201112322 六、發明說明： 【發明所屬之_技術領織】 發明領域 ’切削半導體晶圓 本發明係有關於一種使用切削刀片 等被加工物之切削裝置。 L ^tr 發明背景 在半導體元件製程中，以於略呈圓板狀之半導體晶圓 表面排列成格子狀之稱為㈣道的分_定_分複數個 «’於此所劃分之_形成IC、⑽等元件。然後，藉將 半導體晶圓沿著切割道切斷，而分割形成有元件之區域， 而可製造諸個半導體元件。 上述半導體9曰圓之沿著切割道之切斷通常以稱為切割 機之切削裝置進行。此切削裝置具有保持晶圓等被加工物 之炎頭座、具有用以切削保持在該夹頭座之被加工物之切 削刀片的切削機構、用以將夾頭座進行切削進給之切削進 給機構，藉-面將切削刀片旋轉…面將夾頭座進行切削 進給，可切削保持在夾頭座之被加工物。 用於上述切削裝置之切削刀片因使用而產生阻塞或碎 片，切削性能降低，於切削溝兩側產生細小之碎片（碎屬） 或溝寬度大，而有使元件之品質降低之問題。是故，當沿 著10條切割道切削後，拍攝切削溝，檢測切削溝之狀^ 判定是否要將切削刀片修整或更換(例如參照專利文獻D。 先行技術文獻 201112322 專利文獻 專利文獻1 日本專利公開公報平10-312979號 【發明内容】 發明概要 發明欲解決之課題 於是，於晶圓之切割道有形成測試用金屬圖形（TEG) 或被覆有絕緣膜之情形，用以判定以拍攝機構所拍攝之切 削溝狀態之控制機構，可能因對拍攝區域照射之光之強 度，將TEG或絕緣膜誤認為切削溝，儘管實際上切削溝之 狀態為適當，仍發出警報或發出錯誤訊息。因此，雖然實 際上切削溝之狀態適當，但每次操作員都必須因應，而有 使生產性降低之問題。 本發明即是鑑於上述事實而發明者，其主要技術課題 在於提供具有可正確判定以拍攝機構所拍攝之切削溝狀態 之功能的切削裝置。 用以欲解決課題之手段 為解決上述主要技術課題，根據本發明，提供一種切 削裝置，其包含有：夾頭座，係用以保持被加工物者；切 削機構，係具有用以切削被保持在該夾頭座之被加工物之 切削刀片者；拍攝機構，係具有對以該切削機構之切削刀 片所切削之切削溝照射光的光照射器，而以該光照射器對 切削溝照射光，拍攝切削溝者；控制機構係判定以該拍攝 機構所拍攝之切削溝之狀態者；輸入機構係用以將加工條 件輸入至該控制機構者；顯示機構係用以顯示以該拍攝機 201112322 構所拍攝之切削溝之狀態等者；及警報機構；該切削裝置 之特徵在於該控制機構執行切削溝判定步驟及光量學習步 驟，該切削溝判定步驟係依據以該輸入機構所輸入之加工 條件及以該拍攝機構所拍攝之切削溝之狀態，判定切削溝 是否適當者；該光量學習步驟係在該切削溝判定步驟中判 定切削溝不適當時，一面將該拍攝機構之該光照射器之光 量在預定範圍中予以調整，一面判定切削溝是否適當，當 判定切削溝適當時，便將判定為適當時所拍攝之光量作為 修正光量進行變更，當將該拍攝機構之該光照射器之光量 在預定範圍中予以調整，仍判定切削溝不適當時，則使該 警報機構作動，並於該顯示機構顯示錯誤訊息者。 在上述光量學習步驟中，於判定為適當之切削溝有複 數個時，將複數個切削溝與所拍攝之光量顯示於該顯示機 構，並使該警報機構作動。 又，在上述光量學習步驟中，當將該拍攝機構之該光 照射器之光量在預定範圍中予以調整，仍判定切削溝不適 當時，一面將拍攝機構之該光照射器之光量在超過該預定 範圍之範圍中予以調整，一面判定切削溝是否適當，當判 定切削溝適當時，便將判定為適當時所拍攝之光量作為修 正光量進行變更，將該切削溝與所拍攝之光量顯示於該顯 示機構，並使該警報機構作動。 發明效果 由於本發明之切削裝置如以上構成，故在切削溝判定 步驟中判定切削溝不適當時，施行光量學習步驟，該光量 201112322 學習步驟係調整拍攝機構之光照射器之光量，依據所拍攝 之切削溝狀態檢測適當之光量者，故可防止儘管以切削刀 片所切削之切削溝適當，仍因光量不符合而判斷為不適當 所造成之頻繁警報，藉此可提高生產性。 圖式簡單說明 第1圖係以本發明構成之切削裝置之立體圖。 第2圖係顯示裝備於第1圖所示之切削裝置之拍攝機構 及控制機構的塊結構圖。 第3圖係規定了對應於儲存於第2圖所示之控制機構之 隨機存取記憶體的被加工物種類而設定，用以施加於拍攝 機構之光照射器之標準電壓的電壓表。 第4圖係顯示儲存於第2圖所示之控制機構之隨機存取 記憶體之切削刀片厚度與判定切削溝適當與否的寬度之判 定基準之關係的切削溝適當與否判定表。 第5圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝狀態之說明圖。 第6圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝與修正電壓之說明圖。 第7圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的複數個切削溝與修正電壓的說明圖。 第8圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝與修正電壓之另一說明圖。 C實施方式3 用以實施發明之形態 6 201112322 以下，就以本發明構成之切削裝置之較佳實施形態， 參照附加圖式，更詳細說明。 於第1圖顯示以本發明構成之切削裝置之立體圖。第1 圖所示之切削裝置具有略呈長方體狀之裝置殼體2。用以保 持被加工物之夾頭座3以可於箭號X所示之切削進給方向（X 軸方向）移動之狀態配設於此裝置殼體2内。夾頭座3具有夾 頭座本體31及配設於該夾頭座本體31上面之吸附夾頭32， 藉使圖中未示之吸引機構作動，可將為被加工物之晶圓吸 引保持於為該吸附夾頭32上面之保持面上。又，夾頭座3構 造成可以圖中未示之旋轉設備旋轉。此外，於夾頭座本體 31配設有用以固定藉由切割膠帶支撐後述晶圓之環狀框架 之炎器33。如此構成之失頭座3可以圖中未示之切削進給機 構於X軸方向移動。 圖中所示之實施形態之切削裝置具有作為切削機構之 心軸單元4。心軸單元4可以圖中未示之分度進給機構，於 第1圖中以箭號Y顯示之分度進給方向（Y軸方向）移動，並且 可以圖中未示之切入進給機構，於第1圖中以箭號Z所示之 切入進給方向（Z軸方向）移動。此心軸單元4具有裝設於圖 中未示之移動基台，而可於Y軸方向及Z軸方向調整移動之 心軸殼體41、旋轉自如地支撐於該心軸殼體41，並以圖中 未示之伺服馬達旋轉驅動之旋轉心軸42、裝設於該旋轉心 軸42前端部之切削刀片43。於此切削刀片43之兩側配設有 切削水供給喷嘴44。此切削水供給喷嘴44連接於圖中未示 之切削水供給機構。 201112322 圖中所示之貫施形態之切削裝置具有拍攝機構5 ,該拍 攝機構係用以拍攝保持在上述夾頭座3上之被加卫物& 面’以檢測要以上述切削刀片43切削之區域或拍攝以切削 刀片43所切肖彳之切職。又，切職置具有顯示以拍攝機 構所拍攝之圖像等之顯示機構6。此外關於拍攝機構$及 顯示機構6，之後詳細說明。 ;上述裝置殼體2之晶舟載置區域8a配設有用以載置 收谷被加:L物之晶舟之晶舟載置台8。此晶舟載置台8構造 成可以圖中未示之升降機構於上下方向移動。可於晶舟載 置台8上載置收容作為被加工物之半導體晶圓1〇之晶舟9。 收容於晶舟9之半導體晶圓1 〇於矽基板表面形成有格子狀 切J道於以此格子狀切割道所劃分之複數個矩形區域形 成有元件。如此形成之半導體晶圓10可以裡面貼附於裝設 在環狀框架F之切割膠帶T表面之狀態收容於晶舟9。 又’圖中所示之實施形態之切削裝置具有將收容於載 置在晶舟載置台8上之晶舟9的半導體晶圓1〇(藉由切割膠 帶T支樓於環狀框架ρ之狀態）搬出至暫置台u之搬出搬入 機構12、將搬出至暫置台11之半導體晶圓10搬送至上述夾 頭座3之第1搬送機構13、將業經在夾頭座3上切削加工之半 導體晶圓1 〇洗淨之洗淨機構14、將業經在夾頭座3上切削加 工之半導體晶圓10搬送至洗淨機構14之第2搬送機構15。 在此，就上述拍攝機構5，參照第2圖來說明。拍攝機 構5由光照射器51、光學系統52、拍攝器件(CCD)53構成。 光照射器51由鹵素光源構成，其光量可以電壓調整器510調 8 201112322 整。從此光照射器51發出之光藉由光纖511傳送至光學系統 52。光學系統52由外殼521、配設於該外殼521内’將從光 照射器51藉由光纖傳送之光朝圖中下方轉換方向之半鏡 522、配設於該半鏡522之圖中下側之物鏡523構成。上述拍 攝器件(CCD)53透過半鏡522，拍攝來自光照射器51之光藉 由半鏡522及物鏡523而照明之被拍攝體，將所拍攝之圖像 信號送至後述之控制機構。 參照第2圖，繼續說明，圖中所示之實施形態之切削裝 置具有控制機構20。控制機構20以電腦構成，具有根據控 制程式，演算處理之中央處理單元(CPU)201、儲存控制程 式等之唯讀記憶體(R〇M)202、儲存演算結果等之可讀寫之 隨機存取記憶體(RAM)203、輸入介面204及輸出介面205。 可於如此構成之控制機構20之輸入介面205輸入來自上述 拍攝機構5之拍攝器件(CCD)53等之檢測信號，並且從輸入 機構21輸入加工條件等。又’可從輸出介面205將控制信號 輸出至上述顯示機構6 '用以調整施加於上述拍攝機構5之 光照射器51之電壓的電壓調整器510、警報蜂鳴器等警報機 構22。此外’於隨機存取記憶體(RAM)203儲存有第3圖所 示，規定了對應於被加工物種類而設定，用以施加於光照 射器51的標準電壓之電壓表，並且儲存有如第4圖所示，顯 示切削刀片43厚度與判定切削溝適當與否的寬度之判定基 準之關係的切削溝適當與否判定表。如此構成之控制機構 20亦可與用以使切削裝置之各設備作動之控制機構兼用。 圖中所示之實施形態之切削裝置如以上構成，以下， 201112322 就將半導體晶圓1 〇沿預定切割道切斷之切削作業作說明。 收容於載置在晶舟載置台8上之晶舟9之預定位置的半 導體晶圓10 (呈藉由切割膠帶Τ支撐於環狀框架F之狀態）藉 晶舟載置台8以圖中未示之升降機構上下移動，而定位於搬 出位置。接著，搬出搬入機構12進退作動，而將定位於搬 出位置之晶圓10搬出至暫置台11上。搬出至暫置台11之半 導體晶圓10以第1搬送機構13之旋繞動作搬送至上述夾頭 座3上。當將半導體晶圓1〇載置於夾頭座3上後，圖中未示 之吸引機構作動，而將半導體晶圓吸弓丨保持於夾頭座3上。 又，將半導體晶圓10藉由切割膠帶T支撐之支撐框架？以上 述爽器33岐。如此崎聽持有半導體晶圓狀夹頭座3 移動至拍攝機構5之正下方。當失頭座3定位於拍攝機構5之 正下方時’以拍攝機構5檢_成於半導體晶圓ig之切割 道，將心軸單元4於為分度方向之箭號γ方向移動調節，進 =割道與切削刀片43之精密對位作業(校準步驟）。此時， 對半導體晶圓狀表面照射來自光照射器& 預疋光夏之光，以拍攝拍攝區域。 將使夾頭座3移動至切削區域， 定方向旋轉，-面Γ 定量’並—面使其於預 切削料奸 麟有半物晶圓吸夾頭座3於 刀方向之X㈣向（與切削刀片43之 之方向）以財i确進給速度移動，藉此 相乂 上之半導體晶_以_刀片^ ^在失頭座3 削步驟）。在此切削步驟中，切肖，丨:割道切斷(切 水攸切削水供給喷嘴44朝 10 201112322 切肖!刀片43之側面切。如此進行將半導體晶圓1〇沿預 疋=割道切斷後’將失頭座3於Υ財向分度進給切割道之 門隔里細*行上述切削步驟。然後，當沿著形成於半導體 Β曰圓1〇之預疋方向之所有㈣道，施行切肖彳步驟後，使夹 頭座3凝轉9G度’沿著形成於半導體晶_之與狀方向番 直相乂之方向的切割道執行切削步驟，藉此，半導體晶圓 10~著形成格子狀之所有切割道切削’而分割成諸個元 件此外，所分割之諸個元件因切割膠帶Τ之作用，而不致 刀政，維持著支標於環狀框架？