201112899 π - “凡％ : 【發明所屬之技術領域】 本發明，总 印刷基板Γ用以對印刷配線基板（以下簡略名稱為 孔加工方;)：良好精度有效率地開孔加工之印刷基板之 【先前技術】 導電二二印刷基板中隔著絕緣物將配置於表背兩面之 "之情料，係對印刷基板開設出用以連接 :之導體層之孔（以下稱為連接孔），並於連接孔之内部 :乂導電性鍍敷，II此將表背之導電層電氣連接。近年隨 ^ 機器之小型化、咼密度構裝化，搭載於電子機器之 印刷基板之連接孔之孔徑係採用大致015〜0 08mm之尺寸 々圍此種連接孔，通常係使用鑽頭或雷射進行孔加工。 圖7 ’係周知技術中使用鑽頭加工出連接孔時之工件之 說月圖，該圖（a)為其俯視圖，該圖（b)為其側視圖，該圖（幻 係該圖（b)之A區域部之部分放大圖。 參照圖7(a)〜（c)，此處之印刷基板丨係隔著絕緣層lz 於表面層配置導體層1 a，於背面側配置導體層i b。絕緣層 1 2係由樹脂1 j與玻璃纖維1 g構成。在使用鑽頭對印刷基 板1加工出連接孔時，為了提升加工效率，通常係對重疊 有複數片印刷基板1之積層體進行開孔加工，順帶一提， 以鑽頭進行開孔加工時之連接孔係貫通孔（穿通孔）。 在使用鑽頭開孔加工出穿通孔時，係先於印刷基板1 201112899 之周”彖』之預疋位置加工出定位固定用之周緣孔2，並對重 疊有複數片印刷基板1之積層體插人堆疊銷3。通常，周緣 孑L 2在板面方向夕# γ 截•面形狀為圓形，為了防止作為積層體 而重噎之印刷基板1彼此偏ί多，係於每片印刷基板1設置 兩處以上（此處為兩處）之周緣孔2。又，堆疊銷3之外徑僅 略大於周”彖孔2之直徑，當將堆疊銷3插入周緣孔2並卡 合後’即能將複數片印刷基板U此處為八片)積層而成之積 層體作為一個工彳丰\λ/ m 仟w使用。此堆疊銷3，係如周知般亦具 有用以將工件W定〆办Μ 疋位於加工平台之定位銷之功能4參照例 如專利文獻1 )。 田如上述般’使用鑽頭開孔加工出穿通孔後，由於能 使孔内壁之面之粗度為2 “ m以下，因此在將導電性鍍敷對 孔内壁進行鍍敷處理時，能形成厚度均一之錢敷層，而能 確實地將導體層U與導體層lb電氣連接。 圖8係周知技術中使用雷射加工出連接孔時之工件之 說明圖’該圖⑷為其俯視圖’該圖⑻係該圖⑷之B區域部 之部分放大圖。 …參照® 8⑷〜（b) ’在以雷射加X出連接孔時，係形成 從早-印刷基板i之導體層h到達導體層b表面之具底部 孔5。在加工出具底部孔時’雖係將印刷基板1逐片加工， 出個孔所需之時間如周知般與以鑽頭加工之情形 相較可縮紐大f夂10〜100倍’因此加工速度(加工時間)不會 .成為問題(參照例如專利文獻2)。不過，在雷射加工之情形 下士圖8(b)所不，由於在轴方向產生錐狀（因光束能量分 201112899 布所致)，而大多會使具底部孔5之形狀成為圓錐梯形，孔 底之直杈變成較入口側之孔之直徑小。 ，此外，此處雖亦例示了於印刷基^設有周緣孔2之 情形’但以雷射加工出連接孔時，由於不需對策即可解決 將複數片印刷基板1重疊而作成積層體之情形之印刷基板i 彼此之偏移’因此亦可不設置周緣孔2而例如設置定位標 記等，藉由其他手段將印刷基板丨定位於平台。 丁 [專利文獻] [專利文獻1]日本特開昭63—3〇6847號公報 [專利文獻2]日本特開2〇〇2 — 335〇63號公報 【發明内容】 [發明所欲解決之問題] 圖9係將周知技術中使用鑽頭對積層體之工件*加工 出穿通孔時之要部局部放大之截面圖。 、圖9，在藉由鑽頭對積層體之工件w進行開孔加 ^有時會在開孔加工時因積層體之剛性作用導致作為 目標之穿通孔4之軸線L，N相對印刷基板i表面成垂直之 直線方向在途中傾斜（略圖）或如圓示般在途中彎曲。在此種 狀態之情形下，下層之印刷基板1中穿通孔4之孔位置之 :^係降低而產生無法滿足容許值之事態。因此，通常係 積層體中之印刷基& !之重疊片數來進行開孔加工。 右係圖9所不之例之情形，可知為了提升穿通孔*之 孔位置之精度’只要將積層體之印刷基板1之重疊片數設 201112899 為四片以下即可。 、體^料印刷基板1，#使用隔著具有玻璃纖维 之樹脂之表面層與背面層之銅箱分別為者，且:定 對板厚0.1mm者開孔加工出 且位马〇· 1 mm之穿通孔4 形，若欲將最下層之穿通 大^ ^ 才通孔4之孔位置精度限在±30以m 時’重疊四片則為其限度。 扼要言之，使用周知技術之鑽頭進行之開孔加工 2持孔之加H由於須限制積層體之印刷基板之積 層數，因此有無法有效率地實施開孔加工之問題。 7 H)係將周知技術中使用雷射對I件W(印刷基 加工出連接孔時之要部在板厚方向之局部放大之截面圖。 參照圖1 0，雖以Φ0日丨 雷射開孔加工出連接孔時，加工出一 =需之時間與以鑽頭加工之情形相較可大幅縮短，： “字雷射之能量強度設為能切斷玻璃纖維m程产之： 時’樹脂U會過度地溶解，而不僅使具底部孔5之： 表面粗度變粗’視情形不同有時甚至 部孔5之内壁彈I如上述，當具底部孔5之== 粗，導電性鍍敷之鍍敷處理中所形成之鍍敷層之厚 ::會不均’使導體層㈣導體…電氣連接之可靠： 扼要言之，透過周知技術之雷射進行之開孔加 由於需嚴密地進行雷射之能量強度之設定值管理以維持孔 之加工精度，因此有無法簡易地實施開孔加工之問題。 本發明係為解決上述門θ§卜 — 述問碭點而完成者，其技術課題在 6 201112899 於提供一種印刷基板之開孔加工方法，可有效活用雷射及 鑽頭，不焚到基板之重疊片數之限制，以良好精度簡易且 有效率地進行開孔加工。 [解決問題之技術手段] 為解決上述課題，本發明之印刷基板之開孔加工方 法，其具有：第1步驟，係對印刷基板之除了周緣部以外 之既定位置使用雷射進行孔加卫；第2步驟，係將經孔加 工之印刷基板以孔之軸方向一致之方式重疊複數片而形成 積層體；以及第3步驟，係使用直徑較孔之直徑大之鑽頭 對積層體中之複數個印刷基板之各孔以沿該孔之軸方向貫 通之方式進行開孔加工，藉此於該積層體形成具有該鑽頭 直徑之貫通孔。 …此情形下，第1步驟中，亦可在使用雷射對印刷基板 進仃孔加工前’先實施於該印刷基板之周緣部之預定位置 形成定位固定用之周緣孔之步驟。 又，第i步驟中，亦可藉由使用雷射之孔加工對印刷 ㈣形成具底部孔；第2步驟中’亦可實施將印刷基板未 露出有具底部孔之側與露出有該具底部孔之側交互重叠成 彼此對接㈣成積層體’且對該積層體之周緣孔插入堆疊 銷’藉此防止各該印刷基板之位置偏移之步驟；第3步驟 中’作為開孔加工，亦可使用鑽頭使積層體之具底部孔貫 通以形成貫通孔。201112899 π - "Where %: [Technical Field of the Invention] In the present invention, the total printed substrate is used for a printed wiring board (hereinafter referred to simply as a hole processing side): a printed circuit board which is efficiently holed and processed with good precision [Prior Art] In the case where the conductive printed circuit board is placed on both sides of the front and back with an insulator interposed therebetween, a hole for connecting the conductor layer (hereinafter referred to as a connecting hole) is formed on the printed circuit board. In the inside of the connection hole: 乂 conductive plating, II electrically connects the conductive layer on the back of the watch. In recent years, with the miniaturization of the machine and the density of the ,, the aperture of the connection hole of the printed circuit board mounted on the electronic device The connection hole is generally sized by 015 to 0 08 mm, and the hole is usually processed by using a drill or a laser. Fig. 7 ' is a monthly diagram of a workpiece when a connecting hole is machined using a drill bit in