201111773 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種使用雷射來對用以製造顯示用面 板（panel)等的玻璃（glass)基板或塑膠（plastic)基板 等的缺陷進行檢測的線内（in line)基板檢查裝置的光學 系統校正方法及線内基板檢查裝置，尤其是有關於一種適 合於檢查裝置的光學系統的維護作業的線内基板檢查裝置 的光學系統校正方法及線内基板檢查裝置，該檢查裝置裝 入至玻璃基板或塑膠基板等的製造線内，或者裝入至使用 有這些基板的顯示用面板基板的製造線内。 【先前技術】 用作顯示用面板的液晶顯示（display )裝置的薄膜電 晶體（Thin Film Transistor，TFT )基板或彩色濾光片（color filter)基板、電漿顯示面板（plasma display panel)用基板、 有機電致發光（Electroluminescence，EL )顯示面板用基 板等的製造是以如下的方式進行，即，借由光微影 (photolithography)技術，在玻璃基板或塑膠基板等的基 板上形成圖案（pattern)。此時，若在基板上存在損傷或 異物等的缺陷，則無法良好地形成圖案，從而成為引起不 良的原因。因此，使用基板檢查裝置來對基板的損傷或異 物等的缺陷進行檢查。 基板檢查裝置將雷射等的檢查光照射至基板，並接收 來自基板的反射光或散射光，以對基板的損傷或異物等的 缺陷進行檢測。由於借由檢查光來對基板進行掃描，因此， 201111773 整個基板的檢查會耗費時間。因此，先前，在玻璃基板或 塑膠基板等的製造軸，或者在使时這些基板的顯示用 面板基板的製造線内，即時（real time)地對基板的缺陷 進行檢查。對於以所述方式在製造線内即時地進行檢查的 基板檢查裝置而言’對於光學系統的定期性的雷射功率 (power)的管理、以及檢測靈敏度的調整作業等的校正作業 不可或缺°先前，基板檢查裝置的光學系統的校正作業， 是將塗布有標準粒子的基準樣品（sample)基板搭載在檢 查平臺（stage)上’借此來實施光學系統的校正作業。在 此種校正作業巾，為了實施光學系制校正作業，必須由 作業者利用手來將附帶標準粒子的基板放置在檢查平臺 上。作為以所述方式搭載基準樣品基板並進行校正的技 術，專利文獻1所揭示的技術已為人所知。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser for using a laser to manufacture defects such as a glass substrate or a plastic substrate for manufacturing a panel or the like. An optical system calibration method for an in-line substrate inspection device and an in-line substrate inspection device, and more particularly to an optical system calibration method for an in-line substrate inspection device suitable for maintenance operation of an optical system of an inspection device and The in-line substrate inspection device is incorporated in a manufacturing line such as a glass substrate or a plastic substrate, or is incorporated in a manufacturing line of a display panel substrate using the substrates. [Prior Art] A Thin Film Transistor (TFT) substrate, a color filter substrate, and a plasma display panel substrate for a liquid crystal display device used as a display panel The production of an organic electroluminescence (EL) display panel substrate or the like is performed by forming a pattern on a substrate such as a glass substrate or a plastic substrate by photolithography. ). At this time, if there is a defect such as damage or foreign matter on the substrate, the pattern cannot be formed satisfactorily, which causes a cause of the defect. Therefore, the substrate inspection device is used to inspect damage of the substrate or defects such as foreign matter. The substrate inspection device irradiates the inspection light such as a laser onto the substrate, and receives reflected light or scattered light from the substrate to detect damage of the substrate or defects such as foreign matter. Since the substrate is scanned by inspection light, the inspection of the entire substrate in 201111773 takes time. Therefore, in the past, in the manufacturing line of a glass substrate or a plastic substrate, or in the manufacturing line of the display panel substrate of these substrates, the defects of the substrate were inspected in real time. For the substrate inspection apparatus that performs inspection in the manufacturing line in the manner described above, it is indispensable for the management of the periodic laser power of the optical system and the adjustment operation of the detection sensitivity. In the prior art, the calibration operation of the optical system of the substrate inspection apparatus is performed by mounting a reference sample substrate coated with standard particles on an inspection stage, thereby performing an optical system calibration operation. In the correction work towel, in order to perform the optical system calibration work, the operator must use the hand to place the substrate with the standard particles on the inspection platform. The technique disclosed in Patent Document 1 is known as a technique in which a reference sample substrate is mounted and corrected as described above.
專利文獻1 :日本專利特開2003-59994號公報 、—專利文獻1所揭示的技術是對半導體的晶圓（wafer) 進行檢查的裝置的管理方法的技術，賴術的目的在於： 在連、地對夕個被檢查樣品進行測定的檢查途中，從預先 女置（Set)的禚準樣品專用盒（cassette)中自動地供給標 準樣品yXit行測定，並對鋪準樣品的測定結果與校正 基準及官理基準進行核對，從而對檢絲置進行管理。 由於顯示用面板用的基板的尺寸（size)與晶圓的尺 =比顯得非常大’因此’非常難以像專利文獻1所揭示 、術那樣’準備標準樣品，將該標準樣品安裝於專用盒， 並預先搭載在檢查裝置内。 廉 201111773 系統：正的基板檢查裝置中的光學 載至用以搬送基板的;杳:將::::::的基板搭 =正下方移動，從而實施光學系統的校正作業?= 大型化’如上所述的作業變得困難，另外，在對基ί 樣品進行操作時，會對作業者⑭極大的貞擔。此外，對 ^如上所制方法而言’在實施光學系_校正作業期間 會佔據㈣搬絲板的檢料臺，因此，致使在製造線上 流動的基板停滯在檢錢置的上游，從而對基板檢查裝置 的即時性造成影響。 【發明内容】 本务明疋鑒於所述方面而成的發明，目的在於提供一 種線内基板檢查裝置的光學系統校正方法及線内基板檢查 裝置，能夠不使製造線停止而實施裝入在製造線内的檢查 裝置的光學系統的校正作業。 本發明的線内基板檢查裝置的光學系統校正方法的第 1特徵在於：一邊使基板依次從上游製造線向下游製造線 移動’一邊借由所述基板移動單元來使包括投光系統及受 光系統的光學系統向與移動中的基板正交的方向移動，照 射檢查光’並且接收來自所述基板的反射光或散射光，基 於所接收的來自所述基板的反射光或散射光來對所述基板 的缺陷進行檢查，在所述線内基板檢查裝置的光學系統校 正方法中，在對所述基板進行檢查的檢查區域（area)以 外的位置設置校正作業區域，並使所述光學系統可移動至 201111773 所述板正作業區域，在所述基板的移動過程中，在所述校 正作業區域内進行所述光學祕的校正作業。 本考X月疋在檢查平臺或搬送運送機（c〇nveyer)等的 ，查區域以外的位置設置H絲學系制校正作業的 才又正作業（維護（maintenance))區域，該檢查平臺具有 從上游製造線向下游製造線錢基板的功能，使光學系統 的移動行程（stn)ke)可移動至所述校正作#區域為止，借 此，可在檢查區域之外進行光學系統的校正作業，從而可 不使製造線停止而進行校正作業。 本發明的線内基板檢查裝置的光學系統校正方法的第 2特徵在於.一邊使基板依次從上游製造線向下游製造線 移動，一邊使具有投光系統及受光系統的光學系統向與基 ，移動方向正交的方向移動，針對每個基板，將檢查光所 掃描的基板的掃描區域予以變更，該檢查光來自投光系統 且在與基板移動方向正交的方向上具有規定的寬度，將在 與基板移動方向正交的方向上具有規定的寬度的檢查光從 杈光系統照射至基板，根據受光系統所接收的光的強度來 對掃描區域的基板的缺陷進行檢測，針對每個掃描區域而 將檢測出的掃描區域的基板的缺陷的資料（data)予以儲 存，並針對每個基板，根據新檢測出的掃描區域的基板的 缺陷的資料，來對所記憶的相同掃描區域的基板的缺陷的 資料進行更新，根據多個掃描區域的基板的缺陷的資料來 衣作1塊基板的缺陷的資料，在所述線内基板檢查方法 中，在對所述基板進行檢查的檢查區域以外的位置設置校 201111773 正作業區域，並使所述光學系統可移動至所述校正作業區 域，在所述基板的移動過程中，在所述校正作業區内= 行所述光學系統的校正作業。 — 本發明是一種線内基板檢查裝置，針對每個基板而取 得不同的掃㈣域的缺關㈣，且針對每個掃描區域而 將該=陷的資料以儲存’並針對每個基板，根據新檢測 出的掃描區域的基板的缺関資料，來對所記憶的相同掃 描區域的基板的缺陷的資料進行更新，根據多個掃描區域 的基板的缺陷的資料來製作丨塊基板的缺陷的資料，更迅 速地對線内的基板的缺陷進行檢查，在該線内基板檢查裝 置中，設置用以實施光學系統的校正作業的校正作業（維 護）區域，使光學系統的移動行程可移動至該校正作業區 域為止，借此，可在檢查區域之外實施光學系統的校正作 業，從而可不使製造線停止而進行校正作業。 如所述第1特徵或第2特徵所述的線内基板檢查方 法，本發明的線内基板檢查裝置的光學系統校正方法的第 3特徵在於：將以與所述基板的移動方向相同的方向及相 同的速度來移動的附帶標準粒子的基板設置在所述校正作 業區域内，使所述光學系統移動至所述校正作業區域，在 所述基板的移動過程中，對所述附帶標準粒子的基板進行 檢查，借此來進行所述光學系統的校正作業。對以與實際 的基板的移動相同的狀態而移動的附帶標準粒子的基板進 行檢查，借此，可正確地進行光學系統的校正作業。 如所述第3特徵所述的線内基板檢查方法，本發明的 201111773 線内基板檢查裝置的光學系統校正方法的第4特徵在於： 包括高度調整單元，使所述附帶標準粒子的基板的高度與 所述檢查區域内的基板的高度一致。使附帶標準粒子的基 板的高度與檢查區域内的基板的高度一致，借此，可正確 地進行校正作業。 如所述第2特徵所述的線内基板檢查方法，本發明的 線内基板檢查裝置的光學系統校正方法的第5特徵在於： 基於所製作的1塊基板的缺陷的資料，並針對每個基板來 判疋1塊基板的缺陷的數量是否處於允許值以内。由於基 於所製作的1塊基板的缺陷的資料，並針對每個基板來判 定1塊基板的缺陷的數量是否處於允許值以内，因此，當 產生1塊基板的缺陷的數量超過允許值的故障時，可針對 每個基板而提早發現該故障。 本發明的線内基板檢查裝置的第i特徵在於包括：基 板移動單元，使基板依次從上游製造線向下游製造線$ 動；光學系統，具有借由所述基板移動單元來將檢查光照 射至移動中的基板的投光系統、及接收來自所述基板的反 射光或政射光的受光糸統；以及檢查單元，使所述光學系 統向與所述基板的移動方向正交的方向移動，並基於來自 所述基板的反射光或散射光來對所述基板的缺陷進行檢 查，在所述線内基板檢查裝置中，在借由所述檢查單元來 對所述基板進行檢查的檢查區域以外的位置設置校正作業 區域’並使所述光學系統可移動至所述校正作t區域，在 所述基板的移動過程中，在所述校正作業區域内進行所述 201111773 光學系統的校正作業。此是實現了所述線内基板檢查裝置 的校正方法的第1特徵所述的内容的線内基板檢查裝置的 發明。 本發明的線内基板檢查裝置的第2特徵的特徵在於包 括：基板移動單元’使基板依次從上游製造線向下游製造 線移動；光學系統’具有借由所述基板移動單元來將檢查 光照射至移動中的基板的投光系統、及接收來自所述基板 的反射光或散射光的受光系統；光學系統移動單元’使所 述光學系統向與基板移動方向正交的方向移動，並針對每 個基板，將來自所述投光系統的檢查光所掃描的基板的掃 描區域予以變更；處理單元，根據所述受光系統所接收的 光的強度來對掃描區域的基板的缺陷進行檢測；記憶單 元’針對每個掃描區域而將所述處理單元所檢測出的掃描 區域的，板的缺陷的資料予以儲存；以及控制單元，對所 述記憶單元進行控制，針對每個基板，根據所述處理單元 所新檢測士的掃描區域的基板的缺陷的資料，來對記憶於 所述。己ft單元的相同掃描區域的基板的缺陷的資料進行更 新己憶於所述記憶單元的多個掃描區域的基板的缺 1貝料來製作1塊基板的缺陷的資料，在所述線内基板 檢置巾’在借由所述檢查單元來騎述基板進行檢查 的檢—區域以外的位置設置校正作域，域所述光學 ^統I移動至所述校正作魏域，在所述基板的移動過程 豐。