重合後之狀態。 圖2係為圖l(a)之橫剖面圖，係表示上方之第2基板的 底面圖，（b)係表示下方之第丨基板的平面圖。 圖3係有關本發明之其他實施形態之貼合元件的說明圖 150561.doc 201115237 (縱剖正面圖）’ U)表示第1基板及第2基板重合前之狀態， (b)(c)表示第1基板及第2基板重合途中之狀態，（句表示第1 基板及第2基板.重合後之狀態。 圖4係為圖3(a)之橫剖面圖’（a)係表示上方之第2基板的 底面圖’（b)係表示下方之第1基板的平面圖。 圖5係表示有關本發明之一實施形態之貼合元件之貼合 裝置的塗佈步驟之說明圖（縱剖正面圖）。 圖6係表示有關本發明之一實施形態之貼合元件之貼合 裝置的說明圖（縱剖正面圖），（a)表示第丨基板及第2基板重 合别之狀態’（b)表示第1基板及第2基板重合途_之狀態， (c)表示第1基板及第2基板重合後之狀態。 圖7係表示有關本發明之其他實施形態之貼合元件之貼 合裝置的說明圖（縱剖正面圖），（a)表示第丨基板及第2基板 重合前之狀態，（b)表示第1基板及第2基板重合途中之狀 態’（C)表示第1基板及第2基板重合後之狀態。 【主要元件符號說明】 1 . 第1基板 1 a 對向面（表面） 2 第2基板 2a 對向面（表面） 3 一液混合硬化型 3a 主劑液 3b 副劑液 3c 二液混合部 15056l.doc -32- 201115237 10 塗佈機構 11 液體定量吐出機 12 控制器 13 計測部 14 記憶部 20 貼合機 21、 22 保持板 21a ' 22a 保持面 23 升降驅動部 24 基板搬送機構 25 控制部 26a 、26b 、 26c 、 26d 分割室 27a 、27b 開閉驅動部 28 環狀密封部 29 壓力調整部 A 貼合元件 D 直徑 G 間距 S 封閉空間 150561.doc -33 -Therefore, the embodiment 2 of FIG. 7(4) to (4) is the same as the embodiment and the same effect and effect, as shown in the figure: 150561.doc -30·201115237 When the main solution liquid 3a and the sub-agent liquid 3b are alternately dispersed on one side, it is not necessary to invert or apply from the coating step of the main solution liquid 3& and the sub-agent liquid fumig of the coating mechanism 1 to the bonding step. Since the first substrate 1 is inclined, it is possible to prevent the main solution liquid and the liquid drop of the auxiliary agent from being applied thereto, and to prevent the main solution 3a and the auxiliary liquid 3b from being attached before the bonding. The advantages of mixing. In the embodiment of the present invention, the application example of the main solution liquid 3a and the auxiliary liquid 3b is exemplified as being disposed so as to be oppositely disposed on the opposing surface 13 of the second substrate 1 and the second substrate 2. Examples of the two sides, and the examples of the two sides of the first substrate 1 and the second substrate 2, which are alternately and separately arranged, are not limited thereto, and the two may be used. The coating examples are arranged in combination in the opposing faces 1&, 2a of the first substrate 1 and the second substrate 2 of one set. Further, in the illustrated example, all of the main solution liquid 3& and the auxiliary liquid are applied to the opposing surfaces la and 2a of the second substrate 丨 and the second substrate 2 so as to have the same size, but not The present invention is not limited thereto, and may be applied to different sizes in accordance with an appropriate mixing ratio of the main agent liquid & and the auxiliary agent liquid 3b. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an explanatory view showing a general configuration of a bonding element according to an embodiment of the present invention (a vertical cross-sectional front view), and (a) shows a state before a second substrate and a second substrate are overlapped each other' ( b) (c) shows the state in which the second substrate and the second substrate are overlapped, and (d) shows the state in which the first substrate and the second substrate are overlapped. Fig. 2 is a cross-sectional view of Fig. 1(a) showing a bottom view of the upper second substrate, and Fig. 2(b) is a plan view showing the lower second substrate. Fig. 3 is an explanatory view of a bonding element according to another embodiment of the present invention. 150561.doc 201115237 (longitudinal sectional view) 'U) indicates a state before the first substrate and the second substrate are overlapped, and (b) (c) indicates The state in which the first substrate and the second substrate overlap each other (the sentence indicates the state in which the first substrate and the second substrate are overlapped. Fig. 4 is a cross-sectional view of Fig. 3(a). 2 (b) is a plan view showing a first substrate below. Fig. 5 is an explanatory view showing a coating step of a bonding device for a bonding element according to an embodiment of the present invention (longitudinal sectional view) Fig. 6 is an explanatory view (longitudinal sectional front view) showing a bonding apparatus of a bonding element according to an embodiment of the present invention, and (a) shows a state in which the second substrate and the second substrate are overlapped each other' (b) (c) shows a state in which the first substrate and the second substrate are overlapped, and (c) shows a state in which the first substrate and the second substrate are overlapped. Fig. 7 is a view showing a bonding apparatus of a bonding element according to another embodiment of the present invention. (a vertical cross-sectional front view), (a) shows a state before the second substrate and the second substrate are overlapped (b) shows a state in which the first substrate and the second substrate are overlapped. (C) shows a state in which the first substrate and the second substrate are overlapped. [Description of Main Element Symbols] 1. First substrate 1 a opposite surface ( Surface) 2 Second substrate 2a Opposite surface (surface) 3 One-liquid mixing hardening type 3a Main liquid 3b Auxiliary liquid 3c Two-liquid mixing part 15056l.doc -32- 201115237 10 Coating mechanism 11 Liquid quantitative discharge machine 12 Control Measuring unit 14 measuring unit 14 memory unit 20 bonding machine 21, 22 holding plate 21a' 22a holding surface 23 lifting and lowering driving unit 24 substrate conveying mechanism 25 control portions 26a, 26b, 26c, 26d dividing chambers 27a, 27b opening and closing driving portion 28 Sealing part 29 Pressure adjusting part A Fitting element D Diameter G Spacing S Closed space 150561.doc -33 -