a known technique. (a) is a plan view thereof, and FIG. 2(b) is a side view thereof, which is a partial enlarged view of the A region of the figure (b). Referring to FIG. 7(a) to (c), here The printed substrate is separated by an insulating layer lz on the surface The conductor layer 1a is disposed on the surface layer, and the conductor layer ib is disposed on the back side. The insulating layer 1 2 is composed of the resin 1 j and the glass fiber 1 g. When the connection hole is formed in the printed circuit board 1 by using a drill, in order to improve the processing efficiency, In general, a layered body in which a plurality of printed boards 1 are stacked is subjected to a hole drilling process, and a through hole (through hole) is formed in the case of a hole drilled by a drill. When the through hole is machined using a drill hole The peripheral hole 2 for positioning and fixing is processed before the pre-twisting position of the periphery of the printed circuit board 1 201112899, and the laminated body 3 is inserted into the laminated body on which the plurality of printed substrates 1 are stacked. Usually, the circumference 孑L 2 In the direction of the board surface, the γ-cut surface has a circular shape, and in order to prevent the printed circuit boards 1 which are stacked as a laminated body from being biased by each other, two or more places are provided for each printed circuit board 1 (here, two places) Peripheral hole 2. Further, the outer diameter of the stacking pin 3 is only slightly larger than the diameter of the circumference "boring hole 2, when the stacking pin 3 is inserted into the peripheral hole 2 and is engaged", the plurality of printed circuit boards U can be Eight pieces) layered body as a layer The use of the stacking pin 3 is also known as a function for positioning the workpiece W. The function of the positioning pin located on the processing platform is referred to, for example, Patent Document 1). Generally, after the through hole is machined by the drill hole, since the thickness of the inner surface of the hole can be made 2 μm or less, when the conductive plating is plated on the inner wall of the hole, a uniform thickness can be formed. The layer is applied to electrically connect the conductor layer U to the conductor layer 1b. Fig. 8 is an explanatory view of a workpiece when a connection hole is formed by laser using a technique of the prior art. Fig. 4 is a plan view of the same. Fig. 8 is a partially enlarged view of a portion B of the figure (4). ...refer to ® 8(4) to (b) ' When the connection hole is formed by laser plus X, the bottom hole 5 is formed from the conductor layer h of the early-print substrate i to the surface of the conductor layer b. When processing the bottom hole, the film substrate 1 is processed one by one, and the time required for the hole to be punched is as large as 10 to 100 times larger than the case of the bit processing. Therefore, the processing speed ( The processing time does not become a problem (see, for example, Patent Document 2). However, in the case of laser processing, the figure is not shown in Fig. 8(b). Since the cone is formed in the axial direction (due to the beam energy of 201112899), the shape of the bottom hole 5 is mostly conical trapezoidal. The straight bottom becomes smaller than the diameter of the hole on the inlet side. Further, although the case where the peripheral hole 2 is provided in the printing substrate is exemplified here, when the connection hole is formed by laser, it is possible to solve the problem of overlapping the plurality of printed circuit boards 1 to form a laminated body without any countermeasure. In this case, the printed substrates i are offset from each other. Therefore, the peripheral holes 2 may not be provided, for example, positioning marks or the like may be