之晶圓之狀態。 如上述進行’當沿著形成於半導體晶圓10之所有切割 道知仃切削步驟後，保持有半導體晶圓1〇之夾頭座3返回至 最初吸引保持半導體晶BUG之位置。然後’解除半導體晶 〇之吸引保持。接著，半導體晶圓10(藉由切割膠帶τ支 攆於環狀框架F)以第2搬送機構15搬送至洗淨機構14。搬送 至洗淨機構14之半導體晶圓10在此洗淨。如此進行而洗淨 之半導體晶圓10於乾燥後，以第丨搬送機構13搬送至暫置台 11。之後，半導體晶圓10以搬出搬入機構12收納於晶舟9之 預定仇置。 因施行上述切削步驟’切削刀片43產生阻塞或碎片， 刀削性能降低，於切削溝兩側產生細小之碎片（碎屑）或溝寬 度大’而有使元件之品質降低之問題。是故，當沿著1〇條 切割道切削後’拍攝切削溝，檢測切削溝之狀態，以判定 是否需修整或更換切削刀片43。以下，就以切削刀片43所 切削之切削溝之判定方法作說明。此外，於控制機構2〇從 11 201112322 輸入機構21輸入有被加工物之種類（在圖中所示之實施形 態中’為第3圖所示之電壓表之被加工物B) ’並且輸入有切 削刀片43之厚度(在圖中所示之實施形態中，為20 μ m)。如 此進行’當從輸入機構21輸入加工條件後，控制機構2〇將 所輸入之加工條件顯示於顯示機構6。 當沿著形成於半導體晶圓10之1 〇條切割道施行上述切 削步驟後’使保持有半導體晶圓1 〇之夾頭座3移動至拍攝機 構5之正下方，將最後所切削之切削溝定位於拍攝區域。然 後’控制機構20控制電壓調整器510，俾將對應於從輸入機 構21輸入之被加工物種類（在圖中所示之實施形態中，為被 加工物B)之標準電壓（例如7.5 V)施加於拍攝機構5之光照射 器51。如此進行，當於光照射器51施加7.5V之電壓時，光 照射器51便發出對應於所施加之電壓之光量的光。從光照 射器51所發出之光藉由光纖511、半鏡522及物鏡523，照射 至形成於半導晶圓10之最後切削之切削溝。如此進行，在 對最後切削之切削溝照射光之狀態下，控制機構20使拍攝 器件(CCD)53作動，拍攝切削溝，而輸入其圖像信號。 如上述，輸入了以拍攝器件(CCD)53所拍攝之圖像信號 之控制機構20如第5圖所示，將所拍攝之切削溝11〇之狀態 顯示於顯示機構6。此外’於顯示機構6 ’切削溝11〇之長度 L以5mm之範圍顯示。然後，控制機構20執行依據顯示於顯 示機構6之切削溝11〇之狀態’判定切削溝是否適當之切削 溝判定步驟。首先，控制機構20依據上述第4圖所示之切削 溝適當與否判定表’判定顯示於顯示機構6之切削溝11〇之 12 201112322 寬度Η。即，控制機構20於為以厚度20//m之切削刀片43所 切削之切削溝時，若切削溝110之寬度Η不到3〇vm，便判 定為適當’若切削溝110之寬度Η為30μπι以上時，則判定 為不適當。接著’控制機構20判定於顯示於顯示機構6之切 削溝110雨側產生之碎屑（碎片）111之數。即，控制機構20 於在顯示於顯示機構6之切削溝11〇之範圍（長度5mm)產生 於兩側的碎屑（碎片）111之數不到10個時，判定為適性，於 產生於切削溝110兩側之碎屑（碎片）111之數為10個以上 時，則判定為不適當。 如以上進行’執行切削溝判定步驟，當判定為切削溝 110之狀態適當時，控制機構20接著執行上述切削步驟。另 一方面，當判定為切削溝110不適當時，控制機構20—面將 拍攝機構5之光照射器51之光量在預定範圍調整，一面判定 切削溝110適當與否。即，控制機構2〇—面控制電壓調整器 510，將施加於光照射器51之電壓在7 5V±5%之範圍調整， 一面拍攝切削溝110,如第6圖所示，將判定為切削溝11〇適 當時之施加電壓（在圖中所示之實施形態，為7 8”作為適當 光量而顯示於顯示機構6(光量學習步驟）。然後，控制機構 20接者進行上仙肖，丨步驟。如此進行，將判定為切削溝 適當時之施加錢(修正電壓：7 8v)作為修正光量而顯示於 顯不機構6 ’並且’在之後之切肖彳溝判定步驟，將施加於光 照射器51之電壓變更為修正電壓。 另一方面，即使執行上述光量學習步驟仍判定為切 削溝110不適當時’控制機構2G將錯誤訊息輸出至顯示機構 13 201112322 6，並使警報機構22作動，發出警報。依據此警報’操作員 確認顯示於顯示機構6之錯誤訊息，施行切削刀片之修整或 更換作業。 在上述實施形態，由於在切削溝判定步驟’判定為切 削溝110不適當時，施行依據調整來自拍攝機構5之光照射 器51照射之光的光量而拍攝之切削溝u〇狀態，檢測適當之 光量之光量學習步驟，故可防止儘管以切削刀片所切削之 切削溝適當，光量不符合，仍判斷為不適當，而頻繁地發 出警報’而可使生產性提高。 接著，就上述光量學習步驟之另一實施形態作說明。 控制機構20—面控制電壓調整器510 ’將施加於光照射 器51之電壓在7.5V±5%之範圍每1%便調整，一面判定所拍 攝之切削溝110是否適當。然後，於判定為適當之切削溝11〇 之狀態為複數時，控制機構2〇如第7圖所示，將判定為適當 之切削溝110之狀態及施加電壓作為適當光量而顯示於顯 示機構6，並使警報機構22作動。依據此警報機構22之作 動，操作員確認顯示於顯示機構6之圖像（判定為適當之切 削溝110之狀態及施加電壓），在畫面上選擇判斷為較適當 之1個，藉此，控制機構20修正之後施加於光照射器51之電 壓(修正電壓：修正光量）。此外，操作員亦可從輸入機構21 輸入上述修正電壓。如此進行，藉選擇判斷為更適當之施 加電壓(修正電壓），在之後之切削溝判定步驟，不致頻繁地 發出警報，而可平順地執行適當之判定。 接著’就上述光量學習步驟之又s ^ ^鄉炙又另一貫施形態作說明。 14 201112322 如上述，一面控制電壓調整器51 〇，將施加於光照射器 51之電壓在7.5V±5%之範圍調整，一面判定所拍攝之切削 溝510為不適當時，控制機構20在施加於光照射器51之電壓 超過上述預定範圍（7.5V±5%)之範圍，施行光量學習步驟。 即，控制機構20—面將施加於光照射器51之電壓在對應於 第3圖所示之電壓表之被加工物A，C，D的標準電壓±5%、即 6.5V±5%、8.5V±5%、9.5V士5%之範圍調整，一面判定所拍 攝之切削溝110是否適當。接著，如第8圖所示，將判定為 適當時之切削溝110之狀態及施加電壓（在圖中所示之實施 形態為9.5V)作為適當光量而顯示於顯示機構6，並使警報 機構22作動。依據此警報機構22之作動，操作員確認顯示 於顯示機構6之圖像（判定為適當之切削溝11〇之狀態及施 加電壓）’若適當，便點擊晝面上之〇Κ鈕，藉此，控制機構 20將該施加電壓修正作為之後施加於光照射器51之電壓。 此外’操作員亦可從輸入機構21輸入顯示於晝面之施加電 壓。 如此，即使施行最初之光量學習步驟，而仍未檢測出 施加於光照射器51之適當電壓時，由於在超過最初之光量 學習步驟之預定範圍之範圍施行光量學習步驟，故亦可因 應從輸入機構21輸入之被加工物種類之輸入失誤。 【圖式簡單請^明】 第1圖係以本發明構成之切削裝置之立體圖。 第2圖係顯示裝備於第1圖所示之切削裝置之拍攝機構 及控制機構的塊結構圖。 15 201112322 第3圖係規定了對應於儲存於第2圖所示之控制機構之 隨機存取記憶體的被加工物種類而設定，用以施加於拍攝 機構之光照射器之標準電壓的電壓表。 第4圖係顯示儲存於第2圖所示之控制機構之隨機存取 記憶體之切削刀片厚度與判定切削溝適當與否的寬度之判 定基準之關係的切削溝適當與否判定表。 第5圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝狀態之說明圖。 第6圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝與修正電壓之說明圖。 第7圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的複數個切削溝與修正電壓的說明圖。 第8圖係顯示在裝備於第1圖所示之切削裝置之顯示機 構顯示的切削溝與修正電壓之另一說明圖。 【主要元件符號說明】 2...裝置殼體 11...暫置台 3...夾頭座 12...搬出搬入機構 4...心軸單元 13...第1搬送機構 5...拍攝機構 14...洗淨機構 6...顯示機構 15...第2搬送機構 8...晶舟載置台 20...控制機構 8a...晶舟載置區域 21...輸入機構 9...晶舟 22...警報機構 10...半導體晶圓 31...夾頭座本體 16 201112322 32.. .吸附夾頭 33.. .夾器 40.··殼體蓋 41.. .心軸殼體 42.. .旋轉心軸 43.. .切削刀片 44.. .切削水供給喷嘴 51.. .光照射器 52.. .光學系統 53.. .拍攝器件 110.. .切削溝 111…碎屑(碎片） 201.. .中央處理裝置(CPU) 202···唯讀記憶體(ROM) 203…隨機存取記憶體(RAM) 204.. .輸入介面 205.. .輸出介面 510.. .電壓調整器 511.. .光纖 521.. .外殼 522.. .半鏡 523.. .物鏡 F...環狀框架 H...寬度 T...切割膠帶 X，Y，Z...方向 17BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting apparatus using a workpiece such as a cutting insert. L ^tr BACKGROUND OF THE INVENTION In a semiconductor device process, a semiconductor wafer surface having a substantially circular plate shape is arranged in a lattice shape, and is called a (four) track. , (10) and other components. Then, by cutting the semiconductor wafer along the dicing street and dividing the region where the element is formed, it is possible to manufacture the semiconductor elements. The cutting of the above-mentioned semiconductor 9 turns along the dicing line is usually performed by a cutting device called a cutter. The cutting device has a head holder for holding a workpiece such as a wafer, a cutting mechanism having a cutting insert for cutting a workpiece to be held in the chuck holder, and cutting for cutting the chuck holder. For the mechanism, the cutting blade is rotated by the surface, and the