201038872 六、發明說明： 【發明所屬之技術領域】 本發明涉及一種照明裝置，特別是涉及一種發 光二極體照明裝置。 x 【先前技術】 通常之發光二極體照明裝置包括電路板及發光 二極體，電路板之表面設置線路層，線路層上劃分 〇 為複數發光二極體安裝區’每-發光二極體安裝區 包括第-電極區、第二電極區及導熱區，發光二極 ϋ女裝於電路板之線路層丨。導熱區之寬度影響整 個發光二極體照明裝置之散熱性能，導熱區之&度 越大’則‘熱區與發光二極體之接觸面積越大，進 而散熱性能越好；另一方面，第一電極與導熱區之 間距及第二電極與導熱區之間距影響整個發光二極 體照明裝置之電氣性能，第一電極與導熱區之間距 〇 及第二電極與導熱區之間距越大職漏電流較少且 放電火花現象較少。 然’發光L明裝置趨向於緊湊結構化設 計’導熱區之寬度、電極與導熱區之間距成為相互 制約之因素’即在不改變發光二極體安裝區之幾何 尺寸情況下’如果導熱區之寬度越大則使得電極與 導熱區之間距越小，這會降低發光二極體照明裝置 之電氣性能；反之’電極與導熱區之間距越大則導 4 201038872 熱區之寬度越小’這會降低發光二極體照明裝置之 散熱性能。 【發明内容】 ▲繁於此’有必要提供—種具有較佳散熱性能及 較佳電氧性忐之發光二極體照明裝置。 一種發光二極體照明裝置，包括至少一發光二 極體及電路板’邊電路板包括線路層、枯著層及導 Ο 熱層，枯著層設於線路層與導熱層之間，線路層設 置與發光二極體相對應之發光二極體安裝區，每一 發光二極體安裝區包括間隔設置之第一電極區、第 二電極區及導熱區，第一電極區與第二電極區分佈 於導熱區之兩侧，該發光二極體安裝於該電路板之 lx光一極體安裝區上，每一導熱區内設有導熱柱， 該導熱柱貫穿電路板之線路層及粘著層，該導熱柱 之兩端分別與發光二極體及電路板之導熱層熱連 〇 接，發光一極體安裝區之第一電極區與導熱區之間 距介於0·7毫米與1.45毫米之間，第二電極區與導 熱區之間距介於〇.7毫米與1.45毫米之間。 與習知技術相比，本發明之發光二極體照明裳 置之導熱區寬度減少’使得第一電極區及第二電極 區與導熱區之間距增加，這可減少高壓絕緣特性測 试中產生洩漏電流，確保發光二極體不被反向擊 穿；與此同時，導熱柱使得發光二極體之導熱塾與 5 201038872 電路板之導熱層直接熱連接，發光二極體所產生之 熱量直接傳遞到電路板之導熱層，而不必再經過粘 著層，可提高發光二極體照明裝置之散熱性能，以 彌補導熱區寬度減少所導致之散熱性能下降之不利 影響。故，在不改變幾何尺寸情況下，本發明之發 光二極體具有較佳之散熱性能及電氣性能。 【實施方式】 如圖1所示，發光二極體照明裝置10包括驅動 電源（圖未示）、散熱器11、電路板12及複數安裝 於電路板12上之發光二極體13。散熱器11包括基 座110及複數由基座110 —體延伸形成之散熱鰭片 111。 電路板12包括依次由下而上疊放之導熱層 124、導熱但不導電之電絕緣層123、粘著層122及 線路層121，線路層121及導熱層124分別位於電 路板12之上、下兩端，粘著層122及電絕緣層123 夾設於線路層121與導熱層124之間，其中電絕緣 層123貼附於導熱層124之上，粘著層122貼附於 電絕緣層123之上。 導熱層124由鋁等高導熱金屬材料製成，導熱 層124固定於散熱器11之基座110上。電絕緣層123 由陶瓷等材料製成，具有優良之導熱性能及電氣絕 緣性能，電絕緣層123用於增強線路層121與導熱 201038872 層124之間之電氣絕緣性能。線路層121為銅箔材 料製版而成，用於形成驅動電源與發光二極體13之 間電連接之電路。粘著層122由環氧樹脂材料製 成，使得線路層121均勻且緊密地貼附於電絕緣層 123 上。 線路層121劃分為複數發光二極體安裝區 125,該複數發光二極體安裝區125與該複數發光二 極體13——對應。每一發光二極體安裝區125包括 〇 相互絕緣之第一電極區126、第二電極區127及導 熱區128，第一電極區126與第二電極區127對稱 之設置於導熱區128之左、右兩侧。 導熱區128之寬度L1介於4.1毫米到5.6毫米 之間，第一電極區126及第二電極區127之寬度 L4、L5相等且介於0.7毫米到0.95毫米之間，第一 電極區126與導熱區128之間距L2介於0.7毫米到 Ο 1.45毫米之間，第二電極區127與導熱區128之間 距L3介於0.7毫米到1.45毫米之間。優選地，導熱 區128之寬度L1為4.6毫米，第一電極區126與導 熱區128之間距L2為1.2毫米，第二電極區127與 導熱區128之間距L3為1.2毫米。 導熱區128之中央開設一導熱柱129,該導熱柱 129沿垂直方向自線路層121依次貫穿粘著層122 及電絕緣層123並與導熱層124連接，導熱柱129 201038872 之直徑與導熱區128之寬度相當。導熱柱129由導 熱膏等導熱且不導電之材料製成，具有優良之導熱 性能及電氣絕緣性能。在其他實施方式中，導熱柱 129由金屬等導熱且導電之材料製成，具有優良之 導熱性能。 每一發光二極體13包括一基板131、反射座 132、發光二極體晶粒133及封裝體134,反射座132 位於基板131之上方，反射座132内開設一腔體 138,發光二極體晶粒133固定於反射座132之腔體 138内，封裝體134包覆於發光二極體晶粒133之 外圍。每一發光二極體13之基板131設置相互絕緣 之第一電極135、第二電極136及導熱墊137，第一 電極135及第二電極136對稱地分佈於導熱墊137 之左、右兩側。優選地，導熱墊137之寬度為5.6 毫米，第一電極135與第二電極136之寬度相等且 均為0.7毫米，第一電極135與導熱墊137之間距 為0.7毫米，第二電極136與導熱墊137之間距為 0.7毫米。 每一發光二極體13之基板131安裝於電路板12 上所對應之發光二極體安裝區125上，每一發光二 極體安裝區125之導熱區128中心位於相對應之發 光二極體13之中心軸線上，發光二極體13之第一 電極135及第二電極136分別貼合於對應之發光二 201038872 極體安裝區125之第一電極區126及第二電極區127 上，每一發光二極體13之導熱墊137貼合於對應之 發光二極體安裝區125之導熱區128上。 當發光二極體13安裝於電路板12後進行高壓 絕緣特性測試時，由於導熱區128之寬度L1減少， 這使得在不改變發光二極體之原有幾何尺寸之情況 下，電路板12之第一電極區126及第二電極區127 與導熱區128之間距L2、L3均大於0.7毫米，這將 〇 增加第一電極區126及第二電極區與導熱區128之 間之爬電距離，降低洩漏電流，從而保證發光二極 體12不會因為反向電壓過高而被擊穿，並使得第一 電極區126及第二電極區127與導熱區128之間放 電減少，均未產生放電火花現象；與此同時，由於 導熱柱129之兩端分別與對應發光二極體13之導熱 墊137及電路板12之導熱層124連接，導熱柱129 ❹ 將發光二極體13之導熱墊137與電路板12之導熱 層124熱連接，故發光二極體13發光時所產生之熱 量直接藉由電路板12之導熱柱129由基板131之導 熱墊137傳遞到電路板12之導熱層124，並最終傳 遞到散熱器11上，而不必經過電路板12之粘著層 122，這可提高整個發光二極體照明裝置10之散熱 性能，以彌補由於導熱區128之寬度減少所導致之 散熱性能降低之不利影響。故，在不改變幾何尺寸 情況下，本發明之發光二極體具有較佳之散熱性能 201038872 及電氣性能。 綜上所述，本發明符合發明專利之要件，爰依 法提出專利申請。惟以上所述者僅為本發明之較佳 實施例，舉凡熟悉本案技藝之人士，在爰依本發明 精神所作之等效修飾或變化，皆應涵蓋於以下之申 請專利範圍内。 【圖式簡單說明】 圖1為本發明之發光二極體照明裝置之一較佳 實施例之局部剖面示意圖。 圖2為圖1中電路板之局部俯視圖。 