provided, and the printed substrate 丨 may be positioned on the stage by other means. [Patent Document 1] [Patent Document 1] Japanese Laid-Open Patent Publication No. SHO63-35-6-A. Fig. 9 is a partially enlarged cross-sectional view showing a part of the prior art in which a drill bit is used to machine a through-hole of a workpiece* of a laminated body. In Fig. 9, the opening of the workpiece w of the laminated body by the drill bit may cause the axis L, N of the target through-hole 4 to be opposite to the surface of the printed substrate i due to the rigidity of the laminated body during the drilling process. The direction perpendicular to the straight line is inclined on the way (thumbnail) or curved on the way as a circle. In the case of such a state, the position of the hole of the through-hole 4 in the lower printed circuit board 1 is lowered to cause a situation in which the allowable value cannot be satisfied. Therefore, the number of overlapping sheets of the printing base & In the case of the example shown in Fig. 9, it is understood that the accuracy of the hole position of the through hole* is increased as long as the number of the printed boards of the laminated body 1 is set to 201112899 to be four or less. The printed circuit board 1 and # use a copper box having a surface layer and a back layer of a resin having a glass fiber, respectively, and a hole having a thickness of 0.1 mm is machined and positioned. The through hole of mm is 4 in shape. If the hole placement accuracy of the lowermost layer is to be limited to ±30 m, the overlap of four pieces is the limit. In other words, the hole is formed by using a drill of a known technique. 2 Since the number of holes in the printed circuit board is limited, it is impossible to efficiently perform the hole drilling process. 7 H) is a cross-sectional view in which the laser beam is applied to the I piece W in the prior art (the portion of the printing base is machined out of the connecting hole in the thickness direction). Referring to FIG. 10, the laser is opened by Φ0. When the hole is machined out of the connecting hole, the time required for processing = can be greatly shortened compared with the case of processing with the drill bit: "The energy intensity of the word laser is set to cut the fiberglass m-process: when the resin U It will dissolve excessively, and not only the bottom hole 5: the surface roughness becomes thicker. Depending on the situation, sometimes even the inner wall of the hole 5 is as described above, when the bottom hole 5 is == thick, conductive plating The thickness of the plating layer formed in the plating treatment: unevenness 'to make the conductor layer (four) conductor... electrical connection reliable: In other words, the opening through the well-known laser is strictly required Since the setting value of the energy intensity of the laser is maintained to maintain the processing accuracy of the hole, there is a problem that the hole drilling cannot be easily performed. The present invention has been made to solve the above-mentioned problem of the above-mentioned door θ § 卜 - Providing a hole for processing a printed substrate at 6 201112899 The method can effectively utilize the laser and the drill bit, and does not incinerate the limitation of the number of overlapping sheets of the substrate, and performs the hole drilling process with good precision in a simple and efficient manner. [Technical means for solving the problem] In order to solve the above problem, the printing of the present invention A method for processing a hole in a substrate, comprising: a first step of using a laser to fix a hole at a predetermined position other than a peripheral portion of the printed circuit board; and a second step of using the hole-processed printed substrate as a hole axis And stacking a plurality of sheets in