201113155 六、發明說明： 【發明所屬之技術領域】 本發明係關於-種電子裝置之製造方法、及附支持體之 電子裝置。 【先前技術】 近年來，液晶顯示裝置（LCD，Liquid Crystal Display)、 有機EL(EleCtr〇lUminescence，電致發光）顯示裝置（〇led， Organic Light Emitting Di〇de ’有機發光二極體）係作為顯 示裝置而文到廣泛利用。尤其在手機或行動電話等可攜式 顯示裝置之領域中，要求顯示裝置輕量化、薄型化。 同樣地，太陽能電池、薄膜二次電池、於表面形成有電 路之半導體晶圓等電子裝置亦要求輕量化、薄型化。 為因應該等要求，顯示裝置等電子裝置所使用之玻璃、 樹脂、金屬等之基板正在向薄板化方向發展。 於玻璃基板之情形時，作為使板厚變薄之方法，一般使 用如下方法：於玻璃基板之表面上形成顯示裝置用構件， 在形成顯示裝置用面板後，使用化學蝕刻來對顯示裝置用 面板之兩外側表面進行蝕刻處理，使顯示裝置用面板之厚 度變薄。 該使用化學蝕刻進行之基板薄化之方法中，例如，將】 張玻璃基板之板厚自07 mm薄化加工至〇2 mm或〇ι瓜瓜 時，會因蝕刻液而削落原先的玻璃基板材料之大半，因此 就生產性或原材料之使用效率之觀點而言不佳。相對於 此，若最初便採用板厚較薄之玻璃基板而欲製造TFT(Thin 147170.doc 201113155[Technical Field] The present invention relates to a method of manufacturing an electronic device and an electronic device with a support. [Prior Art] In recent years, a liquid crystal display (LCD), an organic EL (EleCtr〇Uminescence, electroluminescence) display device (〇led, Organic Light Emitting Di〇de 'organic light-emitting diode) has been used as The display device is widely used. In particular, in the field of portable display devices such as mobile phones and mobile phones, display devices are required to be lighter and thinner. Similarly, solar cells, thin film secondary batteries, and electronic devices such as semiconductor wafers having circuits formed on their surfaces are also required to be lighter and thinner. In order to meet the requirements, substrates such as glass, resin, and metal used in electronic devices such as display devices are progressing in the direction of thinning. In the case of a glass substrate, as a method of thinning the thickness, a method of forming a member for a display device on the surface of a glass substrate, and forming a panel for a display device, and then using a chemical etching to face the display device The outer side surfaces are etched to make the thickness of the panel for the display device thin. In the method of thinning the substrate by chemical etching, for example, when the thickness of the glass substrate is thinned from 07 mm to 〇2 mm or 〇ι 瓜, the original glass is cut off by the etching solution. Most of the substrate materials are not good in terms of productivity or use efficiency of raw materials. In contrast, if a thin glass substrate is initially used, TFTs are to be fabricated (Thin 147170.doc 201113155).
Film Transistor，薄膜電晶體）陣列基板或彩色濾光片基 板，則製造時玻璃基板之強度不足，彎曲量亦增大。由此 而產生無法利用現有之生產線進行處理之問題。 又’於上述使用化學钮刻之基板薄化法中，於玻璃基板 之表面上形成顯示裝置用構件後，進行化學蝕刻處理等而 使玻璃基板變薄’因此有時會產生形成於玻璃基板表面之 微細之傷痕顯在化的問題，即，產生钱刻斑之問題。 因此，為解決上述問題而提出如下方法等：使板厚未滿 0.7 mm之較薄的玻璃基板（亦稱為「薄板玻璃基板」）與其 他的支持玻璃基板黏合而形成積層體，並於此狀態下實施 用以製造顯示裝置之特定之處理，其後，分離薄板玻璃基 板與支持玻璃基板。 例如，於專利文獻1中記載有一種方法，其係利用玻璃 基板彼此之靜電吸附力或真空吸附力將製品用玻璃基板與 增強用玻璃基板黏合在一起而實現一體化，製造使用有製 品用玻璃基板之顯示裝置。 又，於專利文獻2中，記載有一種液晶顯示裝置之製造 方法，其係使用玻璃料系之接著劑將液晶顯示裝置之基板 與支持體之端部加以接著，其後形成電極圖案等。 於專利文獻3中，記載有一種顯示裝置用基板之製造方 法’其係、包括以下步驟：對2張玻璃基板之至少周緣部之 端面附近照射雷射光，使上述2張玻璃基板融合。 .於專利文獻4中，記載有一種液晶顯示裝置之製造方 法’其係將基板貼附於在支持體上設置有黏著劑層之基板 I47170.doc 201113155 搬送用治具’並搬送基板搬送用A且 一 双做廷用，口具，稭此，經由液晶顯 示元:牛之製造步驟來對貼附於基板搬送用治具上之基板依 序進行液晶顯示元件形成處理，在完成特定之步驟後，將 基板自基板搬送用治具剝離。 於專利文獻5中，記載有一種液晶顯示元件之製造方 法，其特徵在於：使用由紫外線硬化型黏著劑將液晶顯示 裝置用電極基板設置於支持體上之治具，對液晶顯示裝置 用電極基板實施特定之加工後，對紫外線硬化型黏著劑照 射紫外線，藉此使上述紫外線硬化型黏著劑之黏著力下 降，從而將上述液晶顯示裝置用電極基板自上述治具剝 離。 於專利文獻6中，記載有一種搬送方法，其係以黏著劑 將薄板暫時固定於支持板上，並以密封劑密封上述黏著劑 之周緣部而搬送暫時固定有薄板之支持板。 於專利文獻7中，記載有一種薄板玻璃積層體，其特徵 在於：其係使薄板玻璃基板與支持玻璃基板積層而成者， 且上述薄板玻璃基板與上述支持玻璃基板係經由具有剝離 性及非黏著性之聚石夕氧樹脂層而積層。並且，在分離薄板 _ 玻璃基板與支持玻璃基板時’只要賦予沿垂直方向將薄板 - 玻璃基板自支持玻璃基板拉開之力即可，利用弟彳刀之刀等 在端部形成剝離起始部，或者向積層界面注入空氣，藉此 可更容易地剝離。 又，於專利文獻8中，記載有一種使用有聚矽氧之半導 體製造用之雙面密著片材。 147170.doc 201113155 先前技術文獻 專利文獻 專利文獻1 :曰本專利特開2000-241804號公報 專利文獻2 :曰本專利特開昭58_543丨6號公報 專利文獻3 :曰本專利特開2〇〇3_216〇68號公報 專利文獻4:曰本專利特開平8_86993號公報 專利文獻5:曰本專利特開平9_1〇5896號公報 專利文獻6:曰本專利特開2〇〇〇_252342號公報 專利文獻7 :國際公開第2〇〇7/〇18〇28號小冊子 專利文獻8:日本專利特開2004-26950號公報 【發明内容】 發明所欲解決之問題 然而’於專利文獻1所記載之利用靜電吸附力或真空吸 附力將玻璃基板彼此固定之方法、專利文獻2所記載之利 用玻璃料將玻璃基板之兩端固定之方法、或者專利文獻3 所記載之對周緣部之端面附近照射雷射光而使2張玻璃基 板融合之方法中，由於並未經由任何中間層而使玻璃基板 彼此積層密著’故因混入至玻璃基板間之氣泡或塵芥等異 物而會於玻璃基板上產生應變缺陷。因此，難以獲得表面 平滑之玻璃基板積層體。 又’於專利文獻4〜6所記載之在玻璃基板間配置黏著劑 層等之方法中，可避免上述的因混入至玻璃基板間之氣泡 等而導致應變缺陷之產生，但難以分離兩玻璃基板，且於 分離時有薄板玻璃基板破損之虞。又，於分離後之薄板玻 147170.doc 201113155 璃基板上殘存有黏著劑亦將成為問題。 相對於此，根據專利文獻7所記載之薄板玻璃基板積層 體，難以產生上述的因混入至玻璃基板間之氣泡等而導致 之應變缺陷。又，亦可剝離薄板玻璃基板與支持玻璃基 板。進而，可解決於剝離後之薄板玻璃基板上殘存有黏著 劑之問題。但是，即便對剝離後之薄板玻璃基板之附樹脂 層之面貼附偏光膜或相位差膜等附黏著劑之膜，亦有黏著 強度較弱而會剝離之情形。尤其在偏光膜等中之黏著劑為 丙烯酸系時容易剝離。本發明者對其原因進行努力研究 後，認為其原因在於：對於專利文獻7所記載之積層體， 於剝離後之薄板玻璃基板上看起來並未殘存有聚矽氧樹脂 層’但源自該樹脂層之任何物質（例如可列舉化合物。 又，例如可列舉形成樹脂層之物質的一部分、且於上述樹 脂層之表面析出並存在之低分子化合物等。以下亦稱為 轉印物」）、空氣中飛散之塵芥、及因製造步驟而導致 之金屬片或機油等之異物會極少地附著於上述薄板玻璃基 板之表面。進而’本發明者發現一種可不對薄板玻璃基板 及附著於其上之顯示裝置用構件等造成熱、電磁、機械及 化學性.貝傷地去除上述異物之方法。當薄板玻璃基板為顯 不裝置用面板之一部分時，在與薄板玻璃基板之分離面為 相反側之面會形成薄膜電晶冑、有機此元#、或彩色渡光 片等顯不裝置用構件’ x，由於必需不會對其等造成如上 所述之彳貝傷’故亦有2張薄板玻璃基板藉由密封劑而成為 封裝化之狀態之情形。 147170.doc 201113155 本發明係赛於上述問題而完成者。即，本發明之目的在 於提供一種電子裝置之製造方法，其係自將含有電子裝置 用構件之基板、樹脂層及支持基板積層而成之附支持體之 電子裝置’剝離包含上述樹脂·層及上述支持基板之支持體 而獲得電子裝置後’不對基板及電子裝置用構件等（例如 薄膜電晶體、有機EL元件、彩色濾光片）造成熱、電磁、 機械及化學性損傷地去除附著於上述電子裝置用之基板主 面的異物’其結果可將偏光膜或相位差膜等附黏著劑之膜 牢固地貼附於剝離後之基板之附樹脂層的面。 解決問題之技術手段 本發明者為解決上述課題而進行反覆努力研究，完成本 發明。 本發明係關於以下（1)〜（8)。 (1) 一種電子裝置之製造方法，其包括：剝離步驟，自附支 持體之電子裝置剝離包含支持基板及樹脂層之支持體，獲 得包含電子裝置用構件及基板之電子裝置，上述附支持體 之電子裝置係：在含有第1主面及第2主面、且於第2主面 上含有電子裝置用構件之基板之第i主面密著有樹脂層， 該樹脂層含有剝離性表面，其固定於含有第1主面及第2主 面之支持基板之第1主面；及去除步驟，去除附著於上述 電子裝置中之上述基板第1主面的異物。 (2) 如上述（1)之電子裝置之製造方法，其中上述樹脂層係 聚矽氧樹脂層。 (3) 如上述（1)或（2)之電子裝置之製造方法，其中令上述樹 147170.doc 201113155 脂層之剝離性表面密著於上述基板第丨主面之前的上述基 板第1主面之黏著強度為f〇，且令上述去除步驟之後獲得之 電子裝置中的上述基板第丨主面之黏著強度為f時，。。 (4) 如上述⑴〜(3)中任一項之電子裝置之製造方法，其中上 述去除步驟係對上述基板之第1主面照射電聚而去除上述 異物者。 (5) 如上述（1)〜(3)中任一項之電子裝置之製造方法，其中上 述去除步驟係使用含有酸或鹼之藥液而去除上述異物者。 (6) 如上述⑴〜(3)中任一項之電子裝置之製造方法，其中上 述去除步驟係使用含有溶解度參數為7〜15之溶劑之藥液而 去除上述異物者。 ⑺如上述（5)或（6)之電子裝置之製造方法，其係以下步 驟.進而使用超音波振動而去除上述異物。 W如上述⑴〜⑺中任一項之電子裝置之製造方法其中包 括2個以上的上述去除步驟。 發明之效果 根據本為Θ ’可提供一種電子裝置之製造方、法，其係自 將含有顯示裝置等電子裝置用構件之基板、樹脂層及支持 土板積層而成之附支持體之電子裝置，剝離包含上述樹脂 層及上述支持基板之支持體而獲得電子裝置後，不對基板 及電子裝置用構件等(例如薄膜電晶體、有機EL元件、彩 色濾光片、成熱、電磁、機械及化學性損傷地去除附著 於上述電子裝置用之基板主面的異物，其結果可將偏光膜 或相位差膜等附黏著劑之膜牢固地貼附於剝離後之基板之 147170.doc 201113155 附樹脂層的面。 【實施方式】 對本發明進行說明。 本發明之電子裝置製造方法（以下亦稱為「本發明之電 子裝置製造方法」）係包括：剝離步驟，自附支持體之電 子裝置剝離包含支持基板及樹脂層之支持體，獲得包含電 子裝置用構件及基板之電子裝置，上述附支持體之電子裝 置係.在含有第1主面及第2主面、且於第2主面上含有電 子裝置用構件之基板之第1主面密著有樹脂層，該樹脂層 含有剝離性表面，其固定於含有第丨主面及第2主面之支持 基板之第1主面；及去除步驟，去除附著於上述電子裝置 中之上述基板第1主面的異物。 又，以下，將供本發明之電子裝置製造方法中之剝離步 驟的附支持體之電子裝置亦稱為「本發明之附支持體之電 子裝置」，該附支持體之電子裝置即為：在含有第丨主面及 第2主面之上述基板之第〗主面密著有樹脂層，該樹脂層含 有剝離性表面，其固定於含有第丨主面及第2主面之支持基 板之第1主面。 再者’關於詳細情形將於以下敍述，本發明中所使用之 附支持體之電子裝置係：在含有第i主面及第2主面、且於 第2主面上含有電子裝置用構件之基板之第i主面密著有樹 脂層，該樹脂層含有剝離性表面，其固定於含有第ι主面 及第2主面之支持基板之第丨主面。 即’附支持體之電子裝置含有電子裝置用構件、基板、 147170.doc 201113155 樹脂層及支持基板，且該等係依此順序而積層。又，電子 裝置含有電子裝置用構件及基板，且電子裝置用構件係形 成於基板之第2主面上》 又’附支持體之電子裝置亦可係將由基板、樹脂層及支 持基板依此順序積層後之積層體經由電子裝置用構件而積 層2個所成者，即，將支持基板、樹脂層、基板、電子裝 置用構件、基板、樹脂層及支持基板依此順序積層而成 者。 此處，所謂電子裝置，係指顯示裝置用面板、太陽電 池、薄膜二次電池、於表面形成有電路之半導體晶圓等電 子零件。所謂顯示裝置用面板，係包括液晶面板、有機EL 面板、電漿顯示面板、場發射面板等。 以下，將基板及支持基板包含玻璃之顯示裝置用面板作 為本發明中之電子裝置之一進行詳細敍述。以下，將顯示 裝置用面板之製造方法稱為「本發明之面板製造方法」， 將附支持體之顯示裝置用面板稱為「本發明之附支持體之 面板」。 首先’對本發明之附支持體之面板中之薄板玻璃基板進 行說明。 對薄板玻璃基板而言，其厚度、形狀、大小、物性(熱 收縮率、表面形狀、耐化學品性等）、組成等並無特別限 定’例如，可與先前之LCD' 〇LED等顯示裝置用之玻璃 基板相同。 薄板玻璃基板之厚度以未滿Q7随為宜，較佳者為〇5 147170.doc „ 201113155 mm以下，更佳者為〇·4細以下。又，薄板玻璃基板之厚 度以0.05 mm以上為宜’較佳者為〇〇7爪爪以上更佳者為 0· 1 mm以上。 薄板玻璃基板之形狀並無限定，但以矩形為宜。此處， 所謂矩形，係指實質上為大致矩形，亦包括切除周邊部之 角後（切角後）所成之形狀。 薄板玻璃基板之大小並無限定，例如，當矩形時可為 100〜2000 mmxl00〜2000 mm，較佳者為 5〇〇〜1〇〇〇 _ 500〜1 〇〇〇 mm 〇 本毛月中βρ便為上述厚度及大小時，亦可容易剝離薄 板玻璃基板與支持體。 薄板玻璃基板之熱收縮率、表面形狀、耐化學品性等特 性亦無特別限定’其根據所製造之顯示裝置之種類而不 同。 熱收縮率較小時為宜。具體而言，作為熱收縮率指標之 線膨脹係數以500x丨〇-7/t以下為宜，較佳者為3〇〇χ丨〇· Vc 以下，進而較佳者為2〇0x1(rvc以下，更佳者為1〇〇xi〇-Vc 以下’進而更佳者為45x1 〇-7/。〇以下。 再者於本發明中，線膨脹係數係指JiS R3 102(1995年） 中所規定者。 薄板玻璃基板之玻璃材料之組成例如亦可與先前已知的 含有鹼金屬氧化物之鹼玻璃或無鹼玻璃相同。其中，自熱 收縮率較小之觀點而言尤以無鹼玻璃為佳。 本發明之附支持體之面板中，於上述薄板玻璃基板之第 147170.doc •12· 201113155 2主面含有顯示裝置用構件。 所謂顯示裝置用構件’係指先前的LCD、OLED等顯示 裝置用之玻璃基板於其表面上所含有之發光層、保護層、 TFT陣列（以下稱為陣列）、彩色濾光片、液晶、含有 ITO(Indium Tin Oxide，氧化銦錫）之透明電極等、各種電 路圖案等。上述薄板玻璃基板之第2主面上之顯示裝置用 構件的種類並無特別限定。 由上述顯示裝置用構件與上述薄板玻璃基板而形成顯示 裝置用面板。 其次，對本發明之附支持體之面板中之支持玻璃基板進 行說明。 本發明之附支持體之面板係在上述薄板玻璃基板之第i 主面含有固定有樹脂層的支持玻璃基板作為支持體。支持 玻璃基板係經由樹脂層而與薄板玻璃基板密著，以增強薄 板玻璃基板之強度。 支持玻璃基板之厚度、形狀、大小、物性（熱收縮率、 表面形狀、耐化學品性等）、組成等並無特別限定。 支持玻璃基板之厚度並無特別限定，但本發明之附支持 體之面板必品為以現行的生產線可處理之厚度。 例如，厚度宜為0.1〜1.1 mm ’較佳者為0 3〜〇8 mm，更 佳者為0.4〜0.7 mni。 例如，現行的生產線係設計成可對厚度05 mm之基板進 行處理者，故當薄板玻璃基板之厚度為O.i mm時，使支持 玻璃基板之厚度與樹脂層之厚度相加為〇.4 mm。又，現行 147170.doc •13- 201113155 的生產線最普遍的是設計成可對厚度0·7 mm之玻璃基板進 行處理者，故例如在薄板玻璃基板之厚度為04 mm時使 支持玻璃基板之厚度與樹脂層之厚度相加為〇 3 mm。 支持玻璃基板之厚度與上述薄板玻璃基板之相對厚度之 關係並無限定，支持玻璃基板之厚度可厚於薄板玻璃基板 之厚度，支持玻璃基板之厚度亦可薄於薄板玻璃基板之厚 度》 支持玻璃基板之形狀並無限定，但以矩形為宜。此處， 所谓矩形，係指實質上為大致矩形，亦包括切除周邊部之 角後（切角後）所成之形狀。 支持玻璃基板之大小並無限定，但以與上述薄板玻璃基 板相同程度為宜，較佳者為稍大於上述薄板玻璃基板。具 體而言，例如縱向或橫向之大小分別為〇 〇5〜1〇 左右時 為佳。其理由為：在顯示裝置用面板製造時，可容易保護 上述薄板玻螭基板之端部，不讓其不與定位銷等對準裝置 接觸，以及可更容易地進行薄板玻璃基板與支持玻璃基板 之剝離。 支持玻璃基板之線膨脹係數可與上述薄板玻璃基板實質 同’亦可不同。若實質上㈣，則在以本發明之面板 製造方法進行處理時’在薄板玻璃基板或支持玻璃基板上 難以產生翹曲，此點較佳。 4板玻璃基板與支持玻璃基板之線膨脹係數之差宜為 300x10 /C以下，較佳者為looxio.Vc以下，更佳者為 5〇xl〇-7/°C 以下。 147170.doc 201113155 支持玻璃基板之玻璃材料之組成例如可與鹼玻璃、無鹼 玻璃相同。其中’自熱收縮率較小之觀點而言尤以無鹼玻 璃為佳。 於本發明之實施形態中，基板設為薄板玻璃基板，但本 發明並不限定於此。就工業上之易取得性之觀點而言，可 將玻璃板、矽晶圓、金屬板、塑膠板等作為較佳之例而呈 現。 在採用板厚較薄之玻璃板（薄板玻璃基板）作為基板時， 薄板玻璃基板之組成例如可與驗玻璃或無驗玻璃相同。其 中，自熱收縮率較小之觀點而言尤以無鹼玻璃為佳。 在採用塑膠板作為基板時，其種類並無特別限制，例 如，於透明基板之情形時，可例示：聚對苯二曱酸乙二醋 樹月曰、聚兔酸自旨樹脂、聚謎硬樹脂、聚蔡二曱酸乙二醋樹 脂、聚丙烯酸樹脂、聚聚矽氧樹脂、透明氟樹脂等。於不 透明基板之情形時，可例示：聚醯亞胺樹脂、氟樹脂、聚 醯胺樹脂、芳族聚醯胺樹脂、聚醚酮樹脂、聚醚醚酮樹 脂、各種液晶聚合物樹脂等。 在採用金屬板作為基板時，其種類並無特別限制，例如 可例示不鑛鋼板、銅板等。 基板之耐熱性並無特別限制’但在形成顯示裝置用構件 之TFT陣列等時，耐熱性宜較高。具體而言，上述5%加熱 重量損失溫度宜為300°C以上。較佳者為350°C以上。 於此情形時’就耐熱性之觀點而言，上述玻璃板之任— 者皆適合。 147170.doc 15 201113155 就耐熱性之觀點而言，作為較佳之塑膠板，可例示：聚 醯亞胺樹脂、氟樹脂、聚醯胺樹脂、芳族聚醯胺樹脂、聚 醚楓樹脂、聚趟酮樹脂、聚喊喊酮樹脂、聚萘二曱酸乙二 酯樹脂、各種液晶聚合物樹脂等。 又’基板亦可為將玻璃板、矽晶圓、金屬板、塑膠板等 不同材質積層而成之積層體。例如可列舉：將玻璃板、樹 脂層、塑膠板依此順序積層而成之積層體之類的將不同種 類之基板經由樹脂層積層而成之積層體；或者將玻璃板、 塑膠'玻璃板依此順序積層而成者用作基板之類的將由不 同種類之板複層化而成者用作基板之積層體。 進而，亦可為將2張以上之玻璃板彼此用作基板、或者 將2張以上之塑膠板彼此用作基板之類的將由同一種類之 板複層化而成者用作基板之積層體等。 又，於本發明之實施形態中，支持基板設為使用有玻璃 板之支持玻璃基板，但本發明並不限定於此。就工業上之 易取得性之觀點而言，可將玻璃板、矽晶圓、金屬板、塑 膠板等作為較佳之例而呈現。 在採用玻璃板作為支持基板時，支持玻璃基板之厚度、 形狀、大小、物性（熱收縮率、表面形狀、耐化學品性 等）、組成等並無特別限定。 支持玻璃基板之厚度並無特別限定，但附支持體之顯示 裝置用面板必需為以現行的生產線可處理之厚度。 例如厚度宜為0.1〜1.1 者為0.4〜0.7 m m。 rnm，較佳者為〇_3〜0·8 mm，更佳 mm 〇 147170.doc -16 - 201113155 例如’現行的生產線係設計成可對厚度〇 5 _min之基板進 行處理者’故當薄板玻璃基板之厚度為0.1 mm時，使支持 玻璃基板之厚度與樹脂層之厚度相加為〇4 mm。又，現行 的生產線最普遍的是設計成可對厚度0.7 mm之玻璃基板進 行處理者’故例如在薄板玻璃基板之厚度為0.4 mm時，使 支持玻璃基板之厚度與樹脂層之厚度相加為〇 3 mm。 支持玻璃基板之厚度宜厚於上述薄板玻璃基板。 其次’對本發明之附支持體之面板中之樹脂層進行說 明。 樹脂層固定於上述支持玻璃基板之第1主面。並且，樹 脂層密著於上述薄板玻璃基板之第1主面，但可容易地剝 離。即’樹脂層對上述薄板玻璃基板之第1主面而以某種 程度之結合力結合，且以剝離時不會破壞薄板玻璃基板而 可容易剝離之程度之結合力結合。本發明中，將樹脂層表 面的可容易剝離之性質稱為剝離性。 於本發明之附支持體之面板中，較佳為：樹脂層與薄板 玻璃基板之第1主面並非藉由含有黏著劑之類的黏著力而 附著’而是藉由固體分子間之凡得瓦力所引起之力、即密 著力而附著。 另一方面’樹脂層對上述支持玻璃基板之第1主面之結 合力，相對地高於對上述薄板玻璃基板之第i主面之結合 力。本發明中，將對薄板玻璃基板之第i主面之結合稱為 密著，將對支持玻璃基板之第丨主面之結合稱為固定。 樹脂層之厚度並無特別限定，以00 μη1為宜，較佳者 147170.doc 17 201113155 為5〜30μιη，更佳者為7〜20μηιβ其原因在於：在樹脂層之 厚度為上述範圍時，薄板玻璃基板之第1主面與樹脂層之 也、者將會充分。 又，其原因在於，即便介入有氣泡或異物，亦可抑制薄 板玻璃基板產生應變缺陷。又，若樹脂層之厚度過厚，則 形成時需要花費時間及材料而不經濟。 另外，樹脂層可包含2層以上。於此情形時，「樹脂層之 厚度」係指所有層之總計厚度。 又，當樹脂層包含2層以上時，形成各個層之樹脂的種 類可不同。 對樹脂層而言，相對於上述薄板玻璃基板之第丨主面的 樹脂層之剝離性表面之表面張力宜為3〇 mN/m以下，較佳 者為25 mN/m以下，更佳者為22 mN/m以下。其原因在 於，當為上述表面張力時，可更容易地與薄板玻璃基板之 第1主面剝離，同時與薄板玻璃基板之第丨主面之密著亦會 充分。 又，樹脂層宜包含玻璃轉移點低於室溫（25c>c左右）或者 不具有玻璃轉移點之材料。其原因在於，可成為非黏著性 之樹脂層，且具有更高之剝離性，更容易與薄板玻璃基板 之第1主面剝離’同時與薄板玻璃基板之第1主面之密著亦 會充分。 又’樹知層宜具有耐熱性。其原因在於’於本發明之面 板製造方法中’例如於上述薄板玻璃基板之第2主面上形 成顯不裝置用構件時，可將由薄板玻璃基板、樹脂層及支 147170.doc -18- 201113155 持玻璃基板積層而成之㈣積層體供熱處理。 若Μ月曰層之彈性模數過高，則與薄板玻璃基板之第 1主面之密著性將會降低而不佳。另外，若彈性模數過 低，則剝離性將會降低而不佳。 形成樹脂層之樹脂之種類並無特別限定。例如可列舉： 丙烯酸樹脂、聚烯烴系樹脂、聚胺基曱酸酯樹脂及聚矽氧 树月曰。可混合若干種類之樹脂而使用。於上述樹脂之群 中，聚矽氡樹脂為宜。其原因在於，聚矽氧樹脂之耐熱性 優異，且對薄板玻璃基板之剝離性之程度較佳。又，其原 因在於，於支持玻璃基板之第1主面使硬化性聚矽氧樹脂 硬化而形成聚矽氡樹脂層時，藉由與支持玻璃基板之第1 主面之矽烷醇基之縮合反應而容易固定於支持玻璃基板 上。聚矽氧樹脂層例如即便於3〇〇〜4〇(rc左右進行丄小時左 右之處理，剝離性仍大致不會劣化，此點亦較佳。 又，樹脂層在聚矽氧樹脂中尤以剝離紙用之硬化性聚矽 氧之硬化物為佳。剝離紙用聚矽氧係以於分子内含有直鏈 狀的二曱基聚⑦氧烧之聚妙氧作為主劑者。使用觸媒、光 聚合起始劑等而使含有該主劑與交聯劑之組合物於上述支 持玻璃基板之表面主面）硬化所形成之樹脂層具有優異 的剝離性’故較佳。又，上述樹脂層之柔軟性較高，因此 即便氣泡或塵芥等異物混入至薄板玻璃基板與樹脂層之 間’亦可抑制薄板玻璃基板產生應變缺陷。 ,該種剝離紙用聚矽氧根據其硬化機構而分類為縮合反應 型聚石夕氧、加成反應型聚⑦氧、紫外線硬化型聚♦氧或電 147170.doc -19· 201113155 子束硬化型聚⑪氧，但皆可使用。該等中尤以加成反應型 聚矽氧為佳。其原因在於，硬化反應之難易度、形成樹脂 層時剝離性之程度為良好，且耐熱性亦較高。 又’剝離紙用㈣氧在形態上有溶劑型、乳液型及盈溶 劑型’任一類型皆可使用。該等中尤以無溶劑型為佳。其 原因在於’在生產性'安全性、環境特性之方面優異。 又，其原因在於，形成樹脂層時在進行硬化時，即，在加 熱硬化、料線硬化或電子束硬化時，不含有會產生發泡 之溶劑，故樹脂層中難以殘留氣泡。 又，作為剝離紙用聚矽氧，具體而言，作為一般市售之 商品名或型號’可列舉：KNS_320A、Ks_847(皆為信越聚 矽氧（Shin-Etsu Silicones)公司製造）、TpR67〇〇(GE 東芝 (GE Toshiba Silic〇nes)聚矽氧公司製造）、乙烯基聚矽氧 「8500」（.荒川化學工業股份有限公司製造）、與曱基氫化 聚石夕氧院「12031」（荒川化學工業股份有限公司製造）之組 合；乙婦基聚魏「11364」（荒川化學I業股份有限公司 製造）與甲基氫化聚矽氧烷「12031」（荒川化學工業股份有 限公司製造）之組合；乙烯基聚矽氧「1 1365」（荒川化學工 業股份有限公司製造）與甲基氫化聚矽氧烷「12〇31」（荒川 化學工業股份有限公司製造）之組合等。再者’ KNs_ 320A、KS-847及TPR6700係預先含有主劑與交聯劑之聚矽 氧。 又，形成樹脂層之聚矽氧樹脂宜具有聚矽氧樹脂中之成 分難以轉移至薄板玻璃基板的性質，即，宜具有低聚矽氧 147170.doc •20· 201113155 轉移性。 其次，利用圖式來說明本發明之附支持體之面板。 圖1係表示本發明之附支持體之面板之-態樣的概略剖 面圖。 於圖1中，顯不裝置用面板16包含層狀之顯示裝置用構 件14及薄板玻璃基板12，該等被積層。此處，顯示裝置用 構件14係形成於薄板玻璃基板12之第2主面上。並且，薄 板玻璃基板12之第1主面與固定於支持玻璃基板19之第is 面之樹脂層18的表面密著而附著，形成本發明之附支持體 之面板10。 圖1所示之態樣之本發明之附支持體之面板1〇中，薄板 玻璃基板12、樹脂層18、及支持玻璃基板19在面方向上為 大致相同之大小。 圖2係表示本發明之附支持體之面板之另一態樣的概略 正視圖，圖3係其A-A'剖面圖（概略剖面圖）。 於圖2及圖3中’顯示裝置用面板26包含層狀之顯示裝置 用構件24及薄板玻璃基板22，該等被積層《此處，顯示裝 置用構件24係形成於薄板玻璃基板22之第2主面上。並 且，薄板玻璃基板22之第1主面與固定於支持玻璃基板29 之第1主面的樹脂層28密著而附著，形成本發明之附支持 體之面板20。 圖2及圖3所示之態樣之本發明之附支持體之面板20中， 較薄板玻璃基板22而言，支持玻璃基板29之主面面積更 大，且薄板玻璃基板22之面方向之外緣並未自支持玻璃基 147170.doc -21 - 201113155 板29之外緣伸出。 又，圖2及圖3所示之態樣之本發明之附支持體之面板2〇 中’較樹脂層28之表面（與薄板玻璃基板22之第1主面相接 之面）之面積（以下’亦稱為樹脂層中之「表面面積」）而 吕’薄板玻璃基板22之第1主面之面積更大。樹脂層28之 表面面積較薄板玻璃基板22之第一主面之面積小了相當於 形成後述間隙部25之部分。並且，薄板玻璃基板22之第1 主面中之未與樹脂層28相接之部分α、及與其對向之支持 玻璃基板29之一部分β ’形成連接本發明之附支持體之面 板20之端面（γι、γ2)的間隙部25。 在形成上述間隙部2 5後，於後述之本發明之面板製造方 法之剝離步驟中，可更容易地剝離薄板玻璃基板與樹脂 層，因而較佳。 又，間隙部25之深度宜為1 mm以上，較佳者為3 mm以 上，更佳者為5 mm以上。又，宜為15 mm以下，較佳者為 10 mm以下。其原因在於，於後述之本發明之面板製造方 法之剝離步驟中，可更容易地剝離薄板玻璃基板與樹脂 層。 再者，所謂「間隙部之深度」，係指自薄板玻螭基板之 端面（γ 2)起沿該端面之垂直方向直至樹脂層之端面為止的 長度。於圖2、圖3所示之情形下，係指所表示之部分 的長度。再者，如後述之圖5所示之態樣，當自薄板玻璃 基板之端面起沿該端面之垂直方向直至樹脂層之端面為止 的之長度係根據作為起點之薄板玻璃基板之端面之部位而 147170.doc •22- 201113155 不同時’使最大長度為「間隙部之深度」。 又’間隙部25之位置可為如圖2所示之矩形的薄板玻璃 基板22之一邊之中心部分，亦可為如圖4所示之矩形的薄 板玻璃基板22之一邊之全部。又，亦可為將如圖5所示之 矩形的薄板玻璃基板22含有之角中之一個角大幅切角後所 成者。再者，圖4、圖5分別係表示本發明之附支持體之面 板之又一態樣的概略正視圖。 又’如圖6之概略剖面圖所示，本發明之附支持體之面 板亦可為如下態樣：將顯示裝置用構件34之兩主面夾入至 薄板玻璃基板（32a、32b)、樹脂層（38a、38b)及支持玻璃 基板（39a、39b)之積層體中。該種態樣亦為可利用本發明 的面板製造方法進行處理之本發明之附支持體之面板。 其次，說明本發明之附支持體之面板之製造方法。 本發明之附支持體之面板之製造方法並無特別限定，但 宜包括如下步驟：樹脂層形成步驟，於上述支持玻璃基板 之第1主面形成含有剝離性表面之樹脂層；密著步驟，積 層上述薄板玻璃基板與上述支持玻璃基板，使上述樹脂層 之剝離性表面密著於上述薄板玻璃基板之第丨主面；及顯 示裝置用構件形成步驟，於上述薄板玻璃基板之第2主面 上形成顯示裝置用構件。 本發明之附支持體之面板之製造方法中的薄板玻璃基板 及支持玻璃基板之製造方法並無特別限定。例如可利用先 前公知之方法來製造。例如，在將先前公知之玻璃原料溶 解而形成炫融玻璃後’可藉由浮式法、溶融法、流孔法 147170.doc •23- 201113155 (slot method)、再曳引法（redraw method)等成形為板狀而 獲得。 對本發明之附支持體之面板之製造方法中的樹脂層形成 步驟進行說明》 於支持玻璃基板之表面（第丨主面）上形成樹脂層之方法 並無特別限定。 例如可列舉將膜狀之樹脂接著於支持玻璃基板之表面的 方法。具體而言可列舉如下方法：為了對膜之表面賦予較 高之接著力而進行表面改質處理，將其接著於支持玻璃基 板之第1主面。作為表面改質之處理方法，可例示：如矽 烷偶合劑之類的使密著力化學性地提高之化學方法（底塗 處理）；或如火焰（flame)處理之類的使表面活性基增加之 物理方法；如噴砂處理之類的藉由增力〇表面粗縫度而使捕 獲力增加之機械方法等。 又，例如可列舉以公知之方法將形成樹脂層之樹脂組 物塗佈於支持玻璃基板之第i主面上的方法1為公知 方法可列舉·喷塗法、模塗法、旋塗法、浸塗法、輥: 法、棒塗法、絲網印刷法、凹版印刷塗佈法。可根據樹】 組合物之種類而自上述方法中適當選擇。 例如，在使用無溶劑型之剝離紙用聚石夕氧作為樹脂㈣ 物時，宜採用模塗法、旋塗法或絲網印刷法。 1 再者，在製造含有如使用圖2〜5所說明之間隙部的 明之附支持體之面板時，宜對形成間隙部之部位預々 遮蔽’然後塗佈樹脂組合物。所謂遮蔽，係指如下方法:’ 147170.doc •24· 201113155 在塗佈樹脂組合物時，對形成間隙部之部位預先貼附可再 剝離之膜等，使樹脂組合物不塗佈於該部位，其後剝離上 述膜。 又，在將樹脂組合物塗佈於支持玻璃基板之第丨主面上 時，其塗佈量宜為！〜100g/m2,較佳者為5〜2〇g/m2。 又’作為其他方法’例如在由加成反應型聚矽氧而形成 樹脂層時，藉由上述之喷塗法等公知之方法，將包含：於 分子内含有直鏈狀之二甲基聚矽氧烷之聚矽氧（主劑）、交 聯劑及觸媒之樹脂組合物塗佈於支持玻璃基板之第1主面 上，其後使其加熱硬化。加熱硬化條件係根據觸媒之調配 量而不同，例如在相對於主劑及交聯劑之總計量1〇〇重量 份而調配鉑系觸媒2重量份時，使其在大氣中於 50C〜250°C下進行反應，較佳者為1〇〇t〜2〇〇β(：τ進行反 應又此時之反應時間為5〜60分鐘，較佳者為〗〇分 鐘。由於形成為具有低聚矽氧轉移性之聚矽氧樹脂層，因 此使硬化反應儘可能地進行以便聚矽氧樹脂層中不殘留有 未反應之聚石夕氧成分為纟’若&上述的反應溫度及反應時 間，則可使聚石夕氧樹脂層中不t殘留有未反應之聚石夕氧成 分，因而較佳。當反應時間較上述反應時間而言過長時、 或反應溫度過高時，會同時引起聚矽氧樹脂之氧化分解， 生成低刀子量之聚石夕氧成分，因此聚石夕氧轉移性有可能變 尚。使硬化反應儘可能地進行以便聚矽氧樹脂層中不會殘 留有未反應之聚矽氧成分’由此亦可使加熱處理後之剝離 性良好，故較佳。 147170.doc •25- 201113155 利用上述方法於支持破璃美你夕 ^ 于圾碉丞板之第1主面上形成樹脂層 之後，於樹脂層之表面積層薄板破璃基板。 又，例如，在使用剝離紙用聚矽氧而製造樹脂層時，將 塗佈於支持玻璃基板之第！主面上之剝離紙用聚石夕氧加执 硬化而形成聚石夕氧樹脂層之後，於密著步驟令使薄板玻璃 基板積層於支持玻璃基板之聚石夕氧樹脂形成面。藉由使剝 離紙用聚矽氧加熱硬化而使聚矽氧樹脂硬化物與支持玻璃 基板化學性結合。又，根據效果，聚矽氧樹脂層會與支持 玻璃基板結合。於該等之作用下，聚矽氧樹脂層被牢固地 固定於支持玻璃基板之第1主面。 對本發明之附支持體之面板之製造方法中的密著步驟進 行說明。 密著步驟係將上述薄板玻璃基板之第1主面、與在第丄主 面形成有上述樹脂層之上述支持玻璃基板進行積層，並使 上述樹脂層之剝離性表面密著於上述薄板玻璃基板之第i 主面的步驟。 薄板玻璃基板之第1主面與樹脂層之剝離性表面宜藉由 非常接近之相對的固體分子間之凡得瓦力所引起之力、即 密著力而結合。此時，可保持為使支持玻璃基板與薄板玻 璃基板積層之狀態。 使上述薄板玻璃基板與在第1主面固定有上述樹脂層之 上述支持玻璃基板積層之方法並無特別限定。例如可使用 公知之方法而實施。例如可列舉如下方法··在常麼環境下 將薄板玻璃基板疊合於樹脂層之表面後，使用輥或衝壓機 147170.doc -26- 201113155 使樹脂層與薄板玻璃基板壓接。使用輥或衝壓機進行壓 接，藉此樹脂層與薄板玻璃基板將進一步密著，故較佳。 又’使用輥或衝壓機之壓接，藉此可容易地去除混入至樹 脂層與薄板玻璃基板之間的氣泡，故較佳。 若藉由真空層壓法或真空加壓法進行壓接，則可更好地 抑制氣泡之混入及確保良好的密著，故更佳。於真空下進 行壓接，藉此亦存在以下優點：即便在殘存有微量氣泡之 情形時，氣泡亦不會因加熱而成長，從而難以導致薄板玻 璃基板之應變缺陷。 於密著步称中’在使薄板玻璃基板積層於支持玻璃基板 之樹脂層之剝離性表面時’宜充分地清洗薄板玻璃基板之 表面，於潔淨度高的環境下進行積層。即便在樹脂層與薄 板玻璃基板之間混入有異物，亦不會因樹脂層變形而對薄 板玻璃基板之表面之平坦性造成影響，但潔淨度越高，其 平坦性越好，故潔淨度高為佳。 以此方式獲得積層有薄板玻璃基板、樹脂層及支持玻璃 基板之玻璃積層體（以下’亦稱為「薄板玻璃積層體」）之 後’於該薄板玻璃積層體中之薄板玻璃基板之第2主面上 形成顯示裝置用構件。 备形成顯示裝置用構件時 ^ 吁視需要亦宜對薄板玻璃基相 之第2主面進行研磨以提高其平坦度。 顯示裝置用構件並無特別限定-二; 陣列或彩线又， 如可列舉：含有OLED之透曰月 電極、電洞注人層、電洞傳輪層、發光層、電子傳輸層。 147170.doc •27· 201113155 對本發明之附支持體之面板之製造方法中的顯示裝置用 構件形成步驟進行說明。 ~ 顯示裝置用構件形成步驟係於上述薄板玻璃積層體之上 述薄板玻璃基板之第2主面上形成顯示裝置用構件的步 驟。 ’ 於上迷薄板玻瑀積層 上 J队叹w签败之第2主f 形成上述顯示裝置用構件之方法並無特別限定，可化 前公知之方法相同。 例如，在製造LCD作為顯示裝置時，可與先前公知之方 玻璃基板上形成陣狀步驟、形成彩色濾光^ 由密封劑而使形成有陣列之玻璃基板與形成有彩色遽光) 之玻璃基板黏合之步驟（陣列.彩色遽光片黏合步驟择的4 種步驟相同。更具體而言，作為該等步驟中實施之處理， 例如可列舉：純水清洗、乾燥、成膜、抗飯劑塗佈、_ ^顯影、㈣及抗㈣R除。進而，作為在實施陣列 彩色慮光片毒占合步驟後所要進行之步冑，有液晶、主入^ 驟、及實施該處理後進行之注人口之密封步驟，可列舉^ 等步驟中實施之處理。 / 之^主以製造。咖之情形為，作為用以於薄板玻璃基相 之第2主面上形成有姐結構體之步驟，其包括： 明電極之步驟、基_妒:雪：|=| 4 λ a π η. 電洞傳輸層.發光層.電子 傳輸層等之步驟、及密封步驟等 寻的各種步驟，作為該等步 驟中所實施之處理’具體而言例如 _ . J列舉.成膜處理、蒸 鐘處理、密封板之接著處理等。 ‘、、 147170.doc •28- 201113155 如此一來，可製造本發明之附支持體之面板。 其次’對本發明之面板製造方法進行說明。 本發明之面板製造方法並無特別限^，但宜包括：剝離 步驟，其係自上述附支持體之面板剝離包含上述支持玻璃 基板及上述樹脂層之支持體；及去除步驟，其係去除附著 於經該剝離步驟而獲得之顯示裝置用面板中之薄板玻璃基 板第1主面的來源於上述樹脂層之轉印物等的異物。 對本發明之面板製造方法中之剝離步驟進行說明。 剝離步驟係自上述附支持體之顯示裝置用面板剝離包含 上述支持玻璃基板及上述樹脂層之支持體的步驟。 剝離方法只要係可不對薄板玻璃基板、形成於其第2主 面上之顯示裝置用構件及密封劑造成熱、電磁、機械及化 學性損傷地進行剝離之方法，則無特別限制。而且，較佳 者為支持玻璃基板無損傷之方法，進而，更佳者為固定於 支持玻璃基板之第1主面之具有剝離性的樹脂層無損傷之 方法。 作為具體的剝離方法，例如，可於薄板玻璃基板與樹脂 層之界面中插入鋒利的刀具狀物或喷射水與壓縮空氣之混 合流體而進行剝離。較佳者為，以上述附支持體之面板之 支持玻璃基板側為上側、顯示裝置用面板側為下側之方式 於壓盤上，將顯示裝置用面板側基板真空吸附於麼盤 上（於雙面積層有支持玻璃基板時，依序進行），並於該狀 態下對附支持體之面板之薄板玻璃基板與樹脂層之邊界喷 射水與壓縮空氣之混合流體，朝垂直上方上拉支持玻璃基 147170.doc •29· 201113155 板之端部。如此一來’於上述邊界依序形成空氣層，該空 氣層擴展至上述邊界之整個面，可容易地剝離支持體（於 附支持體之面板之兩主面積層有支持玻璃基板時，逐一單 面地反覆進行上述剝離步驟）。 經上述剝離步驟所剝離之支持體可再利用。例如，當上 述樹脂層為聚矽氧樹脂層之情形時，剝離後之支持體中之 聚矽氧樹脂層越具有低聚矽氧轉移性，則越會有可抑制上 述玻璃積層體由於經加熱步驟時之剝離強度上升而導致的 剝離不良之傾向。因此，可更好地再利用。 對本發明之面板製造方法中之去除步驟進行說明。 去除步驟係去除附著於上述顯示裝置用面板中之上述薄 板玻璃基板之第1主面之異物的步驟。 如上所述，即便供上述剝離步驟後所獲得之顯示裝置用 面板中之薄板玻璃基板之第丨主面（與樹脂層密著之面）貼附 偏光膜或相位差膜等附黏著劑之膜，亦有黏著強度較弱而 會剝離之情形。本發明者對其原因進行研究後，認為其原 因在於：源自樹脂層之轉印物、空氣中飛散之塵芥、及因 製造步驟而導致之金屬片或機油等異物會極少地附著於該 第1主面。並且，本發明者發現一種可不對薄板玻璃基板 及形成於該薄板玻璃基板之第2主面的顯示裝置用構件等 造成熱、電磁、機械及化學性損傷地去除上述異物之方 法。 如上所述’所謂異物’係指包含源自上述樹脂層之任何 物質（即轉印物）、空氣中飛散之塵芬、及因製造步驟而導 147170.doc •30- 201113155 致之金屬片或機油等在内的除附著於薄板玻璃基板第κ 面之薄板玻璃基板以外之物。作為上述轉印物，例如可列 舉形成樹脂層之化合物，其係藉由與薄板玻璃基板之第i 主面密著而附著於該第！主面者。又，例如可列舉形成樹 脂層之物質之一部分、且於上述樹脂層之表面析出並存在 之低分子化合物等。 對上述轉印物進行具體說明.例如，當樹脂層包含聚矽 氧時，由於薄板玻璃基板之第丨主面與固定於支持玻璃基 板之第1主面的聚矽氧樹脂層之密著，故可認為較低分子 量之聚矽氧化合物會藉由樹脂層内之擴散效應而附著於薄 板玻璃基板之第1主面上。此處’當玻璃積層體經過加熱 步驟時，使用溶解聚矽氧化合物所得之溶劑等而自薄板玻 璃基板之第1主面去除聚矽氧化合物較為困難。