201104133 六、發明說明： 【發明所屬之技術領域】 本發明是有關於一種光源模組，特別是指一種線光源 模組。 【先前技術】 相較於傳統燈泡，以發光二極體晶片組裝成的發光二 極體封裝件具有體積小、發光壽命長'低功率消耗、無水 銀π染等特性，因此，隨著發光二極體晶片發光效率提升 1光一極體封裝件在部分領域已漸漸取代日光燈及白熾 2泡而廣泛應用’如掃描器光源、液晶顯示器的背光源、 汽車儀表板光源及交通號誌的發光源。 參閱圖1，目前由發光二極體晶片組裝成的發光二極體 封裝件1包含一封襞殼11、一發光二極體晶片12,及一封 裝膠材13。 該封裝殼U概呈立方體，並包括一㈣⑴、一自該 底壁111周緣向上且向外延伸的周壁112、—由該底壁⑴ :該周壁所界定出的碗狀容置空間113，及一形成於該 底壁⑴上的導電線路114;該發光二極體晶片η與該封 裝殼U的導電線路114電連接地裝設於該封裝殼U的底壁 ⑴上；該封裝膝材13為透明並填覆於該容置空間⑴中 ，並包覆該發光二極體晶片12使該發光二極體晶片^與 外界隔絕，避i外界溼氣等造成損害。 /、 當自外界經由該導電線路114供電而使該發光二極體晶 片12發光時，該發光二極體晶月12所發出的光部分直2 201104133 穿通過該封裝膠材13後向外射出，部分則在經過該封裝殼 η周壁112内表面反射後改變行進方向，並同樣穿通過該 封裝膠材13向外射出。 目前的發光二極體封裝件i雖可達到提供光源的目的 ’但是主要的缺點還是在封裝殼的體積無法縮減，導致元 件整體無法配合電子產品往輕薄短小的趨勢發展，此外， 光在藉周壁H2内表面的反射過程中，會有部分光被吸收而 轉變成熱’進而造成該魏二極體晶片12的實際工作壽命 減短，也會造成該發光二極體晶片12發㈣光量不穩定而 影響發光》 參閱圖2，雖然上述的發光二極體封裝件i具有上述的 缺點’但是相較於目前的人造光源種類而言，無論在體積 上、消耗電能上都有大幅的改進，也因此，有相關業者提 出應用上述㈣光二極體封裝们，料整齊排列地設置於 印刷電路板200上構成線光源模組3，用以取代傳統的冷陰 極燈7希望達成縮減背光模組體積、耗電，以及提升發 光亮度的目的。 但是，這樣直接使用發光二極體封裝件丨組裝而成的 線光源模組3仍然會受限於發光二極體封裝件〗封裝殼u 本身的體#，而纟法進一步的配合電子產品進行體積縮減， 應用領域仍有限。 再者’由於這樣的線光源模組3形成的線型光場是由 每一顆發光二極體封裝件丨發出的光場彼此連接而成的，因 此’由於封裝殼11的遮阻，必然在相鄰的光場間會出現光 201104133 亮度較弱的情況，而使線型光場整體形成有亮、暗區域交錯 的現象，而非亮度均勻且連續的線型光，而這樣的明暗交錯 的線型光並不利於後續的實際應用。 此外，當以這樣的線光源模組3搭配導光板構成背光 模組時，就光行進的過程來說，每一發光二極體晶片12所 發出的光，是依序經過封裝膠材13、空氣、再進入導光板 内’由於封裝騎13、空氣，及導光㈣折射率均不相同201104133 VI. Description of the Invention: [Technical Field] The present invention relates to a light source module, and more particularly to a line light source module. [Prior Art] Compared with the conventional light bulb, the light-emitting diode package assembled by the light-emitting diode chip has the characteristics of small volume, long light-emitting life, low power consumption, anhydrous silver π dyeing, and the like, Increased luminous efficiency of polar body wafers In some areas, optical monolithic packages have gradually replaced fluorescent lamps and incandescent 2 bubbles for a wide range of applications such as scanner light sources, backlights for liquid crystal displays, automotive instrument panel light sources, and traffic sources. Referring to Fig. 1, a light-emitting diode package 1 assembled from a light-emitting diode chip currently comprises a clamshell 11, a light-emitting diode chip 12, and a filling material 13. The package U is substantially a cube and includes a (four) (1), a peripheral wall 112 extending upwardly and outwardly from a periphery of the bottom wall 111, a bowl-shaped accommodation space 113 defined by the bottom wall (1): the peripheral wall, and a conductive line 114 formed on the bottom wall (1); the light emitting diode wafer η is electrically connected to the conductive line 114 of the package U to be mounted on the bottom wall (1) of the package U; the package knee 13 It is transparent and filled in the accommodating space (1), and covers the illuminating diode chip 12 to isolate the illuminating diode chip from the outside, thereby avoiding damage caused by external moisture or the like. When the light-emitting diode wafer 12 emits light from the outside through the conductive line 114, the light emitted by the light-emitting diode 12 is directly passed through the package rubber 13 and then emitted outward. And a portion is changed in the traveling direction after being reflected by the inner surface of the peripheral wall 112 of the encapsulating shell, and is also outwardly