201115159 六、發明說明： 【發明所屬之技術領域】 本發明係關於一種陣列基板之檢測裝置及檢測方法。 【先前技術】 就大眾所知，平面顯示器係一種輕薄型的影像顯示 器，它比傳統使用陰極射線管的顯示器更輕、更薄。平面 顯示器的種類繁多，例如液晶顯示器、電漿顯示器、場發 射顯示器、有機發光二極體顯示器等。平面顯示器已被大 量發展並使用。 其中，液晶顯示器具有複數液晶單元陣列設置，並依 據影像資料提供資料訊號至各液晶單元以調整各液晶單 元之光線穿透率進而顯示晝面。由於其薄型化、輕量化、 低耗電以及低操作電壓，液晶顯示器已被廣泛的使用。以 下簡述一種習知液晶顯示面板的製造方法。 首先，於一上基板形成一彩色濾光層及一共同電極 層，並於一下基板形成複數薄膜電晶體及畫素電極。上基 . 板與下基板係相對設置。然後，於上基板與下基板各形成 一配向層。之後，在配向膜上磨擦以提供一預傾角及一配 向方向來配向液晶層之液晶分子。其中，液晶層將會形成 於兩基板之間。 此外，依據一預定圖案在兩基板之至少一基板上塗 膠，以形成框膠，藉以避免液晶洩漏到基板外。然後兩基 板在維持一間隙的情況下封合。之後，在兩基板之間形成 201115159 液晶層，如此就完成了液晶面板的製造方法。 Λ 在製造方法的過程中’需要有一檢測程序來檢驗是否 有缺陷存在’例如設置於下基板（以下皆稱為陣列基板， 其上設置有薄膜電晶體及畫素電極）之資料線或掃描線的 電性連接是否良好、或是畫素單元之色彩的精確度。 一種習知用來檢測陣列基板之檢測裝置係包含具有 一探針模組，探針模組包含複數探針腳。檢測裝置係定位 該等探針腳至陣列基板上需檢測之電極位置，並使探針腳 接觸電極，且將預設的電性訊號傳送至電極而進行檢測。 另外，不同態樣的陣列基板，其電極的位置及佈設方 向亦不同。故為了使用同一個檢測裝置來檢測不同的陣列 基板’就需要調整檢測裝置的探針腳，以便探針腳能夠符 合各陣列基板上電極的位置及佈設方向。·然而，上述習知 的檢測裝置由於需要替換探針模組以適合於具有不同位 置及佈設方向之電極的陣列基板，而使陣列基板的製造效 率大幅降低。 【發明内容】 為解決上述習知技術所產生的問題，本發明之目的係 提供一種陣列基板的檢測裝置及檢測方法，能夠旋轉檢測 裝置之探針桿，以使各探針桿之複數探針腳能夠對應奚陣 列基板上之複數電極，進而針對具有不同位置及佈設方向 之電極的陣列基板進行更有效率的檢測。 為達成上述目的，本發明提供一種陣列基板檢測裝 201115159 置，其係包含複數㈣頭、複_針料及複數旋轉單 針頭係設置於-探針頭支持單元，並可依據探針頭 =早…長軸方向移動。探針捍係設置於探針頭，各 採針，係具有複數探針腳。.旋轉單元係用以旋轉探針桿。 —= 發明之一實施例令，檢測震置更包含-影像單 兀，其係鄰設於探針頭，並用 干 極進行攝像。㈣相叫探針腳與陣列基板之電 、去，本發明係提供一種陣列基板檢测方 /勺人;列基板檢測裝置，陣列基板檢測褒置 及數旋轉單元，其中，複數探針桿係設 ，於該私針頭，且各具有複數探針腳，該等旋轉單 之一探針桿，以使該等探針腳對準 極；最後，步驟c移動探針桿靠近雷腳：旱该荨電 探針腳傳送電性訊號至該等電極。 、’經由該等 在本發明之—實故 ^其中，步驟131葬^’^包含步驟1)1及步驟 電之-電極數量·而Γ 接觸到電極，量測已通 數量小於該等電極二=2=當=1所量測到之電極 _ , 卜 、、心数里時以一苐一方向或鱼笛一 方向相反之一第二方向旋轉 ， 並量測已通電之一電極數量二，3針腳接觸電極， 之電極數量小於步驟b2所量測到 Μ所！測到之電極數量時，探針桿 201115159 係以與探針桿在步驟b2之旋轉 然後重覆步驟b2 ,·而, 方向叙轉 步驟bl所量測到田所置測到之電極數量大於 步驟μ之旋轉方時’探針桿係以與探針桿在 以使該等探針腳與”電極對準。4重Μ驟 在本發明之—普+Α 等電極進行攝像，係對該等探針腳與該 等電極對準。 依據所攝仔之影像使該等探針腳與該 方向^極陣列基板檢測裝置針對具有不同排列 作而使探針腳對準=，’皆能藉由旋轉探針桿之簡易的操 對不同的陣列基板並不用像習知的檢測裝置需要針 程之k率。i *換探針模組，進而大幅提升製造流 【實施方式】 陣列依綱明較佳實施例之 的參:C方法，其中相同的元件心相同 檢測二所ΐ广明較佳實施例之-種陣 夏係包含一承載單元10、一檢測單元20以及一 載單元3〇。其中，承載單元10係用以承載一陣列基板s 15 檢測單元20係用以檢測承載於承載單元10之陣列基板 S，卸裁單元30係在檢測完畢之後，將陣列基板s卸^下 來0 6 201115159 檢測單元20係檢測陣列基板S之電性上的缺陷， 係包含一檢測平台21、一檢測模組22、一探針模纽23 = 及一控制單元24。承載單元1〇係將陣列基板運迸至檢、= 平台21上。檢測模組22係檢測陣列基板s是否有電性2 的缺陷。探針模組23係將電性訊號傳送至陣列基板s上 電極。控制單元24係用以控制檢測模組22及探針模級 請參照圖2至圖5所示，探針模組23可包含―探° Ϊ支持單元5〇、複數探針頭60、複數探針桿、一^針 單元80以及—旋轉單元9〇。其中，探針頭支持單元: 沿圖中之X方向延伸設置，並設置於檢測平台2 糸 探針頭60係裝設於探針頭支持單a % 。 支持單元-之-長袖方向(即X方向)移::= 頌 刊係設置於各探針頭60,並具有複數 各 疋80可使探針桿7〇上升或下降。旋 /升降早 轉探針桿70。 早70 90係用以旋 探針頭支持單元50係與一支 可沿著圖式中…向移動。此外連接，並 係設置於探針頭支持單元5G 探針鄉動單元6! 針頭60沿著又方向移動。縣^6G之間，並可使探 移動元件而實現，例如線性馬可藉由線性 該等探針桿70係由玆尊珠、'、口構。 且各探針桿70具有複數探針二；水平地延伸設置， 之 針捍7〇的底部，並沿著探針桿7〇的^腳71係設置於探 X方向及圖5之Y方向）排㈣長軸方向（如圖4 / 201115159 各升降單元8〇設置於各探_ 6G，並與各 連接。升降單元8G可藉由任何可使探針桿70上升^降 的結構而實現，例如由_控制缸、歧電 升降單元8〇係用以在陣列基板s設置於檢測平台制2= 後：驅動探針桿7〇下降，以使探針腳71能夠接觸或按壓 到陣列基板s之電極si。 旋轉單元90可設置於探針頭6〇，並與探針桿7 接。旋轉單元9G可例如藉由旋轉馬達而實現。旋轉單元 90:使&針# 7〇沿水平方向旋轉。較佳者，旋轉單元％ 可，^步進馬達而使探針桿70得到精確的旋轉角度。各 旋方疋單几90係使各對應的探針桿7〇旋轉，以致排列於各 探針才干7G上的探針腳71能夠對應至陣列基板s的電極 Sl° 本實施例之檢測装置可藉由簡易的操作，即旋轉對應 的探針桿7G ’可使該等探針腳71對準陣列基板S上之該 等電極S1。舉例來說，如圖4所示，若料電極S1以圖 式中之X方向排列於陣列基板s上，則藉由旋轉單元9〇 方疋轉捺針桿70，可使得探針腳71對應至陣列基板s上之 電極si。另一面，如圖5所示，若電極S1係沿著圖式中 的Y方向排列於陣列基板s上，則藉由旋轉單元9〇旋轉 探針和· 70’可使探針腳71對應至陣列基板s上之電極si。 藉此，即使電極S1排列於陣列基板s上之方向改變，本 發明之陣列基板之檢測裝置亦可藉由旋轉探針桿7〇之簡 易的操作而使探針腳71輕易地對準陣列基板s上之電極 8 201115159 si ° 以下’敘述本發明較佳實施例之陣列基板之檢測 的操作。 、直 &首先’當陣列基板S藉由承載單元10的操作而移動 則平台21時，探針模組23係提供電性訊號至陣列其 板S之電極S1。然後，藉由檢測單元2〇對陣列基板s 行電性之缺陷的檢驗。 為使探針模組23提供電性訊號至陣列基板s之 ’叉持移動單元51係可驅動探針頭支持單元50沿γ方 $移動，並使探針頭60沿著Y方向移動，探針頭6〇亦可 =由探針頭移動單元61之驅動而沿著χ方向移動。