chuck holder is cut and fed to cut the workpiece to be held in the chuck holder. The cutting insert used in the above cutting device is clogged or chipped due to use, and the cutting performance is lowered, and fine debris (fragment) or groove width is generated on both sides of the cutting groove, and the quality of the element is lowered. Therefore, when cutting along 10 cutting passes, the cutting groove is photographed, and the shape of the cutting groove is detected to determine whether or not the cutting insert is to be trimmed or replaced (for example, refer to Patent Document D. First Technical Document 201112322 Patent Document Patent Document 1 Japanese Patent SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION Therefore, in the case where a test metal pattern (TEG) or an insulating film is formed on a dicing street of a wafer, it is determined by a photographing mechanism. The control mechanism of the cutting groove state may mistake the TEG or the insulating film for the cutting groove due to the intensity of the light irradiated to the shooting area, and although an actual state of the cutting groove is appropriate, an alarm or an error message is issued. Although the state of the cutting groove is actually appropriate, there is a problem that the productivity is lowered every time the operator has to respond. The present invention has been invented in view of the above facts, and its main technical object is to provide a correct judgment for shooting. The cutting device that functions as a cutting groove in the mechanism. The means used to solve the problem is the solution. According to the present invention, there is provided a cutting apparatus comprising: a chuck holder for holding a workpiece; and a cutting mechanism having a workpiece for cutting the workpiece held in the chuck holder The cutting blade has a light illuminator that illuminates the cutting groove cut by the cutting insert of the cutting mechanism, and the light illuminator irradiates the cutting groove with light to capture the cutting groove; the control mechanism is Determining the state of the cutting groove captured by the shooting mechanism; the input mechanism is for inputting the processing condition to the control mechanism; and the display mechanism is for displaying the state of the cutting groove captured by the camera 201112322 And an alarm mechanism; the cutting device is characterized in that the control mechanism performs a cutting groove determining step and a light amount learning step, the cutting groove determining step is based on a processing condition input by the input mechanism and a cutting groove taken by the shooting mechanism a state in which it is determined whether the cutting groove is appropriate; the light amount learning step determines that the cutting groove is not in the cutting groove determining step At that time, when the amount of light of the light irradiator of the imaging mechanism is adjusted within a predetermined range, it is determined whether or not the cutting groove is appropriate. When it is determined that the cutting groove is appropriate, the amount of light captured when it is determined to be appropriate is changed as the corrected light amount. When the amount of light of the light illuminator of the photographing mechanism is adjusted within a predetermined range, and it is determined that the cutting groove is unsuitable, the alarm mechanism is activated, and an error message is displayed on the display mechanism. In the light amount learning step. When there are a plurality of cutting grooves determined to be appropriate, a plurality of cutting grooves and the amount of light to be captured are displayed on the display mechanism, and the alarm mechanism is activated. In the light amount learning step, the imaging mechanism is used. The amount of light of the light illuminator is adjusted within a predetermined range, and it is determined that the cutting groove is inappropriate, and the amount of light of the light illuminator of the imaging mechanism is adjusted within a range exceeding the predetermined range, and it is determined whether the cutting groove is appropriate. When it is determined that the cutting groove is appropriate, the amount of light taken when it is determined to be appropriate is used as the amount of corrected light. The row is changed, the cutting groove and the amount of light captured are displayed on the display mechanism, and the alarm mechanism is actuated. Advantageous Effects of Invention Since the cutting apparatus of the present invention is configured as described above, in the cutting groove determining step, it is determined that the cutting groove is not appropriate, and the light amount learning step is performed, and the light amount 201112322 learning step adjusts the amount of light of the light irradiator of the photographing mechanism, according to the photographed Since it is possible to detect an appropriate amount of light in the state of the cutting groove, it is possible to prevent a frequent alarm caused by an inaccurate amount of light due to the fact that the cutting groove cut by the cutting insert is appropriate, thereby improving productivity. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus constructed in accordance with the present invention. Fig. 2 is a block diagram showing the photographing mechanism and the control mechanism of the cutting device shown in Fig. 1. Fig. 3 is a voltmeter for setting a standard voltage for applying to the light irradiator of the photographing mechanism in accordance with the type of the workpiece to be stored in the random access memory of the control unit shown in Fig. 2. Fig. 4 is a view showing a cutting groove appropriateness determination table showing the relationship between the thickness of the cutting insert stored in the random access memory of the control unit shown in Fig. 2 and the determination criteria for determining the width of the cutting groove. Fig. 5 is an explanatory view showing a state of a cutting groove displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 6 is an explanatory view showing a cutting groove and a correction voltage displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 7 is an explanatory view showing a plurality of cutting grooves and correction voltages displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 8 is another explanatory view showing the cutting groove and the correction voltage displayed on the display mechanism of the cutting device shown in Fig. 1. C. Embodiment 3 Mode for Carrying Out the Invention 6 201112322 Hereinafter, a preferred embodiment of a cutting apparatus constructed by the present invention will be described in more detail with reference to additional drawings. Fig. 1 is a perspective view showing a cutting apparatus constructed in accordance with the present invention. The cutting device shown in Fig. 1 has a device housing 2 having a substantially rectangular parallelepiped shape. The chuck holder 3 for holding the workpiece is disposed in the apparatus casing 2 in a state in which it can be moved in the cutting feed direction (X-axis direction) indicated by the arrow X. The chuck base 3 has a chuck base body 31 and an adsorption chuck 32 disposed on the top of the chuck base body 31, so that the suction mechanism of the workpiece can be sucked and held by the suction mechanism (not shown). It is the holding surface above the adsorption chuck 32. Further, the collet holder 3 is configured to be rotatable by a rotating device not shown. Further, the collet holder body 31 is provided with an ejector 33 for fixing an annular frame for supporting a wafer to be described later by a dicing tape. The lost head holder 3 thus constructed can be moved in the X-axis direction by a cutting feed mechanism (not shown). The cutting device of the embodiment shown in the drawings has a spindle unit 4 as a cutting mechanism. The spindle unit 4 can be moved by the indexing feed mechanism (not shown), and is moved in the indexing feed direction (Y-axis direction) indicated by the arrow Y in FIG. 1, and can be cut into the feed mechanism not shown. In Fig. 1, the cutting direction (Z-axis direction) shown by the arrow Z is moved. The spindle unit 4 has a movable base that is mounted on a moving base (not shown), and is rotatably supported by the spindle housing 41 in the Y-axis direction and the Z-axis direction, and is rotatably supported by the spindle housing 41. A rotary mandrel 42 that is rotationally driven by a servo motor (not shown) and a cutting insert 43 that is attached to a front end portion of the rotary mandrel 42 are provided. A cutting water supply nozzle 44 is disposed on both sides of the cutting insert 43. This cutting water supply nozzle 44 is connected to a cutting water supply mechanism (not shown). 201112322 The cutting device of the embodiment shown in the figure has a photographing mechanism 5 for photographing the object being held on the above-mentioned chuck holder 3 to detect that the cutting blade 43 is to be cut. The area or shooting is cut by the cutting blade 43. Further, the cutting position has a display mechanism 6 for displaying an image or the like taken by the photographing mechanism. Further, the photographing mechanism $ and the display mechanism 6 will be described in detail later. The boat loading area 8a of the apparatus casing 2 is provided with a boat mounting table 8 for placing a wafer boat in which the grain is added: L. The boat mounting table 8 is constructed to be movable in the up and down direction by a lifting mechanism not shown. A wafer boat 9 that accommodates a semiconductor wafer 1 as a workpiece can be placed on the wafer deck 8 . The semiconductor wafer 1 accommodated in the wafer