正作業^域内進行所述光學系統的校正作 ” 疋貫現了所述線内基板檢查裝置的校正方法的第2 201111773 特徵所述的内容的線内基板檢查裝置的發明。 如所述第1特徵或第2特徵所述的線内基板檢查裝 置，本發明的線内基板檢查裝置的第3特徵在於：將以與 所述基板的移動方向相同的方向及相同的速度來移動的附 帶標準粒子的基板設置在所述校正作業區域内，使所述光 學系統移動至所述校正作業區域，在所述基板的移動過程 中’對所述附帶標準粒子的基板進行檢查，借此來進行所 述光學系統的校正作業。此是實現了所述線内基板檢查裝 置的校正方法的第3特徵所述的内容的線内基板檢查裝置 的發明。 如所述第3特徵所述的線内基板檢查裝置，本發明的 線内基板檢查裝置的第4特徵在於：包括高度調整單元， 使所述附帶標準粒子的基板的高度與所述檢查區域内的基 板的高度一致。此是實現了所述線内基板檢查裝置的校正 方法的第4特徵所述的内容的線内基板檢查裝置的發明。 如所述第2特徵所述的線内基板檢查裝置，本發明的 線内基板檢錄置的第5賴在於：所述控鮮元基於所 製作的1塊基板的缺陷的資料，並針對每個基板來判定丄 塊基板的賴隨量是錢於允許值Μ。歧實現了所 述線内基板檢絲置的校正方法的第5特賴述的内容的 線内基板檢查裝置的發明。 【發明的效果】 根據本發明，存在如下的效果，即，可不使製造線停 止而實施裝人至製造線内的線内基板檢查裝置的光學系統 201111773 的校正作業。 為讓本發明之上述和其他目的、特徵和優點能更明顯 易懂’下文特舉較佳實施例，並配合所附圖式，作詳細說 明如下。 【實施方式】 圖1是本發明的一個實施方式的基板檢查裝置的俯視 圖’圖2是本發明的一個實施方式的基板檢查裝置的側視 圖。本實施方式表示了如下的基板檢查裝置的例子，即， 該基板檢查裝置根據檢查光由於基板的缺陷而散射所形成 的散射光來對基板的缺陷進行檢測。基板檢查裝置包括平 臺 10、輥（roller) 11、框架（frame) 13、14、光學系統 移動機構、光學系統單元（unit) 2〇a、2〇b、焦點調節機 構41、感測器（sens〇r) 51、校正用平臺61&、6比及控制 系統。再者，以下所說明的實施方式中的χγ方向為例示， 也可調換X方向與γ方向。 在圖1及圖2中，作為檢查對象的多個基板丨在製造 線内，借由搬入運送機2來依次搬入至基板檢查裝置，經 過檢查之後，借由搬出運送機3來將所述多個基板丨從基 板檢查裝置中依次搬出。平臺1〇從該搬入運送機2接受各 基板1。圖3是從上側觀察平臺的俯視圖。如圖3所示， 分別呈直線狀地設置於平臺丨〇的兩端部的輥u , 一邊與 圖3中的虛線所示的各基板丨的背面的周邊部接觸，—邊 旋轉，使各基板1依次向箭頭所示的基板移動方向（χ方 向）移動。在平臺10的上表面設置有未圖示的多個空氣 12 201111773 (air)喷出口。 所述多個空氣喷出口將空氣喷射至借由輥11而移動 的各基板1的背面。借由噴射至各基板丨的中央部的空氣 的作用，各基板1無彎曲地懸浮並依次向X方向移動。 如圖1及圖2所示，在借由輥π而向X方向移動的 基板1的上方（圖i的附圖的縱深方向的近前側、圖2的 上側）設置有框架Π、14，該框架π、14超過基板i的Patent Document 1: Japanese Laid-Open Patent Publication No. 2003-59994, the technology disclosed in Patent Document 1 is a technique for managing a device for inspecting a wafer of a semiconductor, and the purpose of the technique is to: In the course of the test for the measurement of the sample to be inspected on the ground, the standard sample yXit is automatically supplied from the cassette of the pre-special sample, and the measurement result and the calibration standard of the sample are automatically measured. Check with the official benchmark to manage the wire inspection. Since the size of the substrate for the display panel and the size ratio of the wafer are very large, it is very difficult to prepare a standard sample as in the patent document 1, and install the standard sample in a dedicated box. It is mounted in the inspection device in advance. Integrity 201111773 System: The optical in the positive substrate inspection device is loaded to the substrate for transport; 杳: The substrate of :::::: is moved directly below, and the optical system is corrected. The above-described work becomes difficult, and when the sample is operated on the base, the operator 14 is greatly burdened. Further, in the method as described above, 'the inspection table for the (4) wire-drawing plate is occupied during the implementation of the optical system_correction operation, so that the substrate flowing on the manufacturing line is stagnated upstream of the money-checking device, thereby opposing the substrate Check the immediacy of the device to affect it. SUMMARY OF THE INVENTION In view of the above, an object of the invention is to provide an optical system calibration method and an in-line substrate inspection device for an in-line substrate inspection device, which can be incorporated in a manufacturing process without stopping the manufacturing line. Correction of the optical system of the inspection device in the line. A first feature of the optical system calibration method of the in-line substrate inspection apparatus of the present invention is to move the substrate to the downstream manufacturing line while sequentially moving the substrate from the upstream manufacturing line to the downstream manufacturing line. The optical system moves toward a direction orthogonal to the moving substrate, illuminates the inspection light' and receives reflected or scattered light from the substrate, based on the received reflected or scattered light from the substrate The defect of the substrate is inspected, and in the optical system correction method of the in-line substrate inspection device, a correction work area is set at a position other than an inspection area where the substrate is inspected, and the optical system is movable To the board positive working area of 201111773, the optical secret correction operation is performed in the correction working area during the movement of the substrate. In this test, the inspection platform or the transport conveyor (c〇nveyer), etc., is installed at a position other than the inspection area, and the H-study system calibration work is performed (maintenance) area. The function of manufacturing the wire substrate from the upstream manufacturing line to the downstream, so that the moving stroke (stn) of the optical system can be moved to the correction # region, whereby the optical system can be corrected outside the inspection region. Therefore, the calibration work can be performed without stopping the manufacturing line. A second feature of the optical system correction method of the in-line substrate inspection device of the present invention is to move the optical system having the light projecting system and the light receiving system to the base while sequentially moving the substrate from the upstream manufacturing line to the downstream manufacturing line. Moving in a direction orthogonal to the direction, the scanning area of the substrate scanned by the inspection light is changed for each substrate, and the inspection light is from the light projecting system and has a predetermined width in a direction orthogonal to the moving direction of the substrate, and will be The inspection light having a predetermined width in a direction orthogonal to the substrate moving direction is irradiated from the calender system to the substrate, and the defect of the substrate in the scanning region is detected according to the intensity of the light received by the light receiving system, and for each scanning region The data of the defect of the substrate in the detected scanning area is stored, and for each substrate, the defect of the substrate of the same scanning area is memorized according to the data of the defect of the substrate of the newly detected scanning area. The data is updated to make a defect of one substrate based on the defect of the substrate of the plurality of scanning areas. In the in-line substrate inspection method, a positive working area of the 201111773 is set at a position other than the inspection area where the substrate is inspected, and the optical system is movable to the correction working area, During the movement of the substrate, the correction operation of the optical system is performed in the correction work area. The present invention is an in-line substrate inspection apparatus that obtains different scan (four) domain defects for each substrate (4), and stores the data for each scan area for each substrate, according to The newly detected missing material of the substrate in the scanning area is used to update the data of the defect of the