萨由 探針頭60在X方向及或γ方向的移動，探針頭6〇可^動 至陣列基板S之電極S1之位置。藉此，裝設於各探針桿 70上之探針腳71便可移動至鄰近於電極S1之位置。 進一步，探針桿70亦可藉由旋轉單元9〇之驅動而旋 轉’以致其上之探針腳71對準該等電極si。 此外，可藉由升降單元80之驅動以使探針桿7〇降 低，並接觸到電極si。電性訊號即可經由探針腳71傳送 至各電極S1。 . 、 當電性訊號經由探針腳71傳送至陣列基板s之電極 S1之後’檢測單元20之撿測模組22便可對陣列基板s進 行電性缺陷之檢驗。 藉此’即使具有不同排列方向之電極S1之陣列基板s 承載至檢測裝置，本發明較佳實施例之檢測裝置皆能藉由 201115159 旋轉探針桿70之簡易的操作而使探針腳71對準電極SI， 而不用像習知的檢測裝置需要替換探針模組23,進而大幅 提升製造流程之效率。 以下更詳細的說明藉由旋轉探針桿70而使探針腳71 對準電極S1之步驟。 請參照圖6至圖8所示，該等探針腳71藉由旋轉探 針桿70而分別對應至該等電極S1，並藉由降低探針桿70 而使探針腳71按壓到電極S1上。然後在傳送電性訊號至 電極S1時，控制單元24係量測該等電極S1中有通電之 電極S1數量η，如步驟S10。 進一步，於步驟S20，判斷已通電之電極S1數量η 是否等於欲通電之電極S1之總數量nt。 若已通電之電極S1數量η等於欲通t之電極S1之總 數量nt，則表示該等探針腳71與該等電極S1係相互對 準。在此種狀況下，對準探針腳71與電極S1之步驟就會 終止，並繼續進行檢測陣列基板的步驟。 相反的，若已通電之電極S1數量η不等於欲通電之 電極S1之總數量nt，則於步驟S30中，探針桿70會以一 第一方向A旋轉至一預設角度，並下降以使探針腳71接 觸到電極S1。再將電性訊號經由探針腳71傳送至電極 S1，然後量測已通電的電極數量nl。 然後，於步驟S40中，判斷在探針桿70以第一方向A 旋轉之後所量測到的已通電之電極數量nl是否大於原先 所量測到的已通電之電極數量η。 201115159 若在探針桿70以第一方向A旋轉之後所量測到的電 極數量nl大於原先所量測到的電極數量n，則表示探針桿 70在沿第一方向a旋轉之後，該等探針腳71可對準該等 電極S1。承上，當探針桿7〇沿著第一方向a旋轉時，量 測已通e電的電極數量於步驟S5〇 ’ 已通電之電極 =數1 nl是否等於欲通電之電極si之總數量价。若已通 ^之電極S1數量nl等於欲通電之電極S1之總數量nt， 二對準探針腳71與電極Sl的操作會終止，並繼續進行接 下來的陣列基板檢測操作。 另外如圖7所不，假若在探針桿70以第一方向A 後所量測到的電極數量ni不大於縣所量測到的 量…則表示探針桿在沿第-方向A旋轉之後， ^、来針腳71無法對準該等電極$卜所以，於步驟s6〇 τ ’探針桿70係以與篦—士人 然抬 、 方向Α相反的第二方向Β旋轉。 、、、後’藉由使探針桿7 在值、、，兩 下降而使探針腳71接觸電極S1。 寻迗電性訊號至電;^ W數量n2。 Hi之後，量測在這時已通電的電 於步驟S70中，忠丨.丄 《後所量測狀已針桿7G以第二方向B旋轉 到之已通電電極數量n數量112是否大於原先所量測 史後所量測到的已探針桿7G以第二方向B旋轉 電極數，則矣電極數量n2大於原先所量測到的 讀等探針腳71 7〇在沿第二方向B旋轉之後’ 第二方向3旋轉時，^電極S卜承上，當探針桿7〇沿 里測已通電的電極數量n2。於步驟 201115159 編’判斷已通電之電 極s〗之總數量 # 、妖里n2疋否·#於欲通電之電 電之電極S1之總數=已通電之電極幻數量n2等於欲通 操作會終止，龙繼姨患nt則對準探針聊71與電極S1的 藉此，本^進行接下來的陣列基板檢測操作。 X明之陣列基板的檢 7〇的旋轉方向及旋轉 "職置便此藉由探針桿 通電的總電極數量= [通電的電極數量等於欲 以下說明本發明另〜餘針腳精確地對準電極8卜 置。其中，本實施例使用/又佳實施例之陣列基板檢測裝 施例相同的元件，且^相同/元件符號來表示與上述實 請參照圖9所干，^件的細節於此不再費述。 含-3像單元ιγηΛ 之陣魁板㈣憤置更包 H/ ，八係鄰設於一探針頭60，並具有一搞 :器101用以對探針腳71輿陣列基板s之電極幻、進行攝 时當探針腳71 ϋ由上迷結構而欲與電極S1對準時，， 像單το 100係對探針腳71與電極S1進行攝像，並且一俨 針桿70係依據所攝的影像而以—方向旋轉，使針 與電極S1對準。 & 這樣，針對具有不同排列方向之電極S1之陣列美击 S，本實施例之檢測裝置皆能藉由漩轉探針桿70之簡^合 操作而使探針腳71對準電極S1，而不像習知的檢測裝眉 需要針對不同的陣列基板而替換探針模組，進而大幅 製造流程之效率。 需注意者，本發明之所有實施例的技術特徵可單獨實 12 201115159 施、或相互結合使用。此外，本發明之探針模組可應用於 任何需要傳送電性訊號至不同態樣之基板上之電極以進 行檢測的裝置，其中基板例如薄膜電晶體基板。 以上所述僅為舉例性，而非為限制性者。任何未脫離 本發明之精神與範疇，而對其進行之等效修改或變更，均 應包含於後附之申請專利範圍中。 【圖式簡單說明】 圖1為本發明較佳實施例之一種陣列基板檢測裝置的 示意圖； 圖2為圖1之陣列基板檢測裝置之探針模組的示意 圖； 圖3為圖1之陣列基板檢測裝置之探針模組的前視示 意圖； 圖4及圖5為圖1之陣列基板檢測裝置之探針頭的示 意圖； 圖6及圖7為本發明之陣列基板檢測裝置之探針腳與 電極對準之不同狀態的示意圖； 圖8為本發明之陣列基板檢測裝置之探針腳與電極對 準之流程圖；以及 圖9為本發明另一較佳實施例之陣列基板檢測裝置的 示意圖。 13 201115159 【主要元件符號說明】 10 :承載單元 20 :檢測單元 21 :檢測平台 2 2 ·檢測核組 23 :探針模組 24 :控制單元 30 :卸載單元 50 :探針頭支持單元 51 :支持移動單元 60 :探針頭 61 :探針頭移動單元 70 :探針桿 71 :探針腳 80 :升降單元 90 :旋轉單元 100 :影像單元 101 :攝像器 A :第一方向 B:第二方向 S :陣列基板 S1 :電極 S10〜S80 :探針腳與電極對準之流程步驟 14201115159 VI. Description of the Invention: [Technical Field] The present invention relates to a detection device and a detection method for an array substrate. [Prior Art] As far as the public is concerned, a flat panel display is a thin and light image display device which is lighter and thinner than a conventional display using a cathode ray tube. There are many types of flat displays, such as liquid crystal displays, plasma displays, field emission displays, organic light emitting diode displays, and the like. Flat panel displays have been developed and used in large numbers. The liquid crystal display has a plurality of liquid crystal cell arrays, and provides data signals to the