201115061 六、發明說明： 【發明所屬之技術領域】 本發明是有關於—種光源裝置’且特別是有關一種發光二 極體燈條及其製作方法，以及使用此發光二極體燈條之發光二 極體燈管。 【先前技術】 發光二極體（light emitting diode, LED)具有效率高、壽 命長、耗電量低、不易破損等優點’因此發光二極體的應用 正趨向普遍化，例如大型顯示的電子看板、紅綠燈、汽 _ 車方向燈以及照明方面的應用等。 I知發光一極體光源裝置通常係直接將發光二極體裂配 於電路板（printed circuit board，PCB)上，並封裳成産品。作 由於發光二極體在工作時會產生大量熱能，尤其是高功 光二極體，因此發光二極體光源裝置必須具有良好的散埶= 则嶋源裝置中而 【發明内容】201115061 VI. Description of the Invention: [Technical Field] The present invention relates to a light source device, and more particularly to a light-emitting diode light bar and a method of fabricating the same, and the use of the light-emitting diode light bar Diode lamp. [Prior Art] Light emitting diodes (LEDs) have the advantages of high efficiency, long life, low power consumption, and low damage, so the application of light-emitting diodes is becoming more and more popular, such as electronic display for large displays. , traffic lights, steam _ car direction lights and lighting applications. I know that the light-emitting one-pole light source device usually directly illuminates the light-emitting diode on a printed circuit board (PCB) and seals it into a product. Since the light-emitting diode generates a large amount of heat energy during operation, especially a high-power light-emitting diode, the light-emitting diode light source device must have good heat dissipation = then in the source device [invention]
具有良好的 本發明另提供一種發光二極體盆 的發光二極體燈條，因 :使用散熱效果良好 本發明又提供一種發 熱效果良好的發光二極體燈條。"條之1作方法，以製成散 為達上述優點，本發明提出 路板、多個發光二極體、導熱材種3一極體燈條’包括電 電路板具有第紗第 ^”、、、，，邑緣層以及導熱板。 面具有制❹㈣峨㈣ 4 201115061 區内具有至少一散熱貫孔，貫诵 光二極體係-對-地設置於‘與第二表面。這些發 性連接。導熱材料填充於這^^片己置區内，並與電路板電 極體，並延伸至第二表面上=貝:匕内而接觸對應之發光二 出的導熱材料於 ί電路i之間路板之第—表面’導熱絕緣層則是配置於導熱板The invention further provides a light-emitting diode light bar of a light-emitting diode basin, because the heat-dissipating effect is good. The invention further provides a light-emitting diode light bar with good heat-generating effect. "1 method, to achieve the above advantages, the present invention proposes a road board, a plurality of light-emitting diodes, a heat-conducting material type 3 one-pole light strip 'including an electric circuit board having a first yarn ^" , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , The heat-conducting material is filled in the region of the ^^ film, and is connected to the electrode body of the circuit board, and extends to the second surface: 贝: 匕 contact the corresponding light-emitting material between the il circuit i The first surface of the board - the surface thermal conductive insulation layer is disposed on the heat conducting board
二極出—種發光二極贿管，包括燈殼與上述發光 間内。n'i述發光二極體燈條係配置於燈殼的容置空 在本發明之一實施例中 在本發明之一實施例中 或銀膠。 上述之導熱板為紹板。 上述之導熱材料包括焊錫、銅膠The two poles are a type of light-emitting two-pole bribe, including the lamp housing and the above-mentioned light. The light-emitting diode strip is disposed in the housing of the lamp envelope. In one embodiment of the invention, in one embodiment of the invention, silver paste is used. The above heat conducting plate is a slab. The above thermal conductive materials include solder and copper glue