substrate in the same scanning area, and the defect data of the substrate is prepared based on the defect data of the substrate in the plurality of scanning areas. Further, the defect of the substrate in the line is inspected more quickly, and in the in-line substrate inspection device, a correction work (maintenance) area for performing a correction operation of the optical system is provided, so that the movement path of the optical system can be moved to the By correcting the work area, the correction operation of the optical system can be performed outside the inspection area, and the correction work can be performed without stopping the manufacturing line. According to the in-line substrate inspection method according to the first or second aspect, the optical system correction method of the in-line substrate inspection apparatus of the present invention is characterized in that the direction is the same as the movement direction of the substrate. And a substrate with standard particles moving at the same speed is disposed in the correction work area, moving the optical system to the correction work area, and during the movement of the substrate, the standard particle-attached The substrate is inspected to perform the calibration operation of the optical system. The substrate with the standard particles moved in the same state as the movement of the actual substrate is inspected, whereby the optical system can be accurately corrected. According to the in-line substrate inspection method according to the third aspect, the fourth aspect of the optical system correction method of the 201111773 in-line substrate inspection apparatus of the present invention includes: a height adjustment unit that sets the height of the substrate with the standard particles It coincides with the height of the substrate in the inspection area. The height of the substrate with the standard particles is made to match the height of the substrate in the inspection area, whereby the correction work can be performed correctly. According to the in-line substrate inspection method of the second aspect, the optical system correction method of the in-line substrate inspection apparatus of the present invention is characterized in that: based on the information of the defects of the one substrate to be produced, The substrate determines whether the number of defects of one substrate is within an allowable value. It is determined whether or not the number of defects of one substrate is within an allowable value based on the data of the defects of one substrate produced, and therefore, when the number of defects of one substrate exceeds the allowable value. The fault can be detected early for each substrate. An i-th feature of the in-line substrate inspection apparatus of the present invention includes: a substrate moving unit that sequentially moves the substrate from the upstream manufacturing line to the downstream manufacturing line; and an optical system having the substrate moving unit for irradiating the inspection light to a light projecting system of the moving substrate, and a light receiving system that receives reflected light or political light from the substrate; and an inspection unit that moves the optical system in a direction orthogonal to a moving direction of the substrate, and Defecting the substrate based on reflected light or scattered light from the substrate, in the in-line substrate inspection device, outside the inspection region where the inspection unit checks the substrate The position setting correction work area 'and the optical system are movable to the correction t area, and the correction operation of the 201111773 optical system is performed in the correction work area during the movement of the substrate. This is an invention of the in-line substrate inspection apparatus which realizes the content described in the first feature of the correction method of the in-line substrate inspection apparatus. A second feature of the in-line substrate inspection apparatus of the present invention is characterized in that the substrate moving unit 'moves the substrate sequentially from the upstream manufacturing line to the downstream manufacturing line; the optical system' has the inspection unit that moves the inspection light by the substrate moving unit a light projecting system to a moving substrate, and a light receiving system that receives reflected light or scattered light from the substrate; the optical system moving unit moves the optical system in a direction orthogonal to the substrate moving direction, and for each a substrate, the scanning area of the substrate scanned by the inspection light from the light projecting system is changed; the processing unit detects the defect of the substrate of the scanning area according to the intensity of the light received by the light receiving system; the memory unit 'Storing data of defects of the scanning area detected by the processing unit for each scanning area; and controlling unit for controlling the memory unit, for each substrate, according to the processing unit The data of the defect of the substrate of the new inspection area of the scanning area is stored in the memory. The data of the defect of the substrate in the same scanning area of the ft unit is updated by recalling the defect of the substrate of the plurality of scanning areas of the memory unit to create a defect of the substrate, in the in-line substrate The inspection towel 'sets a correction field at a position other than the inspection area by which the inspection unit rides the substrate for inspection, and the optical system I moves to the correction for the Wei domain, on the substrate The movement process is abundant. The invention of the in-line substrate inspection apparatus that performs the correction of the optical system in the positive operation field, which is the second 201111773 feature of the correction method of the in-line substrate inspection apparatus. The in-line substrate inspection device according to the second aspect of the present invention, characterized in that the in-line substrate inspection device of the present invention is characterized in that the standard substrate is moved in the same direction and at the same speed as the moving direction of the substrate. a substrate disposed in the correction work area, moving the optical system to the correction work area, and performing inspection on the substrate with standard particles during movement of the substrate The invention of the in-line substrate inspection apparatus according to the third feature of the method for correcting the in-line substrate inspection apparatus. According to a fourth aspect of the present invention, in the in-line substrate inspection device of the present invention, the height adjustment unit includes a height of the substrate with the standard particles and the inspection The height of the substrate in the domain is the same. This is an invention of the in-line substrate inspection device that realizes the fourth feature of the method for correcting the in-line substrate inspection device. The in-line substrate according to the second feature. In the inspection apparatus, the fifth aspect of the in-line substrate inspection of the present invention is that the control unit determines the amount of the defect of the substrate based on the defect of the one substrate to be produced. An invention of the in-line substrate inspection apparatus which realizes the content of the fifth aspect of the method for correcting the detection of the in-line substrate is disclosed. [Effect of the Invention] According to the present invention, the following effects are obtained. That is, the correction operation of the optical system 201111773 of the in-line substrate inspection apparatus incorporated into the manufacturing line can be performed without stopping the manufacturing line. The above and other objects, features and advantages of the present invention can be more clearly understood. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a plan view of a substrate inspecting apparatus according to an embodiment of the present invention. FIG. 2 is a view of the present invention. A side view of a substrate inspection apparatus according to an embodiment of the present invention. The present embodiment shows an example of a substrate inspection apparatus that scatters the scattered light formed by the inspection light due to the defect of the substrate to the defect of the substrate. The substrate inspection apparatus includes a stage 10, a roller 11, a frame 13, 14, an optical system moving mechanism, an optical system unit 2〇a, 2〇b, a focus adjustment mechanism 41, and a sensing unit. (sens〇r) 51, calibration platform 61 &, 6 ratio and control system. In addition, in the embodiment described below, the χ γ direction is exemplified, and the X direction and the γ direction are also interchangeable. In the second embodiment, the plurality of substrates to be inspected are loaded into the substrate inspection device by the carry-in conveyor 2 in the manufacturing line, and after the inspection, the plurality of substrates are transported from the substrate by the carry-out conveyor 3 The inspection device is sequentially carried out. The platform 1 receives the respective substrates 1 from the carry-in conveyor 2. Fig. 3 is a plan view of the platform viewed from the upper side. As shown in Fig. 3, the rollers u which are respectively disposed linearly at both end portions of the stage 接触 are in contact with the peripheral portion of the back surface of each of the substrate rafts shown by broken lines in Fig. 3, and are rotated while rotating. The substrate 1 is sequentially moved in the substrate moving direction (χ direction) indicated by the arrow. A plurality of air (not shown) 12 201111773 (air) discharge ports are provided on the upper surface of the stage 10. The plurality of air ejection ports eject air to the back surface of each of the substrates 1 moved by the roller 11. By the action of the air ejected to the central portion of each of the substrate turns, each of the substrates 1 is suspended without being bent and sequentially moved in the X direction. As shown in FIG. 1 and FIG. 2, frames Π and 14 are provided above the substrate 1 that moves in the X direction by the roller π (the front side in the depth direction of the drawing of FIG. i and the upper side in FIG. 2). Frame π, 14 exceeds substrate i
與基板移動方向（X方向）正交的方向方向）上的寬 度而延伸。在該框架13、14中搭載有使光學系統單元2〇a、 2〇b向Y方向移動的光學系統移動機構。再者，在本實施 方式中’雖然設置有兩個光學系統單元20a、20b，但光學 系統的數量並不限於此，也可設置一個或三個以上的光學 系統。 圖4是表示使兩個光學系統向γ方向移動的光學系統 移動機構的概略構成的局部剖面侧視圖。光學系統移動機 構包括導軌（guide) 15、17、移動台16、以及由磁鐵板 及線圈（c〇il) 19構成的線性馬達（linear motor)。在 =面形狀為大致L字型的框架13、14上，以包夾兩個光 本系、先單元2〇a、2〇b的方式設置有向圖4的附圖的縱深方 向（Y方向）延伸的導軌15。在各個導軌15的上側搭載 有移動台16的收納部16c。 移動台16包括收納著光學系統單元20a、2〇b的凹形 的收納部16c、以及從所述收納部16c的上端部沿著水平 方向延伸的臂（arm)部16d。光學系統單元20a、20b隔 13 201111773 著，述的焦點調節機構41而收納並搭載於收納部16c。在 C杀13的上表面部兩側，設置有向圖4的附圖的縱深方向 (γ方向）延伸的導軌17。在各個導執17的上側搭載有 移動台16的臂部16d。 在框架13上表面部中央安裝有作為線性馬達的定子 的磁鐵板18。在移動纟16的臂部16d的下側安裝有作為 線性馬達的轉子的線目19。電献後述的光㈣統移動控 制電路60流向線圈19之後’由於線圈19的電流與磁鐵板 1\的磁場，根據夫累銘（Fleming)的左手法則，推力（洛 倫妓力（Lorentzforce))會作用於線圈19，移動台16沿 著導轨15及導軌17移動’光學系統單元2〇a、2〇b以向與 基板移動方向（X方向）正交的附圖縱深方向（γ方向） 移動的方式受到控制。 圖5是表示光學系統及控制系統的概略構成的圖。光 學糸統單元20a、20b包括將檢查光照射至基板1的投光系 統、對來自基板1的反射光進行檢測的反射光檢測系統、 以及接收來自基板1的散射光的受光系統。另外，控制系 統包括焦點調節控制電路40、信號處理電路5〇、光學系統 移動控制電路60、記憶體（memory) 70、通報裝置80、 輸入輸出裝置90及中央處理單元（Central Processing Unit，CPU) 100。 圖6是表示光學系統的投光系統及受光系統的概略構 成的立體圖。投光系統包括雷射源21、透鏡（lens)群22 及鏡面（mirror) 23。雷射源21產生成為檢查光的雷射。It extends in the width in the direction orthogonal to the substrate moving direction (X direction). In the frames 13 and 14, an optical system moving mechanism that moves the optical system units 2a and 2b in the Y direction is mounted. Further, in the present embodiment, although two optical system units 20a, 20b are provided, the number of optical systems is not limited thereto, and one or three or more optical systems may be provided. Fig. 4 is a partial cross-sectional side view showing a schematic configuration of an optical system moving mechanism for moving two optical systems in the γ direction. The optical system moving mechanism includes guides 15, 17, a moving table 16, and a linear motor composed of a magnet plate and a coil 19. In the frames 13 and 14 having a substantially L-shaped surface shape, the depth direction (Y direction) of the drawing of FIG. 4 is provided so as to sandwich the two light-based systems and the first units 2〇a and 2〇b. ) an extended guide rail 15 . The accommodating portion 16c of the moving table 16 is mounted on the upper side of each of the guide rails 15. The mobile station 16 includes a concave accommodating portion 16c in which the optical system units 20a and 2b are housed, and an arm portion 16d extending in the horizontal direction from the upper end portion of the accommodating portion 16c. The optical system units 20a and 20b are housed and mounted on the storage unit 16c by the focus adjustment mechanism 41 described above. On both sides of the upper surface portion of the C-kill 13, a guide rail 17 extending in the depth direction (γ direction) of the drawing of Fig. 4 is provided. An arm portion 16d of the moving table 16 is mounted on the upper side of each of the guides 17. A magnet plate 18 as a stator of a linear motor is attached to the center of the upper surface portion of the frame 13. A wire mesh 19 as a rotor of a linear motor is attached to the lower side of the arm portion 16d of the moving jaw 16. After the light (four) system movement control circuit 60 described later flows to the coil 19, 'the current due to the coil 19 and the magnetic field of the magnet plate 1\, according to the left-hand rule of Fleming, the thrust (Lorentzforce) Acting on the coil 19, the moving table 16 moves along the guide rail 15 and the guide rail 17 'optical system unit 2〇a, 2〇b to the depth direction (γ direction) of the drawing orthogonal to the substrate moving direction (X direction) The way you move is controlled. Fig. 5 is a view showing a schematic configuration of an optical system and a control system. The optical unit 20a, 20b includes a light projecting system that irradiates inspection light onto the substrate 1, a reflected light detecting system that detects reflected light from the substrate 1, and a light receiving system that receives scattered light from the substrate 1. In addition, the control system includes a focus adjustment control circuit 40, a signal processing circuit 5, an optical system movement control circuit 60, a memory 70, a notification device 80, an input/output device 90, and a central processing unit (CPU). 100. Fig. 6 is a perspective view showing a schematic configuration of a light projecting system and a light receiving system of an optical system. The light projecting system includes a laser source 21, a lens group 22, and a mirror 23. The laser source 21 generates a laser that becomes an inspection light.