liquid crystal cells according to the image data to adjust the light transmittance of each liquid crystal cell to display the kneading surface. Liquid crystal displays have been widely used due to their thinness, light weight, low power consumption, and low operating voltage. A method of manufacturing a conventional liquid crystal display panel will be briefly described below. First, a color filter layer and a common electrode layer are formed on an upper substrate, and a plurality of thin film transistors and a pixel electrode are formed on the lower substrate. The upper plate is opposite to the lower substrate. Then, an alignment layer is formed on each of the upper substrate and the lower substrate. Thereafter, rubbing on the alignment film to provide a pretilt angle and an alignment direction to align liquid crystal molecules of the liquid crystal layer. Among them, the liquid crystal layer will be formed between the two substrates. In addition, a glue is applied to at least one of the substrates of the two substrates according to a predetermined pattern to form a sealant to prevent the liquid crystal from leaking out of the substrate. The two substrates are then sealed while maintaining a gap. Thereafter, a 201115159 liquid crystal layer is formed between the two substrates, thus completing the method of manufacturing the liquid crystal panel. Λ In the process of manufacturing, 'a test procedure is needed to check for defects.' For example, data lines or scan lines are provided on the lower substrate (hereinafter referred to as the array substrate on which the thin film transistor and the pixel electrode are placed). Whether the electrical connection is good or the color of the pixel unit is accurate. A conventional detection device for detecting an array substrate includes a probe module including a plurality of probe pins. The detecting device positions the probe pins to the position of the electrodes to be detected on the array substrate, and the probe pins contact the electrodes, and the predetermined electrical signals are transmitted to the electrodes for detection. In addition, different positions of the array substrate have different positions and layout directions of the electrodes. Therefore, in order to use the same detecting device to detect different array substrates, it is necessary to adjust the probe pins of the detecting device so that the probe pins can conform to the position and the routing direction of the electrodes on each array substrate. However, the above-described conventional detecting device greatly reduces the manufacturing efficiency of the array substrate because it is necessary to replace the probe module to suit the array substrate having electrodes having different positions and routing directions. SUMMARY OF THE INVENTION In order to solve the problems caused by the above-mentioned prior art, an object of the present invention is to provide a detecting device and a detecting method for an array substrate, which can rotate a probe rod of the detecting device to make a plurality of probes of each probe rod The foot can correspond to the plurality of electrodes on the array substrate, and the array substrate having electrodes with different positions and routing directions can be more efficiently detected. In order to achieve the above object, the