另一方 面，當基板並非為薄板玻璃基板而是包含聚醯亞胺等樹脂 之基板（以下，亦稱為樹脂基板）時，在自支持體剝離樹脂 基板後，可使用溶解聚石夕氧化合物所得之溶劑等來去除附 著於樹脂基板之第1主面的聚矽氧化合物。_般而言，偏 光膜等中之黏著劑係使用丙烯酸系，並被調整為可獲得對 親水性之玻璃基板表面之適度的黏著強度。相對於此，若 斥水性之聚矽氧化合物附著於玻璃基板表面，則丙烯酸系 黏著劑對玻璃基板表面之黏著強度將降低，二次加工 (rework)性增加，另一方面，偏光板會藉由外力而剝離。 再者’作為決定偏光膜對玻璃基板表面之黏著強度之因 素’除玻璃基板表面之親水性、即水接觸角以外，還可列 147170.doc 31 201113155 舉膜之彈性、黏著狀難等，本發明中，黏著強㈣指 利用將25 _寬度之偏光膜、或者將㈣著劑之膜貼附於 玻璃基板表面之㈣施9,離之枝進行敎所取得之 值0 附著於上述顯示裝置用面板等電子裝置中之上述薄板玻 璃基板等基板之第!主面之上述異物的去除方法並無特別 限定，但如上所述，即便根據樹脂層或基板之種類而使用 溶劑’《以絲’宜使料異物進行熱或化學性分解之 方法，’當樹脂層為聚石夕氧樹脂層，且基板為薄板玻 璃基板時，可認為異物令聚矽氧化合物為主成分，可列 舉：使附著於薄板玻璃基板之第面的聚矽氧化合物熱 分解成二氧切、水及二氧化碳之方法；或使用酸或驗來 進行化學性分解之方法。另—方面，當樹脂層為聚石夕氧樹 脂層，且基板為樹脂基板時，除將附著於樹脂基板之聚矽 氧化合物進行熱或化學性分解以外，亦可藉由溶劑之溶解 而去除。 又，供去除步驟的顯示裝置用面板之態樣為：於薄板玻 璃基板之第2主面上形成有陣列、有機EL元件或彩色濾光 片等電子裝置用構件；或者利用密封劑而黏合二張薄板玻 璃基板，進而於所黏合之二張薄板玻璃基板之間注入有液 晶；因此於任一態樣中，皆可無損傷地去除上述異物。 即，較好的是，去除步驟係可不對上述薄板玻璃基板、上 述顯不裝置用構件及密封劑造成熱、電磁、機械及化學性 損傷地去除上述異物之步驟。 147170.doc •32- 201113155 又’較好的是，令密著上述樹脂層之前的上述薄板玻璃 基板之第1主面之黏著強度為f。，且令上述去除步驟之後獲 得，顯示裝置用面板中的上述薄板玻璃基板之第ι主面之 黏著強度為f時’ f ^ f。。此黏著強度之關係、藉由最恰當地 進行剝離步驟及去除步驟中之處理而可實現。 作為附著於上述薄板玻璃基板之第i主面之聚石夕氧化合 物等異物的去除方法，可縣電㈣射處理作為較佳例。 其中’尤以具備電場屏蔽之方式為佳，其係利用所謂的遠 距電漿(Remote Plasma)法而不會對顯示裝置用面板造成熱 或電磁性影響者。X，與電漿灰化法等需要高真空之方式 相比’常壓遠距電漿法為宜，且能夠以較低成本去除異 物，因而較佳。 藉由該種電漿照射處理，可使偏光板等附黏著劑之膜對 該薄板玻璃基板之h主面的黏著強度較與樹脂層密著之 前為相同《更高（即，黏#強統黏著強度f〇)，因而較 佳。 對上述薄板玻璃基板之第丨主面進行電漿照射之次數並 無特別限定，只要該薄板玻璃基板之第丨主面可獲得所需 之黏著強度即可，可照射丨次或複數次電漿。 又，電漿照射時之上述薄板玻璃基板表面溫度宜為 100C以下。其理由為：不會導致顯示裝置用面板之密封 劑或液晶等構件產生劣化或損傷等，可維持顯示性能。 以下顯示常壓遠距電漿法之具體例。 使用圖7來說明可用以實施常壓遠距電漿法之裝置。 147170.doc •33· 201113155 圓7係本發明之面板製造方法之去除步驟中可用以藉由 遠距電漿法而去除上述異物之電漿放電裝置的模式性裝置 圖。 於圖7中’電壓施加電極42與接地電極43係對向設置， 且與基材對向之面分別由固體電介質46被覆。處理氣體沿 箭-員方向被導入至由電壓施加電極42與接地電極a所形成 之放電空間44 ’並被電漿化後，自電漿喷出口 45向顯示裝 置用面板50喷出。 此處，顯示裝置用面板50之搬送速度宜為〇 較佳者為0.5〜2 m/min，其中以i m/min左右為佳。 作為附著於上述顯示裝置用面板中之上述薄板玻璃基板 之第1主面之聚矽氧化合物等異物的去除方法，宜使用含 有酸或驗之藥液而去除上述異⑯。自ρ方止處理裝置腐钱等 保王之觀點而s，較佳者為使用含有鹼之藥液進行處理。 又，於使用含有酸或驗之藥液之處对，由於接液之關 係，浸槽清洗（vat soaking washing)比喷淋清洗更理想，藉 由選定適切之濃度、溫度、處理時間，可尤其不對密封劑 造成影響地去除聚矽氧化合物等異物。可例示如下方法： 例如’使用已調整為3G〜7(rc (較佳者為泰6代）之1〇〜3〇 質量％(較佳者為15〜25質量％)之含有酸或鹼之藥液進行 1〜20分鐘（較佳者為5〜15分鐘）的處理。X，在將顯示裝置 用面板浸潰於酸或驗之藥液中時，最好不與顯示裝置用構 件k㈣㈣之構件宜適當地進行密封或遮蔽處理。例 如右顯不裝置用構件上有液晶注入孔，則藥液有可能進 I47170.doc -34- 201113155 入至顯示裝置内，故適當地實施密封或遮蔽處理為宜。 作為附著於上述薄板玻璃基板之第1主面之聚矽氧化合 物等異物的去除方法’在不會對上述薄板玻璃基板、上述 顯不裝置用構件及密封劑造成熱、電磁、機械及化學性損 傷之處理條件之範圍内，可列舉電暈放電、或火焰（即火 焰處理）。 作為上述處理條件’例如，電暈放電時或火焰處理時之 上述薄板玻璃基板表面溫度宜為l〇〇»c以下。其理由為： 不會導致顯示裝置用面板之密封劑或液晶等構件劣化或損 傷等’可維持顯示性能。 作為附著於上述薄板玻璃基板之第1主面之聚矽氧化合 物等異物料除方法，在不對上述薄板玻璃基板、上述^ 不裝置用構件及密封劑造成熱、電磁、機械或化學性損傷 处條件之圍内，宜使用含有sp(s〇lubility parameter) 值:即溶解度參數為7〜15(單位：call/2cm.3/2)之溶劑之藥 =去除異物1溶解度參數為7〜15之範圍外，則液體與 =月曰層之親和性較低，因此液體難以儒濕樹脂層。例如， 使用3有曱醇、乙醇、丙醇、丙酮、二曱笨 藥液去除上述里物4 己烷等之 > 达/、物。進而，自環境負載之觀點而言，官你 用醇系凊洗液，例如使用 液。潠宏、主* 畔乙私、丙醇等之清洗 洗液之適切之濃度、溫度、處 尤其抑制對密封劑 ^ 鞛此可 化合物等異物。 〕眾矽氧 忒4溶劑可單獨、或組合使用。 將顯示裝置用面板與含有 ^ 關於 汉兴3有上述洛劑之樂液接液時，最好不 147170.doc •35- 201113155 與樂液相接觸之顯示裝置用構件宜適#地進行密封或遮蔽 處理。例％ ’當顯示裝置用面板上有液晶注入孔時，有可 能會使藥液自液晶注入孔進入至顯示裝置用面板内部，因 此對液晶注入孔實施密封或遮蔽處理為宜。 於本發明之面板製造方法中’包括2個以上的上述去除 步驟。 即較好的是，複數次地實施單一種類之去除步驟而去 除上述異物’或者將複數種類之去除步驟加以組合而去除 上述異物。例如可列舉：將如上所述使用有電漿之方法與 使用有酸等藥液之方法加以組合而去除上述異物。又，於 去除步驟中，較好的是進而使用超音波振動而去除上述異 物。 如此一來，於本發明之面板製造方法中，藉由進一步供 所需之步驟而可獲得顯示裝置用面板。所謂所需之步驟， 例如於LCD之情形肖，可列舉如下步驟：將存在複數塊晶 胞之大型晶胞分割為所需大小之晶胞；對上述分割後之晶 胞注入液晶，其後密封注入口；對上述注入口密封後之晶 胞貼附偏光板；及形成模組。又，例如於〇LED之情形， 除上述步驟以外，還可列舉如下步取：將形成有機el結構 體之4板玻璃基板與對向基板進行組裝。再者，自不會因 切割處理而導致薄板玻璃基板之強度下降、且亦不會產生 玻璃屑（cullet)之觀點考慮，分割為所需大小之晶胞之步驟 且為利用雷射裁刀進行之切割。 對本發明之面板製造方法之具體例進行說明。 147170.doc -36· 201113155 、 說月本發明之面板製造方法中的本發明之附支持 體之面板之製造方法。 首先準it薄板玻璃基板及支持玻璃基板，；青洗其等之 表面作為，月洗，例如可列舉純水清洗、旧叫1體1〇1以， 紫外線）清洗》 其次，於支持玻璃基板之第！主自上形成樹脂層。例 如:使用絲㈣印刷機於支持玻璃基板之第1主面上塗佈聚 矽氧樹脂。然後進行加熱硬化，於支持玻璃基板之第1主 面上形成樹脂層，獲得固定有樹脂層之支持玻璃基板。 接著，使樹脂層之剝離性表面與薄板玻璃基板之第！主 面附者並黏合。例如’可於室溫下對樹脂層與薄板玻璃基 板進行真空加壓而黏合。並且，可獲得作為支持玻璃基 板樹月曰層及薄板玻璃基板之積層體的薄板玻璃積層體。 接下來，視需要，可研磨亦可清洗薄板玻璃積層體中之 薄板玻璃基板之第2主面。作為清洗，例如可列舉純水清 洗、UV清洗。 利用上述方法而製造2個薄板玻璃積層體後，於各薄板 玻璃積層體中的薄板玻璃基板之第2主面上形成顯示裝置 用構件。其中1個薄板玻璃積層體係供公知之彩色濾光片 形成步驟’藉此而於該薄板玻璃基板之第2主面形成彩色 滤光片。又，另丨個薄板玻璃積層體係供公知之陣列形成 步驟’藉此而於該薄板玻璃基板之第2主面形成陣列。 以上述方法可製造2個本發明之附支持體之面板。 再者’以下’亦將此處獲得的含有彩色濾光片之本發明 147170.doc -37- 201113155 之附支持體之面板稱為「附支持體之面板χ」，且將含有陣 列之本發明之附支持體之面板稱為「附支持體之面板 於本發明之面板製造方法中’例如利用以下所示之實例 i〜實例4之方法進-步處理以上所製造之附支持體之面板 X、及附支持體之面板y，製造出顯示裝置用面板。 (實例1) 於實例1中，以上述方式，使附支持體之面板X及附支持 體之面板y各自中的彩色濾光片形成面與陣列形成面對 向，並使用晶胞形成用紫外線硬化型密封劑等密封劑進行 黏合。以下’將此處獲得的本發明之附支持體之面板亦稱 為「附支持體之面板Zl」。附支持體之面板zl係尚未被液 晶填充之狀態者’為所謂之空晶胞狀態。 其次，在利用藥液實施去除步驟時，暫時密封附支持體 之面板zl之液晶注入孔。例如’亦可使用紫外線硬化型密 封劑等來進一步密封該注入口之外側。 然後，將密封後之附支持體之面板21之2個支持體供上 述本發明之面板製造方法中的剝離步驟進行剝離。並且， 供本發明之面板製造方法中的去除步驟。以下，將如此獲 得之面板亦稱為「面板wlje剝離後之2個支持體可於其他 的支持體付面板之製造中再利用。 其次，去除面板wl之液晶注入孔之暫時密封後，將該面 板w 1切割為各別晶胞。 其次，自上述注入孔對切割後之各別晶胞注入液晶其 後，密封該注入孔而形成液晶晶胞。 147170.doc •38· 201113155 然後，進而於上述液晶晶胞上貼附偏光板，形成背光 等，由此可獲得LCD1。 再者’該實例中的本發明之面板製造方法中之去除步 驟，可在自附支持體之面板剝離支持體後、或者切割為各 別晶胞而形成液晶晶胞後之任一情況下進行。其中，於支 持體剝離後之藥液處理時，為了防止藥液向空晶胞内滲 透’較理想的是對上述注入孔實施暫時密封。 (實例2) 於實例2中，使用先前已知之液晶滴下式注入法（〇DF， One Drop Filling)而製造液晶晶胞。使液晶垂滴至附支持 體之面板X及附支持體之面板y各自中的彩色濾光片形成面 與陣列形成面中之任一方，且使另一方之形成面與垂滴有 該液晶之形成面對向，並使用晶胞形成用紫外線硬化型密 封劑等密封劑進行黏合。以下，將此處獲得之本發明之附 支持體之面板亦稱為「附支持體之面板z2」。 其次，將附支持體之面板22之2個支持體供上述本發明 之面板製造方法中的剝離步驟進行剝離。並且，供本發明 之面板製造方法中的去除步驟。以下，將如此獲得之面板 亦稱為「面板w2」。剝離後之2個支持體可於其他的支持體 付面板之製造中再利用。 其次，將面板W2切割為各別晶胞。 然後’進而於切割為各別晶胞之面板〜2上貼附偏光板， 形成背光等，由此可獲得LCD2。 再者’該實例中的本發明之去除步驟可在剝離支持玻璃 147170.doc •39· 201113155 &或者切割為各別晶胞而形成液晶晶胞後之任一情 進行。其中’於支持體剝離後之藥液處理時，為了防 止藥液向空晶胞内滲透，較理想的是對上述注入孔實施暫 時密封。 (實例3) ;貫例3中，使用〇DF製造液晶晶胞。使液晶垂滴至附 支持體之面板X及附支持體之面板丫各自中的彩色濾光片形 成面與陣列形成面中之任一方，使另一方之形成面與垂滴 有該液晶之形成面對向，並使用晶胞形成用紫外線硬化型 密封劑等密封劑進行黏合。然後，上述黏合後之附支持體 之面板X及附支持體之面板y係與支持體一併被切割為各別 晶胞。以下，將此處經切割而獲得之本發明之附支持體之 面板亦稱為「附支持體之面板z3」。 接下來，將附支持體之面板z3之2個支持體供上述本發 明之面板製造方法中的剝離步驟進行剝離。並且，供本發 明之面板製造方法中的去除步驟。以下，將如此獲得之面 板亦稱為「面板w3」。 然後，於面板w3貼附偏光板，形成背光等，由此可獲得 LCD3。 (實例4) 於實例4中，以上述方式，使附支持體之面板χ及附支持 體之面板y各自中的彩色渡光片形成面與陣列形成面對 向’並使用晶胞形成用紫外線硬化型密封劑等密封劑進行 黏合。然後’與支持體一併被切割為各別晶胞。以下，將 147170.doc -40- 201113155 此處經切割而獲得之本發明之附支持體之面板亦稱為「附 支持體之面板z4」。附支持體之面板z4係尚未被液晶填充 之狀癌者，為所謂之空晶胞狀態。 其次’在利用藥液實施去除步驟時，暫時密封附支持體 之面板z4之液晶注入孔。 然後，將附支持體之面板24之2個支持體供上述本發明 之面板製造方法中的剝離步驟進行剝離。並且，供本發明 之面板製造方法中的去除步驟。以下，將如此獲得之面板 亦稱為「面板w4」。 其次，去除面板W4之液晶注入孔之暫時密封後，對該面 板w4之晶胞注入液晶，其後進行密封。 然後，進而貼附偏光板，形成背光等，由此可獲得 LCD4 〇 其中，於支持體剝離後之藥液處理時，為了防止藥液向 空晶胞内滲透，較理想的是對上述注入孔實施暫時密封。 根據本發明之面板製造方法，在薄板玻璃基板較大時， 例如為730x920 mm時，亦可容易地剝離上述薄板玻璃基 板。 其次’對本發明之顯示裝置之製造方法進行說明。 本發明之顯示裝置之製造方法係包含本發明之面板製造 方法者。 於以本發明之面板製造方法獲得顯示裝置用面板後，將 其進而供先前公知之步驟’藉此可獲得顯示裝置。 本發明之顯示裝置之製造方法適合於行動電話或 147170.doc 201113155 PDA(Personal Digital Assistant，個人數位助理）之類的手 機終端所使用之小型顯示裝置之製造。顯示裝置主要為 LCD或OLED，作為LCD，包括：TN(Twisted Nematic，扭 轉向列）型、STN(Super Twisted Nematic，超扭轉向列） 型、FE(Field Effect，揚效應）型、TFT型、MIM(Metal Insulator Metal，金屬-絕緣體-金屬）型、IPS(In_piane Switching’ 橫向電場切換）型、VA(Vertical AHgned，垂直 配向）型等。基本上’本發明對於被動驅動型、主動驅動 型之任一類型之顯示裝置亦可適用。 以上’作為本發明之電子裝置，以於基板之表面（第2主 面）含有顯示裝置用構件之顯示裝置用面板為代表例進行 了說明，但如上所述，本發明並不限定於此，當然亦可 為.代替顯示裝置用構件而於基板之表面（第2主面）分別含 有太陽電池用構件 '薄膜二次電池用構件、及電子零件用 電路等電子裝置用構件的太陽電池、薄臈二次電池、及電 子零件等的電子裝置。 例如，作為太陽電池用構件，矽型中可列舉：正極之氧 化錫等透明電極、由層戶斤表示之石夕層、及負極之 金屬等#他可列舉：與化合物型、色素增感型、量子點 型等對應之各種構件等。 ’‘ 又，作為薄膜二次電池用構件，經離子型十可列舉： 極及負極之金屬或金屬氧化物等透明電極、電解質層之 :合物、集電層之金屬、作為密封層之樹脂等，其他可 舉.與氫化錦型、帶八你剂 聚0物型、陶瓷電解質型等對應之各 147170.doc -42· 201113155 構件等。 又，作為電子零件用電路，CCD(Charge c〇upied Device，電荷耦合元件）或 CM〇s(c〇mpiementary —Μ 〇Xide Semiconduct〇r ’互補金屬氧化物半導體）中可列 舉：導電部之金屬、絕緣部之氧化石夕或氮化石夕等，其他可 列舉：與Μ力感測器.加速度感測g等各種感调】器或硬式 印刷基板、軟式印刷基板、軟_硬式印刷基板等對應之各 種構件等。 實施例 (實施例la) 首先，對縱720 mm、橫600 mm、板厚0.4 mm、線膨脹 係數38xl〇-7/t：之支持玻璃基板（旭硝子股份有限公司製， AN 1 〇 〇，無驗玻璃）進行純水清洗、uv清洗，使其淨化。 其-入，利用絲網印刷機，將無溶劑加成反應型剝離紙用 聚石夕氧（信越聚矽氧公司製，kns_320a，黏度為〇 4〇 Pa’s，溶解參數（3?值）=7 3)1〇〇重量份與鉑系觸媒（信越聚 矽氧公司製，CAT-PL-56)2重量份之混合物於支持玻璃基 板之第1主面上塗佈成縱7〇5 mm、橫595 1Ώιη大小之長方形 • (塗佈量為30 g/m2)。 ' 接著’使其在大氣中於180。(：下加熱硬化30分鐘，於支 持玻璃基板之第！主面形成厚度為2〇 μηι之聚矽氧樹脂層。 其次’對與縱720 mm、橫600 mm、板厚0.3 mm、線膨 張係數38xl〇-7/°c之薄板玻璃基板（旭硝子股份有限公司 製’ AN1 〇〇 ’無鹼玻璃）之聚矽氧樹脂層相接觸之側的面進 嶋如 -43- 201113155 行純水清洗、uv清洗，使其淨化後，於室溫下對聚石夕氧 樹脂層與薄板玻璃基板以真空加壓而黏合，從而獲得薄板 玻璃積層體（以下，亦稱為「薄板玻璃積層體A1」）。 再者’樹脂層之形成及薄板玻璃基板之積層係以於薄板 玻璃積層體A 1之端部形成有深度為1 5 mm之間隙部之方式 而進行。 於所獲得之薄板玻璃積層體A1中，兩玻璃基板係與聚石夕 氧樹脂層不產生氣泡地密著，亦無變形狀缺陷，平滑性亦 良好。 其次，使薄板玻璃積層體A1在大氣中於250。(：下進行2小 時加熱處理。可確認：薄板玻璃積層體A1之樹脂層不會因 熱而導致劣化，耐熱性良好。 接下來’將薄板玻璃積層體A1中之薄板玻璃基板之第2 主面固定於固定台上。又’以吸附墊吸附支持玻璃基板之 第2主面。然後’向薄板玻璃積層體幻所具有之4個角部中 之1個中、且薄板玻璃基板與樹脂層之界面中，插入厚度 為0.4 mm之小刀稍加剝離’繼而使吸附墊向遠離固定台之 方向移動’從而剝離薄板玻璃基板與支持體（含有樹脂層 之支持玻璃基板）。剝離所得之薄板玻璃基板亦稱為「薄 板玻璃基板al」^ 接下來，於薄板玻璃基板al中之第1主面（密著有樹脂層 之面）上貼附偏光膜（曰東電工公司製，丙婦酸系黏著劑）。 然後，測定該偏光膜之黏著強度。測定方法為：將25 mm 寬之偏光膜、或附黏著劑之膜貼附於玻璃基板表面之後， 147170.doc •44- 201113155 對膜端部進行90。剝離。其結果，黏著強度為〇 2〇 n/25 mm 〇 其次’暫時剝離偏光膜後，使用常壓遠距電漿裝置（積 水化學公司製造）對薄板玻璃基板al之第1主面照射電漿。 此處’處理條件為.輸出為3 kw，I氣與空氣流量之比 = 600 slm/750 sccm，搬送速度為i m/min。電漿照射時之 薄板玻璃基板a之表面溫度為5〇°c以下。 其次，與照射電漿之前同樣地，對照射電漿後之薄板玻 璃基板al中之第1主面貼附偏光膜，並以相同方法測定偏 光膜之黏著強度。 其結果為’ 90°剝離時之黏著強度為4.7 N/25 mm。又， 利用光學顯微鏡觀察薄板玻璃基板al之第1主面後，並未 觀察到異物附著或破裂、缺損。 再者’形成薄板玻璃積層體A1之前的薄板玻璃基板之第 1主面中的黏著強度為3 9 n/25 mm。 (實施例lb) 於支持玻璃基板之第1主面上，使用：在兩末端具有乙 稀基之直鏈狀聚有機矽氧烷（荒川化學工業股份有限公司 製’商品名「8500」）、在分子内具有氫矽烷基之甲基氫 化聚矽氧烷（荒川化學工業股份有限公司製，商品名 12031」）、及鉑系觸媒（荒川化學工業股份有限公司製， 商品名「CAT12070」）之混合物，除此之外，以與實施例 la相同之方法獲得薄型玻璃積層體（以下，亦稱為「薄板 玻璃積層體A2」）後，於大氣中進行加熱處理。 147170.doc -45- 201113155 其次，以與實施例la相同之方法，剝離薄板破璃基板與 支持體（含有樹脂層之支持玻璃基板）。剝離後所得之薄板 玻璃基板亦稱為「薄板玻璃基板a2」。 其次，以與實施例13相同之方法測定薄板玻璃基板&2之 第1主面中之偏光膜的黏著強度，其結果為〇 6〇 n/25 mm ° 其次，暫時剝離偏光膜，使該薄型玻璃基板&2於50充下 於已稀釋成20重量％之抗蝕劑剝離液（parker c〇rp〇rati〇n公 司製，含有作為主成分之氫氧化鉀20質量％)中浸潰丨〇分 鐘’進行水洗及送風。 其次’測定該薄板玻璃基板a2之第1主面中之偏光膜的 黏著強度’其結果為4.5 N/25 mm ° (實施例lc) 以與貫施例1 b相同之方法獲得薄型玻璃積層體（以下， 亦稱為「薄板玻璃積層體A3」）後，於大氣中進行加熱處 理。 其次’以與實施例lb相同之方法，剝離薄板玻璃基板與 支持體（含有樹脂層之支持玻璃基板）。剝離後所得之薄板 玻璃基板亦稱為「薄板玻璃基板a3」。 然後’將該薄板玻璃基板a3浸潰於抗蝕劑剝離液中。此 處’剝離液之溫度為50。(：，浸潰5分鐘。又，使用設置於 液槽内之超音波振動板，對薄板玻璃基板a3施加超音波振 動。 然後’測定該薄板玻璃基板a3之第1主面中之偏光膜之 147170.doc •46· 201113155 黏著強度，其結果為4.0 N/25 nun。 (實施例Id) 以與實施例lb相同之方法獲得薄型玻璃積層體（以下， 亦稱為「薄板玻璃積層體A4」）後，於大氣中進行加熱處 理。 其次，以與實施例lb相同之方法，剝離薄板玻璃基板與 支持體（含有樹脂層之支持玻璃基板）。剝離後所得之薄板 玻璃基板亦稱為「薄板玻璃基板^」。 其次，於薄板玻璃基板之表面溫度為i 〇〇。匚以下之條件 下，利用火焰處理機（Arcotec公司製造）對該薄板玻璃基板 a4之第1主面以氧氟燃燒器火焰之緣部1 〇爪化化之掃描速 度進行4次處理。 其次’測定該薄板玻璃基板a4之第1主面中之偏光膜之 黏者強度’其結果為4.0 Ή/25 mm。 (實施例le) 於實施例le中，將薄板玻璃基板變更為厚度〇〇5 mm之 聚酿亞胺樹脂基板（東麗.杜邦公司製，Kapt〇n 200HV)，除 此之外’以與實施例la相同之方法獲得裝置用基板積層體 (以下’亦稱為「裝置用基板積層體A5」）。聚醯亞胺樹脂 基板之兩主面中’將與樹脂層之剝離性表面密著之面作為 第1主面，將形成有電子裝置用構件之主面作為第2主面。 以與實施例1 a相同之方法對裝置用基板積層體A5之樹脂層 之耐熱性進行評估後，可確認：不會因熱而導致劣化，耐 熱性良好。 147170.doc •47· 201113155 其次，以與實施例la相同之方法剝離聚醯亞胺樹脂基板 與支持體（含有樹脂層之支持玻璃基板）。剝離後所得之聚 醯亞胺樹脂基板亦稱為「聚醯亞胺樹脂基板a5」。 其次’以與實施例U相同之方法，對聚醯亞胺樹脂基板 a5之第1主面貼附偏光膜。然後，測定聚醯亞胺樹脂基板 a5之第1主面中之偏光膜之黏著強度。偏光膜之黏著強度 為 0·50 N/25 mm 〇 然後，以與實施例1 a相同之方法，使用常壓遠距電漿裝 置’對聚酿亞胺樹脂基板a5之第1主面照射電漿，並貼附 偏光膜。測疋聚酿亞胺樹脂基板a 5之第1主面中之偏光膜 之黏著強度，其結果為3.0 N/25 mm ° 再者’裝置用基板積層體A5形成前之聚醯亞胺樹脂基板 之第1主面中的黏著強度為1.5 N/25 mm。 (實施例If) 於實施例if中，將薄板玻璃基板變更為厚度〇1 mm之已 實施鏡面處理之不鏽鋼（SUS3〇4)基板，除此之外，以與實 施例la相同之方法獲得裝置用基板積層體（以下，亦稱為 「裝置用基板積層體A6」）。不鏽鋼基板之兩主面中，將 與樹脂層之剝離性表面密著之面作為第1主面，將形成電 子裝置用構件之主面作為第2主面。以與實施例u相同之 方法對裝置用基板積層體A6之樹脂層之耐熱性進行評估 後’可確認：不會因熱而導致劣化，耐熱性良好。 其次，以與實施例la相同之方法剝離不鏽鋼基板與支持 體（含有樹脂層之支持玻璃基板）。剝離後所得之不鏽鋼基 147170.doc -48- 201113155 板亦稱為「不鏽鋼基板a6」。 其次，以與實施例la相同之方法’對不鏽鋼基板Μ之第 1主面貼附偏光膜。然後，測定不鏽鋼基板a6之第丨主面中 之偏光膜之黏著強度。偏光膜之黏著強度為〇 4〇 n/25 mm ° 接下來，以與實施例la相同之方法，使用常壓遠距電漿 裝置，對不鏽鋼基板36之第i主面照射電漿，並貼附偏光 膜。測定不鏽鋼基板a6之第1主面中之偏光膜之黏著強 度’其結果為1.5 N/25 mm ° 再者，裝置用基板積層體A6形成前之不鏽鋼基板之第j 主面中之黏著強度為1.0 N/25 mm。 (實施例lg) 首先，利用鹼性洗劑對縱350 mm、橫300 mm、板厚 0.08 mm、線膨脹係數38xl(r7/t：2玻璃膜（旭硝子股份有 限么司製，AN 100，無驗玻璃）進行清洗，使玻璃膜之表面 淨化。進而’以γ-巯丙基三甲氧基矽烷之〇丨％甲醇溶液對 玻璃膜之表面進行噴霧’並於8〇。(：下乾燥3分鐘。另一方 面，對縱350 mm、橫300 mm、板厚〇.〇5 mm之聚醯亞胺樹 脂基板（東麗.杜邦公司製，Kapton 200HV)之表面進行電聚 處理。然後，將玻璃膜與聚醯亞胺樹脂基板疊合，使用加 熱至320°C之加壓裝置而形成玻璃/樹脂積層基板。玻璃/樹 脂積層基板之兩主面中’將與樹脂層之剝離性表面密著之 聚醯亞胺樹脂基板側之主面作為第1主面，將對向之玻璃 膜側之主面作為第2主面。 I47170.doc -49· 201113155 於實施例lg中，將薄板玻璃基板變更為上述玻璃/樹脂 積層基板，除此之外，以與實施例1 a相同之方法獲得裝置 用基板積層體（以下，亦稱為「裝置用基板積層體A7」）。 以與實施例la相同之方法對裝置用基板積層體A7之樹脂層 之耐熱性進行評估後，可確認：不會因熱而導致劣化，耐 熱性良好。 其次’以與實施例la相同之方法剝離玻璃/樹脂積層基 板與支持體（含有樹脂層之支持玻璃基板）。剝離後所得之 玻璃/樹脂積層基板亦稱為「玻璃/樹脂積層基板a7」。 其次’以與實施例1 a相同之方法，對玻璃/樹脂積層基 板a7之第1主面貼附偏光膜。然後，測定玻璃/樹脂積層基 板a7之第1主面中之偏光膜之黏著強度。偏光膜之黏著強 度為 0.4 0 N / 2 5 in m。 其次’以與實施例1 a相同之方法，使用常壓遠距電漿裝 置’對玻璃/樹脂積層基板a7之第1主面照射電漿，並貼附 偏光膜。測定玻璃/樹脂積層基板a7之第1主面中之偏光膜 之黏著強度’其結果為3.0 N/25 mm ° 再者，裝置用基板積層體A7形成前之玻璃/樹脂積層基 板之第1主面中之黏著強度為15 n/25 mm。 (實施例lh) 於實施例1 h中，以與實施例1 e相同之方法獲得裝置用基 板積層體A51 ^ 其次，以與實施例le相同之方法剝離聚醯亞胺樹脂基板 與支持體（含有樹脂層之支持玻璃基板）。 147170.doc 201113155 其次，以與實施例la相同之方法，對裝置用基板積層體 A51中的聚醯亞胺樹脂基板之第1主面貼附偏光膜。並且， 測定聚醯亞胺樹脂基板之第1主面中之偏光膜之黏著強 度。偏光膜之黏著強度為0.40 N/25 mm。 其次，一邊對聚醯亞胺樹脂基板之第1主面喷射醇系清 洗劑（Neocoal R7，Japan Alcohol Trading公司製）一邊進行 刷洗。藉由送風而自聚醯亞胺樹脂基板之第1主面去除清 洗劑後，以與實施例la相同之方法貼附偏光膜。測定聚酿 亞胺樹脂基板之第1主面中之偏光膜之黏著強度，其結果 為 2·8 N/25 mm β (實施例2) 首先，對縱720 mm、橫600 mm、板厚〇 6 mm、線膨脹 係數38><1〇-7/。(：之支持玻璃基板（旭硝子股份有限公司製， AN100，無鹼玻璃）進行純水清洗、uv清洗，使其淨化。 其次，利用絲網印刷機，將在兩末端具有乙烯基之直鏈 狀聚有機矽氧烷（荒川化學工業股份有限公司製，商品名 /500」）、在分子内具有氫矽烷基之甲基氫化聚矽氧烷 (’〇*川化子工業股份有限公司製，商品名「⑶3工」）、及敍 系觸媒（荒川4匕舉τ $ & 、 「 業版伤有限公司製，商品名 12070」）之混合物於支持玻璃基板之第^主面上塗佈 成縱;7〇5麵、橫595 mm之大小（塗佈量為20 g/m2)。此 處。周1直鏈狀聚有機石夕氧烧與甲基氮化聚石夕氧烧之混合 以使風梦烧基與乙稀基之莫耳比達到1/1。相對於直 鏈狀聚有機石夕氧燒與甲基氫化聚石夕氧烧之總計⑽重量 147170.doc 201113155 份，鉑系觸媒為5重量份。 其次’使其在大氣中於18〇°C下加熱硬化30分鐘，於支 持玻璃基板之第1主面形成厚度為2〇 μη!之聚；ε夕氧樹脂層。 其次’對與縱720 mm、橫600 mm、厚度〇. 1 mm、線膨 脹係數5〇xl〇-7/°c之薄板玻璃基板（旭硝子股份有限公司 製’ AN100，無鹼玻璃）之聚矽氧樹脂層相接觸之側之面進 行純水清洗、UV清洗而使其淨化後，於室溫下對聚矽氧 樹脂層與薄板玻璃基板以真空加壓而黏合，從而獲得薄板 玻璃積層體（以下亦稱為「薄板玻璃積層體B」）。 再者’樹脂層之形成及薄板玻璃基板之積層係以於薄板 玻璃積層體B之端部形成有深度為15 間隙部之方式 而進行。 於所獲得之薄板玻璃積層體B中，兩玻璃基板係與聚矽 氧樹脂層不產生氣泡地密著，亦無變形狀缺陷，平滑性亦 良好。 其次’準備2個薄板玻璃積層體並且，於其中的一個 薄板玻璃積層體B(稱為「薄板玻璃積層體B1」）之薄板玻 璃基板之第2主面形成陣列。具體而言，絕緣層及非晶矽 層係利用CVD(Chemical Vapor Deposition，化學氣相沈積） 法而形成，電極層係利用濺鍍法而形成，且各自之圖案係 利用光微影之方法而形成陣列。 又，於其中的另一個薄板玻璃積層體B(稱為「薄板玻璃 積層體B2」）之薄板玻璃基板之第2主面形成彩色濾光片。 具體而言，黑色矩陣及RGB像素係利用塗佈及烘烤法而形 147170.doc •52· 201113155 成’電極層係利用丨賤鑛法而形成’且各自之圖案係利用光 微影之方法而形成彩色濾光片。 然後’使薄板玻璃積層體B 1中之陣列形成面與薄板玻璃 積層體B2中之彩色濾光片形成面相對向，使用晶胞形成用 紫外線硬化型密封劑進行黏合，從而獲得附支持體之顯示 裝置用面板（以下，亦稱為「附支持體之面板C」）。 其次’將作為附支持體之面板C中之薄板玻璃積層體b j 之一部分的支持玻璃基板之第2主面固定於固定台上。 又，以吸附墊吸附作為附支持體之面板c中之薄板玻璃積 層體B2之一部分的支持玻璃基板之第2主面。並且，向附 支持體之面板C所具有之4個角部中之丨個中、且作為薄板 玻璃積層體B2之一部分的薄板玻璃基板與樹脂層的界面 中，插入厚度為〇.〗mm之小刀，將薄板玻璃基板與支持體 (3有樹知層之支持玻璃基板）稍加剝離，繼而使吸附墊向 退離固定台之方向移動，從而剝離薄板玻璃基板之第丄主 面與支持體。自附支持體之面板c剝離薄板玻璃積層體 之支持體後所獲得者亦稱為「附支持體之面板cx」e 接下來，將作為附支持體之面板Cx中之薄板玻璃積層體 B2之一部分的溥板玻璃基板之第1主面固定於固定台上。 又，以吸附墊吸附作為附支持體之面板Cx中之薄板玻璃積 層體B1之一部分的支持玻璃基板之第之主面。並且，向附 支持體之面板Cx所具有之4個角部中之丨個中、且作為薄板 玻璃積層體B1之一部分的薄板玻璃基板與樹脂層之界 ’插入厚度為0」mm之小刀，將薄板玻璃基板與支持體 147170.doc -53· 201113155 (含有樹月曰層之支持玻璃基板）稍加剝離，繼而使吸附塾向 遠離固定台之方向移動，從而剝離薄板玻璃基板與支持A film transistor or a color filter substrate has insufficient strength and a large amount of bending when manufactured. This creates problems that cannot be handled with existing production lines. In the substrate thinning method using the chemical button, the member for the display device is formed on the surface of the glass substrate, and then the chemical conversion treatment or the like is performed to thin the glass substrate. Therefore, the surface of the glass substrate may be formed on the surface of the glass substrate. The problem of microscopic scars is obvious, that is, the problem of generating money spots. Therefore, in order to solve the above problems, the following methods are proposed: the plate thickness is less than 0. A 7 mm thin glass substrate (also referred to as a "thin glass substrate") is bonded to another supporting glass substrate to form a laminate, and in this state, a specific process for manufacturing a display device is performed, and thereafter, separation is performed. A thin glass substrate and a supporting glass substrate. For example, Patent Document 1 discloses a method in which a glass substrate for a product and a glass substrate for reinforcement are bonded together by electrostatic adsorption force or vacuum adsorption force of a glass substrate to form an integrated glass for use. Display device for the substrate. Further, Patent Document 2 describes a method of manufacturing a liquid crystal display device in which an end portion of a substrate and a support of a liquid crystal display device is followed by a glass frit-based adhesive, and thereafter an electrode pattern or the like is formed. Patent Document 3 describes a method for producing a substrate for a display device, which includes irradiating laser light to the vicinity of an end surface of at least a peripheral portion of two glass substrates to fuse the two glass substrates. . Patent Document 4 describes a method of manufacturing a liquid crystal display device, which attaches a substrate to a substrate I47170 provided with an adhesive layer on a support. Doc 201113155 The jig for transporting and transporting the substrate for transfer A and one pair for the purpose of use, the mouth, and the straw, through the liquid crystal display element: the manufacturing step of the cow, the substrate attached to the substrate transfer jig is sequentially The liquid crystal display element forming process is performed to peel the substrate from the substrate transfer jig after the specific step is completed. Patent Document 5 describes a method for producing a liquid crystal display device, which comprises using a jig for mounting an electrode substrate for a liquid crystal display device on a support with an ultraviolet curable adhesive, and an electrode substrate for a liquid crystal display device. After the specific processing, the ultraviolet curable adhesive is irradiated with ultraviolet rays, whereby the adhesion of the ultraviolet curable adhesive is lowered, and the electrode substrate for a liquid crystal display device is peeled off from the jig. Patent Document 6 describes a transfer method in which a thin plate is temporarily fixed to a support plate with an adhesive, and a peripheral portion of the adhesive is sealed with a sealant to transport a support plate on which a thin plate is temporarily fixed. Patent Document 7 discloses a thin-plate glass laminate in which a thin glass substrate and a supporting glass substrate are laminated, and the thin glass substrate and the supporting glass substrate are detachable and non-transmissive. Adhesive polyglycol layer is laminated. Further, in the case of separating the thin plate_glass substrate and the supporting glass substrate, it is only necessary to impart a force for pulling the thin plate-glass substrate from the supporting glass substrate in the vertical direction, and forming a peeling start portion at the end portion by using a knife or the like. Or injecting air into the laminate interface, which makes it easier to peel off. Further, Patent Document 8 describes a double-sided adhesive sheet for producing a semiconductor using polyoxyxylene. 