TW201041971A - Polyester composition for forming thermoset film - Google Patents

Polyester composition for forming thermoset film Download PDF

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TW201041971A
TW201041971A TW099108502A TW99108502A TW201041971A TW 201041971 A TW201041971 A TW 201041971A TW 099108502 A TW099108502 A TW 099108502A TW 99108502 A TW99108502 A TW 99108502A TW 201041971 A TW201041971 A TW 201041971A
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group
component
formula
polyester composition
forming
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TW099108502A
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TWI488914B (en
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Tadashi Hatanaka
Isao Adachi
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Nissan Chemical Ind Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/09Carboxylic acids; Metal salts thereof; Anhydrides thereof
    • C08K5/092Polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/12Esters; Ether-esters of cyclic polycarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/13Phenols; Phenolates
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133514Colour filters
    • G02F1/133519Overcoatings
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/13363Birefringent elements, e.g. for optical compensation
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1337Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
    • G02F1/133711Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films
    • G02F1/133715Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by organic films, e.g. polymeric films by first depositing a monomer
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00Materials and properties
    • G02F2202/02Materials and properties organic material
    • G02F2202/022Materials and properties organic material polymeric
    • G02F2202/023Materials and properties organic material polymeric curable
    • G02F2202/025Materials and properties organic material polymeric curable thermocurable

Abstract

A material which forms a cured film that has high solvent resistance, the property of aligning liquid crystals, heat resistance, high transparency, and high planarization characteristics and which, when used in forming a cured film, can be dissolved in various solvents usable in a line for producing, for example, a planarization film for color filters. The material is a polyester composition for forming heat-cured films which comprises a polyester as component (A), a cros slinking agent as component (B), and at least one diester compound represented by formula (1) as component (C). (In formula (1), P represents an alicyclic group, a group composed of an alicyclic group and an aliphatic group, or a structure represented by formula (2), and Q represents an alicyclic group or a group composed of an alicyclic group and an aliphatic group. In formula (2), R represents an alkylene ground.

Description

201041971 六、發明說明: 【發明所屬之技術領域】 本發明係有關熱硬化膜形成用聚酯組成物及自其而得 之硬化膜。更詳細爲,具有高透明性、平坦化性、及液晶 配向能、高耐溶劑性與耐熱性之熱硬化膜形成用聚酯組成 物及其硬化膜,以及該硬化膜之適用法。該熱硬化膜形成 用聚酯組成物適用爲,特別是液晶顯示器中兼具液晶配向 0 機能之彩色濾光器保護膜劑。 【先前技術】 一般液晶顯示元件、有機EL ( electroluminescent ) 元件、固體攝影元件等之光裝置中,爲了防止元件表面曝 露於製造產線時所使用的溶劑及熱而設置保護膜。該保護 膜除了對被保護之基板具有高密合性及高耐溶劑性外,也 要求具有透明性、耐熱性等性能。 Q 該類保護膜作爲彩色液晶顯示裝置及固體攝影元件所 使用的彩色濾光片之保護膜用時,一般要求具有使其底層 基板之彩色濾光片或黑色基底(black matrix)樹脂平坦化之 性能,即平坦化膜用之性能。特別是製造STN方式及TFT 方式之彩色顯示元件時,彩色濾光片基板與對向基板需具 有非常嚴密的貼合精準度,因此使基板間之單元間距均勻 爲不可缺事項。另外爲了維持透過彩色濾光片之光線的透 過率,其保護膜般此等平坦化膜需具有高透明性。 又,近年來開始檢討將相位差材料導入液晶顯示裝置 -5- 201041971 之單元內以達低成本化及輕量化,又一般所使 位差材料爲塗佈液晶單體後配向再光硬化之材 該相位差材料配向其需爲,對底層膜進行硏磨 配向性之材料。因此於彩色濾光片之保護膜上 層成膜後,可形成相位差材料(參考圖2 ( a ) 具該液晶配向層及彩色濾光片之保護膜的層( ))可具有低成本化、削減步驟數等優點,因 該類材料。 一般該彩色濾光片之保護膜係使用透明性 酸樹脂。就安全性及處理性觀點,此等丙烯酸201041971 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a polyester composition for forming a thermosetting film and a cured film obtained therefrom. More specifically, it is a polyester composition for forming a thermosetting film having high transparency, flatness, liquid crystal alignment energy, high solvent resistance and heat resistance, a cured film thereof, and a method for applying the cured film. The polyester composition for forming a thermosetting film is suitably used as a color filter protective film which has a liquid crystal alignment function in a liquid crystal display. [Prior Art] In general, a light-shielding device such as a liquid crystal display device, an organic EL (electroluminescent) device, or a solid-state imaging device is provided with a protective film for preventing exposure of the surface of the device to a solvent and heat used in the production line. In addition to high adhesion and high solvent resistance to the substrate to be protected, the protective film is required to have properties such as transparency and heat resistance. Q When such a protective film is used as a protective film for a color filter used in a color liquid crystal display device or a solid-state imaging device, it is generally required to have a color filter or a black matrix resin for the underlying substrate. Performance, ie the performance of a flattening film. In particular, when manufacturing color display elements of the STN type and the TFT type, the color filter substrate and the counter substrate need to have a very close bonding precision, so that the cell pitch between the substrates is uniform. Further, in order to maintain the transmittance of light transmitted through the color filter, the planarizing film like the protective film needs to have high transparency. In addition, in recent years, it has been reviewed to introduce a phase difference material into a cell of a liquid crystal display device-5-201041971 to achieve cost reduction and weight reduction, and generally, the material for the difference is coated with a liquid crystal monomer and then re-hardened. The phase difference material is aligned with a material which is required to be honed and aligned to the underlying film. Therefore, after the upper layer of the protective film of the color filter is formed, a phase difference material can be formed (refer to FIG. 2 (a) a layer ( ) having the protective film of the liquid crystal alignment layer and the color filter), which can be reduced in cost. The advantages of reducing the number of steps are due to this type of material. Generally, a transparent acid resin is used as the protective film of the color filter. In terms of safety and handling, these acrylics

溶劑及乳酸乙酯、乳酸丁酯之酯系溶劑。將該 脂熱硬化及光硬化可賦予耐熱性及耐溶劑性( 、2 )。先前的熱硬化性及光硬化性之丙烯酸 適當的透明性及平坦化性,但就使對該類平坦 磨處理也無法得到充分的配向性。 又,一般液晶配向層係使用溶劑可溶性聚 醯胺酸所形成的材料。曾報告對此等材料進行 完全醯亞胺化時可賦予耐溶劑性,且藉由硏磨 分的配向性(專利文獻3)。但就彩色濾光片 而言,會有大幅降低平坦化性及透明性等問題 胺及聚醯胺酸雖可溶於N-甲基吡咯烷酮及γ_ 劑中,但對二元醇系溶劑及酯系溶劑之溶解性 用於製作平坦化膜之產線。 用的該類相 料。爲了使 處理後具有 使液晶配向 )。形成兼 參考圖2 ( b 此強烈需求 較高之丙烯 樹脂係廣泛 之二元醇系 類丙烯酸樹 專利文獻1 樹脂雖具有 化膜進行硏 醯亞胺及聚 事後烘烤而 處理可得充 之平坦化膜 。又聚醯亞 -丁內酯之溶 較低,難適 -6 - 201041971 【發明內容】 (發明所欲解決之課題) 基於上述事情’本發明所欲解決之課題爲,提供硬化 膜形成後具有高耐溶劑性、液向配向性、耐熱性、高透明 性性及高平坦化性,且硬化膜形成時可溶解於,適用於彩 色濾光片之平坦化膜製作產線的二元醇系溶劑之材料。 Ο (解決課題之方法) 本發明者爲了解決上述課題而專心硏究,結果完成本 發明。 即’第1觀點係有關一種熱硬化膜形成用聚酯組成物 ’其爲含有(A)成份之聚酯、(B)成份之交聯劑及(C )成份之下述式(1)所表示的至少一種二酯化合物。 [化1] ❹ hooc-qV〇>"°VQ"cooh 、0R、 Ο o ⑴ (2) (式中’ p爲脂環式基、脂環式基及脂肪族基所形成 之基或式(2)所表示的構造,Q爲脂環式基或脂環式基 及脂肪族基所形成之基;式(2)中,R爲伸烷基)。 第2觀點係有關第丨觀點之熱硬化膜形成用聚酯組成 物,其中(C)成份爲,下述式(iii)所表示的二醇化合 201041971 酐1.7至2莫 物1莫耳’與下述式(iv)所表示的二羧酸 耳反應而得之二酯化合物。 [化2] HO-P-OH (Hi) Ο Λ .〇 (iv) (2) 肪族基所形成 基或脂環式基 各基中所含的 R爲伸烷基) 成用聚酯組成 意氫原子可各 、醚基、磺酸 取代之碳原子 單鍵或碳原子 熱硬化膜形成 (式中,P爲脂環式基、脂環式基及月 之基或式(2)所表示的構造,Q爲脂環5 及脂肪族基所形成之基,P及Q可各自爲 任意氫原子被脂肪族基取代;式(2 )中, 〇 第3觀點係有關第2觀點之熱硬化膜? 物,其中P爲下述式(1P1)所表示之基。 [化3] —R12-P1-^R11-P1^R13- (1P1) (式中,P1爲環狀飽和烴基,P1基中 自獨立被脂肪族基取代;rm爲單鍵、羰 基、碳原子數1至8之飽和烴基或被氟原 數1至8的飽和烴基,R12、R13各自獨立 數1至5之伸烷基,h爲0或1)。 第4觀點係有關第2觀點或第3觀點 用聚酯組成物,其中Q爲下述式(1Q1)所表示之基。 -8- 201041971 [化4] -Q1—X— (1Q1 ) (式中,Q1爲碳原子數4至8之環伸烷基或環伸鏈烯 基,Q1基中任意氫原子可被脂肪族基或苯基取代;X爲單 鍵或碳原子數1至3之伸烷基)。 第5觀點係有關第1觀點之熱硬化膜形成用聚酯組成 Ο 物,其中(C)成份爲,含有下述式(ι-a)所表示的至少 一種多價酯化合物。 [化5] ΗΟΟ(^γ〇、Pa {〇V|f^Qa、COO^| —Ra-^^Ra)j· (1-a ) ( 2-a) (式中,Pa爲可被氧原子或氮原子中斷之脂環式基或 q 脂肪族烷基,或式(2-a)所表示的構造,Qa爲脂環式基 ,t爲1至5之整數;式(2-a)中,Ra爲伸烷基)。 第6觀點係有關第1觀點至第5觀點中任何一項之熱 硬化膜形成用聚酯組成物,其中(A)成份爲,含有下述 式(3)所表示之構造單位的聚酯。 [化6] / HOOC ^OOH \ 十0_Π〇-Β十 (3)Solvent and ester solvent of ethyl lactate and butyl lactate. This grease thermosetting and photocuring impart heat resistance and solvent resistance (2). The conventional thermosetting and photocurable acrylic acid has appropriate transparency and flattening properties, but sufficient alignment properties cannot be obtained for such flat grinding treatment. Further, in general, the liquid crystal alignment layer is made of a solvent-soluble polyamic acid. It has been reported that the solvent resistance can be imparted to the material when the material is completely imidized, and the alignment property by the honing is known (Patent Document 3). However, in the case of color filters, there are problems such as flatness and transparency which are greatly reduced. Although amines and polylysines are soluble in N-methylpyrrolidone and γ_agents, they are solvents and esters of diols. The solubility of the solvent is used to produce a flat film production line. This type of material is used. In order to make the liquid crystal alignment after the treatment). Fig. 2 (b) This is a highly demanding propylene resin. The diol resin is widely used. The resin has a film which is treated with ruthenium and post-bake. The film is formed, and the solution of the polypyrene-butyrolactone is low, and it is difficult to be -6 - 201041971 [Explanation] The problem to be solved by the present invention is to provide a cured film. After forming, it has high solvent resistance, liquid orientation, heat resistance, high transparency, and high flatness, and is soluble in the formation of a cured film. It is suitable for the flat film production line of color filters.材料 方法 Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο Ο ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' It is at least one diester compound represented by the following formula (1) containing the polyester of the component (A), the crosslinking agent of the component (B), and the component (C). [Chemical Formula 1] ❹ hooc-qV〇>"°VQ"cooh,0R, Ο o (2) (wherein 'p is a group formed by an alicyclic group, an alicyclic group or an aliphatic group or a structure represented by the formula (2), and Q is an alicyclic group or an alicyclic group and an aliphatic group The base formed by the base; in the formula (2), R is an alkylene group). The second aspect is a polyester composition for forming a thermosetting film according to the second aspect, wherein the component (C) is the following formula (iii) The diester compound obtained by reacting the diol compound of 201041971 anhydride 1.7 to 2 moles 1 mole to the dicarboxylic acid represented by the following formula (iv). [Chemical 2] HO-P-OH ( Hi) Ο Λ .〇(iv) (2) The radical formed by the aliphatic group or the R contained in the alicyclic group is an alkyl group. The polyester is composed of a hydrogen atom, an ether group, a sulfonate. An acid-substituted carbon atom single bond or a carbon atom thermosetting film is formed (wherein P is an alicyclic group, an alicyclic group, and a base of the moon or a structure represented by the formula (2), and Q is an alicyclic ring 5 and a fat The group formed by the group, P and Q may each be an arbitrary hydrogen atom substituted by an aliphatic group; in the formula (2), the third viewpoint is a thermosetting film of the second aspect, wherein P is a formula The base represented by (1P1). ] —R12-P1-^R11-P1^R13- (1P1) (wherein P1 is a cyclic saturated hydrocarbon group, and the P1 group is independently substituted by an aliphatic group; rm is a single bond, a carbonyl group, and a carbon number of 1 to a saturated hydrocarbon group of 8 or a saturated hydrocarbon group of 1 to 8 in terms of fluorine, R12 and R13 each independently have an alkylene group of 1 to 5, and h is 0 or 1). The fourth viewpoint is related to the second viewpoint or the third viewpoint. a polyester composition, wherein Q is a group represented by the following formula (1Q1): -8- 201041971 [Chemical Formula 4] -Q1 - X - (1Q1) (wherein Q1 is a ring extension of 4 to 8 carbon atoms An alkyl group or a cycloalkenyl group, wherein any hydrogen atom in the Q1 group may be substituted by an aliphatic group or a phenyl group; X is a single bond or an alkylene group having 1 to 3 carbon atoms). The fifth aspect is the polyester composition for forming a thermosetting film according to the first aspect, wherein the component (C) contains at least one polyvalent ester compound represented by the following formula (I-a).化(^γ〇, Pa {〇V|f^Qa, COO^|—Ra-^^Ra)j· (1-a ) ( 2-a) (wherein, Pa is oxygen An alicyclic group or a q-aliphatic alkyl group interrupted by an atom or a nitrogen atom, or a structure represented by the formula (2-a), Qa is an alicyclic group, and t is an integer of 1 to 5; (2-a) Wherein, Ra is an alkyl group). The polyester composition for forming a thermosetting film according to any one of the first aspect to the fifth aspect, wherein the component (A) is a polyester having a structural unit represented by the following formula (3). [化6] / HOOC ^OOH \ 十0_Π〇-Β十 (3)

\ 0 ° I 201041971 (式中,A爲脂環式基或脂肪族基鍵結4個鍵結鍵之 4價有機基,B爲脂環式基或脂肪族基鍵結2個鍵結鍵之 2價有機基)° 第7觀點係有關第1觀點至第6觀點中任何一項之熱 硬化膜形成用聚酯組成物’其中(A)成份爲’下述式(1 )所表示的四羧酸二酐與式(ii)所表示的二醇化合物反 應而得之聚酯。\ 0 ° I 201041971 (wherein A is an alicyclic group or an aliphatic group bonded to a 4-valent organic group of four bonding bonds, and B is an alicyclic group or an aliphatic group bonding 2 bonding bonds (2) The polyester composition for forming a thermosetting film according to any one of the first aspect to the sixth aspect, wherein the component (A) is a compound represented by the following formula (1) A polyester obtained by reacting a carboxylic acid dianhydride with a diol compound represented by the formula (ii).

(式中,A爲脂環式基或脂肪族基鍵結4個鍵結鍵之 4價有機基,B爲脂環式基或脂肪族基鍵結2個鍵結鍵之 2價有機基)。 第8觀點係有關第6觀點或第7觀點之熱硬化膜形成 用聚酯組成物,其中前述式(3)中,A爲下述式(A-1) 至式(A-8)所表示之基中選出的至少一種基,B爲下述 式(B-1 )至(B-5 )所表示之基中選出的至少一種基。 -10- 201041971 [化8] XX 仰 \術 (A-1, (A-2, (A-/, (間(wherein, A is a tetravalent organic group in which an alicyclic group or an aliphatic group is bonded to four bonding bonds, and B is an alicyclic group or a divalent organic group in which an aliphatic group is bonded to two bonding bonds) . According to a sixth aspect of the present invention, in the above formula (3), A is represented by the following formula (A-1) to formula (A-8); At least one selected from the group consisting of at least one selected from the group represented by the following formulas (B-1) to (B-5). -10- 201041971 [Chem. 8] XX Yang \ surgery (A-1, (A-2, (A-/, (between

(A-?)(A-?)