boat 9 has a lattice-shaped J-channel formed on the surface of the substrate, and a plurality of rectangular regions defined by the lattice-shaped dicing streets are formed with elements. The semiconductor wafer 10 thus formed can be housed in the wafer boat 9 in a state of being attached to the surface of the dicing tape T attached to the annular frame F. Further, the cutting device of the embodiment shown in the drawing has a semiconductor wafer 1 收容 accommodated in the wafer boat 9 placed on the wafer boat mounting table 8 (the state of the ring frame ρ by the dicing tape T The unloading and loading mechanism 12 that has been carried out to the temporary stage u, the first transfer mechanism 13 that transports the semiconductor wafer 10 that has been carried out to the temporary stage 11 to the chuck holder 3, and the semiconductor crystal that has been cut by the chuck holder 3 The circular cleaning mechanism 14 transports the semiconductor wafer 10 that has been cut by the chuck holder 3 to the second transfer mechanism 15 of the cleaning mechanism 14. Here, the imaging unit 5 will be described with reference to FIG. 2 . The photographing mechanism 5 is composed of a light irradiator 51, an optical system 52, and an imaging device (CCD) 53. The light illuminator 51 is composed of a halogen light source, and its light amount can be adjusted by the voltage regulator 510. Light emitted from the light illuminator 51 is transmitted to the optical system 52 via the optical fiber 511. The optical system 52 is disposed in the casing 521, and a half mirror 522 disposed in the casing 521 from the light irradiated by the optical illuminator 51 toward the lower side in the drawing, and disposed on the lower side of the half mirror 522 The objective lens 523 is constructed. The above-described photographing device (CCD) 53 passes through the half mirror 522, and photographs the subject from which the light from the light irradiator 51 is illuminated by the half mirror 522 and the objective lens 523, and sends the captured image signal to a control unit to be described later. Referring to Fig. 2, the description will continue with the description of the cutting device of the embodiment shown in the drawings having a control mechanism 20. The control unit 20 is constituted by a computer, and has a central processing unit (CPU) 201 which performs calculation processing according to a control program, a read-only memory (R〇M) 202 such as a storage control program, and a readable and writable random storage and storage result. A memory (RAM) 203, an input interface 204, and an output interface 205 are taken. The detection signal from the imaging device (CCD) 53 or the like of the above-described imaging unit 5 can be input to the input interface 205 of the control unit 20 thus constructed, and processing conditions and the like can be input from the input unit 21. Further, the control means can output a control signal from the output interface 205 to the display means 6' for adjusting the voltage regulator 510 of the light illuminator 51 of the imaging means 5, and an alarm mechanism 22 such as an alarm buzzer. Further, in the random access memory (RAM) 203, as shown in FIG. 3, a voltmeter for setting a standard voltage applied to the light illuminator 51 corresponding to the type of the workpiece is defined, and the voltmeter is stored as described in the first figure. 4 shows a cutting groove appropriateness determination table showing the relationship between the thickness of the cutting insert 43 and the criterion for determining the width of the cutting groove. The control mechanism 20 thus constructed can also be used in combination with a control mechanism for actuating the various devices of the cutting device. The cutting apparatus of the embodiment shown in the figure is configured as described above. Hereinafter, 201112322 describes a cutting operation in which the semiconductor wafer 1 is cut along a predetermined scribe line. The semiconductor wafer 10 (in a state of being supported by the dicing tape Τ in the annular frame F) is placed in a predetermined position of the wafer boat 9 placed on the boat mounting table 8 by the boat mounting table 8 (not shown) The lifting mechanism moves up and down and is positioned at the carry-out position. Then, the carry-in/out mechanism 12 moves forward and backward, and the wafer 10 positioned at the carry-out position is carried out to the temporary stage 11. The semiconductor wafer 10 that has been carried out to the temporary stage 11 is transported to the above-described chuck holder 3 by the winding operation of the first transfer mechanism 13. After the semiconductor wafer 1 is placed on the chuck holder 3, the suction mechanism (not shown) is actuated to hold the semiconductor wafer suction tab on the chuck holder 3. Also, the support frame of the semiconductor wafer 10 supported