201111773 21產生的檢絲料，並使聚光後 板移動方向(x方向)正交的方向(Y方 方向)1¾ 1’使舰後的檢查光沿著基板移動方向(x 其Γ23將借由透鏡群22而聚光的檢查光傾 ==的表面。照射至基板1的表面的檢查光 ’沿著基板移動方向（x方向）彙聚， 成為在躲板移動方向（x方向）正交的方向（Y方向） j有規定的寬度的長條狀的檢纽。基板i向基板移動 β X方向）移動，借此，從投光系統照射出的規定的 寬度的檢查光對基板1進行掃描，從而檢查掃描區域的缺 陷。 當基板1的表面上不存在損傷或異物等的缺陷時，傾 斜地照射至基板1的表面的檢查光的一部分被基板丨的表 面反射，剩餘的檢查光透過基板丨的内部並從基板i的背 面射出。當在基板1的表面上存在損傷或異物等的缺陷 時，照射至基板1的表面的檢查光中，照射至基板表面的 損傷或異物等的缺陷的光成為散射光而散射，照射至其他 部位的光與上述同樣地，一部分的光被表面反射，剩餘的 光透過該表面。 在圖5中’反射光檢測系統包括鏡面25、透鏡26、及 電荷耦合元件（Charge Coupled Device，CCD)線感測器 27。來自基板1的表面的反射光經由鏡面25而射入至透鏡 26。該透鏡26使來自基板1的反射光彙聚，並在CCD線 感測器27的受光面上成像。 15 201111773 此時，CCD線感測器27的受光面上的反射光的受光 位置會根據基板1的表面的高度而發生變化。當將圖5所 示的基板1的表面的高度設為基準時，在基板1的表面的 高度低於該基準的情況下，基板1的表面上的檢查光的照 射位置及反射位置會向附圖的左側移動，CCD線感測器 27的受光面上的反射光的受光位置會向附圖的右侧移 動。相反地，在基板1的表面的高度高於所述基準的情況 下，基板1的表面上的檢查光的照射位置及反射位置會向 附圖的右側移動，CCD線感測器27的受光面上的反射光 的受光位置會向附圖的左側移動。 CCD線感測器27將與受光面所接收的反射光的強度 ，對應的私測彳§號輸出至焦點調節控制電路4〇。該焦點調 ，控^電路40根據來自CPU100的指令，並基於CCD線 ^ ^^器27的仏測#號來對焦點調節機構41進行驅動以使 ^系統單元20a、2此移動，使得來自基板1的表面的反 線感測器27的受光面的中心位置被接收。焦 郎，構41包括脈衝馬達（Pulsernotor)42、凸輪（cam) 沾# 及凸輪隨動件（_ f〇U〇Wer) 44。在脈衝馬達42 有已偏心的凸輪43 ’在光學系統單元 > 丨φ二上安裴有凸輪隨動件4 4。將驅動脈衝從焦點調節 2几41供給至脈衝馬達42，借此，脈衝馬達42被驅 從而光轉，光學系統單元施、勘上下地移動， =予糸統單元2 〇 a、2 0b的焦點位置受到控制。 圖6中，叉光系統包括聚光透鏡28、成像透鏡29、 16 201111773 以及CCD線感測器3〇。聚光透鏡28使來自基板1的散射 光聚光’成像透鏡29使被聚光透鏡28聚光的散射光成像 於CCD線感測器30的受光面。在圖5中，CCD線感測器 3 0將與受光面所接收的散射光的強度相對應的檢測信號 轉換成數位（digital)信號，並將該數位信號輸出至信號 處理電路50。 圖1及圖3中，在平臺1〇上’在來自光學系統單元 20a的投光系統的檢查光所照射的區域，設置有多個開口 12a，在來自光學系統單元20b的投光系統的檢查光所照射 的區域，設置有多個開口 12b。開口 12a與開口 12b在與 基板移動方向（X方向）正交的方向（Y方向）上，具有 超過來自光學系統單元20a、20b的投光系統的檢查光的寬 度的長度，且該開口 12a與開口 12b交替地設置在不同的 位置。在圖4中，從光學系統單元20a的投光系統照射出 的向基板1的内部透射並從基板1的背面射出的檢查光， 通過開口 12a之後向平臺10的下方前進，該檢查光不會由 光學系統單元20a的反射光檢測系統及受光系統所接收。 從光學系統單元20b的投光系統照射出的向基板1的内部 透射並從基板1的背面射出的檢查光，也同樣地通過開口 12b之後向平臺10的下方前進，該檢查光不會由光學系統 單元20b的反射光檢測系統及受光系統所接收。 在圖5中，光學系統移動控制電路60根據來自 CPU100的指令，將電流供給至線圈19，使光學系統單元 20a、20b向與基板移動方向（X方向）正交的方向（Y方 17 201111773 向）移動’針對每個基板，將來自光學系統單元20a、20b 的投光系統的蚊寬度的檢查光崎描板i的掃描區 域予以變更。 圖7是表示基板的掃描區域的圖。本實施方式表示了 如下的例子，即’將基板丨的檢查區域分割為44個掃描區 ^ ’使用_光學系統單元施、施來分別進行22次掃 :。再者’掃描區域的數量及掃描缝並不限於此，可根 據基板的大小及光學系統的數量來適當地決定。 认认Ϊ圖7中’基板1的周邊部的區域奶是報11所接觸 s、欢一對象以外的區域，區域SA1〜SA22、sb1〜sb22 j學系統單元2Ga、2()b的掃描區域。在本實施方式中， 你止，在第1塊基板1到達後述的感測器51的下方之前， 說學系統單元2Ga向掃描區域SA1所通過的位置的上空 並使光學系統單元2〇b向掃描區域側所通過的位 空移動。接著，對於第1塊基板卜借由來自光學 早兀施的投光系統的檢查光來對掃描區域SA1進行 借由來自光學系統單元勘的投光系統的檢查光 木對知描區域SB1進行掃描。 述的^第。1塊基板的掃描結束之後，第2塊基板1到達後 ^ %測裔51的下方之前，使光學系統單元2〇&向掃描區 =·Λ，過的位置的上空移動，並使光學系統單元施 區域SB2所通，位置的上空移動。接著，對於第 光來tt1’借由來自光學系統單元施的投光系統的檢查 帚描區域SA2進行掃描，並借由來自光學系統單元 18 201111773 來對掃描區域SB22進行掃描 的技先糸統的檢查光201111773 21 The inspection wire is produced, and the direction of the movement of the concentrating plate (x direction) is orthogonal (Y direction) 13⁄4 1' so that the inspection light behind the ship moves along the substrate movement direction (x Γ 23 will be used by The surface of the inspection light tilted by the lens group 22 is tilted ==. The inspection light 'irradiated on the surface of the substrate 1' converges along the substrate moving direction (x direction), and is orthogonal to the direction in which the board is moved (x direction). (Y direction) j has a strip-shaped inspection beam having a predetermined width. The substrate i moves in the β X direction), whereby the inspection light of a predetermined width emitted from the light projection system scans the substrate 1 . Thereby checking for defects in the scanning area. When there is no damage such as damage or foreign matter on the surface of the substrate 1, a part of the inspection light obliquely irradiated onto the surface of the substrate 1 is reflected by the surface of the substrate, and the remaining inspection light is transmitted through the inside of the substrate and from the back of the substrate i. Shoot out. When there is a defect such as damage or foreign matter on the surface of the substrate 1, in the inspection light that is irradiated onto the surface of the substrate 1, light that has been damaged to the surface of the substrate or a defect such as foreign matter is scattered and scattered, and is irradiated to other portions. As in the above, a part of the light is reflected by the surface, and the remaining light passes through the surface. In Fig. 5, the reflected light detecting system includes a mirror surface 25, a lens 26, and a charge coupled device (CCD) line sensor 27. The reflected light from the surface of the substrate 1 is incident on the lens 26 via the mirror surface 25. The lens 26 converges the reflected light from the substrate 1 and forms an image on the light receiving surface of the CCD line sensor 27. 15 201111773 At this time, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 changes depending on the height of the surface of the substrate 1. When the height of the surface of the substrate 1 shown in FIG. 5 is used as a reference, when the height of the surface of the substrate 1 is lower than the reference, the irradiation position and the reflection position of the inspection light on the surface of the substrate 1 are attached. Moving to the left side of the figure, the light receiving position of the reflected light on the light receiving surface of the CCD line sensor 27 moves to the right side of the drawing. On the contrary, in the case where the height of the surface of the substrate 1 is higher than the reference, the irradiation position and the reflection position of the inspection light on the surface of the substrate 1 are moved to the right side of the drawing, and the light receiving surface of the CCD line sensor 27 The light receiving position of the reflected light on the upper side moves to the left side of the drawing. The CCD line sensor 27 outputs the intensity of the reflected light received by the light receiving surface and the corresponding private measurement number to the focus adjustment control circuit 4A. The focus adjustment, control circuit 40 drives the focus adjustment mechanism 41 based on the instruction from the CPU 100 and based on the measurement # of the CCD line 27 to move the system unit 20a, 2 so that the substrate is The