147170. Doc 201113155 PCT Patent Publication No. 2000-241804 Patent Document 2: Japanese Patent Laid-Open Publication No. SHO-58-543 No. 6 Patent Document 3 Japanese Laid-Open Patent Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. [Problem to be Solved by the Invention] However, the electrostatic adsorption force described in Patent Document 1 is used. The method of fixing the glass substrates to each other by the vacuum adsorption force, the method of fixing the both ends of the glass substrate by the glass frit described in Patent Document 2, or the irradiation of the vicinity of the end faces of the peripheral portion described in Patent Document 3, and 2 In the method of merging a glass substrate, since the glass substrates are not adhered to each other without passing through any intermediate layer, the foreign matter such as bubbles or dust mustard mixed in between the glass substrates may occur. Strain defects are generated on the glass substrate. Therefore, it is difficult to obtain a glass substrate laminate having a smooth surface. Further, in the method of disposing an adhesive layer or the like between the glass substrates described in Patent Documents 4 to 6, it is possible to avoid the occurrence of strain defects due to bubbles or the like interposed between the glass substrates, but it is difficult to separate the two glass substrates. And there is a flaw in the thin glass substrate at the time of separation. Also, after separation, the thin plate glass 147170. Doc 201113155 Residual adhesive on the glass substrate will also be a problem. On the other hand, according to the thin-plate glass substrate laminate described in Patent Document 7, it is difficult to cause the above-described strain defects due to bubbles or the like interposed between the glass substrates. Further, the thin glass substrate and the supporting glass substrate can be peeled off. Further, the problem that the adhesive remains on the thin glass substrate after peeling can be solved. However, even if a film of an adhesive such as a polarizing film or a retardation film is attached to the surface of the resin-attached layer of the thinned glass substrate after peeling, the adhesive strength may be weak and peeled off. In particular, when the adhesive in a polarizing film or the like is acrylic, it is easily peeled off. The present inventors have made an effort to study the cause of the problem, and it is considered that the laminated body described in Patent Document 7 does not appear to have a polyoxyxene resin layer on the thinned glass substrate after peeling. Any one of the resin layer (for example, a compound which is a part of a substance which forms a resin layer and which is deposited on the surface of the resin layer, etc., which is also referred to as a transfer product), Foreign matter such as metal dust or oil caused by the manufacturing process is rarely adhered to the surface of the thin glass substrate. Further, the inventors have found that heat, electromagnetic, mechanical, and chemical properties can be caused not to the thin glass substrate and the member for the display device attached thereto. The method of removing the above foreign matter from the shellfish. When the thin glass substrate is a part of the panel for the display device, a component for the display device such as a thin film transistor, an organic device, or a color light guide plate is formed on the surface opposite to the separation surface of the thin glass substrate. 'x, since it is necessary not to cause the mussel injury as described above, so there are cases where the two thin glass substrates are encapsulated by the sealant. 147170. Doc 201113155 The present invention is completed by the above problems. That is, an object of the present invention is to provide a method for producing an electronic device in which an electronic device having a support including a substrate including a member for an electronic device, a resin layer, and a support substrate is peeled off from the resin layer and After the electronic device is obtained by the support of the support substrate, the substrate, the electronic device member (for example, a thin film transistor, an organic EL device, or a color filter) are removed from the above by thermal, electromagnetic, mechanical, and chemical damage. As a result, a foreign matter on the main surface of the substrate for the electronic device can be firmly adhered to the surface of the resin-attached substrate of the substrate after peeling, such as a film of an adhesive film such as a polarizing film or a retardation film. Means for Solving the Problems The inventors of the present invention have made intensive studies to solve the above problems, and have completed the present invention. The present invention relates to the following (1) to (8). (1) A method of manufacturing an electronic device, comprising: a peeling step of peeling off a support including a support substrate and a resin layer from an electronic device having a support, and obtaining an electronic device including a member for an electronic device and a substrate, the support In the electronic device, a resin layer is adhered to the i-th main surface of the substrate including the first main surface and the second main surface and including the electronic device member on the second main surface, and the resin layer contains a peelable surface. The first main surface is fixed to the support substrate including the first main surface and the second main surface; and the removing step removes foreign matter adhering to the first main surface of the substrate in the electronic device. (2) The method of producing an electronic device according to (1) above, wherein the resin layer is a polyoxynated resin layer. (3) The method of manufacturing an electronic device according to (1) or (2) above, wherein the above tree 147170. Doc 201113155 The adhesive strength of the first main surface of the substrate before the peeling surface of the adhesive layer is adhered to the first major surface of the substrate is f〇, and the first major surface of the substrate in the electronic device obtained after the removing step is obtained When the adhesion strength is f, . (4) The method of manufacturing an electronic device according to any one of (1) to (3) wherein the removing step is performed by irradiating the first main surface of the substrate with electropolymerization to remove the foreign matter. (5) The method for producing an electronic device according to any one of the above (1), wherein the removing step is a method of removing the foreign matter by using a chemical solution containing an acid or a base. (6) The method for producing an electronic device according to any one of the above (1), wherein the removing step is performed by using a chemical solution containing a solvent having a solubility parameter of 7 to 15 to remove the foreign matter. (7) The method of manufacturing an electronic device according to (5) or (6) above, which is the following step. Further, the foreign matter is removed by ultrasonic vibration. The method of manufacturing an electronic device according to any one of the above (1) to (7), wherein the two or more removal steps are included. According to the present invention, there is provided a method and method for manufacturing an electronic device, which is an electronic device including a substrate including a member for an electronic device such as a display device, a resin layer, and a supporting support layer. After the electronic device is obtained by peeling off the support including the resin layer and the support substrate, the substrate and the electronic device are not used (for example, a thin film transistor, an organic EL element, a color filter, heat generation, electromagnetic, mechanical, and chemical). The foreign matter adhering to the main surface of the substrate for the electronic device is removed by the damage, and as a result, the film of the adhesive film such as the polarizing film or the retardation film can be firmly attached to the peeled substrate 147170. Doc 201113155 The surface with the resin layer. [Embodiment] The present invention will be described. The electronic device manufacturing method of the present invention (hereinafter also referred to as "the electronic device manufacturing method of the present invention") includes a peeling step of peeling off a support including a support substrate and a resin layer from an electronic device having a support, and obtaining an electronic device. The electronic device of the component and the substrate, the electronic device with the above support. a resin layer is adhered to the first main surface of the substrate including the first main surface and the second main surface and including the electronic device member on the second main surface, and the resin layer contains a peelable surface, and the resin layer is fixed to the first surface. a first main surface of the support substrate of the second main surface and the second main surface; and a removing step of removing foreign matter adhering to the first main surface of the substrate in the electronic device. In the following, the electronic device with the support for the peeling step in the method for manufacturing an electronic device of the present invention is also referred to as "the electronic device with the support of the present invention", and the electronic device with the support is: a resin layer is adhered to the first main surface of the substrate including the second main surface and the second main surface, and the resin layer includes a peelable surface fixed to the support substrate including the second main surface and the second main surface 1 main face. In the following, the electronic device with the support used in the present invention includes the i-th main surface and the second main surface, and includes the electronic device member on the second main surface. A resin layer is adhered to the i-th main surface of the substrate, and the resin layer contains a peelable surface which is fixed to the second main surface of the support substrate including the first main surface and the second main surface. That is, the electronic device with the support includes the member for the electronic device, the substrate, and 147170. Doc 201113155 Resin layer and supporting substrate, and these layers are laminated in this order. Further, the electronic device includes the electronic device member and the substrate, and the electronic device member is formed on the second main surface of the substrate. The electronic device with the support may be in the order of the substrate, the resin layer, and the support substrate. The laminated body after lamination is formed by laminating two members of the electronic device, that is, the support substrate, the resin layer, the substrate, the electronic device member, the substrate, the resin layer, and the support substrate are laminated in this order. Here, the electronic device refers to an electronic component such as a panel for a display device, a solar cell, a thin film secondary battery, or a semiconductor wafer on which a circuit is formed. The panel for a display device includes a liquid crystal panel, an organic EL panel, a plasma display panel, a field emission panel, and the like. Hereinafter, a panel for a display device including a glass substrate and a support substrate will be described in detail as one of the electronic devices in the present invention. In the following, the method of manufacturing the panel for a display device is referred to as "the panel manufacturing method of the present invention", and the panel for the display device with the support is referred to as "the panel of the support of the present invention". First, the thin glass substrate in the panel of the support of the present invention will be described. The thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, and the like of the thin glass substrate are not particularly limited. For example, it can be used with a display device such as a previous LCD' LED. The same glass substrate is used. The thickness of the thin glass substrate is preferably less than Q7, preferably 〇5 147170. Doc „ 201113155 mm or less, more preferably 〇·4 fine. Also, the thickness of the thin glass substrate is 0. More than 05 mm is preferred. The preferred one is more than 0. 1 mm or more. The shape of the thin glass substrate is not limited, but a rectangular shape is preferred. Here, the term "rectangular" means a substantially rectangular shape, and includes a shape formed by cutting the corner of the peripheral portion (after the chamfering angle). The size of the thin glass substrate is not limited, for example, when it is rectangular, it may be 100 to 2000 mm x 100 to 2000 mm, preferably 5 〇〇 to 1 〇〇〇 _ 500 〜 1 〇〇〇 mm 〇 毛 毛 毛 β ρ In the case of the above thickness and size, the thin glass substrate and the support can be easily peeled off. The characteristics such as the heat shrinkage ratio, the surface shape, and the chemical resistance of the thin glass substrate are not particularly limited. Depending on the type of display device to be manufactured. When the heat shrinkage rate is small, it is preferable. Specifically, the linear expansion coefficient as the index of heat shrinkage is preferably 500 x 丨〇 -7 / t or less, preferably 3 〇〇χ丨〇 Vc or less, and more preferably 2 〇 0 x 1 (vrc or less). More preferably, it is 1〇〇xi〇-Vc below, and further preferably 45x1 〇-7/. 〇 below. In the present invention, the coefficient of linear expansion is defined in JiS R3 102 (1995). The composition of the glass material of the thin glass substrate may be the same as the previously known alkali glass or alkali-free glass containing an alkali metal oxide, wherein the alkali-free glass is particularly small from the viewpoint of a small heat shrinkage rate. Preferably, in the panel of the supporting body of the present invention, in the above-mentioned thin glass substrate, the 147170. Doc •12· 201113155 2 The main surface contains components for display devices. The term "a member for a display device" refers to a light-emitting layer, a protective layer, a TFT array (hereinafter referred to as an array), a color filter, a liquid crystal, and a photoreceiving layer on a surface of a glass substrate for a display device such as an LCD or an OLED. A transparent electrode such as ITO (Indium Tin Oxide), various circuit patterns, and the like. The type of the member for the display device on the second main surface of the thin glass substrate is not particularly limited. A panel for a display device is formed by the member for a display device and the thin glass substrate. Next, the supporting glass substrate in the panel of the support of the present invention will be described. In the panel with a support of the present invention, a support glass substrate to which a resin layer is fixed is provided as a support on the i-th main surface of the thin glass substrate. The support glass substrate is adhered to the thin glass substrate via the resin layer to enhance the strength of the thin glass substrate. The thickness, shape, size, physical properties (heat shrinkage ratio, surface shape, chemical resistance, etc.), composition, and the like of the glass substrate are not particularly limited. The thickness of the supporting glass substrate is not particularly limited, but the panel of the support of the present invention must be a thickness that can be handled by the current production line. For example, the thickness should be 0. 1~1. 1 mm ' is preferably 0 3 to 〇 8 mm, and more preferably 0. 4~0. 7 mni. For example, the current production line is designed to handle substrates with a thickness of 05 mm, so when the thickness of the thin glass substrate is O. When i mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer. 4 mm. Also, current 147170. Doc •13- 201113155 The most common line is designed to handle glass substrates with a thickness of 0·7 mm. Therefore, for example, when the thickness of the thin glass substrate is 04 mm, the thickness of the supporting glass substrate and the thickness of the resin layer are made. Add up to 〇3 mm. The relationship between the thickness of the supporting glass substrate and the relative thickness of the thin glass substrate is not limited, and the thickness of the supporting glass substrate may be thicker than the thickness of the thin glass substrate, and the thickness of the supporting glass substrate may be thinner than the thickness of the thin glass substrate. The shape of the substrate is not limited, but a rectangular shape is preferred. Here, the term "rectangular" means a substantially rectangular shape, and includes a shape formed by cutting the corner of the peripheral portion (after the chamfering angle). The size of the supporting glass substrate is not limited, but is preferably the same as that of the above-mentioned thin glass substrate, and is preferably slightly larger than the above-mentioned thin glass substrate. Specifically, it is preferable that the size of the longitudinal direction or the lateral direction is 〇 〇 5 to 1 分别, respectively. The reason is that when the panel for a display device is manufactured, the end portion of the thin plate glass substrate can be easily protected from contact with an alignment device such as a positioning pin, and the thin glass substrate and the supporting glass substrate can be more easily performed. Stripping. The coefficient of linear expansion of the supporting glass substrate may be substantially the same as that of the above-mentioned thin glass substrate. If it is substantially (4), it is preferable that the warpage is hard to occur on the thin glass substrate or the supporting glass substrate when the panel manufacturing method of the present invention is carried out. The difference between the linear expansion coefficients of the 4-plate glass substrate and the supporting glass substrate is preferably 300x10 / C or less, preferably looxio. Below Vc, the better is 5〇xl〇-7/°C or less. 147170. Doc 201113155 The composition of the glass material supporting the glass substrate is, for example, the same as that of alkali glass or alkali-free glass. Among them, the non-alkali glass is preferred from the viewpoint of a small self-heat shrinkage ratio. In the embodiment of the present invention, the substrate is a thin glass substrate, but the present invention is not limited thereto. From the viewpoint of industrial availability, a glass plate, a tantalum wafer, a metal plate, a plastic plate or the like can be presented as a preferred example. When a thin glass plate (thin plate glass substrate) having a small thickness is used as the substrate, the composition of the thin glass substrate can be the same as that of the glass or the glass. Among them, from the viewpoint of a small heat shrinkage ratio, an alkali-free glass is particularly preferable. When a plastic plate is used as the substrate, the type thereof is not particularly limited. For example, in the case of a transparent substrate, it can be exemplified by: polyethylene terephthalate, bismuth sulphate, poly-rhothic acid, and poly-mystery. Resin, polycaephthalic acid ethylene glycol resin, polyacrylic resin, polyoxymethylene resin, transparent fluororesin, and the like. In the case of the opaque substrate, a polyimide resin, a fluororesin, a polyamide resin, an aromatic polyamide resin, a polyether ketone resin, a polyetheretherketone resin, various liquid crystal polymer resins, and the like can be exemplified. When a metal plate is used as the substrate, the type thereof is not particularly limited, and examples thereof include a non-mineral steel plate and a copper plate. The heat resistance of the substrate is not particularly limited. However, when forming a TFT array or the like for a member for a display device, heat resistance is preferably high. Specifically, the above 5% heating weight loss temperature is preferably 300 °C or higher. Preferably it is 350 ° C or more. In this case, any of the above glass sheets is suitable from the viewpoint of heat resistance. 