Claims (1)

201115237 七、申請專利範圍： 1_ 一種貼合元件，其特糌A认.孙〆 、、 其係以黏接劑貼合第1基 板、以及覆蓋該第1基板之第2基板者， 作為上述黏接劑，係使用向冬 定用匕3主劑液與副劑液之二液 混合硬化型黏接劑， 1基板及上述第2基板 述副劑液以彼此不互相接觸之方 續之細微點狀， 於上述第 方’將上述主劑液與上 式分散塗佈配置成非連 之對向面的雙方或一 藉由上述第1基板與上述第2基板之重合，使上述主劑 液與上述副劑液分別伸展且相互連接，從而使上述^ 基板與上述第2基板之間，形成上述主劑液與上述副劑 液以指定之比例混合之連續的一層二液混合部。 2. -種貼合元件之製造方法，其特徵在於：其係以黏接劑 貼合第1基板、以及覆蓋該第！基板之第2基板者，且包 括下述步驟： 於上述第1基板及上述第2基板之對向面的雙方或一 方，將二液混合硬化型黏接劑之主劑液與副劑液作為上 述黏接劑，以相互不接觸之方式分散塗佈成非連續的細 微點狀，以及 使上述第1基板與上述第2基板重合，而使上述主劑液 與上述副劑液伸展且相互連接，在上述第丨基板與上述 第2基板之間，形成上述主劑液與上述副劑液以指定比 例混合之連續的一層二液混合部，以此方式進行混合。 3.如請求項2之貼合元件之製造方法，其中 150561.doc 201115237 於上述第1基板及上述第2基板之對向面的雙方，以相 互對向之方式塗佈上述主劑液與上述副劑液，藉由上述 第1基板與上述第2基板之重合，使上述主劑液與上述副 劑液接觸，並且使其等沿著上述第丨基板及上述第2基板 之對向面而伸展。 4. 如請求項2或3之貼合元件之製造方法，其中 對上述第1基板及上述第2基板之周圍空間進行減壓， 在該已減壓之環境下使上述第丨基板與上述第2基板重 δ ’昆合上述主劑液與上述副劑液。 5. —種貼合元件之貼合裝置，其特徵在於：其係以黏接劑 貼合第1基板、以及將其覆蓋之第2基板者，且具備： 塗佈機構，其於上述第丨基板及上述第2基板之表面， 塗佈作為上述黏接劑之二液混合硬化型黏接劑的主劑液 與副劑液；及 貼合機，其用於以上述第丨基板之表面與上述第2基板 之表面相對向之方式而可裝卸自如地保持該兩者且使其 等重合，且 上述塗佈機構係朝向上述第1基板及上述第2基板之雙 方或是單方之表面，使上述主劑液與上述副劑液以各自 不相互接觸之方式分散塗佈成非連續之細微點狀， 上述貼合機係藉由上述第1基板與上述第2基板之重 合，而使上述主劑液與上述副劑液伸展且相互連接，在 上述第1基板與上述第2基板之間，形成上述主劑液與上 述副劑液以指定之比例混合之連續的一層二液混合部。 150561.doc 201115237 6·如請求項5之貼合元件之貼合裝置其中 向上述第1基板及上述第2基板彼此之對向面，藉由 上述塗佈機構，以彼此分別對向之方式塗佈上述主劑液 . 與上述副劑液。 7.如4求項5或6之貼合元件之貼合裝置其中 ,上述貼合機係，在上述第i基板及上述第2基板之周圍 形成可調整氣壓之封閉空間’在上述封閉空間被減壓之 環境下使上述第丨基板與上述第2基板重合，混合上述主 劑液與上述副劑液，從而形成上述二液混合部。 150561.doc201115237 VII. Patent application scope: 1_ A bonding component, which is characterized by A. Sun, which is bonded to the first substrate by an adhesive and the second substrate covering the first substrate, as the above-mentioned adhesive The bonding agent is a two-liquid mixed-hardening type adhesive which is used for the main solution of the 匕3 main agent liquid and the auxiliary agent liquid, and the substrate and the second substrate are in contact with each other, and the fine points are not in contact with each other. In the above-mentioned first aspect, the main component liquid and the upper type dispersion coating are disposed on both sides of the non-connected opposite surface or one of the first substrate and the second substrate is superposed on each other, and the main solution liquid is The auxiliary agent liquids are stretched and connected to each other to form a continuous two-liquid mixing portion in which the main solution liquid and the auxiliary agent liquid are mixed at a predetermined ratio between the substrate and the second substrate. 2. A method of producing a bonding element, characterized in that it is bonded to a first substrate with an adhesive and covers the first! In the second substrate of the substrate, the method includes the steps of: using the main solution liquid and the auxiliary liquid of the two-liquid mixing and curing type adhesive agent on either or both of the opposing surfaces of the first substrate and the second substrate; The adhesive agent is dispersed and applied in a discontinuous fine dot shape without contacting each other, and the first substrate and the second substrate are superposed on each other, and the main solution liquid and the auxiliary liquid are stretched and connected to each other. A continuous two-liquid mixing portion in which the main agent liquid and the auxiliary agent liquid are mixed at a predetermined ratio is formed between the second substrate and the second substrate, and mixed in this manner. 