by the dicing tape T? The above description is 33. Thus, the semiconductor wafer holder 3 is moved to the lower side of the photographing mechanism 5. When the head rest 3 is positioned directly below the photographing mechanism 5, 'the photographing mechanism 5 detects the cut line formed on the semiconductor wafer ig, and moves the spindle unit 4 in the direction of the arrow γ in the indexing direction. = Precision alignment of the cutting path with the cutting insert 43 (calibration step). At this time, the semiconductor wafer-like surface is irradiated with light from the light illuminator & The chuck holder 3 will be moved to the cutting area, and the direction will be rotated, and the - face Γ quantitative 'and the surface will be made in the pre-cutting material. There is a half-object wafer chuck 3 in the knife direction X (four) direction (with cutting The direction of the blade 43 is moved at the feed rate by the i.e., so that the semiconductor crystal is _ blade ^ ^ in the head block 3 cutting step). In this cutting step, cut: 割: cut cut (cut water cutting water supply nozzle 44 is cut toward 10 201112322! The side of the blade 43 is cut. Thus, the semiconductor wafer 1 is preliminarily = cut After cutting off, the above-mentioned cutting step is performed by the missing head seat 3 in the door of the cutting channel. Then, along all the (four) roads formed in the direction of the semiconductor circle After performing the cutting step, the chuck holder 3 is condensed at 9 G degrees to perform a cutting step along a scribe line formed in a direction perpendicular to the direction of the semiconductor crystal, whereby the semiconductor wafer 10~ The cutting of all the cutting lines forming a lattice shape is divided into the components. In addition, the divided components are not slashed by the action of the cutting tape, and the state of the wafer supported by the annular frame is maintained. As described above, after the cutting step is performed along all the dicing streets formed on the semiconductor wafer 10, the chuck holder 3 holding the semiconductor wafer 1 is returned to the position where the semiconductor crystal BUG is initially attracted and then released. The attraction of the semiconductor wafer is maintained. Then, The conductor wafer 10 (supported by the dicing tape τ on the annular frame F) is transported to the cleaning mechanism 14 by the second transport mechanism 15. The semiconductor wafer 10 transported to the cleaning mechanism 14 is washed here. After the cleaned semiconductor wafer 10 is dried, it is transported to the temporary stage 11 by the second transport mechanism 13. Thereafter, the semiconductor wafer 10 is stored in the wafer boat 9 by the carry-in/out mechanism 12. The above-described cutting step is performed. The cutting insert 43 is clogged or chipped, the cutting performance is lowered, and fine fragments (chips) or groove widths are generated on both sides of the cutting groove, and there is a problem that the quality of the element is lowered. After the cutting of the cutting pass, the cutting groove is photographed, and the state of the cutting groove is detected to determine whether or not the cutting insert 43 needs to be trimmed or replaced. Hereinafter, the method of determining the cutting groove cut by the cutting insert 43 will be described. Further, in the control mechanism 2 〇11 201112322 The input mechanism 21 inputs the type of the workpiece (in the embodiment shown in the figure, 'the workpiece B of the voltmeter shown in FIG. 3') and the thickness of the cutting insert 43 is input ( in In the embodiment shown in the figure, it is 20 μm). When the processing conditions are input from the input mechanism 21, the control unit 2 displays the input processing conditions on the display mechanism 6. When formed along the semiconductor crystal After the above-mentioned cutting step is performed, the first cutting step of the round 10 is performed to move the chuck holder 3 holding the semiconductor wafer 1 to the directly below the photographing mechanism 5, and to position the last cut cutting groove in the photographing area. The control unit 20 controls the voltage regulator 510 to apply a standard voltage (for example, 7.5 V) corresponding to the type of the workpiece to be processed (in the embodiment shown in the drawing, the workpiece B) from the input mechanism 21. The light irradiator 51 of the photographing mechanism 5 is thus operated, and when a voltage of 7.5 V is applied to the light irradiator 51, the light irradiator 51 emits light corresponding to the amount of light of the applied voltage. The light emitted from the illuminator 51 is irradiated to the cutting groove formed at the last cutting of the semiconductor wafer 10 by the optical fiber 511, the half mirror 522, and the objective lens 523. In this manner, in a state where the last cutting groove