a uniform manner to form a laminate; and in the third step, using a drill having a diameter larger than that of the hole, the holes of the plurality of printed substrates in the laminate are penetrated in the axial direction of the hole. Opening the hole to form a through hole having the diameter of the drill in the laminated body. In this case, in the first step, the printing substrate may be first applied to the printed substrate before the boring process is performed using the laser. The predetermined position of the peripheral portion forms a peripheral hole for positioning and fixing. Further, in the i-th step, the bottom hole may be formed by printing (4) by using a hole for laser processing; In the step 2, the side on which the printed substrate is not exposed with the bottom hole and the side on which the bottom hole is exposed are alternately overlapped to be butted to each other (4) to form a layered body 'and the peripheral hole of the laminated body is inserted into the stacking pin' This step of preventing the positional displacement of each of the printed boards; in the third step, 'as a hole drilling process, the bottom hole of the laminated body may be penetrated by a drill to form a through hole.
此外，第3步驟中，亦可使用前端角為HO 201112899 [發明之效果] 根據本發明’由於可有效活用雷射及鑽頭，不受到基 板之重疊片數之限制’ α良好精度簡易且有效率地進行開 孔加工，且能良好地維持孔内壁之表面粗度，因此能提升 導電性鍍敷層對孔内壁之表面之鍍敷處理時之收尾可靠 性。亦即，雖因具有以積層體（經由對各印刷基板以雷射= 成具底部孔之動作）之各具底部孔為對象之鑽頭進行貫通孔 之形成之步驟，而使步驟數目較周知手法增加些許，但由 於在使用鑽頭進行開孔加i日寺基板之重疊片數即使為習知 之情形之兩倍以上，亦可良好地保持孔位置之精度，因此 開孔步驟所需之總時間僅會增加些許，而有產業上之效益。 【實施方式】 以下，參照圖式詳細說明本發明之印刷基板之開孔加 工方法。 [實施例1] 圖1係顯示本發明之實施例1之印刷基板之開孔加工 方法之整體加工步驟之流程圖。 在此加工步驟中，首先在使用雷射加工機之雷射對與 以圖7(a)〜（c)所說明者相同構造之印刷基板1進行孔加工 實施於該印刷基板1周緣部之預定位置使用鑽頭形成 疋位固疋用周緣孔2之步驟。此係於印刷基板1加工出(周 緣）孔2之步驟（步驟sl〇)e此外，此步驟係實施以下之第i 步驟前之準備步驟。 201112899 ’、夂’實施第1步驟’亦即對印刷基板i之既定 使用雷射進行從導^ 叮攸導體層U到達導體層lb表面之 中，第1步驟中，係茲山 刀工其 係藉由使用雷射之孔加工對印刷基板i 升〉成具底部孔5 β A α (本例之情形，具底部孔5為圓錐梯形）此 係It由雷射於印刷某杯 加工出具底部孔5之步驟（步驟 一，具底部孔5之直徑（表示具底部孔5之入口側 之直仅）’係先設為較作為目標而指定之連接孔之直徑 J 3〇 "爪程度而形成，此即可實際運用。又，杏將 印刷基板1定位於雷Λ 田、 疋位於雷射加工機之平台時，或進行加 ， 能以周緣孔2為基準進行加工。 且庙實施第2步驟，亦即將經孔加工之印刷基板1 以”底口p孔5之軸方向_较 古 體。 致之方式重疊複數^形成積層 2步驟中’係實施如下步驟，亦即將印刷基 =未露出有具底部孔5之側與露出有該具底部孔5之 父重且成彼此對接（亦即使經加工 =對接)而構成積層體之工件I且對積層體之工件= 此係疊銷，藉此防止各印刷基板1之位置偏移。 =將複數個印刷基板1重疊彙整（工件w)之步驟（步驟 之直之ΐ:第3步驟，亦即使用標稱直徑較具底部孔5 邻 ⑯之鑽頭對積層體中之各印刷基板1之且底 4孔5以沿該等具底部孔5之軸 、 工，内貝通之方式進行孔加 藉此於積層體形成具有鑽頭之直 此係H由_&1# ^ 通孔）。 牙通孔之步驟（步驟S40)。此 201112899 外’所使用之鑽頭’最好係使用前端角為丨10度以下者， 以提升貫通孔（穿通孔）之孔位置精度。 印刷基板1 (積層體之工件w)之開孔加工之加工步驟， 雖於以上已結束’惟係於貫通孔（穿通孔）之内壁表面藉由鍍 敷處理而形成導電性鍵敷層。 圖2 ’係以此處之加工步驟使用雷射加工出連接孔之前 半步驟中之工件W之說明圖，圖2(a)為其俯視圖，圖2(b) 為其側視圖，圖2(c)係圖2(b)之C區域部之部分放大圖。 參照圖2(a)，（b)可知，藉由重疊複數片印刷基板 堆疊銷3插入周緣孔2，而構成積層體。上述第1步驟中使 用雷射進行孔加工時，由於具底部孔5之定位精度係土 1 〇 " m之程度，因此如圖2(c)所示，積層體所成之工件w中各 印刷基板1之具底部孔5之軸線係於積層方向（與印刷基板 1之板面垂直之方向）大致成一直線狀。藉由堆疊銷3而成 為一體構造之各印刷基板丨之積層體所成之工件w係成為 在第3步驟中使用鑽頭開孔之加工對象。 圖3，係以上述加工步驟使用鑽頭6加工出連接孔之後 半步驟中之工件要部在板厚方向之放大載面圖，圖3(a)係與 形成-方之貫通孔(穿通孔4)時相關之圖，^ 3⑻係與兩方 之貫通孔（穿通孔4)均形成後相關之圖。 此處，係顯示上述第3步驟中，藉由與被指定了標稱 直徑之連接孔之直徑相等之口徑之鑽帛6對穿通孔4進行 加工之樣子之圖。參照圖3⑷可知，由於鑽頭“系沿未加工 於各印刷基板1之具底部孔5之軸線方向進行穿孔，因此 10 201112899 即使在對最下層之印刷基板1進行加工之時點於鑽頭6亦 幾乎不會產生彎曲。 本例中’雖將經孔加工之印刷基板之表面與背面交互 積層成彼此對接，但並不限於此，當使用雷射進行加工之 孔相對定位固定用之周緣孔為對稱時，亦可係使經孔加工 之印刷基板之表面與表面、背面與背面成彼此對接。不過， 由於後者之情形未開孔之導體層之厚度實質上係變厚，因 此有時會導致孔位置精度降低。 ㈣-提’因具底部孔5之位置之不均及鑽頭6之軸 線之定位不均（±1〇Am程度之容許範圍），有時會產生穿通 :“之軸線與具底部孔5之軸線不一定同軸之情形。然而， 當穿通孔4之軸線與具底部孔5之軸線之偏移變大時⑼如 在水平面方向之截面形狀成為不倒翁形之情形)或在具底部 孔5之内壁一部分未經加工而殘留之情形，由於穿通孔4 =之表面粗度形成為較小，®此不會成為不良品，而 導電性鍍敷層之鑛敷處理中形成可靠性高之錢敷層。 [變形例1 ] 闯*，你顯示上述加工步驟斛舻嗝由七士 # . Μ ^ ^ ^驟所此適用之積層體所成之 千之第1變形例基本構造 罟冲在板厚方向之放大截面I 此處之積層體所成之工件 ^ _ 1如圖4所示，#蔣力 月1J之卓1步驟中使用逮·身+ Λ '、 + 使用雷射加工出具底部孔5之印刷其妬 與未加工出s <印刷基板 5 Η 之印刷基板卜以已加工出具底部 Ρ刷基板1配置於上部 ' 以上述工件W1A式依序積層之構造。即使 為對象’亦能與實施例1同樣地在第3步 201112899 中使用鑽頭6開孔加工出穿通孔4。此情形下，由於能將在 第1 v驟中之具底部孔5之加工時間與如實施例丨所示作 為對象之工件W般對各印刷基板1全部加工出具底部孔5 之It 1相車交縮短至一帛’因4匕能提升至穿通子匕4之形成為 止之加工效率。 [變形例2] 圖5’係顯示上述加工步驟所能適用之積層體所成之工 件W2之第2變形例基本構造之要部在板厚方向之放大截面 ㈣體所成之工件W2，係如圖5所示，取# 施例1中形成於各印刷In addition, in the third step, the front end angle can also be used as HO 201112899. [Effects of the Invention] According to the present invention, since the laser and the drill can be effectively utilized, the number of overlapping sheets of the substrate is not limited. α Good accuracy is simple and efficient The hole drilling process is performed, and the surface roughness of the inner wall of the hole can be favorably maintained, so that the finishing reliability in the plating treatment of the surface of the inner wall of the hole by the conductive plating layer can be improved. In other words, the number of steps is relatively well known because of the step of forming a through hole for the drill having the bottom hole for the laminated body (through the laser for each printed substrate). Adding a little, but since the number of overlapping sheets of the substrate and the i-ji temple is more than twice as high as in the conventional case, the accuracy of the hole position can be well maintained, so the total time required for the opening step is only It will add a little, but there will be industrial benefits. [Embodiment] Hereinafter, a method of manufacturing a hole for a printed circuit board of the present invention will be described in detail with reference to the drawings. [Embodiment 1] Fig. 1 is a flow chart showing the overall processing procedure of a method for forming a hole in a printed circuit board according to Embodiment 1 of the present invention. In this processing step, first, the printing of the printed circuit board 1 having the same structure as that described in FIGS. 7(a) to (c) is performed on the laser beam of the laser processing machine, and the peripheral portion of the printed circuit board 1 is predetermined. The position is formed by using a drill bit to form the peripheral hole 2 for clamping the solid. This is a step of processing the (peripheral) hole 2 in the printed substrate 1 (step sl1). Further, this step is a preparatory step before the first step i. 201112899 ', 夂 'implementing the first step', that is, the predetermined use of the printed substrate i to the laser from the conductive conductor layer U to the surface of the conductor layer lb, in the first step, the The printed substrate i is lifted into a bottom hole 5 β A α by using a laser hole processing (in the case of this example, the bottom hole 5 is a conical trapezoid). This system is made by laser printing a cup to produce a bottom hole 5 The step (step one, having the diameter of the bottom hole 5 (indicating that the inlet side with the bottom hole 5 is straight) is formed firstly by the diameter J 3 〇 " of the connection hole specified as the target, In this case, the apricot will position the printed substrate 1 on the platform of the laser processing machine, or it can be processed on the basis of the peripheral hole 2. The temple performs the second step. The printed circuit board 1 is also processed by the hole. The axis direction of the bottom hole p hole 5 is relatively old. The method of stacking multiple layers to form the layer 2 step is to perform the following steps, that is, the printing base is not exposed. The side of the bottom hole 5 and the parent exposing the bottom hole 5 And the workpieces I constituting the laminate and the workpieces of the laminates are stacked on each other (even if processed/butted), thereby preventing the positional shift of each printed substrate 1. = Multiple printed substrates 1 Step of overlapping the assembly (workpiece w) (step straight: step 3, that is, using a drill having a nominal diameter of 5 to 16 with the bottom hole 5 to the bottom of each printed substrate 1 in the laminate The shaft, the work, and the inner pass are carried out in such a manner that the hole is formed in the laminated body to form a straight line having a drill bit from the _&1#^ through hole. The