=發明之一實施例中’上述之電路板在各晶片配置區内 -夕固電連接孔’且各發光二極體包括主體及自主 出的夕個引腳。其中，各主體分別覆蓋其所在之晶片配置 =熱貫孔，而引腳則是插人這些電連接孔内而與電路板電性 本發明又提出-種發光二極體燈條之製作方法，適用於 作上述之發光二極體燈條。此發光二極體燈條之 、 提供具有第一表面以及與第一表面相對之第二表面的電路糸 板，其中第一表面具有排列成多排之多個晶片配置區。然 於電路板之各晶片配置區内形成至少一散熱貫孔，以貫二 表面與第二表面。後續再將導熱材料填充於這些散熱貫孔内 延伸至第一表面上，以使從同一排晶片配置區之這些散熱母 中所延伸出的導熱材料於第二表面連接為一體。之後，將 201115061 發光二極體一對一地配置於這些晶片配置區，以使其電性連接 至電路板並與對應之散熱貫孔内之導熱材料接觸。接著，於電 路板之第二表面形成導熱絕緣層，並將導熱板貼合於導熱絕緣 層。 本發明係在裝配發光二極體的電路板上形成貫通電路板 的散熱貫孔，並將導熱材料填充於散熱貫孔内，以使其從散熱 貫孔中延伸至電路板背面。而且，導熱板係藉由導熱絕緣層貼 合於電路板背面，以使發光二極體作動時所產生的熱能可依序 經由導熱材料及導熱絕緣層傳導至導熱板上而散逸，進而提升 發光二極體燈條的散熱效果。 為讓本發明之上述和其他目的、特徵和優點能更明顯易 懂，下文特舉較佳實施例，並配合所附圖式，作詳細說明如下。 【實施方式】 圖1為本發明之一實施例中發光二極體燈管的立體示意 圖，圖2為圖1之發光二極體燈條的放大示意圖，圖3則為圖 2之發光二極體燈條沿Π —π’線的剖面圖。請參閱圖1，發光 二極體燈管100包括發光二極體燈條1〇2與燈殼1〇4，其中發 # 光二極體燈條1〇2是配置於燈殼1〇4的容置空間1〇5内。 請參閱圖2及圖3 ’本實施例之發光二極體燈條1〇2包括 電路板110、多個發光二極體12〇、導熱材料13〇、導熱絕緣 層140以及導熱板15〇。其中，電路板no具有第一表面112 以及與第一表面112相對之第二表面1H，且第一表面112具 有多個晶片配置區115，用於配設發光二極體丨2〇。在本實施 例中，這些晶片配置區115係在電路板11〇的第一表面112上 排列成兩排，但本發明並不以此為限，亦即是說，晶片配置區 115可根據實際需要而排列成任意多排。 201115061 承上述，電路板110在各晶片配置區115内可具有一個或 多個散熱貫孔116。其中，散熱貫孔116貫通第一表面112與 第一表面114。需要注意的是，各晶片配置區115内的散熱貫 孔116之數量可相同亦可不相同。在本實施例中，各晶片配置 區115均具有一個散熱貫孔116，但本發明並不以此為限。 另一方面，發光二極體12〇是一對一地配置於晶片配置區 115内，並與電路板11〇電性連接。亦即是說，一個晶片配置 區115内設置有一個發光二極體12〇。在本實施例中，由於電 路板U〇的這些晶片配置區115排列成兩排，因此設置於其上 的發光一極體120亦排列成兩排。此外，電路板no在每一晶 片配置區115内更具有多個電連接孔ip，且每一發光二極體 120包括主體122及自主體122延伸出的多個引腳124。在各 晶片配置區115内，發光二極體12〇的主體122係覆蓋散熱貫 孔116，而引腳124則是插入至對應之電連接孔117中而與電 路板110電性連接。 值得一提的是，覆蓋在散熱貫孔116上的發光二極體12〇 係透過其主體122與導熱材料no的接觸來傳導熱能。詳細來 鲁 〇尤導熱材料填充於各晶片配置區115之散熱貫孔116 内’並延伸至電路板110之第二表面U4上。而且，從同一排 之晶片配置區115之散熱貫孔116中所延伸出的導熱材料13〇 於第二表面114連接為一體。本實施例中，導熱材料13〇例如 為知錫，但不以此為限，導熱材料1 50例如還可為銅膝、銀膠 或其他適合之導熱材料。 更特別的是，導熱板150是貼合於電路板no之第二表面 114。詳細來說，導熱板15〇係藉由導熱絕緣層14〇而黏合於 電路板110的第二表面114。換言之，導熱絕緣層14〇係配置 201115061 於導熱板150與電路板110之間。在本實施例中，導熱絕緣層 140例如是可黏合導熱板150與電路板no的導熱絕緣黏著材 料，以避免電路板110上的電路（圖未示）因與導熱板15()產 生電性接觸而短路。另外，導熱板150通常為導熱性較好的金 屬板’例如鋁板，但本發明不以此為限。 承上所述’填充於散熱貫孔116内並延伸至電路板11〇之 第二表面114的導熱材料130係與導熱絕緣層14〇及導熱板 150構成熱傳導路徑。而且，由於從同一排之晶片配置區115 之散熱貫孔116中所延伸出的導熱材料13〇於第二表面114連 •接為一體，因此可大幅增加導熱材料13〇的熱傳導面積，有利 於及時將發光二極體120作動時所產生的熱能傳導至導熱絕 緣層140及導熱板150而散逸至外界。 下文將配合圖2與圖3具體說明發光二極體燈條1〇2之製 作方法。 f先’提供電路板110，其具有第一表面112以及與第〆 表面112相對之第二表面114。其中，第一表面112具有排列 成多排的多個晶片配置區115在本實施例中，這些晶片配置區 • 115排列成兩排，但本發明不以此為限。 接著，於各晶>{配置(1 115内形成—個或多個散熱貫孔 116，以貫通電路板110之第-表s m與第二表S m。在 本實f例中，各晶片配置區115均形歧—個散熱貫孔116。 詳細來f，散熱貫孔116例如可採用機械鑽孔或雷射鑽孔等方 式進行製作。 f來’將導熱材料130填充於這些散熱貫孔116内並使 其電路板，之第二表面114上。其中，從同—排晶片 配置區15之散熱貫孔116中所延伸出的導熱材料13〇於第二 201115061 表面114連接為一體。在本實施例中，其例如是先將導熱材 130填入散熱貫孔116之後’再於電路板11〇的部分第-夺^ 114上塗佈導熱材料130，以連接同一排晶片配置區ιΐ5又面 熱貫孔116内的導熱材料130，但本發明不以此為限。之散 之後，將多個發光二極體120 —對一地配置於這此a片配 置區115’以電性連接至電路板110,並與對應之散熱 内的導熱材料130接觸。在本實施例中，將發光二極體12〇配 設於電路板110上的方法包括將發光二極體120之主體122覆 蓋此晶片配置區115内的散熱貫孔116以使其接觸至導熱材料 130，並將發光二極體12〇之引腳124插入電路板ΐι〇 :電連 接孔117 ’以使其與電路板n〇電性連接。 —然後’於電路板丨川之第二表面114形成導熱絕緣層14〇, 再藉由導熱絕緣層14〇將導熱板15〇貼合於電路板11〇之第二 表面114。在本實施例中，導熱絕緣層14〇例如可採用相應的 導熱絕緣材料以塗佈方式形成於電路板11〇之第二表面I"， 亦可採用相應的導熱絕緣材料製成薄膜以熱壓合等方式形成 於電路板110之第二表面114，但本發明不以此為限。另外， _導熱板150則以例如熱壓合等方式貼合於電路板11〇之第二表 面 114。 ，、’’τ、上所述’本發明係在發光二極體燈條之電路板上形成貫 j電路板相對之第—表面與第二表面的散熱貫孔，並且將導熱 料填入散熱f孔内而延伸至電路板的第二表面，然後再藉由 導熱絕緣層料熱板貼合於電路板的第二表面，以於發光二極 ，與導熱板之間形成熱傳導連接，大大增加了發光二極體的散 二面積’使％•配設於電路板上的發光二極體在王作時所產生的 熱能可以及時排出。 201115061 雖然本發明已以較佳實施例揭露如 本發明，任何·梅， 内，些許之更動舆潤飾，因此本發明之保 附之申請專利範圍所界定者為準。 俊 【圖式簡單說明】 圖1為本發明之一實施例中發光二極體燈管的立體示咅 圖。 圖2為圖1所示之發光二極體燈條的放大示意圖。 圖3為圖2之發光二極體燈條沿II —II’線的剖面圖。 • 【主要元件符號說明】 100 :發光二極體燈管 102 :發光二極體燈條 104 :燈殼 105 :容置空間 110 :電路板 112 :第一表面 114 :第二表面 φ II5 :晶片配置區 116 :散熱貫孔 117 :電連接孔 120 :發光二極體 122 :主體 124 :引脚 130 :導熱材料 140 :導熱絕緣層 150 :導熱板In one embodiment of the invention, the above-mentioned circuit board is disposed in each of the wafer arrangement regions, and each of the light-emitting diodes includes a main body and an abutting pin. Wherein, each of the main bodies covers the wafer configuration=the hot through hole, and the pins are inserted into the electrical connection holes and electrically connected to the circuit board. The present invention further proposes a method for manufacturing the light-emitting diode light bar. It is suitable for use as the above-mentioned light-emitting diode light bar. The light emitting diode strip provides a circuit board having a first surface and a second surface opposite the first surface, wherein the first surface has a plurality of wafer arrangement regions arranged in a plurality of rows. At least one heat dissipation through hole is formed in each of the wafer arrangement regions of the circuit board to align the surface with the second surface. Subsequently filling the heat-conducting material into the heat-dissipating holes extends to the first surface, so that the heat-conducting materials extending from the heat-dissipating fins of the same row of wafer-arranged regions are integrally connected to the second surface. Thereafter, the 201115061 light-emitting diodes are disposed one-to-one in the wafer arrangement regions to be electrically connected to the circuit board and in contact with the heat conductive material in the corresponding heat dissipation through-holes. Next, a thermally conductive insulating layer is formed on the second surface of the circuit board, and the heat conducting plate is bonded to the thermally conductive insulating layer. In the present invention, a heat dissipation through hole penetrating through the circuit board is formed on a circuit board on which the light emitting diode is mounted, and a heat conductive material is filled in the heat dissipation through hole so as to extend from the heat dissipation through hole to the back surface of the circuit board. Moreover, the heat conducting plate is adhered to the back surface of the circuit board by the heat conducting insulating layer, so that the heat energy generated when the light emitting diode is actuated can be sequentially transmitted to the heat conducting plate through the heat conducting material and the heat conducting insulating layer to dissipate, thereby improving the light emitting. The heat dissipation effect of the diode strip. The above and other objects, features and advantages of the present invention will become more <RTIgt; 1 is a perspective view of a light-emitting diode lamp according to an embodiment of the present invention, FIG. 2 is an enlarged schematic view of the light-emitting diode lamp bar of FIG. 1, and FIG. 3 is a light-emitting diode of FIG. A section of the body light bar along the Π-π' line. Referring to FIG. 1 , the LED lamp 100 includes a light-emitting diode light bar 1〇2 and a lamp housing 1〇4, wherein the light-emitting diode light bar 1〇2 is disposed in the lamp housing 1〇4. Set the space within 1〇5. Referring