center position of the light receiving surface of the reverse line sensor 27 of the surface of 1 is received. The focal length 41 includes a pulse motor 42 (cam) and a cam follower (_f〇U〇Wer) 44. The pulse follower 42 has an eccentric cam 43' mounted on the optical system unit > φφ2 with a cam follower 4 4 . The drive pulse is supplied from the focus adjustment 2 to 41 to the pulse motor 42, whereby the pulse motor 42 is driven to rotate, and the optical system unit is moved up and down, and the focus of the control unit 2 〇a, 20b The location is under control. In Fig. 6, the fork light system includes a condensing lens 28, imaging lenses 29, 16 201111773, and a CCD line sensor 3 〇. The condensing lens 28 condenses the scattered light from the substrate 1 to the imaging lens 29 to image the scattered light collected by the condensing lens 28 on the light receiving surface of the CCD line sensor 30. In Fig. 5, the CCD line sensor 30 converts a detection signal corresponding to the intensity of the scattered light received by the light receiving surface into a digital signal, and outputs the digital signal to the signal processing circuit 50. In Fig. 1 and Fig. 3, a plurality of openings 12a are provided on the stage 1' in a region where the inspection light from the light projecting system of the optical system unit 20a is irradiated, and the light projection system from the optical system unit 20b is inspected. A region where the light is irradiated is provided with a plurality of openings 12b. The opening 12a and the opening 12b have a length exceeding a width of the inspection light from the light projecting system of the optical system unit 20a, 20b in a direction (Y direction) orthogonal to the substrate moving direction (X direction), and the opening 12a is The openings 12b are alternately disposed at different positions. In FIG. 4, the inspection light emitted from the light projecting system of the optical system unit 20a and transmitted to the inside of the substrate 1 and emitted from the back surface of the substrate 1 passes through the opening 12a and then proceeds downward below the stage 10, and the inspection light does not. It is received by the reflected light detecting system and the light receiving system of the optical system unit 20a. The inspection light emitted from the light projecting system of the optical system unit 20b and transmitted to the inside of the substrate 1 and emitted from the back surface of the substrate 1 is similarly advanced to the lower side of the stage 10 through the opening 12b, and the inspection light is not optically The reflected light detecting system of the system unit 20b and the light receiving system receive it. In FIG. 5, the optical system movement control circuit 60 supplies a current to the coil 19 in accordance with an instruction from the CPU 100, and causes the optical system units 20a and 20b to be orthogonal to the substrate moving direction (X direction) (Y side 17 201111773 direction) The movement of the scanning area of the mosquito width inspection plate i of the light projecting system from the optical system units 20a and 20b is changed for each substrate. Fig. 7 is a view showing a scanning area of a substrate. The present embodiment shows an example in which the inspection area of the substrate 分割 is divided into 44 scanning areas ′, and the scanning is performed 22 times using the _ optical system unit. Further, the number of scanning regions and the scanning slit are not limited thereto, and can be appropriately determined depending on the size of the substrate and the number of optical systems. It is recognized that the area milk in the peripheral portion of the substrate 1 in Fig. 7 is the area other than the object s, the area SA1 to SA22, the sb1 to sb22, and the scanning area of the system unit 2Ga, 2()b. . In the present embodiment, before the first substrate 1 reaches the lower side of the sensor 51 to be described later, the position of the system unit 2Ga passing through the scanning area SA1 is increased and the optical system unit 2b is turned to The bit space moved by the scanning area side. Next, for the first substrate, the scanning area SA1 is scanned by the inspection light from the optical system unit to scan the visible area SB1 by the inspection light from the optical system unit. . Said ^. After the scanning of one substrate is completed, before the second substrate 1 reaches the lower side of the lower substrate 51, the optical system unit 2 is moved to the upper position of the scanning area=·Λ, and the optical system is moved. The unit application area SB2 is open, and the position moves upward. Next, the first light tt1' is scanned by the inspection scanning area SA2 of the light projecting system applied from the optical system unit, and the scanning area SB22 is scanned by the optical system unit 18 201111773. Check light
二:===的掃描結祕^ 一掃:可==第 元2〇a、2〇b向反方向移動反二統單 :描同樣地，對第24塊〜第44塊基板!進行掃：反2 第45塊以後的基板1的掃描也相同。 ； ，圖丄及圖2中’感測器51對輥η所移動的基板^ 的基板移動方向侧的邊緣進行檢測，並將檢測信號輸出至 圖5的信號處理電路5G。在圖5巾，信號處理電路％ 來自CCD線感測|§ 30的數位信號進行處理，按照預定大 小的級別（rank)來對掃描區域的基板丨的缺陷進行檢測， 從而對檢測出的缺陷在掃描區域内的與基板移動方向（χ 方向）正父的方向（γ方向）上的位置進行檢測。另外， 信號處理電路50基於從感測器51輸入檢測信號後所經過 的經過時間，來對檢測出的缺陷在基板移動方向（χ方向） 上的位置進行檢測。信號處理電路50將檢測出的缺陷的資 料輸出至CPU100。 在圖5中’記憶體70根據CPU100的控制，針對每個 19 201111773 掃描區域而將信號處理電路50所檢測出的掃描區域的基 板1的缺陷的資料予以儲存。通報裝置80根據cpui〇〇 的控制來進行後述的通報。輸入輸出裝置9〇輸入後述的製 造線停止命令，並根據CPUUK)的控制來將缺陷的資料^ 後述的判定結果予以輸出。 圖8是表示本發明的-個實施方式的基板檢查裝置的 動作的流程圖（flow chart)。首先，CPUl〇〇向光學系統 移動控制電路60發出指令來使光學系統單元2加、2肋移 動。光學系統移動控制電路60根據來自CPU100的指令， =電流供給至線圈19，使光學系統單元2〇a、2% “個 掃描區域所通過的位置的上空移動（步驟（step) ι〇ι)。 伴隨著借由輥11來使基板丨移動，信號處理電路5〇對來 自CCD線感㈣3G的數位信號進行處理，對掃描區域的 基板1的缺陷進行檢測（步驟1〇2)。 。饮苍，irui⑽对圮憶體7〇進行控制，針對每個掃描 區域而將檢測出的掃描區域的基板的缺陷的資料予以儲 存，並針對每個基板’根據信號處理電路5〇新檢測出的掃 描區域的基板1的缺陷的資料，來對記憶於記憶體川的相 同^描(1域的基板1的缺陷的資料進行更新（步驟卿。 ，著:CPU100針對每個基板，根據記憶於記憶體1〇〇的 夕個掃描區域的基板丨的缺陷的資料，來製作丨 缺陷的資料（步驟104)。 土 接著，CPU100基於所製作的i塊基板的缺陷的資料， 針對每個基板來判定1塊基板的缺陷的數量是否處於允許 20 201111773 值以内（步驟1G5)。可按照缺陷的大小的級別來進行所 述判定’或者也可無關大小驗難關，而是將i塊 基板的全部㈣作為縣來騎㈣判定。#丨塊基板的 缺陷的數量處於允許值以内時，前進至步驟1〇9。當i塊 基板的缺陷的數量已超過允許值時，cpui〇〇對通報裝置 80進行控制’向製紗f理者或製造線控做備通報工、塊 基板的缺陷的數量已超過允許值（步驟1〇6)。接著， CPU100判定衫已將製造線停止命令從製造線管理者 製造線控制設備輸入至輸入輸出裝置9〇 (步驟1〇7)。冬 並未輸入有製造線停止命令時，前進至步驟1〇9。當已二 入有製造線停止命令時’ CPU1(K)對輸人輸出裝置^進^ 控制，將缺陷的資料及判定結果予以輸出（步驟1〇 並使處理停止（Stop)。 接著，CPU100對輸入輸出裝置90進行控制，針對 個基板而將缺陷的資料及判定結果予以輸出。（步驟 109)。例如，由監視（m〇nit〇r)用顯示器來顯示表示缺 陷的大小及位置的圖表（map)，或由印表機（pnnter)來 列，出該圖表；或者按照缺_大小的級別，由監視用顯 不盗來顯不各掃描區域的缺陷的數量及丨塊基板的缺陷的 數量’或的表機來列印出所述數量，從而將缺陷的 予以輸出。接著’ CPU100判定全部基板的檢查是否已妹 束（步驟11G)，當所述檢查尚未結束時，返回至步驟1〇厂 當所述檢查已結束時，使處理停止。 根據以上所說明的實施方式，針對每個掃描區域而將 21 201111773 ，測出的掃描區域的基板的缺陷的資料予以儲存，並針對 每個基板，根據新檢測出的掃描區域的基板的缺陷的資 料，來對所記憶的相同掃描區域的基板的缺陷的資料進行 ^新（步驟103)，並根據多個掃描區域的基板的缺陷的 資料來製作1塊基板的缺陷的資料（步驟104)，借此， 可針對每個基板而獲得1塊基板的缺陷的資料，因此，可 更迅速地對製造線内的基板的缺陷進行檢查。 此外，根據以上所說明的實施方式，基於已製作的1 塊基板的缺陷的資料，針對每個基板來判定丨塊基板的缺 陷的數量是否處於允許值以内（步驟1〇5)，借此，當發 生1塊基板的缺陷的數量超過允許值的故障時，可針對每 個基板而提早發現該故障。 圖9及圖10是表示圖丨及圖2的校正用平臺的概略構 成的圖，圖9表示對應於圖i的俯視圖，圖1〇表示從左側 觀察圖2所示的校正平臺的側視圖。如圖丨所示，校正平 臺61a處於平臺10的下側的維護區域内，且設置在框架 13、14的腳上。