147170. Doc 15 201113155 From the viewpoint of heat resistance, as a preferred plastic sheet, polyimine resin, fluororesin, polyamide resin, aromatic polyamide resin, polyether maple resin, polyfluorene ketone resin can be exemplified. , screaming for ketone resin, polyethylene naphthalate resin, various liquid crystal polymer resins, and the like. Further, the substrate may be a laminate in which different materials such as a glass plate, a silicon wafer, a metal plate, and a plastic plate are laminated. For example, a laminate in which a different type of substrate is laminated via a resin layer such as a laminate in which a glass plate, a resin layer, and a plastic plate are laminated in this order; or a glass plate or a plastic glass plate is used. This sequential layer is used as a laminate of a substrate which is formed by laminating different types of sheets. Further, a laminate of two or more glass sheets may be used as a substrate, or two or more plastic sheets may be used as a substrate, and a laminate of the same type of sheet may be used as a laminate of the substrate. . Further, in the embodiment of the present invention, the support substrate is a support glass substrate using a glass plate, but the present invention is not limited thereto. From the viewpoint of industrial availability, a glass plate, a tantalum wafer, a metal plate, a plastic plate or the like can be presented as a preferred example. When a glass plate is used as the support substrate, the thickness, shape, size, physical properties (heat shrinkage, surface shape, chemical resistance, etc.), composition, and the like of the support glass substrate are not particularly limited. The thickness of the supporting glass substrate is not particularly limited, but the panel for the display device with the support must be a thickness that can be handled by the current production line. For example, the thickness should be 0. 1~1. 1 is 0. 4~0. 7 m m. Rnm, preferably 〇_3~0·8 mm, more preferably mm 〇 147170. Doc -16 - 201113155 For example, 'the current production line is designed to handle substrates with a thickness of 5 _min', so the thickness of the thin glass substrate is 0. At 1 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer to be 〇4 mm. Moreover, the most common production line is designed to have a thickness of 0. The 7 mm glass substrate is processed by the processor. Therefore, for example, the thickness of the thin glass substrate is 0. At 4 mm, the thickness of the supporting glass substrate is added to the thickness of the resin layer to be 〇 3 mm. The thickness of the supporting glass substrate is preferably thicker than the above-mentioned thin glass substrate. Next, the resin layer in the panel of the support of the present invention will be described. The resin layer is fixed to the first main surface of the support glass substrate. Further, the resin layer is adhered to the first main surface of the thin glass substrate, but can be easily peeled off. In other words, the resin layer is bonded to the first main surface of the thin glass substrate by a certain degree of bonding force, and the bonding force is bonded to the extent that the thin glass substrate can be easily peeled off at the time of peeling. In the present invention, the property of easily peeling off the surface of the resin layer is referred to as peelability. In the panel of the support of the present invention, it is preferable that the first main surface of the resin layer and the thin glass substrate are not adhered by an adhesive force such as an adhesive, but by solid molecules. The force caused by the tile force, that is, the adhesion is attached. On the other hand, the bonding strength of the resin layer to the first main surface of the supporting glass substrate is relatively higher than the bonding force to the i-th main surface of the thin glass substrate. In the present invention, the bonding of the i-th main surface of the thin glass substrate is referred to as adhesion, and the bonding of the first main surface of the supporting glass substrate is referred to as fixing. The thickness of the resin layer is not particularly limited, and is preferably 00 μη1, preferably 147170. Doc 17 201113155 is 5 to 30 μm, and more preferably 7 to 20 μm, because the thickness of the resin layer is in the above range, and the first main surface of the thin glass substrate and the resin layer are sufficient. Further, this is because the occurrence of strain defects in the thin glass substrate can be suppressed even if air bubbles or foreign matter are interposed. Further, if the thickness of the resin layer is too thick, it takes time and material to be formed, which is uneconomical. Further, the resin layer may contain two or more layers. In this case, "thickness of the resin layer" means the total thickness of all the layers. Further, when the resin layer contains two or more layers, the types of the resins forming the respective layers may be different. The surface tension of the resin layer with respect to the resin layer of the second major surface of the thin glass substrate is preferably 3 〇 mN/m or less, preferably 25 mN/m or less, more preferably 22 mN/m or less. This is because, in the case of the surface tension described above, it is more easily peeled off from the first main surface of the thin glass substrate, and the adhesion to the first main surface of the thin glass substrate is also sufficient. Further, the resin layer preferably contains a material having a glass transition point lower than room temperature (about 25 c > c) or having no glass transition point. The reason for this is that it can be a non-adhesive resin layer, and has higher peelability, and is more easily peeled off from the first main surface of the thin glass substrate, and is also sufficiently adhered to the first main surface of the thin glass substrate. . Further, the tree layer is preferably heat resistant. The reason for this is that, in the method for producing a panel of the present invention, for example, when the member for the display device is formed on the second main surface of the thin glass substrate, the thin glass substrate, the resin layer and the support 147170. Doc -18- 201113155 (4) Laminated body made of glass substrate for heat treatment. If the elastic modulus of the enamel layer is too high, the adhesion to the first main surface of the thin glass substrate will be lowered. Further, if the modulus of elasticity is too low, the peeling property will be lowered. The kind of the resin forming the resin layer is not particularly limited. For example, an acrylic resin, a polyolefin resin, a polyamino phthalate resin, and a polyxanthene resin can be mentioned. It can be used by mixing several types of resins. Among the above groups of resins, polyfluorene resins are preferred. The reason for this is that the polyoxynoxy resin is excellent in heat resistance and is excellent in the peeling property to the thin glass substrate. Further, when the polyacrylic resin layer is formed by curing the curable polyoxynoxy resin on the first main surface of the supporting glass substrate, the condensation reaction with the decyl alcohol group of the first main surface of the supporting glass substrate is carried out. It is easy to fix on a supporting glass substrate. For example, even if the polyoxyxene resin layer is treated at about 3 〇〇 to 4 Torr (about rc for about 丄 hours, the peeling property is not substantially deteriorated, and this is preferable. Further, the resin layer is particularly preferable in the polysiloxane resin. It is preferable to use a hardened polyfluorene hardened product for release paper, and a polyfluorene type for release paper is used as a main component of a linear diterpene-based polyoxynitride in a molecule. It is preferred that the resin layer formed by curing the composition containing the main component and the crosslinking agent on the surface of the surface of the supporting glass substrate has excellent releasability, such as a photopolymerization initiator. Further, since the resin layer has high flexibility, even if foreign matter such as bubbles or dust mustard is mixed between the thin glass substrate and the resin layer, strain defects can be suppressed in the thin glass substrate. The release paper is classified into a condensation reaction type polysulfide, an addition reaction type polyoxygen, an ultraviolet curing type polyoxygen or an electric 147170 according to a hardening mechanism thereof. Doc -19· 201113155 Sub-bundled poly 11 oxygen, but can be used. Among these, an addition reaction type polyoxane is preferred. The reason for this is that the ease of the hardening reaction, the degree of peeling property when the resin layer is formed are good, and the heat resistance is also high. Further, it is also possible to use either a solvent type, an emulsion type or a solvent type in the form of (4) oxygen for the release paper. Among these, a solventless type is preferred. The reason is that it is excellent in terms of productivity and environmental characteristics. Further, the reason for this is that when the resin layer is formed, that is, when the curing is performed, that is, when the heat curing, the strand curing, or the electron beam curing is performed, the solvent which causes foaming is not contained, so that it is difficult to leave bubbles in the resin layer. In addition, as a general-purpose brand name or model of the polyethylene oxide for the release paper, KNS_320A and Ks_847 (all manufactured by Shin-Etsu Silicones Co., Ltd.) and TpR67〇〇 are mentioned. (GE Toshiba Silic〇nes polyoxyl company), vinyl polyoxyl "8500" (. Arakawa Chemical Industry Co., Ltd., and a combination of thiol hydrogenation polysulfide "12031" (manufactured by Arakawa Chemical Industry Co., Ltd.); ) a combination of methyl hydrogenated polyoxane "12031" (manufactured by Arakawa Chemical Industries Co., Ltd.); vinyl polyoxyl "1 1365" (manufactured by Arakawa Chemical Industries Co., Ltd.) and methyl hydrogenated polyoxyalkylene oxide "12〇31" (available from Arakawa Chemical Industry Co., Ltd.). Further, 'KNs_320A, KS-847 and TPR6700 are preliminarily containing polyoxane of a main component and a crosslinking agent. Further, the polyfluorene oxide resin forming the resin layer preferably has a property that the component in the polyxanthoxy resin is difficult to transfer to the thin glass substrate, that is, it is preferable to have an oligomeric germanium oxygen 147170. Doc •20· 201113155 Transferability. Next, the panel of the attached support of the present invention will be described using a drawing. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing a state of a panel of a support according to the present invention. In Fig. 1, the display device panel 16 includes a layered display device member 14 and a thin glass substrate 12, which are laminated. Here, the display device member 14 is formed on the second main surface of the thin glass substrate 12. Further, the first main surface of the thin glass substrate 12 is adhered to the surface of the resin layer 18 fixed to the is surface of the supporting glass substrate 19, and the panel 10 with the support of the present invention is formed. In the panel 1 of the support of the present invention as shown in Fig. 1, the thin glass substrate 12, the resin layer 18, and the supporting glass substrate 19 are substantially the same in the plane direction. Fig. 2 is a schematic front view showing another aspect of the panel of the support of the present invention, and Fig. 3 is a cross-sectional view (a schematic cross-sectional view) taken along line A-A'. In FIG. 2 and FIG. 3, the display device panel 26 includes a layered display device member 24 and a thin glass substrate 22, and the display device member 24 is formed on the thin glass substrate 22 2 main faces. Further, the first main surface of the thin glass substrate 22 is adhered to the resin layer 28 fixed to the first main surface of the supporting glass substrate 29, and the panel 20 with the support of the present invention is formed. In the panel 20 with the support of the present invention as shown in FIG. 2 and FIG. 3, the main surface area of the support glass substrate 29 is larger than that of the thin glass substrate 22, and the surface direction of the thin glass substrate 22 is The outer edge does not support the glass base 147170. Doc -21 - 201113155 The outer edge of the board 29 extends. Further, in the panel 2 of the support of the present invention as shown in Figs. 2 and 3, the area of the surface of the resin layer 28 (the surface in contact with the first main surface of the thin glass substrate 22) is Hereinafter, 'the surface area in the resin layer' is also referred to as the "surface area"), and the area of the first main surface of the thin glass substrate 22 is larger. The surface area of the resin layer 28 is smaller than the area of the first main surface of the thin glass substrate 22, and corresponds to a portion where the gap portion 25 to be described later is formed. Further, a portion of the first main surface of the thin glass substrate 22 that is not in contact with the resin layer 28, and a portion of the supporting glass substrate 29 that is opposite to the opposite side of the glass substrate 29 are formed to be connected to the end face of the panel 20 of the support of the present invention. The gap portion 25 of (γι, γ2). After the gap portion 25 is formed, it is preferable that the thin plate glass substrate and the resin layer can be more easily peeled off in the peeling step of the panel manufacturing method of the present invention to be described later. Further, the depth of the gap portion 25 is preferably 1 mm or more, preferably 3 mm or more, and more preferably 5 mm or more. Further, it is preferably 15 mm or less, preferably 10 mm or less. This is because the thin-plate glass substrate and the resin layer can be more easily peeled off in the peeling step of the panel manufacturing method of the present invention to be described later. In addition, the "depth of the gap portion" means the length from the end surface (γ 2) of the thin plate glass substrate along the vertical direction of the end surface to the end surface of the resin layer. In the case of Figures 2 and 3, it refers to the length of the indicated portion. Further, as shown in FIG. 5, which will be described later, the length from the end face of the thin glass substrate along the vertical direction of the end face to the end face of the resin layer is based on the end face of the thin glass substrate as the starting point. 