to FIG. 2 and FIG. 3, the light-emitting diode light bar 1〇2 of the present embodiment includes a circuit board 110, a plurality of light-emitting diodes 12A, a heat conductive material 13A, a heat conductive insulating layer 140, and a heat conducting plate 15A. The circuit board no has a first surface 112 and a second surface 1H opposite to the first surface 112, and the first surface 112 has a plurality of wafer arrangement regions 115 for arranging the light-emitting diodes. In this embodiment, the wafer arrangement regions 115 are arranged in two rows on the first surface 112 of the circuit board 11 , but the invention is not limited thereto, that is, the wafer configuration region 115 can be based on actual conditions. Arrange in any number of rows as needed. 201115061 In view of the above, the circuit board 110 can have one or more heat dissipation through holes 116 in each of the wafer arrangement regions 115. The heat dissipation through hole 116 penetrates the first surface 112 and the first surface 114. It should be noted that the number of the heat dissipation through holes 116 in each of the wafer arrangement areas 115 may be the same or different. In this embodiment, each of the wafer arrangement regions 115 has a heat dissipation through hole 116, but the invention is not limited thereto. On the other hand, the light-emitting diodes 12 are arranged one-to-one in the wafer arrangement region 115, and are electrically connected to the circuit board 11. That is, a light-emitting diode 12 is disposed in a wafer arrangement area 115. In the present embodiment, since the wafer arrangement regions 115 of the circuit board U are arranged in two rows, the light-emitting pole bodies 120 disposed thereon are also arranged in two rows. In addition, the circuit board no has a plurality of electrical connection holes ip in each of the wafer arrangement regions 115, and each of the light-emitting diodes 120 includes a body 122 and a plurality of pins 124 extending from the body 122. In each of the wafer arrangement regions 115, the body 122 of the LED 12A covers the heat dissipation via 116, and the pins 124 are inserted into the corresponding electrical connection holes 117 to be electrically connected to the circuit board 110. It is worth mentioning that the light-emitting diode 12 covering the heat-dissipating through-hole 116 transmits thermal energy through contact of the body 122 with the heat-conducting material no. In detail, the Luliang heat conductive material is filled in the heat dissipation through holes 116 of each of the wafer arrangement regions 115 and extends to the second surface U4 of the circuit board 110. Moreover, the heat conductive material 13 extending from the heat dissipation through holes 116 of the wafer arrangement area 115 of the same row is integrally connected to the second surface 114. In this embodiment, the heat conductive material 13 is, for example, known as tin, but not limited thereto, the heat conductive material 150 may be, for example, a copper knee, a silver paste or other suitable heat conductive material. More specifically, the heat conducting plate 150 is a second surface 114 that is bonded to the circuit board no. In