step of the through hole (step S40). It is preferable to use the front end angle of 钻头10 degrees or less in this 201112899 to improve the hole position accuracy of the through hole (through hole). The printed substrate 1 (the workpiece w of the laminated body) is opened. The processing step of the hole processing, although completed above, is formed by plating on the inner wall surface of the through hole (through hole) to form a conductive bond layer. Figure 2 'Using the laser in the processing steps here An illustration of the workpiece W in the first half of the process of processing the connection hole, Figure 2(a) 2(b) is a side view thereof, and FIG. 2(c) is a partial enlarged view of a portion C of FIG. 2(b). Referring to FIG. 2(a), (b), by overlapping a plurality of slices The printed circuit board stacking pin 3 is inserted into the peripheral hole 2 to form a laminated body. When the hole is processed by using the laser in the first step, since the positioning accuracy of the bottom hole 5 is the degree of soil 1 〇 " m, as shown in Fig. 2 (c), the axis of the bottom hole 5 of each printed circuit board 1 in the workpiece w formed by the laminated body is substantially linear in the lamination direction (direction perpendicular to the plate surface of the printed circuit board 1). The workpiece w formed by the laminated body of each of the printed boards of the integrated structure is the object to be processed by using the drill hole in the third step. 3 is an enlarged plan view of the main part of the workpiece in the half thickness step after the connection hole is machined by the above-mentioned processing step, and FIG. 3(a) is a through hole formed in the square hole (through hole 4). In the case of the correlation diagram, ^ 3 (8) is formed after the formation of the through holes (through holes 4) of both sides. Here, a view is shown in which the through-hole 4 is processed by the drill collar 6 having the same diameter as the diameter of the connection hole to which the nominal diameter is designated in the third step. Referring to Fig. 3 (4), since the drill bit "is perforated along the axial direction of the bottom hole 5 which is not processed in each printed circuit board 1, 10 201112899 is almost no problem even when the lowermost printed substrate 1 is processed. In this example, the surface of the printed substrate processed by the hole is alternately laminated to each other, but it is not limited thereto, and when the hole for processing by the laser is symmetric with respect to the peripheral hole for positioning and fixing. Alternatively, the surface, the back surface, and the back surface of the printed substrate subjected to the hole processing may be butted against each other. However, since the thickness of the conductor layer which is not opened in the latter case is substantially thick, the positional accuracy of the hole may be sometimes caused. (4) - mention 'Because of the uneven position of the bottom hole 5 and the uneven positioning of the axis of the drill bit 6 (the tolerance range of ±1 〇 Am), sometimes the punch-through is generated: "the axis and the bottom hole 5 The axis is not necessarily coaxial. However, when the deviation of the axis of the through hole 4 from the axis with the bottom hole 5 becomes large (9) as the cross-sectional shape in the horizontal direction becomes a tumbler shape) or a part of the inner wall having the bottom hole 5 is left unprocessed and remains. In this case, since the surface roughness of the through-hole 4 = is formed to be small, this does not become a defective product, and a highly reliable money coating is formed in the mineral deposit treatment of the conductive plating layer. [Modification 1] 闯*, you show that the above-mentioned processing steps are made by the seven-story #. Μ ^ ^ ^ The basic structure of the