present invention provides an array substrate detecting device 201115159, which comprises a plurality of (four) heads, a complex _ needle material and a plurality of rotating single needle heads arranged in the - probe head supporting unit, and can be based on the probe head = early... Move in the direction of the long axis. The probe tether is disposed on the probe head, and each of the needles has a plurality of probe legs. The rotating unit is used to rotate the probe rod. —= In one embodiment of the invention, the detection is further comprised of an image-single, which is disposed adjacent to the probe head and is imaged with a dry electrode. (4) calling the probe pin and the array substrate, the present invention provides an array substrate detecting/spooning person; a column substrate detecting device, an array substrate detecting device and a number rotating unit, wherein the plurality of probe rods Arranging, in the private needle, and each having a plurality of probe legs, the ones of the probe pins are rotated to align the probe pins; and finally, step c moves the probe rods close to the thunder feet: The electric probe pin transmits an electrical signal to the electrodes. In the present invention, the step 131 is to include the steps 1) 1 and the number of steps of the electrode - and the electrode is contacted to the electrode, and the measured number of passes is less than the electrode 2 =2=When the measured electrode _, 卜, and number of hearts are rotated in one direction or one direction opposite to the direction of the fish flute, and the number of electrodes that have been energized is measured, The 3 pin contacts the electrode, and the number of electrodes is less than that measured in step b2! When the number of electrodes is measured, the probe rod 201115159 is rotated with the probe rod at step b2 and then the step b2 is repeated. However, the direction of the direction step bl is measured, and the number of electrodes measured by the field is greater than the step μ. When the rotation is performed, the probe rod is aligned with the probe rod to align the probe pins with the electrode. The 4th step is used to image the electrode of the present invention. The pins are aligned with the electrodes. According to the image of the camera, the probe pins and the direction electrode array substrate detecting device are arranged differently for the probe pins to be aligned, and the rotation can be performed by rotating the probe pins. The simple operation of the probe rod does not require the k-rate of the needle path as in the conventional detection device. i *Changes the probe module, thereby greatly improving the manufacturing flow. [Embodiment] The array is better. The method of the embodiment: the C method, wherein the same component is the same as the second embodiment of the present invention. The seeding system comprises a carrying unit 10, a detecting unit 20 and a carrying unit 3〇. The carrying unit 10 is used to carry an array of substrates s 15 In order to detect the array substrate S carried on the carrying unit 10, the unloading unit 30 unloads the array substrate s after the detection is completed. The detection unit 20 detects the electrical defects of the array substrate S, including one. The detection platform 21, a detection module 22, a probe module 23 = and