【主要元件符號說明】 發光二極體照明裝置 10 散熱器 11 基座 110 散熱鰭片 111 電路板 12 線路層 121 粘著層 122 導熱電絕緣層 123 導熱層 124 發光二極體安裝區 125 第一電極 126、135第二電極 127、136 導熱區 128、137導熱柱 129 發光二極體 13 基板 131 反射座 132 發光二極體晶粒 133 封裝體 134 腔體 138201038872 VI. Description of the Invention: [Technical Field] The present invention relates to a lighting device, and more particularly to a lighting diode lighting device. x [Prior Art] A typical light-emitting diode lighting device includes a circuit board and a light-emitting diode, and a circuit layer is disposed on the surface of the circuit board, and the circuit layer is divided into a plurality of light-emitting diode mounting regions 'per-light emitting diode The mounting area includes a first electrode region, a second electrode region, and a heat conducting region, and the light emitting diodes are disposed on the circuit layer of the circuit board. The width of the heat conduction zone affects the heat dissipation performance of the entire light emitting diode illumination device, and the greater the & degree of the heat conduction zone, the greater the contact area between the hot zone and the light emitting diode, and the better the heat dissipation performance; The distance between the first electrode and the heat conduction zone and the distance between the second electrode and the heat conduction zone affect the electrical performance of the entire LED illumination device, the distance between the first electrode and the heat conduction zone, and the distance between the second electrode and the heat conduction zone Less leakage current and less sparking. However, the 'light-emitting L-ming device tends to be compact and structured. The width of the heat-conducting zone and the distance between the electrode and the heat-conducting zone become mutually constrained factors', that is, without changing the geometrical dimensions of the LED mounting area. The larger the width, the smaller the distance between the electrode and the heat conduction zone, which will reduce the electrical performance of the light-emitting diode illumination device; otherwise, the larger the distance between the electrode and the heat conduction zone, the smaller the width of the heat conduction zone 201038872, which will reduce the illumination. The heat dissipation performance of the diode lighting device. SUMMARY OF THE INVENTION ▲In this case, it is necessary to provide a light-emitting diode lighting device having better heat dissipation performance and better electrical oxygen enthalpy. A light-emitting diode lighting device comprising at least one light-emitting diode and a circuit board' side circuit board including a circuit layer, a dry layer and a conductive layer, and a dry layer is disposed between the circuit layer and the heat conductive layer, and the circuit layer And a light emitting diode mounting region corresponding to the light emitting diode, each of the light emitting diode mounting regions includes a first electrode region, a second electrode region and a heat conducting region, a first electrode region and a second electrode region The light emitting diodes are disposed on the lx optical body mounting area of the circuit board, and each of the heat conducting regions is provided with a heat conducting column, and the heat conducting column penetrates the circuit layer and the adhesive layer of the circuit board. The two ends of the heat conducting column are respectively connected to the heat conducting