147170. Doc •22- 201113155 At the same time, the maximum length is “the depth of the gap”. Further, the position of the gap portion 25 may be a central portion of one side of the rectangular thin glass substrate 22 as shown in Fig. 2, or may be one of the sides of the rectangular thin glass substrate 22 as shown in Fig. 4. Further, it may be a case where one of the corners of the rectangular thin glass substrate 22 shown in Fig. 5 is substantially chamfered. Further, Fig. 4 and Fig. 5 are schematic front views showing still another aspect of the face plate of the support of the present invention. Further, as shown in the schematic cross-sectional view of Fig. 6, the panel of the support of the present invention may be such that the main faces of the member 34 for display device are sandwiched between the thin glass substrates (32a, 32b) and the resin. The layers (38a, 38b) and the laminated body supporting the glass substrates (39a, 39b). This aspect is also a panel of the support of the present invention which can be treated by the panel manufacturing method of the present invention. Next, a method of manufacturing the panel with the support of the present invention will be described. The method for producing the panel of the support according to the present invention is not particularly limited, but preferably includes the step of forming a resin layer on the first main surface of the supporting glass substrate to form a resin layer containing a releasable surface, and a step of adhering, Laminating the thin glass substrate and the supporting glass substrate, the peeling surface of the resin layer is adhered to the first major surface of the thin glass substrate; and the member forming step for the display device is on the second main surface of the thin glass substrate A member for a display device is formed thereon. The method for producing a thin glass substrate and a supporting glass substrate in the method for producing a panel with a support according to the present invention is not particularly limited. For example, it can be produced by a previously known method. For example, after dissolving a previously known glass raw material to form a glazed glass, it can be floated, melted, or flow-through 147170. Doc • 23- 201113155 (slot method), redraw method, etc. are obtained by forming into a plate shape. The resin layer forming step in the method for producing a panel with a support of the present invention will be described. The method of forming the resin layer on the surface (the first major surface) of the supporting glass substrate is not particularly limited. For example, a method of adhering a film-like resin to a surface of a supporting glass substrate can be mentioned. Specifically, a method of surface modification treatment for imparting a high adhesion to the surface of the film is carried out, and this is followed by supporting the first main surface of the glass substrate. As a treatment method of the surface modification, a chemical method (primer treatment) which chemically enhances the adhesion force such as a decane coupling agent, or an increase in surface active group such as a flame treatment can be exemplified. Physical method; a mechanical method such as sandblasting to increase the trapping force by increasing the surface roughness of the surface. Further, for example, a method 1 of applying a resin composition for forming a resin layer to the i-th main surface of a supporting glass substrate by a known method is a known method, a spraying method, a die coating method, a spin coating method, and the like. Dip coating method, roll: method, bar coating method, screen printing method, gravure coating method. It can be appropriately selected from the above methods depending on the kind of the composition of the tree. For example, in the case of using a solventless type release paper using polysulfuric acid as the resin (tetra), a die coating method, a spin coating method or a screen printing method is preferably employed. Further, in the case of manufacturing a panel including the support having the gap portion as described with reference to Figs. 2 to 5, it is preferable to apply a resin composition to the portion where the gap portion is formed. The so-called obscuration refers to the following method: ' 147170. Doc • 24· 201113155 When the resin composition is applied, a re-peelable film or the like is attached to a portion where the gap portion is formed, and the resin composition is not applied to the portion, and then the film is peeled off. Further, when the resin composition is applied to the second main surface of the supporting glass substrate, the coating amount thereof is preferably! ~100g/m2, preferably 5~2〇g/m2. In another example, when a resin layer is formed by addition reaction type polyoxo, a known method such as the above-described spraying method includes containing a linear dimethyl polyfluorene in a molecule. The resin composition of the polyoxane (main agent), the crosslinking agent, and the catalyst of the oxyalkylene is applied onto the first main surface of the supporting glass substrate, and then heat-hardened. The heat-hardening condition differs depending on the amount of the catalyst to be mixed. For example, when 2 parts by weight of the platinum-based catalyst is blended with respect to the total amount of the main agent and the crosslinking agent, 2 parts by weight of the platinum-based catalyst is placed in the atmosphere at 50 C. The reaction is carried out at 250 ° C, preferably 1 〇〇 t 2 2 〇〇 β (: τ is carried out and the reaction time is 5 to 60 minutes at this time, preferably 〇 minute. Since it is formed to have a low The polyoxonium-transporting polyoxyxene resin layer is used, so that the hardening reaction is carried out as much as possible so that the unreacted polysulfide component does not remain in the polyoxynoxy resin layer, and the reaction temperature and reaction are as described above. At the time, it is preferable that the unreacted polysulfide component remains in the poly-stone oxide layer, and when the reaction time is too long compared to the above reaction time, or the reaction temperature is too high, At the same time, the oxidative decomposition of the polyoxynene resin is caused, and a low-knife amount of the poly-stone component is formed, so that the oxygen transfer property of the poly-stone can be changed. The hardening reaction is carried out as much as possible so that the polyoxy-resin layer does not remain. There are unreacted polyoxo components' Peeling resistance after the heating treatment is good, it is preferred. 147,170. Doc •25- 201113155 By using the above method to support the glaze, the resin layer is formed on the first main surface of the slab, and the substrate is smeared on the surface layer of the resin layer. Further, for example, when a resin layer is produced by using polyfluorene oxide for a release paper, it is applied to a support glass substrate! After the release paper on the main surface is hardened by polyglycol oxygen to form a polysulfide resin layer, the thin glass substrate is laminated on the surface of the polysilicate resin supporting the glass substrate in the adhesion step. The cured resin of the polyoxyxylene resin is chemically bonded to the supporting glass substrate by heat-hardening the release paper with polyoxymethylene. Further, depending on the effect, the polyoxyxene resin layer is bonded to the supporting glass substrate. Under these actions, the polyoxyxene resin layer is firmly fixed to the first main surface of the supporting glass substrate. The adhesion step in the method of manufacturing the panel with the support of the present invention will be described. In the adhesion step, the first main surface of the thin glass substrate and the supporting glass substrate having the resin layer formed on the second main surface are laminated, and the peeling surface of the resin layer is adhered to the thin glass substrate. The steps of the i-th main face. The peeling surface of the first main surface of the thin glass substrate and the resin layer is preferably bonded by a force, i.e., a close force, which is caused by the van der Waals force between the opposing solid molecules. In this case, the state in which the supporting glass substrate and the thin glass substrate are laminated can be maintained. The method of laminating the above-mentioned thin glass substrate with the above-mentioned supporting glass substrate to which the resin layer is fixed on the first main surface is not particularly limited. For example, it can be carried out using a known method. For example, the following method can be mentioned: In a normal environment, after laminating a thin glass substrate on the surface of a resin layer, a roll or a punch 147170 is used. Doc -26- 201113155 Crimp the resin layer to the thin glass substrate. It is preferable to use a roll or a press to press, whereby the resin layer and the thin glass substrate are further adhered. Further, it is preferable to use a pressure bonding using a roll or a press to easily remove air bubbles mixed between the resin layer and the thin glass substrate. When the pressure bonding is carried out by a vacuum lamination method or a vacuum press method, it is preferable to suppress the incorporation of air bubbles and ensure good adhesion. The pressure bonding is carried out under vacuum, whereby the air bubbles do not grow by heating even when a small amount of air bubbles remain, and it is difficult to cause strain defects of the thin glass substrate. In the case of the adhesion step, when the thin glass substrate is laminated on the peeling surface of the resin layer supporting the glass substrate, the surface of the thin glass substrate should be sufficiently cleaned and laminated in an environment having high cleanliness. Even if foreign matter is mixed between the resin layer and the thin glass substrate, the flatness of the surface of the thin glass substrate is not affected by the deformation of the resin layer, but the higher the cleanliness, the better the flatness, so the cleanliness is high. It is better. In this way, the second layer of the thin-plate glass substrate in the thin-plate glass laminate is obtained after the glass laminate having the thin glass substrate, the resin layer, and the supporting glass substrate (hereinafter referred to as "thin-glass laminate") is obtained. A member for a display device is formed on the surface. When forming a member for a display device ^ It is also advisable to grind the second main surface of the thin glass base phase to improve the flatness. The member for the display device is not particularly limited - two; and the array or the color line may, for example, be a moon-receiving electrode containing an OLED, a hole injection layer, a hole transmission layer, a light-emitting layer, and an electron transport layer. 147170. Doc • 27·201113155 A description will be given of a member forming step for a display device in a method of manufacturing a panel with a support according to the present invention. The member forming step for the display device is a step of forming a member for a display device on the second main surface of the thin glass substrate on the thin glass laminate. The method of forming the member for the display device described above is not particularly limited, and the method known in the prior art is the same as the method of forming the member for the display device. For example, when manufacturing an LCD as a display device, a step of forming a pattern on a previously known square glass substrate, forming a color filter, and a glass substrate on which an array of glass substrates and colored phosphors are formed may be formed. The step of bonding (array. The four steps of the color grading film bonding step are the same. More specifically, examples of the treatment carried out in the steps include pure water washing, drying, film formation, anti-rice coating, _ ^ development, (four), and anti-(four) R removal. Further, as a step to be performed after performing the step of arranging the color filter of the array coloring film, there are a liquid crystal, a main entrance, and a sealing step of performing a population after performing the process, and the steps are performed in steps such as ^ deal with. / The main ^ to manufacture. In the case of a coffee, as a step for forming a sister structure on the second main surface of the thin glass base phase, the method includes: a step of a bright electrode, a base _妒: snow: |=| 4 λ a π η. Hole transport layer. Luminous layer. The steps of the steps of the electron transport layer, and the steps of the sealing step, etc., are taken as the processing carried out in the steps, specifically, for example, _ . J enumeration. Film formation treatment, steam treatment, and subsequent treatment of the sealing plate. ‘, 147170. Doc • 28- 201113155 In this way, the panel of the support of the present invention can be manufactured. Next, the panel manufacturing method of the present invention will be described. The method for producing a panel of the present invention is not particularly limited, but preferably includes a peeling step of peeling the support comprising the support glass substrate and the resin layer from the panel of the support; and a removing step of removing the adhesion The foreign material derived from the transfer material of the resin layer on the first main surface of the thin glass substrate in the panel for a display device obtained by the peeling step. The peeling step in the panel manufacturing method of the present invention will be described. The peeling step is a step of peeling off the support including the support glass substrate and the resin layer from the panel for a display device with the support. The peeling method is not particularly limited as long as it can be peeled off without causing thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate or the member for a display device formed on the second main surface thereof and the sealant. Further, it is preferable to support the glass substrate without damage, and more preferably, it is a method in which the resin layer having releasability fixed to the first main surface of the supporting glass substrate is not damaged. As a specific peeling method, for example, a sharp cutter or a mixed fluid of sprayed water and compressed air may be inserted into the interface between the thin glass substrate and the resin layer to perform peeling. Preferably, the panel side substrate of the display device is vacuum-adsorbed on the disk by using the support glass substrate side of the panel of the support body as the upper side and the display device panel side as the lower side. When the double-layer layer has a supporting glass substrate, it is sequentially performed, and in this state, a mixed fluid of water and compressed air is sprayed on the boundary between the thin-plate glass substrate and the resin layer of the panel with the support, and the supporting glass is pulled up vertically upward. Base 147170. Doc •29· 201113155 The end of the board. In this way, an air layer is sequentially formed on the boundary, and the air layer is extended to the entire surface of the boundary, and the support can be easily peeled off (when the two main area layers of the panel with the support are supported by the glass substrate, one by one The above peeling step is repeated in the surface. The support stripped by the above peeling step can be reused. For example, when the above resin layer is a polyoxyxylene resin layer, the more the polyoxynoxy resin layer in the support after peeling has the oligomeric oxime oxygen transfer property, the more the glass laminated body can be suppressed from being heated. The tendency of peeling failure due to an increase in peel strength at the time of the step. Therefore, it can be reused better. The removal step in the panel manufacturing method of the present invention will be described. The removing step is a step of removing foreign matter adhering to the first main surface of the thin glass substrate in the panel for a display device. As described above, the film of the adhesive film such as a polarizing film or a retardation film is attached to the second main surface of the thin glass substrate (the surface to be adhered to the resin layer) in the panel for a display device obtained after the peeling step. There are also cases where the adhesion strength is weak and peeling off. The inventors of the present invention have studied the cause of the problem, and the reason is that the transfer material derived from the resin layer, the dust mustard scattered in the air, and the foreign matter such as a metal piece or an oil due to the manufacturing process are rarely attached to the first 1 main face. In addition, the inventors of the present invention have found a method of removing the foreign matter by thermal, electromagnetic, mechanical, and chemical damage to the thin glass substrate and the member for the display device formed on the second main surface of the thin glass substrate. As used above, the term "so-called foreign matter" means any substance (i.e., a transfer material) derived from the above-mentioned resin layer, dust particles scattered in the air, and 147170. Doc •30- 201113155 A metal sheet or engine oil, etc., which is attached to a thin glass substrate attached to the κ surface of the thin glass substrate. As the transfer product, for example, a compound which forms a resin layer, which adheres to the ith main surface of the thin glass substrate, adheres to the first! The main face. Further, for example, a low molecular compound which is a part of a substance forming a resin layer and which is deposited on the surface of the resin layer and which is present may be mentioned. The above transfer product will be specifically described. For example, when the resin layer contains polyfluorene oxide, since the first major surface of the thin glass substrate is adhered to the polyoxyn resin layer fixed to the first main surface of the supporting glass substrate, the lower molecular weight polycondensation can be considered. The oxygen compound adheres to the first main surface of the thin glass substrate by the diffusion effect in the resin layer. Here, when the glass laminate is subjected to a heating step, it is difficult to remove the polyoxygen compound from the first main surface of the thin glass substrate by using a solvent or the like obtained by dissolving the polysiloxane. On the other hand, when the substrate is not a thin glass substrate but a substrate containing a resin such as polyimide or the like (hereinafter, also referred to as a resin substrate), after the resin substrate is peeled off from the support, the dissolved polyoxo compound can be used. The obtained solvent or the like removes the polyfluorene oxide compound adhering to the first main surface of the resin substrate. In general, an adhesive in a polarizing film or the like is made of acrylic, and is adjusted so as to obtain an appropriate adhesive strength to the surface of the hydrophilic glass substrate. On the other hand, if the water-repellent polyoxymethylene compound adheres to the surface of the glass substrate, the adhesion strength of the acrylic adhesive to the surface of the glass substrate is lowered, and the rework property is increased. On the other hand, the polarizing plate is borrowed. Stripped by external force. Furthermore, as a factor determining the adhesion strength of the polarizing film to the surface of the glass substrate, in addition to the hydrophilicity of the surface of the glass substrate, that is, the water contact angle, it may be listed as 147170. Doc 31 201113155 The elasticity and adhesion of the film are difficult. In the present invention, the adhesion (4) refers to the use of a polarizing film of 25 mm width or a film of (4) agent attached to the surface of the glass substrate. The method of removing the foreign matter attached to the first main surface of the substrate such as the thin glass substrate in the electronic device such as the display device panel is not particularly limited, but as described above, even according to the resin For the type of layer or substrate, the solvent '"wire" should be used to thermally or chemically decompose the foreign matter. 'When the resin layer is a polysulfide resin layer and the substrate is a thin glass substrate, it can be considered as a foreign material. The polyoxane compound is a main component, and a method of thermally decomposing a polyfluorene oxide attached to a first surface of a thin glass substrate into a dioxane, water, and carbon dioxide; or a method of chemically decomposing using an acid or an assay is exemplified. . On the other hand, when the resin layer is a polysulfide resin layer and the substrate is a resin substrate, in addition to thermal or chemical decomposition of the polyoxo compound attached to the resin substrate, it may be removed by dissolution of the solvent. . Further, in the panel for a display device to be removed, a member for an electronic device such as an array, an organic EL element, or a color filter is formed on the second main surface of the thin glass substrate; or a bonding agent is used to bond the second member. The thin glass substrate is further filled with liquid crystal between the two thin glass substrates to be bonded; therefore, in any of the aspects, the foreign matter can be removed without damage. That is, it is preferable that the removing step is a step of removing the foreign matter without causing thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate, the display device member, and the sealant. 