ejected through the encapsulating material 13. The current LED package i can achieve the purpose of providing a light source. However, the main disadvantage is that the volume of the package cannot be reduced, resulting in the inability of the component to cope with the trend of light and thin electronic products. In addition, the light is borrowing from the wall. During the reflection process of the inner surface of H2, part of the light is absorbed and converted into heat', which causes the actual working life of the Wei diode wafer 12 to be shortened, which also causes the light-emitting diode wafer 12 to emit light (four) unstable. In contrast to FIG. 2, although the above-mentioned light-emitting diode package i has the above-mentioned disadvantages, but compared with the current types of artificial light sources, there is a significant improvement in both volume and power consumption. Therefore, the related art has proposed to apply the above (4) optical diode packages, which are arranged neatly arranged on the printed circuit board 200 to form the line light source module 3, which is used to replace the conventional cold cathode lamp 7 and hope to reduce the volume of the backlight module. Power consumption, and the purpose of improving the brightness of the light. However, the line light source module 3 assembled directly using the light emitting diode package is still limited by the body of the light emitting diode package, and the electronic product is further compatible with the electronic product. Volume reduction, application areas are still limited. Furthermore, since the linear light field formed by the line light source module 3 is connected to each other by the light field emitted from each of the light emitting diode packages, it is inevitable that due to the blocking of the package 11 Between the adjacent light fields, the brightness of the light 201104133 is weak, and the linear light field is formed with the phenomenon that the bright and dark regions are interlaced, instead of the linear light with uniform brightness and continuous, and such light and dark interlaced linear light And it is not conducive to the subsequent practical application. In addition, when the light source module 3 is combined with the light guide plate to form the backlight module, the light emitted by each of the light-emitting diode chips 12 passes through the package adhesive 13 in the process of light travel. Air, then enter the light guide plate. 'The refractive index is different due to package riding 13, air, and light guide (4)
，因此會有部分的光無法耦合進入導光板中，造成光量的損 失。 因此，如何改善目前應用發光二極體晶片13所成之發 光二極體封裝件1，以及應用此等發^^㈣封裝件i形成 之線光源模組3，使其能在體積、散熱上有大幅的提升、形 成之光場有實際應用的價值，甚至應用作為背光模組時可 以減少光量的損失，都有待學界與業界共同集思廣益。 【發明内容】Therefore, part of the light cannot be coupled into the light guide plate, causing loss of light amount. Therefore, how to improve the light-emitting diode package 1 formed by the current application of the light-emitting diode chip 13 and the line light source module 3 formed by using the above-mentioned four-component package i can be used for volume and heat dissipation. There is a substantial increase, the formation of the light field has practical application value, and even when used as a backlight module can reduce the loss of light, it is waiting for the academic community and the industry to brainstorm together. [Summary of the Invention]