layer of the light emitting diode and the circuit board, and the distance between the first electrode region and the heat conducting region of the light emitting body mounting region is between 0.7 mm and 1.45 mm. The distance between the second electrode region and the heat transfer region is between 〇.7 mm and 1.45 mm. Compared with the prior art, the width of the heat conduction region of the light-emitting diode illumination device of the present invention is reduced, so that the distance between the first electrode region and the second electrode region and the heat conduction region is increased, which can reduce the occurrence of high-voltage insulation property test. The leakage current ensures that the light-emitting diode is not reverse-punched; at the same time, the heat-conducting column causes the thermal conductivity of the light-emitting diode to be directly thermally connected to the heat-conducting layer of the 5 201038872 circuit board, and the heat generated by the light-emitting diode is directly The heat transfer layer transferred to the circuit board without having to pass through the adhesive layer can improve the heat dissipation performance of the light-emitting diode illumination device to compensate for the adverse effect of the heat dissipation performance caused by the reduction of the width of the heat conduction region. Therefore, the light-emitting diode of the present invention has better heat dissipation performance and electrical performance without changing the geometrical dimensions. [Embodiment] As shown in Fig. 1, a light-emitting diode lighting device 10 includes a driving power source (not shown), a heat sink 11, a circuit board 12, and a plurality of light-emitting diodes 13 mounted on the circuit board 12. The heat sink 11 includes a base 110 and a plurality of heat dissipation fins 111 extending from the base 110. The circuit board 12 includes a heat conductive layer 124 which is sequentially stacked from bottom to top, a thermally conductive but non-conductive electrical insulating layer 123, an adhesive layer 122 and a circuit layer 121. The circuit layer 121 and the heat conductive layer 124 are respectively disposed on the circuit board 12, The lower end, the adhesive layer 122 and the electrically insulating layer 123 are interposed between the circuit layer 121 and the heat conducting layer 124, wherein the electrically insulating layer 123 is attached on the heat conducting layer 124, and the adhesive layer 122 is attached to the electrically insulating layer. Above 123. The heat conductive layer 124 is made of a highly thermally conductive metal material such as aluminum, and the heat conductive layer 124 is fixed to the base 110 of the heat sink 11. The electrically insulating layer 123 is made of a material such as ceramic and has excellent thermal conductivity and electrical insulation properties. The electrically insulating layer 123 serves to enhance the electrical insulation between the circuit layer 121 and the thermal conductive layer 201038872. The wiring layer 121 is made of a copper foil material and is used to form a circuit for electrically connecting the driving power source to the light-emitting diode 13. The adhesive layer 122 is made of an epoxy resin material such that the wiring layer 121 is uniformly and closely attached to the electrically insulating layer 123. The circuit layer 121 is divided