first variant which is applied to the laminate is applied in the direction of the plate thickness. Enlarged section I The workpiece formed by the laminated body here ^ _ 1 as shown in Fig. 4, #蒋力月1J之卓1 step using the catch body + Λ ', + using the laser processing to produce the bottom hole 5 of the print The printed circuit board which is not processed with the s <printed substrate 5 构造 has a structure in which the bottom squeegee substrate 1 has been processed and disposed on the upper portion in the above-described workpiece W1A. Even in the same manner as in the first embodiment, the through hole 4 can be machined by using the drill 6 in the third step 201112899. In this case, since the processing time of the bottom hole 5 in the first step is the same as that of the workpiece W as shown in the embodiment, the entire printed circuit board 1 can be processed with the bottom hole 5 of the It 1 phase car. The crossover is shortened to one 帛 'because the 4 匕 can be upgraded to the processing efficiency of the formation of the piercing 匕 4 . [Modification 2] Fig. 5' shows a workpiece W2 formed by an enlarged cross section (fourth) in a thickness direction of a main portion of a basic structure of a second modification of the workpiece W2 which is formed by the above-described processing step. As shown in FIG. 5, it is formed in each printing in Example 1.
板之具底部孔5而藉由雷务 谷印刷基板1 1形成圓錐梯形I H卩L ^ 伸办之貝通孔&所積層之構造 即，此處之工件W2中各印刷其刼,, 合P刷基板U之貫通孔 入口側（在圖5之例之情形A 士 γ如、 ^ ' 』滑开夕為大㈣)分別-致於上方側， 出口側（在圖5之例之情形為小徑 方側 當以上述構造之工件W2作為對致於下方側 例1 ’能提升在第3步驟中使夺’由於相較於實 之效率，因此即使更多姆加各£ 開孔加工出穿通子 旎容易地形成穿通孔b 之私層片數， [變形例3] 圖6,係顯示上述加工步驟所能 件W3之第3變形例基本構造之 積層體所成之 圖。 °板厚方向之放大載 此處之積層體所成之工件 件^如圖6所示’係以在變 12 201112899 例2所形成之印刷基板n之一片為核心層，於其兩側將以 單方之主面層為絕緣層之方式構成之印刷基板丨2(積累層 buildup layer)積層成導電層及絕緣層彼此對接而互相貼合 構造之積層基板。其甲，於此處之各積累層12在第1步驟 中使用雷射形成有貫通孔5a’。圖6之例之情形，雖顯示從 各積累層12之導體層側以雷射進行開孔加工者，但並不限 於此，亦可從各積累層12之絕緣層側使用雷射而形成有具 底部孔者。 即使以上述構造之工# W3作為對象，由於相較於實施 例1月b提升在第3步驟中使用鑽頭6開孔加工出穿通孔4 X率’因此即使更多增加各印刷基板12之積層片數，仍 能容易地形成穿通孔4。 【圖式簡單說明】 1之印刷基板之開孔加工 圖1係顯示本發明之實施例 方法之整體加工步驟之流程圖。 圖2，係以圖 孔之前半步驟中之 圖（b)為其側視圖， 圖0 1所說明之加工步驟使用雷射加工出連接 工件之說明圖，該圖（a)為其俯視圖該 該圖U)係該圖（b)之C區域部之部分放^ 圚3，係以圖！所筇 說月之加工步驟使用鑽頭加工出遠接 匕之後半步驟中之工件 ..t 要0卩在板厚方向之放大截面圖 3(a)係與形成—方之言、$ 圖 貫通I通孔時相關之圖，® 3(b)係與兩方 貫通孔均形成後相關之圖。 之 13 201112899 、圖4係顯示圖丨所說明之加工步驟所能適用之積層體 所成之工件之帛i變形例基本構造之要部在板厚方向之放 大截面圖。 、圖5係顯示圖！所說明之加工步驟所能適用之積層體 所成之工件之f 2變形例基本構造之要部在板厚方向之放 大截面圖。 圖6係顯示圖i所說明之加工步驟所能適用之積層體 所成之工件之帛3變形例基本構造之要部在板厚方向之放 大截面圖。 圖7’係周知技術中制鑽頭加工出連接孔時之工件之 說月圖i 7(a)為其俯視圖，7⑻為其側視圖，圖 係圖7(b)之A區域部之部分放大圖。 圖8’係周知技術中使用雷射加工出連接孔時之工件之 說明圖’ _ 8⑷為其俯視圖，目8(b)係圖8⑷之b區域部 之部分放大圖。 圖9係將周知技術中使用鑽頭對積層體之工件加工出 穿通孔時之要部局部放大之截面圖。 圖1〇係將周知技術中使用雷射對工件加工出連接孔時 之要部在板厚方向之局部放大之截面圖。 為其側視圖，該圖（c)係該圖（b)之c區域部之部分放大 圖。 【主要元件符號說明】 1’ 1 1，12 印刷基板 14 201112899 la, lb 導體層 lg 玻璃纖維 lj 樹脂 1 z 絕緣層 2 周緣孔 3 堆疊銷 4 穿通孔（貫通孔） 5 具底部孔 5a, 5a5 貫通孔 6 絕緣層 W, Wl， -W3 工件 15The bottom hole 5 of the plate is formed by the Raymond Valley printed substrate 1 1 to form a conical trapezoidal IH 卩 L ^. The structure of the laminated layer of the beacon hole and the film is formed, that is, each of the workpieces W2 is printed therein. The inlet side of the through-hole of the P-brush substrate U (in the case of the example of Fig. 5, the sigma γ, ^ ' 』 is slid to the next (four)), respectively, to the upper side and the outlet side (in the case of the example of Fig. 5) The side of the small-diameter side is treated as the workpiece W2 of the above-described configuration as the opposite side of the example 1 'can be lifted in the third step because of the efficiency compared to the actual, so even more The number of the private layers of the through-holes b is easily formed by the piercing of the through-holes. [Modification 3] FIG. 6 is a view showing the laminated body of the basic structure of the third modification of the processing member W3. The enlargement of the direction of the workpiece piece formed by the