該校正平臺61a包括基底㈧⑽幻&、、 調整螺栓（bolt) 62、滚珠螺杆單元（ballscrewunit) 63、 伺服馬達（servomotor) 64、樣品固持器（sampleh〇lder) 65、附帶標準粒子的基板66、可動塊體⑽⑶）67及板 彈簧69。附帶標準粒子的基板66被安置於樣品固持器65。 借由設置於樣品固持器65的板彈簧69來保持附帶標準粒 子的基板66。樣品固持器65被設置在滾珠螺杆單元63的 可動塊體67上，伺服馬達64旋轉之後，該可動塊體67 22 201111773 進行直線移動。與基板移動方向並行地設置滾珠螺杆單元 63，借此，可動塊體67上的樣品固持器65也可平行地移 動。 滾珠螺杆單元63固定在基底61上，可借由3個調整 螺栓62，在與設置在裝置腳上的基底68之間的間隙°中， 向兩個方向來對基底61進行調整。借此，可對高度進行調 整，使得正在基板移動方向上移動的基板i的表面的高度 與附帶標準粒子的基板66的表面高度相同。 操作員（operator)對操作面板（pand)進行操作以 將檢查模式（mode)切換為校正模式，借此來進行 統的校正作業。借此，光學系統單元咖、應向_γ方向 進行動作’並向維護區域移動。光學系統單元施、勘 移動至維·__帶標準粒子的基板.％上的檢 ==後:亭止，成為附帶標準粒子的基板66的檢查 =寺嶋。校正用平臺61a開始進行以與檢 的基板移動方向相同的方向、相同的速度向义方㈣^ 之後’光學系統單元施、咖 進行掃描。在校正用平臺6la、6lh广丰粒子的基板66 之後’光學系統單元20a' 20b為了準向備x接;向=完二 向X方向返回的動作直至檢查開始位置為止。 仃 在杈正用平臺61a、61b向 位置為止的返回動作完成之後，校正二回ft開始 檢查區域内的基板移動方向相同的方：：6门=从與Two: === Scanning Junction ^ One sweep: Yes == Dimensions 2〇a, 2〇b Move in the opposite direction to the opposite unit: In the same way, sweep the 24th to 44th substrates! The scanning of the substrate 1 after the 45th block is also the same. The sensor 51 detects the edge on the substrate moving direction side of the substrate 2 on which the roller η moves, and outputs a detection signal to the signal processing circuit 5G of FIG. In Figure 5, the signal processing circuit % is processed from the CCD line sensing | § 30 digital signal, and the defect of the substrate 扫描 in the scanning area is detected according to a predetermined size, so that the detected defect is The position in the scanning area in the direction (γ direction) of the positive direction of the substrate moving direction (χ direction) is detected. Further, the signal processing circuit 50 detects the position of the detected defect in the substrate moving direction (χ direction) based on the elapsed time after the detection signal is input from the sensor 51. The signal processing circuit 50 outputs the detected defect information to the CPU 100. In Fig. 5, the memory 70 stores the data of the defect of the substrate 1 of the scanning area detected by the signal processing circuit 50 for each 19 201111773 scanning area in accordance with the control of the CPU 100. The notification device 80 performs notification described later based on the control of cpui〇〇. The input/output device 9A inputs a manufacturing line stop command to be described later, and outputs a determination result of the defect data described later based on the control of the CPUUK). Fig. 8 is a flow chart showing the operation of the substrate inspecting apparatus according to the embodiment of the present invention. First, the CPU 1 issues an instruction to the optical system movement control circuit 60 to move the optical system unit 2 and the ribs. The optical system movement control circuit 60 supplies a current to the coil 19 in accordance with an instruction from the CPU 100, and causes the optical system unit 2a, 2% to move up the position through which the scanning area passes (step ι〇ι). The signal processing circuit 5 处理 processes the digital signal from the CCD line sense (4) 3G to detect the defect of the substrate 1 in the scanning area (step 1〇2). Irui (10) controls the memory 7 ,, stores the data of the defects of the detected scanning area for each scanning area, and scans the newly detected scanning area according to the signal processing circuit 5 for each substrate The data of the defect of the substrate 1 is updated with the same data (the data of the defect of the substrate 1 in the 1 domain) (the step is: The CPU 100 is for each substrate, and is stored in the memory 1) The defect data of the substrate 丨 in the scan area of the 〇 is used to create the defect data (step 104). Next, the CPU 100 is based on the data of the defect of the created i-block substrate for each base. The board determines whether the number of defects of one substrate is within the allowable value of 20 201111773 (step 1G5). The determination may be made according to the level of the size of the defect' or may be irrelevant, but the i-substrate All (4) as the county to ride (four) judgment. # When the number of defects of the substrate is within the allowable value, proceed to step 1〇9. When the number of defects of the i-block substrate has exceeded the allowable value, cpui〇〇 to the notification device 80 performs control 'the number of defects of the block and the substrate to be notified to the yarn-making or manufacturing line control has exceeded the allowable value (step 1〇6). Next, the CPU 100 determines that the shirt has stopped the manufacturing line from the manufacturing line. The manager manufactures the line control device to input to the input/output device 9 (step 1〇7). When the manufacturing line stop command is not input in winter, the process proceeds to step 1〇9. When the manufacturing line stop command has been entered, 'CPU1 (K) Controlling the input and output device, outputting the defect data and the determination result (step 1〇 and stopping the process (Stop). Next, the CPU 100 controls the input/output device 90 for each base. The data of the defect and the determination result are output (step 109). For example, a monitor (m〇nit〇r) displays a map indicating the size and position of the defect, or a printer (pnnter) ) to list, out of the chart; or according to the level of the lack of size, the number of defects in the scanning area and the number of defects of the block substrate can be printed by the monitor. Said quantity, thereby outputting the defect. Then 'CPU 100 determines whether the inspection of all the substrates has been sisterd (step 11G), and when the inspection has not ended, returns to step 1 when the inspection has ended, so that Processing stops. According to the embodiment described above, 21 201111773, the data of the defects of the substrate of the detected scanning area are stored for each scanning area, and for each substrate, according to the defect of the substrate of the newly detected scanning area Data is used to update the data of the defects of the substrate in the same scanning area (step 103), and to make data of defects of one substrate based on the data of the defects of the substrate in the plurality of scanning areas (step 104), Thereby, the data of the defects of one substrate can be obtained for each substrate, and therefore, the defects of the substrate in the manufacturing line can be inspected more quickly. Further, according to the embodiment described above, it is determined for each substrate whether or not the number of defects of the block substrate is within an allowable value based on the material of the defect of the one substrate that has been produced (step 1〇5), whereby When a failure occurs in which the number of defects of one substrate exceeds an allowable value, the failure can be found early for each substrate. Figs. 9 and 10 are views showing a schematic configuration of the correction table of Fig. 2 and Fig. 2, Fig. 9 is a plan view corresponding to Fig. i, and Fig. 1A is a side view showing the correction stage shown in Fig. 2 as viewed from the left side. As