into a plurality of light-emitting diode mounting regions 125, and the plurality of light-emitting diode mounting regions 125 correspond to the plurality of light-emitting diodes 13. Each of the LED mounting regions 125 includes a first electrode region 126, a second electrode region 127, and a heat conducting region 128 that are insulated from each other. The first electrode region 126 and the second electrode region 127 are symmetrically disposed to the left of the heat conducting region 128. Right side. The width L1 of the heat conduction region 128 is between 4.1 mm and 5.6 mm, and the widths L4 and L5 of the first electrode region 126 and the second electrode region 127 are equal and between 0.7 mm and 0.95 mm, and the first electrode region 126 is The distance between the thermally conductive regions 128 is between 0.7 mm and Ο 1.45 mm, and the distance between the second electrode region 127 and the thermally conductive region 128 is between 0.7 mm and 1.45 mm. Preferably, the width L1 of the heat conduction region 128 is 4.6 mm, the distance L2 between the first electrode region 126 and the heat conduction region 128 is 1.2 mm, and the distance L3 between the second electrode region 127 and the heat conduction region 128 is 1.2 mm. A heat conducting column 129 is defined in the center of the heat conducting portion 128. The heat conducting column 129 sequentially penetrates the adhesive layer 122 and the electrically insulating layer 123 from the circuit layer 121 in a vertical direction and is connected to the heat conducting layer 124. The diameter of the heat conducting column 129 201038872 and the heat conducting region 128 The width is equivalent. The heat transfer column 129 is made of a thermally conductive and non-conductive material such as a heat conductive paste, and has excellent thermal conductivity and electrical insulation properties. In other embodiments, the thermally conductive post 129 is made of a thermally and electrically conductive material such as metal and has excellent thermal conductivity. Each of the LEDs 13 includes a substrate 131, a reflector 132, a LED 133 and a package 134. The reflector 132 is located above the substrate 131. A cavity 138 is formed in the reflector 132. The body die 133 is fixed in the cavity 138 of the reflector 132, and the package 134 is wrapped around the periphery of the LED die 133. The substrate 131 of each of the LEDs 13 is provided with a first electrode 135, a second electrode 136 and a thermal pad 137 which are insulated from each other. The first electrode 135 and the second electrode 136 are symmetrically distributed on the left and right sides of the thermal pad 137. . Preferably, the width of the thermal pad 137 is 5.6 mm, the width of the first electrode 135 and the second electrode 136 are equal and 0.7 mm, the distance between the first electrode 135 and the thermal pad 137 is 0.7 mm, and the second electrode 136 is thermally conductive. The distance between the pads 137 is 0.7 mm. The substrate 131 of each of the LEDs 13 is mounted on the corresponding LED mounting area 125 on the circuit board 12, and the center of the heat conducting area 128 of each of the LED mounting areas 125 is located at the corresponding LED. The first electrode 135 and the second electrode 136 of the light-emitting diode 13 are respectively attached to the first electrode region 126 and the second electrode