laminated body here is as shown in Fig. 6 as a core layer of the printed circuit board n formed in Example 2 of 201112899, and will be unilateral on both sides thereof. The printed substrate 丨2 (the buildup layer) formed by the surface layer being an insulating layer is laminated to form a conductive layer and the insulating layer are opposite to each other. In the first step, each of the accumulation layers 12 is formed with a through hole 5a' by using a laser. In the case of the example of FIG. 6, the accumulation layer 12 is shown. The conductor layer side is opened by a laser, but the invention is not limited thereto, and a bottom hole may be formed by using a laser from the insulating layer side of each accumulation layer 12. Even the above-mentioned structure #W3 is targeted. Since the through hole 4X is processed by using the drill 6 to open the hole in the third step as compared with the example b b of the embodiment, the through hole can be easily formed even if the number of laminated layers of each of the printed substrates 12 is increased more. 4. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the overall processing steps of the method of the embodiment of the present invention. Fig. 2 is a diagram (b) in the first half of the figure. For the side view, the processing steps illustrated in Fig. 0 1 use laser processing to illustrate the connection of the workpiece, the figure (a) is its top view. The figure U) is the part of the C area of the figure (b). ^ 圚 3, with a picture! According to the processing steps of the month, the workpiece in the second half of the long-distance 加工 is machined using a drill bit..t It is necessary to enlarge the cross-section in the direction of the plate thickness. Figure 3 (a) is formed and formed. For the relevant diagram of the through hole, the relation between the ® 3(b) and the two through holes is formed. 13 201112899 and Fig. 4 show an enlarged cross-sectional view of the main part of the basic structure of the basic structure of the workpiece formed by the laminated body to which the processing steps described in the drawings are applicable. Figure 5 shows the picture! The enlarged cross-sectional view of the main part of the basic structure of the f 2 modified example of the workpiece to which the described processing steps can be applied is in the thickness direction. Fig. 6 is an enlarged cross-sectional view showing the essential part of the basic structure of the ninth modification of the workpiece formed by the laminated body to which the processing steps applicable to the processing steps illustrated in Fig. i are applied. Fig. 7' is a plan view showing a workpiece when the drill bit is machined with a connecting hole in the prior art. i 7 (a) is a plan view thereof, 7 (8) is a side view thereof, and a partial enlarged view of the A portion of the figure 7 (b) is shown. . Fig. 8' is an explanatory view of a workpiece when a connection hole is formed by laser using a laser in the prior art, and Fig. 8(b) is a plan view thereof, and Fig. 8(b) is a partially enlarged view of a portion b of Fig. 8(4). Fig. 9 is a partially enlarged cross-sectional view showing a part of the prior art in which a drill bit is used to machine a workpiece of a laminated body through a through hole. Fig. 1 is a partially enlarged cross-sectional view showing a portion of a portion in the thickness direction when a laser is used to machine a joint hole in a known technique. In the side view, the figure (c) is a partial enlarged view of the area of the area c of the figure (b). [Main component symbol description] 1' 1 1,12 Printed substrate 14 201112899 la, lb Conductor layer lg Glass fiber lj Resin 1 z Insulation layer 2 Peripheral hole 3 Stacking pin 4 Through hole (through hole) 5 With bottom hole 5a, 5a5 Through hole 6 insulation layer W, Wl, -W3 workpiece 15