detail, the heat conducting plate 15 is bonded to the second surface 114 of the circuit board 110 by the thermally conductive insulating layer 14''. In other words, the thermally conductive insulating layer 14 is disposed between the heat conducting plate 150 and the circuit board 110. In this embodiment, the thermally conductive insulating layer 140 is, for example, a thermally conductive insulating adhesive material that can bond the heat conducting plate 150 and the circuit board no, so as to prevent electrical circuits (not shown) on the circuit board 110 from being electrically connected to the heat conducting plate 15 (). Short circuit due to contact. In addition, the heat conducting plate 150 is generally a metal plate having a good thermal conductivity, such as an aluminum plate, but the invention is not limited thereto. The thermally conductive material 130, which is filled in the heat dissipation through-hole 116 and extends to the second surface 114 of the circuit board 11, forms a heat conduction path with the thermally conductive insulating layer 14 and the heat conducting plate 150. Moreover, since the heat conductive material 13 extending from the heat dissipation through holes 116 of the wafer arrangement area 115 of the same row is connected to the second surface 114, the heat conduction area of the heat conductive material 13〇 can be greatly increased, which is advantageous. The thermal energy generated when the LED 120 is actuated is conducted to the thermally conductive insulating layer 140 and the heat conducting plate 150 to dissipate to the outside. Hereinafter, a method of manufacturing the light-emitting diode light bar 1〇2 will be specifically described with reference to Figs. 2 and 3. f first provides a circuit board 110 having a first surface 112 and a second surface 114 opposite the second surface 112. The first surface 112 has a plurality of wafer arrangement regions 115 arranged in a plurality of rows. In the embodiment, the wafer arrangement regions 115 are arranged in two rows, but the invention is not limited thereto. Next, in each crystal > {arrangement (one or more heat dissipation through holes 116 are formed in 1 115 to penetrate the first table sm and the second surface S m of the circuit board 110. In the present f example, each wafer The arranging area 115 is shaped into a heat dissipating through hole 116. In detail, the heat dissipating through hole 116 can be fabricated by mechanical drilling or laser drilling, etc. f to 'fill the heat conducting material 130 into the heat dissipating through holes. 116 and the second surface 114 of the circuit board, wherein the heat conductive material 13 extending from the heat dissipation through hole 116 of the same row of wafer arrangement area 15 is connected to the second 201115061 surface 114. In this embodiment, for example, after the heat conductive material 130 is filled into the heat dissipation through hole 116, the heat conductive material 130 is coated on the portion of the circuit board 11 to connect the same row of wafer arrangement areas ιΐ5. The heat conductive material 130 in the through hole 116 is surfaced, but the invention is not limited thereto. After the dispersion, the