因此，本發明之目的，即在提供一 薄、小的超薄型線光源模組。 種導熱快、且體積 於是，本發明一種超薄型線光源模組，包含一座板、 多數發光二極體晶片，及一封裝膠材。 該座板匕#可撓曲且由具有高熱傳導係數的材料構 成的基底層、一形成在該基底層上並絕緣的絕緣層，及一 設置於該絕緣層上的導電料，該絕緣層由構成該基底層 之材料所成的氧化物所構成。 多數發光二極體晶片與該導電線路電連接地裝設於該 201104133 座板上並經由該導電線路供電時發光。 該透明的封裝謬材形成於該座板上並包覆該發光二極 體晶片单元。 本發明之功效在於：直接將發光二極體晶片設置於可 繞曲且主要由可快速導熱之基底層構成的座板上，可將發 光時伴隨產生的熱快速導離而提升發光穩定度與實際工作 壽命，同時大幅縮減體積，並可藉著撓屈特性增加應用領 域，此外，封裝膠材可視後續導光與均光之應用成型，而 減少光損失、增加應用效能。 【實施方式】 有關本發明之前述及其他技術内容、特點與功效，在 以下配合參考圖式之一個較佳實施例的詳細說明中，將可 清楚的呈現。 在本發明被詳細描述之前，要注意的是，在以下的說 明内容中，類似的元件是以相同的編號來表示。 參閱圖3，本發明一種超薄型線光源模組4的一較佳實 施例，包含一座板41、多數發光二極體晶片42，及一封裝 膠材43。 該座板41呈長條薄片狀，包括一可挽曲且由具有高熱 傳導係數的材料構成的基底層川、一形成在該基底層川 上並絕緣的絕緣層412，及一設置於該絕緣層412上的導電 線路413，該基底層411的厚度愈薄愈佳，但過薄時會出現 承載力不足㈣題’過厚時則失去本發明訴求超薄的主要 目的之’且散熱的路徑變長而有散熱的問題出現，因此 201104133 尽度在50 5〇〇/zm為佳，且選自由I呂、鋼、錄、翻、鋼、 銀等金屬，及/或此等金屬所成的合金所構成，該絕緣層 412由構成該基底層411之材料所成的氧化物所構成，厚度 在0.1〜1/zm即可有絕緣的功效，所以整體來說，座板41 的整體厚度不大於501#m，故可以視應用而做適度的撓曲 變形，同時也具有絕佳的散熱表現；更詳細地說，該座板 41疋先選自例如極薄的鋁板經過適度的氧化處理後，於表 面形成氧化鋁層，此時，氧化鋁層即為絕緣層412，未氧化 的結構即為基底層411，之後，再於絕緣層412上佈設預定 形狀、厚度的金屬獏作為導電線路413，而完成整體座板 41的I作，當然，該座板41也可以選自例如極薄的鋁板作 為基底層411，再施以物理性或是化學性鍍膜依序形成絕緣 層412、導電線路413，由於此等製作過程並非本發明創作 重點所在，故在此不再多加舉例贅述。 該等發光二極體晶片42即一般自晶圓加工後所製作得 到的發光二極體晶片，分別與該導電線路4丨3電連接地整 \裝。又於該座板41上’並在經由該等導電線路413供電時 發光。 該透明的封裝料43形成於該座板41上，自該座板 41表面向上包覆該等發光二極體晶片42與該導電線路‘Η 用以阻、，.邑外界濕氣等污染發光二極體曰曰曰# 42，值得一提 地’該封裝膠材43的構成材料在固化後是可撓屈的，用以 配合座板41的撓屈度進行後續應用，或是厚度極薄而不影 響到整體的撓屈變％，此外’其立體形狀可以搭配後續導 201104133 光與均光之應用而做不同的改變；在本例中，該封裝膠材 43的構成材料可選自例如壓克力材料，切膠材料。 當外界經由該等導電線路413供電時可使該等發光二 極體晶片42發光’發出的光在穿通過該封裝膠材“後向 外射出；且由於該等發光：極體晶片42是直接整齊設置於 座板41上，且封裝膠材43是成連續的預定立體型態包覆 該等發光二極體晶片42,所以該等發光二極體晶片42所發 出的光直接經過封裝膠材43向外穿通過該封裝膠材43於 外界形成的線型光場’是亮度均勾且連續的線型光場，並 不會像現有的線光源模組3 一般，由於單顆發光二極體封 裝件1的封裝殼11 pa隔，而出現有亮 '暗區域交錯的現象 〇 另外，由於該座板41主要是由具有高熱傳導係數的材 料，例如鋁、銅、鎳、鉬、鋼、銀等金屬或合金所構成， 同時整體厚度極薄，所以該等發光二極體晶片42作動發光 而產生的廢熱可直接經過厚度極薄的該座板41的絕緣層 412、基底層411而向外導出，進而可以延長本發明超薄型 線光源模組4的實際使用壽命，並提升發光的穩定度及均 句度。 也因為由於該座板41整體厚度不大於5〇1#m而成長 薄片態樣，即便再計入發光二極體晶片42、封裝膠材43的 最大厚度，整體厚度仍極薄，而相較於目前的線光源模組工 而言，體積大幅縮減不言可喻，進而使得本發明超薄型發 光二極體光源模組4實際應用於電子產品中時，確實有助 201104133 2子產品㈣型與輕量化設計；制是魏合該座板“ 』的可挽曲特性，所以更可視實際需要作多樣化的配合 *並可以應用於目前發展中的可撓式液晶顯示器、電子紙 專作為光源使用。 而要另外朗的是，t應用本㈣超Μ線光源模組4 ”導光板配σ組裝成液晶顯示器用的背光源時，還可以選 擇封裳膠材43的折射係'數與導光板相同，並配合直接將封 靖43接觸導光板，例如於導光板的入光面開設一恰可 谷置本發明超薄型線光源模組4的凹槽，而將本發明超薄 型線光源模組4與導光板相組裝，如此，不但可以縮減背 米源的整體體積，同時，就光的行進路徑來說，該等發光 -極體日日片42所發出的光是經過封裝膠材43後即直接耗 合進入折射係數與封歸材43 —致的導光板中，所以幾乎 無光損耗產生，而更可以提升背光源的發光亮度與均勾度 〇 綜上所述，本發明超薄型線光源模、组4是藉著直接將 發光二極體晶片42設置在可撓曲且可快速導熱的座板Μ 上，使得發光二極體晶片42發光時伴隨產生的祕可快速 自座板41向外導出，此外，也藉由座板41成薄片狀的設 计，可縮減整體體積而減少於電子產品内佔用的空間，同 時因本發明超薄型線光源模組4為可撓曲，所以可配合應 用於例如可撓式液晶顯示器、電子紙作為背光源之用^ 外，本發明超薄型線光源模組4的封裝膠材杓外型、材質 均可以視後續導光與均光之應用成型，大幅減少光損失貝 201104133 並增加應用領域效能’確實改進習知線光源模組i的熱門 題與體積問題’達成本發明之目的。 …° 惟以上所述者，僅為本發明之較佳實施例而已，當不 能以此限定本發明實施之範圍，即大凡依本發明申請: 範圍及發明說明内容所作之簡單的等效變化與修飾 屬本發明專利涵蓋之範圍内。 【圖式簡單說明】 圖是體剖視圖，說明習知的發光二極體封裝件 » 圖2是一立體圖，說明以圖i的發光二極體封裳件所 成的線光源模組；及 圖3是一立體剖視圖，說明木發明超薄型線光源模組 的一較佳實施例。 