X (A-5) (A-δ) [化9]X (A-5) (A-δ) [Chemistry 9]

(A-6) 第9觀點係有關第1觀點至第8觀點中任何一項之熱 硬化膜形成用聚酯組成物,其中(A)成份之聚酯的重量 平均分子量爲,聚苯乙烯換算下1,000至3〇,〇〇〇。 第1 0觀點係有關第1觀點至第9觀點中任何一項之 熱硬化膜形成用聚酯組成物,其中另含有(D)成份用之 防氧化劑的苯酚化合物。 第1 1觀點係有關第1觀點至第1 〇觀點中任何一項之 熱硬化膜形成用聚酯組成物,其中另含有(E)成份用之 矽烷偶合劑。 第1 2觀點係有關第1觀點至第1 1觀點中任何—項之 熱硬化膜形成用聚酯組成物,其中另含有(F)成份用之 雙馬來醯亞胺化合物。 第1 3觀點係有關第1觀點至第1 2觀點中任何—項之 熱硬化膜形成用聚酯組成物,其中相對於(A)成份100 質量份含有(B)成份3至50質量份,及(C)成份1至 -11 - 201041971 100質量份。 第1 4觀點係有關第1 〇觀點之熱硬化膜形成用聚酯組 成物,其中相對於(A)成份100質量份含有(D)成份 〇.〇1至5質量份。 第1 5觀點係有關第1 1觀點之熱硬化膜形成用聚酯組 成物,其中相對於(A)成份100質量份含有(E)成份 0.5至30質量份。 第1 6觀點係有關第1 2觀點之熱硬化膜形成用聚酯組 成物,其中相對於(A)成份100質量份含有(F)成份 0.5至50質量份。 第17觀點係有關一種硬化膜,其爲使用第1觀點至 第1 6觀點中任何一項之熱硬化膜形成用聚酯組成物而得 〇 第18觀點係有關一種液晶配向層,其爲使用第1觀 點至第1 6觀點中任何一項之熱硬化膜形成用聚酯組成物 而得。 (發明之效果) 本發明之熱硬化膜形成用聚酯組成物除了具有高平坦 化性、高透明性、高耐溶劑性及高耐熱性外,可形成具有 液晶配向能之硬化膜,因此適用爲液晶配向膜及平坦化膜 之形成材料。特別是可一次形成兼具先前獨立形成之液晶 配向膜及彩色濾光片之保護膜兩者特性的「液晶配向層」 ’故可實現製造過程簡略化及步驟數減少而低成本化等。 -12- 201041971 又本發明之熱硬化膜形成用聚酯組成物可溶於二元醇 系溶劑,因此適用於主要使用此等溶劑之平坦化膜製作管 線時。 (實施發明之最佳形態) 如前述般’先前提案的丙烯酸樹脂及聚醯亞胺系硬化 膜無法充分符合液晶配向膜及平坦化膜所要求的平坦化性 0 、透明性、配向性等全部性能。 又目前爲止液晶顯示元件之配向材料曾提案使用聚酯 (參考特開平5- 1 5805 5號公報、特開2002-229039號公報 )’但此等均不具有熱硬化性,且所形成的硬化膜之耐溶 劑性差。 本發明之特徵爲’使用熱硬化性之聚酯以提升前述平 坦化性、透明性、配向性等性能。即,本發明爲一種熱硬 化膜形成用聚酯組成物,其含有(A)成份用之聚酯、(B Q )成份用之交聯劑、及(C )成份用之下述式(1 )所表示 的二酯化合物。 [化 10] hooc^qV°"p"°YQnc〇〇h 、0R、 Ο O ~R〆〆 ⑴ (2) (式中,P爲脂環式基、含有脂環式基及脂肪族基所 形成之基的基或式(2)所表示的構造,Q爲脂環式基或 -13- 201041971 脂環式基及脂肪族基所形成之基,又式(2)中,R爲伸 烷基)。 又,該熱硬化膜形成用聚酯組成物除了上述(A)至 (C)成份外,可依所希望另含有(D )成份用之防氧化劑 的苯酚化合物、(E )成份用之矽烷偶合劑、(F )成份用 之雙馬來醯亞胺化合物。 下面將詳細說明各成份。 [(A)成份] (A)成份之聚酯較佳爲,含有下述式(3)所表示之 構造單位的聚酯,更佳爲由式(3)所表示之構造單位形 成的聚酯。 [化 12](A-6) The polyester composition for forming a thermosetting film according to any one of the first aspect to the eighth aspect, wherein the weight average molecular weight of the polyester of the component (A) is polystyrene conversion Below 1,000 to 3, hey. The present invention relates to a polyester composition for forming a thermosetting film according to any one of the first aspect to the ninth aspect, which further comprises a phenol compound for an antioxidant of the component (D). The polyester composition for forming a thermosetting film according to any one of the first aspect to the first aspect, further comprising a decane coupling agent for the component (E). The present invention relates to a polyester composition for forming a thermosetting film according to any one of the first aspect to the first aspect, which further comprises a bismaleimide compound for the component (F). The polyester composition for forming a thermosetting film according to any one of the first aspect to the first aspect, wherein the component (B) is contained in an amount of 3 to 50 parts by mass based on 100 parts by mass of the component (A). And (C) ingredients 1 to -11 - 201041971 100 parts by mass. The first aspect is a polyester composition for forming a thermosetting film according to the first aspect, which contains (D) component 〇.〇1 to 5 parts by mass based on 100 parts by mass of the component (A). The fifteenth aspect is the polyester composition for forming a thermosetting film according to the above aspect, wherein the component (E) is contained in an amount of from 0.5 to 30 parts by mass based on 100 parts by mass of the component (A). The present invention relates to a polyester composition for forming a thermosetting film according to the above aspect, wherein the component (F) is contained in an amount of from 0.5 to 50 parts by mass based on 100 parts by mass of the component (A). The seventeenth aspect relates to a cured film which is a polyester composition for forming a thermosetting film according to any one of the first aspect to the sixteenth aspect, wherein the liquid crystal alignment layer is used. The polyester composition for forming a thermosetting film according to any one of the first aspect to the sixteenth aspect. (Effects of the Invention) The polyester composition for forming a thermosetting film of the present invention can form a cured film having a liquid crystal alignment energy in addition to high planarization property, high transparency, high solvent resistance, and high heat resistance. It is a material for forming a liquid crystal alignment film and a planarization film. In particular, the "liquid crystal alignment layer" which combines the characteristics of both the previously formed liquid crystal alignment film and the protective film of the color filter can be formed at one time, so that the manufacturing process can be simplified, the number of steps can be reduced, and the cost can be reduced. -12- 201041971 Further, the polyester composition for forming a thermosetting film of the present invention is soluble in a glycol solvent, and is therefore suitable for use in a flattening film mainly using such a solvent to produce a pipe. (Best Mode for Carrying Out the Invention) As described above, the acrylic resin and the polyimide-based cured film which have been previously proposed cannot sufficiently satisfy the flatness required for the liquid crystal alignment film and the planarizing film, transparency, alignment, and the like. performance. In the prior art, the alignment material of the liquid crystal display device has been proposed to use polyester (see Japanese Patent Laid-Open Publication No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. Hei. No. 2002-229039). The film has poor solvent resistance. The present invention is characterized in that 'the thermosetting polyester is used to enhance the properties such as the aforementioned flatness, transparency, and alignment. That is, the present invention is a polyester composition for forming a thermosetting film comprising the polyester for (A) component, the crosslinking agent for (BQ) component, and the following formula (1) for (C) component. The diester compound represented. [10] hooc^qV°"p"°YQnc〇〇h, 0R, Ο O ~R〆〆(1) (2) (wherein P is an alicyclic group, contains an alicyclic group and an aliphatic group) The base of the group formed or the structure represented by the formula (2), Q is an alicyclic group or a group formed by an alicyclic group and an aliphatic group of -13 to 201041971, and in the formula (2), R is a stretching alkyl). Further, in addition to the above components (A) to (C), the polyester composition for forming a thermosetting film may further contain a phenol compound for the antioxidant of the component (D) and a decene couple for the component (E). Mixture, (F) component of the bismaleimide compound. The components will be described in detail below. [(A) component] The polyester of the component (A) is preferably a polyester containing a structural unit represented by the following formula (3), more preferably a polyester formed of a structural unit represented by the formula (3). . [化 12]

HOOC COOH Ο一C—A一C—O—B II II Ο ΟHOOC COOH Ο一 C—A—C—O—B II II Ο Ο

(3) 上述式中,A爲脂環式基或脂肪族基鍵結4個鍵結鍵 之4價有機基,B爲脂環或脂肪族基鍵結2個鍵結鍵之2 價有機基。 上述A較佳爲下述式(3A1)、式(3A2)或式(3A3 )所表示之基。 -14 - 201041971 [化 13] X >1-R< (3A1) (3A2) (3A3) 式中A1爲環狀飽和烴基,較佳爲碳原子數4至8之 環狀飽和烴基,更佳爲碳原子數4至6之環狀飽和烴基。 又A1基中所含的任意氫原子可各自獨立被脂肪族基取代 ,又此等之中的2個取代基可相互鍵結形成4至6員環。 Ο 此時該取代基之脂肪族基較佳爲碳原子數1至5之脂 肪族基,更佳爲碳原子數1至3之脂肪族基。鍵結此等取 代基形成環時,例如可形成降莰烯基及金剛烷基等交聯環 式烴基、部分或全部氫化之縮合多環式烴基。 上述式中,R1爲單鍵、羰基、醚基、磺酸基、碳原子 數1至8之飽和烴基或被氟原子取代之碳原子數1至8的 飽和烴基。較佳爲單鍵、羰基、醚基、磺酸基、碳原子數 1至5之飽和烴基或被氟原子取代之碳原子數1至5的飽 〇 ^和烴基。 又R2爲碳原子數1至8之飽和烴基,較佳爲碳原子 數1至5之飽和烴基,更佳爲碳原子數1至3之飽和烴基 〇 式(3)中4價有機基之A的具體例較佳爲下述式( A-1)至式(A-8)。下述(A-1)至式(A-8)所表示之基 中,A特佳爲式(A-1)或(A-2)中選出之基。 -15- 201041971 [化 14] (A-1 ) (A-2) (A*3} (A-4) κ (A-δ) (Α-6)(3) In the above formula, A is a tetravalent organic group in which an alicyclic group or an aliphatic group is bonded to four bonding bonds, and B is a divalent organic group in which an alicyclic or aliphatic group is bonded to two bonding bonds. . The above A is preferably a group represented by the following formula (3A1), formula (3A2) or formula (3A3). -14 - 201041971 X >1-R<(3A1) (3A2) (3A3) wherein A1 is a cyclic saturated hydrocarbon group, preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, more preferably It is a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms. Further, any of the hydrogen atoms contained in the A1 group may be independently substituted with an aliphatic group, and two of the substituents may be bonded to each other to form a 4- to 6-membered ring. The aliphatic group of the substituent at this time is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. When the substituents are bonded to form a ring, for example, a crosslinked cyclic hydrocarbon group such as a norenyl group or an adamantyl group or a partially or fully hydrogenated condensed polycyclic hydrocarbon group may be formed. In the above formula, R1 is a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms which is substituted by a fluorine atom. Preferred are a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms substituted by a fluorine atom. Further, R2 is a saturated hydrocarbon group having 1 to 8 carbon atoms, preferably a saturated hydrocarbon group having 1 to 5 carbon atoms, more preferably a saturated hydrocarbon group having 1 to 3 carbon atoms, and A having a tetravalent organic group in the formula (3) Specific examples are preferably the following formula (A-1) to formula (A-8). Among the groups represented by the following (A-1) to (A-8), A is particularly preferably a group selected from the formula (A-1) or (A-2). -15- 201041971 (A-1) (A-2) (A*3} (A-4) κ (A-δ) (Α-6)

(Α-8) 上述式(3)中,Β爲脂環式基或脂肪族基鍵結2個 鍵結鍵之2價有機基,較佳爲下述式(3Β1 )或式(3Β2 ) 所表示之基。 [化 15] —r4-b1-^r3-b1^-r5— —-r6-b2-r7- (3B1) (3B2) 式中之B1爲環狀飽和烴基,較佳爲碳原子數4至8 之環狀飽和烴基,更佳爲碳原子數4至6之環狀飽和烴基 。:Β1基中所含的任意氫原子可各自獨立被脂肪族基取代。 此時該取代基之脂肪族基較佳爲碳原子數1至5之脂 肪族基,更佳爲碳原子數1至3之脂肪族基。此等取代基 鍵結形成環時,例如可形成降莰烯基及金剛烷基等交聯環 式烴基、部分或全部氫化之縮合多環式烴基。 又Β 2爲伸苯基。 式中,R3爲單鍵、羰基、醚基、磺酸基、碳原子數1 至8之飽和烴基或被氟原子取代之碳原子數1至8的飽和 -16- 201041971 烴基,較佳爲單鍵、羰基、醚基、磺酸基、碳原子數1至 5之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴 基。 R4、R5各自獨立爲單鍵或碳原子數1至5之伸烷基’ 較佳爲單鍵、碳原子數1至3之伸烷基。 R6、R7各自獨立爲碳原子數1至5之伸烷基’較佳爲 碳原子數1至3之伸烷基。 又,k爲0或1。 式(3)中2價有機基之B的具體例較佳爲下述式( B-1)至式(B-5)。下述式(B-1)至式(B-5)所表示之 基中,B特佳爲(B-1)至(B-4)中選出之基。 [化 16](Α-8) In the above formula (3), fluorene is a divalent organic group in which two bonding bonds are bonded to an alicyclic group or an aliphatic group, and preferably a formula (3Β1) or a formula (3Β2) The base of expression. -r4-b1-^r3-b1^-r5---r6-b2-r7- (3B1) (3B2) wherein B1 is a cyclic saturated hydrocarbon group, preferably having 4 to 8 carbon atoms The cyclic saturated hydrocarbon group is more preferably a cyclic saturated hydrocarbon group having 4 to 6 carbon atoms. Any of the hydrogen atoms contained in the oxime group may be independently substituted with an aliphatic group. The aliphatic group of the substituent at this time is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. When these substituents are bonded to form a ring, for example, a crosslinked cyclic hydrocarbon group such as a norenyl group or an adamantyl group or a partially or fully hydrogenated condensed polycyclic hydrocarbon group can be formed. Also Β 2 is a stretched phenyl group. Wherein R3 is a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated-16-201041971 hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, preferably a single A bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. R4 and R5 are each independently a single bond or a stretch alkyl group having 1 to 5 carbon atoms. A preferred one is a single bond or an alkylene group having 1 to 3 carbon atoms. R6 and R7 each independently represent a stretch alkyl group having 1 to 5 carbon atoms, and preferably a alkylene group having 1 to 3 carbon atoms. Also, k is 0 or 1. Specific examples of B of the divalent organic group in the formula (3) are preferably the following formulas (B-1) to (B-5). Among the groups represented by the following formulas (B-1) to (B-5), B is particularly preferably a group selected from (B-1) to (B-4). [Chemistry 16]

(B-1 ) (B-2) (B*3> (B-4) (B-5) (A)成份之聚酯較佳爲,含有式(3)所表示之構造 單位中,A爲式(3A1 )至式(3A3 )所表示之基所成群中 選出的至少一種之構造,但可含有式(3A1 )至式(3A3 )所表示之基以外的構造。此時可形成聚酯之構造下’其 構造無特別限定,較佳爲下述式(3A4 )至式(3A5 )所 表示之基所成群中選出的至少一種之構造。 201041971 [化 17](B-1) (B-2) (B*3> (B-4) (B-5) The polyester of the component (A) is preferably composed of the structural unit represented by the formula (3), and A is a structure of at least one selected from the group consisting of the formulas (3A1) to (3A3), but may contain a structure other than the group represented by the formula (3A1) to the formula (3A3). The structure is not particularly limited, and is preferably a structure selected from at least one of the groups represented by the following formulas (3A4) to (3A5). 201041971 [Chem. 17]

>3C (3A5) (3A4) 上述式中,R8、R9、R1Q各自獨立爲單鍵、羰基、醚 基、磺酸基、碳原子數1至8之飽和烴基或被氟原子取代 之碳原子數1至8的飽和烴基,較佳爲單鍵、羰基、醚基 、磺酸基、碳原子數1至5之飽和烴基或被氟原子取代之 碳原子數1至5的飽和烴基。 R8特佳爲單鍵、羰基、醚基、磺酸基、碳原子數1至 5之飽和烴基或被氟原子取代之碳原子數1至5的飽和烴 基,R9特佳爲醚基、碳原子數1至5之飽和烴基或被氟原 子取代之碳原子數1至5的飽和烴基’ R1(>特佳爲羰基、 醚基、擴酸基、碳原子_數1至5之飽和烴基或被氟原子取 代之碳原子數1至5的飽和烴基。 又h爲0或1。 前述式(3A4 )至(3A5 )之具體例較佳如下述式(al )至(a7 )所示。 [化 18]>3C (3A5) (3A4) In the above formula, R8, R9 and R1Q are each independently a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a carbon atom substituted by a fluorine atom. The saturated hydrocarbon group of 1 to 8 is preferably a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. R8 is particularly preferably a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms substituted by a fluorine atom, and R9 is particularly preferably an ether group or a carbon atom. a saturated hydrocarbon group of 1 to 5 or a saturated hydrocarbon group having 1 to 5 carbon atoms substituted by a fluorine atom '>(> particularly preferably a carbonyl group, an ether group, an acid extension group, a saturated hydrocarbon group having 1 to 5 carbon atoms or The saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom, and h is 0 or 1. Specific examples of the above formulas (3A4) to (3A5) are preferably represented by the following formulas (al) to (a7). 18]

201041971 本發明所使用的(A)成份之聚酯中,上述式(3)所 表示的構造單位中,A較佳爲至少含有60莫耳%以上的前 述式(3A1 )至(3A3 )所表示之基所成群中選出的至少 一種構造單位。 (A)成份之聚酯的重量平均分子量較佳爲000至 30,000,更佳爲1,500至10,000。(A)成份之聚酯的重 量平均分子量未達前述範圍時,傾向會降低配向性及耐溶 0 劑性,超過前述範圍時會降低平坦化性。 <(A)成份之製造方法> 本發明之(A)成份的聚酯可由,例如聚合四羧酸二 酐與二元醇化合物而得。更佳由,使含有下述式所 表示之四羧酸二酐的四羧酸二酐(以下也稱爲酸成份), 與含有下述式(ii)所表示之二元醇化合物的二元醇化合 物(以下也稱爲二元醇成份)反應而得。In the polyester of the component (A) used in the present invention, in the structural unit represented by the above formula (3), A is preferably at least 60 mol% or more expressed by the above formulas (3A1) to (3A3). At least one structural unit selected from the group of bases. The polyester of the component (A) preferably has a weight average molecular weight of from 000 to 30,000, more preferably from 1,500 to 10,000. When the weight average molecular weight of the polyester of the component (A) is less than the above range, the alignment property and the solvent resistance tend to be lowered, and when it exceeds the above range, the planarization property is lowered. <Production Method of (A) Component> The polyester of the component (A) of the present invention can be obtained, for example, by polymerizing a tetracarboxylic dianhydride and a diol compound. More preferably, a tetracarboxylic dianhydride (hereinafter also referred to as an acid component) containing a tetracarboxylic dianhydride represented by the following formula and a binary compound containing a diol compound represented by the following formula (ii) An alcohol compound (hereinafter also referred to as a glycol component) is obtained by reaction.