plurality of light emitting diodes 120 are disposed in a one-to-one manner in the a-sheet arrangement area 115' to be electrically connected. To the circuit board 110, and in contact with the heat conductive material 130 in the corresponding heat dissipation. In this embodiment, The method of disposing the LED 12 on the circuit board 110 includes covering the main body 122 of the LED 120 with the heat dissipation through hole 116 in the wafer arrangement area 115 to contact the heat conductive material 130, and to emit light. The pin 124 of the diode 12 is inserted into the circuit board 〇 〇: the electrical connection hole 117 ′ to electrically connect it to the circuit board. — Then, the thermally conductive insulating layer 14 is formed on the second surface 114 of the circuit board. Then, the heat conducting plate 15 is bonded to the second surface 114 of the circuit board 11 by the thermally conductive insulating layer 14 。. In the embodiment, the thermally conductive insulating layer 14 can be coated with a corresponding thermally conductive insulating material, for example. The method is formed on the second surface I" of the circuit board 11〇, and the film may be formed on the second surface 114 of the circuit board 110 by thermocompression bonding or the like by using a corresponding heat conductive insulating material, but the invention is not limited thereto. In addition, the heat conducting plate 150 is attached to the second surface 114 of the circuit board 11 by, for example, thermocompression bonding. , ''τ, the above description' is a circuit of the light emitting diode light bar. The upper surface of the board is formed on the first surface and the second surface Dissipating the through hole, and filling the heat conductive material into the heat sink hole to extend to the second surface of the circuit board, and then bonding the heat plate to the second surface of the circuit board through the heat conductive insulating material layer to the light emitting diode The heat conduction connection is formed between the heat-conducting plate and the heat-dissipating plate, which greatly increases the two-area area of the light-emitting diode. The heat energy generated by the light-emitting diode disposed on the circuit board can be discharged in time. 201115061 The present invention has been disclosed in the preferred embodiments, and is intended to be in accordance with the invention. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a light-emitting diode lamp according to an embodiment of the present invention. 2 is an enlarged schematic view of the light-emitting diode light bar shown in FIG. 1. Figure 3 is a cross-sectional view of the light-emitting diode strip of Figure 2 taken along line II-II'. • [Main component symbol description] 100: Light-emitting diode lamp 102: Light-emitting diode light bar 104: Lamp housing 105: accommodating space 110: Circuit board 112: First surface 114: Second surface φ II5: Wafer Configuration area 116: heat dissipation through hole 117: electrical connection hole 120: light emitting diode 122: main body 124: pin 130: heat conductive material 140: thermal conductive insulation layer 150: heat conducting plate