shown in Fig. 2, the correction stage 61a is located in the maintenance area on the lower side of the platform 10, and is disposed on the legs of the frames 13, 14. The calibration platform 61a includes a substrate (8) (10) phantom &, an adjustment bolt 62, a ball screw unit 63, a servomotor 64, a sample holder 65, and a substrate 66 with standard particles. , movable block (10) (3)) 67 and leaf spring 69. The substrate 66 with standard particles is placed on the sample holder 65. The substrate 66 with standard particles is held by a leaf spring 69 provided to the sample holder 65. The sample holder 65 is disposed on the movable block 67 of the ball screw unit 63, and after the servo motor 64 rotates, the movable block 67 22 201111773 moves linearly. The ball screw unit 63 is disposed in parallel with the moving direction of the substrate, whereby the sample holder 65 on the movable block 67 can also be moved in parallel. The ball screw unit 63 is fixed to the base 61, and the base 61 can be adjusted in two directions by a gap between the three adjustment bolts 62 and the base 68 provided on the device foot. Thereby, the height can be adjusted such that the height of the surface of the substrate i moving in the substrate moving direction is the same as the height of the surface of the substrate 66 with the standard particles. An operator operates an operation panel (pand) to switch the inspection mode (mode) to the correction mode, thereby performing a calibration operation. Thereby, the optical system unit should operate in the _γ direction and move to the maintenance area. The optical system unit is applied, and the movement is moved to the surface of the substrate with the standard particles. The inspection on the %==: after the pavilion, the inspection of the substrate 66 with the standard particles = the temple. The calibration stage 61a starts scanning the optical system unit in the same direction and at the same speed as the detected substrate moving direction. After the correction of the substrates 66a and 61h of the substrate 66 of the Guangfeng particles, the optical system unit 20a' 20b is placed in the x direction; the operation returns to the X direction in the second direction until the inspection start position.仃 After the return operation to the position of the screens 61a and 61b is completed, correct the two ft starts. The direction in which the substrate moves in the inspection area is the same: 6 gates = slaves
J万向、相同的速度向X 23 201111773 方向移動，光學系統單元20a、20b對附帶標準粒子的基板 66進仃掃描，接著完成檢查。基於該檢查結果，操作員進 ;^雷射功率（laser p〇wer)的確認及靈敏度調整作業。在 作業中，由於人無需進入至製造線内，因此，即使在 製造線運轉過程中，也可實施該校正作業。再者，在該實 包方式中，权正平臺61a、的配置部位為維護區 板1的移動區域為檢查區域。 一 、在本實例中，對將維護區域設置於框架端的一個部位 的情況進行了朗，但在雙基的光學魏單元搭載在框架 的If况下，也可將維護區域設置在框架兩端的兩個部 ，並對校正用平臺進行設置。在此情況下，單基的光學 系統單元對檢查區域内的在製造線上流動的基板進行2 查。其他單基的光學系統單元也可實施校正作業。 雖然本發明已以較佳實施例揭露如上，然其並非用以 限，本發明，任何熟習此技藝者，在不脫離本發明之精神 ^範圍内，當可作些許之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準。 w 【圖式簡單說明】 圖1是本發明的一個實施方式的基板檢查裝置的俯視 圖。 圖2是本發明的一個實施方式的基板檢查装置的側視 圖。 圖3是平臺的俯視圖。 圖4是表示光學系統移動機構的局部剖面側視圖。 24 201111773 圖5是表示光學系統及控制系統的概略構成的圖。 圖6是表示光學系_投^統及受光系統的立體 圖。 一 圖7是表示基板的掃描區域的圖。 圖8疋表示本發明的一個實施方式的基板檢查裝置的 動作的流程圖。 圖9是表示圖1及圖2的校正用平臺的概略構成的 圖，且是對應於圖1的俯視圖。 圖10是表示校正用平臺的概略構成的圖’且是從左侧 觀察圖2所示的校正平臺的侧視圖。 【主要元件符號說明】 I :基板 2:搬入運送機 3:搬出運送機 10 :平臺 II :輥 12a、12b :開口 13、14 :框架 15'17’·導轨 16 ·移動台 16c :收納部 16d :臂部 18 :磁鐵板（線性馬達的定子） 19 :線圈（線性馬達的轉子） 25 201111773 20a、20b :光學系統 21 :雷射源 22 :透鏡群 23、25 :鏡面 26 :透鏡 27、30 : CCD線感測器 28 :聚光透鏡 29 :成像透鏡 40 :焦點調節控制電路 41 :焦點調節機構 42 :脈衝馬達 43 :凸輪 44 :凸輪隨動件 50 :信號處理電路 51 :感測器 60 :光學系統移動控制電路 61a、61b :校正用平臺 ❿ 70 :記憶體 80 :通報裝置 90:輸入輸出裝置J universal direction and the same speed are moved in the direction of X 23 201111773, and the optical system units 20a and 20b scan the substrate 66 with the standard particles, and then the inspection is completed. Based on the result of the inspection, the operator enters the laser laser (laser p〇wer) and the sensitivity adjustment operation. In the work, since the person does not need to enter the manufacturing line, the correction work can be performed even during the operation of the manufacturing line. Further, in the package mode, the arrangement portion of the right platform 61a is the inspection area of the maintenance area board 1. 1. In this example, the case where the maintenance area is set to one part of the frame end is performed, but in the case where the double-base optical WE unit is mounted in the frame, the maintenance area can also be set at the two ends of the frame. The department is set up for the calibration platform. In this case, the single-base optical system unit performs a check on the substrate flowing on the manufacturing line in the inspection area. Calibration operations can also be performed on other single-base optical system units. Although the present invention has been described in the above preferred embodiments, it is not intended to limit the scope of the invention, and it is possible to make some modifications and refinements without departing from the spirit of the invention. The scope of the invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a plan view of a substrate inspecting apparatus according to an embodiment of the present invention. Fig. 2 is a side elevational view of a substrate inspecting apparatus according to an embodiment of the present invention. Figure 3 is a top view of the platform. Fig. 4 is a partial cross-sectional side view showing the optical system moving mechanism. 24 201111773 FIG. 5 is a view showing a schematic configuration of an optical system and a control system. Fig. 6 is a perspective view showing an optical system and a light receiving system. Figure 7 is a view showing a scanning area of a substrate. Fig. 8A is a flow chart showing the operation of the substrate inspecting apparatus according to the embodiment of the present invention. Fig. 9 is a view showing a schematic configuration of the correction platform of Figs. 1 and 2, and is a plan view corresponding to Fig. 1; Fig. 10 is a view showing a schematic configuration of a calibration platform, and is a side view of the correction platform shown in Fig. 2 as viewed from the left side. [Description of main component symbols] I: Substrate 2: Carry-in conveyor 3: Unloading conveyor 10: Platform II: Rollers 12a and 12b: Openings 13, 14: Frame 15'17', Guide rail 16 • Mobile station 16c: Storage unit 16d: Arm 18: Magnet plate (stator of linear motor) 19: Coil (rotor of linear motor) 25 201111773 20a, 20b: Optical system 21: Laser source 22: Lens group 23, 25: Mirror surface 26: Lens 27, 30 : CCD line sensor 28 : condensing lens 29 : imaging lens 40 : focus adjustment control circuit 41 : focus adjustment mechanism 42 : pulse motor 43 : cam 44 : cam follower 50 : signal processing circuit 51 : sensor 60: Optical system movement control circuit 61a, 61b: Calibration platform ❿ 70: Memory 80: Notification device 90: Input/output device
100 ： CPU 101〜110 :步驟 NS、SA1 〜SA22、SB1 〜SB22 :區域 26100 : CPU 101 to 110 : Steps NS, SA1 to SA22, SB1 to SB22: Area 26