上述式中’A及B同上述式(3)定義,較佳之形態 也同上述。 前述(A)成份之聚酯中,四羧酸二酐之合計量(酸 成份合計量)與二元醇化合物之合計量(二元醇成份合計 -19- 201041971 量)的添加比,即 <二元醇化合物之合計莫耳數>/<四羧酸 二酐化合物之合計莫耳數 >較佳爲0.5至1.5。同一般聚縮 合反應,該莫耳比近似1時所生成的聚酯之聚合度較大, 可增加分子量。 (A)成份之聚酯爲了避免保存安定性下降,其末端 較佳爲酸酐末端。 上述聚酯之末端會依存於酸成份與二元醇成份之添加 比而改變。例如係以過量之酸成份進行反應時,末端易成 爲酸酐。 又,以過量之二元醇成份進行聚合時,末端易成爲羥 基。此時使該末端羥基與羧酸酐反應,可以酸酐封止末端 羥基。該類羧酸酐如,酞酸酐、偏苯三甲酸酐、馬來酸酐 、萘二甲酸酐、氫化酞酸酐、衣康酸酐、四氫酞酸酐、 1,2-環己烷二羧酸酐、4-甲基_-1,2-環己烷二羧酸酐、4-苯 基-1,2-環己烷二羧酸酐、甲基-5-降莰烯-2,3-二羧酸酐、 四氫酞酸酐、甲基四氫酞酸酐、二環[2.2.2]辛烯-2,3-二羧 酸酐等。 製造上述(A)成份之聚酯時,酸成份與二元醇成份 之反應溫度可由50至200°C,較佳由80至170°C之任意 溫度中選擇。例如反應溫度爲l〇〇°C至140°C,反應時間 爲2至48小時下可得聚酯。 又,以酸酐保護末端羥基時之反應溫度可由50至200 °C,較佳爲80至170 °C之任意溫度中選擇。 上述酸成份與二元醇成份之反應一般係於溶劑中進行 -20- 201041971 。此時所使用之溶劑可爲,不含羥基及胺基與能與酸酐反 應的官能基之物無特別限定。例如,N,N-二甲基甲醯胺、 N,N-二甲基乙醯胺、N-甲基吡咯烷酮、N-乙烯基吡咯烷酮 、N_甲基己內醯胺、二甲基亞颯、四甲基尿素、二甲基碾 、六甲基亞楓、m-甲酚、γ-丁內酯、環己酮、環戊酮、甲 基乙基酮、甲基異丁基酮、2-庚酮、丙二醇單甲基醚乙酸 酯、丙二醇丙基醚乙酸酯、3-甲氧基丙酸甲酯、2-甲氧基 ^ 丙酸甲酯、3-甲氧基丙酸乙酯、2-甲氧基丙酸乙酯、3-乙 氧基丙酸乙酯、2-乙氧基丙酸乙酯等。 此等溶劑可單獨或混合使用,但就安全性、對彩色濾 光片之保護膜劑的管線適用性觀點更佳爲丙二醇單甲基醚 乙酸酯。 另外不析出聚合反應所生成之聚酯的範圍內,上述溶 劑可混合使用不會溶解聚酯之溶劑。 又,上述酸成份(式(i))與二元醇成份(式(ii) Q )反應時可使用觸媒。 聚合聚酯時所使用的觸媒之具體例如,苄基三甲基銨 氯化物、苄基三甲基銨溴化物、苄基三乙基銨氯化物、苄 基三乙基銨溴化物、苄基三丙基銨氯化物、苄基三丙基銨 溴化物、四甲基銨氯化物、四乙基銨溴化物、四丙基銨氯 化物、四丙基銨溴化物等四級銨鹽、四苯基鱗氯化物、四 苯基鐃溴化物、苄基三苯基鳞氯化物、苄基三苯基鱗溴化 物、乙基三苯基鱗氯化物、乙基三苯基辚溴化物等四級辚 -21 - 201041971 由此而得的含有(A)成份之聚酯的溶液可直接使用 於調製熱硬化膜形成用聚酯組成物。又可於水、甲醇、乙 醇、二乙基醚、己烷等弱溶劑中沉澱單離所得的聚酯,再 回收使用。 < (B )成份> 本發明之(B )成份爲交聯劑。交聯劑如環氧化合物 及羥甲基化合物等化合物,但較佳爲具有2個以上環氧基 之環氧化合物。 該化合物如,三(2,3-環氧丙基)三聚異氰酸酯、 1,4-丁二醇二縮水甘油醚、1,2-環氧基- 4-(環氧乙基)環 己烷、甘油三縮水甘油醚、二乙二醇二縮水甘油醚、2,6-二縮水甘油基苯基縮水甘油醚、1,1,3-三[p-(2,3-環氧丙 氧基)苯基]丙烷、I,2-環己烷二羧酸二縮水甘油酯、4,4’-伸甲基雙(N,N-二縮水甘油基苯胺)、3,4-環氧環己基甲 基-3,4-環氧環己烷羧酸酯、三羥甲基乙烷三縮水甘油醚、 雙酚A-二縮水甘油醚、及季戊四醇基聚縮水甘油醚等。 又,就易取得性觀點可使用市售之化合物。下面爲其 具體例(商品名),但不限定於此等。YH-434、YH434L (東都化成(股)製)等具有胺基之環氧樹脂;耶波里特 GT-401、GT-403、GT-301、GT-3 02、歇洛吉 202 1、歇洛 吉3000、歇洛吉P-2021 (泰歇爾化學工業(股)製)等具有 環己烯氧化物構造之環氧樹脂;耶皮可特1 〇 〇 1、1 〇 0 2、 10〇3、1004、1007、1009' 1010、828 (以上爲油化殼環 -22- 201041971 氧(股)(現爲日本環氧樹脂(股))製)等雙酚A型環氧樹 脂;耶皮可特807 (油化殼環氧(股)(現爲日本環氧樹脂( 股))製)等雙酚F型環氧樹脂;耶皮可特152、154 (以 上爲油化殻環氧(股)(現爲日本環氧樹脂(股))製)、 EPPN 201、202 (以上爲日本化藥(股)製)等苯酚酚醛清 漆型環氧樹脂;EOCN-102、EOCN-103S、EOCN-104S、 EOCN-1020、EOCN-1025、EOCN-1027 (以上爲日本化藥( 0 股)製)、耶皮可特I8OS75 (油化殻環氧(股)(現爲日本 環氧樹脂(股))製)等甲酚酚醛清漆型環氧樹脂;丹那可 爾 EX-252 (那凱歇(股)製)、CY 175、CY 177、CY 179 、艾拉爾 CY-182、CY-192、CY-184 (以上爲 CIBA-GEIGY、A.G製)、耶皮庫隆200、400 (以上爲DIC (股) 製)、耶皮可特871、8 72 (油化殼環氧(股)(現爲日本環 氧樹脂(股)製)、ED-5661、ED-5662 (以上爲歇拉尼(股) 製)等脂環式環氧樹脂;丹那可爾EX-611、EX-612、EX-❹ 614、EX-622、EX-41 1、EX-5 12、EX-522、EX-421、EX- 3 13、EX-3 14、EX-321 (那凱歇(股)製)等脂肪族聚縮水 甘油醚等。 又,可使用至少具有2個環氧基之化合物的具有環氧 基之聚合物。該類聚合物可爲具有環氧基之物無特別限制 使用。 上述具有環氧基之聚合物例如可由,使用具有環氧基 之加聚性單體的加聚反應製造。例如,聚縮水甘油基丙烯 酸酯、縮水甘油基甲基丙烯酸酯與乙基甲基丙烯酸酯之共 -23- 201041971 聚物、縮水甘油基甲基丙烯酸酯與苯乙烯與2-羥基乙基甲 基丙烯酸酯之共聚物等的加聚聚合物’及環氧酚醛清漆等 縮聚聚合物。 又,上述具有環氧基之聚合物可由,具有羥基之高分 子化合物與環氧氯丙烷、縮水甘油基對甲苯磺酸酯等具有 環氧基之化合物反應而得。 該類聚合物之重量平均分子量例如300至200,000。 此等具有2個以上環氧基之環氧化合物可單獨或2種 以上組合使用。 本發明之熱硬化膜形成用聚酯組成物中,(B )成份 之交聯劑的含量相對於(A)成份之聚酯100質量份較佳 爲3至50質量份,更佳爲5至40質量份,特佳爲10至 3 0質量份。該比率太小時會降低由熱硬化膜形成用聚酯組 成物而得之硬化膜的耐溶劑性及耐熱性,又太大時會降低 耐溶劑性及保存安定性。 < (C )成份> (C)成份爲下述式(1)所表示之二酯化合物。本發 明中(C)成份之二酯化合物可僅使用一種或使用複數種 式(1 )所表示之化合物。In the above formula, 'A and B are the same as defined in the above formula (3), and preferred embodiments are also the same as described above. In the polyester of the above (A) component, the total ratio of the tetracarboxylic dianhydride (the total amount of the acid component) to the total amount of the diol compound (the total amount of the diol component is -19 - 201041971), that is, < The total number of moles of the diol compound >/<the total number of moles of the tetracarboxylic dianhydride compound> is preferably from 0.5 to 1.5. In the case of the general polycondensation reaction, the degree of polymerization of the polyester formed when the molar ratio is approximately 1 is large, and the molecular weight can be increased. The polyester of the component (A) is preferably an acid anhydride terminal in order to avoid a decrease in storage stability. The end of the above polyester varies depending on the ratio of addition of the acid component to the glycol component. For example, when the reaction is carried out with an excess of an acid component, the terminal is liable to be an acid anhydride. Further, when the polymerization is carried out in an excess amount of the glycol component, the terminal tends to become a hydroxyl group. At this time, the terminal hydroxyl group is reacted with a carboxylic anhydride, and the terminal hydroxyl group can be blocked with an acid anhydride. Such carboxylic anhydrides such as phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, itaconic anhydride, tetrahydrophthalic anhydride, 1,2-cyclohexanedicarboxylic anhydride, 4-methyl Base-1,2-cyclohexanedicarboxylic anhydride, 4-phenyl-1,2-cyclohexanedicarboxylic anhydride, methyl-5-norbornene-2,3-dicarboxylic anhydride, tetrahydroanthracene Anhydride, methyltetrahydrophthalic anhydride, bicyclo[2.2.2]octene-2,3-dicarboxylic anhydride, and the like. When the polyester of the above (A) component is produced, the reaction temperature of the acid component and the glycol component may be selected from any temperature of 50 to 200 ° C, preferably 80 to 170 ° C. For example, the reaction temperature is from 10 ° C to 140 ° C, and the reaction time is from 2 to 48 hours to obtain a polyester. Further, the reaction temperature at the time of protecting the terminal hydroxyl group with an acid anhydride may be selected from any temperature of 50 to 200 ° C, preferably 80 to 170 ° C. The reaction of the above acid component with the glycol component is generally carried out in a solvent -20-201041971. The solvent to be used at this time may be one which does not contain a hydroxyl group and an amine group and a functional group which can react with an acid anhydride, and is not particularly limited. For example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, N-vinylpyrrolidone, N-methylcaprolactam, dimethylammonium , tetramethyl urea, dimethyl mill, hexamethyl sulfoxide, m-cresol, γ-butyrolactone, cyclohexanone, cyclopentanone, methyl ethyl ketone, methyl isobutyl ketone, 2 -heptanone, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate, methyl 2-methoxypropionate, 3-methoxypropionic acid Ester, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. These solvents may be used singly or in combination, but propylene glycol monomethyl ether acetate is more preferable in terms of safety and pipeline suitability for a protective film of a color filter. Further, in the range in which the polyester formed by the polymerization reaction is not precipitated, the solvent may be used in combination with a solvent which does not dissolve the polyester. Further, a catalyst may be used in the reaction of the above acid component (formula (i)) with a glycol component (formula (ii) Q). Specific examples of the catalyst used in polymerizing the polyester are, for example, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltriethylammonium chloride, benzyltriethylammonium bromide, benzylidene. a quaternary ammonium salt such as tripropylammonium chloride, benzyltripropylammonium bromide, tetramethylammonium chloride, tetraethylammonium bromide, tetrapropylammonium chloride or tetrapropylammonium bromide, Tetraphenyl squaride chloride, tetraphenyl sulfonium bromide, benzyl triphenyl squaride chloride, benzyl triphenyl squarate bromide, ethyl triphenyl squaride chloride, ethyl triphenyl sulfonium bromide, etc. Quaternary 辚-21 - 201041971 The thus obtained solution containing the polyester of the component (A) can be used as it is for preparing a polyester composition for forming a thermosetting film. Further, the obtained polyester can be precipitated in a weak solvent such as water, methanol, ethanol, diethyl ether or hexane, and recycled. <(B) Component> The component (B) of the present invention is a crosslinking agent. The crosslinking agent is a compound such as an epoxy compound or a methylol compound, but is preferably an epoxy compound having two or more epoxy groups. The compound is, for example, tris(2,3-epoxypropyl)trimeric isocyanate, 1,4-butanediol diglycidyl ether, 1,2-epoxy-4-(epoxyethyl)cyclohexane , glycerol triglycidyl ether, diethylene glycol diglycidyl ether, 2,6-diglycidylphenyl glycidyl ether, 1,1,3-tris[p-(2,3-epoxypropoxy Phenyl]propane, 1,2-cyclohexanedicarboxylic acid diglycidyl ester, 4,4'-methyl bis(N,N-diglycidyl aniline), 3,4-epoxycyclohexyl Methyl-3,4-epoxycyclohexanecarboxylate, trimethylolethane triglycidyl ether, bisphenol A-diglycidyl ether, and pentaerythritol-based polyglycidyl ether. Further, commercially available compounds can be used from the viewpoint of availability. The following is a specific example (trade name), but it is not limited thereto. YH-434, YH434L (Dongdu Chemical Co., Ltd.) and other amine-based epoxy resins; Yepperit GT-401, GT-403, GT-301, GT-3 02, Shiroji 202 1 Epoxy resin with cyclohexene oxide structure, such as Luoji 3000 and Shiluoji P-2021 (made by Taischer Chemical Industry Co., Ltd.); Jupiter 1 11, 1 〇0 2, 10〇 3, 1004, 1007, 1009' 1010, 828 (above is oily shell ring-22- 201041971 oxygen (stock) (now Japan epoxy resin (share))) and other bisphenol A epoxy resin; Kete 807 (oily shell epoxy (stock) (now manufactured by Japan Epoxy Resin Co.)) and other bisphenol F type epoxy resin; yuppiet 152, 154 (above is oily shell epoxy ( Phenolic novolac type epoxy resin such as epoxide phenolic varnish type epoxy resin; EOCN-102, EOCN-103S, EOCN- 104S, EOCN-1020, EOCN-1025, EOCN-1027 (The above is made by Nippon Kayaku (0 shares)), Yippitol I8OS75 (oiled shell epoxy (shares) (now Japanese epoxy resin) Creatin phenol Varnish-type epoxy resin; Danakol EX-252 (Nachet), CY 175, CY 177, CY 179, Airlar CY-182, CY-192, CY-184 (above CIBA- GEIGY, AG), Yepikulung 200, 400 (above DIC (share) system), Yippitol 871, 8 72 (oiled shell epoxy (share) (now Japanese epoxy resin) , ED-5661, ED-5662 (above), alicyclic epoxy resin; Danakol EX-611, EX-612, EX-❹ 614, EX-622, EX -41 1. Aliphatic polyglycidyl ethers such as EX-5 12, EX-522, EX-421, EX-3, EX-3 14, and EX-321 (made by Kaiser). A polymer having an epoxy group having at least a compound having at least 2 epoxy groups may be used. The polymer having such an epoxy group may be used without particular limitation. The above epoxy group-containing polymer may, for example, be used, A polyaddition reaction of an epoxy group-addition monomer, for example, poly-glycidyl acrylate, glycidyl methacrylate and ethyl methacrylate, -23-201041971 polymer, glycidyl group A a polyaddition polymer such as a copolymer of acrylate and a copolymer of styrene and 2-hydroxyethyl methacrylate, and a polycondensation polymer such as an epoxy novolac. Further, the above epoxy group-containing polymer may have a hydroxyl group. The polymer compound is obtained by reacting a compound having an epoxy group such as epichlorohydrin or glycidyl p-toluenesulfonate. The weight average molecular weight of such polymers is, for example, from 300 to 200,000. These epoxy compounds having two or more epoxy groups may be used singly or in combination of two or more kinds. In the polyester composition for forming a thermosetting film of the present invention, the content of the crosslinking agent of the component (B) is preferably from 3 to 50 parts by mass, more preferably from 5 to 50 parts by mass per 100 parts by mass of the polyester of the component (A). 40 parts by mass, particularly preferably 10 to 30 parts by mass. When the ratio is too small, the solvent resistance and heat resistance of the cured film obtained from the polyester composition for forming a thermosetting film are lowered, and when it is too large, solvent resistance and storage stability are lowered. <(C) Component> The component (C) is a diester compound represented by the following formula (1). The diester compound of the component (C) in the present invention may be used alone or in a plurality of compounds represented by the formula (1).

[化 20] HOOC,Q 丫〇、P〆0丫 Q、COOH R. Ο ο(1) -24- (2) 201041971 式中,p爲脂環式基、脂環式基及脂肪族基所形成之 基或式(2)所表示之構造,Q爲脂環式基或脂環式基及 脂肪族基所形成之基,P及Q可各自爲’其中任意的氫原 子被脂肪族基取代。 又式(2)中,R爲伸院基,R較佳爲碳原子數1至6 之伸烷基,更佳爲碳原子數1至5之伸烷基,特佳爲碳原 ^ 子數1至3之伸烷基。 上述式中,P之較佳構造如上述式(2)或下述式( 1 P 1 )所表示。 [化 21] __R12_p1^.R11.p1^_R13_ (1P1) 式中,P1爲環狀飽和烴基’較佳爲碳原子數4至8之 ^ 環狀飽和烴基,更佳爲碳原子數4至6之環狀飽和烴基。HOOC, Q 丫〇, P〆0丫Q, COOH R. Ο ο(1) -24- (2) 201041971 where p is an alicyclic group, an alicyclic group, and an aliphatic group. a group formed by the formula or the formula (2), Q is a group formed by an alicyclic group or an alicyclic group and an aliphatic group, and each of P and Q may be 'in which any hydrogen atom is replaced by an aliphatic group . Further, in the formula (2), R is a stretching group, and R is preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 5 carbon atoms, particularly preferably a carbon number. An alkyl group of 1 to 3. In the above formula, a preferred structure of P is represented by the above formula (2) or the following formula (1 P 1 ). __R12_p1^.R11.p1^_R13_ (1P1) wherein P1 is a cyclic saturated hydrocarbon group, preferably a cyclic saturated hydrocarbon group having 4 to 8 carbon atoms, more preferably 4 to 6 carbon atoms. A cyclic saturated hydrocarbon group.