10 201104133 【主要元件符號說明】 4 超薄型線光源模組 413 導電線路 41 座板 42 發光二極體晶片 411 基底層 43 封裝膠材 412 絕緣層 11Accordingly, it is an object of the present invention to provide a thin, small ultra-thin line light source module. The heat conduction is fast and the volume is. Therefore, the ultra-thin line light source module of the invention comprises a board, a plurality of light-emitting diode chips, and a package glue. The seat plate is a base layer which is flexible and composed of a material having a high heat transfer coefficient, an insulating layer formed on the base layer and insulated, and a conductive material disposed on the insulating layer, the insulating layer is composed of It is composed of an oxide formed of a material constituting the underlayer. A plurality of light-emitting diode chips are electrically connected to the conductive line and are mounted on the 201104133 seat board and emit light when powered by the conductive line. The transparent package coffin is formed on the seat plate and covers the light emitting diode wafer unit. The utility model has the advantages that the light-emitting diode wafer is directly disposed on a seat plate which can be wound and mainly composed of a base layer capable of rapid heat conduction, and the heat generated accompanying the light-emitting can be quickly guided away to improve the light-emitting stability and the light-emitting stability. The actual working life, while greatly reducing the volume, can increase the application field by flexing characteristics. In addition, the encapsulant can be shaped by subsequent light guiding and homogenizing, thereby reducing light loss and increasing application efficiency. The above and other technical contents, features, and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. Before the present invention is described in detail, it is noted that in the following description, similar elements are denoted by the same reference numerals. Referring to Figure 3, a preferred embodiment of an ultra-thin line source module 4 of the present invention comprises a board 41, a plurality of LED chips 42, and a package of adhesive 43. The seat plate 41 is in the form of a long strip, and comprises a base layer which is bendable and made of a material having a high thermal conductivity, an insulating layer 412 formed on the base layer and insulated, and a layer disposed on the insulating layer The conductive line 413 on the 412, the thinner the thickness of the base layer 411 is better, but when the thickness is too thin, the bearing capacity is insufficient. (4) When the problem is too thick, the main purpose of the invention is to lose the ultra-thinness and the path of heat dissipation is changed. Long and heat-dissipating problems occur, so 201104133 is best at 50 5〇〇/zm and is selected from alloys such as Ilu, steel, recorded, turned, steel, silver, etc., and/or alloys of these metals. The insulating layer 412 is made of an oxide formed of a material constituting the base layer 411, and has a thickness of 0.1 to 1 / zm, so that the overall thickness of the seat plate 41 is not more than 501#m, so it can be moderately flexed according to the application, and also has excellent heat dissipation performance; more specifically, the seat plate 41 is first selected from, for example, a very thin aluminum plate after a moderate oxidation treatment. Forming an aluminum oxide layer on the surface, at this time, oxidizing The layer is the insulating layer 412, and the unoxidized structure is the base layer 411. Thereafter, a metal crucible of a predetermined shape and thickness is disposed on the insulating layer 412 as the conductive line 413, thereby completing the I of the integral seat plate 41. The seat plate 41 can also be selected from, for example, an extremely thin aluminum plate