a control unit 24. The carrier unit 1 transports the array substrate to the inspection, = platform 21. The detection module 22 detects the array substrate s. Whether there is a defect of electrical 2. The probe module 23 transmits the electrical signal to the upper electrode of the array substrate s. The control unit 24 is used to control the detection module 22 and the probe module. Please refer to FIG. 2 to FIG. The probe module 23 can include a probe support unit 5, a plurality of probe heads 60, a plurality of probe rods, a needle unit 80, and a rotation unit 9A. The probe head support unit: The X direction of the figure is extended and arranged on the detection platform 2 糸 The probe head 60 is mounted on the probe head support sheet a %. Support unit - the long sleeve direction (ie X direction) shift::= Provided in each of the probe heads 60, and having a plurality of cymbals 80, the probe rods 7 can be raised or lowered. / Lifting and rotating the probe rod 70. The early 70 90 series is used to rotate the probe head support unit 50 and one can move along the direction of the drawing. In addition, it is connected to the probe head support unit 5G. Needle moving unit 6! The needle 60 moves in the opposite direction. Between the county and 6G, and can realize the moving element, for example, the linear horse can be linearized by the probe rod 70 by Zzunzhu, ', Each of the probe rods 70 has a plurality of probes 2; horizontally extending, the bottom of the needles 7〇, and disposed along the probe shaft 7 of the probe shaft 7 in the X direction and FIG. Y direction) row (four) long axis direction (as shown in Figure 4 / 201115159, each lifting unit 8〇 is set in each probe _ 6G, and connected with each. The lifting unit 8G can be realized by any structure that can raise and lower the probe rod 70. For example, the _ control cylinder and the electric hoisting unit 8 are used to set the array substrate s on the detection platform 2 = after: driving The probe lever 7 is lowered to enable the probe leg 71 to contact or press against the electrode si of the array substrate s. The rotating unit 90 can be disposed on the probe head 6A and connected to the probe stem 7. The rotating unit 9G can be realized, for example, by a rotary motor. Rotating unit 90: Rotate 〇 in the horizontal direction. Preferably, the rotating unit % can step the motor to give the probe rod 70 a precise angle of rotation. Each of the plurality of 90 series rotates the corresponding probe rods 7 to rotate, so that the probe legs 71 arranged on the respective probes 7G can correspond to the electrodes S1 of the array substrate s. The detecting device of the embodiment can be The probe pins 71 can be aligned with the electrodes S1 on the array substrate S by a simple operation, that is, by rotating the corresponding probe rods 7G'. For example, as shown in FIG. 4, if the material electrode S1 is arranged on the array substrate s in the X direction in the drawing, the rotation of the rotation unit 9 疋 turns the needle bar 70, so that the probe pin 71 can be correspondingly To the electrode si on the array substrate s. On the other hand, as shown in FIG. 5, if the electrode S1 is arranged on the array substrate s along the Y direction in the drawing, the probe pin 71 can be made to correspond to the rotation of the probe