region 127 of the corresponding light-emitting diode 201038872 polar body mounting region 125, respectively. The thermal pad 137 of the LED 13 is attached to the heat conducting region 128 of the corresponding LED mounting region 125. When the high-voltage insulation characteristic test is performed after the light-emitting diode 13 is mounted on the circuit board 12, since the width L1 of the heat-transfer region 128 is reduced, the circuit board 12 is not changed without changing the original geometric size of the light-emitting diode. The distances L2 and L3 between the first electrode region 126 and the second electrode region 127 and the heat conducting region 128 are both greater than 0.7 mm, which increases the creepage distance between the first electrode region 126 and the second electrode region and the heat conducting region 128. The leakage current is reduced, so that the light-emitting diode 12 is not broken down due to the reverse voltage being too high, and the discharge between the first electrode region 126 and the second electrode region 127 and the heat conduction region 128 is reduced, and no discharge is generated. At the same time, since the two ends of the heat conducting column 129 are respectively connected to the heat conducting pad 137 of the corresponding light emitting diode 13 and the heat conducting layer 124 of the circuit board 12, the heat conducting column 129 ❹ will be the thermal pad 137 of the light emitting diode 13 The heat generated by the light-emitting diodes 12 is electrically connected to the heat-conducting layer 124 of the circuit board 12, and the heat generated by the light-emitting diodes 13 is directly transferred from the heat-conductive pads 137 of the substrate 131 to the heat-conducting layer 124 of the circuit board 12. And finally passed to The heat sink 11 does not have to pass through the adhesive layer 122 of the circuit board 12, which can improve the heat dissipation performance of the entire light-emitting diode lighting device 10 to compensate for the adverse effect of the heat dissipation performance due to the reduction of the width of the heat-transfer region 128. . Therefore, the light-emitting diode of the present invention has better heat dissipation performance 201038872 and electrical performance without changing the geometrical dimensions. In summary, the present invention complies with the requirements of the invention patent and submits a patent application in accordance with the law. However, the above description is only the preferred embodiment of the present invention, and equivalent modifications or variations made by those skilled in the art will be included in the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a partial cross-sectional view showing a preferred embodiment of a light-emitting diode lighting device of the present invention. 2 is a partial plan view of the circuit board of FIG. 1. [Main component symbol description] LED lighting device 10 Heat sink 11 Base 110 Heat sink fin 111 Circuit board 12 Circuit layer 121 Adhesive layer 122 Thermally conductive electrically insulating layer 123 Thermally conductive layer 124 Light-emitting diode mounting area 125 First Electrode 126, 135 Second electrode 127, 136 Thermal conduction region 128, 137 Thermal conduction column 129 Light-emitting diode 13 Substrate 131 Reflector 132 Light-emitting diode die 133 Package 134 Cavity 138