147170. Doc 32-201113155 Further, it is preferable that the first main surface of the thin glass substrate before the resin layer is adhered has an adhesive strength f. After the removal step, the adhesion strength of the first main surface of the thin glass substrate in the panel for a display device is f f f f f. . The relationship of the adhesion strength can be achieved by performing the processing in the peeling step and the removing step most appropriately. As a method of removing foreign matter such as a polysulfide oxide adhered to the i-th main surface of the thin glass substrate, the electric power generation (four) radiation treatment is preferable. Among them, the method of shielding with electric field is preferable, and the so-called remote plasma method is used without causing thermal or electromagnetic influence on the panel for display devices. X is preferable to a method in which a high vacuum is required, such as a plasma ashing method, because the atmospheric pressure remote plasma method is preferable and the foreign matter can be removed at a low cost. By the plasma irradiation treatment, the adhesion of the film of the adhesive such as the polarizing plate to the main surface of the thin glass substrate is the same as that before the adhesion of the resin layer (ie, the adhesion is strong). Adhesion strength f〇) is therefore preferred. The number of times of plasma irradiation on the first major surface of the thin glass substrate is not particularly limited as long as the first major surface of the thin glass substrate can obtain the desired adhesive strength, and the irradiation can be performed once or several times. . Further, the surface temperature of the above-mentioned thin glass substrate at the time of plasma irradiation is preferably 100 C or less. The reason for this is that the display performance can be maintained without causing deterioration or damage to the sealing member such as the panel for the display device or a member such as a liquid crystal. Specific examples of the atmospheric pressure remote plasma method are shown below. A device that can be used to implement the atmospheric pressure remote plasma method will be described using FIG. 147170. Doc • 33· 201113155 Round 7 is a schematic device diagram of a plasma discharge device in which the foreign matter is removed by a remote plasma method in the removal step of the panel manufacturing method of the present invention. In Fig. 7, the voltage application electrode 42 and the ground electrode 43 are opposed to each other, and the surfaces facing the substrate are covered by the solid dielectric 46, respectively. The process gas is introduced into the discharge space 44' formed by the voltage application electrode 42 and the ground electrode a in the direction of the arrow and is plasma-formed, and then ejected from the plasma discharge port 45 to the display device panel 50. Here, the transport speed of the display device panel 50 is preferably 〇, preferably 0. 5~2 m/min, of which about i m/min is preferred. As a method of removing foreign matter such as a polyoxygen compound attached to the first main surface of the above-mentioned thin glass substrate in the panel for a display device, it is preferable to remove the above-mentioned foreign matter 16 by using an acid or a chemical solution. It is preferable to use a chemical solution containing a base for treatment from the viewpoint of the stagnation treatment device, such as rotten money. Moreover, in the case of using a chemical solution containing acid or test, vat soaking washing is more desirable than spray cleaning due to the liquid contact relationship, and it is particularly preferable to select a suitable concentration, temperature, and treatment time. Foreign matter such as polyoxane is removed without affecting the sealant. The following method can be exemplified: For example, 'use of acid or alkali which has been adjusted to 3 G to 7 (rc (preferably 6 generations) of 1 〇 to 3 〇 mass% (preferably 15 to 25% by mass)) The chemical solution is treated for 1 to 20 minutes (preferably 5 to 15 minutes). X, when the panel for the display device is immersed in the acid or the test liquid, it is preferably not used with the member for the display device k (4) (4) The member should be properly sealed or shielded. For example, if there is a liquid crystal injection hole on the member for the right display device, the liquid may enter I47170. Doc -34- 201113155 is incorporated into the display device, so it is advisable to properly perform sealing or shielding. The method for removing foreign matter such as a polyoxo compound adhered to the first main surface of the thin glass substrate does not cause thermal, electromagnetic, mechanical, or chemical properties to the thin glass substrate, the display device member, and the sealant. Within the scope of the treatment conditions of the damage, corona discharge or flame (ie, flame treatment) may be mentioned. As the above-mentioned processing conditions, for example, the surface temperature of the above-mentioned thin glass substrate at the time of corona discharge or flame treatment is preferably l〇〇»c or less. The reason for this is that the display performance can be maintained without causing deterioration or damage of a sealant such as a panel for a display device or a member such as a liquid crystal. a method of removing a foreign material such as a polyoxyxene compound attached to the first main surface of the thin glass substrate, without causing thermal, electromagnetic, mechanical or chemical damage to the thin glass substrate, the member for the device, and the sealant. Within the conditions, it is advisable to use the sp(s〇lubility parameter) value: the solubility parameter is 7~15 (unit: call/2cm. 3/2) Solvent drug = Removal of foreign matter 1 Solubility parameter is outside the range of 7 to 15, the liquid has a low affinity with the ruthenium layer, so the liquid is difficult to thicken the resin layer. For example, using 3 sterol, ethanol, propanol, acetone, and dioxane to remove the above-mentioned 4 hexanes and the like. Furthermore, from the viewpoint of environmental load, you can use alcohol-based rinsing liquid, for example, a liquid. The concentration, temperature, and the concentration of the washing liquid, which are suitable for the sealant, such as the compound, can be suppressed. 〕 All oxygen 忒 4 solvents can be used alone or in combination. It is better not to use 147170 when the panel for the display device is connected to the liquid containing the above-mentioned agent for Hanxing 3. Doc •35- 201113155 The components of the display device that are in contact with the liquid phase should be sealed or shielded. In the case of the liquid crystal injection hole on the panel for a display device, it is possible to cause the chemical liquid to enter the inside of the panel for the display device from the liquid crystal injection hole. Therefore, it is preferable to perform sealing or shielding treatment on the liquid crystal injection hole. In the panel manufacturing method of the present invention, 'two or more of the above removal steps are included. That is, it is preferred to carry out the removal of the foreign matter by a single type of removal step or to remove the foreign matter by combining the plurality of types of removal steps. For example, the above-mentioned foreign matter can be removed by a method in which a plasma is used as described above and a method using a chemical solution such as an acid. Further, in the removing step, it is preferred to further remove the foreign matter by using ultrasonic vibration. As a result, in the panel manufacturing method of the present invention, the panel for a display device can be obtained by further supplying the required steps. The steps required, for example, in the case of an LCD, may be exemplified by dividing a large unit cell having a plurality of unit cells into a unit cell of a desired size; injecting liquid crystal into the divided unit cell, and thereafter sealing Injection port; attaching a polarizing plate to the cell after the injection port is sealed; and forming a module. Further, for example, in the case of a ruthenium LED, in addition to the above steps, a step of assembling a four-plate glass substrate on which an organic EL structure is formed and a counter substrate may be mentioned. Further, since the strength of the thin glass substrate is not lowered by the dicing process, and the cullet is not generated, the step of dividing into a unit cell of a desired size is performed by using a laser cutter. Cutting. A specific example of the panel manufacturing method of the present invention will be described. 147170. Doc-36·201113155 A manufacturing method of a panel with a support of the present invention in the panel manufacturing method of the present invention. First, the thin glass substrate and the supporting glass substrate are quasi-it; the surface of the green is washed, and the surface is washed, for example, pure water cleaning, the old one is 1 〇1, and the ultraviolet ray is cleaned. Secondly, the glass substrate is supported. The first! The main layer forms a resin layer from above. For example, a silicone resin is coated on the first main surface of the supporting glass substrate using a silk (four) printer. Then, heat curing is performed to form a resin layer on the first main surface of the supporting glass substrate, and a supporting glass substrate to which a resin layer is fixed is obtained. Next, the peeling surface of the resin layer and the sheet glass substrate are the first! The main surface is attached and bonded. For example, the resin layer and the thin glass substrate can be vacuum-bonded and bonded at room temperature. Further, a thin-plate glass laminate which is a laminate supporting the glass substrate tree layer and the thin glass substrate can be obtained. Next, if necessary, the second main surface of the thin glass substrate in the thin glass laminate can be polished. Examples of the washing include pure water washing and UV washing. After the two thin plate glass laminates were produced by the above method, members for the display device were formed on the second main surface of the thin glass substrate in each of the thin glass laminates. One of the thin glass laminated systems is provided with a known color filter forming step, whereby a color filter is formed on the second main surface of the thin glass substrate. Further, another thin-plate glass laminated system is formed by a known array forming step, whereby an array is formed on the second main surface of the thin glass substrate. Two panels of the support of the present invention can be produced by the above method. Further, the following invention will also be obtained herein with a color filter 147170. The panel of the attached support of doc-37-201113155 is called "the panel of the support body", and the panel with the support of the present invention containing the array is called "the panel with the support body" in the panel manufacturing method of the present invention. For example, the panel X for the support and the panel y with the support are manufactured by the method of the examples i to 4 shown below, and the panel for the display device is manufactured. (Example 1) In the above-described embodiment, the color filter forming surface of each of the panel X with the support and the panel y with the support is formed to face the array, and an ultraviolet curing type sealant for forming a cell is used. The sealant is bonded. Hereinafter, the panel of the support of the present invention obtained herein is also referred to as "the panel Z1 with a support". The panel zl with the support is not yet filled with the liquid crystal, and the state is the so-called empty cell state. Next, when the removal step is performed by the chemical solution, the liquid crystal injection hole of the panel z1 of the support is temporarily sealed. For example, an ultraviolet curable sealant or the like may be used to further seal the outer side of the injection port. Then, the two supports of the panel 21 with the support after sealing are peeled off by the peeling step in the panel manufacturing method of the present invention. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "the two supports after the panel wlje peeling can be reused in the manufacture of the other support panel. Next, after the temporary sealing of the liquid crystal injection hole of the panel w1 is removed, the panel is removed. The panel w 1 is cut into individual cells. Next, liquid crystals are injected into the respective unit cells after the cutting from the injection holes, and then the injection holes are sealed to form a liquid crystal cell. Doc • 38· 201113155 Then, a polarizing plate is attached to the liquid crystal cell to form a backlight or the like, whereby the LCD 1 can be obtained. Further, the removal step in the panel manufacturing method of the present invention in the example may be performed after the support of the panel of the self-supporting body is peeled off, or after cutting into individual cells to form a liquid crystal cell. . Among them, in order to prevent the chemical solution from penetrating into the empty cell during the treatment of the chemical solution after the support is peeled off, it is preferable to temporarily seal the injection hole. (Example 2) In Example 2, a liquid crystal cell was fabricated using a previously known liquid crystal dropping method (〇DF, One Drop Filling). Dropping the liquid crystal to one of the color filter forming surface and the array forming surface of each of the panel X of the support and the panel y with the support, and forming the liquid crystal by the other forming surface and the dripping droplet The surface is formed to face and is bonded using a sealing agent such as an ultraviolet curable sealant for forming a unit cell. Hereinafter, the panel of the support of the present invention obtained herein is also referred to as "the panel z2 with a support". Next, the two supports of the panel 22 with the support are peeled off by the peeling step in the above-described panel manufacturing method of the present invention. Further, it is a removal step in the method of manufacturing a panel of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w2". The two supports after peeling can be reused in the manufacture of other support panels. Next, the panel W2 is cut into individual cells. Then, the polarizing plate is attached to the panel 〜2 which is cut into individual cells, and a backlight or the like is formed, whereby the LCD 2 can be obtained. Further, the removal step of the present invention in this example can be performed on the peeling support glass 147170. Doc •39· 201113155 & or any condition after cutting into individual cells to form a liquid crystal cell. In order to prevent the penetration of the chemical liquid into the empty cell during the treatment of the chemical solution after the support is peeled off, it is preferable to temporarily seal the injection hole. (Example 3); In Example 3, a liquid crystal cell was fabricated using 〇DF. The liquid crystal is dripped onto one of the color filter forming surface and the array forming surface of each of the panel X of the support and the panel 附 of the support, so that the other forming surface and the drip are formed by the liquid crystal. The surface is oriented and bonded using a sealing agent such as an ultraviolet curable sealant. Then, the bonded panel X of the support and the panel y with the support are cut into individual cells together with the support. Hereinafter, the panel of the support of the present invention obtained by cutting here is also referred to as "the panel z3 with a support". Next, the two supports of the panel z3 with the support are peeled off by the peeling step in the panel manufacturing method of the present invention. Further, it is a removal step in the panel manufacturing method of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w3". Then, a polarizing plate is attached to the panel w3 to form a backlight or the like, whereby the LCD 3 can be obtained. (Example 4) In Example 4, in the above manner, the color louver forming surface in each of the panel 附 of the support and the panel y of the supporting member was formed to face the array and ultraviolet rays were used for forming the unit cell. A sealant such as a hardenable sealant is bonded. Then 'with the support, it is cut into individual cells. Below, will be 147170. Doc -40- 201113155 The panel of the present invention obtained by cutting here is also referred to as "support panel z4". The panel z4 with the support is not yet filled with liquid crystal, and is a so-called empty cell state. Next, when the removal step is performed by the chemical solution, the liquid crystal injection hole of the panel z4 of the support is temporarily sealed. Then, the two supports of the panel 24 with the support are peeled off by the peeling step in the above-described panel manufacturing method of the present invention. Further, it is a removal step in the method of manufacturing a panel of the present invention. Hereinafter, the panel thus obtained is also referred to as "panel w4". Next, after the temporary sealing of the liquid crystal injection hole of the panel W4 is removed, the liquid crystal of the panel w4 is injected into the liquid crystal, and then sealed. Then, a polarizing plate is attached to form a backlight or the like, whereby an LCD 4 can be obtained. In order to prevent penetration of the chemical liquid into the empty cell during the chemical treatment after the support is peeled off, it is preferable to apply the above-mentioned injection hole. Implement a temporary seal. According to the panel manufacturing method of the present invention, when the thin glass substrate is large, for example, 730 x 920 mm, the thin