U 基P1中之任意氫原子可各自獨立被脂肪族基取代。 該取代基之脂肪族基較佳爲碳原子數1至5之脂肪族 基,更佳爲碳原子數1至3之脂肪族基。 上述式中,R11爲單鍵、羰基、醚基、磺酸基、碳原 子數1至8之飽和烴基或被氟原子取代之碳原子數1至8 的飽和烴基,較佳爲單鍵、羰基、醚基 '磺酸基、碳原子 數1至5之飽和烴基或被氟原子取代之碳原子數1至5的 飽和烴基。 -25- 201041971 R12、R13各自獨立爲單鍵或碳原子數1至5之伸院基 ,較佳爲單鍵、碳原子數1至3之伸烷基。 又h爲0或1。 上述式(1)之p的具體例較佳如下述式(P — 1)至( P-5 )所示。 [化 22]Any of the hydrogen atoms in the U group P1 may be independently substituted with an aliphatic group. The aliphatic group of the substituent is preferably an aliphatic group having 1 to 5 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. In the above formula, R11 is a single bond, a carbonyl group, an ether group, a sulfonic acid group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms which is substituted by a fluorine atom, preferably a single bond or a carbonyl group. And an ether group 'sulfonic acid group, a saturated hydrocarbon group having 1 to 5 carbon atoms or a saturated hydrocarbon group having 1 to 5 carbon atoms which is substituted by a fluorine atom. -25- 201041971 R12 and R13 are each independently a single bond or a pendant group having 1 to 5 carbon atoms, preferably a single bond and an alkylene group having 1 to 3 carbon atoms. Again h is 0 or 1. Specific examples of p of the above formula (1) are preferably represented by the following formulae (P-1) to (P-5). [化22]

(P-3)(P-3)

上述式(2)中,Q爲脂環式基或脂環式基及脂肪族 基所形成之基,較佳爲下述式(1Q1)所表示之基。 [化 23] —Q1—X— (1Q1 ) 式中,Q1爲碳原子數4至8之環伸烷基或環伸鏈烯基 ,較佳爲碳原子數4至6之環伸烷基或環伸鏈烯基。基 Q1中之任意氫原子可被脂肪族基取代。 該取代基爲脂肪族基,較佳爲碳原子數1至6之脂肪 族基,更佳爲碳原子數1至3之脂肪族基。 又X爲單鍵或碳原子數1至3之伸烷基。 Q之具體例較佳如,環丁烷基、甲基環丁烷基、二甲 -26- 201041971 基環丁烷基、環戊基、環伸己基、甲基環伸己基、四氫酞 醯基或甲基四氫酞醯基等。 本發明之(C)成份的二酯化合物可由,下述式(iii )所表示之二元醇1莫耳與式(iv)所表示之二羧酸酐 I·7至2莫耳’較佳爲1.8至2莫耳反應而得。 [化 24] 0 :〇Η ψ ⑻、〆、 〇 (2) 上述式(iii )及式(iv )中,P爲脂環式基、脂環式 基及脂肪族基所形成之基或式(2)所表示之構造,q爲 脂環式基或脂環式基及脂肪族基所形成之基,式中 ’R爲伸烷基。又P、Q及R同上述式(1)及式(2)之 定義,較佳之形態也同上述。 〇 本發明之上述式(iii)所表示的二元醇化合物及式( iv)所表示的二羧酸酐可各自僅使用一種,或使用複數種 上述式(iii )所表示的二元醇化合物之具體例如,氫 化雙酚A、4,4’-二環己醇、丨,4_環己二醇、丨,3_環己二醇 、1,4-環己烷二甲醇、1,3_環己烷二甲醇、p_二甲苯二醇 、m-二甲苯二醇等。 (C)成份可爲下述式(i_a)所表示的多價酯化合物 。本發明中該多價酯化合物可僅使用一種式(l_a)所表 -27- 201041971 示之化合物,或使用複數種。 [化 25] HOOC^V〇X Pa VQaXC〇〇H| -Ra^Ra^ (1-a) (2-a) 式中’ Pa爲可被氧原子或氮原子中斷之脂環式基或脂 肪族烴基’或式(2-a)所表示之構造,Qa爲脂環式基,t 爲1至5之整數,Pa及(^可各自爲,基中的任意氫原子 被脂肪族基取代。又式(2-a)中,Ra爲伸烷基,Ra較佳 爲碳原子數1至6之伸烷基,更佳爲碳原子數1至5之伸 烷基,特佳爲碳原子數1至3之伸烷基。 前述多價酯化合物可由,下述式(iii-a )所表示之二 元醇與式(iv-a)所表示之二羧酸酐反應而得。 [化 26] 0 HO-Pa-f OH )t Qa^O (iv-a) (Hi-a) y - Ri0{R 扣 (2-a) 上述式及式(iv_a)中’ Pa爲可被氧原子或 氮原子中斷之脂環式基或脂肪族院基’或式(2-a)所表 示之構造’ t爲1至5之整數’ Qa爲脂環式基’式(2-a) 中,113爲伸烷基。又。、匕及1同上述式(1-a)及式 (2-a)之定義,較佳之形態也同上述。 -28- 201041971 本發明中上述式(iii-a)所表示之多價醇化合物及式 (iv-a )所表示之二羧酸酐可各自僅使用一種,或使用複 數種。 上述式(iii-a)所表示的多價醇化合物如,1,3,5-環 己三醇及季戊四醇等化合物。 上述式(iii-a )所表示的多價醇化合物之具體例如下 所示。In the above formula (2), Q is a group formed by an alicyclic group or an alicyclic group and an aliphatic group, and is preferably a group represented by the following formula (1Q1). — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — — Ring-chain alkenyl. Any hydrogen atom in the group Q1 may be substituted with an aliphatic group. The substituent is an aliphatic group, preferably an aliphatic group having 1 to 6 carbon atoms, more preferably an aliphatic group having 1 to 3 carbon atoms. Further, X is a single bond or an alkylene group having 1 to 3 carbon atoms. Specific examples of Q are preferably, for example, cyclobutane, methylcyclobutane, dimethyl-26-201041971 cyclobutane, cyclopentyl, cyclohexyl, methylcyclohexyl, tetrahydroanthracene Or a methyltetrahydroindenyl group or the like. The diester compound of the component (C) of the present invention may preferably be a diol 1 mole represented by the following formula (iii) and a dicarboxylic anhydride I·7 to 2 mole represented by the formula (iv). 1.8 to 2 moles of reaction. [Chem. 24] 0 : 〇Η ψ (8), 〆, 〇 (2) In the above formula (iii) and formula (iv), P is a group or formula formed by an alicyclic group, an alicyclic group, and an aliphatic group. (2) The structure represented, q is a group formed by an alicyclic group or an alicyclic group and an aliphatic group, wherein 'R is an alkylene group. Further, P, Q and R are the same as defined in the above formulas (1) and (2), and preferred embodiments are also the same as described above. The diol compound represented by the above formula (iii) and the dicarboxylic acid anhydride represented by the formula (iv) of the present invention may each be used alone or in combination with a plurality of diol compounds represented by the above formula (iii). Specifically, for example, hydrogenated bisphenol A, 4,4'-dicyclohexanol, hydrazine, 4_cyclohexanediol, hydrazine, 3_cyclohexanediol, 1,4-cyclohexanedimethanol, 1,3_ Cyclohexanedimethanol, p-xylene glycol, m-xylene glycol, and the like. The component (C) may be a polyvalent ester compound represented by the following formula (i-a). In the present invention, the polyvalent ester compound may be used alone or in a plurality of compounds represented by the formula (e-a) in the range of -27 to 201041971. HOOC^V〇X Pa VQaXC〇〇H| -Ra^Ra^ (1-a) (2-a) where 'Pa is an alicyclic group or a fat which can be interrupted by an oxygen atom or a nitrogen atom A hydrocarbon group or a structure represented by the formula (2-a), Qa is an alicyclic group, t is an integer of 1 to 5, and Pa and (^ may each be an arbitrary hydrogen atom in the group substituted by an aliphatic group. Further, in the formula (2-a), Ra is an alkylene group, and Ra is preferably an alkylene group having 1 to 6 carbon atoms, more preferably an alkylene group having 1 to 5 carbon atoms, particularly preferably a carbon atom number. The above-mentioned polyvalent ester compound can be obtained by reacting a diol represented by the following formula (iii-a) with a dicarboxylic acid anhydride represented by the formula (iv-a). 0 HO-Pa-f OH )t Qa^O (iv-a) (Hi-a) y - Ri0{R Buckle (2-a) In the above formula and formula (iv_a), 'Pa is an oxygen atom or nitrogen The atomic interrupted alicyclic group or the aliphatic steroid group or the structure represented by the formula (2-a) is an integer from 1 to 5' Qa is an alicyclic group 'in the formula (2-a), 113 is Alkyl. also. And 匕 and 1 are the same as defined in the above formula (1-a) and formula (2-a), and the preferred embodiment is also the same as above. -28-201041971 In the present invention, the polyvalent alcohol compound represented by the above formula (iii-a) and the dicarboxylic acid anhydride represented by the formula (iv-a) may be used singly or in plural. The polyvalent alcohol compound represented by the above formula (iii-a) is a compound such as 1,3,5-cyclohexanetriol or pentaerythritol. Specific examples of the polyvalent alcohol compound represented by the above formula (iii-a) are shown below.

[化 27][化27]

上述式(iv )所表示的二羧酸酐之具體例如,1,2-環 己烷二羧酸酐、4-甲基-1,2-環己烷二羧酸酐、四氫酞酸酐 -29 - 201041971 、甲基四氫酞酸酐、六氫酞酸酐等。 製造上述(C)成份之二酯化合物(或多價酯化合物 )時,二元醇化合物(或多價醇化合物)與二羧酸酐之反 應溫度可由50至200°c,較佳由80至l7〇°C之任意溫度 中選擇。例如反應溫度爲1〇〇 °C至140 °C,反應時間爲2 至48小時下可得二醋化合物(或多價酯化合物)。 上述二元醇化合物(或多價醇化合物)與二羧酸酐之 反應一般係於溶劑中進行。此時所使用的溶劑可爲不含羥 # % I f 基及胺基等能與酸酐反應的官能基之物無特別限定。例如 ,N,N-二甲基甲醯胺、N,N-二甲基乙醯胺、N-甲基吡略烷 酮、N-乙烯基吡咯烷酮、N-甲基己內醯胺、二甲基亞颯、 四甲基尿素、二甲基颯、六甲基亞颯、m -甲酚、γ-丁內酯 、環己酮、環庚酮、甲基乙基酮、甲基異丁基酮、2-庚酮 、丙二醇單甲基醚乙酸酯、丙二醇丙基醚乙酸酯、3 -甲氧 基丙酸甲酯、2-甲氧基丙酸甲酯、3-甲氧基丙酸乙酯、2_ 甲氧基丙酸乙酯、3-乙氧基丙酸乙酯、2-乙氧基丙酸乙酯 〇 等。 此等溶劑可單獨或混合使用,但就安全性、對彩色濾 光片之保護膜劑的管線適用性觀點更佳爲丙二醇單甲基酸 乙酸酯。 另外不會析出聚合反應所生成之二酯化合物的範圍內 ,上述溶劑可混合使用不溶解二酯化合物之溶劑。 又,上述二元醇化合物(式(iii ))(或多價醇化合 物(iii-a))與二竣酸酐(式(iv)或式(iv-a)反應時 -30- 201041971 可使用觸媒。 此時所使用的觸媒之具體例如,苄基三甲基銨氯化物 、苄基三甲基銨溴化物、苄基三乙基銨氯化物、苄基三乙 基銨溴化物、苄基三丙基銨氯化物'苄基三丙基銨溴化物 、四甲基銨氯化物、四乙基銨溴化物、四丙基銨氯化物、 四丙基銨溴化物等四級銨鹽、四苯基鱗氯化物、四苯基鱗 溴化物、苄基三苯基辚氯化物、苄基三苯基鱗溴化物、乙 0 基三苯基鱗氯化物、乙基三苯基鐄溴化物等四級鱗鹽。 本發明之熱硬化膜形成用聚酯組成物中,(C)成份 之含量相對於(A)成份之聚酯100質量份較佳爲1至 1 〇〇質量份,更佳爲5至60質量份。該比率太小時會降低 由熱硬化膜形成用聚酯組成物而得之硬化膜的配向性及平 坦化性,又太大時會降低透光率。 < (D )成份> Q 本發明可含有(D )成份之防氧化劑。該(D )成份 可有效防止本發明於形成熱硬化膜後過程中因設定的高溫 焙燒而使膜變色。 (D )成份之防氧化劑特佳爲苯酚化合物,其具體例 如 ’ 2,6-二-t-丁基-4-甲酚、2,6-二-t-丁基-苯酚、2,4,6-三 (3’,5’-二-t-丁基-4’-羥基苄基)采、季戊四醇四[3-( 3’,5’-二-t-丁基-4’-羥基苯基)丙酸酯]、丙酮雙(3,5-二-t-丁基-4-羥基苯基)縮硫醇、4,4’-伸甲基雙(2,6-二-t-丁 基苯酚)、3- (3,5-二-t-丁基-4-羥基苯基)丙酸甲酯、 -31 - 201041971 4,4’-硫—(2,6-二-t-丁 基苯酚)、三(3,5、二-t-丁基-4-羥 基苄基)三聚異氰酸、雙(3,5_二_t_ 丁基-4_羥基苄基)硫 化物等。 此等防氧化劑之苯醋化合物非特別限定爲上述之物。 又此等可單獨或2種以上之成份倂用。 此等防氧化劑中又以2,6-二-t-丁基-4-甲酚、2,4,6-三 (3’,5’-二-t-丁基- 4’-羥基苄基)来、4,4,-伸甲基雙(2,6-二-t-丁基苯酚)等不會降低配向性且耐熱性較高而特佳。 本發明中(D)成份之防氧化劑的苯酚化合物,相對 於(A)成份之聚酯1〇〇質量份的使用率較佳爲〇.〇1至5 質量份’更佳爲0.1至3質量份。該比率太小時將無法得 到充分的防氧化劑用之效果,又太大時會降低配向性及使 塗膜粗糙。 < (E )成份> 本發明可含有(E )成份用之矽烷偶合劑。 (E)成份之砂院偶合劑可有效提升與由聚合性液晶 形成之相位差材料的密合性。 該類矽烷偶合劑之具體例如’三甲基氯矽烷' 二甲基 乙烯基氯矽院、甲基二苯基氯矽烷、氯甲基二甲基砂院等 氯矽烷類;三甲基甲氧基矽烷、二甲基二乙氧基砂院、甲 基三甲氧基矽烷、二甲基乙烯基乙氧基矽烷、二苯基二甲 氧基矽烷、苯基三乙氧基矽垸等烷氧基矽烷類;六甲基二 矽氮烷、N,N,-雙(三甲基砂烷基)脲 '二甲基三甲基砂 -32- 201041971 烷基胺、三甲基矽烷基咪唑等矽氮烷類;乙烯基 、γ-胺基丙基三乙氧基矽烷、γ-甲基丙烯氧基丙 基矽烷、γ-甲基丙烯氧基丙基三乙氧基矽烷、γ-基丙基三乙氧基矽烷、γ-(Ν-哌啶基)丙基三乙 等矽烷類;苯并三唑、苯并咪唑、吲唑、咪唑、 并咪唑、2 -锍基苯并噻唑、2 -巯基苯并噁唑、尿 嘧啶、锍基咪唑、锍基嘧啶等雜環狀化合物,及 0 基脲、1,3-二甲基脲等尿素或尿素化合物,此等 劑可使用1種或2種以上組合使用》 此等矽烷偶合劑中就與相位差材料之密合力 定性觀點特佳爲γ-甲基丙烯氧基丙基三乙氧基矽 上述矽烷偶合劑可使用例如信越化學工業 MOMENTIVE製及東麗(股)製等市售之化合物, 售品易取得。 此等矽烷偶合劑之添加量相對於(A )成份;^ Q 量份一般爲0.5至30質量份,較佳爲0.8至20 使用20質量份以上時會降低塗膜之耐溶劑性,5 質量份時將無法得到充分的矽烷偶合劑效果。 < (F )成份> 本發明可含有(F)成份用之雙馬來醯亞胺 (F)成份之雙馬來醯亞胺化合物可有效進一步 化性’例如下述式(4 )所表示之化合物。此等 胺化合物非特別限定於上述之物。此等可單獨或 三氯矽烷 基三甲氧 環氧丙氧 氧基矽烷 2-锍基苯 唑、硫尿 1,1-二甲 矽烷偶合 、保存安 烷。 (股)製、 且此等市 匕1 〇〇質 質量份。 L未達0.5 化合物。 提升平坦 馬來酿亞 2種以上 -33- 201041971 之成份倂用。 [化 28]Specific examples of the dicarboxylic acid anhydride represented by the above formula (iv) are, for example, 1,2-cyclohexanedicarboxylic anhydride, 4-methyl-1,2-cyclohexanedicarboxylic anhydride, tetrahydrophthalic anhydride -29 - 201041971 , methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride, and the like. When the diester compound (or polyvalent ester compound) of the above component (C) is produced, the reaction temperature of the diol compound (or polyvalent alcohol compound) with the dicarboxylic anhydride may be from 50 to 200 ° C, preferably from 80 to 17. Choose from any temperature of 〇 °C. For example, the reaction temperature is from 1 ° C to 140 ° C, and the reaction time is from 2 to 48 hours to obtain a diacetate compound (or a polyvalent ester compound). The reaction of the above diol compound (or polyvalent alcohol compound) with a dicarboxylic acid anhydride is generally carried out in a solvent. The solvent to be used at this time is not particularly limited as long as it does not contain a functional group capable of reacting with an acid anhydride such as a hydroxyl group #% I f group or an amine group. For example, N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, N-vinylpyrrolidone, N-methylcaprolactam, dimethyl Kea, tetramethyl urea, dimethyl hydrazine, hexamethyl hydrazine, m-cresol, γ-butyrolactone, cyclohexanone, cycloheptanone, methyl ethyl ketone, methyl isobutyl Ketone, 2-heptanone, propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, methyl 3-methoxypropionate, methyl 2-methoxypropionate, 3-methoxypropane Ethyl acetate, ethyl 2-methoxypropionate, ethyl 3-ethoxypropionate, ethyl 2-ethoxypropionate, and the like. These solvents may be used singly or in combination, but propylene glycol monomethyl acetate is more preferable in view of safety and suitability for the line of the protective film of the color filter. Further, in the range in which the diester compound produced by the polymerization reaction is not precipitated, a solvent which does not dissolve the diester compound may be used in combination with the above solvent. Further, the above diol compound (formula (iii)) (or polyvalent alcohol compound (iii-a)) can be used in combination with diacetic anhydride (formula (iv) or formula (iv-a) -30-201041971 Specific examples of the catalyst used at this time are, for example, benzyltrimethylammonium chloride, benzyltrimethylammonium bromide, benzyltriethylammonium chloride, benzyltriethylammonium bromide, benzylidene. a quaternary ammonium salt such as tripropylammonium chloride, benzyltripropylammonium bromide, tetramethylammonium chloride, tetraethylammonium bromide, tetrapropylammonium chloride, tetrapropylammonium bromide, Tetraphenyl squaride chloride, tetraphenyl sulphate bromide, benzyl triphenyl sulfonium chloride, benzyl triphenyl squarate bromide, octyltriphenyl sulphate, ethyl triphenyl sulfonium bromide In the polyester composition for forming a thermosetting film of the present invention, the content of the component (C) is preferably from 1 to 1 part by mass based on 100 parts by mass of the polyester of the component (A). It is preferably from 5 to 60 parts by mass. When the ratio is too small, the alignment and flatness of the cured film obtained from the polyester composition for forming a thermosetting film are lowered, and when it is too large, it is lowered. Light transmittance. (D) Component> Q The present invention may contain an antioxidant of the component (D). The component (D) is effective for preventing the high temperature baking of the present invention in the process of forming a thermosetting film. The film is discolored. The antioxidant of the component (D) is particularly preferably a phenol compound, and specifically, for example, '2,6-di-t-butyl-4-methylphenol, 2,6-di-t-butyl-phenol, 2 , 4,6-tris(3',5'-di-t-butyl-4'-hydroxybenzyl), pentaerythritol tetra[3-( 3',5'-di-t-butyl-4' -hydroxyphenyl)propionate], acetone bis(3,5-di-t-butyl-4-hydroxyphenyl)thiol, 4,4'-extended methyl bis(2,6-di- T-butylphenol), methyl 3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, -31 - 201041971 4,4'-sulfur-(2,6-di- T-butylphenol), tris(3,5,di-t-butyl-4-hydroxybenzyl)trimeric isocyanate, bis(3,5-di-t-butyl-4-hydroxybenzyl) Sulfide, etc. The benzene vinegar compound of these antioxidants is not particularly limited to the above. These may be used alone or in combination of two or more. These antioxidants are also 2,6-di-t-butyl. 4--4-cresol, 2,4,6-three (3' , 5'-di-t-butyl-4'-hydroxybenzyl), 4,4,-extended methylbis(2,6-di-t-butylphenol), etc. do not degrade the orientation and are heat resistant The phenol compound of the antioxidant of the component (D) in the present invention is preferably used in an amount of from 1 to 5 parts by mass based on 1 part by mass of the polyester of the component (A). More preferably, it is 0.1 to 3 parts by mass. When the ratio is too small, sufficient effect of the antioxidant is not obtained, and if it is too large, the alignment property is lowered and the coating film is roughened. <(E) Component> The present invention may contain a decane coupling agent for the component (E). The sand chamber coupling agent of the component (E) can effectively improve the adhesion to the phase difference material formed of the polymerizable liquid crystal. Specific examples of the decane coupling agent such as 'trimethylchlorodecane' dimethylvinyl chloride brothel, methyl diphenyl chlorodecane, chloromethyl dimethyl sand or the like; chloro silanes; trimethyl methoxy Alkoxylates such as decane, dimethyldiethoxylate, methyltrimethoxydecane, dimethylvinylethoxysilane, diphenyldimethoxydecane, phenyltriethoxyhydrazine Base decanes; hexamethyldioxane, N,N,-bis(trimethylsilyl)urea-dimethyltrimethyl sand-32- 201041971 alkylamine, trimethyldecyl imidazole, etc. Indoloxanes; vinyl, γ-aminopropyltriethoxydecane, γ-methylpropoxypropyl decane, γ-methylpropoxypropyltriethoxydecane, γ-propyl a decane such as triethoxy decane or γ-(Ν-piperidinyl)propyltriethyl; benzotriazole, benzimidazole, oxazole, imidazole, imidazole, 2-mercaptobenzothiazole, 2 a heterocyclic compound such as mercaptobenzoxazole, uracil, mercapto imidazole or mercaptopyrimidine, and urea or urea compound such as 0-urea or 1,3-dimethylurea, and one or the like may be used. 2 kinds In combination, the affinity of the decane coupling agent to the phase difference material is preferably γ-methacryloxypropyltriethoxy fluorene. The above decane coupling agent can be used, for example, by Shin-Etsu Chemical Co., Ltd. Commercially available compounds such as the Li (share) system are readily available for sale. The amount of the decane coupling agent added is usually 0.5 to 30 parts by mass, preferably 0.8 to 20 parts by weight of the component (A), and the solvent resistance of the coating film is lowered when used in an amount of 20 parts by mass or more. A sufficient decane coupling agent effect will not be obtained at the time of dispensing. <(F)Component> The bismaleimine compound which can contain the bismaleimide (F) component for the component (F) can be effectively further improved, for example, the following formula (4) Expressed as a compound. These amine compounds are not particularly limited to those described above. These may be mono- or trichlorodecane-trimethoxy-oxypropylene oxy oxane 2-mercaptobenzoxazole, thiourea 1,1-dimethyl decane coupled, and preserved ane. (share) system, and these cities 匕 1 〇〇 quality parts. L does not reach 0.5 compound. Increased flatness More than two types of Malayanyan -33- 201041971 are used. [化 28]