and the 70' by the rotation unit 9 The electrode si on the array substrate s. Thereby, even if the direction in which the electrodes S1 are arranged on the array substrate s is changed, the detecting device of the array substrate of the present invention can easily align the probe pins 71 with the array substrate by the simple operation of rotating the probe rod 7 Electrode 8 on s 201115159 si ° The following describes the operation of the detection of the array substrate of the preferred embodiment of the present invention. First, when the array substrate S is moved by the operation of the carrying unit 10, the probe module 23 supplies an electrical signal to the electrode S1 of the panel S of the array. Then, the inspection of the defect of the electrical conductivity of the array substrate s by the detecting unit 2 is performed. In order to enable the probe module 23 to provide electrical signals to the array substrate s, the 'fork movement unit 51 can drive the probe head support unit 50 to move along the gamma side $ and move the probe head 60 along the Y direction. The needle 6〇 can also be moved in the x-direction by the driving of the probe head moving unit 61. The movement of the probe head 60 in the X direction or the γ direction allows the probe head 6 to move to the position of the electrode S1 of the array substrate S. Thereby, the probe leg 71 mounted on each probe stem 70 can be moved to a position adjacent to the electrode S1. Further, the probe lever 70 can also be rotated by the rotation of the rotary unit 9' so that the probe legs 71 thereon are aligned with the electrodes si. Further, the probe rod 7 is lowered by the driving of the elevating unit 80 and is in contact with the electrode si. The electrical signal can be transmitted to each electrode S1 via the probe pin 71. After the electrical signal is transmitted to the electrode S1 of the array substrate s via the probe pin 71, the detection module 22 of the detecting unit 20 can perform an electrical defect inspection on the array substrate s. Therefore, even if the array substrate s of the electrodes S1 having different alignment directions is carried to the detecting device, the detecting device of the preferred embodiment of the present invention can make the probe pins 71 by the simple operation of the 201115159 rotating probe rod 70. The quasi-electrode SI does not require replacement of the probe module 23 like a conventional detection device, thereby greatly increasing the efficiency of the manufacturing process. The step of aligning the probe pin 71 with the electrode S1 by rotating the probe stem 70 will be described in more detail below. Referring to FIG. 6 to FIG. 8 , the probe pins 71 respectively correspond to the electrodes S1 by rotating the probe rod 70, and the probe pins 71 are pressed to the electrodes S1 by lowering the probe rods 70. on. Then, when transmitting the electrical signal to the electrode S1, the control unit 24 measures the number n of energized electrodes S1 in the electrodes S1, as by step S10. Further, in step S20, it is judged whether or not the number n of energized electrodes S1 is equal to the total number nt of electrodes S1 to be energized. If the number η of energized electrodes S1 is equal to the total number nt of electrodes S1 to be t, it means that the probe pins 71 