glass substrate can be easily peeled off. Next, a method of manufacturing the display device of the present invention will be described. The method of manufacturing the display device of the present invention comprises the panel manufacturing method of the present invention. After the panel for a display device is obtained by the panel manufacturing method of the present invention, it is further supplied to a previously known step' to thereby obtain a display device. The manufacturing method of the display device of the present invention is suitable for a mobile phone or 147170. Doc 201113155 Manufacture of a small display device used in a mobile terminal such as a PDA (Personal Digital Assistant). The display device is mainly LCD or OLED, and as LCD, including: TN (Twisted Nematic) type, STN (Super Twisted Nematic) type, FE (Field Effect) type, TFT type, MIM (Metal Insulator Metal) type, IPS (In_piane Switching 'transverse electric field switching) type, VA (Vertical AHgned) type, and the like. Basically, the present invention is also applicable to any type of display device of a passive drive type or an active drive type. In the electronic device of the present invention, the panel for a display device including the member for a display device on the surface (second main surface) of the substrate has been described as a representative example. However, as described above, the present invention is not limited thereto. Of course it can also be. A solar cell, a thin secondary battery, and a member for an electronic device such as a member for a solar cell, and a member for an electronic device such as an electronic component circuit, respectively, are provided on the surface (second main surface) of the substrate instead of the member for the display device. And electronic devices such as electronic parts. For example, as a member for a solar cell, a transparent electrode such as a tin oxide of a positive electrode, a stone layer represented by a layer of a ruthenium, and a metal of a negative electrode may be mentioned, and examples thereof include a compound type and a dye-sensitized type. Various components such as quantum dot type. In addition, as a member for a thin film secondary battery, a transparent electrode such as a metal or a metal oxide of a pole and a negative electrode, a metal of a collector layer, a metal of a collector layer, and a resin as a sealing layer may be mentioned. Wait, others can be raised. Corresponding to the hydrogenation type, the eight-agent poly-type, ceramic electrolyte type, etc. 147170. Doc -42· 201113155 Components and so on. Further, as a circuit for an electronic component, a CCD (Charge C〇upied Device) or a CM〇s (c〇mpiementary - 〇 Xide Semiconduct〇r 'complementary metal oxide semiconductor) may be exemplified by a metal of a conductive portion. , the oxidation of the oxidized stone or the nitrite, etc., other examples: with the force sensor. Acceleration sensing g or other various components such as a hard printed circuit board, a flexible printed circuit board, and a soft-hard printed circuit board. EXAMPLES (Example la) First, the longitudinal direction was 720 mm, the width was 600 mm, and the plate thickness was 0. 4 mm, linear expansion coefficient 38xl〇-7/t: Supported glass substrate (made by Asahi Glass Co., Ltd., AN 1 〇 〇, no inspection glass), pure water cleaning, uv cleaning, purification. Into, using a screen printing machine, the solvent-free addition reaction type release paper is made of poly-stone (manufactured by Shin-Etsu Chemical Co., Ltd., kns_320a, viscosity is 〇4〇Pa's, dissolution parameter (3? value) = 7 3) 1 part by weight and a platinum-based catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-56), 2 parts by weight of a mixture coated on the first main surface of the supporting glass substrate to have a length of 7 〇 5 mm, Rectangular size 595 1Ώιη• (Coating amount is 30 g/m2). 'Next' to make it 180 in the atmosphere. (: heat-hardening for 30 minutes, forming a poly-xylene resin layer having a thickness of 2 μm on the main surface of the supporting glass substrate. Next, 'pair and vertical 720 mm, width 600 mm, thickness 0. The surface of the 3 mm, line expansion coefficient 38xl〇-7/°c thin glass substrate (the 'AN1 〇〇' alkali-free glass made by Asahi Glass Co., Ltd.) is contacted on the side of the layer of the epoxy resin layer, such as -43- 201113155 After pure water cleaning and uv cleaning, after purifying, the poly-stone epoxy resin layer and the thin-plate glass substrate are bonded by vacuum pressure at room temperature to obtain a thin-plate glass laminate (hereinafter, also referred to as "thin sheet Glass laminate A1"). Further, the formation of the resin layer and the lamination of the thin glass substrate were carried out so that a gap portion having a depth of 15 mm was formed at the end portion of the thin glass laminated body A1. In the obtained thin plate glass laminate A1, the two glass substrates and the polyoxylate resin layer were not adhered to each other, and there was no shape defect, and the smoothness was also good. Next, the thin plate glass laminate A1 is placed at 250 in the atmosphere. (The heat treatment was performed for 2 hours. It was confirmed that the resin layer of the thin-plate glass laminate A1 was not deteriorated by heat, and the heat resistance was good. Next, the second main thin-plate glass substrate in the thin-plate glass laminate A1 The surface is fixed on the fixed table, and the second main surface of the glass substrate is adsorbed by the adsorption pad. Then, the thin glass substrate and the resin layer are formed in one of the four corner portions of the thin glass laminated body. In the interface, the insertion thickness is 0. The 4 mm knife was slightly peeled off and then the adsorption pad was moved away from the fixed table to peel off the thin glass substrate and the support (support glass substrate containing the resin layer). The thin-plate glass substrate obtained by the peeling is also referred to as a "thin-glass substrate a". Next, a polarizing film is attached to the first main surface (the surface on which the resin layer is adhered) in the thin-plate glass substrate a1 (manufactured by Minto Electric Co., Ltd.) , B-acidic adhesive). Then, the adhesion strength of the polarizing film was measured. The measurement method is as follows: after attaching a 25 mm wide polarizing film or a film with an adhesive to the surface of the glass substrate, 147170. Doc •44- 201113155 Perform 90 on the end of the film. Stripped. As a result, the adhesive strength was 〇 2 〇 n / 25 mm 〇 Next, after the polarizing film was temporarily peeled off, the first main surface of the thin glass substrate a1 was irradiated with plasma using a normal pressure remote plasma device (manufactured by Sekisui Chemical Co., Ltd.). Here's the processing condition is. The output is 3 kw, the ratio of I gas to air flow = 600 slm / 750 sccm, and the transport speed is i m / min. The surface temperature of the thin glass substrate a at the time of plasma irradiation is 5 〇 ° C or less. Then, a polarizing film was attached to the first main surface of the thin glass substrate a1 after the plasma was irradiated, and the adhesion strength of the polarizing film was measured in the same manner as in the case of irradiating the plasma. The result is an adhesion strength of '90° peeling. 7 N/25 mm. Further, after observing the first main surface of the thin glass substrate a1 by an optical microscope, no foreign matter adhered, cracked, or damaged was observed. Further, the adhesive strength in the first main surface of the thin glass substrate before the formation of the thin glass laminate A1 was 3 9 n/25 mm. (Example lb) On the first main surface of the supporting glass substrate, a linear polyorganosiloxane having a vinyl group at both ends (trade name "8500" manufactured by Arakawa Chemical Co., Ltd.) was used. Methylhydrogenated polyoxyalkylene (manufactured by Arakawa Chemical Co., Ltd., trade name: 12031) having a hydrofluorenyl group in the molecule, and a platinum-based catalyst (product name "CAT12070", manufactured by Arakawa Chemical Industries, Ltd.) In addition, a thin glass laminate (hereinafter also referred to as "thin glass laminate A2") was obtained in the same manner as in Example la, and then heat-treated in the air. 147170. Doc-45-201113155 Next, in the same manner as in Example la, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off. The thin glass substrate obtained after the peeling is also referred to as "thin glass substrate a2". Then, the adhesion strength of the polarizing film in the first main surface of the thin glass substrate & 2 was measured in the same manner as in Example 13, and as a result, 〇6〇n/25 mm °, and the polarizing film was temporarily peeled off. The thin glass substrate & 2 was impregnated in a 20% by weight of a resist stripper (manufactured by Parker C〇rp〇rati〇n, containing 20% by mass of potassium hydroxide as a main component)丨〇 Minutes 'wash and air supply. Next, 'the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a2' was measured, and the result was 4. 5 N/25 mm ° (Example lc) A thin glass laminate (hereinafter also referred to as "thin glass laminate A3") was obtained in the same manner as in Example 1 b, and then heat-treated in the air. Next, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example lb. The thin glass substrate obtained after the peeling is also referred to as "thin glass substrate a3". Then, the thin glass substrate a3 was immersed in the resist stripper. The temperature of the stripping solution here is 50. (:, immersing for 5 minutes. Further, ultrasonic vibration is applied to the thin glass substrate a3 by using an ultrasonic vibration plate provided in the liquid tank. Then, 'the polarizing film in the first main surface of the thin glass substrate a3 is measured. 147170. Doc •46· 201113155 Adhesive strength, the result is 4. 0 N/25 nun. (Example Id) A thin glass laminate (hereinafter also referred to as "thin glass laminate A4") was obtained in the same manner as in Example lb, and then heat-treated in the air. Next, the thin glass substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example lb. The thin glass substrate obtained after the peeling is also referred to as a "thin glass substrate ^". Next, the surface temperature of the thin glass substrate is i 〇〇. Under the following conditions, the first main surface of the thin glass substrate a4 was subjected to four treatments at a scanning speed of the edge portion of the oxyfluoride burner flame by a flame treatment machine (manufactured by Arcotec Co., Ltd.). Next, 'the adhesion strength of the polarizing film in the first main surface of the thin glass substrate a4' was measured, and the result was 4. 0 Ή / 25 mm. (Example le) In Example le, the thin glass substrate was changed to a polyimide resin substrate having a thickness of 〇〇 5 mm (Dong Li. A substrate laminate for a device (hereinafter also referred to as "device substrate laminate A5") was obtained in the same manner as in Example la except that the product was manufactured by DuPont Co., Ltd., Kapt〇n 200HV. In the two main faces of the polyimide film, the surface which is adhered to the peeling surface of the resin layer is referred to as a first main surface, and the main surface on which the electronic device member is formed is referred to as a second main surface. When the heat resistance of the resin layer of the substrate laminate A5 for a device was evaluated in the same manner as in Example 1a, it was confirmed that the heat resistance was not deteriorated due to heat, and the heat resistance was good. 147170. Doc • 47· 201113155 Next, the polyimide film substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example la. The polyimide film substrate obtained after the peeling is also referred to as "polyimine resin substrate a5". Next, a polarizing film was attached to the first main surface of the polyimide film a5 in the same manner as in Example U. Then, the adhesion strength of the polarizing film in the first main surface of the polyimide film a5 was measured. The adhesion strength of the polarizing film was 0·50 N/25 mm. Then, the first main surface of the polyimide resin substrate a5 was irradiated with the same method as in Example 1a using the atmospheric pressure remote plasma device. Pulp and attach a polarizing film. The adhesion strength of the polarizing film in the first main surface of the polyimide iran resin substrate a 5 was measured, and the result was 3. 0 N / 25 mm ° Further, the adhesion strength in the first main surface of the polyimide substrate substrate before the formation of the substrate laminate A5 was 1. 5 N/25 mm. (Example) In the example of the example, the apparatus was obtained in the same manner as in Example la except that the thin-plate glass substrate was changed to a mirror-treated stainless steel (SUS3〇4) substrate having a thickness of 〇1 mm. A substrate laminate (hereinafter also referred to as "device substrate laminate A6"). In the main surfaces of the stainless steel substrate, the surface which is adhered to the peeling surface of the resin layer is referred to as a first main surface, and the main surface on which the electronic device member is formed is referred to as a second main surface. After the heat resistance of the resin layer of the substrate laminate A6 for the device was evaluated in the same manner as in Example u, it was confirmed that the heat resistance was not deteriorated by heat and the heat resistance was good. Next, the stainless steel substrate and the support (support glass substrate containing the resin layer) were peeled off in the same manner as in Example la. Stainless steel base obtained after peeling 147170. Doc -48- 201113155 The board is also called "stainless steel substrate a6". Next, a polarizing film was attached to the first main surface of the stainless steel substrate by the same method as in Example la. Then, the adhesion strength of the polarizing film in the second major surface of the stainless steel substrate a6 was measured. The adhesion strength of the polarizing film was 〇4〇n/25 mm °. Next, in the same manner as in the example la, the i-th main surface of the stainless steel substrate 36 was irradiated with plasma using a normal-pressure remote plasma device, and attached. With a polarizing film. The adhesion strength of the polarizing film in the first main surface of the stainless steel substrate a6 was measured, and the result was 1. 5 N/25 mm ° Further, the adhesion strength in the jth main surface of the stainless steel substrate before the formation of the substrate laminate A6 is 1. 0 N/25 mm. (Example lg) First, an alkaline lotion is used for a length of 350 mm, a width of 300 mm, and a plate thickness of 0. 08 mm, linear expansion coefficient 38xl (r7/t: 2 glass film (Asahi Glass Co., Ltd., AN 100, no glass) is cleaned to purify the surface of the glass film. Further γ-mercaptopropyltrimethoxy The surface of the glass film was sprayed with a hydrazine-based hydrazine % methanol solution at 8 Torr. (: drying for 3 minutes. On the other hand, the vertical 350 mm, the transverse 300 mm, the plate thickness 〇. 〇5 mm polyimine resin substrate (Dongli. The surface of DuPont, Kapton 200HV) was electropolymerized. Then, the glass film was laminated on the polyimide substrate, and a glass/resin laminated substrate was formed using a pressurizing device heated to 320 °C. In the main surfaces of the glass/resin laminated substrate, the main surface of the polyimide-imide resin substrate side which is adhered to the peeling surface of the resin layer is referred to as a first main surface, and the main surface of the glass film side facing the opposite side is referred to as 2 main faces. I47170. Doc -49·201113155 In the same manner as in Example 1a, a substrate laminate for a device was obtained in the same manner as in Example 1a, except that the thin glass substrate was changed to the above-described glass/resin laminate substrate (hereinafter also referred to as "Device substrate laminate A7"). When the heat resistance of the resin layer of the substrate laminate A7 for a device was evaluated in the same manner as in Example la, it was confirmed that the heat resistance was not deteriorated by heat and the heat resistance was good. Next, the glass/resin laminated substrate and the support (supporting glass substrate containing the resin layer) were peeled off in the same manner as in Example la. The glass/resin laminated substrate obtained after the peeling is also referred to as "glass/resin laminated substrate a7". Next, a polarizing film was attached to the first main surface of the glass/resin laminated substrate a7 in the same manner as in Example 1a. Then, the adhesion strength of the polarizing film in the first main surface of the glass/resin laminated substrate a7 was measured. The adhesion strength of the polarizing film is 0. 4 0 N / 2 5 in m. Next, the first main surface of the glass/resin laminated substrate a7 was irradiated with a plasma by the same method as in Example 1a using a normal pressure remote plasma device, and a polarizing film was attached thereto. The adhesion strength of the polarizing film in the first main surface of the glass/resin laminate substrate a7 was measured, and the result was 3. 0 N/25 mm ° Further, the adhesive strength in the first main surface of the glass/resin laminated substrate before the formation of the substrate laminate A7 was 15 n/25 mm. (Example lh) In the same manner as in Example 1 e, the substrate laminate A51 for a device was obtained in the same manner as in Example 1 h. Next, the polyimide substrate and the support were peeled off in the same manner as in Example le ( A supporting glass substrate containing a resin layer). 147170. Doc 201113155 Next, a polarizing film is attached to the first main surface of the polyimide film substrate in the device substrate laminate A51 in the same manner as in the example la. Further, the adhesion strength of the polarizing film in the first main surface of the polyimide film substrate was measured. The adhesion strength of the polarizing film is 0. 