上述式中,Y爲脂肪族基、含有環式構造 及芳香族基所成群中選出的有機基,或此等群 數有機基組合形成的有機基。又γ可含有酯鍵 胺鍵、胺基甲酸乙酯鍵等鍵。 上述式(4 )所表示的馬來醯亞胺化合衫 3.3- 二苯基甲烷雙馬來醯亞胺、N,N’- ( 3,3-二 甲基)-4,4-二苯基-甲烷雙馬來醯亞胺、Ν,Ν’ 甲烷雙馬來醯亞胺、3,3 -二苯基楓雙馬來醯亞 苯基礪馬來醯亞胺、Ν,Ν’-ρ -二苯甲酮雙馬? Ν,Ν’-二苯基乙烷雙馬來醯亞胺、Ν,Ν’-二苯基 亞胺、Ν,Ν’-(伸甲基二-二四氫苯基)雙馬 Ν,Ν,- ( 3-乙基)-4,4-二苯基甲烷雙馬來醯亞0: 3.3- 二甲基)-4,4-二苯基甲烷雙馬來醯亞胺、 二乙基)-4,4-二苯基甲烷雙馬來醯亞胺、Ν,Ν’ )-4,4-二苯基甲烷雙馬來醯亞胺、Ν,Ν’-異佛 醯亞胺、Ν,Ν’-三嗪雙馬來醯亞胺、Ν,Ν’-二苯 來醯亞胺、Ν,Ν’-萘雙馬來醯亞胺、Ν,Ν’-m-伸 醯亞胺、Ν,Ν’-5·甲氧基-1,3-伸苯基雙馬來醯Ϊ 之脂肪族基 中選出之複 、醚鍵、醯 5 如,Ν,Ν’-乙基-5,5-二 -4,4·二苯基 胺、4,4-二 夜醯亞胺、 醚雙馬來醯 來醯亞胺、 安、Ν,Ν’-( Ν,Ν,- ( 3,3--(3,3-二氯 爾嗣雙馬來 基丙烷雙馬 苯基雙馬來 (胺、2,2-雙 -34- 201041971 雙 I 2 2 、 烷 丙 \ly 基 苯 \ly 基 氧 苯 胺 亞 醯 來 馬 氯 烷、 丙烷 } 丙 基 } 苯基 )苯 基 } 氧 苯 胺 亞 醯 來 馬 基 氧 苯 胺 亞 醯 來 馬 A 基 3 乙 C3-雙 C 2-雙 烷烷 丙丙 ) ) 基基 苯苯 ) ) 基基 氧氧 苯苯 胺胺 亞亞 醯醯 來來 馬馬 雙雙 -4基 基丙 丙異In the above formula, Y is an aliphatic group, an organic group selected from a group consisting of a cyclic structure and an aromatic group, or an organic group formed by combining these groups of organic groups. Further, γ may contain a bond such as an ester bond or a urethane bond. Maleic acid imide shirt represented by the above formula (4) 3.3-diphenylmethane bismaleimide, N,N'-(3,3-dimethyl)-4,4-diphenyl - methane bismaleimide, hydrazine, Ν' methane bismaleimide, 3,3-diphenyl maple bismales phenylene fluorene imidazol, hydrazine, Ν'-ρ - Benzophenone double horse? Ν,Ν'-diphenylethane, bismaleimide, hydrazine, Ν'-diphenylimine, hydrazine, Ν'-(methyl bis-ditetrahydrophenyl) bismuth, Ν ,-(3-ethyl)-4,4-diphenylmethane bismaleline 0: 3.3-dimethyl)-4,4-diphenylmethane bismaleimide, diethyl) -4,4-diphenylmethane bismaleimide, hydrazine, Ν')-4,4-diphenylmethane bismaleimide, hydrazine, Ν'-isophorbium imine, hydrazine, Ν'-Triazine bismaleimide, hydrazine, Ν'-diphenyl quinone imine, hydrazine, Ν'-naphthalene bismaleimide, hydrazine, Ν'-m-extension imine, hydrazine , Ν'-5. methoxy-1,3-phenylphenyl bismales selected from the aliphatic group, the ether bond, 醯5, Ν, Ν '-ethyl-5, 5- Bis-4,4·diphenylamine, 4,4-dimethyleneimine, ether, bismaleimide, anthracene, anthracene, Ν'-( Ν,Ν,- ( 3,3-- (3,3-Dichloro-indenyl-bi-maleylpropane-bis-p-phenyl-p-male (amine, 2,2-bis-34- 201041971 double I 2 2 , alkane-propyl phenyl) lysyloxyaniline马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马 马Aniline, oxime, horse A, A, 3, B, C, bis, C, bis, bis, s, s, s, s, s, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y, y