and the electrodes S1 are aligned with each other. In this case, the step of aligning the probe pin 71 with the electrode S1 is terminated, and the step of detecting the array substrate is continued. Conversely, if the number n of energized electrodes S1 is not equal to the total number nt of electrodes S1 to be energized, then in step S30, the probe lever 70 is rotated in a first direction A to a predetermined angle and lowered. The probe leg 71 is brought into contact with the electrode S1. The electrical signal is then transmitted to the electrode S1 via the probe pin 71, and then the number nl of energized electrodes is measured. Then, in step S40, it is judged whether or not the number n1 of energized electrodes measured after the probe lever 70 is rotated in the first direction A is larger than the number of energized electrodes η originally measured. 201115159 If the number of electrodes n1 measured after the probe rod 70 is rotated in the first direction A is greater than the number n of electrodes measured originally, it means that after the probe rod 70 is rotated in the first direction a, The probe pins 71 can be aligned with the electrodes S1. In the case where the probe rod 7 is rotated along the first direction a, the number of electrodes that have passed the e-electricity is measured. In step S5, the energized electrode=number 1 nl is equal to the total number of electrodes si to be energized. price. If the number n1 of electrodes S1 that has been passed is equal to the total number nt of electrodes S1 to be energized, the operation of the second alignment probe pin 71 and the electrode S1 is terminated, and the subsequent array substrate detecting operation is continued. In addition, as shown in FIG. 7, if the number of electrodes measured after the probe rod 70 is in the first direction A is not greater than the amount measured by the county, it indicates that the probe rod is rotated in the first direction A. ^, the incoming pin 71 cannot be aligned with the electrodes. Therefore, in step s6 〇τ' the probe stem 70 is rotated in a second direction opposite to the 篦-士人然, direction Α. After the probe lever 7 is lowered by the value, the probe pin 71 is brought into contact with the electrode S1. Look for electrical signals to electricity; ^ W number n2. After Hi, the electric power that has been energized at this time is measured in step S70, and the quantity of the number of energized electrodes n that has been rotated by the needle bar 7G in the second direction B is greater than the original amount. After the history of the measurement, the probe rod 7G rotates the number of electrodes in the second direction B, and the number of the electrodes n2 is larger than that of the previously measured reading probe 71 7〇 after rotating in the second direction B. When the second direction 3 is rotated, the electrode S is supported, and the number of electrodes n2 that have been energized is measured when the probe rod 7 is turned. In step 201115159 edit the total number of 'determined energized electrode s' #, 妖里n2疋不·# the total number of electrodes S1 of the electric power to be energized = the number of electrodes that have been energized is n2 equal to the operation will terminate, dragon Following the nt, the probe talk 71 and the electrode S1 are aligned, and the next array substrate detecting operation is performed. The rotation direction and rotation of the X-ray array substrate are the number of total electrodes that are energized by the probe rod = [the number of energized electrodes is equal to the following description of the present invention. 