3. The method of manufacturing a bonding device according to claim 2, wherein 150561.doc 201115237 applies the main solution liquid to the opposite sides of the first substrate and the second substrate The auxiliary agent liquid is brought into contact with the auxiliary agent liquid by the superposition of the first substrate and the second substrate, and is caused to be along the opposing surface of the second substrate and the second substrate. stretch. 4. The method of manufacturing a bonding device according to claim 2, wherein the space between the first substrate and the second substrate is depressurized, and the second substrate and the first surface are removed in the decompressed environment. 2 substrate weight δ 'Kun combined with the above main agent liquid and the above-mentioned auxiliary agent liquid. 5. A bonding apparatus for a bonding element, which is characterized in that a first substrate and a second substrate covered with an adhesive are bonded together, and a coating mechanism is provided in the above-mentioned third a surface of the substrate and the second substrate, a main solution liquid and a sub-solution liquid for applying a two-liquid mixing-curing type adhesive as the adhesive; and a bonding machine for applying a surface of the second substrate The surface of the second substrate is detachably held so as to overlap the two substrates, and the coating mechanism is directed to both the first substrate and the second substrate or to the surface of the single substrate. The main agent liquid and the auxiliary agent liquid are dispersed and applied in a discontinuous fine dot shape so as not to be in contact with each other, and the bonding machine is superposed on the first substrate and the second substrate to make the main body The agent liquid and the auxiliary agent liquid are stretched and connected to each other, and a continuous two-liquid mixing unit in which the main agent liquid and the auxiliary agent liquid are mixed at a predetermined ratio is formed between the first substrate and the second substrate. The bonding apparatus of the bonding element of claim 5, wherein the opposing surface of the first substrate and the second substrate are coated with each other by the coating mechanism The above main agent liquid is mixed with the above-mentioned auxiliary agent liquid. 7. The bonding apparatus of the bonding device of claim 5 or 6, wherein the bonding machine is configured to form an airtight closed space around the i-th substrate and the second substrate in the closed space. The second substrate and the second substrate are superposed on each other under reduced pressure, and the main solution liquid and the auxiliary liquid are mixed to form the two-liquid mixing unit. 150561.doc
TW099130109A 2009-09-09 2010-09-06 Stuck device, method for manufacturing same, and sticking apparatus for stuck device TW201115237A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2009/065762 WO2011030414A1 (en) 2009-09-09 2009-09-09 Laminate structure, process for producing same, and work-laminating device