is irradiated with light, the control unit 20 activates the imaging device (CCD) 53, captures the cutting groove, and inputs the image signal. As described above, the control unit 20 that has input the image signal captured by the imaging device (CCD) 53 displays the state of the captured cutting groove 11 on the display unit 6 as shown in Fig. 5. Further, the length L of the cutting groove 11' of the display mechanism 6' is displayed in a range of 5 mm. Then, the control unit 20 executes a cutting groove determining step of determining whether or not the cutting groove is appropriate in accordance with the state of the cutting groove 11〇 displayed on the display unit 6. First, the control unit 20 determines the width Η 12 201112322 of the cutting groove 11 显示 displayed on the display mechanism 6 in accordance with the cutting groove appropriateness determination table ' shown in Fig. 4 . That is, when the control mechanism 20 is a cutting groove cut by the cutting insert 43 having a thickness of 20/m, if the width 切削 of the cutting groove 110 is less than 3 〇 vm, it is determined to be appropriate 'If the width of the cutting groove 110 is Η When it is 30 μπι or more, it is judged to be inappropriate. Next, the control unit 20 determines the number of debris (fragments) 111 generated on the rain side of the cutting groove 110 displayed on the display mechanism 6. In other words, when the number of the chips (fragments) 111 generated on both sides in the range (length: 5 mm) of the cutting groove 11〇 displayed on the display unit 6 is less than ten, the control unit 20 determines that it is suitable for cutting. When the number of pieces of debris (fragments) 111 on both sides of the groove 110 is 10 or more, it is judged to be inappropriate. When the cutting groove determination step is performed as described above, when it is determined that the state of the cutting groove 110 is appropriate, the control mechanism 20 then executes the above-described cutting step. On the other hand, when it is determined that the cutting groove 110 is not appropriate, the control mechanism 20-side adjusts the light amount of the light irradiator 51 of the photographing mechanism 5 within a predetermined range, and determines whether the cutting groove 110 is appropriate or not. In other words, the control unit 2 controls the voltage regulator 510 to adjust the voltage applied to the light irradiator 51 within a range of 75 V ± 5%, and photographs the cutting groove 110. As shown in Fig. 6, it is determined that the cutting is performed. The voltage applied to the trench 11 (in the embodiment shown in the figure is 7 8) is displayed as an appropriate amount of light on the display unit 6 (light amount learning step). Then, the control unit 20 picks up the upper fairy, 丨In this way, it is determined that the application of the money (correction voltage: 7 8v) as the corrected light amount is displayed on the display mechanism 6' and the subsequent cut-off determination step is applied to the light irradiation. On the other hand, even if the light amount learning step is performed, it is determined that the cutting groove 110 is not appropriate. The control mechanism 2G outputs an error message to the display mechanism 13 201112322 6, and causes the alarm mechanism 22 to actuate. According to this alarm, the operator confirms the error message displayed on the display mechanism 6 and performs the trimming or replacement of the cutting insert. In the above embodiment, the determination is made in the cutting groove. When it is determined that the cutting groove 110 is not suitable, the cutting amount is detected based on the amount of light irradiated from the light irradiator 51 of the imaging unit 5, and the light amount learning step of detecting the appropriate amount of light is performed, so that it is possible to prevent The cutting groove cut by the cutting insert is appropriate, the amount of light is not matched, and it is judged to be inappropriate, and the alarm is frequently issued to improve the productivity. Next, another embodiment of the above-described light amount learning step will be described. The surface control voltage regulator 510' determines whether the captured cutting groove 110 is appropriate by adjusting the voltage applied to the light irradiator 51 every 1% in the range of 7.5 V ± 5%. Then, it is determined that the cutting is appropriate. When the state of the groove 11 is plural, the control means 2 displays the state of the cutting groove 110 and the applied voltage as appropriate light amounts on the display means 6 as shown in Fig. 7, and causes the alarm mechanism 22 to operate. According to the operation of the alarm mechanism 22, the operator confirms the image displayed on the display unit 6 (the state of the cutting groove 110 determined to be appropriate and the applied voltage), on the screen. The control unit 20 corrects the voltage applied to the light irradiator 51 (corrected voltage: corrected light amount). The operator can also input the corrected voltage from the input unit 21 as described above. By selecting the judgment to apply the voltage (correction voltage) more appropriately, in the subsequent cutting groove determination step, the alarm is not frequently issued, and the appropriate determination can be smoothly performed. Then, the above-mentioned light amount learning step is again s ^ ^ The same is true for the homesickness. 