Q 、、 烷 院烷丙 丙丙} &gt; &gt;基 基基苯 苯苯U &gt; }基 基基氧 氧氧苯 苯苯胺 胺胺亞 亞亞釀 醯醯來 來來-M 馬馬 4 ' - ( 4 4 -c C-4 4-4-基 雙 雙 雙 基 氧 甲 烷烷、 乙乙烷 乙 基基 } 苯苯基 } &gt; 苯 基基 &gt; 氧氧基 苯苯氧 胺胺苯 亞亞胺 醯醯亞 來來醯 馬馬來 4 4 馬 雙雙 基-4 甲氯 )、 基 基烷苯 苯戊} } } 基 基基氧 氧苯苯 苯 } 胺 胺基亞 亞氧酿 醯苯來 來胺馬 烷 乙 烷 丙 雙 C 氟,3 1-雙六1, ? - * 1 馬亞 4 雙 4-醯-(,2--(來4--2, -4-馬C氟 溴4-1六 (3,5-二甲基-4- (4-馬來醯亞胺苯氧基)苯基)丙院、 ◎ 1,1,1,3,3,3-六氟-2,2-雙(3,5-二溴-4-(4-馬來醯亞胺苯氧 基)苯基)丙院、N,N’-伸乙基二馬來酿亞胺、n,N,-六伸 甲基馬來醯亞胺、N,N’-十二伸甲基雙馬來醯亞胺、n,N,-m -二甲苯雙馬來醯亞胺、N,N’-p -二甲苯馬來醯亞胺、 \1^’-1,3-雙伸甲基環己烷雙馬來醯亞胺、;^,;^,-2,4-伸苄基 雙馬來醯亞胺、Ν,Ν’-2,6-伸苄基雙馬來醯亞胺等,但非特 別限定於上述之物。此等可單獨或2種以上之成份倂用。 此等雙馬來醯亞胺中較佳爲2,2_雙(4- ( 4-馬來醯亞 胺苯氧基)苯基)丙烷' Ν,Ν’-4,4-二苯基甲烷雙馬來醯亞 -35- 201041971 胺、;^,:^’-(3,3-二乙基-5,5-二甲基)-4,4-二苯基-甲烷雙 馬來醯亞胺等芳香族雙馬來醯亞胺。 又,此等芳香族雙馬來醯亞胺中’爲了得到更高的平 坦化性較佳爲分子量〗,000以下之物。 本發明中(F )成份之雙馬來醯亞胺化合物相對於(a )成份之聚酯1〇〇質量份的使用率較佳爲0.5至50質量 份,更佳爲1至30質量份,特佳爲2至20質量份。該比 率太小時將難得到提升由熱硬化膜形成用聚酯組成物而得 之硬化膜平坦化的效果,太大時會降低硬化膜之透光率及 使塗膜粗糙。 &lt;溶劑&gt; 本發明之熱硬化膜形成用聚酯組成物多半係溶解於溶 劑以溶液狀態使用。此時所使用的溶劑爲,溶解(A )成 份至(C )成份、必要時之(D )成份至(F )成份及/或後 述的其他添加劑之物,又可爲具有該類溶解能之溶劑’其 種類及構造等無特別限定。 該類溶劑如,(A )成份聚合用之溶劑及下述溶劑。 例如甲基溶纖劑乙酸酯、乙基溶纖劑乙酸酯、甲基溶纖劑 、乙基溶纖劑、丁基溶纖劑、丙二醇單甲基醚、丙二醇丙 基醚、乳酸乙酯、乳酸丁酯、環己醇、乙酸乙酯、乙酸丁 酯、乳酸乙酯、乳酸丁酯等。 此等溶劑可單獨使用一種,或二種以上組合使用。 -36- 201041971 &lt;其他添加劑&gt; 又無損本發明之效果下,必要時本發明之熱硬化膜形 成用聚酯組成物可含有表面活性劑、液流調整劑等接著補 助劑、顏料、染料、保存安定劑、消泡劑、多價苯酚及多 羧酸等溶解促進劑等。 &lt;熱硬化膜形成用聚酯組成物&gt; 0 本發明之熱硬化膜形成用聚酯組成物爲,含有(A) 成份之聚酯、(B )成份之交聯劑、(C )成份之二酯(或 多價酯,及依所希望的(D )成份之防氧化劑(苯酚化合 物)、(E)成份之矽烷偶合劑、(F)成份之雙馬來醯亞 胺化合物’又可另含有其他添加劑中之一種以上的組成物 。一般此等多半係溶解於溶劑以溶液狀使用。 本發明之熱硬化膜形成用聚酯組成物較佳如下述之物 〇 Ο [1]:相對於(A)成份100質量份含有(B)成份3 至50質量份、(C)成份1至1〇〇質量份之熱硬化膜形成 用聚酯組成物。 [2] :相對於(A )成份1〇〇質量份含有(b )成份3 至50質量份、(C )成份1至丨00質量份、溶劑之熱硬化 膜形成用聚酯組成物。 [3] :相對於(A)成份100質量份含有(b )成份3 至50質量份、(C )成份i至10〇質量份、(d )成份 0.01至5質量份、(E)成份〇.5至30質量份、成 -37- 201041971 份0.5至50質量份之熱硬化膜形成用聚酯組成物。 [4]:相對於(A)成份1〇〇質量份含有(B )成份3 至50質量份、(C )成份3至50質量份、(D)成份 〇.〇1至5質量份、(E)成份0.5至30質量份、(F)成 份〇· 5至50質量份、溶劑之熱硬化膜形成用聚酯組成物 〇 下面將詳述以溶液狀使用本發明之熱硬化膜形成用聚 酯組成物時的添加率、調製方法等。 本發明之熱硬化膜形成用聚酯組成物中固體成份之比 率爲,能均勻將各成份溶解於溶劑下無特別限制,可爲1 至80質量%,較佳爲5至60質量%,更佳爲10至50質 量%。此時之固體成份係指,由熱硬化膜形成用聚酯組成 物之全部成份去除溶劑之物。 本發明之熱硬化膜形成用聚酯組成物的調製方法無特 別限定,其調製方法如,將(A )成份溶解於溶劑後,以 —定比率混合該溶液、(B )成份、(C )成份、及(D ) 成份、(E )成份、(F )成份而得均勻溶液之方法,或於 該調製法之適當階段中,另添加必要時之其他添加劑混合 的方法。 調製本發明之熱硬化膜形成用聚酯組成物時,可直接 使用溶劑中聚合反應而得之聚酯溶液。此時可因前述將( B )成份、(C )成份、(D )成份、(E )成份、(F )成 份等加入該(A)成份之溶液中形成均勻溶液後,爲了調 整濃度另追加投入溶劑。此時生成聚酯過程所使用的溶劑 -38- 201041971 ’可與調製熱硬化膜形成用聚酯組成物時調 劑相同或相異。 又以使用孔徑〇·2μπι之濾器等過濾調製 膜形成用聚酯組成物之溶液後再使用爲佳。 &lt;塗膜、硬化膜及液晶配向層&gt; 將本發明之熱硬化膜形成用聚酯組成物 0 動塗佈、輥塗佈、縫隙塗佈、縫隙後回轉塗 、印刷等於基板(例如,矽/二氧化矽被覆 基板、被覆金屬,例如鋁、鉬、鉻等之基板 石英基板、ΙΤΟ基板等)或薄膜(例如三乙 、聚酯薄膜、丙烯酸薄膜等樹脂薄膜)等上 板或烤箱等預備乾燥(預烤),可形成塗膜 理該塗膜,形成被膜。 該加熱處理之條件如,可由溫度7 0 °c至 Q 0.3至60分鐘之範圍內採用適當的加熱溫度 加熱溫度及加熱時間較佳爲80°C至140°C下 鐘。 又,由熱硬化膜形成用聚酯組成物形成 如0.1至30μηι,可考量所使用的基板段差 性質後適當選擇。 事後烘烤一般係採用,選用溫度140 °C 圍內的加熱溫度,於熱板上處理5至30分 理30至90分鐘之方法。 整濃度用之溶 而得的熱硬化 回轉塗佈、流 佈、噴墨塗佈 1板、氮化矽 、玻璃基板、 酿纖維素薄膜 方後,使用熱 。其後加熱處 1 60°c,時間 及加熱時間。 〇·5至1 0分 之被膜的膜厚 、光學性及電 至2 5 0 °C之範 鐘或烤箱中處 39 201041971 以上述條件硬化本發明之熱硬化膜形成用聚酯組成物 後,可使基板段差充分平坦化,形成具有高透明性之硬化 膜。 對由上述形成之硬化膜進行硏磨處理,可賦予液晶配 向層,即使具有液晶性之化合物配向的層之機能。 硏磨處理之條件一般係使用回轉速度3 00至l〇〇〇rpm 、運送速度3至200mm/秒、擠入量0.1至1mm之條件。 其後使用純水等藉由超音波洗淨去除硏磨所生成之殘 渣。 將相位差材料塗佈於由上述形成之液晶配向層後,將 相位差材料光硬化爲液晶狀態,可形成具有光學各向異性 之層。 所使用的相位.差材料如,具有聚合性基之液晶單體及 含有其之組成物等。 又,介有調距器以液晶配向層面對面方式貼合由上述 形成之具有液晶配向層的2枚基板後,將液晶注入此等基 板之間,可得液晶配向之液晶顯示元件。 另外使形成液晶配向層之基材爲薄膜狀,可作爲光學 各向異性薄膜之材料用。 如上述般,本發明之熱硬化膜形成用聚酯組成物適用 於各種光學各向異性薄膜、液晶顯示元件。 又,本發明之熱硬化膜形成用聚酯組成物至少具有必 要水準之平坦化性,因此適用爲形成薄膜晶體管(TFT ) 型液晶顯示元件、有機EL等各種顯示器之保護膜、平坦 -40- 201041971 化膜、絕緣膜等硬化膜之材料,特別是適用爲彩色濾光片 之保護膜、TFT型液晶元件之層間絕緣膜、有機EL元件 之絕緣膜等的材料。 【實施方式】 實施例 下面將舉實施例更詳細說明本發明,但本發明非限定 0 於此等實施例。 [實施例所使用的代號] 下面爲實施例所使用的代號之意義。 &lt;聚酯及二酯化合物 原料&gt; HBPDA: 3,3,-4,4,-二環己基四竣酸二肝 BPDA :聯苯四羧酸二酐 〇 BPADA : 4,4’- ( 4,4’-異亞丙基二苯氧基)雙酞酸酐 ΗΡΑ:六氫酞酸酐 CHDO : 1,4-環己二醇 (:111'0:1,3,5-環己三醇 Ρ Ε :季戊四醇 ΗΒΡΑ:氫化雙酚A 1[犯入:1,2,5,6-四氫酞酸酐 &lt;聚酯及二酯化合物 聚合觸媒&gt; -41 - 201041971 BTEAC :苄基三乙基銨氯化物 &lt;聚醯亞胺先驅物原料&gt; CBDA:環己烷四羧酸二酐 pDA: p -伸苯基二胺 &lt;丙烯酸基共聚物原料&gt; MAA :甲基丙烯酸 MMA :甲基甲基丙烯酸酯 HEM A : 2-羥基乙基甲基丙烯酸酯 CHMI: N -環己基馬來醯亞胺 AIBN :偶氮雙異丁腈 &lt;環氧化合物&gt; CEL:泰歇爾化學工業(股)製歇洛吉P-2〇21(製品名 )(化合物名:3,4-環氧環己烯基甲基-3’,4’-環氧環己烯 羧酸酯) &lt;防氧化劑&gt; TBHBM: 2,4,6-三(3,,5,-二-t-丁基- 4,-羥基节基)来 MBP: 4,4’-伸甲基雙(2,6-二-t-丁基苯酚) &lt;矽烷偶合劑&gt; MPS: γ-甲基丙烯氧基丙基三甲氧基矽烷 -42- 201041971 &lt;雙馬來醯亞胺化合物&gt; 8厘11:1^”,-(3,3-二乙基-5,5-二甲基)-4,4-二苯基-甲烷雙馬來醯亞胺 &lt;溶劑&gt; PGMEA:丙二醇單甲基醚乙酸酯 0 PGME :丙二醇單甲基醚 NMP : N-甲基吡咯烷酮 下述合成例所得之聚酯、聚醯亞胺先驅物及丙烯酸基 共聚物的數平均分子量及重量平均分子量係使用日本分光 (股)製GPC裝置(Shodex (登記商標)管柱KF803 L及 KF804L),使溶出溶劑四氫呋喃以流量lml/分之速度流 動於管柱中(管柱溫度40°C )進行溶離之條件測定。下述 數平均分子量(以下稱爲Μη)及重量平均分子量(以下 Q 稱爲Mw)係以聚苯乙烯換算値表示。 &lt;合成例1&gt; 125°C 下使 HBPDA 18.0g、BPDA 4.54g、HBPA 15.9g 、THPA 2.01g、BTEAC 0.19 於 PGMEA 95.1g 中反應 19 小時,得聚酯溶液(固體成份濃度:30.0質量%) ( PI ) 。所得聚酯之Μη爲1,310’ Mw爲3,270。 &lt;合成例2&gt; -43- 201041971 125°C 下使 HBPDA 12.0g、HBPA 10.2g、THPA 0.95g 、BTEAC 0_22g於PGMEA 54.58g中反應19小時,得聚酯 溶液(固體成份濃度:30.0質量% ) ( P2 )。所得聚酯之 Μη 爲 1,98 0,Mw 爲 3,5 00。 &lt;合成例3&gt; 125°C 下使 HBPDA 18.0g、BPADA 7.37g、HBPA 17.0g、THPA 2.15g、BTEAC 0.10g 於 PGMEA 104.2g 中反 應19小時,得聚酯溶液(固體成份濃度:30.0質量% ) (P3 )。所得聚酯之Μη爲l,440,Mw爲3,080。 &lt;合成例4&gt; 130〇C 下使 HBPA 16.82g ( 0.070mol ) 、THPA 20.85g (0.1 37mol ) 、BTEAC 0.096g 於 PGMEA 88.13g 中反應 16小時,得二酯溶液(固體成份濃度:30.0質量%) ( A1 &lt;合成例5 &gt; 130。。下使 CHDO 8. 1 3g ( 0.070mol ) ' THPA 20.8 5 g (0.1 37mol ) 、BTEAC 0.096g 於 PGMEA 67.86g 中反應 16小時,得二酯溶液(固體成份濃度:30.0質量%) ( A2 &lt;合成例6&gt; -44- 201041971 130。(:下使 HBPA 16.82g ( 0.070mol)、ΗΡΑ 21.13g ( O.137mol) 、BTEAC 0.096g 於 PGMEA 88.77g 中反應 16 小時,得二酯溶液(固體成份濃度:3 0.0質量%) ( A 3 ) &lt;合成例 130°C 下使 CHTO 5.5〇g(〇.〇42mol)、THPA 17.08g (0.112m〇l) 、BTEAC 0.057g 於 PGMEA 52.83 g 中反應 16小時,得二酯溶液(固體成份濃度:3〇·0質量% ) ( A4 &lt;合成例8&gt; 130。。下使 PE 5.00g ( 〇.〇37mol ) 、ΤΗΡΑ 20.10g ( 0.1 32mol ) 、BTEAC 0.050g 於 PGMEA 5 8.69g 中反應 16 小時,得二酯溶液(固體成份濃度:30.0質量% ) ( A5 ) ❹ &lt;合成例9&gt; 23°C 下使 CBDA 17.7g、pDA 10.2g 於 NMP 66.4g 中反 應24小時,得聚醯亞胺先驅物溶液(固體成份濃度: 30.0質量% ) ( P4 )。所得聚醯亞胺先驅物之Μη爲5,800 ’ Mw 爲 1 2,500。 &lt;合成例10&gt; -45- 201041971Q,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,,, ( 4 4 -c C-4 4-4-ylbisbis bis oxymethane, ethyl ethane ethyl phenyl phenyl) &gt; phenyl group &gt; oxy oxy phenoxy amine imidate醯醯亚来来醯马马来4 4马双双基-4 chloro), benzyl benzene phenyl pentene} } } yloxy oxyphenylbenzene phenylamine amide amide Ethyl propyl double C fluorine, 3 1-double six 1, 1 - * 1 Maya 4 double 4-醯-(, 2--(to 4- 4-, 4-methyl C-fluorobromo 4-1 hexa 3,5-Dimethyl-4-(4-maleimidophenoxy)phenyl)propane, ◎ 1,1,1,3,3,3-hexafluoro-2,2-dual ( 3,5-dibromo-4-(4-maleimidophenoxy)phenyl)propyl, N,N'-extended ethyl dimaleimide, n,N,-six-extension Kima lysine, N, N'-dodemethyl methyl bismaleimide, n, N, -m-xylene bismaleimide, N, N'-p-xylene horse醯iimine, \1^'-1,3-bis-extended methylcyclohexane, bismaleimide ;^,;^,-2,4-extended benzyl bismaleimide, hydrazine, Ν'-2,6-extension benzyl bismaleimide, etc., but is not particularly limited to the above. These may be used alone or in combination of two or more. Among these bismaleimides, 2,2_bis(4-(4-maleimidophenoxy)phenyl)propane is preferred. Ν,Ν'-4,4-diphenylmethane Bismale-35- 201041971 Amine, ;^,:^'-(3,3-diethyl-5,5-dimethyl)-4 An aromatic bismaleimide such as 4-diphenyl-methane bismaleimide. Further, in such aromatic bismaleimine, it is preferred to obtain a higher degree of planarization. The content of the (b) component of the bismaleimide compound is preferably 0.5 to 50 parts by mass, more preferably 0.5 to 50 parts by mass, based on the mass of the polyester of the component (a). It is preferably from 2 to 20 parts by mass, particularly preferably from 2 to 20 parts by mass. When the ratio is too small, it is difficult to obtain an effect of flattening the cured film obtained by forming the polyester composition for thermosetting film, and if it is too large, the hardening is lowered. The light transmittance of the film and the roughening of the coating film. &lt;Solvent&gt; The heat hardening of the present invention The polyester composition for formation is mostly dissolved in a solvent and used in a solution state. The solvent used at this time is to dissolve the components (A) to (C), and if necessary, the components (D) to (F) and/or The other additive described later may be a solvent having such a solubility energy, and the type and structure thereof are not particularly limited. Such a solvent is, for example, a solvent for polymerizing (A) component and the following solvent. For example, methyl cellosolve acetate, ethyl cellosolve acetate, methyl cellosolve, ethyl cellosolve, butyl cellosolve, propylene glycol monomethyl ether, propylene glycol propyl ether, ethyl lactate, Butyl lactate, cyclohexanol, ethyl acetate, butyl acetate, ethyl lactate, butyl lactate, and the like. These solvents may be used alone or in combination of two or more. -36-201041971 &lt;Other Additives&gt; Without further impairing the effects of the present invention, the polyester composition for forming a thermosetting film of the present invention may contain a surfacing agent, a pigment, a dye, etc., such as a surfactant and a liquid flow regulator. And storage stabilizers, antifoaming agents, dissolution promoters such as polyvalent phenols and polycarboxylic acids. &lt;Polyester composition for thermosetting film formation&gt; 0 The polyester composition for forming a thermosetting film of the present invention is a polyester containing (A) component, a crosslinking agent of (B) component, and (C) component a diester (or a polyvalent ester, and an antioxidant (phenol compound) according to the desired component (D), a decane coupling agent of the component (E), and a bismaleimide compound of the component (F) Further, one or more of the other additives are contained. Generally, most of these are dissolved in a solvent and used as a solution. The polyester composition for forming a thermosetting film of the present invention is preferably as follows [1]: relative 100 parts by mass of the component (A), the polyester composition for forming a thermosetting film containing 3 to 50 parts by mass of the component (B) and 1 to 1 part by mass of the component (C). [2] : Relative to (A) 1 part by mass of the polyester composition containing 3 to 50 parts by mass of the component (b), 1 to 00 parts by mass of the component (C), and a thermosetting film for forming a solvent. [3] : Relative to the component (A) 100 parts by mass of (b) component 3 to 50 parts by mass, (C) component i to 10 parts by mass, (d) component 0.01 to 5 parts by mass, (E) 5% to 30 parts by mass, from -37 to 201041971 parts, from 0.5 to 50 parts by mass of the polyester composition for forming a thermosetting film. [4]: (B) is contained in an amount of 1 part by mass relative to the component (A). 3 to 50 parts by mass of the component, 3 to 50 parts by mass of the component (C), 1 to 5 parts by mass of the component (D), 0.5 to 30 parts by mass of the component (E), and 〇 5 to 50 parts by mass of the component (F) The polyester composition for forming a thermosetting film of a solvent and a solvent. The addition ratio, the preparation method, and the like when the polyester composition for forming a thermosetting film of the present invention is used in the form of a solution will be described in detail below. The thermosetting film of the present invention is formed. The ratio of the solid content in the polyester composition is not particularly limited, and the component can be uniformly dissolved in the solvent, and may be from 1 to 80% by mass, preferably from 5 to 60% by mass, more preferably from 10 to 50% by mass. The solid content at this time is a method of removing the solvent from all the components of the polyester composition for forming a thermosetting film. The method for preparing the polyester composition for forming a thermosetting film of the present invention is not particularly limited, and a preparation method thereof is as follows. After dissolving the component (A) in a solvent, mixing the solution, the component (B) at a constant ratio, C) a component, and (D) component, (E) component, (F) component to obtain a homogeneous solution, or in a suitable stage of the preparation method, a method of mixing other additives as necessary. When the polyester composition for forming a thermosetting film is used, the polyester solution obtained by polymerization in a solvent can be directly used. In this case, the component (B), the component (C), the component (D), and the (E) may be used as described above. After the component (F) component is added to the solution of the component (A) to form a homogeneous solution, a solvent is additionally added to adjust the concentration. The solvent used in the process of producing the polyester-38-201041971' can be combined with the thermosetting film. When the polyester composition is formed, the adjustments are the same or different. Further, it is preferred to use a solution of a polyester composition for film formation after filtering using a filter having a pore size of 2·2 μm or the like. &lt;Coating film, cured film, and liquid crystal alignment layer&gt; The polyester composition for forming a thermosetting film of the present invention is subjected to 0-coating, roll coating, slit coating, slit coating, and printing to be equal to a substrate (for example, a crucible/cerium oxide-coated substrate, a coated metal such as a substrate quartz substrate such as aluminum, molybdenum or chromium, or a tantalum substrate, or a film (for example, a resin film such as triethyl, polyester film or acrylic film), or the like, or an oven or the like. Prepare to dry (pre-bake), and form a coating film to form a film. The heat treatment conditions may be, for example, from a temperature of from 70 ° C to a temperature of from 0.3 to 60 minutes by a suitable heating temperature. The heating temperature and the heating time are preferably from 80 ° C to 140 ° C for a period of time. Further, the polyester composition for forming a thermosetting film is formed to have a thickness of, for example, 0.1 to 30 μm, and can be appropriately selected in consideration of the substrate step difference property to be used. Post-baking is generally carried out by using a heating temperature of 140 ° C and a heat treatment on a hot plate for 5 to 30 minutes for 30 to 90 minutes. Thermal hardening obtained by dissolving the whole concentration. Rotating coating, flowing cloth, inkjet coating, 1 plate, tantalum nitride, glass substrate, and cellulose film are used, and heat is used. Thereafter, the heating is 1 60 ° C, time and heating time.膜·5 to 10° film thickness, optical properties and electricity to a temperature of 250 ° C or in the oven 39 201041971 After curing the polyester composition for forming a thermosetting film of the present invention under the above conditions, The substrate step can be sufficiently flattened to form a cured film having high transparency. By honing the cured film formed as described above, it is possible to impart a function to a liquid crystal alignment layer even if a layer having a liquid crystal compound is aligned. The conditions of the honing treatment are generally those using a rotation speed of 300 to 1 rpm, a conveying speed of 3 to 200 mm/sec, and a pushing amount of 0.1 to 1 mm. Thereafter, the residue generated by the honing is removed by ultrasonic cleaning using pure water or the like. After the phase difference material is applied to the liquid crystal alignment layer formed as described above, the phase difference material is photocured into a liquid crystal state to form a layer having optical anisotropy. The phase difference material used is, for example, a liquid crystal monomer having a polymerizable group, a composition containing the same, and the like. Further, after the two substrates having the liquid crystal alignment layer formed by the above-described liquid crystal alignment layer are bonded to each other via a liquid crystal alignment layer, liquid crystal is injected between the substrates to obtain a liquid crystal display element in which the liquid crystal is aligned. Further, the substrate on which the liquid crystal alignment layer is formed is formed into a film shape, and can be used as a material for an optically anisotropic film. As described above, the polyester composition for forming a thermosetting film of the present invention is suitable for use in various optically anisotropic films and liquid crystal display elements. Moreover, since the polyester composition for forming a thermosetting film of the present invention has at least a required level of planarization, it is suitable for forming a protective film of various types of displays such as a thin film transistor (TFT) type liquid crystal display element and an organic EL, and flat-40- 201041971 The material of the cured film such as a film or an insulating film is particularly suitable for a protective film of a color filter, an interlayer insulating film of a TFT liquid crystal element, or an insulating film of an organic EL element. [Embodiment] The present invention will now be described in more detail by way of examples, but the invention is not limited thereto. [Codes used in the examples] The following are the meanings of the symbols used in the examples. &lt;Polyester and diester compound raw material&gt; HBPDA: 3,3,-4,4,-dicyclohexyltetradecanoic acid liver BPDA: biphenyltetracarboxylic dianhydride 〇BPADA : 4,4'- ( 4 , 4'-isopropylidenediphenoxy)biphthalic anhydride hydrazine: hexahydrophthalic anhydride CHDO: 1,4-cyclohexanediol (: 111'0:1,3,5-cyclohexanetriol Ρ Ε : pentaerythritol hydrazine: hydrogenated bisphenol A 1 [intrusion: 1,2,5,6-tetrahydrophthalic anhydride &lt;polyester and diester compound polymerization catalyst&gt; -41 - 201041971 BTEAC : benzyltriethylammonium Chloride &lt;polyimine precursor raw material&gt; CBDA: cyclohexanetetracarboxylic dianhydride pDA: p-phenylenediamine &lt;acrylic-based copolymer raw material&gt; MAA: methacrylic acid MMA: methyl Methacrylate HEM A : 2-hydroxyethyl methacrylate CHMI: N-cyclohexylmaleimide AIBN : azobisisobutyronitrile &lt;epoxy compound&gt; CEL: Tachel Chemical Industry ( Co., Ltd. 歇洛吉 P-2〇21 (product name) (Compound name: 3,4-epoxycyclohexenylmethyl-3', 4'-epoxycyclohexene carboxylate) &lt;Prevention Oxidizer &gt; TBHBM: 2,4,6-tris(3,5,-di-t-butyl-4,-hydroxyl group) to MBP: 4,4'- Bis(2,6-di-t-butylphenol) &lt;decane coupling agent&gt; MPS: γ-methacryloxypropyltrimethoxydecane-42- 201041971 &lt;Bismaleimide compound &gt; 8 PCT 11:1^",-(3,3-diethyl-5,5-dimethyl)-4,4-diphenyl-methane bismaleimide &lt;solvent&gt; PGMEA : propylene glycol monomethyl ether acetate 0 PGME : propylene glycol monomethyl ether NMP : N-methylpyrrolidone The number average molecular weight and weight of the polyester, polyimide precursor and acrylic copolymer obtained in the following synthesis examples The average molecular weight was obtained by using a GPC apparatus (Shodex (registered trademark) column KF803 L and KF804L) manufactured by K.K., and the dissolution solvent tetrahydrofuran was flown in the column at a flow rate of 1 ml/min (column temperature 40 ° C). The conditions for the elution were measured. The following number average molecular weight (hereinafter referred to as Μη) and weight average molecular weight (hereinafter referred to as Mw) are expressed in terms of polystyrene &. <Synthesis Example 1> HBPDA 18.0 was made at 125 °C. g, BPDA 4.54g, HBPA 15.9g, THPA 2.01g, BTEAC 0.19 reacted in PGMEA 95.1g for 19 hours to obtain polyester solution (solid content concentration) 30.0% by mass) (PI). The obtained polyester had a Μη of 1,310' Mw of 3,270. &lt;Synthesis Example 2&gt; -43-201041971 12.0 g of HBPDA, 10.3 g of HBPA, 0.95 g of THPA, and 0_22 g of BTEAC were reacted in PGMEA 54.58 g at 125 ° C for 19 hours to obtain a polyester solution (solid content concentration: 30.0% by mass) ) ( P2 ). The obtained polyester had a Μη of 1,980 0 and a Mw of 3,500. &lt;Synthesis Example 3&gt; HBPOS 18.0 g, BPADA 7.37 g, HBPA 17.0 g, THPA 2.15 g, and BTEAC 0.10 g were reacted in PGMEA 104.2 g at 125 ° C for 19 hours to obtain a polyester solution (solid content concentration: 30.0 mass) % ) (P3 ). The obtained polyester had a Μη of 1,440 and a Mw of 3,080. &lt;Synthesis Example 4&gt; HBPA 16.82 g (0.070 mol), THPA 20.85 g (0.137 mol), and BTEAC 0.096 g were reacted in PGMEA 88.13 g at 130 ° C for 16 hours to obtain a diester solution (solid content concentration: 30.0 mass) %) (A1 &lt;Synthesis Example 5 &gt; 130. Next, CHDO 8. 1 3g (0.070 mol ) 'THPA 20.8 5 g (0.1 37 mol) and BTEAC 0.096 g were reacted in PGMEA 67.86 g for 16 hours to obtain a diester. Solution (solid content concentration: 30.0% by mass) (A2 &lt; Synthesis Example 6 &gt; -44 - 201041971 130. (: Lower HBPA 16.82 g (0.070 mol), ΗΡΑ 21.13 g (O.137 mol), BTEAC 0.096 g to PGMEA The reaction was carried out in 88.77 g for 16 hours to obtain a diester solution (solid content concentration: 3 0.0% by mass) (A 3 ) &lt; Synthesis Example CHTO 5.5 〇g (〇.〇42 mol) and THPA 17.08 g (0.112) at 130 °C M〇l), BTEAC 0.057g was reacted in PGMEA 52.83 g for 16 hours to obtain a diester solution (solid content concentration: 3 〇·0 mass%) (A4 &lt; Synthesis Example 8 &gt; 130. Under PE 5.00 g ( 〇.〇37mol), ΤΗΡΑ20.10g (0.132mol), BTEAC 0.050g in PGMEA 5 8.69g for 16 hours to obtain diester solution (solid Part concentration: 30.0% by mass) (A5) ❹ &lt;Synthesis Example 9&gt; 17.7 g of CBDA and 10.2 g of pDA were reacted in NMP 66.4 g at 23 ° C for 24 hours to obtain a polyimine precursor solution (solid concentration) : 30.0% by mass) (P4). The obtained polyamidiamine precursor has a Μη of 5,800 'Mw of 1,2,500. &lt;Synthesis Example 10&gt; -45- 201041971