Publications (1)

Publication Number Publication Date
TW201115237A true TW201115237A (en) 2011-05-01

Family

ID=43732102

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099130109A TW201115237A (en) 2009-09-09 2010-09-06 Stuck device, method for manufacturing same, and sticking apparatus for stuck device

Country Status (2)

Country Link
TW (1) TW201115237A (en)
WO (2) WO2011030414A1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103287054A (en) * 2012-02-24 2013-09-11 良奕工业有限公司 Panel fitting method and finished product by using same
CN106353932A (en) * 2016-11-07 2017-01-25 深圳市华星光电技术有限公司 Jointing method of liquid crystal display panel
CN109061954A (en) * 2018-09-10 2018-12-21 张家港康得新光电材料有限公司 A kind of panel attachment method and panel attachment equipment

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014155661A1 (en) * 2013-03-29 2017-02-16 共栄制御機器株式会社 Adhesive coating apparatus, bonding apparatus, and method for manufacturing bonded member
CN109753085A (en) * 2018-12-26 2019-05-14 中国科学院长春光学精密机械与物理研究所 One kind using equipment for having figuratum pellet parts in groups

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0453937Y2 (en) * 1985-05-27 1992-12-18
JPS6346282A (en) * 1987-08-07 1988-02-27 Semedain Kk Adhesive
JPH0397778A (en) * 1989-09-08 1991-04-23 Sanyo Kogyo:Kk Method for bonding
JPH10193498A (en) * 1997-01-08 1998-07-28 Misawa Homes Co Ltd Laminated panel and its production

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103287054A (en) * 2012-02-24 2013-09-11 良奕工业有限公司 Panel fitting method and finished product by using same
CN106353932A (en) * 2016-11-07 2017-01-25 深圳市华星光电技术有限公司 Jointing method of liquid crystal display panel
CN109061954A (en) * 2018-09-10 2018-12-21 张家港康得新光电材料有限公司 A kind of panel attachment method and panel attachment equipment

Also Published As

Publication number Publication date
WO2011030718A1 (en) 2011-03-17
WO2011030414A1 (en) 2011-03-17

Similar Documents

Publication Publication Date Title
TWI541562B (en) The manufacturing method of the bonding element
KR101471705B1 (en) Method and system for manufacturing display panel
US9061485B2 (en) Method of manufacturing translucent rigid substrate laminate
TW201115237A (en) Stuck device, method for manufacturing same, and sticking apparatus for stuck device
TWI379129B (en) Method of bonding substrates and apparatus for bonding substrates
JP2001264782A (en) Method of filling gap of flat panel substrate with viscous liquid material
TW200928524A (en) An attachment process of flexible substrate and a pattern of sealant thereof
CN105359203B (en) The manufacturing method of abutted equipment
CN110930882A (en) Flexible display panel laminating device and method
JP5358847B2 (en) Method and apparatus for laminating plate members
JP6209154B2 (en) Substrate laminating apparatus, display panel manufacturing apparatus, and display panel manufacturing method
TWI616340B (en) Substrate bonding apparatus, manufacturing apparatus for display panel and method thereof
KR101852200B1 (en) Bonding apparatus and bonding method
KR20160137736A (en) A lamination equipment and method
TWI274947B (en) Apparatus and process for filling liquid crystal into LCD cell
JP6257855B1 (en) Joining member manufacturing apparatus, manufacturing method of joining member, and manufacturing method of coated material coated member
JP2010147184A (en) Method and apparatus for forming multilayer substrate
JP2010128454A (en) Liquid crystal display panel and method of manufacturing the same
JP5207036B2 (en) Laminated wafer end face seal forming apparatus and seal forming method
JPH11249155A (en) Method and device for producing fluid material sealing structure
KR101334409B1 (en) Side gap dispensing device and method of bonding substrates, and apparatus and method of bonding substrates having the same
KR20200088688A (en) Optical bonding apparatus and optical bonding method using the same
JP2003186027A (en) Inter-substrate gap forming method
JP2020177191A (en) Bonding apparatus and bonding method of bonding device, and bonding device