40 N/25 mm. Next, the alcohol-based cleaning agent (Neocoal R7, manufactured by Japan Alcohol Trading Co., Ltd.) was sprayed on the first main surface of the polyimide film substrate. The cleaning agent was removed from the first main surface of the polyimide film substrate by air blowing, and then a polarizing film was attached in the same manner as in Example la. The adhesion strength of the polarizing film in the first main surface of the polyimide resin substrate was measured, and as a result, it was 2·8 N/25 mm β (Example 2) First, the vertical direction was 720 mm, the width was 600 mm, and the thickness was 〇. 6 mm, coefficient of linear expansion 38><1〇-7/. (: Support glass substrate (made by Asahi Glass Co., Ltd., AN100, alkali-free glass) for pure water cleaning, uv cleaning, and purification. Secondly, using a screen printer, it will have a linear chain of vinyl at both ends. Polyorganosiloxane (product name: 500, manufactured by Arakawa Chemical Co., Ltd.), methylhydrogenated polyoxyalkylene having a hydroquinone group in the molecule ('〇*Kawasumi Chemical Co., Ltd., product A mixture of "3 (3) and 3 workers) and a mixture of the catalysts (Arakawa 4 匕 τ $ &, "Industry Edition, Ltd., trade name 12070") are coated on the main surface of the supporting glass substrate. Vertical; 7〇5 face, horizontal 595 mm size (coating amount is 20 g/m2). Here, the combination of linear 1 polychlorinated oxygen and methyl nitriding polyoxyus oxide The molar ratio of the wind-smooth base to the ethylene base is 1/1. Compared with the linear polyorganisms and the methyl hydrogenated polyoxo-oxygen (10) weight 147170.doc 201113155 parts, platinum system The catalyst is 5 parts by weight. Secondly, it is heat-hardened in the atmosphere at 18 ° C for 30 minutes. The first main surface of the glass substrate is formed into a thickness of 2 〇μη!; an oxime oxy-resin layer. Next, 'pair and 720 mm in length, 600 mm in width, thickness 〇 1 mm, coefficient of linear expansion 5 〇 xl 〇 -7 The surface of the thin-plate glass substrate (the 'AN100, alkali-free glass made by Asahi Glass Co., Ltd.) is cleaned by pure water, UV-cleaned, and purified at room temperature. The polyoxygenated resin layer and the thin glass substrate are bonded by vacuum pressure to obtain a thin glass laminated body (hereinafter also referred to as "thin glass laminated body B"). Further, the formation of the resin layer and the lamination of the thin glass substrate In the thin-plate glass laminate B obtained, the two glass substrates and the polyoxy-resin layer are not adhered to each other in the form of a gap. There is no shape defect, and the smoothness is also good. Next, the second main thin-plate glass substrate in which two thin-plate glass laminates are prepared and one of the thin-plate glass laminates B (referred to as "thin-glass laminated body B1") is prepared. Face formation array Specifically, the insulating layer and the amorphous germanium layer are formed by a CVD (Chemical Vapor Deposition) method, and the electrode layers are formed by a sputtering method, and the respective patterns are formed by photolithography. Further, a second color filter is formed on the second main surface of the thin glass substrate of the other thin glass laminate B (referred to as "thin glass laminate B2"). Specifically, the black matrix and the RGB pixels In the coating and baking method, 147170.doc • 52· 201113155 is formed into an 'electrode layer formed by a bismuth method' and each pattern is formed by a method of photolithography to form a color filter. Then, the array forming surface in the thin glass laminated body B 1 is opposed to the color filter forming surface in the thin glass laminated body B2, and bonded by an ultraviolet curing type sealing agent for forming a unit cell, thereby obtaining a support. A panel for a display device (hereinafter also referred to as "panel C with a support"). Next, the second main surface of the supporting glass substrate which is a part of the thin plate glass laminate b j in the panel C with the support is fixed to the fixing table. Further, the second main surface of the supporting glass substrate which is a part of the thin glass laminated body B2 in the panel c of the support is adsorbed by the adsorption pad. Further, in the interface between the thin glass substrate and the resin layer which is one of the four corner portions of the panel C of the support, and the resin layer is a part of the thin plate glass laminate B2, the insertion thickness is 〇. The knives slightly peel off the thin glass substrate and the support (the supporting glass substrate having the tree layer), and then move the adsorption pad in the direction away from the fixed table, thereby peeling off the first main surface of the thin glass substrate and the support . The panel obtained by attaching the support panel c to the support of the thin-plate glass laminate is also referred to as "the panel cx with the support" e. Next, the thin-plate glass laminate B2 in the panel Cx with the support is used. A part of the first main surface of the seesaw glass substrate is fixed to the fixing table. Further, the first main surface of the supporting glass substrate which is a part of the thin glass laminated body B1 in the panel Cx as the support is adsorbed by the adsorption pad. Further, a knives having a thickness of 0 mm are inserted into the boundary between the thin glass substrate and the resin layer which is a part of the thin plate glass laminate B1 among the four corner portions of the panel Cx of the support. The thin glass substrate and the support 147170.doc -53·201113155 (supporting glass substrate containing the tree layer) are slightly peeled off, and then the adsorption enthalpy is moved away from the fixed table, thereby peeling off the thin glass substrate and supporting
體。將此處所獲得者、即將自附支持體之面板c剝離2個支 持體後所獲得者作為「面板C」D 其次，於面板C所具有之2個薄板玻璃基板各自之第1主 面貼附偏光膜（曰東電工公司製，丙烯酸系黏著劑）。然 後，測疋s亥偏光臈之黏著強度。測定方法係與實施例丨&相 同。其結果為，90。剝離時之黏著強度為〇78 N/25 mm及 0.59 N/25 mm。 其次，暫時剝離上述膜，切割面板c，獲得縱51爪^^橫 3 8 mm之168個晶胞。並且，向各晶胞中注入液晶並密封注 入孔’形成液晶晶胞。其後’使液晶晶胞於5〇〇c下於已稀 釋成20重量％之抗蝕劑剝離液（Parker c〇rp〇rati〇n&司製， 含有作為主成分之氫氧化鉀2〇質量％)中浸潰1〇分鐘，進行 水洗及送風。其後’將形成有液晶晶胞陣列之薄板玻璃基 板之第1主面固定於固定台上，以吸附墊吸附形成有彩色 滤光片之薄板玻璃基板之第1主面，向遠離固定台之方向 以20 N/25 mm拉伸後’並無密封劑之剝離及晶胞之破壞。 其次’與浸潰於抗蝕劑剝離液之前相同，對浸潰於抗蝕 劑剝離液之後的液晶晶胞中之薄板玻璃基板之第1主面貼 附偏光膜’並以相同之方法測定偏光膜之黏著強度。其結 果為，90。剝離時之黏著強度為4 4 N/25 mm 〇 然後’實施模組形成步驟，可獲得LCD。如此獲得之 LCD不會產生特性上之問題，即不會產生陣列性能或彩色 147170.doc •54- 201113155 濾光片之色度之劣化等。其結果可獲得上述LCD之對向之 2個薄板玻璃基板各自之外表面之間的總厚度約為〇 2 mm 之液晶顯示裝置。 (實施例3) 準備實施例2中已形成之薄板玻璃積層體B、及厚度為 0.7 mm之無鹼玻璃基板（旭硝子股份有限公司製， AN100，無鹼玻璃）（將此處使用之薄板玻璃積層體b作為 「薄板玻璃積層體B3」）。並且，以與實施例2相同之方 法’於薄板玻璃積層體B3之薄板玻璃基板之第2主面形成 彩色濾光片，於無鹼玻璃基板之一個主面形成陣列。 並且，與貫施例2之情形相同，使無驗玻璃基板之陣列 形成面與薄板玻璃積層體B3之彩色濾光片形成面相對向， 填充液晶’使用晶胞形成用紫外線硬化型密封劑進行黏 合’從而獲得附支持體之顯示裝置用面板（以下，亦稱為 「附支持體之面板D」）。此處，將液晶注入孔密封。 其次，以與實施例2相同之方法，可剝離薄板玻璃積層 體B3之支持體。將此處所獲得者、即將自附支持體之面板 D剝離支持體後所獲得者作為「面板〇」。 然後，以與實施例2相同之方法切割面板D而獲得168個 晶胞後’形成液晶晶胞。 並且，辟所獲得之液晶晶胞浸潰於與實施例2相同之抗 蝕劑剝離液中。此處，剝離液之溫度為5(rc，並浸潰5分 鐘。又，使用設置於液槽内之超音波振動板，對液晶晶胞 施加超音波振動。 147170.doc -55- 201113155 其次’對浸潰於抗蝕劑剝離液之後的液晶晶胞之薄板玻 璃基板之第1主面貼附偏光膜，測定該偏光膜之黏著強 度。所使用之偏光膜之種類及黏著強度之測定方法與實施 例1同樣。其結果為，90。剝離時之黏著強度為4 3 N/25 mm ° 然後’貫施模組形成步驟而可獲得LCD。如此獲得之 LCD不會產生特性上之問題，即不會產生陣列性能或彩色 濾光片之色度之劣化等。其結果可獲得上述lcd之對向之 2個溥板玻璃基板各自之外表面之間的總厚度約為〇 8爪爪 之液晶顯示裝置。 (實施例4) 準備2個已於實施例2中形成之薄板玻璃積層體並 且，以與實施例2相同之方法，於其中的一個薄板玻璃積 層體B(稱為「薄板玻璃積層體B4」）之薄板玻璃基板之第2 主面形成陣列。又，於另一個薄板玻璃積層體B(稱為「薄 板玻璃積層體B5」）之薄板玻璃基板之第2主面形成有機EL 結構體。具體而言，實施形成透明電極之步驟、形成輔助 電極之步驟、蒸鍍電洞注入層.電洞傳輸層.發光層電子傳 層專之步驟、及後封邊專之步驟，於薄板玻璃積層體B5 之薄板玻璃基板上形成有機EL結構體。 並且’將薄板玻璃積層體B4及薄板玻璃積層體B5組合 而獲得附支持體之面板E。 其次，以與實施例2相同之方法，可剝離薄板玻璃積層 體84及薄板玻璃積層體B5之支持體。將此處所獲得者， 147170.doc -56· 201113155 即將自附支持體之面板E剝離支持體後所獲得者作為「面 板E」。於面板E中之薄板玻璃基板之表面’並未發現會導 致強度降低之傷痕。 其次，使用常壓遠距電漿裝置（積水化學公司製），對已 形成有機EL結構體之薄板玻璃基板之第丨主面照射電漿。 此處，處理條件為：輸出為3 kw，氮氣與空氣流量之比 -600 slm/750 seem，搬送速度為1 m/mjn。電漿照射時之 薄板玻璃基板之表面溫度為50〇c以下。 其次，使用雷射刀或切割-斷裂法來切割面板E，分割為 縱41 mmx橫30 mm之288個晶胞後，於晶胞表面貼附作為 保護膜之PET(p〇lyethylene terephthalate，聚對苯二甲酸乙 二酯）膜（日東電工公司製，丙烯酸系黏著劑卜此時之黏著 強度為3.9 N/25 mm。其後，實施模組形成步驟而製作 OLED 〇 如此獲得之OLED不會產生特性上問題。 上述例中，於分割為顯示之面板單位之前剝離支持體， 但亦可將複數個面板彼此連接而成之結構作為單位進行處 理。 除上述例以外，亦可於分割為顯示之面板單位之後剥十 支持體。 已參照特別4曰疋之貫施態樣詳細地說明了本發明，伯 本 領域技術人員明白’在不脫離本發明之精神與範圍内， 進行各種變更或修正。 本申請案係基於2009年3月24日提出申請之日本專利申 147170.doc •57- 201113155 其内容以參照的形式併入於此 請2009-072282者，其内 產業上之可利用性 根據本發明，可提供— 一種電子裝置之製造方法，其係自body. The person obtained here, which is obtained by peeling off the two supports from the panel c to be attached to the support, is referred to as "panel C" D. Next, the first main surface of each of the two thin glass substrates of the panel C is attached. Polarized film (made by Jidong Electric Co., Ltd., acrylic adhesive). Then, measure the adhesion strength of the 偏 偏 偏 polarized light. The measurement method is the same as in the examples 丨 & The result is 90. The adhesion strength at the time of peeling was 〇78 N/25 mm and 0.59 N/25 mm. Next, the film was temporarily peeled off, and the panel c was cut to obtain 168 cells having a length of 51 claws and a width of 38 mm. Further, liquid crystal is injected into each unit cell and the injection hole is sealed to form a liquid crystal cell. Thereafter, the liquid crystal cell was allowed to be diluted to 20% by weight of a resist stripper at 5 〇〇c (Parker c〇rp〇rati〇n & system, containing potassium hydroxide as a main component %) soaked for 1 minute, washed and aired. Thereafter, the first main surface of the thin glass substrate on which the liquid crystal cell array is formed is fixed to the fixed stage, and the first main surface of the thin glass substrate on which the color filter is formed is adsorbed by the adsorption pad, and is moved away from the fixed stage. After the direction is stretched at 20 N/25 mm, there is no peeling of the sealant and destruction of the unit cell. Next, the polarizing film is attached to the first main surface of the thin glass substrate in the liquid crystal cell after being immersed in the resist stripping liquid, and the polarized film is measured in the same manner as before the resist stripping solution is immersed in the resist stripping solution. Adhesive strength of the film. The result is 90. The adhesive strength at the time of peeling was 4 4 N/25 mm 〇 Then, the module forming step was carried out to obtain an LCD. The LCD thus obtained does not cause a problem in characteristics, that is, it does not cause array performance or color deterioration of the color of the filter 147170.doc •54-201113155. As a result, a liquid crystal display device having a total thickness of about mm 2 mm between the outer surfaces of the two thin glass substrates opposed to the above LCD can be obtained. (Example 3) The thin-plate glass laminate B formed in Example 2 and the alkali-free glass substrate having a thickness of 0.7 mm (AN100, alkali-free glass, manufactured by Asahi Glass Co., Ltd.) were prepared (the thin plate glass used here) The layered body b is referred to as "thin-plate glass laminate B3"). Further, a color filter is formed on the second main surface of the thin glass substrate of the thin glass laminated body B3 in the same manner as in the second embodiment, and an array is formed on one main surface of the alkali-free glass substrate. Further, in the same manner as in the case of the second embodiment, the array forming surface of the glass-free substrate is opposed to the color filter forming surface of the thin glass-clad laminate B3, and the liquid-filled liquid crystal is formed using the ultraviolet curing type sealing agent for cell formation. Bonding 'to obtain a panel for a display device with a support (hereinafter also referred to as "panel D with a support"). Here, the liquid crystal injection hole is sealed. Next, the support of the thin plate glass laminate B3 can be peeled off in the same manner as in the second embodiment. The person obtained here, the panel D to which the support is attached is peeled off from the support, is referred to as a "panel". Then, the panel D was cut in the same manner as in Example 2 to obtain 168 cells to form a liquid crystal cell. Further, the liquid crystal cell obtained was immersed in the same resist stripping solution as in Example 2. Here, the temperature of the peeling liquid was 5 (rc, and it was immersed for 5 minutes. Further, ultrasonic vibration was applied to the liquid crystal cell using an ultrasonic vibration plate provided in the liquid tank. 147170.doc -55- 201113155 Next' A polarizing film is attached to the first main surface of the thin glass substrate of the liquid crystal cell which is immersed in the resist stripping liquid, and the adhesion strength of the polarizing film is measured. The type of the polarizing film used and the measuring method of the adhesive strength are The result is the same as in Example 1. The result is 90. The adhesive strength at the time of peeling is 4 3 N/25 mm ° and then the LCD can be obtained by performing the module forming step. The LCD thus obtained does not cause a problem in characteristics, that is, The array performance or the chromaticity of the color filter is not deteriorated, etc. As a result, the liquid crystal having a total thickness of about 爪8 claws between the outer surfaces of the two slab glass substrates opposite to the lcd can be obtained. (Example 4) Two thin-plate glass laminates which were formed in Example 2 were prepared, and in the same manner as in Example 2, one of the thin-plate glass laminates B (referred to as "thin-glass laminate" Thin plate glass of body B4") An array is formed on the second main surface of the sheet, and an organic EL structure is formed on the second main surface of the thin glass substrate of the other thin glass laminate B (referred to as "thin glass laminate B5"). Specifically, the implementation is performed. The step of forming a transparent electrode, the step of forming an auxiliary electrode, the step of depositing a hole of a vapor deposit, the layer of a hole transport layer, the step of electron transport layer of the light-emitting layer, and the step of post-sealing, the thin plate glass of the thin-plate glass laminate B5 An organic EL structure is formed on the substrate. The panel E with the support is obtained by combining the thin glass laminate B4 and the thin glass laminate B5. Next, the thin plate glass laminate 84 can be peeled off in the same manner as in the second embodiment. And the support of the thin-plate glass laminate B5. The person obtained here, 147170.doc -56· 201113155, will be the panel E after peeling off the support from the panel E of the support. The thin plate in the panel E The surface of the glass substrate was not found to have a flaw that would cause a decrease in strength. Secondly, a thin plate glass in which an organic EL structure was formed was used using a normal pressure remote plasma device (manufactured by Sekisui Chemical Co., Ltd.). The main surface of the first surface of the plate is irradiated with plasma. Here, the processing conditions are: the output is 3 kw, the ratio of nitrogen to air flow is -600 slm/750 seem, and the conveying speed is 1 m/mjn. The surface temperature of the substrate is 50 〇c or less. Next, the panel E is cut by a laser knife or a cutting-fracture method, and divided into 288 cells of 41 mm in length and 30 mm in width, and then attached as a protective film on the surface of the unit cell. PET (p〇lyethylene terephthalate, polyethylene terephthalate) film (made by Nitto Denko Co., Ltd., acrylic adhesive) at this time the adhesive strength is 3.9 N / 25 mm. Thereafter, the module forming step is performed to fabricate the OLED. The OLED thus obtained does not cause a problem in characteristics. In the above example, the support is peeled off before being divided into panel units for display, but the structure in which a plurality of panels are connected to each other may be handled as a unit. In addition to the above examples, the support body may be stripped after being divided into panel units for display. The present invention has been described in detail with reference to the particular embodiments thereof, and those skilled in the art will be able to make various changes or modifications without departing from the spirit and scope of the invention. The present application is based on Japanese Patent Application No. 147170.doc filed on March 24, 2009, the entire contents of Invention, can provide - a method of manufacturing an electronic device, which is
光片）造成熱、電磁、機械及化學性損傷地去除附著於上 述電子裝置用之基板主面的異物，其結果可將偏光膜或相 位差膜等附黏著劑之膜牢固地貼附於剝離後之基板中之附 樹脂層的面。 【圖式簡單說明】 圖1係表示本發明之附支持體之面板之一態樣的概略剖 面圖。 圖2係表示本發明之附支持體之面板之另一態樣的概略 正視圖。 圖3係表示本發明之附支持體之面板之另一態樣的概略 剖面圖。 圖4係表示本發明之附支持體之面板之另一態樣的概略 正視圖。 圖5係表示本發明之附支持體之面板之另一態樣的概略 正視圖。 圖6係表示本發明之附支持體之面板之另一態樣的概略 剖面圖。 147170.doc •58· 201113155 圖7係說明可用於本發明之面板製造方法之 的常壓遠距電漿裝置之例的模式圖。 【主要元件符號說明】 10 ' 20 ' 30 本發明之附支持體之面板 12 、 22 、 32 薄板玻璃基板 14 、 24 、 34 顯示裝置用構件 16、26 顯示裝置用面板 18、28、38 樹脂層 19 、 29 、 39 支持玻璃基板 25 間隙部 41 電源（高壓脈衝電.源） 42 電壓施加電極 43 設置電極 44 放電空間 45 電漿噴出口 46 固體電介質 50 剝離步驟後之顯示裝置用面板 147170.doc -59-The light sheet) removes foreign matter adhering to the main surface of the substrate for the electronic device by thermal, electromagnetic, mechanical, and chemical damage, and as a result, the film of the adhesive film such as a polarizing film or a retardation film can be firmly attached to the peeling film. The surface of the substrate with the resin layer attached. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic cross-sectional view showing an aspect of a panel of a support according to the present invention. Fig. 2 is a schematic front view showing another aspect of the panel of the support of the present invention. Fig. 3 is a schematic cross-sectional view showing another aspect of the panel of the support of the present invention. Fig. 4 is a schematic front view showing another aspect of the panel of the support of the present invention. Fig. 5 is a schematic front view showing another aspect of the panel of the support of the present invention. Fig. 6 is a schematic cross-sectional view showing another aspect of the panel with a support of the present invention. 147170.doc • 58· 201113155 Fig. 7 is a schematic view showing an example of an atmospheric pressure remote plasma device which can be used in the panel manufacturing method of the present invention. [Description of main component symbols] 10 ' 20 ' 30 Panels 12, 22, 32 with support of the present invention Thin-plate glass substrates 14, 24, 34 Display device members 16, 26 Display device panels 18, 28, 38 Resin layer 19, 29, 39 Support glass substrate 25 Gap portion 41 Power supply (high voltage pulse power source) 42 Voltage application electrode 43 Setting electrode 44 Discharge space 45 Plasma discharge port 46 Solid dielectric 50 Panel for display device after peeling step 147170.doc -59-