所使用的單體成份爲MAA l〇.9g、CHMI 35.3g、 HEMA 25.5g、MMA 28.3g,所使用的自由基聚合引發劑爲 AIBN 5g ’溫度60°C至100°C下使此等於溶劑PGMEA 15 0g中聚合反應,得丙烯酸基共聚物溶液(固體成份濃度 :40.0質量% ) ( P 5 )。所得丙烯酸基共聚物之溶液爲 Μη 爲 3,800,Mw 爲 6,700。 &lt;實施例1至實施例9及比較例1至比較例3 &gt; 依表1所示組成調製實施例1至實施例9及比較巧1 至比較例3之各組成物’再各自評估該組成物所得之硬化 膜的平坦化性、耐溶劑性、配向性、密合性、透明性及耐 熱性(透光率)。 -46- 201041971The monomer components used were MAA l〇.9g, CHMI 35.3g, HEMA 25.5g, MMA 28.3g, and the radical polymerization initiator used was AIBN 5g 'The temperature was 60 ° C to 100 ° C to make this equal to the solvent. The polymerization reaction was carried out in PGMEA 15 0 g to obtain an acrylic-based copolymer solution (solid content concentration: 40.0% by mass) (P 5 ). The solution of the obtained acrylic-based copolymer had a Μη of 3,800 and a Mw of 6,700. &lt;Example 1 to Example 9 and Comparative Example 1 to Comparative Example 3 &gt; Compositions of Examples 1 to 9 and Comparative 1 to Comparative Example 3 were prepared according to the composition shown in Table 1 The flattening property, solvent resistance, alignment property, adhesion, transparency, and heat resistance (light transmittance) of the cured film obtained from the composition. -46- 201041971

(Α戚份* (B戚份 (c)成份 (D)成份 (E)成份 (F)成份 溶劑 之溶液(g) (g) (g) (g) (g) (g) (g) 實施例1 P1 CEL A1 TBHBM MPS PGME 14 1.5 6. 0 0. 036 0. 48 4. 0 實施例2 P2 CEL A1 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 實施例3 P3 CEL A1 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 實施例4 P2 CEL A1 TBHBM MPS PGME 10 1.5 10 0. 036 0. 48 4. 0 實施例5 P2 CEL A1 MBP MPS PGME 14 1. 5 6. 0 0. 036 0. 48 4. 0 實施例6 P2 CEL A2 TBHBM MPS PGME 16 1.5 4. 0 0. 036 0. 48 4. 0 實施例7 P3 CEL A3 TBHBM MPS BMI1 PGME 14 1. 5 6. 0 0. 036 0. 48 0. 6 5. 8 實施例8 P1 CEL A4 TBHBM MPS PGME 14 1.5 6. 0 0. 036 0. 48 4. 0 實施例9 P1 CEL A5 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 比較例1 P2 PGMEA 20 — 2. 22 比較例2 P4 CEL NMP 20 1.2 _ 2. 97 比較例3 P5 CEL PGMEA 20 1. 2 2. 80 ※P1~P3 :聚酯溶液 P4 :聚醯亞胺先驅物P5 :丙烯酸基共聚物 〇 [評估平坦化性] 使用旋塗機將實施例1至實施例9及比較例1至比較 例3之各組成物塗佈於高ΙΟμπι、線寬ΙΟΟμχη、線間之空 間40 μπα之段差基板(玻璃製)上,再置於100 °C之熱板 上進行120秒預烤,形成膜厚2.5 μιη之塗膜。膜厚係使用 FILMETRICS公司製F20測定。於溫度23 0°C之熱風循環 式烤箱中加熱該塗膜3 0分鐘進行事後烘烤,形成膜厚 2.0μιη之硬化膜。 -47- 201041971 測定段差基板線上之塗膜及空間上 參考圖1 ),再利用平坦化率(DOP ): 厚差(μηΟ /段差基板之高度(Ι.Ομπι) 〇 確認爲平坦化膜之條件爲,至少具 化率。 [評估耐溶劑性] 使用旋塗機將實施例1至實施例9 例3之各組成物塗佈於矽電路板上,再 上進行120秒預烤,形成膜厚2.8μιη之 FILMETRICS公司製F20測定。於溫度 式烤箱中對該塗膜進行3 0分鐘事後 2.5μιη之硬化膜。 將該硬化膜浸漬於PGMEA或ΝΜΡ 以溫度1 〇〇°C乾燥60秒,再測定膜厚。 或NMP後無膜厚變化之物視爲〇,將 物視爲X。 [評估配向性] 使用旋塗機將實施例1至實施例9 例3之各組成物塗佈於I τ Ο基板上,再 上進行120秒預烤,形成膜厚2.8μιη之 FILMETRICS公司製F20測定。於溫度 之塗膜的膜厚差( 10〇x[l-·(塗膜之膜 }]式求取平坦化率 享6 0 %以上之平坦 及比較例1至比較 置於100°C之熱板 塗膜。膜厚係使用 230°C之熱風循環 烘烤,形成膜厚 中6 0秒後,各自 將浸漬於PGMEA 浸漬後膜厚減少之 及比較例1至比較 置於1 0 0 °c之熱板 塗膜。膜厚係使用 230 °C之熱風循環 -48 - 201041971 式烤箱中對該膜進行30分鐘事後烘烤,形成硬化膜。 以回轉速度 400rpm、運送速度 30mm/秒、擠入量 0.4mm對該硬化膜進行硏磨處理。以純水超音波洗淨硏磨 處理後之基板5分鐘。 使用旋塗機將由液晶單體形成之相位差材料塗佈於該 基板上,再置於8(TC之熱板上進行60秒預烤,形成膜厚 1.4μιη之塗膜。氮氣下以l,〇〇〇mJ將該基板曝光。以偏向 0 板挾持所得基板,再以目視確認配向性。將基板傾斜45 度時及不傾斜時光透過性有明顯變化之物視爲〇,無變化 之物視爲X。 [評估密合性] 使用旋塗機將實施例1至實施例9及比較例1至比較 例3之各組成物塗佈於石英基板上,再置於10 〇°C之熱板 上進行120秒預烤,其後於溫度23 0°C之熱風循環式烤箱 Q 中進行3 0秒事後烘烤,形成硬化膜。 以回轉速度 400rpm、運送速度 30mm/秒' 擠入量 0.4mm對該硬化膜進行硏磨處理。以純水超音波洗淨硏磨 處理後之基板5分鐘。 使用旋塗機將由液晶單體形成之相位差材料塗佈於該 基板上,再置於80°C之熱板上進行60秒預烤,形成膜厚 1·4μιη之塗膜。氮氣下以l,〇〇〇mJ將該基板曝光。於所得 塗膜上切出25個1mm xl mm格子後進行黏著膠布剝離試 驗(使用膠布:Cello-tap (登記商標))。將切出的25 -49- 201041971 個格子完全未剝離之物視爲〇,既使1個剝離之物視爲X [評估透明性(透光率)] 使用旋塗機將實施例1至實施例9及比較例1至比較 例3之各組成物塗佈於石英基板上,再置於1 〇〇 °C之熱板 上進行12〇秒預烤,形成膜厚2.8 μιη之塗膜。膜厚係使用 FILMETRICS公司製F20測定。於溫度23 0°C之熱風循環 式烤箱中對該膜進行3 0分鐘事後烘烤,形成硬化膜。 使用紫外線可視分光光度計(島津製作所(股)製 SHIMADSU UV-25 50型號)測定該硬化膜之波長400nm 時的透光率。 [評估耐熱性(透光率)] 於溫度230°C之熱風循環式烤箱中加熱3小時上述評 估透明性後之硬化膜,再使用紫外線可視分光光度計(島 津製作所(股)製SHIMADSU UV-2550型號),測定波長 400nm時之透光率。 [評估結果] 上述評估結果如下述表2所示。 -50- 201041971 [表2] 平坦化率 (%) 耐溶劑性 配向性 密合性 透明性 (%) 耐熱性 (%) PGMEA NMP 實施例1 61 〇 〇 〇 〇 98 93 實施例2 61 〇 〇 〇 〇 99 97 實施例3 63 〇 〇 〇 〇 97 92 實施例4 64 〇 〇 〇 〇 99 97 實施例5 61 〇 〇 〇 〇 99 94 實施例6 60 〇 〇 〇 〇 99 96 實施例7 64 〇 〇 〇 〇 98 95 實施例8 63 〇 〇 〇 〇 99 97 實施例9 60 〇 〇 〇 〇 97 95 比較例1 — X X — — — 一 比較例2 20 〇 〇 〇 X 85 84 比較例3 65 〇 〇 X X 96 95(Α戚份* (B part (c) ingredient (D) ingredient (E) ingredient (F) ingredient solvent solution (g) (g) (g) (g) (g) (g) (g) implementation Example 1 P1 CEL A1 TBHBM MPS PGME 14 1.5 6. 0 0. 036 0. 48 4. 0 Example 2 P2 CEL A1 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 Example 3 P3 CEL A1 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 Example 4 P2 CEL A1 TBHBM MPS PGME 10 1.5 10 0. 036 0. 48 4. 0 Example 5 P2 CEL A1 MBP MPS PGME 14 1. 5 6. 0 0. 036 0. 48 4. 0 Example 6 P2 CEL A2 TBHBM MPS PGME 16 1.5 4. 0 0. 036 0. 48 4. 0 Example 7 P3 CEL A3 TBHBM MPS BMI1 PGME 14 1. 5 6. 0 0. 036 0. 48 0. 6 5. 8 Example 8 P1 CEL A4 TBHBM MPS PGME 14 1.5 6. 0 0. 036 0. 48 4. 0 Example 9 P1 CEL A5 TBHBM MPS PGME 14 1· 5 6. 0 0. 036 0. 48 4. 0 Comparative Example 1 P2 PGMEA 20 — 2. 22 Comparative Example 2 P4 CEL NMP 20 1.2 _ 2. 97 Comparative Example 3 P5 CEL PGMEA 20 1. 2 2. 80 ※P1~P3: Polyester solution P4: Polyimine precursor P5: Acrylic copolymer 〇 [Evaluation of flatness] Using a spin coater Each of the compositions of Examples 1 to 9 and Comparative Examples 1 to 3 was applied to a step substrate (made of glass) having a height of μμπι, a line width ΙΟΟμχη, and a space between the lines of 40 μπα, and then placed at 100 °. The hot plate of C was pre-baked for 120 seconds to form a coating film having a film thickness of 2.5 μm. The film thickness was measured by F20 manufactured by FILMETRICS Co., Ltd. The film was heated in a hot air circulating oven at a temperature of 23 ° C for 30 minutes. After the baking, a cured film having a film thickness of 2.0 μm was formed. -47- 201041971 Measure the coating film on the stepped substrate line and refer to Figure 1 in the space, and then use the flattening ratio (DOP): Thickness difference (μηΟ / height of the step substrate (Ι.Ομπι) 〇 Confirmed as the condition of the planarizing film In order to at least have a chemical conversion rate. [Evaluation of Solvent Resistance] Each of the compositions of Example 1 to Example 9 Example 3 was applied onto a ruthenium circuit board using a spin coater, and then pre-baked for 120 seconds to form a film thickness. The F20 was measured by FILMETRICS Co., Ltd. at 2.8 μm, and the film was subjected to a curing film of 2.5 μm after 30 minutes in a temperature oven. The cured film was immersed in PGMEA or dried at a temperature of 1 ° C for 60 seconds. The film thickness was measured, or the film having no change in film thickness after NMP was regarded as 〇, and the object was regarded as X. [Evaluation of alignment property] Each of the compositions of Example 1 to Example 9 Example 3 was applied to I using a spin coater. The τ Ο substrate was pre-baked for 120 seconds to form F20 measured by FILMETRICS Co., Ltd. having a film thickness of 2.8 μm. The film thickness difference of the coating film at temperature (10〇x [l-·(film of film]}] A flatness ratio of 60% or more was obtained, and Comparative Example 1 was compared to a hot plate coating film at 100 °C. The film thickness was baked by hot air circulation at 230 ° C, and after forming a film thickness for 60 seconds, each of the films was immersed in PGMEA after immersion reduction and Comparative Example 1 was compared to a hot plate coated at 100 ° C. The film thickness was 230 ° C using a hot air cycle -48 - 201041971. The film was post-baked for 30 minutes in an oven to form a cured film. The rotation speed was 400 rpm, the conveying speed was 30 mm/sec, and the extrusion amount was 0.4 mm. The cured film was subjected to honing treatment, and the substrate after the honing treatment was washed with pure water for 5 minutes. The phase difference material formed of the liquid crystal monomer was applied onto the substrate by a spin coater, and then placed on the substrate (8). The hot plate was pre-baked for 60 seconds to form a coating film having a film thickness of 1.4 μm. The substrate was exposed to light at 1, 〇〇〇mJ under nitrogen, and the obtained substrate was held by biasing the 0-plate, and the alignment was visually confirmed. The object which has a significant change in light transmittance when tilted at 45 degrees and when it is not tilted is regarded as 〇, and the thing which is not changed is regarded as X. [Evaluation of adhesion] Examples 1 to 9 and Comparative Example 1 were applied using a spin coater Each of the compositions of Comparative Example 3 was coated on a quartz substrate and placed at 10 〇 ° C. The hot plate was pre-baked for 120 seconds, and then baked in a hot air circulating oven Q at a temperature of 23 ° C for 30 seconds to form a cured film. The rotation speed was 400 rpm, and the conveying speed was 30 mm/sec. The hardened film was honed at 0.4 mm, and the honed substrate was washed with pure water for 5 minutes. A phase difference material formed of a liquid crystal monomer was applied onto the substrate using a spin coater, and then placed. The hot plate at 80 ° C was pre-baked for 60 seconds to form a coating film having a film thickness of 1. 4 μm. The substrate was exposed to 1, 〇〇〇mJ under nitrogen. An adhesive tape peeling test (using a tape: Cello-tap (registered trademark)) was carried out by cutting 25 1 mm x 1 mm grids on the obtained coating film. The cut 25-49-201041971 lattice completely unpeeled is regarded as 〇, even if one peeled object is regarded as X [evaluation of transparency (light transmittance)] Example 1 to implementation using a spin coater Each of the compositions of Example 9 and Comparative Examples 1 to 3 was applied onto a quartz substrate, and placed on a hot plate at 1 ° C for 12 sec pre-bake to form a coating film having a film thickness of 2.8 μm. The film thickness was measured using F20 manufactured by FILMETRICS. The film was post-baked for 30 minutes in a hot air circulating oven at a temperature of 23 ° C to form a cured film. The light transmittance at a wavelength of 400 nm of the cured film was measured using an ultraviolet visible spectrophotometer (SHIMADSU UV-25 50 model manufactured by Shimadzu Corporation). [Evaluation of heat resistance (light transmittance)] The film was heated in a hot air circulating oven at a temperature of 230 ° C for 3 hours. The cured film was evaluated for transparency, and then an ultraviolet visible spectrophotometer (SHIMADSU UV-made by Shimadzu Corporation) was used. 2550 model), the transmittance at a wavelength of 400 nm was measured. [Evaluation Results] The above evaluation results are shown in Table 2 below. -50- 201041971 [Table 2] Flattening ratio (%) Solvent resistance alignment adhesion transparency (%) Heat resistance (%) PGMEA NMP Example 1 61 〇〇〇〇98 93 Example 2 61 〇〇 〇〇99 97 Example 3 63 〇〇〇〇97 92 Example 4 64 〇〇〇〇99 97 Example 5 61 〇〇〇〇99 94 Example 6 60 〇〇〇〇99 96 Example 7 64 〇〇 〇〇98 95 Example 8 63 〇〇〇〇99 97 Example 9 60 〇〇〇〇97 95 Comparative Example 1 - XX — — — A Comparative Example 2 20 〇〇〇X 85 84 Comparative Example 3 65 〇〇XX 96 95