8 Bu. In this embodiment, the same components of the mounting substrate are used in the embodiment of the present invention, and the same components/component symbols are used to indicate the above-mentioned details with reference to FIG. 9. Details of the components will not be described herein. . Included in the -3 image unit ιγηΛ (4) Indigning more package H / , eight series adjacent to a probe head 60, and has a device: 101 for the probe foot 71 舆 array substrate s electrode magic When the probe pin 71 is configured to be aligned with the electrode S1 by the upper structure, the single το 100 is used to image the probe pin 71 and the electrode S1, and a needle bar 70 is based on the image taken. The image is rotated in the - direction to align the needle with the electrode S1. & Thus, for the array of the electrodes S1 having different alignment directions, the detecting device of the embodiment can align the probe pins 71 with the electrodes S1 by the simple operation of the swirling probe rods 70. Rather than the conventional detection of eyebrows, it is necessary to replace the probe modules for different array substrates, thereby greatly improving the efficiency of the process. It should be noted that the technical features of all the embodiments of the present invention can be used alone or in combination with each other. In addition, the probe module of the present invention can be applied to any device that needs to transmit an electrical signal to an electrode on a substrate of a different aspect, such as a thin film transistor substrate. The above is intended to be illustrative only and not limiting. Any equivalent modifications or alterations to the spirit and scope of the present invention are intended to be included in the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic diagram of an array substrate detecting device according to a preferred embodiment of the present invention; FIG. 2 is a schematic diagram of a probe module of the array substrate detecting device of FIG. 1; FIG. 4 and FIG. 5 are schematic diagrams of probe heads of the array substrate detecting device of FIG. 1. FIG. 6 and FIG. 7 are probe pins of the array substrate detecting device of the present invention. FIG. 8 is a flow chart showing the alignment of the probe pin and the electrode of the array substrate detecting device of the present invention; and FIG. 9 is a schematic diagram of the array substrate detecting device according to another preferred embodiment of the present invention. . 13 201115159 [Description of main component symbols] 10 : Carrying unit 20 : Detection unit 21 : Detection platform 2 2 · Detection core group 23 : Probe module 24 : Control unit 30 : Unloading unit 50 : Probe head support unit 51 : Support Moving unit 60: probe head 61: probe head moving unit 70: probe lever 71: probe foot 80: lifting unit 90: rotating unit 100: image unit 101: camera A: first direction B: second direction S: array substrate S1: electrodes S10 to S80: process of aligning the probe pins with the electrodes Step 14