14 201112322 As described above, while controlling the voltage regulator 51 〇, the voltage applied to the light illuminator 51 is adjusted within a range of 7.5 V ± 5%, and the captured cutting groove 510 is determined. In the case of discomfort, the control unit 20 performs a light amount learning step in a range in which the voltage applied to the light irradiator 51 exceeds the above-described predetermined range (7.5 V ± 5%). That is, the voltage applied to the light irradiator 51 by the control mechanism 20 is ±5% of the standard voltage of the workpieces A, C, and D corresponding to the voltmeter shown in FIG. 3, that is, 6.5 V±5%. The range of 8.5V±5% and 9.5V 5% is adjusted, and it is determined whether or not the cutting groove 110 to be photographed is appropriate. Next, as shown in FIG. 8, the state of the cutting groove 110 and the applied voltage (9.5 V in the embodiment shown in the drawing) are displayed as appropriate light amounts on the display unit 6, and the alarm mechanism is provided. 22 action. According to the operation of the alarm mechanism 22, the operator confirms the image displayed on the display unit 6 (the state of the cutting groove 11 is determined to be appropriate and the voltage applied). If appropriate, the button on the face is clicked. The control unit 20 corrects the applied voltage as the voltage applied to the light irradiator 51 later. Further, the operator can also input the applied voltage displayed on the kneading surface from the input mechanism 21. Thus, even if the initial light amount learning step is performed and the appropriate voltage applied to the light irradiator 51 is not detected, since the light amount learning step is performed in a range exceeding a predetermined range of the initial light amount learning step, the input can be taken from the input. The input error of the type of workpiece to be input by the mechanism 21 is incorrect. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view of a cutting apparatus constructed by the present invention. Fig. 2 is a block diagram showing the photographing mechanism and the control mechanism of the cutting device shown in Fig. 1. 15 201112322 Fig. 3 is a voltmeter for setting the standard voltage of the light illuminator applied to the photographing mechanism in accordance with the type of the workpiece to be stored in the random access memory of the control unit shown in Fig. 2; . Fig. 4 is a view showing a cutting groove appropriateness determination table showing the relationship between the thickness of the cutting insert stored in the random access memory of the control unit shown in Fig. 2 and the determination criteria for determining the width of the cutting groove. Fig. 5 is an explanatory view showing a state of a cutting groove displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 6 is an explanatory view showing a cutting groove and a correction voltage displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 7 is an explanatory view showing a plurality of cutting grooves and correction voltages displayed on a display mechanism equipped with the cutting device shown in Fig. 1. Fig. 8 is another explanatory view showing the cutting groove and the correction voltage displayed on the display mechanism of the cutting device shown in Fig. 1. [Description of main component symbols] 2: Device housing 11 ... temporary table 3 ... chuck holder 12 ... carrying-in mechanism 4 - spindle unit 13 ... first conveying mechanism 5. .. photographing mechanism 14...cleaning mechanism 6...display mechanism 15...second transport mechanism 8...crystal boat mounting table 20...control mechanism 8a...cell boat mounting area 21. .. Input mechanism 9...Crystal 22...Alarm mechanism 10...Semiconductor wafer 31...Chuck holder body 16 201112322 32.. .Adsorption chuck 33.. .Clipper 40.·· Housing cover 41.. spindle housing 42.. rotating mandrel 43.. cutting blade 44.. cutting water supply nozzle 51.. light illuminator 52.. optical system 53.. Device 110.. Cutting groove 111... Debris (fragment) 201.. Central processing unit (CPU) 202···Read only memory (ROM) 203... Random access memory (RAM) 204.. Input Interface 205.. . Output interface 510.. Voltage regulator 511.. . Fiber 521.. Shell 522.. Half mirror 523.. Objective lens F... Ring frame H...Width T.. . Cutting tape X, Y, Z... direction 17