實施例1至實施例 9均具有高平坦化率,且對 PGMEA ' NMP均具有耐性。又均具有良好配向性,高溫 Q 焙燒後及再度高溫焙燒後均可達成高透光率(透明性), 且備有耐熱性。另外任何實施例對相位差材料均具有良好 密合性。 但比較例1未形成硬化膜。 又,比較例2雖具有良好耐溶劑性、耐熱性及配向性 ,但仍殘存透明性課題,且平坦化率非常低、密合性差。 比較例3雖具有良好的平坦化率、耐溶劑性及透明性 ,但配向性及密合性差。 由上述得知,本發明之熱硬化膜形成用聚酯組成物於 -51 - 201041971 形成硬化膜時可使用丙二醇單甲基醚乙酸酯等二元醇系溶 劑,且所得硬化膜具有優良的光透過性、耐溶劑性、耐熱 性、平坦化性、密合性及配向性之任何性能。 [產業上利用可能性】 本發明之熱硬化膜形成用聚酯組成物非常適合使用於 光學各向異性薄膜及液晶顯不兀件之液晶配向層,又適用 爲形成薄膜晶體管(TFT )型液晶顯示元件、有機EL元 件等各種顯示器之保護膜、平坦化膜、絕緣膜等硬化膜的 材料,特別是形成TFT型液晶元件之層間絕緣膜、彩色濾 光片之保護膜、有機EL元件之絕緣膜等的材料。 [先前技術文獻] [專利文獻] 專利文獻1 :特開2 0 0 0 - 1 0 3 9 3 7號公報 專利文獻2 :特開2000- 1 1 9472號公報 專利文獻3 :特開2005 -03 793 0號公報 【圖式簡單說明】 圖1爲,將熱硬化性聚酯組成物塗佈於段差基板時所 形成的硬化膜模式圖。 圖2爲,利用先前技術形成液晶配向膜之液晶單元( a )與使用本發明之熱硬化膜形成用聚酯組成物形成平坦 化膜之液晶單元(b )的對比模式圖。 -52-Each of Examples 1 to 9 has a high flattening rate and is resistant to PGMEA 'NMP. They all have good alignment properties, and high light transmittance (transparency) can be achieved after high-temperature Q baking and after high-temperature baking, and heat resistance is provided. Further, any of the examples has good adhesion to the phase difference material. However, Comparative Example 1 did not form a cured film. Further, in Comparative Example 2, although the solvent resistance, heat resistance, and alignment property were good, the problem of transparency remained, and the flattening ratio was extremely low, and the adhesion was inferior. In Comparative Example 3, although it had a good flatness, solvent resistance, and transparency, the alignment property and the adhesion were inferior. As described above, when the polyester composition for forming a thermosetting film of the present invention forms a cured film at -51 - 201041971, a glycol solvent such as propylene glycol monomethyl ether acetate can be used, and the obtained cured film has excellent properties. Any property of light transmittance, solvent resistance, heat resistance, flatness, adhesion, and alignment. [Industrial Applicability] The polyester composition for forming a thermosetting film of the present invention is very suitable for use in a liquid crystal alignment layer of an optically anisotropic film and a liquid crystal display, and is also suitable for forming a thin film transistor (TFT) type liquid crystal. A material for a cured film such as a protective film, a flattening film or an insulating film of various displays such as a display element or an organic EL element, in particular, an interlayer insulating film for forming a TFT-type liquid crystal element, a protective film for a color filter, and an insulating of an organic EL element. A material such as a film. [Prior Art Document] [Patent Document 1] Patent Document 1: JP-A-2000- 1 0 3 9 3 Patent Document 2: JP-A-2000-1-17491 Patent Document 3: JP-A-2005-03 793 0. Brief Description of the Drawings Fig. 1 is a schematic view showing a cured film formed when a thermosetting polyester composition is applied to a step substrate. Fig. 2 is a view showing a comparison of a liquid crystal cell (a) for forming a liquid crystal alignment film by a prior art and a liquid crystal cell (b) for forming a planarization film using the polyester composition for forming a thermosetting film of the present invention. -52-

Claims (1)

Ο 201041971 七、申請專利範圍: i 一種熱硬化膜形成用聚酯組成物,: (A )成份之聚酯,(B )成份之交聯劑及( 述式(1)所表示的至少一種二酯化合物, [化1] hooc-qy〇&gt;-°yq-cooh 、r0R (υ (2) (式中,ρ爲脂環式基、脂環式基及脂 之基或式(2)所表示的構造,Q爲脂環式 及脂肪族基所形成之基;式(2)中,R爲伸 2 ·如申請專利範圍第1項之熱硬化膜 成物,其中(C)成份爲,下述式(in)所 化合物1莫耳與下述式(iv)所表示的二羧 Q 莫耳反應而得之二酯化合物, [化2] HO-P-OH qA〇 (.ν) 0、 (Hi) Π R 〇 (2) (式中,p爲脂環式基 '脂環式基及脂且 之基或式(2)所表示的構造,Q爲脂環式3 及脂肪族基所形成之基’ Ρ及Q可各自爲,《 任意氫原子被脂肪族基所取代;式(2)中, 特徵爲含有 )成份之下 族基所形成 或脂環式基 基)。 成用聚酯組 示的二元醇 酐1.7至2 族基所形成 或脂環式基 基中所含的 R爲伸烷基 -53 - 201041971 3 .如申請專利範圍第2項之熱硬化膜形成用聚酯組 成物’其中P爲下述式(1P1)所表示之基, [化3] -r12-p1-(r11-p1^r13- (1P1) (式中’ P1爲環狀飽和烴基,P1基中任意的氫原子可 各自獨立被脂肪族基所取代;R11爲單鍵、羰基、醚基、 擴酸基、碳原子數1至8之飽和烴基或被氟原子取代的碳 原子數1至8之飽和烴基,R12、R13各自獨立爲單鍵或碳 原子數1至5之伸烷基,h爲0或1)。 4 ·如申請專利範圍第2或3項之熱硬化膜形成用聚 酯組成物,其中Q爲下述式(1Q1)所表示之基, [化4] ~Q1一X一 (1Q1 ) (式中,Q1爲碳原子數4至8之環伸烷基或環伸鏈烯 基,Q1基中任意的氫原子可被脂肪族基所取代;X爲單鍵 或碳原子數1至3之伸烷基)。 5.如申請專利範圍第1項之熱硬化膜形成用聚酯組 成物,其中(C)成份含有下述式(Ι-a)所表示的至少一 種多價酯化合物, -54- 201041971 [化5] HOOC*&quot;Qa 丫。、Pa {〇Vg^Qa、COOH) —Ra^(Ra)j· (1a) (2-a) (式中,Pa爲可被氧原子或氮原子中斷的脂環式基或 脂肪族烷基,或式(2-a )所表示的構造,Qa爲脂環式基 ,1爲1至5之整數;式(2-0中,Ra爲伸烷基)。 0 6.如申請專利範圍第1至5項中任何一項之熱硬化 膜形成用聚酯組成物,其中(A)成份爲,含有下述式(3 )所表示之構造單位的聚酯, [化6]Ο 201041971 VII. Patent application scope: i A polyester composition for forming a thermosetting film, comprising: (A) a polyester component, (B) a crosslinking agent, and (at least one of the two represented by the formula (1) Ester compound, [chemical 1] hooc-qy〇&gt;-°yq-cooh, r0R (υ (2) (wherein ρ is an alicyclic group, an alicyclic group and a lipid group or a formula (2) The structure indicated, Q is a group formed by an alicyclic group and an aliphatic group; and in the formula (2), R is a stretch 2; as in the thermosetting film of the first aspect of the patent application, wherein the component (C) is a diester compound obtained by reacting a compound 1 molar of the following formula (in) with a dicarboxy Q mole represented by the following formula (iv), [Chemical 2] HO-P-OH qA〇(.ν) 0 (Hi) Π R 〇(2) (wherein p is an alicyclic group of an alicyclic group and a lipid group or a structure represented by the formula (2), and Q is an alicyclic group 3 and an aliphatic group. The groups '' and Q' which are formed may each be, "any hydrogen atom is replaced by an aliphatic group; in the formula (2), characterized by containing a group formed by a group or an alicyclic group). Polyol group 1.7 to 2 group of glycol anhydride The R contained in the alicyclic group or the alicyclic group is an alkyl group-53 - 201041971. The polyester composition for forming a thermosetting film according to the second aspect of the patent application' wherein P is the following formula (1P1) The group represented, [Chem. 3] -r12-p1-(r11-p1^r13- (1P1) (wherein P1 is a cyclic saturated hydrocarbon group, and any hydrogen atom in the P1 group may be independently bonded by an aliphatic group Substituting; R11 is a single bond, a carbonyl group, an ether group, an acid extension group, a saturated hydrocarbon group having 1 to 8 carbon atoms or a saturated hydrocarbon group having 1 to 8 carbon atoms substituted by a fluorine atom, and R12 and R13 are each independently a single bond or The alkyl group having a carbon number of 1 to 5, h is 0 or 1). 4. The polyester composition for forming a thermosetting film according to claim 2 or 3, wherein Q is a formula (1Q1) The base of the formula, [Chemical 4] ~Q1 -X-(1Q1) (wherein, Q1 is a cycloalkyl group having 4 to 8 carbon atoms or a cycloalkenyl group, and any hydrogen atom in the Q1 group may be fat. The group of the (C) component contains the following polyester composition, which is a single bond or a C 1 to 3 alkyl group. Type (Ι-a) At least one polyvalent ester compound represented, -54- 201041971 [Chemical 5] HOOC*&quot;Qa 丫.,Pa {〇Vg^Qa,COOH)-Ra^(Ra)j· (1a) (2-a) (In the formula, Pa is an alicyclic group or an aliphatic alkyl group interrupted by an oxygen atom or a nitrogen atom, or a structure represented by the formula (2-a), Qa is an alicyclic group, and 1 is 1 to 5 An integer; in the formula (2-0, Ra is an alkylene group). The polyester composition for forming a thermosetting film according to any one of claims 1 to 5, wherein the component (A) is a polyester having a structural unit represented by the following formula (3), [Chemical 6] Q (式中,A爲脂環式基或脂肪族基鍵結4個鍵結鍵之 4價有機基,B爲脂環式基或脂肪族基鍵結2個鍵結鍵之 2價有機基)。 7.如申請專利範圍第1至6項中任何一項之熱硬化 膜形成用聚酯組成物,其中(A)成份爲,下述式(i)所 表示之四羧酸二酐與式(Π)所表示之二元醇化合物反應 而得的聚酯, -55- 201041971Q (wherein, A is a tetravalent organic group in which an alicyclic group or an aliphatic group is bonded to four bonding bonds, and B is an alicyclic group or a divalent organic group in which an aliphatic group is bonded to two bonding bonds; ). 7. The polyester composition for forming a thermosetting film according to any one of claims 1 to 6, wherein the component (A) is a tetracarboxylic dianhydride represented by the following formula (i) and a formula (聚酯) The polyester obtained by reacting the diol compound represented, -55- 201041971 (式中,A爲脂環式基或脂肪族基鍵結4個鍵結鍵之 4價有機基,B爲脂環式基或脂肪族基鍵結2個鍵結鍵之 2價有機基)。 8.如申請專利範圍第6或7項之熱硬化膜形成用聚 酯組成物,其中前述式(3)中,A爲下述式(A-1)至式 (A-8)所表示之基中選出的至少一種基,B爲下述式( B-1)至(B-5)所表示之基中選出的至少一種基, [化8] XX w (A-1 ) (A-2) (A-3) (A-4)(wherein, A is a tetravalent organic group in which an alicyclic group or an aliphatic group is bonded to four bonding bonds, and B is an alicyclic group or a divalent organic group in which an aliphatic group is bonded to two bonding bonds) . 8. The polyester composition for forming a thermosetting film according to claim 6 or 7, wherein in the above formula (3), A is represented by the following formula (A-1) to formula (A-8). At least one group selected from the group, B is at least one selected from the group represented by the following formulas (B-1) to (B-5), [Chem. 8] XX w (A-1 ) (A-2 ) (A-3) (A-4) (A-7) (A-5) (A-6) (A-8) [化9](A-7) (A-5) (A-6) (A-8) [Chem. 9] (B-1 ) (B-2) (B-3) (B-4) (B-5} 9.如申請專利範圍第1至8項中任何一項之熱硬化 膜形成用聚酯組成物’其中(A)成份之聚酯的重量平均 分子量爲,聚苯乙烯換算下1,000至3 0,000。 1 〇.如申請專利範圍第1至9項中任何一項之熱硬化 -56- 201041971 膜形成用聚酯組成物’其中另含有(D )成份用之防氧化 劑的苯酚化合物。 1 1 .如申請專利範圍第1至1 0項中任何一項之熱硬 化膜形成用聚酯組成物,其中另含有(E)成份用之矽烷 偶合劑。 1 2.如申請專利範圍第1至1 1項中任何一項之熱硬 化膜形成用聚酯組成物,其中另含有(F)成份用之雙馬 Q 來醯亞胺化合物。 1 3 .如申請專利範圍第1至1 2項中任何一項之熱硬 化膜形成用聚酯組成物,其中相對於(A )成份1 00質量 份含有(B)成份3至50質量份,(C)成份1至100質 量份。 14.如申請專利範圍第10項之熱硬化膜形成用聚酯 組成物,其中相對於(A)成份100質量份含有(D)成 份0.01至5質量份。 Q 1 5.如申請專利範圍第1 1項之熱硬化膜形成用聚酯 組成物,其中相對於(A )成份1 0 0質量份含有(E )成份 0.5至3 0質量份。 16. 如申請專利範圍第12項之熱硬化膜形成用聚酯 組成物,其中相對於(A )成份1 00質量份含有(F )成份 0.5至50質量份。 17. —種硬化膜,其特徵爲使用如申請專利範圍第1 至1 6項中任何一項之熱硬化膜形成用聚酯組成物而得。 1 8 . —種液晶配向層,其特徵爲使用如申請專利範圍 -57- 201041971 第1至1 7項中任何一項之熱硬化膜形成用聚酯組成物而 得。 -58-(B-1) (B-2) (B-3) (B-4) (B-5) 9. The polyester composition for forming a thermosetting film according to any one of claims 1 to 8 'The weight average molecular weight of the polyester of the component (A) is 1,000 to 30,000 in terms of polystyrene. 1 热. Thermal hardening according to any one of claims 1 to 9 - 56- 201041971 Film formation A polyester composition for forming a thermosetting film for use in any one of the first to tenth aspects of the invention, wherein the polyester composition is a polyester composition for forming a thermosetting film. Further, the decane coupling agent for the component (E) is used. The polyester composition for forming a thermosetting film according to any one of claims 1 to 1 wherein the (F) component is additionally used. The polyester composition for forming a thermosetting film according to any one of the items 1 to 12, wherein the (A) component is contained in an amount of 100 parts by mass (B) The component is 3 to 50 parts by mass, and the component (C) is 1 to 100 parts by mass. 14. The polyester composition for forming a thermosetting film according to claim 10 of the patent application scope It is contained in an amount of 0.01 to 5 parts by mass based on 100 parts by mass of the component (A). Q 1 5. The polyester composition for forming a thermosetting film according to item 11 of the patent application, wherein (A) The component (10) is contained in an amount of from 0.5 to 30 parts by mass of the component (E). The polyester composition for forming a thermosetting film according to claim 12, wherein the component (A) is contained in an amount of 100 parts by mass. (F) Component: 0.5 to 50 parts by mass. 17. A cured film obtained by using the polyester composition for forming a thermosetting film according to any one of claims 1 to 16. 1 8 A liquid crystal alignment layer which is obtained by using a polyester composition for forming a thermosetting film as disclosed in any one of claims 1 to 7 to 4, 2010 to 1971.
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