as the base layer 411, and then the physical layer or the chemical plating film is sequentially formed to form the insulating layer 412 and the conductive line 413. Since the manufacturing process is not the focus of the present invention. Therefore, no more details are given here. The LED chips 42 are generally fabricated from the wafer after processing, and are electrically connected to the conductive lines 4丨3. It is also on the seat plate 41 and emits light when it is supplied via the conductive lines 413. The transparent package material 43 is formed on the seat plate 41, and the light-emitting diode chip 42 and the conductive line '' are shielded from the surface of the seat plate 41 for blocking, and the external moisture and the like are contaminated. Diode 曰曰曰# 42, It is worth mentioning that the constituent material of the encapsulating material 43 is curable after curing, and is used for the subsequent application of the flexor of the seat plate 41, or the thickness is extremely thin. Without affecting the overall flex %, in addition, 'the three-dimensional shape can be changed differently with the application of the subsequent guide 201104133 light and the uniform light; in this example, the constituent material of the encapsulating material 43 can be selected, for example, from Acrylic material, cut material. When the external power is supplied through the conductive lines 413, the light emitting diodes 42 can emit light emitted by the light emitting diodes 42 after being passed through the package rubber; and due to the light emitting: the polar body wafer 42 is directly The package material 43 is disposed on the seat plate 41, and the package material 43 is coated with the light-emitting diode chips 42 in a continuous predetermined three-dimensional shape. Therefore, the light emitted by the light-emitting diode chips 42 directly passes through the package rubber. 43. The linear light field formed by the outer surface of the package adhesive 43 is a linear light field with continuous brightness and is not like the existing line light source module 3, due to the single light emitting diode package. The package case 11 of the piece 1 is separated, and there is a phenomenon that the bright 'dark area is staggered. In addition, since the seat plate 41 is mainly made of a material having a high heat transfer coefficient, such as aluminum, copper, nickel, molybdenum, steel, silver, etc. The metal or the alloy is formed, and the overall thickness is extremely thin. Therefore, the waste heat generated by the light-emitting diodes 42 can be directly led out through the insulating layer 412 and the base layer 411 of the seat plate 41 having a very small thickness. And can be extended The actual service life of the ultra-thin line light source module 4 of the present invention improves the stability of the illumination and the uniformity of the sentence. Also, since the overall thickness of the seat plate 41 is not more than 5〇1#m, the thin film is grown, even if Taking into account the maximum thickness of the LED wafer 42 and the encapsulant 43 , the overall thickness is still extremely thin, and compared with the current line source module, the volume is greatly reduced, and thus the invention is super When the thin light-emitting diode light source module 4 is actually used in electronic products, it really helps the 201104133 2 sub-product (four) type and lightweight design; the system is the flexible function of the "s" of the seat plate, so it is more visible. It is actually necessary to make a variety of cooperation* and can be applied to the currently developing flexible liquid crystal display and electronic paper for use as a light source. In addition, if the application of the (4) super-twisted light source module 4" light guide plate with σ assembled into a backlight for liquid crystal display, the refractive index of the sealing material 43 can also be selected to be the same as the light guide plate. And in conjunction with directly contacting Fengjing 43 to the light guide plate, for example, opening a groove of the ultra-thin line light source module 4 of the present invention on the light incident surface of the light guide plate, and the ultrathin line light source module of the present invention The group 4 is assembled with the light guide plate, so that not only the overall volume of the back rice source can be reduced, but also the light emitted by the light-emitting body day 42 is passed through the encapsulating material 43 in terms of the traveling path of the light. After that, it directly consumes into the light guide plate with the refractive index and the sealing material 43, so that almost no light loss is generated, and the brightness and the uniformity of the backlight can be improved, and the invention is ultra-thin. The linear light source mode and the group 4 are provided by directly arranging the light-emitting diode wafer 42 on the flexible and rapidly heat-conductive seat plate ,, so that the light-emitting diode chip 42 can be quickly self-supporting when it emits light. The plate 41 is outwardly led out, and in addition, is also thinned by the seat plate 41 The sheet-like design can reduce the overall volume and reduce the space occupied by the electronic product. At the same time, since the ultra-thin line light source module 4 of the present invention is flexible, it can be applied to, for example, a flexible liquid crystal display, an electronic device. The paper is used as a backlight. In addition, the package material of the ultra-thin line light source module 4 of the present invention can be formed according to the application of the subsequent light guiding and the homogenizing light, thereby greatly reducing the optical loss of the shell 201104133 and increasing the application. The field performance 'does improve the hot title and volume problem of the conventional line source module i' to achieve the object of the present invention. The above is only the preferred embodiment of the present invention, and the present invention cannot be limited thereto. 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Light-emitting diode package » Fig. 2 is a perspective view showing a line light source module formed by the light-emitting diode package of Fig. i; and Fig. 3 is a perspective sectional view showing the wood invention super A preferred embodiment of the thin-line light source module. 10 201104133 [Description of main component symbols] 4 Ultra-thin line light source module 413 Conductive line 41 Seat plate 42 Light-emitting diode wafer 411 Base layer 43 Package adhesive 412 Insulation layer 11